WO2021060431A1 - Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage - Google Patents

Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage Download PDF

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Publication number
WO2021060431A1
WO2021060431A1 PCT/JP2020/036164 JP2020036164W WO2021060431A1 WO 2021060431 A1 WO2021060431 A1 WO 2021060431A1 JP 2020036164 W JP2020036164 W JP 2020036164W WO 2021060431 A1 WO2021060431 A1 WO 2021060431A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
component unit
holder
mounting member
fixing pin
Prior art date
Application number
PCT/JP2020/036164
Other languages
English (en)
Japanese (ja)
Inventor
満 黒須
修 一倉
Original Assignee
日本ケミコン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019177870A external-priority patent/JP7388099B2/ja
Priority claimed from JP2019177869A external-priority patent/JP7388098B2/ja
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Publication of WO2021060431A1 publication Critical patent/WO2021060431A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture

Definitions

  • the present disclosure relates to an electronic component unit having a fixing pin, a manufacturing method thereof, a manufacturing method of an electronic device including the electronic component unit, and a mounting member.
  • Electronic components such as capacitors are mounted on the board by soldering such as flow solder and reflow solder for connection to the circuit, and by press-fitting compliant pins into through holes.
  • soldering such as flow solder and reflow solder for connection to the circuit
  • compliant pins into through holes.
  • an electronic component including an electrolytic capacitor main body, a holder, and a compliant pin is known (for example, Patent Document 1).
  • the holder holds and secures the body of the electrolytic capacitor
  • the compliant pin partly fixed to the holder, has a lead wire connection at one end and the other tip.
  • the portion has a connection fixing portion that is press-fitted into the through hole of the circuit board.
  • Electronic components with compliant pins are pressure-fixed to through-holes in the circuit board. Therefore, the soldering process is unnecessary, and the mounting cost can be suppressed.
  • the capacitor body or the holder when the compliant pin is press-fitted into the through hole of the circuit board, the capacitor body or the holder is pressed toward the circuit board. Therefore, deformation of the capacitor body or the holder may cause an adverse effect due to pressing on the connection portion of the compliant pin, and the connection strength between the lead terminal and the compliant pin may decrease. Further, the deformation of the capacitor body may reduce the connection strength between the electrode foil and the lead terminal in the capacitor body, which may reduce the performance of the capacitor body. In addition, the holder may be damaged due to the deformation of the holder.
  • circuit boards on which electronic components are mounted are used not only in static environments but also in environments with vibration. Even when used in a stationary environment, the circuit board will be vibrated due to the occurrence of an abnormal situation such as an earthquake.
  • the vibration resistance of a circuit board is one of the important performances of the circuit board, and may be affected by the mounting state of electronic components on the circuit board.
  • an object of the present disclosure is, for example, to suppress a force applied to an electronic component such as a capacitor body or a holder when the electronic component unit is mounted on a substrate.
  • the present disclosure aims to enhance the stability of mechanical and electrical connections of electronic components to, for example, substrates.
  • the electronic component unit includes a holder and a mounting member.
  • the holder is for holding electronic components.
  • the mounting member includes a fixing pin fixed to the holder and a pressure receiving portion arranged on the fixing pin and receiving a pressure applied at the time of mounting the electronic component.
  • the pressure receiving portion may be exposed from the holder.
  • the pressure receiving portion may have a surface parallel to a surface orthogonal to the fixing pin or a surface substantially parallel to a surface orthogonal to the fixing pin.
  • the mounting member may further include a terminal connection portion for connecting to the lead terminal of the electronic component.
  • the terminal connection portion may be arranged at a position away from the region between the pressure receiving portion of the pressure receiving portion and the fixing pin.
  • the pressure receiving portion may be arranged directly above the fixing pin.
  • the holder is a gap portion formed between an installation portion on which the electronic component is installed, a plurality of side wall portions arranged around the installation portion, and a plurality of adjacent side wall portions. And may be included, and the pressure receiving portion may be adjacent to the gap portion.
  • the electronic component unit includes a holder and a mounting member.
  • the holder is for holding electronic components.
  • the mounting member is fixed to the holder, and has a terminal connection portion for connecting to the electronic component, a plurality of fixing pins used for fixing to the substrate, and a conductor connection for connecting the terminal connection portion to the plurality of fixing pins.
  • the conductor connecting portion can be divided into a central portion and a side portion sandwiching the central portion.
  • the terminal connection portion is arranged at the central portion of the conductor connection portion.
  • the plurality of fixing pins are respectively arranged on the side portion of the conductor connecting portion.
  • the distance between the fixing pins may be greater than or equal to the distance between the plurality of lead terminals of the electronic component and less than or equal to the width of the electronic component in the direction in which the fixing pins are separated.
  • the electronic component unit may include at least two of the mounting members and may include at least four of the fixing pins.
  • the distance between the adjacent fixing pins of the two mounting members is equal to or greater than the distance between the plurality of lead terminals of the electronic component, and the electronic component is separated from the adjacent fixing pins. It may be less than or equal to the width of.
  • the terminal connection portion and the fixing pin may be arranged on the same plane as the conductor connection portion.
  • the terminal connection portion and the fixing pin may be orthogonal to or substantially orthogonal to the longitudinal direction of the conductor connection portion.
  • the lead terminal may pass through a through hole of the holder, may be bent along the lower surface of the holder, or may be connected to the terminal connection portion of the mounting member.
  • a part of the mounting member may be inserted and fixed in the groove formed in the holder.
  • a part of the mounting member may be embedded and fixed inside the holder by insert molding.
  • a method of manufacturing an electronic component unit comprises a mounting member that includes a fixing pin and a pressure receiving portion that is placed above the fixing pin and receives pressure applied when the electronic component is mounted.
  • the step of forming and the step of fixing the mounting member to a holder for holding the electronic component are included.
  • a method of manufacturing an electronic component unit includes a terminal connection portion for connecting to an electronic component, a plurality of fixing pins used for fixing to a substrate, and the plurality of terminal connection portions.
  • the present invention includes a step of forming a mounting member including a conductor connecting portion connected to the fixing pin of the above, and a step of fixing the mounting member to a holder for holding the electronic component.
  • the conductor connecting portion can be divided into a central portion and a side portion sandwiching the central portion.
  • the terminal connection portion is arranged at the central portion of the conductor connection portion.
  • the plurality of fixing pins are respectively arranged on the side portion of the conductor connecting portion.
  • a method of manufacturing an electronic device including an electronic component unit includes a step of manufacturing an electronic component unit having a pressure receiving portion above a fixing pin and the pressure receiving portion of the electronic component unit.
  • the electronic component unit is mounted on a substrate by applying pressure to the electronic component unit to manufacture an electronic device.
  • the mounting member for mounting the electronic component includes a conductor connecting portion, a terminal connecting portion, and a fixing pin.
  • the conductor connecting portion can be divided into a central portion and a side portion sandwiching the central portion.
  • the terminal connection portion is arranged in the central portion of the conductor connection portion and is for connecting to the electronic component.
  • the fixing pins are arranged on the side portions of the conductor connecting portion, respectively, and are used for fixing to the substrate.
  • the pressure applied to the pressure receiving portion is mainly the pressure of the pressure receiving portion inside the mounting member. It acts on the limited area between the receiving part and the fixing pin. Therefore, the pressurization of the holder and the electronic component can be suppressed.
  • FIG. 4 is a front view of the mounting member
  • B of FIG. 4 is a plan view of the mounting member.
  • FIG. 4 shows an example of the electronic component unit which concerns on 2nd Embodiment.
  • FIG. 10 is a plan view of the mounting member, and B of FIG. 10 is a front view of the mounting member. It is a figure which shows the force applied to the electronic component unit. It is a figure which shows an example of the manufacturing method of an electronic component unit. It is a figure which shows an example of the manufacturing method of an electronic component unit. It is a figure which shows another example of the connection of a lead terminal and a terminal connection part.
  • FIG. 1 shows an example of an electronic component unit according to the first embodiment.
  • FIG. 2 is a plan view of the electronic component unit
  • FIG. 3 is a bottom view of the electronic component unit.
  • the electronic component is omitted, and only the outline of the electronic component is shown by a broken line.
  • the configurations shown in FIGS. 1 to 3 are examples, and the techniques of the present disclosure are not limited to such configurations.
  • the fixing pin side of the electronic component unit is the lower side
  • the electronic component side is the upper side.
  • the electronic component unit 2 includes an electronic component 4, a holder 6, and a plurality of mounting members 8. As shown in FIG. 2, the number of mounting members 8 is, for example, two.
  • the electronic component unit 2 is a unit that can be mounted on a substrate 58 (A in FIG. 5 and B in FIG. 5) such as a circuit board. By mounting on the board 58, the electronic component 4 is connected to, for example, a circuit of the board 58.
  • the electronic component 4 includes a component main body portion 12 and a plurality of lead terminals 14. As shown in FIG. 3, the number of lead terminals 14 is, for example, two, which matches the number of mounting members 8.
  • the component main body 12 has, for example, a cylindrical shape, but may have another shape.
  • the electronic component 4 is, for example, a capacitor, but may be another electronic component such as an inductor, a diode, or a transistor.
  • the holder 6 is a rigid member that holds the electronic component 4, and is made of, for example, an insulating resin. As shown in FIG. 2, the holder 6 has an installation portion 22, a plurality of side wall portions 24, an engagement groove 26, and a protruding end portion 28 on the upper surface, that is, the surface on which the electronic component 4 is installed, and is shown in FIG. As described above, the lower surface, that is, the mounting surface, has a plurality of support protrusions 30 and ribs 32.
  • the installation unit 22 has a surface on which the electronic component 4 is installed, and has a through hole 34 through which the lead terminal 14 extending downward from the electronic component 4 passes through.
  • the through hole 34 is formed at a position facing the lead terminal 14. Therefore, when the electronic component 4 is installed in the installation portion 22, the lead terminal 14 passes through the through hole 34 and projects toward the lower surface side of the holder 6. As shown in FIG. 3, the lead terminal 14 on the lower surface side of the holder 6 is bent along the lower surface of the holder 6 and is connected to the mounting member 8 on the outside of the holder 6.
  • the side wall portion 24 is adjacent to the installation portion 22 and is arranged around the installation portion 22.
  • the inner surface of the side wall portion 24 has a shape along the outer surface of the electronic component 4 installed in the installation portion 22, and surrounds the electronic component 4. Therefore, the holder 6 can hold the electronic component 4 by the installation portion 22 and the side wall portion 24.
  • the outer surface of the side wall portion 24 has a first flat surface 24-1 and a second flat surface 24-2 arranged on both sides of the first flat surface.
  • the holder 6 has, for example, four side wall portions 24. As shown in FIG. 2, the four side wall portions 24 form a partially circular surface on the inside and a partially regular octagonal surface on the outside.
  • the four side wall portions 24 form a regular octagonal prism having a cylindrical space inside.
  • the second flat surfaces 24-2 of the adjacent side wall portions 24 are separated from each other, and a gap portion 36 is formed between the adjacent side wall portions 24.
  • the first side surface of this regular octagonal prism is formed by the first flat surface 24-1 of the four side wall portions 24, and the second side surface is the two second flat surfaces 24-2 of the adjacent side wall portions 24. And the gap 36 between them.
  • the engaging groove 26 has a groove into which the mounting member 8 is inserted.
  • the engaging groove 26 has a recess inside.
  • the recess of the engaging groove 26 engages with the protrusion of the mounting member 8 to prevent the inserted mounting member 8 from coming off.
  • the engaging groove 26 includes a through hole 37, and the through hole 37 allows the fixing pin 42 of the mounting member 8 to pass through the lower surface side of the holder 6.
  • the engaging groove 26 is arranged outside the side wall portion 24, for example, outside the second side surface of the above-mentioned regular octagonal prism.
  • the protruding end portion 28 is formed on the outside of a part of the engaging groove 26.
  • the protruding end portion 28 is used when mounting the electronic component unit 2, for example, for determining the position or orientation of the electronic component unit 2.
  • the support protrusion 30 is arranged near the inside of the fixing pin 42 of the mounting member 8 arranged on the lower surface side of the holder 6.
  • the support protrusion 30 makes it possible to optimize the insertion amount of the fixing pin 42 in mounting the electronic component unit 2.
  • the rib 32 is connected to the support protrusion 30 and the edge of the holder 6 and is arranged around the through hole 34.
  • the rib 32 increases the rigidity of the holder 6.
  • Each mounting member 8 includes a conductor connecting portion 38, a terminal connecting portion 40, and a plurality of fixing pins 42.
  • the number of the plurality of fixing pins 42 of each mounting member 8 is, for example, two. As shown in A of FIG. 4 and B of FIG. 4, the mounting member 8 is symmetrical with respect to the terminal connection portion 40.
  • the mounting member 8 has conductivity and includes, for example, a metal such as copper and a plating material such as tin formed on the surface of the metal. Therefore, the conductor connecting portion 38 physically and electrically connects the terminal connecting portion 40 to the plurality of fixing pins 42. A part of the mounting member 8 is inserted into the engaging groove 26 of the holder 6.
  • the mounting member 8 is fixed to the holder 6 to prevent the mounting member 8 from coming off, and is integrated with the holder 6. As shown in FIG. 2, the two mounting members 8 face each other via the installation portion 22. Further, the terminal connecting portions 40 and the two through holes 34 of the two mounting members 8 are arranged in a straight line as shown in FIG.
  • the conductor connecting portion 38 is a plate-shaped or substantially plate-shaped member bent at two places, and has a central portion 38-1 and two side portions 38-. 2 and are included.
  • the two side portions 38-2 sandwich the central portion 38-1 and are connected to both ends of the central portion 38-1 at a predetermined angle ⁇ .
  • the central portion 38-1 is arranged along the first flat surface 24-1 of the side wall portion 24 of the holder 6 as shown in FIG. 2, and the side portions 38-2 are adjacent as shown in FIG. It is arranged along the second flat surface 24-2 and the gap 36 of the side wall portion 24.
  • the angle ⁇ between the central portion 38-1 and the side portion 38-2 coincides with or substantially coincides with the internal angle of the regular octagon, and becomes 135 degrees or approximately 135 degrees. Become.
  • the pressure receiving portion 44 is arranged above the fixing pin 42, and receives the pressure Fp (such as A in FIG. 5) applied at the time of mounting the electronic component unit 2 at least a part of the pressure receiving portion 44.
  • the pressure receiving portion 44 has a surface parallel to the plane OP passing through the upper end of the fixing pin 42 and orthogonal to the fixing pin 42, and is exposed as shown in FIGS. 1 and 2. Further, as shown in FIG. 2, a part of the pressure receiving portion 44 is adjacent to the gap portion 36 between the side wall portions 24.
  • Each side portion 38-2 includes an engaging protrusion 46, a first stopper portion 48, and a second stopper portion 50.
  • the engaging protrusion 46 is arranged between the pressure receiving portion 44 and the fixing pin 42.
  • the engaging protrusion 46 engages with the engaging groove 26 and the mounting member 8 is pulled out. Prevention is achieved.
  • the first stopper portion 48 is formed on the upper portion of the side end of the side portion 38-2 and has a flat surface on the lower side.
  • the second stopper portion 50 is a flat surface on the lower side of the side portion 38-2, and is arranged on the side closer to the central portion 38-1 than the engaging projection 46.
  • the terminal connection portion 40 is arranged at the center of the lower end of the central portion 38-1.
  • the terminal connection portion 40 has two connection pieces 52 extending in the vertical direction, and the two connection pieces 52 are arranged on the same plane as the central portion 38-1 of the conductor connection portion 38.
  • the two connecting pieces 52 are arranged so as to be separated by a predetermined distance L, form a recess 54 between the connecting pieces 52, and form an opening in the direction in which the tip of the fixing pin 42 faces, that is, on the lower side. ing.
  • Each connecting piece 52 has an inclined surface 56 around the opening. Therefore, the openings of the two connecting pieces 52 are wider than the bottom of the recess 54.
  • the inclined surface 56 can guide the lead terminal 14 to the recess 54, so that the burden of inserting the lead terminal 14 into the recess 54 can be reduced.
  • the lower end of the terminal connection portion 40 is arranged on a flat surface OP, for example.
  • connection piece 52 sandwiches and crimps the lead terminal 14 inserted into the recess 54.
  • the fixing pin 42 is arranged under the pressure receiving portion 44 and the engaging projection 46 and on the same plane as the side portion 38-2 of the conductor connecting portion 38.
  • the fixing pin 42 has a function of engaging with, for example, a connection hole 60 (A in FIG. 5 and B in FIG. 5) of the substrate 58, and is, for example, a press-fit connector or a press-fit terminal.
  • the electronic component unit 2 includes, for example, two mounting members 8, and each mounting member 8 has, for example, two fixing pins 42. As shown in FIGS. 2 and 3, a total of four fixing pins 42 are arranged at equal intervals or substantially equal intervals around the electronic component 4 and are located near the four corners on the lower surface of the holder 6 having a substantially rectangular shape. Be placed. Therefore, in the mounted state of the electronic component unit 2, the electronic component unit 2 is fixed in the vicinity of the four corner portions, and a stable mounted state can be obtained.
  • the distance Lp1 between the two fixing pins 42 of each mounting member 8 is preferably equal to or greater than the distance Lt between the two lead terminals 14 of the electronic component 4, as shown in FIG.
  • it is preferably equal to or less than the width D1 of the electronic component 4 in the separation direction of the fixing pin 42, that is, the diameter of the electronic component 4.
  • the distance Lp2 between the two adjacent fixing pins 42 of the two mounting members 8 is preferably a distance Lt or more as shown in FIG. 3, and is in the separating direction of the fixing pins 42 as shown in FIG. It is preferably equal to or less than the width D2 of the electronic component 4, that is, the diameter of the electronic component 4.
  • the distance Lp2 is equal to or greater than the distance Lt, the stability of the electronic component unit 2 in the mounted state is enhanced. Further, when the distance Lp2 is the width D2 or less, the expansion of the installation area of the electronic component unit 2 can be suppressed.
  • a in FIG. 5 shows an example of a force applied to the electronic component unit during mounting
  • B in FIG. 5 shows an example of a force applied to the electronic component unit at the end of mounting.
  • the fixing pins and connection holes in the substrate are shown by broken lines.
  • the solid line arrows indicate the forces applied to the electronic component unit 2.
  • the dashed arrow indicates the direction of movement of the electronic component unit 2
  • the dashed arrow indicates the drag that may be applied to the holder 6.
  • the electronic component unit 2 is mounted on, for example, a substrate 58, as shown in A of FIG. 5 and B of FIG.
  • the substrate 58 has a connection hole 60 at a position corresponding to the fixing pin 42 of the electronic component unit 2.
  • the connection hole 60 is, for example, a through hole.
  • the electronic component unit 2 receives a pressure Fp and a dynamic friction force Fd during mounting, as shown in FIG. 5A.
  • the pressure Fp is a downward force for inserting the fixing pin 42 of the electronic component unit 2 into the connection hole 60 of the substrate 58, and is shown in a part of the exposed pressure receiving portion 44 of the mounting member 8, for example, A in FIG. It is added directly above the fixing pin 42 so as to.
  • the dynamic friction force Fd is generated by the friction between the fixing pin 42 and the connection hole 60.
  • the dynamic friction force Fd has a direction opposite to the pressure Fp and is offset by the pressure Fp. Due to the insertion of the fixing pin 42, the pressure Fp has a magnitude greater than or equal to the dynamic friction force Fd.
  • the portion of the pressure receiving portion 44 that receives the pressure Fp (the portion where the arrow indicating the pressure Fp is in contact with the pressure receiving portion 44) is arranged directly above the fixing pin 42, that is, on the perpendicular line of the substrate 58 passing through the fixing pin 42. .. Therefore, the pressure Fp faces the dynamic friction force Fd on a straight line.
  • the electronic component unit 2 receives a pressure Fp and a static friction force Fs as shown in B of FIG.
  • the static friction force Fs is generated by the friction between the fixing pin 42 and the connection hole 60.
  • the static friction force Fs has a direction opposite to the pressure Fp and is offset by the pressure Fp.
  • the maximum static friction force Fs is larger than the dynamic friction force Fd. Therefore, when the pressure Fp is set to a magnitude equal to or more than the dynamic friction force Fd and not more than the maximum static friction force, the pressure Fp is balanced with the static friction force Fs at the end of mounting. Therefore, the support protrusion 30 of the holder 6 can gently contact the substrate 58. That is, the drag force Fr that the support protrusion 30 receives from the substrate 58 can be suppressed.
  • the pressure Fp larger than the maximum static friction force is balanced with the static friction force Fs and the drag force Fr as shown in B of FIG.
  • the pressure Fp is generated by, for example, a pressurizing device (not shown) corresponding to the electronic component unit 2.
  • the pressurizing device includes, for example, a pressurization stop setting.
  • the stop set value is a set value related to the distance from the substrate 58.
  • the pressurizing device pushes the pressure receiving portion 44 toward the substrate 58 to the distance set by the stop set value, the pressurizing device stops the pressurization.
  • the distance from the substrate 58 set by the stop set value is, for example, the distance from the substrate 58 shown in FIG. 5B to the pressure receiving portion 44.
  • Such a pressurizing device stops pressurizing when the fixing pin 42 is inserted into the connection hole 60 to an appropriate position. Therefore, even if the pressure Fp is larger than the maximum static friction force, the generation of the drag force Fr can be suppressed.
  • Both the pressure receiving portion 44 and the fixing pin 42 are formed on the mounting member 8, and the portion of the pressure receiving portion 44 that receives the pressure Fp is arranged directly above the fixing pin 42. Therefore, the pressure Fp, the dynamic friction force Fd, and the static friction force Fs act on a limited region of the mounting member 8, that is, a region 61 between the portion of the pressure receiving portion 44 that receives the pressure Fp and the fixing pin 42, and the electronic component 4 And the action of force on the holder 6 is suppressed. Further, when the pressure receiving portion 44 is arranged directly above the fixing pin 42, the direction in which the pressure Fp is applied coincides with or substantially coincides with the direction from the pressure receiving portion 44 toward the fixing pin 42. Therefore, the pressure Fp can be easily transmitted to the fixing pin 42, and the mountability of the electronic component unit 2 can be improved.
  • terminal connection portion 40 Since the terminal connection portion 40 is separated from the region 61 between the portion of the pressure receiving portion 44 that receives the pressure Fp and the fixing pin 42, the action of the force on the terminal connection portion 40 is suppressed.
  • the drag force Fr acts on the holder 6 in the vicinity of the fixing pin 42. Therefore, the pressure Fp, the static friction force Fs, and the drag force Fr are limited to a limited region of the mounting member 8 and the holder 6, that is, a region between the fixing pin 42 on which the force is applied, the support protrusion 30, and the pressure receiving portion 44. It acts on 62. Therefore, even if the drag force Fr is generated, the action of the force on the electronic component 4 and the holder 6 is suppressed. Further, since the terminal connection portion 40 is arranged between the adjacent support protrusions 30 and further in the middle of the support protrusions 30 and is separated from the region 62, the terminal connection portion 40 is separated from the region 62 even if a drag force Fr is generated. The effect of force on is suppressed.
  • the lead terminal 14 is connected to the terminal connection portion 40 in the vicinity of the substrate 58 in the mounted state.
  • the connection in the vicinity of the substrate 58 can improve the stability of the connection against vibration, for example, as compared with the connection at a position away from the substrate 58.
  • the substrate 58 faces the opening of the terminal connection portion 40 with a slight gap between them, so that the vibration of the substrate 58 can be prevented from being directly transmitted to the terminal connection portion 40.
  • the portion of the pressure receiving portion 44 to which the pressure Fp is applied is adjacent to the gap portion 36, there are free spaces on both sides of the pressure receiving portion 44. There are few obstacles around the pressure receiving unit 44, and a work space for pressurizing the pressure receiving unit 44 is secured. Therefore, the workability for mounting the electronic component unit 2 is improved. For example, it is possible to suppress the risk of unintended contact of the pressurizing device with the electronic component unit 2.
  • the part where the pressure Fp is applied is not limited to directly above the fixing pin 42.
  • a pressure Fp may be applied between the position directly above the fixing pin 42 and the position directly above the terminal connection portion 40.
  • the terminal connection portion 40 may be applied.
  • the pressure Fp may be applied to the position directly above the mounting member 8, that is, the central portion of the mounting member 8. That is, the portion of the pressure receiving portion 44 that receives the pressure Fp may be arranged at a position away from the perpendicular line of the substrate 58 passing through the fixing pin 42.
  • the terminal connecting portion 40 is placed between the portion of the pressure receiving portion 44 that receives the pressure Fp and the fixing pin 42. It can be arranged at a position away from the area 61.
  • FIGS. 7 and 8 show an example of the manufacturing procedure of the electronic component unit.
  • the manufacturing procedure shown in FIGS. 7 and 8 is an example of a method for manufacturing an electronic component unit.
  • the electronic component 4 may be manufactured independently or may be a commercially available electronic component.
  • the holder 6 is manufactured by, for example, resin molding using a mold.
  • the holder 6 may be manufactured by, for example, a 3D printer.
  • the mounting member 8 is manufactured through, for example, a cutting step, a molding step, and a plating step.
  • a metal plate such as a copper plate is punched into a predetermined shape using, for example, a die.
  • a metal plate having a predetermined shape may be obtained, and the metal plate may be cut by a cutting machine such as a laser cutting machine or a water jet cutting machine.
  • a metal plate having a predetermined shape is molded into a predetermined shape using, for example, a mold.
  • the surface of the molded metal plate is plated.
  • the cutting step and the molding step may be performed integrally.
  • the fixing pin 42, the engaging protrusion 46, and the side portion 38-2 of the mounting member 8 are inserted into the engaging groove 26 of the holder 6, the fixing pin 42 protrudes from the lower surface of the holder 6, and the engaging protrusion 46 is the engaging groove. Engage with 26.
  • the mounting member 8 is integrally installed in the holder 6.
  • the lead terminal 14 of the electronic component 4 is inserted into the through hole 34 of the holder 6, and the component main body portion 12 of the electronic component 4 is installed in the installation portion 22 of the holder 6. As shown in FIG. 8, the lead terminal 14 protruding from the lower surface of the holder 6 is bent along the lower surface of the holder 6 and connected to the terminal connection portion 40 of the mounting member 8. Through these steps, the electronic component unit 2 is obtained.
  • the electronic component unit 2 obtained through the above steps is provided with a pressure receiving portion 44 above the fixing pin 42.
  • pressure Fp is applied to the pressure receiving portion 44 of the electronic component unit 2
  • the fixing pin 42 of the electronic component unit 2 is inserted into the connection hole 60 of the substrate 58, and the electronic component unit 2 is mounted on the substrate 58, the electronic component unit 2 is mounted. It is possible to obtain an electronic device equipped with.
  • the pressure Fp applied to the pressure receiving portion 44 is mainly the mounting member 8. It acts on the limited area 61 between the portion of the pressure receiving portion 44 that receives the pressure Fp and the fixing pin 42. Therefore, the pressurization of the holder 6 and the electronic component 4 can be suppressed.
  • Each lead terminal 14 of the electronic component 4 is connected to a plurality of fixing pins 42. Therefore, the electronic component unit 2 is fixed to, for example, the substrate 58 with at least twice the number of fixing pins 42 as the number of lead terminals 14, and the stability of the connection of the electronic component unit 2 is enhanced.
  • Each lead terminal 14 of the electronic component 4 can be connected to, for example, a circuit of a board 58 with a plurality of fixing pins 42. Therefore, even if a problem occurs in some of the connections, the connection between the electronic component 4 and the circuit can be maintained by other connections, and the reliability of the connection can be improved.
  • the lead terminal 14 can be connected to the terminal connection portion 40 from the bottom to the top. Therefore, in the electronic component unit 2, the electronic component 4 can be mounted on the substrate 58 so that the lead terminal 14 of the electronic component 4 is arranged on the substrate 58 side.
  • FIG. 9 shows an example of the electronic component unit according to the second embodiment.
  • the configuration shown in FIG. 9 is an example, and the technique of the present disclosure is not limited to such a configuration.
  • the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals.
  • the electronic component unit 72 includes the electronic component 4 described above, the holder 76, and a plurality of mounting members 78.
  • the number of mounting members 78 is, for example, two.
  • the electronic component unit 72 can be mounted on the above-mentioned board 58, for example, and the electronic component 4 is connected to the circuit of the board 58 by mounting on the board 58, for example.
  • the holder 76 is a rigid member that holds the electronic component 4, and is made of, for example, an insulating resin.
  • the holder 76 has the installation portion 22 described in the first embodiment and the plurality of side wall portions 80 on the upper surface, and the plurality of support protrusions 30 described in the first embodiment on the lower surface. And has ribs 32.
  • the side wall portion 80 has a structure in which two adjacent side wall portions 24 described above in the first embodiment are integrated. That is, the holder 76 has a side wall portion instead of the gap 36 between the two adjacent side wall portions 24, and the two adjacent side wall portions 24 and the side wall portion between them form one side wall portion 80. ing.
  • the holder 76 includes two side wall portions 80, and a gap portion 36 is formed between the side wall portions 80.
  • Each mounting member 78 is partially embedded inside the holder 76, and is fixed and integrated with the holder 76. As shown in A of FIG. 10 and B of FIG. 10, the mounting member 78 includes a conductor connecting portion 82, a terminal connecting portion 84, and a plurality of fixing pins 86. The number of the plurality of fixing pins 86 is, for example, two.
  • the mounting member 78 is symmetrical with respect to the terminal connection portion 84.
  • the mounting member 78 has conductivity and includes, for example, a metal such as copper and a plating material such as tin formed on the surface of the metal. Therefore, the conductor connecting portion 82 physically and electrically connects the terminal connecting portion 84 to the plurality of fixing pins 86. Similar to the mounting member 8 described in the first embodiment, the two mounting members 78 face each other via the installation portion 22, and the terminal connecting portion 84 and the two through holes 34 of the two mounting members 78 are opposed to each other. Are arranged in a straight line.
  • the conductor connecting portion 82 is a plate-shaped or substantially plate-shaped member as shown in A of FIG. 10 and B of FIG.
  • the conductor connecting portion 82 includes a retracting portion 88-1 in order to avoid contact with the through hole 34 of the holder 76. Further, the conductor connecting portion 82 includes the retracting portions 88-2 and 88-3 in order to avoid the vertical division of the holder 76 by the conductor connecting portion 82.
  • the conductor connecting portion 82 can be divided into three equal parts in the left-right direction, and can be divided into, for example, a central portion 82-1 and two side portions 82-2. The two side portions 82-2 sandwich the central portion 82-1 and are connected to both ends of the central portion 82-1.
  • Each side portion 82-2 includes a pressure receiving portion 90.
  • the pressure receiving portion 90 is arranged above the fixing pin 86, and is further arranged directly above the fixing pin 86. In the electronic component unit 72, in particular, the pressure receiving portion 90 is adjacent to the fixing pin 86.
  • the pressure receiving portion 90 has a surface parallel to or substantially parallel to the plane OP passing through the upper end of the fixing pin 86 and orthogonal to the fixing pin 86. As shown in FIG. 9, the pressure receiving portion 90 is arranged near the outer side of the side wall portion 80 of the holder 76 and is exposed.
  • the terminal connection portion 84 is arranged at the center of one end of the central portion 82-1.
  • the terminal connection portion 84 has two connection pieces 92 extending in the longitudinal direction of the conductor connection portion 82 and in a direction orthogonal to or substantially orthogonal to the main surface.
  • the distance L, the recess 54, the opening and the inclined surface 56 between the two connecting pieces 92 are the same as those of the terminal connecting portion 40 described in the first embodiment.
  • the fixing pin 86 is arranged below the pressure receiving portion 90.
  • the fixing pin 86 has a function of engaging, for example, with the connection hole 60 of the substrate 58, and is, for example, a press-fit connector or a press-fit terminal.
  • the fixing pin 86 extends in the longitudinal direction of the conductor connecting portion 82 and in a direction orthogonal to or substantially orthogonal to the main surface.
  • the electronic component unit 72 includes, for example, two mounting members 78, and each mounting member 78 has, for example, two fixing pins 86.
  • a total of four fixing pins 86 are arranged at equal intervals or substantially equal intervals around the electronic component 4 as described above in the first embodiment. Further, a total of four fixing pins 86 are arranged on every other side in the vicinity of the eight sides of the lower surface of the holder 76 having an octagonal shape. Therefore, a stable mounting state can be obtained in the mounting state of the electronic component unit 72.
  • the distance Lp3 between the two fixing pins 86 of each mounting member 78 is preferably the distance Lt or more and preferably the width D1 or less, as in the case of the distance Lp1 described in the first embodiment. .. Further, the distance between the two adjacent fixing pins 86 of the two mounting members 78 is preferably the distance Lt or more, and the width D2 or less, as in the case of the distance Lp2 described in the first embodiment. It is preferable to have.
  • a in FIG. 11 shows the force applied to the electronic component unit during mounting
  • B in FIG. 11 shows the force applied to the electronic component unit at the end of mounting.
  • the fixing pins and connection holes in the substrate are shown by broken lines.
  • the solid line arrow indicates the force applied to the electronic component unit 72.
  • the dashed arrow indicates the direction of movement of the electronic component unit 72
  • the dashed arrow indicates the drag that may be applied to the holder 76.
  • the electronic component unit 72 receives the pressure Fp and the dynamic friction force Fd described in the first embodiment as shown in A of FIG. 11 during mounting.
  • the pressure Fp is applied to the pressure receiving portion 90 of the mounting member 78.
  • the electronic component unit 72 receives the pressure Fp and the static friction force Fs described in the first embodiment as shown in FIG. 11B. Further, at the end of mounting, the electronic component unit 72 may receive the drag force Fr described in the first embodiment as shown in B of FIG.
  • Both the pressure receiving portion 90 and the fixing pin 86 are formed on the mounting member 78, and the pressure receiving portion 90 is arranged above the fixing pin 86 and further directly above the fixing pin 86. Therefore, the pressure Fp, the dynamic friction force Fd, and the static friction force Fs act on a limited region of the mounting member 78, that is, a region 61 between the pressure receiving portion 90 and the fixing pin 86, and exerts a force on the electronic component 4 and the holder 76. The action is suppressed. In the electronic component unit 72, in particular, the pressure receiving portion 90 is adjacent to the fixing pin 86.
  • the region on which the pressure Fp, the dynamic friction force Fd, and the static friction force Fs act can be limited to an extremely limited region, that is, a narrow region 61 between the pressure receiving portion 90 and the fixing pin 86. Further, when the pressure receiving portion 90 is arranged directly above the fixing pin 86, the direction in which the pressure Fp is applied coincides with or substantially coincides with the direction from the pressure receiving portion 90 toward the fixing pin 86. Therefore, the pressure Fp can be easily transmitted to the fixing pin 86, and the mountability of the electronic component unit 72 can be improved.
  • terminal connection portion 84 Since the terminal connection portion 84 is separated from the region 61 between the pressure receiving portion 90 and the fixing pin 86, the action of the force on the terminal connection portion 84 is suppressed.
  • the terminal connection portion 84 is arranged between the adjacent support protrusions 30 and further in the middle of the support protrusions 30, and the drag force Fr acts on the holder 76 in the vicinity of the fixing pin 86. Therefore, as described above in the first embodiment, even if the drag force Fr is generated, the action of the force on the electronic component 4, the holder 76, and the terminal connection portion 84 is suppressed.
  • the lead terminal 14 is connected to the terminal connection portion 84 in the vicinity of the substrate 58 in the mounted state, and the substrate 58 faces the opening of the terminal connection portion 84 with a slight gap. .. Therefore, as described in the first embodiment, the connection in the vicinity of the substrate 58 can improve the stability of the connection against vibration, for example, and the vibration of the substrate 58 is directly transmitted to the terminal connection portion 40. Can be prevented.
  • FIGS. 12 and 13 show an example of the manufacturing procedure of the electronic component unit.
  • the manufacturing procedure shown in FIGS. 12 and 13 is an example of a method for manufacturing an electronic component unit.
  • the mounting member 78 is manufactured through, for example, a cutting step, a molding step, and a plating step.
  • a metal plate such as a copper plate is punched into a predetermined shape using, for example, a die.
  • the punched metal plate has two deploying parts of mounting members 78 and a frame 94.
  • the frame 94 is arranged outside the unfolding parts of the two mounting members 78, and is connected to each unfolding part at a plurality of positions. Therefore, the frame 94 can fix the relative positions of the two unfolding parts arranged in the frame. Further, the frame 94 has a plurality of positioning holes 96.
  • the plurality of positioning holes 96 can position, for example, two developing parts or two mounting members 78 in the steps after the molding step.
  • a metal plate having a predetermined shape may be obtained, and the metal plate may be cut by a cutting machine such as a laser cutting machine or a water jet cutting machine.
  • a metal plate is molded into a predetermined shape using, for example, a mold.
  • the surface of the molded metal plate is plated.
  • the cutting step and the molding step may be performed integrally.
  • the holder 76 is formed around the manufactured mounting member 78.
  • the holder 76 is manufactured, for example, by resin molding using a mold. In molding the holder 76, a part of the mounting member 78 is embedded inside the holder 76 by insert molding. By molding the holder 76, the mounting member 78 is inserted into the holder 76 and integrated with the holder 76.
  • the mounting member 78 is removed from the frame 94 to obtain a holder 76 to which the mounting member 78 is attached.
  • the lead terminal 14 of the electronic component 4 is inserted into the through hole 34 of the holder 76, and the component main body portion 12 of the electronic component 4 is installed in the installation portion 22 of the holder 76.
  • the lead terminal 14 protruding from the lower surface of the holder 76 is bent and connected to the terminal connection portion 84 of the mounting member 78 in the same manner as in the first embodiment. Through these steps, the electronic component unit 72 is obtained.
  • the electronic component unit 72 obtained through the above steps is provided with a pressure receiving portion 90 above the fixing pin 86.
  • pressure Fp is applied to the pressure receiving portion 90 of the electronic component unit 72
  • the fixing pin 86 of the electronic component unit 72 is inserted into the connection hole 60 of the substrate 58, and the electronic component unit 72 is mounted on the substrate 58, the electronic component unit 72 is mounted. It is possible to obtain an electronic device equipped with.
  • the mounting member 78 is embedded inside the holder 76 by insert molding. Therefore, the holder 76 does not need to have an engaging groove, and the side surface of the mounting member 78 from the pressure receiving portion 90 to the fixing pin 86 can be exposed. Therefore, the bottom area of the electronic component unit 72 can be suppressed.
  • the mounting member 8 is generally arranged outside the side wall portion 24. Therefore, the height of the electronic component unit 2 can be suppressed.
  • the electronic component 4 has two lead terminals 14, and the electronic component units 2 and 72 include the same number of mounting members 8 and 78 as the lead terminals 14.
  • the number of lead terminals 14 and mounting members 8 and 78 may be one or three or more.
  • the electronic component units 2 and 72 include a smaller number of mounting members 8 and 78 than the number of lead terminals 14, so that a part of the lead terminals 14 is connected to the circuit without using the mounting members 8 and 78. It may be.
  • the side wall portions 24 and 80 form a regular octagon in a plan view.
  • the shape formed by the side wall portions 24 and 80 is a regular octagon
  • four fixing pins 42 and 86 can be arranged on every other side as shown in FIGS. 2 and 3, and the fixing pins 42 and 86 can be electronically arranged. It can be arranged at equal intervals or substantially even intervals around the component 4.
  • the two terminal connection portions 40 and 84 and the two through holes 34 can be arranged in a straight line.
  • the shapes of the side wall portions 24 and 80 may be regular octagons having different side lengths, and may be circular or other polygons.
  • the side wall portion is a regular dodecagon
  • six fixing pins can be arranged on every other side and three terminal connection portions can be arranged on every four sides.
  • the fixing pins and terminal connections can be placed around the electronic component at equal or nearly equal intervals, for example to improve the connectivity of the three lead terminals located at the three corners of an equilateral triangle. it can.
  • the pressure receiving portions 44 and 90 have a plane parallel to the plane OP orthogonal to the fixing pins 42 and 86, or a plane substantially parallel to the plane OP.
  • a downward pressure Fp can be applied to the pressure receiving portions 44 and 90, and the pressure receiving portions 44 and 90 are not limited to a plane parallel to the plane OP or a plane substantially parallel to the plane OP.
  • the pressure receiving portion 44 receives the pressure Fp at one or two places, but may receive the pressure Fp at three or more places.
  • the pressure receiving portions 44 and 90 are exposed.
  • the pressure receiving portions 44 and 90 may be covered with, for example, a cover (not shown).
  • the pressure Fp is transmitted to the pressure receiving portions 44 and 90 via the cover. Therefore, the action of the force on the electronic component 4 and the holders 6 and 76 can be suppressed regardless of whether or not the cover is connected to the holders 6 and 76.
  • the mounting members 8 and 78 include a metal such as copper and a plating material such as tin formed on the surface of this metal. Therefore, the mounting members 8 and 78 are excellent in conductivity, and are excellent in rust prevention and electrical connection stability by tin plating. However, the mounting members 8 and 78 need only have conductivity, and are not limited to such materials.
  • the manufacturing procedure of the present disclosure is not limited to such a procedure.
  • the electronic component 4 is installed in the holder 6, the lead terminal 14 is bent along the lower surface of the holder 6, and then, as shown in FIG. 14, the terminal connection portion is inserted when the mounting member 8 is inserted into the holder 6. 40 may be connected to the lead terminal 14. According to such a manufacturing procedure, it is possible to avoid connecting the lead terminal 14 to the terminal connecting portion 40 while bending the lead terminal 14, and therefore, the stability of the electrical connection can be improved.
  • the pressure receiving portion 90 of the electronic component unit 72 is adjacent to the side wall portion 80, but as described in the first embodiment, the pressure receiving portion 90 is the gap portion 36. May be adjacent to.
  • the gap portion 36 By arranging the gap portion 36, free spaces are formed on both sides of the pressure receiving portion 90. Therefore, there are few obstacles around the pressure receiving portion 90, and a work space for pressurizing the pressure receiving portion 90 can be secured.
  • the electronic component units 2 and 72 include one electronic component 4, but the electronic component units 2 and 72 include a plurality of electronic components 4 and the holders 6 and 76 contain a plurality of electrons.
  • the component 4 may be held.
  • a part or all of the lead terminals 14 of the plurality of electronic components 4 may be connected to the mounting member 8 or the mounting member 78.
  • the technique of the present disclosure can be used and is useful, for example, for mounting electronic components on a substrate.

Abstract

La présente invention a pour but de supprimer une force qui est exercée sur un composant électronique, tel qu'un corps de condensateur, ou un support lorsque, par exemple, une unité de composant électronique est montée sur un substrat.　L'unité de composant électronique (2) comprend un support (6) et un élément de montage (8). Le support est destiné à maintenir un composant électronique (4). L'élément de montage est fixé au support, et comprend, par exemple, une broche de fixation (42) et une partie de réception de pression (44) qui est disposée au-dessus de ladite broche de fixation et reçoit une pression appliquée sur celle-ci lorsque le composant électronique est monté.
PCT/JP2020/036164 2019-09-27 2020-09-25 Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage WO2021060431A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019177870A JP7388099B2 (ja) 2019-09-27 2019-09-27 電子部品ユニット、その製造方法、および電子部品ユニットを備えた電子機器の製造方法
JP2019177869A JP7388098B2 (ja) 2019-09-27 2019-09-27 電子部品ユニット、その製造方法および実装部材
JP2019-177869 2019-09-27
JP2019-177870 2019-09-27

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WO2021060431A1 true WO2021060431A1 (fr) 2021-04-01

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PCT/JP2020/036164 WO2021060431A1 (fr) 2019-09-27 2020-09-25 Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11309128B2 (en) * 2018-03-28 2022-04-19 Panasonic Intellectual Property Management Co., Ltd. Capacitor with seat plate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100658A (ja) * 2004-09-30 2006-04-13 Nippon Chemicon Corp チップ型コンデンサ
JP2008124244A (ja) * 2006-11-13 2008-05-29 Matsushita Electric Ind Co Ltd 電子部品及びそれを用いた電子制御装置
JP2017208409A (ja) * 2016-05-17 2017-11-24 ニチコン株式会社 チップ形電解コンデンサ及びその製造方法
WO2018020993A1 (fr) * 2016-07-29 2018-02-01 パナソニックＩｐマネジメント株式会社 Condensateur électrolytique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100658A (ja) * 2004-09-30 2006-04-13 Nippon Chemicon Corp チップ型コンデンサ
JP2008124244A (ja) * 2006-11-13 2008-05-29 Matsushita Electric Ind Co Ltd 電子部品及びそれを用いた電子制御装置
JP2017208409A (ja) * 2016-05-17 2017-11-24 ニチコン株式会社 チップ形電解コンデンサ及びその製造方法
WO2018020993A1 (fr) * 2016-07-29 2018-02-01 パナソニックＩｐマネジメント株式会社 Condensateur électrolytique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11309128B2 (en) * 2018-03-28 2022-04-19 Panasonic Intellectual Property Management Co., Ltd. Capacitor with seat plate

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