WO2021109693A1 - 一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置 - Google Patents

一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置 Download PDF

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WO2021109693A1
WO2021109693A1 PCT/CN2020/117980 CN2020117980W WO2021109693A1 WO 2021109693 A1 WO2021109693 A1 WO 2021109693A1 CN 2020117980 W CN2020117980 W CN 2020117980W WO 2021109693 A1 WO2021109693 A1 WO 2021109693A1
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coagulation
pipeline
silicon wafer
wax nozzle
wax
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PCT/CN2020/117980
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English (en)
French (fr)
Inventor
吴泓明
党国洋
钟佑生
陈志刚
周军磊
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郑州合晶硅材料有限公司
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Publication of WO2021109693A1 publication Critical patent/WO2021109693A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • the application belongs to the technical field of semiconductor processing equipment, and specifically relates to a wax nozzle moisturizing device for polishing equipment in the polishing process of silicon wafers.
  • polishing silicon wafers is an indispensable processing step for subsequent processing and production.
  • One of the main purposes of silicon wafer polishing is to make the surface of the silicon wafer flat enough, so the flatness after polishing is one of the main indicators of silicon wafer polishing processing.
  • the commonly used silicon wafer fixing methods include mechanical clamping, paraffin bonding, and hydraulic adsorption.
  • the mechanical clamping is due to the inevitable potential deformation and damage to the silicon wafer, so the application range is relatively limited, while the hydraulic adsorption is due to Due to its production cost, complexity and other reasons, the scope of application is also relatively limited, and the paraffin bonding method is currently the most commonly used method for fixing silicon wafers due to its convenience and other reasons.
  • the main process is: first place the silicon wafer at the specified position on the fixture, and then infiltrate the molten paraffin between the silicon wafer and the fixture (only for supply without silicon The necessary amount of floating of the wafer), and then pressurize the workpiece, so that the paraffin will smoothly bond and fix the silicon wafer on the ceramic disc, and then polish the front surface of the silicon wafer with polishing equipment.
  • the polishing equipment will have different downtimes. If the downtime is too long, the temperature of the production environment is low, and the wax nozzles sprayed with paraffin will be unavailable. The paraffin solidification phenomenon is avoided.
  • the wax nozzle device can be improved to a certain extent, it will have better application significance for ensuring the stability of subsequent silicon wafer processing and the quality of the silicon wafer.
  • the purpose of this application is to provide a wax nozzle moisturizing device for polishing equipment in the polishing process of silicon wafers, which can lay a certain technical foundation for the stable quality of polishing processing of silicon wafers.
  • a wax nozzle moisturizing device for polishing equipment in a silicon wafer polishing process comprising: an anti-coagulation pipeline connected with an anti-coagulation liquid container, and a fixing bracket for fixing the anti-coagulation pipeline;
  • the anticoagulant liquid is used to prevent the solidification of an adhesive such as wax (more specifically, paraffin wax), and the main component is generally composed of NH 4 OH, H 2 O 2 and the like;
  • the anti-coagulant liquid container is used to contain the anti-coagulant liquid flowing out of the anti-coagulation pipeline at the connection with the wax nozzle of the polishing equipment; in a preferred design, the container is provided with an absorbent material (The absorbent material is sponge, for example, by contacting the absorbent material with the wax nozzle, on the one hand, the amount of anticoagulant liquid in the anticoagulant wax nozzle can be reduced, and on the other hand, it can avoid the overflow of anticoagulant liquid and the pollution of the working environment;
  • One end of the anti-coagulation pipeline is connected with the wax nozzle of the polishing equipment, and the other end is connected with the anti-coagulation liquid delivery pipeline to transmit the anti-coagulation liquid; in actual design, the anti-coagulation pipeline adopts 1/4 PFA material pipeline In the preferred design, a 1/4 ball valve is designed on the anti-coagulation pipeline to control the flow of the anti-coagulation liquid;
  • the polishing equipment is generally a single-sided polishing equipment
  • the fixing bracket includes three parts: a vertical fixing base, a horizontal fixing bracket and a coagulation prevention tube fixing frame;
  • the vertical fixed base is an "L"-shaped structure, which is used to fix the device on the table as a whole.
  • the vertical fixed base is fixed to the horizontal plate on the table, and
  • the vertical plates used to fix the horizontal fixing brackets are all designed with a "U"-shaped groove structure, so as to facilitate the adjustment of the fixed position;
  • the horizontal fixed bracket is an "L"-shaped structure connected at right angles to the vertical fixed base.
  • the vertical arm and the vertical fixed base are detachably connected (for example, realized by bolts), and the horizontal arm is connected to the anti-coagulation tube
  • the fixing frame is a detachable connection (for example, realized by bolts); in the preferred design, the cross arm also adopts a "U"-shaped groove structure design, so that the distance between the anti-coagulation tube and the polishing equipment can be adjusted in the transverse direction;
  • the anti-coagulation tube fixing frame is an "L"-shaped structure connected at right angles to the horizontal fixing bracket.
  • the vertical panel is fixed with the anti-coagulation pipeline. (Achieved by bolts);
  • the transverse panel also adopts the "U"-shaped groove structure design, so as to facilitate the adjustment of the distance between the anti-coagulation pipeline and the wax nozzle of the polishing equipment in different dimensions.
  • the wax tip moisturizing device designed in this application has a simple structure and easy to use. On the one hand, it better achieves the goal of moisturizing the wax tip and improves the phenomenon of solidification and clogging of the wax tip nozzle caused by a long-term shutdown. On the other hand, It has good practical value for ensuring the uniformity of wax coating during the polishing process of the silicon wafer and improving the polishing yield. In addition, the device provided by the present application has relatively low preparation cost and is easy to maintain, so it has good promotion and application significance.
  • Figure 1 is a schematic diagram of the structure of the wax nozzle moisturizing device provided by the application.
  • the wax nozzle moisturizing device for polishing equipment provided in this application during the polishing process of silicon wafers includes: anti-coagulation pipeline 8 connected with an anti-coagulation liquid container, and a fixed anti-coagulation pipeline Bracket.
  • the anticoagulant liquid is used to prevent the solidification of an adhesive such as wax (more specifically, paraffin wax), and its composition generally consists of NH 4 OH, H 2 O 2 and the like.
  • the anticoagulant liquid container (not shown in the figure) is used to contain the anticoagulant liquid flowing out of the anticoagulant pipeline 8 at the wax nozzle connection 6 of the polishing equipment; in actual design, the container is equipped with
  • the absorbent material adsorbent material such as sponge
  • the absorbent material that absorbs the anticoagulant liquid, through the contact of the adsorbent material with the wax nozzle, on the one hand, can reduce the amount of anticoagulant in the anticoagulant wax nozzle, on the other hand, it can avoid the overflow of the anticoagulant and the effect of the anticoagulant. Pollution of the working environment.
  • One end of the anticoagulant pipeline 8 is connected with the wax nozzle of the polishing equipment (that is, the place marked 6 in the figure is in direct contact with the wax nozzle), and the other end is connected with the anticoagulant liquid delivery pipeline (not shown in the figure) for Transmission of anti-coagulation liquid;
  • the anti-coagulation pipeline adopts 1/4 PFA material pipeline;
  • the anti-coagulation pipeline is designed with a 1/4 ball valve for controlling the flow of anti-coagulation liquid;
  • the polishing equipment is generally a single-sided polishing equipment.
  • the fixing bracket includes three parts: a vertical fixing base 2, a horizontal fixing bracket 3, and a anti-coagulation tube fixing frame 5;
  • the vertical fixed base 2 is an "L"-shaped structure, which is used to fix the device on the table as a whole, and in order to facilitate movement and adjustment, in the preferred design, it is used to fix the vertical fixed base on the horizontal plate 1 on the table.
  • the vertical plate used to fix the horizontal fixed bracket are designed with a "U"-shaped groove structure, so as to facilitate the adjustment of the fixed position;
  • the horizontal fixing bracket 3 is an "L"-shaped structure connected at right angles to the vertical fixing base.
  • the vertical arm and the vertical fixing base are detachably connected (for example, realized by bolts), and the horizontal arm 9 is connected to the resistance.
  • the condensation tube holder is a detachable connection (for example, realized by bolts); in the preferred design, the cross arm 9 also adopts a "U"-shaped groove structure design, so that the distance between the condensation resistance tube and the polishing equipment can be realized in the transverse direction. Adjustment;
  • the anti-coagulation tube fixing frame 5 is an "L"-shaped structure connected at right angles to the horizontal fixing bracket, and the anti-coagulation pipeline is fixed on the vertical panel 7 (it needs to be explained that the figure shows an additional
  • the vertical panel is designed to further realize the vertical displacement adjustment.
  • the anti-coagulation tube can also be directly fixed on the vertical panel), and the horizontal panel 4 is detachably connected with the horizontal fixing bracket (for example, it can be realized by bolts); in the preferred design, the transverse panel also adopts the "U"-shaped groove structure design, so as to facilitate the adjustment of the distance between the anti-coagulation pipeline and the wax nozzle of the polishing equipment in different directions.
  • the wax mouth moisturizing device provided by this application can realize the displacement adjustment of multiple angles such as horizontal, vertical, inside and outside, so as to adapt to different working environments and meet the needs of wax mouth moisturizing. Good practical value.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置。该装置包括：连接有阻凝液盛放容器的阻凝管路（8）、以及固定阻凝管路的固定支架；所述阻凝液盛放容器，用于盛放阻凝管路与抛光设备的蜡嘴接触处（6）阻凝管路所流出的阻凝液；所述阻凝管路，一端与抛光设备的蜡嘴连接，另外一端与阻凝液输送管路连接；所述固定支架，包括：竖向固定底座（2）、横向固定支架（3）和阻凝管固定架（5）三个部分。该蜡嘴保湿装置较好实现了蜡嘴保湿的目标，改善了长时间停机所造成蜡嘴管口凝固、堵塞等现象；对于确保硅片抛光加工过程中涂蜡均匀性、提高抛光良率具有较好的实用价值。

Description

一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置 技术领域
本申请属于半导体加工设备技术领域，具体涉及一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置。
背景技术
作为半导体加工基础生产原料，对硅片进行抛光处理是进行后续加工生产必不可少的加工步骤。硅片抛光主要目的之一在于使硅片表面足够平整，因此抛光后平坦度是硅片抛光加工处理的主要指标之一。
现有技术中，对硅片进行抛光加工处理时，需要先将硅片进行固定，然后再利用抛光设备进行抛光加工。而常用硅片固定方式有机械夹持式、石蜡粘接式、水力吸附式等方式，其中机械夹持式因对硅片不可避免的潜在变形损害，因此应用范围较为有限，而水力吸附式因其生产成本、复杂度等原因，应用范围也较为有限，而石蜡粘接式因其便捷性等原因，是目前应用最为普遍的硅片固定方式。
利用石蜡粘接式对硅片进行抛光加工时，其主要过程为：先将硅片放置在夹具上的规定位置，然后将将熔化的石蜡渗入到硅片与夹具之间(仅供给不使硅片浮起的必要量)，然后在工件上进行加压，使石蜡将硅片平整的粘接固定在陶瓷盘上，进而利用抛光设备对硅片正面进行抛光。但实际加工应用过程中，由于检修、维护、更换等各种原因，抛光设备会存在不同的停机时间，而如果停机过久时，受生产环境温度较低影响，喷涂石蜡的蜡嘴处会不可避免的出现石蜡凝固现象，因此，需要频繁清洗蜡嘴处所凝固石蜡，否则极易造成涂蜡不均，进而造成粘接不牢、或者硅片抛光时平坦度的降低，最终影响生产产能及产品良率。也因此，如果能对蜡嘴装置进行一定改进，对于确保后续硅片加工的稳定性和硅片质量具有较好的应用意义。
发明内容
本申请目的在于提供一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置，可为硅片抛光加工质量稳定奠定一定技术基础。
本申请所采取的技术方案详述如下。
一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置，包括：连接有阻凝液盛放容器的阻凝管路、以及固定阻凝管路的固定支架；
所述阻凝液，用来阻止粘接剂例如蜡(更具体例如为石蜡)的凝固，主要成分一般由NH 4OH、H 2O 2等组成；
所述阻凝液盛放容器，用于盛放与抛光设备的蜡嘴连接处阻凝管路所流出的阻凝液；优选设计中，盛放容器内设有吸附阻凝液的吸附材料(吸附材料例如为 海绵)，通过吸附材料与蜡嘴接触，一方面可以减少阻凝蜡嘴时阻凝液用量，另一方面可以避免阻凝液的外溢和对作业环境的污染；
所述阻凝管路，一端与抛光设备的蜡嘴连接，另外一端与阻凝液输送管路连接，用来传输阻凝液；实际设计中，阻凝管路采用1/4 PFA材质管路；优选设计中，阻凝管路上设计有用于控制阻凝液流量的1/4球阀；
所述抛光设备一般为单面抛光设备；
所述固定支架，包括：竖向固定底座、横向固定支架和阻凝管固定架三个部分；
其中竖向固定底座为一“L”型结构，用于将装置整体固定在台面上，而为便于移动和调整，优选设计中，用于将竖向固定底座固定在台面上的横板、以及用于固定横向固定支架的的竖板上均采用“U”形槽式结构设计，从而便于调整固定位置；
横向固定支架，为一与竖向固定底座呈直角连接关系的“L”形结构，其竖臂与竖向固定底座为可拆卸式连接(例如通过螺栓来实现)，其横臂与阻凝管固定架为可拆卸式连接(例如通过螺栓来实现)；优选设计中，横臂同样采用“U”形槽式结构设计，从而可以在横向方向实现阻凝管与抛光设备间距离的调整；
阻凝管固定架，为一与横向固定支架呈直角连接关系的“L”形结构，其竖直面板上固定有阻凝管路，其横向面板上与横向固定支架为可拆卸式连接(例如通过螺栓来实现)；优选设计中，横向面板同样采用“U”形槽式结构设计，从而便于调节阻凝管路在不同维度方向与抛光设备蜡嘴距离的调节。
本申请所设计的蜡嘴保湿装置，其结构简洁、使用方便，一方面较好实现了蜡嘴保湿的目标，改善了长时间停机所造成蜡嘴管口凝固、堵塞等现象，另一方面，对于确保硅片抛光加工过程中涂蜡均匀性、提高抛光良率具有较好的实用价值，加上本申请所提供装置制备成本较为低廉，便于维护，因而具有较好的推广应用意义。
附图说明
图1为本申请所提供蜡嘴保湿装置结构示意图。
具体实施方式
下面结合实施例对本申请做进一步的解释说明。
实施例
如图1所示，本申请所提供的硅片抛光加工过程中抛光设备用蜡嘴保湿装置，包括：连接有阻凝液盛放容器的阻凝管路8、以及固定阻凝管路的固定支架。
所述阻凝液，用来阻止粘接剂例如蜡(更具体例如为石蜡)的凝固，其成分一般由NH 4OH、H 2O 2等组成。
所述阻凝液盛放容器(图中未示出)，用于盛放与抛光设备的蜡嘴连接处6阻凝管路8所流出的阻凝液；实际设计中，盛放容器内设有吸附阻凝液的吸附材料(吸附材料例如为海绵)，通过吸附材料与蜡嘴接触，一方面可以减少阻凝蜡嘴时阻凝液用量，另一方面可以避免阻凝液的外溢和对作业环境的污染。
所述阻凝管路8，一端与抛光设备的蜡嘴连接(即图中标示6处与蜡嘴直接接触)，另外一端与阻凝液输送管路(图中未示出)连接，用来传输阻凝液；实际设计中，阻凝管路采用1/4 PFA材质管路；优选设计中，阻凝管路上设计有用于控制阻凝液流量的1/4球阀；
所述抛光设备一般为单面抛光设备。
所述固定支架，包括：竖向固定底座2、横向固定支架3和阻凝管固定架5三个部分；
其中竖向固定底座2为一“L”型结构，用于将装置整体固定在台面上，而为便于移动和调整，优选设计中，用于将竖向固定底座固定在台面上的横板1、以及用于固定横向固定支架的的竖板上均采用“U”形槽式结构设计，从而便于调整固定位置；
横向固定支架3，为一与竖向固定底座呈直角连接关系的“L”形结构，其竖臂与竖向固定底座为可拆卸式连接(例如通过螺栓来实现)，其横臂9与阻凝管固定架为可拆卸式连接(例如通过螺栓来实现)；优选设计中，横臂9同样采用“U”形槽式结构设计，从而可以在横向方向实现阻凝管与抛光设备间距离的调整；
阻凝管固定架5，为一与横向固定支架呈直角连接关系的“L”形结构，其竖直面板7上固定有阻凝管路(需要解释的是，图中所示采用了额外的竖直面板设计，从而进一步实现竖直方向的位移调节，但实际设计中，也可直接将阻凝管固定于竖直面板上)，其横向面板4上与横向固定支架为可拆卸式连接(例如通过螺栓来实现)；优选设计中，横向面板同样采用“U”形槽式结构设计，从而便于调节阻凝管路在不同维度方向与抛光设备蜡嘴距离的调节。
通过上述结构设计可以看出，本申请所提供的蜡嘴保湿装置，可以实现横向、纵向、内外等多个角度的位移调节，从而可以适应不同的作业环境，满足蜡嘴保湿需要，因此具有较好的实用价值。

Claims (8)

  1. 一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，该装置包括：连接有阻凝液盛放容器的阻凝管路、以及固定阻凝管路的固定支架；
    所述阻凝液盛放容器，用于盛放阻凝管路与抛光设备的蜡嘴接触处阻凝管路所流出的阻凝液；
    所述阻凝管路，一端与抛光设备的蜡嘴连接，另外一端与阻凝液输送管路连接；
    所述固定支架，包括：竖向固定底座、横向固定支架和阻凝管固定架三个部分；
    其中竖向固定底座为一“L”型结构，用于将装置整体固定在台面上；
    横向固定支架，为一与竖向固定底座呈直角连接关系的“L”形结构，其竖臂与竖向固定底座为可拆卸式连接，其横臂与阻凝管固定架为可拆卸式连接；
    阻凝管固定架，为一与横向固定支架呈直角连接关系的“L”形结构，其竖直面板上固定有阻凝管路，其横向面板上与横向固定支架为可拆卸式连接。
  2. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，盛放容器内设有吸附阻凝液的吸附材料。
  3. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，阻凝管路采用1/4 PFA材质管路。
  4. 如权利要求3所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，阻凝管路上设计有用于控制阻凝液流量的1/4球阀。
  5. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，用于将竖向固定底座固定在台面上的横板、以及用于固定横向固定支架的竖板上均采用“U”形槽式结构设计。
  6. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，横向固定支架的横臂采用“U”形槽式结构设计。
  7. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征在于，阻凝管固定架的横向面板采用“U”形槽式结构设计。
  8. 如权利要求1所述硅片抛光加工过程中抛光设备用蜡嘴保湿装置，其特征 在于，所述抛光设备为单面抛光设备。
PCT/CN2020/117980 2019-12-03 2020-09-27 一种硅片抛光加工过程中抛光设备用蜡嘴保湿装置 WO2021109693A1 (zh)

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