WO2021109321A1 - Led灯丝的制造方法 - Google Patents
Led灯丝的制造方法 Download PDFInfo
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- WO2021109321A1 WO2021109321A1 PCT/CN2020/071349 CN2020071349W WO2021109321A1 WO 2021109321 A1 WO2021109321 A1 WO 2021109321A1 CN 2020071349 W CN2020071349 W CN 2020071349W WO 2021109321 A1 WO2021109321 A1 WO 2021109321A1
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- support substrate
- led
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- metal sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Definitions
- the present invention relates to the technical field of LED filaments, in particular to a manufacturing method of LED filaments.
- the drives used are all DC drives, that is, the mature switching power supply technology converts AC to DC to drive the corresponding LED filaments.
- the LED DC drive can provide stable current for the LED, it has become the current mainstream drive method.
- the life and cost have become the bottleneck restricting the development of the LED DC drive. Accordingly, the process of manufacturing the DC LED filament is relatively complicated and the cost is realized. high.
- the present invention provides a method for manufacturing an LED filament, so as to solve the technical problems of complicated manufacturing process of the LED filament and high implementation cost in the prior art.
- a technical solution adopted by the present invention is to provide a method for manufacturing an LED filament, wherein the method for manufacturing the LED filament includes the following steps: S1: providing at least two rows of a plurality of metal sheets arranged in parallel and spaced apart , One end of each metal sheet extends toward the opposite row of metal sheets, and the other end is connected to each other to form a positioning portion; S2: a plurality of support substrates are provided, and each support substrate is fixedly connected between two metal sheets at opposite positions; S3 : Provide multiple LED chips, attach the LED chips on each support substrate and electrically connect them to the metal sheet through conductive wires; or, prefabricate conductive strips on each support substrate, and place the LED chips on the support substrate and pass through The conductive strip is electrically connected to the metal sheet; S4: the packaging material is wrapped around each support substrate, the LED chip and the conductive strips or conductive wires arranged on the support substrate, and the connection between each support substrate and the metal sheet is covered to form a package Layer
- the steps of the manufacturing method of the LED filament further include S5: cutting between the connection between each support substrate and the metal sheet and the positioning part to obtain a separated LED filament.
- a plurality of positioning holes are provided on the positioning part.
- a plurality of positioning holes are arranged in a one-to-one correspondence with each support substrate.
- each metal sheet is provided with a clamping part for clamping the support substrate.
- the clamping portion includes a pair of opposite and spaced clamping pieces, a pair of clamping pieces are respectively formed by bending and extending from opposite sides of the metal piece, a pair of clamping pieces and the metal piece jointly enclose a receiving space, the bracket The end of the substrate is accommodated in the accommodating space.
- each metal sheet in one row is provided with a marking hole.
- step S5 the metal sheet is cut between the marking hole and the positioning hole to form an LED filament.
- a rectifier module is attached to each support substrate, and the rectifier module is arranged at one end of the support substrate close to the metal sheet.
- the packaging material includes silica gel, rubber or resin.
- the support substrate is made of ceramic material or glass material.
- the present invention also provides a method for manufacturing the LED filament, which includes the following steps:
- S1 Provide at least two rows of a plurality of metal sheets arranged at intervals in parallel, one end of each metal sheet extends toward the opposite row of metal sheets, the other end is connected to each other to form a positioning portion, and a plurality of positioning holes are opened on the positioning portion
- S2 Provide a plurality of support substrates, each of which is fixedly connected between two metal sheets at opposite positions;
- S3 Provide a plurality of LED chips, and attach the LED chips to each of the support substrates and pass The conductive wire is electrically connected to the metal sheet; or, a conductive strip is prefabricated on each of the support substrates, and the LED chip is attached to the support substrate and electrically connected to the metal sheet through the conductive strips;
- S4 Encapsulate each of the support substrates, the LED chips arranged on the support substrates, and the conductive strips or conductive wires with a packaging material, and cover the connection between each support substrate and the metal sheet to form a package Layer; the encapsulation layer, the support substrate, the LED chip,
- LED filament groups can be produced in batches by the manufacturing method of the present invention, the production of LED filaments can be made simpler, the realization cost is low, and the way of forming an encapsulation layer on the LED filaments can be completely isolated. Air to avoid oxidation of the LED chip and the corresponding bracket, and to enable the LED chip to run well in a confined space, creating a good use environment for the LED chip filament, which can greatly increase the service life of the LED filament.
- Figure 1 is a schematic flow chart of the manufacturing method of the LED filament of the present invention.
- FIG. 2 is a schematic diagram of the structure of two rows of metal sheets provided in step S1 in FIG. 1;
- FIG. 3 shows that the bracket substrate is fixed between two rows of metal sheets in step S2;
- step 3 conductive wires are preset on the support substrate, the LED chip and the rectifier module are attached, and they are electrically connected to the metal sheets at both ends, taking one of the support substrates as an example;
- FIG. 5 shows that in step 3 of another embodiment, the LED chip is attached and electrically connected to the metal sheets at both ends through electrical wires, taking one of the support substrates as an example;
- FIG. 6 shows that in step S4, the support substrate, the components attached to the support substrate, and the connection between the support substrate and the metal sheet are packaged using packaging materials.
- Fig. 1 to Fig. 6 a schematic flow diagram of the manufacturing method of the LED filament of the present invention. The steps are as follows:
- S1 Provide at least two rows of a plurality of metal sheets arranged in parallel and spaced apart, one end of each metal sheet extends toward the opposite row of metal sheets, and the other end is connected to each other to form a positioning portion.
- two rows of metal sheets are first produced, which can be made of metal with good electrical conductivity.
- the metal strip can also be made in rolls and divided into reasonable lengths.
- a metal belt with a length of 120mm or 144mm which is not limited in the present invention.
- the two rows of metal sheets may be an integral metal sheet, which is integrally formed into the two rows of metal sheets 10 through a process such as stamping.
- the two rows of metal sheets 10 are arranged in parallel and spaced apart, and the metal sheets 10 in the same row are aligned with each other.
- each metal sheet 10 extends toward the opposite row of metal sheets 10, and the other end thereof is connected to each other to form a positioning portion 20, and the positioning portion 20 is further provided with a plurality of positioning holes 210.
- the metal belt may include 36 or 40 or 48 metal sheets 10 arranged in parallel and spaced in sequence, and the interval between every two adjacent metal sheets 10 is equal, and the distance may be 1 mm- 9mm.
- S2 Provide a plurality of support substrates, and each support substrate is fixedly connected between two metal sheets at opposite positions.
- each of the support substrates 30 can be fixedly connected between two metal sheets 10 at opposite positions, that is, two metal sheets 10 aligned with each other. Between them, so that each two opposite metal sheets 10 are further fixedly connected with a support substrate 30.
- a support substrate sheet can be pre-fabricated, wherein the support substrate sheet may include a plurality of support substrates 30 connected side by side in parallel, so as to further split the support substrate sheet into a plurality of independent support substrates 30 to separate the support substrates 30 from each other.
- Each support substrate 30 is fixedly connected between two metal sheets 10 opposite to each other.
- the support basically can also include 36 or 40 or 48 support substrates 30 connected side by side in parallel, which can be made of ceramic material or glass material, and the width of each support substrate 30 can also be equal to each other, and It is one of 0.8mm, 1.0mm, 1.5mm, 3.0mm, etc. It is understandable that the size of each support substrate 30 can also be different, which can be set according to actual needs.
- the end of each metal sheet 10 is press-fitted with a clamping portion 110 for clamping the support substrate 30.
- the clamping portion 110 includes a pair of opposing and spaced-apart clamping pieces 111 and 112, and the pair of clamping pieces 111 and 112 are respectively bent from opposite sides of the metal sheet 10. It is folded and extended to form a receiving space with the metal sheet 10, so that the end of the support substrate 30 is received in the receiving space. It is understandable that the clamping portion 110 may also be integrally formed with the metal sheet 10 in step S1.
- a plurality of positioning holes 210 are arranged in a one-to-one correspondence with the bracket substrate 30, so that when each bracket substrate 30 is fixedly connected between two metal sheets 10 at opposite positions, it is used for positioning to facilitate corresponding connection.
- each metal sheet 10 can be further provided with a marking hole 120, and the marking hole 120 can be used to identify the positive and negative electrodes of each metal sheet 10, so as to set the end of the metal sheet 10 with the marking hole 120 It is the positive electrode, and the other end of the metal sheet 10 without the marked hole 120 is set as the negative electrode, or the opposite setting can also be used to facilitate the identification of the positive and negative electrodes during the subsequent die-bonding wire bonding.
- the identification hole 120 may also be integrally formed with the metal sheet 10 in step S1.
- S3 Provide multiple LED chips, attach the LED chips on each support substrate and electrically connect them to the metal sheet through conductive wires; or, prefabricate conductive strips on each support substrate, and attach the LED chips on the support substrate and It is electrically connected with the metal sheet through the conductive strip.
- one of the support substrates 30 is taken as an example.
- the conductive strips 31 are printed on the support substrate 30, and the conductive strips 31 are respectively printed on The opposite sides of the support substrate 30; then, a plurality of set number of LED chips 50 are sequentially attached to each support substrate 30 and placed between the two conductive strips 31; then, the conductive strips 31 are welded by wires They are respectively electrically connected to the metal sheets 10 at both ends, and the LED chips 50 are electrically connected to the conductive strips 31 through wires.
- the LED chip 50 may be a high-voltage chip or a low-voltage chip, which is not limited in the present invention.
- a rectifier module 70 can be attached to each support substrate 30, and the rectifier module 70 can be specifically arranged on the corresponding support substrate 30 at one end close to the metal sheet 10.
- the rectifier tube assembly 70 may specifically include a rectifier bridge 710 and a protection resistor 720, and the rectifier bridge 710 may be composed of 4 high-voltage LED chips with different conduction directions, so as to be able to convert the external AC power into DC power so as to be the corresponding LED.
- the chip 50 supplies power, and the protection resistor 720 can stabilize the current and stabilize the current when the corresponding LED filament is turned on and reversely cut off, so as to effectively prevent the AC LED filament from being over-current and over-voltage during the working process. Possible malfunctions are generated to make its use performance more perfect.
- the rectifier tube assembly 40 may also only include the rectifier bridge 710, which is not limited in the present invention.
- the final produced corresponding LED filament can be directly connected to an alternating current, which is lower than the conventional direct current filament and can make The corresponding power supply cost is greatly reduced, and the stability of the AC LED filament is effectively improved, and the phenomenon of dead light caused by the instability of the filtering and voltage drop of the power supply due to the crude power supply is reduced.
- the production process of the AC LED filament can eliminate many components in the power supply scheme, such as rectifiers, capacitors and other high-priced components in the driving power supply, thereby greatly reducing the corresponding production costs.
- a set number of chips such as 8 or 10, etc.
- the conductive wire 50 sequentially connects the set number of LED chips 50 to each other, and further connects to the corresponding metal sheet 10.
- any suitable number of LED chips on the support substrate can be set as required, and other reasonable die bonding positions and wire bonding methods can also be set to implement other circuit logic, which is not limited in the present invention.
- S4 Encapsulate each support substrate, the LED chip and the conductive strips or conductive wires arranged on the support substrate, and cover the connection between each support substrate and the metal sheet to form an encapsulation layer; the encapsulation layer, the support substrate, The LED chip, the conductive strip or the conductive wire and the two connected metal sheets together constitute the LED filament.
- the The packaging material covers each support substrate 30, the LED chips 50 and the conductive strips 40 or conductive wires 60 arranged on the support substrate, and covers the connection between each support substrate 30 and the metal sheet 10 to form a packaging layer 80; and the encapsulation layer 80, the support substrate 30, the LED chip 50, the conductive strip 40 or the conductive wire 60 and the two metal sheets 10 connected together constitute the final LED filament.
- the encapsulation layer 80 can completely isolate the corresponding LED chip 50 from the air to avoid oxidation of the LED chip 50 and the support substrate 30, and enables the LED chip 50 to operate well in a confined space, creating a Good use environment, and greatly improve the service life of the corresponding LED filament. Further, the encapsulation layer 80 also wraps the joint where the metal sheet 10 is fixedly connected to the support substrate 30, so as to prevent the joint from being broken due to external influences, thereby reducing the service life of the filament.
- the packaging material used in the packaging layer 80 may include any one or a combination of materials such as silica gel, rubber, resin, phosphor powder, etc., which is not limited in the present invention.
- step S4 of the above LED filament manufacturing method the following steps may be further included:
- connection between each bracket substrate 30 and the metal sheet 10 and the positioning portion 20 in the finally formed LED filament may be cut off to obtain a plurality of separated LED filaments.
- the metal sheet 10 can be specifically cut off between the marking hole 120 and the positioning hole 210 to separate each LED filament in the LED filament group, thereby forming a plurality of LED filaments, which can be used individually.
- the manufacturing method provided by the present invention can be used to produce LED filament groups in batches, which can make the production of LED filaments simpler, and achieve low cost, and the method of forming an encapsulation layer on the LED filaments can be complete Insulates the air to avoid oxidation of the LED chip and the corresponding bracket, and enables the LED chip to run well in a confined space, creating a good use environment for the LED chip filament, which can greatly increase the service life of the LED filament. .
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Abstract
Description
Claims (12)
- 一种LED灯丝的制造方法,其特征在于,包括以下步骤:S1:提供至少两列平行间隔设置的多个金属片,每个所述金属片的一端朝向其相对的另一列金属片延伸,另一端相互连接形成定位部;S2:提供多个支架基板,每一支架基板固定连接在位置相对的两金属片之间;S3:提供多个LED芯片,将所述LED芯片贴设在每一所述支架基板上并通过导电线与所述金属片电连接;或,每个所述支架基板上预制导电条,将所述LED芯片贴设在所述支架基板上并通过所述导电条与所述金属片电连接;S4:将封装材料包覆每一所述支架基板、设置在所述支架基板上的LED芯片及所述导电条或导电线,并包覆每一支架基板与所述金属片的连接处形成封装层;所述封装层、支架基板、LED芯片、导电条或导电线及相连接的两金属片共同构成所述LED灯丝。
- 根据权利要求1所述的LED灯丝的制造方法,其特征在于,所述步骤还包括:S5:在每一支架基板与所述金属片的连接处与所述定位部之间截断以获取分离的LED灯丝。
- 根据权利要求2所述的LED灯丝的制造方法,其特征在于,所述定位部上开设多个定位孔。
- 根据权利要求3所述的LED灯丝的制造方法,其特征在于,所述多个定位孔与每一所述支架基板一一对应设置。
- 根据权利要求1所述的LED灯丝的制造方法,其特征在于,每一所述金属片设有用于夹持所述支架基板的夹持部。
- 根据权利要求5所述的LED灯丝的制造方法,其特征在于,所述夹持部包括一对相对且间隔设置的夹持片,一对夹持片分别自所述金属片的相对两侧弯折延伸形成,所述一对夹持片及所述金属片共同围成收容空间,所述支架基板的端部收容于所述收容空间。
- 根据权利要求2所述的LED灯丝的制造方法,其特征在于,其中一列的每一所述金属片上开设标示孔。
- 根据权利要求7所述的LED灯丝的制造方法,其特征在于,在所述步骤S5中,在所述标示孔与所述定位孔之间截断所述金属片以形成LED灯丝。
- 根据权利要求1所述的LED灯丝的制造方法,其特征在于,每一所述支架基板上还贴设整流模块,所述整流模块设置在所述支架基板靠近所述金属片的一端。
- 根据所述权利要求1所述的LED灯丝的制造方法,其特征在于,所述封装材料包括硅胶、橡胶或树脂。
- 根据权利要求1所述的LED灯丝的制造方法,其特征在于,所述支架基板由陶瓷材料或玻璃材料制成。
- 一种LED灯丝的制造方法,其特征在于,包括以下步骤:S1:提供至少两列平行间隔设置的多个金属片,每个所述金属片的一端朝向其相对的另一列金属片延伸,另一端相互连接形成定位部,在定位部上开设多个定位孔;S2:提供多个支架基板,每一支架基板固定连接在位置相对的两金属片之间;S3:提供多个LED芯片,将所述LED芯片贴设在每一所述支架基板上并通过导电线与所述金属片电连接;或,每个所述支架基板上预制导电条,将所述LED芯片贴设在所述支架基板上并通过所述导电条与所述金属片电连接;S4:将封装材料包覆每一所述支架基板、设置在所述支架基板上的LED芯片及所述导电条或导电线,并包覆每一支架基板与所述金属片的连接处形成封装层;所述封装层、支架基板、LED芯片、导电条或导电线及相连接的两金属片共同构成所述LED灯丝;S5:在每一支架基板与所述金属片的连接处与所述定位部之间截断以获取分离的LED灯丝。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201911241236.3 | 2019-12-06 | ||
CN201911241236.3A CN111883636A (zh) | 2019-12-06 | 2019-12-06 | Led灯丝的制造方法 |
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US11199298B2 (en) | 2021-12-14 |
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