WO2020258550A1 - 一种显示面板 - Google Patents

一种显示面板 Download PDF

Info

Publication number
WO2020258550A1
WO2020258550A1 PCT/CN2019/107473 CN2019107473W WO2020258550A1 WO 2020258550 A1 WO2020258550 A1 WO 2020258550A1 CN 2019107473 W CN2019107473 W CN 2019107473W WO 2020258550 A1 WO2020258550 A1 WO 2020258550A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
layer
display panel
substrate
sub
Prior art date
Application number
PCT/CN2019/107473
Other languages
English (en)
French (fr)
Inventor
王坤
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/624,126 priority Critical patent/US11335881B2/en
Publication of WO2020258550A1 publication Critical patent/WO2020258550A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present invention relates to the field of display technology, in particular to a display panel.
  • OLED Organic Light-Emitting Diode
  • OLED organic electric laser display device
  • organic light emitting semiconductor organic light emitting semiconductor
  • the basic structure of OLED is a thin, transparent, semi-conducting indium tin oxide (ITO) connected to the positive electrode of electricity, plus another metal-faced cathode, wrapped in a sandwich structure.
  • ITO indium tin oxide
  • the entire structure layer includes: hole transport layer (HTL), light emitting layer (EL) and electron transport layer (ETL).
  • HTL hole transport layer
  • EL light emitting layer
  • ETL electron transport layer
  • the positive electrode holes and the surface cathode charges When the power is supplied to the appropriate voltage, the positive electrode holes and the surface cathode charges will combine in the light-emitting layer, and under the action of the Coulomb force, they will recombine with a certain probability to form excitons (electron-hole pairs) in an excited state.
  • the excited state is unstable in the normal environment.
  • the excitons in the excited state recombine and transfer energy to the luminescent material, making it transition from the ground state energy level to the excited state.
  • the excited state energy generates photons through the radiation relaxation process and releases light It can produce light, and the three primary colors of red, green and blue are produced according to different formulas, which constitute the basic colors.
  • OLED the characteristic of OLED is that it emits light by itself, unlike the thin film transistor liquid crystal display device (English full name: Thin The film transistor-liquid crystal display (TFT-LCD for short) needs backlight, so the visibility and brightness are high.
  • OLED has the advantages of low voltage demand, high power saving efficiency, fast response, light weight, thin thickness, simple structure, low cost, wide viewing angle, almost infinitely high contrast, low power consumption, and extremely high response speed. It has become One of the most important display technologies today is gradually replacing TFT-LCD is expected to become the next-generation mainstream display technology after LCD.
  • OLED devices are particularly sensitive to water and oxygen, and metal electrodes and organic light-emitting materials are easily aging after encountering water and oxygen.
  • the traditional packaging method is rigid packaging, but the device cannot be bent after using rigid packaging.
  • the method of thin film encapsulation (TFE) is widely used, that is, multilayer inorganic/organic film is overlapped for encapsulation.
  • the inorganic layer is used to block water and oxygen, and the organic layer is used to buffer the bending process. Stress, coated particles, etc.
  • OLED display panels The current development trend of OLED display panels is to enhance the bending performance of the panel to adapt to various dynamic bending and static bending products.
  • the current thin-film encapsulated OLED panels often experience edge peeling after high temperature and high humidity tests. , which seriously affects the normal service life of the panel. Therefore, a new type of display panel is needed to solve the above-mentioned problems.
  • An object of the present invention is to provide a display panel, which can solve the film shedding phenomenon caused by the weak bonding force between the packaging film layer and the underlying array substrate film layer in the existing display panel, and avoid display panel failure.
  • one embodiment of the present invention provides a display panel, which includes: a substrate, a buffer layer, an insulating layer, an interlayer insulating layer, a crack prevention member, a dam, a first inorganic encapsulation layer, and a second inorganic encapsulation Layer and organic layer.
  • the buffer layer is disposed on the substrate; the insulating layer is disposed on the buffer layer; the interlayer insulating layer is disposed on the insulating layer; wherein the interlayer insulating layer is away from the substrate
  • One side surface is partially recessed downwards to form a first groove; the anti-cracking member fills the first groove and covers the interlayer insulating layer; the dams are arranged at intervals between the first grooves
  • the interlayer insulating layer; the first inorganic encapsulation layer covers the interlayer insulating layer; the second inorganic encapsulation layer covers the first inorganic encapsulation layer; the organic layer covers the The second inorganic encapsulation layer.
  • the surface of the interlayer insulating layer between the first groove and the dam away from the substrate is partially recessed downward to form a second groove; the first inorganic encapsulation layer fills the first groove Two grooves cover the interlayer insulating layer.
  • the side of the first inorganic encapsulation layer away from the substrate is partially recessed downward to form a third groove, and the second inorganic encapsulation layer is filled in the third groove and covers the first On the inorganic encapsulation layer.
  • the first groove is recessed downward and penetrates the insulating layer and the buffer layer to the substrate.
  • the first groove includes a plurality of first sub-grooves spaced apart from each other, the distance between the first sub-grooves ranges from 1 to 10 ⁇ m, and the width of the first sub-groove ranges It is 1-10 ⁇ m.
  • the depth of the first sub-groove is smaller than the width of the first sub-groove.
  • the bottom surface of the second groove is located on a surface of the buffer layer facing the substrate.
  • the second groove includes a plurality of second sub-grooves spaced apart from each other, the distance between the second sub-grooves ranges from 1 to 20 ⁇ m, and the width of the second sub-groove ranges It is 1-20 ⁇ m.
  • the depth of the second sub-groove is smaller than the width of the second sub-groove.
  • the second groove is formed by a partial depression of a surface of the crack prevention member away from the substrate.
  • the present invention relates to a display panel.
  • the present invention dents a side surface of the interlayer insulating layer away from the substrate until a first groove is formed in the substrate, and the crack prevention member is filled with The first groove is used to achieve the connection between the anti-cracking element and the substrate and the connection between the organic layer and the organic layer, thereby increasing the bending resistance of the display panel and reducing the risk of peeling of the film;
  • the present invention The surface of the interlayer insulating layer between the first groove and the dam away from the substrate is recessed downward to form a second groove, and the first inorganic encapsulation layer fills the second groove, In this way, the inorganic layer in the packaging layer and the inorganic layer in the array substrate are connected to each other, thereby increasing the bending resistance of the display panel and reducing the risk of peeling of the film layer.
  • FIG. 1 is a schematic diagram of the structure of a display panel of Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of a display panel according to Embodiment 2 of the present invention.
  • the first inorganic encapsulation layer 8.
  • the component can be directly placed on the other component; there may also be an intermediate component on which the component is placed , And the intermediate component is placed on another component.
  • a component is described as “installed to” or “connected to” another component, both can be understood as directly “installed” or “connected”, or a component is “installed to” or “connected to” through an intermediate component Another component.
  • a display panel 100 includes: a substrate 1, a buffer layer 2, an insulating layer 3, an interlayer insulating layer 4, a crack prevention member 5, a dam 6, a first inorganic encapsulation layer 7, and a second inorganic encapsulation layer.
  • the buffer layer 2 is arranged on the substrate; the insulating layer 3 is arranged on the buffer layer 2; the interlayer insulating layer 4 is arranged on the insulating layer 3.
  • the surface of the interlayer insulating layer 4 away from the substrate 1 is partially recessed downward to form a first groove 11; the crack prevention member 5 fills the first groove 11 and covers On the interlayer insulating layer 4; since the anti-crack member 5 is formed by inkjet printing or organic coating in the later stage, the anti-crack member 5 can be overlapped with the substrate 1 through the first groove 11 In order to increase the bending resistance of the display panel and reduce the risk of peeling of the film.
  • the first groove 10 is recessed downward and penetrates the insulating layer 3 and the buffer layer 2 to the substrate 7. Because the substrate 1 is generally composed of organic matter, the lap of the organic matter between the anti-crack member 5 and the substrate can be realized, thereby reducing the risk of film peeling.
  • the first groove 10 includes a plurality of first sub-grooves 101 spaced apart from each other, and the distance between the first sub-grooves 101 ranges from 1 to 10 ⁇ m.
  • the width of the sub-groove 101 ranges from 1-10 ⁇ m, and the depth of the first sub-groove is smaller than the width of the first sub-groove.
  • the specific number of the first sub-grooves 101 can be determined according to actual conditions.
  • the dams 6 are arranged on the interlayer insulating layer 4 between the first grooves 10 at intervals; wherein the interlayer between the first grooves 10 and the dam 6
  • the surface of the insulating layer 4 away from the substrate is partially recessed downward to form a second groove 11; the first inorganic encapsulation layer 7 fills the second groove 11 and covers the interlayer insulating layer 4.
  • the first inorganic encapsulation layer 7 can be overlapped with the inorganic layer in the array substrate to increase the bonding force between the encapsulation film layer and the array substrate, thereby increasing the bending resistance of the display panel and reducing the peeling of the film layer. risk.
  • the bottom surface of the second groove 11 is located on the side surface of the buffer layer 2 facing the substrate 1.
  • the second groove 11 cannot exceed the buffer layer 2, because once it exceeds the buffer layer 2, it is the substrate 1.
  • the substrate 1 is an organic layer, so the connection between the inorganic layer and the inorganic layer cannot be realized.
  • the second groove 11 includes a plurality of second sub-grooves 111 spaced apart from each other.
  • the distance between the second sub-grooves 111 ranges from 1 to 20 ⁇ m.
  • the width of the sub-groove 111 ranges from 1-20 ⁇ m.
  • the depth of the second sub-groove 111 is smaller than the width of the second sub-groove 111.
  • the specific number of the second sub-groove 111 can be determined according to actual conditions.
  • the second inorganic encapsulation layer 8 covers the first inorganic encapsulation layer 7; the organic layer 9 covers the second inorganic encapsulation layer 8.
  • the side of the first inorganic encapsulation layer 7 away from the substrate 1 is partially recessed downward to form a third groove 12, and the second inorganic encapsulation layer 8 is filled in the third groove 12 And cover the first inorganic encapsulation layer 7.
  • the bonding force between the first inorganic encapsulation layer 7 and the second inorganic encapsulation layer 8 can be increased, thereby increasing the bending resistance of the display panel and reducing the risk of peeling of the film layer.
  • the first inorganic encapsulation layer 7 and the second inorganic encapsulation layer 8 can be prepared by any one of atomic layer deposition, pulsed laser deposition, magnetron sputtering, and plasma chemical vapor deposition.
  • the constituent materials of the first inorganic encapsulation layer 7 and the second inorganic encapsulation layer 8 include one or more of SiNx, SiOxNy, SiOx, SiCxNy, ZnO, and AlOx.
  • the first inorganic encapsulating layer 7 and the second inorganic encapsulating layer 8 thus prepared have better water and oxygen blocking performance.
  • the difference between this embodiment and Embodiment 1 is that the anti-crack member 5 and the dam 6 are connected to each other, and the second groove 11 is separated from the substrate by the anti-crack member 5 One side surface of 1 is partially recessed downward.
  • the first inorganic packaging layer 7 is overlapped with the inorganic layer in the array substrate, thereby increasing the bonding force between the packaging film layer and the array substrate, thereby increasing the bending resistance of the display panel and reducing the risk of peeling of the film layer. .

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明涉及一种显示面板，一方面，本发明通过在所述层间绝缘层远离所述基板的一侧表面向下凹陷直至所述基板中形成第一凹槽，并且所述防裂件填充所述第一凹槽，以此达到防裂件与基板的连接，实现有机层于有机层的连接，以此增加显示面板的抗弯折性能，降低膜层peeling风险；另一方面，本发明在所述第一凹槽与堤坝之间的所述层间绝缘层远离所述基板的一侧表面向下凹陷形成第二凹槽，所述第一无机封装层填充所述第二凹槽，以此实现封装层中的无机层与阵列基板中的无机层相互连接，以此增加显示面板的抗弯折性能，降低膜层peeling风险。

Description

一种显示面板 技术领域
本发明涉及显示技术领域，具体涉及一种显示面板。
 背景技术
OLED(英文全称：Organic Light-Emitting Diode, 简称OLED)器件又称为有机电激光显示装置、有机发光半导体。OLED的基本结构是由一薄而透明具有半导体特性的铟锡氧化物(ITO)与电力之正极相连，再加上另一个金属面阴极，包成如三明治的结构。整个结构层中包括了:空穴传输层(HTL)、发光层(EL)与电子传输层(ETL)。当电力供应至适当电压时，正极空穴与面阴极电荷就会在发光层中结合，在库伦力的作用下以一定几率复合形成处于激发态的激子（电子-空穴对），而此激发态在通常的环境中是不稳定的，激发态的激子复合并将能量传递给发光材料，使其从基态能级跃迁为激发态，激发态能量通过辐射驰豫过程产生光子，释放出光能，产生光亮，依其配方不同产生红、绿和蓝RGB三基色，构成基本色彩。
首先OLED的特性是自己发光，不像薄膜晶体管液晶显示装置（英文全称：Thin film transistor-liquid crystal display，简称TFT-LCD）需要背光，因此可视度和亮度均高。其次OLED具有电压需求低、省电效率高、反应快、重量轻、厚度薄，构造简单，成本低、广视角、几乎无穷高的对比度、较低耗电、极高反应速度等优点，已经成为当今最重要的显示技术之一，正在逐步替代 TFT-LCD，有望成为继LCD之后的下一代主流显示技术。
 技术问题
然而OLED器件对水氧特别敏感，金属电极及有机发光材料遇到水氧后极易老化，为了防止器件受到破坏，需要在金属电极以及发光材料上进行封装以对其进行保护。传统的封装方法是rigid封装，但使用rigid封装后器件不能进行弯折。为了实现柔性显示的目的，现在广泛采用的是薄膜封装（TFE）的方法，即多层无机/有机薄膜交叠的方式进行封装，其中无机层用来阻隔水氧，有机层用来缓冲弯曲过程中产生的应力、包覆颗粒等。
目前OLED显示面板的发展趋势是增强面板的弯折性能，以适应各种动态弯折及静态弯折的产品，但是目前薄膜封装的OLED面板，在高温高湿试验后，经常出现边缘Peeling的情况，严重影响面板的正常使用寿命。因此，需要寻求一种新型的显示面板以解决上述问题。
 技术解决方案
本发明的一个目的是提供一种显示面板，其能够解决现有的显示面板中存在的由于封装膜层与下层阵列基板膜层间结合力不牢固产生的膜脱落现象，避免显示面板失效。
为了解决上述问题，本发明的一个实施方式提供了一种显示面板，其中包括：基板、缓冲层、绝缘层、层间绝缘层、防裂件、堤坝、第一无机封装层、第二无机封装层以及有机层。其中所述缓冲层设置于所述基板上；所述绝缘层设置于所述缓冲层上；所述层间绝缘层设置于所述绝缘层上；其中所述层间绝缘层远离所述基板的一侧表面局部向下凹陷形成第一凹槽；所述防裂件填充所述第一凹槽并覆盖于所述层间绝缘层上；所述堤坝相互间隔设置于所述第一凹槽之间的层间绝缘层上；所述第一无机封装层覆盖于所述层间绝缘层上；所述第二无机封装层覆盖于所述第一无机封装层上；所述有机层覆盖于所述第二无机封装层上。
进一步的，其中所述第一凹槽与所述堤坝之间的层间绝缘层远离所述基板的一侧表面局部向下凹陷形成第二凹槽；所述第一无机封装层填充所述第二凹槽并覆盖于所述层间绝缘层上。
进一步的，其中所述第一无机封装层远离所述基板的一侧局部向下凹陷形成第三凹槽，所述第二无机封装层填充于所述第三凹槽并覆盖于所述第一无机封装层上。
进一步的，其中所述第一凹槽向下凹陷贯穿所述绝缘层以及缓冲层直至所述基板中。
进一步的，其中所述第一凹槽包括若干个相互间隔设置的第一子凹槽，所述第一子凹槽之间的间距范围为1-10μm，所述第一子凹槽的宽度范围为1-10μm。
进一步的，其中所述第一子凹槽的深度小于第一子凹槽的宽度。
进一步的，其中所述第二凹槽的底面位于所述缓冲层朝向所述基板的一侧表面上。
进一步的，其中所述第二凹槽包括若干个相互间隔设置的第二子凹槽，所述第二子凹槽之间的间距范围为1-20μm，所述第二子凹槽的宽度范围为1-20μm。
进一步的，其中所述第二子凹槽的深度小于第二子凹槽的宽度。
进一步的，其中所述防裂件与所述堤坝相互连接，所述第二凹槽由所述防裂件远离所述基板的一侧表面局部向下凹陷形成。
 有益效果
本发明涉及一种显示面板，一方面，本发明通过在所述层间绝缘层远离所述基板的一侧表面向下凹陷直至所述基板中形成第一凹槽，并且所述防裂件填充所述第一凹槽，以此达到防裂件与基板的连接，实现有机层于有机层的连接，以此增加显示面板的抗弯折性能，降低膜层peeling风险；另一方面，本发明在所述第一凹槽与堤坝之间的所述层间绝缘层远离所述基板的一侧表面向下凹陷形成第二凹槽，所述第一无机封装层填充所述第二凹槽，以此实现封装层中的无机层与阵列基板中的无机层相互连接，以此增加显示面板的抗弯折性能，降低膜层peeling风险。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例1的显示面板的结构示意图。
图2是本发明实施例2的显示面板的结构示意图。
图中部件标识如下：
100、显示面板
1、基板                   2、缓冲层
3、绝缘层                 4、层间绝缘层
5、防裂件                 6、堤坝
7、第一无机封装层         8、第二无机封装层
9、有机层                 10、第一凹槽
11、第二凹槽              12、第三凹槽
101、第一子凹槽           111、第二子凹槽
 本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是附图中的方向，本文所使用的方向用语是用来解释和说明本发明，而不是用来限定本发明的保护范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的 ，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”或“连接至”另一组件时，二者可以理解为直接“安装”或“连接”，或者一个组件通过一中间组件“安装至”或“连接至”另一个组件。
实施例1
如图1所示，一种显示面板100，其中包括：基板1、缓冲层2、绝缘层3、层间绝缘层4、防裂件5、堤坝6、第一无机封装层7、第二无机封装层8以及有机层9。
其中所述缓冲层2设置于所述基板上；所述绝缘层3设置于所述缓冲层2上；所述层间绝缘层4设置于所述绝缘层3上。
如图1所示，其中所述层间绝缘层4远离所述基板1的一侧表面局部向下凹陷形成第一凹槽11；所述防裂件5填充所述第一凹槽11并覆盖于所述层间绝缘层4上；由于防裂件5后期是通过喷墨打印或者涂布有机物的形成制备形成，因此可以通过第一凹槽11实现防裂件5与基板1搭接在一起，以此增加显示面板的抗弯折性能，降低膜层peeling风险。
其中所述第一凹槽10向下凹陷贯穿所述绝缘层3以及缓冲层2直至所述基板7中。因为基板1一般是由有机物组成的，由此才能实现所述的防裂件5与基板之间的有机物的搭接，从而降低膜层peeling风险。
如图1所示，其中所述第一凹槽10包括若干个相互间隔设置的第一子凹槽101，所述第一子凹槽101之间的间距范围为1-10μm，所述第一子凹槽101的宽度范围为1-10μm，所述第一子凹槽的深度小于第一子凹槽的宽度。具体的第一子凹槽101的数量可以根据实际情况决定。
如图1所示，其中所述堤坝6相互间隔设置于所述第一凹槽10之间的层间绝缘层4上；其中所述第一凹槽10与所述堤坝6之间的层间绝缘层4远离所述基板的一侧表面局部向下凹陷形成第二凹槽11；所述第一无机封装层7填充所述第二凹槽11并覆盖于所述层间绝缘层4上。以此可以实现第一无机封装层7与阵列基板中的无机层搭接在一起，增加封装薄膜层与阵列基板之间的结合力，以此增加显示面板的抗弯折性能，降低膜层peeling风险。
如图1所示，其中所述第二凹槽11的底面位于所述缓冲层2朝向所述基板1的一侧表面上。换言之，所述第二凹槽11不能超过所述缓冲层2，因为一旦超过缓冲层2之后就是基板1，然而基板1是有机层，如此就无法实现无机层与无机层的连接。
如图1所示，其中所述第二凹槽11包括若干个相互间隔设置的第二子凹槽111，所述第二子凹槽111之间的间距范围为1-20μm，所述第二子凹槽111的宽度范围为1-20μm，所述第二子凹槽111的深度小于第二子凹槽111的宽度，具体的第二子凹槽111的数量可以根据实际情况决定。
如图1所示，所述第二无机封装层8覆盖于所述第一无机封装层7上；所述有机层9覆盖于所述第二无机封装层8上。在本实施例中，所述第一无机封装层7远离所述基板1的一侧局部向下凹陷形成第三凹槽12，所述第二无机封装层8填充于所述第三凹槽12并覆盖于所述第一无机封装层7上。由此可以增加所述第一无机封装层7与第二无机封装层8之间的结合力，以此增加显示面板的抗弯折性能，降低膜层peeling风险。
其中所述第一无机封装层7和第二无机封装层8可以通过原子层沉积、脉冲激光沉积、磁控溅射、等离子化学气相沉积中的任意一种制备形成。
其中所述第一无机封装层7和第二无机封装层8的组成材料包括SiNx、SiOxNy、SiOx,、SiCxNy、ZnO、AlOx中的一种或多种。由此制备形成的第一无机封装层7和第二无机封装层8具有更好的阻水氧性能。
实施例2
如图2所示，本实施例与实施例1不同的是，其中所述防裂件5与所述堤坝6相互连接，所述第二凹槽11由所述防裂件5远离所述基板1的一侧表面局部向下凹陷形成。由此形成第一无机封装层7与阵列基板中的无机层进行搭接，从而增加封装薄膜层与阵列基板之间的结合力，以此增加显示面板的抗弯折性能，降低膜层peeling风险。
以上对本发明所提供的显示面板进行了详细介绍。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本发明的方法及其核心思想，而并不用于限制本发明。在每个示例性实施方式中对特征或方面的描述通常应被视作适用于其他示例性实施例中的类似特征或方面。尽管参考示例性实施例描述了本发明，但可建议所属领域的技术人员进行各种变化和更改。本发明意图涵盖所附权利要求书的范围内的这些变化和更改，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种显示面板，其中包括：
    基板；
    缓冲层，所述缓冲层设置于所述基板上；
    绝缘层，所述绝缘层设置于所述缓冲层上；
    层间绝缘层，所述层间绝缘层设置于所述绝缘层上；
    其中所述层间绝缘层远离所述基板的一侧表面局部向下凹陷形成第一凹槽；
    防裂件，所述防裂件填充所述第一凹槽并覆盖于所述层间绝缘层上；
    堤坝，所述堤坝相互间隔设置于所述第一凹槽之间的层间绝缘层上；
    第一无机封装层，所述第一无机封装层覆盖于所述层间绝缘层上；
    第二无机封装层，所述第二无机封装层覆盖于所述第一无机封装层上；以及
    有机层，所述有机层覆盖于所述第二无机封装层上。
  2. 根据权利要求1所述的显示面板，其中所述第一凹槽与所述堤坝之间的层间绝缘层远离所述基板的一侧表面局部向下凹陷形成第二凹槽；所述第一无机封装层填充所述第二凹槽并覆盖于所述层间绝缘层上。
  3. 根据权利要求1所述的显示面板，其中所述第一无机封装层远离所述基板的一侧局部向下凹陷形成第三凹槽，所述第二无机封装层填充所述第三凹槽并覆盖于所述第一无机封装层上。
  4. 根据权利要求1所述的显示面板，其中所述第一凹槽向下凹陷贯穿所述绝缘层以及缓冲层直至所述基板中。
  5. 根据权利要求1所述的显示面板，其中所述第一凹槽包括若干个相互间隔设置的第一子凹槽，所述第一子凹槽之间的间距范围为1-10μm，所述第一子凹槽的宽度范围为1-10μm。
  6. 根据权利要求5所述的显示面板，其中所述第一子凹槽的深度小于第一子凹槽的宽度。
  7. 根据权利要求2所述的显示面板，其中所述第二凹槽的底面位于所述缓冲层朝向所述基板的一侧表面上。
  8. 根据权利要求2所述的显示面板，其中所述第二凹槽包括若干个相互间隔设置的第二子凹槽，所述第二子凹槽之间的间距范围为1-20μm，所述第二子凹槽的宽度范围为1-20μm。
  9. 根据权利要求8所述的显示面板，其中所述第二子凹槽的深度小于第二子凹槽的宽度。
  10. 根据权利要求2所述的显示面板，其中所述防裂件与所述堤坝相互连接，所述第二凹槽由所述防裂件远离所述基板的一侧表面局部向下凹陷形成。
PCT/CN2019/107473 2019-06-26 2019-09-24 一种显示面板 WO2020258550A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/624,126 US11335881B2 (en) 2019-06-26 2019-09-24 Display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910560636.4 2019-06-26
CN201910560636.4A CN110335964B (zh) 2019-06-26 2019-06-26 一种显示面板

Publications (1)

Publication Number Publication Date
WO2020258550A1 true WO2020258550A1 (zh) 2020-12-30

Family

ID=68142879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/107473 WO2020258550A1 (zh) 2019-06-26 2019-09-24 一种显示面板

Country Status (3)

Country Link
US (1) US11335881B2 (zh)
CN (1) CN110335964B (zh)
WO (1) WO2020258550A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111129034A (zh) * 2019-12-20 2020-05-08 武汉华星光电半导体显示技术有限公司 一种显示面板
CN110993828A (zh) 2020-01-03 2020-04-10 武汉华星光电半导体显示技术有限公司 Oled显示面板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107910350A (zh) * 2017-11-14 2018-04-13 京东方科技集团股份有限公司 一种显示基板、显示装置
CN108281458A (zh) * 2017-01-03 2018-07-13 昆山工研院新型平板显示技术中心有限公司 柔性oled显示装置及其制备方法
CN108288637A (zh) * 2018-01-24 2018-07-17 武汉华星光电半导体显示技术有限公司 柔性显示面板的制作方法及柔性显示面板
CN109860258A (zh) * 2019-02-27 2019-06-07 武汉华星光电半导体显示技术有限公司 柔性有机发光二极管显示屏

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5720222B2 (ja) * 2010-12-13 2015-05-20 ソニー株式会社 表示装置及び電子機器
KR102391361B1 (ko) * 2015-01-14 2022-04-27 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102421577B1 (ko) * 2016-04-05 2022-07-18 삼성디스플레이 주식회사 디스플레이 장치
US10622585B2 (en) * 2016-12-06 2020-04-14 Samsung Display Co., Ltd. Display apparatus
CN106876428B (zh) * 2017-02-03 2019-10-08 上海天马微电子有限公司 柔性显示面板、其制作方法及显示装置
CN107068715B (zh) * 2017-03-28 2019-12-20 上海天马微电子有限公司 一种有机发光显示面板、有机发光显示装置以及有机发光显示面板的制备方法
KR102373441B1 (ko) * 2017-03-31 2022-03-14 삼성디스플레이 주식회사 디스플레이 장치
CN108364987B (zh) * 2018-02-24 2021-01-26 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
KR20200003328A (ko) * 2018-06-29 2020-01-09 삼성디스플레이 주식회사 디스플레이 장치
CN109004104A (zh) * 2018-07-27 2018-12-14 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制备方法
CN109065552B (zh) * 2018-08-03 2020-03-27 武汉华星光电半导体显示技术有限公司 Oled显示装置
KR102548987B1 (ko) * 2018-08-09 2023-06-29 삼성디스플레이 주식회사 디스플레이 장치
KR102602191B1 (ko) * 2018-08-24 2023-11-15 삼성디스플레이 주식회사 디스플레이 장치
US10541380B1 (en) * 2018-08-30 2020-01-21 Samsung Display Co., Ltd. Display device with substrate comprising an opening and adjacent grooves
US10692950B2 (en) * 2018-08-31 2020-06-23 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. OLED display panel having a first barrier closed ring and a second barrier closed ring
CN109461832B (zh) * 2018-08-31 2020-11-10 云谷（固安）科技有限公司 一种柔性显示面板及其制作方法
KR102617925B1 (ko) * 2018-09-27 2023-12-26 삼성디스플레이 주식회사 표시 장치
CN109449306A (zh) * 2018-09-28 2019-03-08 昆山国显光电有限公司 显示面板、显示装置及显示面板的制造方法
KR20200041420A (ko) * 2018-10-11 2020-04-22 삼성디스플레이 주식회사 표시 패널
US10964731B2 (en) * 2018-12-04 2021-03-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Array substrate and manufacturing method thereof and display device
KR102441330B1 (ko) * 2019-03-27 2022-09-13 삼성디스플레이 주식회사 가요성 표시 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108281458A (zh) * 2017-01-03 2018-07-13 昆山工研院新型平板显示技术中心有限公司 柔性oled显示装置及其制备方法
CN107910350A (zh) * 2017-11-14 2018-04-13 京东方科技集团股份有限公司 一种显示基板、显示装置
CN108288637A (zh) * 2018-01-24 2018-07-17 武汉华星光电半导体显示技术有限公司 柔性显示面板的制作方法及柔性显示面板
CN109860258A (zh) * 2019-02-27 2019-06-07 武汉华星光电半导体显示技术有限公司 柔性有机发光二极管显示屏

Also Published As

Publication number Publication date
US20210343984A1 (en) 2021-11-04
CN110335964B (zh) 2020-11-10
CN110335964A (zh) 2019-10-15
US11335881B2 (en) 2022-05-17

Similar Documents

Publication Publication Date Title
KR100885843B1 (ko) 유기전계발광 표시소자 및 그 제조방법
WO2020199445A1 (zh) 一种oled显示器件及其制备方法
CN107845667A (zh) 一种有机发光显示面板、显示装置及其制作方法
WO2020215415A1 (zh) Oled显示面板的外围电路结构及oled显示面板
JP2014120478A (ja) ピクセル構造、ピクセルユニット構造、表示パネルおよび表示装置
KR101503313B1 (ko) 유기전계발광 표시소자 및 그 제조방법
WO2020248348A1 (zh) 一种显示面板及其显示装置
WO2020172929A1 (zh) 一种柔性oled器件及其制备方法
US11335882B2 (en) Organic light-emitting diode display device and manufacturing method thereof
WO2020244100A1 (zh) 一种显示器件及其制备方法
WO2020258550A1 (zh) 一种显示面板
US20210408427A1 (en) Display panel and display device thereof
US8686443B2 (en) Organic light-emitting display device
KR102312784B1 (ko) 전계발광 소자 및 이의 제조 방법
WO2020077698A1 (zh) 一种有机发光二极管器件的封装结构及其制作方法
CN110718644B (zh) 一种彩膜基板及其制备方法、oled显示装置
US20210359043A1 (en) Array substrate and manufacturing method thereof, and display device
WO2020237875A1 (zh) 一种显示面板及其制备方法
WO2020199268A1 (zh) 一种oled封装结构及oled封装方法
KR102094143B1 (ko) 유기발광다이오드 표시장치의 제조방법
WO2021179419A1 (zh) 一种显示面板及其制备方法、显示装置
US20200274083A1 (en) Flexible oled display device and manufacturing method thereof
WO2021017312A1 (zh) 一种显示面板及其显示装置
KR100609777B1 (ko) 판넬 보호 필름을 갖는 유기 전계 발광 소자
US20210366731A1 (en) Mask, usage method thereof, and manufacturing method of encapsulation layer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19935025

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19935025

Country of ref document: EP

Kind code of ref document: A1