WO2021057322A1 - 波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法 - Google Patents

波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法 Download PDF

Info

Publication number
WO2021057322A1
WO2021057322A1 PCT/CN2020/109154 CN2020109154W WO2021057322A1 WO 2021057322 A1 WO2021057322 A1 WO 2021057322A1 CN 2020109154 W CN2020109154 W CN 2020109154W WO 2021057322 A1 WO2021057322 A1 WO 2021057322A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
layer
laminated
metal
wavy
Prior art date
Application number
PCT/CN2020/109154
Other languages
English (en)
French (fr)
Inventor
王定锋
徐文红
冉崇友
徐磊
琚生涛
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2021057322A1 publication Critical patent/WO2021057322A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of LED light strips, in particular to a laminated circuit board made of a wave-shaped LED light strip circuit board and a metal circuit board and a manufacturing method.
  • LED circuit board light strips come all the time, and many positions need to be bent when used.
  • the circuit board it is very easy to cause the circuit board to bend and break, or the circuit board is broken, or the long light strip is installed due to It is heavy and breaks due to stretching, or there is a thick copper wire or copper cable on the back of the light strip circuit board.
  • the thick copper breaks the circuit board, or the water-proof resin of the light strip packs the circuit when it is bent.
  • the top break of the board how to solve the problem of bending and tensile fragility, and to improve the ability to resist flexure, has always been a problem in the industry.
  • the present invention makes the upper single-layer or double-layer circuit board into a wave-shaped three-dimensional circuit board, which is intermittently bonded to the lower single-layer metal circuit board through the adhesive in the middle.
  • the laminated circuit board formed by bonding to form a double-layer or three-layer circuit board, forming a wavy circuit board, a layered board with a discontinuous layered structure, made with this circuit board LED light strips, stretchable light strips, this kind of light strips are not easy to break when they are bent and used.
  • the invention relates to a laminated circuit board made of a wave-shaped LED lamp strip circuit board and a metal circuit board and a manufacturing method thereof. Specifically, a single-layer or double-layer circuit board is made into a wave-shaped circuit board and then pasted with an adhesive. On a single metal panel, a wavy double-layer circuit board or a three-layer circuit board divided into parts of the area is formed to form both a wavy circuit board and a layered circuit board with intermittent bonding and intermittent layered structure.
  • the circuit board is made of LED light strip, which is not easy to break when bending and using.
  • a method for manufacturing a laminated circuit board made of a wave-shaped LED light strip circuit board laminated with a metal circuit board Specifically, a conjoined upper circuit board containing a plurality of light strip circuit boards is extruded
  • the pressing die squeezes the circuit board into a wave shape.
  • the method is that the extrusion die is composed of two upper and lower templates.
  • the upper and lower templates are respectively made with multiple grooves and ribs, or one of the upper and lower templates is made of convex Ribs, the other is made with grooves.
  • each rib corresponds to a groove, and the ribs are embedded in the groove.
  • the laminated circuit board is not only a wavy circuit board, but also intermittent bonding and intermittent layering. Structure of the layered circuit board.
  • the conduction between the upper and lower layers of the circuit board is that the upper and lower circuit boards are provided with spare conduction connection points, and the spare conduction connection points are set at At the edge of the upper circuit board, or at the position of the hole in the upper circuit board, when the circuit board is used, the conduction connection points on the upper and lower layers are connected and conducted by conductive objects.
  • a laminated circuit board made of a wavy LED lamp strip circuit board and a metal circuit board including: an upper single-layer or double-layer circuit board; an adhesive in the middle layer; a lower single-layer metal circuit board
  • the upper circuit board is a wavy circuit board formed with a plurality of protrusions, the circuit board has wavy protrusions on both sides or one side has wavy protrusions, the wavy circuit
  • the board is a wavy circuit board made by extrusion of a flat circuit board.
  • the wavy circuit board is a stereoscopic flexible circuit board that is shaped when there is no external force.
  • the convex part When it is stretched or squeezed by an external force, the convex part is again It can be stretched or squeezed to deform, so that the circuit board is stretched in the longitudinal direction (long direction) to become longer, or squeezed to become longer or shorter, the lower single layer metal circuit board and the upper single layer or double layer circuit board,
  • the adhesive in the middle layer is used to form an integrated circuit board.
  • the adhesive forms an intermittent bonding structure at multiple locations.
  • the integrated circuit board is a double-layer or three-layer circuit board, and the integral circuit board is wavy.
  • this integrated circuit board is a layered board with a multi-position layered structure formed in the board, this integrated circuit board is the laminated circuit board, and the upper and lower two layers of the integrated circuit board are equipped with spare
  • the circuit board to make the light strip use a conductive object to connect the upper and lower circuit boards.
  • the LED light strip made with this circuit board is a more resistant to bending light strip. When the lamp belt is used, it is not easy to be broken when bent.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board and the metal circuit board is characterized in that the wave-shaped circuit board is squeezed by the convex waves.
  • the pressure setting makes it convenient for the circuit board to have a stable structure when used in the production of light strips.
  • the printed solder paste can be printed accurately, and the SMT machine can be accurately attached when attaching components.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board superimposed on the metal circuit board is characterized in that the wave-shaped circuit board has a wave raised position
  • the molded protrusions are the protrusions that are set in the unstressed state, and are the protrusions that can be deformed under the action of external force.
  • the position of the protrusions of each light strip can be the same or different.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board superimposed on the metal circuit board is characterized in that the wave-shaped circuit board has all the wavy protrusions. Avoiding the position of soldering components, design bumps formed in blanks without soldering components on the circuit board.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board and the metal circuit board is characterized in that the upper circuit board is a circuit board of a single-layer circuit.
  • Single-layer circuit board is a circuit board made of wires, or a circuit board made of copper foil.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board and the metal circuit board is characterized in that the upper circuit board is a double-layer circuit board.
  • the conduction mode of the two-layer circuit of the double-layer circuit board is through-hole copper plating, or the two-sided circuit is connected by soldering, or the two-sided circuit is connected by conductive ink.
  • the wavy LED lamp strip circuit board is made of a laminated circuit board laminated with a metal circuit board, and the spare conduction connection point is characterized by the upper single layer or
  • the conduction between the double-layer circuit board and the lower-layer single-layer metal circuit board is provided by a spare conduction connection point on the edge of the upper circuit board and the lower metal circuit board, or/and a spare conduction connection point is provided in the board. Hole, there are spare connection points on the upper and lower layers of the through holes.
  • the conductive connection points of the upper and lower layers are connected through conductive objects.
  • the conductive objects are tin or tin alloy, or Conductive glue or conductive ink.
  • the laminated circuit board made of wavy LED lamp strip circuit board and metal circuit board is characterized in that the laminated circuit board is an upper circuit board and a laminated circuit board.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board and the metal circuit board is characterized in that the metal thickness of the lower single-layer metal circuit board is greater than or Equal to the metal thickness of the upper circuit board.
  • the laminated circuit board made of the wave-shaped LED lamp strip circuit board and metal circuit board is characterized in that the conduction of the upper and lower circuit boards is through the upper circuit board and the upper circuit board.
  • the contact and conduction formed by the bare metal at the layered place between the lower circuit boards are in contact with each other.
  • Fig. 1 is a schematic plan view of the upper circuit board, the conductive soldering position is provided with a via hole, and the front side circuit pad of the upper circuit board is exposed on the side of the via hole.
  • Figure 2 is a schematic plan view of the upper circuit board, the conductive soldering positions at both ends, on the conductive soldering pads on the board edge of the upper circuit board, only half of the front circuit pads of the upper circuit board are exposed, and the other half is formed with holes.
  • Fig. 3 is a schematic cross-sectional view of an extrusion die with a plurality of grooves and ribs on each of the upper and lower templates.
  • Figure 4 is a schematic cross-sectional view of the extrusion die of "Figure 3" extruding the circuit board.
  • Fig. 5 is a schematic cross-sectional view of a plurality of raised waves on both sides of the circuit board.
  • Fig. 6 is a schematic cross-sectional view of an extrusion die with a plurality of grooves on the upper mold plate and a plurality of ribs on the lower mold plate.
  • Figure 7 is a schematic cross-sectional view of the extrusion die of "Figure 6" extruding the circuit board.
  • Fig. 8 is a schematic cross-sectional view of a circuit board with a plurality of raised waves on only one side.
  • Fig. 9 is a schematic plan view of a single-layer metal circuit in the lower layer.
  • FIG. 10 is a schematic plan view of a film provided with a hole and attached to a single-layer metal circuit of the lower layer to form a single-layer metal circuit board.
  • Fig. 11 is a schematic plan view of the adhesive printed at multiple locations on the lower single-layer metal circuit board.
  • Fig. 12 is a schematic plan view of a laminated circuit board in which the upper circuit board of "Fig. 1" is bonded to the lower single-layer metal circuit board through an adhesive to form an intermittent adhesive and intermittent layered structure.
  • Fig. 13 is a schematic plan view of a laminated circuit board in which the upper circuit board of "Fig. 2" is bonded to the lower single-layer metal circuit board through an adhesive to form an intermittent adhesive and intermittent layered structure.
  • Figure 14 is a schematic cross-sectional view of the laminated circuit board at the position of the via.
  • Fig. 15 is a schematic cross-sectional view of the laminated circuit board at both ends of the welding position.
  • Figure 16 is a schematic plan view of multiple upper-layer circuit boards arranged end to end on a single-layer metal circuit board on the lower layer.
  • the single-sided flexible copper clad board is screen-printed with circuit corrosion-resistant ink, baked and cured, etched, film-removed, and screen-printed with the front ink solder mask to expose the resistance pad 1.1a and the LED lamp pad 1.1b. Bake, print characters, bake and solidify, and then punch out the via hole 1.2a with a die. The hole edge of the via hole 1.2a has the exposed circuit pad 1.3a of the upper circuit board, which is made as shown in Figure 1.
  • the marking 1 in Fig. 1 and Fig. 2 indicates that it is a single-layer circuit board.
  • the double-sided flexible copper clad board is drilled, copper-immersed, copper-plated, dry-filmed, exposed, etched, film-removed, and screen-printed.
  • the front ink solder mask is exposed to expose the resistance pad 1.1a and the LED lamp pad 1.1b , Baking, and then screen printing the back ink solder mask, baking, characters, baking, and then punch out the via hole 1.2a with a mold, the hole edge of the via hole 1.2a has the exposed circuit pad of the upper circuit board 1.3a, make the upper layer double-layer circuit board 1 as shown in Figure 1, or shorten the upper layer circuit on both ends of the circuit board on the pads at the conduction welding position, so that it is on the conduction welding connection point, Only half of the upper-layer circuit’s conduction connection point 1.3b is exposed, and the other half is formed with a hole 1.2b, making the upper-layer double-layer circuit board 1 as shown in Fig. 2.
  • the marking 1 in Fig. 1 and Fig. 2 indicates It
  • a steel plate with a thickness of 15mm is used.
  • the wave is cut from the middle line of the plate thickness and divided into two.
  • the upper template 2.1a and the lower template 2.1b are cut to produce the upper template 2.1a and the lower template 2.1b.
  • the template 2.1a is cut with grooves 2.2a and ribs 2.2b, and on the lower template 2.1b, there are correspondingly cut ribs 2.2b and grooves 2.2a.
  • the grooves 2.2a on the upper template 2.1a are correspondingly matched.
  • the convex rib 2.2b on the template 2.1b, the convex rib 2.2b on the upper template 2.1a correspond to the groove 2.2a on the lower template 2.1b, and then 4 positioning holes are processed on the machining center, and then the lower template 2.1 b.
  • the positioning pin is installed on the top, and after grinding and polishing, the upper mold plate 2.1a and the lower mold plate 2.1b have a plurality of correspondingly matched grooves 2.2a and convex ribs 2.2b extrusion molds (as shown in Figure 3). ).
  • the single-sided flexible copper clad laminate with a copper thickness of 0.15mm is screen-printed with circuit anti-corrosion ink, baked and cured, etched, and film-removed to produce a metal circuit 4.1 (as shown in Figure 9).
  • the PI cover film with holes is attached to the metal circuit 4.1, and the metal circuit 4.1 is exposed from the holes of the PI cover film, and then pressed and baked to form the lower single-layer metal circuit board 4 (as shown in Figure 10) ,
  • the length of the lower single-layer metal circuit board 4 is 0.5 meters to 300 meters.
  • Preferred embodiment one, the combination of a single upper layer circuit board and a lower single layer metal circuit board:
  • the upper layer The metal circuit 4.1 is exposed at the through hole 1.2a on the circuit board 1, and the front circuit pad 1.3a of the upper circuit board is exposed on the side of the through hole 1.2a, and the metal circuit 4.1 of the lower circuit board is conducting
  • the hole 1.2a is exposed from the front (as shown in Figure 12 and Figure 14), or, on both ends of the circuit board, on the pads at the conduction welding position, shorten the upper layer line to make it on the conduction welding connection point , Only half of the upper circuit connection point 1.3b is exposed, and the metal circuit 4.1 of the lower circuit board is exposed from the front at the other half of the hole 1.2b (as shown in Figure 13, Figure 15), and then heated to the upper plate with an iron Make the heat transfer to the 3 layers of adhesive, let the 3 layers of adhesive stick to the upper circuit board 1, the lower single-layer metal circuit board 4, and place a template with holes on top of the laminated board.
  • the holes avoid the raised ones.
  • the wave then transfer to the Bion quick press, use 150 degrees, pressure 120KG, press for 1 minute, remove the template and enter the oven, bake at 150 for 60 minutes to solidify the glue, that is, the wavy shape is made.
  • the laminated circuit board (as shown in Figure 12, Figure 13, Figure 14, Figure 15) made of the LED light strip circuit board superimposed on the metal circuit board is dedicated to the production of LED light strips.
  • Preferred embodiment two, combination of multiple upper layer circuit boards and lower single layer metal circuit boards:
  • the metal circuit 4.1 is exposed at the via hole 1.2a on the upper circuit board 1, and the front circuit pad 1.3a of the upper circuit board is exposed on the side of the via hole 1.2a, and the lower layer
  • the metal circuit 4.1 of the circuit board is exposed from the front at the through hole 1.2a (as shown in Figure 13 and Figure 16), or, on both ends of the circuit board, on the pads at the conductive soldering position, shorten the upper circuit , Make it in the conduction welding connection point, only half of the upper circuit connection point 1.3b is exposed, and the metal circuit 4.1 of the lower circuit board is exposed from the front at the other half of the hole 1.2b (as shown in Figure 15, Figure 16.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明涉及波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法，具体而言，将单层或者双层线路板制成波浪状线路板后，用胶粘剂粘贴在一金属单面板上，形成部分区域分成的波浪状的双层线路板或三层线路板，形成既是波浪状的线路板，又是间断粘合，间断分层结构的分层线路板，这种线路板制作LED灯带，弯折使用时不易折断。

Description

波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法 技术领域
本发明涉及LED灯带领域，具体涉及波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法。
背景技术
LED线路板灯带一直来，使用时很多位置根据需要都要弯曲使用，通常灯带在弯曲使用时，都非常容易造成线路板弯曲断裂，或者线路板断线，或者长灯带在安装时因自身重量重，因拉伸而断裂，或者是灯带线路板背面有厚的铜线或者铜排线，弯曲时，厚铜把线路板顶断，或者是灯带包的防水树脂弯曲时把线路板顶断，如何解决这个弯曲及拉伸易断的问题，提高抗挠折能力，一直以来是业界的一个难题。
为了克服以上的缺陷和解决以上的技术难题，本发明把上层的单层或双层线路板制成波浪状的立体线路板，通过中间的胶粘剂与下层的单层金属线路板间断式的粘接连接成为一个叠层线路板，粘接形成的叠层线路板形成双层或者三层线路的线路板，形成既是波浪状的线路板，间断分层结构的分层板，用此线路板制作的LED灯带，可拉伸的灯带，此种灯带使用时，弯折使用时不易断裂。
发明内容
本发明涉及波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法，具体而言，将单层或者双层线路板制成波浪状线路板后，用胶粘剂粘贴在一金属单面板上，形成部分区域分成的波浪状的双层线路板或三层线路板，形成既是波浪状的线路板，又是间断粘合，间断分层结构的分层线路板，这种线路板制作LED灯带，弯折使用时不易折断。
根据本发明提供了波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板的制作方法，具体而言，将含多条灯带线路板的连体的上层线路板，用挤压模具挤压线路板成波浪状，方法是，挤压模具由上下两块模板组成，上下两块模 板都分别制作有多个凹槽和凸筋，或者是上下两块模板其中一块制作有凸筋，另一块制作有凹槽，上下两块模板对位叠在一起时，每一个凸筋对应一个凹槽，并都形成凸筋嵌入凹槽里的状态，下模板上有定位钉，上模上有定位孔，将线路板对位置于下模板上，然后再将上模置放在线路板上，模板定位孔挂到定位钉上，将整个定位叠层组合置入压机里冷压，冷压完成后，从压机里取出组合，再取下线路板，线路板已压成波浪状，此波浪状的线路板是可伸缩的线路板，再制作一下层的单层金属线路板，在波浪状的线路板的多个位置施加胶粘剂，或者在单层的金属线路板的多个位置施加胶粘剂，然后两种线路板对位粘接在一起，或者将上层线路板打孔后，再将两种线路板对位粘接在一起，制成了两种线路板叠加在一起的叠层线路板，所述叠层线路板既是波浪状的线路板，又是间断粘合，间断分层结构的分层线路板，所述的叠层线路板，上下两层线路板之间的导通，是在上下两层线路板上都设置有备用导通连接点，备用导通连接点设置在上层线路板的板边处，或者设置在上层线路板的板中孔位置处，线路板使用时，再用导电物将上下两层上的导通连接点连接导通。
根据本发明还提供了波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，包括：上层的单层或者双层线路板；中间层的胶粘剂；下层的单层金属线路板；其特征在于，上层线路板是形成有多个凸起的波浪状的线路板，是线路板两面都有波浪状的凸起或者是一面有波浪状的凸起，所述的波浪状的线路板是平面线路板挤压制成的波浪状的线路板，波浪状的线路板，在没有外力拉伸时是定型的立体柔性线路板，在遇到外力拉伸或挤压时凸起部分又能拉伸或挤压变型，而使线路板朝纵向(长方向)拉伸变长，或挤压变长或变短，下层的单层金属线路板和上层的单层或双层线路板，通过中间层的胶粘剂形成粘接成为一个整体线路板，胶粘剂形成在多个位置间断式的粘接结构，此整体线路板是双层或者三层线路的线路板，此整体线路板是波浪状的线路板，此整体线路板是在板内形成有多个位置分层结构的分层板，此整体线路板就是所述的叠层线路板，此整体线路板上下两层线路板都设置有备用的导通连接点，用所述线路板制作灯带时，再用导电物将上下两层线路板连接导通，用此线路板制作的LED灯带，就是更耐弯折的灯带，此种灯带使用时，弯折不易断裂。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线 路板制成的叠层线路板，其特征在于，所述波浪状的线路板，凸起的波浪已挤压定形，便于在制作灯带使用时线路板是稳定的结构，印刷锡膏能印准，SMT机贴元件时能贴准。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述波浪状的线路板，波浪凸起位置都是模压成形的凸起，是在不受力状态下定形的凸起，是在外力作用下又能变型的凸起，每条灯带凸起的位置可相同亦可不同。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述波浪状的线路板，波浪凸起的位置都避开了焊接元件的位置，在线路板上设计无焊接元件的空白处形成的凸起。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述的上层线路板是单层线路的线路板时，单层线路板是导线制作的线路板，或者是铜箔制作的线路板。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述的上层线路板是双层线路的线路板时，双层线路板两层线路的导通方式是用通孔镀铜方式导通，或者两面线路是用焊锡方式导通，或者两面线路通过导电油墨方式导通。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，所述的备用的导通连接点的特征是，上层的单层或者双层线路板与下层的单层金属线路板的导通，是在上层线路板的板边和下层金属线路板上都设置有备用导通连接点，或/和在板中设置有备用导通孔，在导通孔处上下两层都有备用导通连接点，线路板在制作灯带使用时，通过导电物连通上下两层的导通连接点，导电物是锡或锡合金，或者是导电胶或导电油墨。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，其叠层线路板是一张上层线路板和一张下层线路板叠在一起组成的叠层波浪状线路板，或者是多张上层线路板首尾排列叠在下层的一张线路板上制成的叠层线路板。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述下层的单层金属线路板的金属厚度大 于或等于上层线路板的金属厚度。
根据本发明的一优选实施例，所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，上下两层线路板的导通是通过上层线路板和下层线路板之间在分层处的裸露金属相互接触形成的接触导通。
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1为上层线路板，导通焊接位设置导通孔，导通孔边有露出的上层电路板的正面线路焊盘的平面示意图。
图2为上层线路板，两端的导通焊接位，在上层线路板的板边缘的导通焊接焊盘上，只露出一半的上层电路板的正面线路焊盘，另一半形成孔的平面示意图。
图3为上、下两块模板都分别都有多个凹槽和凸筋的挤压模具的截面示意图。
图4为“图3”的挤压模具将线路板挤压成型的截面示意图。
图5为线路板的两面都有多个凸起的波浪的截面示意图。
图6为上模板有多个凹槽，下模板有多个凸筋的挤压模具的截面示意图。
图7为“图6”的挤压模具将线路板挤压成型的截面示意图。
图8为线路板只有一面有多个凸起的波浪的截面示意图。
图9为下层的单层金属线路的平面示意图。
图10为设置有孔的膜，贴在下层的单层金属线路上，形成单层金属线路板的平面示意图。
图11为在下层的单层金属线路板上局部多处位置印刷胶粘剂后的平面示意图。
图12为“图1”的上层线路板通过胶粘剂与下层的单层金属线路板贴合在一起，形成间断粘合，间断分层的结构的叠层线路板的平面示意图。
图13为“图2”的上层线路板通过胶粘剂与下层的单层金属线路板贴合在 一起，形成间断粘合，间断分层的结构的叠层线路板的平面示意图。
图14为叠层线路板，在导通孔位置处的截面示意图。
图15为叠层线路板，在两端导通焊接位处的的截面示意图。
图16为多张上层线路板，首尾排列对位贴到下层的单层金属线路板上的平面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。
上层线路板的制作：
采用传统的线路板制作工艺，将单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、丝印正面油墨阻焊，露出电阻焊盘1.1a和LED灯焊盘1.1b，烘烤、印字符，烘烤固化、再用模具冲切出导通孔1.2a，导通孔1.2a的孔边有露出的上层电路板的正面线路焊盘1.3a，制作成如图1所示的上层单层线路板1，或者在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接连接点上，只露出一半上层线路的导通连接点1.3b，另一半形成孔1.2b，制作成如图2所示的上层单层线路板1，在此加工步骤中、图1、图2中标识1表示是单层线路板。
或者是将双面柔性覆铜板经钻孔、沉铜、镀铜、贴干膜、曝光显景、蚀刻、退膜、丝印正面油墨阻焊，露出电阻焊盘1.1a和LED灯焊盘1.1b，烘烤、再丝印背面油墨阻焊，烘烤、字符，烘烤、再用模具冲切出导通孔1.2a，导通孔1.2a的孔边有露出的上层电路板的正面线路焊盘1.3a，制作成如图1所示的上层双层线路板1，或者在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接连接点上，只露出一半上层线路的导通连接点1.3b，另一半形成孔1.2b，制作成如图2所示的上层双层线路板1，在此加工步骤中、图1、图2中标识1表示是双层线路板。
挤压模具的制作：
采用线切割的加工方式，用厚度为15mm的钢板，根据设计的切割资料，从板厚的中间线切割波浪，一分为二，切割制作出上模板2.1a和下模板2.1b，同 时在上模板2.1a上切割出有凹槽2.2a和凸筋2.2b，和在下模板2.1b上对应切割出有凸筋2.2b和凹槽2.2a，上模板2.1a上的凹槽2.2a对应匹配下模板2.1b上的凸筋2.2b，上模板2.1a上的凸筋2.2b对应匹配下模板2.1b上的凹槽2.2a，再在加工中心上加工制作出4个定位孔，然后在下模板2.1b上装上定位针，经过打磨抛光后，制作出上模板2.1a和下模板2.1b分别都有多个互相对应匹配的凹槽2.2a和凸筋2.2b的挤压模具(如图3所示)。
或者，根据设计的另一个切割资料，制作出上模板2.1a上有多个凹槽2.2a，下模板2.1b有多个凸筋2.2b的挤压模具，上模板2.1a上的凹槽2.2a与下模板2.1b上的凸筋2.2b互相对应匹配(如图6所示)。
波浪状线路板的制作：
用如图3的示的挤压模具，将线路板1置于下模板2.1b上，通过线路板1上的孔套到下模板2.1b的定位针上对位固定好，或者通过CCD对位并固定好，再将上模板2.1a上的定位孔对位套到下模板2.1b的定位钉上，对位叠合在一起，再置入比昂快压机里，冷压1分钟，将线路板1挤压出波浪的形状结构(如图4所示)，冷压完成后，从压机里取出挤压模具，再取下线路板1，线路板1的正面已挤压出凸起的波浪1.3a的形状结构，背面已挤压出凸起的波浪1.3b的形状结构(如图5所示)。
或者，用如图6的示的挤压模具，将线路板1置于下模板2.1b上，通过线路板1上的孔套到下模板2.1b的定位针上对位固定好，或者通过CCD对位并固定好，再将上模板2.1a上的定位孔对位套到下模板2.1b的定位钉上，对位叠合在一起，再置入比昂快压机里，冷压1分钟，将线路板1挤压出波浪形状的结构(如图7所示)，冷压完成后，从压机里取出挤压模具，再取下线路板1，线路板1的正面已压成有多个凸起的波浪1.3a的形状结构(如图8所示)。
下层单层金属线路板的制作：
采用传统的线路板制作工艺，将铜厚0.15mm的单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、制作出金属电路4.1(如图9所示)，再将设置有孔的PI覆盖膜，贴在金属电路4.1上，金属电路4.1从PI覆盖膜的孔中露出，再经压合烘烤，制作成下层单层金属线路板4(如图10所示)，下层单层金属线路板4的长度是0.5米至300米。
根据设计的工程资料，用18T的丝网晒好印胶网，将下层单层金属线路板4置放到丝印机的印刷台上，用CCD与印胶网对好位，将丙烯酸类胶粘剂3印刷到下层单层金属线路板4的局部多处位置上(如图11所示)，进入隧道炉用120度的温度烘烤3分钟，加温挥发掉丙烯酸胶粘剂3中的溶剂。
叠层线路板的制作：
优选实施例一、单张上层线路板和下层的单层金属线路板的组合：
用一带定位钉的模板，将已印胶粘剂3的0.5米长的下层单层金属线路板4置于模板上，胶粘剂3朝上，定位钉进到板的定位孔里，再将上层已挤压出波浪的单层板1、或者双层板1，叠到下层单层金属线路板4上，也使板上的定位钉进到定位孔里，使上下两层对准位置，此时，上层线路板1上的导通孔1.2a处露出了金属电路4.1，导通孔1.2a的边上有露出的上层电路板的正面线路焊盘1.3a，下层的线路板的金属电路4.1在导通孔1.2a处从正面露出(如图12、图14所示)，或者，在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接连接点上，只露出一半上层线路的导通连接点1.3b，下层的线路板的金属电路4.1在另一半孔1.2b处从正面露出(如图13、图15所示)，然后用熨斗加热到上层板上使传热到胶粘剂3层，让胶粘剂3层粘住上层线路板1，下层单层金属线路板4，把已叠好的板的上面置放一个带孔的模板，孔避开凸起的波浪，再转到比昂快压机里，用150度，压力120KG，压1分钟，取出后再拿开模板进入烤箱里，用150的温度烤60分钟使胶固化，即制作完成波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板(如图12、图13、图14、图15所示)，专用于制作LED灯带。
优选实施例二、多张上层线路板和下层的单层金属线路板的组合：
用一带定位钉的模板，将已印胶粘剂3的100米长的下层的单层金属线路板4的第一段置于模板上，胶粘剂3朝上，定位钉进到板的定位孔里，再将已挤压出波浪的第一张上层单层板1、或者双层板1，叠到单层金属板4的第一段上，也使板上的定位钉进到定位孔里，使上下两层对准位置，此时，上层线路板1上的导通孔1.2a处露出了金属电路4.1，导通孔1.2a的边上有露出的上层电路板的正面线路焊盘1.3a，下层的线路板的金属电路4.1在导通孔1.2a处从正面露出(如图13、图16所示)，或者，在线路板两端，在导通焊接位处的焊盘上， 缩短上层线路，使其在导通焊接连接点上，只露出一半上层线路的导通连接点1.3b，下层的线路板的金属电路4.1在另一半孔1.2b处从正面露出(如图15、图16所示)，然后用熨斗加热到上层板上使传热到胶粘剂3层，让胶粘剂3层粘住上层线路板1，下层单层金属线路板4，接下来依次将第二、第三、第四张，直到最后一张单层板1、或者双层板1，按照以上的方法，首尾排列对位贴到下层单层金属线路板4上，然后用比昂整卷快压机里，每段用150度，压力120KG，压1分钟的参数，依次逐段压合，每压一段上面都置放一个带孔的模板，孔避开凸起的波浪，避免压坏凸起的波浪，再放入烤箱里，150度烤60分钟使胶固化，即制作完成波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板(如图14、图15、图16所示)，专用于制作LED灯带。
以上结合附图将波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板及制作方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本发明的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (11)

  1. 波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板的制作方法，具体而言，将含多条灯带线路板的连体的上层线路板，用挤压模具挤压线路板成波浪状，方法是，挤压模具由上下两块模板组成，上下两块模板都分别制作有多个凹槽和凸筋，或者是上下两块模板其中一块制作有凸筋，另一块制作有凹槽，上下两块模板对位叠在一起时，每一个凸筋对应一个凹槽，并都形成凸筋嵌入凹槽里的状态，下模板上有定位钉，上模上有定位孔，将线路板对位置于下模板上，然后再将上模置放在线路板上，模板定位孔挂到定位钉上，将整个定位叠层组合置入压机里冷压，冷压完成后，从压机里取出组合，再取下线路板，线路板已压成波浪状，此波浪状的线路板是可伸缩的线路板，再制作一下层的单层金属线路板，在波浪状的线路板的多个位置施加胶粘剂，或者在单层的金属线路板的多个位置施加胶粘剂，然后两种线路板对位粘接在一起，或者将上层线路板打孔后，再将两种线路板对位粘接在一起，制成了两种线路板叠加在一起的叠层线路板，所述叠层线路板既是波浪状的线路板，又是间断粘合，间断分层结构的分层线路板，所述的叠层线路板，上下两层线路板之间的导通，是在上下两层线路板上都设置有备用导通连接点，备用导通连接点设置在上层线路板的板边处，或者设置在上层线路板的板中孔位置处，线路板使用时，再用导电物将上下两层上的导通连接点连接导通。
  2. 波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，包括：
    上层的单层或者双层线路板；
    中间层的胶粘剂；
    下层的单层金属线路板；
    其特征在于，上层线路板是形成有多个凸起的波浪状的线路板，是线路板两面都有波浪状的凸起或者是一面有波浪状的凸起，所述的波浪状的线路板是平面线路板挤压制成的波浪状的线路板，波浪状的线路板，在没有外力拉伸时是定型的立体柔性线路板，在遇到外力拉伸或挤压时凸起部分又能拉伸或挤压变型，而使线路板朝纵向(长方向)拉伸变长，或挤压变长或变短，下层的单层金属线路板和上层的单层或双层线路板，通过中间层的胶粘剂形成粘接成为一个整体线 路板，胶粘剂形成在多个位置间断式的粘接结构，此整体线路板是双层或者三层线路的线路板，此整体线路板是波浪状的线路板，此整体线路板是在板内形成有多个位置分层结构的分层板，此整体线路板就是所述的叠层线路板，此整体线路板上下两层线路板都设置有备用的导通连接点，用所述线路板制作灯带时，再用导电物将上下两层线路板连接导通，用此线路板制作的LED灯带，就是更耐弯折的灯带，此种灯带使用时，弯折不易断裂。
  3. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述波浪状的线路板，凸起的波浪已挤压定形，便于在制作灯带使用时线路板是稳定的结构，印刷锡膏能印准，SMT机贴元件时能贴准。
  4. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述波浪状的线路板，波浪凸起位置都是模压成形的凸起，是在不受力状态下定形的凸起，是在外力作用下又能变型的凸起，每条灯带凸起的位置可相同亦可不同。
  5. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述波浪状的线路板，波浪凸起的位置都避开了焊接元件的位置，在线路板上设计无焊接元件的空白处形成的凸起。
  6. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述的上层线路板是单层线路的线路板时，单层线路板是导线制作的线路板，或者是铜箔制作的线路板。
  7. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述的上层线路板是双层线路的线路板时，双层线路板两层线路的导通方式是用通孔镀铜方式导通，或者两面线路是用焊锡方式导通，或者两面线路通过导电油墨方式导通。
  8. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，所述的备用的导通连接点的特征是，上层的单层或者双层线路板与下层的单层金属线路板的导通，是在上层线路板的板边和下层金属线路板上都设置有备用导通连接点，或/和在板中设置有备用导通孔，在导通孔处上下两层都有备用导通连接点，线路板在制作灯带使用时，通过导电物连通上下两层的 导通连接点，导电物是锡或锡合金，或者是导电胶或导电油墨。
  9. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，其叠层线路板是一张上层线路板和一张下层线路板叠在一起组成的叠层波浪状线路板，或者是多张上层线路板首尾排列叠在下层的一张线路板上制成的叠层线路板。
  10. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，所述下层的单层金属线路板的金属厚度大于或等于上层线路板的金属厚度。
  11. 根据权利要求1或2所述的波浪状的LED灯带线路板叠加金属线路板制成的叠层线路板，其特征在于，上下两层线路板的导通是通过上层线路板和下层线路板之间在分层处的裸露金属相互接触形成的接触导通。
PCT/CN2020/109154 2019-09-27 2020-08-14 波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法 WO2021057322A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910960779.4A CN112584617A (zh) 2019-09-27 2019-09-27 波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法
CN201910960779.4 2019-09-27

Publications (1)

Publication Number Publication Date
WO2021057322A1 true WO2021057322A1 (zh) 2021-04-01

Family

ID=75116979

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/109154 WO2021057322A1 (zh) 2019-09-27 2020-08-14 波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法

Country Status (2)

Country Link
CN (1) CN112584617A (zh)
WO (1) WO2021057322A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114513895A (zh) * 2022-03-08 2022-05-17 江门市东达丰照明科技有限公司 一种高密度排布的柔性线路板及其灯带、以及模切工具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103682041A (zh) * 2012-09-14 2014-03-26 日亚化学工业株式会社 发光装置
CN203731187U (zh) * 2014-01-08 2014-07-23 王定锋 一种保护元件不易剥离的柔性灯带
US9277685B2 (en) * 2013-12-19 2016-03-01 GE Lighting Solutions, LLC Systems and methods for simulating neon lighting using light emitting diodes
CN205560412U (zh) * 2016-02-15 2016-09-07 广州得昱照明科技有限公司 一种波浪型软灯条
CN207555274U (zh) * 2017-10-20 2018-06-29 林伟滨 一种弹性led灯条
WO2019175914A1 (en) * 2018-03-16 2019-09-19 Linea Light S.R.L. Lighting strip and corresponding production method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101409976B (zh) * 2007-10-12 2011-04-06 比亚迪股份有限公司 多层柔性线路板
JP2016021555A (ja) * 2014-05-27 2016-02-04 キヤノン・コンポーネンツ株式会社 フレキシブルプリント配線板およびフレキシブル回路板
CN206181548U (zh) * 2016-10-19 2017-05-17 王定锋 一种led条型灯双层电路板模组
EP3682716A1 (en) * 2017-09-15 2020-07-22 Lumileds Holding B.V. Flexible light strip
CN212381451U (zh) * 2019-09-27 2021-01-19 王定锋 用波浪状的led灯带线路板制成的叠层线路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103682041A (zh) * 2012-09-14 2014-03-26 日亚化学工业株式会社 发光装置
US9277685B2 (en) * 2013-12-19 2016-03-01 GE Lighting Solutions, LLC Systems and methods for simulating neon lighting using light emitting diodes
CN203731187U (zh) * 2014-01-08 2014-07-23 王定锋 一种保护元件不易剥离的柔性灯带
CN205560412U (zh) * 2016-02-15 2016-09-07 广州得昱照明科技有限公司 一种波浪型软灯条
CN207555274U (zh) * 2017-10-20 2018-06-29 林伟滨 一种弹性led灯条
WO2019175914A1 (en) * 2018-03-16 2019-09-19 Linea Light S.R.L. Lighting strip and corresponding production method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114513895A (zh) * 2022-03-08 2022-05-17 江门市东达丰照明科技有限公司 一种高密度排布的柔性线路板及其灯带、以及模切工具
CN114513895B (zh) * 2022-03-08 2023-09-22 江门市东达丰照明科技有限公司 一种高密度排布的柔性线路板及其灯带、以及模切工具

Also Published As

Publication number Publication date
CN112584617A (zh) 2021-03-30

Similar Documents

Publication Publication Date Title
JP2005142573A (ja) 多層印刷回路基板及びその製造方法
TWI606769B (zh) 剛撓結合板之製作方法
CN102065645A (zh) 带元件的双面电路板及其互连导通方法
CN100546441C (zh) 一种多层柔性线路板的制作方法
WO2021057322A1 (zh) 波浪状的led灯带线路板叠加金属线路板制成的叠层线路板及制作方法
CN110324991A (zh) 一种复合电路板的制备方法
CN211821838U (zh) 一种间断分层的柔性叠层线路板灯带
CN107231761B (zh) 一种使用导电胶连接传感器和印制电路板的方法
WO2021057311A1 (zh) 一种间断分层的柔性叠层线路板灯带及制作方法
CN210469869U (zh) 一种低成本铝制作线路的电路板
CN212381451U (zh) 用波浪状的led灯带线路板制成的叠层线路板
WO2023116595A1 (zh) 一种双层柔性线路板及其制作方法
CN212381453U (zh) 一种波浪叠层线路板制作的led灯带
CN211821837U (zh) 一种波浪状的led短灯带组装成的长灯带
CN217011280U (zh) 单面金手指弯折180°两面接插功能柔性线路板
CN212381476U (zh) 一种波浪状的led线路板灯带
WO2021057321A1 (zh) 一种间断分层的柔性叠层灯带线路板及制作方法
CN212204122U (zh) 一种用led线路板模组制作的波浪状led灯带
CN212381469U (zh) 一种单层线路板组合到排线上制成的双层线路板
WO2021057323A1 (zh) 一种波浪状的led短灯带组装成的长灯带及制作方法
CN201860515U (zh) 焊接连接导通的双面led电路板及组件
WO2021057320A1 (zh) 一种厚金属led长灯带及制作方法
WO2021057310A1 (zh) 一种单层线路板组合到排线上制成的双层线路板及制作方法
WO2021057312A1 (zh) 一种可多向转弯安装的led灯带及制作方法
JP2012243829A (ja) 多層プリント配線板およびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20868416

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20868416

Country of ref document: EP

Kind code of ref document: A1