KR20220158677A - 점착 시트 - Google Patents

점착 시트 Download PDF

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Publication number
KR20220158677A
KR20220158677A KR1020227017625A KR20227017625A KR20220158677A KR 20220158677 A KR20220158677 A KR 20220158677A KR 1020227017625 A KR1020227017625 A KR 1020227017625A KR 20227017625 A KR20227017625 A KR 20227017625A KR 20220158677 A KR20220158677 A KR 20220158677A
Authority
KR
South Korea
Prior art keywords
mpa
elongation
tensile stress
less
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227017625A
Other languages
English (en)
Korean (ko)
Inventor
하루카 사사키
사토시 카와다
유키 카와하라다
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20220158677A publication Critical patent/KR20220158677A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H01L21/6836—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H01L2221/68327—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
KR1020227017625A 2020-03-30 2021-03-29 점착 시트 Pending KR20220158677A (ko)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JPJP-P-2020-060612 2020-03-30
JPJP-P-2020-060611 2020-03-30
JP2020060608 2020-03-30
JP2020060612 2020-03-30
JPJP-P-2020-060609 2020-03-30
JPJP-P-2020-060610 2020-03-30
JP2020060610 2020-03-30
JP2020060611 2020-03-30
JPJP-P-2020-060608 2020-03-30
JP2020060609 2020-03-30
PCT/JP2021/013190 WO2021200786A1 (ja) 2020-03-30 2021-03-29 粘着シート

Publications (1)

Publication Number Publication Date
KR20220158677A true KR20220158677A (ko) 2022-12-01

Family

ID=77929051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227017625A Pending KR20220158677A (ko) 2020-03-30 2021-03-29 점착 시트

Country Status (5)

Country Link
JP (2) JP7755572B2 (https=)
KR (1) KR20220158677A (https=)
CN (1) CN114867804B (https=)
TW (1) TWI876011B (https=)
WO (1) WO2021200786A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784294B2 (ja) * 2021-12-23 2025-12-11 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP2024021488A (ja) * 2022-08-03 2024-02-16 リンテック株式会社 粘着シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5397243B2 (ja) * 2010-01-28 2014-01-22 日立化成株式会社 半導体装置の製造方法及び回路部材接続用接着シート
JP5515811B2 (ja) 2010-02-05 2014-06-11 日立化成株式会社 半導体装置の製造方法及び回路部材接続用接着シート
JP2011173851A (ja) * 2010-02-25 2011-09-08 Kazki International:Kk 美容用貼付材
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
JP5065511B2 (ja) * 2011-06-15 2012-11-07 山本光学株式会社 偏光性成形体および同品の製造方法
JP6522307B6 (ja) * 2014-10-01 2019-07-17 大和製罐株式会社 ポリエステル樹脂組成物
JPWO2018003312A1 (ja) * 2016-06-30 2019-04-18 リンテック株式会社 半導体加工用シート
WO2018083987A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法

Also Published As

Publication number Publication date
WO2021200786A1 (ja) 2021-10-07
TW202142658A (zh) 2021-11-16
CN114867804A (zh) 2022-08-05
JPWO2021200786A1 (https=) 2021-10-07
TWI876011B (zh) 2025-03-11
JP7755572B2 (ja) 2025-10-16
JP2025182039A (ja) 2025-12-11
CN114867804B (zh) 2025-05-09

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