WO2020248747A1 - 显示面板及制作方法 - Google Patents

显示面板及制作方法 Download PDF

Info

Publication number
WO2020248747A1
WO2020248747A1 PCT/CN2020/089084 CN2020089084W WO2020248747A1 WO 2020248747 A1 WO2020248747 A1 WO 2020248747A1 CN 2020089084 W CN2020089084 W CN 2020089084W WO 2020248747 A1 WO2020248747 A1 WO 2020248747A1
Authority
WO
WIPO (PCT)
Prior art keywords
display
base substrate
transition body
display panel
wiring
Prior art date
Application number
PCT/CN2020/089084
Other languages
English (en)
French (fr)
Inventor
刘冬妮
玄明花
刘超
刘英伟
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/283,512 priority Critical patent/US20210399185A1/en
Publication of WO2020248747A1 publication Critical patent/WO2020248747A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method.
  • Micro-led due to its self-luminous, high luminous efficiency, high contrast, wide operating temperature range, long life, low power consumption, excellent resistance to water and oxygen, and very fast response time. , Is receiving more and more people's attention.
  • splicing display panels using micro-light emitting diodes have increasingly higher requirements for ultra-narrow bezels.
  • a double-sided process and a side connection process scheme are usually adopted.
  • the current display panels in the related art still need to be improved due to the limitation of ultra-narrow bezels and process reliability.
  • the embodiment of the present disclosure provides a display panel, including:
  • a base substrate includes a display surface and a display back surface that are arranged oppositely, and a side surface connecting the display surface and the display back surface;
  • a plurality of second traces formed on the display back surface of the base substrate
  • a transition body located on the side surface of the base substrate and respectively in contact with the first wiring and the second wiring, and a surface of the transition body facing away from the side surface is formed as a smooth curved surface;
  • a plurality of connecting wires cover the outer surface of the transition body and are used to electrically connect each of the first wires and the corresponding second wires.
  • the transition body includes a first end in contact with the first wire and a second end in contact with the second wire, the first end and the second end
  • the outer surface facing away from the side is arc-shaped at the corner position.
  • the contact surface between the first trace and the first end is flush with the edge of the base substrate, and the contact between the second trace and the second end The surface is flush with the edge of the base substrate.
  • the upper end of the first end portion is flush with the outer surface of the first wire away from the display surface, and the lower end of the second end portion is away from the second wire The outer surface of the display back is flush.
  • the transition body is composed of a colloid, and the thermal expansion coefficient of the colloid is the same as the thermal expansion coefficient of the connecting line.
  • the maximum thickness of the transition body does not exceed 10 microns.
  • the outer surface of the transition body facing away from the side surface has a circular arc shape or an elliptical arc shape at a corner position.
  • it further includes a light-shielding colloid covering the outer surface of the connecting wire.
  • the embodiment of the present disclosure also provides a manufacturing method of a display panel, the manufacturing method includes:
  • a transition body is formed on the side surface of the base substrate connecting the display surface and the display back surface, wherein the transition body is in contact with the first wiring and the second wiring, and the transition body
  • the surface facing away from the side surface is formed as a smooth curved surface
  • a plurality of connecting lines covering the outer surface of the transition body are formed, and the connecting lines electrically connect the first wiring and the corresponding second wiring.
  • the forming a transition body on the side surface of the base substrate includes:
  • the forming a colloid on the side surface of the base substrate includes:
  • the glue is attached to the side surface of the base substrate by means of transfer or pad printing.
  • the forming multiple connecting lines on the outer surface of the transition body includes:
  • a plurality of the connecting lines are formed on the side of the transition body away from the side surface.
  • the manufacturing method further includes:
  • a light-shielding colloid is formed on the outer surface of the connecting line.
  • the manufacturing method before forming a plurality of first traces on the display surface of the base substrate, the manufacturing method further includes:
  • the mother board is cut to obtain a plurality of the display panels.
  • FIG. 1 is a schematic diagram of the front, back and cross-section of a display panel
  • FIG. 2 is a schematic cross-sectional view of a display panel before cutting
  • FIG. 3 is a schematic cross-sectional view of a display panel after cutting
  • FIG. 4 is a schematic cross-sectional view of a display panel after the chamfering process
  • FIG. 5 is a schematic cross-sectional view of a display panel after forming connecting lines
  • FIG. 6 is a schematic cross-sectional view of a display panel after forming a light-shielding colloid
  • FIG. 7 is a schematic top view of a side connection line of a display panel
  • FIG. 8 is a schematic cross-sectional view of a side connecting line of a display panel
  • FIG. 9 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the disclosure.
  • FIG. 10 is a schematic cross-sectional structure diagram of a display panel including a light-shielding colloid provided by an embodiment of the disclosure
  • FIG. 11 is a schematic diagram of a manufacturing process of a display panel provided by an embodiment of the disclosure.
  • FIG. 12 is a schematic diagram of a manufacturing process of a specific display panel provided by an embodiment of the disclosure.
  • FIG. 13 is a schematic cross-sectional view of a display panel before cutting according to an embodiment of the disclosure.
  • FIG. 14 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the disclosure after being cut;
  • 15 is a schematic cross-sectional view of a display panel provided by an embodiment of the disclosure after forming a gel
  • FIG. 16 is a schematic cross-sectional structure diagram of the display panel provided by an embodiment of the disclosure after the gel is heated.
  • Figure 1 is a schematic diagram of the front of the display panel
  • Figure b is a schematic diagram of the back of the display panel
  • Figure c is a schematic cross-sectional view of the display panel, that is, the pixel circuit and shift register circuits are all designed on the front of the panel
  • sector-shaped The fanout and chip (IC/FPC) are designed on the back of the panel, and the IC is bonded on the back of the panel.
  • the IC signal is transmitted from the fanout and the side line to the front through the side connection method Data line and shift register.
  • the usual side connection process flow is as follows: 1.
  • the glass substrate is cut into a display panel by laser cutting (Laser cut purpose: to improve cutting accuracy and improve panel edge quality), as shown in Figure 2 and Figure 3.
  • 2 is a schematic cross-sectional view of the display panel before cutting
  • FIG. 3 is a schematic cross-sectional view of the display panel after cutting, wherein the display panel specifically includes a pixel unit 013 in the display area, a pixel area wiring 012, and a substrate
  • the first trace 011 of the display surface 010 of the base substrate 01 is located on the second trace 021 of the display back 020.
  • the base substrate 01 has a laser cutting margin d1, a chamfer cutting margin d2, and a side connection margin d3, shading colloid margin d4; 2.
  • Laser cutting accuracy ⁇ 20um
  • the minimum size of chamfer can currently be about 50-100um
  • the side connection process accuracy is mini.
  • BM OC accuracy ⁇ 20um.
  • the chamfering process size becomes the maximum limit for the ultra-narrow frame (or no frame), and after the chamfering process, the chamfering angle is for example 45 degrees, and the side lines are still Some parts (as shown in Figure 5 where the dashed circle is located) are prone to breakage (bad Open), as shown in Figure 7.
  • Figure 7 is a schematic diagram of the corner of the side connection after the chamfering process, and the chamfering process is poor ( Figure 8) ) May also cause the side cable to break.
  • an embodiment of the present disclosure provides a display panel, as shown in FIG. 9, including:
  • the base substrate 1 which includes a display surface 10 and a display back surface 20 arranged oppositely, and a side surface 30 connecting the display surface 10 and the display back surface 20.
  • the base substrate may specifically be a glass substrate;
  • a plurality of first wires 11 are located on the display surface 10 of the base substrate 1;
  • a plurality of second wirings 21 are located on the display back 20 of the base substrate 1;
  • the transition body 3 is located on the side surface 30 of the base substrate 1 and is in contact with the first wiring 11 and the second wiring 21, respectively.
  • the surface of the transition body 3 facing away from the side surface 30 is formed as a smooth curved surface.
  • the transition The body 3 includes a first end opposite to the first trace 11 (as shown in the upper end of the transition body 3 in Figure 9) and a second end opposite to the second trace 21 (as shown in the transition body 3 in Figure 9). Lower end), the outer surfaces of the first end and the second end facing away from the side surface 30 are arc-shaped at corner positions (positions marked by dashed circles in Fig. 9);
  • the display panel provided by the embodiment of the present disclosure includes: a plurality of first wires 11 on the display surface 10, a plurality of second wires 21 on the display back 20, and a transition body 3 on the side surface 30, wherein the transition body 3
  • the outer surface facing away from the side surface 30 is arc-shaped at the corner position.
  • the connecting line 4 can be The smooth transition at the corner position can further improve the problem that the connecting line on the side of the display panel in the related art is easily broken, and avoid the problem that the connecting line is easily broken when there are sharp corners at the corner position.
  • a transition body is formed on the side of the display panel without using the chamfering process in the related art, which can also avoid the need to reserve a larger width of chamfering and cutting margins that would cause the frame of the display panel.
  • the wider problem, and thus the embodiment of the present disclosure can achieve narrow frame.
  • the first wiring 11 may specifically be a data line, or may be a wiring used to provide other components on the display surface, for example, it may specifically also be a wiring providing signals for a shift register.
  • the upper end of the first end of the transition body 3 may be flush with the outer surface of the first wire 11 facing away from the display surface 10, and the lower end of the second end may be flush with the outer surface of the second wire 21 facing away from the display back 20. level.
  • the connecting wire 4 may specifically cover the first wire 11, the second wire 21, and also cover the connecting wire 3.
  • the display panel of the embodiment of the present disclosure may specifically be a display surface composed of micro light emitting diodes.
  • one side edge of the first wiring 11 may be flush with the right edge of the base substrate 1, that is, as shown in FIG. 9, the right edge of the first wiring 11 is flush with The right edge of the base substrate 1 is aligned with the second dashed line from the right in FIG. 9.
  • one side edge of the second wiring 21 can be flush with the right edge of the base substrate 1, that is, as shown in FIG. 9, the right edge of the second wiring 21 is the same as the right edge of the base substrate 1. Both are aligned with the second dashed line from the right in Figure 9. That is, in the embodiment of the present disclosure, one side edge of the first wiring 11 is flush with the right edge of the base substrate 1, and one side edge of the second wiring 21 is flush with the right edge of the base substrate 1.
  • the frame width of the display panel can be reduced to a large extent, so that the display panel can be realized. Narrow frame.
  • the materials of the first wiring 11 and the second wiring 21 may be the same.
  • the transition body 3 may specifically be a colloid, and the thermal expansion coefficient of the colloid is the same as that of the connecting line 4.
  • the material of the transition body 3 is colloid.
  • the colloid can be attached to the side surface 30 of the base substrate 1 by attaching.
  • the side surface 30 of the base substrate 1 forms the transition body 3
  • the method is simple, and the adhesion of the transition body 3 on the side surface 30 of the base substrate 1 is strong, which is also conducive to the subsequent formation of the connecting line 4 on the outer surface of the transition body 3.
  • the transition body 3 is a colloid, which can be heated by heating.
  • the thickness d of the transition body is less than 10 microns. In the embodiment of the present disclosure, the thickness d of the transition body is less than 10 ⁇ m, which is beneficial for the display panel to realize a narrow frame.
  • the outer surface of the transition body 3 facing away from the side surface 30 is in the shape of a circular arc or an elliptical arc at the corner position.
  • the display panel further includes a light-shielding colloid 5 covering the outer surface of the connecting wire 4.
  • the display panel further includes a light-shielding gel 5 covering the outer surface of the connecting wire 4, which can prevent the connecting wire 4 from affecting the display of the display panel when light is reflected.
  • the embodiments of the present disclosure also provide a manufacturing method of the display panel as provided in the embodiments of the present disclosure. As shown in FIG. 11, the manufacturing method includes:
  • Step S101 forming a plurality of first wirings on the display surface of the base substrate.
  • Step S103 forming a transition body on the side surface of the base substrate, wherein the outer surface of the transition body facing away from the side surface is arc-shaped at the corner position.
  • Step S104 forming multiple connecting lines on the outer surface of the transition body.
  • multiple connecting lines can be formed on the outer surface of the transition body by means of transfer or pad printing.
  • step S103 forming a transition body on the side surface of the base substrate includes:
  • Step S1031 forming a colloid on the side surface of the base substrate.
  • the gel can be formed on the side surface of the base substrate by means of transfer or pad printing.
  • the gel is formed by transfer or pad printing, and the method of forming the gel on the side of the base substrate is relatively simple.
  • the glue sticking solution can also be not limited to pad printing and transfer printing, but can also be achieved by sputtering, spin coating, exposure and other methods.
  • Step S1032 heat the colloid, so that the outer surface of the colloid away from the side surface forms an arc at the corner position.
  • step S104 that is, after a plurality of connecting lines are formed on the outer surface of the transition body
  • the manufacturing method further includes: step S105, by transferring or pad printing, after connecting The side of the wire facing away from the side surface forms a light-shielding colloid.
  • the manufacturing method further includes: step S100, cutting a mother board through a laser cutting process to obtain a plurality of the base substrates.
  • the specific manufacturing process flow of the display panel may be as follows:
  • Step 1 The glass substrate on which the circuit traces are formed is cut into a display panel by laser cutting (the purpose of laser cutting is to improve cutting accuracy and improve the edge quality of the display panel), as shown in Figure 13 and Figure 14, where Figure 13 is The structure diagram of the display panel before cutting, d1 is the reserved margin for laser cutting, and FIG. 14 is the structure diagram of the display panel after cutting.
  • Step two forming a transition body 3 on the side of the line by means of transfer or pad printing.
  • the transition body 3 may be a glue material.
  • Step 3 Process the edge of the rubber material by heating and other methods to reduce the angle of the rubber material edge to an arc angle, as shown in Figure 16.
  • Step 4 The side connection process, connect the first trace 11 and the second trace 21 corresponding to the top and bottom by pad printing or transfer to realize the connection between the back IC signal line and the front data line and shift register signal line Connect as shown in Figure 9.
  • Step 5 Cover the side lines with light-shielding gel 5 (BM OC) by transfer or pad printing to prevent the side metal connecting lines from reflecting light and affecting the display effect, as shown in Figure 10.
  • BM OC light-shielding gel 5
  • the conventional chamfering process is replaced by attaching glue material, thereby reducing the frame width to achieve the effect of an ultra-narrow frame, and achieving an ultra-narrow frame (reducing the LED chip to the display Panel edge distance), it can also achieve higher pixel density (Pixels Per Inch, PPI) LED borderless display (compared to the chamfering process), and it can also reduce the opening of the chamfer.
  • the display panel provided by the embodiments of the present disclosure includes: a plurality of first traces on the display surface, a plurality of second traces on the back of the display, and a transition body on the side surface;
  • the outer surface of the body facing away from the side is arc-shaped at the corner position, and then, when the outer surface of the transition body is covered with the connecting line, since the transition body has an arc shape at the corner position, the connecting line can be smoothly transitioned at the corner position Therefore, the problem that the connecting lines on the sides of the display panel in the related art are easily broken can be improved, and the problem that the connecting lines are easily broken when there are sharp corners at the corner positions can be avoided.
  • the transition body is formed on the side of the display panel, which can avoid the use of the chamfering process in the related art, and also can avoid the need to reserve a large width of chamfering and cutting margins that would cause the display panel Because of the problem of a wider frame, the embodiments of the present disclosure can achieve a narrow frame.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开公开了一种显示面板及制作方法所述显示面板，包括：衬底基板，所述衬底基板包括相对设置的显示面和显示背面，以及连接所述显示面和所述显示背面的侧面；形成在所述衬底基板的所述显示面上的多条第一走线；形成在所述衬底基板的所述显示背面上的多条第二走线；位于所述衬底基板的所述侧面上并且分别与所述第一走线和所述第二走线接触的过渡体，所述过渡体的背离所述侧面的表面形成为平滑曲面；多条连接线，覆盖于所述过渡体的外表面，且用于将各所述第一走线与对应的所述第二走线电连接。

Description

显示面板及制作方法
相关申请的交叉引用
本申请主张在2019年6月12日在中国提交的中国专利申请号No.201910505347.4的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板及制作方法。
背景技术
微发光二极管(Micro-led)由于其自发光、发光效率高、对比度高、工作温度范围宽、寿命长、功耗低、对水和氧的阻绝性优良，以及非常快的响应时间等优良特性，正受到越来越多的人的关注。
近来随着拼接显示的广泛应用以及拼缝尺寸的不断减小，使用微发光二极管的拼接显示面板对于超窄边框的要求越来越高。为了减小大尺寸拼接显示的拼缝，提高分辨率，通常采用双面工艺及侧边连线工艺方案。不过当前相关技术中的显示面板在超窄边框限制以及工艺可靠性方向仍有待提高。
发明内容
本公开实施例提供一种显示面板，包括：
衬底基板，所述衬底基板包括相对设置的显示面和显示背面，以及连接所述显示面和所述显示背面的侧面；
形成在所述衬底基板的所述显示面上的多条第一走线；
形成在所述衬底基板的所述显示背面上的多条第二走线；
位于所述衬底基板的所述侧面上并且分别与所述第一走线和所述第二走线接触的过渡体，所述过渡体的背离所述侧面的表面形成为平滑曲面；
多条连接线，覆盖于所述过渡体的外表面，且用于将各所述第一走线与对应的所述第二走线电连接。
可选地，所述过渡体包括与所述第一走线接触的第一端部以及与所述第 二走线接触的第二端部，所述第一端部和所述第二端部的背离所述侧面的外表面在拐角位置处为弧状。
可选地，所述第一走线与所述第一端部之间的接触面与所述衬底基板的边缘齐平，所述第二走线与所述第二端部之间的接触面与所述衬底基板的边缘齐平。
可选地，所述第一端部的上端与所述第一走线的背离所述显示面的外表面齐平，所述第二端部的下端与所述第二走线的背离所述显示背面的外表面齐平。
在一种可能的实施方式中，所述过渡体由胶体构成，所述胶体的热膨胀系数与所述连接线的热膨胀系数相同。
在一种可能的实施方式中，在垂直于所述侧面的方向上，所述过渡体的最大厚度不超过10微米。
在一种可能的实施方式中，所述过渡体背离所述侧面的外表面在拐角位置处为圆弧状或椭圆弧状。
在一种可能的实施方式中，还包括包覆所述连接线外表面的遮光胶体。
本公开实施例还提供一种显示面板的制作方法，所述制作方法包括：
在衬底基板的显示面上形成多条第一走线；
在所述衬底基板上位于所述显示面相对侧的显示背面上形成多条第二走线；
在所述衬底基板的连接所述显示面和所述显示背面的侧面上形成过渡体，其中，所述过渡体分别与所述第一走线和所述第二走线接触，并且过渡体的背离所述侧面的表面形成为平滑曲面；
形成覆盖所述过渡体的外表面的多条连接线，所述连接线将所述第一走线与对应的第二走线电连接。
在一种可能的实施方式中，所述在所述衬底基板的侧面形成过渡体，包括：
在所述衬底基板的所述侧面形成胶体；
对所述胶体加热，以使所述胶体的背离所述侧面的外表面在拐角位置处形成弧状。
在一种可能的实施方式中，所述在所述衬底基板的所述侧面形成胶体，包括：
通过转印或移印的方式，在所述衬底基板的侧面贴附所述胶体。
在一种可能的实施方式中，所述在所述过渡体的外表面形成多条连接线，包括：
通过转印或移印的方式，在所述过渡体的背离所述侧面的一面形成多条所述连接线。
在一种可能的实施方式中，在所述过渡体的外表面形成多条连接线之后，所述制作方法还包括：
通过转印或移印的方式，在所述连接线的外表面形成遮光胶体。
在一种可能的实施方式中，在所述衬底基板的所述显示面形成多条第一走线之前，所述制作方法还包括：
通过激光切割工艺，切割母板以获得多个所述显示面板。
附图说明
图1为一种显示面板正面、背面以及剖面的示意图；
图2为一种显示面板在切割前的剖视示意图；
图3为一种显示面板在切割后的剖视示意图；
图4为一种显示面板在进行倒角工艺后的剖视示意图；
图5为一种显示面板在形成连接线后的剖视示意图；
图6为一种显示面板在形成遮光胶体后的剖视示意图；
图7为一种显示面板的侧边连接线的俯视示意图；
图8为一种显示面板的侧边连接线的剖视示意图；
图9为本公开实施例提供的一种显示面板的剖视结构示意图；
图10为本公开实施例提供的一种包括有遮光胶体的显示面板的剖视结构示意图；
图11为本公开实施例提供的一种显示面板的制作流程示意图；
图12为本公开实施例提供的一种具体的显示面板的制作流程示意图；
图13为本公开实施例提供的显示面板在切割前的剖视结构示意图；
图14为本公开实施例提供的显示面板在切割后的剖视结构示意图；
图15为本公开实施例提供的显示面板在形成胶体后的剖视结构示意图；
图16为本公开实施例提供的显示面板在对胶体加热后的剖视结构示意图。
具体实施方式
为了使得本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
为了保持本公开实施例的以下说明清楚且简明，本公开省略了已知功能和已知部件的详细说明。
为了实现Micro-led的超窄边框，以减小大尺寸拼接显示的拼缝，提高分辨率，双面工艺及侧边连线工艺方案应运而生，参见图1所示，其中，图1中的a图为显示面板的正面示意图，b图为显示面板的背面示意图，c图为显示面板的剖视示意图，即，像素电路及移位寄存器等电路均设计于面板(Panel)的正面，扇形走线区(Fanout)及芯片(IC/FPC)设计于面板(Panel)的背面，IC绑定(bonding)于Panel背面，通过侧边连线方法将IC信号从Fanout及侧边线路传输到正面数据线及移位寄存器。
通常的侧边连线工艺流程如下：1、玻璃基板通过激光切割(laser cut)的方式切割成显示面板(Laser cut目的：提高切割精度，提高Panel边缘品质)，如图2和图3所示，图2为未切割前显示面板的剖视示意图，图3为切割后的显示面板的剖视示意图，其中，显示面板具体包括位于显示区的像素单元013，像素区走线012，以及位于衬底基板01的显示面010的第一走线011，位于显示背面020的第二走线021，衬底基板01留有激光切割边距d1，倒角切割边距d2，侧边连线边距d3，遮光胶体边距d4；2、采用倒角(chamfer)工艺对Panel上下边缘进行倒角处理(防止切割边缘90°角处侧边线路断路)，如图4所示；3、侧边连线(Side wiring)工艺，通过移印或转印的方式通过连接线04将上下对应的side wiring pin连接，实现背面IC信号与正面数据线及移位寄存器信号的传输，如图5所示；4、通过转印或移印等方法在侧边线路上覆盖遮光胶体05(BM OC材料)，如图6所示。
激光切割精度：±20um，chamfer最小尺寸目前能做到50～100um左右，侧边连线工艺精度mini.±20um，BM OC精度：±20um。
采用上述的侧边连线工艺流程，参考上述工艺精度，倒角工艺尺寸成为限制超窄边框(或无边框)的最大限制，且倒角工艺后，倒角例如呈45度，侧边线路仍有部分(如图5虚线圈所在位置处)容易出现断裂(Open不良)，如图7所示，图7为倒角工艺后侧边连线转角处示意图，且倒角工艺不良(如图8)也可能会导致侧边连接线断路。
基于此，本公开实施例提供一种显示面板，参见图9所示，包括：
衬底基板1，衬底基板1包括相对设置的显示面10和显示背面20，以及连接显示面10和显示背面20的侧面30，衬底基板具体例如可以为玻璃衬底基板；
多条第一走线11，位于衬底基板1的显示面10；
多条第二走线21，位于衬底基板1的显示背面20；
过渡体3，位于衬底基板1的侧面30，分别与第一走线11和第二走线21接触，过渡体3的背离所述侧面30的表面形成为平滑曲面，其中可选地，过渡体3包括与所述第一走线11相对的第一端部(如图9中过渡体3的上端)以及与第二走线21相对的第二端部(如图9中过渡体3的下端)，第一端部 和第二端部的背离侧面30的外表面在拐角位置处(如图9虚线圈所标位置处)为弧状；
多条连接线4，覆盖于过渡体3的外表面，且用于将各第一走线11与对应的第二走线21电连接。
本公开实施例提供的显示面板，包括：位于显示面10的多条第一走线11，位于显示背面20的多条第二走线21，位于侧面30的过渡体3，其中，过渡体3背离侧面30的外表面在拐角位置处为弧状，进而，在后续工艺中在过渡体3的外表面覆盖连接线4时，由于过渡体3在拐角位置处为弧形状，可以使连接线4在该拐角位置处进行平缓过渡，进而可以改善相关技术中的显示面板存在侧边的连接线容易断裂的问题，避免拐角位置处存在尖角时，会容易导致连接线容易断裂的问题。另外，本公开实施例中，在显示面板的侧面形成过渡体，无需采用相关技术中的倒角工艺，进而也可以避免需要预留较大宽度的倒角切割边距时会导致显示面板的边框较宽的问题，进而本公开实施例可以实现窄边框化。
在具体实施时，第一走线11具体可以为数据线，也可以为用于为显示面其它部件的走线，例如，具体可以也为移位寄存器提供信号的走线。连接线4为多条，每一连接线4将一条第一走线11与对应的一条第二走线21连接。过渡体3的第一端部的上端可以与第一走线11的背离显示面10的外表面齐平，第二端部的下端可以与第二走线21的背离显示背面20的外表面齐平。连接线4具体可以覆盖第一走线11、覆盖第二走线21，同时也覆盖连接线3。本公开实施例的显示面板具体可以为由微发光二极管构成的显示面。
在具体实施时，结合图9所示，第一走线11的一侧边缘可以与衬底基板1的右侧边缘齐平，即，如图9中，第一走线11的右侧边缘与衬底基板1的右侧边缘均与图9中右起的第二条虚线对齐。同样地，第二走线21的一侧边缘可以与衬底基板1的右侧边缘齐平，即，如图9中，第二走线21的右侧边缘与衬底基板1的右侧边缘均与图9中右起的第二条虚线对齐。即，本公开实施例中，第一走线11的一侧边缘与衬底基板1的右侧边缘齐平，第二走线21的一侧边缘与衬底基板1的右侧边缘齐平。
当然，根据具体的应用和设计需求，位于本公开的显示面板右侧边缘处 的过渡体3，也可以在不同于上述第二条虚线的位置处与第一走线11和/或第二走线21的右侧边缘接合，只要该过渡体3的背离衬底基板1的外侧表面形成平滑曲面、使得连接线4在拐角位置处能够平缓过渡即可。
如上所述，在制作过程中，由于不需要采用chamfer倒角工艺，进而也不需要预留倒角区域(chamfer margin)，进而可以较大程度地减小显示面板的边框宽度，使显示面板实现窄边框化。
在具体实施时，第一走线11与第二走线21的材质具体可以相同。过渡体3具体可以为胶体，胶体的热膨胀系数与连接线4的热膨胀系数相同。本公开实施例中，过渡体3的材质为胶体，在具体制作时，可以通过贴附方式将胶体贴附在衬底基板1的侧面30，在衬底基板1的侧面30形成过渡体3的方式简单，且过渡体3在衬底基板1侧面30的附着力较强，也有利于后续在过渡体3的外表面形成连接线4，而且，过渡体3为胶体，通过加热的方式即可使其在拐角的位置处形成弧状，即，使过渡体3的外表面在拐角位置处为弧状的形式方式也较为简单。另外，本公开实施例中，胶体的热膨胀系数与连接线4的热膨胀系数相同，可以在防止电流流经侧边连接线4，使连接线4发热时，若胶材和侧边连接线4膨胀系数不同，易导致连接线4断裂的问题。
在具体实施时，结合图9所示，在由衬底基板1指向过渡体3的方向(如图9中箭头所指)上，过渡体的厚度d小于10微米。本公开实施例中，过渡体的厚度d小于10微米，有利于显示面板实现窄边框化。
在具体实施时，过渡体3背离侧面30的外表面在拐角位置处为圆弧状或椭圆弧状。
在具体实施时，参见图10所示，显示面板还包括包覆连接线4外表面的遮光胶体5。本公开实施例中，显示面板还包括包覆连接线4外表面的遮光胶体5，可以避免连接线4反光时，影响显示面板的显示。
基于同一发明构思，本公开实施例还提供一种如本公开实施例提供的显示面板的制作方法，参见图11所示，制作方法包括：
步骤S101、在衬底基板的显示面形成多条第一走线。
步骤S102、在衬底基板的显示背面形成多条第二走线。
步骤S103、在衬底基板的侧面形成过渡体，其中，过渡体的背离侧面的外表面在拐角位置处为弧状。
步骤S104、在过渡体的外表面形成多条连接线。具体的，可以通过转印或移印的方式，在过渡体的外表面形成多条连接线。
在具体实施时，对于步骤S103、在衬底基板的侧面形成过渡体，包括：
步骤S1031、在衬底基板的侧面形成胶体。具体的，可以通过转印或移印的方式，在衬底基板的侧面形成胶体。通过转印或移印方式形成胶体，在衬底基板侧面形成胶体的方式较为简单。当然，胶材的贴附方案也可以不仅限于移印、转印，也可通过溅射(sputter)、旋涂、曝光等方法实现。
步骤S1032、对胶体加热，以使胶体的背离侧面的外表面在拐角位置处形成弧状。
在具体实施时，参见图12所示，在步骤S104之后，即，在过渡体的外表面形成多条连接线之后，制作方法还包括：步骤S105、通过转印或移印的方式，在连接线的背离侧面的一面形成遮光胶体。
在步骤S101之前，即，在衬底基板的显示面形成多条第一走线之前，制作方法还包括：步骤S100、通过激光切割工艺，切割母板以获得多个所述衬底基板。
结合图13-图16所示，本公开实施例中，显示面板的具体制作工艺流程可以如下：
步骤一、形成有电路走线的玻璃基板通过激光切割的方式切割成显示面板(激光切割目的：提高切割精度，提高显示面板边缘品质)，如图13和图14所示，其中，图13为切割前的显示面板结构示意图，d1为预留存的激光切割边距，图14为切割后的显示面板的结构是示意图。
步骤二、通过转印或移印等方法在线路侧边形成过渡体3，如图15所示，过渡体3具体可以为胶材。
步骤三、通过加热等方法对胶材边缘进行处理，降低胶材边缘角度，呈弧形角度，如图16所示。
步骤四、侧边连线工艺，通过移印或转印的方式将上下对应的第一走线11和第二走线21连接，实现背面IC信号线与正面数据线及移位寄存器信号 线的连接，如图9所示。
步骤五、通过转印或移印等方法在侧边线路上覆盖遮光胶体5(BM OC)，防止侧边金属连接线反光影响显示效果，如图10所示。
即，本公开实施例中，显示面板切割完成后，通过贴附胶材的方式替代常规的倒角工艺，从而降低边框宽度以达到超窄边框的效果，实现超窄边框(降低LED芯片到显示面板边缘距离)，也可以可实现更高像素密度(Pixels Per Inch，PPI)的LED无边框显示(较倒角工艺)，也可以降低倒角处open不良。
本公开实施例有益效果如下：本公开实施例提供的显示面板，包括：位于显示面的多条第一走线，位于显示背面的多条第二走线，位于侧面的过渡体，其中，过渡体背离侧面的外表面在拐角位置处为弧状，进而，再在过渡体的外表面覆盖连接线时，由于过渡体在拐角位置处为弧形状，可以使连接线在该拐角位置处进行平缓过渡，进而可以改善相关技术中的显示面板存在侧边的连接线容易断裂的问题，避免拐角位置处存在尖角时，会容易导致连接线容易断裂的问题。另外，本公开实施例中，在显示面板的侧面形成过渡体，可以避免采用相关技术中的倒角工艺，进而也可以避免需要预留较大宽度的倒角切割边距时会导致显示面板的边框较宽的问题，进而本公开实施例可以实现窄边框化。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (14)

  1. 一种显示面板，包括：
    衬底基板，所述衬底基板包括相对设置的显示面和显示背面，以及连接所述显示面和所述显示背面的侧面；
    形成在所述衬底基板的所述显示面上的多条第一走线；
    形成在所述衬底基板的所述显示背面上的多条第二走线；
    位于所述衬底基板的所述侧面上并且分别与所述第一走线和所述第二走线接触的过渡体，所述过渡体的背离所述侧面的表面形成为平滑曲面；
    多条连接线，覆盖于所述过渡体的外表面，且用于将各所述第一走线与对应的所述第二走线电连接。
  2. 如权利要求1所述的显示面板，其中所述过渡体包括与所述第一走线接触的第一端部以及与所述第二走线接触的第二端部，所述第一端部和所述第二端部的背离所述侧面的外表面在拐角位置处为弧状。
  3. 如权利要求2所述的显示面板，其中所述第一走线与所述第一端部之间的接触面与所述衬底基板的边缘齐平，所述第二走线与所述第二端部之间的接触面与所述衬底基板的边缘齐平。
  4. 如权利要求2或3所述的显示面板，其中所述第一端部的上端与所述第一走线的背离所述显示面的外表面齐平，所述第二端部的下端与所述第二走线的背离所述显示背面的外表面齐平。
  5. 如权利要求1至4中任一项所述的显示面板，其中，所述过渡体由胶体构成，所述胶体的热膨胀系数与所述连接线的热膨胀系数相同。
  6. 如权利要求5所述的显示面板，其中，在垂直于所述侧面的方向上，所述过渡体的最大厚度不超过10微米。
  7. 如权利要求1所述的显示面板，其中，所述过渡体背离所述侧面的外表面在拐角位置处为圆弧状或椭圆弧状。
  8. 如权利要求1所述的显示面板，还包括包覆所述连接线外表面的遮光胶体。
  9. 一种显示面板的制作方法，包括：
    在衬底基板的显示面上形成多条第一走线；
    在所述衬底基板上位于所述显示面相对侧的显示背面上形成多条第二走线；
    在所述衬底基板的连接所述显示面和所述显示背面的侧面上形成过渡体，其中，所述过渡体分别与所述第一走线和所述第二走线接触，并且过渡体的背离所述侧面的表面形成为平滑曲面；
    形成覆盖所述过渡体的外表面的多条连接线，所述连接线将所述第一走线与对应的第二走线电连接。
  10. 如权利要求9所述的制作方法，其中，所述在所述衬底基板的侧面形成过渡体，包括：
    在所述衬底基板的所述侧面形成胶体；
    对所述胶体加热，以使所述胶体的背离所述侧面的外表面在拐角位置处形成弧状。
  11. 如权利要求10所述的制作方法，其中，所述在所述衬底基板的所述侧面形成胶体，包括：
    通过转印或移印的方式，在所述衬底基板的侧面贴附所述胶体。
  12. 如权利要求9所述的制作方法，其中，所述在所述过渡体的外表面形成多条连接线，包括：
    通过转印或移印的方式，在所述过渡体的外表面形成多条所述连接线。
  13. 如权利要求9所述的制作方法，其中，在所述过渡体的外表面形成多条连接线之后，所述制作方法还包括：
    通过转印或移印的方式，在所述连接线的背离所述侧面的一面形成遮光胶体。
  14. 如权利要求9所述的制作方法，其中，在所述衬底基板的所述显示面形成多条第一走线之前，所述制作方法还包括：
    通过激光切割工艺，切割母板以获得多个所述显示面板。
PCT/CN2020/089084 2019-06-12 2020-05-08 显示面板及制作方法 WO2020248747A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/283,512 US20210399185A1 (en) 2019-06-12 2020-05-08 Display panel and manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910505347.4A CN110211973B (zh) 2019-06-12 2019-06-12 一种显示面板及制作方法
CN201910505347.4 2019-06-12

Publications (1)

Publication Number Publication Date
WO2020248747A1 true WO2020248747A1 (zh) 2020-12-17

Family

ID=67792176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/089084 WO2020248747A1 (zh) 2019-06-12 2020-05-08 显示面板及制作方法

Country Status (3)

Country Link
US (1) US20210399185A1 (zh)
CN (1) CN110211973B (zh)
WO (1) WO2020248747A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110211973B (zh) * 2019-06-12 2021-08-27 京东方科技集团股份有限公司 一种显示面板及制作方法
CN113644181B (zh) * 2020-05-11 2024-04-16 京东方科技集团股份有限公司 发光基板及其制造方法、显示装置
TWI742681B (zh) * 2020-05-21 2021-10-11 友達光電股份有限公司 顯示裝置
CN113751889A (zh) * 2020-05-29 2021-12-07 京东方科技集团股份有限公司 基板及其切割方法、电子器件及电子设备
CN113644085B (zh) 2020-08-14 2023-06-02 友达光电股份有限公司 电子装置及电子装置的制造方法
US11533811B2 (en) 2020-08-14 2022-12-20 Au Optronics Corporation Electronic device
CN114255665A (zh) * 2020-09-24 2022-03-29 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置及拼接显示装置
TWI738533B (zh) * 2020-10-07 2021-09-01 友達光電股份有限公司 顯示面板及其製作方法
CN113437025A (zh) * 2021-06-10 2021-09-24 深圳市华星光电半导体显示技术有限公司 阵列基板侧面走线制造方法及拼接显示面板
CN113386484A (zh) * 2021-06-11 2021-09-14 深圳市华仁三和科技有限公司 一种窄边框屏幕的制作工艺
CN115691349A (zh) * 2021-07-29 2023-02-03 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置及拼接显示装置
WO2023065369A1 (zh) * 2021-10-22 2023-04-27 京东方科技集团股份有限公司 显示面板、显示装置及拼接显示装置
CN114203042A (zh) * 2021-12-10 2022-03-18 惠州华星光电显示有限公司 显示面板、显示面板的制作方法以及显示装置
CN220526563U (zh) * 2022-01-27 2024-02-23 厦门市芯颖显示科技有限公司 显示基板及显示面板
CN116964660A (zh) * 2022-02-25 2023-10-27 京东方科技集团股份有限公司 显示面板、显示装置及拼接显示装置
WO2023184120A1 (zh) * 2022-03-28 2023-10-05 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制备方法
CN115207020A (zh) * 2022-06-08 2022-10-18 深圳市华星光电半导体显示技术有限公司 显示面板的制作方法及显示面板
CN115019655B (zh) * 2022-06-21 2024-04-02 Tcl华星光电技术有限公司 显示面板及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130049231A1 (en) * 2011-08-26 2013-02-28 Rohm Co., Ltd. Semiconductor device and method for making the same
CN103217845A (zh) * 2013-04-22 2013-07-24 京东方科技集团股份有限公司 下基板及其制造方法、液晶显示面板和液晶显示器
CN106710451A (zh) * 2017-03-06 2017-05-24 京东方科技集团股份有限公司 柔性显示面板的支撑轴制作方法及柔性显示面板
CN108957878A (zh) * 2018-07-19 2018-12-07 武汉天马微电子有限公司 显示模组及其制备方法和显示装置
CN109509776A (zh) * 2018-11-22 2019-03-22 武汉华星光电技术有限公司 一种oled显示器
CN109739057A (zh) * 2019-02-28 2019-05-10 京东方科技集团股份有限公司 显示装置及显示基板的绑定方法
CN110211973A (zh) * 2019-06-12 2019-09-06 京东方科技集团股份有限公司 一种显示面板及制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025901A (en) * 1995-08-14 2000-02-15 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
ATE450895T1 (de) * 1999-07-21 2009-12-15 E Ink Corp Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen
CN104741796B (zh) * 2015-04-20 2016-05-04 京东方科技集团股份有限公司 一种液晶显示面板、其制作方法及显示装置
CN108878483A (zh) * 2018-06-22 2018-11-23 武汉华星光电半导体显示技术有限公司 显示面板及电子设备
CN109410767A (zh) * 2018-12-19 2019-03-01 武汉华星光电半导体显示技术有限公司 显示装置和显示装置的制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130049231A1 (en) * 2011-08-26 2013-02-28 Rohm Co., Ltd. Semiconductor device and method for making the same
CN103217845A (zh) * 2013-04-22 2013-07-24 京东方科技集团股份有限公司 下基板及其制造方法、液晶显示面板和液晶显示器
CN106710451A (zh) * 2017-03-06 2017-05-24 京东方科技集团股份有限公司 柔性显示面板的支撑轴制作方法及柔性显示面板
CN108957878A (zh) * 2018-07-19 2018-12-07 武汉天马微电子有限公司 显示模组及其制备方法和显示装置
CN109509776A (zh) * 2018-11-22 2019-03-22 武汉华星光电技术有限公司 一种oled显示器
CN109739057A (zh) * 2019-02-28 2019-05-10 京东方科技集团股份有限公司 显示装置及显示基板的绑定方法
CN110211973A (zh) * 2019-06-12 2019-09-06 京东方科技集团股份有限公司 一种显示面板及制作方法

Also Published As

Publication number Publication date
CN110211973B (zh) 2021-08-27
CN110211973A (zh) 2019-09-06
US20210399185A1 (en) 2021-12-23

Similar Documents

Publication Publication Date Title
WO2020248747A1 (zh) 显示面板及制作方法
CN108122497B (zh) 一种柔性阵列基板、柔性显示装置及组装方法
WO2021012458A1 (zh) 无缝拼接屏
KR101887573B1 (ko) 액정표시장치
WO2020019421A1 (zh) Led背光装置及led显示装置
WO2020233241A1 (zh) 显示模组和电子设备
US20190049794A1 (en) Backlight module and liquid crystal display device
WO2021175320A1 (zh) 阵列基板及其制备方法、发光基板和显示装置
WO2021078054A1 (zh) 显示模组和电子设备
WO2019223726A1 (zh) 触控显示装置及其制造方法
WO2022100335A1 (zh) 显示面板、电子装置
WO2019169882A1 (zh) 触控基板及其制造方法和显示装置
WO2022062723A1 (zh) 显示面板及其制备方法、显示装置及拼接显示装置
WO2019000637A1 (zh) 背光模组及显示装置
US20210183897A1 (en) Substrate and method for manufacturing the same, display panel, and display apparatus
JP3869120B2 (ja) Ｌｅｄ表示装置およびその製造方法
WO2021051739A1 (zh) 一种柔性电路板、触控显示面板和触控显示装置
TWM447541U (zh) 觸控面板
WO2023142698A1 (zh) 阵列基板及其制备方法、显示面板及显示装置
CN206879210U (zh) 一种新型柔性线路板及新型显示装置
CN114927071A (zh) 显示模组和显示装置
CN209248970U (zh) 一种全反射柔性触控液晶显示装置
US11132094B2 (en) Electronic apparatus
WO2022227121A1 (zh) Oled 显示面板
WO2023108745A1 (zh) 双面显示面板及双面显示拼接屏

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20822670

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20822670

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 20822670

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 22/07/2022)

122 Ep: pct application non-entry in european phase

Ref document number: 20822670

Country of ref document: EP

Kind code of ref document: A1