WO2021004252A1 - 壳体组件及其制备方法和电子设备 - Google Patents

壳体组件及其制备方法和电子设备 Download PDF

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Publication number
WO2021004252A1
WO2021004252A1 PCT/CN2020/097012 CN2020097012W WO2021004252A1 WO 2021004252 A1 WO2021004252 A1 WO 2021004252A1 CN 2020097012 W CN2020097012 W CN 2020097012W WO 2021004252 A1 WO2021004252 A1 WO 2021004252A1
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WO
WIPO (PCT)
Prior art keywords
layer
ink
decorative surface
housing assembly
rough area
Prior art date
Application number
PCT/CN2020/097012
Other languages
English (en)
French (fr)
Inventor
邱惊龙
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP20837728.3A priority Critical patent/EP3982703A4/en
Publication of WO2021004252A1 publication Critical patent/WO2021004252A1/zh
Priority to US17/562,907 priority patent/US20220124915A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0036—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers dried without curing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/70—Properties of coatings
    • C03C2217/73—Anti-reflective coatings with specific characteristics
    • C03C2217/734—Anti-reflective coatings with specific characteristics comprising an alternation of high and low refractive indexes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/34—Masking

Definitions

  • the present invention relates to the field of electronic equipment, in particular to a housing assembly, a preparation method thereof, and electronic equipment.
  • a housing assembly includes:
  • the reflective layer is arranged on the decorative surface and covers at least part of the rough area.
  • a method for preparing a shell assembly includes the following steps:
  • a reflective layer is formed on the decorative surface, and the reflective layer covers at least part of the rough area to obtain a housing assembly.
  • An electronic device including:
  • a display assembly connected to the housing assembly, and an installation space is defined between the display assembly and the housing assembly;
  • the circuit board is arranged in the installation space and is electrically connected to the display assembly.
  • a housing assembly includes:
  • the transparent substrate includes a decorative surface and a back surface arranged oppositely, the decorative surface has a rough area, and the haze of the rough area is 20%-40%;
  • the reflective layer is arranged on the side of the decorative surface and covers at least part of the rough area.
  • An electronic device including:
  • the display assembly is arranged on one side of the housing assembly.
  • the circuit board is arranged on the back side of the display assembly and is electrically connected to the display assembly, and the housing assembly covers the circuit board.
  • Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment
  • FIG. 2 is a schematic structural diagram of the housing assembly of the electronic device shown in FIG. 1;
  • Fig. 3 is a schematic cross-sectional view of the housing assembly shown in Fig. 2 along A-A';
  • FIG. 4 is a schematic cross-sectional view of the reflective layer in the housing assembly shown in FIG. 3;
  • FIG. 5 is a schematic cross-sectional view of the membrane layer unit in the housing assembly shown in FIG. 3;
  • FIG. 6 is a schematic cross-sectional view of the reflective sublayer in the film layer unit shown in FIG. 5;
  • FIG. 7 is a schematic cross-sectional view of a transparent substrate and a reflective layer in another embodiment
  • FIG. 8 is a schematic cross-sectional view of a transparent substrate and a reflective layer in another embodiment
  • FIG. 9 is a schematic cross-sectional view of a transparent substrate and a reflective layer in another embodiment
  • FIG. 10 is a schematic cross-sectional view of a transparent substrate and a reflective layer in another embodiment
  • FIG. 11 is a schematic cross-sectional view of a transparent substrate and a reflective layer in another embodiment
  • FIG. 12 is a schematic cross-sectional view of another embodiment of the reflective layer in the housing assembly shown in FIG. 3;
  • FIG. 13 is a schematic cross-sectional view after forming a first ink layer on a partial area of the decorative surface in the method for manufacturing the housing assembly shown in FIG. 1;
  • FIG. 14 is a schematic cross-sectional view of the first ink screen printed on a partial area of the decorative surface in the manufacturing method of the housing assembly shown in FIG. 13;
  • FIG. 15 is a schematic cross-sectional view after forming a protective film on at least a part of the decorative surface where the first ink is not formed in the manufacturing method of the housing assembly shown in FIG. 14;
  • FIG. 16 is a schematic cross-sectional view after spraying the second ink on the area of the transparent substrate where the protective film is not formed in the manufacturing method of the housing assembly shown in FIG. 15;
  • FIG. 17 is a schematic cross-sectional view of the method for manufacturing the housing assembly shown in FIG. 13 after frosting is performed to form a rough area;
  • FIG. 18 is a schematic cross-sectional view of the manufacturing method of the housing assembly shown in FIG. 17 after removing the first ink layer;
  • FIG. 19 is a schematic cross-sectional view after forming a second ink layer on a decorative surface in the manufacturing method of the housing assembly shown in FIG. 18;
  • FIG. 20 is a schematic cross-sectional view after the third ink is screen-printed on the decorative surface in the manufacturing method of the housing assembly shown in FIG. 19;
  • FIG. 21 is a schematic cross-sectional view after forming a masking film on a decorative surface in the manufacturing method of the housing assembly shown in FIG. 20;
  • FIG. 22 is a schematic cross-sectional view after spraying the fourth ink on the region where the masking film is not formed on the transparent substrate in the manufacturing method of the housing assembly shown in FIG. 21;
  • FIG. 23 is a schematic cross-sectional view after coating the decorative surface in the manufacturing method of the housing assembly shown in FIG. 17 and then removing the second ink layer to form a reflective layer.
  • the electronic device of an embodiment includes a housing assembly 100 and a display assembly 20.
  • the display assembly 20 is connected to the housing assembly 100. When the electronic device is operating normally, the display assembly 20 can display patterns.
  • An installation space (not shown) is defined between the display assembly 20 and the housing assembly 100.
  • the electronic device also includes a circuit board (not shown).
  • the circuit board control circuit can control the normal operation of electronic equipment.
  • the circuit board is arranged in the installation space and is electrically connected to the display assembly 20.
  • electronic devices are various devices that can obtain data from the outside and process the data, or various devices that have a built-in battery and can obtain current from the outside to charge the battery.
  • the electronic device can be, for example, a mobile phone, a tablet computer, a computing device, or an information display device.
  • the electronic device is a mobile phone.
  • the housing assembly 100 is the back cover of the mobile phone.
  • the display assembly 20 is fixedly connected to the housing assembly 100.
  • the housing assembly 100 includes a transparent substrate 110 and a reflective layer 120.
  • the transparent substrate 110 has a decorative surface 111.
  • a rough area 113 is provided on the decorative surface 111.
  • the reflective layer 120 is disposed on the decoration surface 111. And the reflective layer 120 covers at least part of the rough area 113.
  • the above-mentioned housing assembly 100 includes a transparent substrate 110 and a reflective layer 120.
  • the transparent substrate 110 has a decorative surface 111.
  • the decorative surface 111 is provided with a rough area 113, so that the housing assembly 100 has a matte effect at the rough area 113 and can prevent glare.
  • the reflective layer 120 is disposed on the decorative surface 111, and the reflective layer 120 covers at least a part of the rough area 113, so that the housing assembly 100 has a relatively high brightness at the reflective layer 120 and presents a bright effect.
  • the above-mentioned housing assembly 100 has brightness and can be anti-glare, and can be used to prepare electronic devices with better appearance effects.
  • the transparent substrate 110 is flat glass or curved glass. Further, the transparent substrate 110 also has a back surface 114 opposite to the decorative surface 111. Specifically, the housing assembly 100 is covered on the display assembly 20. The decorative surface 111 is opposite to the display assembly 20. It should be noted that when the transparent substrate 110 is curved glass, the decorative surface 111 is a concave surface of the transparent substrate 110.
  • the rough area 113 makes the housing assembly 100 exhibit a matte and frosted effect, and has an anti-glare effect.
  • the rough area 113 is located in the decorative surface 111.
  • the contour shape of the rough area 113 is a graphical shape.
  • the graphical shape can be, for example, a geometric shape, a human shape, an animal shape, a badge shape, a letter shape, or a number shape, etc., which can be set according to actual needs.
  • the rough area 113 is formed by the following steps: the rough area 113 is formed by frosting the decorative surface 111 of the transparent substrate 110. Furthermore, the rough area 113 is formed by the following steps: the decorative surface 111 of the transparent substrate 110 is sequentially frosted and polished to form the rough area 113. Such an arrangement can improve the glossiness of the rough area 113.
  • the surface roughness of the rough region 113 is 0.1 ⁇ m-0.2 ⁇ m. With this arrangement, the rough area 113 has a matte effect.
  • the haze of the rough area 113 is 20%-40%. This arrangement can reduce the light transmittance of the rough area 113, so that the rough area 113 has frosting and anti-glare effects.
  • the thickness of the transparent substrate 110 is 0.5 mm-0.7 mm.
  • the reflective layer 120 enables the housing assembly 100 to have a higher brightness at the reflective layer 120 and presents a shiny effect, and the superposition of the reflective layer 120 and the rough area 113 makes the housing assembly 100 appear shiny and frosted , Can prevent glare.
  • the reflective layer 120 includes a first silicon dioxide layer 121, a first niobium pentoxide layer 122, and a second silicon dioxide layer sequentially stacked on the decorative surface 111. 123, a single crystal silicon layer 124, a third silicon dioxide layer 125, a second niobium pentoxide layer 126, and a fourth silicon dioxide layer 127.
  • the reflective layer 120 provided in this way has higher brightness, stronger adhesion and impact resistance.
  • the thickness of the first silicon dioxide layer 121 is 8 nm-12 nm.
  • the thickness of the first niobium pentoxide layer 122 is 68 nm-72 nm.
  • the thickness of the second silicon dioxide layer 123 is 88 nm-92 nm.
  • the thickness of the single crystal silicon layer 124 is 83 nm-87 nm.
  • the thickness of the third silicon dioxide layer 125 is 42 nm-46 nm.
  • the thickness of the second niobium pentoxide layer 126 is 50 nm-54 nm.
  • the thickness of the fourth silicon dioxide layer 127 is 8 nm-12 nm.
  • the reflective layer 120 completely covers the rough area 113.
  • the contour shape of the reflective layer 120 is consistent with the contour shape of the rough region 113. In the illustrated embodiment, the reflective layer 120 and the rough area 113 completely overlap.
  • the housing assembly 100 further includes a film layer unit 130.
  • the film unit 130 covers a side of the transparent substrate 110 close to the reflective layer 120 and covers the reflective layer 120.
  • the film unit 130 can protect the reflective layer 120 and the rough area 113, and can also shield the circuit board from the side close to the casing assembly 100 and the display unit 20 close to the casing assembly 100.
  • the film layer unit 130 includes a substrate 131, a color layer 132, an appearance layer 133 and a primer layer 134 stacked in sequence.
  • the substrate 131 faces the reflective layer 120.
  • the base material 131 includes an adhesive layer 131a and a base material body 131b which are laminated.
  • the adhesive layer 131 a faces the reflective layer 120.
  • the adhesive layer 131 a covers the side of the transparent substrate 110 close to the reflective layer 120 and covers the reflective layer 120.
  • the adhesive layer 131a is an OCA adhesive layer.
  • the base body 131b is a PET (Polyethylene terephthalate) layer.
  • the aforementioned base material 131 has good mechanical properties, and can meet the requirements of the housing assembly 100 for mechanical strength and tensile properties. Dimensions such as the thickness of the substrate 131 are not particularly limited, and can be selected according to actual conditions. For example, the thickness of the adhesive layer 131a is 20 ⁇ m-30 ⁇ m, and the thickness of the base body 131b is 48 ⁇ m-52 ⁇ m.
  • the color layer 132 can make the housing assembly 100 have a color.
  • the color layer 132 is laminated on the side of the base body 131b away from the adhesive layer 131a.
  • the color layer 132 is an offset printing layer or a ribbon layer. Among them, the offset printing layer is formed by offset printing technology.
  • the ribbon layer is formed by ribbon printing technology. It should be noted that the color of the color layer 132 is not limited and can be set according to actual needs.
  • the appearance layer 133 includes a texture sublayer 1332 and a reflective sublayer 1334 that are stacked.
  • the texture sublayer 1332 faces the color layer 132.
  • the texture sublayer 1332 makes the shell assembly 100 present a texture effect.
  • the texture sublayer 1332 is a UV transfer layer with a certain texture structure. Further, the texture sublayer 1332 is formed by curing a colorless or colored UV curing glue. The thickness of the texture sublayer 1332 is 5 ⁇ m-20 ⁇ m.
  • the reflective sublayer 1334 is a metal layer or a metal oxide film layer with a certain reflectivity.
  • the reflective sub-layer 1334 can make the housing assembly 100 have a metallic luster texture appearance.
  • the reflective sublayer 1334 has a single-layer structure or a multi-layer structure.
  • the above-mentioned single-layer structure or multi-layer structure may be formed of metal or metal oxide.
  • the metal is selected from at least one of In (indium) and Sn (tin).
  • the metal oxide is selected from TiO 2 (titanium dioxide), NbO 2 (niobium dioxide), Nb 2 O 3 (niobium trioxide), Nb 2 O 2 (niobium dioxide), Nb 2 O 5 (niobium pentoxide) ), at least one of SiO 2 (silicon dioxide) and ZrO 2 (titanium dioxide).
  • the above-mentioned reflective sub-layer 1334 has a relatively suitable reflectivity, and combined with the texture sub-layer 1332 and the color layer 132, the housing assembly 100 has a relatively bright color effect.
  • the reflective sublayer 1334 includes a first aluminum oxide layer 1334a, an indium layer 1334b, a second aluminum oxide layer 1334c, and a titanium dioxide layer 1334d that are sequentially stacked.
  • the first alumina layer 1334a faces the texture sublayer 1332. This arrangement makes the reflection sub-layer 1334 and the texture sub-layer 1332 more stable, and makes the reflection sub-layer 1334 have a better brightening effect.
  • the thickness of the first aluminum oxide layer 1334a is 30 nm-40 nm.
  • the thickness of the indium layer 1334b is 10 nm-30 nm.
  • the thickness of the second aluminum oxide layer 1334c is 30 nm-40 nm.
  • the thickness of the titanium dioxide layer 1334d is 3nm-7nm. It should be noted that the thicker the thickness of the indium layer 1334b, the better the reflection effect of the reflective sublayer 1334, and the higher the brightness of the texture sublayer 1332. However, the thicker the indium layer 1334b is, the easier it is to be oxidized.
  • the indium layer 1334b provided above can ensure the brightening effect of the reflective sublayer 1334 and can also reduce the oxidation of the indium layer 1334b.
  • the appearance layer 133 further includes a primer layer 1336.
  • the primer layer 1336 is disposed on the side of the texture sublayer 1332 close to the color layer 132.
  • the primer layer 1336 can increase the bonding strength of the color layer 132 and the appearance layer 133, prevent the color layer 132 and the appearance layer 133 from delamination and other undesirable problems, and ensure the service life of the housing assembly 100.
  • the primer layer 1336 is a PET layer.
  • the thickness of the primer layer 1336 is 21 ⁇ m-25 ⁇ m.
  • the bottom oil layer 134 is provided on the surface of the reflective sublayer 1334.
  • the bottom oil layer 134 can prevent light entering the housing assembly 100 from passing through the bottom oil layer 134, and can shield the circuit board from the side of the housing assembly 100 and the side of the display assembly 20 near the housing assembly 100.
  • the primer layer 134 is formed by screen printing or spraying a primer ink.
  • the cover ink is an ink with a hiding power such as black or white.
  • the primer layer 134 is formed by a method of reciprocating screen printing or spraying multiple layers of capping ink to prevent light leakage.
  • the thickness of the primer layer 134 is 5 ⁇ m-24 ⁇ m. This arrangement can effectively prevent light from passing through the bottom oil layer 134, so that the light entering the bottom oil layer 134 can be reflected by the reflective sublayer 1334 or absorbed by the bottom oil layer 134.
  • the housing assembly 100 of the above electronic device includes a transparent substrate 110 and a reflective layer 120.
  • the transparent substrate 110 has a decorative surface 111, and the decorative surface 111 is provided with a rough area 113, so that the housing assembly 100 has a matte effect at the rough area 113.
  • the reflective layer 120 is disposed on the decorative surface 111, and the reflective layer 120 covers at least a part of the rough area 113, so that the housing assembly 100 has a higher brightness at the reflective layer 120 and presents a bright effect.
  • the above-mentioned housing assembly 100 has high brightness and can be anti-glare, and can be used to prepare electronic devices with good appearance effects.
  • the superposition of the rough area 113 and the reflective layer 120 makes the housing assembly 100 have a shiny and frosted effect, so as to achieve the matte and homogenous effect on the housing assembly 100 .
  • electronic equipment may also include other structures or components necessary for conventional electronic equipment.
  • the mobile phone in addition to the aforementioned housing components, the mobile phone also includes a glass cover, an audio processing module, a camera module, a touch screen, etc.
  • the structure or component necessary for a mobile phone in addition to the aforementioned housing components, the mobile phone also includes a glass cover, an audio processing module, a camera module, a touch screen, etc.
  • the structure or component necessary for a mobile phone is not limited to the structure or component necessary for a mobile phone.
  • the structure of the appearance layer 133 is not limited to the above-mentioned structure, and the appearance layer 133 may include one of a texture sublayer 1332 and a reflective sublayer 1334.
  • the appearance layer 133 makes the housing assembly 100 have a texture effect.
  • the appearance layer 133 includes the reflective sub-layer 1334, the appearance layer 133 enables the housing assembly 100 to have a shiny or glossy effect.
  • the decorative surface 111 of the housing assembly 100 is not limited to being opposite to the display assembly 20, and the back 114 of the housing assembly 110 may be opposite to the display assembly 20.
  • the transparent substrate 110 is curved glass
  • the decorative surface 111 is a convex surface of the transparent substrate 110.
  • the film reaction 130 covers the back side 114.
  • the housing assembly 100 may also include a cover layer.
  • the cover layer covers the reflective layer 120 and the rough area 113.
  • the covering layer is provided to protect the reflective layer 120 and the rough area 113 and avoid the reflective layer 120 and the rough area 113 from being scratched. It is understood that the cover layer can be omitted.
  • the reflective layer 120 and the rough area 113 are not limited to being completely overlapped. Please refer to FIG. 7 together.
  • the decorative surface also has a non-rough area 215.
  • the non-rough area 215 is provided around the rough area 213.
  • the reflective layer 220 completely covers the rough area 213 on the decorative surface, and at least partially covers the non-rough area 215.
  • the reflective layer 220 completely covers the rough area 213 and partially covers the non-rough area 215.
  • the shell assembly has a matte effect at the superimposition of the reflective layer 220 and the rough area 213, and also has a higher brightness.
  • the reflective layer 220 When the reflective layer 220 is not superimposed with the rough area 213, it has a shiny effect, achieving a matt and homogenous effect. effect. Further, it can be understood that the reflective layer 220 is not limited to partially covering the non-rough area 215. Please also refer to FIG. 8. In other embodiments, the reflective layer 320 completely covers the non-rough area 315. At this time, the shell assembly presents a shiny effect on the entire decorative surface.
  • the reflective layer 120 is not limited to completely cover the rough area 113. Please refer to FIG. 9 together.
  • the reflective layer 420 may also be located in the rough area 413.
  • the shell assembly has a frosting effect at the overlap of the reflective layer 420 and the rough area 413, and also has a higher brightness.
  • the rough area 413 does not overlap the reflective layer 420 where it has a frosting effect, so that the shell assembly is in different areas With different appearance effects, the appearance is more expressive.
  • the rough area 113 is not limited to being located in the decorative surface 111. Please refer to FIG. 10 together. In other embodiments, the rough area 513 may also completely cover the decorative surface.
  • the rough area 113 and the reflective layer 120 are not limited to the above arrangement. Please refer to FIG. 11 together. In other embodiments, the rough area 613 completely covers the decorative surface, and the reflective layer 120 completely covers the rough area 613.
  • the film layer unit 130 may be omitted.
  • contour shape of the reflective layer 120 and the contour shape of the rough region 113 are not limited to the above settings, and the contour shape of the reflective layer 120 and the contour shape of the rough region 113 may be different.
  • the reflective layer 120 is not limited to the above structure, but may also have other structures.
  • the reflective layer 120' includes a silicon layer 121 laminated on the decorative surface 111 in sequence. ', the first titanium layer 122', the copper layer 123' and the second titanium layer 124'. With this arrangement, the reflective layer 120' has higher brightness and stronger impact resistance.
  • the thickness of the silicon layer 121' is 3 nm-7 nm.
  • the thickness of the first titanium layer 122' is 6 nm-10 nm.
  • the thickness of the copper layer 123' is 18nm-22nm.
  • the thickness of the second titanium layer 124' is 48 nm-52 nm.
  • a method for preparing the housing assembly 100 including the following steps S110-S130:
  • a transparent substrate 110 is provided, and the transparent substrate 110 has a decorative surface 111.
  • the step of forming the rough area 113 on the decorative surface 111 includes: frosting the decorative surface 111 to form the rough area 113.
  • the step of frosting the decorative surface 111 to form the rough area 113 includes S121-S122:
  • the steps of S121 include S1211-S1214:
  • the thickness of the first ink is 5 ⁇ m-16 ⁇ m.
  • the area to be decorated is preset on the decoration surface 111.
  • the preset area to be decorated is used to form the rough area 113.
  • the step S1211 includes: screen printing a first ink on the decoration surface 111, and the first ink is arranged around the area to be decorated. Further, the first ink is spaced from the area to be decorated. Since the ink will overflow or expand during the curing process, the first ink is spaced from the area to be decorated to prevent the overflow or expansion of the first ink from affecting the size of the rough area 113, so as to ensure the size of the rough area 113. size. Further, the distance between the first ink and the area to be decorated is 0.15mm-0.2mm.
  • the step of screen printing the first ink on a partial area of the decorative surface 111 includes: screen printing the first ink in the decorative surface 111 and curing to form a first ink
  • the first through hole 141a is opposite to the area to be decorated.
  • the step of screen printing the first ink on a partial area of the decorative surface 111 includes: overlapping the first ink on a partial area of the decorative surface 111 multiple times. This arrangement can prevent the penetration of the frosting treatment liquid during the frosting treatment. Furthermore, the thickness of each printing is 5 ⁇ m-8 ⁇ m.
  • the first ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 98:3-102:7.
  • the number of printing is two times. More specifically, the first ink is printed on a partial area of the decorative surface 111 for the first time and cured to obtain a cured portion, and the first ink is printed on the cured portion for a second time and cured to obtain the first ink portion 141.
  • the curing temperature is 160°C ⁇ 10°C
  • the curing time is 20min ⁇ 1min.
  • the oil change frequency is every 4h.
  • the curing temperature is 160°C ⁇ 20°C
  • the curing time is 3min ⁇ 0.5min.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75° ⁇ 5°.
  • the angle of the scraper is 70° ⁇ 5°.
  • the screen spacing is 1.5mm-4.5mm.
  • the viscosity of the first ink is 6000mpa.s ⁇ 1000mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par.
  • boiling oil and water need to be added to adjust the viscosity of the first ink. Further, 1mL-3mL of boiling oil and water are added to the first ink every 1h-1.5h.
  • the step of inspecting the first ink portion 141 is further included. Specifically, the appearance of the first ink portion 141 is checked for problems such as toothlessness, missing, blisters, chromatic aberration, black and white dots, etc.
  • a protective film 150 is formed on at least a part of the decorative surface 111 where the first ink is not formed.
  • the protective film 150 is a PET (Polyethylene terephthalate, polyethylene terephthalate) film.
  • S1212 includes: pasting a protective film 150 on at least a part of the decorative surface 111 where the first ink is not formed. Further, S1212 includes: pasting a protective film 150 on the area of the decorative surface 111 where the first ink portion 141 is not formed, and the protective film 150 at least partially covers the first ink portion 141 to shield the first through hole 141a.
  • This arrangement makes it possible to better shield the first through hole 141a, so as to prevent the ink material in the subsequent spraying of the second ink from penetrating into the first through hole 141a and affecting the masking of the decorative surface 111 at the first through hole 141a. Sand effect.
  • the protective film 150 is pasted on the area of the decorative surface 111 where the first ink portion 141 is not formed, and the protective film 150 partially covers the first ink portion 141 to shield the first through hole 141a. With this arrangement, the second ink sprayed afterwards partially covers the first ink portion 141 to protect the area of the decorative surface 111 that does not require frosting. It should be noted that the protective film 150 is not limited to the above-mentioned arrangement. The protective film 150 can be received in the first through hole 141a and directly adhered to the decorative surface 111.
  • a step of inspecting the protective film 150 is further included. Specifically, check whether the protective film 150 is biased, whether there is foreign matter, the edge of the protective film 150 must not have burrs, the surface is flat and smooth, there must be no dents, dirt, wrinkles, impurities, etc., and there must be no bubbles in the film.
  • the protective film 150 is peeled off. After the protective film 150 is peeled off, it is detected that the glass surface is free of dirt, white spots, watermarks, residual glue and other problems.
  • the second ink covers the area of the transparent substrate 110 where the protective film 150 is not formed, and at least partially covers the first ink portion 141.
  • S1213 includes: spraying the second ink on the area of the transparent substrate 110 where the protective film 150 is not formed, and curing it to form the second ink portion 143.
  • the second ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 98:3-102:7.
  • the curing process includes: treating at 160°C ⁇ 20°C for 5min ⁇ 0.5min, and then placing it at 150°C ⁇ 10°C for 20min ⁇ 1min.
  • the second ink after spraying the second ink, it further includes a step of inspecting the formed second ink portion 143. Specifically, check whether the appearance of the second ink portion 143 has problems such as toothlessness, missing, blisters, color difference, black and white dots, etc.
  • the first ink portion 141 and the second ink portion 143 form the first ink layer 140.
  • the decorative surface 111 is frosted, and then the first ink layer 140 is removed, so that the area of the decorative surface 111 where the first ink layer 140 is not formed forms a rough area 113.
  • the step of performing frosting treatment on the decorative surface 111 includes: using a frosting treatment liquid to perform frosting treatment on the decorative surface 111.
  • the frosting treatment liquid includes at least one of ammonium fluoride, ammonium sulfate, organic acid, ammonium bifluoride, and calcium sulfate.
  • the organic acid is selected from at least one of concentrated hydrochloric acid and concentrated sulfuric acid.
  • the frosting temperature is 30°C ⁇ 2°C.
  • the frosting treatment liquid includes frosting liquid and water.
  • the mass ratio of frosting liquid and water is 6.5:25.
  • the frosting liquid is the frosting liquid of Foshan Rhino Fine Chemical Co., Ltd. or the frosting liquid of Shenzhen Jingermei Technology Co., Ltd. It should be noted that the frosting liquid is not limited to the above-mentioned frosting liquid, and other commercially available frosting liquids may also be used.
  • the transparent substrate 110 on which the first ink layer 140 is formed is placed on a conveyor belt, and the decorative surface 111 is sprayed with a frosting treatment liquid to perform a frosting treatment on the decorative surface 111.
  • the running speed of the conveyor belt is 1.4m/min-1.6m/min, and the temperature of the frosting solution is 30°C ⁇ 2°C.
  • the step of spraying the decorative surface 111 with pure water is also included. This arrangement can remove dirt on the decorative surface 111 to ensure the effect of the frosting treatment.
  • the speed of the conveyor belt is 1m/min-3m/min, and the speed of the water jet is 2.3m/min.
  • the step of maturing the frosting treatment liquid is further included. Specifically, the frosting treatment liquid is placed at 55°C ⁇ 3°C and allowed to stand for 48h ⁇ 5h to obtain a matured frosting treatment solution.
  • the step of frosting the decorative surface 111 also includes removing dirt such as oil stains on the decorative surface 111. It should be noted that after the frosting treatment, it also includes checking whether there are watermarks, dirt, uneven frosting, scratches and other defects on the decorative surface 111 formed.
  • the method further includes the following step: chemically polishing the decorative surface 111 after the frosting.
  • chemically polishing Such an arrangement can improve the glossiness of the rough area 113.
  • an aqueous solution of HF with a mass percentage content of 3% to 5% is used to polish the decorative surface 111 after the frosting treatment at 30°C ⁇ 2°C.
  • the frosted transparent substrate 110 is placed on a conveyor belt, and the decorative surface 111 is sprayed with an aqueous solution of HF at 30°C ⁇ 2°C and a mass percentage content of 3% to 5%. Perform chemical polishing treatment.
  • the running speed of the belt is 2.5m/min-3.0m/min.
  • the step of removing the first ink layer 140 includes: using a stripping agent to strip the frosted transparent substrate 110 to remove the first ink layer 140.
  • the deplating agent is a lye with a mass percentage of 1% to 5%.
  • the lye is an aqueous solution of sodium hydroxide or an aqueous solution of potassium hydroxide.
  • the temperature of deplating treatment is 65°C ⁇ 5°C.
  • the transparent substrate 110 after the frosting treatment is sequentially heated with a first stripping agent at a temperature of 65°C ⁇ 5°C, a second stripping agent at a temperature of 65°C ⁇ 5°C, and a temperature of 65°C ⁇ 5°C. Soak in the third stripping agent, and then clean it with pure water at a temperature of 55°C ⁇ 5°C.
  • the first stripping agent is an alkali solution with a mass percentage of 5%.
  • the second stripping agent is a lye with a mass percentage of 1% to 3%.
  • the third stripping agent is a lye with a mass percentage of 1%-3%.
  • the frosted transparent substrate 110 is sequentially immersed in a deplating tank containing a first deplating agent at a temperature of 65°C ⁇ 5°C, and a second deplating bath containing a temperature of 65°C ⁇ 5°C. Soak in the deplating tank of the chemical agent and the deplating tank containing the third deplating agent at a temperature of 65°C ⁇ 5°C, and then immerse in a water tank filled with pure water at a temperature of 55°C ⁇ 5°C. The soaking time of each tank is 60s ⁇ 10s. Wherein, the transparent substrate 110 after the deplating agent treatment is cleaned with pure water at a temperature of 55°C ⁇ 5°C, and the cleaning method is soaking twice. It should be noted that the number of times of cleaning is not limited to two, but can also be one, or three, which can be set as needed.
  • the step of removing the first ink layer 140 further includes a step of inspecting the transparent substrate 110 after the first ink layer 140 is removed. Specifically, it is checked whether there are ink residues, bursts, deep scratches, chipping, etc. on the transparent substrate 110 after the first ink layer 140 is removed.
  • the method further includes the following step: strengthening the transparent substrate 110 on which the rough area 113 is formed.
  • the strengthening treatment can improve the mechanical strength of the transparent substrate 110.
  • the transparent substrate 110 on which the rough region 113 is formed is subjected to multiple strengthening treatments.
  • each strengthening treatment preheat the transparent substrate 110 so that the temperature of the transparent substrate 110 is 300°C ⁇ 20°C; immerse the preheated transparent substrate 110 in molten salt at 380°C ⁇ 2°C for 40 minutes Within ⁇ 3 min, a strengthened transparent substrate 110 is obtained.
  • the step of preheating the transparent substrate 110 so that the temperature of the transparent substrate 110 is 300°C ⁇ 20°C includes: placing the transparent substrate 110 at 300°C ⁇ 20°C for 12 minutes.
  • the molten salt includes sodium nitrate with a mass percentage of 6% and potassium nitrate with a mass percentage of 94%.
  • the Na+ concentration of the transparent substrate 110 during the processing in the molten salt is 16000 ppm to 19000 ppm.
  • the number of strengthening treatments is two.
  • the CS (surface compressive stress) of the transparent substrate 110 after the first strengthening is 465Mpa-605Mpa
  • the CSK corner stress
  • the DOL the depth of ion exchange
  • the DOC depth of internal stress
  • It is 100 ⁇ m-115 ⁇ m
  • the CT central tensile stress
  • the CS of the transparent substrate 110 after the second strengthening is 710Mpa-880Mpa
  • the CSK is 65Mpa-120Mpa
  • the DOL is 8.2 ⁇ m-10 ⁇ m
  • the DOC is 100 ⁇ m-115 ⁇ m
  • the CT is 44 ⁇ m-95 ⁇ m.
  • a step of cooling down is also included. Specifically, a fan is used to blow cold air for cooling.
  • the rough area 113 also includes checking whether there are watermarks, dirt, uneven frosting, scratches and other defects on the transparent substrate 110 on which the rough area 113 is formed.
  • the step of strengthening the transparent substrate 110 formed with the rough area 113 before the step of strengthening the transparent substrate 110 formed with the rough area 113, it further includes the following step: cleaning the transparent substrate 110 formed with the rough area 113. Further, the cleaning method is ultrasonic cleaning.
  • the first cleaning liquid includes the first cleaning agent with a mass percentage of 1.5%-2.5%.
  • the first cleaning agent is an alkaline cleaning agent with a pH of 12-14.
  • the cleaning temperature of the first cleaning solution is 65°C ⁇ 10°C.
  • the second cleaning liquid includes the second cleaning agent with a mass percentage of 1.5%-2.5%.
  • the second cleaning agent is an alkaline cleaning agent with a pH of 12-14.
  • the cleaning temperature of the second cleaning solution is 65°C ⁇ 10°C.
  • the temperature of pure water cleaning is 70°C ⁇ 10°C.
  • the number of times of pure water cleaning can be one or multiple, which can be set as needed.
  • the purity of pure water is greater than 10M ⁇ cm.
  • the cleaning method is soaking or spraying.
  • the temperature of slow drawing dehydration is 70°C ⁇ 10°C.
  • the speed of slow pulling dehydration is 10Hz-15Hz.
  • the drying temperature is 80 ⁇ 20°C.
  • the transparent substrate 110 is sequentially placed in a cleaning tank containing a first cleaning liquid, a cleaning tank containing a second cleaning liquid, and a cleaning tank containing pure water to clean the transparent substrate 110 in sequence, and the cleaned
  • the transparent substrate 110 is sequentially placed in a slow drawing dehydration tank and a drying tank for drying.
  • the processing time of each tank is 60s ⁇ 10s.
  • the sequential slow-drawing dehydration and drying operations on the cleaned transparent substrate 110 may be omitted.
  • the transparent substrate 110 may be allowed to air dry naturally. It should be noted that after the transparent substrate 110 is dried, the step of checking whether the dried transparent substrate 110 has watermarks and impurities is included.
  • the method before S110, further includes the following steps: sequentially performing the first CNC processing, hot bending processing, second CNC processing and 3D polishing processing on the transparent substrate 110.
  • CNC machining refers to computer digital control precision machining.
  • the edge of the transparent substrate 110 is polished.
  • the edge of the transparent substrate 110 is curved by a heat bending process to form 3D glass or curved glass.
  • the transparent substrate 110 is punched through the second CNC processing.
  • the 3D polishing process is used to polish the transparent substrate 110, especially to polish the bends of the transparent substrate 110. It should be noted that if the transparent substrate 110 is 3D glass, the steps of sequentially performing the first CNC processing, hot bending processing, second CNC processing, and 3D polishing processing on the transparent substrate 110 can be omitted.
  • a reflective layer 120 is formed on the decorative surface 111, and the reflective layer 120 at least partially covers the roughened area 113 to obtain the housing assembly 100.
  • the method of forming the reflective layer 120 on the decorative surface 111 is electroplating, deposition or sputtering.
  • the step of forming the reflective layer 120 on the decorative surface 111 includes: forming a first silicon dioxide layer 121, a first niobium pentoxide layer 122, and a second silicon dioxide layer that are sequentially stacked on the decorative surface 111.
  • the silicon layer 123, the single crystal silicon layer 124, the third silicon dioxide layer 125, the second niobium pentoxide layer 126, and the fourth silicon dioxide layer 127 obtain the reflective layer 120.
  • the thickness of the first silicon dioxide layer 121 is 8 nm-12 nm.
  • the thickness of the first niobium pentoxide layer 122 is 68 nm-72 nm.
  • the thickness of the second silicon dioxide layer 123 is 88 nm-92 nm.
  • the thickness of the single crystal silicon layer 124 is 83 nm-87 nm.
  • the thickness of the third silicon dioxide layer 125 is 42 nm-46 nm.
  • the thickness of the second niobium pentoxide layer 126 is 50 nm-54 nm.
  • the thickness of the fourth silicon dioxide layer 127 is 8 nm-12 nm. Specifically, the method of forming each of the above-mentioned film layers is electroplating.
  • the step of forming the reflective layer 120 on the decorative surface 111 includes S131-S132:
  • a second ink layer 160 is formed on the decorative surface 111, and the rough area 113 is at least partially exposed.
  • S131 includes S1311-S1314:
  • the third ink is screen-printed on at least a part of the decorative surface 111 where the rough area 113 is not formed, and the third ink is exposed at least in the rough area 113.
  • S1311 includes: screen printing a third ink on at least a part of the decorative surface 111 where the rough area 113 is not formed, and the third ink is arranged around the rough area 113. Further, the third ink is separated from the rough area 113.
  • the third ink is spaced from the rough area 113 to prevent the overflow or expansion of the third ink from affecting the size of the reflective layer 120 to ensure the reflective layer 120
  • the size is such that the surface of the rough area 113 can be covered with the reflective layer 120 to ensure that the reflective layer 120 and the rough area 113 are accurately aligned and overlapped. Further, the distance between the third ink and the rough area 113 is 0.15mm-0.2mm.
  • S1311 includes: screen printing a third ink on at least a part of the decorative surface 111 where the rough area 113 is not formed, and solidify to form a third ink portion 161 with a third through hole 161a.
  • the third through hole 161a is opposed to the rough area 113.
  • the size of the third through hole 161a is equivalent to the size of the rough area 113, so that the rough area 113 just exposes the third through hole 161a.
  • the third ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 98:3-102:7.
  • the ink material is water-soluble ink.
  • the curing temperature is 180°C ⁇ 10°C, and the curing time is 20min ⁇ 1min.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75° ⁇ 5°.
  • the angle of the scraper is 70° ⁇ 5°.
  • the screen spacing is 1.5mm-4.5mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 22N ⁇ 2N.
  • the viscosity of the ink material is 5000mpa.s ⁇ 1000mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par. It should be noted that during the printing process, boiling oil and water need to be added to adjust the viscosity of the ink material. Further, 1mL-3mL of boiling oil and water are added to the third ink every 1h-1.5h.
  • S1312 includes forming a masking film 170 on the decorative surface 111 to cover the exposed part of the rough area 113 and expose the area where the rough area 113 and the third ink are not formed of the transparent substrate 110.
  • the masking film 170 is a PET film.
  • S1312 includes: sticking a masking film 170 on the decorative surface 111. Further, a masking film 170 is pasted on the decorative surface 111, and the masking film 170 partially covers the third ink portion 161 to shield the third through hole 161a.
  • This arrangement makes it possible to better shield the third through hole 161a, so as to prevent the ink material in the process of subsequent spraying of the fourth ink from penetrating into the third through hole 161a and affecting the coating of the decorative surface 111 at the third through hole 161a effect.
  • the masking film 170 is pasted on the area of the decorative surface 111 where the third ink portion 161 is not formed, and the masking film 170 partially covers the third ink portion 161 to shield the third through hole 161a.
  • the fourth ink sprayed later can partially cover the third ink portion 161, so as to avoid the formation of a gap between the fourth ink and the third ink portion 161, thereby protecting the area of the decorative surface 111 that does not require coating treatment.
  • the shielding film 170 is not limited to the above-mentioned arrangement, and the shielding film 170 may be received in the third through hole 161a and directly attached to the decorative surface 111.
  • the total air pressure of the film sticking machine is 0.5MPa-0.6MPa.
  • the pressure of the film roller is 0.2MPa-0.4MPa.
  • the filming speed is 200mm/s-400mm/s.
  • the feeding speed is 80mm/s-100mm/s.
  • the discharge speed is 80mm/s-100mm/s.
  • the transfer speed is 600mm/s-1000mm/s. It should be noted that the surface of the filming fixture on the filming machine needs to be pasted with Teflon. If the Teflon is damaged, it should be replaced immediately.
  • the shielding film 170 after the shielding film 170 is formed, it also includes checking whether the surface of the transparent substrate 110 on which the shielding film 170 is formed has problems such as dirt and foreign matter.
  • This arrangement can protect the area on the transparent substrate 110 that does not need to be coated, especially the transparent substrate 110 is curved glass, so that the bending area of the transparent substrate 110 can also be sprayed with the fourth ink for protection.
  • S1313 includes spraying and curing the fourth ink on the area where the masking film 170 is not formed on the transparent substrate 110 to form the fourth ink portion 163.
  • the fourth ink includes ink material and boiling water.
  • the ink material is water-soluble ink.
  • the mass ratio of ink material to boiling water is 98:3-102:7.
  • the curing temperature is 180°C ⁇ 10°C, and the curing time is 20min ⁇ 1min.
  • the step of inspecting the fourth ink portion 163 is further included. Specifically, the appearance of the fourth ink portion 163 is checked for problems such as toothlessness, missing, blisters, chromatic aberration, black and white dots, etc.
  • the third ink portion 161 and the fourth ink portion 163 form the second ink layer 160.
  • the method of coating the decorative surface 111 is electroplating, deposition or sputtering.
  • the step of coating the decorative surface 111 includes: forming a first silicon dioxide layer 121, a first niobium pentoxide layer 122, and a second niobium pentoxide layer on the decorative surface 111 sequentially stacked The silicon dioxide layer 123, the single crystal silicon layer 124, the third silicon dioxide layer 125, the second niobium pentoxide layer 126, and the fourth silicon dioxide layer 127.
  • the thickness of the first silicon dioxide layer 121 is 8 nm-12 nm.
  • the thickness of the first niobium pentoxide layer 122 is 68 nm-72 nm.
  • the thickness of the second silicon dioxide layer 123 is 88 nm-92 nm.
  • the thickness of the single crystal silicon layer 124 is 83 nm-87 nm.
  • the thickness of the third silicon dioxide layer 125 is 42 nm-46 nm.
  • the thickness of the second niobium pentoxide layer 126 is 50 nm-54 nm.
  • the thickness of the fourth silicon dioxide layer 127 is 8 nm-12 nm.
  • a first silicon dioxide layer 121, a first niobium pentoxide layer 122, a second silicon dioxide layer 123, a single crystal silicon layer 124, and a third silicon dioxide layer 125 are sequentially stacked on the decorative surface 111.
  • the method of forming each film layer is electroplating.
  • the temperature of the coating is 60°C ⁇ 5°C. More specifically, a coating machine is used to form a first silicon dioxide layer 121, a first niobium pentoxide layer 122, a second silicon dioxide layer 123, a single crystal silicon layer 124, and a second silicon dioxide layer on the decorative surface 111.
  • the silicon oxide layer 125, the second niobium pentoxide layer 126, and the fourth silicon dioxide layer 127 are plated per pot, and the total plating time is 40min ⁇ 5min.
  • the coating machine is a coating machine of Guangchi Company.
  • the step of removing the second ink layer 160 includes: performing a deplating treatment on the transparent substrate 110 after the plating process with a deplating agent to remove the second ink layer 160.
  • the stripping agent is pure water.
  • the temperature of deplating treatment is 65°C ⁇ 5°C.
  • the deplating time is 5min ⁇ 1min.
  • the method of stripping is spraying or soaking.
  • the step of removing the second ink layer 160 further includes a step of inspecting the transparent substrate 110 from which the second ink layer 160 is removed. Specifically, it is checked whether there are any problems such as dirt, creases, wrinkles, scratches, and poor deplating on the transparent substrate 110 after the second ink layer 160 is removed.
  • the method further includes the following steps: testing the reflective layer 120 for adhesion and impact resistance.
  • the detection method of adhesion is 100 grid test.
  • the step of detecting the adhesion of the reflective layer 120 includes: using a sharp blade to apply 100 small grids of 1mm ⁇ 1mm on the reflective layer 120, and the 100 small grids form a square grid, and cut through the film layer until the transparent substrate is exposed.
  • the impact resistance test method is a falling ball test. Specifically, a falling ball tester was used to drop a 32g steel ball from a height of 10 cm onto the side of the transparent substrate 110 away from the decorative surface 111; the test was performed 5 times, and the height of the ball falling was increased by 5 cm each time until the transparent substrate 110 was broken. The height at which the ball falls until the transparent substrate 110 is broken is recorded. The higher the height, the better the impact resistance. Specifically, the side of the transparent substrate 110 away from the decorative surface 111 is the back 114 of the transparent substrate 110.
  • the method further includes the following step: cleaning the transparent substrate 110 on which the third ink part 161 is formed.
  • the cleaning method is ultrasonic cleaning.
  • an alkaline cleaning cleaning agent with a pH of 12-14 is used to ultrasonically clean the transparent substrate 110 on which the third ink portion 161 is formed.
  • the cleaning temperature is 50°C ⁇ 5°C.
  • the transparent substrate 110 on which the third ink portion 161 is formed is sequentially immersed in the first cleaning tank containing the alkaline cleaning agent with a pH of 12-14, and the second cleaning tank containing the alkaline cleaning agent with the pH of 12-14.
  • the second cleaning tank and the pure water tank are used for cleaning, and the cleaned transparent substrate 110 is sequentially dried in the slow drawing dehydration tank and the drying tank.
  • the cleaning time in each tank is 60s ⁇ 10s.
  • the temperature of the first cleaning tank and the second cleaning tank is 50°C ⁇ 5°C.
  • the volume of the alkaline cleaning agent in the first cleaning tank is 3L ⁇ 1L, and the volume of the alkaline cleaning agent in the first cleaning tank is 2L ⁇ 1L.
  • the temperature of the pure water tank is 50°C ⁇ 10°C.
  • the number of times of pure water cleaning can be one or multiple, which can be set as needed.
  • the purity of pure water is greater than 10M ⁇ cm, and the time for each pure water cleaning is 60s ⁇ 10s.
  • the temperature of slow drawing dehydration is 50°C ⁇ 10°C.
  • the speed of slow pulling dehydration is 10Hz-15Hz.
  • the drying temperature is 90°C ⁇ 10°C.
  • the sequential slow-drawing dehydration and drying operations on the cleaned transparent substrate 110 may be omitted.
  • the transparent substrate 110 may be allowed to air dry naturally.
  • the method further includes the following steps: forming a film layer unit 130 on the decorative surface 111.
  • 130 covers the reflective layer 120.
  • the film unit 130 can protect the reflective layer 120 and the rough area 113, and can also shield the circuit board from the side close to the casing assembly 100 and the display unit 20 close to the casing assembly 100.
  • the film layer unit 130 covers a side of the transparent substrate 110 close to the reflective layer 120.
  • the step of forming the film layer unit 130 on the decorative surface 111 includes: forming a substrate 131, a color layer 132, an appearance layer 133 and a primer layer 134 stacked in sequence on the decorative surface 111.
  • the substrate 131 faces the reflective layer 120.
  • the step of forming the substrate 131 on the decorative surface 111 includes: attaching the adhesive layer 131 a to the side of the transparent substrate 110 close to the reflective layer 120 and the reflective layer 120.
  • the step of forming the color layer 132 on the side of the substrate 131 away from the decorative surface 111 includes: forming a ribbon layer on the side of the substrate 131 away from the decorative surface 111 by a ribbon printing technology to obtain the color layer 132. It should be noted that the method of forming the color layer 132 is not limited to ribbon printing technology. An offset printing layer can also be formed on the side of the substrate 131 away from the decorative surface 111 by offset printing technology to obtain the color layer 132.
  • the step of forming the functional layer 133 on the side of the color layer 132 away from the substrate 131 includes: forming a primer layer 1336 and a texture sublayer 1332 that are sequentially stacked on the side of the color layer 132 away from the substrate 131 And the reflective sub-layer 1334 to obtain the functional layer 133. Further, the primer layer 1336 is pasted on the side of the color layer 132 away from the substrate 131.
  • the method of forming the texture sublayer 1332 is UV transfer.
  • the method of forming the reflective sublayer 1334 is electroplating. It should be noted that the method of forming the reflective sublayer 1334 is not limited to electroplating, and may also be deposition or sputtering.
  • the way of forming the primer layer 134 on the side of the appearance layer 133 away from the color layer 132 is screen printing. It should be noted that the method of forming the primer layer 134 is not limited to screen printing, and spray coating may also be used.
  • the rough area 113 is formed on the transparent substrate 110 so that the housing assembly 100 has a frosting effect at the rough area 113, which can prevent glare, and the reflective layer 120 is formed on the decorative surface 111 , So that the reflective layer 120 covers at least a part of the rough area 113, so that the housing assembly 100 has a shiny effect, so that the resulting housing assembly 100 is superimposed on the rough area 113 and the reflective layer 120, so that the housing assembly 100 can be shiny And anti-glare.
  • the frosting process and the coating process are combined by providing the first ink layer 140 and the second ink layer 160, so that the rough area 113 and the reflective layer 120 are superimposed , So that the housing assembly 100 has a shiny and frosted effect, so as to achieve the matte and body effect on the housing assembly 100, so as to enhance the appearance effect of the electronic device containing the housing assembly 100.
  • the formed reflective layer 120 includes a first silicon dioxide layer 121, a first niobium pentoxide layer 122, a second silicon dioxide layer 123, and a single crystal silicon
  • the layer 124, the third silicon dioxide layer 125, the second niobium pentoxide layer 126, and the fourth silicon dioxide layer 127 make the reflective layer 120 have a larger brightening angle and higher adhesion, so that the shell
  • the component 100 has a brightening effect on the reflective layer 120, and the appearance effect is better.
  • the reflective layer 120 has strong adhesion, and the rough area 113 and the reflective layer 120 are superimposed, so that the housing assembly 100 has a shiny and frosted effect.
  • electronic equipment with shiny and frosted LOGO (logo) can be prepared by the preparation method.
  • the decorative surface 111 of the housing assembly 100 is not limited to being opposite to the display assembly 20, and the back 114 of the housing assembly 110 may be opposite to the display assembly 20.
  • the transparent substrate 110 is curved glass
  • the decorative surface 111 is a convex surface of the transparent substrate 110.
  • the film reaction 130 covers the back side 114.
  • the housing assembly 100 may also include a cover layer.
  • the cover layer covers the reflective layer 120 and the rough area 113.
  • the covering layer is provided to protect the reflective layer 120 and the rough area 113 and avoid the reflective layer 120 and the rough area 113 from being scratched.
  • the method for preparing the housing assembly 100 further includes: forming a covering layer on the decorative surface 111, and the covering layer covers the reflective layer 120 and the rough area 113. Specifically, a film film is attached to the side of the transparent substrate 110 close to the reflective layer 120 to form the cover layer 130.
  • the rough area 113 is not limited to being located in the decorative surface 111, and the edge of the rough area 113 may overlap the edge of the decorative surface 111.
  • the reflective layer 120 is not limited to being located within the decorative surface 111, and the edge of the reflective layer 120 may overlap the edge of the decorative surface 111.
  • the size of the third through hole 161a is not limited to the size of the rough area 113, and the size of the third through hole 161a can also be larger than the size of the rough area 113.
  • the second ink layer 160 is separated from the rough area 113.
  • the reflective layer 120 completely covers the rough area 113 and covers the space between the second ink layer 160 and the rough area 113.
  • the housing assembly 100 has a matte effect at the overlap of the reflective layer 120 and the rough area 113.
  • the space between the rough areas 113 and the overlap of the reflective layer 120 present a bright surface effect, so that the housing assembly 100 has the effect of matte and monolithic; the size of the third through hole 161a can also be smaller than the size of the rough area 113, in this case,
  • the second ink layer 160 partially covers the rough area 113, the reflective layer 120 is located in the rough area 113, and the housing assembly 100 has a matte effect at the overlap of the reflective layer 120 and the rough area 113, between the second ink layer 160 and the rough area 113
  • the overlap between the interval and the reflective layer 120 presents a bright surface effect, so that the housing assembly 100 has a matte effect.
  • the first ink layer 140 is not limited to being formed on the decorative surface 111, and the first ink layer 140 may also cover the decorative surface 111 and cover the back 114. At this time, the transparent substrate 110 on which the first ink layer 140 is formed is directly frosted to remove the first ink layer 140 to obtain the rough area 113.
  • the second ink layer 160 is not limited to being formed on the decorative surface 111, and the second ink layer 160 may also cover the decorative surface 111 and cover the back 114. At this time, the transparent substrate 110 on which the second ink layer 160 is formed is directly coated to remove the second ink layer 160 to obtain the reflective layer 120.
  • the method of forming the reflective layer 120 on the decorative surface 111 is not limited to electroplating, and may also be other methods, such as deposition.
  • the deposition method is PVD (Physical Vapor Deposition, physical vapor deposition).
  • the step of forming the reflective layer 120' on the decorative surface includes: forming a silicon layer 121', a first titanium layer 122', and a copper layer sequentially stacked on the decorative surface 123' and the second titanium layer 124' to obtain the reflective layer 120.
  • the reflective layer 120 has higher brightness and stronger impact resistance.
  • the thickness of the silicon layer 121' is 3 nm-7 nm.
  • the thickness of the first titanium layer 122' is 6 nm-10 nm.
  • the thickness of the copper layer 123' is 18nm-22nm.
  • the thickness of the second titanium layer 124' is 48 nm-52 nm.
  • the PVD method is used to form the reflective layer 120' on the side of the rough area away from the transparent substrate, so that the reflective layer 120' has higher brightness and stronger impact resistance.
  • the step of forming the reflective layer 120 on the decorative surface 111 is not limited to the steps indicated above.
  • the step of forming the reflective layer on the decorative surface includes S231-S232:
  • the reflective layer can completely cover the rough area and cover the gap between the second ink and the rough area, so that the shell assembly is shiny and has a matte effect at the superposition of the reflective layer and the rough area.
  • the component has a higher brightness where the reflective layer is not overlapped with the rough area, presenting the effect of a bright surface, so that the shell component has the effect of matte and body.
  • S231 includes S2311-S2314:
  • the operation of S2311 is substantially the same as that of S1311, except that the third ink is arranged around the rough area, and the third ink forms a gap with the rough area. Further, the third ink part is arranged around the rough area, and the third ink part forms a gap with the rough area. Furthermore, the diameter of the third through hole is 0.3 mm-0.4 mm larger than the diameter of the first through hole. This arrangement enables the reflective layer to completely cover the rough area. Please refer to the above for other process and process parameters, so I won't repeat them here.
  • S2312 includes forming a masking film on the decorative surface to cover the rough areas and gaps and expose the areas where the roughness is not formed and the areas where the third ink is not formed on the transparent substrate.
  • the reflective layer formed in the above embodiment completely covers the rough area, and the reflective layer is separated from the rough area, so that the shell assembly is shiny and has a frosted effect at the superposition of the reflective layer and the rough area.
  • the superimposition of the rough area has a higher brightness, presenting a bright surface effect, so that the shell assembly has a matte and body effect.
  • the aperture of the third through hole is not limited to be 0.3mm-0.4mm larger than the aperture of the first through hole; the aperture of the third through hole may be larger than the aperture of the first through hole.
  • the reflective layer is located in the rough area.
  • the shell assembly presents a matte effect at the superposition of the reflective layer and the rough area, and has a shiny and glossy effect.
  • the shell assembly has a matte effect where the rough area is not overlapped with the reflective layer, so that the shell assembly has a different effect in different areas.
  • the gloss Specifically, in the rough area, the center is frosted and has a brightness effect, and the edges are frosted, and the appearance effect is better.
  • the step of forming the first ink layer 140 on the decorative surface 111 may be omitted.
  • the decorative surface 111 can be directly frosted to form the rough area 113. This arrangement makes the entire surface of the decorative surface 111 present a frosting effect.
  • the step of forming the second ink layer 160 on the decorative surface 111 may be omitted.
  • the decorative surface 111 can be directly coated to form the reflective layer 120. This arrangement makes the whole surface of the decorative surface 111 have the effect of shining and gloss.
  • the step of forming the first ink layer 140 on the decorative surface 111 and the step of forming the second ink layer 160 on the decorative surface 111 may both be omitted.
  • the decorative surface 111 may be directly frosted to form the rough area 113, and then the decorative surface 111 may be directly coated to form the reflective layer 120. This arrangement makes the whole surface of the decorative surface 111 have the effects of frosting, shining and glossiness.
  • the step of strengthening the transparent substrate 110 may be omitted.
  • the step of forming the second ink layer 160 on the decorative surface 111 may be omitted.
  • the method further includes the following steps: coating the decorative surface 111 to form the reflective layer 120 on the decorative surface 111, and The reflective layer 120 at least partially covers the rough area 113.
  • the alkaline cleaning agent is a commercially available alkaline cleaning agent.
  • the acid-resistant ink is a commercially available acid-resistant ink.
  • the purity of pure water is greater than 10M ⁇ cm.
  • the boiling oil and water are commercially available boiling oil and water.
  • the water-soluble ink is a commercially available water-soluble ink.
  • the lye is an aqueous solution of sodium hydroxide.
  • Both the protective film and the shielding film are PET films.
  • the transparent substrate is a transparent glass substrate.
  • the thickness of the transparent substrate is 0.5 mm.
  • the first ink is screen-printed on a partial area of the decorative surface for the first time and cured to obtain a cured portion, and the first ink is screen-printed on the cured portion for the second time and cured to obtain the first ink portion.
  • the thickness of each printing is 5 ⁇ m.
  • the first ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 98:3.
  • the curing temperature was 150°C and the curing time was 19 minutes.
  • the oil change frequency is every 4h.
  • the curing temperature was 140°C and the curing time was 2.5 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 70°.
  • the angle of the scraper is 65°.
  • the screen spacing is 1.5mm.
  • the viscosity of the first ink is 5000 mpa.s.
  • the screen life is less than or equal to 12h. During each printing process, 1 mL of boiling water was added to the first ink every 1 hour.
  • the second ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 98:3.
  • the curing process includes: treating at 140°C for 4.5 min, and then placing it at 140°C for 19 min.
  • the frosting treatment fluid includes frosting fluid and water.
  • the mass ratio of frosting liquid and water is 6.5:25.
  • the frosting liquid is the frosting liquid of Shenzhen Jingermei Technology Co., Ltd.
  • the conveyor belt runs at a speed of 1m/min and the water jet speed is 2.3m/min; the cured frosting liquid is sprayed Pour the transparent substrate to obtain a frosted transparent substrate.
  • the running speed of the conveyor belt is 1.4m/min, and the temperature of the frosting solution is 28°C.
  • the frosted transparent substrate is immersed in a decoating tank containing a first decoating agent at a temperature of 60°C, a decoating tank containing a second decoating agent at a temperature of 60°C, and a decoating tank containing a temperature of 60°C. Soaked in a deplating tank of the third stripping agent at a temperature of 50°C, and then immersed in a water tank filled with pure water at a temperature of 50°C to remove the first ink layer to obtain a transparent substrate formed with rough areas.
  • the first stripping agent is a lye with a mass percentage of 5%.
  • the second stripping agent is an alkaline solution with a mass percentage of 1%.
  • the third stripping agent is a lye with a mass percentage of 1%.
  • the soaking time of each tank is 50s.
  • the transparent substrate treated in step (5) is placed in a cleaning tank containing a first cleaning solution, a cleaning tank containing a second cleaning solution, and a cleaning tank containing pure water in order to clean the transparent substrate.
  • the cleaned transparent substrate is placed in a slow-drawing dehydration tank and a drying tank for drying.
  • the processing time of each tank is 50s.
  • the first cleaning solution includes a first cleaning agent with a mass percentage of 1.5%, the first cleaning agent is an alkaline cleaning agent with a pH of 12, and the cleaning temperature of the first cleaning solution is 55°C.
  • the second cleaning solution includes a second cleaning agent with a mass percentage of 1.5%, the second cleaning agent is an alkaline cleaning agent with a pH of 12, and the cleaning temperature of the second cleaning solution is 55°C.
  • the temperature of pure water washing is 60°C.
  • the temperature of slow drawing dehydration is 60°C.
  • the speed of slow pulling dehydration is 10 Hz.
  • the drying temperature is 60°C.
  • step (6) Perform two strengthening treatments on the transparent substrate treated in step (6) to obtain a strengthened transparent substrate.
  • Each strengthening treatment the transparent substrate is placed at 280°C for 12 minutes so that the temperature of the transparent substrate is 280°C; the preheated transparent substrate is immersed in molten salt at 378°C for 37 minutes.
  • the molten salt includes sodium nitrate with a mass percentage of 6% and potassium nitrate with a mass percentage of 94%.
  • the third ink is screen-printed on the part of the decorative surface where the rough area is not formed, and cured to form the third ink portion, and all the rough areas are exposed to the third ink portion.
  • the third ink includes ink material and boiling water. The mass ratio of ink material to boiling water is 98:3.
  • the ink material is water-soluble ink.
  • the curing temperature is 170°C, and the curing time is 19 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 70°.
  • the angle of the scraper is 65°.
  • the screen spacing is 1.5mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 20N.
  • the viscosity of the third ink is 4000 mpa.s.
  • the screen life is less than or equal to 12h. Add 1 mL of boiling oil and water to the third ink every 1 h.
  • the fourth ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 98:3.
  • the ink material is water-soluble ink.
  • the curing temperature is 170°C, and the curing time is 19 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 70°.
  • the angle of the scraper is 65°.
  • the screen spacing is 1.5mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 20N.
  • the viscosity of the fourth ink is 4000 mpa.s.
  • the screen life is less than or equal to 12h. Add 1 mL of boiling oil and water to the fourth ink every 1 h.
  • the first silicon dioxide layer of 8nm, the first niobium pentoxide layer of 68nm, the second silicon dioxide layer of 88nm, and the single crystal silicon layer of 83nm are sequentially stacked on the decorative surface by electroplating.
  • the 42nm third silicon dioxide layer, the 50nm second niobium pentoxide layer, and the 8nm fourth silicon dioxide layer have a coating temperature of 55°C. After coating treatment, soak in pure water at 60°C for 4 minutes to remove the second ink layer to obtain a reflective layer, which completely overlaps with the rough area.
  • a film layer unit is formed on the decorative surface, and the film layer unit covers the decorative surface and the reflective layer to obtain a shell assembly.
  • the thickness of the transparent substrate is 0.7 mm.
  • the first ink is screen-printed on a partial area of the decorative surface for the first time and cured to obtain a cured portion, and the first ink is screen-printed on the cured portion for the second time and cured to obtain the first ink portion.
  • the thickness of each printing is 8 ⁇ m.
  • the first ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 102:7.
  • the curing temperature was 170°C and the curing time was 21 minutes.
  • the oil change frequency is every 4h.
  • the curing temperature was 180°C and the curing time was 3.5 min.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 80°.
  • the angle of the scraper is 75°.
  • the screen spacing is 4.5mm.
  • the viscosity of the first ink is 7000 mpa.s.
  • the screen life is less than or equal to 12h. During each printing process, 3 mL of boiling oil and water were added to the first ink every 1.5h.
  • the second ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 102:7.
  • the curing process includes: treatment at 180°C for 5.5 min, and then at 160°C for 21 min.
  • the frosting treatment fluid includes frosting fluid and water.
  • the mass ratio of frosting liquid and water is 6.5:25.
  • the frosting liquid is the frosting liquid of Foshan Rhino Fine Chemical Co., Ltd.
  • the conveyor belt runs at a speed of 3m/min and the water jet speed is 2.3m/min; the cured frosting liquid is sprayed Pour the transparent substrate to obtain a frosted transparent substrate.
  • the running speed of the conveyor belt is 1.6m/min, and the temperature of the frosting treatment liquid is 32°C.
  • frosted transparent substrate Place the frosted transparent substrate on the conveyor belt, and spray the transparent substrate with an aqueous solution of HF with a mass percentage of 5% at 32° C. to obtain the frosted transparent substrate.
  • the frosted transparent substrate was immersed in a decoating tank containing a first decoating agent at a temperature of 70°C, a decoating tank containing a second decoating agent at a temperature of 70°C, and a decoating tank containing a temperature of 70°C. Soaked in the deplating tank of the third stripping agent at °C, and then immersed in a water tank filled with pure water at a temperature of 60°C to remove the first and second ink layers to obtain a transparent substrate with rough areas .
  • the first stripping agent is a lye with a mass percentage of 5%.
  • the second stripping agent is a lye with a mass percentage of 3%.
  • the third stripping agent is a lye with a mass percentage of 3%.
  • the soaking time of each tank is 70s.
  • the transparent substrate treated in step (5) is placed in a cleaning tank containing a first cleaning solution, a cleaning tank containing a second cleaning solution, and a cleaning tank containing pure water in order to clean the transparent substrate.
  • the cleaned transparent substrate is placed in a slow-drawing dehydration tank and a drying tank for drying.
  • the processing time of each tank is 70s.
  • the first cleaning solution includes a first cleaning agent with a mass percentage of 2.5%, the first cleaning agent is an alkaline cleaning agent with a pH of 14, and the cleaning temperature of the first cleaning solution is 75°C.
  • the second cleaning solution includes a second cleaning agent with a mass percentage of 2.5%, the second cleaning agent is an alkaline cleaning agent with a pH of 14, and the cleaning temperature of the second cleaning solution is 75°C.
  • the temperature of pure water washing is 80°C.
  • the temperature of slow drawing dehydration is 810°C.
  • the speed of slow pulling dehydration is 15 Hz.
  • the drying temperature is 100°C.
  • step (6) Perform two strengthening treatments on the transparent substrate treated in step (6) to obtain a strengthened transparent substrate.
  • Each strengthening treatment the transparent substrate is placed at 320°C for 12 minutes so that the temperature of the transparent substrate is 320°C; the preheated transparent substrate is immersed in molten salt at 382°C for 43 minutes.
  • the molten salt includes sodium nitrate with a mass percentage of 6% and potassium nitrate with a mass percentage of 94%.
  • the third ink is screen-printed on the part of the decorative surface where the rough area is not formed, and cured to form the third ink portion, and all the rough areas are exposed to the third ink portion.
  • the third ink includes ink material and boiling water. The mass ratio of ink material to boiling water is 102:7.
  • the ink material is water-soluble ink.
  • the curing temperature is 190°C, and the curing time is 21 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 80°.
  • the angle of the scraper is 75°.
  • the screen spacing is 4.5mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 24N.
  • the viscosity of the third ink is 6000 mpa.s.
  • the screen life is less than or equal to 12h. Add 3 mL of boiling water to the third ink every 1.5h.
  • the fourth ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 102:7.
  • the ink material is water-soluble ink.
  • the curing temperature is 190°C, and the curing time is 21 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 80°.
  • the angle of the scraper is 75°.
  • the screen spacing is 4.5mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 24N.
  • the viscosity of the fourth ink is 6000 mpa.s.
  • the screen life is less than or equal to 12h. Add 3mL of boiling oil and water to the fourth ink every 1.5h.
  • the first silicon dioxide layer of 12nm, the first niobium pentoxide layer of 72nm, the second silicon dioxide layer of 92nm, and the single crystal silicon layer of 87nm are sequentially stacked on the decorative surface by electroplating.
  • the 46nm third silicon dioxide layer, 54nm second niobium pentoxide layer, 12nm fourth silicon dioxide layer, and the coating temperature is 65°C. After coating treatment, soak in pure water at 70°C for 6 minutes to remove the second ink layer to obtain a reflective layer, which completely overlaps the rough area.
  • a film layer unit is formed on the decorative surface, and the film layer unit covers the decorative surface and the reflective layer to obtain a shell assembly.
  • the thickness of the transparent substrate is 0.6 mm.
  • the first ink is screen-printed on a partial area of the decorative surface for the first time and cured to obtain a cured portion, and the first ink is screen-printed on the cured portion for the second time and cured to obtain the first ink portion.
  • the first ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 100:5.
  • the curing temperature is 160°C
  • the curing time is 20 minutes.
  • the oil change frequency is every 4h.
  • the curing temperature is 160°C and the curing time is 3 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75°.
  • the angle of the scraper is 70°.
  • the screen spacing is 3mm.
  • the viscosity of the first ink is 6000 mpa.s.
  • the screen life is less than or equal to 12h. During each printing process, 2 mL of boiling oil and water were added to the first ink every 1.5 hours.
  • a protective film is pasted on the area of the decorative surface where the first ink is not formed, and the protective film partially covers the first ink portion.
  • the second ink is sprayed on the area of the transparent substrate where the protective film is not formed, cured to form a second ink portion, and the protective film is peeled off to obtain a first ink layer.
  • the second ink includes ink material and boiling water.
  • the ink material is acid-resistant ink.
  • the mass ratio of ink material to boiling water is 100:5.
  • the curing process includes: treating at 160°C for 5 minutes, and then placing it at 150°C for 20 minutes.
  • the frosting treatment fluid includes frosting fluid and water.
  • the mass ratio of frosting liquid and water is 6.5:25.
  • the frosting liquid is the frosting liquid of Shenzhen Jingermei Technology Co., Ltd. Place the transparent substrate with the first ink layer on the conveyor belt, and spray the transparent substrate with pure water.
  • the conveyor belt runs at a speed of 2m/min, and the water jet speed is 2.3m/min; the cured frosting liquid is sprayed Pour the transparent substrate to obtain a frosted transparent substrate.
  • the running speed of the conveyor belt is 1.5m/min, and the temperature of the frosting treatment liquid is 30°C.
  • the frosted transparent substrate is immersed in the decoating tank containing the first decoating agent at a temperature of 65°C, the decoating tank containing the second decoating agent at the temperature of 65°C, and the decoating tank containing the temperature of 65°C. Soaked in the deplating tank of the third stripping agent at °C, and then immersed in a water tank filled with pure water at a temperature of 55°C to remove the first ink layer and the second ink layer to obtain a transparent substrate with rough areas .
  • the first stripping agent is a lye with a mass percentage of 5%.
  • the second stripping agent is a lye with a mass percentage of 5%.
  • the third stripping agent is a lye with a mass percentage of 5%.
  • the soaking time of each tank is 60s.
  • the transparent substrate treated in step (5) is placed in a cleaning tank containing a first cleaning solution, a cleaning tank containing a second cleaning solution, and a cleaning tank containing pure water in order to clean the transparent substrate.
  • the cleaned transparent substrate is placed in a slow-drawing dehydration tank and a drying tank for drying.
  • the processing time of each tank is 60s.
  • the first cleaning solution includes a first cleaning agent with a mass percentage of 2%, the first cleaning agent is an alkaline cleaning agent with a pH of 13, and the cleaning temperature of the first cleaning solution is 65°C.
  • the second cleaning solution includes a second cleaning agent with a mass percentage of 3%, the second cleaning agent is an alkaline cleaning agent with a pH of 13, and the cleaning temperature of the second cleaning solution is 65°C.
  • the temperature of pure water washing is 70°C.
  • the temperature of slow drawing dehydration is 70°C.
  • the speed of slow pulling dehydration is 13 Hz.
  • the drying temperature is 80°C.
  • step (6) Perform two strengthening treatments on the transparent substrate treated in step (6) to obtain a strengthened transparent substrate.
  • Each strengthening treatment the transparent substrate is placed at 300°C for 12 minutes so that the temperature of the transparent substrate is 300°C; the preheated transparent substrate is immersed in molten salt at 380°C for 40 minutes.
  • the molten salt includes sodium nitrate with a mass percentage of 6% and potassium nitrate with a mass percentage of 94%.
  • the third ink is screen-printed on the part of the decorative surface where the rough area is not formed, and cured to form the third ink portion, and all the rough areas are exposed to the third ink portion.
  • the third ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 100:5.
  • the ink material is water-soluble ink.
  • the curing temperature is 180°C, and the curing time is 20 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75°.
  • the angle of the scraper is 70°.
  • the screen spacing is 3mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 22N.
  • the viscosity of the third ink is 5000 mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par. Add 2 mL of boiling oil and water to the third ink every 1 hour.
  • (9) Ultrasonic cleaning is performed on the transparent substrate on which the third ink part is formed.
  • the transparent substrate on which the third ink portion is formed is sequentially immersed in a first cleaning tank containing an alkaline cleaning detergent with a pH of 13, a second cleaning tank containing an alkaline cleaning detergent with a pH of 13, and a pure water tank.
  • the cleaned transparent substrate is sequentially dried in a slow drawing dehydration tank and a drying tank.
  • the temperature of the first cleaning tank and the second cleaning tank is 50°C.
  • the temperature of the pure water tank is 50°C.
  • the cleaning time in each tank is 60s.
  • the temperature of slow drawing dehydration is 50°C.
  • the speed of slow pulling dehydration is 12 Hz.
  • the drying temperature is 90°C.
  • the fourth ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 100:5.
  • the ink material is water-soluble ink.
  • the curing temperature is 180°C, and the curing time is 20 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75°.
  • the angle of the scraper is 70°.
  • the screen spacing is 3mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 22N.
  • the viscosity of the fourth ink is 5000 mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par. Add 2mL of boiling water to the fourth ink every 1h.
  • the first silicon dioxide layer of 10nm, the first niobium pentoxide layer of 70nm, the second silicon dioxide layer of 90nm, and the single crystal silicon layer of 85nm are sequentially stacked on the decorative surface by electroplating. 44nm third silicon dioxide layer, 52nm second niobium pentoxide layer, 10nm fourth silicon dioxide layer.
  • the temperature of the coating is 65°C. After coating treatment, soak in pure water at 65°C for 5 minutes to remove the second ink layer to obtain a reflective layer, which completely overlaps the rough area.
  • a film layer unit is formed on the decorative surface, and the film layer unit covers the decorative surface and the reflective layer to obtain a shell assembly.
  • the structure of the housing assembly of this embodiment is shown in Figures 1-3, 5-6 and 12.
  • the preparation process of the housing assembly of this embodiment is roughly the same as that of Example 1, except that in step (12) In the PVD method, a silicon layer, a first titanium layer, a copper layer, and a second titanium layer are sequentially stacked on the side of the rough area away from the transparent substrate.
  • the thickness of the silicon layer is 3nm
  • the thickness of the first titanium layer is 6nm
  • the thickness of the copper layer is 18nm
  • the thickness of the second titanium layer is 48nm.
  • After the coating treatment it is soaked in pure water at 60° C. for 4 minutes to remove the second ink layer to obtain a reflective layer.
  • the structure of the housing assembly of this embodiment is shown in Figures 1-3, 5-6 and 12.
  • the preparation process of the housing assembly of this embodiment is roughly the same as that of Embodiment 2, except that in step (12) In the PVD method, a silicon layer, a first titanium layer, a copper layer, and a second titanium layer are sequentially stacked on the side of the rough area away from the transparent substrate.
  • the thickness of the silicon layer is 7nm
  • the thickness of the first titanium layer is 10nm
  • the thickness of the copper layer is 22nm
  • the thickness of the second titanium layer is 52nm.
  • After coating treatment, it is soaked in pure water at 70°C for 6 minutes to remove the second ink layer to obtain a reflective layer.
  • the structure of the housing assembly of this embodiment is shown in Figures 1-3, 5-6 and 12.
  • the preparation process of the housing assembly of this embodiment is roughly the same as that of the third embodiment, except that in step (12)
  • a silicon layer, a first titanium layer, a copper layer, and a second titanium layer are sequentially stacked on the side of the rough area away from the transparent substrate.
  • the thickness of the silicon layer is 5nm
  • the thickness of the first titanium layer is 8nm
  • the thickness of the copper layer is 20nm
  • the thickness of the second titanium layer is 50nm.
  • After coating treatment soak in pure water at 65°C for 5 minutes to remove the second ink layer to obtain a reflective layer.
  • step (12) The preparation process of the housing assembly of this embodiment is roughly the same as that of embodiment 3, except that in step (12), a film film is attached to the decorative surface to form a cover layer, and a film layer unit is formed on the transparent substrate The film layer unit is located on the side of the transparent substrate away from the decorative surface to obtain the shell assembly.
  • step (12) The manufacturing process of the housing assembly of this embodiment is roughly the same as that of Embodiment 3, except that in step (12), a germanium layer is used instead of the single crystal silicon layer.
  • step (12) an electroplating method is used to form a 170nm first layer on the side of the rough area away from the transparent substrate.
  • the manufacturing process of the housing assembly of this embodiment is approximately the same as that of Embodiment 6, except that in step (11), the thickness of the copper layer is 15 nm.
  • the preparation process of the housing assembly of this embodiment is roughly the same as that of embodiment 3, except that, in step (5), the frosted transparent substrate is sequentially immersed in the first step with a temperature of 65°C. Soak in the deplating bath of the plating agent, the deplating bath containing the second deplating agent at a temperature of 65°C, and the deplating bath containing the third deplating agent at the temperature of 65°C, and then soak in In a pure water tank at 55°C, the first ink layer and the second ink layer were removed to obtain a transparent substrate with rough areas.
  • the first stripping agent is a lye with a mass percentage of 5%.
  • the second stripping agent is a lye with a mass percentage of 5%.
  • the third stripping agent is a lye with a mass percentage of 5%.
  • the soaking time of each tank is 60s.
  • the thickness of the transparent substrate is 0.6 mm.
  • the transparent substrate treated in step (1) is placed in a cleaning tank containing a first cleaning liquid, a cleaning tank containing a second cleaning liquid, and a cleaning tank containing pure water sequentially to clean the transparent substrate.
  • the cleaned transparent substrate is placed in a slow-drawing dehydration tank and a drying tank for drying.
  • the processing time of each tank is 60s.
  • the first cleaning solution includes a first cleaning agent with a mass percentage of 2%, the first cleaning agent is an alkaline cleaning agent with a pH of 13, and the cleaning temperature of the first cleaning solution is 65°C.
  • the second cleaning solution includes a second cleaning agent with a mass percentage of 3%, the second cleaning agent is an alkaline cleaning agent with a pH of 13, and the cleaning temperature of the second cleaning solution is 65°C.
  • the temperature of pure water washing is 70°C.
  • the temperature of slow drawing dehydration is 70°C.
  • the speed of slow pulling dehydration is 13 Hz.
  • the drying temperature is 80°C.
  • step (3) Perform two strengthening treatments on the transparent substrate processed in step (2) to obtain a strengthened transparent substrate.
  • Each strengthening treatment the transparent substrate is placed at 300°C for 12 minutes so that the temperature of the transparent substrate is 300°C; the preheated transparent substrate is immersed in molten salt at 380°C for 40 minutes.
  • the molten salt includes sodium nitrate with a mass percentage of 6% and potassium nitrate with a mass percentage of 94%.
  • the third ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 100:5.
  • the ink material is water-soluble ink.
  • the curing temperature is 180°C, and the curing time is 20 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75°.
  • the angle of the scraper is 70°.
  • the screen spacing is 3mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 22N.
  • the viscosity of the third ink is 5000 mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par. Add 2 mL of boiling oil and water to the third ink every 1 hour.
  • Ultrasonic cleaning is performed on the transparent substrate on which the third ink part is formed.
  • the transparent substrate on which the third ink portion is formed is sequentially immersed in a first cleaning tank containing an alkaline cleaning detergent with a pH of 13, a second cleaning tank containing an alkaline cleaning detergent with a pH of 13, and a pure water tank.
  • the cleaned transparent substrate is sequentially dried in a slow drawing dehydration tank and a drying tank.
  • the temperature of the first cleaning tank and the second cleaning tank is 50°C.
  • the temperature of the pure water tank is 50°C.
  • the cleaning time in each tank is 60s.
  • the temperature of slow drawing dehydration is 50°C.
  • the speed of slow pulling dehydration is 12 Hz.
  • the drying temperature is 90°C.
  • the fourth ink includes ink material and boiling water.
  • the mass ratio of ink material to boiling water is 100:5.
  • the ink material is water-soluble ink.
  • the curing temperature is 180°C, and the curing time is 20 minutes.
  • the oil change frequency is every 4h.
  • the speed of the ink-returning knife is less than or equal to 300mm/s.
  • the speed of the scraper is less than or equal to 300mm/s.
  • the length of the squeegee is 1cm-2cm longer than the length of the silk screen pattern.
  • the hardness of the scraper is 75°.
  • the angle of the scraper is 70°.
  • the screen spacing is 3mm, the mesh in the screen is 165T mesh (420 mesh), and the screen tension is 22N.
  • the viscosity of the fourth ink is 5000 mpa.s.
  • the screen life is less than or equal to 12h.
  • the air pressure of the equipment is 0.6Par ⁇ 1Par. Add 2mL of boiling water to the fourth ink every 1h.
  • the first silicon dioxide layer of 10nm, the first niobium pentoxide layer of 70nm, the second silicon dioxide layer of 90nm, and the single crystal silicon layer of 85nm are sequentially stacked on the decorative surface by electroplating. 44nm third silicon dioxide layer, 52nm second niobium pentoxide layer, 10nm fourth silicon dioxide layer.
  • the temperature of the coating is 65°C. After the coating treatment, it is soaked in pure water at 65°C for 5 minutes to remove the second ink layer to obtain a reflective layer.
  • a film layer unit is formed on the decorative surface, and the film layer unit covers the decorative surface and the reflective layer to obtain a shell assembly.
  • Table 1 shows the gloss and surface roughness of the rough areas in the housing components of Examples 1-11, the brightness and impact resistance of the housing components of Examples 1-12, and the housing components of Examples 1-12 The adhesion of the reflective layer.
  • the gloss meter is used to measure the gloss; the Olympus laser interferometer is used to measure the surface roughness; the color difference meter is used to measure the brightness.
  • the color difference meter is used to measure the shell component on the side of the transparent substrate away from the decorative surface.
  • Brightness that is, the color difference meter was used to measure the brightness of the housing components on the back of the transparent substrate in Examples 1-6 and 8-12, and the color difference meter was used in Example 7 to measure the housing components on the side of the film film away from the transparent substrate.
  • the brightness of the place; the BYK perspective haze meter is used to determine the haze; the thousand and hundred grid test is used to determine the adhesion; the falling ball test is used to determine the impact resistance. In the falling ball test, it is determined that the ball hits the side of the transparent substrate away from the decorative surface (that is, The back side of the transparent substrate) to the height when the transparent substrate is broken. The higher the height, the better the impact resistance.
  • the glossiness of the rough area of the shell assembly of Examples 1-11 is greater than 20, the surface roughness is 0.1 ⁇ m-0.3 ⁇ m, and the haze is 20%-60%, indicating that the shell of the above embodiment
  • the body component has a frosting effect in the rough area and can prevent glare; the adhesion of the reflective layer is not less than 3B, the impact resistance of the shell component is 17cm-30cm, and the brightness is greater than 50.
  • the reflective layer of the shell component of the above embodiment is explained It has good adhesion, and the shell assembly has good impact resistance, is not easy to fall off and is not easy to be broken, and makes the shell assembly have the effect of shining and gloss.
  • the housing assembly of the above embodiment has the effects of shining, gloss and anti-glare at the superposition of the rough area and the reflective layer, the appearance effect is better, the reflective layer has better adhesion, and the housing assembly It has good impact resistance, so that the shell assembly has excellent mechanical properties.
  • the above-mentioned housing assembly can be used to prepare electronic equipment with shiny and frosted LOGO (logo).

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Abstract

一种壳体组件(100)，包括透明基底(110)和反射层(120)，透明基底(110)具有装饰表面(111)，装饰表面(111)上设有粗糙区域(113)，反射层(120)设置在装饰表面(111)上，且反射层(120)覆盖至少部分粗糙区域(113)。

Description

壳体组件及其制备方法和电子设备 技术领域
本发明涉及电子设备领域，特别是涉及一种壳体组件及其制备方法和电子设备。
背景技术
随着科技的不断发展，智能手机、平板电脑等电子设备已经广泛应用于工作和生活的各个方面。近年来，电子设备行业竞争的日益加剧，电子设备的外观效果也越来越受到关注。一些研究在外壳上设置镀膜层，以使电子设备的外壳具有发亮的效果，以提升电子设备的外观效果。然而，此种设置的电子设备在镀膜层处容易引起眩光。
发明内容
基于此，有必要提供一种壳体组件及其制备方法和电子设备。
一种壳体组件，包括：
透明基底，具有装饰表面，所述装饰表面上设有粗糙区域；及
反射层，设置在所述装饰表面上，并覆盖至少部分所述粗糙区域。
一种壳体组件的制备方法，包括如下步骤：
提供透明基底，所述透明基底具有装饰表面；
在所述装饰表面上形成粗糙区域；及
在所述装饰表面上形成反射层，且所述反射层覆盖至少部分所述粗糙区域，得到壳体组件。
一种电子设备，包括：
上述壳体组件；
显示组件，与所述壳体组件连接，所述显示组件和所述壳体组件之间限定出安装空间；及
电路板，设置在所述安装空间内且与所述显示组件电连接。
一种壳体组件，包括：
透明基底，包括相对设置的装饰表面和背面，所述装饰表面具有粗糙区域，所述粗糙区域的雾度为20％-40％；及
反射层，设置于所述装饰表面所在侧并覆盖至少部分所述粗糙区域。
一种电子设备，包括：
以上所述的壳体组件；
显示组件，设于所述壳体组件的一侧；及
电路板，设于所述显示组件的背侧且与所述显示组件电连接，所述壳体组件覆盖所述电路板。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施方式的电子设备的结构示意图；
图2为图1所示的电子设备的壳体组件的结构示意图；
图3为图2所示的壳体组件沿A-A＇的截面示意图；
图4为图3所示的壳体组件中反射层的截面示意图；
图5为图3所示的壳体组件中膜层单元的截面示意图；
图6为图5所示的膜层单元中反射亚层的截面示意图；
图7为另一实施方式的透明基底和反射层的截面示意图；
图8为另一实施方式的透明基底和反射层的截面示意图；
图9为另一实施方式的透明基底和反射层的截面示意图；
图10为另一实施方式的透明基底和反射层的截面示意图；
图11为另一实施方式的透明基底和反射层的截面示意图；
图12为图3所示的壳体组件中另一实施例的反射层的截面示意图；
图13为图1所示的壳体组件的制备方法中在装饰表面的部分区域形成第一油墨层后的截面示意图；
图14为图13所示的壳体组件的制备方法中在装饰表面的部分区域丝网印刷第一油墨后的截面示意图；
图15为图14所示的壳体组件的制备方法中在装饰表面的未形成有第一油墨的至少部分区域形成保护膜后的截面示意图；
图16为图15所示的壳体组件的制备方法中在透明基底的未形成有保护膜的区域喷涂第二油墨后的截面示意图；
图17为图13所示的壳体组件的制备方法中进行蒙砂处理形成粗糙区域后的截面示意图；
图18为图17所示的壳体组件的制备方法中去除第一油墨层后的截面示意图；
图19为图18所示的壳体组件的制备方法中在装饰表面上形成第二油墨层后的截面示意图；
图20为图19所示的壳体组件的制备方法中在装饰表面上丝网印刷第三油墨后的截面示意图；
图21为图20所示的壳体组件的制备方法中在装饰表面上形成遮蔽膜后的截面示意图；
图22为图21所示的壳体组件的制备方法中在透明基底未形成有遮蔽膜的区域喷涂第四油墨后的截面示意图；
图23为图17所示的壳体组件的制备方法中对装饰表面进行镀膜处理，然后去除第二油墨层，形成反射层后的截面示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
如图1所示，一实施方式的电子设备包括壳体组件100和显示组件20。显示组件20与壳体组件100连接。电子设备正常运行时，显示组件20能够显示图案。显示组件20与壳体组件100之间限定出安装空间(图未示)。电子设备还包括电路板(图未示)。电路板控制电路能够控制电子设备正常运行。电路板设置在安装空间内，且与显示组件20电连接。进一步地，电子设备为各种能够从外部获取数据并对该数据进行处理的设备，或者，各种内置有电池，并能够从外部获取电流对该电池进行充电的设备。电子设备例如可以为手机、平板电脑、计算设备或信息显示设备等。在图示实施例中，电子设备为手机。壳体组件100为手机的后盖。显示组件20与壳体组件100固接。
请一并参阅图2-3，壳体组件100包括透明基底110和反射层120。透明基底110具有装饰表面111。装饰表面111上设有粗糙区域113。反射层120设置在装饰表面111上。且反射层120覆盖至少部分粗糙区域113。
上述壳体组件100包括透明基底110和反射层120，透明基底110具有装饰表面111，装饰表面111上设有粗糙区域113，使得壳体组件100在粗糙区域113处具有磨砂的效果，能够防眩光，反射层120设置在装饰表面111上，且反射层120覆盖至少部分粗糙区域113，使得壳体组件100在反射层120处具有较亮度，呈现发亮的效果。上述壳体组件100具有亮度且能够防眩光，能够用于制备具有较好外观效果的电子设备。
在其中一个实施例中，透明基底110为平面玻璃或曲面玻璃。进一步地，透明基底110还具有与装 饰表面111相对的背面114。具体地，壳体组件100盖设于显示组件20上。装饰表面111与显示组件20相对。需要说明的是，透明基底110为曲面玻璃时，装饰表面111为透明基底110的凹面。
粗糙区域113使得壳体组件100呈现哑光和磨砂的效果，具有防眩光的作用。在其中一个实施例中，粗糙区域113位于装饰表面111内。进一步地，粗糙区域113的轮廓形状为图形化的形状。其中，图形化的形状例如可以为几何形状、人形、动物的形状、徽章的形状或者字母形状或者数字形状等，可以根据实际需要进行设置。
进一步地，粗糙区域113通过如下步骤形成：通过对透明基底110的装饰表面111进行蒙砂处理，形成粗糙区域113。更进一步地，粗糙区域113通过如下步骤形成：通过对透明基底110的装饰表面111依次进行蒙砂处理和抛光处理，形成粗糙区域113。此种设置能够提高粗糙区域113的光泽度。
在其中一个实施例中，粗糙区域113的表面粗糙度为0.1μm-0.2μm。此种设置，使得粗糙区域113具有磨砂的效果。
在其中一个实施例中，粗糙区域113的雾度为20％-40％。此种设置，能够降低粗糙区域113的透光率，使得粗糙区域113具有磨砂和防炫目的效果。
在其中一个实施例中，透明基底110的厚度为0.5mm-0.7mm。
反射层120使得壳体组件100在反射层120处具有较高的亮度，呈现发亮的效果，并且反射层120与粗糙区域113的叠加，使得壳体组件100上呈现具有发亮、磨砂的效果，能够防眩光。
请一并参阅图4，在其中一个实施例中，反射层120包括依次层叠设置在装饰表面111上的第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127。此种设置的反射层120具有较高的亮度、较强的附着力和耐冲击性能。
进一步地，第一二氧化硅层121的厚度为8nm-12nm。第一五氧化二铌层122的厚度为68nm-72nm。第二二氧化硅层123的厚度为88nm-92nm。单晶硅层124的厚度为83nm-87nm。第三二氧化硅层125的厚度为42nm-46nm。第二五氧化二铌层126的厚度为50nm-54nm。第四二氧化硅层127的厚度为8nm-12nm。
在其中一个实施例中，反射层120完全覆盖粗糙区域113。
在其中一个实施例中，反射层120的轮廓形状与粗糙区域113的轮廓形状一致。在图示实施例中，反射层120与粗糙区域113完全重合。
在其中一个实施例中，壳体组件100还包括膜层单元130。膜层单元130覆盖透明基底110靠近反射层120的一侧，且覆盖反射层120。膜层单元130能够保护反射层120和粗糙区域113，还能够遮蔽电路板靠近壳体组件100一侧、显示组件20靠近壳体组件100一侧。
请一并参阅图5，进一步地，膜层单元130包括依次层叠设置的基材131、颜色层132、外观层133和底油层134。基材131朝向反射层120。
基材131包括层叠设置的胶粘层131a和基材本体131b。胶粘层131a朝向反射层120。胶粘层131a覆盖透明基底110靠近反射层120的一侧，且覆盖反射层120。进一步地，胶粘层131a为OCA胶层。基材本体131b为PET(Polyethylene terephthalate，聚对苯二甲酸类)层。上述基材131具有较好的机械性能，能够满足壳体组件100对机械强度以及拉伸性能的要求。基材131的厚度等尺寸不受特别限制，可以根据实际情况进行选择。例如，胶粘层131a的厚度为20μm-30μm，基材本体131b的厚度为48μm-52μm。
颜色层132能够使壳体组件100具有颜色。颜色层132层叠在基材本体131b远离胶粘层131a的一侧上。颜色层132为胶版印刷层或者色带层。其中，胶版印刷层是通过胶版印刷技术形成。色带层是通过色带打印技术形成。需要说明的是，颜色层132的颜色不限，可以根据实际需要进行设置。
外观层133包括层叠设置的纹理亚层1332和反射亚层1334。纹理亚层1332朝向颜色层132。
纹理亚层1332使得壳体组件100呈现纹理效果。纹理亚层1332为具有一定纹理结构的UV转印层。进一步地，纹理亚层1332为无色或带有一定颜色的UV固化胶水固化形成。纹理亚层1332的厚度为5μm-20μm。
反射亚层1334为具有一定反射率的金属层或金属氧化物膜层。反射亚层1334能够使壳体组件100具有金属光泽质感的外观效果。进一步地，反射亚层1334为单层结构或多层结构。上述单层结构或多层结构可以是由金属或金属氧化物形成的。金属选自In(铟)及Sn(锡)中的至少一种。金属氧化物选自TiO 2(二氧化钛)、NbO 2(二氧化铌)、Nb 2O 3(三氧化二铌)、Nb 2O 2(二氧化二铌)、Nb 2O 5(五氧化二铌)、SiO 2(二氧化硅)及ZrO 2(二氧化钛)中的至少一种。上述反射亚层1334具有较为合适的反射率，结合纹理亚层1332和颜色层132，使得壳体组件100具有较为鲜亮的颜色效果。
请一并参阅图6，在其中一个实施例中，反射亚层1334包括依次层叠设置的第一氧化铝层1334a、铟层1334b、第二氧化铝层1334c和二氧化钛层1334d。第一氧化铝层1334a朝向纹理亚层1332。此种设置，使得反射亚层1334与纹理亚层1332结合的更加稳固，且使得反射亚层1334具有较好的增亮效果。
进一步地，第一氧化铝层1334a的厚度为30nm-40nm。铟层1334b的厚度为10nm-30nm。第二氧化铝层1334c的厚度为30nm-40nm。二氧化钛层1334d的厚度为3nm-7nm。需要说明的是，铟层1334b的厚度越厚，反射亚层1334的反射效果越好，纹理亚层1332的亮度越高。但是铟层1334b的厚度越厚，越容易被氧化。上述设置的铟层1334b能够保证反射亚层1334的增亮效果，也能够降低铟层1334b的氧化。
进一步地，外观层133还包括底涂层1336。底涂层1336设置在纹理亚层1332靠近颜色层132的一侧。底涂层1336能够增加颜色层132和外观层133的结合强度，避免颜色层132和外观层133发生分层等不良问题，保证壳体组件100的使用寿命。更进一步地，底涂层1336为PET层。底涂层1336的厚度为21μm-25μm。
底油层134设置在反射亚层1334的表面上。底油层134能够避免进入壳体组件100的光线从底油层134穿过，且能够遮蔽电路板靠近壳体组件100一侧、显示组件20靠近壳体组件100一侧。进一步地，底油层134通过丝网印刷或者喷涂盖底油墨而形成。盖底油墨为黑色或者白色等具有遮盖力的颜色的油墨。更进一步地，通过往复丝网印刷或者喷涂多层盖底油墨的方法形成底油层134，以防止漏光。
在其中一个实施例中，底油层134的厚度为5μm-24μm。此种设置，能够有效地避免光线穿过底油层134，使得进入底油层134内的光线能够被反射亚层1334反射或者被底油层134吸收。
上述电子设备的壳体组件100包括透明基底110和反射层120，透明基底110具有装饰表面111，装饰表面111上设有粗糙区域113，使得壳体组件100在粗糙区域113处具有磨砂的效果，能够防眩光，反射层120设置在装饰表面111上，且反射层120覆盖至少部分粗糙区域113，使得壳体组件100在反射层120处具有较高的亮度，呈现发亮的效果。上述壳体组件100具有较高亮度且能够防眩光，能够用于制备具有较好外观效果的电子设备。
进一步地，上述电子设备的壳体组件100中，粗糙区域113和反射层120的叠加，使得壳体组件100上呈现具有发亮、磨砂的效果，以实现壳体组件100上光哑同体的效果。
可以理解，电子设备还可以包括其他常规电子设备所必备的结构或部件，以手机为例，除了上述壳体组件，手机还包括玻璃盖板、音频处理模组、照相模组、触摸屏等常规手机所必备的结构或部件。
可以理解，外观层133的结构不限于上述指出的结构，外观层133可以包括纹理亚层1332及反射亚层1334中的一层。当外观层133包括纹理亚层1332时，外观层133使得壳体组件100具有纹理效果。当外观层133包括反射亚层1334时，外观层133使得壳体组件100具有发亮或者光泽度的效果。
可以理解，壳体组件100的装饰表面111不限于与显示组件20相对，也可以使壳体组件110的背面114与显示组件20相对。此时，若透明基底110为曲面玻璃时，装饰表面111为透明基底110的凸面。膜层反应130覆盖背面114。进一步地，壳体组件100还可以包括覆盖层。覆盖层覆盖反射层120和粗糙区域113。通过设置覆盖层，以保护反射层120和粗糙区域113，避免反射层120和粗糙区域113被划伤。可以理解，覆盖层可以省略。
可以理解，反射层120与粗糙区域113不限于为完全重合，请一并参阅图7，在其他实施例中，装饰表面上还具有非粗糙区域215。非粗糙区域215围绕粗糙区域213设置。反射层220在装饰表面上完全覆盖粗糙区域213，且至少部分覆盖非粗糙区域215。在图示实施例中，反射层220完全覆盖粗糙区 域213，且部分覆盖非粗糙区域215。此时，壳体组件在反射层220和粗糙区域213的叠加处具有磨砂效果，也具有较高的亮度，在反射层220未与粗糙区域213叠加处为发亮的效果，实现光哑同体的效果。进一步地，可以理解，反射层220不限于部分覆盖非粗糙区域215。请一并参阅图8，在其他实施例中，反射层320完全覆盖非粗糙区域315。此时，壳体组件在整个装饰表面上呈发亮的效果。
可以理解，反射层120不限于完全覆盖粗糙区域113，请一并参阅图9，在其他实施例中，反射层420也可以位于粗糙区域413内。此时，壳体组件在反射层420和粗糙区域413的叠加处具有磨砂效果，也具有较高的亮度，在粗糙区域413未与反射层420叠加处为磨砂效果，使得壳体组件在不同区域具有不同的外观效果，外观表现力较强。
可以理解，粗糙区域113不限于位于装饰表面111内，请一并参阅图10，在其他实施例中，粗糙区域513也可以完全覆盖装饰表面。
可以理解，粗糙区域113和反射层120不限于上述设置，请一并参阅图11，在其他实施例中，粗糙区域613完全覆盖装饰表面，反射层120完全覆盖粗糙区域613。
可以理解，膜层单元130可以省略。
可以理解，反射层120的轮廓形状与粗糙区域113的轮廓形状不限于上述设置，也可以使反射层120的轮廓形状与粗糙区域113的轮廓形状不同。
可以理解，反射层120不限于上述结构，也可以为其他结构，例如：请一并参阅图12，在另一实施例中，反射层120＇包括依次层叠设置在装饰表面111上的硅层121＇、第一钛层122＇、铜层123＇及第二钛层124＇。此种设置，使得反射层120＇具有较高的亮度和较强的耐冲击性。进一步地，硅层121＇的厚度为3nm-7nm。第一钛层122＇的厚度为6nm-10nm。铜层123＇的厚度为18nm-22nm。第二钛层124＇的厚度为48nm-52nm。
请一并参阅图1-6，此外，还提供一实施方式的壳体组件100的制备方法，包括如下步骤S110-S130：
S110、提供透明基底110，透明基底110具有装饰表面111。
需要说明的是，透明基底110的结构请参见上文，此处不再赘述。
S120、在装饰表面111上形成粗糙区域113。
在其中一个实施例中，在装饰表面111上形成粗糙区域113的步骤包括：对装饰表面111进行蒙砂处理以形成粗糙区域113。
进一步地，对装饰表面111进行蒙砂处理以形成粗糙区域113的步骤包括S121-S122：
请一并参阅图13，S121、在装饰表面111的部分区域形成第一油墨层140。
在其中一个实施例中，S121的步骤包括S1211-S1214：
S1211、在装饰表面111的部分区域丝网印刷第一油墨。
在其中一个实施例中，第一油墨的厚度为5μm-16μm。
在其中一个实施例中，在装饰表面111预设待装饰区。预设待装饰区用于形成粗糙区域113。S1211的步骤包括：在装饰表面111内丝网印刷第一油墨，第一油墨围绕待装饰区设置。进一步地，第一油墨与待装饰区间隔。由于油墨在固化的过程中会出现溢出或者外扩的问题，通过使第一油墨与待装饰区间隔，以避免第一油墨的溢出或者外扩影响粗糙区域113的尺寸，以保证粗糙区域113的尺寸。进一步地，第一油墨与待装饰区间隔的距离为0.15mm-0.2mm。
请一并参阅图14，在图示实施例中，在装饰表面111的部分区域丝网印刷第一油墨的步骤包括：在装饰表面111内丝网印刷第一油墨，固化，形成具有第一通孔141a的第一油墨部141，且第一通孔141a贯穿第一油墨部141。第一通孔141a与待装饰区相对。
进一步地，在装饰表面111的部分区域丝网印刷第一油墨的步骤包括：在装饰表面111的部分区域上多次重叠丝网印刷第一油墨。此种设置，能够防止蒙砂处理过程中蒙砂处理液的渗透。更进一步地，每次印刷的厚度为5μm-8μm。第一油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为98:3-102:7。
具体地，印刷的次数为两次。更具体地，在装饰表面111的部分区域上第一次印刷第一油墨，固化，得到固化部，在固化部上第二次印刷第一油墨，固化，得到第一油墨部141。第一次印刷过程中，固化 温度为160℃±10℃，固化时间为20min±1min。换油频率为每4h换油一次。第二次印刷过程中，固化温度为160℃±20℃，固化时间为3min±0.5min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°±5°。刮刀的角度为70°±5°。网版间距为1.5mm-4.5mm。第一油墨的粘度为6000mpa.s±1000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。
需要说明的是，在印刷的过程中，还需要添加开油水以调节第一油墨的粘度。进一步地，每隔1h-1.5h向第一油墨中加入1mL-3mL的开油水。
在其中一个实施例中，第一油墨部141形成后，还包括检查第一油墨部141的步骤。具体地，检查第一油墨部141的外观是否有无牙、缺、砂眼、色差、黑白点等问题。
请一并参阅图15，S1212、在装饰表面111的未形成有第一油墨的至少部分区域形成保护膜150。
在其中一个实施例中，保护膜150为PET(Polyethylene terephthalate，聚对苯二甲酸类塑料)膜。
在其中一个实施例中，S1212包括：在装饰表面111的未形成有第一油墨的至少部分区域粘贴保护膜150。进一步地，S1212包括：在装饰表面111的未形成有第一油墨部141的区域粘贴保护膜150，且保护膜150至少部分覆盖第一油墨部141，以遮蔽第一通孔141a。此种设置，使得能够较好地遮蔽第一通孔141a，以避免后续喷涂第二油墨的过程中的油墨材料渗入第一通孔141a而影响对装饰表面111在第一通孔141a处的蒙砂效果。
在图示实施例中，在装饰表面111的未形成有第一油墨部141的区域粘贴保护膜150，且保护膜150部分覆盖第一油墨部141，以遮蔽第一通孔141a。此种设置，使得后续喷涂的第二油墨部分覆盖第一油墨部141，以保护装饰表面111不需要蒙砂处理的区域。需要说明的是，保护膜150不限于上述设置方式，保护膜150可以收容于第一通孔141a中且直接粘贴在装饰表面111上。
在其中一个实施例中，形成保护膜150后，还包括对保护膜150进行检查的步骤。具体地，检查保护膜150有无贴偏，是否有异物，保护膜150边缘不能有毛刺，表面平整光滑，不能有凹痕、脏污、褶皱，杂质等不良，膜内不可有气泡。将形成保护膜150后静置24h后，剥离保护膜150，检测剥离保护膜150后玻璃表面无脏污、白点、水印、残胶等问题。
请一并参阅图16，S1213、在透明基底110的未形成有保护膜150的区域喷涂第二油墨。
此种设置，使得透明基底110不需要蒙砂处理的区域均能够得到保护，尤其是透明基底110为曲面玻璃时，能够使透明基底110的弯折区域也能够喷涂上第二油墨而得到保护。
进一步地，第二油墨覆盖透明基底110的未形成有保护膜150的区域，且至少部分覆盖第一油墨部141。具体地，S1213包括：在透明基底110的未形成有保护膜150的区域喷涂第二油墨，固化，形成第二油墨部143。第二油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为98:3-102:7。固化的过程包括：在160℃±20℃下处理5min±0.5min，再置于150℃±10℃下处理20min±1min。
进一步地，喷涂第二油墨之后，还包括对形成的第二油墨部143进行检查的步骤。具体地，检查第二油墨部143的外观是否有无牙、缺、砂眼、色差、黑白点等问题。
请再次一并参阅图13，S1214、去除保护膜150，得到第一油墨层140。
在其中一个实施例中，去除保护膜150，得到第一油墨层140的步骤中，第一油墨部141和第二油墨部143形成第一油墨层140。
请一并参阅图17-18，S122、对装饰表面111进行蒙砂处理，然后去除第一油墨层140，以使装饰表面111的未形成有第一油墨层140的区域形成粗糙区域113。
在其中一个实施例中，对装饰表面111进行蒙砂处理的步骤包括：采用蒙砂处理液对装饰表面111进行蒙砂处理。进一步地，蒙砂处理液包括氟化铵、硫酸铵、有机酸、氟化氢铵及硫酸钙中的至少一种。其中，有机酸选自浓盐酸及浓硫酸中的至少一种。蒙砂处理的温度为30℃±2℃。在一个具体示例中，蒙砂处理液包括蒙砂液和水。蒙砂液和水的质量比为6.5:25。蒙砂液为佛山犀马精细化工有限公司的蒙砂液或深圳精而美科技有限公司的蒙砂液。需要说明的是，蒙砂液不限于上述指出的蒙砂液，也可以其他市售的蒙砂液。
具体地，将形成有第一油墨层140的透明基底110置于传送带上，采用蒙砂处理液喷淋装饰表面111，以对装饰表面111进行蒙砂处理。传送带运行的速度为1.4m/min-1.6m/min，蒙砂处理液的温度为30℃±2℃。进一步地，在采用蒙砂处理液喷淋装饰表面111的步骤之前，还包括采用纯水喷淋装饰表面111的步骤。此种设置能够清除装饰表面111上的脏污，以保证蒙砂处理的效果。采用纯水喷淋装饰表面111时，传送带运行的速度为1m/min-3m/min，水刀的速度2.3m/min。
进一步地，采用蒙砂处理液对装饰表面111进行蒙砂处理的步骤之前，还包括对蒙砂处理液进行熟化处理的步骤。具体地，将蒙砂处理液置于55℃±3℃下静置48h±5h，得到熟化后的蒙砂处理液。
需要说明的是，对装饰表面111进行蒙砂处理的步骤之前，还包括清除装饰表面111处的油污等脏污。需要说明的是，蒙砂处理后，还包括检查形成有装饰表面111上是否有水印、脏污、蒙砂不均、划伤等不良问题。
在其中一个实施例中，对装饰表面111进行蒙砂处理的步骤之后，去除第一油墨层140的步骤之前，还包括如下步骤：对蒙砂处理后的装饰表面111进行化学抛光处理。此种设置能够提高粗糙区域113的光泽度。进一步地，采用质量百分含量为3％-5％的HF的水溶液在30℃±2℃下对蒙砂处理后的装饰表面111进行抛光处理。更具体地，将蒙砂处理后的透明基底110置于传送带上，采用30℃±2℃、质量百分含量为3％-5％的HF的水溶液喷淋装饰表面111，以对装饰表面111进行化学抛光处理。传动带运行的速度为2.5m/min-3.0m/min。
在其中一个实施例中，去除第一油墨层140的步骤包括：采用退镀剂对蒙砂处理后的透明基底110进行退镀处理，以去除第一油墨层140。进一步地，退镀剂为质量百分含量为1％-5％的碱液。碱液为氢氧化钠的水溶液或者氢氧化钾的水溶液。退镀处理的温度为65℃±5℃。
进一步地，将蒙砂处理后的透明基底110依次在温度为65℃±5℃的第一退镀剂、温度为65℃±5℃的第二退镀剂及温度为65℃±5℃的第三退镀剂中浸泡，再用温度为55℃±5℃的纯水清洗干净。其中，第一退镀剂为质量百分含量为5％的碱液。第二退镀剂为质量百分含量为1％-3％的碱液。第三退镀剂为质量百分含量为1％-3％的碱液。
更进一步地，将蒙砂处理后的透明基底110依次浸泡在装有温度为65℃±5℃的第一退镀剂的退镀槽、装有温度为65℃±5℃的第二退镀剂的退镀槽及装有温度为65℃±5℃的第三退镀剂的退镀槽中浸泡，再浸泡在装有温度为55℃±5℃的纯水的水槽中。每个槽的浸泡时间为60s±10s。其中，用温度为55℃±5℃的纯水清洗退镀剂处理后的透明基底110，清洗两次，清洗的方式为浸泡。需要说明的是，清洗的次数不限于为两次，也可以为一次，还可以为三次，可以根据需要进行设置。
进一步地，去除第一油墨层140的步骤之后，还包括对去除后第一油墨层140后的透明基底110进行检查的步骤。具体地，检查去除第一油墨层140后的透明基底110上是否有油墨残留、爆裂、深划伤、崩边等问题。
在其中一个实施例中，在装饰表面111上形成粗糙区域113的步骤之后，还包括如下步骤：对形成有粗糙区域113的透明基底110进行强化处理。通过强化处理能够提高透明基底110的机械强度。进一步地，对形成有粗糙区域113的透明基底110进行多次强化处理。
具体地，每次强化处理：对透明基底110进行预热，以使透明基底110的温度为300℃±20℃；将预热后的透明基底110浸入380℃±2℃的熔盐中处理40min±3min，得到强化后的透明基底110。其中，对透明基底110进行预热，以使透明基底110的温度为300℃±20℃的步骤包括：将透明基底110置于300℃±20℃下保持12min。熔盐包括质量百分含量为6％的硝酸钠和质量百分含量为94％的硝酸钾。且透明基底110在熔盐中处理的过程中Na+浓度为16000ppm-19000ppm。
更具体地，强化处理的次数是两次。第一次强化后的透明基底110的CS(表面压应力)为465Mpa-605Mpa，CSK(拐角应力)为100Mpa-140Mpa，DOL(离子交换深度)为7.7μm-9.2μm，DOC(内应力深度)为100μm-115μm，CT(中心张应力)为44μm-93μm。第二次强化后的透明基底110的CS为710Mpa-880Mpa，CSK为65Mpa-120Mpa，DOL为8.2μm-10μm，DOC为100μm-115μm，CT为44μm-95μm。
需要说明的是，对透明基底110进行强化处理后，还包括降温的步骤。具体地，采用风机吹冷风进 行降温。
需要说明的是，形成粗糙区域113后，还包括检查形成有粗糙区域113的透明基底110上是否有水印、脏污、蒙砂不均、划伤等不良问题。
在其中一个实施例中，对形成有粗糙区域113的透明基底110进行强化处理的步骤之前，还包括如下步骤：清洗形成有粗糙区域113的透明基底110。进一步地，清洗的方式为超声清洗。
进一步地，采用第一清洗液、第二清洗液、纯水依次对透明基底110进行清洗，再对清洗后的透明基底110依次进行慢拉脱水和烘干。第一清洗液中包括质量百分含量为1.5％-2.5％的第一清洗剂。第一清洗剂为pH为12-14的碱性清洗剂。第一清洗液清洗的温度为65℃±10℃。第二清洗液中包括质量百分含量为1.5％-2.5％的第二清洗剂。第二清洗剂为pH为12-14的碱性清洗剂。第二清洗液清洗的温度为65℃±10℃。纯水清洗的温度为70℃±10℃。纯水清洗的次数可以为一个，也可以为多次，根据需要进行设置。纯水的纯度大于10MΩ·cm。清洗的方式为浸泡或喷淋。慢拉脱水的温度为70℃±10℃。慢拉脱水的速度为10Hz-15Hz。烘干的温度为80±20℃。
更进一步地，将透明基底110依次置于装有第一清洗液的清洗槽、装有第二清洗液的清洗槽、装有纯水的清洗槽依次对透明基底110进行清洗，将清洗后的透明基底110依次置于慢拉脱水槽和烘干槽中进行干燥。每个槽的处理时间为60s±10s。
需要说明的是，对清洗后的透明基底110依次进行慢拉脱水和烘干的操作可以省略，此时，可以使透明基底110自然风干。需要说明的是，透明基底110干燥后，包括检查干燥后的透明基底110是否有水印和杂质的步骤。
在其中一个实施例中，在S110之前，还包括如下步骤：对透明基底110依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理。其中，CNC加工是指计算机数字化控制精密机械加工。通过第一次CNC加工，以对透明基底110的边缘进行打磨。通过热弯处理使透明基底110的边缘具有弧度，以形成3D玻璃或者曲面玻璃。通过第二次CNC加工以对透明基底110进行打孔。通过3D抛光处理以将透明基底110抛亮，尤其是抛亮透明基底110的弯折处。需要说明的是，若透明基底110为3D玻璃时，对透明基底110依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理的步骤可以省略。
请再次一并参阅图3-4，S130、在装饰表面111上形成反射层120，且反射层120至少部分覆盖粗糙区域113，得到壳体组件100。
在其中一个实施例中，在装饰表面111上形成反射层120的方式为电镀、沉积或者溅射。
在其中一个实施例中，在装饰表面111上形成反射层120的步骤包括：在装饰表面111上形成依次层叠的第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127，得到反射层120。
进一步地，第一二氧化硅层121的厚度为8nm-12nm。第一五氧化二铌层122的厚度为68nm-72nm。第二二氧化硅层123的厚度为88nm-92nm。单晶硅层124的厚度为83nm-87nm。第三二氧化硅层125的厚度为42nm-46nm。第二五氧化二铌层126的厚度为50nm-54nm。第四二氧化硅层127的厚度为8nm-12nm。具体地，形成上述各膜层的方式为电镀。
在其中一个实施例中，在装饰表面111上形成反射层120的步骤包括S131-S132：
请一并参阅图19，S131、在装饰表面111上形成第二油墨层160，并使粗糙区域113至少部分露出。
在其中一个实施例中，S131包括S1311-S1314：
S1311、在装饰表面111的未形成有粗糙区域113的至少部分区域丝网印刷第三油墨，并使至少部分粗糙区域113露出。
请一并参阅图20，在其中一个实施例中，在装饰表面111的未形成有粗糙区域113的至少部分区域丝网印刷第三油墨，并使至少部分粗糙区域113露出第三油墨。进一步地，S1311包括：在装饰表面111的未形成有粗糙区域113的至少部分区域丝网印刷第三油墨，第三油墨环绕粗糙区域113设置。进一步地，第三油墨与粗糙区域113间隔。由于油墨在固化的过程中会出现溢出或者外扩的问题，通过使第三油墨与粗糙区域113间隔，以避免第三油墨的溢出或者外扩影响反射层120的尺寸，以保证反射层 120的尺寸，使得粗糙区域113的表面上均能够覆盖上反射层120，以保证反射层120与粗糙区域113精准对位和叠加。进一步地，第三油墨与粗糙区域113间隔的距离为0.15mm-0.2mm。
进一步地，S1311包括：在装饰表面111的未形成有粗糙区域113的至少部分区域丝网印刷第三油墨，固化，形成具有第三通孔161a的第三油墨部161。第三通孔161a与粗糙区域113相对。在一个具体示例中，第三通孔161a的尺寸与粗糙区域113的尺寸相当，以使粗糙区域113正好露出第三通孔161a。
具体地，第三油墨包括油墨材料和开油水。油墨材料与开油水的质量比为98:3-102:7。油墨材料为水溶性油墨。固化温度为180℃±10℃，固化时间为20min±1min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°±5°。刮刀的角度为70°±5°。网版间距为1.5mm-4.5mm，网版中的网纱为165T网纱(420目)，网版张力为22N±2N。油墨材料的粘度为5000mpa.s±1000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。需要说明的是，在印刷的过程中，还需要添加开油水以调节油墨材料的粘度。进一步地，每隔1h-1.5h向第三油墨中加入1mL-3mL的开油水。
请一并参阅图21，S1312、在装饰表面111上形成遮蔽膜170，以遮蔽粗糙区域113的露出部分。
进一步地，S1312包括：在装饰表面111上形成遮蔽膜170，以遮蔽粗糙区域113的露出部分，且使透明基底110的未形成有粗糙区域113和未形成有第三油墨的区域露出。
在其中一个实施例中，遮蔽膜170为PET膜。
在其中一个实施例中，S1312包括：在装饰表面111上粘贴遮蔽膜170。进一步地，在装饰表面111上粘贴遮蔽膜170，且使遮蔽膜170部分覆盖第三油墨部161，以遮蔽第三通孔161a。此种设置，使得能够较好地遮蔽第三通孔161a，以避免后续喷涂第四油墨的过程中的油墨材料渗入第三通孔161a而影响对装饰表面111在第三通孔161a处的镀膜效果。
在图示实施例中，在装饰表面111的未形成有第三油墨部161的区域粘贴遮蔽膜170，且遮蔽膜170部分覆盖第三油墨部161，以遮蔽第三通孔161a。此种设置，使得后续喷涂的第四油墨能够部分覆盖第三油墨部161，以避免第四油墨和第三油墨部161之间形成间隙，进而保护装饰表面111不需要镀膜处理的区域。需要说明的是，遮蔽膜170不限于上述设置方式，遮蔽膜170可以收容于第三通孔161a中且直接粘贴在装饰表面111上。
更进一步地，贴膜机的总气压为0.5MPa-0.6MPa。压膜轮气压为0.2MPa-0.4MPa。贴膜速度为200mm/s-400mm/s。进料速度为80mm/s-100mm/s。出料速度为80mm/s-100mm/s。转移速度为600mm/s-1000mm/s。需要说明的是，贴膜机上的贴膜夹具表面需要粘贴有铁氟龙。铁氟龙如有破损应立即更换。
进一步地，形成遮蔽膜170之后还包括检查形成有遮蔽膜170的透明基底110的表面是否有脏污、异物等问题。
S1313、在透明基底110未形成有遮蔽膜170的区域喷涂第四油墨。
此种设置能够保护透明基底110上无需被镀膜处理的区域，尤其是透明基底110为曲面玻璃，能够使透明基底110的弯折区域也能够喷涂上第四油墨而得到保护。
请一并参阅图22，在其中一个实施例中，S1313包括：在透明基底110未形成有遮蔽膜170的区域喷涂第四油墨，固化，形成第四油墨部163。第四油墨包括油墨材料和开油水。油墨材料为水溶性油墨。油墨材料与开油水的质量比为98:3-102:7。固化温度为180℃±10℃，固化时间为20min±1min。
进一步地，形成第四油墨部163之后，还包括对第四油墨部163进行检查的步骤。具体地，检查第四油墨部163的外观是否有无牙、缺、砂眼、色差、黑白点等问题。
请再次一并参阅图19，S1314、去除遮蔽膜170，得到第二油墨层160。
在其中一个实施例中，去除遮蔽膜170，得到第二油墨层160的步骤中，第三油墨部161和第四油墨部163形成第二油墨层160。
请一并参阅图23，S132、对装饰表面111进行镀膜处理，然后去除第二油墨层160，形成反射层120。
在其中一个实施例中，对装饰表面111进行镀膜处理的方式为电镀、沉积或者溅射。
请再次一并参阅图4，进一步地，对装饰表面111进行镀膜处理的步骤包括：在装饰表面111上形成依次层叠的第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127。
更进一步地，第一二氧化硅层121的厚度为8nm-12nm。第一五氧化二铌层122的厚度为68nm-72nm。第二二氧化硅层123的厚度为88nm-92nm。单晶硅层124的厚度为83nm-87nm。第三二氧化硅层125的厚度为42nm-46nm。第二五氧化二铌层126的厚度为50nm-54nm。第四二氧化硅层127的厚度为8nm-12nm。
具体地，在装饰表面111上形成依次层叠的第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127的步骤中，形成各膜层的方式为电镀。镀膜的温度为60℃±5℃。更具体地，采用镀膜机在装饰表面111上形成依次层叠的第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127。镀膜机中每锅镀制171片透明基底110，镀制的总时间为40min±5min。在一个具体示例中，镀膜机为光驰公司的镀膜机。
在其中一个实施例中，去除第二油墨层160步骤包括：采用退镀剂对镀膜处理后的透明基底110进行退镀处理，以去除第二油墨层160。进一步地，退镀剂为纯水。退镀处理的温度为65℃±5℃。退镀时间为5min±1min。退镀的方式为喷淋或者浸泡。
进一步地，去除第二油墨层160的步骤之后，还包括对去除第二油墨层160的透明基底110进行检查的步骤。具体地，检查去除第二油墨层160后的透明基底110上是否有脏污、折痕、褶皱、划伤、退镀不良等问题。
在其中一个实施例中，去除第二油墨层160的步骤之后，还包括如下步骤：对反射层120进行附着力和耐冲击性能的测试。其中，附着力的检测方式为百格测试。具体地，检测反射层120的附着力的步骤包括：用锋利刀片在反射层120上100个1mm×1mm的小格，100个小格组成正方形的网格，划穿到膜层直至露出透明基底110；用无尘布或者毛刷将表面碎片刷干净，用3M的610胶纸粘贴至网格上并压平，把气泡挤出，静压至少5s，从胶纸的一端以90°角迅速拉起胶纸，强脱1次，观察是否有小格脱落。
其中，耐冲击性能测试的方式为落球测试。具体地，采用落球测试机将32g钢球从10cm高度落至透明基底110远离装饰表面111的一侧上；测试5次，每次将球落下的高度提高5cm，直至透明基底110破碎为止。记录球落下直至透明基底110破碎时的高度，高度越高，耐冲击性能越优异。具体地，透明基底110远离装饰表面111的一侧即为透明基底110的背面114。
在其中一个实施例中，在S1311之后，在S1312之前，还包括如下步骤：对形成有第三油墨部161的透明基底110进行清洗。进一步地，清洗的方式为超声清洗。更进一步地，采用pH为12-14的碱洗清洗剂对形成有第三油墨部161的透明基底110进行超声清洗。清洗的温度为50℃±5℃。
具体地，将形成有第三油墨部161的透明基底110依次浸泡至装有pH为12-14的碱洗清洗剂的第一清洗槽、装有pH为12-14的碱洗清洗剂的第二清洗槽、纯水槽中进行清洗，再将清洗后的透明基底110依次在慢拉脱水槽和烘干槽中进行干燥。每个槽内的清洗时间为60s±10s。第一清洗槽和第二清洗槽的温度为50℃±5℃。第一清洗槽内的碱性清洗剂的体积为3L±1L，第一清洗槽内的碱性清洗剂的体积为2L±1L。纯水槽的温度为50℃±10℃。纯水清洗的次数可以为一个，也可以为多次，根据需要进行设置。纯水的纯度大于10MΩ·cm，每次纯水清洗的时间为60s±10s。慢拉脱水的温度为50℃±10℃。慢拉脱水的速度为10Hz-15Hz。烘干的温度为90℃±10℃。
需要说明的是，对清洗后的透明基底110依次进行慢拉脱水和烘干的操作可以省略，此时，可以使透明基底110自然风干。
请再次一并参阅图3和图5，在其中一个实施例中，在装饰表面111上形成反射层120的步骤之后，还包括如下步骤：在装饰表面111上形成膜层单元130，膜层单元130覆盖反射层120。膜层单元130能够保护反射层120和粗糙区域113，还能够遮蔽电路板靠近壳体组件100一侧、显示组件20靠近壳体组件100一侧。进一步地，膜层单元130覆盖透明基底110靠近反射层120的一侧。
进一步地，在装饰表面111上形成膜层单元130的步骤包括：在装饰表面111上形成依次层叠设置的基材131、颜色层132、外观层133和底油层134。基材131朝向反射层120。
基材131的结构请参见上文，此处不再赘述。
在装饰表面111上形成基材131的步骤包括：将胶粘层131a与透明基底110靠近反射层120的一侧、反射层120贴合。
在其中一个实施例中，在基材131远离装饰表面111的一侧形成颜色层132的步骤包括：通过色带打印技术在基材131远离装饰表面111的一侧形成色带层，得到颜色层132。需要说明的是，形成颜色层132的方式不限于色带打印技术，还可以通过胶版印刷技术在基材131远离装饰表面111的一侧形成胶版印刷层，得到颜色层132。
外观层133的结构请参见上文，此处不再赘述。
在其中一个实施例中，在颜色层132远离基材131的一侧形成功能层133的步骤包括：在颜色层132远离基材131的一侧形成依次层叠的底涂层1336、纹理亚层1332和反射亚层1334，得到功能层133。进一步地，将底涂层1336粘贴在颜色层132远离基材131的一侧上。
在其中一个实施例中，形成纹理亚层1332的方式为UV转印。
在其中一个实施例中，形成反射亚层1334的方式为电镀。需要说明的是，形成反射亚层1334的方式不限于为电镀，也可以为沉积或者溅射。
在其中一个实施例中，外观层133远离颜色层132的一侧形成底油层134的方式为丝网印刷。需要说明的是，形成底油层134的方式不限于为丝网印刷，也可以为喷涂。
上述实施方式的壳体组件100的制备方法中，在透明基底110上形成粗糙区域113使得壳体组件100在粗糙区域113处具有磨砂的效果，能够防眩光，在装饰表面111上形成反射层120，使反射层120覆盖至少部分粗糙区域113，使得壳体组件100具有发亮的效果，以使得到的壳体组件100通过粗糙区域113和反射层120的叠加，使得壳体组件100能够发亮且防眩光。
进一步地，上述实施方式的壳体组件100的制备方法中，通过设置第一油墨层140和第二油墨层160使得蒙砂处理工艺和镀膜处理工艺结合，以使粗糙区域113和反射层120叠加，而使壳体组件100上呈现具有发亮、磨砂的效果，以实现壳体组件100上光哑同体的效果，以增强含有该壳体组件100的电子设备的外观效果。
再者，上述实施方式的壳体组件100的制备方法中，形成的反射层120包括第一二氧化硅层121、第一五氧化二铌层122、第二二氧化硅层123、单晶硅层124、第三二氧化硅层125、第二五氧化二铌层126、第四二氧化硅层127，使得反射层120具有较大的增亮角度和较高的附着力，以使壳体组件100在反射层120上具有发亮的效果，外观效果较好。
综上，上述实施方式的壳体组件100的制备方法中，反射层120的附着力较强，粗糙区域113和反射层120叠加，而使壳体组件100上呈现具有发亮、磨砂的效果，以使得到能够通过该制备方法制备具有发亮、磨砂的LOGO(标志)的电子设备。
可以理解，壳体组件100的装饰表面111不限于与显示组件20相对，也可以使壳体组件110的背面114与显示组件20相对。此时，若透明基底110为曲面玻璃时，装饰表面111为透明基底110的凸面。膜层反应130覆盖背面114。进一步地，壳体组件100还可以包括覆盖层。覆盖层覆盖反射层120和粗糙区域113。通过设置覆盖层，以保护反射层120和粗糙区域113，避免反射层120和粗糙区域113被划伤。此时，上述壳体组件100的制备方法还包括：在装饰表面111上形成覆盖层，覆盖层覆盖反射层120和粗糙区域113。具体地，在透明基底110靠近反射层120的一侧贴附菲林膜，以形成覆盖层130。
可以理解，粗糙区域113不限于位于装饰表面111内，粗糙区域113的边缘可以与装饰表面111的边缘重叠。对应地，反射层120不限于位于装饰表面111内，反射层120的边缘可以与装饰表面111的边缘重叠。
可以理解，第三通孔161a的尺寸不限于与粗糙区域113的尺寸相当，第三通孔161a的尺寸也可以大于粗糙区域113的尺寸，此时，第二油墨层160与粗糙区域113间隔，反射层120完全覆盖粗糙区域113，且覆盖第二油墨层160与粗糙区域113之间的间隔，壳体组件100在反射层120与粗糙区域113 叠加处呈磨砂效果，在第二油墨层160与粗糙区域113之间的间隔与反射层120叠加处呈亮面的效果，使得壳体组件100具有光哑同体的效果；第三通孔161a的尺寸也可以小于粗糙区域113的尺寸，此时，第二油墨层160部分覆盖粗糙区域113，反射层120位于粗糙区域113内，壳体组件100在反射层120与粗糙区域113叠加处呈磨砂效果，在第二油墨层160与粗糙区域113之间的间隔与反射层120叠加处呈亮面的效果，使得壳体组件100具有光哑同体的效果。
可以理解，第一油墨层140不限于形成在装饰表面111上，第一油墨层140也可以覆盖装饰表面111且覆盖背面114。此时直接对形成有第一油墨层140的透明基底110进行蒙砂处理，去除第一油墨层140，得到粗糙区域113。
可以理解，第二油墨层160不限于形成在装饰表面111上，第二油墨层160也可以覆盖装饰表面111且覆盖背面114。此时，直接对形成有第二油墨层160的透明基底110进行镀膜处理，去除第二油墨层160，得到反射层120。
可以理解，在装饰表面111上形成反射层120的方式不限于为电镀，也可以为其他方式，例如沉积。进一步地，沉积的方式为PVD(Physical Vapor Deposition，物理气相沉积)。请再次一并参阅图12，在另一实施例中，在装饰表面上形成反射层120＇的步骤包括：在装饰表面上形成依次层叠的硅层121＇、第一钛层122＇、铜层123＇及第二钛层124＇，得到反射层120。此种设置，使得反射层120具有较高的亮度和较强的耐冲击性。进一步地，硅层121＇的厚度为3nm-7nm。第一钛层122＇的厚度为6nm-10nm。铜层123＇的厚度为18nm-22nm。第二钛层124＇的厚度为48nm-52nm。
上述实施例中采用PVD的方式在粗糙区域远离透明基底的一侧上形成反射层120＇，使得反射层120＇具有较高的亮度和较强的耐冲击性能。
可以理解，在装饰表面111上形成反射层120的步骤不限于包括上述指出的步骤，在其他实施例中，在装饰表面上形成反射层的步骤包括S231-S232：
S231、在装饰表面上形成第二油墨层，第二油墨层围绕粗糙区域设置，且第二油墨层与粗糙区域形成间隙。
此种设置，使得反射层能够完全覆盖粗糙区域，且覆盖第二油墨与粗糙区域之间的间隙，使得壳体组件在反射层和粗糙区域的叠加处为发亮且具有磨砂的效果，壳体组件在反射层未与粗糙区域叠加处具有较高亮度，呈现亮面的效果，使得壳体组件具有光哑同体的效果。
在其中一个实施例中，S231包括S2311-S2314：
S2311、在装饰表面的未形成有粗糙区域的至少部分区域丝网印刷第三油墨，第三油墨围绕粗糙区域设置，且第三油墨与粗糙区域形成间隙。
需要说明的是，S2311的操作与S1311的操作大致相同，不同指出在于，第三油墨围绕粗糙区域设置，且第三油墨与粗糙区域形成间隙。进一步地，第三油墨部围绕粗糙区域设置，且第三油墨部与粗糙区域形成间隙。更进一步地，第三通孔的孔径比第一通孔的孔径大0.3mm-0.4mm。此种设置，使得反射层能够完全覆盖粗糙区域。其他工艺过程和工艺参数请参见上文，此处不再赘述。
S2312、在装饰表面上形成遮蔽膜，以遮蔽粗糙区域和间隙。
进一步地，S2312包括：在装饰表面上形成遮蔽膜，以遮蔽粗糙区域和间隙且使透明基底的未形成有粗糙区域和未形成有第三油墨的区域露出。
需要说明的是，S2312的操作与S1312的操作大致相同，不同指出在于，遮蔽膜遮蔽粗糙区域和间隙。其他工艺过程和工艺参数请参见上文，此处不再赘述。
S3313、在透明基底未形成有遮蔽膜的区域喷涂第四油墨。
需要说明的是，S3313的操作与S1313的操作相同。此处不再赘述。
S2314、去除遮蔽膜，得到第二油墨层。
需要说明的是，S2314的操作与S1314的操作相同。此处不再赘述。
S232、对装饰表面进行镀膜处理，然后去除第二油墨层，形成反射层，且反射层完全覆盖粗糙区域且覆盖间隙。
需要说明的是，S232的操作与S132的操作大致相同，不同指出在于，反射层完全覆盖粗糙区域且 覆盖间隙。其他工艺过程和工艺参数请参见上文，此处不再赘述。
上述实施例形成的反射层完全覆盖粗糙区域，且反射层与粗糙区域间隔，使得壳体组件在反射层和粗糙区域的叠加处为发亮且具有磨砂的效果，壳体组件在反射层未与粗糙区域叠加处具有较高亮度，呈现亮面的效果，使得壳体组件具有光哑同体的效果。
可以理解，第三通孔的孔径不限于比第一通孔的孔径大0.3mm-0.4mm；第三通孔的孔径可以小于第一通孔的孔径大，此时，反射层位于粗糙区域内，壳体组件在反射层和粗糙区域的叠加处呈现磨砂效果，且具有发亮和光泽度，壳体组件在粗糙区域未与反射层叠加处为磨砂效果，使得壳体组件在不同区域具有不同的光泽度。具体地，在粗糙区域处呈现中心为磨砂、具有亮度的效果，边缘呈现磨砂的效果，外观效果更好。
可以理解，在装饰表面111上形成第一油墨层140的步骤可以省略。此时，可以直接对装饰表面111进行蒙砂处理，形成粗糙区域113。此种设置使得装饰表面111的整面呈现蒙砂效果。
可以理解，在装饰表面111上形成第二油墨层160的步骤可以省略。此时，可以直接对装饰表面111进行镀膜处理，形成反射层120。此种设置使得装饰表面111的整面具有发亮和光泽度的效果。
可以理解，在装饰表面111上形成第一油墨层140的步骤和在装饰表面111上形成第二油墨层160的步骤可以均省略。此时，可以直接对装饰表面111进行蒙砂处理，形成粗糙区域113，接着直接对装饰表面111进行镀膜处理，形成反射层120。此种设置使得装饰表面111的整面具有蒙砂、发亮和光泽度的效果。
可以理解，对透明基底110进行强化处理的步骤可以省略。进一步地，可以理解，在装饰表面111上形成第二油墨层160的步骤可以省略。此时，在形成第一油墨层140的步骤之后，在去除第一油墨层140的步骤之前，还包括如下步骤：对装饰表面111进行镀膜处理，以在装饰表面111上形成反射层120，且反射层120至少部分覆盖粗糙区域113。
以下为具体实施例部分：
如无特别说明，以下实施例中，碱洗清洗剂为市售碱性清洗剂。耐酸油墨为市售的耐酸油墨。纯水的纯度大于10MΩ·cm。开油水为市售的开油水。水溶性油墨为市售的水溶性油墨。碱液为氢氧化钠的水溶液。保护膜和遮蔽膜均为PET膜。透明基底为透明玻璃基底。
实施例1
本实施例的壳体组件的结构如图1-6，壳体组件的制备过程如下：
(1)对透明基底依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理。透明基底的厚度为0.5mm。
(2)在装饰表面的部分区域上第一次丝网印刷第一油墨，固化，得到固化部，在固化部上第二次丝网印刷第一油墨，固化，得到第一油墨部。每次印刷的厚度为5μm。第一油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为98:3。第一次印刷过程中，固化温度为150℃，固化时间为19min。换油频率为每4h换油一次。第二次印刷过程中，固化温度为140℃，固化时间为2.5min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为70°。刮刀的角度为65°。网版间距为1.5mm。第一油墨的粘度为5000mpa.s。网板寿命小于或等于12h。在每次印刷的过程中，每隔1h向第一油墨中加入1mL的开油水。
(3)在装饰表面的未形成有第一油墨的区域粘贴保护膜，且保护膜部分覆盖第一油墨部。在透明基底的未形成有保护膜的区域喷涂第二油墨，固化，形成第二油墨部，剥离保护膜，得到第一油墨层。第二油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为98:3。固化的过程包括：在140℃下处理4.5min，再置于140℃下处理19min。
(4)将蒙砂处理液置于52℃下静置43h，得到熟化后的蒙砂处理液。蒙砂处理液包括蒙砂液和水。蒙砂液和水的质量比为6.5:25。蒙砂液为深圳精而美科技有限公司的蒙砂液。将形成有第一油墨层的透明基底置于传送带上，采用纯水喷淋透明基底，传送带运行的速度为1m/min，水刀的速度2.3m/min； 采用熟化后的蒙砂处理液喷淋透明基底，得到蒙砂处理后的透明基底，传送带运行的速度为1.4m/min，蒙砂处理液的温度为28℃。
(5)将蒙砂处理后的透明基底置于传送带上，采用28℃、质量百分含量为3％的HF的水溶液喷淋透明基底，得到蒙砂处理后的透明基底。将蒙砂处理后的透明基底依次浸泡在装有温度为60℃的第一退镀剂的退镀槽、装有温度为60℃的第二退镀剂的退镀槽及装有温度为60℃的第三退镀剂的退镀槽中浸泡，再浸泡在装有温度为50℃的纯水的水槽中，以去除第一油墨层，得到形成有粗糙区域的透明基底。第一退镀剂为质量百分含量为5％的碱液。第二退镀剂为质量百分含量为1％的碱液。第三退镀剂为质量百分含量为1％的碱液。每个槽的浸泡时间为50s。
(6)将步骤(5)处理后的透明基底依次置于装有第一清洗液的清洗槽、装有第二清洗液的清洗槽、装有纯水的清洗槽依次对透明基底进行清洗，将清洗后的透明基底依次置于慢拉脱水槽和烘干槽中进行干燥。每个槽的处理时间为50s。第一清洗液中包括质量百分含量为1.5％的第一清洗剂，第一清洗剂为pH为12的碱性清洗剂，第一清洗液清洗的温度为55℃。第二清洗液中包括质量百分含量为1.5％的第二清洗剂，第二清洗剂为pH为12的碱性清洗剂，第二清洗液清洗的温度为55℃。纯水清洗的温度为60℃。慢拉脱水的温度为60℃。慢拉脱水的速度为10Hz。烘干的温度为60℃。
(7)对步骤(6)处理后的透明基底进行两次强化处理，得到强化后的透明基底。每次强化处理：将透明基底置于280℃下保持12min，以使透明基底的温度为280℃；将预热后的透明基底浸入378℃的熔盐中处理37min。熔盐包括质量百分含量为6％的硝酸钠和质量百分含量为94％的硝酸钾。
(8)在装饰表面的未形成有粗糙区域的部分区域丝网印刷第三油墨，固化，形成第三油墨部，并使粗糙区域全部露出第三油墨部。第三油墨包括油墨材料和开油水。油墨材料与开油水的质量比为98:3。油墨材料为水溶性油墨。固化温度为170℃，固化时间为19min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为70°。刮刀的角度为65°。网版间距为1.5mm，网版中的网纱为165T网纱(420目)，网版张力为20N。第三油墨的粘度为4000mpa.s。网板寿命小于或等于12h。每隔1h向第三油墨中加入1mL的开油水。
(9)对形成有第三油墨部的透明基底进行超声清洗。具体地，将形成有第三油墨部的透明基底依次浸泡至装有pH为12的碱洗清洗剂的第一清洗槽、装有pH为12的碱洗清洗剂的第二清洗槽、纯水槽中进行清洗，再将清洗后的透明基底依次在慢拉脱水槽和烘干槽中进行干燥。第一清洗槽和第二清洗槽的温度为45℃。纯水槽的温度为40℃。每个槽内的清洗时间为50s。慢拉脱水的温度为40℃。慢拉脱水的速度为10Hz。烘干的温度为80℃。
(10)在装饰表面上粘贴遮蔽膜，以遮蔽粗糙区域，且使遮蔽膜部分覆盖第三油墨部。
(11)在透明基底未形成有遮蔽膜的区域喷涂第四油墨，固化，形成第四油墨部；剥离遮蔽膜，得到第二油墨层。第四油墨包括油墨材料和开油水。油墨材料与开油水的质量比为98:3。油墨材料为水溶性油墨。固化温度为170℃，固化时间为19min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为70°。刮刀的角度为65°。网版间距为1.5mm，网版中的网纱为165T网纱(420目)，网版张力为20N。第四油墨的粘度为4000mpa.s。网板寿命小于或等于12h。每隔1h向第四油墨中加入1mL的开油水。
(12)采用电镀的方式在装饰表面上形成依次层叠的8nm的第一二氧化硅层、68nm的第一五氧化二铌层、88nm的第二二氧化硅层、83nm的单晶硅层、42nm的第三二氧化硅层、50nm的第二五氧化二铌层、8nm的第四二氧化硅层，镀膜的温度为55℃。镀膜处理后置于60℃纯水中浸泡4min，除去第二油墨层，得到反射层，反射层与粗糙区域完全重合。
(13)在装饰表面上形成膜层单元，且膜层单元覆盖装饰表面和反射层，得到壳体组件。
实施例2
本实施例的壳体组件的结构如图1-6，壳体组件的制备过程如下：
(1)对透明基底依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理。透明基底的厚度为0.7mm。
(2)在装饰表面的部分区域上第一次丝网印刷第一油墨，固化，得到固化部，在固化部上第二次丝网印刷第一油墨，固化，得到第一油墨部。每次印刷的厚度为8μm。第一油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为102:7。第一次印刷过程中，固化温度为170℃，固化时间为21min。换油频率为每4h换油一次。第二次印刷过程中，固化温度为180℃，固化时间为3.5min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为80°。刮刀的角度为75°。网版间距为4.5mm。第一油墨的粘度为7000mpa.s。网板寿命小于或等于12h。在每次印刷的过程中，每隔1.5h向第一油墨中加入3mL的开油水。
(3)在装饰表面的未形成有第一油墨的区域粘贴保护膜，且保护膜部分覆盖第一油墨部。在透明基底的未形成有保护膜的区域喷涂第二油墨，固化，形成第二油墨部，剥离保护膜，得到第一油墨层。第二油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为102:7。固化的过程包括：在180℃下处理5.5min，再置于160℃下处理21min。
(4)将蒙砂处理液置于58℃下静置53h，得到熟化后的蒙砂处理液。蒙砂处理液包括蒙砂液和水。蒙砂液和水的质量比为6.5:25。蒙砂液为佛山犀马精细化工有限公司的蒙砂液。将形成有第一油墨层的透明基底置于传送带上，采用纯水喷淋透明基底，传送带运行的速度为3m/min，水刀的速度2.3m/min；采用熟化后的蒙砂处理液喷淋透明基底，得到蒙砂处理后的透明基底，传送带运行的速度为1.6m/min，蒙砂处理液的温度为32℃。
(5)将蒙砂处理后的透明基底置于传送带上，采用32℃、质量百分含量为5％的HF的水溶液喷淋透明基底，得到蒙砂处理后的透明基底。将蒙砂处理后的透明基底依次浸泡在装有温度为70℃的第一退镀剂的退镀槽、装有温度为70℃的第二退镀剂的退镀槽及装有温度为70℃的第三退镀剂的退镀槽中浸泡，再浸泡在装有温度为60℃的纯水的水槽中，以去除第一油墨层和第二油墨层，得到形成有粗糙区域的透明基底。第一退镀剂为质量百分含量为5％的碱液。第二退镀剂为质量百分含量为3％的碱液。第三退镀剂为质量百分含量为3％的碱液。每个槽的浸泡时间为70s。
(6)将步骤(5)处理后的透明基底依次置于装有第一清洗液的清洗槽、装有第二清洗液的清洗槽、装有纯水的清洗槽依次对透明基底进行清洗，将清洗后的透明基底依次置于慢拉脱水槽和烘干槽中进行干燥。每个槽的处理时间为70s。第一清洗液中包括质量百分含量为2.5％的第一清洗剂，第一清洗剂为pH为14的碱性清洗剂，第一清洗液清洗的温度为75℃。第二清洗液中包括质量百分含量为2.5％的第二清洗剂，第二清洗剂为pH为14的碱性清洗剂，第二清洗液清洗的温度为75℃。纯水清洗的温度为80℃。慢拉脱水的温度为810℃。慢拉脱水的速度为15Hz。烘干的温度为100℃。
(7)对步骤(6)处理后的透明基底进行两次强化处理，得到强化后的透明基底。每次强化处理：将透明基底置于320℃下保持12min，以使透明基底的温度为320℃；将预热后的透明基底浸入382℃的熔盐中处理43min。熔盐包括质量百分含量为6％的硝酸钠和质量百分含量为94％的硝酸钾。
(8)在装饰表面的未形成有粗糙区域的部分区域丝网印刷第三油墨，固化，形成第三油墨部，并使粗糙区域全部露出第三油墨部。第三油墨包括油墨材料和开油水。油墨材料与开油水的质量比为102:7。油墨材料为水溶性油墨。固化温度为190℃，固化时间为21min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为80°。刮刀的角度为75°。网版间距为4.5mm，网版中的网纱为165T网纱(420目)，网版张力为24N。第三油墨的粘度为6000mpa.s。网板寿命小于或等于12h。每隔1.5h向第三油墨中加入3mL的开油水。
(9)对形成有第三油墨部的透明基底进行超声清洗。具体地，将形成有第三油墨部的透明基底依次浸泡至装有pH为12的碱洗清洗剂的第一清洗槽、装有pH为12的碱洗清洗剂的第二清洗槽、纯水槽中进行清洗，再将清洗后的透明基底依次在慢拉脱水槽和烘干槽中进行干燥。第一清洗槽和第二清洗槽的温度为55℃。纯水槽的温度为60℃。每个槽内的清洗时间为70s。慢拉脱水的温度为60℃。慢拉脱水的速度为15Hz。烘干的温度为100℃。
(10)在装饰表面上粘贴遮蔽膜，以遮蔽粗糙区域，且使遮蔽膜部分覆盖第三油墨部。
(11)在透明基底未形成有遮蔽膜的区域喷涂第四油墨，固化，形成第四油墨部；剥离遮蔽膜，得到第二油墨层。第四油墨包括油墨材料和开油水。油墨材料与开油水的质量比为102:7。油墨材料为水溶性油墨。固化温度为190℃，固化时间为21min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为80°。刮刀的角度为75°。网版间距为4.5mm，网版中的网纱为165T网纱(420目)，网版张力为24N。第四油墨的粘度为6000mpa.s。网板寿命小于或等于12h。每隔1.5h向第四油墨中加入3mL的开油水。
(12)采用电镀的方式在装饰表面上形成依次层叠的12nm的第一二氧化硅层、72nm的第一五氧化二铌层、92nm的第二二氧化硅层、87nm的单晶硅层、46nm的第三二氧化硅层、54nm的第二五氧化二铌层、12nm的第四二氧化硅层，镀膜的温度为65℃。镀膜处理后置于70℃纯水中浸泡6min，除去第二油墨层，得到反射层，反射层与粗糙区域完全重合。
(12)在装饰表面上形成膜层单元，且膜层单元覆盖装饰表面和反射层，得到壳体组件。
实施例3
本实施例的壳体组件的结构如图1-6，壳体组件的制备过程如下：
(1)对透明基底依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理。透明基底的厚度为0.6mm。
(2)在装饰表面的部分区域上第一次丝网印刷第一油墨，固化，得到固化部，在固化部上第二次丝网印刷第一油墨，固化，得到第一油墨部。第一油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为100:5。第一次印刷过程中，固化温度为160℃，固化时间为20min。换油频率为每4h换油一次。第二次印刷过程中，固化温度为160℃，固化时间为3min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°。刮刀的角度为70°。网版间距为3mm。第一油墨的粘度为6000mpa.s。网板寿命小于或等于12h。在每次印刷的过程中，每隔1.5h向第一油墨中加入2mL的开油水。
(3)在装饰表面的未形成有第一油墨的区域粘贴保护膜，且保护膜部分覆盖第一油墨部。在透明基底的未形成有保护膜的区域喷涂第二油墨，固化，形成第二油墨部，剥离保护膜，得到第一油墨层。第二油墨包括油墨材料和开油水。油墨材料为耐酸油墨。油墨材料与开油水的质量比为100:5。固化的过程包括：在160℃下处理5min，再置于150℃下处理20min。
(4)将蒙砂处理液置于55℃下静置48h，得到熟化后的蒙砂处理液。蒙砂处理液包括蒙砂液和水。蒙砂液和水的质量比为6.5:25。蒙砂液为深圳精而美科技有限公司的蒙砂液。将形成有第一油墨层的透明基底置于传送带上，采用纯水喷淋透明基底，传送带运行的速度为2m/min，水刀的速度2.3m/min；采用熟化后的蒙砂处理液喷淋透明基底，得到蒙砂处理后的透明基底，传送带运行的速度为1.5m/min，蒙砂处理液的温度为30℃。
(5)将蒙砂处理后的透明基底置于传送带上，采用30℃、质量百分含量为4％的HF的水溶液喷淋透明基底，得到蒙砂处理后的透明基底。将蒙砂处理后的透明基底依次浸泡在装有温度为65℃的第一退镀剂的退镀槽、装有温度为65℃的第二退镀剂的退镀槽及装有温度为65℃的第三退镀剂的退镀槽中浸泡，再浸泡在装有温度为55℃的纯水的水槽中，以去除第一油墨层和第二油墨层，得到形成有粗糙区域的透明基底。第一退镀剂为质量百分含量为5％的碱液。第二退镀剂为质量百分含量为5％的碱液。第三退镀剂为质量百分含量为5％的碱液。每个槽的浸泡时间为60s。
(6)将步骤(5)处理后的透明基底依次置于装有第一清洗液的清洗槽、装有第二清洗液的清洗槽、装有纯水的清洗槽依次对透明基底进行清洗，将清洗后的透明基底依次置于慢拉脱水槽和烘干槽中进行干燥。每个槽的处理时间为60s。第一清洗液中包括质量百分含量为2％的第一清洗剂，第一清洗剂为pH为13的碱性清洗剂，第一清洗液清洗的温度为65℃。第二清洗液中包括质量百分含量为3％的第二清洗剂，第二清洗剂为pH为13的碱性清洗剂，第二清洗液清洗的温度为65℃。纯水清洗的温度为70℃。慢拉脱水的温度为70℃。慢拉脱水的速度为13Hz。烘干的温度为80℃。
(7)对步骤(6)处理后的透明基底进行两次强化处理，得到强化后的透明基底。每次强化处理：将透明基底置于300℃下保持12min，以使透明基底的温度为300℃；将预热后的透明基底浸入380℃的熔盐中处理40min。熔盐包括质量百分含量为6％的硝酸钠和质量百分含量为94％的硝酸钾。
(8)在装饰表面的未形成有粗糙区域的部分区域丝网印刷第三油墨，固化，形成第三油墨部，并使粗糙区域全部露出第三油墨部。第三油墨包括油墨材料和开油水。油墨材料与开油水的质量比为100:5。油墨材料为水溶性油墨。固化温度为180℃，固化时间为20min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°。刮刀的角度为70°。网版间距为3mm，网版中的网纱为165T网纱(420目)，网版张力为22N。第三油墨的粘度为5000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。每隔1h向第三油墨中加入2mL的开油水。
(9)对形成有第三油墨部的透明基底进行超声清洗。具体地，将形成有第三油墨部的透明基底依次浸泡至装有pH为13的碱洗清洗剂的第一清洗槽、装有pH为13的碱洗清洗剂的第二清洗槽、纯水槽中进行清洗，再将清洗后的透明基底依次在慢拉脱水槽和烘干槽中进行干燥。第一清洗槽和第二清洗槽的温度为50℃。纯水槽的温度为50℃。每个槽内的清洗时间为60s。慢拉脱水的温度为50℃。慢拉脱水的速度为12Hz。烘干的温度为90℃。
(10)在装饰表面上粘贴遮蔽膜，以遮蔽粗糙区域，且使遮蔽膜部分覆盖第三油墨部。
(11)在透明基底未形成有遮蔽膜的区域喷涂第四油墨，固化，形成第四油墨部；剥离遮蔽膜，得到第二油墨层。第四油墨包括油墨材料和开油水。油墨材料与开油水的质量比为100:5。油墨材料为水溶性油墨。固化温度为180℃，固化时间为20min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°。刮刀的角度为70°。网版间距为3mm，网版中的网纱为165T网纱(420目)，网版张力为22N。第四油墨的粘度为5000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。每隔1h向第四油墨中加入2mL的开油水。
(12)采用电镀的方式在装饰表面上形成依次层叠的10nm的第一二氧化硅层、70nm的第一五氧化二铌层、90nm的第二二氧化硅层、85nm的单晶硅层、44nm的第三二氧化硅层、52nm的第二五氧化二铌层、10nm的第四二氧化硅层。镀膜的温度为65℃。镀膜处理后置于65℃纯水中浸泡5min，除去第二油墨层，得到反射层，反射层与粗糙区域完全重合。
(12)在装饰表面上形成膜层单元，且膜层单元覆盖装饰表面和反射层，得到壳体组件。
实施例4
本实施例的壳体组件的结构如图1-3、图5-6和图12，本实施例的壳体组件的制备过程与实施例1大致相同，不同之处在于，在步骤(12)中，采用PVD的方式在粗糙区域远离透明基底的一侧上形成依次层叠的硅层、第一钛层、铜层及第二钛层，硅层的厚度为3nm，第一钛层的厚度为6nm，铜层的厚度为18nm，第二钛层的厚度为48nm。镀膜处理后置于60℃纯水中浸泡4min，除去第二油墨层，得到反射层。
实施例5
本实施例的壳体组件的结构如图1-3、图5-6和图12，本实施例的壳体组件的制备过程与实施例2大致相同，不同之处在于，在步骤(12)中，采用PVD的方式在粗糙区域远离透明基底的一侧上形成依次层叠的硅层、第一钛层、铜层及第二钛层，硅层的厚度为7nm，第一钛层的厚度为10nm，铜层的厚度为22nm，第二钛层的厚度为52nm。镀膜处理后置于70℃纯水中浸泡6min，除去第二油墨层，得到反射层。
实施例6
本实施例的壳体组件的结构如图1-3、图5-6和图12，本实施例的壳体组件的制备过程与实施例3大致相同，不同之处在于，在步骤(12)中，采用PVD的方式在粗糙区域远离透明基底的一侧上形成依次层叠的硅层、第一钛层、铜层及第二钛层，硅层的厚度为5nm，第一钛层的厚度为8nm，铜层的厚度为20nm，第二钛层的厚度为50nm。镀膜处理后置于65℃纯水中浸泡5min，除去第二油墨层，得 到反射层。
实施例7
本实施例的壳体组件的制备过程与实施例3大致相同，不同之处在于，步骤(12)中，在装饰表面上贴附菲林膜，以形成覆盖层，在透明基底上形成膜层单元，膜层单元位于透明基底远离装饰表面的一侧，得到壳体组件。
实施例8
本实施例的壳体组件的制备过程与实施例3大致相同，不同之处在于，在步骤(12)中，采用锗层替代单晶硅层。
实施例9
本实施例的壳体组件的制备过程与实施例3大致相同，不同之处在于，在步骤(12)中，采用电镀的方式在粗糙区域远离透明基底的一侧上形成依次层叠的170nm的第一五氧化二铌层、90nm的第二二氧化硅层、85nm的单晶硅层、44nm的第三二氧化硅层、52nm的第二五氧化二铌层、10nm的第四二氧化硅层。
实施例10
本实施例的壳体组件的制备过程与实施例6大致相同，不同之处在于，在步骤(11)中，铜层的厚度为15nm。
实施例11
本实施例的壳体组件的制备过程与实施例3大致相同，不同之处在于，在步骤(5)中，将蒙砂处理后的透明基底依次浸泡在装有温度为65℃的第一退镀剂的退镀槽、装有温度为65℃的第二退镀剂的退镀槽及装有温度为65℃的第三退镀剂的退镀槽中浸泡，再浸泡在装有温度为55℃的纯水的水槽中，以去除第一油墨层和第二油墨层，得到形成有粗糙区域的透明基底。第一退镀剂为质量百分含量为5％的碱液。第二退镀剂为质量百分含量为5％的碱液。第三退镀剂为质量百分含量为5％的碱液。每个槽的浸泡时间为60s。
实施例12
本实施例的壳体组件的制备过程如下：
(1)对透明基底依次进行第一次CNC加工、热弯处理、第二次CNC加工和3D抛光处理。透明基底的厚度为0.6mm。
(2)将步骤(1)处理后的透明基底依次置于装有第一清洗液的清洗槽、装有第二清洗液的清洗槽、装有纯水的清洗槽依次对透明基底进行清洗，将清洗后的透明基底依次置于慢拉脱水槽和烘干槽中进行干燥。每个槽的处理时间为60s。第一清洗液中包括质量百分含量为2％的第一清洗剂，第一清洗剂为pH为13的碱性清洗剂，第一清洗液清洗的温度为65℃。第二清洗液中包括质量百分含量为3％的第二清洗剂，第二清洗剂为pH为13的碱性清洗剂，第二清洗液清洗的温度为65℃。纯水清洗的温度为70℃。慢拉脱水的温度为70℃。慢拉脱水的速度为13Hz。烘干的温度为80℃。
(3)对步骤(2)处理后的透明基底进行两次强化处理，得到强化后的透明基底。每次强化处理：将透明基底置于300℃下保持12min，以使透明基底的温度为300℃；将预热后的透明基底浸入380℃的熔盐中处理40min。熔盐包括质量百分含量为6％的硝酸钠和质量百分含量为94％的硝酸钾。
(4)在装饰表面的部分区域丝网印刷第三油墨，固化，形成第三油墨部。第三油墨包括油墨材料和开油水。油墨材料与开油水的质量比为100:5。油墨材料为水溶性油墨。固化温度为180℃，固化时间为20min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°。刮刀的角度为70°。网版间距为3mm，网版中的网纱为165T网纱(420目)，网版张力为22N。第三油墨的粘度为5000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。每隔1h向第三油墨中加入2mL的开油水。
(5)对形成有第三油墨部的透明基底进行超声清洗。具体地，将形成有第三油墨部的透明基底依次浸泡至装有pH为13的碱洗清洗剂的第一清洗槽、装有pH为13的碱洗清洗剂的第二清洗槽、纯水槽中进行清洗，再将清洗后的透明基底依次在慢拉脱水槽和烘干槽中进行干燥。第一清洗槽和第二清洗 槽的温度为50℃。纯水槽的温度为50℃。每个槽内的清洗时间为60s。慢拉脱水的温度为50℃。慢拉脱水的速度为12Hz。烘干的温度为90℃。
(6)在装饰表面上粘贴遮蔽膜，以遮蔽粗糙区域，且使遮蔽膜部分覆盖第三油墨部。
(7)在透明基底未形成有遮蔽膜的区域喷涂第四油墨，固化，形成第四油墨部；剥离遮蔽膜，得到第二油墨层。第四油墨包括油墨材料和开油水。油墨材料与开油水的质量比为100:5。油墨材料为水溶性油墨。固化温度为180℃，固化时间为20min。换油频率为每4h换油一次。回墨刀的速度小于或等于300mm/s。刮刀的速度小于或等于300mm/s。刮胶的长度比丝印图案的长度长1cm-2cm。刮刀的硬度为75°。刮刀的角度为70°。网版间距为3mm，网版中的网纱为165T网纱(420目)，网版张力为22N。第四油墨的粘度为5000mpa.s。网板寿命小于或等于12h。设备气压为0.6Par±1Par。每隔1h向第四油墨中加入2mL的开油水。
(8)采用电镀的方式在装饰表面上形成依次层叠的10nm的第一二氧化硅层、70nm的第一五氧化二铌层、90nm的第二二氧化硅层、85nm的单晶硅层、44nm的第三二氧化硅层、52nm的第二五氧化二铌层、10nm的第四二氧化硅层。镀膜的温度为65℃。镀膜处理后置于65℃纯水中浸泡5min，除去第二油墨层，得到反射层。
(9)在装饰表面上形成膜层单元，且膜层单元覆盖装饰表面和反射层，得到壳体组件。
测试：
测定实施例1-11的壳体组件中粗糙区域的光泽度、表面粗糙度和雾度，测试实施例1-12的壳体组件的亮度和耐冲击性能，测定实施例1-12的壳体组件中反射层的附着力。测定结果详见表1。表1表示的是实施例1-11的壳体组件中粗糙区域的光泽度和表面粗糙度，实施例1-12的壳体组件的亮度和耐冲击性能，实施例1-12的壳体组件中反射层的附着力。
其中，采用光泽度仪测定光泽度；采用奥林巴斯激光干涉仪测定表面粗糙度；采用色差仪测定亮度，具体地，采用色差仪测定壳体组件在透明基底远离装饰表面的一侧处的亮度，即采用色差仪测定实施例1-6和实施例8-12测定壳体组件在透明基底的背面处的亮度，采用色差仪测定实施例7测定壳体组件在菲林膜远离透明基底一侧处的亮度；采用BYK透视雾度仪测定雾度；采用千百格测试测定附着力；采用落球实验测定耐冲击性能，落球实验中测定球落下击中透明基底远离装饰表面的一侧(即为透明基底的背面)，直至透明基底破碎时的高度，高度越高，耐冲击性能越优异。
表1
Figure PCTCN2020097012-appb-000001
从表1可以看出，实施例1-11的壳体组件的粗糙区域的光泽度大于20，表面粗糙度为0.1μm-0.3μm，雾度为20％-60％，说明上述实施方式的壳体组件在粗糙区域处具有磨砂效果，能够防眩光；反射层的 附着力不小于3B，壳体组件的耐冲击性能为17cm-30cm，亮度大于50，说明上述实施方式的壳体组件的反射层具有较好的附着力，且壳体组件具有较好的耐冲击性能，不易脱落且不易被破碎，并且使得壳体组件具有发亮和光泽度的效果。
综上所述，上述实施方式的壳体组件在粗糙区域和反射层叠加处具有发亮、光泽度和防眩光的效果，外观效果较好，反射层具有较好的附着力，且壳体组件具有较好的耐冲击性能，使得壳体组件具有优异的机械性能。上述壳体组件能够用于制备具有发亮、磨砂的LOGO(标志)的电子设备。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (31)

  1. 一种壳体组件，包括：
    透明基底，具有装饰表面，所述装饰表面上设有粗糙区域；及
    反射层，设置在所述装饰表面上，并覆盖至少部分所述粗糙区域。
  2. 根据权利要求1所述的壳体组件，其特征在于，所述粗糙区域的表面粗糙度为0.1μm-0.2μm。
  3. 根据权利要求1所述的壳体组件，其特征在于，所述粗糙区域的雾度为20％-40％。
  4. 根据权利要求1所述的壳体组件，其特征在于，所述反射层与所述粗糙区域完全重合。
  5. 根据权利要求1所述的壳体组件，其特征在于，所述装饰表面上还具有非粗糙区域，所述非粗糙区域围绕所述粗糙区域设置，所述反射层至少部分覆盖所述非粗糙区域。
  6. 根据权利要求1-5任一项所述的壳体组件，其特征在于，所述反射层包括依次层叠设置在所述装饰表面上的第一二氧化硅层、第一五氧化二铌层、第二二氧化硅层、单晶硅层、第三二氧化硅层、第二五氧化二铌层、第四二氧化硅层。
  7. 根据权利要求6所述的壳体组件，其特征在于，所述第一二氧化硅层的厚度为8nm-12nm，所述第一五氧化二铌层的厚度为68nm-72nm，所述第二二氧化硅层的厚度为88nm-92nm，所述单晶硅层的厚度为83nm-87nm，所述第三二氧化硅层的厚度为42nm-46nm，所述第二五氧化二铌层的厚度为50nm-54nm，所述第四二氧化硅层的厚度为8nm-12nm。
  8. 根据权利要求1-5任一项所述的壳体组件，其特征在于，所述反射层包括依次层叠设置在所述装饰表面上的硅层、第一钛层、铜层及第二钛层。
  9. 根据权利要求8所述的壳体组件，其特征在于，所述硅层的厚度为3nm-7nm，所述第一钛层的厚度为6nm-10nm，所述铜层的厚度为18nm-22nm，所述第二钛层的厚度为48nm-52nm。
  10. 根据权利要求1-5任一项所述的壳体组件，其特征在于，所述壳体组件还包括膜层单元，所述膜层单元覆盖所述透明基底靠近所述反射层的一侧，且覆盖所述反射层。
  11. 一种壳体组件的制备方法，包括如下步骤：
    提供透明基底，所述透明基底具有装饰表面；
    在所述装饰表面上形成粗糙区域；及
    在所述装饰表面上形成反射层，且所述反射层覆盖至少部分所述粗糙区域，得到壳体组件。
  12. 根据权利要求11所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成粗糙区域的步骤包括：对所述装饰表面进行蒙砂处理以形成所述粗糙区域。
  13. 根据权利要求12所述的壳体组件的制备方法，其特征在于，所述对所述装饰表面进行蒙砂处理以形成所述粗糙区域的步骤包括：
    在所述装饰表面的部分区域形成第一油墨层；及
    对所述装饰表面进行蒙砂处理，然后去除所述第一油墨层，以使所述装饰表面的未形成有所述第一油墨层的区域形成所述粗糙区域。
  14. 根据权利要求13所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面的部分区域形成第一油墨层的步骤包括：
    在所述装饰表面的部分区域丝网印刷第一油墨；
    在所述装饰表面的未形成有所述第一油墨的至少部分区域形成保护膜；
    在所述透明基底的未形成有所述保护膜的区域喷涂第二油墨；及
    去除所述保护膜，得到所述第一油墨层。
  15. 根据权利要求14所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面的部分区域丝网印刷第一油墨的步骤中，所述第一油墨的厚度为5μm-16μm。
  16. 根据权利要求12所述的壳体组件的制备方法，其特征在于，所述对所述装饰表面进行蒙砂处理的步骤之后，还包括如下步骤：对蒙砂处理后的所述装饰表面进行化学抛光处理。
  17. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成粗糙区域的步骤之后，还包括如下步骤：对形成有所述粗糙区域的所述透明基底进行强化处理。
  18. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成反射层的步骤包括：
    在所述装饰表面上形成第二油墨层，并使所述粗糙区域至少部分露出；及
    对所述装饰表面进行镀膜处理，然后去除所述第二油墨层，形成所述反射层。
  19. 根据权利要求18所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成第二油墨层的步骤包括：
    在所述装饰表面的未形成有所述粗糙区域的至少部分区域丝网印刷第三油墨，并使至少部分所述粗糙区域露出；
    在所述装饰表面上形成遮蔽膜，以遮蔽所述粗糙区域的露出部分；
    在所述透明基底的未形成有所述遮蔽膜的区域喷涂第四油墨；及
    去除所述遮蔽膜，得到所述第二油墨层。
  20. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成反射层的步骤包括：
    在所述装饰表面上形成所述第二油墨层，所述第二油墨层围绕所述粗糙区域设置，且所述第二油墨层与所述粗糙区域形成间隙；及
    对所述装饰表面进行镀膜处理，然后去除所述第二油墨层，形成所述反射层，且所述反射层完全覆盖所述粗糙区域且覆盖所述间隙。
  21. 根据权利要求20所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成第二油墨层的步骤包括：
    在所述装饰表面的未形成有所述粗糙区域的至少部分区域丝网印刷第三油墨，所述第三油墨围绕所述粗糙区域设置，且所述第三油墨与所述粗糙区域形成间隙；
    在所述装饰表面上形成遮蔽膜，以遮蔽所述粗糙区域和所述间隙；
    在所述透明基底未形成有所述遮蔽膜的区域喷涂第四油墨；及
    去除所述遮蔽膜，得到所述第二油墨层。
  22. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，在所述装饰表面上形成所述反射层的方式为电镀、沉积或者溅射。
  23. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成反射层的步骤包括：在所述装饰表面上形成依次层叠的第一二氧化硅层、第一五氧化二铌层、第二二氧化硅层、单晶硅层、第三二氧化硅层、第二五氧化二铌层、第四二氧化硅层，得到所述反射层。
  24. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成反射层的步骤包括：在所述装饰表面上形成依次层叠的硅层、第一钛层、铜层及第二钛层，得到所述反射层。
  25. 根据权利要求11-16任一项所述的壳体组件的制备方法，其特征在于，所述在所述装饰表面上形成反射层的步骤之后，还包括如下步骤：在所述装饰表面上形成膜层单元，所述膜层单元覆盖所述反射层。
  26. 一种电子设备，包括：
    权利要求1-10任一项所述的壳体组件或者权利要求11-25任一项所述的壳体组件的制备方法制备得到的壳体组件；
    显示组件，与所述壳体组件连接，所述显示组件和所述壳体组件之间限定出安装空间；及
    电路板，设置在所述安装空间内且与所述显示组件电连接。
  27. 一种壳体组件，包括：
    透明基底，包括相对设置的装饰表面和背面，所述装饰表面具有粗糙区域，所述粗糙区域的雾度为20％-40％；及
    反射层，设置于所述装饰表面所在侧并覆盖至少部分所述粗糙区域。
  28. 根据权利要求27所述的壳体组件，其特征在于，所述反射层覆盖全部所述粗糙区域。
  29. 根据权利要求28所述的壳体组件，其特征在于，所述装饰表面还具有围绕所述粗糙区域的非粗糙区域，所述装饰层覆盖至少部分所述非粗糙区域。
  30. 根据权利要求27所述的壳体组件，其特征在于，所述壳体组件还包括膜层单元，所述膜层单元设于所述装饰表面所在侧且覆盖所述反射层。
  31. 一种电子设备，包括：
    权利要求27-30任一项所述的壳体组件；
    显示组件，设于所述壳体组件的一侧；及
    电路板，设于所述显示组件的背侧且与所述显示组件电连接，所述壳体组件覆盖所述电路板。
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