WO2021106479A1 - Tête d'impression thermique et procédé pour sa fabrication - Google Patents

Tête d'impression thermique et procédé pour sa fabrication Download PDF

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Publication number
WO2021106479A1
WO2021106479A1 PCT/JP2020/040438 JP2020040438W WO2021106479A1 WO 2021106479 A1 WO2021106479 A1 WO 2021106479A1 JP 2020040438 W JP2020040438 W JP 2020040438W WO 2021106479 A1 WO2021106479 A1 WO 2021106479A1
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WIPO (PCT)
Prior art keywords
convex portion
film
substrate
protective film
wiring
Prior art date
Application number
PCT/JP2020/040438
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English (en)
Japanese (ja)
Inventor
一也 中久保
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to CN202080082095.XA priority Critical patent/CN114728523B/zh
Priority to JP2021561238A priority patent/JPWO2021106479A1/ja
Publication of WO2021106479A1 publication Critical patent/WO2021106479A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Definitions

  • This embodiment relates to a thermal print head and a method for manufacturing the same.
  • the thermal print head is provided with, for example, a large number of heat generating portions arranged in the main scanning direction on the main surface side of the head substrate.
  • Each heat generating portion is laminated on a resistor layer formed on a head substrate via a glaze layer so that a part thereof is exposed, and an upstream electrode layer and a downstream electrode layer are laminated with their ends facing each other. It is formed by doing.
  • the exposed portion (heating portion) of the resistor layer generates heat due to Joule heat.
  • the thermal print head is provided with convex glaze as a heat storage portion extending in the main scanning direction in order to improve the efficiency of heat transfer to the printing medium and enable high-speed printing, and each heat generation is generated at the top of the convex glaze.
  • the part is arranged.
  • Such convex glaze also helps to improve the contact of the platen roller with each heat generating portion and improve the print quality.
  • a technique for forming a protective film (protective layer) on the plurality of substrates in a state where the plurality of substrates are stacked on the support base at different positions from each other is disclosed.
  • a protective film made of a hard film can be further formed on the main surface side of each substrate for a plurality of substrates, and the manufacturing efficiency can be improved.
  • a protective film or the like is already provided on the substrate, and the back surface (opposite surface to the main surface) of the upper substrate is provided on the main surface side of the lower substrate by stacking a plurality of substrates. There is a risk of causing problems that damage the protective film, conductive layer, etc.
  • the back surface of the upper substrate and the protective film of the lower substrate are provided in order to prevent the protective film and the conductive layer provided on the main surface side of the substrate from being scratched.
  • One aspect of the present embodiment provides a thermal print head that suppresses scratches on the protective film or the like provided on the main surface side of the substrate and ensures yield and reliability.
  • another aspect of the present embodiment provides a method for manufacturing the thermal printhead.
  • One aspect of the present embodiment is a wiring composed of a convex portion on a substrate, a heat storage layer on the substrate and the convex portion, a heat generating portion on the heat storage layer, and a metal layer, and connected to the heat generating portion. And the structure having the protective film on the wiring and the heat storage layer, and the conductive layer connected to the metal layer through the opening provided in the protective film, and the protective film.
  • the conductive layer is a thermal printhead that is thicker than the protective film and is in contact with the inner surface of the protective film at the opening, and the conductive layer has a flat upper surface. ..
  • another aspect of the present embodiment is connected to the substrate having the first convex portion and the second convex portion, the heat storage layer on the substrate, the heat generation portion on the heat storage layer, and the heat generation portion.
  • a structure having the wiring, a protective film on the wiring and the heat storage layer, and a hard film in contact with the protective film, and the first convex portion is formed from the second convex portion.
  • a part of the substrate is removed to form a convex portion, a heat storage film is formed on the substrate having the convex portion, and a resistor film is formed on the heat storage film. Then, a wiring film is formed on the resistor film, a part of the wiring film is removed to form a wiring, a part of the resistor film is removed to form a heat generating portion, and the convex portion is formed.
  • a protective film is formed on the substrate, the heat storage film, the heat generating portion, and the wiring, and an opening reaching the wiring is formed in the protective film, and the protective film is formed on the wiring in the opening.
  • a conductive layer having a thick and flat upper surface is formed to manufacture a structure, two or more of the structures are prepared, and one part of the structure and another part of the structure are formed.
  • a hard film in contact with the protective film of two or more of the structures is subjected to a vapor phase growth method in a state where one conductive layer of the structure is sandwiched between them and the two or more structures are superposed on each other. It is a manufacturing method of a thermal print head formed by.
  • a part of the substrate is removed to form a first convex portion and a second convex portion, and heat is stored on the substrate having the first convex portion and the second convex portion.
  • a film is formed, a resistor film is formed on the heat storage film, a wiring film is formed on the resistor film, a part of the wiring film is removed to form a wiring, and one of the resistor films is formed.
  • the portion is removed to form a heat generating portion, and a protective film is formed on the substrate having the first convex portion and the second convex portion, on the heat storage film, on the heat generating portion, and on the wiring to protect the protection.
  • the protective film has a protruding portion, the protruding portion has a flat upper surface, two or more of the structures are prepared, and one part of the structure and one other of the structure are prepared.
  • a hard film in contact with the protective film of two or more of the structures is formed in a state where the portions are overlapped with each other with the protruding portion of one of the structures interposed therebetween and two or more of the structures are superposed with each other.
  • thermo print head that suppresses scratches on the protective film or the like provided on the main surface side of the substrate and secures the yield and reliability.
  • another aspect of the present embodiment can provide a method for manufacturing the thermal printhead.
  • FIG. 1 is a plan view of the thermal print head of the first embodiment.
  • FIG. 2 is a simplified cross-sectional view taken along line II of FIG.
  • FIG. 3 is a partially enlarged plan view (partially omitted) of the thermal print head of the first embodiment.
  • FIG. 4 is a cross-sectional view showing a head substrate included in the thermal print head of the first embodiment.
  • FIG. 5 is a diagram illustrating a method for manufacturing the thermal printhead of the first embodiment, and is a plan view of a process of forming a resist.
  • FIG. 6 is a cross-sectional view of FIG.
  • FIG. 7 is a diagram illustrating a method of manufacturing the thermal print head of the first embodiment, and is a plan view of a step of removing a part of the substrate.
  • FIG. 8 is a cross-sectional view of FIG. 7.
  • FIG. 9 is a diagram illustrating a method of manufacturing the thermal printhead of the first embodiment, and is a plan view of a step of removing a part of the substrate.
  • FIG. 10 is a cross-sectional view of FIG.
  • FIG. 11 is a diagram illustrating a method of manufacturing the thermal print head of the first embodiment, and is a plan view of a process of forming a heat storage layer.
  • FIG. 12 is a cross-sectional view of FIG.
  • FIG. 13 is a diagram illustrating a method of manufacturing the thermal printhead of the first embodiment, and is a plan view of a process of forming a resistor film and a wiring film.
  • FIG. 14 is a cross-sectional view of FIG. FIG.
  • FIG. 15 is a diagram illustrating a method of manufacturing the thermal printhead of the first embodiment, and is a plan view of a process of removing a part of the resistor film and the wiring film to form the resistor layer and the wiring.
  • FIG. 16 is a cross-sectional view of FIG.
  • FIG. 17 is a diagram illustrating a method for manufacturing the thermal printhead of the first embodiment, and is a plan view of a step of forming a protective film and a conductive layer.
  • FIG. 18 is a cross-sectional view of FIG.
  • FIG. 19 is a diagram illustrating a method of manufacturing the thermal print head of the first embodiment, and is a plan view of a process of forming a hard film.
  • FIG. 20 is a cross-sectional view of FIG. FIG.
  • FIG. 21 is a view for explaining the method of manufacturing the thermal printhead of the first embodiment, and is a cross-sectional view after a hard film is formed in a state where a plurality of structures are stacked.
  • FIG. 22 is a cross-sectional view of the thermal print head of the second embodiment.
  • FIG. 23 is a diagram illustrating a method of manufacturing the thermal printhead of the second embodiment, and is a cross-sectional view of a step of forming a resist.
  • FIG. 24 is a diagram illustrating a method of manufacturing the thermal print head of the second embodiment, and is a cross-sectional view of a step of forming a second convex portion.
  • FIG. 25 is a diagram illustrating a method of manufacturing the thermal printhead of the second embodiment, and is a cross-sectional view of a process of forming a heat storage layer, a resistor layer, and wiring.
  • FIG. 26 is a diagram illustrating a method of manufacturing the thermal printhead of the second embodiment, and is a cross-sectional view of a step of forming a protective film, a conductive layer, and a hard film.
  • FIG. 27 is a view for explaining the method of manufacturing the thermal printhead of the second embodiment, and is a cross-sectional view after a hard film is formed in a state where a plurality of structures are stacked.
  • One aspect of this embodiment is as follows.
  • a wiring composed of a convex portion on a substrate, a heat storage layer on the substrate and the convex portion, a heat generating portion on the heat storage layer, a metal layer, and connected to the heat generating portion, and on the wiring.
  • a structure having a protective film on the heat storage layer, a conductive layer connected to the metal layer through an opening provided in the protective film, and a hard film in contact with the protective film.
  • the conductive layer is thicker than the protective film and is in contact with the inner surface of the protective film at the opening, and the conductive layer has a flat upper surface.
  • ⁇ 2> The thermal print head according to ⁇ 1>, wherein the conductive layer has a thickness of 1 to 10 ⁇ m.
  • ⁇ 5> The thermal print head according to ⁇ 1> or ⁇ 2>, wherein the substrate is a ceramic substrate.
  • a structure having a protective film on the heat storage layer and a hard film in contact with the protective film are provided, and the first convex portion is higher in height than the second convex portion, and the second convex portion is provided.
  • the protective film has a protruding portion, and the protruding portion has a flat upper surface, a thermal print head.
  • thermo print head according to any one of ⁇ 6> to ⁇ 8>, wherein the substrate is made of a single crystal semiconductor.
  • ⁇ 11> There are two or more of the structures, and the back surface of the substrate of one of the structures is in contact with the upper surface of the conductive layer of the other one of the structures or a part of the upper surface of the protective film.
  • the hard film of one of the structures is in contact with a part of the side surface and a part of the back surface of the substrate of the structure and is separated from the contact surface, ⁇ 11.
  • a part of the substrate is removed to form a convex portion, a heat storage film is formed on the substrate having the convex portion, a resistor film is formed on the heat storage film, and wiring is performed on the resistor film.
  • a film is formed, a part of the wiring film is removed to form a wiring, a part of the resistor film is removed to form a heat generating portion, and the substrate having the convex portion and the heat storage film are formed.
  • a conductive layer having a protective film formed on the heat generating portion and on the wiring, forming an opening reaching the wiring in the protective film, and having a flat upper surface thicker than the protective film on the wiring in the opening.
  • a structure To manufacture a structure, two or more of the structures are prepared, and one part of the structure and another part of the structure are combined with one conductive layer of the structure.
  • ⁇ 14> The method for manufacturing a thermal print head of ⁇ 13>, wherein the convex portion is formed by performing anisotropic etching using potassium hydroxide.
  • ⁇ 15> The method for manufacturing a thermal print head according to ⁇ 13> or ⁇ 14>, wherein the thickness of the conductive layer is 1 to 10 ⁇ m.
  • a part of the substrate is removed to form a first convex portion and a second convex portion, a heat storage film is formed on the substrate having the first convex portion and the second convex portion, and the heat storage film is formed on the heat storage film.
  • a resistor film is formed on the resistor film, a wiring film is formed on the resistor film, a part of the wiring film is removed to form a wiring, and a part of the resistor film is removed to form a heat generating portion.
  • a protective film is formed on the substrate having the first convex portion and the second convex portion, on the heat storage film, on the heat generating portion, and on the wiring, and an opening reaching the wiring is formed in the protective film.
  • a conductive layer is formed in the opening to manufacture a structure, the first convex portion has a higher height than the second convex portion, and the protective film has a protruding portion on the second convex portion.
  • the projecting portion has a flat upper surface, two or more of the structures are prepared, and a part of one of the structures and another part of the structure are made of one of the structures. Thermal that superimposes the protruding portions on each other and superimposes the two or more structures on each other to form a hard film in contact with the protective film of the two or more structures by the vapor phase growth method. How to make a print head.
  • the second convex portion is a part of a substrate having the first convex portion by forming a resist on a substrate other than the first convex portion after forming the first convex portion and using the resist as a mask.
  • ⁇ 18> A method for manufacturing a thermal printhead of ⁇ 16> or ⁇ 17>, wherein the first convex portion and the second convex portion are formed by performing anisotropic etching using potassium hydroxide.
  • ⁇ 19> The method for manufacturing a thermal print head according to any one of ⁇ 16> to ⁇ 18>, wherein the height of the second convex portion is 1 to 10 ⁇ m.
  • ⁇ 20> The method for manufacturing a thermal print head according to any one of ⁇ 16> to ⁇ 19>, wherein the height of the first convex portion is 20 to 300 ⁇ m.
  • ⁇ 21> The method for manufacturing a thermal print head according to any one of ⁇ 13> to ⁇ 20>, wherein the substrate is made of a single crystal semiconductor.
  • ⁇ 22> The method for manufacturing a thermal printhead according to ⁇ 21>, wherein the single crystal semiconductor is made of silicon.
  • the back surface of the substrate of one of the structures has a contact surface in contact with the upper surface of the conductive layer of the other one of the structure or a part of the upper surface of the protective film, ⁇ 13> to ⁇ 22.
  • the hard film of one of the structures is in contact with a part of the side surface and a part of the back surface of the substrate of the structure and is separated from the contact surface.
  • FIG. 1 is a simplified plan view of the thermal print head.
  • FIG. 2 is a cross-sectional view taken along the line II of FIG.
  • FIG. 3 is a partially enlarged plan view of the thermal print head.
  • FIG. 4 is a cross-sectional view showing a head substrate included in the thermal print head.
  • the thermal print head 10 of the present embodiment drives the substrate 11, the wiring board 12, the heat sink 13, the heat storage unit 21, the wiring 3, the resistor layer 4, the conductive layer 5, and the protective film 6. It includes an IC 7, a plurality of wires 81, a resin portion 82, and a connector 83. In addition, in order to facilitate understanding, some components may be omitted in FIGS. 1 to 3. As shown in FIG. 2, the thermal print head 10 is incorporated in a printer that prints on the print medium 801. The print medium 801 is pressed against the resistor layer 4 portion (heat generating portion 41) of the thermal print head 10 by the platen roller 802. Examples of the print medium 801 include a bar code sheet, a two-dimensional code sheet, and a thermal paper for producing a receipt.
  • the sub-scanning direction X (more accurately, the ⁇ X direction) shown in FIGS. 1 to 3 is the direction in which the print medium 801 is conveyed (paper feed direction).
  • the substrate 11 is made of a single crystal semiconductor or ceramic.
  • the single crystal semiconductor for example, silicon can be used.
  • the ceramic for example, alumina or aluminum nitride can be used. From the viewpoint of easily forming the convex portion (first convex portion) described later, it is preferable to use a single crystal semiconductor for the substrate 11. Further, the first convex portion P1 described later may be formed on the substrate 11 by using a material other than the substrate, and for example, an insulating film such as a silicon oxide film or a silicon nitride film can be used.
  • the silicon oxide film for example, a silicon oxide film (TEOS oxide film) formed by using TEOS (tetraethyl orthosilicate) as a raw material gas can be used.
  • the thickness of the substrate 11 is, for example, about 0.5 to 1.0 mm. As shown in FIG. 2, the substrate 11 has a flat plate shape that extends long in the main scanning direction Y.
  • a conductive layer 111 which is a convex portion used in the manufacturing process, is formed on the main surface 15 side of the substrate 11.
  • the conductive layer 111 may be formed on the substrate 11 on the upstream side (+ X side close to the resin portion 82 in FIG. 2), which is the supply source side of the print medium 801 and at a position some distance from the resistor layer 4. preferable.
  • the conductive layer 111 may be covered with the resin portion 82.
  • the substrate 11 has a main surface 15 which is a substrate surface.
  • the main surface 15 has a planar shape extending in the sub-scanning direction X and the main scanning direction Y.
  • the main surface 15 extends longitudinally along the main scanning direction Y.
  • the main surface 15 faces one of the thickness directions Z of the substrate 11 (upward (and + Z direction) in FIG. 4).
  • the wiring board 12 for example, a printed wiring board can be used.
  • the wiring board 12 has a structure in which a base material layer and a wiring layer (not shown) are laminated.
  • a base material layer for example, a glass epoxy resin can be used.
  • a wiring layer for example, copper can be used.
  • the wiring board 12 may be a flexible printed wiring board.
  • the heat radiating plate 13 has a function of dissipating heat from the substrate 11.
  • a substrate 11 and a wiring board 12 are attached to the heat radiating plate 13.
  • a metal such as aluminum can be used for the heat sink 13 for example.
  • the heat storage unit 21 is formed on the main surface 15 of the substrate 11.
  • the heat storage unit 21 may also be referred to as a glaze layer.
  • the heat storage unit 21 extends in a band shape along the main scanning direction Y.
  • the boundary of the formation region of the heat storage unit 21 is represented by a broken line.
  • the heat storage unit 21 has a partially protruding shape.
  • the heat storage unit 21 can appropriately bring the portion of the protective film 6 that covers the heat generation unit 41 into contact with the print medium 801.
  • the heat storage unit 21 preferably has an insulating property.
  • a substrate made of a single crystal semiconductor can be processed to form a heat storage portion 21 on the first convex portion P1. In this case, it is preferable to form an insulating film on the main surface 15 including the heat storage portion 21.
  • the resistor layer 4 is formed on the heat storage unit 21.
  • the portion of the resistor layer 4 through which the current from the wiring 3 flows generates heat. By generating heat in this way, printing dots are formed on the thermal paper or the like.
  • a material having a resistivity higher than that of the material constituting the wiring 3 can be used, and for example, tantalum nitride, silicon oxide containing tantalum, or the like can be used.
  • the thickness of the resistor layer 4 is, for example, about 0.05 to 0.2 ⁇ m.
  • the resistor layer 4 is interposed between the wiring 3 and the heat storage unit 21. A part of the heat generated by the resistor layer 4 is stored in the heat storage unit 21.
  • the resistor layer 4 includes a plurality of heat generating portions 41.
  • the plurality of heat generating portions 41 in FIG. 3 are shaded for easy understanding.
  • Wiring 3 is formed on the resistor layer 4.
  • the wiring 3 constitutes a path for energizing the resistor layer 4.
  • the wiring 3 is made of a conductor.
  • As the conductor for example, a metal layer such as aluminum, copper, titanium, or gold can be used.
  • the thickness of the wiring 3 is, for example, about 0.2 to 0.8 ⁇ m.
  • the wiring 3 may have a multi-layer structure.
  • the wiring 3 has two layers, for example, a titanium-based titanium layer formed on the resistor layer 4 and a copper-based copper layer formed on the titanium layer. You may.
  • the wiring 3 includes a plurality of individual electrodes 31, a plurality of common electrodes 32, and a plurality of relay electrodes 33.
  • the plurality of individual electrodes 31 are not conducting with each other. Therefore, each individual electrode 31 can be individually applied with different potentials when the printer in which the thermal print head 10 is incorporated is used.
  • Each individual electrode 31 has an individual electrode band-shaped portion 311 and a wide portion 312, and a bonding portion 313 (bonding pad).
  • Each individual electrode band-shaped portion 311 has a band shape extending along the sub-scanning direction X.
  • the individual electrode band-shaped portion 311 is laminated on the resistor layer 4.
  • the wide portion 312 is connected to the individual electrode strip-shaped portion 311 and extends along the sub-scanning direction X.
  • the width dimension of the wide portion 312 (dimension in the main scanning direction Y) is larger than the width dimension of the individual electrode strip-shaped portion 311 (dimension in the main scanning direction Y).
  • the bonding portion 313 is a portion to which the wire 81 is bonded.
  • the width of the individual electrode strip-shaped portion 311 is, for example, about 45 to 50 ⁇ m
  • the width of the wide portion 312 is, for example, about 50 to 70 ⁇ m
  • the width of the bonding portion 313 is, for example, 50. It is about 75 ⁇ m.
  • the common electrode 32 is a portion that is electrically opposite to the plurality of individual electrodes 31 when the printer in which the thermal print head 10 is incorporated is used.
  • the common electrode 32 has a plurality of common electrode band-shaped portions 321, a plurality of branch portions 322, a plurality of orthogonal portions 323, and a trunk portion 324.
  • Each common electrode band-shaped portion 321 has a band shape extending in the sub-scanning direction X. As shown in FIG. 3, in each common electrode 32, the plurality of common electrode strips 321 are separated from each other in the main scanning direction Y and are electrically connected to each other.
  • Each common electrode band-shaped portion 321 is laminated on the resistor layer 4.
  • Each common electrode band-shaped portion 321 is separated from the individual electrode strip-shaped portion 311 in the main scanning direction Y.
  • two common electrode band-shaped portions 321 adjacent to each other are sandwiched between two individual electrode strip-shaped portions 311.
  • the plurality of common electrode strips 321 and the plurality of individual electrode strips 311 are arranged along the main scanning direction Y.
  • the branch portion 322 is a portion connecting two common electrode band-shaped portions 321 and one orthogonal portion 323, and is Y-shaped.
  • the orthogonal portion 323 extends along the sub-scanning direction X.
  • the trunk portion 324 is a band-shaped pattern extending in the main scanning direction Y, and a plurality of orthogonal portions 323 extending along the sub-scanning direction X are connected to each other.
  • the width of the common electrode band-shaped portion 321 is, for example, about 45 to 50 ⁇ m
  • the width of the orthogonal portion 323 is, for example, about 50 to 70 ⁇ m.
  • the width of the trunk portion 324 is, for example, about 300 to 550 ⁇ m.
  • the plurality of relay electrodes 33 are arranged along the main scanning direction Y.
  • the plurality of relay electrodes 33 are located on the opposite sides of the common electrode 32 and the plurality of individual electrodes 31 with the plurality of heat generating portions 41 interposed therebetween in the sub-scanning direction X.
  • one heating element 41 is formed by two adjacent individual heating elements (indicated by one rectangle long in the X direction in the resistor layer 4).
  • Each relay electrode 33 is in contact with two (pair) of adjacent individual heating elements among the individual heating elements.
  • Each of the plurality of relay electrodes 33 is electrically interposed between one of the plurality of individual electrodes 31 and the common electrode 32.
  • Each relay electrode 33 has two (pair) relay electrode band-shaped portions 331, a connecting portion 332, and an extending portion 333. Two adjacent (pair) individual heating elements connected by one relay electrode 33 constitute one heating unit 41. One heat generating portion 41 corresponds to one printing dot formed on the thermal paper.
  • Each relay electrode band-shaped portion 331 has a band shape extending in the sub-scanning direction X.
  • the plurality of relay electrode strips 331 are separated from each other in the main scanning direction Y.
  • Each relay electrode band-shaped portion 331 is laminated on the resistor layer 4.
  • the plurality of relay electrode band-shaped portions 331 are arranged on the resistor layer 4 on opposite sides of the plurality of individual electrode strip-shaped portions 311 and the plurality of common electrode strip-shaped portions 321 in the sub-scanning direction X.
  • Each of the pair of relay electrode strips 331 constituting each relay electrode 33 is in contact with a pair of adjacent individual heating elements.
  • One of the pair of relay electrode band-shaped portions 331 of each relay electrode 33 is arranged to face any one of the plurality of common electrode strip-shaped portions 321 with one individual heating element interposed therebetween in the sub-scanning direction X.
  • the other of the pair of relay electrode band-shaped portions 331 in each relay electrode 33 is any of a plurality of individual electrode strip-shaped portions 311 sandwiching one individual heating element adjacent to the above-mentioned one individual heating element in the sub-scanning direction X. They are placed facing each other.
  • Each relay electrode band-shaped portion 331 is located on the heat storage portion 21.
  • Each of the plurality of connecting portions 332 extends along the main scanning direction Y.
  • Each connecting portion 332 is connected to a pair of relay electrode strip-shaped portions 331 in each relay electrode 33.
  • the pair of relay electrode strips 331 in each relay electrode 33 are electrically connected to each other.
  • Each connecting portion 332 is located on the heat storage portion 21.
  • Each of the plurality of extension portions 333 extends along the sub-scanning direction X.
  • Each extension portion 333 is connected to a connecting portion 332 in each relay electrode 33.
  • the boundary between the connecting portion 332 and the extending portion 333 is represented by an upper virtual line.
  • the conductive layer 5 is laminated on the main surface 15 side of the substrate 11.
  • the conductive layer 5 is provided so as to surround at least a part of the wiring 3, for example.
  • the conductive layer 5 is formed at a position separated from the extending portion 333 on one side ( ⁇ X direction side) of the sub-scanning direction X.
  • the conductive layer 5 shown in FIG. 3 has a predetermined width in the sub-scanning direction X and extends along the main scanning direction Y.
  • the conductive layer 5 is made of, for example, the same material as the wiring 3.
  • the conductive layer 5 is not always necessary. Unlike the present embodiment, the configuration may not include the conductive layer 5.
  • the protective film 6 has a function of protecting the wiring 3, the resistor layer 4, and the conductive layer 5, and an insulating material can be used.
  • silicon nitride can be used.
  • the thickness of the protective film 6 is, for example, about 1 to 8 ⁇ m.
  • the drive IC 7 applies an electric potential to each individual electrode 31 and controls the current flowing through each heat generating portion 41. By applying an electric potential to each individual electrode 31, a voltage is applied between each individual electrode 31 and the common electrode 32, and a current selectively flows through each heat generating portion 41.
  • the drive IC 7 is arranged on the wiring board 12. As shown in FIG. 3, the drive IC 7 includes a plurality of pads 71. The plurality of pads 71 are formed in two rows, for example. Note that, unlike the present embodiment, the drive IC 7 may be arranged on the substrate 11.
  • the wire 81 for example, a conductor such as gold can be used.
  • a conductor such as gold can be used.
  • the drive IC 7 and each individual electrode 31 are electrically connected.
  • a part of the other wires 81 (the lower wire of the drive IC 7 in FIG. 3) is bonded to the pad 71 of the drive IC 7 and to the wiring layer of the wiring board 12.
  • the drive IC 7 and the connector 83 are electrically connected to each other via the wiring layer.
  • the remaining wire 81 is bonded to the trunk portion 324 connected to the common electrode 32, and is bonded to the wiring layer for the common electrode in the wiring board 12.
  • the common electrode 32 and the wiring layer are conductive.
  • a black resin can be used for the resin portion 82 shown in FIG. 2, for example, a black resin can be used.
  • the resin portion 82 for example, an epoxy resin, a silicone resin, or the like can be used.
  • the resin portion 82 covers the drive IC 7, the plurality of wires 81, and the protective film 6, and protects the drive IC 7 and the plurality of wires 81.
  • the connector 83 is fixed to the wiring board 12. A wiring for supplying electric power to the thermal print head 10 from the outside of the thermal print head 10 and controlling the drive IC 7 is connected to the connector 83.
  • FIG. 4 shows a cross-sectional view of an example of a head substrate included in a thermal print head including each of the above-mentioned components.
  • the head substrate 150 shown in FIG. 4 is provided on the substrate 11 having the first convex portion P1, the heat storage layer 102, the resistor layer 109 having the heat generating portion, the wiring 107, the protective film 110, and the protective film 110.
  • a structure having a conductive layer 111 (second convex portion) connected to the wiring 107 through the opening, and a hard film 112 are provided.
  • the conductive layer 111 is thicker than the protective film 110 and is in contact with the side surface of the protective film 110. Further, the conductive layer 111 has a flat upper surface.
  • flat includes those having an average surface roughness of 5 ⁇ m or less.
  • the average surface roughness can be obtained, for example, in accordance with JIS B 0601: 2013 and ISO 25178.
  • the thermal print head includes one head substrate 150 manufactured from the above-mentioned structure.
  • the heat storage layer 102 corresponds to the heat storage layer including the heat storage unit 21, the resistor layer 109 corresponds to the resistor layer 4, the wiring 107 corresponds to the wiring 3, and the protective film 110 corresponds to the protection. Corresponds to the film 6.
  • the heat storage layer 102 covers the substrate 11.
  • An insulating material can be used for the heat storage layer 102, for example, silicon oxide, silicon nitride, or a TEOS oxide film can be used, and it is preferable to use a TEOS oxide film.
  • the thickness of the heat storage layer 102 is not particularly limited, and is, for example, 5 to 15 ⁇ m, preferably 5 to 10 ⁇ m.
  • the conductive layer 111 for example, copper, silver, gold, nickel, or palladium can be used, and the conductive layer 111 may have a single layer structure or a laminated structure.
  • a layer containing nickel, a layer containing palladium, and a layer containing gold may be formed in this order.
  • the thickness of the layer containing nickel in contact with the wiring 107 is preferably about 4 ⁇ m
  • the thickness of the conductive layer 111 is preferably 3 to 10 ⁇ m, and more preferably 4 to 7 ⁇ m.
  • one of the structures A is sandwiched between the conductive layer 111 formed thicker than usual.
  • the portion and a part of the structure B are superposed on each other (here, the upper structure A overlaps the lower structure B in a part of the region).
  • the head substrate after the hard film 112 is formed will be described by the structures A and B for convenience.
  • the thickness of the conductive layer 111 of the structure B can suppress the contact between the protective film 110 of the structure B and the back surface of the substrate 11 of the structure A. .. Therefore, it is possible to prevent the back surface of the substrate 11 of the upper structure A from scratching (for example, cracking, disconnection, etc.) on the protective film 110 or the like of the lower structure B.
  • the conductive layer 111 is formed by a plating process. Either electrolytic plating or electroless plating may be used as the plating treatment.
  • the conductive layer 111 has a function of a spacer in the step of forming the hard film 112 (see FIG. 21) and a function of a bonding portion 313 to which the wire 81 (see FIG. 2) is connected. If plating is used, the conductive layer 111 can be formed at a desired position in the Y direction shown in FIG. 2, such as between the drive ICs 7 and further outside the drive ICs 7 at both ends.
  • the conductive layer 111 can also be formed at a desired position in the X direction.
  • a conductive layer 111 that is not electrically connected to any signal, a conductive layer 111 that is connected to a ground potential, and the like can be formed. Can be formed.
  • the hard film 112 is a protective film of the outermost layer that directly rubs against the printing medium.
  • a film containing sialon, silicon carbide, or silicon nitride as a main component and having a hardness of about 1000 to 2000 HK can be used.
  • the thickness of the hard film is, for example, 5 to 8 ⁇ m.
  • the substrate 100 First, prepare the substrate 100. Next, as shown in FIGS. 5 and 6, the resist 101 is formed.
  • a part of the substrate 100 is removed to form the substrate 100a using the resist 101 as a mask.
  • a part of the substrate 100 can be removed by anisotropic etching using potassium hydroxide.
  • the resist 101 is peeled off.
  • the peeling can be performed using, for example, hydrofluoric acid.
  • a part of the substrate 100a is removed to form a substrate 11 having a main surface 15 and a first convex portion P1.
  • a part of the substrate 100a can be removed by anisotropic etching using tetramethylammonium hydroxide (TMAH).
  • TMAH tetramethylammonium hydroxide
  • the first convex portion P1 is formed.
  • the dimension (width dimension) of the first convex portion P1 in the sub-scanning direction X is about 300 to 700 ⁇ m
  • the dimension (thickness dimension) in the thickness direction Z is about 100 to 170 ⁇ m.
  • the heat storage layer 102 is formed on the main surface 15 of the substrate 11.
  • the heat storage layer 102 for example, TEOS or the like using CVD (Chemical Vapor Deposition) can be used.
  • the resistor film 103 as the heat generating portion and the wiring film 104 as the wiring are formed in order.
  • the resistor film 103 for example, tantalum nitride using sputtering or the like can be used.
  • the wiring film 104 for example, copper, titanium, or the like using sputtering can be used.
  • the resistor layer 109 and the wiring 107 can be formed, for example, by forming a resist and performing wet etching or the like using the resist as a mask. Further, the resistor layer 109 has a heat generating portion. By this step, the resistor layer pattern and the wiring pattern are formed in order from the lower layer.
  • the “wiring 107” includes, in addition to the wiring to which the signal is transmitted, a conductive layer pattern that is not electrically connected to any signal, a conductive layer pattern that is connected to the ground potential, and the like.
  • a protective film 110 is formed, an opening reaching the wiring 107 is formed in the protective film 110, and a conductive layer 111 is formed in the opening.
  • the protective film 110 for example, silicon nitride using CVD or the like can be used.
  • the opening can be formed, for example, by forming a resist and performing reactive ion etching or the like using the resist as a mask.
  • the conductive layer 111 for example, a configuration in which a layer containing nickel, a layer containing palladium, and a layer containing gold can be sequentially formed by plating can be used.
  • the conductive layer 111 is formed so as to fill the opening formed in the protective film 110, it is in contact with the inner surface of the protective film 110. Further, the conductive layer 111 is thicker than the protective film 110, and the height of the upper surface of the conductive layer 111 is higher than the upper surface of the protective film 110 around the conductive layer 111. Further, the conductive layer 111 has a flat upper surface.
  • the structure included in the thermal printhead of the present embodiment can be manufactured.
  • a hard film 112 is formed.
  • the hard film 112 may be in contact with the side surface of the substrate 11. Further, the hard film 112 may come into contact with a part of the back surface of the substrate 11. The hard film 112 is separated from the contact surface described later.
  • silicon carbide or the like formed by a vapor phase growth method for example, by a CVD method (chemical vapor deposition method)
  • the hard film 112 may be formed by the physical vapor deposition method.
  • the hard film 112 is collectively formed in a state where a plurality of the above-mentioned structures are stacked with the conductive layer 111 interposed therebetween.
  • the lower surface of the upper structure A and the surface of the protective film 110 and the surface of the hard film 112 on the upper surface of the lower structure B are separated from each other.
  • the structures A and B shown in FIG. 21 are in a state in which a plurality of head substrates 150 used for one thermal print head are connected to each other (a state in which a plurality of head substrates are connected along the Y direction in FIG. 1). ) May be.
  • a plurality of head substrates can be manufactured by individualizing one structure on which the hard film 112 is formed.
  • a dier may be used, or a cutting device using a laser beam may be used.
  • the head substrate may be cut after the blind holes are discretely formed by using a laser beam along the planned cutting line in one structure (head substrate) on which the hard film 112 is formed.
  • the thickness of the conductive layer 111 of the lower structure B increases the protective film 110 of the structure B and the upper structure.
  • the contact of A with the substrate 11 can be suppressed. Therefore, it is possible to prevent the back surface of the substrate 11 of the upper structure A from scratching (for example, cracking, disconnection, etc.) on the protective film 110 or the like of the lower structure B.
  • the back surface of the substrate 11 of the upper structure A has a contact surface in contact with the upper surface of the conductive layer 111 of the lower structure B.
  • the hard film 112 is formed on the back surface of the substrate 11 of the upper structure A, the contact surface and the hard film 112 are separated from each other. Therefore, the hard film 112 is not formed around the surface of the conductive layer 111 of the lower structure B. Since the surface of the conductive layer 111 of the lower structure B is exposed, the conductive layer 111 functions as a bonding portion. As a result, it is possible to obtain a thermal print head that ensures yield and reliability.
  • the thermal print head of the present embodiment can be manufactured.
  • the thermal printhead of the present embodiment has a conductive layer 111 that functions as a spacer in the step of forming the hard film 112. According to this embodiment, the thermal print head can be manufactured without increasing the number of manufacturing steps for forming the conductive layer 111 that functions as a spacer.
  • the thermal printhead of the present embodiment includes a substrate 11a having a first convex portion P1 and a second convex portion P2, a heat storage layer 102, a resistor layer 109 having a heat generating portion, and wiring 107.
  • the first convex portion P1 has a height higher than that of the second convex portion P2, and the protective film 110 has a protruding portion on the second convex portion P2, and the protruding portion has a flat upper surface.
  • the thermal print head includes one head substrate 150a manufactured from the above-mentioned structure.
  • the difference between the thermal print head of the present embodiment and the thermal print head of the above-described first embodiment is that, in the present embodiment, the substrate 11a having the first convex portion P1 and the second convex portion P2 is provided, and the bonding pad.
  • the thickness of the conductive layer 111 that functions as a function is about the same as usual.
  • the substrate 11a is made of a single crystal semiconductor.
  • the single crystal semiconductor for example, silicon can be used.
  • the height of the first convex portion P1 is higher than that of the second convex portion P2, for example, 20 to 170 ⁇ m or less, and the second convex portion P2 is, for example, 1 to 10 ⁇ m.
  • the first convex portion P1 and the second convex portion P2 each have a flat upper surface.
  • the protective film 110 on the second convex portion P2 has a protruding portion, and the protruding portion has a flat upper surface according to the shape of the second convex portion P2.
  • the step of manufacturing two or more of the above-mentioned structures and forming the hard film 112 a part of the structure A and a part of the structure B are superposed on each other with the protruding portion interposed therebetween (here). Then, the upper structure A overlaps the lower structure B in a part of the region).
  • the protruding portion of the protective film 110 of the structure B suppresses the contact between the protective film 110 and the back surface of the substrate 11a of the structure A other than the second convex portion of the structure B. can do. Therefore, it is possible to prevent the back surface of the substrate 11a of the upper structure A from scratching (for example, cracking, disconnection, etc.) the protective film 110 or the like of the lower structure B.
  • the substrate 11 is formed as in the first embodiment described above. Next, as shown in FIG. 23, the resist 101a is formed.
  • a part of the substrate 11 is removed to form a substrate 11a having a main surface 15, a first convex portion P1, and a second convex portion P2.
  • a part of the substrate 11 can be removed by anisotropic etching using potassium hydroxide.
  • the resist 101a is peeled off.
  • the peeling can be performed using, for example, hydrofluoric acid.
  • the heat storage layer 102, the resistor layer 109, and the wiring 107 are formed.
  • the above description of the first embodiment can be incorporated.
  • the protective film 110 and the conductive layer 111 are formed.
  • the above description of the first embodiment can be incorporated.
  • the structure included in the thermal printhead of the present embodiment can be manufactured.
  • a hard film 112 is formed.
  • the hard film 112 may be in contact with the side surface of the substrate 11a. Further, the hard film 112 may come into contact with a part of the back surface of the substrate 11a. The hard film 112 is separated from the contact surface described later.
  • the hard film 112 is collectively formed in a state where a plurality of the above-mentioned structures are stacked.
  • the lower surface of the upper structure A and the surface of the protective film 110 and the surface of the hard film 112 on the upper surface of the lower structure B are separated from each other.
  • the protruding portion of the protective film 110 of the lower structure B causes the second structure B to be second. It is possible to suppress the contact between the protective film 110 and the back surface of the substrate 11a of the structure A other than on the convex portion P2. Therefore, it is possible to prevent the back surface of the substrate 11a of the upper structure A from scratching (for example, cracking, disconnection, etc.) the protective film 110 or the like of the lower structure B.
  • the back surface of the substrate 11a of the upper structure A has a contact surface in contact with the upper surface of the protective film 110 on the second convex portion P2 of the lower structure B. If the hard film 112 is formed on the back surface of the substrate 11 in the state shown in FIG. 27, the contact surface and the hard film 112 are separated from each other.
  • the conductive layer 111 of the lower structure B is located on the back surface of the substrate 11a of the upper structure A with the second convex portion P2 of the structure B interposed therebetween, opposite to the side on which the hard film 112 is formed. To do. Therefore, the hard film 112 is not formed around the surface of the conductive layer 111 of the lower structure B. Since the surface of the conductive layer 111 of the lower structure B is exposed, the conductive layer 111 functions as a bonding portion. As a result, it is possible to obtain a thermal print head that ensures yield and reliability.
  • the thermal print head of the present embodiment can be manufactured. According to this embodiment, it is possible to manufacture a thermal printhead having an insulating protective film 110 on the second convex portion P2.
  • the protective film 110 on the second convex portion P2 functions as an insulating spacer in the step of forming the hard film 112.
  • first convex portion P1 for example, a glass material such as amorphous glass can be used.
  • the softening point of this glass material is, for example, 800 to 850 ° C.
  • the dimension of the first convex portion P1 in the sub-scanning direction X is, for example, about 500 to 600 ⁇ m.
  • the dimension of the first convex portion P1 in the thickness direction Z is, for example, about 20 to 100 ⁇ m.
  • the thermal print head is used in the state of being incorporated in the printer. As shown in FIG. 2, in the printer, each heat generating portion 41 of the thermal print head 10 faces the platen roller 802.
  • the platen roller 802 rotates so that the print medium 801 moves at a constant speed between the platen roller 802 and each heat generating portion 41 along the sub-scanning direction X (more accurately, the ⁇ X direction). Will be sent at.
  • the print medium 801 is pressed against the portion of the protective film 6 that covers each heat generating portion 41 by the platen roller 802.
  • a potential is selectively applied to each individual electrode 31 shown in FIG. 3 by the drive IC 7.
  • a voltage is applied between the common electrode 32 and each of the plurality of individual electrodes 31. Then, a current selectively flows through the plurality of heat generating portions 41 to generate heat. Then, the heat generated in each heat generating portion 41 is transferred to the print medium 801 through the protective film 6. Then, a plurality of dots are printed in the first line region linearly extending in the main scanning direction Y on the print medium 801. Further, the heat generated in each heat generating section 41 is also transmitted to the heat storage section 21 and stored in the heat storage section 21.
  • the print medium 801 is continuously fed at a constant speed along the sub-scanning direction X (more accurately, the ⁇ X direction). Then, similarly to printing on the first line region, printing is performed on the second line region adjacent to the first line region, which extends linearly in the main scanning direction Y on the print medium 801. At the time of printing on the second line region, in addition to the heat generated by each heat generating section 41, the heat stored in the heat storage section 21 at the time of printing on the first line region is transmitted to the printing medium 801. In this way, printing is performed on the second line area. As described above, printing is performed on the print medium 801 by printing a plurality of dots for each line region extending linearly in the main scanning direction Y on the print medium 801.

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Abstract

L'invention concerne une tête d'impression thermique comprenant : une structure ayant une partie en saillie sur un substrat, une couche de stockage de chaleur granulaire sur le substrat et la partie en saillie, une partie d'émission de chaleur sur la couche de stockage de chaleur, un câblage qui est formé à partir d'une couche métallique et relié à la partie d'émission de chaleur, un film protecteur sur le câblage et la couche de stockage de chaleur, et une couche électroconductrice qui est reliée à la couche métallique par l'intermédiaire d'une ouverture ménagée dans le film protecteur ; et un film dur en contact avec le film protecteur, la couche électroconductrice de la structure étant plus épaisse que le film protecteur et étant en contact avec la surface interne du film protecteur au niveau de l'ouverture, et la couche électroconductrice ayant une surface supérieure plate, de sorte que lorsqu'une pluralité de structures se chevauchent, un contact entre le film protecteur et le substrat est empêché par la couche électroconductrice, un endommagement de la couche de protection est empêché, et il est possible de former le film dur simultanément sur la pluralité de structures dans l'état dans lequel les structures se chevauchent.
PCT/JP2020/040438 2019-11-26 2020-10-28 Tête d'impression thermique et procédé pour sa fabrication WO2021106479A1 (fr)

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