WO2021057321A1 - 一种间断分层的柔性叠层灯带线路板及制作方法 - Google Patents

一种间断分层的柔性叠层灯带线路板及制作方法 Download PDF

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Publication number
WO2021057321A1
WO2021057321A1 PCT/CN2020/109147 CN2020109147W WO2021057321A1 WO 2021057321 A1 WO2021057321 A1 WO 2021057321A1 CN 2020109147 W CN2020109147 W CN 2020109147W WO 2021057321 A1 WO2021057321 A1 WO 2021057321A1
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Prior art keywords
circuit board
layer
laminated
circuit
adhesive
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PCT/CN2020/109147
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English (en)
French (fr)
Inventor
王定锋
徐文红
冉崇友
徐磊
琚生涛
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王定锋
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Publication of WO2021057321A1 publication Critical patent/WO2021057321A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of LED lamp belts, in particular to a flexible laminated lamp belt circuit board with intermittent layering and a manufacturing method.
  • LED circuit board light strips come all the time, and many positions need to be bent when used.
  • the light strip it is very easy to cause the circuit board to bend and break, or the circuit board is broken, or the long light strip is installed due to It is heavy and breaks due to stretching, or there is a thick copper wire or copper cable on the back of the light strip circuit board.
  • the thick copper breaks the circuit board, or the water-proof resin of the light strip packs the circuit when it is bent.
  • the top of the board is broken, and some long strips are connected by soldering to make long strips.
  • thick copper must be used as the circuit conductor.
  • the thicker the copper that needs to be soldered the weaker it is to be soldered and cannot resist flexure. How to solve the problem of bending and tensile fragility and improve the flexural resistance has always been a problem in the industry.
  • the circuit board of the present invention is made into an intermittently layered flexible laminated light strip circuit board, and the single-layer or double-layer flexible circuit board with the front welding components is partially printed with adhesive on the back , And then paste it together with the metal single-layer circuit board on the back to form an intermittent adhesive and intermittent layered structure, which greatly improves the bending resistance of the light strip and solves the problem of breakage caused by many factors during the installation and use of the light strip.
  • the problem is that the present invention also adopts the method of melting and fusing the copper's own solder joints, and copper welding the positive and negative electrodes of multiple short light strips.
  • the long light strip made is very firm, and the connection position does not break when winding, which solves the traditional problem.
  • the invention relates to an intermittently layered flexible laminated lamp belt circuit board and a manufacturing method.
  • a single-layer flexible circuit board or a double-layer flexible circuit board designed with a through hole is printed in multiple locations on the back.
  • Adhesive, and then make a metal single-layer circuit board paste the printed circuit board on the back and the metal single-layer circuit board together to form an intermittent adhesive and intermittent layered structure to make a double or three-layer circuit board.
  • This kind of circuit board is a circuit board with a hierarchical structure at multiple locations.
  • the single-layer circuit board part on the lower back and the upper single-layer circuit board or double-layer circuit board are located in multiple locations. Glue-bonded layered structure.
  • This layered circuit board is used to make LED light strips, which are more resistant to bending when used in bending.
  • a manufacturing method of intermittently layered flexible laminated light strip circuit board Specifically, a conjoined single-layer flexible circuit board containing multiple light strip circuit boards is manufactured first, or a single-layer flexible circuit board containing multiple light strip circuit boards is manufactured first.
  • the conjoined double-layer flexible circuit board with strip lights and circuit boards is used for the upper circuit board of the laminated circuit board.
  • the front side of the circuit board is used for soldering components.
  • a single-layer flexible circuit board with multiple conjoined For the lower circuit board of the laminated circuit board, apply the adhesive of the middle layer to the back of the upper circuit board, or apply it to the side of the lower circuit board.
  • the circuit board is formed in multiple locations with partial adhesive, and then The upper single-layer circuit board or double-layer circuit board is aligned and pasted to the lower circuit board, or after the upper circuit board is punched, the upper circuit board is aligned and pasted to the lower circuit board, and pressure is applied to make the upper and lower circuit boards firm Bonded together to make intermittently layered flexible laminated lamp strip circuit board.
  • the bonding between the upper circuit board and the lower circuit board of the laminated lamp strip circuit board is the intermittent bonding of multiple local adhesives.
  • the unbonded multiple positions are formed with separate gaps, and the intermittent layered flexible laminated light strip circuit board is a laminated circuit board formed by overlapping two different circuit boards and bonding them together with an adhesive.
  • the upper layer is a single-layer circuit board or a double-layer circuit board, and a spare conduction connection point can be formed between the single-layer circuit board and the lower single-layer circuit board on the back.
  • the spare conduction connection point is on the edge of the upper circuit board.
  • the intermittent layered flexible laminated light strip circuit board is a double-layered circuit board with a plurality of intermittent layered gaps formed in the board.
  • the thickness of the circuit metal of the lower back circuit board is greater than or equal to the thickness of the circuit metal of the upper circuit board.
  • the intermittent layered flexible laminated light strip circuit board is produced It is used to make LED light strips.
  • the light strips made with the circuit board have intermittent layered structure due to the line.
  • the produced light strips have improved bending resistance, and at the same time, there are multiple positions with intermittent layers.
  • the interlayer bonding ensures that the lamp made of the laminated circuit board has a relatively strong overall structure.
  • a manufacturing method for intermittently layered flexible laminated light strip circuit boards Specifically, a plurality of single-layer conjoined flexible circuit boards containing multiple light strip circuit boards are manufactured first, or Multiple double-layer conjoined flexible circuit boards containing multiple light strip circuit boards, used for the laminated upper circuit board, the front side of the circuit board is used for soldering components, and another conjoined body containing multiple light strip circuit boards Single-layer long circuit board, used for laminated lower circuit boards, apply adhesive on the back of multiple upper circuit boards, or on one side of the lower long circuit board. After the application is completed, the circuit board is formed in multiple locations.
  • the laminated light strip circuit board is glued between the upper and lower circuit boards.
  • connection is the intermittent bonding with adhesive in multiple parts of the formed part, and the unbonded positions are formed with separate gaps
  • the fabricated flexible laminated light strip circuit board is a discontinuous layered flexible laminated light strip Circuit board
  • the fabricated intermittently layered flexible laminated light strip circuit board is a laminated circuit board formed by a long circuit board which is arranged end to end and bonded to the lower layer by an adhesive.
  • the upper layer is Single-layer circuit board or double-layer circuit board
  • the laminated circuit board after production is double-layer or triple-layer circuit board, and between the upper circuit board and the lower single-layer circuit board on the back, there is a spare conductor that can be connected to each other.
  • connection point the standby connection point is on the edge of the upper circuit board.
  • connection points on the edge of the upper circuit board there are multiple connection points on the edge of the upper circuit board to align with multiple connection points on the lower circuit board.
  • the conductive material can be applied to the edge of the board. Connect the upper and lower layers to form a conduction, or/and provide a spare via hole in the upper circuit board.
  • the front line connection point of the upper circuit board is exposed on the side of the via hole, and the lower circuit board has metal in the via hole
  • the connection points are exposed from the front surface, and the upper layer pads and the lower layer connection points can be connected by conductive objects to form a conduction.
  • the intermittent layered flexible laminated light strip circuit board is formed with multiple A double-layer circuit board or a three-layer circuit board with intermittent layered gaps.
  • the fabricated intermittent layered flexible laminated lamp strip circuit board is used to make LED lamp strips. Because the circuit board has an intermittent layered structure, the fabricated lamp strip has improved bending resistance At the same time, there are discontinuous interlayer laminated bonding formed at multiple positions, and at the same time, it is ensured that the lamp made of laminated circuit board has a relatively strong overall structure.
  • a discontinuously layered flexible laminated light strip circuit board comprising: a single-layer circuit board or a double-layer circuit board stacked on an upper layer; an adhesive layer in the middle; a single-layer circuit board stacked on a lower layer; It is characterized in that, the intermittently layered flexible laminated lamp strip circuit board is composed of a single-layer circuit board or a double-layer circuit board containing multiple conjoined pieces on the upper layer, which is bonded to the lower layer by an adhesive layer.
  • One-piece single-layer circuit boards are formed to form a laminated circuit board, or multiple single-layer circuit boards or double-layer circuit boards containing multiple pieces are arranged end to end, and are bonded to the lower layer through an adhesive layer.
  • the bonding between all the upper circuit boards and the lower circuit boards of the multi-conjoined single-layer circuit board and the laminated lamp belt circuit board is the intermittent bonding of multiple local adhesives, and the unbonded multiple The position is formed with separate gaps
  • the formed flexible laminated light strip circuit board is an intermittently layered flexible laminated light strip circuit board
  • the intermittently layered flexible laminated light strip circuit board is composed of one or Multiple circuit boards are intermittently bonded to the lower circuit board by using adhesive to form a laminated circuit board.
  • the formed laminated circuit board is a double-layer or triple-layer circuit board, and the upper circuit board and the lower single-layer circuit Between the boards, there are alternate conduction connection points that can be connected to each other. The alternate conduction connection points are on the edge of the upper circuit board.
  • the intermittently layered flexible laminated lamp strip circuit board is a double-layer circuit board or a three-layer circuit board with a plurality of intermittent layered gaps formed in the board.
  • the glue connects the circuit metal or/and the insulating non-metal on the circuit on the lower single-layer circuit board to the back of a single upper circuit board or the back of multiple upper circuit boards, and the formation is in multiple positions Intermittent bonding, the thickness of the circuit metal of the lower back circuit board is greater than or equal to the thickness of the circuit metal of the upper circuit board, the intermittent layered flexible laminated light strip circuit board is used to make LED light strips, using the circuit board
  • the produced light strip has a discontinuous layered structure due to the circuit board, the produced light strip has improved bending resistance, and at the same time, there are intermittent interlayer laminated bonding formed in multiple positions, and at the same time, it is guaranteed to be laminated.
  • the lamp made of layered circuit board has a relatively strong overall structure.
  • the intermittently layered flexible laminated lamp strip circuit board is characterized in that, when the upper layer is a double-layer circuit board, the two-layer circuit board is The mutual conduction method is to conduct conduction by soldering conduction at the designed upper and lower solder conduction points, or conduct conduction through copper plating through the through hole formed between the two layers, or conduct conduction by conductive ink. through.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the adhesive is a curable or cured adhesive, or a self-adhesive adhesive .
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the single-layer circuit board stacked on the lower layer is a circuit board with a single-layer film, which carries The film layer of the circuit is at the interlayer gap between the laminated circuit board and the circuit board, or the film layer is completely exposed on the lowermost layer of the laminated circuit board, or the single-layer circuit board laminated on the lower layer is Double-layer film circuit board, two layers of film sandwich the middle circuit layer.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the single-layer circuit board stacked on the lower layer is a plurality of metal lines arranged in parallel In the wiring circuit board, the parallel wiring is the positive and negative power lines, which are used to supply power to the upper circuit and components.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the single-layer circuit board stacked on the lower layer is formed with a plurality of slits , The slit formed is between two adjacent circuits, which is convenient for the light strip made of this circuit board to be installed in multi-directional turning when in use.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the circuit metal of the single-layer circuit board laminated on the lower layer is copper, or aluminum, or Aluminum is nickel-plated, or aluminum is tin-plated, or aluminum is copper-plated, or copper-clad aluminum.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the soldering LED pads are arranged at the layer facing the layered structure, and the The LED light strip made of circuit board, when there are LED lights at the turn, the turning and bending will not easily cause the LED light beads to detach or break.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that a pad containing components is provided on the surface of the upper circuit board of the circuit board,
  • the designed light strip circuit board has been clearly designed and manufactured to only turn at the position without pads (the position where the components are not soldered), and the turning point is a layered structure.
  • the position of the welding LED is set directly between the upper and lower circuit boards. Bonding place.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the single-layer circuit board or double-layer circuit board laminated on the upper layer contains multiple The circuit board of a cycle circuit, the circuit design of each cycle is the same.
  • the alternate conduction connection point between the upper circuit board and the lower circuit board Set in one cycle position or set in multiple cycle positions.
  • the alternate conduction connection point of the upper circuit board and the lower circuit board is set in each cycle and used to make When the light is striped, there must be a conductive object connected every cycle.
  • the intermittently layered flexible laminated circuit board for lamp belts is characterized in that the conductive material is tin, or tin alloy, or conductive ink, or conductive glue.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the conduction of the upper and lower circuit boards is through the connection between the upper circuit board and the lower circuit board.
  • the bare metal at the layered area is in contact with each other, and the resulting contact is conductive.
  • the intermittently layered flexible laminated light strip circuit board is characterized in that the application method of applying the adhesive is to apply the adhesive by printing, or to use multi-head printing.
  • the glue machine applies adhesive or sticking tape.
  • Fig. 1 is a schematic plan view of the upper circuit board, the conductive soldering position is provided with a via hole, and the front side circuit pad of the upper circuit board is exposed on the side of the via hole.
  • Figure 2 is a schematic plan view of the upper circuit board, the conductive soldering positions at both ends, on the conductive soldering pads on the board edge of the upper circuit board, only half of the front circuit pads of the upper circuit board are exposed, and the other half is formed with holes.
  • Fig. 3 is a schematic plan view after printing adhesive at multiple locations on the back of the upper circuit board.
  • Fig. 4 is a schematic plan view of the metal single-layer circuit on the lower layer of the back surface.
  • Fig. 5 is a schematic plan view of a film provided with a hole, which is attached to the metal single-layer circuit on the lower layer of the back side to form a metal single-layer circuit board.
  • Fig. 6 is a schematic plan view of a plurality of slits provided between two adjacent circuits of a metal single-layer circuit board.
  • Fig. 7 is a plan view of the upper circuit board of "Fig. 1" and the lower single-layer circuit board bonded together by an adhesive to form an intermittent adhesive and intermittent layered structure of the intermittent layered flexible laminated light strip circuit board .
  • Fig. 8 is a plan view of the upper circuit board of "Fig. 2" and the lower single-layer circuit board bonded together by adhesive to form an intermittent adhesive and intermittent layered structure of the intermittent layered flexible laminated light strip circuit board .
  • Figure 9 is a schematic plan view of multiple upper circuit boards arranged end to end on the lower circuit board.
  • Fig. 10 is a schematic cross-sectional view of the intermittently layered flexible laminated light strip circuit board at the position of the via hole.
  • Fig. 11 is a schematic cross-sectional view of the intermittently layered flexible laminated lamp ribbon circuit board with the conducting and welding positions at both ends.
  • the single-sided flexible copper clad board is screen-printed with circuit corrosion-resistant ink, baked and cured, etched, film-removed, and screen-printed with the front ink solder mask to expose the resistance pad 1.1a and the LED lamp pad 1.1b. Bake, print characters, bake and solidify, and then punch out the via hole 1.2a with a die. The hole edge of the via hole 1.2a has the exposed circuit pad 1.3a of the upper circuit board, which is made as shown in Figure 1.
  • the marking 1 in Fig. 1 and Fig. 2 indicates that it is a single-layer circuit board.
  • the double-sided flexible copper clad board is drilled, copper-immersed, copper-plated, dry-filmed, exposed, etched, film-removed, and screen-printed.
  • the front ink solder mask is exposed to expose the resistance pad 1.1a and the LED lamp pad 1.1b , Baking, and then screen printing the back ink solder mask, baking, characters, baking, and then punch out the via hole 1.2a with a mold, the hole edge of the via hole 1.2a has the exposed circuit pad of the upper circuit board 1.3a, make the upper layer double-layer circuit board 1 as shown in Figure 1, or shorten the upper layer circuit on both ends of the circuit board on the pads at the conduction welding position, so that it is on the conduction welding connection point, Only half of the upper-layer circuit’s conduction connection point 1.3b is exposed, and the other half is formed with a hole 1.2b, making the upper-layer double-layer circuit board 1 as shown in Fig. 2.
  • the marking 1 in Fig. 1 and Fig. 2 indicates It
  • 18T screen printing glue is used in several places on the back of the upper circuit board 1.
  • the screen is partly leaking and the part is not leaking.
  • the screen frame is placed on the screen printing table, and the backstage is aligned. Install positioning nails on the surface, place the back of the circuit board on the table, insert the positioning nails into the positioning holes for positioning, add glue to the net, print the acrylic adhesive for the flexible board 2 to multiple pre-designed positions on the board
  • the surface enters the tunnel furnace at 120°C for 3 minutes, and heats it to volatilize the solvent in the acrylic adhesive 2.
  • the single-sided flexible copper clad laminate with a copper thickness of 0.15mm is screen-printed with circuit corrosion-resistant ink, baked and cured, etched, and film-removed to produce a metal circuit 3.1 (as shown in Figure 4).
  • the PI cover film with holes is attached to the metal circuit 3.1, and the metal circuit 3.1 is exposed from the holes of the PI cover film, and then pressed and baked to form a lower metal single-layer circuit board (as shown in Figure 5),
  • the length of the lower metal single-layer circuit board is 0.5 to 300 meters.
  • Gap 3.2 is convenient for multi-directional turning installation of subsequent lamp belts.
  • Preferred embodiment (1) a combination of a single upper circuit board and a lower metal single layer board
  • the via holes on the upper circuit board 1 The metal circuit 3.1 is exposed at 1.2a, the front circuit pad 1.3a of the upper circuit board is exposed on the side of the via hole 1.2a, and the metal circuit 3.1 of the lower circuit board is exposed from the front at the via hole 1.2a ( As shown in Figure 7, Figure 10), or, at both ends of the circuit board, on the pads at the conduction welding position, shorten the upper layer circuit so that only half of the upper layer circuit’s conduction is exposed at the conduction welding connection point.
  • the metal circuit 3.1 of the lower circuit board is exposed from the front at the other half of the hole 1.2b (as shown in Figure 8 and Figure 11), and then use an iron to heat it to the upper plate to transfer the heat to the adhesive layer 2.
  • the adhesive 2 layers stick to the upper circuit board 1, the lower metal single layer circuit board 3, transfer the laminated board to the Bion quick press, use 150 degrees, pressure 120KG, press for 1 minute, take it out and enter again In the oven, bake at 150°C for 60 minutes to cure the glue, and then the intermittently layered flexible laminated light strip circuit board (as shown in Figure 7, Figure 8, Figure 10, and Figure 11) is produced, which is dedicated to the production of LED light strips.
  • Preferred embodiment (2) combination of multiple upper circuit boards and lower metal single layer boards
  • the adhesive 2 is folded down on the first section of the metal single-layer board 3, and the positioning nails on the board are also inserted into the positioning holes, so that the upper and lower layers are aligned.
  • the metal circuit 3.1 is exposed at the via hole 1.2a on the upper circuit board 1, and the front circuit pad 1.3a of the upper circuit board is exposed on the side of the via hole 1.2a, and the metal circuit 3.1 of the lower circuit board is exposed.
  • the single-layer or double-layer flexible circuit board of the front welding element is partially intermittently printed on the back of the adhesive, and then glued together with the metal single-layer circuit board on the back to form a structure of intermittent adhesion and intermittent layering, which greatly improves
  • the bending resistance of the light strip solves the problem of board breakage caused by many factors when the light strip is installed and used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明涉及一种间断分层的柔性叠层灯带线路板及制作方法,具体而言,将设计有导通孔的单层柔性线路板或者双层柔性线路板,在背面局部多个位置印刷胶粘剂,再制作一金属单层线路板,将背面已印刷胶的线路板和金属单层线路板粘贴在一起,形成间断粘合,间断分层的结构,制成双层或三层线路板,这种线路板是间断多处位置是分层结构的线路板,背面下层的单层线路板部分,和上层的单层线路板或双层线路板之间,是在局部多处位置是未有胶粘接的分层结构,这种分层线路板用于制作的LED灯带,灯带在弯折使用时更耐弯折。

Description

一种间断分层的柔性叠层灯带线路板及制作方法 技术领域
本发明涉及LED灯带领域,具体涉及一种间断分层的柔性叠层灯带线路板及制作方法。
背景技术
LED线路板灯带一直来,使用时很多位置根据需要都要弯曲使用,通常灯带在弯曲使用时,都非常容易造成线路板弯曲断裂,或者线路板断线,或者长灯带在安装时因自身重量重,因拉伸而断裂,或者是灯带线路板背面有厚的铜线或者铜排线,弯曲时,厚铜把线路板顶断,或者是灯带包的防水树脂弯曲时把线路板顶断,加之一些长灯带都是用焊锡连接的方式制作长灯带,但是,当需要制作超长灯带时,因负载大,载流量大,就必须要用厚铜做电路导体,然而,需要焊接连接的铜越厚用锡焊越不牢固,抗不了挠折,如何解决这个弯曲及拉伸易断的问题,提高抗挠折能,一直以来是业界的一个难题。
为了克服以上的缺陷和解决以上的技术难题,本发明线路板制作成间断分层的柔性叠层灯带线路板,将正面焊元件的单层或者双层柔性线路板,在背面局部间断印刷胶粘剂,再与背面的金属单层线路板粘贴在一起,形成间断粘合,间断分层的结构,大大提高了灯带的耐弯折性,解决了灯带在安装使用时诸多因素导致的断板问题,本发明还采取铜自身焊点融化融合在一起的方式,将多条短灯带首尾正负极铜焊接,制成的长灯带非常牢固,绕折时连接位不断裂,解决了传统锡焊抗挠折,抗拉强度不够的问题。
发明内容
本发明涉及一种间断分层的柔性叠层灯带线路板及制作方法,具体而言,将设计有导通孔的单层柔性线路板或者双层柔性线路板,在 背面局部多个位置印刷胶粘剂,再制作一金属单层线路板,将背面已印刷胶的线路板和金属单层线路板粘贴在一起,形成间断粘合,间断分层的结构,制成双层或三层线路板,这种线路板是间断多处位置是分层结构的线路板,背面下层的单层线路板部分,和上层的单层线路板或双层线路板之间,是在局部多处位置是未有胶粘接的分层结构,这种分层线路板用于制作的LED灯带,灯带在弯折使用时更耐弯折。
根据本发明提供了一种间断分层的柔性叠层灯带线路板的制作方法,具体而言,先制作完成一含多条灯带线路板的连体单层柔性线路板、或者一含多条灯带线路板的连体双层柔性线路板,用于叠层线路板的上层线路板,线路板正面用于焊元件,另外再制作一含多条连体的单层柔性线路板,用于叠层线路板的下层线路板,施加中间层的胶粘剂在上层线路板的背面,或者施加在下层线路板的一面,施加完成后,线路板上是多个位置形成局部有胶粘剂,然后再将上层单层线路板或者双层线路板,对位贴到下层线路板上,或者将上层线路板打孔后,再对位贴到下层线路板上,施加压力压合使上下两层线路板牢固粘接在一起,制成间断分层的柔性叠层灯带线路板,叠层灯带线路板的上层线路板和下层线路板之间的粘接,是形成的局部多处胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,间断分层的柔性叠层灯带线路板,是由两片不同的线路板重叠用胶粘剂粘接在一起形成的叠层线路板,叠在上层的是单层线路板或双层线路板,并且制作有和背面下层单层线路板之间可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点,可通过在板边用导电物连接导通,或/和在上层线路板设置有备用导通孔,导通孔边有露出的上层电路板正面线路上的导通连接点,下层的线路板上有金属在导通孔处从正面露出形成连接点,在此导通孔处,可用导电物使下层背面线路连接点和上层正面线路在孔边的连接点形成导电导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的分层缝隙的双 层板或三层板,缝隙与缝隙之间,有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属,与上层的单层线路板的背面或双层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路是有间断式的分层结构,制作的灯带提高了耐弯折性,同时又有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
根据本发明还提供了一种间断分层的柔性叠层灯带线路板的制作方法,具体而言,先制作完成多张含多条灯带线路板的单层连体柔性线路板、或者制作多张含多条灯带线路板的双层连体的柔性线路板,用于叠层的上层线路板,线路板正面用于焊元件,另外再制作一含多条灯带线路板的连体单层长线路板,用于叠层的下层线路板,施加胶粘剂在多张上层线路板的背面,或者施加在下层长线路板的一面,施加完成后,线路板上是多个位置形成局部有胶粘剂,然后再将多张上层单层柔性线路板或者多张双层柔性线路板,首尾排列对位贴到下层线路板上,或者将多张上层线路板打孔后,再首尾排列对位贴到下层线路板上,再施加压力压合使上下两层线路板牢固粘接在一起,制成叠层灯带线路板,叠层灯带线路板各上层线路板和下层线路板之间的粘接,是形成的局部多处有胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,即制成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板,所制作完成的间断分层的柔性叠层灯带线路板,是由多片线路板首尾排列通过胶粘剂粘接在下层的一片长线路板形成的叠层线路板,叠在上层的是单层线路板或双层线路板,制作完成后的叠层线路板是双层或者三层线路板,并且,上层线路板和背面下层单层线路板之间有可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,在上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点,可通过在板边施加导电物连接上 下层形成导通,或/和在上层线路板的板中设置有备用导通孔,导通孔边有露出的上层电路板的正面线路连接点,下层的线路板有金属在导通孔处从正面露出形成连接点,可通过导电物使上层焊盘和下层连接点连在一起形成导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板,缝隙与缝隙之间,有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属,与多张上层的单层线路板的背面或多张双层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路板是有间断式的分层结构,制作的灯带提高了耐弯折性,同时有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
根据本发明还提供了一种间断分层的柔性叠层灯带线路板,包括:叠在上层的单层线路板或双层线路板;中间的胶粘剂层;叠在下层的单层线路板;其特征在于,所述的间断分层的柔性叠层灯带线路板,是由在上层的含多条连体的单层线路板或双层线路板,通过胶粘剂层粘接在下层的含多条连体的单层线路板上,形成的叠层线路板,或者是由多张含多条连体的单层线路板或双层线路板首尾排列,通过胶粘剂层,粘接在下层的含多条连体的单层线路板上,叠层灯带线路板的所有上层线路板和下层线路板之间的粘接,是形成的局部多处胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,形成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板,所述的间断分层的柔性叠层灯带线路板,是由一张或多张线路板用胶粘剂形成间断粘接在下层的线路板上形成的叠层线路板,所述形成的叠层线路板是双层或者三层线路板,并且,上层线路板和下层单层线路板之间有可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,上层线路板上的板边缘有多个金属连接点对位下层线路板上的多 个金属连接点,可通过在板边施加导电物,连接上下两层的金属连接点形成导通,或/和在上层线路板的板中,设置有备用导通孔,导通孔边有露出的上层电路板正面线路上的金属导通连接点,下层的线路板有金属在导通孔处从正面露出形成连接点,可通过施加导电物使上层导通连接点和下层连接点连在一起形成导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板,缝隙与缝隙之间,有胶将下层的单层线路板上的线路金属或/和线路上的绝缘非金属,与单张上层线路板的背面或多张上层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路板是有间断式的分层结构,制作的灯带提高了耐弯折性,同时有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在上层的是双层线路板时,其双层线路之间互相导通的方式是,在设计的上下两层焊锡导通处用锡焊导通方式导通,或者是通过两层之间形成的通孔镀铜的方式导通,或者是用导电油墨导通。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的胶粘剂是可固化或已经形成固化的胶粘剂,或者是不干胶胶粘剂。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在下层的单层线路板是单层膜的线路板,承载线路的膜层,在叠层夹在线路板的板内分层缝隙处,或者是膜层在叠层线路板的最下层全裸露在外,或者,所述的叠在下层的单层线路板是双层膜的线路板,两层膜夹着中间线路层。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯 带线路板,其特征在于,所述的叠在下层的单层线路板,是多条金属线路并行排列的排线线路板,并行的排线是正负极电源线路,作用是用于为上层电路及元器件供电。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在下层的单层线路板,形成有多个切开的缝隙,形成的切开的缝隙是在相邻两电路之间,便于用此线路板制作的灯带在使用时可多向转弯安装。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述叠在下层的单层线路板的线路金属是铜、或铝、或铝镀镍、或铝镀锡、或铝镀铜、或铜包铝。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,焊LED的焊盘设置在正对分层结构的分层处,用所述线路板制作的LED灯带,在转弯处有LED灯时,转弯弯折不易造成LED灯珠脱离或断裂。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,在所述线路板的上层线路板的表面设置有含元器件的焊盘,设计的灯带线路板已明确设计制作成只在无焊盘的位置(不焊元件的位置)转弯,转弯处是分层结构,焊接LED的位置设置在正对上下两层线路板之间的粘接处。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在上层的单层线路板或双层线路板,是含有多个周期线路的线路板,每个周期的电路设计是相同的,当上层线路板设计有从头至尾的正负极电源主线时,上层线路板和下层线路板之间的备用导通连接点,设置在一个周期位置或者设置在多个周期位置,当上层线路板未设计从头至尾的电源主线时,上层线路板和下层线路板备用的导通连接点,设置在每个周期里,使用制作灯带时,必须每个周期都要有导电物连通。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯 带线路板,其特征在于,所述的导电物是锡、或锡合金、或导电油墨、或导电胶。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,上下两层线路板的导通,是通过上层线路板和下层线路板之间在分层处的裸露金属互相接触,形成的接触导通。
根据本发明的一优选实施例,所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述施加胶粘剂的施加方法是用印刷的方式施加胶粘剂、或者是用多头打胶机打胶的方式施加胶粘剂、或者是贴胶条。
在以下对附图和具体实施方式的描述中,将阐述本发明的一个或多个实施例的细节。
附图说明
通过结合以下附图阅读本说明书,本发明的特征、目的和优点将变得更加显而易见,对附图的简要说明如下。
图1为上层线路板,导通焊接位设置导通孔,导通孔边有露出的上层电路板的正面线路焊盘的平面示意图。
图2为上层线路板,两端的导通焊接位,在上层线路板的板边缘的导通焊接焊盘上,只露出一半的上层电路板的正面线路焊盘,另一半形成孔的平面示意图。
图3为在上层线路板的背面局部多处位置印刷胶粘剂后的平面示意图。
图4为背面下层的金属单层线路的平面示意图。
图5为设置有孔的膜,贴在背面下层的金属单层线路上,形成金属单层线路板的平面示意图。
图6为在金属单层线路板的相邻两电路之间,设置有多个缝隙的平面示意图。
图7为“图1”的上层线路板通过胶粘剂与下层的单层线路板贴合在一起,形成间断粘合,间断分层的结构的间断分层的柔性叠层灯 带线路板的平面示意图。
图8为“图2”的上层线路板通过胶粘剂与下层的单层线路板贴合在一起,形成间断粘合,间断分层的结构的间断分层的柔性叠层灯带线路板的平面示意图。
图9为多张上层线路板,首尾排列对位贴到下层线路板上的平面示意图。
图10为间断分层的柔性叠层灯带线路板,在导通孔位置处的截面示意图。
图11为间断分层的柔性叠层灯带线路板,在两端导通焊接位处的的截面示意图。
具体实施方式
下面将以优选实施例为例来对本发明进行详细的描述。
但是本领域技术人员应当理解,以下所述仅仅是举例说明和描述一些优选实施方式,对本发明的权利要求并不具有任何限制。
上层线路板的制作:
采用传统的线路板制作工艺,将单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、丝印正面油墨阻焊,露出电阻焊盘1.1a和LED灯焊盘1.1b,烘烤、印字符,烘烤固化、再用模具冲切出导通孔1.2a,导通孔1.2a的孔边有露出的上层电路板的正面线路焊盘1.3a,制作成如图1所示的上层单层线路板1,或者在线路板两端,在导通焊接位处的焊盘上,缩短上层线路,使其在导通焊接连接点上,只露出一半上层线路的导通连接点1.3b,另一半形成孔1.2b,制作成如图2所示的上层单层线路板1,在此加工步骤中、图1、图2中标识1表示是单层线路板。
或者是将双面柔性覆铜板经钻孔、沉铜、镀铜、贴干膜、曝光显景、蚀刻、退膜、丝印正面油墨阻焊,露出电阻焊盘1.1a和LED灯焊盘1.1b,烘烤、再丝印背面油墨阻焊,烘烤、字符,烘烤、再用模具冲切出导通孔1.2a,导通孔1.2a的孔边有露出的上层电路板的正面 线路焊盘1.3a,制作成如图1所示的上层双层线路板1,或者在线路板两端,在导通焊接位处的焊盘上,缩短上层线路,使其在导通焊接连接点上,只露出一半上层线路的导通连接点1.3b,另一半形成孔1.2b,制作成如图2所示的上层双层线路板1,在此加工步骤中、图1、图2中标识1表示是双层线路板。
根据设计的工程资料,在上层线路板1的背面的局部多处位置,用18T的丝网印胶,丝网是部分位置漏胶部分位置不漏胶,在丝印台上架上网框,对位后台面上装上定位钉,线路板背面朝上放置到台面上,定位钉进到定位孔里进行定位,胶加到网上面,印刷柔性板用的丙烯酸类胶粘剂2到板上多个预先设计的位置表面(如图3所示),进入隧道炉120度经3分钟,加温挥发掉丙烯酸胶粘剂2中的溶剂。
背面下层金属单层线路板的制作:
采用传统的线路板制作工艺,将铜厚0.15mm的单面柔性覆铜板经丝印电路抗蚀油墨、烘烤固化、蚀刻、退膜、制作出金属电路3.1(如图4所示),再将设置有孔的PI覆盖膜,贴在金属电路3.1上,金属电路3.1从PI覆盖膜的孔中露出,再经压合烘烤,制作成下层金属单层线路板(如图5所示),下层金属单层线路板的长度是0.5米至300米,在金属单层线路板上的相邻两电路3.1之间,用刀模冲切出多个缝隙3.2(如图6所示),此缝隙3.2便于后序灯带多向转弯安装。
间断分层的柔性叠层灯带线路板的制作:
优选实施例(1)、单张上层线路板和下层的金属单层板的组合
用一带定位钉的模板,将0.5米长的下层的金属单层板3置于模板上,定位钉进到板的定位孔里,再将上层已印有胶粘剂2的单层板1、或者双层板1,胶粘剂2朝下叠到金属单层板3上,也使板上的定位钉进到定位孔里,使上下两层对准位置,此时,上层线路板1上的导通孔1.2a处露出了金属电路3.1,导通孔1.2a的边上有露出的上层电路板的正面线路焊盘1.3a,下层的线路板的金属电路3.1在导通孔 1.2a处从正面露出(如图7、图10所示),或者,在线路板两端,在导通焊接位处的焊盘上,缩短上层线路,使其在导通焊接连接点上,只露出一半上层线路的导通连接点1.3b,下层的线路板的金属电路3.1在另一半孔1.2b处从正面露出(如图8、图11所示),然后用熨斗加热到上层板上使传热到胶粘剂2层,让胶粘剂2层粘住上层线路板1,下层金属单层线路板3,把已叠好的板转到比昂快压机里,用150度,压力120KG,压1分钟,取出后再进入烤箱里,150度烤60分钟使胶固化,即制作完成间断分层的柔性叠层灯带线路板(如图7、图8、图10、图11所示),专用于制作LED灯带。
优选实施例(2)、多张上层线路板和下层的金属单层板的组合
用一带定位钉的模板,将100米长的下层的金属单层板3的第一段置于模板上,定位钉进到板的定位孔里,再将第一张上层已印有胶粘剂2的单层板1、或者双层板1,胶粘剂2朝下叠到金属单层板3的第一段上,也使板上的定位钉进到定位孔里,使上下两层对准位置,此时,上层线路板1上的导通孔1.2a处露出了金属电路3.1,导通孔1.2a的边上有露出的上层电路板的正面线路焊盘1.3a,下层的线路板的金属电路3.1在导通孔1.2a处从正面露出(如图9、图10所示),或者,在线路板两端,在导通焊接位处的焊盘上,缩短上层线路,使其在导通焊接连接点上,只露出一半上层线路的导通连接点1.3b,下层的线路板的金属电路3.1在另一半孔1.2b处从正面露出(如图9、图11所示),然后用熨斗加热到上层板上使传热到胶粘剂2层,让胶粘剂2层粘住上层线路板1,下层金属单层线路板3,接下来依次将第二、第三、第四张,直到最后一张上层已印有胶粘剂2的单层板1、或者双层板1,按照以上的方法,首尾排列对位贴到下层金属单层线路板3上,然后用比昂整卷快压机里,每段用150度,压力120KG,压1分钟的参数,依次逐段压合,再放入烤箱里,150度烤60分钟使胶固化,即制作完成间断分层的柔性叠层灯带线路板(如图7、图8、图10、图11所示),专用于制作LED灯带。
本发明将正面焊元件的单层或者双层柔性线路板,在背面局部间断印刷胶粘剂,再与背面的金属单层线路板粘贴在一起,形成间断粘合,间断分层的结构,大大提高了灯带的耐弯折性,解决了灯带在安装使用时诸多因素导致的断板问题。
以上结合附图将一种间断分层的柔性叠层灯带线路板及制作方法的具体实施例对本发明进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本发明的范围,尤其是权利要求的范围,并不具有任何限制。

Claims (15)

  1. 一种间断分层的柔性叠层灯带线路板的制作方法,具体而言,先制作完成一含多条灯带线路板的连体单层柔性线路板、或者一含多条灯带线路板的连体双层柔性线路板,用于叠层线路板的上层线路板,线路板正面用于焊元件,另外再制作一含多条连体的单层柔性线路板,用于叠层线路板的下层线路板,施加中间层的胶粘剂在上层线路板的背面,或者施加在下层线路板的一面,施加完成后,线路板上是多个位置形成局部有胶粘剂,然后再将上层单层线路板或者双层线路板,对位贴到下层线路板上,或者将上层线路板打孔后,再对位贴到下层线路板上,施加压力压合使上下两层线路板牢固粘接在一起,制成间断分层的柔性叠层灯带线路板,叠层灯带线路板的上层线路板和下层线路板之间的粘接,是形成的局部多处胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,间断分层的柔性叠层灯带线路板,是由两片不同的线路板重叠用胶粘剂粘接在一起形成的叠层线路板,叠在上层的是单层线路板或双层线路板,并且制作有和背面下层单层线路板之间可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点,可通过在板边用导电物连接导通,或/和在上层线路板设置有备用导通孔,导通孔边有露出的上层电路板正面线路上的导通连接点,下层的线路板上有金属在导通孔处从正面露出形成连接点,在此导通孔处,可用导电物使下层背面线路连接点和上层正面线路在孔边的连接点形成导电导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的分层缝隙的双层板或三层板,缝隙与缝隙之间,有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属,与上层的单层线路板的背面或双层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔 性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路是有间断式的分层结构,制作的灯带提高了耐弯折性,同时又有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
  2. 一种间断分层的柔性叠层灯带线路板的制作方法,具体而言,先制作完成多张含多条灯带线路板的单层连体柔性线路板、或者制作多张含多条灯带线路板的双层连体的柔性线路板,用于叠层的上层线路板,线路板正面用于焊元件,另外再制作一含多条灯带线路板的连体单层长线路板,用于叠层的下层线路板,施加胶粘剂在多张上层线路板的背面,或者施加在下层长线路板的一面,施加完成后,线路板上是多个位置形成局部有胶粘剂,然后再将多张上层单层柔性线路板或者多张双层柔性线路板,首尾排列对位贴到下层线路板上,或者将多张上层线路板打孔后,再首尾排列对位贴到下层线路板上,再施加压力压合使上下两层线路板牢固粘接在一起,制成叠层灯带线路板,叠层灯带线路板各上层线路板和下层线路板之间的粘接,是形成的局部多处有胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,即制成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板,所制作完成的间断分层的柔性叠层灯带线路板,是由多片线路板首尾排列通过胶粘剂粘接在下层的一片长线路板形成的叠层线路板,叠在上层的是单层线路板或双层线路板,制作完成后的叠层线路板是双层或者三层线路板,并且,上层线路板和背面下层单层线路板之间有可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,在上层线路板上的板边缘有多个连接点对位下层线路板上的多个连接点,可通过在板边施加导电物连接上下层形成导通,或/和在上层线路板的板中设置有备用导通孔,导通孔边有露出的上层电路板的正面线路连接点,下层的线路板有金属在导通孔处从正面露出形成连接点,可通过导电物使上层焊盘和下层连接点连在一起形成导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的 分层缝隙的双层线路板或三层线路板,缝隙与缝隙之间,有胶将下层的线路板上的线路金属或/和线路上的绝缘非金属,与多张上层的单层线路板的背面或多张双层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路板是有间断式的分层结构,制作的灯带提高了耐弯折性,同时有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
  3. 一种间断分层的柔性叠层灯带线路板,包括:
    叠在上层的单层线路板或双层线路板;
    中间的胶粘剂层;
    叠在下层的单层线路板;
    其特征在于,所述的间断分层的柔性叠层灯带线路板,是由在上层的含多条连体的单层线路板或双层线路板,通过胶粘剂层粘接在下层的含多条连体的单层线路板上,形成的叠层线路板,或者是由多张含多条连体的单层线路板或双层线路板首尾排列,通过胶粘剂层,粘接在下层的含多条连体的单层线路板上,叠层灯带线路板的所有上层线路板和下层线路板之间的粘接,是形成的局部多处胶粘剂的间断粘接,未粘接的多个位置是形成有分开的缝隙,形成的柔性叠层灯带线路板是间断分层的柔性叠层灯带线路板,所述的间断分层的柔性叠层灯带线路板,是由一张或多张线路板用胶粘剂形成间断粘接在下层的线路板上形成的叠层线路板,所述形成的叠层线路板是双层或者三层线路板,并且,上层线路板和下层单层线路板之间有可形成互相导通的备用导通连接点,备用导通连接点在上层线路板的板边,上层线路板上的板边缘有多个金属连接点对位下层线路板上的多个金属连接点,可通过在板边施加导电物,连接上下两层的金属连接点形成导通,或/和在上层线路板的板中,设置有备用导通孔,导通孔边有露出的上 层电路板正面线路上的金属导通连接点,下层的线路板有金属在导通孔处从正面露出形成连接点,可通过施加导电物使上层导通连接点和下层连接点连在一起形成导通,所述的间断分层的柔性叠层灯带线路板,是在板内形成有多个间断的分层缝隙的双层线路板或三层线路板,缝隙与缝隙之间,有胶将下层的单层线路板上的线路金属或/和线路上的绝缘非金属,与单张上层线路板的背面或多张上层线路板的背面形成粘接,并且形成的是多个位置的间断式粘接,下层背面线路板的线路金属厚度大于或等于上层线路板的线路金属的厚度,制作的间断分层柔性叠层灯带线路板是用于制作LED灯带,用所述线路板制作的灯带因线路板是有间断式的分层结构,制作的灯带提高了耐弯折性,同时有多个位置形成有间断式的层间叠层粘接,同时又保证了用叠层线路板制作的灯带有相对牢固的整体结构。
  4. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在上层的是双层线路板时,其双层线路之间互相导通的方式是,在设计的上下两层焊锡导通处用锡焊导通方式导通,或者是通过两层之间形成的通孔镀铜的方式导通,或者是用导电油墨导通。
  5. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的胶粘剂是可固化或已经形成固化的胶粘剂,或者是不干胶胶粘剂。
  6. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在下层的单层线路板是单层膜的线路板,承载线路的膜层,在叠层夹在线路板的板内分层缝隙处,或者是膜层在叠层线路板的最下层全裸露在外,或者,所述的叠在下层的单层线路板是双层膜的线路板,两层膜夹着中间线路层。
  7. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在下层的单层线路板,是多条金属线路并行排列的排线线路板,并行的排线是正负极电源线路,作用是 用于为上层电路及元器件供电。
  8. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在下层的单层线路板,形成有多个切开的缝隙,形成的切开的缝隙是在相邻两电路之间,便于用此线路板制作的灯带在使用时可多向转弯安装。
  9. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述叠在下层的单层线路板的线路金属是铜、或铝、或铝镀镍、或铝镀锡、或铝镀铜、或铜包铝。
  10. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,焊LED的焊盘设置在正对分层结构的分层处,用所述线路板制作的LED灯带,在转弯处有LED灯时,转弯弯折不易造成LED灯珠脱离或断裂。
  11. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,在所述线路板的上层线路板的表面设置有含元器件的焊盘,设计的灯带线路板已明确设计制作成只在无焊盘的位置(不焊元件的位置)转弯,转弯处是分层结构,焊接LED的位置设置在正对上下两层线路板之间的粘接处。
  12. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的叠在上层的单层线路板或双层线路板,是含有多个周期线路的线路板,每个周期的电路设计是相同的,当上层线路板设计有从头至尾的正负极电源主线时,上层线路板和下层线路板之间的备用导通连接点,设置在一个周期位置或者设置在多个周期位置,当上层线路板未设计从头至尾的电源主线时,上层线路板和下层线路板备用的导通连接点,设置在每个周期里,使用制作灯带时,必须每个周期都要有导电物连通。
  13. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述的导电物是锡、或锡合金、或导电油墨、或导电胶。
  14. 根据权利要求1或2或3所述的一种间断分层的柔性叠层灯带线路板,其特征在于,上下两层线路板的导通,是通过上层线路板和下层线路板之间在分层处的裸露金属互相接触,形成的接触导通。
  15. 根据权利要求1或2所述的一种间断分层的柔性叠层灯带线路板,其特征在于,所述施加胶粘剂的施加方法是用印刷的方式施加胶粘剂、或者是用多头打胶机打胶的方式施加胶粘剂、或者是贴胶条。
PCT/CN2020/109147 2019-09-27 2020-08-14 一种间断分层的柔性叠层灯带线路板及制作方法 WO2021057321A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103906344A (zh) * 2013-12-01 2014-07-02 吴祖 导热型双面电路板
CN105172089A (zh) * 2015-10-16 2015-12-23 中山市欧曼科技照明有限公司 一种led柔性灯带的生产方法
CN109282179A (zh) * 2018-09-13 2019-01-29 湖南华特光电科技有限公司 一种柔性led灯带

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103906344A (zh) * 2013-12-01 2014-07-02 吴祖 导热型双面电路板
CN105172089A (zh) * 2015-10-16 2015-12-23 中山市欧曼科技照明有限公司 一种led柔性灯带的生产方法
CN109282179A (zh) * 2018-09-13 2019-01-29 湖南华特光电科技有限公司 一种柔性led灯带

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