WO2021000852A1 - Procédé d'obturation de trou sous vide - Google Patents

Procédé d'obturation de trou sous vide Download PDF

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Publication number
WO2021000852A1
WO2021000852A1 PCT/CN2020/099220 CN2020099220W WO2021000852A1 WO 2021000852 A1 WO2021000852 A1 WO 2021000852A1 CN 2020099220 W CN2020099220 W CN 2020099220W WO 2021000852 A1 WO2021000852 A1 WO 2021000852A1
Authority
WO
WIPO (PCT)
Prior art keywords
plug hole
plugging
vacuum
plug
tape
Prior art date
Application number
PCT/CN2020/099220
Other languages
English (en)
Chinese (zh)
Inventor
李远航
Original Assignee
深圳碳森科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳碳森科技有限公司 filed Critical 深圳碳森科技有限公司
Publication of WO2021000852A1 publication Critical patent/WO2021000852A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Definitions

  • This application relates to the technical field of plugging technology, and in particular to a vacuum plugging method.
  • the plug hole technology has a wide range of applications, especially in the production process of printed circuit boards (PCBs), where the holes need to be used for conducting and insulating functions.
  • PCBs printed circuit boards
  • Existing hole plugging methods generally use an exemplary screen printing method to plug the holes. Under the support of the silk screen pad, the screen and the PCB are bonded together, and the plugging materials such as ink and resin are filled into the holes through a scraper.
  • the non-vacuum method is used to plug the hole. Since the plugging material such as ink and resin is filled into the hole by a scraper, it is easy to cause the plugging material to be difficult to completely fill the plug hole, and it is easy to appear There are air bubbles in the plugging material or the inside of the plug hole is not filled up, resulting in poor plugging effect.
  • this application is to provide a vacuum plugging method to improve the plugging effect.
  • a vacuum plugging method includes:
  • S4 Perform a vacuum operation to make the air inside the plug hole leave the plug hole and form bubbles on the surface of the plug hole material, perform a pressure increase operation, and crush the remaining bubbles on the surface of the plug hole material;
  • both ends of the plug hole that does not need to be plugged are sealed, and one end of the plug hole that needs to be plugged is exposed, so that the plugging material enters the plug hole that needs to be plugged.
  • the air in the plug hole moves to the surface of the plug hole material under the action of air pressure to generate bubbles and burst, and some of the bubbles that are not broken will be The sudden rise of air pressure breaks, thereby more effectively removing the air in the plugging material, and improving the effect of plugging.
  • the vacuum operation in S5 is to reduce the air pressure from a standard atmospheric pressure to less than 5000 Pa.
  • the step-up operation in S5 is to restore the air pressure to a standard atmospheric pressure.
  • the upper end and the lower end of the plug hole are sealed by adhesive tape in the S1 and S2.
  • the tape can better seal the plug hole.
  • the S2 includes:
  • the shape of the teaching state is made according to the shape of the plug hole, so that the shape of the tape is adapted to the shape of the plug hole, so that the influence between adjacent plug holes is small.
  • a laser cutting machine or a numerical control platform is used to make the pattern of the tape.
  • the pattern of the tape is produced by a laser cutting machine and a numerical control platform, so that the produced tape is relatively flat and the graphics are more consistent with the actual plug hole shape, which can better fit on the plug hole.
  • the plugging material includes solder or resin or light curing glue or silica gel.
  • the number of repetitions in S5 is 3-9 times.
  • the air bubbles in the plugging material can be discharged as much as possible by repeating multiple times, thereby improving the plugging effect.
  • This application seals the lower ends of all the plug holes and the upper ends of the plug holes that do not need to be plugged, thereby separating the plug holes that need to be plugged and those that do not need to be plugged, and then perform the plugging material Filling, vacuuming and boosting operations are performed, so that the air in the plugging material completely leaves the plugging material, and the plugging effect is improved.
  • FIG. 1 is a step diagram of this application
  • FIG. 2 is a schematic diagram of the steps of this application.
  • a vacuum plugging method disclosed in this application includes:
  • Adhesive tape 3 preferably uses polyimide gold finger tape 3.
  • S2 Seal the upper end of the plug hole 2 that does not require the plug hole 2 operation; select the plug hole 2 that does not require the plug hole 2 operation, and make the corresponding shape according to the shape of the plug hole 2 through a laser cutting machine or a three-axis CNC platform Adhesive tape 3, stick the tape 3 on the board 1, the tape 3 covers and seals the plug hole 2, and the edge of the tape 3 is completely attached to the surface of the board 1.
  • the plugging material 4 can be solder, resin, light curing glue or silica gel.
  • S7 Solidify the plug hole material 4 and release the seal at the lower end of the plug hole 2. Dry the board 1 until the plug material 4 in the plug hole 2 is cured. If the plug material 4 is a light-curing adhesive, add an ultraviolet exposure process after drying to make it completely cured. After the curing is completed, remove the board 1. The tape 3 on the lower surface, gently operate when the tape 3 is removed, to prevent the tape 3 from driving the plugging material 4 out of the plug hole 2.
  • the implementation principle of this embodiment is: first seal the lower surface of the plate 1 with an adhesive tape 3 to establish a bearing surface of the plugging material 4, and then cut the tape 3 into the same plug hole 2 that does not require the plug hole 2 operation
  • the tape 3 is pasted on the plate 1 to seal the plug hole 2 so that the plug hole 2 does not need to be plugged into the hole 2 to prevent the plug hole material 4 from entering.
  • the corresponding plugging material 4 is coated on the surface of the plate 1 according to the process requirements.
  • the plugging material 4 flows into the plug hole 2 due to gravity when passing through the plug hole 2, but at this time, there is generally a bubble cavity in the plug hole , The plug hole cannot be completely filled.
  • the bubbles or cavities in the plug material 4 will continue to rise due to the pressure difference and the volume will continue to increase until it rises to the two-phase interface between the plug material 4 and the gas to form visible bubbles, part of the bubble volume Continue to expand and then burst. Then stop the decrease of the air pressure and let the outside air in. The air quickly enters the vacuum drying box and then the air pressure in the vacuum drying box is rapidly increased. The rapidly rising air pressure crushes the remaining bubbles. Then repeat the above-mentioned vacuuming and boosting operations, so that the air in the plug material 4 is completely discharged. When no more bubbles can be observed, it means that the plug material 4 has completely filled the previous holes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne le domaine des procédés d'obturation de trou. L'invention concerne un procédé d'obturation de trou sous vide, consistant à : S1 : fermer hermétiquement les extrémités inférieures de tous les trous à obturer; S2 : fermer hermétiquement les extrémités supérieures des trous à obturer qui ne nécessitent aucune opération d'obturation de trou; S3 : revêtir la surface d'une carte avec un matériau d'obturation de trou et remplir les trous à obturer avec le matériau d'obturation de trou; S4 : mettre en œuvre une opération de mise sous vide de telle sorte que l'air à l'intérieur des trous à obturer sorte desdits trous et que des bulles se forment sur la surface du matériau d'obturation de trou, et mettre en œuvre une opération de surpression pour faire éclater les bulles restant sur la surface du matériau d'obturation de trou; S5 : répéter l'opération de mise sous vide et l'opération de surpression jusqu'à ce qu'aucune bulle macroscopique ne soit générée; S6 : éliminer le matériau d'obturation de trou superflu et dégager l'ouverture au niveau des extrémités supérieures des trous à obturer; et S7 : faire durcir le matériau d'obturation de trou et dégager l'ouverture au niveau des extrémités inférieures des trous à obturer.
PCT/CN2020/099220 2019-07-03 2020-06-30 Procédé d'obturation de trou sous vide WO2021000852A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910596472.0 2019-07-03
CN201910596472.0A CN112188733A (zh) 2019-07-03 2019-07-03 一种真空塞孔方法

Publications (1)

Publication Number Publication Date
WO2021000852A1 true WO2021000852A1 (fr) 2021-01-07

Family

ID=73914435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/099220 WO2021000852A1 (fr) 2019-07-03 2020-06-30 Procédé d'obturation de trou sous vide

Country Status (2)

Country Link
CN (1) CN112188733A (fr)
WO (1) WO2021000852A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183519A (ja) * 1998-12-16 2000-06-30 Nippon Rekku Kk プリント配線基板孔部への樹脂充填方法
CN1259009A (zh) * 1998-12-25 2000-07-05 日本胜利株式会社 印刷电路板的制造方法
US20020017739A1 (en) * 2000-08-09 2002-02-14 Japan Radio Co., Ltd. Hole filling method for a printed wiring board
CN1411331A (zh) * 2001-10-10 2003-04-16 株式会社电装 流体材料填充装置及其填充方法
US20030135997A1 (en) * 2002-01-23 2003-07-24 Fujitsu Limited Conductive material and method for filling via-hole
US6889433B1 (en) * 1999-07-12 2005-05-10 Ibiden Co., Ltd. Method of manufacturing printed-circuit board
CN1709015A (zh) * 2002-12-09 2005-12-14 野田士克林股份有限公司 印刷电路板的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1262595A (zh) * 1999-01-26 2000-08-09 欣兴电子股份有限公司 塞孔制作工艺的装置及方法
CN102548251B (zh) * 2011-12-12 2014-06-25 深圳崇达多层线路板有限公司 Pcb真空压合塞孔工艺
CN103917060A (zh) * 2013-01-05 2014-07-09 北大方正集团有限公司 一种印刷电路板板件塞孔制作方法
CN103687335A (zh) * 2013-12-11 2014-03-26 广州兴森快捷电路科技有限公司 线路板选择性树脂塞孔的制作方法
CN103732009B (zh) * 2013-12-24 2017-10-17 广州兴森快捷电路科技有限公司 线路板盘中孔的树脂塞孔方法及盘中孔的制作方法
CN108243563A (zh) * 2016-12-23 2018-07-03 无锡深南电路有限公司 一种ic载板用树脂塞孔方法
CN107148151A (zh) * 2017-07-14 2017-09-08 四会富士电子科技有限公司 一种图形后树脂塞孔的方法
CN109195333A (zh) * 2018-10-13 2019-01-11 同健(惠阳)电子有限公司 一种线路板树脂塞孔脱泡的技术

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183519A (ja) * 1998-12-16 2000-06-30 Nippon Rekku Kk プリント配線基板孔部への樹脂充填方法
CN1259009A (zh) * 1998-12-25 2000-07-05 日本胜利株式会社 印刷电路板的制造方法
US6889433B1 (en) * 1999-07-12 2005-05-10 Ibiden Co., Ltd. Method of manufacturing printed-circuit board
US20020017739A1 (en) * 2000-08-09 2002-02-14 Japan Radio Co., Ltd. Hole filling method for a printed wiring board
CN1411331A (zh) * 2001-10-10 2003-04-16 株式会社电装 流体材料填充装置及其填充方法
US20030135997A1 (en) * 2002-01-23 2003-07-24 Fujitsu Limited Conductive material and method for filling via-hole
CN1709015A (zh) * 2002-12-09 2005-12-14 野田士克林股份有限公司 印刷电路板的制造方法

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