WO2012009841A1 - 用热固胶膜粘接并置的扁平导线制作单面电路板 - Google Patents

用热固胶膜粘接并置的扁平导线制作单面电路板 Download PDF

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Publication number
WO2012009841A1
WO2012009841A1 PCT/CN2010/002147 CN2010002147W WO2012009841A1 WO 2012009841 A1 WO2012009841 A1 WO 2012009841A1 CN 2010002147 W CN2010002147 W CN 2010002147W WO 2012009841 A1 WO2012009841 A1 WO 2012009841A1
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WIPO (PCT)
Prior art keywords
circuit board
substrate
layer
film
flat
Prior art date
Application number
PCT/CN2010/002147
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English (en)
French (fr)
Inventor
王定锋
徐文红
Original Assignee
Wang Dingfeng
Xu Wenhong
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Application filed by Wang Dingfeng, Xu Wenhong filed Critical Wang Dingfeng
Publication of WO2012009841A1 publication Critical patent/WO2012009841A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the invention belongs to the circuit board industry, and directly bonds a set of juxtaposed flat wires with a thermosetting adhesive film, and the position where the flat wires need to be disconnected is cut off, and the film surface is directly combined with the circuit board substrate to form a circuit board by thermocompression bonding.
  • the solder mask ink or the cover film is used for the solder mask, and the bridge connection is made by printing a conductive ink or a soldering conductor to form a single-sided circuit board.
  • the present invention allows a circuit board to be fabricated without etching. Compared with the traditional circuit board, the invention is a very environmentally friendly, energy-saving and material-saving new technology. Background technique
  • the invention is based on the characteristics of a circuit board with a large amount of a large number of circuit tubes, and the flat conductors are directly used to produce a production circuit board, which can be used in the field of LEDs, and is widely used in various LED products. Low manufacturing costs, high efficiency, and environmentally friendly. Summary of the invention
  • the invention directly bonds a set of juxtaposed flat wires with a thermosetting adhesive film, and the position where the flat wires need to be disconnected is cut off, and the film surface is directly bonded with the circuit board substrate to form a circuit board by using a solder resist ink or
  • the cover film is used for solder masking, and the bridge connection is connected by printed conductive ink or soldered conductor.
  • it can be drilled directly by drilling holes in the solder joint position or by punching with a die.
  • the invention can produce a circuit board without chemical etching, and is a very environmentally-friendly, energy-saving and material-saving new technology compared with the conventional manufacturing circuit board.
  • the invention directly uses a thermosetting adhesive film to form a circuit board with a flat wire.
  • the circuit board substrate does not need a substrate with a glue, and only the thermosetting adhesive film is damaged at the opening of the cut flat wire, the circuit board Both the substrate and the solder resist layer were not damaged.
  • a method for fabricating a single-sided circuit board by bonding a parallel flat wire with a thermosetting adhesive film comprising: directly bonding a set of juxtaposed flat wires with a thermosetting adhesive film; and cutting the flat wire The position to be disconnected is required to form a conductive layer of the line; the side of the flat wire to which the thermosetting film is adhered is directly combined with the substrate of the single-sided circuit board; the solder resist is treated with a solder resist ink or a cover film And use printed conductive ink or soldered conductors to achieve bridge connection.
  • the jack member when it is desired to mount the jack member, it is drilled or punched directly at the location of the solder joint for insertion and soldering of the jack component.
  • thermosetting film only the flat wire and the thermosetting film are cut at the position where the cut flat wire is broken, and neither the substrate nor the cover film is damaged.
  • thermosetting adhesive film is a semi-cured epoxy glass fiber film of a low flow adhesive, or a thermosetting adhesive film for a flexible circuit board, or a high thermal conductive thermosetting adhesive film.
  • the single-sided circuit board fabricated by the above method is a flexible circuit board or a rigid circuit board.
  • the juxtaposed flat conductors are juxtaposed in parallel.
  • the invention also provides a single-sided circuit board produced by the method of any of the preceding claims.
  • the single-sided circuit board of the present invention is used for LED strips, LED lighting modules, LED guardrail tubes, LED neon lights, LED fluorescent tubes or LED Christmas lights.
  • the present invention also provides a patch type single-sided circuit board manufactured by using a thermosetting adhesive film to bond and align a flat wire, comprising:
  • thermosetting film (2) As a second layer of thermosetting film (2);
  • the invention also provides a plug-in type single-sided circuit board made by using a thermosetting adhesive film and a flat-conducting flat wire, comprising:
  • thermoset limb film (2) As a third layer of thermoset limb film (2);
  • the single-sided circuit board produced by the method of the present invention at the position of the cut-off opening of the flat wire, only the flat wire and the thermosetting film may be cut, and the substrate and the cover film are not damaged (as shown in FIG. 1a). .
  • the bridge connection can be connected by means of a conductive ink 17.
  • the bridge connection can be welded using conductors 9, 12.
  • the substrate may be an epoxy glass substrate, or a phenolic substrate, or a polyimide substrate, or a metal substrate with an insulating paste, or a ceramic substrate.
  • the flat wire may be a copper wire, a copper clad aluminum wire, a copper clad steel wire, a copper tinned wire, a copper nickel plated gold wire, an iron tinned wire, a steel tinned wire, or the like.
  • the method of cutting off the position of the flat wire to be broken may be die cutting with a die or by drilling and milling, or by laser cutting or cutting with a wire cutter.
  • the conductive ink may be a conductive metal ink such as conductive carbon oil or conductive silver oil or conductive copper oil.
  • the circuit board of the pin component may be drilled or punched out of the component pin hole directly at the solder joint position (as shown in FIG. 12B).
  • the single-sided circuit board is characterized by:
  • the width of the same flat wire can be the same.
  • the width of the different flat wires may be the same or different. All flat conductors are arranged side by side, preferably in parallel. According to the present invention, the flat wires in the single-sided circuit board are not formed by etching.
  • Figure 1 is a plan view and cross-sectional structural view of a circuit board.
  • Figure 2 is a schematic view of a cut flat conductor.
  • Figure 3 is a schematic view of a juxtaposed slot die.
  • Figure 4 is a cross-sectional view of a juxtaposed slot die.
  • Figure 5 is a parallel wire layout diagram of a flat wire.
  • Fig. 6 is a schematic view showing the vacuum suction fixing when the flat wires are juxtaposed.
  • Figure 7 is a schematic view of a juxtaposed flat wire affixed to a thermosetting adhesive film.
  • Figure 8 is a schematic illustration of the position at which the flat wire needs to be broken.
  • Figure 9 is a schematic view of the die-cut flattened wire which is put back into the groove of the juxtaposed mold and the other side of the release paper is torn off.
  • Fig. 10 is a schematic view showing the juxtaposed flat conductors pressed and bonded to an insulating substrate by a thermosetting adhesive film.
  • Figure 11 is a schematic view of a printed solder resist ink.
  • Figure 12 is a schematic view of the printed conductive ink.
  • Figure 13 is a schematic view of the hard-board soldered LED and its components.
  • Figure 14 is a schematic view of the flexible circuit board after the top and bottom cover films are attached.
  • Figure 15 is a schematic diagram of the flexible board after soldering the LED and its components.
  • Parallel groove mold making The mirrored stainless steel plate is etched or machined to form a juxtaposed groove 13 (Fig. 3) which is consistent with the line width, and the groove depth is shallower than the flat wire thickness (Fig. 3) As shown in Figure 4).
  • thermosetting film to tear off one side of the release paper and arrange the flattened flat wire fixed in the groove to the good position, pre-press with 120 ° C to 150 ° C for 5 to 20 seconds, fix the line, remove The slot mold is juxtaposed ( Figure 7).
  • Composite insulating substrate Put the punched flat wire back into the groove of the juxtaposed mold, tear off the release paper 15 on the other side (as shown in Figure 9), place the substrate on the top, and use Pre-pressing at 120 ° C to 150 ° C for 5 to 20 seconds, removing the juxtaposed slot mold, covering both the flat wire surface and the substrate surface
  • the upper layer of release film is heat-cured by Hengda's PCB press machine at 150 ° C to 180 ° C for 30 to 120 minutes to achieve curing bonding of flat wire, thermosetting film and substrate (Figure 10).
  • Parallel groove mold making The etched or machined method is used to process the juxtaposed groove with the line width (Fig. 3), and the groove depth is shallower than the thickness of the flat wire ( ; as shown in Figure 4).
  • Flat conductors are juxtaposed: Pre-designed and fabricated with a slotted mold that is consistent with the width of the wire.
  • the flat wires are placed side by side in the groove (see Figure 5).
  • the fixing is fixed by vacuum suction ( Figure 6). ).
  • thermosetting film to tear off one side of the release paper and arrange the flattened flat wire fixed in the groove to the good position, pre-press with 120 ° C to 150 ° C for 5 to 20 seconds, fix the line, remove The slot mold is juxtaposed ( Figure 7).

Description

用热固胶膜粘接并置的扁平导线制作单面电路板 技术领域
本发明属于电路板行业， 用热固胶膜直接粘接一组并置的扁平导 线， 切除扁平导线需要断开的位置， 胶膜面直接和电路板基材结合热 压粘接形成电路板， 用阻焊油墨或者是覆盖膜做阻焊， 过桥连接采用 印刷导电油墨或者焊接导体来连接的方法来制作单面电路板。 本发明 使得无需蚀刻就能制作电路板。 本发明与传统的制作电路板相比， 是 一种十分环保的、 节能的、 省材料的新技术。 背景技术
传统的电路板导线通常都是覆铜板蚀刻出线路， 或者是采取激光 和铣刀切割去除不需要的铜制出线路。 但是， 前者成本高且污染很严 重， 而后者效率太低， 无法大批量生产。
本发明是根据一些线路筒单用量大的电路板的特点直接采取并 置的扁平导线制作生产电路板，可以用于 LED领域， 而且广泛用于各 种 LED产品。 制造成本低、 效率高， 而且十分环保。 发明内容
本发明用热固胶膜直接粘接一组并置的扁平导线， 切除扁平导线 需要断开的位置， 胶膜面直接和电路板基材结合热压粘接形成电路 板， 用阻焊油墨或者是覆盖膜做阻焊， 过桥连接采用印刷导电油墨或 者焊接导体来连接。 当需要安装插孔元件时， 就直接在焊点位置上钻 孔或者用模具冲孔， 就可焊接安装。
本发明无需化学蚀刻就能制作电路板， 与传统的制作电路板相 比， 是一种十分环保的、 节能的、 省材料的新技术。 本发明直接用热 固胶膜并置扁平导线制作电路板， 其特点是， 电路板基材不需用带胶 的基材， 在切除扁平导线的开口处只有热固胶膜受到损伤， 电路板基 材和阻焊层均未受到损伤。 确认本 根据本发明，提供了一种用热固胶膜粘接并置的扁平导线来制作 单面电路板的方法， 包括：用热固胶膜直接粘接一组并置的扁平导线； 切除扁平导线需要断开的位置， 以形成线路导电层； 将扁平导线的粘 有热固胶膜的那一面直接和单面电路板的基材热压结合； 用阻焊油墨 或者是覆盖膜进行阻焊处理； 并且采用印刷导电油墨或者焊接导体来 实现过桥连接。
根据本发明的一优选实施例， 当需要安装插孔元件时， 直接在焊 点位置上钻孔或者冲孔， 以进行插孔元件的插装和焊接。
根据本发明的另一优选实施例， 切除扁平导线断开的位置处只是 扁平导线和热固胶膜被切断， 基材和覆盖膜均未受到损伤。
根据本发明的另一优选实施例， 所迷热固胶膜是低流量胶的半固 化环氧玻纤胶膜、或者是软性线路板用的热固胶膜、高导热热固胶膜。
根据本发明的另一优选实施例， 上述方法制作的单面电路板是柔 性电路板或者是刚性电路板。
根据本发明的另一优选实施例， 所迷并置的扁平导线是平行地并 置的。
本发明还提供了一种采用上述权利要求中任一项所述的方法制 作的单面电路板。
根据本发明的另一优选实施例， 本发明的单面电路板用于 LED 灯带， LED发光模组、 LED护栏管、 LED霓虹灯、 LED 日光灯管或 LED圣诞灯。
本发明还提供了一种采用热固胶膜粘接并置的扁平导线制作的 贴片型单面电路板， 包括：
作为第一层的基材 (1);
作为第二层的热固胶膜 (2)；
作为第三层的线路导电层 (7);
作为第四层的阻焊层 (6); 和
作为第五层的元件及短接导电层 (5， 8, 9)。 本发明还提供了一种采用热固胶膜粘接并置的扁平导线制作的 插件型单面电路板， 包括：
作为第一层的元件及短接导电层 (10, 11, 12);
作为第二层的基材 (1);
作为第三层的热固肢膜 (2);
作为第四层的线路导电层 (7); 和
作为第五层的阻焊层 (6)。
根据本发明的方法生产的单面电路板， 在扁平导线的切断开口位 置处， 可以只是扁平导线和热固胶膜被切断， 基材和覆盖膜均未受到 损伤 (；如图 la所示)。
根据本发明， 所述的过桥连接可以采用导电油墨 17连接。
根据本发明， 所述的过桥连接可以釆用导体 9、 12焊接。
根据本发明， 所述的基材可以是环氧玻纤基材、 或酚醛基材、 或 聚酰亚胺基材、 或带绝缘胶的金属基材、 或陶瓷基材。
根据本发明，所述的扁平导线可以为铜线、铜包铝线、铜包钢线、 铜镀锡线、 铜镀镍金线、 铁镀锡线、 钢镀锡线等。
根据本发明，切除需要断开的扁平导线位置的方法可以是用模具 冲切、 或者用钻孔钻铣的方式切除， 或者用激光切除、 或者用线切割 机切除。
根据本发明， 所述的导电油墨可以是导电碳油或者导电银油或者 导电铜油等导电金属油墨。
根据本发明， 所述的插脚元件的电路板可以是直接在焊点位置钻 出或冲出元件插脚孔 (如图 12B)
根据本发明， 所述的单面电路板， 其特点是：
同一条扁平导线的宽度可以是一样的。
不同的扁平导线的宽度可以相同， 也可以不相同。 所有的扁平导线都是并置布置的， 优选是平行布置。 根据本发明， 所述的单面电路板里的扁平导线， 都不是用蚀刻的 方式做出来的。 附图说明
通过结合以下附图阅读本说明书， 本发明的特征、 目的和优点将 变得更加显而易见， 在附图中：
图 1为电路板的平面结构和横截面结构图。
图 2为切割制作的扁平导线的示意图。
图 3为并置槽模具的示意图。
图 4为并置槽模具的横截面图。
图 5为扁平导线并置布线图。
图 6为扁平导线并置布置时抽真空吸气固定的示意图。
图 7为并置扁平线假贴在热固胶膜上的示意图。
图 8为切除掉扁平导线需要断开的位置的示意图。
图 9为冲切好的扁平导线又放回并置模具的槽里， 撕掉另一面的 离型纸的示意图。
图 10为并置扁平导线用热固胶膜压合粘贴在绝缘基板上的示意 图。
图 11为印刷阻焊油墨的示意图。
图 12为印刷导电油墨后的示意图。
图 13为硬板焊接 LED及其元件后的示意图。
图 14为软性电路板贴上顶面和底面覆盖膜后的示意图。
图 15为软性电路板焊接 LED及其元件后的示意图。
部件标号
1 基材； 2 热固胶膜； 3 电源焊接点； 4、 锡焊； 5、 贴片 LED; 8、 贴片电阻； 9、 贴片过桥导体； 5、 8， 9、 是贴片电路板的贴片 元件及短接导电层； 10、 插件电阻； 11、 插件 LED; 12、 插件过桥 导体； 10， 11， 12、 是插件电路板的的插件元件及短接导电层； 6阻 焊层； 7、 扁平导线制成的线路导电层； 13 平行沟槽； 14抽吸管； 15、 离型纸； 16 切除口； 17 印刷的导电油墨 具体实施方式
下面将对本发明用热固胶膜粘接并置的扁平导线制作单面电路 板的具体实施例进行更详细的描述。
但是， 本领域技术人员应当理解， 以下所述仅是举例说明和描述 一些优选实施方式， 其它一些类似的或等同的实施方式同样也可以用 来实施本发明。
(一） 刚性电路板的制作
1.扁平导线的制作， 釆取铜箔分条切割制作、 或者是用导线压延 机压延铜线制作、 或者是一定宽度和厚度的扁平导线 7(如图 2)。
2.并置槽模具制作：用镜面不锈刚板采用蚀刻或机械加工的方法， 加工出与线路宽度一致的并置沟槽 13(如图 3)， 沟槽深度比扁平导线 厚度浅一些 (如图 4)。
3.扁平导线并置布置： 预先设计制作好具有与扁平导线宽度一致 的并置槽模具，把扁平导线并置布置固定在槽里 (如图 5), 固定通过抽 吸管 14釆用抽真空吸气固定 (如图 6所示)。
4、 用热固胶膜撕掉一面的离型纸和布置固定在槽里的并置的扁 平导线对好位， 用 120°C至 150°C预压 5至 20秒， 固定线路， 拿掉并 置槽模具 (如图 7)。
5、 用模具沖切除掉扁平导线需要断开的位置， 同时热固胶膜与 之相对应的位置也被沖切掉一个相同大小的窗口（如图 8)。
6、 复合绝缘基材： 将沖切好的扁平导线又放回并置模具的槽里， 撕掉另一面的离型纸 15(如图 9)，把基材对准位放在上面，用 120°C至 150°C预压 5至 20秒， 拿掉并置槽模具， 在扁平导线面和基材面都盖 上一层离型膜， 用恒达的 PCB压合机 150°C至 180°C 30至 120分钟 热压， 实现扁平导线、 热固胶膜和基材的固化粘合（如图 10)。
7、 在扁平导线面印刷阻焊油墨并曝光显影、 固化 （如图 11)。
8、 印刷过桥连接导电油墨 17， 120°C至 16CTC固化 45分钟至 90 分钟 (如图 12)。
9、 印刷文字， 用 120°C至 160°C固化 30分钟至 60分钟。
10、 对焊点进行 OSP处理
11、焊接 LED及其它元件 (如图 13)。
11.外型分切， 采取椤或者 V-CUT, 完成制作。
(二）软性电路板的制作
1.扁平导线制作， 釆取铜箔分条切割制作或者是用扁平导线压延 机压延铜线或一定宽度和厚度的扁平导线 (如图 2)。
2.并置槽模具制作：用光面不锈刚板采用蚀刻或机械加工的方法， 加工出与线路宽度一致的并置沟槽 (如图 3),沟槽深度比扁平导线厚度 浅一些 (；如图 4)。
3. 扁平导线并置布置： 预先设计制作好具有与导线宽度一致的 并置槽模具，把扁平导线并置布置固定在槽里 (如图 5)， 固定采用抽真 空吸气固定 (如图 6)。
4、 用热固胶膜撕掉一面的离型纸和布置固定在槽里的并置的扁 平导线对好位， 用 120°C至 150°C预压 5至 20秒， 固定线路， 拿掉并 置槽模具 (如图 7)。
5、 用模具冲切除掉扁平导线需要断开的位置， 同时热固胶膜与 之相对应的位置也被冲切掉一个相同大小的窗口（如图 8)。
6、 将冲切好的扁平导线又放回并置模具的槽里， 撕掉另一面的 离型纸 15(如图 9), 把底面覆盖膜对准位放在上面， 用 120°C至 150°C 预压 5至 20秒， 拿掉并置槽模具， 用开有焊盘窗口的顶面覆盖膜对 准位贴在并置的扁平导线上， 用 12CTC至 150°C预压 5至 20秒， 在顶 面覆盖膜和覆盖膜面都覆上一层离型膜， 用 15(TC至 180°C 90秒至 180秒热压，再用烤箱 150°C至 16(TC固化 30分钟至 60分钟 (如图 14)。
7、 印刷文字， 用 120°C至 16(TC固化 30分钟至 60分钟。
8、 对焊点进行 OSP处理。
9、 焊接元件及过桥连接导体 (如图 15)。
10、 用刀模分切或所需单件产品 (如图 1)。
以上结合附图将方法具体实施例对本发明进行了详细的描述。但 是， 本领域技术人员应当理解， 以上所述仅仅是举例说明和描述一些 具体实施方式， 对本发明的范围， 尤其是权利要求的范围， 并不具有 任何限制。

Claims

权 利 要 求 书
1、 一种用热固胶膜粘接并置的扁平导线来制作单面电路板的方 法， 包括：
用热固胶膜直接粘接一组并置的扁平导线；
切除扁平导线需要断开的位置， 以形成线路导电层；
将扁平导线的粘有热固胶膜的那一面直接和单面电路板的基材 热压结合；
用阻焊油墨或者是覆盖膜进行阻焊处理； 并且
釆用印刷导电油墨或者焊接导体来实现过桥连接， 在焊点位置安 装悍接电子元器件。
2、 根据权利要求 1所述的方法， 其特征在于， 当需要安装插孔 元件时， 直接在焊点位置上钻孔或者沖孔， 以进行插孔元件的插装和 焊接。
3、 根据上述权利要求中任一项所述的方法， 其特征在于， 切除 扁平导线断开的位置处只是扁平导线和热固胶膜被切断， 基材和覆盖 膜均未受到损伤。
4、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述 热固胶膜是低流量胶的半固化环氧玻纤胶膜、 或者是软性线路板用的 热固胶膜、 或者是高导热热固胶膜。
5、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述 方法制作的单面电路板是柔性电路板或者是刚性电路板。
6、 根据上述权利要求中任一项所迷的方法， 其特征在于： 所述 并置的扁平导线是平行地并置的。
7、 一种采用上述权利要求中任一项所述的方法制作的单面电路 板。
8、 根据权利要求 7所述的单面电路板， 其特征在于， 所述单面 电路板用于 LED灯带， LED发光模组、 LED护栏管、 LED霓虹灯、 LED日光灯管或 LED圣诞灯。
9、 一种采用热固胶膜粘接并置的扁平导线制作的贴片型单面电 路板， 包括：
作为第一层的基材 (1);
作为第二层的热固胶膜 (2);
作为第三层的线路导电层 (7);
作为第四层的阻焊层 (6); 和
作为第五层的元件及短接导电层 (5, 8, 9);
其中， 所述基材是环氧玻纤基材、 酚醛基材、 聚酰亚胺基材、 带 绝缘胶的金属基材或陶瓷基材。
10、一种采用热固胶膜粘接并置的扁平导线制作的插件型单面电 路板， 包括：
作为第一层的元件及短接导电层 (10, 11, 12);
作为第二层的基材 (1);
作为第三层的热固胶膜 (2);
作为第四层的线路导电层 (7); 和
作为第五层的阻焊层 (6);
其中， 所述基材是环氧玻纤基材、 酚醛基材、 聚酰亚胺基材、 带 绝缘胶的金属基材或陶瓷基材。
PCT/CN2010/002147 2010-07-20 2010-12-24 用热固胶膜粘接并置的扁平导线制作单面电路板 WO2012009841A1 (zh)

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