CN114867804B - 粘着片 - Google Patents

粘着片 Download PDF

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Publication number
CN114867804B
CN114867804B CN202180007680.8A CN202180007680A CN114867804B CN 114867804 B CN114867804 B CN 114867804B CN 202180007680 A CN202180007680 A CN 202180007680A CN 114867804 B CN114867804 B CN 114867804B
Authority
CN
China
Prior art keywords
elongation
tensile stress
substrate
adhesive sheet
mpa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180007680.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN114867804A (zh
Inventor
佐佐木辽
川田智史
河原田有纪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN114867804A publication Critical patent/CN114867804A/zh
Application granted granted Critical
Publication of CN114867804B publication Critical patent/CN114867804B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199—Acids or hydroxy compounds containing cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
CN202180007680.8A 2020-03-30 2021-03-29 粘着片 Active CN114867804B (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2020-060609 2020-03-30
JP2020060608 2020-03-30
JP2020-060612 2020-03-30
JP2020060612 2020-03-30
JP2020-060610 2020-03-30
JP2020060610 2020-03-30
JP2020-060608 2020-03-30
JP2020060611 2020-03-30
JP2020-060611 2020-03-30
JP2020060609 2020-03-30
PCT/JP2021/013190 WO2021200786A1 (ja) 2020-03-30 2021-03-29 粘着シート

Publications (2)

Publication Number Publication Date
CN114867804A CN114867804A (zh) 2022-08-05
CN114867804B true CN114867804B (zh) 2025-05-09

Family

ID=77929051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180007680.8A Active CN114867804B (zh) 2020-03-30 2021-03-29 粘着片

Country Status (5)

Country Link
JP (2) JP7755572B2 (https=)
KR (1) KR20220158677A (https=)
CN (1) CN114867804B (https=)
TW (1) TWI876011B (https=)
WO (1) WO2021200786A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784294B2 (ja) * 2021-12-23 2025-12-11 リンテック株式会社 ワーク加工用シート、ワーク加工方法、および、ワーク加工用シートの使用
JP2024021488A (ja) * 2022-08-03 2024-02-16 リンテック株式会社 粘着シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
CN109075048A (zh) * 2016-06-30 2018-12-21 琳得科株式会社 半导体加工用片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
JP5515811B2 (ja) 2010-02-05 2014-06-11 日立化成株式会社 半導体装置の製造方法及び回路部材接続用接着シート
JP2011173851A (ja) * 2010-02-25 2011-09-08 Kazki International:Kk 美容用貼付材
JP5065511B2 (ja) * 2011-06-15 2012-11-07 山本光学株式会社 偏光性成形体および同品の製造方法
JP6522307B6 (ja) * 2014-10-01 2019-07-17 大和製罐株式会社 ポリエステル樹脂組成物
WO2018083987A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP2021050319A (ja) * 2019-09-19 2021-04-01 日東電工株式会社 粘着テープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011155191A (ja) * 2010-01-28 2011-08-11 Hitachi Chem Co Ltd 半導体装置の製造方法及び回路部材接続用接着シート
JP2011219563A (ja) * 2010-04-06 2011-11-04 Mitsubishi Chemicals Corp 脂環式ポリエステル系樹脂組成物及びその成形体
CN109075048A (zh) * 2016-06-30 2018-12-21 琳得科株式会社 半导体加工用片

Also Published As

Publication number Publication date
WO2021200786A1 (ja) 2021-10-07
TW202142658A (zh) 2021-11-16
KR20220158677A (ko) 2022-12-01
CN114867804A (zh) 2022-08-05
JPWO2021200786A1 (https=) 2021-10-07
TWI876011B (zh) 2025-03-11
JP7755572B2 (ja) 2025-10-16
JP2025182039A (ja) 2025-12-11

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