WO2011060604A1 - 双面线路板及其互连导通方法 - Google Patents

双面线路板及其互连导通方法 Download PDF

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Publication number
WO2011060604A1
WO2011060604A1 PCT/CN2010/000703 CN2010000703W WO2011060604A1 WO 2011060604 A1 WO2011060604 A1 WO 2011060604A1 CN 2010000703 W CN2010000703 W CN 2010000703W WO 2011060604 A1 WO2011060604 A1 WO 2011060604A1
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Prior art keywords
layer
double
sided
copper
hole
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PCT/CN2010/000703
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English (en)
French (fr)
Inventor
王定锋
张平
Original Assignee
Wang Dingfeng
Zhang Joepeen
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Application filed by Wang Dingfeng, Zhang Joepeen filed Critical Wang Dingfeng
Publication of WO2011060604A1 publication Critical patent/WO2011060604A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Definitions

  • Double-sided circuit board and its interconnection conduction method Double-sided circuit board and its interconnection conduction method
  • the present invention relates to the field of printed wiring boards, and more particularly to a method of interconnecting and conducting a double-sided wiring board and a double-sided wiring board thus produced.
  • DETAILED DESCRIPTION OF THE INVENTION The present invention specifically discloses the formation of vias in a non-chemical manner that does not require the use of drill holes and copper plating, which is more convenient for making continuous rolls of double-sided strip tape boards. Background technique
  • the mechanical via hole or the laser drilling method is generally used to drill the line via hole on the copper clad plate, and then the electroless copper plating process is used to make the double-sided printed circuit board
  • the inner wall of the through hole forms a conductive layer.
  • a blind hole is formed by laser drilling first, and then a copper thick through hole conduction process is added by black hole or electroless plating. This method requires electroplating and electroless plating, which causes serious pollution to the environment.
  • the conventional double-sided printed circuit that does not require copper-plated copper-plated double-sided conduction usually adopts carbon oil filling or silver slurry filling to form a conduction mode, which has obvious disadvantages.
  • the cost of carbon oil filling is low, but due to carbon
  • the oil resistance is large and the conductivity is poor; while the silver paste is well conductive, but the price of the silver paste is very expensive and is not suitable for mass production.
  • the mechanical drilling machine and the laser drilling machine in the traditional manufacturing process are expensive, the drilling speed is slow, and the production efficiency is low.
  • the mechanical drilling machine is a flat drilling, its table top is about 635 X 762mm, so the largest board that can be produced is about 635 x 762mm, and it can't produce more than 762mm board.
  • LED lights With the increasingly urgent need for ultra-long circuit boards larger than 762mm, even reaching a length of more than 100 meters, the traditional drilling method to make through holes is increasingly unable to meet the needs of technological development.
  • a large amount of phenolic tree cover and a wood fiber bottom plate are consumed during mechanical drilling.
  • the laser drilling machine vaporizes the insulating polymer resin of the printed circuit board into the air after high temperature burning, which is not conducive to environmental protection.
  • a method for interconnecting a double-sided circuit board which is die-cut into a hole by a die instead of a conventional mechanical drilling and laser drilling, and a chemical treatment process such as reducing copper copper plating to reduce waste water discharge Compared with the conventional process and printed circuit board configuration, the process of the invention not only reduces the production cost, but also improves the reliability and quality of the process and the final product, greatly improves the production efficiency, and importantly, the process can be realized.
  • the continuous uninterrupted via hole of the circuit board is made into a hole, which causes a revolution in the length limitation of the printed circuit board, and the process reduces the consumption of polymer contaminants caused by the drilling, and reduces the copper plating process. It is environmentally friendly to reduce and eliminate the environmental pollution caused by existing drilling, copper and copper plating processes. Compared with the traditional carbon oil and silver paste filling method, the conductive performance is good and the production cost is low.
  • the double-sided printed wiring board of the hole type structure is not completely penetrated at the hole position, the printed wiring board is not easily broken near the through hole, and the conventional printed circuit board is easily broken at the hole position. It is also another advantage of the present invention.
  • a double-sided copper clad laminate having a concave hole type is disclosed, which is a thermosetting adhesive coated on a copper-free surface using a single-sided copper clad plate, and is pressed against another layer of copper foil after punching. Together, a double-sided copper clad plate with a recessed hole is formed.
  • the invention also discloses that after the circuit board is formed by the conventional circuit board manufacturing method by using the copper-clad board of the hole type, the copper top of the hole is pressed to be flush with the upper copper surface or nearly flush with the upper layer, and the upper layer is Copper contact.
  • solder paste is also printed on the hole, and the copper is passed through the solder while the component is soldered.
  • the hole is welded and connected well.
  • the recessed hole is formed by punching a thermosetting glue with a single-sided copper clad laminate, punching it with a mold, and then compounding it with another layer of copper foil.
  • thermoset is an acrylate or epoxy type thermoset.
  • the copper is a pure copper foil or alloy copper having a certain ductility and a thickness of 0.012 - 0.5 mm.
  • the die punching hole when the above-mentioned double-sided copper plate having a recessed hole type is used, the die punching hole is characterized in that the punching hole causes the top copper surface to form a trapped front, which is convenient for topping up. Copper contact.
  • the copper bottom of the recessed hole is aligned to the top copper surface and contacts the top copper indentation front to achieve a solder paste reflow solder joint.
  • the above-mentioned aperture type double-sided printed wiring board is characterized in that the through hole is not bored and copper-plated, and copper plating is performed to realize conduction of the wiring layer.
  • the through hole is punched out by a through hole.
  • the recessed hole needs to be punched by a bump die to push the copper of the bottom of the recessed hole to the recessed hole, in alignment with and in contact with the top layer of copper.
  • the above-described hole structure double-sided printed wiring board is characterized in that the through hole can be continuously die-cut to form a printed wiring board having a length of 1 m or more.
  • the above-mentioned recessed type double-sided printed wiring board is a double-sided printed wiring board.
  • the circuit layer is a copper foil.
  • the pressing is performed by means of an adhesive.
  • the conduction of the wiring layer is printed with solder paste together when soldering the component, and the solder paste is cured by reflow soldering to achieve conductive connection.
  • a recessed double-sided printed wiring board is used for fabrication LED light strip.
  • the recessed double-sided printed wiring board is a continuous full-length long circuit board.
  • the punching and pressing of the die are carried out by means of continuous punching or continuous pressing.
  • the interconnecting method of the double-sided wiring board is characterized in that the method does not use a chemical treatment to make the holes conductive.
  • the invention additionally includes the following specific technical solutions.
  • a method of interconnecting and conducting a double-sided wiring board comprising: providing a double-sided wiring board with holes; filling a solder paste in the holes by soldering, and making the double-sided wiring The top and bottom circuit layers of the board are interconnected.
  • the solder paste is an SMT solder paste
  • the soldering is performed by a printing reflow process
  • the double-sided wiring board is interconnected at a position of the hole.
  • the double-sided circuit board is a double-sided copper clad laminate having a bottom copper layer and a top copper layer, wherein the hole penetrates the top copper layer of the double-sided copper clad plate, but does not pass through The bottom copper layer of the double-sided circuit board, the method further comprising: topping a bottom copper layer of the double-sided copper clad plate at the hole position to be flush with or nearly flush with the top copper layer; The position is printed with solder paste by SMT method, and the bottom copper layer is soldered and interconnected by reflow soldering.
  • the double-sided copper clad laminate is a double-sided cover which is formed by punching a thermosetting adhesive with a single-sided copper clad laminate and then punching with another layer of copper foil by thermosetting adhesive bonding. Copper plate.
  • thermoset adhesive is of the acrylate type or of the epoxy type.
  • solder paste is printed at the position of the hole, and the bottom is connected by soldering while reflowing the soldering element.
  • Copper layer and top copper layer are thick.
  • the bottom copper layer or the top copper layer is thick
  • the punching is punching with a die, and when punched, the top copper layer is formed into a trapped inset in the hole. .
  • the bottom copper layer is brought into contact with a batch front of the indentation of the top copper layer.
  • no chemical treatment is used in the method to turn the holes on.
  • the punching and the top hole are formed by a mold, and the die punching and the die top hole are performed by continuous punching.
  • the present invention also provides a double-sided wiring board comprising: a top wiring layer (1); a first bonding layer ( 2 ); an insulating film layer (3); a second bonding layer ( 4 ); a bottom wiring layer ( And a hole disposed in the double-sided wiring board; wherein the top wiring layer (1) is bonded to one side of the insulating film layer (3) via the first adhesive layer (2), and The bottom wiring layer (5) is bonded to the opposite side of the insulating film layer (3) via the second adhesive layer (4); and the hole passes through the top wiring layer (1), the first adhesive layer (2) And an insulating film layer (3) and a second adhesive layer (4); the holes are filled with a solder paste to interconnect the top wiring layer (1) and the bottom wiring layer (5).
  • the double-sided circuit board is a double-sided flexible circuit board: wherein the bottom wiring layer (5) of the hole position is topped to be flush with the copper layer of the top circuit layer (1) Or nearly flush; and, the solder paste is printed by SMT at the location of the hole, and the bottom wiring layer (5) is soldered to the top wiring layer (1) by reflow soldering.
  • the double-sided circuit board is a double-sided copper clad laminate in which the top wiring layer (1) and the bottom wiring layer (5) are copper layers, and the double-sided copper clad laminate is covered by a single surface After the copper plate is coated with the thermosetting glue, it is punched, and then bonded with another layer of copper foil by thermosetting glue.
  • the bottom wiring layer (5) is brought into contact with a batch front of the indentation of the top wiring layer (1).
  • the present invention also provides an LED light strip comprising a double-sided line according to the above The board and the LEDs mounted thereon.
  • Figure 1 is a partial cross-sectional view showing a double-sided printed wiring board of the related art, showing a through hole formed by a conventional wiring board which has been subjected to conductive electroless copper plating;
  • Figure 2 shows the construction of a single-sided copper clad laminate
  • Figure 3 shows the structure after attaching the thermosetting adhesive tape to the single-sided copper clad laminate.
  • Figure 4 shows the structure in which the via holes are punched out by means of die punching.
  • Figure 5 shows the pure copper.
  • the foil is formed by lamination and adhesive lamination to form a double-sided circuit board;
  • Figure 6 shows a configuration in which a pure copper foil at the bottom of the recessed hole is punched by a convex top mold to the vicinity of the recess of the first layer of the wiring layer;
  • Fig. 7 is a view showing a structure in which a solder paste is cured by reflow soldering and a double-sided circuit of a double-sided wiring board is turned on after the solder paste is printed, according to an embodiment of the present invention.
  • a single-sided copper clad laminate having a thickness of the coiled copper foil 1 as shown in FIG. 2 of preferably 12.5 to 35 ⁇ m, a thickness of the adhesive 2 preferably 12.5 to 25 ⁇ m, and a thickness of the insulating film 3 of preferably 12.5 to 25 ⁇ m is On the hakut mach 630 laminator, take 120-150.
  • C a pressure of 5 - 8 kg / cm 2 and a speed of 0.8 - 1.0 m / min, pressed together with the thermosetting film 4, thereby forming a structure as shown in FIG.
  • the coating and drying production equipment is used to apply a liquid thermosetting glue on the copper-free insulating layer of the single-sided copper clad laminate.
  • the copper-clad sheet of the structure shown in Figure 3 was punched through the copper-faced punching machine through the through-hole mold made by the engineering department according to the customer's circuit design data in advance on the Ningbo Ou Tai CH1-25 25-ton punching machine.
  • the copper surface forms a trapped peak that facilitates contact with the copper surface of the top.
  • a structure is obtained in which a through hole is formed through a copper foil 1, an adhesive 2, an insulating film 3, and a thermosetting adhesive film 4 as shown in FIG. 4, wherein a peak of the copper foil surface is immersed downward into the hole wall, As shown in Figure 4. Subsequently, the structure shown in Fig.
  • the completed circuit board passes through Ningbo Ou Tai CH1-25 type 25-ton punching machine.
  • the top hole mold made by the engineering department according to the customer's circuit design data in advance, adopts the pipe position positioning method to push the bottom of the concave hole to the top.
  • the top copper faces are flush and contact the top copper indentation front to facilitate subsequent solder paste reflow soldering connections.
  • the indented front is, for example, the portion of the copper foil 1 that is trapped in the hole. 5.
  • the soldering paste is printed on the circuit board shown in FIG. 6 while the solder paste is printed on the SMT, and a layer of solder paste is printed on the aperture, and then the components are attached to the above-mentioned circuit board through an automatic mounter, and are reflowed. After the 5th step of 275 degree curing, the hole solder paste is cured at the same time, and the structure shown in Fig. 7 is obtained. Therefore, the conduction of the two sides of the circuit layer is realized while the components are soldered. Since the above SMT process belongs to the conventional component attaching process, it is well known to those skilled in the art and will not be described in detail herein.
  • the wiring layer is a copper foil
  • the wiring layer can also be made of other metals or alloys having sufficient ductility.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

双面线路板及其互连导通方法 技术领域
本发明涉及印刷线路板的领域， 具体涉及双面线路板的互连导通 方法以及由此制成的双面线路板。 本发明具体披露了无需采用钻孔和 无需沉铜镀铜的非化学方式形成导通孔， 此方法更加便利于制作连续 整卷的双面灯带线路板。 背景技术
在传统的双面线路板的制造工艺中， 一般均采用机械钻孔或者是 激光钻孔的方式在覆铜板上钻出线路过孔， 然后通过化学镀铜工艺来 使双面印刷线路板上的通孔内壁形成导电层， 传统盲孔型线路板的生 产工艺中， 采用先激光钻孔形成盲孔， 然后通过黑孔化或化学镀后再 电镀增加铜厚的通孔导电化处理工艺。 此方法由子需要电镀和化学 镀， 对环境造成严重污染。
而传统的无需沉铜镀铜的双面印刷线路两面导通通常采用的碳 油灌孔或银浆灌孔形成导通方式， 均有其明显的缺点， 碳油灌孔成本 低， 但是由于碳油电阻大， 导电效果差； 而银浆灌孔导电效果好， 但 银浆的价格非常的昂贵， 不适合大量生产。
同时， 传统的制作工艺中机械钻孔机和激光钻孔机， 造价昂贵， 钻孔速度慢， 生产效率低。 并且由于机械钻孔机是平面钻孔， 其台面 为 635 X 762mm左右， 因此能生产的最大板为 635 x 762mm左右， 不 能生产大于 762mm的板， 而随着现今 LED行业的不断发展， LED灯 带越来越迫切需要大于 762mm的超长线路板， 甚至达到 100米以上 的长度， 因此传统的钻孔方式制作导通孔越来越无法满足科技发展的 需要。 而且机械钻孔时还会消耗大量的酚醛树枝盖板和木质纤维底 板， 激光钻孔机在高温灼烧后将印刷线路板的绝缘高分子树脂气化排 到空气中， 不利于环境保护。
确认本 因此， 需要一种能够提高生产效率，速度快，可以实现连续.生产， 而且便宜的工艺替代现有的钻孔成孔方式， 及为了响应国家对于节能 减排的号召， 减少化学方式制作工艺， 以便能够克服上述工艺的缺陷 和不足， 并且能够消除钻孔物料对环境的污染问题。 发明内容
根据本发明， 涉及一种用模具沖切成孔替代传统的机械钻孔和激 光钻孔的双面线路板的互连导通方法， 及减少沉铜镀铜等化学处理工 艺， 减少废水排放。 与传统的工艺和印刷线路板构造相比， 本发明的 工艺不仅降低了生产成本， 提高了工艺过程和最终产品的可靠性和质 量, 大大提高了生产效率， 而且重要的是， 此工艺可以实现线路板的 连续不间断的导通孔成孔制作， 从而引发印刷线路板制作长度限制的 革命， 并且这种工艺减少了钻孔带来的高分子污染物的消耗， 和减少 沉铜镀铜工序制作， 减少了线路板制作工艺中的化学废水排放， 是环 保的， 能够基本上避免和消除现有钻孔、 沉铜、 镀铜工艺所带来的环 境污染问题。而和传统的碳油、银浆灌孔方式制作导通线路的方法比， 其导电性能好， 生产成本低。
不仅如此， 由于这种孔型结构双面印刷线路板在孔位不是完全贯 通的， 因此这种印刷线路板不易在通孔附近折断， 而传统的技术中印 刷线路板易于在孔位置折断， 这也是本发明的另外一个优点。
根据本发明的一方面，披露了一种具有凹孔型的双面覆铜板的制 作， 是采用单面覆铜板在无铜面涂热固胶粘剂， 沖孔后与另一层铜箔 压合在一起形成带有凹孔的双面覆铜板。
本发明还披露了用这种 孔型的覆铜板通过常规线路板制作方 式完成电路板制作后， 用模具冲压使孔位底铜顶至和上层铜面相齐或 者接近平齐， 并和上层面的铜接触。
根据本发明的一个重要特征， 披露了在 SMT元件焊接的同时， 在孔位也印上锡膏， 通过回流焊在元件焊接好的同时也把两面铜通过 孔位焊接连通好。
根据本发明的一个优选实施例， 上述凹孔是用单面覆铜板覆热 固胶后用模具冲孔， 然后和另一层铜箔复合而成。
根据本发明的一个优选实施例， 上述热固胶是丙烯酸酯类的或者 是环氧类型的热固胶。
根据本发明的一个优选实施例 , 上述的铜 是具有一定延展性的 纯铜箔或者是合金铜， 厚度为 0.012-0.5mm厚。
根据本发明的一个优选实施例， 上述的制作凹孔型的双面铜板 时， 用的模具冲孔， 其特征在于沖孔时使顶层铜面形成内陷的批锋， 便于和往上顶的铜面接触。
根据本发明的一个优选实施例， 上述的凹孔底铜顶至与顶铜面相 齐， 并接触顶铜内陷批锋处， 达成用锡膏回流焊接连接。
根据本发明的一个优选实施例， 上述的孔型双面印刷线路板， 其 特征在于， 所述通孔不经过钻孔成孔和沉铜、 镀铜实现线路层导通。
根据本发明的一个优选实施例， 上述通孔是采用模具将通孔沖 出。
根据本发明的一个优选实施例， 上述凹孔需要采用凸点模具用沖 压的方式将凹孔孔底的铜顶至凹孔孔口， 与顶层铜相齐并接触。
根据本发明的一个优选实施例， 上述的孔结构双面印刷线路板， 其特征在于， 所述通孔可以连续沖切来制作长度在 1米以上的印刷线 路板。
根据本发明的一个优选实施例， 上述凹孔型双面印刷线路板为双 面印刷线路板。
根据本发明的另一优选实施例， 上述线路层为铜箔。
根据本发明的一种优选实施例， 压合是采用粘合剂进行粘合。 根据本发明的另一优选实施例， 线路层的导通在焊接元件时一同 印刷上锡膏， 经回流焊后锡膏固化来实现导电连通
根据本发明的另一优选实施例， 凹孔型双面印刷线路板用于制作 LED灯带。
根据本发明的另一优选实施例， 凹孔型双面印刷线路板是连续整 卷的长线路板。
根据本发明的另一优选实施例， 用模具沖孔和顶压是通过连续冲 孔方式或连续压的方式进行的。
根据本发明的另一优选实施例， 所述的双面线路板的互连导通方 法， 其特征在于所述的方法不再使用化学处理使孔导通。
本发明另外还包括如下的具体技术方案。
根据本发明， 提供了一种双面线路板的互连导通方法， 包括： 提供带孔的双面线路板； 在所述孔中用锡焊方式填充锡膏， 而使 所述双面线路板的顶部线路层和底部线路层互连导通。
根据本发明的另一实施方式， 所述锡膏是 SMT锡膏， 并且所述 锡焊采用印刷回流焊工艺， 而使所述双面线路板在所述孔的位置互连 导通。
根据本发明的另一实施方式， 所述双面线路板是具有底铜层和顶 铜层的双面覆铜板， 其中， 所述孔穿通所述双面覆铜板的顶铜层， 但 不穿通所述双面线路板的底铜层， 所述方法进一步包括： 将双面覆铜 板的在所述孔位置的底铜层顶至与顶铜层平齐或者接近平齐； 在所述 孔的位置用 SMT方式印上锡膏， 并且通过回流焊使底铜层顶与顶铜 层焊接互连。
根据本发明的另一实施方式， 所述双面覆铜板是通过用单面覆铜 板覆热固胶后进行冲孔， 然后和另一层铜箔通过热固胶粘合而成的双 面覆铜板。
根据本发明的另一实施方式， 所述热固胶是丙烯酸酯类型的或者 是环氧类型的。
根据本发明的另一实施方式， 在通过 SMT将元件焊接在双面线 路板上的同时， 在所述孔的位置印上锡膏， 通过回流焊在焊接元件的 同时通过孔位焊接来连通底铜层和顶铜层。 根据本发明的另一实施方式， 所述底铜层或顶铜层是厚度为
0.012-0.5mm厚的纯铜箔或者合金铜。
根据本发明的另一实施方式， 所述沖孔是采用模具沖孔， 当冲孔 时， 使顶铜层在所述孔内形成内陷的批锋。 .
根据本发明的另一实施方式， 所述底铜层被顶至与所述顶铜层的 内陷的批锋接触。
根据本发明的另一实施方式， 所述方法中不使用化学处理方法来 使所述孔导通。
根据本发明的另一实施方式， 所述沖孔和顶孔是采用模具进行 的， 并且所述模具冲孔及模具顶孔是采用连续冲压方式进行的。
本发明还提供了一种双面线路板， 包括： 顶部线路层（1); 第一粘 合层 (2)； 绝缘膜层 (3); 第二粘合层 (4)； 底部线路层 (5); 和设置在所 述双面线路板中的孔； 其中， 所述顶部线路层（1)经由第一粘合层 (2) 结合在绝缘膜层 (3)的一面上，并且所述底部线路层 (5)经由第二粘合层 (4)结合在绝缘膜层 (3)相反的另一面上； 并且所述孔穿过顶部线路层 (1)、 第一粘合层 (2)、 绝缘膜层 (3)和第二粘合层 (4); 在所述孔中填有 锡膏， 从而使所述顶部线路层（1)和底部线路层 (5)互连导通。
根据本发明的另一实施方式， 所述双面线路板是双面柔性线路 板： 其中， 所述孔位置的底部线路层 (5)被顶至与顶部线路层（1)的铜层 平齐或者接近平齐； 并且， 所述锡膏是在所述孔的位置用 SMT方式 印上的， 并且通过回流焊使底部线路层 (5)与顶部线路层 (1)焊接互连。
根据本发明的另一实施方式， 所述双面线路板是顶部线路层（ 1 ) 和底部线路层 (5)为铜层的双面覆铜板， 所述双面覆铜板是通过用单面 覆铜板覆热固胶后进行沖孔， 然后和另一层铜箔通过热固胶粘合而成 的。
根据本发明的另一实施方式，所述底部线路层 (5 )被顶至与所述顶 部线路层 (1)的内陷的批锋接触。
本发明还提供了一种 LED灯带， 包括根据如上所述的双面线路 板和安装于其上的 LED。
在以下对附图和具体实施方式的描述中， 将阐述本发明的一个或 多个实施例的细节。 从这些描述、 附图以及权利要求中， 可以清楚本 发明的其它特征、 目的和优点。 附图说明
图 1是相关技术的双面印刷线路板的局部截面图， 显示了已完成 导电化化学镀铜处理的传统线路板制作的通孔；
图 2显示了单面覆铜板的构造；
图 3显示了将热固性粘合胶贴附在单面覆铜板绝缘层后的构造； 图 4显示了通过模具沖孔的方式， 将导通孔冲切出来的构造； 图 5显示了将纯铜箔通过压合与粘合层压合在一起而形成双面线 路板的构造；
图 6显示了利用凸顶模具将凹孔孔底的纯铜箔通过沖压方式顶至 第一层线路层凹孔孔口附近的构造；
图 7显示了根据本发明的一个实施例的经过印刷锡膏后， 经回流 焊固化后的焊连通双面线路板两面电路使两面导通的构造。 具体实施方式
下面将以双面印刷线路板为具体实施例来对本发明进行更详细 的描述。 一、 基板的制作
将如图 2所示的成卷的铜箔 1厚度优选为 12.5-35微米、 粘合胶 2厚度优选为 12.5-25微米、 绝缘膜 3厚度优选为 12.5-25微米的单面 覆铜板，在 hakut mach 630压膜机上，以 120-150。C，压力为 5- 8 kg/cm2 速度为 0.8-1.0 m/min的速度， 与热固胶膜 4压覆在一起， 从而形成如 图 3所示的结构。 或者采用涂敷烘干生产设备， 将液态的热固型胶涂 敷在单面覆铜板无铜面绝缘层上。 二、 凹孔的制作
将图 3所示结构的覆铜板材，经宁波欧泰 CH1-25型 25吨沖床上， 用提前由工程部根据客户线路设计资料制作的通孔模具， 以铜面向上 进行沖孔， 使顶层铜面形成内陷的批峰， 便于和往上顶的铜面接触。 得到如图 4所示的穿过一层铜箔 1、 粘合胶 2、 绝缘膜 3和热固胶膜 4 而形成通孔的构造， 其中铜箔面的披峰向下陷入孔壁内， 如图 4中所 示。 接着经 BURKLEN LAMV多层真空压合机以 120-160°C , 压力为 15-20kg/cm2, 压合时间为 80-120min, 与纯铜箔 5压合在一起形成图 5所示结构。 三、 线路板的其它制作
接着用常规的线路板制作方法， 经压干膜， 图形转移， 曝光， 显 影， 蚀刻， 贴覆盖膜， 压合， 文字， OSP, 成型， 即得到了两面未导 通的成品线路板。 由于以上步骤是印刷线路板的传统工艺， 属于业内 技术人员所熟知， 在此就不在细述。 四、 沖压模顶孔
经完成的线路板，通过宁波欧泰 CH1-25型 25吨沖床， 釆用提前 由工程部根据客户线路设计资料制作的顶孔模具， 采用管位定位的方 式， 将凹孔底铜顶至与顶铜面相齐， 并接触顶铜内陷批锋处， 以便于 后续锡膏回流焊接连接。 如图 4所示， 该内陷的批锋例如为铜箔 1内 陷于孔中的那部分。 五、 线路层的导通
经图 6所示的线路板在 SMT贴附元器件印刷锡膏的同时， 在孔 口印刷上一层锡膏， 然后经自动贴片机将元器件贴附在上述的线路板 上， 经回流焊， 5段 275度固化后， 孔位锡膏同时固化， 得到如图 7 所示的结构， 因此在元器件焊接的同时， 实现了两面线路层的导通。 由于上述的 SMT工艺属于传统的元器件贴附工艺， 属于业内技术人 员所熟知， 在此就不再细述。
以上结合附图将以双面印刷线路板为具体实施例对本发明进行 了详细的描述。 但是， 本领域技术人员应当理解， 以上所述仅仅是举 例说明和描述一些具体实施方式， 对本发明的范围， 尤其是权利要求 的范围， 并不具有任何限制。 例如， 尽管描述了线路层是铜箔， 但是 线路层也可以用其它具有足够延展性的金属或合金制成。 此外， 根据 不同的应用场合和要求， 也可以制作或者不制作披锋。

Claims

1、 一种双面线路板的互连导通方法， 包括：
提供带孔的双面线路板；
在所述孔中用锡焊方式施加锡膏， 而使所述双面线路板的顶部线 路层和底部线路层互连导通。
2、 根据权利要求 1所述的方法， 其特征在于， 所述锡膏是 SMT 锡膏， 并且所述锡焊采用印刷回流焊工艺， 而使所述双面线路板在所 述孔的位置互连导通。
3、 根据权利要求 1或 2所述的方法， 其特征在于， 所述双面线 路板是具有底铜层和顶铜层的双面覆铜板， 其中， 所述孔穿通所述双 面覆铜板的顶铜层， 但不穿通所述双面线路板的底铜层， 所述方法进 一步包括：
将双面覆铜板的在所述孔位置的底铜层顶至与顶铜层平齐或者 接近平齐；
在所述孔的位置用 SMT方式印上锡膏， 并且通过回流焊使底铜 层顶与顶铜层焊接互连。
4、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述 双面覆铜板是通过用单面覆铜板覆热固胶后进行沖孔， 然后和另一层 铜箔通过热固胶粘合而成的双面覆铜板。
5、 根据权利要求 4所述的方法， 其特征在于， 在通过 SMT将元 件焊接在双面线路板上的同时， 在所述孔的位置印上锡膏， 通过回流 焊在焊接元件的同时通过孔位焊接来连通底铜层和顶铜层。
6、 根据上述权利要求 3 - 5中任一项所述的方法， 其特征在于， 所述底铜层或顶铜层是厚度为 0.012-0.5mm厚的纯铜箔或者合金铜，。
7、 根据权利要求 4所述的方法， 其特征在于， 所述冲孔是采用 模具沖孔， 当沖孔时， 使顶铜层在所述孔内形成内陷的批锋。
8、 根据上述权利要求 3 - 8中任一项所述的方法， 其特征在于， 所述底铜层被顶至与所述顶铜层的内陷的批锋接触。
9、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述 方法中不使用化学处理方法来使所述孔导通。
10、 根据权利要求 3所述的方法， 其特征在于， 所述沖孔和顶孔 是采用模具进行的， 并且所述模具冲孔及模具顶孔是采用连续冲压方 式进行的。
11、 一种双面线路板， 包括：
顶部线路层（1);
第一粘合层 (2);
绝缘膜层 (3);
第二粘合层 (4);
底部线路层 (5); 和
设置在所述双面线路板中的孔；
其中， 所述顶部线路层（1)经由第一粘合层 (2)结合在绝缘膜层 (3) 的一面上，并且所述底部线路层 (5)经由第二粘合层 (4)结合在绝缘膜层 (3)相反的另一面上； 并且
所述孔穿过顶部线路层（1)、 第一粘合层 (2)、 绝缘膜层 (3)和第二 粘合层 (4);
在所述孔中设有锡膏， 从而使所述顶部线路层（1)和底部线路层 (5) 互连导通。
12、 根据权利要求 1所述的双面线路板， 其特征在于， 所述锡膏 是 SMT锡膏， 并且所述锡膏通过锡焊而填充。
13、 根据权利要求 1或 2所述的双面线路板， 其特征在于， 所述 双面线路板是双面柔性线路板：
其中， 所述孔位置的底部线路层 (5)被顶至与顶部线路层（1)的钢 层平齐或者接近平齐；
并且， 所述锡膏是在所述孔的位置用 SMT方式印上的， 并且通 过回流焊使底部线路层 (5)与顶部线路层（1)焊接互连。
14、 根据权利要求 13所述的双面线路板， 其特征在于， 所述双 面线路板是顶部线路层（1)和底部线路层 (5)为铜层的双面覆铜板，所述 双面覆铜板是通过用单面覆铜板覆热固胶后进行沖孔， 然后和另一层 铜箔通过热固胶粘合而成的。
15、 根据权利要求 14所述的双面线路板， 其特征在于， 所述热 固胶是丙烯酸酯类型的或者是环氧类型的。
16、 根据上述权利要求 14 - 15 中任一项所述的双面线路板， 其 特征在于，所述铜层是厚度为 0.012-0.5mm厚的纯铜箔或者合金铜， 。
17、 根据权利要求 14所述的双面线路板， 其特征在于， 所述孔 是采用模具冲孔形成的， 当冲孔时， 使顶部线路层 (1)在所述孔内形成 内陷的批锋。
18、 根据上述权利要求 13 - 18 中任一项所述的双面线路板， 其 特征在于，所述底部线路层 (5)被顶至与所述顶部线路层 (1)的内陷的批 锋接触。
19、根据上述权利要求中任一项所述的双面线路板，其特征在于， 不使用化学处理方法来使所述孔导通。
20. 根据权利要求 13所述的双面线路板， 其特征在于， 所述冲 孔和顶孔是采用模具进行的， 并且所述模具冲孔及模具顶孔是采用连 续冲压方式进行的。
21. 一种 LED灯带， 包括根据权利要求 1 1 - 20中任一项所述的 双面线路板和安装于其上的 LED。
PCT/CN2010/000703 2009-11-17 2010-05-19 双面线路板及其互连导通方法 WO2011060604A1 (zh)

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