WO2021057310A1 - 一种单层线路板组合到排线上制成的双层线路板及制作方法 - Google Patents

一种单层线路板组合到排线上制成的双层线路板及制作方法 Download PDF

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WO2021057310A1
WO2021057310A1 PCT/CN2020/108998 CN2020108998W WO2021057310A1 WO 2021057310 A1 WO2021057310 A1 WO 2021057310A1 CN 2020108998 W CN2020108998 W CN 2020108998W WO 2021057310 A1 WO2021057310 A1 WO 2021057310A1
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Prior art keywords
circuit board
layer
layer circuit
double
layered
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PCT/CN2020/108998
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English (en)
French (fr)
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王定锋
徐文红
冉崇友
徐磊
琚生涛
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王定锋
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Publication of WO2021057310A1 publication Critical patent/WO2021057310A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Definitions

  • the invention relates to the field of LED light strips and advertising signs, in particular to a double-layer circuit board made by combining a single-layer circuit board on a flat wire and a manufacturing method.
  • the existing technology produces light strips that are pasted on a plane with multiple turns and is mainly used in the advertising sign luminous character industry and the light box industry.
  • the existing technology is used in the flexible circuit board light strips in this industry. The following solutions are used :
  • the two sides of the double-layer circuit board are narrowed in many places.
  • the purpose of the narrowing is to make it easy to turn on a plane.
  • the industry is called an S-shaped light strip.
  • This type of circuit board is made with two layers, the main line is enlarged. But it also brings another problem.
  • the double-sided light strip turns and bends, the upper and lower copper layers are on top of each other, which is easy to break the line. Therefore, the copper thickness cannot be made thicker. If it is thicker, it will be harder and easier to top when turning.
  • the main line of the long light strip is also reduced due to the narrowing.
  • the overall light strip cannot be made too wide, too wide and difficult to turn
  • the installation space is limited when small characters are used. Therefore, some positions on narrow lines are narrowed, resulting in insufficient main line layout, resulting in a large voltage drop between the head and tail of the light strip and a decrease in the brightness of the tail end. This is used in the industry.
  • the light strips are used as advertising characters, they still have to add wires to supplement the electricity, reduce the voltage drop, and the workload during installation, the overall cost is very high.
  • the present invention will A double-layer circuit board made by combining a single-layer circuit board on a flat cable. Using this circuit board as a light strip will make a single-layer conjoined flexible circuit board containing multiple light strip circuit boards. The upper part is punched with a die to form a number of hollow holes, and adhesive is applied at multiple positions on the back to make a cable. Use a film with glue to paste parallel wires to make a cable. Many places on the cable are exposed.
  • This double-layer circuit board is a multi-layered circuit board , At the edge of each single-layer circuit board in the double-layer circuit board, the single-layer circuit board on the front is narrowed in many places, and the narrowed place (not limited to the narrowed place) and the back side line form a layered structure , The back cable has a gap in the narrowed part itself.
  • hollows are formed in the layered position (but not limited to the layered position), and multiple hollows are formed in the middle of each single circuit board in the conjoined circuit board Hole, a single LED light strip made of this kind of circuit board, when the back is pasted on a flat surface, it is easy to turn and install at the narrowed and layered place.
  • the present invention solves the problem that the back cable has been stratified at the turning point, and the positive and negative poles are cut and separated. When turning, they do not squeeze or top each other.
  • the cable can be enlarged to meet the load requirements, and it is equivalent to using when installing.
  • the wires were taken and integrated together, which did not increase the cost of the copper wires. On the contrary, the layers were integrated, the installation efficiency was high, the overall cost was greatly reduced, and there was no messy wiring in the advertisement.
  • the invention relates to a double-layer circuit board made by combining a single-layer circuit board on a flat wire and a manufacturing method thereof. Specifically, a single-layer circuit board is manufactured.
  • the single-layer circuit board is a connecting circuit board containing multiple light strips.
  • For flexible circuit boards apply adhesive intermittently at multiple positions on the back of the circuit board, and punch out multiple holes with a die, some of which are holes that narrow the edge of a single light strip or hollow out the middle of a single light strip. Some holes are spare holes for connecting with the cable. Make another cable. Use a film with glue to paste parallel wires to make the cable.
  • the metal of the cable is exposed in many places on the cable, and then cut the cable into Multiple gaps, the circuit board and the cable are aligned and pasted together to form a conjoined double-layer circuit board with multiple light strip circuit boards.
  • This circuit board is layered in many places, and the single-layer circuit board on the front is narrowed in many places Or hollow, easy to make a single LED light strip when used, it is convenient for multi-directional turning installation at the narrow or hollow layered place.
  • a method for manufacturing a double-layer circuit board made by combining a single-layer circuit board on a flat cable Specifically, a single-layer circuit board is manufactured, and the single-layer circuit board is a circuit board containing multiple light strips. Connect the flexible circuit board, and then make a row of wires. Use a film with glue to paste parallel wires to make a row. There are many wires on the wire exposed. Then cut the wires into multiple gaps.
  • Adhesive is applied at multiple locations on the back to form an intermittent adhesive layer with glue at multiple locations, and then multiple holes are punched out, some of which are holes that narrow the edges of a single light strip or/and are hollow holes in the middle of a single light strip , Some holes are spare holes that are used to connect with the cable.
  • the circuit board and the cable are aligned and pasted together to form a conjoined double-layer circuit board with multiple light strip circuit boards.
  • This double-layer circuit board is more At the edge of each single-layer circuit board in the double-layer circuit board, the front single-layer circuit board is narrowed in many places, or/and there are many hollows formed in the middle of the front circuit board, In addition, the narrowing or hollowing of the front circuit board (not limited to the narrowing and hollowing) and the back cable form a layered structure, and the back cable forming a gap in the narrowing or/and hollowing.
  • a single LED light strip made of this kind of circuit board is convenient for multi-directional turning and installation at the narrow or hollow layered place when in use.
  • a double-layer circuit board made by combining a single-layer circuit board on a cable, including: a single-layer circuit board on the upper layer; an adhesive in the middle layer; a cable on the lower layer; ,
  • the circuit board is a conjoined circuit board containing multiple single light strip circuit boards, the upper circuit board is a single-layer circuit board, and the upper circuit board and the lower wiring are intermittently formed in multiple positions by the middle layer of adhesive Bonding, the formed double-layer circuit board is a multi-layered circuit board.
  • the front single-layer circuit board is narrowed in many places, or/and the front side
  • the circuit board is formed with multiple hollow structures in the middle of each strip, and the narrowing or/and hollowing (not limited to the narrowing and hollowing) and the back wiring form a layered structure, and the back wiring is narrowing
  • a gap is formed in the or/and hollow part itself.
  • a single LED light strip made of this circuit board has a layered structure in the narrow or/and hollow part, which is convenient for multi-directional turning and installation during use.
  • a method for manufacturing a double-layer circuit board made by combining a single-layer circuit board on a flat cable Specifically, a single-layer circuit board is manufactured, and the single-layer circuit board is a circuit board containing multiple light strips. Connect the flexible circuit board, and then make a cable, use a film with glue to paste parallel wires to make a cable, and there are many wires on the cable metal exposed, apply adhesive on the back of the circuit board or the cable, the adhesive is discontinuous It is glued on the board to form multiple spaced adhesive layers, and the circuit board and the cable are aligned and pasted together to form a conjoined double-layer circuit board with multiple light strip circuit boards.
  • This double-layer circuit board has multiple locations.
  • the layered circuit board is then cut at the layered place to make a single circuit board into multiple hollows, but not limited to the hollows formed at the layered position.
  • a single LED strip made of this circuit board is divided into hollows when used.
  • the layer is convenient for multi-directional turning installation.
  • a double-layer circuit board made by combining a single-layer circuit board on a cable, including: a single-layer circuit board on the upper layer; an adhesive in the middle layer; a cable on the lower layer; ,
  • the circuit board is a conjoined circuit board containing multiple light strip circuit boards
  • the upper circuit board is a single-layer circuit board
  • the upper circuit board and the lower wiring are intermittent adhesives formed in multiple positions through the middle layer of adhesive Connected
  • the formed double-layer circuit board is a multi-layered circuit board, and the layered position (but not limited to the layered position) is hollowed out, and it is in the middle of each single circuit board in the conjoined circuit board ,
  • a plurality of hollows are formed, and a single LED light strip made of this circuit board is convenient for multi-directional turning and installation at the hollow layered position during use.
  • the double-layer circuit board made by combining a single-layer circuit board on a cable is characterized in that the cable is composed of multiple stranded wires or Multiple single strands are juxtaposed and arranged.
  • the double-layer circuit board made by combining a single-layer circuit board on a cable is characterized in that the single-layer circuit board is a circuit board made of wires or It is a circuit board made of copper foil.
  • the double-layer circuit board made by combining a single-layer circuit board on a cable is characterized in that the soldering pad position of the LED lamp (but not limited to the LED lamp Pad position), the position of the middle layer in the opposite board is provided with adhesive.
  • the double-layer circuit board made by combining a single-layer circuit board on a cable is characterized in that the method of applying the adhesive is to apply the adhesive by printing.
  • Fig. 1 is a schematic plan view of a single-layer circuit board on the upper layer, with a through hole provided at the conductive soldering position, and exposed front circuit pads of the upper circuit board on the side of the through hole.
  • FIG. 2 is a schematic plan view of a plurality of hollow holes formed by punching a die on the upper-layer conjoined single-layer circuit board.
  • Fig. 3 is a schematic plan view of the adhesive printed at multiple locations on the back of the upper single-layer circuit board with multiple hollow holes.
  • Fig. 4 is a schematic plan view of a plurality of juxtaposed flat wires covered on a backside adhesive film.
  • Figure 5 is a schematic plan view of a cover film with a window covering the front side of the juxtaposed flat wires, and the juxtaposed flat wires are exposed from the windows to form solder joints to form the lower-layer wiring.
  • Fig. 6 is a schematic plan view showing that a plurality of gaps are punched out with a die between two adjacent flat wires of the lower layer cable.
  • Figure 7 shows the upper single-layer circuit board with multiple hollow holes and the lower layer of the wiring board through the adhesive of the middle layer to form intermittent adhesion, intermittent layering, and multiple conjoined double-layer circuit boards.
  • Fig. 8 is a schematic cross-sectional view of an upper single-layer circuit board with a plurality of hollow holes bonded to a lower-layer cable through the adhesive of the middle layer to form an intermittently bonded, intermittently layered double-layer circuit board.
  • Figure 9 shows the upper layer single-layer circuit board with multiple hollow holes and the lower layer of the wiring board through the adhesive of the middle layer to form a double-sided circuit board with intermittent adhesion and intermittent layering, which is divided into a single double-layer circuit. After the board, the single-layer circuit board on the front side is narrowed in several places.
  • Figure 10 shows that the upper single-layer circuit board is pasted with the lower layer cable through the adhesive of the middle layer to form intermittent adhesion, intermittent layering, multiple conjoined double-layer circuit boards, in the conjoined double-sided circuit board
  • Figure 11 shows that the upper single-layer circuit board is bonded to the lower layer by the adhesive of the middle layer to form an intermittent adhesive, intermittently layered, multiple conjoined double-layer circuit board, in the conjoined double-sided circuit board There are a plurality of hollow holes formed in the middle of each single circuit board, which are cut into a single double-layer circuit board.
  • the single-sided flexible copper clad board is screen-printed with circuit corrosion-resistant ink, baked, cured, etched, and film-removed to make the front circuit, drill positioning holes, and then test and align the cover film with the window. Press on the circuit, expose the pad 1.1 from the window, print the characters, bake and cure, and then punch out the via hole 1.2 with a mold. The hole edge of the via hole 1.2 has the front circuit pad 1.3 exposed, and it is made as The upper single-layer circuit board 1 shown in FIG. 1.
  • the flat copper wire 3.1 is laminated and pasted with the PI film 1 with glue. (As shown in Figure 4), at the same time, the other side of the flat copper wire 3.1 is laminated and pasted with the cover film with the pad window.
  • the flat copper wire 3.1 is exposed from the pad window to form a metal solder joint 3.1a, and the flat copper
  • the line 3.1 is sandwiched in the middle to make a flat line (as shown in Figure 5), and then the flat line is placed on a punching machine with a die, and multiple slits 3.2 are punched out according to the pre-designed position (as shown in Figure 6).
  • This double-layer circuit board is a multi-layered circuit board (as shown in Figure 8) , At the edge of each single-layer circuit board in the double-layer circuit board, the single-layer circuit board on the front is narrowed in many places (as shown in Figure 9), and at the narrowing place (not limited to the narrowing place) and the back
  • the flat cable forms a layered structure, and the rear flat cable has a gap in the narrowed area.
  • a single LED strip made of this circuit board can be easily used at the narrowed layered area when the back is pasted on a flat surface. Turning installation.
  • the single-sided flexible copper clad board is screen-printed with circuit corrosion-resistant ink, baked, cured, etched, and film-removed to make the front circuit, drill positioning holes, and then test and align the cover film with the window. Press on the circuit, expose the pad 1.1 from the window, print the characters, bake and cure, and then punch out the via hole 1.2 with a mold. The hole edge of the via hole 1.2 has the front circuit pad 1.3 exposed, and it is made as The upper single-layer circuit board 1 shown in FIG. 1.
  • the flat copper wire 3.1 is laminated and pasted with the PI film 1 with glue. (As shown in Figure 4), at the same time, the other side of the flat copper wire 3.1 is laminated and pasted with the cover film with the pad window.
  • the flat copper wire 3.1 is exposed from the pad window to form a metal solder joint 3.1a, and the flat copper
  • the line 3.1 is sandwiched in the middle and made into a flat line (as shown in Figure 5).
  • This double-layer circuit board is a multi-layered circuit board (as shown in Figure 8). In the double-layer circuit board In the middle of each strip, there are multiple hollow holes 1.5 (as shown in Figure 11). When a single LED strip made of this circuit board is pasted on a flat surface, it is convenient to turn and install at the hollow layered place.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Insulated Conductors (AREA)
  • Led Device Packages (AREA)

Abstract

一种单层线路板（1）组合到排线上制成的双层线路板及制作方法，具体而言，制作一单层线路板（1），单层线路板（1）是含多条灯带线路板的连体柔性线路板，在线路板（1）背面间断印刷胶粘剂在多个位置，用模具冲切出多个孔（1.4，1.5），其中一些孔（1.4,1.5）是使单条灯带边缘收窄的孔或者是将单条灯带中间镂空的孔，一些孔（1.4,1.5）是备用于和排线导通的备用孔，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，再将排线切成多个缝隙（3.2），将线路板（1）和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此线路板多处分层，正面的单层线路板（1）多处收窄或镂空，便于制成的单条LED灯带使用时，在收窄或镂空分层处便于多向转弯安装。

Description

一种单层线路板组合到排线上制成的双层线路板及制作方法 技术领域
本发明涉及LED灯带及广告招牌领域，具体涉及一种单层线路板组合到排线上制成的双层线路板及制作方法。
背景技术
现有技术制作在一个平面上多次转弯粘贴的灯带，主要用于广告招牌发光字行业，以及灯箱行业，现有技术用在这个行业的柔性线路板灯带，用的是以下几个方案：
1、单层线路板两边多处缩窄，缩窄的目的是便于在一个平面上转弯容易，业界称为S型灯带，这种线路板最大的问题是由于多处缩窄，导致从头至尾的长灯带的主线也在一层线路上，而且因为缩窄导致主线变小，再加上灯带整体也不能做太宽，太宽不易转弯，而且做小字时安装空间受限，所以，就导致在比较窄的线路上，部分位置还要收窄，导致主线布得很小，导致灯带首尾间压降大，尾端亮度降低。业界用这种灯带做广告字时，都要外加导线去补电，减少压降，而且安装时工作量，综合成本很高。
2、双层线路板两边多处缩窄，缩窄的目的是便于在一个平面上转弯容易，业界称为S型灯带，这种线路板虽然通过做两层后，主导线加大了，但是又带来另外的问题，双面板灯带转弯弯折时，上下两层铜互相顶，容易将线路顶断，所以，铜厚更不能做厚，做厚了更硬，转弯时更容易顶断，同时，还是存在由于多处缩窄，导致从头至尾的长灯带的主线也因为缩窄导致主线变小，再加上灯带整体也不能做太宽，太宽不易转弯，而且做小字时安装空间受限，所以，就导致在比较窄的线路上，部分位置还要收窄，导致主线布得还是不够，导致灯 带首尾间压降大，尾端亮度降低，业界用这种灯带做广告字时，都还是要外加导线去补电，减少压降，而且安装时工作量，综合成本很高。
3、业界也还有用完全直条的灯带做广告字，这种虽然压降小一些，但是转弯很困难，基本处于淘汰产品。
为了克服以上的缺陷和不足，如何做长压降小，又能便于转弯，又能转弯时不易断裂，又能在安装使用时，不外加线补充电，又能将综合成本降低，本发明将一种单层线路板组合到排线上制成的双层线路板，用这种线路板做灯带，将作一单层含多条灯带线路板的连体柔性线路板，在线路板上用模具冲切形成多个镂空的孔，在背面多个位置施加胶粘剂，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，再将排线切成多个缝隙，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄，而且在收窄处(不限于收窄处)和背面排线形成分层的结构，背面排线在收窄处又自身形成有缝隙，用这种线路板制成的单条LED灯带，背面贴到一个平面上使用时，在收窄分层处便于转弯安装。
或者，将作一单层含多条灯带线路板的连体柔性线路板，在背面多个位置施加胶粘剂，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，用模具冲切或用激光切割成多个镂空，在分层位置(但不限于分层位置)形成有镂空，而且是在连体线路板里的每条单条线路板的中间形成的多个镂空洞，用这种线路板制成的单条LED灯带，背面贴到一个平面上使用时，在收窄分层处便于转弯安装。
本发明解决了背面排线因为在转弯处已经分层，又是正负极切开分开了，转弯时互相不挤压不顶，可以把线加大，满足负载要求，而且相当于是把使用安装时用的线拿过来整合到了一起，并没有增加铜 线的成本，反而集层到一起了，安装效率高了，综合成本大大降低，而且广告字里没有了乱七八糟的接线。
发明内容
本发明涉及一种单层线路板组合到排线上制成的双层线路板及制作方法，具体而言，制作一单层线路板，单层线路板是含多条灯带线路板的连体柔性线路板，在线路板背面间断施加胶粘剂在多个位置，用模具冲切出多个孔，其中一些孔是使单条灯带边缘收窄的孔或者是将单条灯带中间镂空的孔，一些孔是备用用于和排线导通的备用孔，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，再将排线切成多个缝隙，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此线路板多处分层，正面的单层线路板多处收窄或镂空，便于制成的单条LED灯带使用时，在收窄或镂空分层处便于多向转弯安装。
根据本发明提供了一种单层线路板组合到排线上制成的双层线路板的制作方法，具体而言，制作一单层线路板，单层线路板是含多条灯带线路板的连体柔性线路板，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，再将排线切成多个缝隙，在线路板的背面多个位置施加胶粘剂，形成间断式的多处有胶的胶粘层，然后打出多个孔，其中一些孔是使单条灯带边缘收窄的孔或/和是单条灯带中间镂空的孔，一些孔是备用于和排线导通的备用孔，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄，或/和是正面的线路板中间形成有多处镂空，而且在正面线路板的收窄处或镂空处(不限于收窄处和镂空处)和背面排线形成分层的结构，背面排线在收窄处或/和镂空处又自身形成有缝隙，用这种线路板制成的单条LED灯带，使用时在收窄或镂空分层处便于多向转弯安装。
根据本发明还提供了一种单层线路板组合到排线上制成的双层线路板，包括：在上层的单层线路板；在中间层的胶粘剂；在下层的排线；其特征在于，线路板是含多条单条灯带线路板的连体线路板，在上层的线路板是单层线路板，上层线路板和下层排线是通过中间层胶粘剂在多个位置形成的间断式的粘接，形成的双层线路板是多处分层的线路板，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄，或者/和正面的线路板在每条的中间形成有多处镂空的结构，而且在收窄或/和镂空处(不限于收窄和镂空处)和背面排线形成分层的结构，背面排线在收窄处或/镂空处又自身形成有缝隙，用这种线路板制成的单条LED灯带，在收窄或/和镂空处，又是分层结构，使用时便于多向转弯安装。
根据本发明还提供了一种单层线路板组合到排线上制成的双层线路板的制作方法，具体而言，制作单层线路板，单层线路板是含多条灯带线路板的连体柔性线路板，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，在线路板背面或者排线上施加胶粘剂，胶粘剂是间断粘在板上，形成多处间隔的粘胶层，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，然后在分层处切割使单条线路板成多个镂空，但不限于分层位置形成有镂空，用这种线路板制成的单条LED灯带，使用时，在镂空分层处便于多向转弯安装。
根据本发明还提供了一种单层线路板组合到排线上制成的双层线路板，包括：在上层的单层线路板；在中间层的胶粘剂；在下层的排线；其特征在于，线路板是含多条灯带线路板的连体线路板，在上层的线路板是单层线路板，上层线路板和下层排线是通过中间层胶粘剂在多个位置形成的间断式的粘接，形成的双层线路板是多处分层的线路板，并且在分层位置(但不限于分层位置)形成有镂空，而且是在连体线路板里的每条单条线路板的中间，形成有多个镂空，用这种线路板制成的单条LED灯带，使用时在镂空分层处便于多向转弯安 装。
根据本发明的一优选实施例，所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述的排线，是由多条绞合线或者是多条单股线并置排列形成。
根据本发明的一优选实施例，所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述的单层线路板是导线制成的线路板或者是用铜箔制成的线路板。
根据本发明的一优选实施例，所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，在焊接LED灯的焊盘位置(但不限于LED灯的焊盘位置)，正对的板内中间层的位置处设置有胶粘剂。
根据本发明的一优选实施例，所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述施加胶粘剂的方式是用印刷的方式施加胶粘剂。
在以下对附图和具体实施方式的描述中，将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书，本发明的特征、目的和优点将变得更加显而易见，对附图的简要说明如下。
图1为上层的单层线路板，导通焊接位设置导通孔，导通孔边有露出的上层线路板的正面线路焊盘的平面示意图。
图2为在上层的连体的单层线路板上用模具冲切形成多个镂空孔后的平面示意图。
图3为在有多个镂空孔的上层的单层线路板的背面局部多处位置印刷胶粘剂后的平面示意图。
图4为多条并置的扁平导线覆在背面带胶膜上的平面示意图。
图5为带有窗口的覆盖膜覆在并置的扁平导线正面，并置的扁平 导线从窗口处露出形成焊点，制成下层排线的平面示意图。
图6为在下层排线的相邻两扁平导线之间，用模具冲切出多个缝隙的平面示意图。
图7为有多个镂空孔的上层的单层线路板通过中间层的胶粘剂与下层排线贴合在一起，形成间断粘合，间断分层的，多条连体的双层线路板的平面示意图。
图8为有多个镂空孔的上层的单层线路板通过中间层的胶粘剂与下层排线贴合在一起，形成间断粘合，间断分层的双层线路板的截面示意图。
图9为有多个镂空孔的上层的单层线路板通过中间层的胶粘剂与下层排线贴合在一起，形成间断粘合，间断分层的双面线路板，分切成单条双层线路板后，正面的单层线路板多处收窄的平面示意图。
图10为上层的单层线路板通过中间层的胶粘剂与下层排线贴合在一起，形成间断粘合，间断分层的，多条连体的双层线路板，在连体双面线路板里的每条单条线路板的中间形成的多个镂空孔的平面示意图。
图11为上层的单层线路板通过中间层的胶粘剂与下层排线贴合在一起，形成间断粘合，间断分层的，多条连体的双层线路板，在连体双面线路板里的每条单条线路板的中间形成的多个镂空孔，分切成单条的双层线路板后平面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本发明的权利要求并不具有任何限制。
优选实施一：
采用传统的线路板制作工艺，将单面柔性覆铜板经丝印电路抗蚀 油墨、烘烤固化、蚀刻、退膜制作出正面电路、打定位孔，再测试、将开有窗口的覆盖膜对位贴压在电路上，从窗口处露出焊盘1.1，印字符，烘烤固化、再用模具冲切出导通孔1.2，导通孔1.2的孔边有露出正面电路焊盘1.3，制作成如图1所示的上层的单层线路板1。
在上层的单层线路板1用预先设计制作好的模具，在沃得精机的60吨冲床上，将上层的单层线路板1的定位孔挂到模具的定位针上，然后冲切出多个镂空的孔1.4(如图2所示)。
根据设计的工程资料，在有多个镂空的孔1.4的上层的单层线路板1的背面的局部多处位置，在丝印机上用36T的丝网印刷柔性板用的丙烯酸类胶粘剂2(如图3所示)，进入隧道炉120度经3分钟，加温挥发掉丙烯酸胶粘剂2中的溶剂。
将多卷扁平铜线3.1置放在覆线机的放线架上，通过装在覆线机上的间距棒模具定位排布，扁平铜线3.1一面与带胶的PI膜1覆合粘贴在一起(如图4所示)，同时在扁平铜线3.1的另一面与开有焊盘窗口的覆盖膜覆合粘贴在一起，扁平铜线3.1从焊盘窗口露出形成金属焊点3.1a，扁平铜线3.1夹在中间，制作成排线(如图5所示)，再将排线用模具在冲床上，按预先设计的位置冲切出多个缝隙3.2(如图6所示)。
将上层的单层线路板1印有丙烯酸类胶粘剂2的哪一面，和排线有金属焊点3.1a的哪一面对位贴在一起，金属焊点3.1a从上层的单层线路板1的导通孔1.2中露出，再在快压机上用150度的温度，120kg的压力的参数压合，再用烤箱用150度的温度烘烤60分钟，使丙烯酸类胶粘剂2固化，再经过OSP表面防氧化处理，制成含多条灯带线路板的连体双层线路板(如图7所示)，此双层线路板是多处分层的线路板(如图8所示)，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄(如图9所示)，而且在收窄处(不限于收窄处)和背面排线形成分层的结构，背面排线在收窄处又自身形成有缝隙，用这种线路板制成的单条LED灯带，背面贴到一个平面上使 用时，在收窄分层处便于转弯安装。
优选实施二：
采用传统的线路板制作工艺，将单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜制作出正面电路、打定位孔，再测试、将开有窗口的覆盖膜对位贴压在电路上，从窗口处露出焊盘1.1，印字符，烘烤固化、再用模具冲切出导通孔1.2，导通孔1.2的孔边有露出正面电路焊盘1.3，制作成如图1所示的上层的单层线路板1。
根据设计的工程资料，在上层的单层线路板1的背面的局部多处位置，在丝印机上用36T的丝网印刷柔性板用的丙烯酸类胶粘剂2，进入隧道炉120度经3分钟，加温挥发掉丙烯酸胶粘剂2中的溶剂。
将多卷扁平铜线3.1置放在覆线机的放线架上，通过装在覆线机上的间距棒模具定位排布，扁平铜线3.1一面与带胶的PI膜1覆合粘贴在一起(如图4所示)，同时在扁平铜线3.1的另一面与开有焊盘窗口的覆盖膜覆合粘贴在一起，扁平铜线3.1从焊盘窗口露出形成金属焊点3.1a，扁平铜线3.1夹在中间，制作成排线(如图5所示)。
将上层的单层线路板1印有丙烯酸类胶粘剂2的哪一面，和排线有金属焊点3.1a的哪一面对位贴在一起，金属焊点3.1a从上层的单层线路板1的导通孔1.2中露出，再在快压机上用150度的温度，120kg的压力的参数压合，再用烤箱用150度的温度烘烤60分钟，使丙烯酸类胶粘剂2固化，经过OSP表面防氧化处理后，用预先设计制作好的模具，在沃得精机的60吨冲床上，在连体线路板里的每条单条线路板的中间，冲切出多个镂空孔1.5，制成含多条灯带线路板的连体双层线路板(如图10所示)，此双层线路板是多处分层的线路板(如图8所示)，在双层线路板里的每条的中间，多个镂空孔1.5(如图11所示)，用这种线路板制成的单条LED灯带，背面贴到一个平面上使用时，在镂空分层处便于转弯安装。
以上结合附图将一种单层线路板组合到排线上制成的双层线路板及制作方法的具体实施例对本发明进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本发明的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (8)

  1. 一种单层线路板组合到排线上制成的双层线路板的制作方法，具体而言，制作一单层线路板，单层线路板是含多条灯带线路板的连体柔性线路板，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，再将排线切成多个缝隙，在线路板的背面多个位置施加胶粘剂，形成间断式的多处有胶的胶粘层，然后打出多个孔，其中一些孔是使单条灯带边缘收窄的孔或/和是单条灯带中间镂空的孔，一些孔是备用于和排线导通的备用孔，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄，或/和是正面的线路板中间形成有多处镂空，而且在正面线路板的收窄处或镂空处(不限于收窄处和镂空处)和背面排线形成分层的结构，背面排线在收窄处或/和镂空处又自身形成有缝隙，用这种线路板制成的单条LED灯带，使用时在收窄或镂空分层处便于多向转弯安装。
  2. 一种单层线路板组合到排线上制成的双层线路板，包括：
    在上层的单层线路板；
    在中间层的胶粘剂；
    在下层的排线；
    其特征在于，线路板是含多条单条灯带线路板的连体线路板，在上层的线路板是单层线路板，上层线路板和下层排线是通过中间层胶粘剂在多个位置形成的间断式的粘接，形成的双层线路板是多处分层的线路板，在双层线路板里的每条单层线路板的边缘处，正面的单层线路板多处收窄，或者/和正面的线路板在每条的中间形成有多处镂空的结构，而且在收窄或/和镂空处(不限于收窄和镂空处)和背面排线形成分层的结构，背面排线在收窄处或/镂空处又自身形成有缝隙，用这种线路板制成的单条LED灯带，在收窄或/和镂空处，又是 分层结构，使用时便于多向转弯安装。
  3. 一种单层线路板组合到排线上制成的双层线路板的制作方法，具体而言，制作单层线路板，单层线路板是含多条灯带线路板的连体柔性线路板，再制作一排线，用带胶的膜粘贴平行导线制成排线，排线上多处有导线金属露出，在线路板背面或者排线上施加胶粘剂，胶粘剂是间断粘在板上，形成多处间隔的粘胶层，将线路板和排线对位贴在一起，形成含多条灯带线路板的连体双层线路板，此双层线路板是多处分层的线路板，然后在分层处切割使单条线路板成多个镂空，但不限于分层位置形成有镂空，用这种线路板制成的单条LED灯带，使用时，在镂空分层处便于多向转弯安装。
  4. 一种单层线路板组合到排线上制成的双层线路板，包括：
    在上层的单层线路板；
    在中间层的胶粘剂；
    在下层的排线；
    其特征在于，线路板是含多条灯带线路板的连体线路板，在上层的线路板是单层线路板，上层线路板和下层排线是通过中间层胶粘剂在多个位置形成的间断式的粘接，形成的双层线路板是多处分层的线路板，并且在分层位置(但不限于分层位置)形成有镂空，而且是在连体线路板里的每条单条线路板的中间，形成有多个镂空，用这种线路板制成的单条LED灯带，使用时在镂空分层处便于多向转弯安装。
  5. 根据权利要求1或2或3或4所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述的排线，是由多条绞合线或者是多条单股线并置排列形成。
  6. 根据权利要求1或2或3或4所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述的单层线路板是导线制成的线路板或者是用铜箔制成的线路板。
  7. 根据权利要求1或2或3或4所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，在焊接LED灯的焊盘位置(但 不限于LED灯的焊盘位置)，正对的板内中间层的位置处设置有胶粘剂。
  8. 根据权利要求1或3所述的一种单层线路板组合到排线上制成的双层线路板，其特征在于，所述施加胶粘剂的方式是用印刷的方式施加胶粘剂。
PCT/CN2020/108998 2019-09-27 2020-08-13 一种单层线路板组合到排线上制成的双层线路板及制作方法 WO2021057310A1 (zh)

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