CN114651036B - 具有改善的尺寸稳定性的聚酰亚胺薄膜及其制备方法 - Google Patents
具有改善的尺寸稳定性的聚酰亚胺薄膜及其制备方法 Download PDFInfo
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- CN114651036B CN114651036B CN202080077421.8A CN202080077421A CN114651036B CN 114651036 B CN114651036 B CN 114651036B CN 202080077421 A CN202080077421 A CN 202080077421A CN 114651036 B CN114651036 B CN 114651036B
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Classifications
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Manufacturing & Machinery (AREA)
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| KR10-2019-0144756 | 2019-11-13 | ||
| KR1020190144756A KR102346587B1 (ko) | 2019-11-13 | 2019-11-13 | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 |
| PCT/KR2020/015881 WO2021096245A2 (ko) | 2019-11-13 | 2020-11-12 | 치수 안정성이 향상된 폴리이미드 필름 및 이의 제조방법 |
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| KR102692756B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
| KR102679927B1 (ko) | 2021-11-01 | 2024-07-02 | 피아이첨단소재 주식회사 | 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법 |
| KR20240077041A (ko) * | 2022-11-24 | 2024-05-31 | 피아이첨단소재 주식회사 | 폴리이미드 필름 및 이의 제조방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200702357A (en) * | 2005-07-05 | 2007-01-16 | Chang Chun Plastics Co Ltd | Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom |
| TW201930403A (zh) * | 2017-12-28 | 2019-08-01 | 南韓商愛思開希可隆Ｐｉ股份有限公司 | 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板的電子裝置 |
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| EP0659553A1 (en) | 1993-12-22 | 1995-06-28 | E.I. Du Pont De Nemours And Company | Coextruded multi-layer aromatic polyimide film and preparation thereof |
| JPH09116254A (ja) | 1995-10-24 | 1997-05-02 | Sumitomo Bakelite Co Ltd | フレキシブルプリント回路用基板の製造方法 |
| JPH10138318A (ja) | 1996-09-13 | 1998-05-26 | Ube Ind Ltd | 多層押出しポリイミドフィルムの製法 |
| JP3953051B2 (ja) * | 2004-06-04 | 2007-08-01 | 東洋紡績株式会社 | ポリイミドフィルムおよびそれを用いた銅張積層フィルム |
| WO2007102691A1 (en) * | 2006-03-06 | 2007-09-13 | Lg Chem, Ltd. | Metallic laminate and method for preparing the same |
| JP2016204569A (ja) * | 2015-04-27 | 2016-12-08 | 宇部興産株式会社 | ポリアミック酸溶液組成物およびポリイミドフィルム |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200702357A (en) * | 2005-07-05 | 2007-01-16 | Chang Chun Plastics Co Ltd | Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom |
| TW201930403A (zh) * | 2017-12-28 | 2019-08-01 | 南韓商愛思開希可隆Ｐｉ股份有限公司 | 軟性銅箔積層板製造用聚醯亞胺膜及其製備方法、包含此聚醯亞胺膜的軟性銅箔積層板的電子裝置 |
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| CN114651036A (zh) | 2022-06-21 |
| KR20210057936A (ko) | 2021-05-24 |
| WO2021096245A3 (ko) | 2021-07-22 |
| KR102346587B1 (ko) | 2022-01-05 |
| WO2021096245A2 (ko) | 2021-05-20 |
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