TWI876011B - 黏著片 - Google Patents

黏著片 Download PDF

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Publication number
TWI876011B
TWI876011B TW110111288A TW110111288A TWI876011B TW I876011 B TWI876011 B TW I876011B TW 110111288 A TW110111288 A TW 110111288A TW 110111288 A TW110111288 A TW 110111288A TW I876011 B TWI876011 B TW I876011B
Authority
TW
Taiwan
Prior art keywords
elongation
substrate
tensile stress
mpa
adhesive sheet
Prior art date
Application number
TW110111288A
Other languages
English (en)
Chinese (zh)
Other versions
TW202142658A (zh
Inventor
佐佐木遼
川田智史
河原田有紀
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202142658A publication Critical patent/TW202142658A/zh
Application granted granted Critical
Publication of TWI876011B publication Critical patent/TWI876011B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
TW110111288A 2020-03-30 2021-03-29 黏著片 TWI876011B (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2020-060609 2020-03-30
JP2020060608 2020-03-30
JP2020-060612 2020-03-30
JP2020060612 2020-03-30
JP2020-060610 2020-03-30
JP2020060610 2020-03-30
JP2020-060608 2020-03-30
JP2020060611 2020-03-30
JP2020-060611 2020-03-30
JP2020060609 2020-03-30

Publications (2)

Publication Number Publication Date
TW202142658A TW202142658A (zh) 2021-11-16
TWI876011B true TWI876011B (zh) 2025-03-11

Family

ID=77929051

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110111288A TWI876011B (zh) 2020-03-30 2021-03-29 黏著片

Country Status (5)

Country Link
JP (2) JP7755572B2 (https=)
KR (1) KR20220158677A (https=)
CN (1) CN114867804B (https=)
TW (1) TWI876011B (https=)
WO (1) WO2021200786A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784294B2 (ja) * 2021-12-23 2025-12-11 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP2024021488A (ja) * 2022-08-03 2024-02-16 リンテック株式会社 粘着シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
JP5515811B2 (ja) 2010-02-05 2014-06-11 日立化成株式会社 半導体装置の製造方法及び回路部材接続用接着シート
JP2011173851A (ja) * 2010-02-25 2011-09-08 Kazki International:Kk 美容用貼付材
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
JP5065511B2 (ja) * 2011-06-15 2012-11-07 山本光学株式会社 偏光性成形体および同品の製造方法
JP6522307B6 (ja) * 2014-10-01 2019-07-17 大和製罐株式会社 ポリエステル樹脂組成物
JPWO2018003312A1 (ja) * 2016-06-30 2019-04-18 リンテック株式会社 半導体加工用シート
WO2018083987A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート

Also Published As

Publication number Publication date
WO2021200786A1 (ja) 2021-10-07
TW202142658A (zh) 2021-11-16
KR20220158677A (ko) 2022-12-01
CN114867804A (zh) 2022-08-05
JPWO2021200786A1 (https=) 2021-10-07
JP7755572B2 (ja) 2025-10-16
JP2025182039A (ja) 2025-12-11
CN114867804B (zh) 2025-05-09

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