WO2021096245A3 - 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 - Google Patents

치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 Download PDF

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WO2021096245A3
WO2021096245A3 PCT/KR2020/015881 KR2020015881W WO2021096245A3 WO 2021096245 A3 WO2021096245 A3 WO 2021096245A3 KR 2020015881 W KR2020015881 W KR 2020015881W WO 2021096245 A3 WO2021096245 A3 WO 2021096245A3
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Prior art keywords
polyimide film
manufacturing
dianhydride
dimensional stability
improved dimensional
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PCT/KR2020/015881
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English (en)
French (fr)
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WO2021096245A2 (ko
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이길남
김기훈
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피아이첨단소재 주식회사
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Priority to CN202080077421.8A priority Critical patent/CN114651036B/zh
Publication of WO2021096245A2 publication Critical patent/WO2021096245A2/ko
Publication of WO2021096245A3 publication Critical patent/WO2021096245A3/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

본 발명은 벤조페논테트라카복실릭디안하이드라이드(BTDA), 비페닐테트라카르복실릭디안하이드라이드(BPDA) 및 피로멜리틱디안하이드라이드(PMDA)을 포함하는 이무수물산 성분과, 옥시디아닐린(ODA), 파라페닐렌 디아민(PPD) 및 3,5-디아미노벤조산(DABA)을 포함하는 디아민 성분을 포함하는 폴리아믹산 용액을 이미드화 반응시켜 얻어지고, 나노 실리카 입자를 5~25 중량% 포함하는 폴리이미드 필름 및 그 제조방법을 제공한다.
PCT/KR2020/015881 2019-11-13 2020-11-12 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 WO2021096245A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202080077421.8A CN114651036B (zh) 2019-11-13 2020-11-12 具有改善的尺寸稳定性的聚酰亚胺薄膜及其制备方法

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Application Number Priority Date Filing Date Title
KR10-2019-0144756 2019-11-13
KR1020190144756A KR102346587B1 (ko) 2019-11-13 2019-11-13 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법

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WO2021096245A2 WO2021096245A2 (ko) 2021-05-20
WO2021096245A3 true WO2021096245A3 (ko) 2021-07-22

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CN (1) CN114651036B (ko)
WO (1) WO2021096245A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102652586B1 (ko) * 2021-09-30 2024-04-01 피아이첨단소재 주식회사 기계적 강도 및 내열성이 향상된 폴리이미드 필름 및 이의 제조방법
KR102692756B1 (ko) * 2021-10-26 2024-08-07 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이의 제조방법
KR102679927B1 (ko) 2021-11-01 2024-07-02 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법
KR20240077041A (ko) * 2022-11-24 2024-05-31 피아이첨단소재 주식회사 폴리이미드 필름 및 이의 제조방법

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2007016200A (ja) * 2005-07-05 2007-01-25 Chang Chun Plastics Co Ltd ポリアミック酸樹脂組成物およびポリイミドフィルム
JP3953051B2 (ja) * 2004-06-04 2007-08-01 東洋紡績株式会社 ポリイミドフィルムおよびそれを用いた銅張積層フィルム
KR20070091577A (ko) * 2006-03-06 2007-09-11 주식회사 엘지화학 금속적층판 및 이의 제조방법
JP2016204569A (ja) * 2015-04-27 2016-12-08 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
KR20190079944A (ko) * 2017-12-28 2019-07-08 에스케이씨코오롱피아이 주식회사 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판

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Publication number Priority date Publication date Assignee Title
EP0659553A1 (en) 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
JPH09116254A (ja) 1995-10-24 1997-05-02 Sumitomo Bakelite Co Ltd フレキシブルプリント回路用基板の製造方法
JPH10138318A (ja) 1996-09-13 1998-05-26 Ube Ind Ltd 多層押出しポリイミドフィルムの製法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953051B2 (ja) * 2004-06-04 2007-08-01 東洋紡績株式会社 ポリイミドフィルムおよびそれを用いた銅張積層フィルム
JP2007016200A (ja) * 2005-07-05 2007-01-25 Chang Chun Plastics Co Ltd ポリアミック酸樹脂組成物およびポリイミドフィルム
KR20070091577A (ko) * 2006-03-06 2007-09-11 주식회사 엘지화학 금속적층판 및 이의 제조방법
JP2016204569A (ja) * 2015-04-27 2016-12-08 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
KR20190079944A (ko) * 2017-12-28 2019-07-08 에스케이씨코오롱피아이 주식회사 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판

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CN114651036B (zh) 2023-10-24
CN114651036A (zh) 2022-06-21
KR20210057936A (ko) 2021-05-24
KR102346587B1 (ko) 2022-01-05
WO2021096245A2 (ko) 2021-05-20

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