WO2018020993A1 - Condensateur électrolytique - Google Patents

Condensateur électrolytique Download PDF

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Publication number
WO2018020993A1
WO2018020993A1 PCT/JP2017/025091 JP2017025091W WO2018020993A1 WO 2018020993 A1 WO2018020993 A1 WO 2018020993A1 JP 2017025091 W JP2017025091 W JP 2017025091W WO 2018020993 A1 WO2018020993 A1 WO 2018020993A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
mold resin
portions
electrolytic capacitor
sealing member
Prior art date
Application number
PCT/JP2017/025091
Other languages
English (en)
Japanese (ja)
Inventor
椿　雄一郎
青山　達治
武田　博
美代子 増田
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2018529481A priority Critical patent/JP7209283B2/ja
Publication of WO2018020993A1 publication Critical patent/WO2018020993A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires

Definitions

  • the present disclosure relates to an electrolytic capacitor including a mold resin layer that covers a sealing member.
  • the conventional electrolytic capacitor includes a capacitor element 110, a case 111 that accommodates the capacitor element 110 and has an opening, and a sealing member 112 that seals the opening of the case 111.
  • the element 110 is connected to leads 114A and 114B for taking out electricity.
  • the sealing member 112 may be deteriorated by oxidation in a high temperature environment. When the sealing member 112 is deteriorated, the sealing performance of the electrolytic capacitor is lowered. Therefore, in order to improve the airtightness of the electrolytic capacitor, a mold resin layer 113 that covers the sealing member 112 is provided.
  • the leads 114A and 114B include portions P11a and P11b penetrating the sealing member 112, portions P12a and P12b disposed along the mounting surface 113S of the mold resin layer 113, and portions P11a and P11b and portions P12a and P12b. And bent portions P13a and P13b (for example, Patent Document 1).
  • the bent portions P13a and P13b are formed by bending the portions exposed from the mold resin layer 113 of the leads 114A and 114B substantially vertically.
  • the electrolytic capacitor according to the first aspect of the present disclosure includes a capacitor element, a case, a sealing member, a mold resin layer, and a lead.
  • the case accommodates the capacitor element and has an opening.
  • the sealing member seals the opening.
  • the mold resin layer covers the sealing member.
  • the lead is connected to the capacitor element and penetrates the sealing member and the mold resin layer. A part of the lead is drawn from the mold resin layer on the side close to the mounting surface of the mold resin layer.
  • the lead has a first portion, a second portion, and a bent portion that bends between the first portion and the second portion. The first portion penetrates the sealing member.
  • the second portion is disposed along the mounting surface of the mold resin layer. At least a part of the bent portion is embedded in the mold resin layer.
  • the electrolytic capacitor according to the second aspect of the present disclosure includes a capacitor element, a case, a sealing member, a mold resin layer, and a lead.
  • the case accommodates the capacitor element and has an opening.
  • the sealing member seals the opening.
  • the mold resin layer covers the sealing member.
  • the lead is connected to the capacitor element and penetrates the sealing member and the mold resin layer. A part of the lead is drawn from the mold resin layer on the side close to the mounting surface of the mold resin layer.
  • the lead has a first portion, a second portion, and a bent portion that bends between the first portion and the second portion. The first portion penetrates the sealing member.
  • the second portion is disposed along the mounting surface of the mold resin layer.
  • the mold resin layer has an inclined portion at a position facing the bent portion.
  • an electrolytic capacitor including a mold resin layer covering a sealing member, it is possible to suppress the occurrence of cracks and breaks in the bent portion of the lead, and to improve the reliability of the electrolytic capacitor.
  • FIG. 3 is a bottom view of the electrolytic capacitor shown in FIG. 2. It is a schematic sectional drawing which shows the principal part of the electrolytic capacitor which concerns on the other modification of 1st Embodiment. It is a schematic sectional drawing which shows the principal part of the state which bent the lead a little before forming the mold resin layer in the manufacture process of the electrolytic capacitor which concerns on 1st Embodiment. It is the schematic for demonstrating the structure of the capacitor
  • FIG. 10 is a bottom view of the electrolytic capacitor shown in FIG. 9. It is a schematic sectional drawing which shows the principal part of the electrolytic capacitor which concerns on another modification of 2nd Embodiment. It is a schematic sectional drawing which shows the principal part of the state which bent the lead a little before forming the mold resin layer in the manufacture process of the electrolytic capacitor which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the principal part of the conventional electrolytic capacitor.
  • the leads 114 ⁇ / b> A and 114 ⁇ / b> B are abruptly bent when exposed from the mold resin layer 113 and are disposed along the mounting surface 113 ⁇ / b> S of the mold resin layer 113.
  • stress is applied to the inside of the bent portions P13a and P13b due to vibration or the like, so that the stress is concentrated and the bent portions P13a and P13b are cracked. Or break. In this case, the reliability of the electrolytic capacitor is reduced.
  • the electrolytic capacitor according to the first embodiment of the present disclosure includes a capacitor element, a case, a sealing member, a mold resin layer, and leads.
  • the case houses the capacitor element.
  • the sealing member seals the opening of the case.
  • the mold resin layer covers the sealing member.
  • the lead is connected to the capacitor element and penetrates the sealing member and the mold resin layer. A part of the lead is drawn from the mold resin layer on the side close to the mounting surface of the mold resin layer.
  • the lead has a first portion, a second portion, and a bent portion that bends between the first portion and the second portion. The first portion penetrates the sealing member.
  • the second portion is disposed along the mounting surface of the mold resin layer. Here, at least a part of the bent portion is embedded in the mold resin layer.
  • the bent portion Since the bent portion has a curved shape, the stress is easily dispersed even when stress is applied to the bent portion by vibration or the like. In addition, since at least a part of the bent portion is embedded in the mold resin layer, stress due to vibration or the like is hardly applied to the bent portion. Therefore, cracks and breakage are unlikely to occur in the leads, and the reliability of the electrolytic capacitor is improved.
  • the electrolytic capacitor according to the second embodiment of the present disclosure includes a capacitor element, a case, a sealing member, a mold resin layer, and leads.
  • the case houses the capacitor element.
  • the sealing member seals the opening of the case.
  • the mold resin layer covers the sealing member.
  • the lead is connected to the capacitor element and penetrates the sealing member and the mold resin layer. A part of the lead is drawn from the mold resin layer on the side close to the mounting surface of the mold resin layer.
  • the lead has a first portion, a second portion, and a bent portion that bends between the first portion and the second portion. The first portion penetrates the sealing member.
  • the second portion is disposed along the mounting surface of the mold resin layer.
  • the mold resin layer has an inclined portion at a position facing the bent portion. Due to the presence of the inclined portion, the lead can be processed without being bent suddenly, so that the lead is hardly cracked or broken, and the reliability of the electrolytic capacitor is improved.
  • the inclined portion is a portion where the angle changes gently, for example, a portion having a tapered surface or a curved surface.
  • the angle gradually changes from the portion facing the one end portion on the first portion side of the bent portion to the portion facing the other end portion on the second portion side of the bent portion. It suffices if an inclined surface is configured. In such a case, even when stress is applied to the bent portion due to vibration or the like, the stress is easily dispersed.
  • the rate at which the angle changes slowly may be constant or different.
  • the sealing member and the mold resin layer are hardly damaged when the lead is bent, and the air density in the case can be maintained.
  • FIG. 1 is a schematic cross-sectional view of the electrolytic capacitor according to the first embodiment.
  • the electrolytic capacitor includes a capacitor element 10 and a bottomed cylindrical case 11 that houses the capacitor element 10 and has an opening.
  • the material of the case 11 include metals such as aluminum, stainless steel, copper, iron, brass, and alloys thereof.
  • the electrolytic capacitor includes a sealing member 12 that seals the opening of the case 11 and a mold resin layer 13 that covers the sealing member 12.
  • the mold resin layer 13 is provided so as to cover the opening of the case 11 together with the main surface disposed on the outside of the case 11 of the sealing member 12.
  • the opening of case 11 is sealed with sealing member 12 and mold resin layer 13 after accommodating capacitor element 10.
  • the vicinity of the opening end of the case 11 is drawn inward, and the case 11 is sealed by fitting a sealing member 12 in the vicinity of the opening end of the drawn case 11.
  • the mold resin layer 13 further covers at least a part of the side surface of the case 11 following the opening. Thereby, the sealing performance of the electrolytic capacitor can be further enhanced.
  • the mold resin layer 13 is bonded to the case 11 and the sealing member 12, but there may be portions that are not partially bonded.
  • the electrolytic capacitor includes a pair of leads 14 ⁇ / b> A and 14 ⁇ / b> B that are connected to the capacitor element 10 and penetrate the sealing member 12 and the mold resin layer 13.
  • leads 14 ⁇ / b> A and 14 ⁇ / b> B that are connected to the capacitor element 10 and penetrate the sealing member 12 and the mold resin layer 13.
  • the leads 14A and 14B have linear portions 15A and 15B and tab portions 16A and 16B connected to the linear portions 15A and 15B, respectively.
  • the shape in particular of linear part 15A, 15B is not restrict
  • the linear portions 15A and 15B and the tab portions 16A and 16B are connected by welding or the like.
  • the linear portions 15A and 15B include, for example, iron, copper, nickel, tin, and the like.
  • the linear portions 15A and 15B include, for example, aluminum.
  • the tab portions 16A and 16B have rod-like portions 17A and 17B and flat portions 18A and 18B, respectively.
  • the rod-like portions 17A and 17B and the flat portions 18A and 18B may be electrically connected, or may be integrated.
  • a flat part is formed by rolling one end part of a rod-like body, and a tab part in which the flat part and the rod-like part are integrated can be formed by leaving an unrolled region as a rod-like part.
  • the shape of the rod-shaped portions 17A and 17B is not particularly limited, and may be a round rod shape (for example, a rod shape having a circular or elliptical cross section) or a square bar shape (for example, a rod shape having a polygonal cross section). Also good.
  • the rod-shaped portions 17A and 17B include portions (first portions) P1a and P1b penetrating the sealing member 12, respectively.
  • the end portions of the rod-like portions 17A and 17B are exposed from the surface of the sealing member 12 on the mold resin layer 13 side.
  • the linear portions 15A and 15B extend from the tip portions of the rod-like portions 17A and 17B, respectively.
  • the rod-like portions 17A and 17B are connected to the capacitor element 10 via flat portions 18A and 18B, respectively. By having the flat portions 18A and 18B, the connection between the leads 14A and 14B and the capacitor element is facilitated.
  • the linear portions 15 ⁇ / b> A and 15 ⁇ / b> B have portions that are drawn out from the mold resin layer 13 on the side close to the mounting surface 13 ⁇ / b> S of the mold resin layer 13, and these portions extend along the mounting surface 13 ⁇ / b> S of the mold resin layer 13.
  • the linear portions 15A and 15B have bent portions P3a and P3b that are curved in an arc shape between the portions P1a and P1b and the portions P2a and P2b, respectively.
  • the portion P2a is arranged so as to extend from the end portion on the bent portion P3a side in the direction opposite to the linear portion 15B.
  • the portion P2b is arranged so as to extend from the end portion on the bent portion P3b side in the direction opposite to the linear portion 15A.
  • bent portions P3a and P3b By providing the bent portions P3a and P3b between the portions P1a and P1b and the portions P2a and P2b, even when stress is applied to the bent portions P3a and P3b of the leads 14A and 14B due to vibration or the like, the bent portions P3a and P3b The stress is dispersed by the curved shape of the arc. For this reason, it is suppressed that a crack and a fracture
  • bent portions P3a and P3b are embedded in the mold resin layer 13. This makes it difficult for stress due to vibration or the like to be applied to the bent portions P3a and P3b, further suppressing the occurrence of cracks and breaks, and further improving the reliability of the electrolytic capacitor.
  • the bent portions P3a and P3b have an R shape, and the radii of curvature Ra and Rb of the inner sides 15a and 15b of the R shape are, for example, 0.05 mm or more and 1.00 mm or less.
  • the bent portions P3a and P3b have an R shape, but the bent portions P3a and P3b do not necessarily have an R shape, and may have a shape in which the portion where the lead is bent smoothly bends.
  • the bent portions P3a and P3b are preferably arcuate and preferably have no corners.
  • the thickness T from the boundary surface between the mold resin layer 13 and the sealing member 12 to the mounting surface 13S shown in FIG. 1 is not particularly limited, but is 0.5 mm or more from the viewpoint of suppressing the oxidative deterioration of the sealing member 12. It is preferably 1.0 mm or more and 3.0 mm or less.
  • the thickness T of the mold resin layer is, for example, the thickness of the mold resin layer from the boundary surface between the mold resin layer 13 and the sealing member 12 to the mounting surface 13S in a cross section cut in a direction perpendicular to the mounting surface 13S of the electrolytic capacitor. T can be measured from several places and obtained from the average.
  • the thickness T of the mold resin layer 13 is the thickness in the axial direction of the case 11 (X direction in FIG. 1), and grooves 13A and 13B and recesses 20A and 20B of the mold resin layer 13 described later are provided. It is the thickness of the area
  • the curvature radius Ra (mm) of the inner side 15a of the bent portion P3a and the thickness T (mm) of the mold resin layer are related to each other: 0.1 ⁇ Ra / T ⁇ 1 It is preferable to satisfy.
  • Ra / T is within the above range, the effect obtained by providing the bent portion P3a is sufficiently obtained.
  • the curvature radius Rb (mm) of the inner side 15b of the bent portion P3b and the thickness T (mm) preferably satisfy the above relational expression.
  • the lead is bent from the position where the lead begins to bend (the position inside the bent portions P3a and P3b) in the direction perpendicular to the mounting surface 13S (bend).
  • the height dimension up to the inside of the portions P3a and P3b) can be Ra.
  • elongated grooves 13A and 13B for accommodating the portions P2a and P2b of the leads 14A and 14B may be provided on the mounting surface 13S of the mold resin layer 13.
  • the portions P2a and P2b in the groove portions 13A and 13B can be stably fixed and arranged near the mounting surface 13S.
  • the groove part 13A and the groove part 13B are separated by a certain distance (for example, 0.5 mm or more and 5.0 mm or less) and mounted. It is linearly provided on the surface 13S.
  • the bottom surfaces 13a and 13b of the groove portions 13A and 13B are inclined so that the depth of the groove portions 13A and 13B gradually increases from one end portion on the bent portion P3a and P3b side of the groove portions 13A and 13B toward the other end portion. ing.
  • a force for returning the linear portions 15A and 15B to the original shape acts.
  • the portions P2a and P2b do not protrude excessively from the mounting surface 13S, and the portions P2a and P2b are accommodated in the groove portions 13A and 13B. Can be made.
  • the inclination angle of the bottom surfaces of the groove portions 13A and 13B with respect to the mounting surface 13S is, for example, 3 ° or more and 30 ° or less.
  • the bottom surfaces of the groove portions 13A and 13B are inclined, but the depths of the groove portions 13A and 13B may be constant without inclining the bottom surfaces of the groove portions 13A and 13B.
  • the depth D1 (mm) of the groove portion 13A and the thickness d1 (mm) of the portion P2a are related to each other: 0.1 ⁇ d1 / D1 ⁇ 2.0 It is preferable to satisfy.
  • the thicknesses d1 and d2 are specifically the thicknesses of the portions P2a and P2b in the direction perpendicular to the mounting surface 13S.
  • the depths D1 and D2 are the depths (minimum depth) at one end of the groove portions 13A and 13B on the bent portions P3a and P3b side. Point to.
  • the thickness dimension of the lead portions P2a and P2b in the direction perpendicular to the mounting surface 13S can be set to d1.
  • d1 / D1 and d2 / D2 are within the above ranges, the electrolytic capacitor can be stably mounted on the substrate, and the reliability of mounting the electrolytic capacitor on the substrate can be improved.
  • d1 / D1 and d2 / D2 are more preferably 0.5 or more and 1.2 or less.
  • FIG. 2 is a schematic cross-sectional view showing a main part of an electrolytic capacitor according to a modification of the first embodiment.
  • 3 is a bottom view of the electrolytic capacitor shown in FIG. 2, and
  • FIG. 2 is a cross-sectional view taken along the line II-II of FIG.
  • the solder can be accommodated in the recesses 20A and 20B, and the solder is scattered outside. It is suppressed.
  • some of the bent portions P3a and P3b may be embedded in the mold resin layer 13, or the entire bent portions P3a and P3b may not be embedded in the mold resin layer 13.
  • the groove portions 13A and 13B are provided following the recesses 20A and 20B, respectively. From the viewpoint of suppressing the scattering of the solder to the outside during mounting on the substrate, the recesses 20A and 20B are preferably deeper than the groove portions 13A and 13B.
  • the minimum depth of the grooves 13A and 13B (the depth of the end closest to the bent portions P3a and P3b) is, for example, 0.1 mm or more and 2.0 mm or less.
  • the depth of the recesses 20A and 20 is, for example, 0.1 mm or more and 1.5 mm or less.
  • the bottom surfaces of the grooves 13A and 13B and the recesses 20A and 20B do not reach the sealing member 12.
  • the concave portion 20A and the concave portion 20B are provided apart from each other by a certain distance (for example, 0.5 mm or more and 5.0 mm or less). It is preferable that
  • the grooves 13A and 13B and the recesses 20A and 20B are formed on a plane including the mounting surface 13S.
  • a total area S1 of when projected (mm 2), area S2 of the mounting surface 13S and (mm 2) is the relationship: 0.01 ⁇ S1 / S2 ⁇ 1.00 It is preferable to satisfy.
  • S1 is the total area of the groove 13A, the recess 20A, the groove 13B, and the recess 20B shown in FIG. S2 is the area of the mounting surface 13S shown in FIG. S1 / S2 is more preferably 0.10 or more and 0.50 or less.
  • the above S1 indicates an area when the groove portions 13A and 13B are projected onto a plane including the mounting surface 13S.
  • the shape of the recesses 20A and 20B shown in FIG. 3 is a square shape, but the shape of the recesses 20A and 20B is not particularly limited, and may be, for example, a circular shape.
  • the recesses 20A and 20B preferably have recesses 20a and 20b on their bottom surfaces, respectively.
  • the recess 20a is provided on the recess 20B side in the recess 20A.
  • the recess 20b is provided on the recess 20A side in the recess 20B.
  • the solder is accommodated in the recesses and recesses, and the scattering of the solder to the outside is further suppressed. Further, an external short circuit between the linear portion 15A and the linear portion 15B can be further prevented.
  • the depth of the recesses 20a and 20b is, for example, 0.2 mm or more and 0.5 mm or less.
  • the sealing member 12 may be an insulating material.
  • an elastic body is preferable.
  • the sealing member 12 including an elastic body such as rubber high sealing performance can be ensured. From the viewpoint of easily obtaining high heat resistance, silicone rubber, fluorine rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber (hypalon rubber, etc.), butyl rubber, isoprene rubber and the like are preferable.
  • the sealing member 12 has a shape corresponding to the shape of the opening of the case 11 (for example, a disk shape such as a disk shape).
  • the sealing member 12 has holes for allowing leads 14A and 14B (rod-like portions 17A and 17B) described later to pass through.
  • the shape and size of the hole may be appropriately determined according to the shape and size of the leads 14A and 14B (rod-like portions 17A and 17B).
  • the mold resin layer 13 preferably contains a cured product of the curable resin composition.
  • the curable resin composition may contain at least one of a filler, a curing agent, a polymerization initiator, and a catalyst in addition to the curable resin.
  • examples of the curable resin include a photocurable resin and a thermosetting resin.
  • the glass transition point (Tg) of the cured product of the curable resin composition is, for example, 100 ° C. or higher and 300 ° C. or lower. It is preferable that Tg of hardened
  • the curable resin for example, a compound that is cured or polymerized by the action of light or heat (for example, a monomer, an oligomer, a prepolymer, or the like) is used.
  • a compound (or curable resin) include epoxy compounds, phenol resins, urea resins, polyimides, polyurethanes, diallyl phthalates, and unsaturated polyesters.
  • the curable resin composition may include a plurality of curable resins.
  • insulating particles inorganic or organic
  • insulating particles and fibers may be used in combination as the filler.
  • the insulating material constituting the filler include insulating compounds (such as oxide) such as silica and alumina, glass, mineral materials (such as talc, mica, and clay).
  • the mold resin layer may contain one kind of these fillers, or may contain two or more kinds in combination. Content of the filler in a mold resin layer is 10 mass% or more and 90 mass% or less, for example.
  • a curing agent, a polymerization initiator, a catalyst, etc. are suitably selected according to the kind of curable resin.
  • the mold resin layer 13 may contain a thermoplastic resin.
  • the thermoplastic resin include polyphenylene sulfide (PPS) and polybutylene terephthalate (PBT).
  • the mold resin layer 13 can be formed using a molding technique such as injection molding or insert molding.
  • the mold resin layer 13 is formed by, for example, filling a predetermined portion with a curable resin composition or a thermoplastic resin composition so as to cover the opening of the case 11 together with the outer surface of the sealing member 12 using a predetermined mold. can do.
  • the bent portions P3a and P3b are formed by bending the portions drawn from the mold resin layer 13 of the linear portions 15A and 15B with a predetermined jig, and the portion P2a , P2b are accommodated in the grooves 13A, 13B.
  • the vicinity of the base portions of the linear portions 15A and 15B drawn out from the sealing member 12 is slightly curved in advance. Thereby, a part of bending part P3a, P3b which curves gently in the mold resin layer 13 can be formed. Further, after the mold resin layer 13 is formed, when the portions drawn from the mold resin layer 13 of the linear portions 15A and 15B are curved along the mounting surface 13S, the mold resin layer 13 of the linear portions 15A and 15B. It is suppressed that the part pulled out from is bent sharply or brittlely broken. Furthermore, since the stress applied to the sealing member 12 can be reduced when the linear portions 15A and 15B are bent, the reliability with respect to the airtightness of the electrolytic capacitor can be further increased.
  • the capacitor element 10 includes, for example, a wound body as shown in FIG. 6, and may be manufactured by attaching a conductive polymer to the wound body.
  • the wound body includes an anode foil 21 having a dielectric layer, a cathode foil 22, a separator 23 interposed therebetween, and an electrolyte.
  • the conductive polymer is adhered between the anode foil 21 and the cathode foil 22 so as to cover at least a part of the surface of the dielectric layer of the anode foil 21.
  • the lead 14 ⁇ / b> A is connected to the anode foil 21, and the lead 14 ⁇ / b> B is connected to the cathode foil 22.
  • FIG. 6 has shown the state by which one part was expand
  • Examples of the anode foil 21 include a metal foil having a roughened surface.
  • the kind of metal which comprises metal foil is not specifically limited, From the point that formation of a dielectric material layer is easy, it is preferable to use the alloy which contains valve action metals, such as aluminum, a tantalum, niobium, or a valve action metal.
  • the roughening of the metal foil surface can be performed by a known method. By roughening, a plurality of irregularities are formed on the surface of the metal foil.
  • the roughening is preferably performed, for example, by etching a metal foil.
  • the etching treatment may be performed by, for example, a direct current electrolytic method or an alternating current electrolytic method.
  • the dielectric layer is formed on the surface of the anode foil 21. Specifically, since the dielectric layer is formed on the surface of the roughened metal foil, the dielectric layer is formed along the inner wall surface of the hole or depression (pit) on the surface of the anode foil 21.
  • the formation method of the dielectric layer is not particularly limited, but can be formed by chemical conversion treatment of the metal foil.
  • the chemical conversion treatment may be performed, for example, by immersing the metal foil in a chemical conversion solution such as an ammonium adipate solution.
  • a voltage may be applied in a state where the metal foil is immersed in the chemical conversion liquid as necessary.
  • anode foil 21 having a dielectric layer formed thereon is prepared by cutting the treated foil into a desired size.
  • a metal foil is used for the cathode foil 22.
  • the type of metal is not particularly limited, but it is preferable to use a valve action metal such as aluminum, tantalum, or niobium or an alloy containing the valve action metal.
  • the cathode foil 22 may be subjected to roughening or chemical conversion treatment as necessary. Further, both roughening and chemical conversion treatment may be performed. The roughening and chemical conversion treatment can be performed by, for example, the method described for the anode foil 21.
  • the separator 23 is not particularly limited, and for example, a nonwoven fabric containing fibers of cellulose, polyethylene terephthalate, vinylon, polyamide (for example, aromatic polyamide, aromatic polyamide such as aramid) may be used.
  • the capacitor element can be manufactured by a known method.
  • a capacitor element is manufactured by superposing an anode foil and a cathode foil on which a dielectric layer is formed via a separator, and then forming a conductive polymer layer between the anode foil and the cathode foil. May be.
  • the anode foil and the cathode foil on which the dielectric layer is formed are wound through a separator to form a wound body as shown in FIG. 6, and a highly conductive layer is formed between the anode foil and the cathode foil. You may produce by forming a molecular layer.
  • the leads 14A and 14B may be planted from the wound body by winding while winding the lead as shown in FIG.
  • the end portion of the outer surface of the one located in the outermost layer of the wound body (in FIG. 6, the cathode foil 22) is fixed with a winding tape.
  • the anode foil 21 is prepared by cutting a large metal foil, in order to provide a dielectric layer on the cut surface of the anode foil 21, the capacitor element in a state such as a wound body is further formed. Processing may be performed.
  • an electrolytic solution As the electrolyte, an electrolytic solution, a solid electrolyte, or both can be used.
  • the electrolytic solution may be a non-aqueous solvent or a mixture of a non-aqueous solvent and an ionic substance (solute, eg, organic salt) dissolved in the non-aqueous solvent.
  • the non-aqueous solvent may be an organic solvent or an ionic liquid.
  • the non-aqueous solvent for example, ethylene glycol, propylene glycol, sulfolane, ⁇ -butyrolactone, N-methylacetamide and the like can be used.
  • organic salts include trimethylamine maleate, triethylamine borodisalicylate, ethyldimethylamine phthalate, mono 1,2,3,4-tetramethylimidazolinium phthalate, mono 1,3-dimethyl-2-phthalate
  • organic salts include trimethylamine maleate, triethylamine borodisalicylate, ethyldimethylamine phthalate, mono 1,2,3,4-tetramethylimidazolinium phthalate, mono 1,3-dimethyl-2-phthalate
  • examples include ethyl imidazolinium.
  • the solid electrolyte includes, for example, a manganese compound and a conductive polymer.
  • a conductive polymer for example, polypyrrole, polythiophene, polyaniline, and derivatives thereof can be used.
  • a solid electrolyte containing a conductive polymer can be formed, for example, by subjecting a raw material monomer to chemical polymerization or electrolytic polymerization on a dielectric layer, or by performing both chemical polymerization and electrolytic polymerization.
  • the dielectric layer can be formed by applying a solution in which the conductive polymer is dissolved or a dispersion liquid in which the conductive polymer is dispersed to the dielectric layer.
  • liquids such as electrolytes may evaporate or gas may accumulate in the case due to reflow treatment, use in a high temperature environment, or long-term use.
  • the internal pressure of the case increases and stress is applied to the sealing member and the mold resin layer.
  • the electrolytic capacitor of this embodiment since at least a part of the bent portion is embedded in the mold resin layer, the adhesive force between the lead and the mold resin layer can be increased, so that the effect of holding gas in the case Can be increased.
  • gas is likely to be generated in the case.
  • the structure of the electrolytic capacitor according to the present embodiment in an electrolytic capacitor containing a liquid such as an electrolytic solution, The effect of holding the gas can be obtained more remarkably.
  • FIG. 7 is a schematic cross-sectional view of the electrolytic capacitor according to the second embodiment.
  • the electrolytic capacitor includes a capacitor element 10 and a bottomed cylindrical case 11 that houses the capacitor element 10 and has an opening.
  • the material of the case 11 include metals such as aluminum, stainless steel, copper, iron, brass, and alloys thereof.
  • condenser element 10 in 2nd Embodiment is the same as that of the above-mentioned 1st Embodiment, detailed description is abbreviate
  • omitted since the structure of the capacitor
  • the electrolytic capacitor includes a sealing member 12 that seals the opening of the case 11, and a mold resin layer 13 that is disposed outside the sealing member 12 and covers the opening of the case 11.
  • the opening of the case 11 is sealed with the sealing member 12 and the mold resin layer 13 after accommodating the capacitor element 10 in the case 11.
  • the vicinity of the opening end of the case 11 is drawn inward, and the case 11 is sealed by fitting a sealing member 12 in the vicinity of the opening end of the drawn case 11.
  • the mold resin layer 13 further covers at least a part of the side surface of the case 11 following the opening. Thereby, the sealing performance of the electrolytic capacitor can be further enhanced.
  • the mold resin layer 13 is bonded to the case 11 and the sealing member 12, but there may be portions that are not partially bonded.
  • the electrolytic capacitor includes a pair of leads 14 ⁇ / b> A and 14 ⁇ / b> B that are connected to the capacitor element 10 and penetrate the sealing member 12 and the mold resin layer 13.
  • leads 14 ⁇ / b> A and 14 ⁇ / b> B that are connected to the capacitor element 10 and penetrate the sealing member 12 and the mold resin layer 13.
  • the leads 14A and 14B have linear portions 15A and 15B and tab portions 16A and 16B connected to the linear portions 15A and 15B, respectively.
  • the shape in particular of linear part 15A, 15B is not restrict
  • the linear portions 15A and 15B and the tab portions 16A and 16B are connected by welding or the like.
  • the linear portions 15A and 15B include, for example, iron, copper, nickel, tin, and the like.
  • the tab portions 16A and 16B include, for example, aluminum.
  • the tab portions 16A and 16B have rod-like portions 17A and 17B and flat portions 18A and 18B, respectively.
  • the rod-like portions 17A and 17B and the flat portions 18A and 18B may be electrically connected, or may be integrated.
  • a flat part is formed by rolling one end part of a rod-like body, and a tab part in which the flat part and the rod-like part are integrated can be formed by leaving an unrolled region as a rod-like part.
  • the shape of the rod-shaped portions 17A and 17B is not particularly limited, and may be a round rod shape (for example, a rod shape having a circular or elliptical cross section) or a square bar shape (for example, a rod shape having a polygonal cross section). Also good.
  • the rod-shaped portions 17A and 17B include portions (first portions) P1a and P1b penetrating the sealing member 12, respectively.
  • the tip portions of the rod-like portions 17A and 17B are exposed from the sealing member 12 to the outside (on the mold resin layer 13 side).
  • the linear portions 15A and 15B extend from the tip portions of the rod-like portions 17A and 17B, respectively.
  • the rod-like portions 17A and 17B are connected to the capacitor element 10 via flat portions 18A and 18B, respectively. By having the flat portions 18A and 18B, the connection between the leads 14A and 14B and the capacitor element 10 becomes easy.
  • the linear portions 15A and 15B have portions drawn out from the mold resin layer 13, and the portions are portions (second portions) P2a, which are arranged along the mounting surface 13S of the mold resin layer 13. P2b.
  • the linear portions 15A and 15B have bent portions P3a and P3b that bend between the portions P1a and P1b and the portions P2a and P2b, respectively.
  • the bent portion P3 is bent into an R shape.
  • the portion P2a is arranged so as to extend from the end portion on the bent portion P3a side in the direction opposite to the linear portion 15B.
  • the portion P2b is arranged so as to extend from the end portion on the bent portion P3b side in the direction opposite to the linear portion 15A.
  • the mold resin layer 13 has inclined portions 19A and 19B at portions facing the bent portions P3a and P3b of the leads 14A and 14B. Therefore, even if stress is applied to the bent portions P3a and P3b due to vibration after the electrolytic capacitor is mounted on the substrate, the stress can be dispersed by the inclined portions 19A and 19B, so that the bent portions P3a and P3b are cracked or broken. Generation
  • production is suppressed and the reliability of an electrolytic capacitor can be improved.
  • bent portions P3a and P3b of the leads 14A and 14B have an R shape, the stress applied to the bent portions P3a and P3b of the leads 14A and 14B after the electrolytic capacitor is mounted on the substrate can be further reduced.
  • the inclined portions 19A and 19B are preferably configured by curved surfaces. In this case, after the electrolytic capacitor is mounted on the substrate, the stress applied to the leads 14A and 14B can be further reduced.
  • the curvature radii of the inclined portions 19A and 19B are preferably 0.05 mm or more and 1.0 mm or less.
  • the curvature radii of the inclined portions 19A and 19B are within the above range, the effect of reducing stress on the bent portions P3a and P3b can be further enhanced.
  • the curvature radius of inclination part 19A, 19B is in the said range also from a viewpoint of balance with the thickness T of the mold resin layer 13 mentioned later.
  • the radius of curvature of the inclined portions 19A and 19B is more preferably 0.1 mm or more and 0.5 mm or less.
  • the inclined portion is configured by a curved surface, but it is not necessarily configured by a curved surface, and the shape of the inclined surface is not particularly limited. You may comprise by a plane and may comprise combining a curved surface and a plane.
  • inclined portions 29A and 29B constituted by planes as shown in FIG. 8 may be provided (modified example). Even when the inclined portion is formed of a flat surface, stress on the bent portion can be removed.
  • the R-shaped bent portions P3a and P3b are provided between the portions P1a and P1b and the portions P2a and P2b.
  • the bending part should just be provided between P2a and P2b.
  • Examples of the shape of the bent portion include a bent shape in addition to the curved shape including the R shape.
  • the term “curved” refers to a case where the radius of curvature inside the bent portion of the lead is 0.05 mm or more. Bending refers to the case where the radius of curvature inside the bent portion of the lead is less than 0.05 mm.
  • bent portions P3a and P3b are R-shaped, each lead undergoes plastic deformation relatively slowly compared to the bent shape, and brittle fracture is suppressed. Therefore, the bent portion may crack or break. Is further suppressed.
  • the radii of curvature Ra and Rb of the inner sides 15a and 15b of the bent portions P3a and P3b are, for example, 0.05 mm or more and 1.0 mm or less.
  • the thickness T from the boundary surface between the mold resin layer 13 and the sealing member 12 to the mounting surface 13S shown in FIG. 7 is not particularly limited, but is 0.5 mm or more from the viewpoint of suppressing the oxidative deterioration of the sealing member 12. It is preferably 1.0 mm or more and 3.0 mm or less.
  • the thickness T of the mold resin layer is, for example, the thickness of the mold resin layer from the boundary surface between the mold resin layer 13 and the sealing member 12 to the mounting surface 13S in a cross section cut in a direction perpendicular to the mounting surface 13S of the electrolytic capacitor. T can be measured from several places and obtained from the average.
  • the thickness T of the mold resin layer 13 is the thickness in the axial direction of the case 11 (X direction in FIG. 7), and grooves 13A and 13B and recesses 20A and 20B of the mold resin layer 13 described later are provided. It is the thickness of the area
  • the curvature radius Ra (mm) of the inner side 15a of the bent portion P3a and the thickness T (mm) of the mold resin layer 13 are related to the following formula: 0.1 ⁇ Ra / T ⁇ 1 It is preferable to satisfy.
  • Ra / T is within the above range, the effect obtained by making the bent portion P3a into the R shape is sufficiently obtained.
  • the curvature radius Rb (mm) of the inner side 15b of the bent portion P3b and the thickness T (mm) preferably satisfy the above relational expression.
  • the lead is bent from the position where the lead begins to bend (the position inside the bent portions P3a and P3b) in the direction perpendicular to the mounting surface 13S (bend).
  • the height dimension up to the inside of the portions P3a and P3b) can be Ra.
  • the curvature of the inclined portions 19A and 19B is larger than the curvature of the bent portions P3a and P3b.
  • elongated grooves 13A and 13B for accommodating the portions P2a and P2b of the leads 14A and 14B may be provided on the mounting surface 13S of the mold resin layer 13 subsequent to the inclined portions 19A and 19B.
  • the portions P2a and P2b in the groove portions 13A and 13B can be stably fixed and arranged near the mounting surface 13S.
  • the groove part 13A and the groove part 13B are separated by a certain distance (for example, 0.5 mm or more and 5.0 mm or less) and mounted. It is linearly provided on the surface 13S.
  • the bottom surfaces 13a and 13b of the groove portions 13A and 13B are inclined so that the depth of the groove portions 13A and 13B gradually increases from one end portion on the inclined portions 19A and 19B side of the groove portions 13A and 13B toward the other end portion. ing.
  • the linear portions 15A and 15B are bent so as to be substantially parallel to the mounting surface 13S in order to form the bent portions P3a and P3b, a force for returning the linear portions 15A and 15B to the original shape acts.
  • the portions P2a and P2b do not protrude excessively from the mounting surface 13S, and the entire portions P2a and P2b are within the groove portions 13A and 13B. Can be accommodated.
  • the inclination angle of the bottom surfaces of the groove portions 13A and 13B with respect to the mounting surface 13S is, for example, 3 ° or more and 30 ° or less.
  • the bottom surfaces of the groove portions 13A and 13B are inclined, but the depths of the groove portions 13A and 13B may be constant without inclining the bottom surfaces of the groove portions 13A and 13B.
  • the depth D1 (mm) of the groove portion 13A and the thickness d1 (mm) of the portion P2a are related to each other: 0.1 ⁇ d1 / D1 ⁇ 2.0 It is preferable to satisfy.
  • the thicknesses d1 and d2 are specifically the thicknesses of the portions P2a and P2b in the direction perpendicular to the mounting surface 13S.
  • the depths D1 and D2 indicate the depth (minimum depth) at one end portion on the inclined portions 19A and 19B side of the groove portions 13A and 13B.
  • the thickness dimension of the lead portions P2a and P2b in the direction perpendicular to the mounting surface 13S can be set to d1.
  • d1 / D1 and d2 / D2 are within the above ranges, the electrolytic capacitor can be stably mounted on the substrate, and the reliability of mounting the electrolytic capacitor on the substrate can be improved.
  • d1 / D1 and d2 / D2 are more preferably 0.5 or more and 1.2 or less.
  • FIG. 9 is a schematic cross-sectional view showing a main part of an electrolytic capacitor according to a modification of the first embodiment. 10 is a bottom view of the electrolytic capacitor shown in FIG. 9, and FIG. 9 is a cross-sectional view taken along the line IX-IX in FIG.
  • the solder can be accommodated in the recesses 20A and 20B, and the solder is scattered outside. It is suppressed.
  • the inclined portions 39A and 39B shown in FIGS. 9 and 10 are provided so as to also serve as one side surface (side surface on the groove portions 13A and 13B side) of the recesses 20A and 20B, but are separately inclined in the recesses 20A and 20B. A part may be provided.
  • the groove portions 13A and 13B are provided following the recesses 20A and 20B, respectively. From the viewpoint of suppressing the scattering of the solder to the outside during mounting on the substrate, the recesses 20A and 20B are preferably deeper than the groove portions 13A and 13B.
  • the minimum depth of the groove portions 13A and 13B is, for example, 0.1 mm or more and 2.0 mm or less.
  • the depth of the recesses 20A and 20B is, for example, 0.1 mm or more and 1.5 mm or less.
  • the bottom surfaces of the grooves 13A and 13B and the recesses 20A and 20B do not reach the sealing member 12.
  • the concave portion 20A and the concave portion 20B are provided apart from each other by a certain distance (for example, 0.5 mm or more and 5.0 mm or less). It is preferable that
  • the grooves 13A and 13B and the recesses 20A and 20B are formed on a plane including the mounting surface 13S.
  • a total area S1 of when projected (mm 2), area S2 of the mounting surface 13S and (mm 2) is the relationship: 0.01 ⁇ S1 / S2 ⁇ 1.00 It is preferable to satisfy.
  • S1 is the total area of the groove 13A, the recess 20A, the groove 13B, and the recess 20B shown in FIG. S2 is the area of the mounting surface 13S shown in FIG. S1 / S2 is more preferably 0.10 or more and 0.50 or less.
  • the above S1 indicates an area when the groove portions 13A and 13B are projected onto a plane including the mounting surface 13S.
  • the shape of the recesses 20A and 20B shown in FIG. 10 is a square shape, but the shape of the recesses 20A and 20B is not particularly limited, and may be, for example, a circular shape.
  • the recesses 20A and 20B preferably have recesses 20a and 20b on their bottom surfaces, respectively.
  • the recess 20a is provided on the recess 20B side in the recess 20A.
  • the recess 20b is provided on the recess 20A side in the recess 20B.
  • the solder is accommodated in the recesses 20A and 20B and the recesses 20a and 20b, and the solder is moved to the outside. Is further suppressed, and an external short circuit between the linear portion 15A and the linear portion 15B can be further prevented.
  • the depth of the recesses 20a and 20b is, for example, 0.2 mm or more and 0.5 mm or less.
  • the sealing member 12 may be an insulating material.
  • an elastic body is preferable.
  • the sealing member 12 including an elastic body such as rubber high sealing performance can be ensured. From the viewpoint of easily obtaining high heat resistance, silicone rubber, fluorine rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber (such as Hyperon rubber), butyl rubber, and isoprene rubber are preferable.
  • the sealing member 12 has a shape corresponding to the shape of the opening of the case 11 (for example, a disk shape such as a disk shape).
  • the sealing member 12 has holes for allowing leads 14A and 14B (rod-like portions 17A and 17B) described later to pass through.
  • the shape and size of the hole may be appropriately determined according to the shape and size of the leads 14A and 14B (rod-like portions 17A and 17B).
  • the mold resin layer 13 preferably contains a cured product of the curable resin composition.
  • the curable resin composition may contain at least one of a filler, a curing agent, a polymerization initiator, and a catalyst in addition to the curable resin.
  • examples of the curable resin include a photocurable resin and a thermosetting resin.
  • the glass transition point (Tg) of the cured product of the curable resin composition is, for example, 100 ° C. or higher and 300 ° C. or lower. It is preferable that Tg of hardened
  • the curable resin for example, a compound that is cured or polymerized by the action of light or heat (for example, a monomer, an oligomer, a prepolymer, or the like) is used.
  • a compound (or curable resin) include epoxy compounds, phenol resins, urea resins, polyimides, polyurethanes, diallyl phthalates, and unsaturated polyesters.
  • the curable resin composition may include a plurality of curable resins.
  • insulating particles or fibers are preferable.
  • insulating particles and fibers may be used in combination as the filler.
  • an insulating material which comprises a filler inorganic materials, such as insulating compounds (oxide etc.), such as a silica and an alumina, glass, mineral materials (talc, mica, clay, etc.), are mentioned, for example.
  • the mold resin layer may contain one kind of these fillers, or may contain two or more kinds in combination. Content of the filler in a mold resin layer is 10 mass% or more and 90 mass% or less, for example. Further, an additive may be added to the mold resin layer in order to increase heat resistance.
  • a curing agent, a polymerization initiator, a catalyst, etc. are suitably selected according to the kind of curable resin.
  • the mold resin layer 13 may contain a thermoplastic resin.
  • the thermoplastic resin include polyphenylene sulfide (PPS) and polybutylene terephthalate (PBT).
  • the mold resin layer 13 can be formed using a molding technique such as injection molding or insert molding.
  • the mold resin layer 13 is formed by, for example, filling a predetermined portion with a curable resin composition or a thermoplastic resin composition so as to cover the opening of the case 11 together with the outer surface of the sealing member 12 using a predetermined mold. can do.
  • the bent portions P3a and P3b are formed by bending the portions drawn from the mold resin layer 13 of the linear portions 15A and 15B with a predetermined jig, and the portion P2a , P2b are accommodated in the grooves 13A, 13B.
  • the portions drawn out from the mold resin layer 13 of the linear portions 15A and 15B are bent, the portions are prevented from being bent suddenly or brittlely broken. be able to.
  • the inclined portions 39A and 39B are formed of curved surfaces, the leads can be easily bent in an arc along the curved surfaces of the inclined portions 39A and 39B when the leads drawn from the mold resin layer are bent.
  • the vicinity of the base portions of the linear portions 15A and 15B drawn out from the sealing member 12 is slightly curved in advance. Thereby, a part of bending part P3a, P3b which curves gently in the mold resin layer 13 can be formed. Further, after the mold resin layer 13 is formed, when the portions drawn from the mold resin layer 13 of the linear portions 15A and 15B are curved along the mounting surface 13S, the mold resin layer 13 of the linear portions 15A and 15B. It is suppressed that the part pulled out from is bent sharply or brittlely broken. Furthermore, since the stress applied to the sealing member 12 can be reduced when the linear portions 15A and 15B are bent, the reliability with respect to the airtightness of the electrolytic capacitor can be further increased.
  • liquids such as electrolytes may evaporate or gas may accumulate in the case due to reflow treatment, use in a high temperature environment, or long-term use.
  • the internal pressure of the case increases and stress is applied to the sealing member and the mold resin layer.
  • the sealing member and the mold resin layer are hardly damaged when the lead is bent, and the effect of holding the gas in the case is maintained. it can.
  • gas is likely to be generated in the case. The effect of holding is more remarkably obtained.
  • the present disclosure can be used for an electrolytic capacitor (such as a power storage device, a hybrid electrolytic capacitor, or a solid electrolytic capacitor) including a sealing member and a mold resin layer.
  • an electrolytic capacitor such as a power storage device, a hybrid electrolytic capacitor, or a solid electrolytic capacitor
  • a sealing member and a mold resin layer.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention concerne un condensateur électrolytique, comprenant un élément de condensateur, un boîtier, un élément d'étanchéité, une couche de résine de moulage et des conducteurs. Le boîtier renferme l'élément condensateur et comporte une ouverture. L'élément d'étanchéité scelle l'ouverture dans le boîtier. La couche de résine de moulage recouvre l'élément d'étanchéité. Les conducteurs sont connectés à l'élément condensateur et passent à travers l'élément d'étanchéité et la couche de résine de moulage. Une portion des conducteurs est extraite de la couche de résine de moulage sur un côté proche de la surface de montage de la couche de résine de moulage. Les conducteurs ont une première partie, une seconde partie et une partie incurvée qui s'incurve entre la première partie et la seconde partie La première partie traverse l'élément d'étanchéité. La seconde partie est disposée le long de la surface de montage de la couche de résine de moulage. Au moins une portion de la partie incurvée est intégrée dans la couche de résine de moulage.
PCT/JP2017/025091 2016-07-29 2017-07-10 Condensateur électrolytique WO2018020993A1 (fr)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021060431A1 (fr) * 2019-09-27 2021-04-01 日本ケミコン株式会社 Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage
JP2021057421A (ja) * 2019-09-27 2021-04-08 日本ケミコン株式会社 電子部品ユニット、その製造方法、および電子部品ユニットを備えた電子機器の製造方法
JP2021057420A (ja) * 2019-09-27 2021-04-08 日本ケミコン株式会社 電子部品ユニット、その製造方法および実装部材
WO2021193794A1 (fr) * 2020-03-26 2021-09-30 日本ケミコン株式会社 Condensateur et son procédé de fabrication
WO2022030210A1 (fr) * 2020-08-04 2022-02-10 日本ケミコン株式会社 Condensateur et son procédé de fabrication

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JPS60245106A (ja) * 1984-05-18 1985-12-04 松下電器産業株式会社 チツプ形アルミ電解コンデンサ
JPS6146723U (ja) * 1984-08-31 1986-03-28 日本ケミコン株式会社 電子部品
JP2012244081A (ja) * 2011-05-24 2012-12-10 Nichicon Corp チップ形電解コンデンサ
JP2016063186A (ja) * 2014-09-22 2016-04-25 日本ケミコン株式会社 電子部品およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60245106A (ja) * 1984-05-18 1985-12-04 松下電器産業株式会社 チツプ形アルミ電解コンデンサ
JPS6146723U (ja) * 1984-08-31 1986-03-28 日本ケミコン株式会社 電子部品
JP2012244081A (ja) * 2011-05-24 2012-12-10 Nichicon Corp チップ形電解コンデンサ
JP2016063186A (ja) * 2014-09-22 2016-04-25 日本ケミコン株式会社 電子部品およびその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021060431A1 (fr) * 2019-09-27 2021-04-01 日本ケミコン株式会社 Unité de composant électronique, son procédé de fabrication, procédé de fabrication de dispositif électronique équipé d'une unité de composant électronique, et élément de montage
JP2021057421A (ja) * 2019-09-27 2021-04-08 日本ケミコン株式会社 電子部品ユニット、その製造方法、および電子部品ユニットを備えた電子機器の製造方法
JP2021057420A (ja) * 2019-09-27 2021-04-08 日本ケミコン株式会社 電子部品ユニット、その製造方法および実装部材
JP7388099B2 (ja) 2019-09-27 2023-11-29 日本ケミコン株式会社 電子部品ユニット、その製造方法、および電子部品ユニットを備えた電子機器の製造方法
JP7388098B2 (ja) 2019-09-27 2023-11-29 日本ケミコン株式会社 電子部品ユニット、その製造方法および実装部材
WO2021193794A1 (fr) * 2020-03-26 2021-09-30 日本ケミコン株式会社 Condensateur et son procédé de fabrication
JP7494516B2 (ja) 2020-03-26 2024-06-04 日本ケミコン株式会社 コンデンサおよびその製造方法
WO2022030210A1 (fr) * 2020-08-04 2022-02-10 日本ケミコン株式会社 Condensateur et son procédé de fabrication

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