WO2021103620A1 - 显示面板 - Google Patents
显示面板 Download PDFInfo
- Publication number
- WO2021103620A1 WO2021103620A1 PCT/CN2020/105243 CN2020105243W WO2021103620A1 WO 2021103620 A1 WO2021103620 A1 WO 2021103620A1 CN 2020105243 W CN2020105243 W CN 2020105243W WO 2021103620 A1 WO2021103620 A1 WO 2021103620A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic
- cathode
- display panel
- limiting member
- layer
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 14
- 239000001301 oxygen Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 12
- 125000006850 spacer group Chemical group 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 83
- 238000000034 method Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
Definitions
- This application relates to the field of display technology, and in particular to a display panel.
- the display panel is generally defined with a display area and a non-display area located around the display area.
- the cathode in the display panel generally extends from the display area to the non-display area, and is connected to the cathode lap component in the non-display area.
- the external drive circuit can The electrical signal is transmitted to the cathode through the cathode bonding assembly.
- the main technical problem to be solved by the present application is to provide a display panel that can reduce the corrosion of the cathode connecting wires by the water and oxygen in the organic planarization layer.
- a technical solution adopted in this application is to provide a display panel defined with a display area and a non-display area located around the display area, and the display panel includes: a cathode lap assembly located at all In the non-display area of the display panel, the cathode lap assembly includes an organic planarization layer, a sealing layer, a cathode connection line, and a cathode lead-out line stacked in sequence; wherein the cathode lead-out line extends to the display
- the cathode connection of the zone, the cathode connection line is used to receive an external circuit signal and transmit it to the cathode lead-out line, and the sealing layer is used to block water and oxygen in the organic planarization layer.
- the display panel provided by the present application includes a cathode lap assembly located in a non-display area, and the cathode lap assembly includes an organic planarization layer, a sealing layer, a cathode connection line, and a cathode lead-out line stacked in sequence.
- the cathode lead-out line extends to the cathode connection of the display area
- the cathode connection line is used to receive an external circuit signal and transmit it to the cathode lead-out line
- the sealing layer is used to block water and oxygen in the organic planarization layer.
- the above arrangement of the sealing layer can prevent the water and oxygen in the organic planarization layer from corroding the cathode connection line to protect the cathode connection line, so that the cathode lead-out line and the cathode connection line can be effectively overlapped, and the use of the display panel is improved. Life; and the design of the sealing layer is simple in process and easy to implement. It can make the cathode lead-out line and the cathode connecting line overlap across the entire surface, reduce the area occupied by the cathode lead-out line and the cathode connecting line, and help to achieve a narrow frame.
- FIG. 1 is a schematic structural diagram of an embodiment of a display panel of this application.
- the cathode lead-out line 1006 extends to be connected to the cathode 102 of the display area AA, and the cathode connection line 1004 is used to receive external circuit signals and transmit it to the cathode lead-out line 1006, and then to the cathode 102; the sealing layer 1002 is used to block organic The water and oxygen in the planarization layer 1000.
- the material of the anode 104 can be the same as the material of the cathode connection line 1004.
- the material can be indium tin oxide or the like. This design method can make the cathode connection line 1004 and the anode 104 be formed at the same time during preparation, thereby simplifying the preparation process.
- the above-mentioned arrangement of the first organic limiting member 1008 and the second organic limiting member 1001 can better limit the positions of the sealing layer 1002 and the cathode connecting line 1004, which is beneficial to control the frame width of the display panel 10.
- the first organic limiting member 1008 and the second organic limiting member 1001 are both in contact with the organic planarization layer 1000, and water and oxygen in the organic planarizing layer 1000 can pass through the first organic limiting member 1008 and the second organic limiting member 1008 and the second organic limiting member 1001.
- the positioning member 1001 spreads and disperses; and in order to further reduce water vapor, the first organic limiting member 1008 and the second organic limiting member 1001 may also be provided with dry particles.
- the display area AA of the display panel 10 may also include spacers (not shown) on the side of the pixel defining layer 106 away from the organic planarization layer 1000.
- the spacers are generally made of organic materials.
- the material of the first organic limiter 1008 and the second organic limiter 1001 can be the same as the material of the spacer, so that the first organic limiter 1008, the second organic limiter 1001 and the spacer can be manufactured during the manufacturing process. It is formed at the same time, reducing the difficulty of the preparation process.
- the first organic limiting member 1008 and the second organic limiting member 1001 may also be formed by stacking the pixel defining layer 106 and the spacer, which is not limited in this application.
- the side of the first organic limiting member 1008 away from the organic planarization layer 10001 is in contact with the light emitting layer 101 of the display area AA, that is, the first organic limiting member 1008 is in contact with the light emitting layer 101 of the display area AA.
- the first organic limiting member 1008 may be located at the boundary between the display area AA and the non-display area CC, thereby reducing the display panel.
- the CC width of the non-display area of 10 is conducive to achieving a narrow frame.
- the first organic limiting member 1008 includes a convex portion 10080 protruding from the cathode connecting line 1004, and the angle ⁇ between the side wall (not labeled) of the convex portion 10080 and the plane where the cathode connecting line 1004 is located It is greater than or equal to 90° and less than 180°, for example, the included angle ⁇ may be 120°, 135°, 150°, and so on. The design of the included angle can reduce the probability that the cathode lead wire 1006 covered on the first organic limiting member 1008 will be broken subsequently.
- This design method can make the space between the first organic limiter 1008 and the second organic limiter 1001 larger, increase the coverage area of the cathode connection line 1004, and increase the distance between the cathode lead-out line 1006 and the cathode connection line 1004
- the overlap area is reduced, the overlap resistance is reduced, and the display quality of the display panel is improved.
- the patterned concave-convex structure can increase the overlap area between the cathode lead-out line 1006a and the cathode connecting line 1004a, reduce the overlap resistance, and improve the display quality of the display panel; and under the same conditions, this design method is beneficial to reduce the display panel
- the frame width of 10a is conducive to achieving a narrow frame.
- the height h of the uneven structure on the surface of the organic planarization layer 1000a in FIG. 2 accounts for 0.2-0.8 (for example, 0.3, 0.5, 0.7, etc.) of the thickness of the entire organic planarization layer 1000a.
- the uneven structure within this thickness range can increase the contact area between the cathode lead-out line 1006a and the cathode connecting line 1004a, the unpatterned area remaining under the uneven structure of the organic planarization layer 1000a can ensure its impact on the particles on the underlying structure.
- FIG. 3 is a schematic structural diagram of another embodiment of the display panel of this application.
- the difference between the display panel 10c and the display panel 10 in FIG. 1 is that the sealing layer 1002c can further at least partially cover the opposed surfaces of the first organic limiting member 1008c and the second organic limiting member 1001c.
- This design method can reduce The water and oxygen in the first organic limiting member 1008c and the second organic limiting member 1001c on the peripheral side corrodes the cathode connecting line 1004c, so that the cathode lead-out line 1006c and the cathode connecting line 1004c can be effectively overlapped, and the display is improved.
- the service life of the panel 10c is improved.
- the substrate can be a rigid substrate or a flexible substrate.
- the substrate defines a display area AA and a non-display area CC.
- a thin film transistor layer is formed on one side of the substrate, the thin film transistor layer covers the display area AA, and the thin film transistor layer is used to drive the pixels in the display panel 10 to turn on or off.
- An organic planarization layer 1000 is formed on the side of the substrate provided with the thin film transistor layer, and the organic planarization layer 1000 covers the thin film transistor layer located in the display area AA and the non-display area CC.
- a patterned pixel defining layer 106 is formed at a position of the display area AA on the side of the organic planarization layer 1000 away from the substrate, and a first organic layer is formed at a position of the non-display area CC on the side of the organic planarization layer 1000 away from the substrate.
- the member 1008 and the second organic limit member 1001 can be formed at the same time.
- a cathode connection line 1004 is formed on the sealing layer 1002, and an anode 104 is formed in the opening of the pixel defining layer 106; when the material of the cathode connection line 1004 and the anode 104 are the same, the cathode connection line 1004 and the anode 104 can be formed at the same time.
- a light-emitting layer 101 is formed on the anode 104.
- a cathode lead wire 1006 is formed on the cathode connecting wire 1004, a cathode 102 is formed on the light-emitting layer 101, and the cathode 102 is electrically connected to the cathode lead wire 1006; when the material of the cathode lead wire 1006 and the cathode 102 are the same, the cathode lead The wire 1006 and the cathode 102 may be formed at the same time.
- the manufacturing method provided by the present application further includes: patterning is located between the first organic limiting member 1008a and the second organic limiting member 1001a The surface of the organic planarization layer 1000a is far away from the substrate to form a concave-convex structure on the surface of the organic planarization layer 1000a.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (16)
- 一种显示面板,定义有显示区和位于所述显示区周围的非显示区,所述显示面板包括:阴极搭接组件,位于所述显示面板的所述非显示区,所述阴极搭接组件包括依次层叠设置的有机平坦化层、密封层、阴极连接线和阴极引出线;其中,所述阴极引出线延伸至与所述显示区的所述阴极连接,所述阴极连接线用于接收外部电路信号并将其传递至所述阴极引出线,所述密封层用于阻隔所述有机平坦化层中的水氧。
- 根据权利要求1所述的显示面板,其中,所述阴极搭接组件还包括:间隔设置的第一有机限位件和第二有机限位件,位于所述有机平坦化层上,且所述第一有机限位件相对所述第二有机限位件靠近所述显示面板的所述显示区,所述密封层和所述阴极连接线位于所述第一有机限位件和所述第二有机限位件之间的间隔区域内。
- 根据权利要求2所述的显示面板,其中,所述有机平坦化层延伸至所述显示面板的所述显示区,所述显示区包括位于所述有机平坦化层一侧的像素界定层;所述第一有机限位件、所述第二有机限位件和所述像素界定层的材质相同。
- 根据权利要求2所述的显示面板,其中,所述有机平坦化层延伸至所述显示面板的所述显示区,所述显示区包括位于所述有机平坦化层一侧的像素界定层以及位于所述像素界定层远离所述有机平坦化层一侧的间隔件;所述第一有机限位件、所述第二有机限位件和所述间隔件的材质相同。
- 根据权利要求2所述的显示面板,其中,所述第一有机限位件包括凸出于所述阴极连接线的凸部,且所述凸部的侧壁与所述阴极连接线所在平面的夹角大于等于90°且小于180°。
- 根据权利要求5所述的显示面板,其中,在所述有机平坦化层至所述阴极连接线方向上,所述第一有机限位件的截面为正梯形。
- 根据权利要求6所述的显示面板,其中,在所述有机平坦化层至所述阴极连接线方向上,所述第二有机限位件的截面为倒梯形。
- 根据权利要求2所述的显示面板,其中,位于所述第一有机限位件和所述第二有机限位件之间的所述有机平坦化层面向所述阴极连接线一侧表面为连续的凹凸结构,所述密封层、所述阴极连接线覆盖所述凹凸结构,所述密封层、所述阴极呈连续的凹凸状。
- 根据权利要求8所述的显示面板,其中,在所述有机平坦化层至所述阴极连接线方向上,所述凹凸结构中凸起的截面可以为方形、矩形、菱形、梯形中任意一种;所述凹凸结构在有机平坦化层上的正投影为网状。
- 根据权利要求8所述的显示面板,其中,所述有机平坦化层表面的所述凹凸结构的高度占整个所述有机平坦化层厚度的20%-80%。
- 根据权利要求2所述的显示面板,其中,所述密封层进一步覆盖所述第一有机限位件和所述第二有机限位件相对设置的至少部分表面。
- 根据权利要求1所述的显示面板,其中,所述密封层由氧化硅、氮化硅、氧化铝、石墨烯中一层或者多层叠加形成。
- 根据权利要求1所述的显示面板,其中,所述密封层的厚度为0.5-3微米。
- 根据权利要求13所述的显示面板,其中,当所述密封层的材质包括氧化铝时,所述密封层的厚度为0.5-1微米。
- 根据权利要求1所述的显示面板,其中,所述显示面板的所述显示区还包括阳极,所述阳极与所述阴极连接线的材质相同。
- 根据权利要求1所述的显示面板,其中,所述阴极引出线与所述阴极材质相同。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2021577663A JP7299357B2 (ja) | 2019-11-25 | 2020-07-28 | 表示パネル |
KR1020217041308A KR102678126B1 (ko) | 2019-11-25 | 2020-07-28 | 디스플레이 패널 |
EP20894904.0A EP3982415A4 (en) | 2019-11-25 | 2020-07-28 | BILLBOARD |
US17/523,110 US20220069253A1 (en) | 2019-11-25 | 2021-11-10 | Display panel |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201911166890.2 | 2019-11-25 | ||
CN201911166890.2A CN110752250B (zh) | 2019-11-25 | 2019-11-25 | 一种显示面板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US17/523,110 Continuation US20220069253A1 (en) | 2019-11-25 | 2021-11-10 | Display panel |
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WO2021103620A1 true WO2021103620A1 (zh) | 2021-06-03 |
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PCT/CN2020/105243 WO2021103620A1 (zh) | 2019-11-25 | 2020-07-28 | 显示面板 |
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US (1) | US20220069253A1 (zh) |
EP (1) | EP3982415A4 (zh) |
JP (1) | JP7299357B2 (zh) |
CN (1) | CN110752250B (zh) |
WO (1) | WO2021103620A1 (zh) |
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CN110752250B (zh) * | 2019-11-25 | 2021-08-17 | 昆山国显光电有限公司 | 一种显示面板 |
US20220399426A1 (en) * | 2020-12-16 | 2022-12-15 | Boe Technology Group Co., Ltd. | Display device, display panel and fabrication method thereof |
IT202100009077A1 (it) | 2021-04-12 | 2022-10-12 | Silva Hotel Splendid S R L | Kit d’interfaccia, automatizzato, per l’assistenza ed il monitoraggio nelle strutture alberghiere e sistema ad esso associato |
CN113871433A (zh) * | 2021-09-17 | 2021-12-31 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
WO2023227925A1 (en) * | 2022-05-26 | 2023-11-30 | Silva Hotel Splendid S.R.L. | Automated interface kit, for assistance and monitoring in hotel structures and system associated therewith |
Citations (9)
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CN110752250B (zh) | 2021-08-17 |
EP3982415A1 (en) | 2022-04-13 |
US20220069253A1 (en) | 2022-03-03 |
KR20220002680A (ko) | 2022-01-06 |
EP3982415A4 (en) | 2022-09-07 |
JP7299357B2 (ja) | 2023-06-27 |
CN110752250A (zh) | 2020-02-04 |
JP2022538329A (ja) | 2022-09-01 |
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