WO2021143874A1 - 一种加热装置 - Google Patents

一种加热装置 Download PDF

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Publication number
WO2021143874A1
WO2021143874A1 PCT/CN2021/072246 CN2021072246W WO2021143874A1 WO 2021143874 A1 WO2021143874 A1 WO 2021143874A1 CN 2021072246 W CN2021072246 W CN 2021072246W WO 2021143874 A1 WO2021143874 A1 WO 2021143874A1
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WO
WIPO (PCT)
Prior art keywords
coating
infrared
heating
heating device
electrode
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Application number
PCT/CN2021/072246
Other languages
English (en)
French (fr)
Inventor
戚祖强
武建
罗家懋
雷宝灵
徐中立
李永海
Original Assignee
深圳市合元科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市合元科技有限公司 filed Critical 深圳市合元科技有限公司
Priority to EP21741418.4A priority Critical patent/EP4091486A4/en
Priority to US17/758,886 priority patent/US20230217998A1/en
Publication of WO2021143874A1 publication Critical patent/WO2021143874A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/20—Devices using solid inhalable precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/021—Heaters specially adapted for heating liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating

Definitions

  • the present application relates to the technical field of tobacco, and in particular to a heating device for heating an aerosol generating substrate to volatilize at least one of its components to form an aerosol for users to inhale.
  • the low-temperature smoke infrared heating tube is a new type of low-temperature smoke heating component.
  • the surface of the heating tube is coated with ATO infrared heating film by chemical vapor deposition and other methods.
  • Smoking products are heated.
  • This heating method to heat the smoking article has a better taste and smoke volume than the traditional heating method that relies on heat conduction. The reason is that infrared heating has better temperature field uniformity and certain penetration ability, so that the tobacco and other materials in the smoking article are almost all heated by infrared radiation.
  • the problem with the smoking device with the above structure is that the infrared electrothermal coating radiates at the periphery of the smoking article, while the infrared coating radiates infrared rays to the smoking article in the base body, while also radiating and dissipating heat in the outer peripheral direction.
  • the base body Existence, so that there is a reflective interface at the interface between the infrared electric heating coating and the substrate, which will cause a part of the infrared to be reflected, which will lead to the low power utilization rate of the infrared electric heating coating, and then affect the preheating speed and output of the smoking article.
  • the smoke speed reduces the user experience.
  • the present application provides a heating device.
  • the present application provides a heating device for heating an aerosol generating substrate and volatilizing at least one component thereof to form an aerosol, including a heating element, and the heating element includes:
  • the base body is provided with a chamber for receiving at least part of the aerosol-generating matrix product
  • the infrared electrothermal coating formed on the outer surface of the substrate is used to receive the electric power of the power source to generate heat, and at least transmit the heat to the aerosol-generating matrix product contained in the cavity by infrared radiation, so that At least one component in the aerosol-generating matrix product volatilizes to form an aerosol for inhalation;
  • the electrode coating is coated on a part of the outer surface of the infrared electric heating coating, and is used to supply the electric power of the power supply to the infrared electric heating coating;
  • the infrared radiation coating at least partially covers the infrared electric heating coating, and the infrared radiation coating can radiate infrared rays after heating up.
  • the square resistance of the infrared radiation coating is greater than the square resistance of the infrared electrothermal coating.
  • the thermal conductivity of the infrared radiation coating is less than the thermal conductivity of the infrared electrothermal coating.
  • the electrode coating includes an electrode part and an electrode connecting part, and the infrared radiation coating does not cover the electrode connecting part.
  • the base body is a hollow tube, the cavity is formed in the base body, and the electrode connection parts for connecting the positive electrode of the power source and the negative electrode of the power source are respectively arranged near the two ends of the base body.
  • the base body is a hollow tube, the cavity is formed in the tube, and the electrode connection parts for connecting the positive electrode and the negative electrode of the power supply respectively are arranged near one end of the base body.
  • the outer surface of the substrate is a rough surface.
  • the roughness of the outer surface of the base is greater than the inner surface of the cavity.
  • the outer surface of the base body undergoes mechanical action to form the rough surface.
  • the outer surface of the substrate is chemically etched to form the rough surface.
  • the rough surface is formed on the outer surface of the substrate by laser ablation.
  • an infrared radiation coating is added to the outer periphery of the infrared electrothermal coating structure of the heating element, so that the escaped heat and infrared rays are absorbed by the infrared radiation coating and then radiates infrared rays into the cavity again, which reduces energy dissipation and increases energy Utilization rate.
  • the reflectivity of the surface can be reduced, so that the infrared rays are more transmitted and absorbed by the substrate, thereby improving the heating efficiency of the infrared heating element.
  • This application takes this into consideration, and prepares a non-smooth surface on the outer surface of the substrate, that is, the interface between the infrared electrothermal coating and the substrate, so that the reflection of infrared rays emitted by the infrared electrothermal coating at the interface is reduced, thereby achieving The purpose of improving heating efficiency.
  • Fig. 1 is a schematic diagram of the structure of an existing infrared heating element
  • Figure 2 is a schematic diagram of the multilayer structure of the heating element of the present application.
  • Fig. 3 is an exploded view of a heating device according to an embodiment of the present application.
  • FIG. 1-2 it is a schematic diagram of the structure of the heating element 11 according to an embodiment of the present application. That is, a layer of infrared radiation coating 115 is coated on the outer periphery of an existing infrared heating element to form a multilayer heating element.
  • the heating element includes a base 111, which has a hollow tubular structure.
  • the base 111 is usually made of round tubular quartz glass.
  • the wall thickness of the quartz glass is usually selected as small as possible. In this embodiment, quartz with a wall thickness of 1 mm is selected.
  • the glass tube serves as the base 111.
  • An infrared electrothermal coating 112 is formed on the outer surface of the substrate 111. As shown in FIG.
  • the infrared electrothermal coating 112 is connected to a power source through an electrode coating 113 electrically connected to it.
  • the electrode coating 113 is usually coated on both ends of the substrate 111.
  • the electrode coating 113 also includes an electrode portion 1131 extending from the electrode coating 113 in the longitudinal direction of the surface of the substrate 111 and an electrode connecting portion 1132 (not shown in the figure) connected to the electrode portion 1131.
  • the electrode portion 1131 is a long strip.
  • the electrode connecting portion 1132 and the electrode portion 1131 extending from it constitute one of a pair of electrodes.
  • the above-mentioned electrode coating 113 or the electrode coating 113 with elongated portions are both present in pairs, and each other Insulation, the above-mentioned electrode coating 113 transmits electric energy from the power supply to the infrared electrothermal coating 112, and the current direction can be along the axial direction of the substrate 111 through the infrared electrothermal coating 112, or along the circumferential direction of the substrate 111, depending on the arrangement of the electrodes. (In the case of having an elongated portion)
  • the infrared electrothermal coating 112 is passed through. After forming the infrared electrothermal coating 112 and the electrode coating 113 on the outer surface of the substrate 111, continue to form an infrared radiation coating 115.
  • the infrared radiation coating 115 at least partially covers the infrared electrothermal coating 112. To reduce energy dissipation, preferably, the infrared radiation coating 115 covers the outer surface of the substrate 111 except for the electrode coating 113 at both ends.
  • the infrared electric heating coating 112 is a kind of resistance heating layer, which will generate resistance heat due to its own resistance and increase the temperature after being energized.
  • the infrared electrothermal coating 112 usually selects a material with high infrared emissivity, optionally, for example, a material containing tin oxide. As a choice of this material, antimony-doped tin oxide is preferred. Tin oxide acts as a conductive film, and its carriers mainly come from crystal defects, that is, electrons provided by oxygen vacancies and doped impurities. The conductivity of SnO 2 doped with Sb and other elements is significantly improved to form an n-type semiconductor.
  • Sb doped SnO 2 has good conductivity and stable performance, and is called ATO (Antimony Doped Tin Oxide).
  • ATO Antimony Doped Tin Oxide
  • other SnO 2 doped materials also include: F, Ni, Mn, Mo, Ce, Cu, Zn, Ta, Si, N, P, In, Pd, Bi, etc.
  • the above-mentioned antimony-doped tin oxide can be prepared by thermal spraying method, for example, using SnCl 4 ⁇ 5H 2 O, alcohol and aqueous solution, adding an appropriate amount of SbCl 3 (usually less than or equal to 10%), and spraying with N 2 gas. Spraying onto the surface of the substrate at high temperature (more than or equal to 400°C, preferably 500°C) to form a SnO 2 :Sb thin film. In order to improve the uniformity of the film layer, the base material usually rotates at a certain rate.
  • the antimony-doped tin oxide infrared electrothermal coating can also be prepared by a CVD method, a PVD method or a magnetron sputtering method.
  • the following describes a process for preparing antimony-doped tin oxide infrared electrothermal coating by magnetron sputtering:
  • Magnetron sputtering coating technology is a new type of physical vapor deposition (PVD) coating technology with the following advantages:
  • the film has a dense structure and good adhesion to the substrate
  • the film thickness can be accurately controlled, the film quality is good, the composition is uniform, and the thickness distribution is uniform.
  • a target material co-fired with Sb 2 O 3 and SnO 2 powder at high temperature is used for direct sputtering (wherein the target Sb/Sn atomic ratio can be 1:10, it is understandable that it can also be Choose other ratios, such as the range of 0.5:10-1.5:10) to obtain Sb-doped SnO2 thin films.
  • the radio frequency magnetron sputtering system used mainly includes the following parts: vacuum system, sputtering system, gas delivery system and heating system.
  • Vacuum system The vacuum system consists of mechanical pumps (rough pumping mechanical pumps, maintenance pumps), molecular pumps and various valves (pre-valves, rough pumping valves, high vacuum valves, etc.); it also includes rough vacuum and high vacuum measurement Gauge (thermocouple gauge, ionization vacuum gauge); the background vacuum of the system can reach the order of 10 -4 Pa.
  • the sputtering system uses a radio frequency power supply and a magnetron sputtering cathode target.
  • the radio frequency power supply has a working frequency of 13.56MHz and a maximum power of 2kW; the diameter of the target is 70mm, and the target is installed on a water-cooled copper base.
  • Gas transmission system has 3 mass flow meters, including Ar, O 2 , and N 2 , which are used to deposit metal nitrides or metal oxides. This process uses Ar as the working gas;
  • Heating system is equipped with a heating tube in the center of the sample rack.
  • the maximum heating temperature of the substrate can reach 550°C.
  • the temperature of the substrate can be measured by a thermocouple connected to the substrate rack, and the control circuit can be from room temperature to the highest heating temperature. Adjust between.
  • the sputtering time is set to 10-40min, and the sputtering thickness is about 0.1-1.5 ⁇ m.
  • the Sb-doped SnO 2 film is prepared on the outer surface of the quartz tube through the above process.
  • the resistance value at both ends of the quartz tube is about 1.2 ohms. It can generate heat after power on. Different Sb doping levels will cause the resistance value to change, and the resistance value is preferably 0.8 -5.2 ohm range.
  • SnO 2 film has higher infrared radiation efficiency.
  • the square resistance of the infrared radiation coating 115 is less than or equal to the square resistance of the infrared electrothermal coating 112.
  • the square resistance of the infrared radiation coating 115 is less than that of the infrared electrothermal coating.
  • the sheet resistance of the coating 112 and the conversion of electrical energy to heat are mainly carried out in the infrared electrothermal coating 112.
  • the infrared radiation coating 115 uses more conduction and absorption of the energy radiated from the infrared electrothermal coating 112, but less Electric energy is converted into heat.
  • the infrared radiation coating 115 is an electrical insulating coating, which does not consume electrical energy to generate heat at all, but only conducts and absorbs the infrared electric heating coating 112 outwards. Radiated energy.
  • the thermal conductivity of the infrared radiation coating 115 is less than or equal to the thermal conductivity of the infrared electrothermal coating 112.
  • the thermal conductivity of the infrared radiation coating 115 is less than the thermal conductivity of the infrared electrothermal coating 112, which can better prevent energy from being dissipated through thermal conduction, further improve the utilization rate of electric energy, and thereby reduce the heater outward Dissipate heat and reduce the pressure of the enclosure temperature control.
  • the infrared radiation coating 115 can heat up after absorbing heat and generate infrared rays of a certain wavelength, for example, infrared rays of 1.5 ⁇ m to 15 ⁇ m.
  • the infrared radiation coating 115 can be made of oxides, carbon materials, carbides, nitrides, and other materials with higher infrared radiation rates. Specifically as follows:
  • Metal oxides and multi-component alloy oxides including: iron oxide, aluminum oxide, chromium oxide, indium oxide, lanthanum oxide, cobalt oxide, nickel oxide, and nickel oxide Antimony, antimony pentoxide, titanium dioxide, zirconium dioxide, manganese dioxide, ceria, copper oxide, zinc oxide, magnesium oxide, calcium oxide, molybdenum trioxide, etc.; it can also be two or more of the above metals A combination of oxides; it can also be a ceramic material with a unit cell structure such as spinel, perovskite, olivine, etc.
  • the emissivity of carbon materials is close to that of a black body, and it has a higher infrared emissivity.
  • Carbon materials including: graphite, carbon fiber, carbon nanotubes, graphene, diamond-like films, etc.
  • Carbides including: silicon carbide, silicon carbide has high emissivity in a larger infrared wavelength range (2.3 microns-25 microns), and is a good near full-band infrared radiation material; in addition, there are tungsten carbide and iron carbide , Vanadium carbide, titanium carbide, zirconium carbide, manganese carbide, chromium carbide, niobium carbide, etc., all have high infrared emissivity (MeC phase does not have strict stoichiometric composition and chemical formula).
  • Nitrides including: metal nitrides and non-metal nitrides, where metal nitrides include: titanium nitride, titanium carbonitride, aluminum nitride, magnesium nitride, tantalum nitride, vanadium nitride, etc.; non-metal nitrides Including: boron nitride, phosphorus pentanitride, silicon nitride (Si3N4), etc.
  • inorganic non-metallic materials include: silicon dioxide, silicate (including phosphosilicate, borosilicate, etc.), titanate, aluminate, phosphate, boride, chalcogenide, etc.
  • the infrared radiation coating 115 can also be coated with infrared coatings, for example, infrared coatings prepared by selecting the above-mentioned high infrared emissivity materials or combining with auxiliary materials such as adhesives.
  • infrared coatings prepared by selecting the above-mentioned high infrared emissivity materials or combining with auxiliary materials such as adhesives.
  • An example of such a coating is as follows:
  • composition of infrared coating is as follows:
  • Metal oxides mainly include oxides of elements such as Mg, Al, Ti, Zr, Mn, Fe, Co, Ni, Cu, and Cr.
  • the powder particle size of these oxides is generally less than 1um.
  • the adhesive is one or more of silica sol, potassium water glass, soda water glass and lithium water glass;
  • nano-level rare earth element oxides can improve the overall activity of the coating composition materials, and optimize the overall strength, aging resistance and thermal stability of the coating.
  • the infrared coating of the above composition is applied to the outer surface of the heating element 11 and heated and cured to form an infrared radiation coating 115.
  • FIG. 3 is a heating device 100 according to an embodiment of the present application, which includes a housing assembly 6 and the above-mentioned heating element 11, and the heating element 11 is provided in the housing assembly 6.
  • an infrared electric heating coating 112 and a first electrode (not shown) and a second electrode (not shown) that are electrically connected to the infrared electric heating coating 112 are provided on the outer surface of the substrate 111.
  • the infrared electric heating The outer circumference of the coating 112 is also coated with an infrared radiation coating 115.
  • the infrared electrothermal coating 112 can emit infrared rays to at least radiate and heat the aerosol-generating substrate products in the cavity of the substrate 111.
  • the infrared radiation coating 115 is used to prevent infrared electrothermal coating. The infrared radiation emitted by the layer 112 is lost in the outer circumferential direction, and the heating efficiency of the heating element is improved.
  • the housing assembly 6 includes a housing 61, a fixed housing 62, a fixed seat and a bottom cover 64.
  • the fixed housing 62 and the fixed seat (14, 15) are all fixed in the housing 61, wherein the fixed seat (14, 15) is used to fix the base 111 .
  • the fixing seats (14, 15) are arranged in the fixing shell 62, and the bottom cover 64 is arranged at one end of the shell 61 and covers the shell 61.
  • the fixing bases (14, 15) include a first fixing base 14 and a second fixing base 15.
  • the first fixing base 14 and the second fixing base 15 are both provided in the fixing shell 62, and the first end and the second fixing base of the base 111 The two ends are respectively fixed on the first fixing base 14 and the second fixing base 15.
  • the bottom cover 64 is provided with an air inlet pipe 641.
  • the end of the second fixing base 15 away from the first fixing base 14 is connected to the air inlet pipe 641.
  • the fixing base 14, the base 111, the second fixing base 15 and the air inlet pipe 641 are coaxially arranged, and the base 111 is sealed with the first fixing base 14 and the second fixing base 15, and the second fixing base 15 and the air inlet pipe 641 are also sealed ,
  • the air intake pipe 641 communicates with the outside air so that the user can take in smoothly when inhaling.
  • the heating device 100 also includes a main control circuit board 3 and a battery 7.
  • the fixed shell 62 includes a front shell 621 and a rear shell 622, the front shell 621 and the rear shell 622 are fixedly connected, the main control circuit board 3 and the battery 7 are both arranged in the fixed shell 62, the battery 7 is electrically connected to the main control circuit board 3, and keys are 4 is protrudingly arranged on the housing 61, and by pressing the button 4, the infrared electrothermal coating 112 on the surface of the substrate 111 can be energized or de-energized.
  • the main control circuit board 3 is also connected to a charging interface 31, which is exposed on the bottom cover 64. The user can charge or upgrade the heating device 100 through the charging interface 31 to ensure the continuous use of the heating device 100.
  • the heating device 100 further includes a heat insulating member 16, and the insulating member 16 includes at least one of a vacuum tube, an aerogel tube, an aerogel felt, and a polyurethane foam.
  • the thermal insulation member 16 is a hollow thermal insulation tube.
  • a vacuum thermal insulation tube whose internal air pressure is lower than the ambient pressure, the thermal insulation member 16 is arranged in the fixed shell 62, and the thermal insulation member 16 is sleeved outside the base 111 to insulate the heat.
  • the member 16 can prevent a large amount of heat from being transferred to the housing 61 and causing the user to feel hot.
  • the heat insulating member 16 may also be coated with an infrared reflective coating, or an embedded reflective member can reflect the infrared rays emitted by the infrared electrothermal coating 112 on the substrate 111 back to the infrared electrothermal coating 112 to improve heating efficiency.
  • the heating device 100 also includes an NTC temperature sensor 2 for detecting the real-time temperature of the substrate 111 and transmitting the detected real-time temperature to the main control circuit board 3.
  • the main control circuit board 3 feeds the infrared electrothermal coating 112 according to the real-time temperature adjustment.
  • the size of the electrical power on Specifically, when the NTC temperature sensor 2 detects that the real-time temperature in the substrate 111 is low, for example, when it detects that the temperature inside the substrate 111 is less than 150°C, the main control circuit board 3 controls the battery 7 to output a higher voltage to the electrodes.
  • the current fed into the infrared electrothermal coating 112 is increased, the heating power of the aerosol-generating substrate product is increased, and the time for the user to wait for the first mouth to be sucked is reduced.
  • the main control circuit board 3 controls the battery 7 to output a lower sustain voltage to the electrode; when the NTC temperature sensor 2 detects that the temperature inside the substrate 111 is 250 When the temperature is above or above, the main control circuit board 3 controls the battery 7 to stop outputting voltage to the electrodes.

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Abstract

一种加热装置，用于加热气溶胶生成基质制品并挥发其中至少一种成分以形成气溶胶，包括发热体（11），所述发热体（11）包括：基体（111），设有用于接收至少部分所述气溶胶生成基质制品的腔室；形成于所述基体（111）外表面的红外电热涂层（112），用于接收电源产生热量，并至少以红外辐射将热量传递给接收于所述腔室内的所述气溶胶生成基质制品，以使所述气溶胶生成基质制品中的至少一种成分挥发形成可供吸食的气溶胶；电极涂层（113），涂覆于所述红外电热涂层（112）的部分外表面，用于将电源的电功率供给到所述红外电热涂层（112）；红外辐射涂层（115），至少部分覆盖所述红外电热涂层（112），所述红外辐射涂层（115）升温后能够辐射红外线。该加热装置能提高红外电热涂层（112）的电源功率效率。

Description

一种加热装置
本申请要求于2020年01月17日提交中国专利局，申请号为“202010054549.4”，发明名称为“一种加热装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及烟草技术领域，尤其涉及一种加热装置，用于加热气溶胶生成基质以挥发其中至少一种成分形成供用户吸食的气溶胶。
背景技术
传统的诸如香烟和雪茄的吸烟制品在使用期间通过燃烧烟草以产生烟雾供人吸食，燃烧过程中，吸烟制品在挥发出尼古丁等有效成分的同时，还会由于不完全燃烧等原因产生焦油、一氧化碳等有毒害、致癌的物质，这些物质已经证实是导致吸烟人群健康问题的主要原因。已经尝试通过产生在不燃烧的情况下释放尼古丁等化合物的产品来为这些燃烧烟草的物品提供替代物以降低吸烟的危害。此类产品的示例是所谓的加热不燃烧产品，其通过加热吸烟制品而不是燃烧来释放尼古丁等有效化合物，由于不燃烧，将大大降低烟气中焦油、一氧化碳等有毒害以及致癌物。
低温烟红外加热管是一种新型的低温烟加热部件，该加热管表面通过化学气相沉积等的方法镀有ATO红外发热膜，通过加电发热并将热量转换成红外辐射的形式对管中的吸烟制品加热。用这种加热方式加热吸烟制品比传统的依靠热传导方式加热的方式具有更好的口感和烟雾量。原因是红外加热具有更好的温场均匀性和具有一定的穿透能力，使得吸烟制品内的烟草等材料几乎一起进行红外辐射加热。
采用上述结构的烟具存在的问题是，红外电热涂层在吸烟制品的外围辐射，而红外涂层在向基体内的吸烟制品辐射红外线的同时，也在向外周方向辐射和散热，此外，基体的存在，使得在红外电热涂层和基体之间的界面存在反射界面，会使得红外线的一部分被反射，这些会导致 红外电热涂层的电源利用率较低，进而影响吸烟制品的预热速度和出烟速度，降低了用户体验。
申请内容
为了解决现有技术中存在的电源利用效率较低的问题，提高用户体验，本申请提供了一种加热装置。
本申请提供一种加热装置，用于加热气溶胶生成基质并挥发其中至少一种成分以形成气溶胶，包括发热体，所述发热体包括：
基体，设有用于接收至少部分气溶胶生成基质制品的腔室；
形成于所述基体外表面的红外电热涂层，用于接收电源的电功率产生热量，并至少以红外辐射将所述热量传递给收容于所述腔室内的所述气溶胶生成基质制品，以使所述气溶胶生成基质制品中的至少一种成分挥发形成可供吸食的气溶胶；
电极涂层，涂覆于所述红外电热涂层的部分外表面，用于将电源的电功率供给到所述红外电热涂层；
红外辐射涂层，至少部分覆盖所述红外电热涂层，所述红外辐射涂层升温后能够辐射红外线。
进一步地，所述红外辐射涂层的方块电阻大于所述红外电热涂层的方块电阻。
进一步地，所述红外辐射涂层的热导率小于所述红外电热涂层的热导率。
进一步地，所述电极涂层包括电极部和电极连接部，所述红外辐射涂层不覆盖所述电极连接部。
进一步地，所述基体为中空管状，所述基体内形成所述腔室，用于分别连接电源正极和电源负极的所述电极连接部分别设置在所述基体的两端端部附近。
进一步地，所述基体为中空管状，管内形成所述腔室，用于分别连接电源正极和负极的所述电极连接部均设置在所述基体的一端端部附近。
进一步地，所述基体的外表面为粗糙表面。
所述基体的外表面的粗糙度大于所述腔室的内表面。
进一步地，所述基体的外表面经过机械作用形成所述粗糙面。
进一步地，所述基体的外表面经过化学刻蚀形成所述粗糙面。
进一步地，所述基体的外表面通过激光烧蚀形成所述粗糙面。
本申请在发热体的红外电热涂层结构外周侧增加红外辐射涂层，使得逸散的热量和红外线被红外辐射涂层吸收进而再次向腔室内辐射出红外线，降低了能量逸散，增加了能量利用率。
通过反射表面的粗糙化处理，可以降低表面的反射率，使红外线更多地被基体透射和吸收，进而提升红外发热体的发热效率。本申请考虑到这一点，在基体的外表面，即红外电热涂层的与基体的界面处制备非光滑的表面，使得所述红外电热涂层发射的红外线在界面处的反射降低，进而可以达到提高发热效率的目的。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明并不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1是现有的一种红外发热体的结构示意图；
图2是本申请的发热体的多层结构示意图；
图3是本申请一种实施方式的加热装置分解图。
具体实施方式
为了便于理解本申请，下面结合附图和具体实施方式，对本申请进行更详细的说明。需要说明的是，当元件被表述“固定于”另一个元件，它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件，它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语 “上”、“下”、“左”、“右”、“内”、“外”以及类似的表述只是为了说明的目的。
除非另有定义，本说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本说明书中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是用于限制本申请。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图对本申请做详细的描述，所做描述仅为理解本申请的申请构思，本申请不限于所描述的范围。
如图1-2所示，为本申请的一种实施方式的发热体11的结构示意图，即在现有的一种红外发热体外周涂覆一层红外辐射涂层115形成多层发热体。该发热体包括基体111，基体为中空管状结构，优选地，基体111通常可选择圆管状的石英玻璃，所述石英玻璃的壁厚通常选择尽可能的小，本实施方式选择壁厚1mm的石英玻璃管作为基体111。在基体111的外表面形成红外电热涂层112，如图2所示，红外电热涂层112通过与其电连接的电极涂层113与电源连接，电极涂层113通常涂覆在基体111的两端，电极涂层113还包括从上述电极涂层113沿基体111表面纵向方向延伸的电极部1131以及与电极部1131相连接的电极连接部1132(图中未示出)，电极部1131为长条形，电极连接部1132与由其延伸出的电极部1131构成一对电极中的一个，可以理解的是，上述电极涂层113或者具有长条部的电极涂层113均成对出现，且彼此绝缘，上述电极涂层113从电源馈送电能输送到红外电热涂层112，电流方向依据电极布置的不同可以是沿基体111的轴向方向通过红外电热涂层112，或者沿基体111的周向方向(具有长条部的情况下)通过红外电热涂层112。在形成红外电热涂层112和电极涂层113后的基体111外表面，继续形成红外辐射涂层115，红外辐射涂层115至少部分覆盖红外电热涂层112，可以理解的是，为了尽可能的降低能量耗散，优选的，红外辐射涂层115覆盖于除两端电极涂层113外的基体111外表面。
红外电热涂层112是一种电阻发热层，通电后会因为自身电阻的作 用产生电阻热进而升高温度。红外电热涂层112通常选择具有红外发射率高的材料，可选地，例如含有氧化锡的材料，作为这种材料的一种选择，锑掺杂氧化锡是优选的。氧化锡作为导电膜，其载流子主要来自晶体缺陷，即氧空位和掺杂杂质提供的电子。SnO 2掺杂Sb等元素后导电性能显著提高，形成n型半导体，Sb掺杂SnO 2的半导体导电性好，性能稳定，称为ATO(锑掺杂二氧化锡，Antimony Doped Tin Oxide)。此外，其他SnO 2掺杂材料还包括：F、Ni、Mn、Mo、Ce、Cu、Zn、Ta、Si、N、P、In、Pd、Bi等。
上述锑掺杂氧化锡可以采用热喷涂法制备，例如采用SnCl 4·5H 2O、酒精和水溶液，掺入适量的SbCl 3(通常比例小于等于10％)，用N 2气以喷雾的方式，喷涂到高温(大于等于400℃，优选的基体温度为500℃)衬底表面，形成SnO 2:Sb薄膜。为了提高膜层的均匀性，通常基体材料会以一定的速率旋转。
此外，上述锑掺杂氧化锡红外电热涂层也可以采用CVD法制备、PVD法制备或者磁控溅射法制备。
作为一种示例，下面描述一种磁控溅射制备锑掺杂氧化锡红外电热涂层的工艺：
射频磁控溅射锑掺杂氧化锡(ATO)薄膜
磁控溅射镀膜技术是一种新型的物理气相沉积(PVD)镀膜技术，具有以下优点：
1.可实现大面积沉积，工艺重复性好，可实现大规模生产；
2.薄膜结构致密，与基体结合力好；
3.沉积速率适中，工艺可控性好；
4.能够精确地控制膜厚，薄膜质量好、成分均匀、厚度分布均匀。
在该射频磁控溅射工艺中，采用Sb 2O 3和SnO 2粉末高温共烧的靶材直接溅射(其中靶材Sb/Sn原子比可以为1:10，可以理解的是，也可以选择其他比例，例如0.5:10-1.5:10的范围)，得到掺Sb的SnO2薄膜。
采用的射频磁控溅射系统主要包括以下几个部分：真空系统、溅射系统、输气系统和加热系统。
1.真空系统：真空系统由机械泵(粗抽机械泵、维持泵)、分子泵和各种阀门(前置阀、粗抽阀、高真空阀等)组成；还包括粗真空及高真空测量规(热偶规、电离真空规)；系统本底真空可达10 -4Pa数量级。
2.溅射系统：溅射系统采用射频电源和磁控溅射阴极靶，射频电源工作频率13.56MHz，最高功率2kW；靶材直径为70mm，靶材安装在水冷铜基座上。
3.输气系统：输气系统有3路质量流量计，包括Ar、O 2、N 2，用于沉积金属氮化物或金属氧化物。本工艺使用Ar作为工作气体；
4.加热系统：加热系统在样品架的中心设有加热管，基体最高加热温度可达550℃，基体温度可以通过与基片架相连的热电偶测量，通过控制电路可以从室温到最高加热温度之间进行调节。
具体工艺步骤如下：
1.将外径为9.2mm，高度为30mm的石英管样品装在基片架上，抽真空至5x10 -4Pa以下；
2.开启加热系统，设置基体加热温度为300℃；
3.通入Ar气，流量在30-200sccm之间，维持真空室压力为0.1Pa；
4.开启工件架公自转装置，公转速度为10r/min，自转速度为15r/min；
5.开启掺Sb的SnO 2靶的射频电源，功率设置为300W，开始溅射；
6.溅射时间设置为10-40min，溅射厚度为约0.1-1.5μm。
通过以上工艺在石英管外表面制备了掺Sb的SnO 2膜，石英管两端的阻值约为1.2欧姆，通电后可以发热，不同Sb掺杂量会导致阻值的变化，优选阻值在0.8-5.2欧姆范围内。同时SnO 2膜具有较高的红外辐射效率。
对于所述红外辐射涂层115，所述红外辐射涂层115的方块电阻小于等于所述红外电热涂层112的方块电阻，优选地，所述红外辐射涂层115的方块电阻小于所述红外电热涂层112的方块电阻，电能到热能的转换主要在红外电热涂层112中进行，红外辐射涂层115更多地利用传导以及吸收红外电热涂层112向外辐射的能量，而更少地利用电能转化 为热量，在这一方面，更优选的是，所述红外辐射涂层115为电绝缘涂层，其完全不会消耗电能产生热量，而仅仅利用传导以及吸收红外电热涂层112向外辐射的能量。
所述红外辐射涂层115的热导率小于等于所述红外电热涂层112的热导率。优选地，所述红外辐射涂层115的热导率小于所述红外电热涂层112的热导率，可以更好地防止能量通过热传导散失，进一步提高电能利用率，并进而降低加热器向外散失热量，降低外壳温度控制的压力。
红外辐射涂层115在吸收热量之后可升温并生成一定波长的红外线，例如：1.5μm～15μm的红外线。
红外辐射涂层115可以用氧化物、碳材料、碳化物、氮化物等具有较高红外辐射率的材料制成。具体地如下所示：
金属氧化物及多组分合金氧化物，包括：三氧化二铁、三氧化二铝、三氧化二铬、三氧化二铟、三氧化二镧、三氧化二钴、三氧化二镍、三氧化二锑、五氧化二锑、二氧化钛、二氧化锆、二氧化锰、二氧化铈、氧化铜、氧化锌、氧化镁、氧化钙、三氧化钼等；也可以是以上两种或两种以上金属氧化物的组合；还可以是具有尖晶石、钙钛矿、橄榄石等晶胞结构的陶瓷材料。
碳材料的发射率接近于黑体特性，具有较高的红外辐射率。碳材料，包括：石墨、碳纤维、碳纳米管、石墨烯、类金刚石薄膜等。
碳化物，包括：碳化硅，碳化硅在较大的红外线波长范围内(2.3微米-25微米)具有高发射率，是较好的近全波段红外辐射材料；此外，还有碳化钨、碳化铁、碳化钒、碳化钛、碳化锆、碳化锰、碳化铬、碳化铌等，都具有较高的红外发射率(MeC相不具备严格的化学计算成分和化学式)。
氮化物，包括：金属氮化物和非金属氮化物，其中金属氮化物包括：氮化钛、碳氮化钛、氮化铝、氮化镁、氮化钽、氮化钒等；非金属氮化物包括：氮化硼、五氮化三磷、氮化硅(Si3N4)等。
其他无机非金属材料，包括：二氧化硅、硅酸盐(包括磷硅酸盐、硼硅酸盐等)、钛酸盐、铝酸盐、磷酸盐、硼化物、硫系化合物等。
红外辐射涂层115也可以采用红外涂料涂覆，例如选择上述高红外发射率的材料或组合配合粘结剂等辅助材料制备成的红外涂料，一种这样的涂料的示例如下：
红外涂料成份如下：
粘接剂20～60份(质量)；
纳米碳管0～10份(质量)、优选5-10份(质量)；
金属氧化物30～45份(质量)；
纳米级稀土元素氧化物0～10份(质量)、优选3-8份(质量)；
甘油1～4份(质量)；
水15～35份(质量)。
金属氧化物主要包括Mg、Al、Ti、Zr、Mn、Fe、Co、Ni、Cu、Cr等元素的氧化物。这些氧化物的粉体粒径一般小于1um。
所述粘接剂为硅溶胶、钾水玻璃、钠水玻璃和锂水玻璃中的一种或多种；
其中，纳米级稀土元素氧化物，能提高涂料组成材料整体活性，优化涂料的整体强度、抗老化性和热稳定性。
将上述组分的红外涂料涂覆至发热体11外表面，并对其进行加热固化后，形成红外辐射涂层115。
图3是本申请实施方式的一种加热装置100，包括壳体组件6和上述的发热体11，发热体11设于壳体组件6内。本实施例的加热装置100，在基体111的外表面设置红外电热涂层112以及与红外电热涂层112导电连接的第一电极(图未示)和第二电极(图未示)，红外电热涂层112外周还涂覆有红外辐射涂层115，红外电热涂层112可发出红外线对基体111的腔室内的气溶胶生成基质制品进行至少辐射加热，红外辐射涂层115用于防止红外电热涂层112发出的红外线在外周方向的辐射损失，提高发热体的发热效率。
壳体组件6包括外壳61、固定壳62、固定座以及底盖64，固定壳62、固定座(14、15)均固定于外壳61内，其中固定座(14、15)用于固定基体111，固定座(14、15)设置于固定壳62内，底盖64设于 外壳61一端且盖设外壳61。具体的，固定座(14、15)包括第一固定座14和第二固定座15，第一固定座14和第二固定座15均设于固定壳62内，基体111的第一端和第二端分别固定在第一固定座14和第二固定座15上，底盖64上凸设有进气管641，第二固定座15背离第一固定座14的一端与进气管641连接，第一固定座14、基体111、第二固定座15以及进气管641同轴设置，且基体111与第一固定座14、第二固定座15之间密封，第二固定座15与进气管641也密封，进气管641与外界空气连通以便于用户抽吸时可以顺畅进气。
加热装置100还包括主控制电路板3和电池7。固定壳62包括前壳621与后壳622，前壳621与后壳622固定连接，主控制电路板3和电池7均设置在固定壳62内，电池7与主控制电路板3电连接，按键4凸设在外壳61上，通过按压按键4，可以实现对基体111表面上的红外电热涂层112的通电或断电。主控制电路板3还连接有一充电接口31，充电接口31裸露于底盖64上，用户可以通过充电接口31对加热装置100进行充电或升级，以保证加热装置100的持续使用。
加热装置100还包括绝热件16，绝缘件16包括真空管、气凝胶管、气凝胶毡以及聚氨酯泡沫中的至少一种。在本实施方式中，绝热件16为中空隔热管，优选的，内部气压小于环境气压的真空隔热管，绝热件16设置在固定壳62内，绝热件16套设在基体111外，绝热件16可以避免大量的热量传递到外壳61上而导致用户觉得烫手。绝热件16内还可涂覆有红外线反射涂层，或者内嵌反射件以将基体111上的红外电热涂层112发出的红外线反射回红外电热涂层112，提高加热效率。
加热装置100还包括NTC温度传感器2，用于检测基体111的实时温度，并将检测的实时温度传输到主控制电路板3，主控制电路板3根据该实时温度调节馈送至红外电热涂层112上的电功率的大小。具体的，当NTC温度传感器2检测到基体111内的实时温度较低时，譬如检测到基体111内侧的温度不到150℃时，主控制电路板3控制电池7输出较高的电压给电极，进而提高红外电热涂层112中馈入的电流，提高气溶胶生成基质制品的加热功率，减少用户抽吸第一口所要等待的时间。当 NTC温度传感器2检测到基体111的温度在200℃-250℃时，主控制电路板3控制电池7输出较低的维持电压给电极；当NTC温度传感器2检测到基体111内侧的温度在250℃及以上时，主控制电路板3控制电池7停止输出电压给电极。
需要说明的是，本申请的说明书及其附图中给出了本申请的较佳的实施例，但是，本申请可以通过许多不同的形式来实现，并不限于本说明书所描述的实施例，这些实施例不作为对本申请内容的额外限制，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。并且，上述各技术特征继续相互组合，形成未在上面列举的各种实施例，均视为本申请说明书记载的范围；进一步地，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本申请所附权利要求的保护范围。

Claims (10)

  1. 一种加热装置，用于加热气溶胶生成基质制品并挥发其中至少一种成分以形成气溶胶，其特征在于，包括发热体，所述发热体包括：
    基体，设有用于接收至少部分所述气溶胶生成基质制品的腔室；
    形成于所述基体外表面的红外电热涂层，用于接收电源产生热量，并至少以红外辐射将热量传递给接收于所述腔室内的所述气溶胶生成基质制品，以使所述气溶胶生成基质制品中的至少一种成分挥发形成可供吸食的气溶胶；
    电极涂层，涂覆于所述红外电热涂层的部分外表面，用于将电源的电功率供给到所述红外电热涂层；
    红外辐射涂层，至少部分覆盖所述红外电热涂层，所述红外辐射涂层升温后能够辐射红外线。
  2. 根据权利要求1所述的加热装置，其特征在于，所述红外辐射涂层的方块电阻小于所述红外电热涂层的方块电阻。
  3. 根据权利要求1或2所述的加热装置，其特征在于，所述红外辐射涂层的热导率小于所述红外电热涂层的热导率。
  4. 根据权利要求3所述的加热装置，其特征在于，所述电极涂层包括电极部和电极连接部，所述红外辐射涂层不覆盖所述电极连接部。
  5. 根据权利要求4所述的加热装置，其特征在于，所述基体为中空管状结构，所述基体内形成所述腔室，用于分别连接电源正极和电源负极的所述电极连接部分别设置在所述基体的两端端部附近。
  6. 根据权利要求4所述的加热装置，其特征在于，所述基体为中空管状结构，所述基体内形成所述腔室，用于连接电源正极和负极的所述电极连接部均设置在所述基体的一端端部附近。
  7. 根据权利要求1-6中任一项所述的加热装置，其特征在于，所述基体腔室外表面为粗糙表面。
  8. 根据权利要求7所述的加热装置，其特征在于，所述基体的外表面经过机械作用形成所述粗糙表面，或者所述基体的外表面经过化学刻 蚀形成所述粗糙表面，或者所述基体外表面通过激光烧蚀形成所述粗糙表面。
  9. 根据权利要求7所述的加热装置，其特征在于，还包括绝热件，所述绝热件设置在所述发热体的周向外围，用于阻止至少部分热量向所述发热体四周散失。
  10. 根据权利要求7所述的加热装置，其特征在于，所述绝热件包括真空管、气凝胶管、气凝胶毡以及聚氨酯泡沫中的至少一种。
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