WO2021015099A1 - 露光装置及び露光方法 - Google Patents

露光装置及び露光方法 Download PDF

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Publication number
WO2021015099A1
WO2021015099A1 PCT/JP2020/027723 JP2020027723W WO2021015099A1 WO 2021015099 A1 WO2021015099 A1 WO 2021015099A1 JP 2020027723 W JP2020027723 W JP 2020027723W WO 2021015099 A1 WO2021015099 A1 WO 2021015099A1
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WO
WIPO (PCT)
Prior art keywords
unit
stage
reading
light irradiation
reading unit
Prior art date
Application number
PCT/JP2020/027723
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
尚敦 張
祥平 山崎
秀人 大墳
Original Assignee
株式会社ブイ・テクノロジー
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Application filed by 株式会社ブイ・テクノロジー filed Critical 株式会社ブイ・テクノロジー
Priority to CN202080035298.3A priority Critical patent/CN113841089A/zh
Priority to KR1020217035926A priority patent/KR20220034028A/ko
Publication of WO2021015099A1 publication Critical patent/WO2021015099A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to an exposure apparatus and an exposure method.
  • Patent Document 1 discloses an exposure device that calibrates an alignment sensor based on an alignment mark and a reference scale in an exposure device that exposes an image on a substrate arranged on a stage with an exposure head.
  • the first stage on which the substrate is arranged and the second stage on which the reference scale is fixed can be raised and lowered independently.
  • the present invention has been made in view of such circumstances, and an exposure apparatus capable of dealing with variations in the height direction due to various types of substrates having different thicknesses, assembly errors, etc., without using a complicated mechanism. It is an object of the present invention to provide an exposure apparatus.
  • the exposure apparatus is, for example, an exposure apparatus that exposes a substrate, and is a substantially plate-shaped stage on which the substrate is mounted on a substantially horizontal mounting surface.
  • a first driving unit that moves the stage in a first direction substantially along a horizontal plane, a light irradiation unit provided above the stage, and a light irradiation unit adjacent to or in the light irradiation unit.
  • the bottom surface of the rib is provided on the above-described mounting surface, and a plurality of the recognition marks are formed on the upper surface of the rib opposite to the bottom surface in the first direction. It is characterized in that it is provided along the line.
  • the upper surface of the stage on which the mask is placed is a rib whose height changes, and a rib along the first direction is provided, which is opposite to the bottom surface of the rib.
  • a plurality of recognition marks are provided on the upper surface of the side along the first direction.
  • the rib has a first rib and a second rib provided adjacent to each other along the second direction, and the upper surface of the first rib and the upper surface of the second rib have substantially the same inclination.
  • the height of the first rib at the highest position and the height of the second rib at the lowest position may be substantially the same.
  • the length of the stage in the first direction can be shortened.
  • three or more ribs can be considered as a combination of two ribs (first rib and second rib).
  • the relative position between the reading units can be measured, and drawing can be performed using a multi-head exposure machine having a plurality of light irradiation units.
  • three or more light irradiation units can be considered as a combination of two light irradiation units (first light irradiation unit and second light irradiation unit), and three or more reading units are two reading units (first). It can be considered by the combination of the reading unit and the second reading unit).
  • the read unit may be provided in the vicinity of two sides of the stage along the second direction. Thereby, it is possible to detect whether the stage is moving straight along the first direction, whether the stage is moving in the first direction while bending in the second direction, and the like.
  • an alignment mark is provided on the substrate, and the stage is moved in the first direction by the first driving unit to arrange the alignment mark in the field of view of the reading unit, and the second
  • the drive unit moves the light irradiation unit and the reading unit in the vertical direction according to the height of the substrate, the reading unit reads the alignment mark, and the first driving unit reads the stage.
  • the recognition mark is placed in the field of view of the reading unit by moving in one direction, the recognition mark is read by the reading unit, and the light irradiation unit is based on the result of reading the alignment mark and the recognition mark.
  • a control unit that performs drawing processing for irradiating the substrate with light may be provided.
  • the recognition mark has a thickness of about 5 ⁇ m or more, and has a substantially cross shape in a plan view having protrusions protruding in four directions substantially orthogonal to each other, and the cross-sectional shape of the protrusions is wide on the rib side, and the rib side is wide.
  • the opposite side of the rib has a narrow substantially trapezoidal shape, and the first side surface and the second side surface, which are the side surfaces on both sides of the protrusion, are inclined surfaces inclined with respect to the upper surface, and the inclination of the first side surface with respect to the upper surface.
  • the difference between the absolute value of the angle and the absolute value of the inclination angle of the second side surface with respect to the upper surface is within about 1 degree, and the control unit reads the recognition mark while moving the reading unit in the vertical direction. You may. As a result, the reading unit can correctly read the center of the trapezoidal recognition mark regardless of the height of the reading unit. As a result, the inclination of the optical axis of the reading unit is detected, and high-precision drawing becomes possible.
  • a substantially plate-shaped interchangeable read portion provided on the stage is provided, and the recognition mark has a thickness of about 10 nm to about 1 ⁇ m, and the replaceable read portion has a thickness of about 5 ⁇ m.
  • a trapezoidal recognition mark having a thickness of the above and having protrusions protruding in four directions substantially orthogonal to each other is provided, and the cross-sectional shape of the protrusions is in front of the interchangeable read portion.
  • the difference from the absolute value of the inclination angle with respect to the placement surface is within about 1 degree, and the control unit may read the trapezoidal recognition mark while moving the reading unit in the vertical direction.
  • the control unit may read the trapezoidal recognition mark while moving the reading unit in the vertical direction.
  • the exposure method according to the present invention is, for example, an exposure method in which a substrate is exposed using a light irradiation unit provided above a stage movably provided along a first direction.
  • the substrate is a step of placing the substrate on a substantially horizontal surface of the stage, a light irradiation unit, and a reading unit adjacent to the light irradiation unit or provided in the light irradiation unit.
  • At least one of the step of reading the substrate by the reading unit by moving in the vertical direction according to the height of the stage and two sides along the second direction substantially orthogonal to the first direction of the stage.
  • the alignment mark provided on the substrate is read by the reading unit, and in the step of irradiating the substrate with light from the light irradiation unit, the reading result of the alignment mark is obtained.
  • the substrate may be irradiated with light based on the reading result of the recognition mark. As a result, the alignment mark and the recognition mark can be read with the height of the reading unit aligned with the alignment mark.
  • the calibration step has a substantially reduced thickness while moving the reading unit in a direction closer to the stage and a direction away from the stage.
  • a step of reading a trapezoidal recognition mark having a substantially trapezoidal cross-sectional shape having a substantially trapezoidal cross-sectional shape with a wide stage side and a narrow upper surface side, which is 5 ⁇ m or more and having a substantially cross-shaped plan view, and the trapezoidal recognition mark In the step of irradiating the substrate with light from the light irradiation unit, including a step of detecting the inclination of the optical axis of the reading unit based on the reading result of the above, drawing is performed based on the inclination of the optical axis of the reading unit. The position may be adjusted. As a result, the inclination of the optical axis of the reading unit can be detected and high-precision drawing can be performed.
  • the present invention it is possible to deal with variations in the height direction due to various types of substrates having different thicknesses, assembly errors, etc., without using a complicated mechanism.
  • FIG. 1 It is a figure which shows the trapezoidal recognition mark 41, (A) is a plan view, (B) is a CC sectional view of (A). It is a figure which shows the state when the reading unit 60 is moved up and down, (A) is the case where the optical axis of the reading unit 60 is not tilted, (B) is the case where the optical axis of the reading unit 60 is tilted. Is. It is a figure which shows typically the field of view of the reading part 60 when the reading part 60 reads the read part 25. It is a perspective view which shows the schematic structure of the read
  • embodiments of the present invention are applied to an exposure apparatus that generates a photomask by irradiating a photosensitive substrate (for example, a glass substrate) held in a substantially horizontal direction with light such as a laser while moving it in the scanning direction.
  • a photosensitive substrate for example, a glass substrate
  • light such as a laser
  • photosensitive substrate for example, quartz glass having a very small coefficient of thermal expansion (for example, about 5.5 ⁇ 10-7 / K) is used.
  • Photosensitive substrates come in various sizes, ranging from those having a size of about 400 mm ⁇ 400 mm to large ones having a side of more than 1 m (for example, 1400 mm ⁇ 1220 mm).
  • the thickness of the photosensitive substrate varies depending on the size, and is, for example, 7.5 mm to 16 mm.
  • the photomask generated by the exposure device is, for example, an exposure mask used for manufacturing a substrate for a liquid crystal display device.
  • a photomask is a photomask in which one or a plurality of transfer patterns for an image device are formed on a substantially rectangular substrate.
  • the term mask 100 is used to cover the photosensitive substrate before, during, and after processing.
  • the exposure apparatus of the present invention is not limited to the mask manufacturing apparatus.
  • the exposure apparatus of the present invention is a concept including various devices that irradiate light (including laser, UV, polarized light, etc.) while moving a substrate held in a substantially horizontal direction in a scanning direction.
  • FIG. 1 is a perspective view showing an outline of the exposure apparatus 1 according to the first embodiment.
  • the exposure device 1 mainly includes a surface plate 11, a plate-shaped portion 12, rails 13 and 14, a frame body 15, a stage 20, a light irradiation unit 30, a laser interference meter 50, and a reading unit 60. Has. In FIG. 1, some configurations are not shown. Further, the exposure apparatus 1 is maintained at a constant temperature by a temperature adjusting unit (not shown) that covers the entire apparatus.
  • the directions substantially along the horizontal plane are defined as the x direction and the y direction
  • the directions substantially orthogonal to the x direction and the y direction are defined as the z direction.
  • the x direction and the y direction are substantially orthogonal to each other.
  • the surface plate 11 is placed on a plurality of vibration isolation tables (not shown) placed on an installation surface (for example, a floor). As a result, the surface plate 11 is placed on the installation surface via the vibration isolation table. Since the vibration isolator is already known, detailed description thereof will be omitted. The vibration isolation table is not essential.
  • a loader (not shown) for installing the mask 100 on the stage 20 is provided on the + x side of the surface plate 11.
  • the rail 13 is an elongated plate-shaped member made of ceramic, and is fixed to the upper surface 11a of the surface plate 11 so that the longitudinal direction is along the x direction.
  • the end of the rail 13 on the loader side (+ x side) is arranged at the end of the upper surface 11a, and the end of the rail 13 on the opposite loader side ( ⁇ x side) is arranged inside the end of the upper surface 11a.
  • the heights (positions in the z direction) of the three rails 13 are substantially the same, and the upper surfaces thereof are formed with high accuracy and high flatness.
  • the stage 20 is placed on the rail 14.
  • the stage 20 is provided on the upper surface 11a via the plate-shaped portion 12 and the rails 13 and 14.
  • the stage 20 has a substantially rectangular plate shape in a plan view, and has a low expansion ceramic having a coefficient of thermal expansion of about 0.5 to 1 ⁇ 10-7 / K and a coefficient of thermal expansion of about 5 ⁇ 10-8 / K. It is formed using the ultra-low expansion glass ceramic of. This makes it possible to prevent the stage 20 from being deformed.
  • the stage 20 may be formed of a material that expands and contracts like the mask 100.
  • a guide portion (not shown) is provided on the lower surface of the stage 20 so that the longitudinal direction is along the y direction.
  • the moving direction of the stage 20 is restricted so that the stage 20, that is, the plate-shaped portion 12 does not move in any direction other than the y direction.
  • the stage 20 (plate-shaped portion 12) is provided so as to be movable in the x direction along the rail 13, and the stage 20 is provided so as to be movable in the y direction along the rail 14.
  • the stage 20 has a substantially horizontal upper surface 20a which is a surface opposite to the surface facing the upper surface 11a.
  • the upper surface 20a is a mounting surface on which a mask 100 (see FIG. 2) provided with a plurality of alignment marks 101 is mounted. Further, a read portion 25 (see FIG. 2, detailed later) is provided on the upper surface 20a. The alignment mark 101 and the read unit 25 are read by the reading unit 60, and the stage 20, that is, the mask 100 is positioned (detailed later).
  • stage 20 may be configured to be movable not only in the x direction and the y direction but also in the z direction.
  • the exposure device 1 has drive units 81 and 82 (not shown in FIG. 1, see FIG. 8).
  • the drive units 81 and 82 are, for example, linear motors.
  • the drive unit 81 moves the stage 20 (plate-shaped portion 12) in the x direction along the rail 13, and the drive unit 82 moves the stage 20 in the y direction along the rail 14.
  • various already known methods can be used.
  • the exposure device 1 has a laser interferometer 50 that measures the position of the stage 20.
  • the laser interference meter 50 includes a laser interference meter 51 provided on a pillar provided on the ⁇ y side of the frame body 15 and a laser interference meter (not shown) provided on the + x side side surface of the surface plate 11.
  • a method for measuring the position of the stage 20 using the laser interferometer 50 various already known methods can be used.
  • a frame body 15 is provided on the surface plate 11.
  • a casting having a low expansion coefficient for example, a nickel-based alloy
  • the frame body 15 has a support portion 15a and two pillars 15c that support the support portion 15a at both ends.
  • the frame body 15 holds the light irradiation unit 30 above the stage 20 (+ z direction).
  • a light irradiation unit 30 is attached to the support portion 15a.
  • the frame body 15 will be described in detail later.
  • the light irradiation unit 30 irradiates the mask 100 with light (laser light in the present embodiment).
  • the light irradiation units 30 are provided at regular intervals (for example, approximately every 200 mm) along the y direction. In the present embodiment, it has seven light irradiation units 30a, a light irradiation unit 30b, a light irradiation unit 30c, a light irradiation unit 30d, a light irradiation unit 30e, a light irradiation unit 30f, and a light irradiation unit 30g.
  • the moving mechanism 161 see FIG.
  • the driving unit 39 sets the light irradiation unit 30a to 30g in the z direction in a range of about 30 ⁇ m (micrometer) in order to finely adjust the focal position of the light irradiation unit 30a to 30g. Make a slight movement.
  • the light irradiation unit 30 will be described in detail later.
  • the reading unit 60 reads the alignment mark 101 (see FIG. 2) and the recognition mark 25e (see FIG. 3) formed on the mask 100.
  • the alignment mark 101 and the recognition mark 25e are marks used for positioning (calibration, alignment, etc.) of the mask 100.
  • the reading unit 60 includes seven reading units 60a, a reading unit 60b, a reading unit 60c, a reading unit 60d, a reading unit 60e, a reading unit 60f, and a reading unit 60g.
  • the reading units 60a to 60g are provided in the light irradiation units 30a to 30g so as to be adjacent to the light irradiation units 30a to 30g, respectively.
  • the reading units 60a to 60g may be provided in the light irradiation units 30a to 30g, respectively.
  • a microscope having a magnification of about 50 times and a depth of focus of 1 ⁇ m or less is used as the reading unit 60.
  • the reading unit 60 will be described in detail later.
  • FIG. 2 is a plan view showing an outline of the exposure apparatus 1. In FIG. 2, only the main configuration is shown, and the other configurations are omitted.
  • the read unit 25 is provided in the vicinity of two sides 20b and 20c that are substantially parallel in the plan view of the stage 20.
  • the sides 20b and 20c are along the y direction.
  • a plurality of read portions 25 are provided along the sides 20b and 20c.
  • the read unit 25 is arranged between two reading units 60a to 60g adjacent to each other in the y direction.
  • the number of read units 25 provided between the two reading units 60a to 60g is not limited, and at least one read unit 25 may be provided between the two reading units 60a to 60g.
  • one read unit 25 is provided between the reading unit 60a and the reading unit 60b, between the reading unit 60b and the reading unit 60c, and between the reading unit 60d and the reading unit 60e.
  • Two read units 25 are provided between the reading unit 60c and the reading unit 60d, and between the reading unit 60e and the reading unit 60f.
  • the same read unit 25 can be read by two adjacent reading units 60 (for example, the reading unit 60a and the reading unit 60b). Can be done.
  • the read unit 25 is arranged between two reading units 60 adjacent to each other in the y direction. What to do is an essential configuration for drawing.
  • FIG. 3 is a perspective view showing a schematic configuration of the read unit 25.
  • the read portion 25 is provided on the stage 20 via the plate-shaped member 21, but the plate-shaped member 21 is not essential.
  • the upper surface 20a of the stage 20 includes the upper surface of the plate-shaped member 21.
  • the recognition mark 25e is provided with a size based on the inclination of the plate-shaped portions 25d of the ribs 25A and 25B and the characteristics of the reading portion 60.
  • the size of the recognition mark 25e is such that a plurality of recognition marks 25e are included in the field of view of the reading unit 60, and one of the recognition marks 25e is focused (two or more recognition marks 25e). It is a size (so that it is out of focus).
  • FIG. 4 is a perspective view showing an outline of the support portion 15a of the frame body 15, and is a view seen from the back surface side (+ x side).
  • the support portion 15a and the pillar 15c are shown slightly separated for the sake of explanation, but the support portion 15a and the pillar 15c are actually adjacent to each other.
  • the support portion 15a has a substantially rectangular cross-sectional shape and a substantially rod shape, and the inside is hollow.
  • the support portion 15a is provided so that the longitudinal direction is along the y direction.
  • the support portion 15a mainly has a bottom plate 151, a support plate 153, side plates 152 and 154 provided on both sides of the bottom plate 151 and the support plate 153, and a partition wall 159.
  • the bottom plate 151 and the support plate 153 are provided substantially horizontally, and the side plates 152 and 154 are provided substantially vertically.
  • the plate-shaped partition wall 159 is an internal reinforcement of the support portion 15a, and vibration and deformation (bending, twisting, etc.) of the support portion 15a are prevented at the position where the partition wall 159 is provided.
  • Round holes 155a to 155g and 156a to 156g are formed on the bottom plate 151 and the support plate 153, respectively, along the y direction.
  • the round holes 155a to 155g and 156a to 156g are holes that penetrate the bottom plate 151 and the support plate 153 in the substantially vertical direction, respectively, and are substantially circular in plan view. In a plan view, the position of the center of the round holes 155a to 155g and the position of the center of the round holes 156a to 156g are substantially the same.
  • the side plates 152 and 154 are each formed with holes used as cast holes for discharging casting sand during casting to form an internal space. These holes are used to attach the reading unit 60 to the round holes 157a to 157g.
  • the frame body 15 has a moving mechanism 161 that moves the support portion 15a along the pillar 15c in the z direction.
  • the moving mechanism 161 moves the support portion 15a in the z direction within a range of about 10 mm.
  • an actuator 161c (see FIG. 8) that rotationally drives the rack 161a, the pinion 161b, and the pinion 161b can be used.
  • the frame body 15 has two permanent electromagnets 163 provided on the pillar 15c.
  • the permanent magnet 163 is a permanent electromagnetic type having a permanent magnet and an electromagnet, and a current is passed through the coil of the electromagnet only at the time of attachment / detachment to turn on / off the built-in permanent magnet.
  • the permanent electromagnet 163 attracts the support portion 15a by passing an electric current through the coil of the electromagnet.
  • FIG. 5 is a perspective view of a main part showing an outline of the light irradiation unit 30a.
  • the light irradiation unit 30a mainly includes a DMD 31a, an objective lens 32a, a light source unit 33a, an AF processing unit 34a, a tubular portion 35a, a flange 36a, mounting portions 37a and 38a, and a driving unit 39a.
  • the light irradiation units 30b to 30g are DMD 31b to 31g, objective lenses 32b to 32g, light source units 33b to 33g, AF processing units 34b to 34g, tubular portions 35b to 35g, and flanges 36b to, respectively.
  • the objective lens 32a forms an image of the laser light reflected by each micromirror of the DMD 31a on the surface of the mask 100.
  • light is irradiated from each of the light irradiation unit 30a to the light irradiation unit 30g, and the light is imaged on the mask 100 to draw a pattern on the mask 100.
  • the light source unit 33a mainly includes a light source 331, a lens 332, a fly-eye lens 333, a lens 334, 335, and a mirror 336.
  • the light source 331 is, for example, a laser diode, and the light emitted from the light source 331 is guided to the lens 332 via an optical fiber or the like.
  • the fly-eye lens 333 is a two-dimensional arrangement of a plurality of lenses (not shown), and a large number of point light sources are created in the fly-eye lens 333.
  • the light that has passed through the fly-eye lens 333 becomes parallel light through the lens 334, 335 (for example, a condenser lens), and is reflected by the mirror 336 toward the DMD 31a.
  • the AF processing unit 34a focuses the light applied to the mask 100 to the mask 100, and mainly includes an AF light source 341, a collimator lens 342, an AF cylindrical lens 343, a pentaprism 344, and 345. It has a lens 346 and AF sensors 347 and 348.
  • the light emitted from the AF light source 341 becomes parallel light by the collimator lens 342, becomes linear light by the AF cylindrical lens 343, is reflected by the pentaprism 344, and forms an image on the surface of the mask 100.
  • the light reflected by the mask 100 is reflected by the pentaprism 345, condensed by the lens 346, and incident on the AF sensors 347 and 348.
  • the pentaprisms 344 and 345 bend the light at a bending angle of approximately 97 degrees.
  • a mirror may be used instead of the pentaprisms 344 and 345, but it is desirable to use a pentaprism because the focus is blurred due to the angle deviation of the mirror.
  • the AF processing unit 34a performs autofocus processing for obtaining the focusing position based on the result received by the AF sensors 347 and 348. Since such an autofocus process by the optical lever method is already known, detailed description thereof will be omitted.
  • the light irradiation unit 30a has a substantially cylindrical tubular portion 35a provided with an optical system (including an objective lens 32a) inside.
  • a flange 36a is provided at the upper end of the tubular portion 35a.
  • the flange 36a holds the lens 332, the fly-eye lens 333, and the lens 334, 335 on the upper side.
  • the tubular portion 35a is provided with mounting portions 37a and 38a.
  • the mounting portions 37a and 38a are used for mounting on the frame body 15.
  • the mounting portion 37a is provided near the flange 36a, and the mounting portion 38a is provided near the lower end of the tubular portion 35a.
  • a hollow portion 372 having a diameter larger than the outer diameter of the mounting portion 38a is formed in the mounting portion 37a. As a result, the tubular portion 35a can be pulled out upward.
  • the mounting portion 37a (that is, the light irradiation portion 30a) is moved in the vertical direction (z direction) by the driving unit 39a.
  • the drive unit 39a has a piezoelectric element which is a solid actuator in which displacement occurs when a voltage is applied. When the piezoelectric element expands, the light irradiation unit 30a moves in the + z direction, and when the piezoelectric element 391 contracts, the light irradiation unit 30a moves in the ⁇ z direction.
  • the amount of movement of the light irradiation unit 30a by the drive unit 39a is approximately 30 ⁇ m.
  • FIG. 6 is a perspective view showing an outline of the reading unit 60a, and is a perspective view of the main part.
  • the reading unit 60a is a high-magnification microscope optical system, and mainly includes a lens barrel 601 in which an objective lens is provided, a light source unit 602 that irradiates the objective lens with light (here, visible light), titanium, and zirconia.
  • the reading unit 60a is fixed to the tubular portion 35a via a mounting portion (not shown). As a result, the reading unit 60a moves in the z direction together with the light irradiation unit 30a.
  • the guide members 70 and 70A have guide unit main bodies 71 and 71A and pressing rings 72, 72A, 73 and 73A, respectively.
  • the guide portion main bodies 71 and 71A have a substantially thin plate shape and a substantially disc shape in a plan view.
  • the guide portions 71 and 71A are made of a metal having a thickness of about 0.1 mm so as to be easily deformed. As the metal, stainless steel, phosphor bronze and the like can be used, but it is desirable to use more homogeneous phosphor bronze.
  • the reading unit 60a (not shown in FIG. 7) provided in the light irradiation unit 30a also moves up and down as the light irradiation unit 30a moves up and down. Since the lens barrel 601 of the reading unit 60a is inserted into the round hole 157a (see FIG. 4 and the like) and the lens barrel 601 is not fixed to the round hole 157a, no problem occurs due to the vertical movement of the lens barrel 601.
  • the CPU 201 operates based on the programs stored in the RAM 202 and the ROM 203, and controls each part. Signals are input to the CPU 201 from the laser interference meter 50, the reading unit 60, and the like. The signal output from the CPU 201 is output to the drive units 81, 82, the light irradiation unit 30, and the like.
  • the control unit 201a reads the trapezoidal recognition mark 41 provided on the substantially plate-shaped interchangeable read unit (not shown) before performing the drawing process.
  • 9A and 9B are views showing the trapezoidal recognition mark 41, FIG. 9A is a plan view, and FIG. 9B is a sectional view taken along the line CC of FIG. 9A.
  • the bottom surface 41b and the top surface 41e are substantially parallel to the top surface 20a when the replaceable read unit is placed on the top surface 20a of the stage 20.
  • the side surfaces 41c and 41d on both sides of the protrusion 41a are inclined surfaces that are inclined with respect to the bottom surface 41b and the top surface 41e. In the cross-sectional view shown in FIG. 9B, the side surfaces 41c and 41d are substantially symmetrical.
  • the difference between the absolute value of the inclination angle of the side surface 41c with respect to the bottom surface 41b and the absolute value of the inclination angle of the side surface 41d with respect to the bottom surface 41b is preferably within about 1 degree.
  • the accuracy of the exposure apparatus according to the present embodiment is approximately 60 nm, and the accuracy of the exposure apparatus can be satisfied by setting the difference in inclination angles between the side surfaces 41c and 41d to 1 degree or less.
  • the trapezoidal recognition mark 41 is two-dimensionally arranged on the interchangeable read unit.
  • the replaceable read unit is provided separately from the read unit 25, and is removable from the stage 20.
  • the replaceable read unit is placed on the upper surface 20a of the stage 20.
  • the control unit 201a has a trapezoidal shape while moving the reading unit 60 closer to the stage 20 and away from the stage 20 by the driving unit 39 and the moving mechanism 161 while the replaceable reading unit is mounted on the stage 20. Read the recognition mark 41.
  • control unit 201a reads the trapezoidal recognition mark 41 while moving the reading unit 60 toward the stage 20 and away from the stage 20 before the drawing process, and based on the reading result of the trapezoidal recognition mark 41.
  • the characteristics of the reading unit 60, particularly the inclination of the optical axis, are detected.
  • the reading unit 60 reads the trapezoidal recognition mark 41, even if the reading unit 60 is moved up and down, it is possible to focus on some of the side surfaces 41c and 41d of the trapezoidal recognition mark 41. Since the side surfaces 41c and 41d are substantially symmetrical, even if the side surfaces 41c and 41d are focused on the low position (near the bottom surface 41b), the side surfaces 41c and 41d are focused on the high position (near the top surface 41e). Even if they match, the reading unit 60 can correctly read the center O of the trapezoidal recognition mark 41.
  • control unit 201a moves the stage 20 in the x-direction and the y-direction by the drive units 81 and 82 to arrange the read unit 25 provided near the side 20b in the field of view of the reading unit 60, and the reading unit 60. Read the recognition mark 25e with.
  • the control unit 201a detects the positions of the stage 20, that is, the mask 100 in the x-direction and the y-direction based on the reading results of the alignment mark 101 and the recognition mark 25e.
  • the control unit 201a adjusts the drawing position based on the inclination of the optical axis of the reading unit 60 obtained based on the reading result of the trapezoidal recognition mark 41. Then, the control unit 201a irradiates the mask 100 with light from the light irradiation units 30a to 30g based on the corrected drawing position. Specifically, the control unit 201a changes the timing of the signal (horizontal synchronization signal) that irradiates the light irradiation units 30a to 30g with light in the x direction, and shifts the drawing data in the y direction by the amount of the misalignment in the y direction. Adjust the drawing position by moving it.
  • the signal horizontal synchronization signal
  • the thickness of the recognition mark 25e used in the drawing process is made thinner than the depth of focus of the reading unit 60.
  • the recognition mark 25e is thinned.
  • the alignment mark 101 is provided on the mask 100, but the alignment mark 101 is not essential.
  • the control unit 201a may read an arbitrary pattern or the like existing on the mask 100, or the control unit 201a reads a side portion to the corner portion of the mask 100. May be good. Further, the control unit 201a may read the recognition mark 25e calculated from the height of the mask 100.
  • the exposure device 2 has a stage 20-1.
  • the stage 20-1 is provided with a read portion 25-1 via a plate-shaped member 21-1.
  • FIG. 12 is a perspective view showing a schematic configuration of the read unit 25-1.
  • the bottom surface 41b and the top surface 41e of the trapezoidal recognition mark 41 are substantially parallel to the plate-shaped portion 25f.
  • the side surfaces 41c and 41d of the trapezoidal recognition mark 41 are inclined surfaces that are inclined with respect to the plate-shaped portion 25f.
  • the operation of the exposure apparatus 2 configured in this way will be described.
  • the following processing is mainly performed by the control unit 201a.
  • control unit 201a proceeds to the drawing process.
  • the control unit 201a places the mask 100 on the upper surface 20a of the stage 20, and after several hours have passed, the reading unit 60 reads the alignment mark 101 of the mask 100. Further, the control unit 201a reads the trapezoidal recognition mark 41 of the read unit 25 provided in the vicinity of the side 20b by the reading unit 60.
  • the control unit 201a detects the positions of the stage 20 and the mask 100 in the x-direction and the y-direction based on the reading results of the alignment mark 101 and the trapezoidal recognition mark 41.
  • only the trapezoidal recognition mark 41 is provided on the read unit 25-1, but only one trapezoidal recognition mark 41 is provided on the read unit 25-1, and the other recognition marks 25e are provided. It may be provided.
  • substantially horizontal is not limited to the case of being strictly horizontal, and is a concept including an error of, for example, several degrees.
  • approximately 10 ⁇ m is not limited to 10 ⁇ m, but is a concept including an error of, for example, about 1 to 3 ⁇ m.
  • parallel, orthogonal, etc. not only the case of strictly parallel, orthogonal, etc., but also the case of substantially parallel, substantially orthogonal, etc. is included.
  • the "neighborhood” means to include a region of a certain range (which can be arbitrarily determined) near the reference position.
  • a region of a certain range which can be arbitrarily determined
  • it is a concept indicating that it is a region in a certain range near A and may or may not include A.
  • Exposure device 11 Plate 11a: Top surface 12: Plate-shaped portion 12a: Top surface 13, 14: Rail 15: Frame body 15a: Support portion 15c: Pillar 20, 20-1: Stage 20a: Top surface 20b, 20c : Sides 21, 21-1: Plate-shaped members 25, 25-1: Read portions 25A, 25A-1, 25B, 25B-1: Ribs 25a, 25b: Base portion 25c: Adhesive portion 25d, 25f: Plate-shaped portion 25e: Recognition mark 30 (30a to 30g): Light irradiation unit 32a to 32g: Objective lens 33a to 33g: Light source unit 34a to 34g: AF processing unit 35a to 35g: Cylindrical portion 36a to 36g: Flange 37a to 37g: Mounting Parts 38a to 38g: Mounting part 39 (39a to 39g): Drive part 41: Trapezoidal recognition mark 41a: Projection part 41b: Bottom surface 41c, 41d: Side surface 41e: Top surface 50, 51: Laser interferometer

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PCT/JP2020/027723 2019-07-19 2020-07-16 露光装置及び露光方法 WO2021015099A1 (ja)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH0555111A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 半導体装置の製造方法
JPH08227840A (ja) * 1995-02-20 1996-09-03 Jeol Ltd 荷電粒子線描画装置における調整方法および描画方法
JP2005322710A (ja) * 2004-05-07 2005-11-17 Nec Electronics Corp 半導体製造装置
JP2010034331A (ja) * 2008-07-29 2010-02-12 Canon Inc 露光装置およびデバイス製造方法
JP2010219445A (ja) * 2009-03-18 2010-09-30 Nuflare Technology Inc 荷電粒子ビーム描画方法、荷電粒子ビーム描画用の基準マークの位置検出方法及び荷電粒子ビーム描画装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077004A (ja) * 1999-09-03 2001-03-23 Hitachi Ltd 露光装置および電子線露光装置
JP2006337873A (ja) * 2005-06-03 2006-12-14 Fujifilm Holdings Corp 露光装置及び露光方法
JP4754924B2 (ja) * 2005-10-07 2011-08-24 株式会社ブイ・テクノロジー 露光装置
CN104950587B (zh) * 2014-03-25 2017-12-29 上海微电子装备（集团）股份有限公司 曝光装置与曝光方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555111A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 半導体装置の製造方法
JPH08227840A (ja) * 1995-02-20 1996-09-03 Jeol Ltd 荷電粒子線描画装置における調整方法および描画方法
JP2005322710A (ja) * 2004-05-07 2005-11-17 Nec Electronics Corp 半導体製造装置
JP2010034331A (ja) * 2008-07-29 2010-02-12 Canon Inc 露光装置およびデバイス製造方法
JP2010219445A (ja) * 2009-03-18 2010-09-30 Nuflare Technology Inc 荷電粒子ビーム描画方法、荷電粒子ビーム描画用の基準マークの位置検出方法及び荷電粒子ビーム描画装置

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