WO2021167047A1 - Adhésif électroconducteur, film de blindage électromagnétique et film de liaison électroconducteur - Google Patents

Adhésif électroconducteur, film de blindage électromagnétique et film de liaison électroconducteur Download PDF

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Publication number
WO2021167047A1
WO2021167047A1 PCT/JP2021/006264 JP2021006264W WO2021167047A1 WO 2021167047 A1 WO2021167047 A1 WO 2021167047A1 JP 2021006264 W JP2021006264 W JP 2021006264W WO 2021167047 A1 WO2021167047 A1 WO 2021167047A1
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Prior art keywords
conductive adhesive
conductive
inorganic particles
insulating inorganic
present
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PCT/JP2021/006264
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English (en)
Japanese (ja)
Inventor
洋平 芝田
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タツタ電線株式会社
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Application filed by タツタ電線株式会社 filed Critical タツタ電線株式会社
Priority to KR1020227025968A priority Critical patent/KR20220141291A/ko
Priority to CN202180013670.5A priority patent/CN115038768A/zh
Priority to JP2022502003A priority patent/JP7470179B2/ja
Publication of WO2021167047A1 publication Critical patent/WO2021167047A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter

Definitions

  • the present invention relates to conductive adhesives, electromagnetic wave shielding films and conductive bonding films.
  • Flexible printed wiring boards are often used in electronic devices such as mobile phones, video cameras, and notebook computers, which are rapidly becoming smaller and more sophisticated, in order to incorporate circuits into complicated mechanisms. Further, taking advantage of its excellent flexibility, it is also used for connecting a movable part such as a printer head and a control part.
  • electromagnetic wave shielding measures are indispensable, and even in the flexible printed wiring boards used in the equipment, flexible printed wiring boards with electromagnetic wave shielding measures (hereinafter, also referred to as "shield printed wiring boards"). ) Has come to be used.
  • a general shield-printed wiring board is usually laminated on a printed wiring board in which a printed circuit (including a ground circuit) and an insulating film are sequentially provided on a base film, a conductive adhesive layer, and a conductive adhesive layer. It is composed of an electromagnetic wave shielding film composed of a shield layer and an insulating layer laminated on the shield layer.
  • the conductive filler, the ground circuit, and the shield layer are connected. Stability of contact with is required.
  • Patent Document 1 describes an electromagnetic wave shielding sheet provided with an insulating layer and a conductive layer, wherein the conductive layer contains conductive fine particles, a thermosetting resin, and silica particles.
  • An electromagnetic wave shield sheet is disclosed, which comprises 3 to 95 parts by weight of the silica particles with respect to 100 parts by weight of a thermosetting resin.
  • shield-printed wiring boards have come to be used for in-vehicle parts. Since in-vehicle parts are used in a harsh environment subject to severe temperature changes and vibrations, higher reliability (electrical connection stability) is required. In order to stabilize the contact between the conductive filler and the ground circuit and the shield layer, a method of increasing the amount of the conductive filler in the conductive adhesive layer and increasing the number of contacts can be considered. However, even if the amount of the conductive filler in the conductive adhesive layer is increased, sufficient connection stability cannot be obtained when used in a harsh environment.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a conductive adhesive capable of obtaining sufficient connection stability even when used in a harsh environment. Is.
  • the conductive adhesive of the present invention is characterized by having a resin, a conductive filler, and insulating inorganic particles, and the insulating inorganic particles have pores.
  • the conductive adhesive of the present invention is arranged in a layer between the printed wiring board and an object to be bonded such as an electronic component or a shield film (hereinafter, the conductive adhesive after the arrangement is referred to as "conductive adhesion”. Also referred to as “agent layer”). Then, the printed wiring board and the object to be bonded are electrically connected via the conductive filler contained in the conductive adhesive. If the conductive filler deviates from the fixed position due to temperature change, vibration, or the like, the contact between the printed wiring board, the conductive filler, and the object to be bonded is lost, and the connection stability is lowered.
  • the insulating inorganic particles contained in the conductive adhesive of the present invention can inhibit the movement of the conductive filler when the conductive filler tries to deviate from a fixed position. As a result, it is possible to prevent the connection stability from being lowered. Further, in the conductive adhesive of the present invention, the insulating inorganic particles have pores, so that the connection stability is further improved. It is presumed that this is due to the following reasons. Since the insulating inorganic particles have pores, the surface area per particle is increased, and the frictional resistance between the insulating inorganic particles and the conductive filler or resin is increased. Therefore, it is possible to efficiently prevent the conductive filler from moving from the fixed position. As a result, it is presumed that the connection stability will be further improved.
  • the insulating inorganic particles are preferably silica particles.
  • the connection stability is further improved.
  • the silica particles also function as a filler.
  • the pore volume of the insulating inorganic particles is preferably 0.44 to 1.80 ml / g.
  • the pore volume is in the above range, the movement of the conductive filler can be further prevented, and the connection stability can be prevented from being lowered. If the pore volume is less than 0.44 ml / g, the connection stability tends to decrease. Insulating inorganic particles having a pore volume of more than 1.80 ml / g are difficult to disperse in a conductive adhesive, and it is also difficult to produce insulating inorganic particles.
  • the particle size (D 50 ) of the insulating inorganic particles is preferably 1.0 to 9.0 ⁇ m. If the particle size (D 50 ) of the insulating inorganic particles is less than 1.0 ⁇ m, it becomes difficult to obtain the effect of preventing the movement of the conductive filler. When the particle size (D 50 ) of the insulating inorganic particles exceeds 9.0 ⁇ m, the connection stability tends to decrease.
  • the particle size (D 50 ) of the conductive filler is preferably 9 to 30 ⁇ m. If the particle size (D 50 ) of the conductive filler is less than 9 ⁇ m, the conductive filler tends to shift and the connection stability tends to decrease. If the particle size (D 50 ) of the conductive filler exceeds 30 ⁇ m, the conductive adhesive layer becomes too thick when the conductive adhesive is layered to form a conductive adhesive layer.
  • particle diameter (D 50) of the insulating inorganic particles is preferably smaller than the particle diameter of the conductive filler (D 50).
  • D 50 particle diameter of the conductive filler
  • the conductive adhesive of the present invention assuming that the weight of the resin contained in the conductive adhesive is 100 parts by weight, the conductive adhesive preferably contains 1 to 30 parts by weight of the insulating inorganic particles. .. If the content of the insulating inorganic particles is less than 1 part by weight, it becomes difficult to obtain the effect of preventing the connection stability from being lowered due to the inclusion of the insulating inorganic particles. If the content of the insulating inorganic particles exceeds 30 parts by weight, the amount of the insulating inorganic particles is too large, and it becomes difficult for the conductive filler to come into contact with the object to be adhered. As a result, the connection stability tends to decrease. In addition, since the proportion of the resin is reduced, the flexibility and adhesion strength of the conductive adhesive are reduced.
  • the electromagnetic wave shield film of the present invention is an electromagnetic wave shield film in which an insulating layer and a conductive adhesive layer are laminated, and the conductive adhesive layer is characterized by being made of the conductive adhesive of the present invention. do.
  • the thickness of the conductive adhesive layer is preferably 5 to 50 ⁇ m.
  • the connection stability is further improved.
  • the conductive bonding film of the present invention is characterized by containing the above-mentioned conductive adhesive of the present invention. Since the conductive bonding film of the present invention contains the above-mentioned conductive adhesive of the present invention, it is possible to improve the connection stability of the electrical connection via the conductive bonding film of the present invention.
  • the connection stability is further improved.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing another example of the electromagnetic wave shielding film of the present invention.
  • FIG. 3A is a schematic view showing a method of resistance value test.
  • FIG. 3B is a schematic view showing a method of resistance value test.
  • the conductive adhesive of the present invention will be specifically described.
  • the present invention is not limited to the following embodiments, and can be appropriately modified and applied without changing the gist of the present invention.
  • the conductive adhesive of the present invention has a resin, a conductive filler, and insulating inorganic particles, and the insulating inorganic particles have pores.
  • the conductive adhesive of the present invention is arranged in a layer between a printed wiring board and an object to be bonded such as an electronic component or a shield film. Then, the printed wiring board and the object to be bonded are electrically connected via the conductive filler contained in the conductive adhesive. If the conductive filler deviates from the fixed position due to temperature change, vibration, or the like, the contact between the printed wiring board, the conductive filler, and the object to be bonded is lost, and the connection stability is lowered.
  • the insulating inorganic particles contained in the conductive adhesive of the present invention can inhibit the movement of the conductive filler when the conductive filler tries to deviate from a fixed position. As a result, it is possible to prevent the connection stability from being lowered.
  • the insulating inorganic particles have pores, so that the connection stability is further improved. It is presumed that this is due to the following reasons. Since the insulating inorganic particles have pores, the surface area per particle is increased, and the frictional resistance between the insulating inorganic particles and the conductive filler or resin is increased. Therefore, it is possible to efficiently prevent the conductive filler from moving from the fixed position. As a result, it is presumed that the connection stability will be further improved.
  • the insulating inorganic particles may be of any kind as long as they have pores.
  • the insulating inorganic particles having pores include silica particles, talc particles, mica particles, and alumina particles. Among these, silica particles are preferable. When the insulating inorganic particles are silica particles, the connection stability is further improved. The silica particles also function as a filler.
  • the pore volume of the insulating inorganic particles is preferably 0.44 to 1.80 ml / g, more preferably 0.80 to 1.60 ml / g.
  • the pore volume is in the above range, the movement of the conductive filler can be further prevented, and the connection stability can be prevented from being lowered. If the pore volume is less than 0.44 ml / g, the connection stability tends to decrease. Insulating inorganic particles having a pore volume of more than 1.80 ml / g are difficult to disperse in a conductive adhesive, and it is also difficult to produce insulating inorganic particles.
  • the specific surface area of the insulating inorganic particles is preferably 10 to 700 m 2 / g, more preferably 280 to 500 m 2 / g.
  • the specific surface area is in the above range, it means that there are many pores in the insulating inorganic particles, it is possible to further prevent the movement of the conductive filler, and it is possible to prevent the connection stability from being lowered. Conceivable.
  • the pore volume and specific surface area of the insulating inorganic particles can be measured by a nitrogen adsorption method using an elemental analyzer: Vari EL III (manufactured by Elementar).
  • the particle size (D 50 ) of the insulating inorganic particles is preferably 1.0 to 9.0 ⁇ m, more preferably 2.0 to 7.0 ⁇ m, and 2 More preferably, it is 5.5 to 7.0 ⁇ m. If the particle size (D 50 ) of the insulating inorganic particles is less than 1.0 ⁇ m, it becomes difficult to obtain the effect of preventing the movement of the conductive filler. When the particle size (D 50 ) of the insulating inorganic particles exceeds 9.0 ⁇ m, the connection stability tends to decrease.
  • the particle size (D 50 ) of the insulating inorganic particles can be measured by a known method such as a laser diffraction type particle size distribution measuring device or a flow type particle image analyzer. The same applies to the method for measuring the average diameter (D 50 ) of the conductive filler, which will be described later.
  • the particle diameter of the insulating inorganic particles (D 50) is preferably smaller than the particle diameter of the conductive filler (D 50). In this case, since a large number of insulating inorganic particles can be filled between the conductive fillers, the movement of the conductive fillers can be further prevented, and the connection stability can be prevented from being lowered.
  • the conductive adhesive preferably contains 1 to 30 parts by weight of insulating inorganic particles. It is more preferably contained in an amount of 20 parts by weight, and further preferably contained in an amount of 5 to 10 parts by weight. If the content of the insulating inorganic particles is less than 1 part by weight, it becomes difficult to obtain the effect of preventing the connection stability from being lowered due to the inclusion of the insulating inorganic particles. If the content of the insulating inorganic particles exceeds 30 parts by weight, the amount of the insulating inorganic particles is too large, and it becomes difficult for the conductive filler to come into contact with the object to be adhered. As a result, the connection stability tends to decrease. In addition, since the proportion of the resin is reduced, the flexibility and adhesion strength of the conductive adhesive are reduced.
  • the insulating inorganic when the weight of the resin contained in the conductive adhesive is 100 parts by weight.
  • the content of the particles is Y and the particle size (D 50 ) of the insulating inorganic particles is X, it is preferable that the following formulas (1) to (3) are satisfied.
  • the connection stability is improved and the adhesiveness of the conductive adhesive is improved. 5 ⁇ Y ⁇ 30 (1) 2.7 ⁇ X ⁇ 9.0 (2) Y ⁇ -2.2X + 36.6 (3)
  • the conductive filler is not particularly limited, but may be metal fine particles, carbon nanotubes, carbon fibers, metal fibers, or the like. Among these, metal fine particles are preferable.
  • the metal fine particles are not particularly limited, but silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by plating copper powder with silver, polymer fine particles, glass beads, etc. are coated with metal. It may be fine particles or the like. Among these, from the viewpoint of economy, copper powder or silver-coated copper powder that can be obtained at low cost is preferable.
  • the shape of the conductive filler is not particularly limited, but can be appropriately selected from spherical, flat, lint, dendrite, rod, fibrous and the like.
  • the conductive adhesive of the present invention assuming that the weight of the resin contained in the conductive adhesive is 100 parts by weight, the conductive adhesive preferably contains 1 to 100 parts by weight of the conductive filler, and 5 to 70 parts by weight. It is more preferable to include 20 to 40 parts by weight, and it is further preferable to include 20 to 40 parts by weight.
  • the content of the conductive filler is less than 1 part by weight, the amount of the conductive filler that imparts conductivity to the conductive adhesive is reduced, so that the conductivity of the entire conductive adhesive is lowered.
  • the content of the conductive filler exceeds 100 parts by weight, the proportion of the resin is reduced, so that the flexibility and adhesion strength of the conductive adhesive are lowered.
  • the particle size (D 50 ) of the conductive filler is preferably 9 to 30 ⁇ m, more preferably 12 to 20 ⁇ m. If the particle size (D 50 ) of the conductive filler is less than 9 ⁇ m, the conductive filler tends to shift and the connection stability tends to decrease. If the particle size (D 50 ) of the conductive filler exceeds 30 ⁇ m, the conductive adhesive layer becomes too thick when the conductive adhesive is layered to form a conductive adhesive layer.
  • the resin is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, and an imide resin.
  • Thermoplastic resin compositions such as compositions, amide resin compositions, acrylic resin compositions, phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resins Examples thereof include a thermosetting resin composition such as a composition.
  • the relative permittivity of the resin at a frequency of 1 GHz and 23 ° C. is preferably 1 to 5, and more preferably 2 to 4.
  • the dielectric loss tangent of the resin at a frequency of 1 GHz and 23 ° C. is preferably 0.0001 to 0.03, more preferably 0.001 to 0.002. Within such a range, the transmission characteristics can be improved when the conductive adhesive of the present invention is used in an electronic device.
  • the conductive adhesive of the present invention includes, if necessary, curing accelerators, tackifiers, antioxidants, pigments, dyes, plasticizers, ultraviolet absorbers, etc. It may contain a defoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier, an antiblocking agent and the like.
  • the conductive adhesive of the present invention may be an anisotropic conductive adhesive.
  • the anisotropy of the conductive adhesive can be obtained by adjusting the content and size of the conductive filler.
  • the conductive adhesive of the present invention can be used for an electromagnetic wave shielding film.
  • An electromagnetic wave shielding film using the conductive adhesive of the present invention is also an aspect of the present invention.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing another example of the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film 1 shown in FIG. 1 is an electromagnetic wave shielding film in which an insulating layer 10 and a conductive adhesive layer 20 are laminated in this order.
  • the conductive adhesive layer 20 is made of the above-mentioned conductive adhesive of the present invention. In such an electromagnetic wave shielding film 1, the conductive adhesive layer 20 also functions as a shielding layer.
  • the electromagnetic wave shielding film 2 shown in FIG. 2 is an electromagnetic wave shielding film in which an insulating layer 10, a metal layer 30, and a conductive adhesive layer 20 are laminated in this order.
  • the conductive adhesive layer 20 is made of the above-mentioned conductive adhesive of the present invention.
  • the metal layer 30 functions as a shielding layer.
  • the conductive adhesive layer 20 may have isotropic conductivity or anisotropic conductivity.
  • the conductive adhesive layer 20 is made of the conductive adhesive of the present invention, it is possible to prevent the connection stability from being lowered. Therefore, when the electromagnetic wave shield film 1 or the electromagnetic wave shield film 2 using the conductive adhesive of the present invention is attached to a printed wiring board to form a shield printed wiring board, the shield printed wiring board is used in a harsh environment. Even so, it is possible to prevent the connection stability between the ground circuit of the printed wiring board and the shield layer of the electromagnetic wave shield film from being lowered.
  • the thickness of the conductive adhesive 20 is not particularly limited, but is preferably 5 to 50 ⁇ m, more preferably 10 to 40 ⁇ m. When the thickness of the conductive adhesive layer is within the above range, the connection stability is further improved.
  • the insulating layer 10 is not particularly limited, but is preferably composed of a thermoplastic resin composition, a thermosetting resin composition, an active energy ray curable composition, or the like.
  • thermoplastic resin composition is not particularly limited, but is a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, and an imide resin composition. , Acrylic resin composition and the like.
  • thermosetting resin composition is not particularly limited, but is an epoxy resin composition, a urethane resin composition, a urethane urea resin composition, a styrene resin composition, a phenol resin composition, and a melamine resin composition.
  • examples thereof include at least one resin composition selected from the group consisting of products, acrylic resin compositions and alkyd resin compositions.
  • the active energy ray-curable composition is not particularly limited, and examples thereof include a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule.
  • the thickness of the insulating layer 10 is preferably 1 to 12 ⁇ m.
  • Insulating layers include curing accelerators, tackifiers, antioxidants, pigments, dyes, plasticizers, UV absorbers, defoamers, leveling agents, fillers, flame retardants, viscosity modifiers, as needed. , Anti-blocking agent and the like may be contained.
  • the metal layer 30 is not particularly limited, but is preferably made of gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc or the like. Of these, copper is more preferred.
  • the metal layer 30 may be made of an alloy of the above metals. Further, the metal layer 30 may be a metal film formed by a method such as sputtering, electroless plating, or electrolytic plating.
  • the thickness of the metal layer 30 is preferably 0.01 to 10 ⁇ m. If the thickness of the metal layer is less than 0.01 ⁇ m, it is difficult to obtain a sufficient shielding effect. If the thickness of the metal layer exceeds 10 ⁇ m, it becomes difficult to bend.
  • the conductive adhesive of the present invention can be used as a conductive bonding film.
  • a conductive bonding film using the conductive adhesive of the present invention is also an aspect of the present invention.
  • the conductive bonding film of the present invention can be produced by arranging the conductive adhesive of the present invention in a layer on the surface of a base film whose surface has been subjected to a mold release treatment. Since the conductive adhesive of the present invention is contained, the connection stability of the electrical connection via the conductive bonding film of the present invention can be improved. For example, it can be used for attaching a conductive (metal) reinforcing plate to a flexible printed wiring board.
  • the conductive bonding film of the present invention may have isotropic conductivity or anisotropic conductivity.
  • the thickness of the conductive bonding film of the present invention is preferably 10 to 100 ⁇ m, more preferably 20 to 70 ⁇ m.
  • Silica particles 1 to 10 having the pore volume, particle size (D 50), specific surface area and shape shown in Table 1 were prepared as insulating inorganic particles.
  • the product names, manufacturers, etc. of each insulating inorganic particle are as follows.
  • Silica particle 1 Product name: Syricia 710 (manufactured by Fuji Silysia Chemical Ltd.)
  • Silica particle 2 Product name: Syricia 310P (manufactured by Fuji Silysia Chemical Ltd.)
  • Silica particles 3 Product name: Syricia 530 (manufactured by Fuji Silysia Chemical Ltd.)
  • Silica particles 4 Product name: Syricia 280 (manufactured by Fuji Silysia Chemical Ltd.)
  • Silica particles 5 Product name: Syricia 370 (manufactured by Fuji Silysia Chemical Ltd.)
  • Silica particles 6 Product name: Syricia 380 (manufactured by Fuji Silysia Chemical Ltd.)
  • thermoplastic polyester resin as resin
  • silica particles 1 as insulating inorganic particles
  • a transfer film a polyethylene terephthalate film having a peeling treatment on one side was prepared.
  • an epoxy resin was applied to the peeled surface of the transfer film and heated at 100 ° C. for 2 minutes using an electric oven to prepare an insulating layer having a thickness of 5 ⁇ m.
  • a 2 ⁇ m copper layer was formed on the insulating layer by electroless plating.
  • the copper layer serves as a shield layer.
  • the prepared conductive adhesive was applied onto the copper layer and heated at 100 ° C. for 2 minutes using an electric oven to prepare a conductive adhesive layer having a thickness of 20 ⁇ m.
  • An electromagnetic wave shield film was produced by the above process.
  • FIG. 3A and 3B are schematic views showing a method of resistance value test.
  • tin-plated copper foil tape 52 is bonded to the polyphenyl sulfide film 51 at positions 15 mm from the ends at both ends of the polyphenyl sulfide film 51.
  • a resistance value substrate 50 was produced.
  • the electromagnetic wave shield film 2 is cut so as to have a width of 140 mm and a length of 20 mm, and the conductive adhesive layer 20 of the electromagnetic wave shield film 2 and the tin-plated copper foil tape 52 of the resistance value substrate 50 are cut. And were overlapped so as to face each other. Then, the tin-plated copper foil tape 52 and the electromagnetic wave shield film 2 were made conductive by heating and pressurizing for 5 seconds under the conditions of 120 ° C.
  • an electromagnetic wave shield substrate 60 After leaving the electromagnetic wave shield substrate 60 in an environment of ⁇ 40 ° C. for 500 hours, the electric resistance value (electrical resistance value in the thickness direction) of the conductive adhesive layer 20 was measured. The result was 42 m ⁇ .
  • An electromagnetic wave shield film was prepared using a conductive adhesive using silica particles 2 to 6, and an adhesiveness test was conducted by the following method.
  • the electromagnetic wave shield film was cut into a width of 70 mm and a length of 10 mm, and a polyphenyl sulfide film having a thickness of 50 ⁇ m was heated and pressed on the adhesive layer surface of the electromagnetic wave shield film at 120 ° C., 0.5 MPa, and 5 seconds to prepare a measurement sample. ..
  • this measurement sample was used with a tensile tester AGS-X50N (manufactured by Shimadzu Corporation) at a peeling speed of 50 mm / min and a peeling angle of 180 °, with a conductive adhesive layer and a polyphenyl sulfate film.
  • the peel strength was measured by peeling the interface of.
  • the evaluation criteria are as follows. The results are shown in Table 3. ⁇ : 3.5N / 10mm or more Practical problem ⁇ : 3.5N / 10mm or less Practical problem
  • the conductive adhesive of the present invention having a resin, a conductive filler, and insulating inorganic particles, and the insulating inorganic particles having pores, is exposed to a harsh environment for a long time. Even if it was done, it turned out to be highly reliable.
  • Electromagnetic shield film 10 Insulation layer 20 Conductive adhesive layer 30 Metal layer 50 Resistance value substrate 51 Polyphenyl sulfide film 52 Tin-plated copper foil tape 60 Electromagnetic shield substrate

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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente invention concerne un adhésif électroconducteur capable de conférer une stabilité de liaison suffisante, même s'il est utilisé dans un environnement défavorable. L'adhésif électroconducteur selon la présente invention est caractérisé en ce qu'il contient une résine, une charge électroconductrice et des particules inorganiques isolantes, et est également caractérisé en ce que les particules inorganiques isolantes comportent des pores.
PCT/JP2021/006264 2020-02-19 2021-02-19 Adhésif électroconducteur, film de blindage électromagnétique et film de liaison électroconducteur WO2021167047A1 (fr)

Priority Applications (3)

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KR1020227025968A KR20220141291A (ko) 2020-02-19 2021-02-19 도전성 접착제, 전자파 차폐 필름 및 도전성 본딩 필름
CN202180013670.5A CN115038768A (zh) 2020-02-19 2021-02-19 导电性胶粘剂、电磁波屏蔽膜以及导电性粘结膜
JP2022502003A JP7470179B2 (ja) 2020-02-19 2021-02-19 導電性接着剤、電磁波シールドフィルム及び導電性ボンディングフィルム

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JP2020-026238 2020-02-19
JP2020026238 2020-02-19

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WO2021167047A1 true WO2021167047A1 (fr) 2021-08-26

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JP (1) JP7470179B2 (fr)
KR (1) KR20220141291A (fr)
CN (1) CN115038768A (fr)
WO (1) WO2021167047A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230141491A (ko) 2022-03-29 2023-10-10 토요잉크Sc홀딩스주식회사 도전성 조성물, 도전성 시트, 금속 보강판, 금속 보강판을 포함하는 배선판, 및 전자기기

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04209687A (ja) * 1990-12-04 1992-07-31 Toshiba Chem Corp 導電性ペースト
JP2004339325A (ja) * 2003-05-14 2004-12-02 Matsushita Electric Ind Co Ltd 導電性接着剤およびそれを用いた電子部品実装体
JP2005136144A (ja) * 2003-10-30 2005-05-26 Kyocera Corp 固体撮像装置
JP2014195067A (ja) * 2013-02-27 2014-10-09 ｎ−ｔｅｃｈ株式会社 電磁波シールド塗料
JP2018039959A (ja) * 2016-09-09 2018-03-15 タツタ電線株式会社 導電性接着剤組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5444699B2 (ja) 2008-11-28 2014-03-19 富士通株式会社 異方性導電性接着剤のための導電性粒子、異方性導電性接着剤、異方性導電性接着剤のための導電性粒子の製造方法、半導体装置
JP6255816B2 (ja) 2013-09-09 2018-01-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP7003540B2 (ja) 2017-09-28 2022-02-10 Dic株式会社 組成物および硬化物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04209687A (ja) * 1990-12-04 1992-07-31 Toshiba Chem Corp 導電性ペースト
JP2004339325A (ja) * 2003-05-14 2004-12-02 Matsushita Electric Ind Co Ltd 導電性接着剤およびそれを用いた電子部品実装体
JP2005136144A (ja) * 2003-10-30 2005-05-26 Kyocera Corp 固体撮像装置
JP2014195067A (ja) * 2013-02-27 2014-10-09 ｎ−ｔｅｃｈ株式会社 電磁波シールド塗料
JP2018039959A (ja) * 2016-09-09 2018-03-15 タツタ電線株式会社 導電性接着剤組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230141491A (ko) 2022-03-29 2023-10-10 토요잉크Sc홀딩스주식회사 도전성 조성물, 도전성 시트, 금속 보강판, 금속 보강판을 포함하는 배선판, 및 전자기기

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TW202132510A (zh) 2021-09-01
CN115038768A (zh) 2022-09-09
JPWO2021167047A1 (fr) 2021-08-26
JP7470179B2 (ja) 2024-04-17
KR20220141291A (ko) 2022-10-19

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