WO2021096245A3 - 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 - Google Patents
치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2021096245A3 WO2021096245A3 PCT/KR2020/015881 KR2020015881W WO2021096245A3 WO 2021096245 A3 WO2021096245 A3 WO 2021096245A3 KR 2020015881 W KR2020015881 W KR 2020015881W WO 2021096245 A3 WO2021096245 A3 WO 2021096245A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyimide film
- manufacturing
- dianhydride
- dimensional stability
- improved dimensional
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
본 발명은 벤조페논테트라카복실릭디안하이드라이드(BTDA), 비페닐테트라카르복실릭디안하이드라이드(BPDA) 및 피로멜리틱디안하이드라이드(PMDA)을 포함하는 이무수물산 성분과, 옥시디아닐린(ODA), 파라페닐렌 디아민(PPD) 및 3,5-디아미노벤조산(DABA)을 포함하는 디아민 성분을 포함하는 폴리아믹산 용액을 이미드화 반응시켜 얻어지고, 나노 실리카 입자를 5~25 중량% 포함하는 폴리이미드 필름 및 그 제조방법을 제공한다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202080077421.8A CN114651036B (zh) | 2019-11-13 | 2020-11-12 | 具有改善的尺寸稳定性的聚酰亚胺薄膜及其制备方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0144756 | 2019-11-13 | ||
KR1020190144756A KR102346587B1 (ko) | 2019-11-13 | 2019-11-13 | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2021096245A2 WO2021096245A2 (ko) | 2021-05-20 |
WO2021096245A3 true WO2021096245A3 (ko) | 2021-07-22 |
Family
ID=75913152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2020/015881 WO2021096245A2 (ko) | 2019-11-13 | 2020-11-12 | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102346587B1 (ko) |
CN (1) | CN114651036B (ko) |
WO (1) | WO2021096245A2 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102652586B1 (ko) * | 2021-09-30 | 2024-04-01 | 피아이첨단소재 주식회사 | 기계적 강도 및 내열성이 향상된 폴리이미드 필름 및 이의 제조방법 |
KR102692756B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
KR102679927B1 (ko) | 2021-11-01 | 2024-07-02 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
KR20240077041A (ko) * | 2022-11-24 | 2024-05-31 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 이의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007016200A (ja) * | 2005-07-05 | 2007-01-25 | Chang Chun Plastics Co Ltd | ポリアミック酸樹脂組成物およびポリイミドフィルム |
JP3953051B2 (ja) * | 2004-06-04 | 2007-08-01 | 東洋紡績株式会社 | ポリイミドフィルムおよびそれを用いた銅張積層フィルム |
KR20070091577A (ko) * | 2006-03-06 | 2007-09-11 | 주식회사 엘지화학 | 금속적층판 및 이의 제조방법 |
JP2016204569A (ja) * | 2015-04-27 | 2016-12-08 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
KR20190079944A (ko) * | 2017-12-28 | 2019-07-08 | 에스케이씨코오롱피아이 주식회사 | 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0659553A1 (en) | 1993-12-22 | 1995-06-28 | E.I. Du Pont De Nemours And Company | Coextruded multi-layer aromatic polyimide film and preparation thereof |
JPH09116254A (ja) | 1995-10-24 | 1997-05-02 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板の製造方法 |
JPH10138318A (ja) | 1996-09-13 | 1998-05-26 | Ube Ind Ltd | 多層押出しポリイミドフィルムの製法 |
-
2019
- 2019-11-13 KR KR1020190144756A patent/KR102346587B1/ko active IP Right Grant
-
2020
- 2020-11-12 CN CN202080077421.8A patent/CN114651036B/zh active Active
- 2020-11-12 WO PCT/KR2020/015881 patent/WO2021096245A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3953051B2 (ja) * | 2004-06-04 | 2007-08-01 | 東洋紡績株式会社 | ポリイミドフィルムおよびそれを用いた銅張積層フィルム |
JP2007016200A (ja) * | 2005-07-05 | 2007-01-25 | Chang Chun Plastics Co Ltd | ポリアミック酸樹脂組成物およびポリイミドフィルム |
KR20070091577A (ko) * | 2006-03-06 | 2007-09-11 | 주식회사 엘지화학 | 금속적층판 및 이의 제조방법 |
JP2016204569A (ja) * | 2015-04-27 | 2016-12-08 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
KR20190079944A (ko) * | 2017-12-28 | 2019-07-08 | 에스케이씨코오롱피아이 주식회사 | 연성동박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성동박적층판 |
Also Published As
Publication number | Publication date |
---|---|
CN114651036B (zh) | 2023-10-24 |
CN114651036A (zh) | 2022-06-21 |
KR20210057936A (ko) | 2021-05-24 |
KR102346587B1 (ko) | 2022-01-05 |
WO2021096245A2 (ko) | 2021-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021096245A3 (ko) | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 | |
TWI607868B (zh) | 聚醯亞胺膜及其製成和組合方法 | |
JP2011514266A5 (ko) | ||
KR20000023537A (ko) | 유연한 방향족 폴리이미드 필름/금속 필름 복합 시트 | |
JP2002201271A5 (ko) | ||
CN107540840A (zh) | 聚酰胺酸、覆铜板及电路板 | |
KR20200036770A (ko) | 금속 피복 적층판 및 회로 기판 | |
JP2012133359A5 (ko) | ||
US20080097073A1 (en) | Novel Polyimide Film With Improved Adhesiveness | |
KR100673339B1 (ko) | 금속 필름/방향족 폴리이미드 필름 복합 웹의 롤 | |
JP6036361B2 (ja) | ポリイミドフィルムおよびそれを用いたポリイミド金属積層体 | |
CN113043690A (zh) | 覆金属层叠板及电路基板 | |
US4921745A (en) | Honeycomb structure of aromatic polyimide | |
JP5567283B2 (ja) | ポリイミドフィルム | |
JP2020070359A (ja) | 低誘電率ポリイミド | |
JP5844853B2 (ja) | ポリイミドフィルム | |
JP2008138105A (ja) | ポリイミドフィルムの製造方法 | |
JP2020139039A (ja) | ポリイミドフィルム | |
JP7378122B2 (ja) | ポリイミドフィルム | |
JP2024110929A (ja) | ポリイミド組成物、その製造方法、ポリイミドフィルム、及びフレキシブル銅張積層板 | |
JP2000319392A (ja) | ポリイミドフィルム | |
KR20130133476A (ko) | 폴리아미드-이미드 필름 및 그 제조방법 | |
JPH0253828A (ja) | 新規芳香族ポリイミド及びその製造方法 | |
JPH07316290A (ja) | 粗面化ポリイミドフィルム及びその製造方法 | |
JP2011012270A5 (ko) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20886838 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20886838 Country of ref document: EP Kind code of ref document: A2 |