WO2021170016A1 - 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法 - Google Patents

高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法 Download PDF

Info

Publication number
WO2021170016A1
WO2021170016A1 PCT/CN2021/077756 CN2021077756W WO2021170016A1 WO 2021170016 A1 WO2021170016 A1 WO 2021170016A1 CN 2021077756 W CN2021077756 W CN 2021077756W WO 2021170016 A1 WO2021170016 A1 WO 2021170016A1
Authority
WO
WIPO (PCT)
Prior art keywords
etching
basket
cst
tray
thin glass
Prior art date
Application number
PCT/CN2021/077756
Other languages
English (en)
French (fr)
Inventor
孔繁盛
张永强
阳利民
Original Assignee
成都拓米双都光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 成都拓米双都光电有限公司 filed Critical 成都拓米双都光电有限公司
Publication of WO2021170016A1 publication Critical patent/WO2021170016A1/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching

Definitions

  • the present disclosure relates to the technical field of ultra-thin glass preparation, and more specifically, to a rotary etching device and a rotary etching method for high-precision ultra-thin glass.
  • the cover glass of the foldable mobile phone requires ultra-thin Ultra-thin Glass (referred to as UTG for short, which solves the problems of the current cover material CPI).
  • Ultra-thin Glass products require precise glass thickness and surface quality. At present, 0.07mm glass can be purchased on the market, but the price is very expensive, and thinner glass is not sold.
  • the 0.2-0.4mm thick glass is reduced to 0.03-0.07mm ultra-thin glass for use.
  • the original process used to manufacture thin glass is to first fix the glass substrate to the basket, and then move the basket only in the direction of the left and right for etching. At this time, because the thickness of the glass substrate is thick, when the amount of glass etching increases, the etching conditions of each area caused by the solution flowing from top to bottom and the deviation of the spray pressure of the etching solution are different, which eventually leads to increased thickness deviation and poor surface quality. And other shortcomings.
  • the present disclosure proposes a rotary etching device and a rotary etching method that can ensure that the etching conditions on all surfaces of the glass substrate are the same, increase the thickness precision and improve the surface quality.
  • An aspect of the present disclosure provides a high-precision rotary etching device for ultra-thin glass, the rotary etching device includes:
  • Basket tool used to fix several jigs loaded with glass substrates
  • CST tray used to install baskets, can move significantly and swing slightly, and can control the rotation of the baskets;
  • the etching equipment has an etching area capable of spraying etching liquid on the top or both sides of the CST tray and a cleaning area capable of spraying cleaning liquid on the top or both sides of the CST tray.
  • the clamp is in the form of a plate with low flexibility, and the thickness is 2 to 3 mm.
  • the basket has a plurality of jig insertion grooves and has a jig position locking structure, and the jig can expose all areas of the loaded glass substrate in the basket.
  • the CST tray has a rotatable fixed frame for mounting baskets and a drive assembly, and the drive assembly drives the rotation of the rotatable fixed frame.
  • the rotatable fixed frame of the tray can rotate with the rotation of the rotatable fixed frame, wherein the rotatable fixed frame has a basket position locking structure.
  • the CST tray can move widely between the etching zone and the cleaning zone, and the CST tray can also swing slightly laterally in the etching zone or the cleaning zone.
  • the swing amplitude is 10-300mm, wherein the driving assembly drives the movement and swing of the CST tray.
  • the clamps, baskets, CST trays, and etching equipment are made of acid-resistant PC, PE, or PVC, and the driving components are sealed and protected.
  • Another aspect of the present disclosure provides a high-precision ultra-thin glass rotary etching method, using the above-mentioned high-precision ultra-thin glass rotary etching device to perform high-precision ultra-thin glass etching, wherein the high-precision ultra-thin glass is The thickness is 0.03-0.1mm, and the thickness deviation is ⁇ 5% of the glass thickness.
  • a number of clamps loaded with glass substrates are installed in a basket and fixed, and then the basket is installed on the CST tray and fixed, and the basket is assembled.
  • the glass substrate is etched in the etching area of the etching equipment by rotating the basket on the CST tray of the etching equipment. After the etching is completed, move the CST tray to the cleaning area to clean the glass in a continuous rotating basket, and then take out the basket in progress. And clean and take out the jig for final cleaning to obtain high-precision ultra-thin glass.
  • the surfaces of the fixture and the glass substrate are substantially parallel to the spray direction of the etching solution or the cleaning solution, and the central axis of the basket rotation is perpendicular to the fixture and the glass.
  • the surface of the substrate; the CST tray can move greatly laterally between the etching area and the cleaning area, and the CST tray can also swing slightly laterally in the etching area or the cleaning area with a swing amplitude of 10 to 300 mm.
  • the method of spacing the rotating basket is to divide the total etching time t into 4n parts and each sub-time period is t/4n, where t is the time And n is a positive integer greater than or equal to 1, starting from the initial position and in the same direction at the beginning of each sub-period, rotate 90 degrees to perform the etching of the sub-period until the etching is completed; the method of continuously rotating the basket is in Continue to rotate the basket during the spraying of the cleaning liquid, and continue to rotate for 2 to 5 minutes after stopping the spraying of the cleaning liquid.
  • the high-precision ultra-thin glass is suitable for foldable or rollable cover glass in foldable mobile phones or rollable mobile phones, and bendable OLED lighting Cover glass, cover glass to improve fingerprint recognition performance, and OLED, TFT-LCD, and micro-LED screen panels.
  • the present disclosure is a method for improving the surface quality and thickness deviation by rotating the glass substrate in the chemical etching process when manufacturing ultra-thin glass with a thickness of 0.03-0.1mm.
  • This method is suitable for foldable mobile phones or rollable mobile phones with foldable or rollable covers Etching of plate glass, flexible OLED lighting, cover glass that can improve fingerprint recognition performance, and glass substrates for OLED, TFT-LCD, and micro-LED screen panels.
  • the present disclosure is different from many methods that only move the glass to the left and right for etching.
  • the use of equipment and components featuring rotating glass in the etching process can reduce the flow of the etching solution and the pressure difference in different areas.
  • the surface quality is reduced and thickness deviation and other problems.
  • FIG. 1 shows a schematic diagram of the overall structure of a rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure (etching equipment is not shown).
  • Fig. 2 shows a schematic diagram of the structure of a clamp and a basket in a rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure.
  • FIG. 3a shows a schematic diagram of the rotating manner of the basket during etching of the rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure
  • FIG. 3b shows a high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure Schematic diagram of the rotation of the basket during cleaning of the rotary etching device.
  • FIG. 4 shows a schematic diagram illustrating the process of a spin etching method for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure
  • #1-etching solution or cleaning solution #2-CST tray; #3-basket; #4-glass substrate; #5-fixture.
  • the present disclosure aims to achieve the same etching conditions on all sides of the glass substrate, so as to eliminate the problems of upper and lower quality deviations caused by the flow of solution sprayed from top to bottom, and left and right quality deviations caused by spray pressure deviations.
  • FIG. 1 shows a schematic diagram of the overall structure of a rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure (etching equipment is not shown).
  • the rotary etching device for high-precision ultra-thin glass of the present disclosure includes a fixture #5, a basket #3, and a CST tray #2 With etching equipment, high-precision etching is achieved through the cooperation of various components.
  • Fig. 2 shows a schematic diagram of the structure of a clamp and a basket in a rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure.
  • jig #5 is used to load a glass substrate. Since the glass substrate #4 cannot be moved after being fixed to the jig, the jig #5 is preferably in the form of a plate with low flexibility, and the thickness is preferably 2 to 3 mm.
  • the fixing method can be to place the glass substrate #4 on the jig #5 and fix the four corners of the glass substrate with adhesive cloth or stick the glass substrate to the jig with an adhesive.
  • the basket #3 is used to fix several clamps #5 loaded with the glass substrate #4, and then the glass substrate #4 is fixed.
  • the basket #3 has a plurality of clamp insertion slots and has a clamp position locking structure.
  • the clamp #5 can expose all areas of the loaded glass substrate in the basket #3 to ensure that all areas of the glass substrate can be processed later. It is exposed during the process, and the etching solution sprayed from the top or both sides during rotation can also be sprayed to all areas of the glass substrate.
  • the clamp position locking structure can prevent the clamp #5 from separating or flowing from the basket #3 and ensure that the position of the glass substrate is fixed. Specifically, the existing locking structure in the prior art can be used.
  • the CST tray #2 is used to install the basket #3 to process the glass substrate #4 in the etching equipment.
  • the CST tray #2 can move significantly and slightly swing and can control the rotation of the basket #3.
  • the etching equipment has an etching area capable of spraying etching solution #1 on the top or both sides of the CST tray and a cleaning area capable of spraying cleaning solution #1 on the top or both sides of the CST tray.
  • the present disclosure is applicable to the Top Spray method of spraying from the top and the Side Spray method of spraying from the side, which can be implemented by etching equipment of different structures.
  • CST tray #2 controls the basket tool #3 to rotate at a set time to enable the specific rotary etching of the present disclosure. The specific method will be described in detail later.
  • CST tray #2 preferably has a rotatable fixed frame for mounting basket #3 and a drive assembly (not shown), the drive assembly drives the rotation of the rotatable fixed frame, and basket #3 is installed on the CST tray #2's rotatable fixed frame and can rotate with the rotation of the rotatable fixed frame.
  • the rotatable fixed frame has a basket position locking structure to prevent the basket #3 from being separated from the rotatable fixed frame and shaking due to flow.
  • the position locking structure of the basket should have a key fixing function, because the glass substrate needs to be cleaned as soon as possible after the etching process is completed, but if fixing with screws and other fixing parts is used, it takes more time and may cause stains.
  • CST tray #2 The main function of CST tray #2 is to install basket #3 and move it to the inside of the etching equipment and make it rotatable.
  • the central axis perpendicular to the surface of the fixture #5 and the glass substrate #4 it is preferable to use the central axis perpendicular to the surface of the fixture #5 and the glass substrate #4 as the rotation axis, and the basket #3 is rotated according to the setting by the rotation of the drive assembly Angle and time to rotate.
  • CST tray #2 can move greatly laterally between the etching area and the cleaning area to realize the switching of the etching process and the cleaning process.
  • CST tray #2 can also swing slightly and horizontally in the etching area or the cleaning area. The swing amplitude is 10-300mm to realize fine adjustment during etching, in which the drive assembly also drives the movement of CST tray #2.
  • fixture #5 In order to avoid corrosion, fixture #5, basket #3, CST tray #2 and etching equipment are made of acid-resistant PC, PE or PVC, and the drive components of CST tray #2 are sealed to prevent corrosion. .
  • the high-precision ultra-thin glass rotary etching method of the present disclosure uses the above-mentioned high-precision ultra-thin glass rotary etching device to perform high-precision ultra-thin glass etching.
  • the thickness of the prepared high-precision ultra-thin glass is 0.03 ⁇ 0.1mm, and the thickness deviation is ⁇ 5% of the thickness of the glass.
  • CST tray #2 is used to etch the glass substrate in the etching area of the etching equipment by rotating the basket at intervals. After the etching is completed, move the CST tray to the cleaning area to clean the glass in a continuous rotating basket, and then take out the basket in progress And clean and take out the jig for final cleaning to obtain high-precision ultra-thin glass.
  • the surfaces of the jig #5 and the glass substrate #4 are substantially parallel to the spraying direction of the etching liquid or the cleaning liquid, and the central axis of the rotation of the basket #3 is perpendicular to the surfaces of the jig #5 and the glass substrate #4.
  • the CST tray #2 can move greatly laterally between the etching zone and the cleaning zone, and the CST tray #2 can also swing slightly laterally in the etching zone or the cleaning zone with a swing range of 10 to 300 mm.
  • FIG. 3a shows a schematic diagram of the rotating manner of the basket during etching of the rotary etching device for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure
  • FIG. 3b shows a high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure Schematic diagram of the rotation of the basket during cleaning of the rotary etching device.
  • the interval rotating basket of the present disclosure can be distributed and implemented at any angle and time within the range of 0-360 degrees, that is, the interval rotation is performed within the total etching time to realize the etching at each angle.
  • the conditions are unified.
  • a more preferred way is: divide the total etching time t into 4n parts and each sub-time period is t/4n, where t is time and n is a positive integer greater than or equal to 1, starting from the initial position in the same direction At the beginning of each sub-period, the etching of the sub-period is performed by rotating 90 degrees until the etching is completed.
  • the method of the present disclosure to continuously rotate the basket #3 is to continuously rotate the basket #3 during the spraying of the cleaning liquid and continue to rotate for 2 to 5 minutes after the spraying of the cleaning liquid is stopped.
  • Continuous rotation can effectively remove the etching solution that may remain on the glass substrate, prevent surface stains caused by the acidic solution for a long time, and improve product quality.
  • the rotating basket #3 can be peeled off and thrown out of the solution on the glass substrate #4 by rotating force. When the CST tray is unloaded from the etching equipment, it can minimize the cleaning liquid remaining on the glass substrate. Improve the working environment.
  • FIG. 4 shows a schematic diagram illustrating the process of a spin etching method for high-precision ultra-thin glass according to an exemplary embodiment of the present disclosure
  • the basket with several fixtures (equipped with glass substrates) is placed in the rotatable fixed frame of the CST tray, and it is rotated in the etching zone or cleaning zone where the etching solution or cleaning solution is sprayed from the top.
  • the ultra-thin glass is suitable for the manufacture of cover glass for foldable mobile phones, rollable mobile phones, OLED lighting, and OLED, TFT, and MicroLED substrates.
  • the neutralization tank contains a weak alkaline solution below 40 degrees, which can completely neutralize any remaining residues.
  • Etching liquid on glass substrates and baskets Take out the basket from the neutralization tank, and after unlocking, separate the clamp (attached with the glass that has completed the thin etching process) from the basket and perform final cleaning to obtain the final product.
  • the thickness of the prepared high-precision ultra-thin glass is 0.03-0.1mm, and the thickness deviation is ⁇ 5% of the glass thickness.
  • the present disclosure is not limited to the foregoing specific embodiments.
  • the present disclosure extends to any new feature or any new combination disclosed in this specification, and any new method or process step or any new combination disclosed.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

一种高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法。该装置包括：夹具，用于装载玻璃基板；篮具，用于固定若干个装载有玻璃基板的夹具；CST托盘，用于安装篮具，能够大幅移动和小幅摆动并且能够控制篮具旋转；蚀刻设备，具有能够在CST托盘顶部或者两侧喷射蚀刻液的蚀刻区和能够在CST托盘顶部或者两侧喷射清洗液的清洗区。该方法采用上述旋转蚀刻装置进行蚀刻，得到厚度为0.03～0.1mm、厚度偏差为玻璃厚度的±5％的超薄玻璃。

Description

高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法 技术领域
本公开涉及超薄玻璃制备的技术领域，更具体地讲，涉及一种高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法。
背景技术
可折叠手机的盖板玻璃需要用到极薄的Ultra thin Glass(简称为UTG，该材料解决了当前的盖板材料CPI存在的问题)，Ultra thin Glass类产品要求精密的玻璃厚度和表面品质。目前市面上可以购买到0.07mm的玻璃，但价格很贵，比它更薄的玻璃是没有销售的。
所以，实际中是将0.2～0.4mm的厚玻璃减薄成0.03～0.07mm的超薄型玻璃来使用。原先制造薄玻璃使用的工艺，是先将玻璃基板固定在篮具，将篮具只按照进行方向的左右移动进行蚀刻。这时由于玻璃基板的厚度较厚，当玻璃蚀刻量增多时，由从上往下流动的溶液和因蚀刻溶液的喷射压力偏差造成的各区域蚀刻条件不同，最终导致厚度偏差增高、表面品质低下等缺点。
所以，需要制定出能够让玻璃表面的所有区域都在同一条件并改善表面品质和厚度精密度的解决方案。
发明内容
针对现有技术中存在的问题，本公开提出了一种可确保玻璃基板所有面的蚀刻条件达到同一，提高厚度精密度并改善表面品质的旋转蚀刻装置及旋转蚀刻方法。
本公开的一方面提供了一种高精度超薄玻璃的旋转蚀刻装置，所述旋转蚀 刻装置包括：
夹具，用于装载玻璃基板；
篮具，用于固定若干个装载有玻璃基板的夹具；
CST托盘，用于安装篮具，能够大幅移动和小幅摆动并且能够控制篮具旋转；
蚀刻设备，具有能够在CST托盘顶部或者两侧喷射蚀刻液的蚀刻区和能够在CST托盘顶部或者两侧喷射清洗液的清洗区。
根据本公开高精度超薄玻璃的旋转蚀刻装置的一个实施例，所述夹具为具有低柔软度的板形态，厚度为2～3mm。
根据本公开高精度超薄玻璃的旋转蚀刻装置的一个实施例，所述篮具具有多个夹具插入槽并且具有夹具位置锁定结构，所述夹具在篮具中能够暴露所装载玻璃基板的所有区域。
根据本公开高精度超薄玻璃的旋转蚀刻装置的一个实施例，所述CST托盘具有安装篮具的可旋转固定框和驱动组件，驱动组件驱动可旋转固定框的转动，所述篮具在CST托盘的可旋转固定框中能够随着可旋转固定框的转动而转动，其中，所述可旋转固定框具有篮具位置锁定结构。
根据本公开高精度超薄玻璃的旋转蚀刻装置的一个实施例，所述CST托盘能够在蚀刻区与清洗区之间横向大幅移动，所述CST托盘还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm，其中，所述驱动组件驱动所述CST托盘的移动和摆动。
根据本公开高精度超薄玻璃的旋转蚀刻装置的一个实施例，所述夹具、篮具、CST托盘以及蚀刻设备的材质均为耐酸性的PC、PE或PVC材质，驱动组件被密封保护。
本公开的另一方面提供了一种高精度超薄玻璃的旋转蚀刻方法，采用上述高精度超薄玻璃的旋转蚀刻装置进行高精度超薄玻璃的蚀刻，其中，所述高精度超薄玻璃的厚度为0.03～0.1mm、厚度偏差为玻璃厚度的±5％。
根据本公开高精度超薄玻璃的旋转蚀刻方法的一个实施例，将若干个装载有玻璃基板的夹具装在篮具中并固定，再将篮具安装到CST托盘上并固定，将装好篮具的CST托盘在蚀刻设备的蚀刻区以间隔旋转篮具的方式进行玻璃基板的蚀刻，蚀刻结束后移动CST托盘至清洗区以持续旋转篮具的方式进行玻璃的清洗，随后取出篮具进行中和清洗并取出夹具进行最终清洗，得到高精度超薄玻璃。
根据本公开高精度超薄玻璃的旋转蚀刻方法的一个实施例，所述夹具和玻璃基板的表面基本平行于蚀刻液或清洗液的喷射方向，所述篮具旋转的中心轴垂直于夹具和玻璃基板的表面；所述CST托盘能够在蚀刻区与清洗区之间横向大幅移动，所述CST托盘还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm。
根据本公开高精度超薄玻璃的旋转蚀刻方法的一个实施例，所述间隔旋转篮具的方式为将总蚀刻时间t分为4n份且每份子时间段为t/4n，其中，t为时间且n为大于或等于1的正整数，从初始位置开始以相同的方向在每份子时间段开始时旋转90度进行该份子时间段的蚀刻直至完成蚀刻；所述持续旋转篮具的方式为在喷射清洗液期间持续旋转篮具并在停止喷射清洗液之后继续旋转2～5分钟。
根据本公开高精度超薄玻璃的旋转蚀刻方法的一个实施例，所述高精度超薄玻璃适用于可折叠手机或可卷曲手机中可折叠或可卷曲的盖板玻璃、可弯曲的OLED照明中的盖板玻璃、提升指纹识别性能的盖板玻璃以及OLED、 TFT-LCD、micro-LED的屏幕面板。
本公开在制造0.03～0.1mm厚度的极薄玻璃时通过化学蚀刻过程中旋转玻璃基板来改善表面品质和厚度偏差的方法，此方法适用于可折叠手机或可卷曲手机可折叠或可卷曲的盖板玻璃、可弯曲的OLED照明以及能提高指纹识别性能的盖板玻璃以及制造OLED、TFT-LCD、micro-LED屏幕面板的基板等玻璃的蚀刻。根据上述目的，本公开不同于将玻璃仅向左右移动进行蚀刻的诸多方法，在蚀刻工艺中使用以旋转玻璃为特征的设备和组件，可以减少因蚀刻溶液的流动及不同区域的压力差而造成的表面质量下降和厚度偏差等问题。
附图说明
图1示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置的整体结构示意图(未示出蚀刻设备)。
图2示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置中夹具和篮具的结构示意图。
图3a示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置在蚀刻时篮具的旋转方式示意图，图3b示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置在清洗时篮具的旋转方式示意图。
图4示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻方法的工艺说明示意图，
附图标记说明：
#1-蚀刻液或者清洗液；#2-CST托盘；#3-篮具；#4-玻璃基板；#5-夹具。
具体实施方式
本说明书中公开的所有特征，或公开的所有方法或过程中的步骤，除了互 相排斥的特征和/或步骤以外，均可以以任何方式组合。
本说明书中公开的任一特征，除非特别叙述，均可被其他等效或具有类似目的的替代特征加以替换。即，除非特别叙述，每个特征只是一系列等效或类似特征中的一个例子而已。
本公开旨在让玻璃基板所有面的蚀刻条件达到同一，从而消除由从上而下喷射的溶液流动造成的上下品质偏差和因喷射压力偏差导致的左右品质偏差等问题。
在下文中，先对本公开的高精度超薄玻璃的旋转蚀刻装置进行详细说明。
图1示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置的整体结构示意图(未示出蚀刻设备)。
如图1所示，根据本公开的示例性实施例，为了能将玻璃基板蚀刻得更加均匀，本公开高精度超薄玻璃的旋转蚀刻装置包括夹具#5、篮具#3、CST托盘#2和蚀刻设备，通过各组件的配合实现高精度蚀刻。
图2示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置中夹具和篮具的结构示意图。
如图2所示，根据本公开，夹具#5用于装载玻璃基板。因为玻璃基板#4固定在夹具后不能移动，夹具#5优选为具有低柔软度的板形态，厚度为2～3mm为最佳。固定方式可以为把玻璃基板#4放在夹具#5上后用胶布固定玻璃基板的四角或者把玻璃基板用粘合剂粘到夹具上。
篮具#3用于固定若干个装载有玻璃基板#4的夹具#5，进而固定玻璃基板#4。优选地，篮具#3具有多个夹具插入槽并且具有夹具位置锁定结构，夹具#5在篮具#3中能够暴露所装载玻璃基板的所有区域以保证玻璃基板的所有区域均能够在后续加工过程中暴露，旋转时从顶端或两侧喷出的蚀刻溶液也可以喷 射到玻璃基板的所有区域。夹具位置锁定结构能够防止夹具#5从篮具#3分离或者流动并确保玻璃基板的位置固定，具体可以采用现有技术中已有的锁定结构。
CST托盘#2用于安装篮具#3以在蚀刻设备内对玻璃基板#4进行相关加工工艺，CST托盘#2能够大幅移动和小幅摆动并且能够控制篮具#3旋转。蚀刻设备具有能够在CST托盘顶部或者两侧喷射蚀刻液#1的蚀刻区和能够在CST托盘顶部或者两侧喷射清洗液#1的清洗区。本公开适用于从顶部喷射的Top Spray方法和从侧面喷射的Side Spray方式，可通过不同结构的蚀刻设备来实现。
其中CST托盘#2的大幅移动能够实现蚀刻区至清洗区的移动，CST托盘#2的小幅移动能够在喷射区中横向移动，抵消由喷射喷嘴的压力和流量差异引起的偏差。CST托盘#2控制篮具#3按设定的时间旋转以能够实现本公开特定的旋转蚀刻，具体方法将在后文详细说明。
如图1所示，CST托盘#2优选地具有安装篮具#3的可旋转固定框和驱动组件(未示出)，驱动组件驱动可旋转固定框的转动，篮具#3安装在CST托盘#2的可旋转固定框中并且能够随着可旋转固定框的转动而转动。其中，可旋转固定框具有篮具位置锁定结构以防止篮具#3从可旋转固定框分离及因流动发生晃动。篮具位置锁定结构应有一键固定功能为最佳，因为玻璃基板在完成蚀刻工艺后需尽快进行清洗，但如果使用螺丝等固定件进行固定则费时较多还可能发生污点。
CST托盘#2的主要作用在于安装篮具#3并移送至蚀刻设备内部以及使之可以旋转。为了让安装篮具的可旋转固定框可以旋转，优选地以垂直于夹具#5和玻璃基板#4表面的中心轴做旋转轴，并通过驱动组件的旋转使篮具#3根据 设定的旋转角度和时间来旋转。由此，一方面CST托盘#2能够在蚀刻区与清洗区之间横向大幅移动实现蚀刻工艺和清洗工艺的切换，另一方面CST托盘#2还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm实现蚀刻时的微调，其中，驱动组件也驱动CST托盘#2的移动。
为了避免腐蚀，夹具#5、篮具#3、CST托盘#2以及蚀刻设备的材质均为耐酸性的PC、PE或PVC材质，CST托盘#2的驱动组件则被密封保护以防止其被腐蚀。
接下来结合上述装置进行高精度超薄玻璃旋转蚀刻方法的说明。
本公开的高精度超薄玻璃旋转蚀刻方法采用上述高精度超薄玻璃的旋转蚀刻装置进行高精度超薄玻璃的蚀刻。其中，制备得到高精度超薄玻璃的厚度为0.03～0.1mm、厚度偏差为玻璃厚度的±5％，可以适用于可折叠手机或可卷曲手机中可折叠或可卷曲的盖板玻璃、可弯曲的OLED照明中的盖板玻璃、提升指纹识别性能的盖板玻璃以及OLED、TFT-LCD、micro-LED的屏幕面板。
具体地，将若干个装载有玻璃基板#4的夹具#5装在篮具#3中并固定，再将篮具#3安装到CST托盘#2上并固定，将装好篮具#3的CST托盘#2在蚀刻设备的蚀刻区以间隔旋转篮具的方式进行玻璃基板的蚀刻，蚀刻结束后移动CST托盘至清洗区以持续旋转篮具的方式进行玻璃的清洗，随后取出篮具进行中和清洗并取出夹具进行最终清洗，得到高精度超薄玻璃。
根据本公开，夹具#5和玻璃基板#4的表面基本平行于蚀刻液或清洗液的喷射方向，篮具#3旋转的中心轴垂直于夹具#5和玻璃基板#4的表面。并且，CST托盘#2能够在蚀刻区与清洗区之间横向大幅移动，CST托盘#2还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm。
图3a示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置 在蚀刻时篮具的旋转方式示意图，图3b示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻装置在清洗时篮具的旋转方式示意图。
如图3a所示，本公开的间隔旋转篮具的方式可以以0～360度范围内的任意角度和时间进行分配并实施，即在总蚀刻时间内间隔进行旋转实现使每个角度下的蚀刻条件达到统一。
更优选的方式为：将总蚀刻时间t分为4n份且每份子时间段为t/4n，其中，t为时间且n为大于或等于1的正整数，从初始位置开始以相同的方向在每份子时间段开始时旋转90度进行该份子时间段的蚀刻直至完成蚀刻。例如，当n＝1时，假设总蚀刻时间为1小时，则总蚀刻时间分为4份且每份子时间段为1/4小时即15分钟，初始位置时开始喷射蚀刻液进行蚀刻，15分钟后顺时针或逆时针旋转篮具90度继续进行蚀刻，30分钟后同方向继续旋转篮具90度进行蚀刻(相对于初始位置已旋转180度)，以此类推直至完成总蚀刻时间的蚀刻。
如图3b所示，本公开持续旋转篮具#3的方式为在喷射清洗液期间持续旋转篮具#3并在停止喷射清洗液之后继续旋转2～5分钟。持续旋转可以有效去除可能残留在玻璃基板上的蚀刻溶液，防止因酸性溶液长时间残留造成的表面污点并提升产品品质。清洗液停止喷射后继续旋转篮具#3可以通过旋转力剥离并甩出玻璃基板#4上的溶液，从蚀刻设备中卸载CST托盘等时可以最大限度的减少残留在玻璃基板上的清洗液并改善作业环境。
下面结合实施例对本公开作进一步说明。
实施例：
图4示出了根据本公开示例性实施例的高精度超薄玻璃的旋转蚀刻方法的工艺说明示意图，
如图4所示，将固定了若干个夹具(装置有玻璃基板)的篮具装入CST托盘的可旋转固定框内，在从顶部喷射蚀刻液或清洗液的蚀刻区或清洗区内进行旋转，从而将玻璃基板蚀刻至0.1mm以下并制造出高精度超薄玻璃，该超薄玻璃适用于可折叠手机、可卷曲手机、OLED照明的盖板玻璃以及OLED、TFT、MicroLED的基板制造。
首先，将附有需要蚀刻的玻璃基板#4的夹具#5插入篮具#3并锁定夹具以防止夹具从篮具分离或者流出。再将篮具装在CST托盘的可旋转固定框并锁定篮具以防止篮具从框体分离及因流动发生晃动。这
然后，将装有篮具的CST托盘移动至蚀刻设备内，开始喷射蚀刻液，控制CST托盘在蚀刻溶液的喷射区横向摆动以抵消由喷嘴的压力和流量差异引起的偏差，同时使篮具按设定的时间间隔旋转进行蚀刻。
当蚀刻结束后将CST托盘移动至喷射清洗液的清洗领域并横向摆动，同时CST托盘持续360度旋转，完全中和掉可能残留在玻璃基板的蚀刻溶液。清洗液停止喷射后，继续旋转篮具5分钟以通过旋转力剥离玻璃基板上的溶液。
蚀刻工艺和清洗工艺结束后，从蚀刻设备取出CST托盘并解除锁定，分离篮具并放入中和槽，中和槽中盛有40度以下的弱碱性溶液，可完全中和掉可能残留在玻璃基板和篮具的蚀刻液。从中和槽取出篮具，解除锁定后将夹具(附有已完成薄蚀刻工艺的玻璃)从篮具分离并进行最终清洗，得到最终产品。
经检测，制备得到高精度超薄玻璃的厚度为0.03～0.1mm、厚度偏差为玻璃厚度的±5％。
本公开并不局限于前述的具体实施方式。本公开扩展到任何在本说明书中披露的新特征或任何新的组合，以及披露的任一新的方法或过程的步骤或任何新的组合。

Claims (11)

  1. 一种高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述旋转蚀刻装置包括：
    夹具，用于装载玻璃基板；
    篮具，用于固定若干个装载有玻璃基板的夹具；
    CST托盘，用于安装篮具，能够大幅移动和小幅摆动并且能够控制篮具旋转；
    蚀刻设备，具有能够在CST托盘顶部或者两侧喷射蚀刻液的蚀刻区和能够在CST托盘顶部或者两侧喷射清洗液的清洗区。
  2. 根据权利要求1所述高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述夹具为具有低柔软度的板形态，厚度为2～3mm。
  3. 根据权利要求1所述高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述篮具具有多个夹具插入槽并且具有夹具位置锁定结构，所述夹具在篮具中能够暴露所装载玻璃基板的所有区域。
  4. 根据权利要求1所述高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述CST托盘具有安装篮具的可旋转固定框和驱动组件，驱动组件驱动可旋转固定框的转动，所述篮具在CST托盘的可旋转固定框中能够随着可旋转固定框的转动而转动，其中，所述可旋转固定框具有篮具位置锁定结构。
  5. 根据权利要求4所述高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述CST托盘能够在蚀刻区与清洗区之间横向大幅移动，所述CST托盘还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm，其中，所述驱动组件驱动所述CST托盘的移动和摆动。
  6. 根据权利要求4所述高精度超薄玻璃的旋转蚀刻装置，其特征在于，所述夹具、篮具、CST托盘以及蚀刻设备的材质均为耐酸性的PC、PE或PVC 材质，驱动组件被密封保护。
  7. 一种高精度超薄玻璃的旋转蚀刻方法，其特征在于，采用权利要求1至6中任一项所述高精度超薄玻璃的旋转蚀刻装置进行高精度超薄玻璃的蚀刻，其中，所述高精度超薄玻璃的厚度为0.03～0.1mm、厚度偏差为玻璃厚度的±5％。
  8. 根据权利要求7所述高精度超薄玻璃的旋转蚀刻方法，其特征在于，将若干个装载有玻璃基板的夹具装在篮具中并固定，再将篮具安装到CST托盘上并固定，将装好篮具的CST托盘在蚀刻设备的蚀刻区以间隔旋转篮具的方式进行玻璃基板的蚀刻，蚀刻结束后移动CST托盘至清洗区以持续旋转篮具的方式进行玻璃的清洗，随后取出篮具进行中和清洗并取出夹具进行最终清洗，得到高精度超薄玻璃。
  9. 根据权利要求8所述高精度超薄玻璃的旋转蚀刻方法，其特征在于，所述夹具和玻璃基板的表面基本平行于蚀刻液或清洗液的喷射方向，所述篮具旋转的中心轴垂直于夹具和玻璃基板的表面；所述CST托盘能够在蚀刻区与清洗区之间横向大幅移动，所述CST托盘还能够在蚀刻区或清洗区内横向小幅摆动且摆动幅度为10～300mm。
  10. 根据权利要求8所述高精度超薄玻璃的旋转蚀刻方法，其特征在于，所述间隔旋转篮具的方式为将总蚀刻时间t分为4n份且每份子时间段为t/4n，其中，t为时间且n为大于或等于1的正整数，从初始位置开始以相同的方向在每份子时间段开始时旋转90度进行该份子时间段的蚀刻直至完成蚀刻；所述持续旋转篮具的方式为在喷射清洗液期间持续旋转篮具并在停止喷射清洗液之后继续旋转2～5分钟。
  11. 根据权利要求7所述高精度超薄玻璃的旋转蚀刻方法，其特征在于， 所述高精度超薄玻璃适用于可折叠手机或可卷曲手机中可折叠或可卷曲的盖板玻璃、可弯曲的OLED照明中的盖板玻璃、提升指纹识别性能的盖板玻璃以及OLED、TFT-LCD、micro-LED的屏幕面板。
PCT/CN2021/077756 2020-02-25 2021-02-25 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法 WO2021170016A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010116316.2 2020-02-25
CN202010116316.2A CN111285612B (zh) 2020-02-25 2020-02-25 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法

Publications (1)

Publication Number Publication Date
WO2021170016A1 true WO2021170016A1 (zh) 2021-09-02

Family

ID=71020505

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/077756 WO2021170016A1 (zh) 2020-02-25 2021-02-25 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法

Country Status (2)

Country Link
CN (1) CN111285612B (zh)
WO (1) WO2021170016A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114873926A (zh) * 2022-05-20 2022-08-09 苏州瑞资特智能科技有限公司 Utg超薄柔性玻璃减薄生产工艺方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111285612B (zh) * 2020-02-25 2021-03-19 拓米(成都)应用技术研究院有限公司 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法
CN111816593B (zh) * 2020-07-28 2023-03-14 福建晶安光电有限公司 提高晶片蚀刻均匀性的方法及装置
CN112341004B (zh) * 2020-10-26 2021-11-16 恩利克(浙江)显示科技有限公司 超薄玻璃基板制程方法以及显示面板制程方法
CN113173708B (zh) * 2021-03-10 2024-05-14 凯盛科技股份有限公司 一种提高柔性玻璃弯折性能的加工方法
CN113306270B (zh) * 2021-04-27 2023-01-10 江西沃格光电股份有限公司 超薄玻璃减薄去胶分离装置
CN113416000A (zh) * 2021-07-27 2021-09-21 惠州吉祥达机械设备有限公司 玻璃减薄装置
CN113880446B (zh) * 2021-10-13 2023-05-09 温州光中玻璃科技有限公司 一种全方位均匀蚀刻的玻璃蚀刻机
CN113943109B (zh) * 2021-11-12 2023-11-03 Oppo广东移动通信有限公司 防眩光玻璃的制备方法、壳体以及电子设备
CN114393816A (zh) * 2021-11-28 2022-04-26 凯盛科技股份有限公司蚌埠华益分公司 一种玻璃正面酸刻蚀反面覆耐酸膜设备和方法
CN114031303A (zh) * 2021-11-29 2022-02-11 成都拓米双都光电有限公司 高精度超薄玻璃的制备方法
CN116564866B (zh) * 2023-07-10 2023-09-05 盛奕半导体科技(无锡)有限公司 一种半导体湿法刻蚀清洁装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101080806A (zh) * 2004-12-17 2007-11-28 英特尔公司 在利用独立晶舟旋转的批次喷洒工艺中提高的均匀性
KR20130022936A (ko) * 2011-08-26 2013-03-07 주식회사 이지테크놀러지 유리기판 식각장치
CN103539363A (zh) * 2012-07-09 2014-01-29 技迪科技股份有限公司 超薄玻璃的制造方法
CN104445969A (zh) * 2014-12-31 2015-03-25 成都工投电子设备有限公司 喷淋蚀刻机
KR101620375B1 (ko) * 2016-02-02 2016-05-23 지에프 주식회사 적층, 컷팅공정을 포함하는 초박형 유리 가공방법
CN207175778U (zh) * 2017-08-24 2018-04-03 东莞市龙博自动化设备有限公司 一种改进的玻璃蚀刻机
CN111285612A (zh) * 2020-02-25 2020-06-16 拓米(成都)应用技术研究院有限公司 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101080806A (zh) * 2004-12-17 2007-11-28 英特尔公司 在利用独立晶舟旋转的批次喷洒工艺中提高的均匀性
KR20130022936A (ko) * 2011-08-26 2013-03-07 주식회사 이지테크놀러지 유리기판 식각장치
CN103539363A (zh) * 2012-07-09 2014-01-29 技迪科技股份有限公司 超薄玻璃的制造方法
CN104445969A (zh) * 2014-12-31 2015-03-25 成都工投电子设备有限公司 喷淋蚀刻机
KR101620375B1 (ko) * 2016-02-02 2016-05-23 지에프 주식회사 적층, 컷팅공정을 포함하는 초박형 유리 가공방법
CN207175778U (zh) * 2017-08-24 2018-04-03 东莞市龙博自动化设备有限公司 一种改进的玻璃蚀刻机
CN111285612A (zh) * 2020-02-25 2020-06-16 拓米(成都)应用技术研究院有限公司 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114873926A (zh) * 2022-05-20 2022-08-09 苏州瑞资特智能科技有限公司 Utg超薄柔性玻璃减薄生产工艺方法
CN114873926B (zh) * 2022-05-20 2023-08-22 苏州瑞资特智能科技有限公司 Utg超薄柔性玻璃减薄生产工艺方法

Also Published As

Publication number Publication date
CN111285612A (zh) 2020-06-16
CN111285612B (zh) 2021-03-19

Similar Documents

Publication Publication Date Title
WO2021170016A1 (zh) 高精度超薄玻璃的旋转蚀刻装置及旋转蚀刻方法
TWI459462B (zh) 用於電漿處理設備之複合噴頭電極組件用之清理硬體套組
US4968375A (en) Etching apparatus
US7743449B2 (en) System and method for a combined contact and non-contact wafer cleaning module
US20090039054A1 (en) Etching apparatus of glass substrate for flat panel display and method of ectching glass substrate for flat panel display using the same
CN111253076A (zh) 通过旋转单面蚀刻制造高精度超薄玻璃的方法及其玻璃
EP1708252A4 (en) DEVELOPMENT DEVICE AND DEVELOPMENT PROCESS
US7517431B2 (en) Spinning apparatus
US7007333B1 (en) System and method for a combined contact and non-contact wafer cleaning module
KR20080072230A (ko) 스캔 분사형 노즐 구동부를 가진 기판 처리 장치
KR101292221B1 (ko) 매엽식 세정 및 건조 장치, 매엽식 세정 및 건조 방법
JP2007207973A (ja) 表面処理方法及び表面処理装置
CN215613584U (zh) 一种晶圆清洗台及晶圆清洗装置
KR102159929B1 (ko) 기판 처리 방법
JP4230840B2 (ja) 基板処理方法および基板処理装置
JP2002075943A (ja) 基板処理装置および基板処理方法
KR20020033260A (ko) 반도체 웨이퍼용 세정장치
JP2003234321A (ja) 洗浄方法
KR20100027466A (ko) 웨이퍼 세정장치 및 이를 이용한 웨이퍼 세정방법
KR100493558B1 (ko) 스핀 식각 장치
KR100591777B1 (ko) 스핀 세정 장치
JP2003068700A (ja) 基板処理装置および基板処理方法
JPH06320099A (ja) 洗浄ノズルとこれを用いた基板洗浄装置
KR102596300B1 (ko) 기판 세정 장치
JPH0529305B2 (zh)

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21760210

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21760210

Country of ref document: EP

Kind code of ref document: A1