WO2021057311A1 - 一种间断分层的柔性叠层线路板灯带及制作方法 - Google Patents

一种间断分层的柔性叠层线路板灯带及制作方法 Download PDF

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Publication number
WO2021057311A1
WO2021057311A1 PCT/CN2020/108999 CN2020108999W WO2021057311A1 WO 2021057311 A1 WO2021057311 A1 WO 2021057311A1 CN 2020108999 W CN2020108999 W CN 2020108999W WO 2021057311 A1 WO2021057311 A1 WO 2021057311A1
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WIPO (PCT)
Prior art keywords
circuit board
layer
light strip
circuit
laminated
Prior art date
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PCT/CN2020/108999
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English (en)
French (fr)
Inventor
王定锋
徐文红
冉崇友
徐磊
琚生涛
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王定锋
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Application filed by 王定锋 filed Critical 王定锋
Publication of WO2021057311A1 publication Critical patent/WO2021057311A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of LED light strips, in particular to a flexible laminated circuit board light strip with intermittent layering and a manufacturing method.
  • LED circuit board light strips come all the time, and many positions need to be bent when used.
  • the light strip it is very easy to cause the circuit board to bend and break, or the circuit board is broken, or the long light strip is installed due to It is heavy and breaks due to stretching, or there is a thick copper wire or copper cable on the back of the light strip circuit board.
  • the thick copper breaks the circuit board, or the water-proof resin of the light strip packs the circuit when it is bent.
  • the top of the board is broken, and some long strips are connected by soldering to make long strips.
  • thick copper must be used as the circuit conductor.
  • the thicker the copper that needs to be soldered the weaker it is to be soldered and cannot resist flexure. How to solve the problem of bending and tensile fragility and improve the flexural resistance has always been a problem in the industry.
  • the present invention makes the light strip circuit board into an intermittently layered flexible laminated circuit board, and the single-layer or double-layer flexible circuit board of the front welding component is partially intermittently printed on the back
  • the adhesive is then pasted with the metal single-layer circuit board on the back to form an intermittent adhesive and intermittent layered structure, which greatly improves the bending resistance of the light strip and solves the problem of breakage caused by many factors during the installation and use of the light strip.
  • the present invention also adopts the method of melting and fusing the copper's own solder joints to weld the positive and negative poles of multiple short light strips.
  • the resulting long light strip is very firm, and the connection position does not break when winding, which solves the problem.
  • Traditional soldering is resistant to flexure and insufficient tensile strength.
  • the invention relates to an intermittently layered flexible laminated circuit board light strip and a manufacturing method.
  • a single-layer flexible circuit board or a double-layer flexible circuit board designed with a through hole is printed in multiple locations on the back Adhesive, and then make a metal single-layer circuit board, paste the printed circuit board on the back side and the metal single-layer circuit board together to form an intermittent adhesive and intermittent layered structure, that is, the lower metal circuit board part on the back, and
  • an intermittent adhesive and intermittent layered structure that is, the lower metal circuit board part on the back
  • a method for manufacturing intermittently layered flexible laminated circuit board light strips Specifically, a conjoined single-layer flexible circuit board containing multiple light strip circuit boards is manufactured first, or a single-layer flexible circuit board containing multiple light strip circuit boards is manufactured.
  • the conjoined double-layer flexible circuit board with a strip light and a circuit board is used for the upper circuit board of the laminated circuit board.
  • the front side of the circuit board is used for soldering components.
  • a single-layer circuit board containing multiple conjoined For the lower circuit board of the laminated circuit board, apply the adhesive of the middle layer to the back of the upper circuit board, or apply it to the side of the lower circuit board.
  • the circuit board is partially formed with adhesive in multiple locations, and then the upper layer
  • the circuit board is aligned and pasted to the lower circuit board, or the upper circuit board is punched and then aligned to the lower circuit board, and pressure is applied to bond the upper and lower circuit boards firmly to form a discontinuous part.
  • Layer of flexible laminated lamp with circuit board, the bonding between the upper circuit board and the lower circuit board of the laminated lamp with circuit board is the intermittent bonding of multiple local adhesives, and the unbonded positions are
  • the flexible laminated light strip circuit board with separate gaps and intermittent layers is a laminated circuit board formed by overlapping two different circuit boards and bonding them together with an adhesive.
  • the upper layer is a single-layer circuit board or Double-layer circuit boards, the two-layer circuit boards are made with mutually conductive connection points, the connection points are on the edge of the upper circuit board, and there are multiple connection points on the edge of the upper circuit board to align the lower circuit
  • Multiple connection points on the board, or/and via holes are provided on the upper circuit board, the via holes have connection points on the front lines of the upper circuit board, and the lower circuit board has metal to form connections at the via holes Point
  • the intermittently layered flexible laminated lamp strip circuit board is a double-layer board or a three-layer board with a plurality of intermittent layered gaps formed in the board. Between the gaps and the gaps, there is glue to connect the lines of the lower layer.
  • the circuit metal on the board or/and the insulating non-metal on the circuit are bonded to the back of the upper single-layer circuit board or the back of the double-layer circuit board, and the formation of intermittent bonding in multiple positions, the lower back
  • the thickness of the circuit metal of the circuit board is greater than or equal to the thickness of the circuit metal of the upper circuit board.
  • the components containing the LED lamp are soldered on the intermittently layered flexible laminated lamp strip circuit board by the SMT process, and the upper and lower parts are welded through the connection points
  • the two layers of circuit boards are connected and connected to form a connected light strip with multiple light strips. After slitting with a slitting machine, a kind of intermittent layered flexible laminated circuit board light strip is made.
  • the board is a discontinuous layered structure, which improves the bending resistance, and at the same time, there are multiple intermittent layers of interlayer bonding to ensure a relatively strong overall structure.
  • a method for manufacturing intermittently layered flexible laminated circuit board light strips Specifically, a plurality of single-layer conjoined flexible circuit boards containing multiple light strip circuit boards are produced first, or Multiple double-layer conjoined flexible circuit boards containing multiple light strip circuit boards, used for the laminated upper circuit board, the front side of the circuit board is used for soldering components, and a single-layer conjoined body containing multiple circuit boards Long circuit boards, used for laminated lower circuit boards, apply adhesive on the back of multiple upper circuit boards, or on one side of the lower long circuit boards. After the application is completed, the circuit boards are formed in multiple locations with local adhesives.
  • the circuit boards are firmly bonded together to make a laminated light strip circuit board.
  • the bonding between the upper and lower circuit boards of the laminated light strip circuit board is the intermittent bonding of adhesive in multiple parts of the laminated light strip circuit board.
  • the multiple unbonded positions are formed with separate gaps, that is, the finished flexible laminated light strip circuit board is an intermittently layered flexible laminated light strip circuit board, and the finished intermittently layered flexible laminated light With circuit board, it is a laminated circuit board formed by multiple circuit boards arranged end to end and bonded to the lower layer by an adhesive.
  • the upper layer is a single-layer circuit board or a double-layer circuit board.
  • the finished product The laminated circuit board is a double-layer or three-layer circuit board, and there is a conductive connection point between the upper circuit board and the lower single-layer circuit board on the back, and the conductive connection point is on the edge of the upper circuit board.
  • the lower circuit board has metal exposed from the front at the through hole to form a conductive connection point.
  • the intermittent layered flexible laminated light strip circuit board is formed with a plurality of intermittent points in the board.
  • the back side or the back side of multiple double-layer circuit boards is bonded, and the formation is intermittent bonding in multiple locations.
  • the thickness of the circuit metal of the lower back circuit board is greater than or equal to the thickness of the circuit metal of the upper circuit board, using the SMT process Soldering the components including the LED lights on the intermittently layered flexible laminated lamp strip circuit board.
  • the upper and lower circuit boards are welded together to form the conduction connection between the upper and lower layers.
  • a kind of intermittent layered flexible laminated circuit board light strip is made.
  • the light strip is intermittently layered due to the circuit board.
  • the structure improves the bending resistance, and at the same time, there are interlayer laminated bonding in multiple positions, which ensures a relatively strong overall structure.
  • an intermittently layered flexible laminated circuit board light strip including: a component layer containing LEDs; a single-layer circuit board or a double-layer circuit board stacked on the upper layer; an adhesive layer in the middle; The single-layer circuit board of the lower layer; characterized in that, the circuit board of the intermittently layered flexible laminated circuit board light strip is made of a single-layer circuit board or a double-layer circuit board on the upper layer, which is bonded to The laminated circuit board formed on the lower single-layer circuit board, or the laminated circuit board formed by multiple single-layer circuit boards or double-layer circuit boards arranged end to end and bonded to the lower single-layer circuit board through an adhesive layer
  • the bonding between all the upper circuit boards and the lower circuit boards of the circuit board, laminated lamp strip circuit board is the intermittent bonding of multiple local adhesives formed, and the multiple positions that are not bonded are formed with separate gaps.
  • the formed flexible laminated light strip circuit board is an intermittently layered flexible laminated light strip circuit board, and the intermittently layered flexible laminated light strip circuit board is intermittently bonded by one or more circuit boards with adhesive
  • the laminated circuit board formed on the lower-layer circuit board is a double-layer or triple-layer circuit board, and the upper circuit board and the lower single-layer circuit board are connected to each other.
  • the conduction connection point is on the edge of the upper circuit board, and there are multiple metal connection points on the edge of the upper circuit board to align with multiple metal connection points on the lower circuit board, or/and on the upper circuit board
  • the board is provided with a through hole.
  • the side of the through hole has a metal conduction connection point on the front line of the upper circuit board.
  • the lower circuit board has metal to form a conduction connection point at the through hole, and the upper layer has been soldered
  • the conduction connection point and the lower conduction connection point have been welded and connected together to form a conduction.
  • the intermittent layered flexible laminated light strip circuit board is formed with a plurality of intermittent layered gaps in the board Double-layer circuit board or three-layer circuit board, between the gap and the gap, there is glue to connect the circuit metal or/and the insulating non-metal on the circuit on the lower single-layer circuit board to the back of the single upper circuit board or multiple upper layers The back side of the circuit board is bonded, and the intermittent bonding is formed at multiple locations.
  • the thickness of the circuit metal of the lower back circuit board is greater than or equal to the thickness of the circuit metal of the upper circuit board, and the light strip is soldered and contains LEDs.
  • the components of the lamp are formed on the intermittently layered flexible laminate lamp strip circuit board to form an intermittently layered flexible laminate circuit board lamp strip. Because the circuit board has an intermittent layered structure, the lamp strip has improved bending resistance. Foldability, and at the same time, there are multiple intermittent interlayer lamination bonding, which ensures a relatively strong overall structure.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that, when the upper layer is a double-layer circuit board, the double-layer circuit
  • the mutual conduction method is to conduct conduction by soldering conduction at the designed upper and lower solder conduction points, or conduct conduction through copper plating through the through hole formed between the two layers, or conduct conduction by conductive ink. through.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the adhesive is a curable or cured adhesive, or a self-adhesive adhesive .
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the single-layer circuit board stacked on the lower layer is a circuit board with a single-layer film, which carries The film layer of the circuit is on the layered side of the board sandwiched by the circuit board, or the film layer is fully exposed on the lowermost layer of the laminated circuit board, or the single-layer circuit board laminated on the lower layer is Double-layer film circuit board, two layers of film sandwich the middle circuit layer.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the single-layer circuit board stacked on the lower layer is a plurality of metal lines arranged in parallel In the wiring circuit board, the parallel wiring is the positive and negative power lines, which are used to supply power to the upper circuit and components.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the single-layer circuit board stacked on the lower layer is formed with a plurality of slits , The gap formed is between two adjacent metal lines, which is convenient for multi-directional turning and installation when the light strip is used.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the circuit metal of the single-layer circuit board stacked on the lower layer is copper, or aluminum, or Aluminum is nickel-plated, or aluminum is tin-plated, or aluminum is copper-plated, or copper-clad aluminum.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the LED is arranged at the layer facing the layered structure, and the LED light strip is When there are LED lights at the turn, the turning and bending will not easily cause the LED lamp beads to detach or break.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the light strip is really designed and made to turn only at the position without components, and the turning point is layered. Structure, the soldering pad of the LED is set at the bonding place between the upper and lower circuit boards.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the single-layer circuit board or double-layer circuit board laminated on the upper layer contains multiple The circuit board of the circuit of two cycles, the circuit design of each cycle is the same, when the upper circuit board is designed with the positive and negative power main lines from the beginning to the end, the conduction connection point between the upper circuit board and the lower circuit board, Set at one cycle position or set at multiple cycle positions, is to connect and conduct the upper and lower circuits at one cycle position or multiple cycle positions.
  • the upper circuit board and Each cycle between the lower layer circuit boards is provided with a conduction connection point, and connection conduction has been formed.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the conduction of the upper and lower circuit boards is between the upper circuit board and the lower circuit board. The contact formed by the bare metal at the delamination is conducted.
  • the intermittently layered flexible laminated circuit board light strip is characterized in that the application method of applying the adhesive is to apply the adhesive by printing, or to use multi-head printing.
  • the glue machine applies adhesive or sticking tape.
  • Figure 1 is the upper circuit board.
  • the conductive soldering position is provided with a through hole.
  • the front circuit pad of the upper circuit board is exposed on the side of the through hole, and the metal on the lower circuit board is exposed from the front at the through hole to form a solder joint.
  • Figure 2 is a schematic plan view of the upper circuit board, the conductive soldering positions at both ends, and the multiple solder joints on the board edge of the upper circuit board aligning with the multiple solder joints of the lower circuit board.
  • Fig. 3 is a schematic plan view after printing adhesive at multiple locations on the back of the upper circuit board.
  • Fig. 4 is a schematic plan view of the metal single-layer circuit on the lower layer of the back surface.
  • Fig. 5 is a schematic plan view of a film provided with a hole, which is attached to the metal single-layer circuit on the lower layer of the back side to form a metal single-layer circuit board.
  • Fig. 6 is a schematic plan view of a plurality of slits provided between two adjacent circuits of a metal single-layer circuit board.
  • Fig. 7 is a plan view of the upper circuit board of "Fig. 1" and the lower single-layer circuit board bonded together by an adhesive to form an intermittent adhesive and intermittent layered structure of the intermittent layered flexible laminated light strip circuit board .
  • Fig. 8 is a plan view of the upper circuit board of "Fig. 2" and the lower single-layer circuit board bonded together by adhesive to form an intermittent adhesive and intermittent layered structure of the intermittent layered flexible laminated light strip circuit board .
  • Figure 9 is a schematic plan view of multiple upper circuit boards arranged end to end on the lower circuit board.
  • Fig. 10 is a schematic cross-sectional view of the intermittently layered flexible laminated light strip circuit board at the position of the via hole.
  • Fig. 11 is a schematic cross-sectional view of the intermittently layered flexible laminated lamp ribbon circuit board with the conducting and welding positions at both ends.
  • Fig. 12 is a schematic plan view of a flexible laminated circuit board light strip with intermittent layering by soldering the LED on the laminated light strip circuit board through SMT mounting.
  • Fig. 13 is a schematic cross-sectional view of a flexible laminated circuit board light strip with intermittent layers made by soldering LEDs on a laminated light strip circuit board through SMT.
  • the single-sided flexible copper clad board is screen-printed with circuit corrosion-resistant ink, baked and cured, etched, film-removed, and screen-printed with the front ink solder mask to expose the resistance pad 1.1a and the LED lamp pad 1.1b. Bake, print characters, bake and solidify, and then punch out the via hole 1.2a with a mold. The hole edge of the via hole 1.2a has the exposed circuit pad 1.3a of the upper circuit board, which is made as shown in Figure 1.
  • the marking 1 in Fig. 1 and Fig. 2 indicates that it is a single-layer circuit board.
  • the double-sided flexible copper clad board is drilled, copper-immersed, copper-plated, dry-filmed, exposed, etched, film-removed, and screen-printed.
  • the front ink solder mask is exposed to expose the resistance pad 1.1a and the LED lamp pad 1.1b , Baking, and then screen printing the back ink solder mask, baking, characters, baking, and then punching out the via hole 1.2a with a die.
  • the hole edge of the via hole 1.2a has the exposed circuit pad of the upper circuit board.
  • 18T screen printing glue is used in several places on the back of the upper circuit board 1.
  • the screen is partly leaking and the part is not leaking.
  • the screen frame is placed on the screen printing table, and the backstage is aligned. Install positioning nails on the surface, place the back of the circuit board on the table, insert the positioning nails into the positioning holes for positioning, add glue to the net, print the acrylic adhesive for the flexible board 2 to multiple pre-designed positions on the board
  • the surface enters the tunnel furnace at 120°C for 3 minutes, and heats it to volatilize the solvent in the acrylic adhesive 2.
  • the single-sided flexible copper clad laminate with a copper thickness of 0.15mm is screen-printed with circuit corrosion-resistant ink, baked and cured, etched, and film-removed to produce a metal circuit 3.1 (as shown in Figure 4).
  • the PI cover film with holes is attached to the metal circuit 3.1, and the metal circuit 3.1 is exposed from the holes of the PI cover film, and then pressed and baked to form a lower metal single-layer circuit board (as shown in Figure 5),
  • the length of the lower metal single-layer circuit board is 0.5 to 300 meters.
  • Gap 3.2 is convenient for multi-directional turning installation of subsequent lamp belts.
  • Preferred embodiment (1) a combination of a single upper circuit board and a lower metal single layer board
  • the via holes on the upper circuit board 1 The metal circuit 3.1 is exposed at 1.2a, the front circuit pad 1.3a of the upper circuit board is exposed on the side of the via hole 1.2a, and the metal circuit 3.1 of the lower circuit board is exposed from the front at the via hole 1.2a ( As shown in Figure 7 and Figure 10), or, at both ends of the circuit board, on the pads at the conduction welding position, shorten the upper layer circuit so that only half of the upper layer circuit’s conduction is exposed on the conduction welding spot.
  • the metal circuit 3.1 of the lower circuit board is exposed from the front at the other half of the hole 1.2b (as shown in Figure 8 and Figure 11), and then heated to the upper plate with an iron to transfer the heat to the adhesive layer 2 , Let the adhesive 2 layers stick to the upper circuit board 1, the lower metal single layer circuit board 3, transfer the laminated board to the Bion quick press, use 150 degrees, pressure 120KG, press for 1 minute, take it out and enter again In the oven, bake at 150°C for 60 minutes to cure the glue, and then the intermittently layered flexible laminated light strip circuit board (as shown in Figure 7, Figure 8, Figure 10, and Figure 11) is produced, which is dedicated to the production of LED light strips.
  • Preferred embodiment (2) combination of multiple upper circuit boards and lower metal single layer boards
  • the adhesive 2 is folded down on the first section of the metal single-layer board 3, and the positioning nails on the board are also inserted into the positioning holes, so that the upper and lower layers are aligned.
  • the metal circuit 3.1 is exposed at the via hole 1.2a on the upper circuit board 1, and the front circuit pad 1.3a of the upper circuit board is exposed on the side of the via hole 1.2a, and the metal circuit 3.1 of the lower circuit board is exposed.
  • the solder paste is printed on the LED lamp bead pad 1.1b and the resistor pad 1.1a of the intermittently layered flexible laminated light strip circuit board with a stencil, and then Use the SMT placement machine to mount the LED lamp beads 4.1 and resistor 4.2 to the solder paste-printed pads respectively, and solder the lamp beads 4.1 and resistor 4.2 to the intermittently layered flexible laminated lamp.
  • a connected light strip containing multiple light strips is made, and then it is slit on a slitting machine to make a discontinuous layered flexible laminated circuit board light strip (as shown in Figure 12). , Figure 13), because the circuit board is a discontinuous layered structure, the bending resistance is improved, and at the same time, there are multiple positions of discontinuous interlayer laminated bonding, which ensures a relatively strong The overall structure.
  • the light strip circuit board is made into an intermittently layered flexible laminated circuit board, and the single-layer or double-layer flexible circuit board of the front welding element is partially intermittently printed with adhesive on the back, and then glued to the metal single-layer circuit board on the back Together, a structure of intermittent bonding and intermittent layering is formed, which greatly improves the bending resistance of the light strip and solves the problem of plate breakage caused by many factors when the light strip is installed and used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Led Device Packages (AREA)

Abstract

一种间断分层的柔性叠层线路板灯带及制作方法，将设计有导通孔（1.2a）的单层柔性线路板或者双层柔性线路板，在背面局部多个位置印刷胶粘剂（2），再制作一金属单层线路板（3），将背面已印刷胶的线路板和金属单层线路板（3）粘贴在一起，形成间断粘合，间断分层的结构，即背面下层的金属线路板部分，和上层的单层线路板或双层线路板之间，是在局部多处位置是未有胶粘接的分层结构，制成双层或三层的间断分层的柔性叠层线路板，再用SMT工艺贴焊包含有LED灯的元器件，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，这种灯带在弯折使用时更耐弯折。

Description

一种间断分层的柔性叠层线路板灯带及制作方法 技术领域
本发明涉及LED灯带领域，具体涉及一种间断分层的柔性叠层线路板灯带及制作方法。
背景技术
LED线路板灯带一直来，使用时很多位置根据需要都要弯曲使用，通常灯带在弯曲使用时，都非常容易造成线路板弯曲断裂，或者线路板断线，或者长灯带在安装时因自身重量重，因拉伸而断裂，或者是灯带线路板背面有厚的铜线或者铜排线，弯曲时，厚铜把线路板顶断，或者是灯带包的防水树脂弯曲时把线路板顶断，加之一些长灯带都是用焊锡连接的方式制作长灯带，但是，当需要制作超长灯带时，因负载大，载流量大，就必须要用厚铜做电路导体，然而，需要焊接连接的铜越厚用锡焊越不牢固，抗不了挠折，如何解决这个弯曲及拉伸易断的问题，提高抗挠折能，一直以来是业界的一个难题。
为了克服以上的缺陷和解决以上的技术难题，本发明将灯带线路板制作成间断分层的柔性叠层线路板，将正面焊元件的单层或者双层柔性线路板，在背面局部间断印刷胶粘剂，再与背面的金属单层线路板粘贴在一起，形成间断粘合，间断分层的结构，大大提高了灯带的耐弯折性，解决了灯带在安装使用时诸多因素导致的断板问题，本发明还采取铜自身焊点融化融合在一起的方式，将多条短灯带首尾正负极铜焊接，制成的长灯带非常牢固，绕折时连接位不断裂，解决了传统锡焊抗挠折，抗拉强度不够的问题。
发明内容
本发明涉及一种间断分层的柔性叠层线路板灯带及制作方法，具 体而言，将设计有导通孔的单层柔性线路板或者双层柔性线路板，在背面局部多个位置印刷胶粘剂，再制作一金属单层线路板，将背面已印刷胶的线路板和金属单层线路板粘贴在一起,形成间断粘合，间断分层的结构，即背面下层的金属线路板部分，和上层的单层线路板或双层线路板之间，是在局部多处位置是未有胶粘接的分层结构，制成双层或三层的间断分层的柔性叠层线路板，再用SMT工艺贴焊包含有LED灯的元器件，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，这种灯带在弯折使用时更耐弯折。
根据本发明提供了一种间断分层的柔性叠层线路板灯带的制作方法，具体而言，先制作完成一含多条灯带线路板的连体单层柔性线路板、或者一含多条灯带线路板的连体双层柔性线路板，用于叠层线路板的上层线路板，线路板正面用于焊元件，另外再制作一含多条连体的单层线路板，用于叠层线路板的下层线路板，施加中间层的胶粘剂在上层线路板的背面，或者施加在下层线路板的一面，施加完成后，线路板上是多个位置形成局部有胶粘剂，然后再将上层线路板对位贴到下层线路板上，或者先将上层线路板打孔后再对位贴到下层线路板上，施加压力压合使上下两层线路板牢固粘接在一起，制成间断分层的柔性叠层灯带线路板，叠层灯带线路板的上层线路板和下层线路板之间的粘接，是形成的局部多处胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，间断分层的柔性叠层灯带线路板，是由两片不同的线路板重叠用胶粘剂粘接在一起形成的叠层线路板，叠在上层的是单层线路板或双层线路板，两层线路板之间制作有互相导通的导通连接点，导通连接点在上层线路板的板边，上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点，或/和在上层线路板设置有导通孔，导通孔边有上层线路板正面线路上的连接点，下层的线路板上有金属在导通孔处形成连接点，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断分层缝隙的双层板或三层板，缝 隙与缝隙之间，有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属，与上层的单层线路板的背面或双层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，用SMT工艺贴焊包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，通过焊接连接点将上下两层线路板连接导通，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
根据本发明还提供了一种间断分层的柔性叠层线路板灯带的制作方法，具体而言，先制作完成多张含多条灯带线路板的单层连体柔性线路板、或者制作多张含多条灯带线路板的双层连体的柔性线路板，用于叠层的上层线路板，线路板正面用于焊元件，另外再制作一含多条线路板的单层连体长线路板，用于叠层的下层线路板，施加胶粘剂在多张上层线路板的背面，或者施加在下层长线路板的一面，施加完成后，线路板上是多个位置形成局部有胶粘剂，然后将多张上层线路板，首尾排列对位贴到下层线路板上，或者先将多张上层线路板打孔后再首尾排列对位贴到下层线路板上，施加压力压合使上下两层线路板牢固粘接在一起，制成叠层灯带线路板，叠层灯带线路板各上层线路板和下层线路板之间的粘接，是形成的局部多处有胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，即制成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板，所制作完成的间断分层的柔性叠层灯带线路板，是由多张线路板首尾排列通过胶粘剂粘接在下层的一张长线路板形成的叠层线路板，叠在上层的是单层线路板或双层线路板，制作完成后的叠层线路板是双层或者三层线路板，并且，上层线路板和背面下层单层线路板之间有形成互相导通的导通连接点，导通连接点在上层线路板的板边，在上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点，或/和在上层线路板设置 有导通孔，导通孔边有上层线路板的正面线路导通连接点，下层的线路板有金属在导通孔处从正面露出形成导通连接点，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板，缝隙与缝隙之间，有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属，与多张上层的单层线路板的背面或多张双层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，用SMT工艺贴焊包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，经焊接使上下两层线路板将导通连接点焊接在一起，形成了上下两层之间的导通，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
根据本发明还提供了一种间断分层的柔性叠层线路板灯带，包括：包含LED的元器件层；叠在上层的单层线路板或双层线路板；中间的胶粘剂层；叠在下层的单层线路板；其特征在于，所述的间断分层的柔性叠层线路板灯带的线路板，是由在上层的单层线路板或双层线路板，通过胶粘剂层粘接在下层的单层线路板上，形成的叠层线路板，或者是由多条单层线路板或双层线路板首尾排列，通过胶粘剂层，粘接在下层的单层线路板上形成的叠层线路板，叠层灯带线路板的所有上层线路板和下层线路板之间的粘接，是形成的局部多处胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，形成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板，所述的间断分层的柔性叠层灯带线路板，是由一条或多条线路板用胶粘剂间断粘接在下层的线路板上形成的叠层线路板，所述形成的叠层线路板是双层或者三层线路板，并且，上层线路板和下层单层线路板之间有形成互相导通的导通连接点，导通连接点在上层线路板的板边，上层线路板上的板边缘有多个金属连接点对位下层线路板上的多个金属连接点，或/和在 上层线路板的板中，设置有导通孔，导通孔边有上层线路板正面线路上的金属导通连接点，下层的线路板有金属在导通孔处形成导通连接点，并且已通过焊锡使上层导通连接点和下层导通连接点，已焊接连在了一起形成导通，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板，缝隙与缝隙之间，有胶将下层的单层线路板上的线路金属或/和线路上的绝缘非金属，与单条上层的线路板背面或多条上层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，所述灯带是焊接包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，形成一种间断分层的柔性叠层线路板灯带，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在上层的是双层线路板时，其双层线路之间互相导通的方式是，在设计的上下两层焊锡导通处用锡焊导通方式导通，或者是通过两层之间形成的通孔镀铜的方式导通，或者是用导电油墨导通。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的胶粘剂是可固化或已经形成固化的胶粘剂，或者是不干胶胶粘剂。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板是单层膜的线路板，承载线路的膜层，在叠层夹在线路板的板内在分层的一边，或者是膜层在叠层线路板的最下层全裸露在外，或者，所述的叠在下层的单层线路板是双层膜的线路板，两层膜夹着中间线路层。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板，是多条金属 线路并行排列的排线线路板，并行的排线是正负极电源线路，作用是用于为上层电路及元器件供电。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板，形成有多个切开的缝隙，形成的缝隙是在相邻两金属线路之间，便于灯带使用时多向转弯安装。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述叠在下层的单层线路板的线路金属是铜、或铝、或铝镀镍、或铝镀锡、或铝镀铜、或铜包铝。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，LED设置在正对分层结构的分层处，所述的LED灯带，在转弯处有LED灯时，转弯弯折不易造成LED灯珠脱离或断裂。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，灯带确设计制作成只在不含元件的位置转弯，转弯处是分层结构，焊接LED的焊盘设置在正对上下两层线路板之间的粘接处。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在上层的单层线路板或双层线路板，是含有多个周期的线路的线路板，每个周期的电路设计是相同的，当上层线路板设计有从头至尾的正负极电源主线时，上层线路板和下层线路板之间的导通连接点，设置在一个周期位置或者设置在多个周期位置，是在一个周期位置或者多个周期位置连接导通了上下两层电路，当上层线路板未设计从头至尾的电源主线时，上层线路板和下层线路板之间每个周期都设置有导通连接点，而且都已形成连接导通。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，上下两层线路板的导通，是上层线路板和下层路板之间在分层处的裸露金属形成的接触导通。
根据本发明的一优选实施例，所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述施加胶粘剂的施加方法是用印刷的方式施加胶粘剂、或者是用多头打胶机打胶的方式施加胶粘剂、或者是贴胶条。
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1为上层线路板，导通焊接位设置导通孔，导通孔边有露出的上层线路板的正面线路焊盘，下层的线路板有金属在导通孔处从正面露出形成焊点的平面示意图。
图2为上层线路板，两端的导通焊接位，在上层线路板的板边缘上有多个焊点对位下层线路板的多个焊点的平面示意图。
图3为在上层线路板的背面局部多处位置印刷胶粘剂后的平面示意图。
图4为背面下层的金属单层线路的平面示意图。
图5为设置有孔的膜，贴在背面下层的金属单层线路上，形成金属单层线路板的平面示意图。
图6为在金属单层线路板的相邻两电路之间，设置有多个缝隙的平面示意图。
图7为“图1”的上层线路板通过胶粘剂与下层的单层线路板贴合在一起，形成间断粘合，间断分层的结构的间断分层的柔性叠层灯带线路板的平面示意图。
图8为“图2”的上层线路板通过胶粘剂与下层的单层线路板贴合在一起，形成间断粘合，间断分层的结构的间断分层的柔性叠层灯 带线路板的平面示意图。
图9为多张上层线路板，首尾排列对位贴到下层线路板上的平面示意图。
图10为间断分层的柔性叠层灯带线路板，在导通孔位置处的截面示意图。
图11为间断分层的柔性叠层灯带线路板，在两端导通焊接位处的的截面示意图。
图12为将LED通过SMT贴装焊接在叠层灯带线路板上，制作成间断分层的柔性叠层线路板灯带的平面示意图。
图13为将LED通过SMT贴装焊接在叠层灯带线路板上，制作成间断分层的柔性叠层线路板灯带的截面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。
上层线路板的制作：
采用传统的线路板制作工艺，将单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、丝印正面油墨阻焊，露出电阻焊盘1.1a和LED灯焊盘1.1b，烘烤、印字符，烘烤固化、再用模具冲切出导通孔1.2a，导通孔1.2a的孔边有露出的上层线路板的正面线路焊盘1.3a，制作成如图1所示的上层单层线路板1，或者在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接焊点上，只露出一半上层线路的导通焊点1.3b，另一半形成孔1.2b，制作成如图2所示的上层单层线路板1，在此加工步骤中、图1、图2中标识1表示是单层线路板。
或者是将双面柔性覆铜板经钻孔、沉铜、镀铜、贴干膜、曝光显 景、蚀刻、退膜、丝印正面油墨阻焊，露出电阻焊盘1.1a和LED灯焊盘1.1b，烘烤、再丝印背面油墨阻焊，烘烤、字符，烘烤、再用模具冲切出导通孔1.2a，导通孔1.2a的孔边有露出的上层线路板的正面线路焊盘1.3a，制作成如图1所示的上层双层线路板1，或者在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接焊点上，只露出一半上层线路的导通焊点1.3b，另一半形成孔1.2b，制作成如图2所示的上层双层线路板1，在此加工步骤中、图1、图2中标识1表示是双层线路板。
根据设计的工程资料，在上层线路板1的背面的局部多处位置，用18T的丝网印胶，丝网是部分位置漏胶部分位置不漏胶，在丝印台上架上网框，对位后台面上装上定位钉，线路板背面朝上放置到台面上，定位钉进到定位孔里进行定位，胶加到网上面，印刷柔性板用的丙烯酸类胶粘剂2到板上多个预先设计的位置表面(如图3所示)，进入隧道炉120度经3分钟，加温挥发掉丙烯酸胶粘剂2中的溶剂。
背面下层金属单层线路板的制作：
采用传统的线路板制作工艺，将铜厚0.15mm的单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、制作出金属电路3.1(如图4所示)，再将设置有孔的PI覆盖膜，贴在金属电路3.1上，金属电路3.1从PI覆盖膜的孔中露出，再经压合烘烤，制作成下层金属单层线路板(如图5所示)，下层金属单层线路板的长度是0.5米至300米，在金属单层线路板上的相邻两电路3.1之间，用刀模冲切出多个缝隙3.2(如图6所示)，此缝隙3.2便于后序灯带多向转弯安装。
间断分层的柔性叠层灯带线路板的制作：
优选实施例(1)、单张上层线路板和下层的金属单层板的组合
用一带定位钉的模板，将0.5米长的下层的金属单层板3置于模板上，定位钉进到板的定位孔里，再将上层已印有胶粘剂2的单层板1、或者双层板1，胶粘剂2朝下叠到金属单层板3上，也使板上的定位钉进到定位孔里，使上下两层对准位置，此时，上层线路板1上的导通孔1.2a处露出了金属电路3.1，导通孔1.2a的边上有露出的上层线路板的正面线路焊盘1.3a，下层的线路板的金属电路3.1在导通孔1.2a处从正面露出(如图7、图10所示)，或者，在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接焊点上，只露出一半上层线路的导通焊点1.3b，下层的线路板的金属电路3.1在另一半孔1.2b处从正面露出(如图8、图11所示)，然后用熨斗加热到上层板上使传热到胶粘剂2层，让胶粘剂2层粘住上层线路板1，下层金属单层线路板3，把已叠好的板转到比昂快压机里，用150度，压力120KG，压1分钟，取出后再进入烤箱里，150度烤60分钟使胶固化，即制作完成间断分层的柔性叠层灯带线路板(如图7、图8、图10、图11所示)，专用于制作LED灯带。
优选实施例(2)、多张上层线路板和下层的金属单层板的组合
用一带定位钉的模板，将100米长的下层的金属单层板3的第一段置于模板上，定位钉进到板的定位孔里，再将第一张上层已印有胶粘剂2的单层板1、或者双层板1，胶粘剂2朝下叠到金属单层板3的第一段上，也使板上的定位钉进到定位孔里，使上下两层对准位置，此时，上层线路板1上的导通孔1.2a处露出了金属电路3.1，导通孔1.2a的边上有露出的上层线路板的正面线路焊盘1.3a，下层的线路板的金属电路3.1在导通孔1.2a处从正面露出(如图9、图10所示)，或者，在线路板两端，在导通焊接位处的焊盘上，缩短上层线路，使其在导通焊接焊点上，只露出一半上层线路的导通焊点1.3b，下层的线路板的金属电路3.1在另一半孔1.2b处从正面露出(如图9、图11 所示)，然后用熨斗加热到上层板上使传热到胶粘剂2层，让胶粘剂2层粘住上层线路板1，下层金属单层线路板3，接下来依次将第二、第三、第四张，直到最后一张上层已印有胶粘剂2的单层板1、或者双层板1，按照以上的方法，首尾排列对位贴到下层金属单层线路板3上，然后用比昂整卷快压机里，每段用150度，压力120KG，压1分钟的参数，依次逐段压合，再放入烤箱里，150度烤60分钟使胶固化，即制作完成间断分层的柔性叠层灯带线路板(如图7、图8、图10、图11所示)，专用于制作LED灯带。
间断分层的柔性叠层线路板灯的制作：
采用传统的SMT贴片工艺，在锡膏印刷机上，用钢网将锡膏印在间断分层的柔性叠层灯带线路板的LED灯珠焊盘1.1b和电阻焊盘1.1a上，然后用SMT贴片机分别将LED灯珠4.1和电阻4.2对应贴装到印了锡膏的焊盘上，过回流焊机焊接，将灯珠4.1和电阻4.2焊接到间断分层的柔性叠层灯带线路板的上层线路板1上，制成含多条灯带的连体灯带，再在分条机上分条，制成一种间断分层的柔性叠层线路板灯带(如图12、图13所示)，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
本发明将灯带线路板制作成间断分层的柔性叠层线路板，将正面焊元件的单层或者双层柔性线路板，在背面局部间断印刷胶粘剂，再与背面的金属单层线路板粘贴在一起，形成间断粘合，间断分层的结构，大大提高了灯带的耐弯折性，解决了灯带在安装使用时诸多因素导致的断板问题。
以上结合附图将一种间断分层的柔性叠层线路板灯带及制作方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员 应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本发明的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (14)

  1. 一种间断分层的柔性叠层线路板灯带的制作方法，具体而言，先制作完成一含多条灯带线路板的连体单层柔性线路板、或者一含多条灯带线路板的连体双层柔性线路板，用于叠层线路板的上层线路板，线路板正面用于焊元件，另外再制作一含多条连体的单层线路板，用于叠层线路板的下层线路板，施加中间层的胶粘剂在上层线路板的背面，或者施加在下层线路板的一面，施加完成后，线路板上是多个位置形成局部有胶粘剂，然后再将上层线路板对位贴到下层线路板上，或者先将上层线路板打孔后再对位贴到下层线路板上，施加压力压合使上下两层线路板牢固粘接在一起，制成间断分层的柔性叠层灯带线路板，叠层灯带线路板的上层线路板和下层线路板之间的粘接，是形成的局部多处胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，间断分层的柔性叠层灯带线路板，是由两片不同的线路板重叠用胶粘剂粘接在一起形成的叠层线路板，叠在上层的是单层线路板或双层线路板，两层线路板之间制作有互相导通的导通连接点，导通连接点在上层线路板的板边，上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点，或/和在上层线路板设置有导通孔，导通孔边有上层线路板正面线路上的连接点，下层的线路板上有金属在导通孔处形成连接点，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断分层缝隙的双层板或三层板，缝隙与缝隙之间，有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属，与上层的单层线路板的背面或双层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，用SMT工艺贴焊包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，通过焊接连接点将上下两层线路板连接导通，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，灯带因线路板是间 断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
  2. 一种间断分层的柔性叠层线路板灯带的制作方法，具体而言，先制作完成多张含多条灯带线路板的单层连体柔性线路板、或者制作多张含多条灯带线路板的双层连体的柔性线路板，用于叠层的上层线路板，线路板正面用于焊元件，另外再制作一含多条线路板的单层连体长线路板，用于叠层的下层线路板，施加胶粘剂在多张上层线路板的背面，或者施加在下层长线路板的一面，施加完成后，线路板上是多个位置形成局部有胶粘剂，然后将多张上层线路板，首尾排列对位贴到下层线路板上，或者先将多张上层线路板打孔后再首尾排列对位贴到下层线路板上，施加压力压合使上下两层线路板牢固粘接在一起，制成叠层灯带线路板，叠层灯带线路板各上层线路板和下层线路板之间的粘接，是形成的局部多处有胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，即制成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板，所制作完成的间断分层的柔性叠层灯带线路板，是由多张线路板首尾排列通过胶粘剂粘接在下层的一张长线路板形成的叠层线路板，叠在上层的是单层线路板或双层线路板，制作完成后的叠层线路板是双层或者三层线路板，并且，上层线路板和背面下层单层线路板之间有形成互相导通的导通连接点，导通连接点在上层线路板的板边，在上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点，或/和在上层线路板设置有导通孔，导通孔边有上层线路板的正面线路导通连接点，下层的线路板有金属在导通孔处从正面露出形成导通连接点，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板，缝隙与缝隙之间，有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属，与多张上层的单层线路板的背面或多张双层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，用 SMT工艺贴焊包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，经焊接使上下两层线路板将导通连接点焊接在一起，形成了上下两层之间的导通，制成含多条灯带的连体灯带，用分条机分条后，制成了一种间断分层的柔性叠层线路板灯带，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
  3. 一种间断分层的柔性叠层线路板灯带，包括：
    包含LED的元器件层；
    叠在上层的单层线路板或双层线路板；
    中间的胶粘剂层；
    叠在下层的单层线路板；
    其特征在于，所述的间断分层的柔性叠层线路板灯带的线路板，是由在上层的单层线路板或双层线路板，通过胶粘剂层粘接在下层的单层线路板上，形成的叠层线路板，或者是由多条单层线路板或双层线路板首尾排列，通过胶粘剂层，粘接在下层的单层线路板上形成的叠层线路板，叠层灯带线路板的所有上层线路板和下层线路板之间的粘接，是形成的局部多处胶粘剂的间断粘接，未粘接的多个位置是形成有分开的缝隙，形成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板，所述的间断分层的柔性叠层灯带线路板，是由一条或多条线路板用胶粘剂间断粘接在下层的线路板上形成的叠层线路板，所述形成的叠层线路板是双层或者三层线路板，并且，上层线路板和下层单层线路板之间有形成互相导通的导通连接点，导通连接点在上层线路板的板边，上层线路板上的板边缘有多个金属连接点对位下层线路板上的多个金属连接点，或/和在上层线路板的板中，设置有导通孔，导通孔边有上层线路板正面线路上的金属导通连接点，下层的线路板有金属在导通孔处形成导通连接点，并且已通过焊锡使上层导通连接点和下层导通连接点，已焊接连在了一起形成导通，所述的间断分层的柔性叠层灯带线路板，是在板内形成有多个间断的分层缝隙的双层 线路板或三层线路板，缝隙与缝隙之间，有胶将下层的单层线路板上的线路金属或/和线路上的绝缘非金属，与单条上层的线路板背面或多条上层线路板的背面形成粘接，并且形成的是多个位置的间断式粘接，下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度，所述灯带是焊接包含有LED灯的元器件在间断分层的柔性叠层灯带线路板上，形成一种间断分层的柔性叠层线路板灯带，灯带因线路板是间断式的分层结构，提高了耐弯折性，同时又有多个位置是间断式的层间叠层粘接，又保证了有相对牢固的整体结构。
  4. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在上层的是双层线路板时，其双层线路之间互相导通的方式是，在设计的上下两层焊锡导通处用锡焊导通方式导通，或者是通过两层之间形成的通孔镀铜的方式导通，或者是用导电油墨导通。
  5. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的胶粘剂是可固化或已经形成固化的胶粘剂，或者是不干胶胶粘剂。
  6. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板是单层膜的线路板，承载线路的膜层，在叠层夹在线路板的板内在分层的一边，或者是膜层在叠层线路板的最下层全裸露在外，或者，所述的叠在下层的单层线路板是双层膜的线路板，两层膜夹着中间线路层。
  7. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板，是多条金属线路并行排列的排线线路板，并行的排线是正负极电源线路，作用是用于为上层电路及元器件供电。
  8. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在下层的单层线路板，形成有多个切开的缝隙，形成的缝隙是在相邻两金属线路之间，便于灯带使用时 多向转弯安装。
  9. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述叠在下层的单层线路板的线路金属是铜、或铝、或铝镀镍、或铝镀锡、或铝镀铜、或铜包铝。
  10. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，LED设置在正对分层结构的分层处，所述的LED灯带，在转弯处有LED灯时，转弯弯折不易造成LED灯珠脱离或断裂。
  11. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，灯带确设计制作成只在不含元件的位置转弯，转弯处是分层结构，焊接LED的焊盘设置在正对上下两层线路板之间的粘接处。
  12. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述的叠在上层的单层线路板或双层线路板，是含有多个周期的线路的线路板，每个周期的电路设计是相同的，当上层线路板设计有从头至尾的正负极电源主线时，上层线路板和下层线路板之间的导通连接点，设置在一个周期位置或者设置在多个周期位置，是在一个周期位置或者多个周期位置连接导通了上下两层电路，当上层线路板未设计从头至尾的电源主线时，上层线路板和下层线路板之间每个周期都设置有导通连接点，而且都已形成连接导通。
  13. 根据权利要求1或2或3所述的一种间断分层的柔性叠层线路板灯带，其特征在于，上下两层线路板的导通，是上层线路板和下层路板之间在分层处的裸露金属形成的接触导通。
  14. 根据权利要求1或2所述的一种间断分层的柔性叠层线路板灯带，其特征在于，所述施加胶粘剂的施加方法是用印刷的方式施加胶粘剂、或者是用多头打胶机打胶的方式施加胶粘剂、或者是贴胶条。
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