WO2021200429A1 - Structure - Google Patents

Structure Download PDF

Info

Publication number
WO2021200429A1
WO2021200429A1 PCT/JP2021/012128 JP2021012128W WO2021200429A1 WO 2021200429 A1 WO2021200429 A1 WO 2021200429A1 JP 2021012128 W JP2021012128 W JP 2021012128W WO 2021200429 A1 WO2021200429 A1 WO 2021200429A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
resin layer
resin
value
thickness
Prior art date
Application number
PCT/JP2021/012128
Other languages
English (en)
Japanese (ja)
Inventor
衆 管
康代 金沢
中居　弘進
尚人 小山
和貴 仲田
Original Assignee
太陽インキ製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=77929575&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2021200429(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 太陽インキ製造株式会社 filed Critical 太陽インキ製造株式会社
Priority to JP2022512005A priority Critical patent/JP7186920B2/ja
Priority to CN202180015814.0A priority patent/CN115135496A/zh
Publication of WO2021200429A1 publication Critical patent/WO2021200429A1/fr
Priority to JP2022186907A priority patent/JP2023016876A/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to a structure, and more particularly to a structure having a first film and a resin layer, or a structure having a first film, a resin layer, and a second film in this order.
  • the insulating layer is generally formed by thermosetting the curable resin composition as a curable resin layer.
  • the dry film is a structure having a curable resin layer obtained by applying a liquid curable resin composition adjusted to a predetermined viscosity to a region on the surface of a first film prepared separately and then drying. be.
  • the dry film is generally further laminated with a second film in order to protect the surface of the curable resin layer opposite to the first film.
  • the steps are ordered such that the second film is peeled off first, and then the first film is peeled off after laminating or curing on the base material, the first film and the second film are used. There needs to be a way to tell which of the films to peel off.
  • the first film and the second film are transparent, it is difficult to distinguish the films, and there is a risk that the first film and the second film are peeled off in the wrong order. .. This tendency is particularly remarkable when the first film and the second film have the same specifications, and in such a case, when the second film is peeled off from the structure, due to the relationship with the first film.
  • film marks linear marks
  • chip-type devices such as semiconductor elements and electronic parts
  • a transfer molding method using a powdered epoxy resin composition, potting using a liquid epoxy resin composition, a silicone resin or the like. It has been carried out by the method, the dispensing method, the printing method, etc.
  • it is suitable for mounting a device with a high degree of integration, and in order to efficiently manufacture a device such as a surface acoustic wave (SAW) device or a crystal device that needs to be hollow after sealing.
  • SAW surface acoustic wave
  • Patent Document 2 is characterized by containing (A) a crosslinkable elastomer, (B) an epoxy resin, (C) an epoxy resin curing agent, and (D) an inorganic filler as a composition that can be collectively sealed.
  • Thermosetting resin compositions have been proposed. Further, in recent years, it has been proposed to use a dry film type for batch sealing.
  • the dry film is usually a structure having a curable resin layer on the first film.
  • the above structure can be produced by applying a liquid curable resin composition on a tensioned first film and then drying to form a curable resin layer.
  • the first film used for the structure is used by unwinding the film wound on a roll, but there is a problem that the film is wrinkled or sagging at that time.
  • the roll circumferences D1 to D14 at each part when the film roll is divided into 14 equal parts in the width direction satisfy specific conditions and are straight in the width direction of the film roll divided into 14 equal parts. It has been proposed that the maximum thickness difference (Tm) between the film thicknesses T1 to T14 of each portion measured on the line satisfies a specific condition (see Patent Document 3).
  • an object of the first embodiment of the present invention is a structure in which the first film and the second film of the multi-layered structure can be easily distinguished, and the resin layer is less likely to have film marks when the second film is peeled off. To provide the body.
  • an object of the second embodiment of the present invention is to provide a structure having a resin layer having a thickness of 50 ⁇ m or more and a small variation in thickness on the first film.
  • the present inventors have measured the haze of the first film and the second film itself, or the Lab color measured from the first film side of the structure. Adjust the L * value, a * value, b * value in space and the L * value, a * value, b * value in the Lab color space measured from the second film side of the structure, and adjust each haze or each L *. It was found that it is possible to easily distinguish the front and back of the structure by giving a difference of a certain value or more to the value, the a * value, or the b * value.
  • the present inventors have adjusted the trouser tearing force of the first film and the second film, and made a difference of a certain amount or more between the trouser tearing forces. , It was found that the generation of film marks can be suppressed.
  • the structure according to the first aspect for the purpose of the first aspect of the present invention comprises the first film, the resin layer, and the second film in this order.
  • the difference between the trouser tearing force of the first film and the trouser tearing force of the second film is ⁇ 0.05 N or less or + 0.05 N or more.
  • the difference between the haze of the first film and the haze of the second film is -5% or less or + 5% or more.
  • a structure according to a second aspect for the purpose of the first aspect of the present invention comprises a first film, a resin layer, and a second film in this order.
  • the difference between the trouser tearing force of the first film and the trouser tearing force of the second film is ⁇ 0.05 N or less or + 0.05 N or more.
  • the difference between the * value and b * value is the following conditions (i) to (iii): (I) The difference between L * values is -0.1 or less or +0.1 or more. (Ii) The difference between the a * values is ⁇ 0.1 or less or +0.1 or more. (Iii) The difference between b * values is -1 or less or +1 or more. It is characterized by satisfying at least one of.
  • the trouser tearing force of the second film is smaller than the trouser tearing force of the first film.
  • the resin layer is a curable resin layer.
  • the first film is selected from a polyester film and a polyolefin film.
  • the second film is selected from a polyester film and a polyolefin film.
  • the structure according to the aspect of the present invention comprises a first film and a resin layer.
  • the thickness of the first film is 30 ⁇ m or more, and the thickness is 30 ⁇ m or more.
  • the trouser tearing force of the first film is 0.1 N or more.
  • the thickness of the resin layer is 50 ⁇ m or more, and the thickness of the resin layer is 50 ⁇ m or more.
  • the resin layer is a curable resin layer.
  • the curable resin layer contains a thermosetting resin and a curing agent.
  • thermosetting resin is an epoxy compound.
  • the resin layer is a curable resin layer.
  • the first film is selected from the group consisting of a polyester film, a polyolefin film, and a polyimide film.
  • the variation in the thickness of the first film is preferably ⁇ 10% or less.
  • ⁇ Effect of the first form> it is possible to provide a structure in which the front and back surfaces of a multi-layered structure can be easily distinguished and the resin layer is less likely to have film marks when the second film is peeled off.
  • the reason why the generation of film marks can be suppressed by adjusting the trouser tearing force of the first film and the second film and making a difference of a certain amount or more between each trouser tearing force is not always clear, but as follows. I can guess. That is, when the difference in the tearing force of the trouser is added, the load applied to the resin layer when the film is peeled off is different from that in the case where there is no difference in the tearing force, which is appropriate. As a result, it is considered that there is a difference in the ease of forming film marks on the resin layer. However, this is just a guess, and not limited to this.
  • ⁇ Effect of the second form> it is possible to provide a structure having a resin layer having a thickness of 50 ⁇ m or more and a small variation in thickness on the first film.
  • the reason why a resin layer having a small variation in thickness can be formed by adjusting the trouser tearing force of the first film and adjusting the thickness of the first film is not always clear, but it can be inferred as follows. .. That is, by the above adjustment, the surface condition of the first film becomes appropriate, and even when tension is applied to the first film, the force can be withstood, so that wrinkles are less likely to occur, and as a result, the first It is presumed that the resin layer formed on the film of No. 1 can be easily formed, and the variation in the thickness of the resin layer can be suppressed. However, this is just a guess, and not limited to this.
  • the structure according to the present invention includes a first film, a resin layer, and a second film in this order, and the first film and the second film satisfy specific conditions described later.
  • the first film and the second film satisfy the specific conditions described later, it is easy to distinguish the front and back sides of the multi-layered structure, and when the second film is peeled off, it becomes a resin layer. It is possible to provide a structure in which film marks are less likely to be formed.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of a structure according to the present invention.
  • the structure 1 is a surface provided with a first film 10, a resin layer 20 provided on one surface of the first film 10, and a first film 10 of the resin layer 20. It is provided with a second film 30 provided on the opposite surface.
  • the first film in the present invention has a role of supporting the resin layer of the structure, and is a film to which the resin composition is applied when the resin layer is formed.
  • the resin layer side of the structure is in contact with a base material such as a substrate and integrally molding, it means that the resin layer is at least adhered to the resin layer, and the resin layer is cured. After that, it is preferable to peel off from the structure.
  • the first film examples include polyester films such as polyethylene terephthalate and polyethylene naphthalate, polyolefin films such as polyethylene film and polypropylene film, fluororesin films such as polytetrafluoroethylene film, polyimide films, polyamideimide films, and polystyrene films.
  • a film made of a thermoplastic resin such as the above can be used.
  • a polyester film and a polyolefin film can be preferably used from the viewpoints of heat resistance, mechanical strength, handleability and the like.
  • the surface of the first film on which the resin layer is provided may be subjected to a mold release treatment or a matting treatment, or a sputtered or ultrathin copper foil and an adhesive layer may be formed.
  • the thickness of the first film is not particularly limited and can be appropriately selected depending on the intended use.
  • the thickness of the first film is preferably 12 ⁇ m or more and 125 ⁇ m or less, and more preferably 15 ⁇ m or more and 75 ⁇ m or less, from the viewpoint of mechanical strength, handleability, and the like.
  • the second film in the present invention is provided on the surface opposite to the first film of the resin layer for the purpose of preventing dust and the like from adhering to the surface of the resin layer of the structure and improving handleability.
  • It is a film that can be used.
  • it refers to a material that is peeled off from the structure before laminating when it is laminated by heating or the like so that the resin layer side of the structure is in contact with a base material such as a substrate and integrally molded.
  • a film made of the thermoplastic resin exemplified in the first film can be used.
  • polyester film and polyolefin film are preferable from the viewpoint of heat resistance, mechanical strength, handleability and the like.
  • the surface of the second film on which the resin layer is provided may be subjected to a mold release treatment.
  • the thickness of the second film is not particularly limited and can be appropriately selected depending on the intended use.
  • the thickness of the second film is preferably 10 ⁇ m or more and 100 ⁇ m or less, and more preferably 15 ⁇ m or more and 50 ⁇ m or less, from the viewpoint of mechanical strength, handleability, and the like.
  • the trouser tearing force of the first film and the second film is described in JIS K 7128-1: 1998 "Plastic-Film and Sheet Tear Strength Test Method-Part 1: Trouser Tearing Method". It is a value measured under the following measurement conditions using a tensile tester (manufactured by Shimadzu Corporation, EZ-SX) in accordance with the above.
  • EZ-SX tensile tester
  • the measurement direction shall be measured only in the vertical direction (MD direction) regardless of the presence or absence of anisotropy depending on the direction.
  • the trouser tearing force of the first film and the second film is the type of thermoplastic resin of the first film and the second film, the draw ratio during film formation, the film thickness, the breaking strength of the film, and the surface. It can be adjusted within a desired range by adjusting the roughness of the film.
  • the difference between the haze of the first film and the haze of the second film is -5% or less or +5. % Or more, preferably -8% or less or + 8% or more, more preferably -85% or more and -8% or less or + 8% or more in that the front and back of the multi-layer structure can be more easily distinguished. It is + 85% or less.
  • the haze of the first film and the second film is the surface roughness of the first film and the second film, the addition and type of colorant, the type of thermoplastic resin, the draw ratio during film formation, and the film. It can be adjusted within a desired range by adjusting the thickness of the film.
  • the haze of the first film and the second film is a value measured by using a haze mate for the film itself in accordance with ASTMD1003.
  • the structure according to the present invention has L * values, a * values, b * values in the Lab color space measured from the first film side of the structure and the Lab color space measured from the second film side of the structure.
  • the L * value, a * value, b * value ") in the Lab color space measured from the second film side satisfies at least one of the following conditions (i) to (iii).
  • the difference between the L * values is ⁇ 0.1 or less or +0.1 or more, and is preferably ⁇ 10 or less or +10 or more in that the front and back of the multi-layer structure can be more easily distinguished. More preferably, it is -30 or more and -15 or less or +15 or more and +30 or less.
  • the difference between the a * values is ⁇ 0.1 or less or +0.1 or more, and it is preferable that the difference between the front and back of the multi-layered structure is ⁇ 0.3 or less or +0.3. The above is more preferably ⁇ 30 or more and ⁇ 0.3 or less or +0.3 or more and +30 or less.
  • the difference between the b * values is -1 or less or +1 or more, and is preferably -2 or less or +2 or more, more preferably ⁇ 2 or more, in that the front and back of the multi-layer structure can be more easily distinguished. It is 10 or more and -2 or less or +2 or more and +10 or less.
  • the b * value adjusts the surface roughness of the first film and the second film, the amount and type of colorant added, the type of thermoplastic resin, the draw ratio during film formation, the film thickness, and the like.
  • L * value, a * value, b * value in the Lab color space measured from the first film side of the structure and L * value, a * value, in the Lab color space measured from the second film side of the structure When the difference in b * values satisfies the above condition, it becomes easy to distinguish the back side and the back side of the multi-layered structure.
  • the difference described in (i) that is, the difference in the L * value satisfies the above condition from the viewpoint of making it easier to distinguish.
  • the value, a * value, and b * value are values measured under the following measurement conditions using a spectrocolorimeter.
  • the resin layer is a layer located between the first film and the second film of the structure, and is preferably a curable resin layer.
  • the curable resin layer is a dry coating film obtained by drying the curable resin composition, and may be a thermosetting resin layer that is cured by heating, a photocurable resin layer that is cured by light irradiation, or a photocurable resin layer. It may be a thermosetting / photocurable resin layer that is cured by heating and cured by light irradiation.
  • the curable resin composition preferably contains at least one of a thermosetting resin and a photocurable resin, and may further contain other components.
  • thermosetting resin When the curable resin composition contains a thermosetting resin, the heat resistance of the cured product is improved and the adhesion to the substrate is improved.
  • thermosetting resin include amino resins such as melamine resin, benzoguanamine resin, melamine derivative, and benzoguanamine derivative, isocyanate compounds, blocked isocyanate compounds, cyclocarbonate compounds, epoxy compounds, oxetane compounds, episulfide resins, bismaleimide, and carbodiimide resins. Etc. can be used.
  • thermosetting resin one type may be used alone or two or more types may be used in combination.
  • thermosetting resin having a cyclic (thio) ether group in the molecule is a compound having either or both of a 3, 4 or 5-membered cyclic ether group or a cyclic thio ether group in the molecule.
  • an epoxy compound, a polyfunctional oxetane compound, an episulfide resin and the like can be mentioned. Of these, epoxy compounds are preferred.
  • the epoxy compound examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, and bisphenol Z type epoxy resin.
  • Novolak type epoxy resin such as bisphenol type epoxy resin, bisphenol A novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, arylalkylene type epoxy resin, tetraphenylol ethane Type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantan type epoxy resin, fluorene type epoxy resin, glycidyl methacrylate copolymer type epoxy resin, Copolymerized epoxy resin of cyclohexyl maleimide and glycidyl methacryl
  • Examples of commercially available epoxy resins include jER 828, 806, 807, YX8000, YX8034, 834 manufactured by Mitsubishi Chemical Corporation, YD-128, YDF-170, ZX-1059 manufactured by Nittetsu Chemical & Materials Co., Ltd. Examples thereof include ST-3000, EPICLON 830, 835, 840, 850, N-730A, N-695 manufactured by DIC Corporation, and RE-306 manufactured by Nippon Kayaku Corporation.
  • polyfunctional oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, and 1,4-bis [(3-3-oxythenylmethoxy) methyl] ether.
  • Methyl-3-oxetanylmethoxy) methyl] benzene 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-3) Oxetanyl) methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and polyfunctional oxetane such as their oligomers or copolymers, as well as oxetane alcohols and novolak resins.
  • Examples of the compound having a plurality of cyclic thioether groups in the molecule include bisphenol A type episulfide resin and the like. Further, using the same synthesis method, an episulfide resin or the like in which the oxygen atom of the epoxy group of the novolak type epoxy resin is replaced with a sulfur atom can also be used.
  • amino resins such as melamine derivatives and benzoguanamine derivatives include methylol melamine compounds, methylol benzoguanamine compounds, methylol glycol uryl compounds and methylol urea compounds.
  • polyisocyanate compound a polyisocyanate compound can be blended.
  • Polyisocyanate compounds include 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate and Aromatic polyisocyanates such as 2,4-tolyrene dimer; aliphatic polyisocyanates such as tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate) and isophorone diisocyanate; bicyclo Alicyclic polyisocyanates such as heptanthriisocyanate; and adducts, burettes, and isocyanurates
  • an addition reaction product of the isocyanate compound and the isocyanate blocking agent can be used.
  • the isocyanate compound capable of reacting with the isocyanate blocking agent include the above-mentioned polyisocyanate compound and the like.
  • the isocyanate blocking agent include a phenol-based blocking agent; a lactam-based blocking agent; an active methylene-based blocking agent; an alcohol-based blocking agent; an oxime-based blocking agent; a mercaptan-based blocking agent; an acid amide-based blocking agent; an imide-based blocking agent; Amine-based blocking agents; imidazole-based blocking agents; imine-based blocking agents and the like can be mentioned.
  • Photocurable resin Radical polymerization
  • a compound having one or more ethylenically unsaturated bonds in the molecule is particularly preferably used.
  • the compound having an ethylenically unsaturated bond known and commonly used photopolymerizable oligomers, photopolymerizable vinyl monomers and the like are used.
  • Examples of the photopolymerizable oligomer include unsaturated polyester-based oligomers and (meth) acrylate-based oligomers.
  • Examples of the (meth) acrylate-based oligomer include epoxy (meth) acrylates such as phenol novolac epoxy (meth) acrylate, cresol novolac epoxy (meth) acrylate, and bisphenol type epoxy (meth) acrylate, urethane (meth) acrylate, and epoxy urethane (meth). ) Acrylate, polyester (meth) acrylate, polyether (meth) acrylate, polybutadiene-modified (meth) acrylate and the like.
  • (meth) acrylate is a generic term for acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions.
  • styrene derivatives such as styrene, chlorostyrene and ⁇ -methylstyrene
  • vinyl esters such as vinyl acetate, vinyl butyrate or vinyl benzoate
  • vinyl isobutyl ether vinyl- Vinyl ethers such as n-butyl ether, vinyl-t-butyl ether, vinyl-n-amyl ether, vinyl isoamyl ether, vinyl-n-octadecyl ether, vinyl cyclohexyl ether, ethylene glycol monobutyl vinyl ether, triethylene glycol monomethyl vinyl ether
  • acrylamide (Meta) acrylamides such as methacrylicamide, N-hydroxymethylacrylamide, N-hydroxymethylmethacrylicamide, N-methoxymethylacrylamide, N-ethoxymethylacrylamide, N-butoxymethylacrylamide
  • triallyl isocyanurate diallyl phthalate
  • Polyoxyalkylene glycol poly (meth) acrylates such as di (meth) acrylates, trimethylolethane ethoxylated propantriacrylates, propoxylated trimethylol propantri (meth) acrylates, etc.
  • Poly (meth) acrylates such as neopentyl glycol ester di (meth) acrylate of hydroxybivariate
  • Isocyanurate-type poly (meth) acrylates such as tris [(meth) acryloxyethyl] isocyanurate. ..
  • photocurable resin cationic polymerization
  • an alicyclic epoxy compound a vinyl ether compound and the like
  • the alicyclic epoxy compounds include 3,4,3', 4'-diepoxybicyclohexyl, 2,2-bis (3,4-epoxycyclohexyl) propane, and 2,2-bis (3,4-epoxy).
  • vinyl ether compound examples include cyclic ether type vinyl ethers such as isosorbite divinyl ether and oxanolbornene divinyl ether (vinyl ethers having cyclic ether groups such as oxylane ring, oxetane ring and oxolan ring); aryl vinyl ethers such as phenyl vinyl ether; n-butyl vinyl ether.
  • cyclic ether type vinyl ethers such as isosorbite divinyl ether and oxanolbornene divinyl ether
  • aryl vinyl ethers such as phenyl vinyl ether
  • n-butyl vinyl ether examples include cyclic ether type vinyl ethers such as isosorbite divinyl ether and oxanolbornene divinyl ether (vinyl ethers having cyclic ether groups such as oxylane ring, oxetane ring and oxolan
  • Alkyl vinyl ethers such as octyl vinyl ethers; cycloalkyl vinyl ethers such as cyclohexyl vinyl ethers; polyfunctional vinyl ethers such as hydroquinone divinyl ethers, 1,4-butanediol divinyl ethers, cyclohexane divinyl ethers, cyclohexanedimethanol divinyl ethers, ⁇ and / or ⁇ -positions.
  • Examples thereof include vinyl ether compounds having a substituent such as an alkyl group and an allyl group.
  • the curable resin composition can contain an alkali-soluble resin.
  • the alkali-soluble resin it is preferable to use a carboxyl group-containing resin or a phenol resin.
  • a carboxyl group-containing resin it is more preferable to use a carboxyl group-containing resin from the viewpoint of developability.
  • the carboxyl group-containing resin may be a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond.
  • Carboxyl group-containing photosensitive by reacting an epoxy resin with (meth) acrylic acid and adding a dibasic acid anhydride such as phthalic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride to a hydroxyl group existing in a side chain. Sex resin.
  • a dibasic acid anhydride such as phthalic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride
  • Sex resin (2) Carboxyl group-containing photosensitive in which a (meth) acrylic acid is reacted with a polyfunctional epoxy resin obtained by further epoxidizing the hydroxyl group of the epoxy resin with epichlorohydrin, and a dibasic acid anhydride is added to the generated hydroxyl group. Sex resin.
  • the epoxy compound is obtained by reacting a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group in one molecule with an unsaturated group-containing monocarboxylic acid such as (meth) acrylic acid.
  • an unsaturated group-containing monocarboxylic acid such as (meth) acrylic acid.
  • Photosensitive resin such as maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, or adipic acid.
  • An unsaturated group-containing monocarboxylic acid is reacted with a reaction product obtained by reacting a compound having two or more phenolic hydroxyl groups in one molecule with a cyclic carbonate compound such as ethylene carbonate or propylene carbonate.
  • a carboxyl group-containing photosensitive resin obtained by reacting the obtained reaction product with a polybasic acid anhydride.
  • Diisocyanate compounds such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates, and polycarbonate-based polyols, polyether-based polyols, polyester-based polyols, polyolefin-based polyols, acrylic-based polyols, and bisphenol A-based A terminal carboxyl group-containing urethane resin obtained by reacting an acid anhydride with the end of a urethane resin obtained by a double addition reaction of a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
  • a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
  • Molecules such as hydroxyalkyl (meth) acrylate during the synthesis of a carboxyl group-containing urethane resin by a double addition reaction between a diisocyanate, a carboxyl group-containing dialcohol compound such as dimethylolpropionic acid and dimethylolbutyric acid, and a diol compound.
  • a carboxyl group-containing urethane resin obtained by adding a compound having one hydroxyl group and one or more (meth) acryloyl groups to the terminal (meth) acrylic.
  • a carboxyl group-containing urethane resin by a double addition reaction of a diisocyanate, a carboxyl group-containing dialcohol compound, and a diol compound, an isophorone diisocyanate and a pentaerythritol triacrylate equimolar reaction product, etc.
  • a carboxyl group-containing urethane resin that is terminally (meth) acrylicated by adding a compound having one isocyanate group and one or more (meth) acryloyl groups.
  • a carboxyl group-containing resin obtained by copolymerizing an unsaturated carboxylic acid such as (meth) acrylic acid with an unsaturated group-containing compound such as styrene, ⁇ -methylstyrene, lower alkyl (meth) acrylate, or isobutylene.
  • a carboxyl group-containing polyester resin obtained by reacting an oxetane resin with a dicarboxylic acid such as adipic acid, phthalic acid, or hexahydrophthalic acid, and adding a dibasic acid anhydride to the generated primary hydroxyl group.
  • carboxyl group-containing resin Since the above-mentioned carboxyl group-containing resin has a large number of carboxyl groups in the side chain of the backbone polymer, it can be developed with a dilute alkaline aqueous solution.
  • the acid value of the carboxyl group-containing resin is preferably in the range of 40 to 200 mgKOH / g, more preferably in the range of 45 to 120 mgKOH / g.
  • the acid value of the carboxyl group-containing resin is 40 mgKOH / g or more, alkaline development becomes easy, while drawing a normal resist pattern of 200 mgKOH / g or less becomes easy.
  • the weight average molecular weight of the above-mentioned carboxyl group-containing resin varies depending on the resin skeleton, but is generally preferably in the range of 2,000 to 150,000, more preferably 5,000 to 100,000.
  • the weight average molecular weight is 2,000 or more, the tack-free performance, the development resistance of the coating film after exposure, and the resolution are good.
  • the weight average molecular weight is 150,000 or less, the developability is excellent.
  • carboxyl group-containing resin those other than those described above can be used, and one type of each may be used alone, or a plurality of types may be mixed and used.
  • phenolic resin examples include compounds having a phenolic hydroxyl group, for example, a compound having a biphenyl skeleton and / or a phenylene skeleton, or a phenolic hydroxyl group-containing compound, for example, phenol, orthocresol, paracresol, metacresol, 2 , 3-Xylenol, 2,4-Xylenol, 2,5-Xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, catechol, cresolsinol, hydroquinone, methylhydroquinone, 2,6-dimethylhydroquinone , Phenolic resins having various skeletons synthesized with trimethylhydroquinone, pyrogallol, fluoroglucolcinol and the like may be used.
  • phenol novolac resin alkylphenol volac resin, bisphenol A novolak resin, dicyclopentadiene type phenol resin, Xyloc type phenol resin, terpene modified phenol resin, polyvinylphenols, bisphenol F, bisphenol S type phenol resin, poly-p- Known and commonly used phenol resins such as hydroxystyrene, a condensate of naphthol and aldehydes, and a condensate of dihydroxynaphthalene and aldehydes can be used. These can be used alone or in combination of two or more.
  • the alkali-soluble resin either one of the carboxyl group-containing resin and the phenol resin, or a mixture thereof may be used.
  • the photocurable resin is photocurable by irradiation with active energy rays and promotes the dissolution of the alkali-soluble resin in an alkaline aqueous solution. In either case, one or more types of photocurable resins can be used.
  • the curable resin composition may further contain a thermoplastic resin in order to improve the mechanical strength of the obtained cured film.
  • the thermoplastic resin is preferably soluble in a solvent. When it is soluble in a solvent, the flexibility of the dry film is improved, and the generation of cracks and powder falling can be suppressed.
  • various acid anhydrides or acid chlorides are used for the thermoplastic polyhydroxypolyether resin, the phenoxy resin which is a condensate of epichlorohydrin and various bifunctional phenol compounds, or the hydroxyl group of the hydroxyether portion existing in the skeleton thereof.
  • Examples thereof include phenoxy resins, polyvinyl acetal resins, polyamide resins, polyamideimide resins, block copolymers, and polymer resins having a glass transition point of 20 ° C. or lower and a weight average molecular weight of 10,000 or more.
  • the polymer resin is preferably an acrylic acid ester copolymer.
  • the thermoplastic resin may be used alone or in combination of two or more.
  • the curable resin composition may contain a curing agent.
  • the curing agent include phenol resins, polycarboxylic acids and their acid anhydrides, cyanate ester resins, active ester resins, maleimide compounds, alicyclic olefin polymers and the like.
  • the curing agent one type may be used alone or two or more types may be used in combination.
  • the curable resin layer can contain a curing accelerator.
  • the curing accelerator accelerates the thermosetting reaction, and is used to further improve properties such as adhesion, chemical resistance, and heat resistance.
  • Specific examples of such a curing accelerator include imidazole and its derivatives; guanamines such as acetoguanamine and benzoguanamine; diaminodiphenylmethane, m-phenylenediamine, m-xylenediamine, diaminodiphenylsulphon, dicyandiamide, urea, urea derivatives, etc.
  • Polyamines such as melamine, polybasic hydrazide; these organic acid salts and / or epoxy adducts; amine complexes of boron trifluoride; ethyldiamino-S-triazine, 2,4-diamino-S-triazine, 2,4- Triazine derivatives such as diamino-6-xysilyl-S-triazine; trimethylamine, triethanolamine, N, N-dimethyloctylamine, N-benzyldimethylamine, pyridine, N-methylmorpholin, hexa (N-methyl) melamine, Amines such as 2,4,6-tris (dimethylaminophenol), tetramethylguanidine, m-aminophenol; polyphenols such as polyvinylphenol, polyvinylphenol bromide, phenol novolac, alkylphenol novolac; tributylphosphine, triphenyl Organic pho
  • Styrene-maleic anhydride resin Styrene-maleic anhydride resin; equimolar reactants of phenylisocyanate and dimethylamine, equimolar reactants of organic polyisocyanate and dimethylamine such as tolylene diisocyanate and isophorone diisocyanate, and conventionally known curing accelerators such as metal catalysts.
  • curing accelerators phosphonium salts are preferable because BHAST resistance can be obtained.
  • one type may be used alone or two or more types may be mixed.
  • the curable resin composition can contain a photoreaction initiator.
  • the photoreaction initiator may be any as long as it can generate radicals, bases, acids and the like by light irradiation to cure the curable resin.
  • Examples of the photoreaction initiator include known and commonly used compounds such as benzophenone, acetophenone, aminoacetophenone, benzoin ether, benzyl ketal, acylphosphine oxide, oxime ether, oxime ester, and titanosen. ..
  • As the photoreaction initiator it is preferable to contain one or more selected from the group consisting of an oxime ester type, an ⁇ -aminoacetophenone type acylphosphine oxide type, and a titanosen type.
  • oxime ester-based photoreaction initiator examples include 1,2-octanedione-1- [4- (phenylthio) -2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-). Methylbenzoyl) -9H-carbazole-3-yl]-, 1- (O-acetyloxime), 2- (acetyloxyiminomethyl) thioxanthene-9-one and the like can be mentioned.
  • the oxime ester-based photoreaction initiator may be a compound having a plurality of oxime ester groups.
  • Examples of the ⁇ -aminoacetophenone-based photoreaction initiator include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1- (4-morpholino). Phenyl) -butane-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N, N-dimethyl Aminoacetophenone and the like can be mentioned.
  • Acylphosphine oxide-based photoreactive initiators include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and bis (2,6-dimethoxybenzoyl). ) -2,4,4-trimethyl-Pentylphosphine oxide and the like.
  • titanosen-based photoreaction initiator examples include bis ( ⁇ 5-2,4-cyclopentadiene-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) -phenyl) titanium. Be done.
  • the curable resin composition can contain a photoreaction initiator other than the above-mentioned compounds, a photoinitiator aid and a sensitizer, and for example, a benzoin compound, an anthraquinone compound, a thioxanthone compound, a ketal compound, and a xanthone compound. , And a tertiary amine compound and the like.
  • the curable resin composition may contain an inorganic filler.
  • the inorganic filler preferably has properties such as adhesion, mechanical strength, and coefficient of linear expansion of the cured product.
  • Examples of the inorganic filler include barium sulfate, barium titanate, silicon oxide powder, fine powdered silicon oxide, amorphous silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, zirconium phosphate, and mica.
  • Known and commonly used inorganic fillers such as powder can be used.
  • the inorganic filler preferably contains at least one of barium sulfate and silica.
  • the average particle size of the inorganic filler is preferably 0.1 to 20 ⁇ m.
  • the average particle size can be determined by a laser diffraction type particle size distribution measuring device. Examples of the measuring device by the laser diffraction method include Microtrac Bell Co., Ltd. (Nanotrac wave).
  • the average particle size is a concept including an average primary particle size and an average secondary particle size.
  • the curable resin composition may contain an organic solvent used for preparing the composition and adjusting the viscosity.
  • organic solvent include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol and propylene glycol.
  • Glycol ethers such as monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether; ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbi Esters such as tall acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, and solvent naphtha are used. can do. These organic solvents can be used alone or in combination of two or more.
  • the curable composition may include a colorant.
  • the colorant is not particularly limited, and known colorants such as red, blue, green, and yellow can be used, and any of pigments, dyes, and pigments may be used. However, the colorant preferably does not contain halogen from the viewpoint of reducing the environmental load and affecting the human body.
  • red colorants examples include monoazo, disazo, azolake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, quinacridone, etc.
  • -Index CI; The Society of Dyers and Colorists (issued by The Society of Dyersand Colorists)) numbered ones can be mentioned.
  • Pigment Red 1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114, 146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269 and the like can be mentioned.
  • Examples of the disazo-based red colorant include Pigment Red 37, 38, 41 and the like.
  • Examples of the benzimidazolone-based red colorant include Pigment Red 171, 175, 176, 185, 208 and the like.
  • Examples of the perylene-based red colorant include Solvent Red 135,179, Pigment Red 123,149,166,178,179,190,194,224 and the like.
  • Examples of the diketopyrrolopyrrole-based red colorant include Pigment Red 254, 255, 264, 270, 272 and the like.
  • Examples of the condensed azo red colorant include Pigment Red 220, 144, 166, 214, 220, 211, 242 and the like.
  • Examples of the anthraquinone-based red colorant include Pigment Red 168, 177, 216 and Solvent Red 149, 150, 52, 207.
  • Examples of the quinacridone-based red colorant include Pigment Red 122, 202, 206, 207, 209 and the like.
  • blue colorant examples include phthalocyanine-based and anthraquinone-based compounds, and pigment-based compounds include compounds classified as Pigment.
  • Pigment Blue 15,15: 1,15: 2,15: 3,15: 4,15: 6,16,60, as the dye system, Compound Blue 35,63,68,70,83,87,94,97,122,136,67,70 and the like can be used.
  • metal-substituted or unsubstituted phthalocyanine compounds can also be used.
  • yellow colorant examples include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, anthraquinone, etc.
  • examples of the anthraquinone yellow colorant include Solvent Yellow 163, Pigment Yellow 24, 108, 193, 147, 199, 202 and the like can be mentioned.
  • examples of the isoindolinone-based yellow colorant include Pigment Yellow 110, 109, 139, 179, 185 and the like.
  • condensed azo-based yellow colorant examples include Pigment Yellow 93, 94, 95, 128, 155, 166, 180 and the like.
  • Examples of the benzimidazolone-based yellow colorant include Pigment Yellow 120, 151, 154, 156, 175, 181 and the like.
  • a monoazo yellow colorant Pigment Yellow 1,2,3,4,5,6,9,10,12,61,62,62:1,65,73,74,75,97,100, 104, 105, 111, 116, 167, 168, 169, 182, 183 and the like can be mentioned.
  • Examples of the disazo-based yellow colorant include Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198 and the like. Can be mentioned.
  • colorants such as purple, orange, brown, black, and white may be added.
  • the structure according to the present invention is preferably for forming a cured film of a printed wiring board, more preferably for forming a permanent protective film, and is preferably an interlayer insulating layer, a coverlay, a solder resist or a fill-in-the-blank (material). It is particularly preferable that it is for forming. Further, since the structure of the present invention can form a cured product having excellent film strength even with a thin film, it is a pattern layer in a printed wiring board, for example, a package substrate (printed wiring board used for a semiconductor package), which is required to be thinned. It can also be suitably used for formation. Further, the structure of the present invention can be suitably used for a flexible printed wiring board.
  • the structure according to the present invention includes a first film and a resin layer, and the first film and the resin layer satisfy specific conditions described later.
  • the first film and the resin layer satisfy the specific conditions described later, it is possible to obtain a structure in which the resin layer having a small variation in thickness is formed on the first film.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of the structure according to the present invention.
  • the structure 1 includes a first film 10 and a resin layer 20 provided on one surface of the first film 10.
  • a resin layer 20 provided on one surface of the first film 10.
  • the first film has a role of supporting the resin layer of the structure, and is a film to which the resin composition is applied when the resin layer is formed.
  • the first film may be one that can be peeled off from the structure after the resin layer is cured.
  • the first film include polyester films such as polyethylene terephthalate and polyethylene naphthalate, polyolefin films such as polyethylene film and polypropylene film, fluororesin films such as polytetrafluoroethylene film, polyimide films, polyamideimide films, and polystyrene films.
  • a film made of a thermoplastic resin such as the above can be used.
  • a polyester film and a polyolefin film can be preferably used from the viewpoints of heat resistance, mechanical strength, handleability and the like.
  • the surface of the first film on which the resin layer is provided may be subjected to a mold release treatment or a matting treatment, or a sputtered or ultrathin copper foil and an adhesive layer may be formed.
  • the thickness of the first film is 30 ⁇ m or more, preferably 35 ⁇ m or more and 125 ⁇ m or less. When the thickness of the first film is within the above numerical range, it is possible to suppress the occurrence of vertical wrinkles when tension is applied to the first film.
  • the trouser tearing force of the first film is 0.1 N or more, preferably 0.15 N or more and 2 N or less, and more preferably 0.2 N or more and 1.5 N or less.
  • the trouser tearing force of the first film is measured under the following measurement conditions using a tensile tester (manufactured by Shimadzu Corporation, EZ-SX) in accordance with JIS K 7128-1: 1998. It is a value measured in.
  • the first film in the structure of the present invention has a thickness variation of ⁇ 10% or less of the first film, which means that the film thickness can be easily controlled because the resin layer is applied without variation. Is preferable. More preferably, it is ⁇ 5% or less.
  • the variation in the thickness of the first film shall be measured as follows. That is, 40 mm was cut out in the MD direction from a position 1 m in the MD direction from the end of the film of the first film to prepare a measurement sample. The measurement sample was measured at 25 points in the TD direction at a pitch of 20 mm from a position 15 mm away from the edge of the film using an automatic measurement type film thickness meter (TOFJ manufactured by Yamabun Denki Co., Ltd.).
  • Thickness variation (%) (maximum value-minimum value) / average value x 100
  • the resin layer is a curable resin layer formed on the first film of the structure.
  • the curable resin layer is a dry coating film obtained by drying a liquid curable resin composition, and may be a thermosetting resin layer that is cured by heating or a photocurable resin layer that is cured by light irradiation. It may also be a thermosetting resin layer that is cured by heating and cured by light irradiation.
  • the thickness of the resin layer is 50 ⁇ m or more, preferably 50 ⁇ m or more and 200 ⁇ m or less. When the thickness of the resin layer is within the above numerical range, parts of a wide range of sizes can be sealed.
  • the thickness of the resin layer is measured by the following method. A 40 mm cut in the MD direction was cut out from a position 10 m in the MD direction from the end of the coating film (resin layer) of the structure to prepare a measurement sample. About the measurement sample, 25 points were measured at a pitch of 20 mm in the TD direction from a position 15 mm away from the end of the coating film (resin layer) using an automatic measurement type film thickness meter (TOFJ manufactured by Yamabun Denki Co., Ltd.). The average value calculated from the measurement results of 25 points was taken as the thickness of the resin layer.
  • TOFJ automatic measurement type film thickness meter
  • the curable resin composition preferably contains a curable resin and a curing agent, and may further contain other components.
  • the curable resin composition preferably contains at least one of a thermosetting resin and a photocurable resin as the curable resin.
  • thermosetting resin The thermosetting resin is as described in the specific description of the first embodiment.
  • epoxy compounds bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin, and phenol novolac type epoxy resin are used from the viewpoint of optimizing the breaking point strength, thermal expansion coefficient, and storage elasticity of the cured coating film. , It is more preferable to use two or more of these in combination, and it is even more preferable to use these three in combination.
  • photocurable resin (radical polymerization)
  • the photocurable resin (radical polymerization) is as described in the specific description of the first embodiment.
  • photocurable resin (cationic polymerization)
  • the photocurable resin (cationic polymerization) is as described in the specific description of the first embodiment.
  • the curable resin composition can contain an alkali-soluble resin.
  • the alkali-soluble resin is as described in the specific description of the first embodiment.
  • the curable resin composition may further contain a thermoplastic resin in order to improve the mechanical strength of the obtained cured film.
  • the thermoplastic resin is as described in the specific description of the first embodiment.
  • the curable resin composition may contain a curing agent.
  • the curing agent is as described in the specific form of the first embodiment.
  • the curable resin layer can contain a curing accelerator.
  • the curing accelerator is as described in the specific form of the first embodiment.
  • the curable resin composition can contain a photoreaction initiator.
  • the photoreaction initiator is as described in detail in the first embodiment.
  • the curable resin composition may contain an inorganic filler.
  • the inorganic filler is as described in the specific form of the first embodiment.
  • the curable resin composition may contain an organic solvent used for preparing the composition and adjusting the viscosity.
  • the organic solvent is as described in the specific description of the first embodiment.
  • the curable composition may include a colorant.
  • the colorant is as described in the specific form of the first embodiment.
  • the structure of the present invention may include a second film.
  • the second film is a film provided on the surface opposite to the first film of the resin layer for the purpose of preventing dust and the like from adhering to the surface of the resin layer of the structure and improving handleability.
  • the second film may be one that can be peeled off from the resin layer before being attached to the substrate during use.
  • a film made of the thermoplastic resin exemplified in the first film can be used.
  • polyester film and polyolefin film are preferable from the viewpoint of heat resistance, mechanical strength, handleability and the like.
  • the surface of the second film on which the resin layer is provided may be subjected to a mold release treatment.
  • the thickness of the second film is not particularly limited and can be appropriately selected depending on the intended use.
  • the thickness of the second film is preferably 10 ⁇ m or more and 100 ⁇ m or less, and more preferably 15 ⁇ m or more and 50 ⁇ m or less, from the viewpoint of mechanical strength, handleability, and the like.
  • the structure according to the present invention can be preferably used as a sealing or protective application for a SAW filter. In addition to the above applications, it is preferably for forming a cured film of a printed wiring board, more preferably for forming a permanent protective film, an interlayer insulating layer, a coverlay, a solder resist, or a fill-in-the-blank filling (material). ) Is particularly preferable. Further, since the structure of the present invention can form a cured product having excellent film strength even with a thin film, it is a pattern layer in a printed wiring board, for example, a package substrate (printed wiring board used for a semiconductor package), which is required to be thinned. It can also be suitably used for formation. Further, the structure of the present invention can be suitably used for a flexible printed wiring board.
  • the electrical and electronic component according to the present invention includes the above-mentioned printed wiring board.
  • the electrical and electronic components according to the present invention can be used in various conventionally known electrical devices. Of these, a SAW filter is preferable.
  • the substrate examples include a printed wiring board, an LTCC (Low Temperature Co-fired Ceramics) substrate (hereinafter, also referred to as a low-temperature co-fired ceramic substrate), a ceramic substrate, a silicon substrate, and a metal substrate.
  • LTCC Low Temperature Co-fired Ceramics
  • electrical and electronic components include sensors, MEMS, SAW chips and the like. Among them, a pressure sensor, a vibration sensor, and a SAW chip can be preferably used, and the SAW chip is particularly preferable.
  • thermosetting resin composition When the thermosetting resin composition is made into a dry film, it is preferable that the thermosetting resin composition is bonded onto the base material under pressure and heating using a vacuum laminator or the like.
  • a vacuum laminator By using such a vacuum laminator, when a board on which components are mounted is used, even if there are irregularities, it adheres to the substrate, so that there is no air bubbles mixed in and the sealing performance of electrical and electronic components is improved. improves.
  • the pressurizing condition is preferably about 0.1 to 2.0 MPa, and the heating condition is preferably 40 to 120 ° C.
  • Curing performed after applying the thermosetting resin composition is performed by directing the hot air in the dryer using a hot air circulation type drying oven, IR furnace, hot plate, convection oven, etc. (using a heat source equipped with an air heating method using steam). It can be carried out by using a method of flowing contact and a method of spraying on a support from a nozzle). Among these, from the viewpoint of curability, it is preferable to use a hot air circulation drying furnace. For example, after the first step of heating at 80 to 120 ° C., preferably 90 to 110 ° C. for 10 to 60 minutes, preferably 20 to 40 minutes, further 180 ° C. to 220 ° C., preferably 190 to 210 ° C.
  • the cured product can be formed by performing the second stage heat curing for 30 to 120 minutes, preferably 50 to 70 minutes. It is preferable to perform two-step curing in that the generation of bubbles during curing can be suppressed. Specifically, by volatilizing the residual solvent component in the first step, it is possible to suppress the generation of bubbles during the main curing. Next, the curing can be completed by curing at a higher temperature in the second step.
  • Example of the first embodiment> ⁇ Preparation Example A of Curable Resin Composition> (Formulation Example A1)
  • the solvent shown in Formulation Example A1 in Table 1 below was placed in a container, heated to 50 ° C. so that the solvent did not volatilize, each epoxy resin was added, and the mixture was sufficiently stirred and dissolved. Then, additives and fillers are added and kneaded with a three-roll mill, a curing agent, a curing accelerator, and other resins are further added, and the mixture is sufficiently stirred with a stirrer to obtain a curable resin composition. rice field.
  • composition Example A3 A curable resin composition was obtained in the same procedure as in Formulation Example 1 except that the formulation was changed to the formulation shown in Formulation Example A3 shown in Table 1 below.
  • the combination of the first film shown in Table 2, the resin layer using the above curable resin composition (thermosetting resin layer), and the second film 3 A layered structure was obtained.
  • the curable resin composition obtained above was applied onto the first film using a bar coater so that the film thickness of the resin layer became 100 ⁇ m after drying.
  • a resin layer was formed on the first film by drying in a hot air circulation type drying oven at 85 ° C. for 5 to 15 minutes so that the amount of residual solvent was 1.0 to 4.0%.
  • the second film was laminated on the surface of the dry coating film using a roll laminator under the conditions of a set temperature of 90 ° C. and a pressure of 0.15 MPa to obtain a structure having a three-layer structure.
  • the film prepared above is subjected to a tensile tester (stock) under the following conditions in accordance with JIS K 7128-1: 1998 "Plastic-Film and Sheet Tear Strength Test Method-Part 1: Trouser Tear Method”.
  • the trouser tearing force was measured using EZ-SX, manufactured by Shimadzu Corporation. However, regarding the measurement direction, only the vertical direction (MD direction) was measured regardless of the presence or absence of anisotropy depending on the direction. 20 mm at the start of tearing and 5 mm before the end of tearing were excluded, and the approximate average value of the tear strength of the remaining 50 mm was calculated. The measurement results are shown in Table 2.
  • ⁇ Measurement of haze> The haze of the film prepared above was measured using a haze mate (NDH7000II, manufactured by Nippon Denshoku Kogyo Co., Ltd.) in accordance with ASTMD1003. The measurement results are shown in Table 2.
  • ⁇ Presence or absence of film marks> The appearance of the resin layer when peeled from the second film side of the structure obtained above at an angle of 180 degrees and a speed of 2 cm / sec was visually confirmed.
  • the film marks on the resin layer were evaluated according to the following criteria, and the evaluation results are shown in Table 3. (Evaluation criteria) ⁇ : There were no film marks on the resin layer. ⁇ : There were film marks on the resin layer that did not affect the use. X: There were film marks on the resin layer that had a large effect on use.
  • ⁇ Visibility of the appearance of the structure > The visibility of the appearance was visually confirmed from the second film side (front) and the first film side (back) of the structure obtained above. The visibility of the appearance of the structure was evaluated according to the following criteria, and the evaluation results are shown in Table 3. (Evaluation criteria) ⁇ : It was easy to distinguish the front and back of the structure. ⁇ : The front and back of the structure could be distinguished. X: The front and back of the structure could not be distinguished.
  • the structure of the embodiment of the first embodiment of the present application can easily distinguish the front and the back, and when the second film is peeled off, it is possible to make it difficult for the resin layer to have film marks. rice field.
  • Example of the second embodiment> ⁇ Preparation Example B of Curable Resin Composition> (Formulation Example B1)
  • the solvent shown in Formulation Example B1 in Table 4 below was placed in a container, heated to 50 ° C. so that the solvent did not volatilize, each epoxy resin was added, and the mixture was sufficiently stirred and dissolved. Then, additives and fillers are added and kneaded with a three-roll mill, a curing agent, a curing accelerator, and other resins are further added, and the mixture is sufficiently stirred with a stirrer to obtain a curable resin composition. rice field.
  • a structure was obtained by combining the first film shown in Table 5 and a resin layer (curable resin layer) using the above-mentioned curable resin composition. Specifically, the curable resin composition obtained above is applied on a first film to which a tension of 100 N / m is applied in the MD direction with a die coater, and then dried at 100 ° C. for 3.5 minutes. Then, a curable resin layer was formed to obtain a structure.
  • the trouser tearing force was measured using a tensile tester (manufactured by Shimadzu Corporation, EZ-SX) under the following conditions in accordance with JIS K 7128-1: 1998. 20 mm at the start of tearing and 5 mm before the end of tearing were excluded, and the approximate average value of the tear strength of the remaining 50 mm was calculated. The measurement results are shown in Table 5.
  • a measurement sample was obtained by cutting out 40 mm in the MD direction from a position 10 m in the MD direction from the end of the dry coating film (resin layer) of the structure obtained above. About the measurement sample, 25 points were measured at a pitch of 20 mm in the TD direction from a position 15 mm away from the end of the dry coating film (resin layer) using an automatic measurement type film thickness meter (TOFJ manufactured by Yamabun Denki Co., Ltd.). .. From the measurement results of 25 points, the maximum value, the minimum value, and the average value were calculated. The average value is shown in Table 5.
  • the variation in thickness was calculated from the difference between the maximum value and the minimum value by the following formula, and evaluated by the following criteria.
  • Thickness variation (%) (maximum value-minimum value) / average value x 100 (Evaluation criteria)
  • ⁇ The difference between the maximum value and the minimum value of 25 points was 5% or less with respect to the average value.
  • ⁇ The difference between the maximum value and the minimum value of 25 points was more than 5% and 10% or less with respect to the average value.
  • X The difference between the maximum value and the minimum value of 25 points was more than 10% with respect to the average value.
  • the resin layer of the structure of the second embodiment of the present application has a thickness of 50 ⁇ m or more, but has a small variation in thickness.

Abstract

Le problème décrit par la présente invention est de fournir une structure d'une structure multicouche qui facilite la reconnaissance des côtés avant et arrière de celle-ci et empêche qu'une piste de film soit laissée sur une couche de résine lorsqu'un second film est séparé. La solution selon la présente invention porte sur une structure comportant un premier film, une couche de résine et un second film, dans cet ordre, la structure étant caractérisée en ce qu'une différence entre une résistance à l'allongement d'une déchirure du premier film et une résistance à l'allongement d'une déchirure du second film est de inférieure ou égale à -0,05 N ou supérieure ou égale à +0,05 N, une différence de trouble entre le premier film et le second film est inférieure ou égale à 5 % ou inférieure ou égale à +5 %, ou une différence entre une valeur L*, une valeur a*, et une valeur b* dans un espace colorimétrique Lab mesurée sur le côté du premier film de la structure et une valeur L*, une valeur a*, et une valeur b* dans l'espace colorimétrique Lab mesurée sur le côté du second film de la structure satisfait une condition spécifique.
PCT/JP2021/012128 2020-03-31 2021-03-24 Structure WO2021200429A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022512005A JP7186920B2 (ja) 2020-03-31 2021-03-24 構造体
CN202180015814.0A CN115135496A (zh) 2020-03-31 2021-03-24 结构体
JP2022186907A JP2023016876A (ja) 2020-03-31 2022-11-22 構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-063383 2020-03-31
JP2020063383 2020-03-31

Publications (1)

Publication Number Publication Date
WO2021200429A1 true WO2021200429A1 (fr) 2021-10-07

Family

ID=77929575

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/012128 WO2021200429A1 (fr) 2020-03-31 2021-03-24 Structure

Country Status (4)

Country Link
JP (2) JP7186920B2 (fr)
CN (1) CN115135496A (fr)
TW (1) TW202144187A (fr)
WO (1) WO2021200429A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320592A (ja) * 1992-05-22 1993-12-03 Nitto Denko Corp 両面粘着テープ
JP2001253033A (ja) * 2000-03-09 2001-09-18 Sekisui Chem Co Ltd マーキングフィルム
WO2005066246A1 (fr) * 2003-12-26 2005-07-21 Sekisui Chemical Co., Ltd. Film de demoulage
JP2006232896A (ja) * 2005-02-22 2006-09-07 Kyodo Giken Kagaku Kk 粘接着フィルム
JP2013067743A (ja) * 2011-09-26 2013-04-18 Mitsubishi Plastics Inc 基材レス両面粘着シート
JP2015217530A (ja) * 2014-05-14 2015-12-07 株式会社巴川製紙所 粘着型高硬度透明フィルム
JP2020062786A (ja) * 2018-10-16 2020-04-23 藤森工業株式会社 袋用ラミネートフィルム及びその製造方法
JP2020069720A (ja) * 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
JP2021000747A (ja) * 2019-06-20 2021-01-07 味の素株式会社 樹脂シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6952530B2 (en) * 2003-12-19 2005-10-04 The Aerospace Corporation Integrated glass ceramic systems
JP5320592B2 (ja) 2009-03-18 2013-10-23 大学共同利用機関法人 高エネルギー加速器研究機構 中性子線の単色集光装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05320592A (ja) * 1992-05-22 1993-12-03 Nitto Denko Corp 両面粘着テープ
JP2001253033A (ja) * 2000-03-09 2001-09-18 Sekisui Chem Co Ltd マーキングフィルム
WO2005066246A1 (fr) * 2003-12-26 2005-07-21 Sekisui Chemical Co., Ltd. Film de demoulage
JP2006232896A (ja) * 2005-02-22 2006-09-07 Kyodo Giken Kagaku Kk 粘接着フィルム
JP2013067743A (ja) * 2011-09-26 2013-04-18 Mitsubishi Plastics Inc 基材レス両面粘着シート
JP2015217530A (ja) * 2014-05-14 2015-12-07 株式会社巴川製紙所 粘着型高硬度透明フィルム
JP2020062786A (ja) * 2018-10-16 2020-04-23 藤森工業株式会社 袋用ラミネートフィルム及びその製造方法
JP2020069720A (ja) * 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
JP2021000747A (ja) * 2019-06-20 2021-01-07 味の素株式会社 樹脂シート

Also Published As

Publication number Publication date
CN115135496A (zh) 2022-09-30
JPWO2021200429A1 (fr) 2021-10-07
TW202144187A (zh) 2021-12-01
JP7186920B2 (ja) 2022-12-09
JP2023016876A (ja) 2023-02-02

Similar Documents

Publication Publication Date Title
KR101545724B1 (ko) 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
WO2019163292A1 (fr) Composition de résine pour composants électroniques multicouches, film sec, produit durci, composant électronique multicouche, et carte de circuit imprimé
JP2017198746A (ja) ドライフィルム、硬化物およびプリント配線板
JP2017198747A (ja) ドライフィルム、硬化物およびプリント配線板
WO2018143220A1 (fr) Composition de résine photodurcissable, film sec, produit durci et carte imprimée
JP2020166207A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6748478B2 (ja) ドライフィルム、硬化物およびプリント配線板
WO2018123695A1 (fr) Composition durcissable, résine de base, agent de durcissement, film sec, produit durci, et carte à circuit imprimé
WO2021200429A1 (fr) Structure
WO2020066049A1 (fr) Composition de résine durcissable, feuil sec, produit durci, structure stratifiée et composant électronique
JP2020057667A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP6724097B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
JP7101513B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
CN113448166A (zh) 固化性树脂组合物、干膜、固化物和电子部件
KR20160117237A (ko) 적층 필름
CN113631603A (zh) 固化性树脂组合物、干膜、固化物和电子部件
JP2020055927A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、積層構造体、および、電子部品
JP6774185B2 (ja) 積層構造体およびプリント配線板
JP7339103B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
KR102092554B1 (ko) 지문 인식 센서 모듈의 착색층용 드라이 필름 조성물 및 그 경화물인 착색층을 갖는 지문 인식 센서 모듈
JP2006267152A (ja) プリント配線板保護膜用感光性ドライフィルム及びその製造方法
WO2019187587A1 (fr) Composition de résine durcissable, feuil sec, produit durci, structure stratifiée et composant électronique
CN115151028A (zh) 电子部件用绝缘膜以及制造电子部件用绝缘膜的方法
JP2020052362A (ja) 硬化物の製造方法、これに用いる感光性樹脂組成物、ドライフィルム、硬化物および電子部品
JP2023149638A (ja) ドライフィルム、硬化物、および該硬化物からなる被膜を備えたプリント配線板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21779056

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022512005

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21779056

Country of ref document: EP

Kind code of ref document: A1