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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
  • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/38—Polysiloxanes modified by chemical after-treatment
  • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
  • C08G77/392—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing sulfur
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
  • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
  • C09D183/10—Block or graft copolymers containing polysiloxane sequences
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
  • C09J183/10—Block or graft copolymers containing polysiloxane sequences
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2201/00—Properties
  • C08L2201/10—Transparent films; Clear coatings; Transparent materials

Definitions

• the present invention relates to a photocurable silicone composition and a cured product thereof.
• Curable silicone compositions having good optical transparency and mechanical properties are utilized as adhesives or encapsulants.
• Photocurable silicone compositions enabling relatively low curing temperature are mainly used for an optical display because thermally instable components like liquid crystalline, OLED, touch panel, and cover lens are needed to use the image display unit.
• a thixotropic property of the photocurable silicone composition has recently been required to improve dimensional accuracy and productivity of the optical display.
• a high thixotropic curable silicone composition can be used as a stencil/screen printable material or a dam material for the optical display.
• Patent Document 1 discloses a photocurable silicone resin composition
• a photocurable silicone resin composition comprising: an organopolysiloxane having silicon atom-bonded mercaptoalkyl groups, an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups, a photoinitiator, and a silane compound having an aliphatic unsaturated group.
• a photocurable silicone resin composition has a problem that the composition exhibits poor thixotropic property.
• Patent Document 2 discloses a thixotropic photocurable silicone composition
• a thixotropic photocurable silicone composition comprising: an organopolysiloxane having silicon atom-bonded mercaptoalkyl groups, an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups including a linear organopolysiloxane and optionally including a branched organopolysiloxane, a photoinitiator, and a fumed silica having a BET specific surface area of 180 to 500 m 2 /g.
• Patent Document 3 discloses a photocurable silicone composition
• a photocurable silicone composition comprising: a mercapto-functional organopolysiloxane having the unit formula: [(CH ) SiO-
• a photocurable silicone composition has a problem that the composition exhibits poor transparency.
• Patent Document 1 US Patent Application Publication No. 2013/0065983 A1
• Patent Document 2 US Patent Application Publication No. 2015/0232666 A1
• Patent Document 3 US Patent Application Publication No. 2016/0244625 A1
• the photocurable silicone composition of the present invention comprises: (A) an organopolysiloxane represented by the following average composition formula: R1 a R2 b SiO (4-a-b)/2 wherein, R1 is a C 2-12 alkenyl group; R2 is a C 1-12 alkyl group, a C 6-12 aryl group, or a C 7-12 aralkyl group; provided that at least one R 2 in a molecule is the aryl group or the aralkyl group; and "a" and "b” are positive numbers satisfying: 1 ⁇ a+b ⁇ 2.5 and 0.001 ⁇ a/(a+b) ⁇ 0.2; (B) a polysiloxane block copolymer comprising: (i) a polysiloxane block represented by the general formula: (R 3 2 SiO) n , wherein each R 3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C
• the polysiloxane block (i) in component (B) is at least one selected from a group consisting of a polysiloxane block represented by the following formula: [(CH 3 ) 2 SiO] n a polysiloxane block represented by the following formula:
• each "n” is a positive number of at least about 5; and each "n1" and “n2” is a positive number, provided that "n1+n2" is a positive number of at least about 5.
• the organo block (ii) in component (B) is at least one selected form a group consisting of an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: and an organo block represented by the following formula: [0011]
• the content of the polysiloxane block (i) in component (B) is in a range of from about 60 to about 90 mass% of the sum of the polysiloxane block (i) and the organo block (ii).
• component (B) is a reaction product produced by reaction of: (B1) a polysiloxane represented by the general formula: R 5 (R 3 2 SiO) n SiR 3 2 R 5 wherein each R3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C 7-12 aralkyl group; each R 5 is independently a alkenyl group; and "n" is a positive number of at least about 5; and (B2) an organo compound having at least three thiol groups in a molecule, in a presence of (B3) a photoinitiator by irradiation with UV ray.
• a polysiloxane represented by the general formula: R 5 (R 3 2 SiO) n SiR 3 2 R 5 wherein each R3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C 7-12 aralkyl group; each R 5 is independently a alkenyl group; and "n
• raw material (B1) has a number average molecular weight of from about 500 to about 50,000 in accordance with a standard polystyrene basis by gel permeation chromatography.
• raw material (B2) is at least one selected from a group consisting of an organo compound represented by the following formula: and an organo compound represented by the following formula:
• a reaction amount of raw material (B2) is in an amount such that the thiol groups in raw material (B2) is in a range of from about 2.0 to about 10.0 moles per 1 mole of the total alkenyl groups in raw material (B1).
• the cured product of the present invention is characterized by being obtained by irradiating the photocurable silicone composition described above with light.
• the photocurable silicone composition of the present invention exhibits excellent thixotropic property without failing its transparency. Furthermore, the cured product of the present invention exhibits excellent transparency.
• DETAILED DESCRIPTION OF THE INVENTION [0019]
• the terms “comprising” or “comprise” are used herein in their broadest sense to mean and encompass the notions of “including,” “include,” “consist(ing) essentially of,” and “consist(ing) of.
• a hyphen “-” or dash “ ” in a range of values is “to” or “through”; a “>” is “above” or “greater-than”; a “ ⁇ ” is “at least” or “greater-than or equal to”; a “ ⁇ ” is “below” or “less-than”; and a “ ⁇ ” is “at most” or “less-than or equal to.”
• a hyphen “-” or dash “ ” in a range of values is “to” or “through”; a “>” is “above” or “greater-than”; a “ ⁇ ” is “at least” or “greater-than or equal to”; a “ ⁇ ” is “below” or “less-than”; and a “ ⁇ ” is “at most” or “less-than or equal to.”
• a range “of from 0.1 to 0.9” may be further delineated into a lower third, i.e., from 0.1 to 0.3, a middle third, i.e., from 0.4 to 0.6, and an upper third, i.e., from 0.7 to 0.9, which individually and collectively are within the scope of the appended claims, and may be relied upon individually and/or collectively and provide adequate support for specific embodiments within the scope of the appended claims.
• a range such as “at least,” “greater than,” “less than,” “no more than,” and the like, it is to be understood that such language includes subranges and/or an upper or lower limit.
• a range of “at least 10” inherently includes a subrange of from at least 10 to 35, a subrange of from at least 10 to 25, a subrange of from 25 to 35, and so on, and each subrange may be relied upon individually and/or collectively and provides adequate support for specific embodiments within the scope of the appended claims.
• an individual number within a disclosed range may be relied upon and provides adequate support for specific embodiments within the scope of the appended claims.
• a range “of from 1 to 9” includes various individual integers, such as 3, as well as individual numbers including a decimal point (or fraction), such as 4.1, which may be relied upon and provide adequate support for specific embodiments within the scope of the appended claims.
• polysiloxane block copolymer used herein are designed to mean reaction products of a polysiloxane and an organo compound which does not have a siloxane unit, or compositions essentially consisting of the reaction products.
• the polysiloxane block copolymer is generally formed having linear and/or three-dimensional units, typically formed via ene-thiol reactions.
• ⁇ Photocurable silicone composition> [0024]
• Component (A) is a base compound of the present composition and is an organopolysiloxane represented by the average composition formula: R 1 a R2 b SiO (4-a-b)/2 .
• R 1 is a C 2-12 alkenyl group, and examples thereof include vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, undecenyl group, and dodecenyl group. Among these, vinyl group and hexenyl group are preferred.
• R2 is a C 1-12 alkyl group, a C 6-12 aryl group, or a 2 aralkyl group.
• alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, and dodecyl group.
• methyl group is preferred.
• aryl group examples include phenyl group, tolyl group, naphthyl group, and biphenyl group. Among these, phenyl group is preferred.
• examples of the aralkyl group include phenylmethyl group, 1- phenylethyl group, 2-phenylethyl group, and 2-phenylpropyl group.
• At least one R 2 in a molecule is the aryl group or the aralkyl group. In certain embodiments, at least 10 mol%, alternatively at least 15 mol% of R 2 in a molecule are the aryl groups. [0027] Furthermore, in the formula, "a" and “b” are positive numbers satisfying: 1 ⁇ a+b ⁇ 2.5, and preferably 1.5 ⁇ a+b ⁇ 2.2, and satisfying: 0.001 ⁇ a/(a+b) ⁇ 0.2, and preferably 0.001 ⁇ a/(a+b) ⁇ 0.1.
• Component (A) may be one type of organopolysiloxane that satisfies the average composition formula above or may be a mixture of at least two types of organopolysiloxanes that satisfy the average composition formula above.
• the state of component (A) at 25°C is not limited and is preferably a liquid.
• the viscosity at 25°C of component (A) is not limited; however, the viscosity is preferably in a range of 100 to 1,000,000 mPa ⁇ s. Note that in the present specification, viscosity is the value measured using a type B viscometer according to ASTM D 1084 at 23 ⁇ 2 °C.
• Component (B) is a curing agent of the present composition and is a polysiloxane block copolymer comprising: (i) a polysiloxane block and (ii) an organo block.
• the polysiloxane block (i) is represented by the general formula: (R 3 2 SiO) n .
• each R 3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C 7-12 aralkyl group. Examples of such groups for R 3 include the groups described above for R 2 . In certain embodiments, R 3 is a methyl group or a phenyl group.
• n is a positive number of at least about 5, preferably at least about 10. This is because, when “n” is greater than or equal to the lower limit described above, compatibility of component (B) to component (A) can increase.
• the polysiloxane block (i) is not limited, but is preferably at least one selected from a group consisting of a polysiloxane block represented by the following formula: [ (CH 3 ) 2 SiO] n a polysiloxane block represented by the following formula: [ (C 6 H 5 ) 2 SiO] n a polysiloxane block represented by the following formula: [ (CH 3 ) 2 SiO] n1 [(C 6 H 5 ) 2 SiO] n2 and a polysiloxane represented by the following formula: [ (CH 3 )(C 6 H 5 )SiO] n wherein each "n” is a positive number of at least 5; and each "n1" and "n2
• the polysiloxane block (i) essentially comprises the polysiloxane block represented by the general formula: (R 3 2 SiO) n , but it may comprise other siloxane units such as R 3 3 SiO 1/2 , [0035]
• the organo block (ii) contains at least three sulfur atoms and is free of silicon (Si) atom in a chemical structure thereof.
• the organo block (ii) is not limited, but it is preferably at least one selected form a group consisting of an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: an organo block represented by the following formula: and an organo block represented by the following formula: [0036]
• the polysiloxane block (i) is bonded to the organo block (ii) via a linkage represented by the general formula: (Si)-R 4 -(S).
• Si is an atom in a chemical structure of the polysiloxane block (i) and S is an atom in a chemical structure of the organo block (ii).
• R 4 is a alkylene group. Examples of the alkenyl group include vinyl groups, allyl groups, butenyl groups, pentenyl groups, heptenyl groups, and hexenyl groups.
• the content of the polysiloxane block (i) in component (B) is not limited, but it is preferably in a range of from about 60 to about 90 mass% of the sum of the polysiloxane block (i) and the organo block (ii).
• Component (B) has at least two thiol (HS-) groups in a molecule.
• the bonding positions of the thiol groups in the polysiloxane block copolymer for component (B) are not particularly limited, and examples thereof include a position in the organo block (ii) other than the organo block represented by the following formula:
• the number average molecular weight (Mn) of the polysiloxane block copolymer for component (B) on a standard polystyrene basis by gel permeation chromatography is not limited, but it is preferably in the range from about 3,000 to about 50,000, alternatively in the range from about 4,000 to about 10,000. This is because, when the molecular weight of the polysiloxane block copolymer is within the range described above, the resulting silicone block copolymer can promote to form a cured product having excellent tensile strength and low modulus.
• a method of producing the polysiloxane block copolymer for component (B) is not limited, but is preferably a method characterized by reacting (B1) a polysiloxane represented by the general formula: R 5 (R 3 2 SiO) n SiR 3 2 R 5 wherein each R3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C 7-12 aralkyl group; each R 5 is independently a alkenyl group; and "n" is a positive number of at least about 5; and (B2) an organo compound having at least three thiol groups in a molecule, in a presence of a photoinitiator (B3) by irradiation with UV ray.
• B1 a polysiloxane represented by the general formula: R 5 (R 3 2 SiO) n SiR 3 2 R 5 wherein each R3 is independently a C 1-12 alkyl group, a C 6-12 aryl group, or a C
• Raw material (B1) preferably has a number average molecular weight of about 500 from about 50,000 in accordance with a standard polystyrene basis by gel permeation chromatography.
• Raw material (B2) is not limited as long as an organo component has at least three thiol groups in a molecule, but it is preferably at least one selected from a group consisting of an organo compound represented by the following formula: and an organo compound represented by the following formula: [0046]
• a reaction amount of raw material (B2) is not limited but it is preferably in an amount such that the thiol groups in raw material (B2) is in a range of from about 2.0 to about 10.0 moles, alternatively in a range of from about 2.5 to about 10.0 moles, or alternatively in a range of from about 2.5 to about 8.0 moles, per 1 mole of the total alkenyl groups in raw material (B1).
• reaction amount of raw material (B2) is within the range described above, transparency of the resulting polysiloxane block copolymer increases.
• the reaction is initiated in a presence of raw material (B3) by irradiation with UV ray.
• Raw material (B3) is not limited.
• raw material (B3) examples include phenone type photoinitiators such as 2,2-dimethoxy-1,2-diphenylethan-1-one (IRGACURE 651: manufactured by BASF), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (DAROCUR 1173: manufactured by BASF), 1-hydroxy-cyclohexyl-phenyl-ketone (IRGACURE 184: manufactured by BASF), 1-[4- (2-hydroxyethoxy) phenyl]-2-hydroxy-2-methyl-1-propan-1-one (IRGACURE 2959: manufactured by BASF), 2-hydroxy-1- ⁇ 4-[4-(2-hydroxy-2-methyl-propionyl) benzyl]-phenyl ⁇ -2- methyl-propan-1-one (IRGACURE 127: manufactured by BASF), 2-methyl-1-(4- methylthiophenyl)-2-morpholinopropan-1-one (IRGACURE 907: manufactured by BASF), 2- benzyl-2-dimethylamino-
• 1-hydroxy- cyclohexyl-phenyl-ketone (IRGACURE 184: manufactured by BASF), 2,2-dimethoxy-1,2- diphenylethan-1-one (IRGACURE 651: manufactured by BASF), 2-hydroxy-2-methyl-1-phenyl- propan-1-one (DAROCUR 1173: manufactured by BASF), phenylbis(2,4,6- trimethylbenzoyl)phosphine oxide (IRGACURE 819, manufactured by BASF), and ethyl(2,4,6- trimethylbenzoyl)phenyl phosphonate (TPO-L, manufactured by BASF) are preferred.
• the photoinitiator (C) may be used alone or in combination of two or more.
• a reaction amount of raw material (B3) is not limited, but it is preferably in a range of from about 0.001 to about 1 mass%, alternatively in a range of from about 0.005 to about 0.1 mass%, or alternatively in a range of from about 0.005 to about 0.1 mass%, of the total of raw materials (B1), (B2), and (B3).
• the reaction is conducted by ultraviolet irradiation.
• ultraviolet irradiation For example, low pressure, high pressure or ultrahigh pressure mercury lamp, metal halide lamp, (pulse) xenon lamp, or an electrodeless lamp is useful as an UV lamp.
• Irradiation dose is preferably in a range of from 2,000 to 10,000 mJ/cm 2 , alternatively in a range of from 3,000 to 6,000 mJ/cm 2 .
• the content of component (B) is an amount such that the amount of the thiol groups in component (B) is in a range of from 0.2 to 2.0 moles, or optionally in a range of 0.3 to 1.6 moles, per 1 mole of the total alkenyl groups in component (A). This is because, when the content of component (B) is within the range described above, mechanical strength of the resulting cured product increases.
• Component (C) is a photoinitiator to initiate photocuring reaction of the present composition.
• component (C) examples include the photoinitiators described above for raw material (B3).
• the content of component (C) is in a range of from 0.01 to 5 parts by mass, optionally in a range of from 0.05 to 2 parts by mass, or optionally in a range of from 0.1 to 1.5 parts by mass, per 100 parts by mass of a total mass of components (A) and (B). This is because, when the content of component (C) is within the range described above, curing efficiently proceeds to form a cured product having excellent heat resistance and light resistance.
• Component (D) is an inorganic filler to impart thixotropic property to the present composition.
• the fillers include one or more of finely divided treated or untreated precipitated or fumed silica; and metal oxides such as fumed or precipitated titanium dioxide, cerium oxide, magnesium oxide, zinc oxide, and iron oxide.
• the content of component (D) is in an amount of about 0.01 to about 40 parts by mass, alternatively about 0.05 to about 30 parts by mass, and alternatively about 0.05 to about 20 parts by mass, per 100 parts by mass of a total mass of components (A) and (B).
• the present composition comprises components (A) to (D) described above; however, to impart heat resistance to a cured product of the present composition, mercapto-containing organo compound; and a hindered phenol compound is preferably contained.
• Examples of such mercapto-containing organo compounds include o-, m-, or p- xylenedithiol, ethyleneglycol bisthioglycolate, butanediol bisthioglycolate, hexanediol bisthioglycolate, ethyleneglycol bis(3-thiopropionate), butanediol bis(3-thiopropionate), trimethylolpropane tris(3-thiopropionate), pentaerythritol tetrakis(3-thiopropionate), trihydroxyethyl triisocyanuric acid tris(3-thiopropionate), and organopolysiloxanes substituted with a mercapto group.
• the content of the mercapto-containing organo compounds is not limited; however, the content is preferably in a range of 0.001 to 1 part by mass, and preferably in a range of 0.003 to 0.5 parts by mass, per 100 parts by mass of component (A).
• hindered phenol compound examples include pentaerythritol tetrakis[3-(3,5-di- tert-butyl-4-hydroxyphenyl)propionate], thiodiethylene bis[3-(3,5-di-tert-butyl-4- hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,4- dimethyl-6-(1-methylpentadecyl)phenol, diethyl[ ⁇ 3,5-bis(1,1-di-tert-butyl-4- hydroxyphenyl)methyl ⁇ phosphonate, 33′,3′′,5,5′,5′′-hexane-tert-butyl-4-a,a′,a′′-(mesitylene- 2,4,6-tolyl)tri-p-cresol, 4,6-bis(octylthiomethyl)-o
• the content of hindered phenol compound is not limited; however, the content is preferably in a range of 0.001 to 1 part by mass, and preferably in a range of 0.003 to 0.5 parts by mass, per 100 parts by mass of component (A).
• the present composition may further contain, as an optional component, to enhance storage stability in a light-shielded condition of the present composition, a radical scavenger is preferably contained.
• radical scavenger examples include hindered amines, such as N,N′,N′′,N′′′-tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)-triazin-2-yl)- 4,7-diazadecane-1,10-diamine, bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1- dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, methyl-1,2,2,6,6-pentamethyl-4- piperidylsebacate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1,2,2,6,6-pentamethyl-4- piperidyl)sebacate, and 8-acetyl-3-dodecyl-7,7,9,9-tetramethyl-1,3,8-tri
• the content of the radical scavenger is not limited; however, the content is preferably in a range of 0.0001 to 1 part by mass, optionally 0.0001 to 0.1 parts by mass, or optionally 0.0001 to 0.05 parts by mass, per 100 parts by mass of component (A).
• the present composition may further contain, as an optional component, to enhance adhesion property of the present composition, an adhesion promoter is preferably contained.
• adhesion promoter examples include, but are not limited to: epoxy group-containing alkoxysilanes such as 3-glycidoxytrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3- glycidoxypropylmethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and 4- oxysilanylbutyltrimethoxysilane; acrylic group-containing alkoxysilanes such as 3- methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3- acryloxypropyltrimethoxysilane; amino group-containing alkoxysilanes such as 3- aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3- aminopropyltrimethoxysilane, and N-phenyl-3
• the adhesion promoter comprises, or is, selected from reaction mixtures of the above epoxy group-containing alkoxysilanes and the above amino group-containing alkoxysilanes.
• the content of the adhesion promoter is not limited provided that it is an amount that can impart sufficient adhesion to the organic resin that the composition contacts during curing.
• the content of the adhesion promoter is in a range of from about 0.01 to about 10 parts by mass, or optionally in a range of from about 0.01 to about 5 parts by mass, relative to 100 parts by mass of component (A).
• the viscosity at 25°C of the present composition is not limited; however, the viscosity is preferably in a range of 100 to 100,000 mPa ⁇ s, optionally in a range of 200 to 100,000 mPa ⁇ s, or optionally in a range of 1,000 to 50,000 mPa ⁇ s. This is because, when the viscosity of the present composition is greater than or equal to the lower limit of the range described above, a cured product having high mechanical strength can be obtained. On the other hand, when the viscosity is less than or equal to the upper limit of the range described above, excellent coatability/workability of the resulting composition is achieved.
• the cured product of the present invention is obtained by irradiating the photocurable silicone composition described above with light.
• the light used to cure the present composition include ultraviolet light and visible light; however, the light with a wavelength in a range of 250 to 500 nm is preferred. This is because excellent curability is achieved, and the cured product is not decomposed by the light.
• the ultraviolet-curing is conducted by ultraviolet irradiation.
• low pressure, high pressure or ultrahigh pressure mercury lamp, metal halide lamp, (pulse) xenon lamp, or an electrodeless lamp is useful as an UV lamp.
• Irradiation dose is preferably in a range of from 5 to 6,000 mJ/cm 2 , or optionally in a range of from 10 to 4,000 mJ/cm 2 .
• the cured product is typically optically transparent. This is because when the cured product is preferably used for an optical device or an image display, optical transparency is desired for high performance.
• the form of the cured product is not limited and may be in a sheet, film, or block form.
• the cured product may be combined with various substrates.
• the cured product is typically laminated between same or different substrates, and especially, between same or different substrates in an optical device.
• the state of the cured product is not limited, but it is preferably an elastomer or gel.
• the hardness is preferably in a range of 10 to 80, or optionally in a range of 10 to 70, in Shore OO Hardness. This is because when the cure product is within the range described above, good cohesive strength against deformation and good flexibility against material fracture are obtained.
• Shore OO Hardness is the value measured using a type OO hardness according to ASTM D 2240 at 23 ⁇ 2 °C.
• Examples [0064] The photocurable silicone composition and the cured product of the present invention will now be described in detail using Practical Examples and Comparative Examples. Note that, in the formulas, "Me”, “Ph”, and “Vi” respectively indicates methyl group, phenyl group, and vinyl group.
• the characteristics of the photocurable silicone composition and the cured product thereof were measured as follows.
• Viscosity at 25 ⁇ 2 °C was measured by using a type B viscometer (Brookfield HA Type Rotational Viscometer with using Spindle #52 at 0.5 rpm) / Viscosity at 25 ⁇ 2 °C was measured by using a type B viscometer (Brookfield HA Type Rotational Viscometer with using Spindle #52 at 5 rpm) ⁇ Appearance> [0069] After the photocurable silicone composition was prepared, its appearance was visually observed. ⁇ Curability> [0070] Thickness 2 mm Teflon ® zig on glass was prepared. And then UV exposure. After UV cure, finger test was implemented.
• Curability of the curable silicone composition was evaluated as follows. ⁇ : cured X: not cured ⁇ Hardness> [0071]
• the photocurable silicone composition was poured into a mold having a depression of a predetermined shape, and ultraviolet rays were irradiated from the upper liquid surface with a metal halide lamp or LED lamp so that the cumulative irradiation amount was 4,000 mJ/cm 2 .
• the hardness of the obtained cured product was measured by a type OO hardness according to the method specified by ASTM D 2240-00.
• the SH/Vi ratio in Table 1 indicates the ratio of the number of moles of thiol (HS-) groups in the organo compound (B2) per 1 mole of the vinyl group in the polysiloxane (B1). [0074] The following polysiloxanes were used as raw material (B1).
• TMMP stands for a mixture of an organo block represented by the following formula: an organo block represented by the following formula:
• Photocurable silicone compositions were prepared by a planetary centrifugal vacuum mixer (Thinky mixer) from the following components using the composition (parts by mass) shown in Table 2. Note that the photocurable silicone compositions of Practical Examples 1-10 and Comparative Example 1 were prepared to provide 0.8 moles of thiol groups in component (B) with regard to 1 mole of total vinyl groups in component (A). The properties of this photocurable silicone compositions and cured product thereof are shown in Table 2. [0083] The following organopolysiloxanes were used as component (A).
• the following organic compounds were used as component (B).
• component (b1) the polysiloxane block copolymer prepared by Reference Example 3
• component (b2) the polysiloxane block copolymer prepared by Reference Example 10
• component (B) a mixture of component (i), component (ii) and component (iv) in a mass ratio of 11:55:34
• component (C) The following photoinitiator was used as component (C).
• component (c1) 1-hydroxy-cyclohexyl-phenyl-ketone
• the following fillers were used as component (D).
• (d2) a hydrophobic fumed silica having a BET specific surface area of 100 m 2 /g. [0088] [Table 2] [0089] [Table 2] (Continued)
• the present composition exhibits excellent thixotropic property without impairing transparency. Therefore, the present composition is useful as various potting agents, sealing agents, and adhesive agents for optical devices and image displays.

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