WO2021103620A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2021103620A1
WO2021103620A1 PCT/CN2020/105243 CN2020105243W WO2021103620A1 WO 2021103620 A1 WO2021103620 A1 WO 2021103620A1 CN 2020105243 W CN2020105243 W CN 2020105243W WO 2021103620 A1 WO2021103620 A1 WO 2021103620A1
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WO
WIPO (PCT)
Prior art keywords
organic
cathode
display panel
limiting member
layer
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Application number
PCT/CN2020/105243
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English (en)
French (fr)
Inventor
刘明星
赵晶晶
冯士振
李文星
李伟丽
甘帅燕
Original Assignee
昆山国显光电有限公司
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Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Priority to JP2021577663A priority Critical patent/JP7299357B2/ja
Priority to KR1020217041308A priority patent/KR102678126B1/ko
Priority to EP20894904.0A priority patent/EP3982415A4/en
Publication of WO2021103620A1 publication Critical patent/WO2021103620A1/zh
Priority to US17/523,110 priority patent/US20220069253A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant

Definitions

  • This application relates to the field of display technology, and in particular to a display panel.
  • the display panel is generally defined with a display area and a non-display area located around the display area.
  • the cathode in the display panel generally extends from the display area to the non-display area, and is connected to the cathode lap component in the non-display area.
  • the external drive circuit can The electrical signal is transmitted to the cathode through the cathode bonding assembly.
  • the main technical problem to be solved by the present application is to provide a display panel that can reduce the corrosion of the cathode connecting wires by the water and oxygen in the organic planarization layer.
  • a technical solution adopted in this application is to provide a display panel defined with a display area and a non-display area located around the display area, and the display panel includes: a cathode lap assembly located at all In the non-display area of the display panel, the cathode lap assembly includes an organic planarization layer, a sealing layer, a cathode connection line, and a cathode lead-out line stacked in sequence; wherein the cathode lead-out line extends to the display
  • the cathode connection of the zone, the cathode connection line is used to receive an external circuit signal and transmit it to the cathode lead-out line, and the sealing layer is used to block water and oxygen in the organic planarization layer.
  • the display panel provided by the present application includes a cathode lap assembly located in a non-display area, and the cathode lap assembly includes an organic planarization layer, a sealing layer, a cathode connection line, and a cathode lead-out line stacked in sequence.
  • the cathode lead-out line extends to the cathode connection of the display area
  • the cathode connection line is used to receive an external circuit signal and transmit it to the cathode lead-out line
  • the sealing layer is used to block water and oxygen in the organic planarization layer.
  • the above arrangement of the sealing layer can prevent the water and oxygen in the organic planarization layer from corroding the cathode connection line to protect the cathode connection line, so that the cathode lead-out line and the cathode connection line can be effectively overlapped, and the use of the display panel is improved. Life; and the design of the sealing layer is simple in process and easy to implement. It can make the cathode lead-out line and the cathode connecting line overlap across the entire surface, reduce the area occupied by the cathode lead-out line and the cathode connecting line, and help to achieve a narrow frame.
  • FIG. 1 is a schematic structural diagram of an embodiment of a display panel of this application.
  • the cathode lead-out line 1006 extends to be connected to the cathode 102 of the display area AA, and the cathode connection line 1004 is used to receive external circuit signals and transmit it to the cathode lead-out line 1006, and then to the cathode 102; the sealing layer 1002 is used to block organic The water and oxygen in the planarization layer 1000.
  • the material of the anode 104 can be the same as the material of the cathode connection line 1004.
  • the material can be indium tin oxide or the like. This design method can make the cathode connection line 1004 and the anode 104 be formed at the same time during preparation, thereby simplifying the preparation process.
  • the above-mentioned arrangement of the first organic limiting member 1008 and the second organic limiting member 1001 can better limit the positions of the sealing layer 1002 and the cathode connecting line 1004, which is beneficial to control the frame width of the display panel 10.
  • the first organic limiting member 1008 and the second organic limiting member 1001 are both in contact with the organic planarization layer 1000, and water and oxygen in the organic planarizing layer 1000 can pass through the first organic limiting member 1008 and the second organic limiting member 1008 and the second organic limiting member 1001.
  • the positioning member 1001 spreads and disperses; and in order to further reduce water vapor, the first organic limiting member 1008 and the second organic limiting member 1001 may also be provided with dry particles.
  • the display area AA of the display panel 10 may also include spacers (not shown) on the side of the pixel defining layer 106 away from the organic planarization layer 1000.
  • the spacers are generally made of organic materials.
  • the material of the first organic limiter 1008 and the second organic limiter 1001 can be the same as the material of the spacer, so that the first organic limiter 1008, the second organic limiter 1001 and the spacer can be manufactured during the manufacturing process. It is formed at the same time, reducing the difficulty of the preparation process.
  • the first organic limiting member 1008 and the second organic limiting member 1001 may also be formed by stacking the pixel defining layer 106 and the spacer, which is not limited in this application.
  • the side of the first organic limiting member 1008 away from the organic planarization layer 10001 is in contact with the light emitting layer 101 of the display area AA, that is, the first organic limiting member 1008 is in contact with the light emitting layer 101 of the display area AA.
  • the first organic limiting member 1008 may be located at the boundary between the display area AA and the non-display area CC, thereby reducing the display panel.
  • the CC width of the non-display area of 10 is conducive to achieving a narrow frame.
  • the first organic limiting member 1008 includes a convex portion 10080 protruding from the cathode connecting line 1004, and the angle ⁇ between the side wall (not labeled) of the convex portion 10080 and the plane where the cathode connecting line 1004 is located It is greater than or equal to 90° and less than 180°, for example, the included angle ⁇ may be 120°, 135°, 150°, and so on. The design of the included angle can reduce the probability that the cathode lead wire 1006 covered on the first organic limiting member 1008 will be broken subsequently.
  • This design method can make the space between the first organic limiter 1008 and the second organic limiter 1001 larger, increase the coverage area of the cathode connection line 1004, and increase the distance between the cathode lead-out line 1006 and the cathode connection line 1004
  • the overlap area is reduced, the overlap resistance is reduced, and the display quality of the display panel is improved.
  • the patterned concave-convex structure can increase the overlap area between the cathode lead-out line 1006a and the cathode connecting line 1004a, reduce the overlap resistance, and improve the display quality of the display panel; and under the same conditions, this design method is beneficial to reduce the display panel
  • the frame width of 10a is conducive to achieving a narrow frame.
  • the height h of the uneven structure on the surface of the organic planarization layer 1000a in FIG. 2 accounts for 0.2-0.8 (for example, 0.3, 0.5, 0.7, etc.) of the thickness of the entire organic planarization layer 1000a.
  • the uneven structure within this thickness range can increase the contact area between the cathode lead-out line 1006a and the cathode connecting line 1004a, the unpatterned area remaining under the uneven structure of the organic planarization layer 1000a can ensure its impact on the particles on the underlying structure.
  • FIG. 3 is a schematic structural diagram of another embodiment of the display panel of this application.
  • the difference between the display panel 10c and the display panel 10 in FIG. 1 is that the sealing layer 1002c can further at least partially cover the opposed surfaces of the first organic limiting member 1008c and the second organic limiting member 1001c.
  • This design method can reduce The water and oxygen in the first organic limiting member 1008c and the second organic limiting member 1001c on the peripheral side corrodes the cathode connecting line 1004c, so that the cathode lead-out line 1006c and the cathode connecting line 1004c can be effectively overlapped, and the display is improved.
  • the service life of the panel 10c is improved.
  • the substrate can be a rigid substrate or a flexible substrate.
  • the substrate defines a display area AA and a non-display area CC.
  • a thin film transistor layer is formed on one side of the substrate, the thin film transistor layer covers the display area AA, and the thin film transistor layer is used to drive the pixels in the display panel 10 to turn on or off.
  • An organic planarization layer 1000 is formed on the side of the substrate provided with the thin film transistor layer, and the organic planarization layer 1000 covers the thin film transistor layer located in the display area AA and the non-display area CC.
  • a patterned pixel defining layer 106 is formed at a position of the display area AA on the side of the organic planarization layer 1000 away from the substrate, and a first organic layer is formed at a position of the non-display area CC on the side of the organic planarization layer 1000 away from the substrate.
  • the member 1008 and the second organic limit member 1001 can be formed at the same time.
  • a cathode connection line 1004 is formed on the sealing layer 1002, and an anode 104 is formed in the opening of the pixel defining layer 106; when the material of the cathode connection line 1004 and the anode 104 are the same, the cathode connection line 1004 and the anode 104 can be formed at the same time.
  • a light-emitting layer 101 is formed on the anode 104.
  • a cathode lead wire 1006 is formed on the cathode connecting wire 1004, a cathode 102 is formed on the light-emitting layer 101, and the cathode 102 is electrically connected to the cathode lead wire 1006; when the material of the cathode lead wire 1006 and the cathode 102 are the same, the cathode lead The wire 1006 and the cathode 102 may be formed at the same time.
  • the manufacturing method provided by the present application further includes: patterning is located between the first organic limiting member 1008a and the second organic limiting member 1001a The surface of the organic planarization layer 1000a is far away from the substrate to form a concave-convex structure on the surface of the organic planarization layer 1000a.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供了一种显示面板，定义有显示区和位于所述显示区周围的非显示区，所述显示面板包括：阴极搭接组件，位于所述显示面板的所述非显示区，所述阴极搭接组件包括依次层叠设置的有机平坦化层、密封层、阴极连接线和阴极引出线；其中，所述阴极引出线延伸至与所述显示区的所述阴极连接，所述阴极连接线用于接收外部电路信号并将其传递至所述阴极引出线，所述密封层用于阻隔所述有机平坦化层中的水氧。通过上述方式，本申请能够降低有机平坦化层中的水氧对阴极连接线的侵蚀。

Description

显示面板
本申请要求在2019年11月25日提交中国专利局、申请号为201911166890.2的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别是涉及一种显示面板。
背景技术
显示面板一般定义有显示区和位于显示区周围的非显示区，显示面板中的阴极一般会从显示区延伸至非显示区，并与非显示区中的阴极搭接组件连接，外界驱动电路可以将电信号通过阴极搭接组件传递至阴极。
但是，阴极搭接组件中的电线容易受到周围有机物中存在的微量的水氧的侵蚀，进而可能会影响显示品质。
发明内容
本申请主要解决的技术问题是提供一种显示面板，能够降低有机平坦化层中的水氧对阴极连接线的侵蚀。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种显示面板，定义有显示区和位于所述显示区周围的非显示区，所述显示面板包括：阴极搭接组件，位于所述显示面板的所述非显示区，所述阴极搭接组件包括依次层叠设置的有机平坦化层、密封层、阴极连接线和阴极引出线；其中，所述阴极引出线延伸至与所述显示区的所述阴极连接，所述阴极连接线用于接收外部电路信号并将其传递至所述阴极引出线，所述密封层用于阻隔所述有机平坦化层中的水氧。
本申请的有益效果是：本申请所提供的显示面板中包括位于非显示区的阴极搭接组件，阴极搭接组件包括依次层叠设置的有机平坦化层、密封层、阴极连接线和阴极引出线；其中，阴极引出线延伸至与显示区的阴极连接，阴极连接线用于接收外部电路信号并将其传递至阴极引出线，密封层用于阻隔有机平坦化层中的水氧。上述密封层的设置方式可以阻隔有机平坦化层中的水氧对阴极连接线的侵蚀，以保护阴极连接线，使得阴极引出线和阴极连接线之间可以 实现有效搭接，提高显示面板的使用寿命；且上述密封层的设计方式工艺简单，易于实现，可以使得阴极引出线和阴极连接线实现整面搭接，降低阴极引出线和阴极连接线所占面积，有利于实现窄边框。
【附图说明】
图1为本申请显示面板一实施方式的结构示意图；
图2为本申请显示面板另一实施方式的结构示意图；
图3为本申请显示面板又一实施方式的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本申请保护的范围。
请参阅图1，图1为本申请显示面板一实施方式的结构示意图，该显示面板10可以是OLED显示面板、Micro-LED显示面板等，其定义有显示区AA和位于显示区AA周围的非显示区CC。该显示面板10包括阴极搭接组件100，位于显示面板10的非显示区CC，阴极搭接组件100包括依次层叠设置的有机平坦化层1000、密封层1002、阴极连接线1004和阴极引出线1006。其中，阴极引出线1006延伸至与显示区AA的阴极102连接，阴极连接线1004用于接收外部电路信号并将其传递至阴极引出线1006，进而传递至阴极102；密封层1002用于阻隔有机平坦化层1000中的水氧。
在本实施例中，密封层1002可以由氧化硅、氮化硅、氧化铝、石墨烯中一层或者多层叠加形成。上述材质的密封层1002容易获得，且阻水氧效果较好。密封层1002的厚度可以为0.5微米-3微米，例如，1微米、2微米等。该厚度范围内的密封层1002不仅可以满足阻隔水氧的效果，而且不会增加显示面板10的边框厚度。当密封层1002中的材质包括氧化铝时，由于氧化铝材质的致密性较高，其厚度可以在较薄范围内，例如，0.5微米-1微米(例如，0.6微米、0.8微米等)。
上述密封层1002的设置方式可以阻隔有机平坦化层1000中的水氧对阴极连接线1004的侵蚀，以保护阴极连接线1004，使得阴极引出线1006和阴极连 接线1004之间可以实现有效搭接，提高显示面板10的使用寿命；且上述密封层1002的设计方式工艺简单，易于实现，可以使得阴极引出线1006和阴极连接线1004实现整面搭接，降低阴极引出线1006和阴极连接线1004所占面积，有利于实现窄边框。
在本实施例中，上述有机平坦化层1000还可进一步延伸至显示面板10的显示区AA，有机平坦化层1000背离阴极引出线1006和阴极102的一侧还可设置有其他结构，有机平坦化层1000可以减小或者最小化工艺过程导致的其他结构表面不平整的问题。
此外，上述阴极引出线1006可以与阴极102的材质相同，其材质可以为金属，例如，镁银合金等，该设计方式可以使得阴极引出线1006与阴极102在制备时同时形成(例如，通过蒸镀的方式同时形成)，从而简化制备工艺流程。另外，上述显示面板10的显示区AA还包括阳极104，阳极104与阴极102相对间隔设置，且阳极104相对阴极102靠近有机平坦化层1000，阳极104的材质可以与阴极连接线1004的材质相同，其材质可以为氧化铟锡等，该设计方式可以使得阴极连接线1004与阳极104在制备时同时形成，从而简化制备工艺流程。
进一步，上述显示面板10的显示区AA的阳极104和阴极102之间的相对间隔设置的区域内还可设置有发光层101，发光层101可以发红光、绿光或蓝光等，发光层101的最外侧边界可以视为显示区AA和非显示区CC的界限。
请继续参阅图1，上述阴极搭接组件100还包括间隔设置的第一有机限位件1008和第二有机限位件1001。第一有机限位件1008和第二有机限位件1001位于有机平坦化层1000上，且第一有机限位件1008相对第二有机限位件1001靠近显示面板10的显示区AA，密封层1002和阴极连接线1004位于第一有机限位件1008和第二有机限位件1001之间的间隔区域内，而阴极引出线1006则覆盖第一有机限位件1008和第二有机限位件1001之间的间隔区域以及进一步覆盖第一有机限位件1008表面，以与位于显示区AA的阴极102连接。上述第一有机限位件1008和第二有机限位件1001的设置方式可以较好的限定密封层1002和阴极连接线1004的位置，有利于控制显示面板10的边框宽度。此外，上述第一有机限位件1008和第二有机限位件1001均与有机平坦化层1000接触，有机平坦化层1000中的水氧可以通过第一有机限位件1008和第二有机限位件1001传播并分散；而为了进一步降低水汽，第一有机限位件1008和第二有机限位件1001内部也可设置有干燥颗粒。
一般而言，显示面板10的显示区AA包括位于显示区AA的有机平坦化层1000上的像素界定层106。像素界定层106的材质一般为有机物，像素界定层106之间的开口区域内设置有各个子像素对应的阳极104、发光层101和阴极102。上述第一有机限位件1008和第二有机限位件1001的材质可以与像素界定层106的材质相同，从而第一有机限位件1008、第二有机限位件1001和像素界定层106在制备过程中可以同时形成，降低制备工艺难度。或者，显示面板10的显示区AA也可包括位于像素界定层106远离有机平坦化层1000一侧的间隔件(图未示)，，间隔件的材质一般为有机物。上述第一有机限位件1008和第二有机限位件1001的材质可以与间隔件的材质相同，从而第一有机限位件1008、第二有机限位件1001和间隔件在制备过程中可以同时形成，降低制备工艺难度。又或者，上述第一有机限位件1008和第二有机限位件1001也可以由上述像素界定层106和间隔件层叠设置形成，本申请对此不作限定。
此外，在本实施例中，请继续参阅图1，第一有机限位件1008远离有机平坦化层10001的一侧与显示区AA的发光层101接触，即第一有机限位件1008除了起到限定密封层1002、阴极连接线1004的作用外，还起到限定发光层101的作用，第一有机限位件1008可以处于显示区AA与非显示区CC的分界线处，从而降低显示面板10的非显示区CC宽度，有利于实现窄边框。
进一步，请继续参阅图1，第一有机限位件1008包括凸出于阴极连接线1004的凸部10080，且凸部10080的侧壁(未标示)与阴极连接线1004所在平面的夹角α大于等于90°且小于180°，例如，该夹角α可以为120°、135°、150°等。该夹角的设计方式可以使得后续覆盖在第一有机限位件1008上的阴极引出线1006断裂的概率降低。
在一个实施例中，在有机平坦化层1000至阴极连接线1004方向上，第一有机限位件1008的截面为正梯形。该设计方式可以使得覆盖在第一有机限位件1008上的阴极引出线1006断裂的概率降低，且还可以降低形成该第一有机限位件1008的工艺复杂程度。进一步，如图1所示，在有机平坦化层1000至阴极连接线1004方向上，第二有机限位件1001的截面为倒梯形。该设计方式可以使得第一有机限位件1008和第二有机限位件1001之间的间隔空间变大，增加阴极连接线1004的覆盖面积，增大阴极引出线1006与阴极连接线1004之间的搭接面积，降低搭接电阻，提高显示面板的显示品质。
当然，在其他实施例中，在有机平坦化层1000至阴极连接线1004方向上， 上述第一有机限位件1008和第二有机限位件1001也可为其他结构，例如，上述第一有机限位件1008的凸部10080为正梯形，而位于凸部10080以下的部分可以为柱体、或其他类型的梯形等。又例如，上述第一有机限位件1008和第二有机限位件1001的截面均可为柱体等。
在又一个实施方式中，请参阅图2，图2为本申请显示面板另一实施方式的结构示意图。位于第一有机限位件1008a和第二有机限位件1001a之间的有机平坦化层1000a面向阴极连接线1004a一侧表面为连续的凹凸结构(未标示)，密封层1002a、阴极连接线1004a覆盖该凹凸结构，且为连续的凹凸状。该图案化的凹凸结构可以增加阴极引出线1006a与阴极连接线1004a之间的搭接面积，降低搭接电阻，提高显示面板的显示品质；且在同等条件下，该设计方式有利于降低显示面板10a的边框宽度，即有利于实现窄边框。
在本实施例中，在有机平坦化层1000a至阴极连接线1004a方向上，图2中有机平坦化层1000a表面的凹凸结构中凸起的截面可以为方形、矩形、菱形、正梯形等。而该凹凸结构在有机平坦化层1000a面向阴极连接线1004a一侧表面上的正投影可以为网状或其他形状，该网状可以为蜂窝状等，本申请对此不作限定。
此外，图2中有机平坦化层1000a表面的凹凸结构的高度h占整个有机平坦化层1000a厚度的0.2-0.8(例如，0.3、0.5、0.7等)。该厚度范围内的凹凸结构在可以增加阴极引出线1006a与阴极连接线1004a接触面积的前提下，有机平坦化层1000a的凹凸结构下方保留的未图案化的区域可以保证其对下层结构上颗粒等不平表面覆盖的能力。
在又一个实施方式中，请参阅图3，图3为本申请显示面板又一实施方式的结构示意图。该显示面板10c与上述图1中的显示面板10的区别在于，密封层1002c可以进一步至少部分覆盖第一有机限位件1008c和第二有机限位件1001c相对设置的表面，该设计方式可以降低周侧的第一有机限位件1008c和第二有机限位件1001c中水氧对阴极连接线1004c的侵蚀，以使得阴极引出线1006c和阴极连接线1004c之间可以实现有效搭接，提高显示面板10c的使用寿命。
下面请再次参阅图1，从制备方法的角度对本申请所提供的显示面板10作进一步说明。
A、提供衬底(图1中未示)，该衬底可以是刚性衬底，也可以是柔性衬底，衬底定义有显示区AA和非显示区CC。
B、在衬底一侧形成薄膜晶体管层，薄膜晶体管层覆盖显示区AA，该薄膜晶体管层用于驱动显示面板10中的像素点亮或者关闭。
C、在衬底设置有薄膜晶体管层一侧形成有机平坦化层1000，有机平坦化层1000覆盖位于显示区AA的薄膜晶体管层、以及非显示区CC。
D、在有机平坦化层1000背离衬底一侧的显示区AA位置处形成图案化的像素界定层106、在有机平坦化层1000背离衬底一侧的非显示区CC位置处形成第一有机限位件1008和第二有机限位件1001；其中，当像素界定层106、第一有机限位件1008、第二有机限位件1001材质相同时，像素界定层106、第一有机限位件1008、第二有机限位件1001可以同时形成。
E、在第一有机限位件1008和第二有机限位件1001之间的间隔区域内采用化学气相沉积方法形成密封层1002。
F、在密封层1002上形成阴极连接线1004、在像素界定层106的开口内形成阳极104；当阴极连接线1004和阳极104的材质相同时，阴极连接线1004可以与阳极104同时形成。
G、在阳极104上形成发光层101。
H、在阴极连接线1004上形成阴极引出线1006、在发光层101上形成阴极102，且阴极102与阴极引出线1006之间电连接；当阴极引出线1006和阴极102材质相同时，阴极引出线1006和阴极102可以同时形成。
当显示面板10a的结构为图2中所示时，在上述步骤E之前，本申请所提供的制备方法还包括：图案化位于第一有机限位件1008a和第二有机限位件1001a之间的有机平坦化层1000a远离衬底一侧表面，以在有机平坦化层1000a表面形成凹凸结构。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (16)

  1. 一种显示面板，定义有显示区和位于所述显示区周围的非显示区，所述显示面板包括：
    阴极搭接组件，位于所述显示面板的所述非显示区，所述阴极搭接组件包括依次层叠设置的有机平坦化层、密封层、阴极连接线和阴极引出线；
    其中，所述阴极引出线延伸至与所述显示区的所述阴极连接，所述阴极连接线用于接收外部电路信号并将其传递至所述阴极引出线，所述密封层用于阻隔所述有机平坦化层中的水氧。
  2. 根据权利要求1所述的显示面板，其中，所述阴极搭接组件还包括：
    间隔设置的第一有机限位件和第二有机限位件，位于所述有机平坦化层上，且所述第一有机限位件相对所述第二有机限位件靠近所述显示面板的所述显示区，所述密封层和所述阴极连接线位于所述第一有机限位件和所述第二有机限位件之间的间隔区域内。
  3. 根据权利要求2所述的显示面板，其中，
    所述有机平坦化层延伸至所述显示面板的所述显示区，所述显示区包括位于所述有机平坦化层一侧的像素界定层；所述第一有机限位件、所述第二有机限位件和所述像素界定层的材质相同。
  4. 根据权利要求2所述的显示面板，其中，
    所述有机平坦化层延伸至所述显示面板的所述显示区，所述显示区包括位于所述有机平坦化层一侧的像素界定层以及位于所述像素界定层远离所述有机平坦化层一侧的间隔件；所述第一有机限位件、所述第二有机限位件和所述间隔件的材质相同。
  5. 根据权利要求2所述的显示面板，其中，
    所述第一有机限位件包括凸出于所述阴极连接线的凸部，且所述凸部的侧壁与所述阴极连接线所在平面的夹角大于等于90°且小于180°。
  6. 根据权利要求5所述的显示面板，其中，
    在所述有机平坦化层至所述阴极连接线方向上，所述第一有机限位件的截面为正梯形。
  7. 根据权利要求6所述的显示面板，其中，
    在所述有机平坦化层至所述阴极连接线方向上，所述第二有机限位件的截面为倒梯形。
  8. 根据权利要求2所述的显示面板，其中，
    位于所述第一有机限位件和所述第二有机限位件之间的所述有机平坦化层面向所述阴极连接线一侧表面为连续的凹凸结构，所述密封层、所述阴极连接线覆盖所述凹凸结构，所述密封层、所述阴极呈连续的凹凸状。
  9. 根据权利要求8所述的显示面板，其中，
    在所述有机平坦化层至所述阴极连接线方向上，所述凹凸结构中凸起的截面可以为方形、矩形、菱形、梯形中任意一种；所述凹凸结构在有机平坦化层上的正投影为网状。
  10. 根据权利要求8所述的显示面板，其中，
    所述有机平坦化层表面的所述凹凸结构的高度占整个所述有机平坦化层厚度的20％-80％。
  11. 根据权利要求2所述的显示面板，其中，
    所述密封层进一步覆盖所述第一有机限位件和所述第二有机限位件相对设置的至少部分表面。
  12. 根据权利要求1所述的显示面板，其中，
    所述密封层由氧化硅、氮化硅、氧化铝、石墨烯中一层或者多层叠加形成。
  13. 根据权利要求1所述的显示面板，其中，
    所述密封层的厚度为0.5-3微米。
  14. 根据权利要求13所述的显示面板，其中，
    当所述密封层的材质包括氧化铝时，所述密封层的厚度为0.5-1微米。
  15. 根据权利要求1所述的显示面板，其中，
    所述显示面板的所述显示区还包括阳极，所述阳极与所述阴极连接线的材质相同。
  16. 根据权利要求1所述的显示面板，其中，
    所述阴极引出线与所述阴极材质相同。
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US20220069253A1 (en) 2022-03-03
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EP3982415A4 (en) 2022-09-07
JP7299357B2 (ja) 2023-06-27
CN110752250A (zh) 2020-02-04
JP2022538329A (ja) 2022-09-01

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