WO2021070442A1 - パッケージとその製造方法、及びカバーガラスとその製造方法 - Google Patents

パッケージとその製造方法、及びカバーガラスとその製造方法 Download PDF

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Publication number
WO2021070442A1
WO2021070442A1 PCT/JP2020/027513 JP2020027513W WO2021070442A1 WO 2021070442 A1 WO2021070442 A1 WO 2021070442A1 JP 2020027513 W JP2020027513 W JP 2020027513W WO 2021070442 A1 WO2021070442 A1 WO 2021070442A1
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WO
WIPO (PCT)
Prior art keywords
cover glass
main surface
glass
fire
base material
Prior art date
Application number
PCT/JP2020/027513
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English (en)
French (fr)
Japanese (ja)
Inventor
辰夫 笹井
大介 大川
宏亮 中堀
Original Assignee
日本電気硝子株式会社
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Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2021550359A priority Critical patent/JPWO2021070442A1/ja
Publication of WO2021070442A1 publication Critical patent/WO2021070442A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/09—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

Definitions

  • the present invention relates to a package accommodating a solid-state image sensor and other various elements and a method for manufacturing the same, and a cover glass used for the package and the method for manufacturing the same.
  • the package for accommodating various elements such as a solid-state image sensor and a light emitting element includes a base material on which the element is formed, a cover glass covering the base material, and an adhesive portion for fixing the cover glass to the base material. Things are known.
  • Patent Document 1 discloses a package in which a solid-state image sensor (CMOS image sensor) is die-bonded onto a base material (substrate) and a cover glass is fixed to the base material via a transparent resin as an adhesive. ing.
  • CMOS image sensor solid-state image sensor
  • the cover glass is formed by cutting a glass material that is larger than its size.
  • a dicing blade is used to cut the glass material. Specifically, a first wide dicing blade forms a first groove having a U-shaped cross section in the glass material, and then a second narrow dicing blade follows the first groove. Form a groove.
  • the end face (cut surface) of the cover glass thus formed has a first groove remaining as a chamfered portion (see paragraphs 0051 to 0058 and FIG. 14 of the same document).
  • the present invention has been made in view of the above circumstances, and it is a technical subject to increase the strength of the end face of the cover glass used for the package and to efficiently manufacture the cover glass.
  • the present invention is for solving the above-mentioned problems, and is a package including a base material, a cover glass covering the base material, and an adhesive portion for adhering the base material and the cover glass.
  • the cover glass is located between the first main surface, the second main surface opposite to the first main surface and facing the base material, and between the first main surface and the second main surface.
  • the end face of the cover glass is provided with a fire-made surface formed on the first main surface side and a split cross section formed on the second main surface side, and the adhesion thereof is provided.
  • the portion is characterized in that it contacts the entire surface of the fractured surface and at least a part of the fire-making surface.
  • the cover glass according to the present invention has significantly improved end face strength as compared with the cover glass cut by the dicing blade. Further, since the end face can be formed without requiring steps such as etching and polishing, the cover glass can be efficiently manufactured. Further, since there are no microcracks or the like on the end face of the cover glass, stray light caused by the microcracks or the like can be reduced, and the amount of incident light increases. The reduction of stray light and the increase of the amount of light are particularly advantageous for solving the problems of misrecognition and decrease in sensitivity when the package is used as an in-vehicle sensor, for example.
  • the surface roughness Ra of the fire-made surface may be set to be larger than the surface roughness Ra of the fractured surface.
  • the fire-making surface and the split cross section are formed on the entire circumference of the cover glass, and the adhesive portion is said to be in a range of 5% or more of the length dimension of the fire-making surface in the thickness direction of the cover glass. It may come into contact with the fire-making surface.
  • the cover glass may include a light-shielding film formed on the second main surface. According to such a configuration, when the package is used as a solid-state image sensor, it is possible to prevent the occurrence of flare and the like by the light-shielding film.
  • the light-shielding film may be a metal film containing Cr. As a result, a light-shielding film having high light-shielding property and excellent durability can be formed on the cover glass.
  • the package includes a spacer arranged between the base material and the cover glass, the spacer includes an inner surface and an outer surface, and the adhesive portion may come into contact with the outer surface of the spacer.
  • the cover glass and the spacer can be firmly fixed to the base material by sufficiently securing the accommodation space of the element on the inner surface side of the spacer and bringing the adhesive portion into contact with the outer surface of the spacer.
  • the present invention is for solving the above-mentioned problems, and in a method for manufacturing a cover glass used for a package, a film forming step of forming a metal film containing Cr on one main surface of a glass sheet and the glass.
  • the cutting step includes a cutting step of cutting the sheet to form the cover glass, and the cutting step includes a scribing step of forming a scribing line on the other main surface of the glass sheet and the glass sheet along the scribing line.
  • the cutting step is characterized in that a fire-making surface is formed on the scribing wire by the scribing step, and a split cross section connected to the fire-making surface is formed by the cutting step. ..
  • the cover glass produced by this method has a significantly improved end face strength as compared with the cover glass cut by the dicing blade. Further, since the end face can be formed without requiring steps such as etching and polishing, the cover glass can be efficiently manufactured.
  • the present invention is for solving the above-mentioned problems, and is a method for manufacturing a package including a base material, a cover glass covering the base material, and an adhesive portion for adhering the base material and the cover glass. Therefore, a film forming step of forming a metal film containing Cr on one main surface of a glass sheet, a cutting step of cutting the glass sheet to form the cover glass, and using an adhesive to form the cover glass as a base.
  • the cutting step includes an bonding step of fixing to a material, a scribing step of forming a scribing line on the other main surface of the glass sheet, and a cutting step of cutting the glass sheet along the scribing line.
  • a fire-making surface is formed on the scribing wire by the scribing step, a split cross section connected to the fire-making surface is formed by the cutting step, and the adhesive is split into the crack in the bonding step. It is characterized in that the entire surface of the cross section is brought into contact with at least a part of the fire-making surface, and the adhesive is cured to form the adhesive portion.
  • the cover glass of the package manufactured by this method has a significantly improved end face strength as compared with the cover glass cut by the dicing blade. Further, since the end face can be formed without requiring steps such as etching and polishing, the cover glass and the package can be efficiently manufactured.
  • the present invention is for solving the above-mentioned problems, and is a cover glass used for a package provided with a base material, which is located on a side opposite to the first main surface and the first main surface and the base.
  • the cover glass is provided with a second main surface facing the material, an end surface located between the first main surface and the second main surface, and a metal film formed on the second main surface.
  • the end surface includes a fire-made surface formed on the first main surface side and a split cross section formed on the second main surface side, and includes an end portion of the metal film and an end portion of the split cross section.
  • the distance is 0.5 mm or less.
  • the cover glass according to the present invention has significantly improved end face strength as compared with the cover glass cut by the dicing blade. Further, since the end face can be formed without requiring steps such as etching and polishing, the cover glass can be efficiently manufactured.
  • the strength of the end face of the cover glass used for the package is increased, and the cover glass is efficiently manufactured.
  • 1 to 12 show a cover glass and a package according to the present invention, and a first embodiment of a method for manufacturing the same.
  • the package 1 according to the present embodiment is arranged between the base material 3 on which the element 2 is formed, the cover glass 4 covering the base material 3, and the base material 3 and the cover glass 4.
  • the spacer 5 and the adhesive portion 6 for fixing the cover glass 4 and the spacer 5 to the base material 3 are provided.
  • a solid-state image sensor is exemplified as the element 2, but the package 1 can accommodate a light emitting element and various other elements.
  • the base material 3 is composed of a printed circuit board on which the solid-state image sensor 2 is mounted, but is not limited to this configuration.
  • the base material 3 is composed of ceramics, organic materials, resins, glass and various other materials.
  • the base material 3 has a first fixing portion 7a to which the spacer 5 is fixed and a second fixing portion 7b to which the adhesive portion 6 is fixed on one surface 3a thereof.
  • the cover glass 4 is formed of transparent glass in a rectangular shape.
  • the thickness t of the cover glass 4 is 0.2 to 1.2 mm, but is not limited to this range.
  • the cover glass 4 includes a first main surface 8, a second main surface 9 located on the opposite side of the first main surface 8 and facing the base material 3, and a first main surface 8 and a second main surface 9. It is provided with an end face 10 located between the two.
  • the cover glass 4 has a glass composition of, for example, SiO 2 50 to 70%, Al 2 O 3 0.5 to 20%, B 2 O 3 5 to 20%, and RO 0.1 to 30% by mass.
  • the end surface 10 of the cover glass 4 includes a first end surface 10a formed on the first main surface 8 side and a second end surface 10b formed on the second main surface 9 side.
  • the first end surface 10a and the second end surface 10b are formed on the entire circumference (all four sides) of the cover glass 4.
  • the first end surface 10a and the second end surface 10b are connected at an intermediate portion of the end surface 10 in the thickness direction of the cover glass 4.
  • the first end surface 10a is composed of a fire-made surface, and its surface roughness (arithmetic mean roughness) Ra is 0.1 to 10 nm, preferably 0.9 to 8.0 nm, and more preferably 1.1 to. It is 6.0 nm.
  • the "fire-making surface” refers to a surface formed by non-contact heating means without contacting a cutting tool such as a dicing blade.
  • the second end surface 10b is composed of a fractured surface, and its surface roughness (arithmetic mean roughness) Ra is 0.01 to 10 nm, preferably 0.01 to 5 nm, and more preferably 0.1 to 1.0 nm.
  • the "split section” refers to a surface formed by the action of a force such as bending stress.
  • the surface roughness Ra of the first end surface 10a is preferably larger than the surface roughness Ra of the second end surface 10b.
  • the second end surface 10b is inclined with respect to the first end surface 10a.
  • the inclination angle ⁇ formed by the second end surface 10b with respect to the first end surface 10a is preferably within the range of ⁇ 5 °.
  • the length dimension H2 of the second end surface 10b in the thickness direction of the cover glass 4 is set to be larger than the length dimension H1 of the first end surface 10a in the same direction.
  • the second main surface 9 of the cover glass 4 is provided with a light-shielding film 11.
  • the light-shielding film 11 is made of a metal film containing Cr. Specifically, the light-shielding film 11 may contain 80% or more of Cr in mass%, and may contain, for example, oxygen, nitrogen, or the like as a component other than Cr.
  • the package 1 accommodating the solid-state image sensor 2 is used as an in-vehicle sensor, flare may cause erroneous recognition.
  • the light-shielding film 11 By forming the light-shielding film 11 on the second main surface 9, the occurrence of flare can be prevented. Further, by using the light-shielding film 11 as a metal film, the strength and durability of the cover glass 4 can be improved.
  • the light-shielding film 11 is formed in a rectangular shape and an annular shape (frame shape) along the four sides of the second main surface 9.
  • the light-shielding film 11 has an opening 11a that exposes the second main surface 9. With this configuration, a part of the glass sheet GS within the range of the opening 11a is a translucent part.
  • the end portion (outer end portion) 11b on the end surface 10 side of the light-shielding film 11 is formed on the end portion 10c (the boundary portion between the second end surface 10b and the second main surface 9) of the second end surface 10b.
  • it is located at a distance D1. It is desirable that this distance D1 be as small as possible, and for example, it is preferably 0.5 mm or less.
  • the spacer 5 is made of resin in a square tubular shape, but is not limited to this material and shape.
  • the spacer 5 has an inner surface 5a, an outer surface 5b, a first end portion 5c fixed to the base material 3, and a second end portion 5d fixed to the cover glass 4.
  • the adhesive portion 6 is configured by, for example, curing an ultraviolet curable resin (adhesive), but is not limited to this configuration.
  • the adhesive portion 6 is fixed to the second fixing portion 7b of the base material 3, the end surface 10 of the cover glass 4, and the entire surface of the outer surface 5b of the spacer 5.
  • the adhesive portion 6 is in contact with the entire surface of the first end surface 10a and the entire surface of the second end surface 10b, but is not limited to this configuration.
  • the adhesive portion 6 may be in contact with the entire surface of the second end surface 10b and at least a part of the first end surface 10a.
  • the adhesive portion 6 may come into contact with the first end surface 10a within a range of 5% or more of the length dimension H1 of the first end surface 10a. preferable.
  • the method for manufacturing the cover glass 4 includes a molding step S1 for forming a long glass ribbon GR, a first cutting step S2 for cutting the glass ribbon GR to form a glass sheet GS, and the like. It mainly includes a film forming step S3 for forming the light-shielding film 11 on the glass sheet GS, and a second cutting step S4 for cutting the glass sheet GS on which the light-shielding film 11 is formed to form the cover glass 4.
  • the glass ribbon GR is molded by using the so-called redraw method in which the base glass MG is heated and stretched by the stretch molding apparatus 12. Specifically, the upper end of the base glass MG is fixed to the upper part of the stretch molding apparatus 12, and the base glass MG is heated by the heating furnace 13 held at a predetermined temperature. Further, the thin plate-shaped glass ribbon GR is formed by carrying out the heated base glass MG by the heat-resistant roller 14 arranged below the heating furnace 13.
  • the glass ribbon GR is cut to a predetermined size by a cutting means such as a laser cutting device to form a rectangular glass sheet GS.
  • the glass ribbon GR may be made into a glass roll by winding it in a roll shape at a position below the heat-resistant roller 14.
  • the glass ribbon GR is pulled out from the glass roll and the glass ribbon GR is cut to a predetermined size.
  • the molding method of the glass ribbon GR is not limited to the above, and may be molded by using a well-known molding method such as an overflow down draw method or a float method, or the ingot may be sliced and molded. Further, a step of polishing the main surface of the obtained glass ribbon GR may be further provided.
  • the light shielding film 11 is formed on one main surface of the glass sheet GS by a known film forming method.
  • the main surface of the glass sheet GS on which the light-shielding film 11 is not formed is referred to as a first main surface GSa
  • the main surface of the glass sheet GS on which the light-shielding film 11 is formed is referred to as a second main surface GSb.
  • the first main surface GSa of the glass sheet GS corresponds to the first main surface 8 of the cover glass 4
  • the second main surface GSb of the glass sheet GS corresponds to the second main surface 9 of the cover glass 4.
  • Examples of film formation methods include sputtering method, vacuum vapor deposition method, thermal CVD method, laser CVD method, plasma CVD method, molecular beam epitaxy method (MBE method), ion plating method, laser ablation method, and metalorganic chemical vapor deposition.
  • Examples thereof include a chemical vapor deposition method (or CVD method) such as a phase growth method (MOCVD), a sol-gel method, a coating method of spin coating or screen printing, and a liquid phase growth method such as a plating method.
  • a plurality of light-shielding films 11 formed in an annular shape and a quadrangular shape are formed on the second main surface GSb of the glass sheet GS by the film forming step S3.
  • the light-shielding films 11 are formed apart at a predetermined interval D2.
  • the distance D2 between the plurality of light-shielding films 11 is preferably 1 mm or less, but is not limited to this range.
  • the light-shielding film 11 is cross-hatched, but this is for emphasis and does not mean a cross section (the same applies to FIGS. 13, 16 and 17).
  • the glass sheet GS is cut along the virtually set cutting schedule line CL (see FIG. 6) so as to separate the plurality of light-shielding films 11 individually.
  • the planned cutting line CL is set in a portion where the light-shielding film 11 is not formed, that is, a portion between adjacent light-shielding films 11.
  • the second cutting step S4 includes a scribe step of forming the scribe line 15 on the glass sheet GS and a cutting step of cutting the glass sheet GS along the scribe line 15.
  • a laser cutting device 16 forms a plurality of scribe lines 15 on the first main surface GSa of the glass sheet GS.
  • the laser cutting device 16 includes a laser irradiation device 17 and a cooling device 18.
  • the laser irradiation device 17 irradiates the first main surface GSa of the glass sheet GS with laser light L from , for example, a CO 2 laser, while moving in the direction along the planned cutting line CL.
  • the cooling device 18 is configured to move together with the laser irradiation device 17.
  • the cooling device 18 is located behind the laser irradiation device 17 in the traveling direction, and jets the refrigerant R toward the irradiation portion of the laser beam L while following the laser irradiation device 17.
  • thermal stress acts on the glass sheet GS by heating the glass sheet GS by the laser irradiation device 17 and cooling the glass sheet GS by the cooling device 18. Due to the action of this thermal stress, the scribe line 15 is formed linearly along the traveling direction of the laser irradiation device 17.
  • the depth D3 of the scribe line 15 (see FIG. 8) is preferably 5% to 30% of the thickness dimension t of the glass sheet GS.
  • each machined surface 19 by the scribe line 15 is formed on the glass sheet GS.
  • Each machined surface 19 is a cross section constituting the scribe line 15, and corresponds to the first end surface 10a of the cover glass 4.
  • Each machined surface 19 is formed as a fire-made surface by heating the laser beam L.
  • a plurality of scribe lines 15 are orthogonalized by a laser cutting device 16 to form the scribe lines 15 in a grid pattern.
  • the metal line-shaped head 20a in the cutting device 20 is moved and brought into contact with the second main surface GSb of the glass sheet GS. Further, the first main surface GSa of the glass sheet GS is pressed by a pressing jig (not shown) of the cutting device 20. As a result, bending stress for breaking the glass sheet GS with the scribe line 15 as the starting point acts on the glass sheet GS.
  • the glass sheet GS Due to the action of this bending stress, a crack from the scribe wire 15 corresponding to the linear head 20a grows toward the second main surface GSb of the glass sheet GS. When this crack reaches the second main surface GSb, the glass sheet GS is cut along the scribe line 15. In this case, a fractured surface is formed in the cut portion of the glass sheet GS formed by the growth of cracks. As a result of the above cutting, as shown in FIG. 10, the cut surface of the glass sheet GS becomes the end surface 10 (first end surface 10a and second end surface 10b) of the cover glass 4. According to the above cutting, the glass sheet GS can be cut without causing the light-shielding film 11 to peel off.
  • the distance between the end portion 10c of the second end surface 10b of each cover glass 4 (the boundary portion or the ridgeline portion between the second end surface 10b and the second main surface 9) and the end portion (outer end portion) 11b of the light-shielding film 11. D1 (see FIG. 3) can be made as small as possible (D1 ⁇ 0.5 mm).
  • the cutting process is completed when all the scribe lines 15 are cut. As a result, a plurality of cover glasses 4 are formed from one glass sheet GS.
  • the manufacturing method of the package 1 includes an bonding step of fixing the cover glass 4 manufactured as described above and the spacer 5 to the base material 3.
  • the bonding step as shown in FIG. 11, the base material 3 on which the element 2 is formed, the spacer 5, and the cover glass 4 are prepared, and as shown in FIG. 12, the cover glass 4 and the spacer 5 are used as the base material. Position with respect to 3.
  • the element 2 and the base material 3 are covered with the cover glass 4 and the spacer 5.
  • the first end portion 5c of the spacer 5 comes into contact with the first fixing portion 7a of the base material 3.
  • the second end portion 5d of the spacer 5 comes into contact with the light-shielding film 11 of the cover glass 4.
  • first end portion 5c of the spacer 5 and the first fixing portion 7a of the base material 3 are temporarily fixed with an adhesive, and the second end portion 5d of the spacer 5 and the light-shielding film 11 of the cover glass 4 are adhered to each other. It may be temporarily fixed with an agent.
  • the adhesive 6a is applied so as to come into contact with the entire outer surface 5b of the spacer 5, the end surface 10 of the cover glass 4, and the second fixing portion 7b of the base material 3.
  • the adhesive portion 6 is formed by irradiating the adhesive 6a with ultraviolet rays to cure the adhesive.
  • the adhesive portion 6 fixes the cover glass 4 and the spacer 5 to the base material 3 by curing the adhesive 6a.
  • a fire-making surface (first end surface 10a) is formed on the end surface 10 of the cover glass 4 by the second cutting step S4 (scribing step and cutting step).
  • the fractured surface (second end surface 10b)
  • the end surface 10 can be made a surface in which chipping and microcracks do not exist. Therefore, the strength of the end face 10 of the cover glass 4 is significantly improved as compared with the cover glass cut by the dicing blade. Further, since the end face 10 can be formed without requiring steps such as etching and polishing, the cover glass 4 and the package 1 can be manufactured efficiently and inexpensively.
  • the first main surface 8 of the cover glass 4 is used as the outer surface
  • the second main surface 9 is used as the inner surface (the surface facing the base material 3), so that the first end surface 10a is arranged on the outer surface side.
  • the two end faces 10b can be arranged on the inner surface side.
  • the adhesive portion 6 is brought into contact with the first end surface 10a located on the outer surface side. Due to the anchor effect of the first end surface 10a, the adhesive portion 6 can be made difficult to peel off from the end surface 10. As a result, the package 1 having excellent durability can be formed.
  • FIG. 13 to 15 show a second embodiment of the present invention.
  • the aspects of the film forming step and the second cutting step in the method for manufacturing the cover glass 4 are different from those in the first embodiment.
  • a plurality of light-shielding films 11 separated by a fixed interval D2 are formed on the glass sheet GS, but in the film-forming step S3 according to the present embodiment, the light-shielding films 11 are separated. Formed integrally without causing. That is, as shown in FIG. 13, the light-shielding film 11 is formed in a planar grid pattern with respect to the second main surface GSb of the glass sheet GS.
  • the second cutting step S4 includes a step of cutting the lattice-shaped light-shielding film 11 along the scheduled cutting line CL shown in FIG. 13 (cutting step of the light-shielding film 11) when cutting the glass sheet GS.
  • a scribe line 15 is formed with respect to the first main surface GSa of the glass sheet GS (scribe step).
  • the line-shaped head 20a of the cutting device 20 is brought into contact with the second main surface GSb (light-shielding film 11) of the glass sheet GS (not shown), and the glass sheet GS is cut together with the light-shielding film 11 (cutting step).
  • the light-shielding film 11 is formed up to the boundary portion (ridge line portion) between the second end surface 10b and the second main surface 9. Become.
  • 16 and 17 show other examples of glass sheets on which a light-shielding film is formed.
  • a plurality of openings 21 are formed in the light-shielding film 11 formed on the second main surface GSb of the glass sheet GS along the planned cutting line CL.
  • Each opening 21 is formed in a circular shape, but is not limited to this shape.
  • the light-shielding film 11 is provided with a fragile portion 22 between adjacent openings 21. In the second cutting step S4, by cutting each fragile portion 22, the light-shielding film 11 can be cut accurately and easily along the scheduled cutting line CL.
  • the shape of the opening 21 of the light-shielding film 11 is different from the example of FIG. That is, the opening 21 includes a slit-shaped first opening 21a and a cross-shaped second opening 21b.
  • the first opening 21a is formed in a long shape along the planned cutting line CL.
  • the second opening 21b is formed at the intersection of the planned cutting lines CL.
  • a fragile portion 22 is formed between the adjacent openings 21a and 21b as in the example of FIG.
  • the present invention is not limited to the configuration of the above embodiment, and is not limited to the above-mentioned action and effect.
  • the present invention can be modified in various ways without departing from the gist of the present invention.
  • the glass sheet GS on which the scribing line 15 is formed is cut together with the light-shielding film 11, but the present invention is not limited to this, and before the cutting step is executed, The step of cutting only the light-shielding film 11 along the scheduled cutting line CL may be executed.
  • the package 1 according to the present invention may include a cover glass 4 on which the light-shielding film 11 is not formed, or may include a cover glass 4 having a functional film other than the light-shielding film 11. That is, in the method for manufacturing the package 1 (cover glass 4), the film forming step S3 may be omitted, or various functional films may be formed on the cover glass 4 in the film forming step S3.
  • the configuration of the cover glass 4 of the above embodiment is an example, and the cover glass 4 may be composed of, for example, an infrared shielding glass made of phosphoric acid glass or borosilicate glass. Further, the cover glass 4 may be made of ultraviolet transmissive glass, and the package 1 may be configured so as to include a light source that outputs ultraviolet rays as the element 2.

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PCT/JP2020/027513 2019-10-11 2020-07-15 パッケージとその製造方法、及びカバーガラスとその製造方法 WO2021070442A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023166786A1 (ja) * 2022-03-03 2023-09-07 日東電工株式会社 脆性材料チップ、脆性材料シート、脆性材料シートの製造方法及び脆性材料チップの製造方法

Citations (8)

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JP2004221541A (ja) * 2002-11-15 2004-08-05 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス
JP2005086100A (ja) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd 固体撮像装置
JP2006041201A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 封止型電子部品及びその製造方法
WO2006041074A1 (ja) * 2004-10-12 2006-04-20 Nippon Electric Glass Co., Ltd. 固体撮像素子用カバーガラス及びその製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2008227232A (ja) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd 半導体デバイスの製造方法、半導体デバイスおよび光ピックアップモジュール
JP2014230083A (ja) * 2013-05-22 2014-12-08 オリンパス株式会社 撮像装置、撮像装置の製造方法、及び内視鏡システム
WO2017094502A1 (ja) * 2015-11-30 2017-06-08 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004221541A (ja) * 2002-11-15 2004-08-05 Nippon Electric Glass Co Ltd 固体撮像素子用カバーガラス
JP2005086100A (ja) * 2003-09-10 2005-03-31 Fuji Photo Film Co Ltd 固体撮像装置
JP2006041201A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 封止型電子部品及びその製造方法
WO2006041074A1 (ja) * 2004-10-12 2006-04-20 Nippon Electric Glass Co., Ltd. 固体撮像素子用カバーガラス及びその製造方法
JP2006303482A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法
JP2008227232A (ja) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd 半導体デバイスの製造方法、半導体デバイスおよび光ピックアップモジュール
JP2014230083A (ja) * 2013-05-22 2014-12-08 オリンパス株式会社 撮像装置、撮像装置の製造方法、及び内視鏡システム
WO2017094502A1 (ja) * 2015-11-30 2017-06-08 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023166786A1 (ja) * 2022-03-03 2023-09-07 日東電工株式会社 脆性材料チップ、脆性材料シート、脆性材料シートの製造方法及び脆性材料チップの製造方法

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