WO2021139219A1 - 一种电连接插座、光模块及光模块笼子 - Google Patents

一种电连接插座、光模块及光模块笼子 Download PDF

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Publication number
WO2021139219A1
WO2021139219A1 PCT/CN2020/117407 CN2020117407W WO2021139219A1 WO 2021139219 A1 WO2021139219 A1 WO 2021139219A1 CN 2020117407 W CN2020117407 W CN 2020117407W WO 2021139219 A1 WO2021139219 A1 WO 2021139219A1
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WO
WIPO (PCT)
Prior art keywords
optical module
connection socket
electrical connection
pin
electrical signal
Prior art date
Application number
PCT/CN2020/117407
Other languages
English (en)
French (fr)
Inventor
舒亮
李进波
陈磊
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华为技术有限公司
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Publication date
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Publication of WO2021139219A1 publication Critical patent/WO2021139219A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/02—Details
    • H04L12/10—Current supply arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6666—Structural association with built-in electrical component with built-in electronic circuit with built-in overvoltage protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H04L12/40045—Details regarding the feeding of energy to the node from the bus

Definitions

  • This application relates to the field of communication technology, and in particular to an electrical connection socket, an optical module, and an optical module cage.
  • Electronic devices such as access point devices (AP) and web cameras are usually installed in areas such as corporate campuses, indoor ceilings, building walls, etc. There is usually no power supply device near these areas to provide the power required for the operation of electronic devices. Therefore, The power supply of these electronic devices is generally achieved through power over ethernet (PoE).
  • PoE power over ethernet
  • Power over Ethernet is a technology that can transmit power to electronic devices through twisted pair cables in Ethernet.
  • Power over Ethernet generally uses a photoelectric hybrid cable to transmit optical signals and electrical energy at the same time.
  • the optical signal is used to enable remote electronic devices to achieve network communication, and the electrical energy is used to power the remote electronic devices.
  • the photoelectric hybrid cable is composed of optical fibers and cables. , The transmission of optical signal and electric energy is realized by optical fiber and cable respectively.
  • the photoelectric hybrid cable After the photoelectric hybrid cable is stretched to the vicinity of the electronic device, it will be split into independent optical fibers and cables.
  • the fiber ends are equipped with optical fiber connectors, and the cable ends are equipped with Ethernet connectors.
  • the electronic device also needs to be provided with an additional POE interface for docking with the Ethernet connector. Only in this way can it receive power from the photoelectric hybrid cable.
  • the provision of an additional POE interface in the electronic device will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • This application provides an electrical connection socket, an optical module, and an optical module cage to solve the problems existing in the prior art.
  • the present application provides an electrical connection socket that can be applied to an optical module.
  • the electrical connection socket includes an insulating base; the base includes an upper surface and a lower surface, and is connected to the upper surface and the lower surface.
  • the first side surface is provided with an electrical signal slot, the electrical signal slot is used to couple with the electrical signal terminal of the optical module; at least two first pins; one end of the at least two first pins is located on the upper surface, and the other One end extends from the inside of the base to the lower surface, and at least two first pins are used for coupling to the electronic device.
  • the electrical connection socket provided in this application can be applied to various interface modules, such as optical modules, electrical interface modules, etc., to support the interface modules with the original signal transmission function while using the power-over-Ethernet technology to power electronic devices , So that the electronic device does not need to set up additional POE interface, which is beneficial to reduce the volume of the electronic device.
  • the electrical connection socket further includes: an insulating plate; the insulating plate is arranged on an end of the lower surface away from the first side surface, one end of the insulating plate is connected to the lower surface, and the other end faces away from the lower surface. extend.
  • the insulating plate has a certain electrical isolation effect on the housing of the optical module and the first pin of the electrical connection socket, which can shorten the safety distance between the housing and the first pin to resist surges, and prevent the first pin from discharging the housing. It is beneficial for the optical module and the electrical connection socket to complete a more compact structure design and realize miniaturization.
  • the electrical signal socket includes a first inner surface and a second inner surface that are opposed to each other; the electrical connection socket further includes: at least one second pin; one end of the at least one second pin is located in the first An inner surface, the other end extends from the inside of the base to the lower surface; at least one third stitch; one end of the at least one third stitch is located on the second inner surface, and the other end extends from the inside of the base to the lower surface.
  • the second and third pins on the lower surface can be mounted on the motherboard through surface mount technology SMT, wave soldering and other soldering processes. On the one hand, they serve as a fixed electrical connection socket, and on the other hand, they can couple electrical signals to the motherboard of the electronic device.
  • At least one second stitch and at least one third stitch are arranged in pairs.
  • the distance between any first stitch and any second stitch on the lower surface is greater than the first threshold; the distance between any first stitch and any third stitch on the lower surface is greater than the first Threshold; the distance between any second stitch and any third stitch on the lower surface is greater than the first threshold.
  • the distance between any two first stitches on the upper surface is greater than the second threshold; the distance between any two first stitches on the lower surface is greater than the second threshold.
  • the electrical signal slot is a multi-source protocol MSA gold finger slot.
  • the present application provides an optical module, the optical module includes a housing; a printed circuit board PCB arranged in the housing, the PCB is provided with electrical signal terminals, and the electrical signal terminals are similar to the first aspect of the application and its various implementations.
  • the electrical signal socket of the electrical connection socket provided by the method is plug-in connection; at least two conductive terminals arranged in the housing, at least two conductive terminals are coupled with a supply voltage; at least two conductive terminals are arranged facing the upper surface of the electrical connection socket, At least two conductive terminals are electrically connected to at least two first pins of the electrical connection socket in a one-to-one correspondence to couple the power supply voltage to the electronic device.
  • the optical module provided in this application can not only receive light/electrical signals, but also couple the power of Power over Ethernet to electronic devices to supply power to the electronic devices, so that the electronic devices do not need to be provided with additional POE interfaces, which is beneficial to reduce the cost of the electronic devices. volume.
  • the distance between any first pin and the housing is greater than the third threshold. In this way, the first pin is prevented from discharging to the housing and the risk of surge is avoided.
  • the electrical signal terminal is a multi-source protocol MSA gold finger terminal.
  • the optical module is a small pluggable packaged SFP optical module with an SC-type optical fiber interface or an LC-type optical fiber interface.
  • the present application provides an optical module cage, which is characterized in that it comprises: a cage shell and a cavity enclosed by the cage shell; the cavity is used to accommodate the first aspect of the application and its various implementations.
  • the electrical connection socket and the optical module provided by the second aspect and various implementations thereof; one end of the cage shell is provided with an opening for inserting the optical module and the electrical connection socket into the cavity from the opening so that the electrical connection socket is located in the cavity
  • the depth of the cavity in the insertion direction of the optical module and the electrical connection socket matches the length of the optical module and the electrical connection socket after being connected.
  • the optical module cage provided by the present application is used to accommodate the electrical connection sockets provided in the first aspect and various implementations of the application and the optical modules provided in the second aspect and various implementations of the application, and can provide electrical power to the electrical connection sockets and optical modules. Isolation.
  • Figure 1 is a schematic diagram of an installation scene of an electronic device
  • Figure 2 is a schematic diagram of a local power supply scheme for electronic equipment
  • Figure 3 is a schematic diagram of a remote power supply scheme for electronic equipment
  • Figure 4 is a schematic diagram of a remote power supply scheme for electronic equipment
  • FIG. 5 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of an electrical connection socket provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of an optical module cage provided by an embodiment of the present application.
  • Figure 8 is a schematic diagram of the electrical connection socket and the optical module cage being connected to the main board of the electronic device
  • FIG. 9 is a schematic diagram of the pin definition of the electrical connection socket shown in an embodiment of the present application.
  • FIG. 10 is a schematic diagram of other implementation manners of conductive terminals shown in an embodiment of the present application.
  • Figure 11 is a schematic view of the lower surface of the electrical connection socket
  • Figure 12 is a D view of an electrical connection socket provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of an SPF packaged electrical interface module with an RJ45 interface provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of power supply of an electronic device provided by an embodiment of the present application.
  • Fig. 1 is a schematic diagram of an installation scene of an electronic device.
  • electronic devices such as access point (AP) 030, webcam 010, traffic lights, micro base stations, etc. can be installed on indoor ceilings 050, walls 060, and outdoor building walls and telephone poles. Wait for the location.
  • These electronic devices can establish network connections with other remote network devices through optical fiber, twisted pair, etc., for example: the access point device is connected to the remote switch device 040, the network camera is connected to the remote storage device 020, traffic Signals, etc. are connected to remote control equipment, etc.
  • the electronic device may adopt the solution shown in FIG. 2 for power supply, for example.
  • a locally equipped power supply device is coupled to a high-voltage cable to take power.
  • the high-voltage cable carries, for example, 220V (Volt) AC power.
  • the power supply device can convert AC power into, for example, DC 48V, DC 12V, DC 9V, or DC.
  • the DC input voltage commonly used in electronic equipment such as 5V, and the DC input voltage is transmitted to the voltage processing unit of the electronic equipment through the power supply cable.
  • the voltage processing unit is used to further process the DC input voltage into the work required by each electronic component in the electronic equipment Voltage.
  • the electronic device also includes a network module for realizing network connection, such as an optical module (optical module), which can be connected to an optical fiber to complete the mutual conversion between optical signals and electrical signals, so that the electronic device can be connected to other Network equipment for network communication.
  • a network module for realizing network connection such as an optical module (optical module), which can be connected to an optical fiber to complete the mutual conversion between optical signals and electrical signals, so that the electronic device can be connected to other Network equipment for network communication.
  • the electronic device may, for example, adopt the solution shown in FIG. 3 to supply power.
  • the long-distance power supply cable is coupled with the voltage processing unit of the electronic device, and the remote power supply voltage (for example, 220V AC voltage) is introduced to the voltage processing unit; the voltage processing unit is used to convert the AC voltage into the electronic device The operating voltage required by the various electronic components in the.
  • the electronic device also includes a network module for realizing network connection, such as an optical module (optical module), so that the electronic device can perform network communication with other network devices.
  • the scheme shown in Figure 3 requires electronic equipment to have the ability to convert alternating current (AC) into direct current (DC). Therefore, an AC/DC conversion circuit and related structures need to be added to the electronic equipment, which will increase the volume of the electronic equipment and is not conducive to electronics. The miniaturization of equipment cannot be implemented in small devices such as access point equipment and webcams.
  • the electronic equipment When the electronic equipment is not equipped with power supply equipment nearby, for example, the electronic equipment can also be powered by the power over ethernet (PoE) scheme, which is a way to transmit power through the twisted pair in the Ethernet.
  • PoE power over ethernet
  • the network and power transmission medium used by Power over Ethernet can be a photoelectric hybrid cable.
  • Optical hybrid cables are composed of integrated optical fibers and cables. Optical fibers are used to carry optical signals, and cables are used to carry power supply voltage. After the optical hybrid cables are stretched to the vicinity of electronic equipment, they will be split into independent optical fibers and cables. An optical fiber connector is arranged at the end of the optical fiber, and an Ethernet connector is arranged at the end of the cable.
  • electronic devices are inserted with optical modules for docking with optical fiber connectors to complete the mutual conversion between optical signals and electrical signals, so that electronic devices can communicate with other network devices on the network;
  • An independent POE interface is also provided, and the POE interface is used for docking with the Ethernet connector.
  • the POE interface is connected to the voltage processing unit inside the electronic device, and can couple the supply voltage to the voltage processing unit.
  • the voltage processing unit is used to convert the supply voltage into the operating voltage required by each electronic component in the electronic device. It is understandable that, since the solution shown in FIG. 4 requires an independent POE interface to be provided in the electronic device, this will increase the structural complexity of the electronic device and increase the volume of the electronic device.
  • the optical module may be an enhanced small form-factor pluggable (SPF or SPF+) optical module, a small form factor (SFF) optical module, for example.
  • SPF enhanced small form-factor pluggable
  • SFF small form factor
  • Fig. 5 is a schematic structural diagram of an optical module provided by an embodiment of the present application.
  • the optical module includes a housing 100, and one end of the housing 100 is provided with an optical fiber interface 120 for docking with the optical fiber connector 200.
  • the optical fiber interface 120 can be designed into different specifications accordingly.
  • the optical fiber connector 200 is an SC type optical fiber connector (subscriber connector/standard connector)
  • the optical fiber interface 120 may be an SC type optical fiber interface
  • the optical fiber connector 200 is an LC type optical fiber connector (lucent connector/local connector)
  • the optical fiber interface 120 may be an LC-type optical fiber interface.
  • the housing 100 may be designed as a rectangular parallelepiped structure or other structures.
  • the housing 100 can be made of metal materials such as copper, aluminum, steel, etc., so that it has the ability to shield electromagnetic radiation.
  • a photoelectric processing module 130 is further provided in the housing 100 of the optical module, and the photoelectric processing module 130 includes a printed circuit board PCB 131 and a photoelectric converter 132.
  • the photoelectric converter 132 is disposed at one end of the PCB 131 close to the optical fiber interface 120, and is coupled to the PCB 131.
  • the photoelectric converter 132 is provided with an optical connector 133, and one end of the optical connector 133 extends away from the PCB 131 toward the optical fiber interface 120.
  • the optical fiber ferrule 210 of the optical fiber connector 200 can be docked with the optical connector 133 to transmit optical signals.
  • An electrical signal terminal 134 is provided at one end of the PCB 131 away from the optical fiber interface 120, and the photoelectric converter 132 is used for converting the optical signal into an electrical signal and outputting the electrical signal terminal 134.
  • the optical fiber interface 120 of the optical module can also be used as a POE interface, which can access the power supply voltage in the photoelectric hybrid cable 220 from the optical fiber connector 200 and couple the power supply voltage to the electronic device.
  • the optical fiber interface 120 of the optical module is provided with at least two conductive terminals 135, such as conductive terminals PIN 1+ and PIN 1-, and the above-mentioned at least two conductive terminals 135 face the optical fiber connector.
  • the area where the electrical signal terminal 134 of the optical module is located is provided with at least two conductive terminals 136, such as conductive terminals PIN 2+ and PIN 2-, the above at least two conductive terminals 136 are set facing the electrical signal terminal 134; wherein, At least two conductive terminals 135 in the optical fiber interface 120 are electrically connected to at least two conductive terminals 136 on the side of the electrical signal terminal 134 in a one-to-one correspondence.
  • the conductive terminal PIN 1+ in the optical fiber interface 120 and the conductive terminal PIN 2+ on the electrical signal terminal 134 side can be connected through the cable L1, and the conductive terminal PIN 1 in the optical fiber interface 120 is connected to the electrical signal
  • the conductive terminal PIN 2 on the terminal 134 side can be connected via the cable L2. It is understandable that the conductive terminals PIN 1+, PIN 1- and the conductive terminals PIN 2+, PIN 2- can also be connected through an additional PCB or connected in other ways.
  • the connection method of the conductive terminals in the embodiment of the present application There is no specific limitation.
  • the optical fiber connector 200 can also be used as a power-over-Ethernet connector.
  • the optical fiber connector 200 is provided with at least two power supply terminals, such as power supply terminals V+ and V-.
  • the above-mentioned at least two power supply terminals are provided on the optical fiber connector 200 facing the conductive terminals PIN 1+ and PIN 1- Side surface.
  • the power supply terminal V+ is connected to the positive cable of the photoelectric hybrid cable 220
  • the power supply terminal V- is connected to the negative cable of the photoelectric hybrid cable 220
  • the positive and negative cables of the photoelectric hybrid cable 220 are connected to the positive and negative poles of the remote power supply device.
  • the power supply terminals V+ and V- are coupled with a power supply voltage.
  • the power supply terminal V+ and the conductive terminal PIN 1+ are connected to form a path
  • the power supply terminal V- and the conductive terminal PIN 1- are connected to form a path
  • the power supply voltage is coupled to the conductive terminal PIN at the other end. 2+ and PIN 2-.
  • the electrical signal in the electrical signal terminal 134 and the power supply voltage in the conductive terminals PIN 2+ and PIN 2- are finally coupled to electronic devices, such as access point devices (AP), web cameras Etc., so that the electronic device can establish network communication with other network devices, and can also obtain the power required for the operation of the device.
  • electronic devices such as access point devices (AP), web cameras Etc.
  • the optical module of the embodiment of the present application further includes an electrical connection socket 300, which is used to communicate with the electrical signal terminal 134 and the conductive terminals PIN 2+, PIN 2- of the optical module. Docking.
  • the electrical connection socket 300 can be designed to be pluggable with other components of the optical module, or can be designed as an integrated structure with other components of the optical module.
  • the electrical connection socket 300 has an electrical signal socket 314 that matches the electrical signal terminal 134, and the electrical signal socket 314 can be plugged and connected with the electrical signal terminal 134 to transmit electrical signals.
  • the electrical connection socket 300 may have different electrical signal slots 314.
  • the electrical signal terminals 134 are multi-source agreement (MSA) golden finger terminals
  • the electrical signal plug The slot 314 may be an MSA gold finger slot.
  • the electrical connection socket 300 may also be called a socket, for example: SPF socket.
  • Fig. 6 is a schematic structural diagram of an electrical connection socket provided by an embodiment of the present application.
  • the electrical connection socket 300 includes an insulating base 310, and the insulating base 310 includes an upper surface 311 and a lower surface 312, and a first side surface 313 connected to the upper surface 311 and the lower surface 312.
  • the first side surface 313 is provided with an electrical signal slot 314, such as an SPF gold finger slot, and the electrical signal slot 314 is used for coupling with the electrical signal terminal 134 of the optical module.
  • the base 310 may be made of rubber, resin, or other materials with insulating properties.
  • the upper surface 311 and the lower surface 312 of the base 310 can be arranged parallel to each other, so that the electrical connection socket 300 can be smoothly inserted into the casing 100 from one end of the optical module casing 100, or can be smoothly pulled out from the casing 100 to realize hot unplugging. Plug in.
  • the electrical connection socket 300 further includes at least two first pins 315. Wherein, one end of the at least two first pins 315 is located on the upper surface 311 of the base 310.
  • the electrical signal slot 314 of the electrical connection socket 300 is connected to the electrical signal terminal 134, the upper surface 311 of the base 310 faces the optical module.
  • the at least two conductive terminals 136 of the electrical connection socket 300 are connected to the at least two conductive terminals 136 of the optical module in a one-to-one correspondence.
  • the optical module includes conductive terminals PIN 2+ and PIN 2-
  • the upper surface 311 of the base 310 includes first pins POW+ and POW- correspondingly, wherein the conductive terminal PIN 2+ is used to connect to the first pin POW+ ,
  • the conductive terminal PIN 2- is used to connect with the first pin POW-.
  • the embodiment of the present application also provides an optical module cage, that is, a cage, such as an SPF cage.
  • Fig. 7 is a schematic structural diagram of an optical module cage provided by an embodiment of the present application.
  • the optical module cage 500 includes: a cage housing 510 and a cavity 520 enclosed by the cage housing 510; the cavity 520 is used for accommodating the electrical connection socket 300 and the optical module 600 provided in the embodiment of the present application.
  • One end of the cage shell 510 is provided with an opening 530. After the optical module 600 and the electrical connection socket 300 are plugged and connected through the electrical signal terminal and the electrical signal slot, they can be inserted into the cavity 520 through the opening 530, so that the electrical connection socket 300 penetrates The bottom of the cavity 520.
  • the optical module cage 500 provided in the embodiment of the present application is used to accommodate the electrical connection socket 30 and the optical module 600 provided in the embodiment of the present application, and can electrically isolate the electrical connection socket 300 and the optical module 600.
  • the length of the electrical connection socket 300 of the embodiment of the present application is increased after the first pin 315 is added, in order to enable the optical module cage 500 to accommodate the electrical connection socket 300 and the optical module 600, it is effective in electrical connection.
  • the depth of the cavity 520 of the optical module cage 500 can also be increased accordingly, so that the depth of the cavity 520 of the optical module cage 500 in the insertion direction of the optical module 600 and the electrical connection socket 300 is the same as that of the optical module 600 and the electrical connection socket 300. Match the length after connection.
  • Fig. 8 is a schematic diagram of the electrical connection socket and the optical module cage being connected to the main board of the electronic device.
  • the cage housing 510 is installed on the main board 400 of the electronic device by crimping or welding, wherein the lower surface 312 of the base 310 of the electrical connection socket is disposed facing the main board 400.
  • the other ends of the at least two first pins 315 of the electrical connection socket extend from the inside of the base 310 to the lower surface 312 of the base 310, and are mounted on the motherboard 400 by soldering processes such as surface mounted technology (SMT) and wave soldering.
  • SMT surface mounted technology
  • the above plays a role of fixing the electrical connection socket, on the other hand, coupling the power supply voltage to the main board 400.
  • the electrical signal slot 314 includes a first inner surface 321 and a second inner surface 322 that are opposed to each other.
  • the first inner surface 321 may be provided with at least one second pin 316, one end of the at least one second pin 316 is exposed on the first inner surface 321, and the other end extends from the inside of the base 310 to the lower surface 312 of the base 310, and It is installed on the main board 400 through surface mount technology SMT, wave soldering and other soldering processes. On the one hand, it plays a role of fixing the electrical connection socket, and on the other hand, it couples electrical signals to the main board 400.
  • the second inner surface 322 may be provided with at least one third stitch 317, one end of the at least one third stitch 317 is exposed on the first inner surface 321, and the other end extends from the inside of the base 310 to the lower surface 312 of the base 310, and It is mounted on the main board 400 through surface mounting technology SMT, wave soldering and other soldering processes. On the one hand, it plays a role of fixing the electrical connection socket 300, and on the other hand, it couples electrical signals to the main board 400.
  • the lower surface 312 of the electrical connection socket is further provided with an insulating plate 318, and the insulating plate 318 is located at an end of the lower surface 312 away from the first side surface 313.
  • One end of the insulating plate 318 is connected to the lower surface 312, and the other end extends in a direction away from the lower surface 312 and is inserted into the main board 400.
  • the insulating plate 318 can be made of insulating materials such as plastic or resin.
  • the insulating plate 318 has a certain electrical isolation effect on the cage shell 510 and the first pin 315, which can shorten the need for the cage shell 510 and the first pin 315 to resist surges. The safety distance of the first pin 315 is prevented from discharging the cage shell 510, which is conducive to the completion of a more compact structural design of the optical module and the electrical connection socket, and the realization of miniaturization.
  • the lower surface 312 of the electrical connection socket 300 is also provided with at least one positioning pin 319, which can be inserted into a preset positioning hole on the main board 400 to form a hole-shaft fit to achieve a fixed electrical connection. The purpose of connecting the socket.
  • the distance D4 between the first pin 315 and the cage housing 510 along the D direction of the electrical connection socket is greater than the third threshold, so as to prevent the first pin 315 from discharging the cage housing 510 and avoid the risk of surge.
  • the third threshold may be 3.5 mm, so that the common mode 4KV (kilovolt) surge protection requirement can be met between the first pin 315 and the cage shell 510.
  • the number and arrangement of the at least one second pin 316 and the at least one third pin 317 can be determined according to the protocol used by the electrical signal terminal 134 and the electrical signal socket 314.
  • the total number of pins is 20, of which there are 10 second pins 316, 10 third pins 317, and the above 10 second pins 316 and 10 third pins 317 are paired Set up.
  • the electrical connection socket 300 as shown in FIG. 7 also includes the first pins POW+ and POW-
  • the electrical connection socket 300 includes a total of 22 pins.
  • the functions of the pins are The definition can be shown in Figure 9 and Table 1:
  • pin function definition of the electrical connection socket 300 provided in the embodiment of the present application is only used as an example to illustrate the feasibility of the electrical connection socket 300 that can transmit electrical signals and supply voltage at the same time, and it is not enough for paired pin functions.
  • some or all of the pins of the electrical connection socket 300 can have other definitions.
  • pin 21 can be defined as POW- (power supply negative)
  • pin 22 can be defined as POW+ (power supply positive). It does not exceed the protection scope of the embodiments of this application.
  • the number of conductive terminals 135 in the optical fiber interface 120 and the number of conductive terminals 136 on the side of the electrical signal terminal 134 may both be greater than two.
  • the optical fiber interface 120 includes PIN 11+ terminal, PIN 11-terminal, PIN 12+ terminal, and PIN 12-terminal;
  • the electrical signal terminal 134 side includes: PIN 21+terminal, PIN 21-terminal, PIN 22 +terminal and PIN 22-terminal.
  • the PIN 11+ terminal and the PIN 12+ terminal can be docked with the power supply terminal V+ of the optical fiber connector 200, and the PIN 11- terminal and PIN 12- terminal can be docked with the power supply terminal V- of the optical fiber connector 200 .
  • the PIN 11+ terminal is electrically connected to the PIN 21+ terminal
  • the PIN 11- terminal is electrically connected to the PIN 21- terminal
  • the PIN 12+ terminal is electrically connected to the PIN 22+ terminal
  • the PIN 12- terminal is electrically connected to the PIN 22- terminal Electric connection.
  • the upper surface 311 of the electrical connection socket 300 may include two first pins POW+ and two first pins POW-, one of the first pins POW+ is connected to the PIN 21+ terminal, and the other first pin POW+ is connected to the PIN 22 +Terminal connection, one of the first pin POW- is connected to the PIN 21- terminal, and the other first pin POW- is connected to the PIN 22- terminal to form a dual power supply output.
  • the details will not be repeated in the embodiments of the present application, and those skilled in the art can reasonably design the number of the first pins 315 according to actual needs based on the technical idea and technical enlightenment of the embodiments of the present application. These designs and their corresponding connection modes do not exceed the protection scope of the embodiments of the present application.
  • FIG. 11 is a schematic view of the lower surface of the electrical connection socket.
  • FIG. 11 shows the C direction perpendicular to the insertion direction of the electrical signal terminal 134 and the D direction parallel to the insertion direction of the electrical signal terminal 134.
  • at least two first stitches 315 are arranged in parallel along the C direction
  • at least one second stitch 316 is arranged in parallel along the C direction
  • at least one third stitch 317 is arranged in parallel along the C direction
  • at least one third stitch 317 is sequentially distributed along the D direction.
  • the distance D1 between any first pin 315 and any second pin 316 on the lower surface 312 is greater than the first threshold, so that electromagnetic interference will not be caused between the first pin 315 and the second pin 316, and the risk of surge is avoided;
  • the distance D3 between any first pin 315 and any third pin 317 on the lower surface 312 is greater than the first threshold, so that electromagnetic interference will not be caused between the first pin 315 and the third pin 317, and the risk of surge is avoided;
  • the distance D2 between the second pin 316 and any third pin 317 on the lower surface 312 is greater than the first threshold, so that electromagnetic interference will not be caused between the second pin 316 and the third pin 317 and the risk of surge is avoided.
  • the first threshold may be 3.5 mm, so that the first pin 315, the second pin 316, and/or the third pin 317 can meet the common mode 4KV (kilovolt) surge protection requirement.
  • the distance D5 between any two first pins 315 on the lower surface 312 is greater than the second threshold.
  • the second threshold may be 3.5 mm, so that the common mode 4KV (kilovolt) surge protection requirement can be met between the two first pins 315.
  • FIG. 12 is a view from the direction D of the electrical connection socket provided by the embodiment of the present application after being installed in the optical module.
  • the distance D5 between any two first pins 315 on the upper surface 311 is greater than the second threshold to meet the surge protection requirements; the distance D6 between any first pin 315 and the housing 100 along the C direction It is greater than the third threshold to prevent the first pin 315 from discharging the housing 100 and avoid the risk of surge.
  • the third threshold may be 3.5 mm, so that the common mode 4KV (kilovolt) surge protection requirement can be met between the first pin 315 and the housing 100.
  • the width and height of the first side surface 313 of the electrical connection socket 300 provided in the embodiment of the present application have not changed, and therefore, it can be adapted to the existing standard electrical connection socket.
  • the electrical signal slot 314 of the electrical connection socket 300 provided in the embodiment of the present application does not change the function definition and size layout of the golden finger and pin defined by the existing standard or protocol (such as the MSA protocol), and therefore can be compared with the existing optical module.
  • the electrical signal terminals are mixed and inserted, which has a wide range of compatibility.
  • the electrical connection socket 300 provided in the embodiment of the present application can also be applied to other interface modules, for example, an SPF package electrical interface module with an RJ45 interface.
  • Figure 13 is a schematic diagram of an SPF packaged electrical interface module with an RJ45 interface provided by an embodiment of the present application. As shown in FIG. 13, the electrical port module includes an RJ45 interface 710 at one end, and an electrical signal terminal 134 that complies with the MSA protocol at the other end.
  • the RJ45 interface 710 of the electrical interface module may also be provided with conductive terminals PIN 1+ and PIN 1-, and the electrical signal terminal 134 side may also be provided with conductive terminals PIN 2+ and PIN 2-, conductive terminals PIN 1+ and PIN 2+ is electrically connected, and the conductive terminal PIN 1- is electrically connected to PIN 2-.
  • the embodiment of the present application also provides an RJ45 crystal head 720 with power supply terminals V+ and V-. The power supply terminals V+ and V- can be connected to A pair of Ethernet twisted-pair cables coupled to the supply voltage are connected.
  • the power supply terminal V+ is connected to the conductive terminal PIN 1+, and the power supply terminal V- is connected to the conductive terminal PIN 1-.
  • the conductive terminal PIN 2+ is connected to the first pin POW+ of the electrical connection socket, which is conductive
  • the terminal PIN- is connected to the first pin POW- of the electrical connection socket, thereby coupling the power supply voltage to the main board of the electronic device connected to the electrical connection socket.
  • the electrical connection socket provided in the embodiments of the present application can be applied to various interface modules, such as optical modules, electrical interface modules, etc., to support the interface modules while having the original signal transmission function, while using
  • the power-over-Ethernet technology provides power to the electronic device, so that the electronic device does not need to have an additional POE interface, which is beneficial to reduce the size of the electronic device.
  • the electrical signal slot of the electrical connection socket provided by the embodiment of the present application does not change the function definition and size layout of the gold finger and pin defined by the existing standard or protocol (such as the MSA protocol), so it can be compatible with the electrical signal of the existing interface module.
  • the terminals are mixed and inserted, with wide compatibility.
  • FIG. 14 is a schematic diagram of power supply of an electronic device provided by an embodiment of the present application.
  • the electronic device includes a voltage processing unit and the photoelectric connection device provided in the embodiment of the present application.
  • the photoelectric connection device is used to connect with the photoelectric hybrid cable.
  • the optical fiber in the photoelectric hybrid cable receives and emits light signals; on the other hand, the power supply voltage in the photoelectric hybrid cable is coupled to the voltage processing unit.
  • the voltage processing unit is used to convert the supply voltage into the operating voltage required by each electronic component in the electronic device.
  • the electronic device does not need to be provided with an independent POE port, and the optical signal transmission and the introduction of the power supply voltage can be realized at the same time only through the photoelectric connection device, which simplifies the structural design of the electronic device and is beneficial to reduce the volume of the electronic device.

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Abstract

一种电连接插座（300）、光模块（600）及光模块笼子（500），该电连接插座包括：绝缘的基体；基体包括上表面（311）和下表面（312），以及与上表面和下表面连接的第一侧面（313），第一侧面设置有电信号插槽（314），电信号插槽用于与光模块的电信号端子（134）耦合；至少两个第一针脚（315）；至少两个第一针脚的一端位于上表面，另一端从基体内部延伸至下表面，至少两个第一针脚用于耦合至电子设备。该电连接插座，可以应用于各类接口模块，包括光模块或电口模块，用于支持接口模块在具备原有的信号传输功能的同时，利用以太网供电技术为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。

Description

一种电连接插座、光模块及光模块笼子
本申请要求于2020年1月8日提交中国国家知识产权局、申请号为202010019417.8、发明名称为“一种电连接插座、光模块及光模块笼子”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种电连接插座、光模块及光模块笼子。
背景技术
接入点设备(access point，AP)、网络摄像头等电子设备通常安装在企业园区、室内天花板、建筑墙面等区域，这些区域附近通常没有供电设备为电子设备提供运行所需的电能，因此，这些电子设备的供电一般是通过以太网供电(power over ethernet，PoE)方式实现的。
以太网供电是一种可以在以太网中透过双绞线来传输电力到电子设备上的技术。以太网供电一般使用光电混合缆同时传输光信号和电能，其中，光信号用于使远端的电子设备实现网络通信，电能用于为远端的电子设备供电，光电混合缆由光纤和电缆组成，光信号和电能的传输分别由光纤和电缆实现。
光电混合缆被拉远至电子设备附近之后，会被拆分成独立走线的光纤和电缆，光纤末端设置有光纤连接器，电缆末端设置有以太网连接器。与之相适应地，电子设备除了设置常规的光模块以对接光纤连接器以外，还需要设置额外的POE接口以对接以太网连接器，只有这样，才能够从光电混合缆接收电能。然而，在电子设备设置额外的POE接口会增加电子设备的结构复杂程度，增大电子设备的体积。
发明内容
本申请提供了一种电连接插座、光模块及光模块笼子，以解决现有技术中存在的问题。
第一方面，本申请提供了一种电连接插座，该电连接插座可应用于光模块，该电连接插座包括：绝缘的基体；基体包括上表面和下表面，以及与上表面和下表面连接的第一侧面，第一侧面设置有电信号插槽，电信号插槽用于与光模块的电信号端子耦合；至少两个第一针脚；至少两个第一针脚的一端位于上表面，另一端从基体内部延伸至下表面，至少两个第一针脚用于耦合至电子设备。
本申请提供的电连接插座，可以应用于各类接口模块，例如光模块、电口模块等，用于支持接口模块在具备原有的信号传输功能的同时，利用以太网供电技术为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。
在一种可选择的实现方式中，该电连接插座还包括：绝缘板；绝缘板设置于下表面的远离第一侧面的一端，绝缘板一端与下表面连接，另一端向远离下表面的方向延伸。绝缘板对于光模块的壳体和电连接插座的第一针脚具有一定的电气隔离的作用，能够缩短壳体与第一针脚抵抗浪涌所需的安全距离，避免第一针脚对壳体放电，有利于光模块和电连接 插座完成更紧凑的结构设计，实现小型化。
在一种可选择的实现方式中，电信号插槽包括相对设置的第一内表面和第二内表面；该电连接插座还包括：至少一个第二针脚；至少一个第二针脚的一端位于第一内表面，另一端从基体内部延伸至下表面；至少一个第三针脚；至少一个第三针脚的一端位于第二内表面，另一端从基体内部延伸至下表面。第二针脚和第三针脚在下表面可以通过表面安装技术SMT、波峰焊等焊接工艺安装在主板上，一方面起到固定电连接插座的作用，一方面将电信号耦合到电子设备的主板。
在一种可选择的实现方式中，至少一个第二针脚和至少一个第三针脚成对设置。
在一种可选择的实现方式中，任意一个第一针脚与任意一个第二针脚在下表面相隔的距离大于第一阈值；任意一个第一针脚与任意一个第三针脚在下表面相隔的距离大于第一阈值；任意一个第二针脚与任意一个第三针脚在下表面相隔的距离大于第一阈值。由此，各个针脚之间能够避免浪涌风险。
在一种可选择的实现方式中，任意两个第一针脚在上表面相隔的距离大于第二阈值；任意两个第一针脚在下表面相隔的距离大于第二阈值。由此，可以使两个第一针脚之间满足浪涌防护要求。
在一种可选择的实现方式中，电信号插槽为多源协议MSA金手指插槽。
第二方面，本申请提供了一种光模块，该光模块包括壳体；设置于壳体内的印刷电路板PCB，PCB设置有电信号端子，电信号端子与本申请第一方面及其各个实现方式提供的电连接插座的电信号插槽插装连接；设置于壳体内的至少两个导电端子，至少两个导电端子耦合有供电电压；至少两个导电端子面向电连接插座的上表面设置，至少两个导电端子与电连接插座的至少两个第一针脚一一对应电连接，以将供电电压耦合至电子设备。
本申请提供的光模块，不仅能够收发光/电信号，还能够将以太网供电的电能耦合至电子设备，为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。
在一种可选择的实现方式中，任意第一针脚与壳体之间的距离大于第三阈值。由此，防止第一针脚对壳体放电，避免浪涌风险。
在一种可选择的实现方式中，电信号端子为多源协议MSA金手指端子。
在一种可选择的实现方式中，光模块为带有SC型光纤接口或者LC型光纤接口的小型可插拔封装SFP光模块。
第三方面，本申请提供了一种光模块笼子，其特征在于，包括：笼子外壳，以及由笼子外壳围成的腔体；腔体用于容纳本申请第一方面及其各个实现方式提供的电连接插座和第二方面及其各个实现方式提供的光模块；笼子外壳一端设置有开孔，用于光模块和电连接插座连接后，从开孔插入腔体内，使电连接插座位于腔体的底部；其中，腔体在光模块和电连接插座插入方向上的深度与光模块和电连接插座连接后的长度相匹配。
本申请提供的光模块笼子，用于容纳本申请第一方面及其各个实现方式提供的电连接插座和第二方面及其各个实现方式提供的光模块，能够对电连接插座和光模块起到电气隔离作用。
附图说明
图1是一种电子设备的安装场景示意图；
图2是电子设备的一种本地供电的方案示意图；
图3是电子设备的一种远程供电的方案示意图；
图4是电子设备的一种远程供电的方案示意图；
图5是本申请实施例提供的光模块的结构示意图；
图6是本申请实施例提供的电连接插座的结构示意图；
图7是本申请实施例提供的光模块笼子的结构示意图；
图8是电连接插座和光模块笼子与电子设备的主板连接的示意图；
图9是本申请实施例示出的电连接插座的针脚定义示意图；
图10是本申请实施例示出的导电端子的其他实现方式的示意图；
图11是电连接插座的下表面示意图；
图12是本申请实施例提供电连接插座的D向视图；
图13是本申请实施例提供的带有RJ45接口的SPF封装电口模块的示意图；
图14是本申请实施例提供的电子设备的供电示意图。
具体实施方式
下面首先结合附图对本申请实施例的应用场景进行说明。
图1是一种电子设备的安装场景示意图。如图1所示，接入点设备(access point，AP)030、网络摄像头010、交通信号灯、微基站等电子设备可以安装在室内的天花板050、墙壁060，以及室外的建筑墙面、电线杆等位置。这些电子设备可以通过光纤、双绞线等方式与远端的其他网络设备建立网络连接，例如：接入点设备连接至远端的交换机设备040，网络摄像头连接到远端的存储设备020、交通信号等连接到远端的控制设备等。
除网络连接以外，电子设备还需要供电设备进行供电才能正常工作。
当电子设备的附近配备有供电设备时，电子设备例如可以采用如图2示出的方案进行供电。如图2所示，本地配备的供电设备耦合至高压电缆进行取电，高压电缆例如携带电压为220V(伏特)的交流电，供电设备可以将交流电转换成例如直流48V、直流12V、直流9V或直流5V等电子设备常用的直流输入电压，并将直流输入电压通过供电电缆输送到电子设备的电压处理单元，电压处理单元用于将直流输入电压进一步处理为电子设备中的各个电子元件所需的工作电压。另外，电子设备还包括有用于实现网络连接的网络模块，例如光模块(optical module)，光模块可以与光纤对接，用于完成光信号和电信号之间的相互转换，使电子设备可以与其他网络设备进行网络通信。
然而，在图1所示的场景中，电子设备安装的墙壁、天花板、建筑墙面、电线杆等位置附近通常没有供电设备，因此电子设备无法采用如图2所示的方式进行供电。
当电子设备的附近没有配备供电设备时，电子设备例如可以采用图3所示的方案进行供电。如图3所示，长距离的供电电缆与电子设备的电压处理单元耦合，将远端的供电电压(例如220V交流电压)引入到电压处理单元；电压处理单元用于将交流电压转换成电子设备中的各个电子元件所需的工作电压。另外，电子设备还包括有用于实现网络连接的网络模块，例如光模块(optical module)，使电子设备可以与其他网络设备进行网络通信。图3所示方案要求电子设备具备将交流电(AC)转换成直流电(DC)的能力，因此需要在电子设备内增加AC/DC转换电路和相关结构，会增大电子设备的体积，不利于电子设备的小型化，在接入点设备、网络摄像头等体积较小的设备中无法实施。
当电子设备的附近没有配备供电设备时，电子设备例如还可以采用以太网供电(power over ethernet，PoE)方案进行供电，以太网供电是一种可以在以太网中透过双绞线来传输电力到电子设备上的技术。如图4所示，以太网供电使用的网络和电力传输介质可以是光电混合缆。光电混合缆由集成的光纤和电缆组成，光纤用于承载光信号，电缆用于承载供电电压，光电混合缆被拉远至电子设备附近之后，会被拆分成独立走线的光纤和电缆，光纤末端设置有光纤连接器，电缆末端设置有以太网连接器。与光纤和电缆相对应地，电子设备插装有光模块，用于与光纤连接器对接，完成光信号和电信号之间的相互转换，使电子设备可以与其他网络设备进行网络通信；电子设备还设置有独立的POE接口，该POE接口用于与以太网连接器对接。POE接口在电子设备内部连接至电压处理单元，能够将供电电压耦合至电压处理单元，电压处理单元用于将供电电压转换成电子设备中的各个电子元件所需的工作电压。可以理解的是，由于图4所示的方案需要在电子设备设置独立的POE接口，会增加电子设备的结构复杂程度，增大电子设备的体积。
为了解决上述问题，本申请提供了一种光模块，该光模块例如可以是小型可插拔封装(enhanced small form-factor pluggable，SPF或SPF+)光模块、小型封装(small form factor，SFF)光模块10G小型封装(10gigabit small form factor pluggable，XFP)光模块、10G小型封装(centum form factor pluggable module，CFP)光模块和高速以太网接口转换器(gigabit interface converter，GBIC)模块等。
图5是本申请实施例提供的光模块的结构示意图。如图5所示，该光模块包括壳体100，壳体100一端设置有用于与光纤连接器200对接的光纤接口120。根据光纤连接器200的规格不同，光纤接口120可以被相应地设计成不同的规格。例如：当光纤连接器200是SC型光纤连接器(subscriber connector/standard connector)时，光纤接口120可以是SC型光纤接口；当光纤连接器200时LC型光纤连接器(lucent connector/local connector)时，光纤接口120可以是LC型光纤接口。
在一个实现方式中，壳体100可以被设计为长方体结构或其他结构。壳体100可以使用铜、铝、钢等金属材质制成，使其具备屏蔽电磁辐射的能力。
进一步如图5所示，光模块的壳体100内还设置有光电处理模块130，光电处理模块130包括印刷电路板PCB 131和光电转换器132。其中，光电转换器132设置于PCB 131的靠近光纤接口120的一端，与PCB 131耦合。光电转换器132设置有光接头133，光接头133一端远离PCB 131向光纤接口120方向延伸。当光纤连接器200插入到光纤接口120内时，光纤连接器200的光纤插芯210能够与光接头133对接，以传输光信号。PCB 131的远离光纤接口120的一端设置有电信号端子134，光电转换器132用于将光信号转换成电信号并输出到电信号端子134。
本申请实施例中，光模块的光纤接口120还可以作为POE接口使用，能够从光纤连接器200接入光电混合缆220中的供电电压，并将供电电压耦合至电子设备。为了达到上述目的，如图5所示，光模块的光纤接口120内设置有至少两个导电端子135，例如：导电端子PIN 1+和PIN 1-，上述至少两个导电端子135面向光纤连接器200设置；光模块的电信号端子134所在的区域设置有至少两个导电端子136，例如：导电端子PIN 2+和PIN 2-，上述至少两个导电端子136面向电信号端子134设置；其中，光纤接口120内的至少两个导电端子135与电信号端子134侧的至少两个导电端子136一一对应电连接。
示例地，如图5所示，光纤接口120内的导电端子PIN 1+与电信号端子134侧的导电端子PIN 2+可以通过电缆L1连接，光纤接口120内的导电端子PIN 1-与电信号端子134侧的导电端子PIN 2-可以通过电缆L2连接。可以理解的是，导电端子PIN 1+、PIN 1-和导电端子PIN 2+、PIN 2-还可以通过额外设置的PCB连接，或者通过其他的方式连接，本申请实施例对导电端子的连接方式不做具体限定。
本申请实施例中，光纤连接器200还可以作为以太网供电的连接器使用。如图5所示，光纤连接器200设置有至少两个供电端子，例如供电端子V+和V-，上述至少两个供电端子设置于光纤连接器200的面向导电端子PIN 1+和PIN 1-的侧表面。其中，供电端子V+与光电混合缆220的正极电缆连接，供电端子V-与光电混合缆220的负极电缆连接，光电混合缆220的正极电缆和负极电缆连接至远端供电设备的正极和负极，因此，供电端子V+和V-耦合有供电电压。当光纤连接器200插入到光纤接口120时，供电端子V+与导电端子PIN 1+连接形成通路，供电端子V-与导电端子PIN 1-连接形成通路，将供电电压耦合到另一端的导电端子PIN 2+和PIN 2-。
本申请实施例中，电信号端子134中的电信号，以及导电端子PIN 2+和PIN 2-中的供电电压最终耦合至电子设备，例如：接入点设备(access point，AP)、网络摄像头等，使电子设备能够与其他网络设备建立网络通信，还能够获得设备运行所需的电能。为达到上述目的，如图5所示，本申请实施例的光模块还包括电连接插座300，该电连接插座300用于与光模块的电信号端子134和导电端子PIN 2+、PIN 2-对接。该电连接插座300可以与光模块的其他部件实现可插拔设计，也可以与光模块的其他部件设计成一体结构。
一般来说，电连接插座300具备与电信号端子134相匹配的电信号插槽314，电信号插槽314能够与电信号端子134插接连接，以传输电信号。根据电信号端子134的型号不同，电连接插座300可以具备不同的电信号插槽314，例如：当电信号端子134是多源协议(multi-source agreement，MSA)金手指端子时，电信号插槽314可以是MSA金手指插槽。在一些命名方式中，电连接插座300还可以被称作socket，例如：SPF socket等。
图6是本申请实施例提供的电连接插座的结构示意图。如图6所示，电连接插座300包括绝缘的基体310，该绝缘基体310包括上表面311和下表面312，以及与上表面311和下表面312连接的第一侧面313。其中，第一侧面313设置有电信号插槽314，例如SPF金手指插槽，该电信号插槽314用于与光模块的电信号端子134耦合。
本申请实施例中，基体310可以使用橡胶、树脂或者其他具备绝缘特性的一种或者多种材料制成。基体310的上表面311和下表面312可以相互平行设置，使得电连接插座300能够从光模块的壳体100一端顺利插入到壳体100内，或者从壳体100内顺利拔出，实现热拔插。
进一步如图6所示，电连接插座300还包括至少两个第一针脚315。其中，上述至少两个第一针脚315的一端位于基体310的上表面311，当电连接插座300的电信号插槽314与电信号端子134插接连接时，基体310的上表面311面向光模块的至少两个导电端子136，使电连接插座300的至少两个第一针脚315与光模块的至少两个导电端子136一一对应连接。示例地，当光模块包括导电端子PIN 2+和PIN 2-时，基体310的上表面311相应的包括第一针脚POW+和POW-，其中，导电端子PIN 2+用于与第一针脚POW+连接，导电端子PIN 2-用于与第一针脚POW-连接。
本申请实施例还提供了一种光模块笼子，即cage，例如SPF cage等。图7是本申请实施例提供的光模块笼子的结构示意图。如图7所示，光模块笼子500包括：笼子外壳510，以及由笼子外壳510围成的腔体520；腔体520用于容纳本申请实施例提供的电连接插座300和光模块600。笼子外壳510一端设置有开孔530，光模块600和电连接插座300通过电信号端子和电信号插槽插接连接后，可以从开孔530插入腔体520内，使电连接插座300深入到腔体520的底部。本申请实施例提供的光模块笼子500，用于容纳本申请实施例提供的电连接插座30和光模块600，能够对电连接插座300和光模块600起到电气隔离作用。
进一步地，考虑到本申请实施例的电连接插座300在添加了第一针脚315之后，长度会有所增加，为了使光模块笼子500能够容纳电连接插座300和光模块600，起到有效的电气隔离作用，光模块笼子500的腔体520深度也可以相应地增加，使得光模块笼子500的腔体520在光模块600和电连接插座300插入方向上的深度与光模块600和电连接插座300连接后的长度相匹配。
图8是电连接插座和光模块笼子与电子设备的主板连接的示意图。如图8所示，笼子外壳510通过压接或者焊接的方式安装在电子设备的主板400之上，其中，电连接插座的基体310的下表面312面向主板400设置。电连接插座的至少两个第一针脚315的另一端从基体310内部一直延伸到基体310的下表面312，并通过表面安装技术(surface mounted technology，SMT)、波峰焊等焊接工艺安装在主板400上，一方面起到固定电连接插座的作用，一方面将供电电压耦合到主板400。
进一步如图8所示，电信号插槽314包括相对设置的第一内表面321和第二内表面322。其中，第一内表面321可以设置有至少一个第二针脚316，上述至少一个第二针脚316的一端裸露于第一内表面321，另一端从基体310内部延伸至基体310的下表面312，并通过表面安装技术SMT、波峰焊等焊接工艺安装在主板400上，一方面起到固定电连接插座的作用，一方面将电信号耦合到主板400。另外，第二内表面322可以设置有至少一个第三针脚317，上述至少一个第三针脚317的一端裸露于第一内表面321，另一端从基体310内部延伸到基体310的下表面312，并通过表面安装技术SMT、波峰焊等焊接工艺安装在主板400上，一方面起到固定电连接插座300的作用，一方面将电信号耦合到主板400。
进一步图8所示，电连接插座的下表面312还设置有绝缘板318，绝缘板318位于下表面312的远离第一侧面313的一端。绝缘板318的一端与下表面312连接，另一端向远离下表面312的方向延伸，并且插入到主板400内。绝缘板318可以是用塑胶、树脂等绝缘材料制成，绝缘板318对于笼子外壳510和第一针脚315具有一定的电气隔离的作用，能够缩短笼子外壳510与第一针脚315抵抗浪涌所需的安全距离，避免第一针脚315对笼子外壳510放电，有利于光模块和电连接插座完成更紧凑的结构设计，实现小型化。
进一步如图8所示，电连接插座300的下表面312还设置有至少一个定位销319，该定位销319可以插入到主板400上预设的定位孔中，形成孔轴配合，以达到固定电连接插座的目的。
进一步如图8所示，第一针脚315与笼子外壳510沿着电连接插座的插入的D方向的距离D4大于第三阈值，以防止第一针脚315对笼子外壳510放电，避免浪涌风险。示例地，第三阈值例如可以取值为3.5mm，可以使第一针脚315和笼子外壳510之间满足共模4KV(千伏)的浪涌防护要求。
需要补充说明的是，上述至少一个第二针脚316和至少一个第三针脚317的数量和布置方式可以根据电信号端子134和电信号插槽314使用的协议确定。例如，在MSA协议中，针脚的总数量为20个，其中，第二针脚316有10个，第三针脚317有10个，并且上述10个第二针脚316和10个第三针脚317成对设置。当第二针脚316和第三针脚317遵循MSA协议，并且如图7所示的电连接插座300还包括第一针脚POW+和POW-时，电连接插座300总共包含22个针脚，其针脚的功能定义可以如图9和表1所示：
针脚序号(PinNum.) 名称 功能
1 VeeT 发射器接地
2 TxFault 发射器故障指示
3 TxDisable 发射器禁用指示
4 SDA 通信串行数据线
5 SCL 通信串行时钟线
6 VeeR 接收器接地
7 Dyinggasp Dyinggasp功能
8 LOS LOSS信号
9 VeeR 接收器接地
10 VeeR 接收器接地
11 VeeR 接收器接地
12 RX- 差分接收(-)
13 RX+ 差分接收(+)
14 VeeR 接收器接地
15 VCCR 接收器供电
16 VCCT 发射器供电
17 VeeT 发射器接地
18 TX+ 差分发送(+)
19 TX- 差分发送(-)
20 VeeT 发射器接地
21 POW+ 供电正极
22 POW- 供电负极
表1针脚功能定义
需要补充说明的是，本申请实施例提供的电连接插座300的针脚功能定义仅作为一种示例，用于说明电连接插座300可以同时传输电信号和供电电压的可行性，不够成对针脚功能定义的具体限定。在一些其他的设计中，电连接插座300的部分或者全部针脚可以具有其他的定义，例如：针脚21可以定义为POW-(供电负极)，针脚22可以定义为POW+(供电正极)，这些设计都没有超出本申请实施例的保护范围。
在一些实施例中，光纤接口120内的导电端子135的数量和电信号端子134侧的导电端子136的数量均可以大于两个。如图10所示，光纤接口120内包括PIN 11+端子、PIN 11-端子、PIN 12+端子和PIN 12-端子；电信号端子134侧包括：PIN 21+端子、PIN 21-端子、PIN 22+端子和PIN 22-端子。其中，在光纤接口120内，PIN 11+端子和PIN 12+端子可 以与光纤连接器200的供电端子V+对接，PIN 11-端子和PIN 12-端子可以与光纤连接器200的供电端子V-对接。在光模块内部，PIN 11+端子与PIN 21+端子电连接，PIN 11-端子与PIN 21-端子电连接，PIN 12+端子与PIN 22+端子电连接，PIN 12-端子与PIN 22-端子电连接。相应地，电连接插座300的上表面311可以包括两个第一针脚POW+和两个第一针脚POW-，其中一个第一针脚POW+与PIN 21+端子连接，另一个第一针脚POW+与PIN 22+端子连接，其中一个第一针脚POW-与PIN 21-端子连接，另一个第一针脚POW-与PIN 22-端子连接，形成双路供电输出。对于第一针脚315可实现的其他数量，本申请实施例中不再赘述，本领域技术人员在本申请实施例的技术构思和技术启示之下，可以根据实际需求合理设计第一针脚315的数量及其对应的连接方式，这些设计都没有超出本申请实施例的保护范围。
图11是电连接插座的下表面示意图。图11示出了垂直于电信号端子134插入方向的C向，以及平行于电信号端子134插入方向的D向。如图11所示，至少两个第一针脚315沿C向并列设置，至少一个第二针脚316沿C向并列设置，至少一个第三针脚317沿C向并列设置；并且，至少一个第三针脚317、至少一个第二针脚316和至少两个第一针脚315沿D向依次分布。其中，任意一个第一针脚315与任意一个第二针脚316在下表面312相隔的距离D1大于第一阈值，使得第一针脚315和第二针脚316之间不会造成电磁干扰，避免浪涌风险；任意一个第一针脚315与任意一个第三针脚317在下表面312相隔的距离D3大于第一阈值，使得第一针脚315和第三针脚317之间不会造成电磁干扰，避免浪涌风险；任意一个第二针脚316与任意一个第三针脚317在下表面312相隔的距离D2大于第一阈值，使得第二针脚316和第三针脚317之间不会造成电磁干扰，避免浪涌风险。示例地，第一阈值例如可以取值为3.5mm，可以使第一针脚315、第二针脚316和/或第三针脚317之间满足共模4KV(千伏)的浪涌防护要求。
进一步如图11所示，为了避免相邻的两个第一针脚315之间相互放电而产生浪涌风险，任意两个第一针脚315在下表面312相隔的距离D5大于第二阈值。示例地，第二阈值例如可以取值为3.5mm，可以使两个第一针脚315之间满足共模4KV(千伏)的浪涌防护要求。
图12是本申请实施例提供的电连接插座安装于光模块之后的D向视图。如图12所示，任意两个第一针脚315在上表面311相隔的距离D5大于第二阈值，以满足浪涌防护要求；任意第一针脚315沿C向与壳体100之间的距离D6大于第三阈值，以防止第一针脚315对壳体100放电，避免浪涌风险。示例地，第三阈值例如可以取值为3.5mm，可以使第一针脚315和壳体100之间满足共模4KV(千伏)的浪涌防护要求。
需要补充说明的是，本申请实施例提供的电连接插座300与现有标准的电连接插座(例如SPF socket)相比，第一侧面313的宽度和高度未发生改变，因此，能够适配现有标准的光模块笼子(例如SPF cage)，不会与常规的光模块笼子产生干涉。另外，本申请实施例提供的电连接插座300的电信号插槽314不改变现有标准或协议(例如MSA协议)定义的金手指针脚功能定义和尺寸布局，因此可以与现有的光模块的电信号端子混插，具有广泛的兼容性。
可以理解的是，本申请实施例提供的电连接插座300还可以应用到其他接口模块中，例如：带有RJ45接口的SPF封装电口模块。图13是本申请实施例提供的带有RJ45接口 的SPF封装电口模块的示意图。如图13所示，该电口模块一端包括RJ45接口710，另一端包括遵循MSA协议的电信号端子134。其中，该电接口模块的RJ45接口710还可以设置有导电端子PIN 1+和PIN 1-，电信号端子134一侧还可以设置有导电端子PIN 2+和PIN 2-，导电端子PIN 1+与PIN 2+电连接，导电端子PIN 1-与PIN 2-电连接。与RJ45接口710的导电端子PIN 1+和PIN 1-相匹配地，本申请实施例还提供了一种带有供电端子V+和V-的RJ45水晶头720，该供电端子V+和V-可以与一对耦合至供电电压的以太网双绞线连接，当RJ45水晶头720插入到RJ45接口710内时，供电端子V+连接至导电端子PIN 1+，供电端子V-连接至导电端子PIN 1-。在电口模块的另一端，当电信号端子134与本申请实施例提供的电连接插座的电信号插槽314插接时，导电端子PIN 2+连接至电连接插座的第一针脚POW+，导电端子PIN-连接至电连接插座的第一针脚POW-，由此将供电电压耦合至与电连接插座连接的电子设备主板。
由以上技术方案可知，本申请实施例提供的电连接插座，可以应用于各类接口模块，例如光模块、电口模块等，用于支持接口模块在具备原有的信号传输功能的同时，利用以太网供电技术为电子设备供电，使电子设备不需要额外设置POE接口，有利于减小电子设备的体积。并且，本申请实施例提供的电连接插座的电信号插槽不改变现有标准或协议(例如MSA协议)定义的金手指针脚功能定义和尺寸布局，因此可以与现有的接口模块的电信号端子混插，具有广泛的兼容性。
图14是本申请实施例提供的电子设备的供电示意图。如图14所示，该电子设备包括电压处理单元和本申请实施例提供的光电连接装置。光电连接装置用于与光电混合缆连接，一方面通过光电混合缆中的光纤收发光信号，另一方面将光电混合缆中的供电电压耦合至电压处理单元。电压处理单元用于将供电电压转换成电子设备中的各个电子元件所需的工作电压。由此，电子设备不需要设置独立的POE端口，仅通过光电连接装置就能够同时实现光信号的传输和供电电压的引入，简化了电子设备的结构设计，有利于减小电子设备的体积。
以上的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本发明的保护范围之内。

Claims (12)

  1. 一种电连接插座，其特征在于，包括：
    绝缘的基体；所述基体包括上表面和下表面，以及与所述上表面和所述下表面连接的第一侧面，所述第一侧面设置有电信号插槽，所述电信号插槽用于与光模块的电信号端子耦合；
    至少两个第一针脚；所述至少两个第一针脚的一端位于所述上表面，另一端从所述基体内部延伸至所述下表面，所述至少两个第一针脚用于耦合至电子设备。
  2. 根据权利要求1所述的电连接插座，其特征在于，还包括：
    绝缘板；所述绝缘板设置于所述下表面的远离所述第一侧面的一端，所述绝缘板一端与所述下表面连接，另一端向远离所述下表面的方向延伸。
  3. 根据权利要求1所述的电连接插座，其特征在于，所述电信号插槽包括相对设置的第一内表面和第二内表面；所述电连接插座还包括：
    至少一个第二针脚；所述至少一个第二针脚的一端位于所述第一内表面，另一端从所述基体内部延伸至所述下表面；
    至少一个第三针脚；所述至少一个第三针脚的一端位于所述第二内表面，另一端从所述基体内部延伸至所述下表面。
  4. 根据权利要求3所述的电连接插座，其特征在于，所述至少一个第二针脚和所述至少一个第三针脚成对设置。
  5. 根据权利要求3或4所述的电连接插座，其特征在于，
    任意一个所述第一针脚与任意一个所述第二针脚在所述下表面相隔的距离大于第一阈值；任意一个所述第一针脚与任意一个所述第三针脚在所述下表面相隔的距离大于第一阈值；任意一个所述第二针脚与任意一个所述第三针脚在所述下表面相隔的距离大于第一阈值。
  6. 根据权利要求1所述的电连接插座，其特征在于，任意两个所述第一针脚在所述上表面相隔的距离大于第二阈值；任意两个所述第一针脚在所述下表面相隔的距离大于第二阈值。
  7. 根据权利要求1-6任一项所述的电连接插座，其特征在于，所述电信号插槽为多源协议MSA金手指插槽。
  8. 一种光模块，其特征在于，包括：壳体；
    设置于所述壳体内的印刷电路板PCB，所述PCB设置有电信号端子，所述电信号端子用于与权利要求1-7任一项所述的电连接插座的电信号插槽插装连接；
    至少两个导电端子，所述至少两个导电端子耦合有供电电压；
    所述至少两个导电端子面向所述电连接插座的上表面设置，所述至少两个导电端子与所述电连接插座的至少两个第一针脚一一对应电连接，以将所述供电电压耦合至电子设备。
  9. 根据权利要求8所述的光模块，其特征在于，任意所述第一针脚与所述壳体之间的距离大于第三阈值。
  10. 根据权利要求8所述的光模块，其特征在于，所述电信号端子为多源协议MSA金手指端子。
  11. 根据权利要求8所述的光模块，其特征在于，所述光模块为带有SC型光纤接口 或者LC型光纤接口的小型可插拔封装SFP光模块。
  12. 一种光模块笼子，其特征在于，包括：笼子外壳，以及由笼子外壳围成的腔体；
    所述腔体用于容纳权利要求8所述的光模块和电连接插座；
    所述笼子外壳一端设置有开孔，用于所述光模块和所述电连接插座连接后，从所述开孔插入所述腔体内，使所述电连接插座位于所述腔体的底部；
    其中，所述腔体在所述光模块和所述电连接插座插入方向上的深度与所述光模块和所述电连接插座连接后的长度相匹配。
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