WO2021164584A1 - 电子膨胀阀 - Google Patents

电子膨胀阀 Download PDF

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Publication number
WO2021164584A1
WO2021164584A1 PCT/CN2021/075609 CN2021075609W WO2021164584A1 WO 2021164584 A1 WO2021164584 A1 WO 2021164584A1 CN 2021075609 W CN2021075609 W CN 2021075609W WO 2021164584 A1 WO2021164584 A1 WO 2021164584A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
section
electronic expansion
connecting pipe
expansion valve
Prior art date
Application number
PCT/CN2021/075609
Other languages
English (en)
French (fr)
Inventor
詹少军
徐冠军
姚坚
楼金强
Original Assignee
浙江盾安人工环境股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010100335.6A external-priority patent/CN113339510B/zh
Priority claimed from CN202020180745.1U external-priority patent/CN211599576U/zh
Priority claimed from CN202020730890.2U external-priority patent/CN212389757U/zh
Application filed by 浙江盾安人工环境股份有限公司 filed Critical 浙江盾安人工环境股份有限公司
Priority to JP2022528043A priority Critical patent/JP7398560B2/ja
Priority to KR1020227022360A priority patent/KR20220103797A/ko
Publication of WO2021164584A1 publication Critical patent/WO2021164584A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/10—Welded housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/10—Welded housings
    • F16K27/102—Welded housings for lift-valves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • This application relates to the technical field of electronic expansion valves, and in particular to an electronic expansion valve.
  • an electronic expansion valve includes a housing, a valve core assembly, and a valve seat core.
  • the valve core assembly and the valve seat core are both set in the housing.
  • the valve seat core is provided with a valve port.
  • the valve core component is used to control the opening and closing of the valve port.
  • the housing is provided with an installation hole, the valve seat core is inserted in the installation hole and is loosely matched with the installation hole, and the connecting pipe is sleeved on the valve seat core.
  • valve seat core in order to assemble the valve seat core, the housing and the connecting pipe, the valve seat core and the housing are welded and positioned by laser spot welding, and then the connecting pipe is sleeved on the valve seat core.
  • the welding ring is sleeved outside the connecting pipe, and finally the valve seat core, the shell and the connecting pipe are welded and fixed by furnace welding.
  • the present application provides an electronic expansion valve to solve the problem of poor coaxiality between the valve seat core and the housing in the related art.
  • the present application provides an electronic expansion valve.
  • the electronic expansion valve includes: a housing with a mounting hole; a valve seat core passing through the mounting hole; the valve seat core includes a press-fitting section and a guide section; the press-fitting section and the mounting hole Interference fit; the connecting pipe is sleeved on the guide section, and there is a solder circulation chamber between the shell, the valve seat core and the connecting pipe.
  • the housing has a bottom wall, the mounting hole penetrates the inner and outer sides of the bottom wall, the press-fitting section and the guide section are connected to each other, and the guide section is located on the outer side of the bottom wall.
  • the solder circulation chamber includes a solder preset portion, a solder channel, and In the first solder cavity, the solder preset part is arranged close to the outside of the bottom wall, the solder preset part is used to place the solder, the solder channel is arranged between the pressing section and the mounting hole, and the first solder is provided between the valve seat core and the housing In the cavity, the first solder cavity is arranged close to the inner side of the bottom wall, one end of the solder channel is communicated with the solder preset part, and the other end of the solder channel is communicated with the first solder cavity.
  • solder channel is arranged on the pressing section and/or in the mounting hole.
  • the press-fitting section is provided with a circulation groove, one end of the circulation groove is communicated with the solder preset portion, the other end of the circulation groove is communicated with the first solder cavity, and the circulation groove forms a solder channel.
  • the inner wall of the mounting hole is provided with a first annular groove, the first annular groove is arranged close to the inner side of the bottom wall, and a first solder cavity is formed between the first annular groove and the valve seat core.
  • the end wall of the connecting pipe abuts against the housing, a second solder cavity is formed between the housing, the valve seat core, and the connecting pipe, and one end of the second solder cavity is in communication with the solder preset portion, and the second solder cavity The other end is connected to the solder channel.
  • the diameter of the guide section is smaller than or equal to the diameter of the press-fitting section.
  • the space between the guide section, the housing and the connecting pipe forms a second solder cavity.
  • one end of the connecting pipe connected to the guide section has a second chamfer, and the space between the second chamfer, the housing and the valve seat core forms a second solder cavity.
  • the end of the hole wall of the mounting hole facing the connecting pipe has a third chamfer, and the interval between the third chamfer, the valve seat core and the connecting pipe forms a second solder cavity.
  • solder preset portion is located between the inner wall of the connecting pipe and the outer side wall of the guide section.
  • the outer side wall of the guide section is provided with a containing groove, the containing groove is annularly arranged along the circumference of the guide section, and the containing groove forms a solder preset portion.
  • the press-fitting section and the guide section are connected to each other, the guide section is located outside the mounting hole, the end wall of the connecting pipe abuts the housing, and the solder circulation chamber includes a cavity between the housing, the valve seat core and the connecting pipe. The second solder cavity.
  • the diameter of the guide section is smaller than or equal to the diameter of the press-fitting section.
  • the space between the guide section, the housing and the connecting pipe forms a second solder cavity.
  • one end of the connecting pipe connected to the guide section has a second chamfer, and the space between the second chamfer, the housing and the valve seat core forms a second solder cavity.
  • the end of the hole wall of the mounting hole facing the connecting pipe has a third chamfer, and the interval between the third chamfer, the valve seat core and the connecting pipe forms a second solder cavity.
  • solder pre-set part is provided between the inner wall of the connecting pipe and the outer side wall of the guide section, and the solder pre-set part is used for placing solder.
  • the outer side wall of the guide section is provided with a containing groove, the containing groove is annularly arranged along the circumference of the guide section, and the containing groove forms a solder preset portion.
  • valve seat core further includes a limit boss, the limit boss is arranged at an end of the pressing section away from the guide section, and the limit boss is annularly arranged along the circumference of the valve seat core.
  • the housing includes a sleeve and a valve body connected to each other, and the mounting hole is provided on the valve body.
  • the solder circulation chamber includes a solder channel arranged between the pressing section and the hole wall of the mounting hole, and the connecting end of the connecting pipe is sleeved on the guide section and inserted into the mounting hole.
  • a flow groove is provided on the side wall of the pressing section and/or the hole wall of the mounting hole, and the flow groove forms a solder channel.
  • the diameter of the guide section is less than or equal to the diameter of the press-fitting section, and the circulation groove is arranged on the side wall of the press-fitting section.
  • the solder circulation chamber further includes a third solder cavity arranged between the connecting end of the connecting pipe and the housing, the housing has a bottom wall, the mounting hole penetrates the inside and outside of the bottom wall, and the third solder cavity is close to the bottom wall The third solder cavity is communicated with one end of the solder channel.
  • the end of the mounting hole close to the outer side of the bottom wall is provided with a second annular groove, and the interval between the second annular groove and the outer wall of the connecting end of the connecting pipe forms a third solder cavity.
  • solder circulation cavity further includes a first solder cavity arranged between the valve seat core and the housing, the first solder cavity is arranged close to the inner side of the bottom wall, and the first solder cavity is communicated with the other end of the solder channel.
  • an end of the mounting hole close to the inner side of the bottom wall is provided with a first annular groove, and the interval between the first annular groove and the valve seat core forms a first solder cavity.
  • valve seat core further includes a limiting section, the limiting section is located at one end of the pressing section away from the guide section, the limiting section has a larger diameter than the pressing section, and the limiting section is connected to the bottom wall of the first annular groove Abutting, the space between the outer wall of the limiting section and the first annular groove forms a first solder cavity.
  • the pressing section is connected with the guiding section, and the end wall of the connecting pipe abuts against the end wall of the pressing section.
  • the mounting hole includes a first hole section and a second hole section that are connected to each other.
  • the first hole section is located above the second hole section.
  • the hole diameter of the first hole section is smaller than that of the second hole section.
  • the hole section is interference fit, the solder channel is arranged between the pressing section and the first hole section, and the connecting end of the connecting pipe is sleeved on the guide section and inserted into the second hole section.
  • the connecting pipe is sleeved on the guide section, there is a solder circulation chamber between the shell, the valve seat core and the connecting pipe, and the solder circulation chamber is filled with solder to complete the shell ,
  • the connection of the valve seat core and the connecting pipe due to the interference fit between the press-fitting section and the mounting hole, there is no need to use spot welding to locate the valve seat core, which can ensure the coaxiality of the valve seat core and the housing.
  • Figure 1 shows a schematic structural diagram of an electronic expansion valve provided by an embodiment of the present application
  • Figure 2 shows a partial enlarged view of A in Figure 1;
  • Figure 3 shows a schematic structural view of the valve seat core in Figure 1;
  • Fig. 4 shows another structural schematic diagram of the valve seat core in Fig. 1;
  • Figure 5 shows an assembly diagram of the valve seat core, valve body and connecting pipe in Figure 1;
  • Fig. 6 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the first embodiment of the present application
  • FIG. 7 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the second embodiment of the present application.
  • FIG. 8 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the third embodiment of the present application.
  • Fig. 9 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the fourth embodiment of the present application.
  • FIG. 10 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the fifth embodiment of the present application.
  • FIG. 11 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided in the sixth embodiment of the present application.
  • Figure 12 shows a schematic structural view of the valve body in Figure 1;
  • Figure 13 shows a schematic structural diagram of an electronic expansion valve provided by an embodiment of the present invention.
  • Figure 14 shows a partial enlarged view at B in Figure 13;
  • Figure 15 shows a schematic structural view of the valve seat core in Figure 13;
  • Figure 16 shows an exploded view of the valve seat core and valve body in Figure 13;
  • Figure 17 shows an assembly diagram of the valve seat core, valve body and connecting pipe in Figure 13;
  • Figure 18 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the seventh embodiment of the present invention.
  • Figure 19 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the eighth embodiment of the present invention.
  • Figure 20 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the ninth embodiment of the present invention.
  • Figure 21 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the tenth embodiment of the present invention.
  • Figure 22 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the eleventh embodiment of the present invention.
  • Figure 23 shows a partial enlarged view of the solder cavity of the electronic expansion valve provided by the twelfth embodiment of the present invention.
  • Figure 24 shows a schematic structural diagram of an electronic expansion valve provided by a thirteenth embodiment of the present invention.
  • FIG. 25 shows a partial enlarged view at C in FIG. 24
  • FIG. 26 shows a schematic diagram of the structure of the valve seat core in FIG. 24.
  • the embodiment of the present application provides an electronic expansion valve.
  • the electronic expansion valve includes a housing 10, a valve seat core 20, and a connecting pipe 30.
  • the housing 10 has a mounting hole 11, and the valve seat core 20 is inserted into the mounting hole 11.
  • the seat core 20 includes a press-fitting section 21 and a guide section 22, the press-fitting section 21 is in interference fit with the mounting hole 11, the connecting pipe 30 is sleeved on the guide section 22, the housing 10, the valve seat core 20 and the connecting pipe 30 are three There is a solder flow chamber between.
  • solder circulation chamber between the housing 10, the valve seat core 20, and the connecting pipe 30, and the solder circulation chamber is filled with solder to complete the housing 10 and the valve seat.
  • the solder circulation chamber is filled with solder to complete the housing 10 and the valve seat.
  • the first embodiment of the present application provides an electronic expansion valve.
  • the electronic expansion valve includes a housing 10, a valve seat core 20 and a connecting pipe 30.
  • the housing 10 has a bottom wall, and the bottom wall has an inner side and an outer side, and a mounting hole 11 penetrating the inner side and the outer side.
  • the inside of the bottom wall corresponds to the inside of the electronic expansion valve
  • the outside of the bottom wall corresponds to the outside.
  • the valve seat core 20 includes a press-fitting section 21 and a guide section 22 that are connected to each other.
  • the press-fitting section 21 and the mounting hole 11 are interference fit, which can realize the positioning connection between the valve seat core 20 and the housing 10 and Ensure the coaxiality of the valve seat core 20 and the housing 10.
  • the guide section 22 is located outside the bottom wall, and the connecting pipe 30 is sleeved on the guide section 22.
  • the solder circulation chamber includes a solder preset 50, a solder channel 60, and a first solder cavity 70.
  • the solder preset 50 is arranged close to the outside of the bottom wall.
  • the solder preset 50 is used to place solder, and the valve seat core 20 is connected to the There is a first solder cavity 70 between the shells 10, and the first solder cavity 70 is disposed close to the inner side of the bottom wall.
  • solder channel 60 By arranging the solder channel 60 between the pressing section 21 and the mounting hole 11, one end of the solder channel 60 is communicated with the solder preset portion 50, and the other end of the solder channel 60 is communicated with the first solder cavity 70, so that the solder can pass through
  • the solder channel 60 enters the first solder cavity 70 to simultaneously weld and fix the valve seat core 20 on the inner and outer sides of the bottom wall, which can improve the welding strength.
  • the electronic expansion valve provided by this embodiment, by interference fit the press-fitting section 21 with the mounting hole 11, there is no need to use spot welding to locate the valve seat core, which can realize the positioning of the valve seat core 20 and the housing 10
  • the connection can also ensure the coaxiality of the valve seat core 20 and the housing 10, simplifying the processing technology.
  • the solder By providing the solder channel 60 between the press-fitting section 21 and the mounting hole 11, the solder can enter the first solder cavity 70 through the solder channel 60, and the inner and outer sides of the bottom wall can be welded and fixed to the valve seat core 20 at the same time. Improve welding strength.
  • the first solder cavity 70 is disposed close to the inner side of the bottom wall, the first solder cavity 70 can also be used to identify the welding quality of the valve seat core 20 and the housing 10.
  • the solder channel 60 can be arranged on the press-fitting section 21, or arranged in the mounting hole 11, or on the press-fitting section 21 and the mounting hole 11 at the same time.
  • the solder channel 60 is arranged on the press-fitting section 21, which facilitates the processing of the solder channel 60.
  • the solder channel 60 can be a flow groove or a circulation hole, or a separate connecting pipe is arranged between the pressing section 21 and the mounting hole 11, and the connecting pipe is used to realize the communication between the solder preset 50 and the first solder cavity 70 .
  • a serrated notch may be provided on the mounting hole 11, and the serrated notch can be used to form the solder channel 60.
  • the press-fitting section 21 is provided with a circulation groove 211, one end of the circulation groove 211 is in communication with the solder preset 50, the other end of the circulation groove 211 is in communication with the first solder cavity 70, and the circulation groove 211
  • the solder channel 60 is formed.
  • the structure of the circulation groove 211 is convenient for processing and can reduce the cost.
  • the circulation groove 211 is a milled groove.
  • the inner wall of the mounting hole 11 is provided with a first annular groove 111, the first annular groove 111 is arranged close to the inner side of the bottom wall, between the first annular groove 111 and the valve seat core 20
  • the first solder cavity 70 is formed, which facilitates the processing of the first solder cavity 70.
  • the end wall of the connecting pipe 30 is in contact with the housing 10, the housing 10, the valve seat core 20, and the connecting pipe 30 have a second solder cavity 40 between them, and one end of the second solder cavity 40 is in contact with The solder preset portion 50 is in communication, and the other end of the second solder cavity 40 is in communication with the solder channel 60.
  • the second solder cavity 40 is a transition area through which solder flows.
  • the diameter of the guide section 22 is less than or equal to the diameter of the press-fitting section 21.
  • the guide section 22 can play a guiding role, facilitating assembly.
  • the diameter of the guide section 22 is smaller than the diameter of the press-fitting section 21.
  • the space between the guide section 22, the housing 10 and the connecting pipe 30 forms a second solder cavity 40.
  • the press-fitting section 21 is in interference fit with the mounting hole 11, between the guide section 22 and the inner wall of the mounting hole 11, and the end wall of the connecting pipe 30 and the press-fitting section
  • the solder preset portion 50 is located between the inner wall of the connecting pipe 30 and the outer side wall of the guide section 22.
  • the solder preset portion can be arranged on the inner wall of the connecting pipe 30 or on the outer side wall of the guiding section 22, or on the inner wall of the connecting pipe 30 and the outer side wall of the guiding section 22 at the same time.
  • the solder can be sleeved on the outer wall of the connecting pipe 30, and the position of the solder does not affect the lifting of the valve seat core 20 by means of press fitting, the first solder cavity 70 and the second solder cavity 40. Coaxiality with the housing 10.
  • the solder preset 50 is used to place a solder ring.
  • the solder is provided inside the connecting pipe 30, when the connecting pipe 30 is welded, by observing whether there is solder leaking from the connecting pipe 30 and the housing 10 outside the connecting pipe 30, the welding can be performed.
  • the quality is accurately judged, and it is convenient for employees to carry out inspections.
  • the judgment of welding quality is not limited by the tube type of the connecting pipe 30, and can be used for the judgment of the bent pipe. Since less solder accumulates on the outside of the connecting pipe 30 after welding, the positioning and press-fitting after the device can be effectively ensured.
  • the solder preset portion is provided on the guide section 22.
  • the solder preset portion can be arranged at the middle of the guide section 22 or at both ends of the guide section 22.
  • the outer side wall of the guide section 22 is provided with a receiving groove 221, the receiving groove 221 is annularly arranged along the circumference of the guide section 22, and the receiving groove 221 forms a solder preset portion.
  • the accommodating groove 221 can be provided in the middle of the guide section 22 or at both ends of the guide section 22, and the provision of the accommodating groove 221 has the advantage of facilitating processing.
  • the receiving groove 221 is located at an end of the guide section 22 away from the press-fitting section 21.
  • the receiving groove 221 can be formed by turning the end of the guide section 22 away from the pressing section 21, which can further reduce the processing cost and facilitate the placement of solder.
  • the valve seat core 20 further includes a limiting boss 24, which is arranged at one end of the pressing section 21 away from the guide section 22, and the limiting boss 24 is along the circumferential direction of the valve seat core 20. It is arranged in a ring shape, and the limiting boss 24 is used to limit the position of the valve seat core 20 in the mounting hole 11.
  • the limiting protrusion 24 is disposed in the first annular groove 111, and a first solder cavity 70 is formed between the first annular groove 111 and the limiting protrusion 24.
  • the housing 10 includes a sleeve 13 and a valve body 14 connected to each other, and the mounting hole 11 is provided on the valve body 14. Separating the housing 10 into the sleeve 13 and the valve body 14 facilitates assembly and can improve assembly efficiency.
  • the electronic expansion valve further includes a valve core assembly, the valve core assembly is arranged in the housing 10, the valve seat core 20 is provided with a valve port, and the valve core assembly is used to control the opening and closing of the valve port.
  • the second embodiment of the present application provides an electronic expansion valve.
  • the difference between the second embodiment and the first embodiment is that in the second embodiment, there is a first chamfer between the pressing section 21 and the guide section 22 23.
  • the space between the first chamfer 23, the housing 10 and the connecting pipe 30 forms a second solder cavity 40.
  • the third embodiment of the present application provides an electronic expansion valve.
  • the difference between the third embodiment and the first embodiment is that in the third embodiment, the end of the connecting pipe 30 connected to the guide section 22 has a second inverted valve.
  • the space between the corner 31, the second chamfer 31, the housing 10 and the valve seat core 20 forms a second solder cavity 40.
  • the fourth embodiment of the present application provides an electronic expansion valve.
  • the difference between the fourth embodiment and the second embodiment is that in the fourth embodiment, the end of the connecting pipe 30 connected to the guide section 22 has a second inverted The space between the corner 31, the second chamfer 31, the housing 10 and the valve seat core 20 forms a second solder cavity 40.
  • the volume of the second solder cavity 40 can be increased, welding can be facilitated, and the welding strength can be enhanced.
  • the fifth embodiment of the present application provides an electronic expansion valve.
  • the difference between the fifth embodiment and the first embodiment is that, in the fifth embodiment, the end of the hole wall of the mounting hole 11 facing the connecting pipe 30 has a first The space between the three chamfers 12, the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a second solder cavity 40.
  • the third chamfer 12 By providing the third chamfer 12 on the wall of the mounting hole 11, the volume of the second solder cavity 40 can be increased, which facilitates welding, and can enhance the welding strength.
  • the sixth embodiment of the present application provides an electronic expansion valve.
  • the difference between the sixth embodiment and the second embodiment is that, in the sixth embodiment, the end of the hole wall of the mounting hole 11 facing the connecting pipe 30 has a first The space between the three chamfers 12, the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a second solder cavity 40.
  • the volume of the second solder cavity 40 can be increased, which facilitates welding, and can enhance the welding strength.
  • the implementation of the second solder cavity 40 is not limited to the above-mentioned embodiment, and its specific structure can be adjusted adaptively according to actual conditions.
  • the third chamfer 12 is provided on the wall of the mounting hole 11, so that the diameter of the press-fitting section 21 and the guide section 22 are the same, and the third chamfer 12, the valve seat core 20 and the connecting pipe 30
  • the second solder cavity 40 can be formed with an interval of ⁇ .
  • valve seat core 20 and the housing 10 can ensure the coaxiality of the valve seat core 20 and the housing 10;
  • a solder channel 60 is provided between the press-fitting section 21 and the mounting hole 11, and the inner and outer sides of the bottom wall can be welded and fixed to the valve seat core 20 at the same time, which can improve the welding strength;
  • solder is built-in, and by observing whether there is solder leaking from the connecting tube 30 and the housing 10 outside the connecting tube 30, the welding quality can be identified and the process is more reliable.
  • the seventh embodiment of the present invention provides an electronic expansion valve.
  • the electronic expansion valve includes a housing 10, a valve seat core 20 and a connecting pipe 30.
  • the housing 10 has a mounting hole 11, and the valve seat core 20 is penetrated in the mounting hole 11.
  • the valve seat core 20 includes a press-fitting section 21 and a guide section 22 that are connected to each other.
  • the press-fitting section 21 is in an interference fit with the mounting hole 11, and the guide section 22 is located outside the mounting hole 11.
  • the connecting pipe 30 is sleeved on the guide section 22, and the end wall of the connecting pipe 30 abuts against the housing 10.
  • the solder circulation cavity includes one of the housing 10, the valve seat core 20, and the connecting pipe 30.
  • the solder will gather in the second solder cavity 40, which can realize the fixed connection of the housing 10, the valve seat core 20 and the connecting pipe 30.
  • the diameter of the guide section 22 is less than or equal to the diameter of the press-fitting section 21.
  • the diameter of the guide section 22 is smaller than the diameter of the press-fitting section 21.
  • the guide section 22 can play a guiding role, facilitating assembly.
  • the diameter of the guide section 22 may be set equal to the diameter of the press-fitting section 21.
  • the space between the guide section 22, the housing 10 and the connecting pipe 30 forms a second solder cavity 40.
  • the press-fitting section 21 is in interference fit with the mounting hole 11, between the guide section 22 and the inner wall of the mounting hole 11, and the end wall of the connecting pipe 30 and the press-fitting section
  • solder pre-set part is provided between the inner wall of the connecting pipe 30 and the outer side wall of the guide section 22, and the solder pre-set part is used for placing solder.
  • the solder preset portion can be arranged on the inner wall of the connecting pipe 30 or on the outer side wall of the guiding section 22, or on the inner wall of the connecting pipe 30 and the outer side wall of the guiding section 22 at the same time.
  • the solder can be sleeved on the outer wall of the connecting pipe 30, and the position of the solder does not affect the use of press-fitting and the second solder cavity 40 to lift the valve seat core 20 and the housing 10 together.
  • Axial degree In this embodiment, the solder preset portion is used to place the solder ring.
  • the solder is provided inside the connecting pipe 30, when the connecting pipe 30 is welded, by observing whether there is solder leaking from the connecting pipe 30 and the housing 10 outside the connecting pipe 30, the welding can be performed.
  • the quality is accurately judged, and it is convenient for employees to carry out inspections.
  • the judgment of welding quality is not limited by the tube type of the connecting pipe 30, and can be used for the judgment of the bent pipe. Since less solder accumulates on the outside of the connecting pipe 30 after welding, the positioning and press-fitting after the device can be effectively ensured.
  • the solder preset portion is provided on the guide section 22.
  • the solder preset portion can be arranged at the middle of the guide section 22 or at both ends of the guide section 22.
  • the outer side wall of the guide section 22 is provided with a receiving groove 221, the receiving groove 221 is annularly arranged along the circumference of the guide section 22, and the receiving groove 221 forms a solder preset portion.
  • the accommodating groove 221 can be provided in the middle of the guide section 22 or at both ends of the guide section 22, and the provision of the accommodating groove 221 has the advantage of facilitating processing.
  • the receiving groove 221 is located at an end of the guide section 22 away from the press-fitting section 21.
  • the receiving groove 221 can be formed by turning the end of the guide section 22 away from the pressing section 21, which can further reduce the processing cost and facilitate the placement of solder.
  • valve seat core 20 further includes a limiting boss 24, which is arranged at one end of the pressing section 21 away from the guide section 22, and the limiting boss 24 is along the circumferential direction of the valve seat core 20. It is arranged in a ring shape, and the limiting boss 24 is used to limit the position of the valve seat core 20 in the mounting hole 11.
  • the housing 10 includes a sleeve 13 and a valve body 14 connected to each other, and the mounting hole 11 is provided on the valve body 14. Separating the housing 10 into the sleeve 13 and the valve body 14 facilitates assembly and can improve assembly efficiency.
  • the electronic expansion valve further includes a valve core assembly, the valve core assembly is arranged in the housing 10, the valve seat core 20 is provided with a valve port, and the valve core assembly is used to control the opening and closing of the valve port.
  • the eighth embodiment of the present invention provides an electronic expansion valve.
  • the eighth embodiment is different from the seventh embodiment.
  • the space between the corner 23, the first chamfer 23, the housing 10 and the connecting pipe 30 forms a second solder cavity 40.
  • the ninth embodiment of the present invention provides an electronic expansion valve.
  • the difference between the ninth embodiment and the seventh embodiment is that in the ninth embodiment, the end of the connecting pipe 30 connected to the guide section 22 has a second The space between the chamfer 31, the second chamfer 31, the housing 10 and the valve seat core 20 forms a second solder cavity 40.
  • the volume of the second solder cavity 40 can be increased, welding can be facilitated, and the welding strength can be enhanced.
  • the tenth embodiment of the present utility model provides an electronic expansion valve.
  • the difference between the tenth embodiment and the eighth embodiment is that, in the tenth embodiment, the end of the connecting pipe 30 connected to the guide section 22 has a second The space between the chamfer 31, the second chamfer 31, the housing 10 and the valve seat core 20 forms a second solder cavity 40.
  • the volume of the second solder cavity 40 can be increased, welding can be facilitated, and the welding strength can be enhanced.
  • the eleventh embodiment of the present invention provides an electronic expansion valve.
  • the difference between the eleventh embodiment and the seventh embodiment is that in the eleventh embodiment, the wall of the mounting hole 11 faces the connecting pipe 30 There is a third chamfer 12 at one end of the, and the interval between the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a second solder cavity 40.
  • the third chamfer 12 By providing the third chamfer 12 on the wall of the mounting hole 11, the volume of the second solder cavity 40 can be increased, which facilitates welding, and can enhance the welding strength.
  • the twelfth embodiment of the present invention provides an electronic expansion valve.
  • the difference between the twelfth embodiment and the eighth embodiment is that in the twelfth embodiment, the hole wall of the mounting hole 11 faces the connecting pipe 30 There is a third chamfer 12 at one end of the, and the interval between the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a second solder cavity 40.
  • the third chamfer 12 By providing the third chamfer 12 on the wall of the mounting hole 11, the volume of the second solder cavity 40 can be increased, which facilitates welding, and can enhance the welding strength.
  • the implementation of the second solder cavity 40 is not limited to the above-mentioned embodiment, and its specific structure can be adjusted adaptively according to actual conditions.
  • the third chamfer 12 is provided on the wall of the mounting hole 11, so that the diameter of the press-fitting section 21 and the guide section 22 are the same, and the third chamfer 12, the valve seat core 20 and the connecting pipe 30
  • the second solder cavity 40 can be formed with an interval of ⁇ .
  • valve seat core 20 and the housing 10 can ensure the coaxiality of the valve seat core 20 and the housing 10;
  • solder is built in, and by observing whether there is solder leaking from the connecting pipe 30 and the housing 10 outside the connecting pipe 30, the welding quality can be identified and the process is more reliable.
  • the thirteenth embodiment of the present invention provides an electronic expansion valve.
  • the electronic expansion valve includes a housing 10, a valve seat core 20 and a connecting pipe 30.
  • the housing 10 has a mounting hole 11, and the valve seat core 20 is penetrated in the mounting hole 11.
  • the valve seat core 20 includes a press-fitting section 21 and a guide section 22, and the press-fitting section 21 is in interference fit with the mounting hole 11, so that the coaxiality of the valve seat core 20 and the housing 10 can be ensured.
  • the solder circulation chamber includes a solder channel 60 provided between the press-fitting section 21 and the wall of the mounting hole 11.
  • the connecting end of the connecting pipe 30 is sleeved on the guide section 22 and inserted into the mounting hole 11.
  • the welding ring 90 is sleeved on the outer wall of the connecting pipe 30, and then the valve seat core 20, the housing 10 and the connecting pipe 30 are fixed by furnace welding, so as to facilitate the soldering of the valve seat core 20, the housing 10 and the connection
  • the pipe 30 circulates among the three, which can improve the welding firmness.
  • the press-fitting section 21 and the mounting hole 11 are interference fit, so that the coaxiality of the valve seat core 20 and the housing 10 can be ensured, and there is no need to use spot welding on the valve seat core 20. Positioning can simplify the processing technology and reduce processing costs.
  • the connecting end of the connecting pipe 30 is sleeved on the guide section 22 and inserted into the mounting hole 11.
  • solder channel 60 is provided between the hole walls, which enhances the tendency of solder to infiltrate and guide the mounting hole 11, facilitate the flow of solder between the connecting pipe 30, the mounting hole 11 and the valve seat core 20, and can improve the soldering strength without judgment. Whether the welding seam between the inner wall of the connecting pipe 30 and the valve seat core is welded with solder, the process is simpler and more reliable.
  • the solder channel 60 includes structures such as slotting, knurling, flower arrangement, and thread on the press-fitting section 21 and/or the mounting hole 11, and also includes a flow pipe formed between the press-fitting section 21 and the mounting hole 11 to form a solder channel
  • the structure of the solder channel is not limited, as long as the solder can circulate in the solder channel.
  • a flow groove 211 is provided on the side wall of the pressing section 21 and/or on the hole wall of the mounting hole 11, and the flow groove 211 forms the solder channel 60.
  • the method of setting the flow groove 211 to form the solder channel 60 has the advantages of simple structure and convenient processing.
  • a flow groove 211 is provided on the side wall of the pressing section 21.
  • the flow groove 211 may be provided on the wall of the mounting hole 11, or a flow groove may be provided on the pressing section and the mounting hole 11 at the same time.
  • the diameter of the guide section 22 is smaller than the diameter of the press-fitting section 21, and the circulation groove 211 is provided on the side wall of the press-fitting section 21.
  • the circulation groove 211 is provided through the upper and lower sides of the pressing section 21 to facilitate the circulation of the solder in the mounting hole 11.
  • a plurality of circulation grooves 211 can be provided on the side wall of the pressing section 21 to improve the circulation capacity.
  • the circulation groove 211 is a milled groove.
  • the solder circulation chamber further includes a third solder cavity 80 provided between the connecting end of the connecting pipe 30 and the housing 10.
  • the housing 10 has a bottom wall
  • the mounting hole 11 penetrates the inside and outside of the bottom wall
  • the third solder cavity 80 is disposed close to the outside of the bottom wall
  • the third solder cavity 80 communicates with one end of the solder channel 60.
  • the end of the mounting hole 11 close to the outside of the bottom wall is provided with a second annular groove 112, and the interval between the second annular groove 112 and the outer wall of the connecting end of the connecting pipe 30 forms a third solder cavity 80 .
  • the welding ring 90 is sleeved on the outer wall of the connecting pipe 30, so that the welding ring 90 is covered above the second annular groove 112.
  • the solder can circulate to the connecting pipe 30, the mounting hole 11 and the valve seat core 20 In the welding seam between the three, the remaining solder can be contained in the second annular groove 112, which can improve the welding strength and can also prevent the solder from flowing to other parts.
  • the solder circulation chamber also includes a first solder cavity 70 arranged between the valve seat core 20 and the housing 10.
  • the first solder cavity 70 is arranged close to the inner side of the bottom wall, and the first solder cavity 70 communicates with the other end of the solder channel 60.
  • the solder can fill the welding seam between the connecting pipe 30, the mounting hole 11 and the valve seat core 20 through the third solder cavity 80, the solder channel 60 and the first solder cavity 70, which can ensure the welding strength.
  • an end of the mounting hole 11 close to the inner side of the bottom wall is provided with a first annular groove 111, and the interval between the first annular groove 111 and the valve seat core 20 forms a first solder cavity 70.
  • the method of forming the solder cavity by setting the annular groove has the advantages of convenient processing and low cost.
  • the valve seat core 20 also includes a limiting section 25, which is located at one end of the press-fitting section 21 away from the guide section 22, and the limiting section 25 is used to limit the installation of the valve seat core 20
  • the position in the hole 11 avoids over-pressing the valve seat core.
  • the diameter of the limiting section 25 is larger than the diameter of the pressing section 21, and the limiting section 25 abuts against the bottom wall of the first annular groove 111 to limit the position of the valve seat core 20 in the mounting hole 11.
  • the space between the outer wall of the limiting section 25 and the first annular groove 111 forms a first solder cavity 70.
  • the pressing section 21 is connected to the guide section 22, and the end wall of the connecting pipe 30 abuts against the end wall of the pressing section 21, and the connecting pipe can be assembled and positioned by the pressing section.
  • the press-fitting section and the guide section may not be connected to each other, as long as an interference fit between the press-fitting section and the mounting hole 11 can be satisfied, and the connecting pipe is sleeved on the guide section and inserted into the mounting hole 11.
  • the housing 10 includes a sleeve 13 and a valve body 14 connected to each other, and the mounting hole 11 is provided on the valve body 14. Separating the housing 10 into the sleeve 13 and the valve body 14 facilitates assembly and can improve assembly efficiency.
  • the electronic expansion valve further includes a valve core assembly, the valve core assembly is arranged in the housing 10, the valve seat core 20 is provided with a valve port, and the valve core assembly is used to control the opening and closing of the valve port.
  • the fourteenth embodiment of the present invention provides an electronic expansion valve.
  • the difference between the fourteenth embodiment and the thirteenth embodiment is that, in the fourteenth embodiment, the mounting hole 11 includes a first hole section and a second hole that are connected to each other. Section, the first hole section is located above the second hole section, the hole diameter of the first hole section is smaller than that of the second hole section, the press-fitting section 21 and the first hole section are interference fit, and the solder channel 60 is provided in the press-fitting section 21 and Between the first hole sections, the connecting end of the connecting pipe 30 is sleeved on the guide section 22 and inserted into the second hole section.
  • the diameters of the press-fitting section and the guide section may be the same or different, as long as the press-fitting section and the first hole section can meet the interference fit, and the connecting pipe is sleeved on the guide section and inserted into the second hole section.
  • valve seat core and the shell have an interference fit, which can better ensure the coaxiality of the two;
  • a flow groove is set on the valve seat core to allow the solder to penetrate into the shell during the welding process to ensure the welding quality
  • the connecting pipe is embedded in the end surface of the bottom wall of the housing, and there is a weld between the connecting pipe and the mounting hole 11 of the housing.
  • the welding process enhances the tendency of solder to infiltrate and guide the mounting hole 11, which can reduce
  • the solder welding between the connecting pipe and the shell is poor, and it is no longer necessary to evaluate whether there is solder welding between the inner wall of the connecting pipe and the outer wall of the valve seat core, and the process is simpler and more reliable.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
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  • Thermal Sciences (AREA)
  • Valve Housings (AREA)
  • Magnetically Actuated Valves (AREA)

Abstract

一种电子膨胀阀，该电子膨胀阀包括：壳体（10），具有安装孔（11）；阀座芯（20），穿设在安装孔（11）内，阀座芯（20）包括压装段（21）和导向段（22），压装段（21）与安装孔（11）过盈配合；连接管（30），套设在导向段（22）上，壳体(10)、阀座芯（20）以及连接管（30）三者之间具有焊料流通腔室。该电子膨胀阀能够解决相关技术中的阀座芯与壳体同轴度差的问题。

Description

电子膨胀阀
本申请要求以下三个专利申请的优先权：
1、2020年02月18日提交至中国国家知识产权局，申请号为202010100335.6，发明名称为“电子膨胀阀”的专利申请的优先权；
2、2020年02月18日提交至中国国家知识产权局，申请号为202020180745.1，发明名称为“电子膨胀阀”的专利申请的优先权；
3、2020年05月06日提交至中国国家知识产权局，申请号为202020730890.2，发明名称为“电子膨胀阀”的专利申请的优先权。
技术领域
本申请涉及电子膨胀阀技术领域，具体而言，涉及一种电子膨胀阀。
背景技术
通常，电子膨胀阀包括壳体、阀芯组件以及阀座芯，阀芯组件和阀座芯均设置在壳体内，阀座芯上设置有阀口，阀芯组件用于控制阀口的开闭。其中，壳体上设置有安装孔，阀座芯穿设在安装孔内并与安装孔松配，连接管套设在阀座芯上。
在相关技术中，为了对阀座芯、壳体以及连接管三者进行装配，首先利用激光点焊的方式将阀座芯与壳体焊接定位，然后将连接管套设在阀座芯上，并将焊环套设在连接管外部，最后通过炉焊的方式对阀座芯、壳体以及连接管进行焊接固定。
但是，由于阀座芯与安装孔松配，在对阀座芯和壳体进行点焊时，难以保证阀座芯与壳体的同轴度，影响装置的性能。因此，相关技术中存在阀座芯与壳体同轴度差的问题。
发明内容
本申请提供一种电子膨胀阀，以解决相关技术中的阀座芯与壳体同轴度差的问题。
本申请提供了一种电子膨胀阀，电子膨胀阀包括：壳体，具有安装孔；阀座芯，穿设在安装孔内，阀座芯包括压装段和导向段，压装段与安装孔过盈配合；连接管，套设在导向段上，壳体、阀座芯以及连接管三者之间具有焊料流通腔室。
进一步地，壳体具有一底壁，安装孔贯穿底壁的内侧和外侧，压装段和导向段相互连接，导向段位于底壁的外侧，焊料流通腔室包括焊料预置部、焊料通道以及第一焊料腔，焊料预置部靠近底壁的外侧设置，焊料预置部用于放置焊料，焊料通道设置在压装段与安装孔之间，阀座芯与壳体之间具有第一焊料腔，第一焊料腔靠近底壁的内侧设置，焊料通道的一端与焊料预置部连通，焊料通道的另一端与第一焊料腔连通。
进一步地，焊料通道设置在压装段上和/或安装孔内。
进一步地，压装段上设置有流通槽，流通槽的一端与焊料预置部连通，流通槽的另一端与第一焊料腔连通，流通槽形成焊料通道。
进一步地，安装孔的内壁上设置有第一环形凹槽，第一环形凹槽靠近底壁的内侧设置，第一环形凹槽与阀座芯之间形成第一焊料腔。
进一步地，连接管的端壁与壳体相抵接，壳体、阀座芯以及连接管三者之间具有第二焊料腔，第二焊料腔的一端与焊料预置部连通，第二焊料腔的另一端与焊料通道连通。
进一步地，导向段的直径小于或等于压装段的直径。
进一步地，导向段、壳体以及连接管三者之间的间隔形成第二焊料腔。
进一步地，压装段与导向段之间具有第一倒角，第一倒角、壳体以及连接管三者之间的间隔形成第二焊料腔。
进一步地，连接管的与导向段连接的一端具有第二倒角，第二倒角、壳体以及阀座芯三者之间的间隔形成第二焊料腔。
进一步地，安装孔的孔壁的朝向连接管的一端具有第三倒角，第三倒角、阀座芯以及连接管三者之间的间隔形成第二焊料腔。
进一步地，焊料预置部位于连接管的内壁与导向段的外侧壁之间。
进一步地，导向段的外侧壁上设置有容纳槽，容纳槽沿导向段的周向环形设置，容纳槽形成焊料预置部。
进一步地，压装段和导向段相互连接，导向段位于安装孔外侧，连接管的端壁与壳体相抵接，焊料流通腔室包括位于壳体、阀座芯以及连接管三者之间的第二焊料腔。
进一步地，导向段的直径小于或等于压装段的直径。
进一步地，导向段、壳体以及连接管三者之间的间隔形成第二焊料腔。
进一步地，压装段与导向段之间具有第一倒角，第一倒角、壳体以及连接管三者之间的间隔形成第二焊料腔。
进一步地，连接管的与导向段连接的一端具有第二倒角，第二倒角、壳体以及阀座芯三者之间的间隔形成第二焊料腔。
进一步地，安装孔的孔壁的朝向连接管的一端具有第三倒角，第三倒角、阀座芯以及连接管三者之间的间隔形成第二焊料腔。
进一步地，连接管的内壁与导向段的外侧壁之间设置有焊料预置部，焊料预置部用于放置焊料。
进一步地，导向段的外侧壁上设置有容纳槽，容纳槽沿导向段的周向环形设置，容纳槽形成焊料预置部。
进一步地，阀座芯还包括限位凸台，限位凸台设置在压装段的远离导向段的一端，限位凸台沿阀座芯的周向环形设置。
进一步地，壳体包括相互连接的套管和阀体，安装孔设置在阀体上。
进一步地，焊料流通腔室包括设置在压装段与安装孔的孔壁之间的焊料通道，连接管的连接端套设在导向段上并插入安装孔内。
进一步地，压装段的侧壁上和/或安装孔的孔壁上设置有流通槽，流通槽形成焊料通道。
进一步地，导向段的直径小于或等于压装段的直径，流通槽设置在压装段的侧壁上。
进一步地，焊料流通腔室还包括设置在连接管的连接端与壳体之间的第三焊料腔，壳体具有底壁，安装孔贯穿底壁的内侧和外侧，第三焊料腔靠近底壁的外侧设置，第三焊料腔与焊料通道的一端相连通。
进一步地，安装孔的靠近底壁的外侧的一端设置有第二环形凹槽，第二环形凹槽与连接管的连接端的外壁之间的间隔形成第三焊料腔。
进一步地，焊料流通腔室还包括设置在阀座芯与壳体之间的第一焊料腔，第一焊料腔靠近底壁的内侧设置，第一焊料腔与焊料通道的另一端相连通。
进一步地，安装孔的靠近底壁的内侧的一端设置有第一环形凹槽，第一环形凹槽与阀座芯之间的间隔形成第一焊料腔。
进一步地，阀座芯还包括限位段，限位段位于压装段的远离导向段的一端，限位段的直径大于压装段的直径，限位段与第一环形凹槽的底壁相抵接，限位段的外壁与第一环形凹槽之间的间隔形成第一焊料腔。
进一步地，压装段与导向段相连接，连接管的端壁与压装段的端壁相抵接。
进一步地，安装孔包括相互连接的第一孔段和第二孔段，第一孔段位于第二孔段上方，第一孔段的孔径小于第二孔段的孔径，压装段与第一孔段过盈配合，焊料通道设置在压装段与第一孔段之间，连接管的连接端套设在导向段上并插入第二孔段内。
应用本申请的技术方案，将连接管套设在导向段上，壳体、阀座芯以及连接管三者之间具有焊料流通腔室，利用焊料对焊料流通腔室进行填充，能够完成壳体、阀座芯以及连接管三者的连接，由于压装段与安装孔过盈配合，无需利用点焊的方式对阀座芯进行定位，能够保证阀座芯与壳体的同轴度。
附图说明
构成本申请的一部分的说明书附图用来提供对本申请的进一步理解，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1示出了本申请实施例提供的电子膨胀阀的结构示意图；
图2示出了图1中A处的局部放大图；
图3示出了图1中的阀座芯的结构示意图；
图4示出了图1中的阀座芯的又一结构示意图；
图5示出了图1中的阀座芯、阀体以及连接管的装配图；
图6示出了本申请实施例一提供的电子膨胀阀的焊料腔处的局部放大图；
图7示出了本申请实施例二提供的电子膨胀阀的焊料腔处的局部放大图；
图8示出了本申请实施例三提供的电子膨胀阀的焊料腔处的局部放大图；
图9示出了本申请实施例四提供的电子膨胀阀的焊料腔处的局部放大图；
图10示出了本申请实施例五提供的电子膨胀阀的焊料腔处的局部放大图；
图11示出了本申请实施例六提供的电子膨胀阀的焊料腔处的局部放大图；
图12示出了图1中的阀体的结构示意图；
图13示出了本实用新型实施例提供的电子膨胀阀的结构示意图；
图14示出了图13中B处的局部放大图；
图15示出了图13中的阀座芯的结构示意图；
图16示出了图13中的阀座芯与阀体的爆炸图；
图17示出了图13中的阀座芯、阀体以及连接管的装配图；
图18示出了本实用新型实施例七提供的电子膨胀阀的焊料腔处的局部放大图；
图19示出了本实用新型实施例八提供的电子膨胀阀的焊料腔处的局部放大图；
图20示出了本实用新型实施例九提供的电子膨胀阀的焊料腔处的局部放大图；
图21示出了本实用新型实施例十提供的电子膨胀阀的焊料腔处的局部放大图；
图22示出了本实用新型实施例十一提供的电子膨胀阀的焊料腔处的局部放大图；
图23示出了本实用新型实施例十二提供的电子膨胀阀的焊料腔处的局部放大图；
图24示出了本实用新型实施例十三提供的电子膨胀阀的结构示意图；
图25示出了图24中C处的局部放大图；
图26示出了图24中的阀座芯的结构示意图。
其中，上述附图包括以下附图标记：
10、壳体；11、安装孔；111、第一环形凹槽；112、第二环形凹槽；12、第三倒角；13、套管；14、阀体；20、阀座芯；21、压装段；211、流通槽；22、导向段；221、容纳槽；23、第一倒角；24、限位凸台；25、限位段；30、连接管；31、第二倒角；40、第二焊料腔；50、焊料预置部；60、焊料通道；70、第一焊料腔；80、第三焊料腔；90、焊环。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本申请及其应用或使用的任何限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供了一种电子膨胀阀，电子膨胀阀包括壳体10、阀座芯20以及连接管30，壳体10具有安装孔11，阀座芯20穿设在安装孔11内，阀座芯20包括压装段21和导向段22，压装段21与安装孔11过盈配合，连接管30套设在导向段22上，壳体10、阀座芯20以及连接管30三者之间具有焊料流通腔室。
应用本实施例提供的电子膨胀阀，壳体10、阀座芯20以及连接管30三者之间具有焊料流通腔室，利用焊料对焊料流通腔室进行填充，能够完成壳体10、阀座芯20以及连接管30三者的连接，由于压装段21与安装孔11过盈配合，无需利用点焊的方式对阀座芯20进行定位，能够保证阀座芯20与壳体10的同轴度。
如图1至图11所示，本申请实施例一提供一种电子膨胀阀，该电子膨胀阀包括壳体10、阀座芯20以及连接管30。其中，壳体10具有一底壁，底壁具有内侧和外侧及贯穿内侧与外侧的安装孔11。在本实施例中，底壁的内侧对应电子膨胀阀的内部设置，底壁的外侧对应外界设置。具体的，阀座芯20包括相互连接的压装段21和导向段22，将压装段21与安装孔11过盈配合，既能实现阀座芯20与壳体10的定位连接，又能够保证阀座芯20与壳体10的同轴度。在本实施例中，导向段22位于底壁的外侧，连接管30套设在导向段22上。其中，焊料流通腔室包括焊料预置部50、焊料通道60以及第一焊料腔70，焊料预置部50靠近底壁的外侧设置，焊料预置部50用于放置焊料，阀座芯20与壳体10之间具有第一焊料腔70，第一焊料腔70靠近底壁的内侧设置。通过将焊料通道60设置在压装段21与安装孔11之间，使焊料通道60的一端与焊料预置部50连通，使焊料通道60的另一端与第一焊料腔70连通，焊料能够通过焊料通道60进入第一焊料腔70内，以同时在底壁的内侧和外侧对阀座芯20进行焊接固定，能够提升焊接强度。
应用本实施例提供的电子膨胀阀，通过将压装段21与安装孔11过盈配合，无需利用点焊的方式对阀座芯进行定位，既能实现阀座芯20与壳体10的定位连接，又能够保证阀座芯20与壳体10的同轴度，简化加工工艺。通过在压装段21与安装孔11之间设置焊料通道60，焊料能够通过焊料通道60进入第一焊料腔70内，能够同时将底壁的内侧和外侧分别与阀座芯20焊接固定，能够提升焊接强度。并且，由于第一焊料腔70靠近底壁的内侧设置，第一焊料腔70还可用于识别阀座芯20与壳体10的焊接质量。
其中，焊料通道60可设置在压装段21上，或者设置在安装孔11内，或者同时设置在压装段21和安装孔11上。在本实施例中，焊料通道60设置在压装段21上，如此便于对焊料通道60进行加工。其中，焊料通道60可以为流动槽或流通孔，或者将单独设置的连通管设置在压装段21与安装孔11之间，利用连通管实现焊料预置部50和第一焊料腔70的连通。在其它实施例中，可在安装孔11上设置锯齿状缺口，利用该锯齿状缺口形成焊料通道60。
如图3和图4所示，压装段21上设置有流通槽211，流通槽211的一端与焊料预置部50连通，流通槽211的另一端与第一焊料腔70连通，流通槽211形成焊料通道60。采用流通槽211的结构，便于进行加工，能够降低成本。在本实施例中，流通槽211为铣边槽。
如图2和图12所示，安装孔11的内壁上设置有第一环形凹槽111，第一环形凹槽111靠近底壁的内侧设置，第一环形凹槽111与阀座芯20之间形成第一焊料腔70，如此便于对第一焊料腔70进行加工。
在本实施例中，连接管30的端壁与壳体10相抵接，壳体10、阀座芯20以及连接管30三者之间具有第二焊料腔40，第二焊料腔40的一端与焊料预置部50连通，第二焊料腔40的另一端与焊料通道60连通。其中，第二焊料腔40为焊料流经的过渡区域。利用炉焊的方式可实现壳体10、阀座芯20以及连接管30三者的固定连接，能够减少激光点焊，具有工艺简单的优点，能够降低成本。
其中，导向段22的直径小于或等于压装段21的直径。在将阀座芯20插入安装孔11时，导向段22可起到导向的作用，便于进行装配。在本实施例中，导向段22的直径小于压装段21的直径。
如图6所示，导向段22、壳体10以及连接管30三者之间的间隔形成第二焊料腔40。其中，导向段22与压装段21之间具有台阶结构，压装段21与安装孔11过盈配合，导向段22与安装孔11的内壁之间以及连接管30的端壁与压装段21之间具有间隔，该间隔形成第二焊料腔40。
其中，焊料预置部50位于连接管30的内壁与导向段22的外侧壁之间。其中，焊料预置部可设置在连接管30的内壁上，或设置在导向段22的外侧壁上，或同时设置在连接管30的内壁和导向段22的外侧壁上。在其它实施例中，可将焊料套设在连接管30的外壁上，焊料的设置位置并不影响利用压装、第一焊料腔70以及第二焊料腔40相配合的方式提升阀座芯20与壳体10的同轴度。在本实施例中，焊料预置部50用于放置焊环。
在本实施例中，由于焊料设置在连接管30内部，在对连接管30进行焊接时，通过在连接管30外部观察是否有焊料从连接管30与壳体10之间漏出，即可对焊接质量进行准确判断，便于员工进行检测。并且，焊接质量的判断不受连接管30的管型限制，可用于对弯管的判断。由于焊接后连接管30的外部堆积的焊料较少，可有效确保装置后的定位与压装。
在本实施例中，焊料预置部设置在导向段22上。其中，焊料预置部可设置在导向段22的中部，也可设置在导向段22的两端。通过将焊料预置部设置在导向段22上，便于对焊料预置部进行加工，能够降低加工成本。
如图3所示，导向段22的外侧壁上设置有容纳槽221，容纳槽221沿导向段22的周向环形设置，容纳槽221形成焊料预置部。具体的，容纳槽221可设置在导向段22的中部，也可设置在导向段22的两端，且设置容纳槽221具有便于加工的优点。在本实施例中，容纳槽221位于导向段22的远离压装段21的一端。采用上述结构，只需对导向段22的远离压装段21的一端进行车削即可形成容纳槽221，能够进一步降低加工成本，且便于放置焊料。
在本实施例中，阀座芯20还包括限位凸台24，限位凸台24设置在压装段21的远离导向段22的一端，限位凸台24沿阀座芯20的周向环形设置，限位凸台24用于限制阀座芯20在安装孔11内的位置。其中，限位凸台24设置在第一环形凹槽111内，第一环形凹槽111与限位凸台24之间形成第一焊料腔70。
其中，壳体10包括相互连接的套管13和阀体14，安装孔11设置在阀体14上。将壳体10分体设置为套管13和阀体14便于进行装配，能够提升装配效率。
在本实施例中，电子膨胀阀还包括阀芯组件，阀芯组件设置在壳体10内，阀座芯20上设置有阀口，阀芯组件用于控制阀口的开闭。
如图7所示，本申请实施例二提供一种电子膨胀阀，实施例二与实施例一的区别在于，在实施例二中，压装段21与导向段22之间具有第一倒角23，第一倒角23、壳体10以及连接管30三者之间的间隔形成第二焊料腔40。具体的，第一倒角23与安装孔11的内壁和连接管30的端壁之间具有间隔，该间隔形成第二焊料腔40。
如图8所示，本申请实施例三提供一种电子膨胀阀，实施例三与实施例一的区别在于，在实施例三中，连接管30的与导向段22连接的一端具有第二倒角31，第二倒角31、壳体10以及阀座芯20三者之间的间隔形成第二焊料腔40。通过在连接管30上设置第二倒角31，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图9所示，本申请实施例四提供一种电子膨胀阀，实施例四与实施例二的区别在于，在实施例四中，连接管30的与导向段22连接的一端具有第二倒角31，第二倒角31、壳体10以及阀座芯20三者之间的间隔形成第二焊料腔40。通过在连接管30上设置第二倒角31，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图10所示，本申请实施例五提供一种电子膨胀阀，实施例五与实施例一的区别在于，在实施例五中，安装孔11的孔壁的朝向连接管30的一端具有第三倒角12，第三倒角12、阀 座芯20以及连接管30三者之间的间隔形成第二焊料腔40。通过在安装孔11的孔壁上设置第三倒角12，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图11所示，本申请实施例六提供一种电子膨胀阀，实施例六与实施例二的区别在于，在实施例六中，安装孔11的孔壁的朝向连接管30的一端具有第三倒角12，第三倒角12、阀座芯20以及连接管30三者之间的间隔形成第二焊料腔40。通过在安装孔11的孔壁上设置第三倒角12，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
其中，第二焊料腔40的实现方式并不仅限于上述实施例，其具体结构可根据实际情况进行适应性调整。例如，仅在安装孔11的孔壁上设置第三倒角12，使压装段21和导向段22的直径相同，利用第三倒角12、阀座芯20以及连接管30三者之间的间隔即可形成第二焊料腔40。
在对装置进行装配时，将装置倒置，内置的焊料在阀座芯20上端，焊料熔化后，由于连接管30与阀座芯20之间的热膨胀系数不同，连接管30膨胀的多以形成焊缝使得焊料在重力及毛细吸引下，依次流至第二焊料腔40、第一焊料腔70内。
通过本实施例提供的装置，具有以下有益效果：
(1)将阀座芯20与壳体10过盈配合，能够保证阀座芯20与壳体10的同轴度；
(2)在压装段21与安装孔11之间设置焊料通道60，能够同时将底壁的内侧和外侧分别与阀座芯20焊接固定，能够提升焊接强度；
(3)能够减少激光点焊，具有工艺简单的优点，能够降低成本；
(4)将焊料内置，可通过在连接管30外部观察是否有焊料从连接管30与壳体10之间漏出，可以识别焊接质量，工艺更可靠。
如图13至图23所示，本实用新型实施例七提供一种电子膨胀阀，该电子膨胀阀包括壳体10、阀座芯20以及连接管30。其中，壳体10具有安装孔11，阀座芯20穿设在安装孔11内。具体的，阀座芯20包括相互连接的压装段21和导向段22，压装段21与安装孔11过盈配合，导向段22位于安装孔11外侧。通过将压装段21与安装孔11过盈配合，无需采用其它方式进行定位，能够保证阀座芯20与壳体10的同轴度。在本实施例中，连接管30套设在导向段22上，连接管30的端壁与壳体10相抵接，焊料流通腔包括位于壳体10、阀座芯20以及连接管30三者之间的第二焊料腔40，利用炉焊的方式，焊料会聚集在第二焊料腔40内，可以实现壳体10、阀座芯20以及连接管30三者的固定连接。
应用本实施例提供的电子膨胀阀，通过将阀座芯20的压装段21过盈穿设在安装孔11内，能够保证阀座芯20与壳体10的同轴度，壳体10、阀座芯20以及连接管30三者之间具有第二焊料腔40，利用炉焊的方式可实现壳体10、阀座芯20以及连接管30三者的固定连接，能够减少激光点焊，具有工艺简单的优点，能够降低成本。
其中，导向段22的直径小于或等于压装段21的直径。在本实施例中，导向段22的直径小于压装段21的直径。在将阀座芯20插入安装孔11时，导向段22可起到导向的作用，便于进行装配。在其它实施例中，可将导向段22的直径设置为等于压装段21的直径。
如图18所示，导向段22、壳体10以及连接管30三者之间的间隔形成第二焊料腔40。其中，导向段22与压装段21之间具有台阶结构，压装段21与安装孔11过盈配合，导向段22与安装孔11的内壁之间以及连接管30的端壁与压装段21之间具有间隔，该间隔形成第二焊料腔40。
如图14至图17所示，连接管30的内壁与导向段22的外侧壁之间设置有焊料预置部，焊料预置部用于放置焊料。其中，焊料预置部可设置在连接管30的内壁上，或设置在导向段22的外侧壁上，或同时设置在连接管30的内壁和导向段22的外侧壁上。在其它实施例中，可将焊料套设在连接管30的外壁上，焊料的设置位置并不影响利用压装和第二焊料腔40相配合的方式提升阀座芯20与壳体10的同轴度。在本实施例中，焊料预置部用于放置焊环。
在本实施例中，由于焊料设置在连接管30内部，在对连接管30进行焊接时，通过在连接管30外部观察是否有焊料从连接管30与壳体10之间漏出，即可对焊接质量进行准确判断，便于员工进行检测。并且，焊接质量的判断不受连接管30的管型限制，可用于对弯管的判断。由于焊接后连接管30的外部堆积的焊料较少，可有效确保装置后的定位与压装。
在本实施例中，焊料预置部设置在导向段22上。其中，焊料预置部可设置在导向段22的中部，也可设置在导向段22的两端。通过将焊料预置部设置在导向段22上，便于对焊料预置部进行加工，能够降低加工成本。
如图15所示，导向段22的外侧壁上设置有容纳槽221，容纳槽221沿导向段22的周向环形设置，容纳槽221形成焊料预置部。具体的，容纳槽221可设置在导向段22的中部，也可设置在导向段22的两端，且设置容纳槽221具有便于加工的优点。在本实施例中，容纳槽221位于导向段22的远离压装段21的一端。采用上述结构，只需对导向段22的远离压装段21的一端进行车削即可形成容纳槽221，能够进一步降低加工成本，且便于放置焊料。
在本实施例中，阀座芯20还包括限位凸台24，限位凸台24设置在压装段21的远离导向段22的一端，限位凸台24沿阀座芯20的周向环形设置，限位凸台24用于限制阀座芯20在安装孔11内的位置。
其中，壳体10包括相互连接的套管13和阀体14，安装孔11设置在阀体14上。将壳体10分体设置为套管13和阀体14便于进行装配，能够提升装配效率。
在本实施例中，电子膨胀阀还包括阀芯组件，阀芯组件设置在壳体10内，阀座芯20上设置有阀口，阀芯组件用于控制阀口的开闭。
如图19所示，本实用新型实施例八提供一种电子膨胀阀，实施例八与实施例七的区别在于，在实施例八中，压装段21与导向段22之间具有第一倒角23，第一倒角23、壳体10以 及连接管30三者之间的间隔形成第二焊料腔40。具体的，第一倒角23与安装孔11的内壁和连接管30的端壁之间具有间隔，该间隔形成第二焊料腔40。
如图20所示，本实用新型实施例九提供一种电子膨胀阀，实施例九与实施例七的区别在于，在实施例九中，连接管30的与导向段22连接的一端具有第二倒角31，第二倒角31、壳体10以及阀座芯20三者之间的间隔形成第二焊料腔40。通过在连接管30上设置第二倒角31，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图21所示，本实用新型实施例十提供一种电子膨胀阀，实施例十与实施例八的区别在于，在实施例十中，连接管30的与导向段22连接的一端具有第二倒角31，第二倒角31、壳体10以及阀座芯20三者之间的间隔形成第二焊料腔40。通过在连接管30上设置第二倒角31，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图22所示，本实用新型实施例十一提供一种电子膨胀阀，实施例十一与实施例七的区别在于，在实施例十一中，安装孔11的孔壁的朝向连接管30的一端具有第三倒角12，第三倒角12、阀座芯20以及连接管30三者之间的间隔形成第二焊料腔40。通过在安装孔11的孔壁上设置第三倒角12，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
如图23所示，本实用新型实施例十二提供一种电子膨胀阀，实施例十二与实施例八的区别在于，在实施例十二中，安装孔11的孔壁的朝向连接管30的一端具有第三倒角12，第三倒角12、阀座芯20以及连接管30三者之间的间隔形成第二焊料腔40。通过在安装孔11的孔壁上设置第三倒角12，能够增大第二焊料腔40的体积，便于进行焊接，能够增强焊接强度。
其中，第二焊料腔40的实现方式并不仅限于上述实施例，其具体结构可根据实际情况进行适应性调整。例如，仅在安装孔11的孔壁上设置第三倒角12，使压装段21和导向段22的直径相同，利用第三倒角12、阀座芯20以及连接管30三者之间的间隔即可形成第二焊料腔40。
在对装置进行装配时，将装置倒置，内置的焊料在阀座芯20上端，焊料熔化后，由于连接管30与阀座芯20之间的热膨胀系数不同，连接管30膨胀的多以形成焊缝使得焊料在重力及毛细吸引下流至第二焊料腔40内。
通过本实施例提供的装置，具有以下有益效果：
(1)将阀座芯20与壳体10过盈配合，能够保证阀座芯20与壳体10的同轴度；
(2)能够减少激光点焊，具有工艺简单的优点，能够降低成本；
(3)将焊料内置，可通过在连接管30外部观察是否有焊料从连接管30与壳体10之间漏出，可以识别焊接质量，工艺更可靠。
如图24至图26所示，本实用新型实施例十三提供了一种电子膨胀阀，该电子膨胀阀包括壳体10、阀座芯20以及连接管30。其中，壳体10具有安装孔11，阀座芯20穿设在安装孔11内。具体地，阀座芯20包括压装段21和导向段22，压装段21与安装孔11过盈配合， 如此能够保证阀座芯20与壳体10的同轴度。在本实施例中，焊料流通腔室包括设置在压装段21与安装孔11的孔壁之间的焊料通道60，连接管30的连接端套设在导向段22上并插入安装孔11内，将焊环90套设在连接管30的外壁上，然后利用炉焊的方式对阀座芯20、壳体10以及连接管30进行固定，便于焊料在阀座芯20、壳体10以及连接管30三者之间流通，能够提升焊接牢固性。
应用本实施例提供的电子膨胀阀，通过将压装段21与安装孔11过盈配合，能够保证阀座芯20与壳体10的同轴度，无需利用点焊的方式对阀座芯20进行定位，能够简化加工工艺、降低加工成本。并且，将连接管30的连接端套设在导向段22上并插入安装孔11内，连接管30的外壁与安装孔11的内壁之间具有焊缝，且压装段21与安装孔11的孔壁之间设置有焊料通道60，增强了焊料往安装孔11浸润引导的趋势，便于焊料在连接管30、安装孔11以及阀座芯20三者之间流通，能够提升焊接强度，无需判断连接管30的内壁与阀座芯之间的焊缝是否有焊料熔接，工艺更为简单、可靠。
其中，焊料通道60包括在压装段21和/或安装孔11上开槽、滚花、插花、螺纹线等结构，还包括在压装段21与安装孔11之间设置流通管形成焊料通道的结构，焊料通道的形成方式及其结构不做限制，只要能够使焊料在焊料通道内流通即可。
具体地，压装段21的侧壁上和/或安装孔11的孔壁上设置有流通槽211，流通槽211形成焊料通道60。采用设置流通槽211形成焊料通道60的方式，具有结构简单、便于加工的优点。在本实施例中，压装段21的侧壁上设置有流通槽211。在其它实施例中，可将流通槽211设置在安装孔11的孔壁上，或者同时在压装段和安装孔11上设置流通槽。
如图25和图26所示，导向段22的直径小于压装段21的直径，流通槽211设置在压装段21的侧壁上。具体地，流通槽211贯穿压装段21的上下两侧设置，便于焊料在安装孔11内流通。其中，压装段21的侧壁上可设置多个流通槽211，以提升流通能力。在本实施例中，流通槽211为铣边槽。
如图24和图25所示，焊料流通腔室还包括设置在连接管30的连接端与壳体10之间的第三焊料腔80。其中，壳体10具有底壁，安装孔11贯穿底壁的内侧和外侧，第三焊料腔80靠近底壁的外侧设置，第三焊料腔80与焊料通道60的一端相连通。通过设置第三焊料腔80，利用第三焊料腔80可对焊料进行收集容纳，能够提升连接管在底壁外侧的焊接牢固性。
在本实施例中，安装孔11的靠近底壁的外侧的一端设置有第二环形凹槽112，第二环形凹槽112与连接管30的连接端的外壁之间的间隔形成第三焊料腔80。将焊环90套设在连接管30的外壁上，使焊环90盖设在第二环形凹槽112上方，当焊环融化之后，焊料可流通至连接管30、安装孔11以及阀座芯20三者之间的焊缝内，其余焊料可容纳在第二环形凹槽112内，可以提升焊接强度，还可以避免焊料流通至其它部位。
如图24和图25所示，焊料流通腔室还包括设置在阀座芯20与壳体10之间的第一焊料腔70，第一焊料腔70靠近底壁的内侧设置，第一焊料腔70与焊料通道60的另一端相连通。 采用上述结构，焊料通过第三焊料腔80、焊料通道60以及第一焊料腔70可填充连接管30、安装孔11以及阀座芯20三者之间的焊缝，能够保证焊接强度。
在本实施例中，安装孔11的靠近底壁的内侧的一端设置有第一环形凹槽111，第一环形凹槽111与阀座芯20之间的间隔形成第一焊料腔70。采用设置环形凹槽形成焊料腔的方式，具有便于加工、成本低的优点。
如图25和图26所示，阀座芯20还包括限位段25，限位段25位于压装段21的远离导向段22的一端，限位段25用于限制阀座芯20在安装孔11内的位置，避免阀座芯过度压装。具体地，限位段25的直径大于压装段21的直径，限位段25与第一环形凹槽111的底壁相抵接，以限制阀座芯20在安装孔11内的位置。其中，限位段25的外壁与第一环形凹槽111之间的间隔形成第一焊料腔70。
在本实施例中，压装段21与导向段22相连接，连接管30的端壁与压装段21的端壁相抵接，利用压装段能够对连接管进行装配定位。在其它实施例中，压装段与导向段可以不相互连接，只要能够满足压装段与安装孔11过盈配合，连接管套设在导向段上并插入安装孔11内即可。
在本实施例中，安装孔11的内壁与阀座芯上的流通槽之间、安装孔11的内壁与连接管的外壁之间以及连接管的内壁与导向段的外壁之间均具有间隙，该间隙形成焊缝。
在本实施例中，壳体10包括相互连接的套管13和阀体14，安装孔11设置在阀体14上。将壳体10分体设置为套管13和阀体14便于进行装配，能够提升装配效率。
在本实施例中，电子膨胀阀还包括阀芯组件，阀芯组件设置在壳体10内，阀座芯20上设置有阀口，阀芯组件用于控制阀口的开闭。
本实用新型实施例十四提供了一种电子膨胀阀，实施例十四与实施例十三的区别在于，在实施例十四中，安装孔11包括相互连接的第一孔段和第二孔段，第一孔段位于第二孔段上方，第一孔段的孔径小于第二孔段的孔径，压装段21与第一孔段过盈配合，焊料通道60设置在压装段21与第一孔段之间，连接管30的连接端套设在导向段22上并插入第二孔段内。具体地，压装段与导向段的直径可相同也可不同，只要能够满足压装段与第一孔段过盈配合，连接管套设在导向段上并插入第二孔段内即可。
通过本实施例提供的装置，具有以下有益效果：
(1)阀座芯与壳体过盈配合，可更好确保两者同轴度；
(2)阀座芯上设置流通槽，用于焊接过程焊料向壳体内渗透，保证焊接质量；
(3)减少激光点焊，工艺简单，能够降低成本；
(4)连接管埋入壳体底壁的端面，连接管与壳体的安装孔11间具有焊缝，焊接过程增强了焊料往安装孔11浸润引导的趋势，与现有结构相比能够减少连接管、壳体间的焊料熔接不 良，并不再需要评价连接管内壁与阀座芯外壁之间的焊缝是否有焊料熔接，工艺更简单、可靠。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (33)

  1. 一种电子膨胀阀，其特征在于，所述电子膨胀阀包括：
    壳体(10)，具有安装孔(11)；
    阀座芯(20)，穿设在所述安装孔(11)内，所述阀座芯(20)包括压装段(21)和导向段(22)，所述压装段(21)与所述安装孔(11)过盈配合；
    连接管(30)，套设在所述导向段(22)上，所述壳体(10)、所述阀座芯(20)以及所述连接管(30)三者之间具有焊料流通腔室。
  2. 根据权利要求1所述的电子膨胀阀，其特征在于，所述壳体(10)具有一底壁，所述安装孔(11)贯穿所述底壁的内侧和外侧，所述压装段(21)和导向段(22)相互连接，所述导向段(22)位于所述底壁的外侧，所述焊料流通腔室包括焊料预置部(50)、焊料通道(60)以及第一焊料腔(70)，所述焊料预置部(50)靠近所述底壁的外侧设置，所述焊料预置部(50)用于放置焊料，所述焊料通道(60)设置在所述压装段(21)与所述安装孔(11)之间，所述阀座芯(20)与所述壳体(10)之间具有所述第一焊料腔(70)，所述第一焊料腔(70)靠近所述底壁的内侧设置，所述焊料通道(60)的一端与所述焊料预置部(50)连通，所述焊料通道(60)的另一端与所述第一焊料腔(70)连通。
  3. 根据权利要求2所述的电子膨胀阀，其特征在于，所述焊料通道(60)设置在所述压装段(21)上和/或所述安装孔(11)内。
  4. 根据权利要求3所述的电子膨胀阀，其特征在于，所述压装段(21)上设置有流通槽(211)，所述流通槽(211)的一端与所述焊料预置部(50)连通，所述流通槽(211)的另一端与所述第一焊料腔(70)连通，所述流通槽(211)形成所述焊料通道(60)。
  5. 根据权利要求2所述的电子膨胀阀，其特征在于，所述安装孔(11)的内壁上设置有第一环形凹槽(111)，所述第一环形凹槽(111)靠近所述底壁的内侧设置，所述第一环形凹槽(111)与所述阀座芯(20)之间形成所述第一焊料腔(70)。
  6. 根据权利要求2所述的电子膨胀阀，其特征在于，所述连接管(30)的端壁与所述壳体(10)相抵接，所述壳体(10)、所述阀座芯(20)以及所述连接管(30)三者之间具有第二焊料腔(40)，所述第二焊料腔(40)的一端与所述焊料预置部(50)连通，所述第二焊料腔(40)的另一端与所述焊料通道(60)连通。
  7. 根据权利要求6所述的电子膨胀阀，其特征在于，所述导向段(22)的直径小于或等于所述压装段(21)的直径。
  8. 根据权利要求7所述的电子膨胀阀，其特征在于，所述导向段(22)、所述壳体(10)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  9. 根据权利要求7所述的电子膨胀阀，其特征在于，所述压装段(21)与所述导向段(22)之间具有第一倒角(23)，所述第一倒角(23)、所述壳体(10)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  10. 根据权利要求6所述的电子膨胀阀，其特征在于，所述连接管(30)的与所述导向段(22)连接的一端具有第二倒角(31)，所述第二倒角(31)、所述壳体(10)以及所述阀座芯(20)三者之间的间隔形成所述第二焊料腔(40)。
  11. 根据权利要求6至10任一项所述的电子膨胀阀，其特征在于，所述安装孔(11)的孔壁的朝向所述连接管(30)的一端具有第三倒角(12)，所述第三倒角(12)、所述阀座芯(20)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  12. 根据权利要求2所述的电子膨胀阀，其特征在于，所述焊料预置部(50)位于所述连接管(30)的内壁与所述导向段(22)的外侧壁之间。
  13. 根据权利要求12所述的电子膨胀阀，其特征在于，所述导向段(22)的外侧壁上设置有容纳槽(221)，所述容纳槽(221)沿所述导向段(22)的周向环形设置，所述容纳槽(221)形成所述焊料预置部(50)。
  14. 根据权利要求1所述的电子膨胀阀，其特征在于，所述压装段(21)和导向段(22)相互连接，所述导向段(22)位于所述安装孔(11)外侧，所述连接管(30)的端壁与所述壳体(10)相抵接，所述焊料流通腔室包括位于所述壳体(10)、所述阀座芯(20)以及所述连接管(30)三者之间的第二焊料腔(40)。
  15. 根据权利要求14所述的电子膨胀阀，其特征在于，所述导向段(22)的直径小于或等于所述压装段(21)的直径。
  16. 根据权利要求15所述的电子膨胀阀，其特征在于，所述导向段(22)、所述壳体(10)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  17. 根据权利要求15所述的电子膨胀阀，其特征在于，所述压装段(21)与所述导向段(22)之间具有第一倒角(23)，所述第一倒角(23)、所述壳体(10)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  18. 根据权利要求14所述的电子膨胀阀，其特征在于，所述连接管(30)的与所述导向段(22)连接的一端具有第二倒角(31)，所述第二倒角(31)、所述壳体(10)以及所述阀座芯(20)三者之间的间隔形成所述第二焊料腔(40)。
  19. 根据权利要求14至18任一项所述的电子膨胀阀，其特征在于，所述安装孔(11)的孔壁的朝向所述连接管(30)的一端具有第三倒角(12)，所述第三倒角(12)、所述阀座芯(20)以及所述连接管(30)三者之间的间隔形成所述第二焊料腔(40)。
  20. 根据权利要求14所述的电子膨胀阀，其特征在于，所述连接管(30)的内壁与所述导向段(22)的外侧壁之间设置有焊料预置部(50)，所述焊料预置部(50)用于放置焊料。
  21. 根据权利要求20所述的电子膨胀阀，其特征在于，所述导向段(22)的外侧壁上设置有容纳槽(221)，所述容纳槽(221)沿所述导向段(22)的周向环形设置，所述容纳槽(221)形成所述焊料预置部(50)。
  22. 根据权利要求14所述的电子膨胀阀，其特征在于，所述阀座芯(20)还包括限位凸台(24)，所述限位凸台(24)设置在所述压装段(21)的远离所述导向段(22)的一端，所述限位凸台(24)沿所述阀座芯(20)的周向环形设置。
  23. 根据权利要求14所述的电子膨胀阀，其特征在于，所述壳体(10)包括相互连接的套管(13)和阀体(14)，所述安装孔(11)设置在所述阀体(14)上。
  24. 根据权利要求1所述的电子膨胀阀，其特征在于，所述焊料流通腔室包括设置在所述压装段(21)与所述安装孔(11)的孔壁之间的焊料通道(60)，所述连接管(30)的连接端套设在所述导向段(22)上并插入所述安装孔(11)内。
  25. 根据权利要求24所述的电子膨胀阀，其特征在于，所述压装段(21)的侧壁上和/或所述安装孔(11)的孔壁上设置有流通槽(211)，所述流通槽(211)形成所述焊料通道(60)。
  26. 根据权利要求25所述的电子膨胀阀，其特征在于，所述导向段(22)的直径小于或等于所述压装段(21)的直径，所述流通槽(211)设置在所述压装段(21)的侧壁上。
  27. 根据权利要求24所述的电子膨胀阀，其特征在于，所述焊料流通腔室还包括设置在所述连接管(30)的连接端与所述壳体(10)之间的第三焊料腔(80)，所述壳体(10)具有底壁，所述安装孔(11)贯穿所述底壁的内侧和外侧，所述第三焊料腔(80)靠近所述底壁的外侧设置，所述第三焊料腔(80)与所述焊料通道(60)的一端相连通。
  28. 根据权利要求27所述的电子膨胀阀，其特征在于，所述安装孔(11)的靠近所述底壁的外侧的一端设置有第二环形凹槽(112)，所述第二环形凹槽(112)与所述连接管(30)的连接端的外壁之间的间隔形成所述第三焊料腔(80)。
  29. 根据权利要求27所述的电子膨胀阀，其特征在于，所述焊料流通腔室还包括设置在所述阀座芯(20)与所述壳体(10)之间的第一焊料腔(70)，所述第一焊料腔(70)靠近所述底壁的内侧设置，所述第一焊料腔(70)与所述焊料通道(60)的另一端相连通。
  30. 根据权利要求29所述的电子膨胀阀，其特征在于，所述安装孔(11)的靠近所述底壁的内侧的一端设置有第一环形凹槽(111)，所述第一环形凹槽(111)与所述阀座芯(20)之间的间隔形成所述第一焊料腔(70)。
  31. 根据权利要求30所述的电子膨胀阀，其特征在于，所述阀座芯(20)还包括限位段(25)，所述限位段(25)位于所述压装段(21)的远离所述导向段(22)的一端，所述限位段(25)的直径大于所述压装段(21)的直径，所述限位段(25)与所述第一环形凹槽(111)的底壁相抵接，所述限位段(25)的外壁与所述第一环形凹槽(111)之间的间隔形成所述第一焊料腔(70)。
  32. 根据权利要求24所述的电子膨胀阀，其特征在于，所述压装段(21)与所述导向段(22)相连接，所述连接管(30)的端壁与所述压装段(21)的端壁相抵接。
  33. 根据权利要求24所述的电子膨胀阀，其特征在于，所述安装孔(11)包括相互连接的第一孔段和第二孔段，所述第一孔段位于所述第二孔段上方，所述第一孔段的孔径小于所述第二孔段的孔径，所述压装段(21)与所述第一孔段过盈配合，所述焊料通道(60)设置在所述压装段(21)与所述第一孔段之间，所述连接管(30)的连接端套设在所述导向段(22)上并插入所述第二孔段内。
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