WO2021047469A1 - 一种双面生理数值测试片的制备方法及产品 - Google Patents

一种双面生理数值测试片的制备方法及产品 Download PDF

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WO2021047469A1
WO2021047469A1 PCT/CN2020/113728 CN2020113728W WO2021047469A1 WO 2021047469 A1 WO2021047469 A1 WO 2021047469A1 CN 2020113728 W CN2020113728 W CN 2020113728W WO 2021047469 A1 WO2021047469 A1 WO 2021047469A1
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layer
film
photoresist
photoresist layer
double
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French (fr)
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赖欣怡
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浙江大学
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/27Association of two or more measuring systems or cells, each measuring a different parameter, where the measurement results may be either used independently, the systems or cells being physically associated, or combined to produce a value for a further parameter
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface

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  • the invention relates to the technical field of test pieces, in particular to a preparation method and product of a double-sided physiological value test piece.
  • diabetes is a metabolic disease, and its characteristic is that the patient's blood glucose level is at a high level for a long time. And this state of high blood sugar will cause three high and one low symptoms: polyphagia, polydipsia, polyuria, and weight loss. If the persistent symptoms are not treated, it may cause many subsequent complications, such as blurred vision, headache, muscle weakness, etc.
  • the current commonly used detection methods usually use a blood glucose value test piece to detect the blood glucose concentration in the blood.
  • This detection method requires a blood glucose machine to measure the blood glucose content in the blood based on the principle of electrochemical analysis. Therefore, the blood glucose test piece, as a more commonly used blood glucose testing method, has a considerable demand in the market.
  • the Chinese patent document with the publication number CN1982886A discloses a batch manufacturing method of electrochemical biosensing test piece and its metal electrode manufacturing method.
  • a metal film is obtained, and then multiple strips are cut on the metal film by die cutting.
  • the electrode separation line separates the same metal film into a number of metal electrodes required for the detection of electrochemical sensing test pieces; because the metal film can be made in a large area in a roll in advance, it can be cut quickly when it is cut with a knife.
  • Cutting out a batch of metal electrodes the cutting edge is flat and there is no problem of chemical residues. Therefore, the cutting method of the invention uses a knife die to cut the cost lower than that of laser cutting, and can quickly and batch produce electrochemical products. High-quality metal electrodes are required for biosensing test strips.
  • the purpose of the present invention is to provide a preparation method and product of a double-sided physiological value test piece.
  • the preparation method provided by the present invention can effectively simplify the preparation process.
  • a method for preparing a double-sided physiological value test sheet comprising the following steps:
  • the pattern layer includes a first photoresist layer that has not been removed by irradiation and a first surface of the thin film layer exposed after the first photoresist layer is removed by irradiation;
  • step (3) The pattern layer formed in step (2) is plated with a metal layer
  • step (3) The first photoresist layer that has not been removed by irradiation in step (3) is removed, and the metal layer on the first surface forms a test circuit;
  • step (4) Coating a layer of insulating material on the test circuit formed in step (4) to form an insulating layer, the height of the insulating layer is greater than the thickness of the test circuit, and then coating photoresist on the insulating layer After the material, the second photoresist layer is formed; the second photoresist layer is shielded by the mask, the second photoresist layer above the test circuit is removed after irradiation, and then the insulating layer and the insulating layer above the test circuit are removed. The second photoresist layer that has not been removed by irradiation, and an insulating layer is formed between the test lines;
  • the first or second photoresist layer that has not been removed by irradiation refers to the area of the photoresist layer shielded by the mask, and the first photoresist layer removed by irradiation is exposed
  • the film layer refers to the area of the photoresist layer that is not shielded by the mask, and the film layer is exposed after the photoresist layer is removed.
  • the film is selected from polyamide film, polyester film, polyimide film, polyethylene terephthalate film or polyvinyl chloride film.
  • the heat-resistant temperature of the adhesive is greater than 100 degrees Celsius, and the adhesive force between the adhesive and the substrate is greater than the adhesive force between the adhesive and the film.
  • the materials of the first photoresist layer and the second photoresist layer are independently photoresist liquid or ink.
  • the material of the metal layer is selected from gold, palladium, silver or platinum.
  • the present invention also provides a double-sided physiological value test sheet prepared according to the above preparation method, which includes a film layer and test circuits arranged on both surfaces of the film layer.
  • the method for preparing a double-sided physiological value test sheet provided by the present invention can form the test circuit on the second surface of the film after the film is removed from the substrate after the test circuit is formed on the first surface of the film.
  • the second test line The preparation method provided by the invention can not only effectively simplify the existing preparation process, but also the prepared test piece can be used as a double-sided test piece.
  • Fig. 1 is a flowchart of a method for preparing a double-sided physiological value test sheet provided by the present invention
  • Figure 2 is a three-dimensional view of a double-sided physiological value test sheet prepared by the present invention.
  • 3a to 3l in FIG. 3 are schematic diagrams of the process of preparing the double-sided physiological value test sheet in the embodiment, where 1 is a film, 2 is a substrate, 11 is a first surface, 12 is a second surface; 111 is a first surface A photoresist layer, 112 is a mask with a set pattern, 113 is a metal layer, 114 is a test circuit, 115 is an insulating layer, 116 is a second photoresist layer, and 117 is a mask.
  • the preparation method of the double-sided physiological value test sheet provided by the present invention includes the following steps:
  • Pasting step S1 As shown in 3a in FIG. 3, the film 1 is pasted on the substrate 2 through an adhesive, wherein the film 1 includes a first surface 11 and a second surface 12, and the first surface 11 and the second surface The surfaces 12 are respectively located on opposite sides, and the second surface 12 faces the substrate 2 to adhere to each other.
  • Pattern forming step S2 As shown in 3b and 3c in FIG. 3, the first surface 11 of the film 1 is coated with a photoresist material to form a first photoresist layer 111, and the pattern mask 112 with the set pattern is aligned with the first surface 11 of the film 1.
  • a photoresist layer 111 is shielded and is irradiated with ultraviolet light to form a pattern layer.
  • the pattern layer includes a first photoresist layer 111 that has not been removed by irradiation and a first surface 11 exposed after the first photoresist layer 111 is removed by irradiation.
  • Metal layer forming step S3 as shown in 3d in FIG. 3, the pattern layer formed in step S2 is plated with a metal layer 113.
  • Test circuit forming step S4 As shown in 3e and 3f in FIG. 3, the first photoresist layer 111 and the metal layer 113 on the first photoresist layer 111 that have not been removed in step S3 are removed. The metal layer 113 on the surface 11 forms a test circuit 114.
  • Insulation layer forming step S5 As shown in 3g-3l in Figure 3, a layer of insulating material is coated on the test circuit 114 to form an insulating layer 115, the height of the insulating layer 115 is greater than the thickness of the test circuit 114, and then the insulating layer 115 is coated After disposing the photoresist material, the second photoresist layer 116 is formed; the second photoresist layer 116 is shielded by the mask 117, the second photoresist layer 116 above the test circuit 114 is removed after ultraviolet light irradiation, and then plasma is used The insulating layer 115 above the test circuit 114 and the second photoresist layer 116 not removed by irradiation are removed, and an insulating layer 115 is formed between the test circuits 114.
  • the second surface 12 side is pasted on the substrate 2, and steps S1-S5 are repeated to obtain a test piece with a test circuit and an insulating layer on both sides.
  • the structure diagram of the prepared test piece is shown in FIG. 2, and the test circuit 114 and the insulating layer are provided on the two opposite surfaces 11 and 12 of the film 1.
  • the film is a polyimide film (PI).
  • PI polyimide film
  • the PI film has excellent radiation resistance, high dielectric constant, electrical insulation, high temperature resistance and low temperature resistance, etc., but it is not limited to this.
  • Other materials with the aforementioned excellent properties are also feasible solutions.
  • the substrate may be glass, but is not limited thereto.
  • the heat-resistant temperature of the adhesive is greater than 100 degrees Celsius, because an environment higher than 100 degrees Celsius may occur during the preparation process, so the heat-resistant temperature of the adhesive must be greater than 100 degrees Celsius, which will make the film and glass bond stable , It is not easy to be affected by other factors and shift.
  • the adhesive force of the adhesive on the substrate 2 is greater than the adhesive force of the adhesive on the film 1, so that when the film 1 is removed, the film 1 can be easily removed from the substrate 2. Bottom, and because the adhesive force between the adhesive and the substrate 2 is relatively large, the adhesive is left on the substrate and will not remain on the film 1.
  • the materials of the first photoresist layer and the second photoresist layer are photoresist liquid or ink, but not limited thereto.
  • the material of the metal layer can be selected from gold, palladium, silver, platinum or other precious metals.
  • the preparation method provided by the present invention uses a lift-off process, but is not limited to this.
  • the film 1 is adhered to the substrate 2 with the second surface 12.
  • the first photoresist layer 111 is formed on the first surface 11, which can be formed by using photoresist or ink.
  • a photomask 112 is used to cover the first photoresist layer 111 and expose with ultraviolet light.
  • the photomask 112 is removed so that the first photoresist layer 111 is formed on the first surface 11 of the film 1 at intervals.
  • a metal layer 113 is formed on the first photoresist layer 111 on the first surface 11 of the film 1.
  • the metal layer 113 can be formed by sputtering.
  • a plasma gun is used to precisely remove a portion of the metal layer 113 and the first photoresist layer 111 on the first surface 11 of the film 1.
  • the test circuit 114 is formed.
  • the method for manufacturing a double-sided physiological value test sheet of the present invention can effectively simplify the current manufacturing process, and at the same time, can achieve the effect of making a double-sided physiological value test sheet.

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  • Health & Medical Sciences (AREA)
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  • Investigating Or Analysing Biological Materials (AREA)
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Abstract

一种双面生理数值测试片的制备方法,制备方法包括以下步骤:通过胶黏剂将薄膜(1)的第二表面(12)粘贴于基材(2)上(S1);在薄膜(1)的第一表面(11)涂布光阻材料后形成第一光阻层(111),用图罩(112)对第一光阻层(111)进行屏蔽,进行照射后形成图样层(S2);在图样层镀上一层金属层(113)(S3);移除未经照射去除的第一光阻层(111),位于第一表面(11)上的金属层(113)形成测试线路(114)(S4);在测试线路(114)上涂布一层绝缘材料形成绝缘层(115),在绝缘层(115)上涂布光阻材料后形成第二光阻层(116);通过图罩(117)去除位于测试线路(114)上方的第二光阻层(116),再移除测试线路(114)上方的绝缘层(115)和未经照射去除的第二光阻层(116),测试线路间形成绝缘层(115)(S5);将第一表面(11)粘贴于基材(2)上,重复上述步骤,得到测试片。双面生理数值测试片的制备方法可以有效简化制备流程。

Description

一种双面生理数值测试片的制备方法及产品
本申请要求于2019年09月09日提交中国专利局、申请号为CN201910865040.5、发明名称为“一种双面生理数值测试片的制备方法及产品”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本发明涉及测试片技术领域,特别涉及一种双面生理数值测试片的制备方法及产品。
背景技术
随着医疗技术的进步,人类平均寿命不断的延长,却也伴随着各种疾病的出现。其中,糖尿病是一种代谢性疾病,它的特征是患者的血糖值长期的处于一个较高的水平。而这种高血糖的状态即会造成三高一少的症状:多食、多饮、多尿以及体重下降。若持续症状不进行治疗,则可能引发后续许多并发症,例如:视力模糊、头痛、肌肉无力等等。
而为了避免上述情况发生,随时地监控血糖浓度是控制糖尿病过程的重要步骤。目前常用的检测方法通常都会使用一种血糖数值测试片来检测血液中的血糖浓度,这种检测方法需要配合血糖机以电化学分析的原理来测量血液当中的血糖含量。因此,血糖测试片作为目前较为常用的一种血糖测试方法,其在市场上存在相当大的需求。
现有血糖测试片技术都在一张基板上同时形成多条测试线路,再切割该基板形成多个测试片。如公开号为CN1982886A的中国专利文献公开了一种电化学生物感测试片成批制法及其金属电极制法,先取得一金属薄膜,再以刀模切割方式在金属薄膜上切割出多条电极分隔线,使同一金属薄膜分割出多个电化学感测试片检测所需的金属电极;由于金属薄膜可预先以成卷方式大面积制作,配合刀模进行切割时,可迅速将该金属薄膜切割出成批的金属电极,切边平整而且完全没有化学药品残留的问题,故该发明采用刀模进行切割方式相较于雷射切割的成本来得更低,而能快速且成批生产电化学生物感测试片所需高质量的金属电极。
然而,这种血糖测试片的制备方法复杂和成本较高。
因此一种可以改善前述缺失的双面生理数值测试片制造方法为目前相关业界的发展目标之一。
发明内容
本发明之目的在于提供一种双面生理数值测试片的制备方法及产品,本发明提供的制备方法可以有效简化制备流程。
一种双面生理数值测试片的制备方法,所述制备方法包括以下步骤:
(1)通过胶黏剂将薄膜的第二表面粘贴于基材上,其中,薄膜的两个相对面中的任一面为第一表面,所述第一表面的相对侧为第二表面;
(2)在薄膜的第一表面涂布光阻材料后形成第一光阻层,将带有设定图样的图罩对所述第一光阻层进行屏蔽,进行照射后形成图样层,所述图样层包括未经照射去除的第一光阻层和经照射去除第一光阻层后露出的薄膜层的第一表面;
(3)在步骤(2)形成的所述图样层镀上一层金属层;
(4)移除步骤(3)中所述未经照射去除的第一光阻层,位于所述第一表面上的金属层形成测试线路;
(5)在步骤(4)形成的所述测试线路上涂布一层绝缘材料形成绝缘层,所述绝缘层的高度大于所述测试线路的厚度,再在所述绝缘层上涂布光阻材料后形成第二光阻层;通过图罩对所述第二光阻层进行屏蔽,进行照射后去除位于所述测试线路上方的第二光阻层,再移除测试线路上方的绝缘层和未经照射去除的第二光阻层,所述测试线路间形成绝缘层;
(6)将所述薄膜从基板上取下后,将第一表面粘贴于基板上,重复步骤(1)~(5),得到双面具有测试线路和绝缘层的测试片。
优选的,在步骤(2)和(5)中,未经照射去除的第一或第二光阻层是指图罩屏蔽的光阻层的区域,经照射去除的第一光阻层后露出的薄膜层是指图罩未屏蔽的光阻层的区域,光阻层经去除后则露出薄膜层。
优选的,所述薄膜选自聚酰胺薄膜、聚酯薄膜、聚酰亚胺薄膜、聚对苯二甲酸乙二酯薄膜或聚氯乙烯薄膜。
优选的,所述胶黏剂的耐热温度大于100摄氏度,所述胶黏剂与基材的粘接力大于胶黏剂与薄膜的粘接力。
优选的,所述第一光阻层和第二光阻层的材料独立地为光阻液或油墨。
优选的,所述金属层的材料选自金、钯、银或铂。
本发明还提供一种根据上述制备方法制备的双面生理数值测试片,包括薄膜层,和在薄膜层两表面设置的测试线路。
与现有技术相比,本发明提供的双面生理数值测试片的制备方法在薄膜的第一表面上形成该测试线路后,从基材将薄膜取下后可以在薄膜的第二表面上形成第二测试线路。本发明提供的制备方法不仅可以有效的简化现有制备流程,同时制备的测试片可以用作双面测试片。
说明书附图
图1为本发明提供的双面生理数值测试片的制备方法的流程图;
图2为本发明制备的双面生理数值测试片的立体图;
图3中的3a~3l为实施例中双面生理数值测试片的制备方法的工艺示意图,其中,1为薄膜,2为基材,11为第一表面,12为第二表面;111为第一光阻层,112为带有设定图样的图罩,113为金属层,114为测试线路,115为绝缘层,116为第二光阻层,117为图罩。
具体实施方式
为使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例对本发明进行进一步的详细说明。应当理解,此处所描述的具体实施方式仅仅用以解释本发明,并不限定本发明的保护范围。此外,附图仅用于示意性地加以说明,并未依照其原尺寸进行绘制。
如图1和图3中的3a-3l所示,本发明提供的双面生理数值测试片的制备方法包括以下步骤:
粘贴步骤S1:如图3中的3a所示,通过胶黏剂将薄膜1粘贴于基材2上,其中,薄膜1包括第一表面11和第二表面12,第一表面11与该第二表面12分别位于相对侧,且第二表面12面对于基材2以相粘合。
图样成形步骤S2:如图3中的3b和3c所示,在薄膜1的第一表面11涂布光阻材料后形成第一光阻层111,将带有设定图样的图罩112对第 一光阻层111进行屏蔽,进行紫外光照射后形成图样层,图样层包括未经照射去除的第一光阻层111和经照射去除第一光阻层111后露出的第一表面11。
金属层成形步骤S3:如图3中的3d所示,在步骤S2形成的图样层镀上一层金属层113。
测试线路成形步骤S4:如图3中的3e和3f所示,移除步骤S3中未经照射去除的第一光阻层111和位于第一光阻层111上的金属层113,位于第一表面11上的金属层113形成测试线路114。
绝缘层成形步骤S5:如图3中3g-3l所示,测试线路114上涂布一层绝缘材料形成绝缘层115,绝缘层115的高度大于测试线路114的厚度,再在绝缘层115上涂布光阻材料后形成第二光阻层116;通过图罩117对第二光阻层116进行屏蔽,进行紫外光照射后去除位于测试线路114上方的第二光阻层116,再使用电浆去除测试线路114上方的绝缘层115和进行照射未去除的第二光阻层116,测试线路114间形成绝缘层115。
将薄膜1从基板2上取下后,将第二表面12侧粘贴于基板2上,重复步骤S1-S5,得到双面具有测试线路和绝缘层的测试片。制备的测试片的结构示意图如图2所示,在薄膜1的两个相对面11和12上具有测试线路114和绝缘层。
其中,薄膜为聚酰亚胺薄膜(Polyimide Film;PI),PI膜具有优良的耐辐射性、高介电常数、电器绝缘性、耐高温以及耐低温等等特性,但不限于此,若为其他具有前述优良特性的材料也为可行的方案。基材可为玻璃,但不限于此。
较佳地,胶黏剂的耐热温度大于100摄氏度,其因制备过程中可能出现高于100摄氏度的环境,因此该胶黏剂耐热温度需大于100摄氏度,将可使薄膜与玻璃结合稳定,不易受到其他因素影响而移位。并且胶黏剂粘合于基材2上的粘接力大于胶黏剂粘合于薄膜1的粘接力,从而在取下薄膜1时,可以轻易的将该薄膜1从基材2上取下,并且因胶黏剂与基材2的粘接力较大而将胶黏剂留在基材上,不会残留于薄膜1。
其中,第一光阻层和第二光阻层的材料为光阻液或油墨,但不限于此。金属层的材料可以选自金、钯、银、铂或其他贵金属。
本发明提供的制备方法采用了掀离(lift-off)制程,但不限于此。
于本实施例中,薄膜1以第二表面12黏贴于基材2上。于图3a中,首先,先于第一表面11上形成第一光阻层111,可利用光阻或油墨来形成。于图3b中,利用一光罩112覆盖于第一光阻层111上并进行紫外光曝光。于图3c中,移除光罩112以使第一光阻层111间隔形成于薄膜1的第一表面11上。于图3d中,在薄膜1的第一表面11的第一光阻层111上形成金属层113,例如,可利用溅镀方式形成金属层113。于图3e中,以电浆枪精准地移除薄膜1的第一表面11上部分金属层113以及第一光阻层111,于图3f中,最后,形成该测试线路114。
因此,本发明双面生理数值测试片制造方法可以有效的简化现行制程,同时还可以达到制作双面生理数值测试片之效果。
以上实施例的说明只是用于帮助理解本发明的方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求的保护范围内。对这些实施例的多种修改对本领域的专业技术人员来说是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (6)

  1. 一种双面生理数值测试片的制备方法,其特征在于,所述制备方法包括以下步骤:
    (1)通过胶黏剂将薄膜的第二表面粘贴于基材上,其中,薄膜的两个相对面中的任一面为第一表面,所述第一表面的相对侧为第二表面;
    (2)在薄膜的第一表面涂布光阻材料后形成第一光阻层,将带有设定图样的图罩对所述第一光阻层进行屏蔽,进行照射后形成图样层,所述图样层包括未经照射去除的第一光阻层和经照射去除第一光阻层后露出的薄膜层的第一表面;
    (3)在步骤(2)形成的所述图样层镀上一层金属层;
    (4)移除步骤(3)中所述未经照射去除的第一光阻层,位于所述第一表面上的金属层形成测试线路;
    (5)在步骤(4)形成的所述测试线路上涂布一层绝缘材料形成绝缘层,所述绝缘层的高度大于所述测试线路的厚度,再在所述绝缘层上涂布光阻材料后形成第二光阻层;通过图罩对所述第二光阻层进行屏蔽,进行照射后去除位于所述测试线路上方的第二光阻层,再移除测试线路上方的绝缘层和未经照射去除的第二光阻层,所述测试线路间形成绝缘层;
    (6)将所述薄膜从基板上取下后,将第一表面粘贴于基板上,重复步骤(1)~(5),得到双面具有测试线路和绝缘层的测试片。
  2. 根据权利要求1所述的双面生理数值测试片的制备方法,其特征在于,所述薄膜选自聚酰胺薄膜、聚酯薄膜、聚酰亚胺薄膜、聚对苯二甲酸乙二酯薄膜或聚氯乙烯薄膜。
  3. 根据权利要求1或2所述的双面生理数值测试片的制备方法,其特征在于,所述胶黏剂的耐热温度大于100摄氏度,所述胶黏剂与基材的粘接力大于所述胶黏剂与薄膜的粘接力。
  4. 根据权利要求1所述的双面生理数值测试片的制备方法,其特征在于,所述第一光阻层和第二光阻层的材料独立地为光阻液或油墨。
  5. 根据权利要求1所述的双面生理数值测试片的制备方法,其特征在于,所述金属层的材料选自金、钯、银或铂。
  6. 一种根据权利要求1~5任一所述的双面生理数值测试片的制备方 法所制备的双面生理数值测试片,包括薄膜层和在所述薄膜层两表面设置的测试线路。
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