WO2021139212A1 - 一种光电连接装置 - Google Patents

一种光电连接装置 Download PDF

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Publication number
WO2021139212A1
WO2021139212A1 PCT/CN2020/116766 CN2020116766W WO2021139212A1 WO 2021139212 A1 WO2021139212 A1 WO 2021139212A1 CN 2020116766 W CN2020116766 W CN 2020116766W WO 2021139212 A1 WO2021139212 A1 WO 2021139212A1
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WO
WIPO (PCT)
Prior art keywords
optical
conductive terminals
connecting portion
photoelectric
terminal
Prior art date
Application number
PCT/CN2020/116766
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English (en)
French (fr)
Inventor
李进波
舒亮
吴援朋
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华为技术有限公司
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Publication of WO2021139212A1 publication Critical patent/WO2021139212A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit

Definitions

  • This application relates to the field of communication technology, and in particular to a photoelectric connection device.
  • Electronic devices such as access point devices (AP) and web cameras are usually installed in areas such as corporate campuses, indoor ceilings, building walls, etc. There is usually no power supply device near these areas to provide the power required for the operation of electronic devices. Therefore, The power supply of these electronic devices is generally achieved through power over ethernet (PoE).
  • PoE power over ethernet
  • Power over Ethernet is a technology that can transmit power to electronic devices through twisted pair cables in Ethernet.
  • Power over Ethernet generally uses a photoelectric hybrid cable to transmit optical signals and electrical energy at the same time.
  • the optical signal is used to enable remote electronic devices to achieve network communication, and the electrical energy is used to power the remote electronic devices.
  • the photoelectric hybrid cable is composed of optical fibers and cables. , The transmission of optical signal and electric energy is realized by optical fiber and cable respectively.
  • the photoelectric hybrid cable After the photoelectric hybrid cable is stretched to the vicinity of the electronic device, it will be split into independent optical fibers and cables.
  • the fiber ends are equipped with optical fiber connectors, and the cable ends are equipped with Ethernet connectors.
  • the electronic device also needs to be provided with an additional POE interface for docking with the Ethernet connector. Only in this way can it receive power from the photoelectric hybrid cable.
  • the provision of an additional POE interface in the electronic device will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • This application provides a photoelectric connection device, which can not only receive light/electric signals, but also couple remotely powered electric energy to electronic equipment to supply power to the electronic equipment, so that the electronic equipment does not need to be additionally provided with a POE interface, which is conducive to reducing The volume of electronic equipment.
  • the photoelectric connection device includes: a housing; and, a first connection portion provided at one end of the housing, the first connection portion being used for coupling to the optical signal transmission medium; and a first connection portion provided at the other end of the housing
  • the second connection part, the second connection part is used for coupling to the electric signal transmission medium;
  • the first connection part and the second connection part are coupled by the photoelectric processing module arranged in the housing;
  • the plurality of first conductive terminals are used for additional multiplication through the optical signal transmission medium
  • Each power supply terminal is coupled to the power supply voltage, and the plurality of second conductive terminals are used for coupling the power supply voltage to the electronic device through a plurality of power receiving terminals attached by the electric signal transmission medium.
  • the optoelectronic connection device provided in this application can enable the optoelectronic connection device to communicate with the optoelectronic device without changing the interface form of the existing optical modules (such as SPF+ optical modules, SPF optical modules, XFP optical modules, and CFP optical modules).
  • the hybrid cable has the ability to supply power to electronic equipment.
  • the photoelectric connection device provided by this application has the same compatibility with the existing optical modules, and can be adapted to the existing SC-type optical fiber connectors, LC-type optical fiber connectors, electrical connection sockets and other
  • the docking structure does not need to be modified to the above docking structure, the deployment flexibility is high, the cost is low, and it is conducive to large-scale deployment.
  • the photoelectric processing module includes: a first printed circuit board PCB arranged between the first connection part and the second connection part; a photoelectric converter coupled with the first PCB, the photoelectric converter is provided with an optical connector, and an optical connector It extends into the first connection part along the transmission direction of the optical signal.
  • the optical connector becomes a part of the first connection part, and is used for docking with the optical fiber connector or the optical fiber ferrule of other optical signal transmission media to receive optical signals sent by other network devices or send optical signals to other network devices .
  • the first connecting portion includes an insulating component, and the insulating component includes a first insulating plate and a second insulating plate that are connected; the first insulating plate is arranged perpendicular to the direction of optical signal transmission, and the first insulating plate is provided with positioning holes, The optical connector passes through the positioning hole and is connected to the optical fiber ferrule included in the optical signal transmission medium; the second insulating plate is arranged on the side of the optical connector, and the plurality of first conductive terminals are arranged on the second insulating plate facing the optical connector. Therefore, if the optical signal transmission medium is provided with a power supply terminal corresponding to the first conductive terminal, when the optical signal transmission medium is inserted into the first connecting portion, the first conductive terminal can be connected to the power supply terminal to couple the power supply voltage.
  • the first PCB is provided with electrical signal terminals, and the electrical signal terminals extend into the second connection portion along the transmission direction of the optical signal, and are connected to the socket containing the pins of the electrical signal transmission medium;
  • the second connection portion includes the third The insulating plate, the third insulating plate is arranged on the side surface of the electric signal terminal parallel to the direction of optical signal transmission, and the plurality of second conductive terminals are arranged on the third insulating plate facing the electric signal terminal.
  • the electrical signal terminal becomes a part of the second connecting portion, which is used for docking with the corresponding electrical signal interface of the electrical signal transmission medium to send and receive electrical signals; and, if the electrical signal transmission medium is provided with a receiving terminal corresponding to the second conductive terminal
  • the electric terminal when the electric signal transmission medium is inserted into the second connecting part, the second conductive terminal can be connected to the electric receiving terminal, and the supply voltage is coupled to the electronic device through the electric signal transmission medium.
  • the photoelectric connection device further includes: at least two cables arranged in the housing, and the plurality of first conductive terminals and the plurality of second conductive terminals are electrically connected by the at least two cables.
  • the photoelectric connection device further includes: a metal isolating plate; the metal isolating plate is arranged parallel to the transmission direction of the optical signal, and the metal isolating plate divides the space inside the housing into a first subspace and a second subspace, at least Two cables are located in the first subspace, and the first PCB is located in the second subspace.
  • the cable and the first PCB are electrically isolated by the metal isolation plate, so that the electromagnetic radiation of the first PCB does not leak to the outside of the housing, and the problem of radiated emission (RE) is avoided.
  • RE radiated emission
  • the housing further includes an optical connector support set perpendicular to the transmission direction of the optical signal, the optical connector support is located on the side of the first insulating plate facing the photoelectric converter, and the optical connector support is used to fix the optical connector.
  • the optical connector is sleeved with a conductive ring, and the conductive ring is used to fill the gap between the optical connector and the optical connector support.
  • the conductive ring and the optical connector holder form an electromagnetic shielding layer, which can electrically isolate the first connection part from other parts of the photoelectric converter except the optical connector, and avoid the pairing of the first conductive terminals of the first connection part.
  • the photoelectric converter generates electromagnetic interference to ensure the stability of signal conversion.
  • the distance between any two adjacent first conductive terminals among the plurality of first conductive terminals is greater than or equal to a first threshold, so that the optoelectronic connection device can meet high-voltage surge protection without grounding Claim.
  • the distance between any two adjacent second conductive terminals in the plurality of second conductive terminals is greater than or equal to the second threshold, so that the optoelectronic connection device can meet high-voltage surge protection without grounding Claim.
  • the optical signal transmission medium includes an SC-type optical fiber connector or an LC-type optical fiber connector.
  • the electrical signal transmission medium includes a multi-source protocol MSA gold finger connector.
  • Figure 1 is a schematic diagram of an installation scene of an electronic device
  • Figure 2 is a schematic diagram of a local power supply scheme for electronic equipment
  • Figure 3 is a schematic diagram of a remote power supply scheme for electronic equipment
  • Figure 4 is a schematic diagram of a remote power supply scheme for electronic equipment
  • FIG. 5 is an exploded view of the structure of the photoelectric connection device provided by the embodiment of the present application.
  • Fig. 6 shows a schematic diagram of an achievable structure of the insulating component
  • Figure 7 is a schematic diagram of the mating of the first connecting portion and the optical fiber connector
  • FIG. 8 shows a schematic diagram of an achievable structure of the third insulating plate
  • Fig. 9 is a schematic diagram of the mating of the second connecting portion and the electrical connector
  • Figure 10 is a schematic diagram of the first conductive terminal and the second conductive terminal connected using a cable
  • FIG. 11 is a schematic diagram of the first conductive terminal and the second conductive terminal connected using a PCB;
  • FIG. 12 is a schematic diagram of an optical fiber connector shown in an embodiment of the present application.
  • FIG. 13 is a schematic diagram of an electrical connector shown in an embodiment of the present application.
  • Fig. 14 is an internal schematic diagram of an electrical connector shown in an embodiment of the present application.
  • 15 is a schematic diagram of the pin definition of the electrical connector shown in the embodiment of the present application.
  • FIG. 16 is a schematic diagram in which the numbers of the first conductive terminal and the second conductive terminal are both greater than two;
  • Figure 17 is a schematic diagram of the cable routing in the housing
  • Figure 18 is a schematic diagram of the matching structure of the housing and the photoelectric converter
  • FIG. 19 is a B-direction view of the first connecting part shown in the embodiment of the present application.
  • FIG. 20 is a view from the direction C of the second connecting part shown in the embodiment of the present application.
  • FIG. 21 is a schematic diagram of a photoelectric connection device with an LC-type optical fiber interface shown in an embodiment of the present application.
  • FIG. 22 is a schematic diagram of power supply of an electronic device provided by an embodiment of the present application.
  • Fig. 1 is a schematic diagram of an installation scene of an electronic device.
  • electronic devices such as access point (AP) 030, webcam 010, traffic lights, micro base stations, etc. can be installed on indoor ceilings 050, walls 060, and outdoor building walls and telephone poles. Wait for the location.
  • These electronic devices can establish network connections with other remote network devices through optical fiber, twisted pair, etc., for example: the access point device is connected to the remote switch device 040, the network camera is connected to the remote storage device 020, traffic Signals, etc. are connected to remote control equipment, etc.
  • the electronic device may adopt the solution shown in FIG. 2 for power supply, for example.
  • a locally equipped power supply device is coupled to a high-voltage cable to take power.
  • the high-voltage cable carries, for example, 220V (Volt) AC power.
  • the power supply device can convert AC power into, for example, DC 48V, DC 12V, DC 9V, or DC.
  • the DC input voltage commonly used in electronic equipment such as 5V, and the DC input voltage is transmitted to the voltage processing unit of the electronic equipment through the power supply cable.
  • the voltage processing unit is used to further process the DC input voltage into the work required by each electronic component in the electronic equipment Voltage.
  • the electronic device also includes a network module for realizing network connection, such as an optical module (optical module), which can be connected to an optical fiber to complete the mutual conversion between optical signals and electrical signals, so that the electronic device can be connected to other Network equipment for network communication.
  • a network module for realizing network connection such as an optical module (optical module), which can be connected to an optical fiber to complete the mutual conversion between optical signals and electrical signals, so that the electronic device can be connected to other Network equipment for network communication.
  • the electronic device may, for example, adopt the solution shown in FIG. 3 to supply power.
  • the long-distance power supply cable is coupled with the voltage processing unit of the electronic device, and the remote power supply voltage (for example, 220V AC voltage) is introduced to the voltage processing unit; the voltage processing unit is used to convert the AC voltage into the electronic device The operating voltage required by the various electronic components in the.
  • the electronic device also includes a network module for realizing network connection, such as an optical module (optical module), so that the electronic device can perform network communication with other network devices.
  • the scheme shown in Figure 3 requires electronic equipment to have the ability to convert alternating current (AC) into direct current (DC). Therefore, an AC/DC conversion circuit and related structures need to be added to the electronic equipment, which will increase the volume of the electronic equipment and is not conducive to electronics. The miniaturization of equipment cannot be implemented in small devices such as access point equipment and webcams.
  • the electronic equipment When the electronic equipment is not equipped with power supply equipment nearby, for example, the electronic equipment can also be powered by the power over ethernet (PoE) scheme, which is a way to transmit power through the twisted pair in the Ethernet.
  • PoE power over ethernet
  • the network and power transmission medium used by Power over Ethernet can be a photoelectric hybrid cable.
  • Optical hybrid cables are composed of integrated optical fibers and cables. Optical fibers are used to carry optical signals, and cables are used to carry power supply voltage. After the optical hybrid cables are stretched to the vicinity of electronic equipment, they will be split into independent optical fibers and cables. An optical fiber connector is arranged at the end of the optical fiber, and an Ethernet connector is arranged at the end of the cable.
  • electronic devices are inserted with optical modules for docking with optical fiber connectors to complete the mutual conversion between optical signals and electrical signals, so that electronic devices can communicate with other network devices on the network;
  • An independent POE interface is also provided, and the POE interface is used for docking with the Ethernet connector.
  • the POE interface is connected to the voltage processing unit inside the electronic device, and can couple the supply voltage to the voltage processing unit.
  • the voltage processing unit is used to convert the supply voltage into the operating voltage required by each electronic component in the electronic device. It is understandable that, since the solution shown in FIG. 4 requires an independent POE interface to be provided in the electronic device, this will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • the photoelectric connection device may be an optical module, for example: an enhanced small form-factor pluggable (SPF or SPF+) optical module, a small form factor (SFF) optical module 10G small Package (10gigabit small form factor pluggable, XFP) optical module, 10G small form factor pluggable module (CFP) optical module and high-speed Ethernet interface converter (gigabit interface converter, GBIC) module, etc.
  • SPF or SPF+ small form factor
  • SFF small form factor
  • 10G small Package (10gigabit small form factor pluggable, XFP) optical module
  • 10G small form factor pluggable module CPP optical module
  • high-speed Ethernet interface converter gigabit interface converter, GBIC
  • Fig. 5 is an exploded view of the structure of the photoelectric connection device provided by the embodiment of the present application.
  • the photoelectric connection device includes a housing 100.
  • the first connecting portion 110 is provided at one end of the housing 100, and the first connecting portion 110 is used for coupling to an optical signal transmission medium.
  • the second connecting portion 120 provided at the other end of the housing 100 is used for coupling to an electrical signal transmission medium.
  • the housing 100 is also provided with a photoelectric processing module 200.
  • the photoelectric processing module 200 is used to realize photoelectric conversion between optical signals and electrical signals.
  • the photoelectric processing module 200 is located between the first connecting portion 110 and the second connecting portion 120.
  • a connecting portion 110 and a second connecting portion 120 are coupled through the photoelectric processing module 200.
  • the housing 100 may be designed as a rectangular parallelepiped structure or other structures.
  • the housing 100 can be made of metal materials such as copper, aluminum, steel, etc., so that it has the ability to shield electromagnetic radiation.
  • the housing 100 may also be called a cage, for example, SPF cage.
  • the first connection part 110 is used to receive optical signals sent by other network devices, or send optical signals to other network devices.
  • the optical signal transmission medium may include, for example, an optical fiber and an optical fiber connector equipped at the end of the optical fiber.
  • the first connecting portion 110 can be designed into different types of interface structures accordingly to realize the docking with the optical fiber connectors. For example: when the end of the optical fiber is equipped with an SC type optical fiber connector (subscriber connector/standard connector), the first connecting part 110 may have an SC type optical fiber interface; when the end of the optical fiber is equipped with an LC type optical fiber connector (lucent connector/local connector), The first connection part 110 may be provided with an LC-type optical fiber interface.
  • the embodiments of the present application do not specifically limit the types of optical fiber connectors that can be docked with the first connecting portion 110 and the interface forms included in the first connecting portion 110.
  • the optical fiber connector with SC-type optical fiber interface will be mainly used.
  • the connecting device is taken as an example, and the technical solution of the embodiment of the present application is specifically explained.
  • the photoelectric processing module 200 includes a first printed circuit board PCB 220 and a photoelectric converter 210.
  • the first PCB 220 is disposed between the first connection portion 110 and the second connection portion 120.
  • One end of the first PCB 220 is close to the first connection portion 110, and the other end is close to the second connection portion 120.
  • the photoelectric converter 210 is disposed at one end of the first PCB 220 close to the first connecting portion 110, and is coupled to the first PCB 220.
  • the photoelectric converter 210 is provided with an optical connector 211.
  • One end of the optical connector 211 extends away from the first PCB 220 into the first connecting portion 110, and becomes a part of the first connecting portion 110, which is used for connecting to optical fiber connectors or other optical signal transmission media.
  • the optical fiber ferrule is connected to receive optical signals sent by other network equipment through optical fibers, or send optical signals to other network equipment through optical fibers.
  • the optical fiber ferrule may be a ceramic ferrule made of ceramics, for example.
  • One end of the first PCB 220 close to the second connection portion 120 is provided with an electrical signal terminal 221.
  • the telecommunication terminal extends into the second connection portion 120 and becomes a part of the second connection portion 120 for corresponding to the electrical signal transmission medium.
  • the electrical signal interface is docked to send and receive electrical signals.
  • the first connecting portion 110 is provided with an insulating member 300 as shown in FIG. 5.
  • FIG. 6 shows an achievable structure of the insulating member 300.
  • the insulating component 300 includes a first insulating plate 310 and a second insulating plate 320, and the first insulating plate 310 and the second insulating plate 320 are connected at an angle to form an L-shaped structure.
  • the first insulating plate 310 is provided with a positioning hole 311 whose size matches the size of the optical connector 211 of the photoelectric converter 210 so that the optical connector 211 can pass through the positioning hole 311.
  • first insulating plate 310 and the second insulating plate 320 in the embodiment of the present application can be designed as an integral part, or can be designed as two independent parts. Based on the technical ideas and technical enlightenment of the application embodiments, the design methods of the first insulating plate 310 and the second insulating plate 320 can be rationally designed according to actual requirements, and these designs do not exceed the protection scope of the embodiments of the present application.
  • the second insulating plate 320 is provided with a plurality of first conductive terminals 321, and these first conductive terminals 321 are arranged at a certain distance.
  • the two ends of the first conductive terminal 321 are hidden inside the second insulating plate 320, and the middle part of the first conductive terminal 321 protrudes in the direction of the first insulating plate 310, and is exposed on the surface of the second insulating plate 320 and faces the first insulating plate.
  • An arc-shaped protruding structure of an insulating plate 310 is provided with a plurality of first conductive terminals 321, and these first conductive terminals 321 are arranged at a certain distance.
  • the two ends of the first conductive terminal 321 are hidden inside the second insulating plate 320, and the middle part of the first conductive terminal 321 protrudes in the direction of the first insulating plate 310, and is exposed on the surface of the second insulating plate 320 and faces the first insulating plate.
  • the insulating component 300 can also be provided with a corresponding fixing structure of the optical fiber connector, for example, buckles are provided on both sides of the positioning hole 311 of the first insulating plate 310
  • buckles are provided on both sides of the positioning hole 311 of the first insulating plate 310
  • the structure or positioning arm structure, etc., the above-mentioned structure is not specifically shown in FIG. 6.
  • the structure of the optical fiber connector of a person skilled in the art reasonably designs the fixing structure of the optical fiber connector, which will not be repeated in the embodiment of this application.
  • FIG. 7 is a schematic diagram of the mating of the first connecting portion 110 and the optical fiber connector 500.
  • the first insulating plate 310 of the insulating component 300 is arranged perpendicular to the transmission direction of the optical signal, and the first insulating plate 310 has a certain distance from the housing 100 along the transmission direction of the optical signal. D1, thereby forming a space 330 for accommodating the insertion of the optical fiber connector 500 between the housing 100 and the first insulating plate 310.
  • the optical connector 211 of the photoelectric converter 210 passes through the positioning hole 311 of the first insulating plate 310 and becomes a part of the first connecting portion 110.
  • the positioning hole 311 is coaxially arranged with the optical fiber ferrule 510 of the optical fiber connector 500, so that after the optical fiber connector 500 is inserted into the first connecting portion 110, the optical fiber ferrule 510 and the optical connector 211 are accurately butted.
  • the second insulating plate 320 is located on the side of the optical connector 211 and the optical fiber connector 500, and the plurality of first conductive terminals 321 of the second insulating plate 320 are arranged facing the optical connector 211 and the optical fiber connector 500, so that the optical fiber connector 500 is inserted into the first After the connecting portion 110, the arc-shaped protruding structures of the plurality of first conductive terminals 321 are in crimp contact with the optical fiber connector 500.
  • the electrical signal transmission medium may include a multi-source agreement (MSA) gold finger connector or other electrical connectors, such as an electrical connection socket (socket).
  • MSA multi-source agreement
  • the first PCB 220 may be provided with different types of electrical signal terminals 221 to realize the docking with the electrical connector.
  • the electrical connector is an MSA golden finger connector with 20 pins (20pin)
  • the first PCB 220 can be provided with a 20pin MSA golden finger terminal.
  • the embodiment of the present application does not specifically limit the type of the electrical connector with which the second connecting portion 120 can be connected and the form of the electrical signal terminal 221 included in the first PCB 220.
  • the second connecting portion 120 is provided with a third insulating plate 400 as shown in FIG. 5.
  • FIG. 8 shows an achievable structure of the third insulating plate 400.
  • the third insulating plate 400 is provided with a plurality of second conductive terminals 410, and these second conductive terminals 410 are arranged at a certain distance and interval. Both ends of the second conductive terminal 410 are hidden inside the third insulating plate 400, and the middle part of the second conductive terminal 410 protrudes from the inside of the third insulating plate 400 to form an arc exposed on the surface of the third insulating plate 400 Protruding structure.
  • FIG. 9 is a schematic diagram of the mating of the second connecting portion 120 and the electrical connector 600.
  • the third insulating plate 400 is arranged in parallel with the transmission direction of the optical signal, and the third insulating plate 400 is close to one side surface of the housing 100, so that the third insulating plate 400 and the housing 100
  • the other side surfaces of the slab form a space 420 for accommodating the insertion of the electrical connector 600.
  • the plurality of second conductive terminals 410 of the third insulating plate 400 are arranged facing the electrical signal terminals 221 of the first PCB 220, so that after the electrical connector 600 is inserted into the second connecting portion 120 and is mated with the electrical signal terminals 221, the plurality of second The arc-shaped protruding structure of the conductive terminal 410 is in crimp contact with the electrical connector 600.
  • the number of the plurality of first conductive terminals 321 and the plurality of second conductive terminals 410 are equivalent, and the plurality of first conductive terminals 321 and the plurality of second conductive terminals 410 are electrically connected.
  • the plurality of first conductive terminals 321 and the plurality of second conductive terminals 410 may be electrically connected by a corresponding number of cables; or, the plurality of first conductive terminals 321 and the plurality of second conductive terminals 410 may be connected by a printed circuit
  • the board PCB is electrically connected.
  • the number of the first conductive terminal 321 and the second conductive terminal 410 are both two.
  • the two first conductive terminals 321 are referred to as PIN 1+ terminal and PIN 1-terminal respectively.
  • the two second conductive terminals 410 are referred to as PIN 2+ terminals and PIN 2-terminals, respectively.
  • the PIN 1+ terminal and the PIN 2+ terminal are connected through the cable L1 to form an electrical connection path; the PIN 1-terminal and the PIN 2-terminal are connected through the cable L2 to form another electrical connection path.
  • a second PCB 340 may also be provided between the first conductive terminal 321 and the second conductive terminal 410, and the second PCB 340 is provided with a first pad Pad 1 and a pad at one end close to the first conductive terminal 321.
  • the second pad Pad 2, and the second PCB 340 is provided with a third pad Pad 3 and a fourth pad Pad 4 at one end close to the second conductive terminal 410.
  • the first pad Pad 1 and the third pad Pad 3 are electrically connected by the first metal wiring RDL1 printed on the second PCB 340, and the second pad Pad 2 and the fourth pad Pad 4 pass on the second PCB.
  • the second metal wiring RDL2 formed by printing 340 is electrically connected.
  • the PIN 1+ terminal in the first conductive terminal 321 is soldered to the first pad Pad 1, the PIN 1-terminal is soldered to the second pad Pad 2; the PIN 2+ in the second conductive terminal 410 The terminal is soldered to the third pad Pad 3, and the PIN 2-terminal is soldered to the fourth pad Pad 4.
  • the PIN 1+ terminal and the PIN 2+ terminal are connected through the first pad Pad 1, the first metal wiring RDL 1 and the third pad Pad 3 to form an electrical connection path; PIN 1-terminal and PIN 2-terminal
  • the second pad Pad 2, the second metal wiring RDL 2 and the fourth pad Pad 4 are connected to form another electrical connection path.
  • FIG. 12 is a schematic diagram of an optical fiber connector 500 shown in an embodiment of the present application.
  • the optical fiber connector 500 may include a plurality of power supply terminals in addition to an optical fiber ferrule 510 for transmitting optical signals.
  • the optical fiber connector 500 may correspondingly include two power supply terminals V+ and V-. Among them, a power supply voltage is coupled between the V+ terminal and the V- terminal, the V+ terminal is a positive terminal, and the V- terminal is a negative terminal.
  • the V+ terminal and the V- terminal can be arranged on the side surface of the optical fiber connector 500 for mating with the second insulating plate 320.
  • the V+ terminal contacts the PIN 1+
  • V -The terminal is in contact with the PIN 1-, thereby coupling the supply voltage to the PIN 1+ terminal and the PIN 1- terminal.
  • the power supply voltage between the V+ terminal and the V- terminal is transmitted through the photoelectric hybrid cable.
  • the photoelectric hybrid cable is composed of optical fiber and at least two cables.
  • the optical fiber is connected to the optical fiber ferrule 510 of the optical fiber connector 500 for transmitting optical signals.
  • the cable is connected to the power supply terminal of the optical fiber connector 500 and is used to provide a power supply voltage.
  • the photoelectric hybrid cable correspondingly includes two cables. One cable is used as the positive cable and is connected to the power supply terminal V+, and the other cable is used as the negative cable and is connected to the power supply terminal. Terminal V- connection.
  • FIG. 13 is a schematic diagram of an electrical connector 600 shown in an embodiment of the present application.
  • the electrical connector 600 may include a plurality of power receiving terminals in addition to the golden finger socket 610 for transmitting electrical signals.
  • the electrical connector 600 may additionally include two power receiving terminals POW+ and POW-.
  • the POW+ terminal and the POW- terminal can be arranged on the side surface of the electrical connector 600 for mating with the third insulating plate 400.
  • FIG. 14 is an internal schematic diagram of an electrical connector 600 shown in an embodiment of the present application.
  • a plurality of pins 611 in the golden finger socket 610 pass through the inside of the electrical connector 600, extend to the bottom surface 612 of the electrical connector 600, and are exposed on the bottom surface 612 of the electrical connector 600.
  • the pins 611 exposed on the bottom surface 612 of the electrical connector 600 can be soldered to corresponding pads on the motherboard of an electronic device (for example: access point (AP), webcam or other electronic devices).
  • AP access point
  • the connection device and the electronic equipment establish an electrical signal transmission channel through the electrical connector 600.
  • the power receiving terminals POW+ and POW- may also pass through the inside of the electrical connector 600, extend to the bottom surface 612 of the electrical connector, and be exposed on the bottom surface 612 of the electrical connector 600.
  • the main board of the electronic device may be provided with a power supply circuit
  • the power supply circuit may be provided with pads for docking with the power receiving terminals POW+ and POW-
  • the power receiving terminals POW+ and POW- pass Solder with the pad of the power supply circuit to couple the power supply voltage to the electronic device.
  • the pins of the electrical connector 600 in the embodiment of the present application include two parts, one is the pin 611 in the golden finger socket 610, and the other is the additional power receiving terminals POW+ and POW-.
  • the gold finger socket 610 is a 20pin gold finger socket 610 of MSA
  • the electrical connector 600 includes a total of 22 pins as shown in Figure 15 (20 pins 611 of the gold finger socket 610, and POW+ and POW- ), the function definition of these pins can be shown in Table 1:
  • the number of first conductive terminals 321 and the number of second conductive terminals 410 may both be greater than two. As shown in Figure 16, the number of first conductive terminals 321 is four, including PIN 11+ terminals, PIN 11- terminals, PIN 12+ terminals, and PIN 12- terminals; the number of second conductive terminals 410 corresponds to four, Including: PIN 21+terminal, PIN 21-terminal, PIN 22+terminal and PIN 22-terminal.
  • the PIN 11+ terminal is electrically connected to the PIN 21+ terminal
  • the PIN 11- terminal is electrically connected to the PIN 21- terminal
  • the PIN 12+ terminal is electrically connected to the PIN 22+ terminal
  • the PIN 12- terminal is electrically connected to the PIN 22- terminal.
  • the PIN 11+ terminal and PIN 12+ terminal can be connected to the power supply terminal V+ of the optical fiber connector 500, and the PIN 11- terminal and PIN 12- terminal can be connected to the power supply terminal V- of the optical fiber connector 500, so that the second Two power supply outputs are formed on one side of the conductive terminal 410, that is, the PIN 21+ terminal and the PIN 21- terminal can be used as one power supply output, and the PIN 22+ terminal and the PIN 22- terminal can be used as another power supply output.
  • the other numbers that can be realized by the first conductive terminal 321 and the second conductive terminal 410 it will not be repeated in the embodiment of the present application.
  • FIG. 17 is a schematic diagram of the cable routing in the housing 100.
  • a metal isolation plate 700 is also provided in the housing 100.
  • the metal isolating plate 700 is arranged parallel to the transmission direction of the optical signal.
  • the metal isolating plate 700 can divide the space 330 inside the housing 100 into two sub-spaces parallel to the transmission direction of the optical signal.
  • the first PCB 220 is located in the first In the sub-space, the cable is located in the second sub-space, so that the electromagnetic radiation of the first PCB 220 will not leak to the outside of the housing, avoiding the problem of radiated emission (RE).
  • RE radiated emission
  • the metal isolation plate 700 is further provided with a lead plate 710 along the extension direction of the cable.
  • the lead plate 710 is arranged on the side of the metal isolation plate 700 facing the second subspace and extends in a direction away from the metal isolation plate 700.
  • the lead plate 710 is close to the side of the housing 100, so that the cables L1 and L2 can be routed close to the side of the housing 100 under the guidance of the lead plate 710, thereby increasing the distance between the cable and the first PCB 220, so that the first PCB 220 Will not be subject to electromagnetic interference from cables L1 and L2, ensuring the stability of signal transmission.
  • FIG. 18 is a schematic diagram of the matching structure of the housing 100 and the photoelectric converter 210.
  • the housing 100 further includes an optical connector 211 support set perpendicular to the transmission direction of the optical signal, and the optical connector 211 support is located on the side of the first insulating plate 310 facing the photoelectric converter 210.
  • the optical connector 211 is located on the optical connector 211 support, which restricts the movement of the photoelectric converter 210 in the direction perpendicular to the transmission direction of the optical signal, and realizes the radial fixation of the photoelectric converter 210.
  • the optical connector 211 support is also used to limit the photoelectric converter 210.
  • the optical connector 211 is also sleeved with a conductive ring 140.
  • the conductive ring 140 can be made of metal.
  • the conductive ring 140 and the optical connector 211 support form an electromagnetic shielding layer, which can electrically isolate the first connecting portion 110 from the photoelectric converter 210 except for the optical connector 211.
  • the first conductive terminal 321 of the first connecting portion 110 generates electromagnetic interference to the photoelectric converter 210 to ensure the stability of signal conversion.
  • FIG. 19 is a B-direction view of the first connecting portion 110 shown in an embodiment of the present application.
  • the distance D2 between any two adjacent first conductive terminals 321 among the plurality of first conductive terminals 321 is greater than or equal to the first threshold, and any one of the first conductive terminals 321 is connected to the housing 100
  • the distance D3 is greater than or equal to the first threshold, so that the optoelectronic connection device can meet the high-voltage surge protection requirements without grounding.
  • the optoelectronic connection device can Meet the common mode 4KV (kV) surge protection requirements.
  • the distance between the housing 100 and the first conductive terminal 321 may be Insulation stickers are set between them to achieve the same purpose of meeting the requirements of surge protection.
  • FIG. 20 is a C view of the second connecting portion 120 shown in an embodiment of the present application.
  • the distance D4 between any two adjacent second conductive terminals 410 among the plurality of second conductive terminals 410 is greater than or equal to the second threshold, and any one of the second conductive terminals 410 is connected to the housing 100.
  • the distance D5 is greater than or equal to the second threshold, so that the optoelectronic connection device can meet the requirements of high-voltage surge protection when it is not grounded. For example, when the second threshold is 3.5mm, the optoelectronic connection device can Meet the common mode 4KV (kV) surge protection requirements.
  • kV common mode 4KV
  • the space 330 of the housing 100 is limited and the distance D5 between the second conductive terminal 410 and the housing 100 cannot be greater than or equal to the second threshold, it can be set between the housing 100 and the second conductive terminal 410. Insulation stickers are set between them to achieve the same purpose of meeting the requirements of surge protection.
  • FIG. 21 is a schematic diagram of a photoelectric connection device with an LC-type optical fiber interface shown in an embodiment of the present application.
  • the first connecting portion 110 of the photoelectric connection device includes an insulating member 300, and the insulating member 300 is provided with at least two first conductive terminals 321.
  • the arrangement of the insulating component 300 and the first conductive terminal 321 can be implemented with reference to the photoelectric connection device of the SC-type optical fiber interface, which will not be repeated here.
  • the photoelectric connection device provided by the embodiment of the present application can not only receive light/electric signals, but also can couple the power supplied by the remote power to the electronic equipment to supply power to the electronic equipment, so that the electronic equipment does not need to be additionally equipped with POE.
  • the interface is conducive to reducing the volume of electronic equipment.
  • the photoelectric connection device provided by the embodiment of the present application does not change the interface form of the existing optical module (for example: SPF+ optical module, SPF optical module, XFP optical module, CFP optical module, etc.).
  • the compatibility is the same, and it can be adapted to the existing SC-type optical fiber connectors, LC-type optical fiber connectors, electrical connection sockets and other docking structures, without the need to modify the above-mentioned docking structure, and the application flexibility is high.
  • the low cost is conducive to large-scale deployment.
  • FIG. 22 is a schematic diagram of power supply of an electronic device provided by an embodiment of the present application.
  • the electronic device includes a voltage processing unit and the photoelectric connection device provided in the embodiment of the present application.
  • the photoelectric connection device is used to connect with the photoelectric hybrid cable.
  • the optical fiber in the photoelectric hybrid cable receives and emits light signals; on the other hand, the power supply voltage in the photoelectric hybrid cable is coupled to the voltage processing unit.
  • the voltage processing unit is used to convert the supply voltage into the operating voltage required by each electronic component in the electronic device.
  • the electronic device does not need to be provided with an independent POE port, and the optical signal transmission and the introduction of the power supply voltage can be realized at the same time only through the photoelectric connection device, which simplifies the structural design of the electronic device and is beneficial to reduce the volume of the electronic device.

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Abstract

一种光电连接装置，例如光模块，包括：设置于壳体（100）一端，用于耦合至光信号传输介质的第一连接部（110）；设置于壳体（100）另一端，用于耦合至电信号传输介质的第二连接部（120）；其中，第一连接部（110）包括多个第一导电端子（321），第二连接部（120）包括多个第二导电端子（410），多个第一导电端子（321）与多个第二导电端子（410）电连接；多个第一导电端子（321）用于通过光信号传输介质附加的多个供电端子（V+、V-）耦合至供电电压，多个第二导电端子（410）用于通过电信号传输介质附加的多个受电端子（POW+、POW-）将供电电压耦合至电子设备。上述光电连接装置，不仅能够收发光/电信号，还能够将远端供电的电能耦合至电子设备，为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。

Description

一种光电连接装置
本申请要求于2020年1月8日提交中国国家知识产权局、申请号为202010018765.3、发明名称为“一种光电连接装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种光电连接装置。
背景技术
接入点设备(access point，AP)、网络摄像头等电子设备通常安装在企业园区、室内天花板、建筑墙面等区域，这些区域附近通常没有供电设备为电子设备提供运行所需的电能，因此，这些电子设备的供电一般是通过以太网供电(power over ethernet，PoE)方式实现的。
以太网供电是一种可以在以太网中透过双绞线来传输电力到电子设备上的技术。以太网供电一般使用光电混合缆同时传输光信号和电能，其中，光信号用于使远端的电子设备实现网络通信，电能用于为远端的电子设备供电，光电混合缆由光纤和电缆组成，光信号和电能的传输分别由光纤和电缆实现。
光电混合缆被拉远至电子设备附近之后，会被拆分成独立走线的光纤和电缆，光纤末端设置有光纤连接器，电缆末端设置有以太网连接器。与之相适应地，电子设备除了设置常规的光模块以对接光纤连接器以外，还需要设置额外的POE接口以对接以太网连接器，只有这样，才能够从光电混合缆接收电能。然而，在电子设备设置额外的POE接口会增加电子设备的结构复杂程度，增大电子设备的体积。
发明内容
本申请提供了一种光电连接装置，不仅能够收发光/电信号，还能够将远端供电的电能耦合至电子设备，为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。
为达到上述目的，本申请提供的光电连接装置包括：壳体；以及，设置于壳体一端的第一连接部，第一连接部用于耦合至光信号传输介质；设置于壳体另一端的第二连接部，第二连接部用于耦合至电信号传输介质；第一连接部和第二连接部通过设置于壳体内的光电处理模块耦合；设置于第一连接部的多个第一导电端子，以及，设置于第二连接部的多个第二导电端子，多个第一导电端子与多个第二导电端子电连接；多个第一导电端子用于通过光信号传输介质附加的多个供电端子耦合至供电电压，多个第二导电端子用于通过电信号传输介质附加的多个受电端子将供电电压耦合至电子设备。
本申请提供的光电连接装置，能够在不改变目前已有光模块(例如：SPF+光模块、SPF光模块、XFP光模块和CFP光模块等)的接口形态前提下，使光电连接装置能够与 光电混合缆配合，具备对电子设备供电的能力。同时，本申请提供的光电连接装置与目前已有的光模块具有相同的兼容性，能够适配目前已有的SC型光纤连接器、LC型光纤连接器、电连接插座(socket)以及其他的对接结构，而不需要对上述对接结构进行改造，部署灵活性高，成本低，有利于实现大规模部署。
可选的，光电处理模块包括：设置于第一连接部和第二连接部之间的第一印刷电路板PCB；与第一PCB耦合的光电转换器，光电转换器设置有光接头，光接头沿光信号的传输方向延伸至第一连接部内。由此，光接头成为第一连接部的一部分，用于与光纤连接器或者其他光信号传输介质的光纤插芯对接，以接收其他网络设备发送的光信号，或者向其他的网络设备发送光信号。
可选的，第一连接部包括绝缘部件，绝缘部件包括相连接的第一绝缘板和第二绝缘板；第一绝缘板垂直于光信号传输的方向设置，第一绝缘板设置有定位孔，光接头穿过定位孔与光信号传输介质包含的光纤插芯对接；第二绝缘板设置于光接头的侧面，多个第一导电端子面向光接头设置于第二绝缘板。由此，如果光信号传输介质设置有与第一导电端子对应的供电端子，当光信号传输介质插入第一连接部时，第一导电端子能够与供电端子对接，以耦合供电电压。
可选的，第一PCB设置有电信号端子，电信号端子沿光信号的传输方向延伸至第二连接部内，与电信号传输介质的包含管脚的插槽对接；第二连接部包括第三绝缘板，第三绝缘板平行于光信号传输的方向设置于电信号端子的侧面，多个第二导电端子面向电信号端子设置于第三绝缘板。由此，电信号端子成为第二连接部的一部分，用于与电信号传输介质的相应电信号接口对接，以收发电信号；并且，如果电信号传输介质设置有与第二导电端子对应的受电端子，当电信号传输介质插入第二连接部时，第二导电端子能够与受电端子对接，将供电电压通过电信号传输介质耦合至电子设备。
可选的，该光电连接装置还包括：设置于壳体内的至少两根电缆，多个第一导电端子和多个第二导电端子通过至少两根电缆电连接。
可选的，该光电连接装置还包括：金属隔离板；金属隔离板沿平行于光信号的传输方向设置，金属隔离板将壳体内部的空间分隔成第一子空间和第二子空间，至少两根电缆位于第一子空间内，第一PCB位于第二子空间内。由此，电缆和第一PCB通过金属隔离板实现电气隔离，使得第一PCB的电磁辐射不会泄露到壳体外部，避免出现辐射发射(radiated emission，RE)问题。
可选的，壳体还包括垂直于光信号的传输方向设置的光接头支座，光接头支座位于第一绝缘板的面向光电转换器的一侧，光接头支座用于固定光接头。
可选的，光接头套接有导电环，导电环用于填充光接头和光接头支座之间的缝隙。由此，导电环与光接头支座形成了一个电磁屏蔽层，能够将第一连接部与光电转换器的除了光接头以外的其他部件进行电气隔离，避免第一连接部的第一导电端子对光电转换器产生电磁干扰，保证信号转换的稳定性。
可选的，多个第一导电端子中的任意相邻的两个第一导电端子之间的距离大于或者等于第一阈值，使得光电连接装置在不接地的情况下，能够满足高压浪涌防护要求。
可选的，多个第二导电端子中的任意相邻的两个第二导电端子之间的距离大于或者等于第二阈值，使得光电连接装置在不接地的情况下，能够满足高压浪涌防护要求。
可选的，光信号传输介质包括SC型光纤连接器或LC型光纤连接器。
可选的，电信号传输介质包括多源协议MSA金手指连接器。
附图说明
图1是一种电子设备的安装场景示意图；
图2是电子设备的一种本地供电的方案示意图；
图3是电子设备的一种远程供电的方案示意图；
图4是电子设备的一种远程供电的方案示意图；
图5是本申请实施例提供的光电连接装置的结构分解图；
图6示出了该绝缘部件的一种可实现的结构示意图；
图7是第一连接部与光纤连接器的配合示意图；
图8示出了该第三绝缘板的一种可实现的结构示意图；
图9是第二连接部与电连接器的配合示意图；
图10是第一导电端子和第二导电端子使用电缆连接的示意图；
图11是第一导电端子和第二导电端子使用PCB连接的示意图；
图12是本申请实施例示出的光纤连接器的示意图；
图13是本申请实施例示出的电连接器的示意图；
图14是本申请实施例示出的电连接器的内部示意图；
图15是本申请实施例示出的电连接器的管脚定义示意图；
图16是第一导电端子和第二导电端子的数量均大于两个的示意图；
图17是电缆在壳体内的走线示意图；
图18是壳体与光电转换器的配合结构示意图；
图19是本申请实施例示出的第一连接部的B向视图；
图20是本申请实施例示出的第二连接部的C向视图；
图21是本申请实施例示出的具备LC型光纤接口的光电连接装置的示意图；
图22是本申请实施例提供的电子设备的供电示意图。
具体实施方式
下面首先结合附图对本申请实施例的应用场景进行说明。
图1是一种电子设备的安装场景示意图。如图1所示，接入点设备(access point，AP)030、网络摄像头010、交通信号灯、微基站等电子设备可以安装在室内的天花板050、墙壁060，以及室外的建筑墙面、电线杆等位置。这些电子设备可以通过光纤、双绞线等方式与远端的其他网络设备建立网络连接，例如：接入点设备连接至远端的交换机设备040，网络摄像头连接到远端的存储设备020、交通信号等连接到远端的控制设备等。
除网络连接以外，电子设备还需要供电设备进行供电才能正常工作。
当电子设备的附近配备有供电设备时，电子设备例如可以采用如图2示出的方案进行供电。如图2所示，本地配备的供电设备耦合至高压电缆进行取电，高压电缆例如携带电压为220V(伏特)的交流电，供电设备可以将交流电转换成例如直流48V、直流12V、直流9V或直流5V等电子设备常用的直流输入电压，并将直流输入电压通 过供电电缆输送到电子设备的电压处理单元，电压处理单元用于将直流输入电压进一步处理为电子设备中的各个电子元件所需的工作电压。另外，电子设备还包括有用于实现网络连接的网络模块，例如光模块(optical module)，光模块可以与光纤对接，用于完成光信号和电信号之间的相互转换，使电子设备可以与其他网络设备进行网络通信。
然而，在图1所示的场景中，电子设备安装的墙壁、天花板、建筑墙面、电线杆等位置附近通常没有供电设备，因此电子设备无法采用如图2所示的方式进行供电。
当电子设备的附近没有配备供电设备时，电子设备例如可以采用图3所示的方案进行供电。如图3所示，长距离的供电电缆与电子设备的电压处理单元耦合，将远端的供电电压(例如220V交流电压)引入到电压处理单元；电压处理单元用于将交流电压转换成电子设备中的各个电子元件所需的工作电压。另外，电子设备还包括有用于实现网络连接的网络模块，例如光模块(optical module)，使电子设备可以与其他网络设备进行网络通信。图3所示方案要求电子设备具备将交流电(AC)转换成直流电(DC)的能力，因此需要在电子设备内增加AC/DC转换电路和相关结构，会增大电子设备的体积，不利于电子设备的小型化，在接入点设备、网络摄像头等体积较小的设备中无法实施。
当电子设备的附近没有配备供电设备时，电子设备例如还可以采用以太网供电(power over ethernet，PoE)方案进行供电，以太网供电是一种可以在以太网中透过双绞线来传输电力到电子设备上的技术。如图4所示，以太网供电使用的网络和电力传输介质可以是光电混合缆。光电混合缆由集成的光纤和电缆组成，光纤用于承载光信号，电缆用于承载供电电压，光电混合缆被拉远至电子设备附近之后，会被拆分成独立走线的光纤和电缆，光纤末端设置有光纤连接器，电缆末端设置有以太网连接器。与光纤和电缆相对应地，电子设备插装有光模块，用于与光纤连接器对接，完成光信号和电信号之间的相互转换，使电子设备可以与其他网络设备进行网络通信；电子设备还设置有独立的POE接口，该POE接口用于与以太网连接器对接。POE接口在电子设备内部连接至电压处理单元，能够将供电电压耦合至电压处理单元，电压处理单元用于将供电电压转换成电子设备中的各个电子元件所需的工作电压。可以理解的是，由于图4所示的方案需要在电子设备设置独立的POE接口，会增加电子设备的结构复杂程度，增大电子设备的体积。
为了解决上述问题，本申请实施例提供了一种光电连接装置。其中，该光电连接装置可以是光模块(optical module)，例如：小型可插拔封装(enhanced small form-factor pluggable，SPF或SPF+)光模块、小型封装(small form factor，SFF)光模块10G小型封装(10gigabit small form factor pluggable，XFP)光模块、10G小型封装(centum form factor pluggable module，CFP)光模块和高速以太网接口转换器(gigabit interface converter，GBIC)模块等。
图5是本申请实施例提供的光电连接装置的结构分解图。如图5所示，该光电连接装置包括壳体100。设置于壳体100一端的第一连接部110，第一连接部110用于耦合至光信号传输介质。设置于壳体100另一端的第二连接部120，第二连接部120用于耦合至电信号传输介质。壳体100内还设置有光电处理模块200，光电处理模块200 用于实现光信号和电信号之间的光电转换，光电处理模块200位于第一连接部110和第二连接部120之间，第一连接部110和第二连接部120通过光电处理模块200耦合。
在一个实现方式中，壳体100可以被设计为长方体结构或其他结构。壳体100可以使用铜、铝、钢等金属材质制成，使其具备屏蔽电磁辐射的能力。在一些命名方式中，壳体100还可以被称作笼子(cage)，例如：SPF cage等。
本申请实施例中，第一连接部110用于接收其他网络设备发送的光信号，或者向其他网络设备发送光信号。光信号传输介质例如可以包括光纤，以及光纤末端配备的光纤连接器。根据光纤连接器的种类不同，第一连接部110可以相应地被设计成不同种类的接口结构，以实现与光纤连接器的对接。例如：当光纤末端配备SC型光纤连接器(subscriber connector/standard connector)时，第一连接部110可以具备SC型光纤接口；当光纤末端配备LC型光纤连接器(lucent connector/local connector)时，第一连接部110可以具备LC型光纤接口。本申请实施例对第一连接部110可对接的光纤连接器的种类以及第一连接部110包括的接口形态不做具体限定，在接下来的内容中，将主要以具备SC型光纤接口的光电连接装置作为示例，对本申请实施例的技术方案做具体的解释说明。
进一步如图5所示，光电处理模块200包括第一印刷电路板PCB 220和光电转换器210。其中，第一PCB 220设置于第一连接部110和第二连接部120之间。第一PCB 220的一端靠近第一连接部110，另一端靠近第二连接部120。光电转换器210设置于第一PCB 220的靠近第一连接部110的一端，与第一PCB 220耦合。光电转换器210设置有光接头211，光接头211一端远离第一PCB 220延伸到第一连接部110内，成为第一连接部110的一部分，用于与光纤连接器或者其他光信号传输介质的光纤插芯对接，以接收其他网络设备通过光纤发送的光信号，或者通过光纤向其他的网络设备发送光信号。其中，光纤插芯例如可以是陶瓷制成的陶瓷插芯。第一PCB 220的靠近第二连接部120的一端设置有电信号端子221，该电信端子延伸到第二连接部120内，成为第二连接部120的一部分，用于与电信号传输介质的相应电信号接口对接，以收发电信号。
为了实现光接头211与光纤插芯的准确对接，第一连接部110如图5所示设置有绝缘部件300。图6示出了该绝缘部件300的一种可实现的结构。如图6所示，绝缘部件300包括第一绝缘板310和第二绝缘板320，第一绝缘板310和第二绝缘板320呈一定角度连接，形成L型结构。第一绝缘板310设置有定位孔311，该定位孔311的尺寸与光电转换器210的光接头211的尺寸相匹配，使得光接头211可以从定位孔311中穿过。需要补充说明的是，本申请实施例中的第一绝缘板310和第二绝缘板320可以被设计成一个整体的部件，也可以被设计成两个相互独立的部件，本领域技术人员在本申请实施例的技术构思和技术启示之下，可以根据实际需求合理设计第一绝缘板310和第二绝缘板320的设计方式，这些设计都没有超出本申请实施例的保护范围。
特别地，如图6所示，第二绝缘板320设置有多个第一导电端子321，这些第一导电端子321呈现一定的距离间隔设置。第一导电端子321的两端部分隐藏于第二绝缘板320内部，第一导电端子321的中间部分向第一绝缘板310所在的方向凸出，形成裸露于第二绝缘板320表面并且面向第一绝缘板310的弧形凸出结构。
另外，为了固定光纤连接器，使光纤插芯与光接头211准确对接，绝缘部件300还可以设置相应的光纤连接器的固定结构，例如在第一绝缘板310的定位孔311两侧设置卡扣结构或者定位臂结构等，上述结构在图6中未具体示出，本领域技术人员光纤连接器的结构形态合理设计光纤连接器的固定结构，本申请实施例中不再赘述。
图7是第一连接部110与光纤连接器500的配合示意图。如图7所示，在壳体100内，绝缘部件300的第一绝缘板310垂直于光信号的传输方向设置，并且第一绝缘板310沿光信号的传输方向与壳体100具有一定的距离D1，从而在壳体100和第一绝缘板310之间形成用于容纳光纤连接器500插入的空间330。光电转换器210的光接头211穿过第一绝缘板310的定位孔311，成为第一连接部110的一部分。定位孔311与光纤连接器500的光纤插芯510同轴设置，使得光纤连接器500插入第一连接部110之后，光纤插芯510与光接头211准确对接。第二绝缘板320位于光接头211和光纤连接器500的侧面，并且第二绝缘板320的多个第一导电端子321面向光接头211和光纤连接器500设置，使得光纤连接器500插入第一连接部110之后，上述多个第一导电端子321的弧形凸出结构与光纤连接器500压接接触。
本申请实施例中，电信号传输介质可以包括多源协议(multi-source agreement，MSA)金手指连接器或者其他电连接器，例如电连接插座(socket)。根据电连接器的种类不同，第一PCB 220可以设置有不同种类的电信号端子221，以实现与电连接器对接。例如：当电连接器是具有20个管脚(20pin)的MSA金手指连接器时，第一PCB 220可以设置20pin MSA金手指端子。本申请实施例对第二连接部120可对接的电连接器的种类以及第一PCB 220包括的电信号端子221的形态不做具体限定。
为了实现电信号端子221与电连接器的准确对接，第二连接部120如图5所示设置有第三绝缘板400。图8示出了该第三绝缘板400的一种可实现的结构。如图8所示，第三绝缘板400设置有多个第二导电端子410，这些第二导电端子410呈现一定的距离间隔设置。第二导电端子410的两端部分隐藏于第三绝缘板400内部，第二导电端子410的中间部分从第三绝缘板400内部向外凸出，形成裸露于第三绝缘板400表面的弧形凸出结构。
图9是第二连接部120与电连接器600的配合示意图。如图9所示，在壳体100内，第三绝缘板400与光信号的传输方向平行设置，并且第三绝缘板400靠近壳体100的一个侧面，使得第三绝缘板400与壳体100的其他侧面形成用于容纳电连接器600插入的空间420。第三绝缘板400的多个第二导电端子410面向第一PCB 220的电信号端子221设置，使得电连接器600插入第二连接部120并且与电信号端子221对接之后，上述多个第二导电端子410的弧形凸出结构与电连接器600压接接触。
本申请实施例中，多个第一导电端子321和多个第二导电端子410的数量相当，并且多个第一导电端子321和多个第二导电端子410电连接。可选的，多个第一导电端子321和多个第二导电端子410可以通过相应数量的电缆形成电连接；或者，多个第一导电端子321和多个第二导电端子410可以通过印刷电路板PCB电连接。
如图10所示，第一导电端子321和第二导电端子410的数量均为两个，为了便于描述，这里将两个第一导电端子321分别称作PIN 1+端子和PIN 1-端子，将两个第二导电端子410分别称作PIN 2+端子和PIN 2-端子。其中，PIN 1+端子和PIN 2+端子 通过电缆L1连接，形成一条电连接通路；PIN 1-端子和PIN 2-端子通过电缆L2连接，形成另一条电连接通路。
如图11所示，第一导电端子321和第二导电端子410之间还可以设置有第二PCB 340，第二PCB 340在靠近第一导电端子321的一端设置有第一焊盘Pad 1和第二焊盘Pad 2，第二PCB 340在靠近第二导电端子410的一端设置有第三焊盘Pad 3和第四焊盘Pad 4。其中，第一焊盘Pad 1和第三焊盘Pad 3通过在第二PCB 340印刷形成的第一金属布线RDL1电连接，第二焊盘Pad 2和第四焊盘Pad 4通过在第二PCB 340印刷形成的第二金属布线RDL2电连接。进一步如图11所示，第一导电端子321中的PIN 1+端子焊接于第一焊盘Pad 1，PIN 1-端子焊接于第二焊盘Pad 2；第二导电端子410中的PIN 2+端子焊接于第三焊盘Pad 3，PIN 2-端子焊接于第四焊盘Pad 4。由此，PIN 1+端子和PIN 2+端子通过第一焊盘Pad 1、第一金属布线RDL 1和第三焊盘Pad 3连接，形成一条电连接通路；PIN 1-端子和PIN 2-端子通过第二焊盘Pad 2、第二金属布线RDL 2和第四焊盘Pad 4连接，形成另一条电连接通路。
图12是本申请实施例示出的光纤连接器500的示意图。如图12所示，光纤连接器500除了包含用于传输光信号的光纤插芯510以外，还可以包含多个供电端子。示例地，当第一导电端子321包括PIN 1+和PIN 1-时，光纤连接器500可以对应包含两个供电端子V+和V-。其中，V+端子和V-端子之间耦合有供电电压，V+端子为正极端子，V-端子为负极端子。V+端子和V-端子可以设置于光纤连接器500的用于与第二绝缘板320配合的侧表面，当光纤连接器500插入第一连接部110时，V+端子与PIN 1+相接触，V-端子与PIN 1-相接触，从而将供电电压耦合至PIN 1+端子和PIN 1-端子。
本申请实施例中，V+端子和V-端子之间的供电电压是通过光电混合缆传输的。光电混合缆有光纤和至少两根电缆组成。其中，光纤与光纤连接器500的光纤插芯510连接，用于传输光信号。电缆与光纤连接器500的供电端子连接，用于提供供电电压。示例地，当光纤连接器500包括两个供电端子V+和V-，光电混合缆对应包含两根电缆，一根电缆作为正极电缆，与供电端子V+连接，另一根电缆作为负极电缆，与供电端子V-连接。
图13是本申请实施例示出的电连接器600的示意图。如图13所示，电连接器600除了包含用于传输电信号的金手指插槽610以外，还可以包括多个受电端子。示例地，当第二连接部120包括两个第二导电端子PIN 2+和PIN 2-时，电连接器600可以额外包含两个受电端子POW+和POW-。POW+端子和POW-端子可以设置于电连接器600的用于与第三绝缘板400配合的侧表面，当电连接器600的金手指插槽610与第一PCB 220的金手指端子对接时，POW+端子与PIN 2+相接触，POW-端子与PIN 2-相接触，从而将供电电压耦合至POW+端子和POW-端子。
图14是本申请实施例示出的电连接器600的内部示意图。如图14所示，金手指插槽610内的多个管脚611穿过电连接器600内部，延伸到电连接器600的底面612，并且裸露于电连接器600的底面612。裸露于电连接器600的底面612的管脚611可以与电子设备(例如：接入点设备(access point，AP)、网络摄像头或者其他电子设备)主板上的相应焊盘焊接，由此，光电连接装置和电子设备通过电连接器600建立电信号的传输通道。特别地，受电端子POW+和POW-也可以穿过电连接器600的内部， 延伸到电连接器的底面612，并且裸露于电连接器600的底面612。与受电端子POW+和POW-相对应地，电子设备的主板可以设置有供电电路，该供电电路可以设置有用于与受电端子POW+和POW-对接的焊盘，受电端子POW+和POW-通过与供电电路的焊盘焊接，将供电电压耦合至电子设备。
结合图13和图14，本申请实施例中电连接器600的管脚包含两部分，一部分是金手指插槽610内的管脚611，另一部分是额外增加的受电端子POW+和POW-。当金手指插槽610是MSA的20pin金手指插槽610时，电连接器600如图15所示总共包含22个管脚(20个金手指插槽610的管脚611，以及POW+和POW-)，这些管脚的功能定义可以如表1所示：
管脚序号(PinNum.) 名称 功能
1 VeeT 发射器接地
2 TxFault 发射器故障指示
3 TxDisable 发射器禁用指示
4 SDA 通信串行数据线
5 SCL 通信串行时钟线
6 VeeR 接收器接地
7 Dyinggasp Dyinggasp功能
8 LOS LOSS信号
9 VeeR 接收器接地
10 VeeR 接收器接地
11 VeeR 接收器接地
12 RX- 差分接收(-)
13 RX+ 差分接收(+)
14 VeeR 接收器接地
15 VCCR 接收器供电
16 VCCT 发射器供电
17 VeeT 发射器接地
18 TX+ 差分发送(+)
19 TX- 差分发送(-)
20 VeeT 发射器接地
21 POW+ 供电正极
22 POW- 供电负极
表1管脚功能定义
在一些实施例中，第一导电端子321的数量和第二导电端子410的数量均可以大于两个。如图16所示，第一导电端子321的数量为四个，包括PIN 11+端子、PIN 11-端子、PIN 12+端子和PIN 12-端子；第二导电端子410的数量对应为四个，包括：PIN 21+端子、PIN 21-端子、PIN 22+端子和PIN 22-端子。其中，PIN 11+端子与PIN 21+端子电连接，PIN 11-端子与PIN 21-端子电连接，PIN 12+端子与PIN 22+端子电连接，PIN 12-端子与PIN 22-端子电连接。进一步地，PIN 11+端子和PIN 12+端子可以与光 纤连接器500的供电端子V+对接，PIN 11-端子和PIN 12-端子可以与光纤连接器500的供电端子V-对接，从而在第二导电端子410一侧形成两路供电输出，即：PIN 21+端子和PIN 21-端子可以作为一路供电输出，PIN 22+端子和PIN 22-端子可以作为另一路供电输出。对于第一导电端子321和第二导电端子410可实现的其他数量，本申请实施例中不再赘述，本领域技术人员在本申请实施例的技术构思和技术启示之下，可以根据实际需求合理设计第一导电端子321和第二导电端子410的数量及其对应的连接方式，这些设计都没有超出本申请实施例的保护范围。
图17是电缆在壳体100内的走线示意图。如图17所示，当第一导电端子321和第二导电端子410通过电缆L1和L2连接时，壳体100内还设置有金属隔离板700。金属隔离板700沿平行于光信号的传输方向设置，金属隔离板700能够将壳体100内部的空间330分隔成沿垂直于光信号的传输方向并列的两个子空间，第一PCB 220位于第一子空间内，电缆位于第二子空间内，使得第一PCB 220的电磁辐射不会泄露到壳体外部，避免出现辐射发射(radiated emission，RE)问题。金属隔离板700沿着电缆的延伸方向还设置有引线板710，引线板710设置于金属隔离板700的面向第二子空间的一侧，向远离金属隔离板700的方向延伸。引线板710贴近壳体100的侧面，使电缆L1和L2可以在引线板710的引导下贴近壳体100的侧面走线，由此增大电缆到第一PCB 220的距离，使得第一PCB 220不会受到电缆L1和L2的电磁干扰，保证信号传输的稳定性。
图18是壳体100与光电转换器210的配合结构示意图。如图18所示，壳体100还包括垂直于光信号的传输方向设置的光接头211支座，光接头211支座位于第一绝缘板310的面向光电转换器210的一侧。光接头211坐落于光接头211支座之上，限制光电转换器210在垂直于光信号的传输方向上的移动，实现光电转换器210的径向固定，光接头211支座还用于限制光电转换器210在平行于光信号的传输方向上的移动，实现光电转换器210的轴向固定。进一步如图18所示，为了填充光接头211与光接头211支座之间可能存在的缝隙，光接头211还套接有导电环140。导电环140可以使用金属材质，导电环140与光接头211支座形成了一个电磁屏蔽层，能够将第一连接部110与光电转换器210的除了光接头211以外的其他部件进行电气隔离，避免第一连接部110的第一导电端子321对光电转换器210产生电磁干扰，保证信号转换的稳定性。
图19是本申请实施例示出的第一连接部110的B向视图。如图19所示，多个第一导电端子321中的任意相邻的两个第一导电端子321之间的距离D2大于或者等于第一阈值，并且任意一个第一导电端子321与壳体100之间的距离D3大于或者等于第一阈值，使得光电连接装置在不接地的情况下，能够满足高压浪涌防护要求，例如：当第一阈值取值为3.5mm时，可以使光电连接装置能够满足共模4KV(千伏)的浪涌防护要求。需要补充说明的是，如果壳体100内部空间330限制导致第一导电端子321与壳体100之间的距离D3无法大于或者等于第一阈值，则可以在壳体100和第一导电端子321之间设置绝缘贴纸，以达到同样的满足浪涌防护要求的目的。
图20是本申请实施例示出的第二连接部120的C向视图。如图20所示，多个第二导电端子410中的任意相邻的两个第二导电端子410之间的距离D4大于或者等于第 二阈值，并且任意一个第二导电端子410与壳体100之间的距离D5大于或者等于第二阈值，使得光电连接装置在不接地的情况下，能够满足高压浪涌防护要求，例如：当第二阈值取值为3.5mm时，可以使光电连接装置能够满足共模4KV(千伏)的浪涌防护要求。需要补充说明的是，如果壳体100内部空间330限制导致第二导电端子410与壳体100之间的距离D5无法大于或者等于第二阈值，则可以在壳体100和第二导电端子410之间设置绝缘贴纸，以达到同样的满足浪涌防护要求的目的。
图21是本申请实施例示出的具备LC型光纤接口的光电连接装置的示意图。如图21所示，光电连接装置的第一连接部110包括绝缘部件300，绝缘部件300设置有至少两个第一导电端子321。绝缘部件300和第一导电端子321的布置方式可以参照SC型光纤接口的光电连接装置实施，此处不再赘述。
由以上技术方案可知，本申请实施例提供的光电连接装置，不仅能够收发光/电信号，还能够将远端供电的电能耦合至电子设备，为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。同时，本申请实施例提供的光电连接装置，不改变目前已有光模块(例如：SPF+光模块、SPF光模块、XFP光模块和CFP光模块等)的接口形态，与目前已有光模块的兼容性相同，能够适配目前已有的SC型光纤连接器、LC型光纤连接器、电连接插座(socket)以及其他的对接结构，而不需要对上述对接结构进行改造，应用灵活性高，成本低，有利于实现大规模部署。
图22是本申请实施例提供的电子设备的供电示意图。如图22所示，该电子设备包括电压处理单元和本申请实施例提供的光电连接装置。光电连接装置用于与光电混合缆连接，一方面通过光电混合缆中的光纤收发光信号，另一方面将光电混合缆中的供电电压耦合至电压处理单元。电压处理单元用于将供电电压转换成电子设备中的各个电子元件所需的工作电压。由此，电子设备不需要设置独立的POE端口，仅通过光电连接装置就能够同时实现光信号的传输和供电电压的引入，简化了电子设备的结构设计，有利于减小电子设备的体积。
以上的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本发明的保护范围之内。

Claims (12)

  1. 一种光电连接装置，其特征在于，包括：壳体；以及，
    设置于所述壳体一端的第一连接部，所述第一连接部用于耦合至光信号传输介质；
    设置于所述壳体另一端的第二连接部，所述第二连接部用于耦合至电信号传输介质；
    所述第一连接部和所述第二连接部通过设置于所述壳体内的光电处理模块耦合；
    设置于所述第一连接部的多个第一导电端子，以及，设置于所述第二连接部的多个第二导电端子，所述多个第一导电端子与所述多个第二导电端子电连接；
    所述多个第一导电端子用于通过所述光信号传输介质附加的多个供电端子耦合至供电电压，所述多个第二导电端子用于通过所述电信号传输介质附加的多个受电端子将所述供电电压耦合至电子设备。
  2. 根据权利要求1所述的光电连接装置，其特征在于，所述光电处理模块包括：
    设置于所述第一连接部和所述第二连接部之间的第一印刷电路板PCB；
    与所述第一PCB耦合的光电转换器，所述光电转换器设置有光接头，所述光接头沿光信号的传输方向延伸至所述第一连接部内。
  3. 根据权利要求2所述的光电连接装置，其特征在于，
    所述第一连接部包括绝缘部件，所述绝缘部件包括相连接的第一绝缘板和第二绝缘板；
    所述第一绝缘板垂直于光信号传输的方向设置，所述第一绝缘板设置有定位孔，所述光接头穿过所述定位孔与所述光信号传输介质包含的光纤插芯对接；
    所述第二绝缘板设置于所述光接头的侧面，所述多个第一导电端子面向所述光接头设置于所述第二绝缘板。
  4. 根据权利要求2所述的光电连接装置，其特征在于，
    所述第一PCB设置有电信号端子，所述电信号端子沿光信号的传输方向延伸至所述第二连接部内，与所述电信号传输介质的包含管脚的插槽对接；
    所述第二连接部包括第三绝缘板，所述第三绝缘板平行于光信号传输的方向设置于所述电信号端子的侧面，所述多个第二导电端子面向所述电信号端子设置于所述第三绝缘板。
  5. 根据权利要求2-4任一项所述的光电连接装置，其特征在于，还包括：
    设置于所述壳体内的至少两根电缆，所述多个第一导电端子和所述多个第二导电端子通过所述至少两根电缆电连接。
  6. 根据权利要求5所述的光电连接装置，其特征在于，还包括，金属隔离板；
    所述金属隔离板沿平行于光信号的传输方向设置，所述金属隔离板将壳体内部的空间分隔成第一子空间和第二子空间，所述至少两根电缆位于所述第一子空间内，所述第一PCB位于所述第二子空间内。
  7. 根据权利要求3所述的光电连接装置，其特征在于，所述壳体还包括垂直于光信号的传输方向设置的光接头支座，所述光接头支座位于所述第一绝缘板的面向所述光电转换器的一侧，所述光接头支座用于固定所述光接头。
  8. 根据权利要求7所述的光电连接装置，其特征在于，所述光接头套接有导电环， 所述导电环用于填充所述光接头和所述光接头支座之间的缝隙。
  9. 根据权利要求1-8任一项所述的光电连接装置，其特征在于，所述多个第一导电端子中的任意相邻的两个第一导电端子之间的距离大于或者等于第一阈值。
  10. 根据权利要求1-8任一项所述的光电连接装置，其特征在于，所述多个第二导电端子中的任意相邻的两个第二导电端子之间的距离大于或者等于第二阈值。
  11. 根据权利要求1-8任一项所述的光电连接装置，其特征在于，所述光信号传输介质包括SC型光纤连接器或LC型光纤连接器。
  12. 根据权利要求1-8任一项所述的光电连接装置，其特征在于，所述电信号传输介质包括多源协议MSA金手指连接器。
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