WO2020218139A1 - Film de polymère à cristaux liquides thermoplastique, stratifié, et article moulé, et leurs procédés de production - Google Patents

Film de polymère à cristaux liquides thermoplastique, stratifié, et article moulé, et leurs procédés de production Download PDF

Info

Publication number
WO2020218139A1
WO2020218139A1 PCT/JP2020/016680 JP2020016680W WO2020218139A1 WO 2020218139 A1 WO2020218139 A1 WO 2020218139A1 JP 2020016680 W JP2020016680 W JP 2020016680W WO 2020218139 A1 WO2020218139 A1 WO 2020218139A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
crystal polymer
thermoplastic liquid
polymer film
heat
Prior art date
Application number
PCT/JP2020/016680
Other languages
English (en)
Japanese (ja)
Inventor
澤田 貴文
光則 浅田
紀久雄 有本
Original Assignee
株式会社クラレ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72942638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2020218139(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 株式会社クラレ filed Critical 株式会社クラレ
Priority to JP2021516047A priority Critical patent/JP7024141B2/ja
Priority to KR1020217036848A priority patent/KR102518008B1/ko
Priority to CN202080030360.XA priority patent/CN113727832B/zh
Publication of WO2020218139A1 publication Critical patent/WO2020218139A1/fr
Priority to JP2022018581A priority patent/JP2022070936A/ja

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/20Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19Hydroxy compounds containing aromatic rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Definitions

  • the present invention relates to a film, a laminate, and a molded product, which are made of a polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as a thermoplastic liquid crystal polymer) and have excellent heat resistance, and a method for producing the same. ..
  • a high-density circuit is manufactured by forming a metal-clad laminate composed of a non-metal layer and a metal layer into multiple layers via the non-metal layer.
  • a thermosetting resin such as a phenol resin or an epoxy resin is mainly used as a non-metal layer in a printed wiring board / circuit, and the printed wiring board / circuit is manufactured by laminating it with a metal layer such as a copper foil.
  • a thermosetting resin it takes time for a thermosetting resin to be properly laminated by a heating reaction.
  • thermoplastic liquid crystal polymer material can be expected to have an effect of improving productivity by taking advantage of the fact that it is a thermoplastic resin, and also in terms of physical properties, it has an extremely low water absorption rate and dielectric compared to other materials. Due to the loss, it is attracting a lot of attention as a representative of high frequency transmission applications.
  • Thermoplastic liquid crystal polymer materials can be multi-layered by thermocompression bonding using thermoplasticity, but on the other hand, heat resistance is also required for multi-layering. That is, even when the non-metal layer used for multi-layering is appropriately softened and plasticized and the laminate is manufactured under the condition that the laminate is firmly adhered to the metal layer or the non-metal layer of the laminate.
  • the non-metal layer of the above has high heat resistance, a stable product with a wide process window (optimal range of manufacturing conditions) can be manufactured.
  • Patent Document 1 Patent No. 4004139
  • Patent Document 2 Patent No. 4138995
  • a method for manufacturing a metal laminate composed of a metal layer and a multilayer laminate having a non-metal layer is described.
  • Patent Document 3 Japanese Patent No. 389930
  • a plurality of sheet materials made of a thermoplastic resin are laminated, and the laminated sheet materials are held one by one in a sheet material holder.
  • a multilayer substrate can be manufactured without utilizing a conventional batch type vacuum chamber. Therefore, according to the manufacturing method, the production efficiency can be significantly improved as compared with the process using the conventional batch type vacuum chamber.
  • Patent Document 4 Patent No. 3878741 describes a method of raising the melting point of a thermoplastic liquid crystal polymer having a melting point of 300 ° C. or less to 300 ° C. or higher. Is described.
  • Japanese Patent No. 4004139 Japanese Patent No. 4138995 Japanese Patent No. 389930 Japanese Patent No. 3878741
  • thermoplastic liquid crystal polymer film having a low melting point is used.
  • heat treatment for 4 hours or more in multiple steps is required, which causes a problem of poor productivity.
  • thermoplastic resin undergoes a hydrolysis reaction, and for example, in the case of a thermoplastic liquid crystal polymer or the like, the fluidity of the resin is increased.
  • the position of the conductor pattern becomes larger and the position of the conductor pattern shifts, or voids are generated in the resin film.
  • thermoplastic liquid crystal polymer films Therefore, there is a limit to the improvement of equipment and adhesives in order to widen the process window when multi-layering using a thermoplastic liquid crystal polymer film, and the demand for further multi-layering has not been fully satisfied. In addition, simply raising the melting point has not been able to satisfy market demands, including productivity during the production of thermoplastic liquid crystal polymer films.
  • an object of the present invention is to provide a thermoplastic liquid crystal polymer film, a laminate, and a molded product having a wide process window when performing multilayering, and a method capable of easily producing these.
  • the integrated strength of 26 degrees is A
  • B / A ⁇ 100 UC
  • the thermoplastic liquid crystal polymer film in which UC exists in a specific range is
  • the crystal structure is controlled by a mechanism different from that of the conventional heat resistance step to heat the heat, and such a thermoplastic liquid crystal polymer film requires the time required for crystal formation according to the required heat resistance. Since it can be controlled, not only the time required for heat resistance is shortened, but also it has been found that it has a wide process window derived from high heat resistance in both the lamination process and the circuit processing process, and the present invention has been completed. It was.
  • the present invention can be configured in the following aspects.
  • Aspect 1 It is composed of a polymer (hereinafter referred to as a thermoplastic liquid crystal polymer) capable of forming an optically anisotropic molten phase.
  • a polymer hereinafter referred to as a thermoplastic liquid crystal polymer
  • the profile of the main peak at 2 ⁇ 22.3 to 24.3 degrees.
  • thermoplastic liquid crystal polymer film according to aspect 1 which satisfies the following formula (2). 0.1 ⁇ UC ⁇ 1.5 (2)
  • endothermic peak position that appears when the temperature is raised at a rate of 10 ° C./min in the temperature range of room temperature to 400 ° C. using a differential scanning calorimeter is 310 ° C. or higher (preferably 315 ° C. or higher, more preferably 320 ° C. or higher).
  • thermoplastic liquid crystal polymer film according to any one of aspects 1 to 3.
  • a laminate comprising at least one layer of the thermoplastic liquid crystal polymer film according to any one of aspects 1 to 4.
  • the metal layer is composed of copper, a copper alloy, an aluminum, an aluminum alloy, a nickel, a nickel alloy, an iron, an iron alloy, a silver, a silver alloy, and at least one selected from a composite metal type thereof.
  • the heat treatment is a heat treatment of one step or more steps, if the melting point of the thermotropic liquid crystal polymer was Tm 0, Tm 0 ° C. or less, preferably followed by a first heat treatment at (Tm 0 -2) °C less heat
  • the method for producing a thermoplastic liquid crystal polymer film according to the eleventh aspect [Aspect 13] The thermoplastic liquid crystal polymer film according to aspect 11 or 12, wherein at least one selected from a hot air oven, a steam oven, an electric heater, an infrared heater, a ceramic heater, a heat roll, a heat press, and an electromagnetic wave irradiator is used as a heat source. Manufacturing method.
  • the heat treatment is a heat treatment of one step or more steps, if the melting point of the thermotropic liquid crystal polymer was Tm 0, Tm 0 ° C. or less, preferably followed by a first heat treatment at (Tm 0 -2) °C less heat
  • the method for producing a laminate according to aspect 15, wherein the laminate is made.
  • the rate of increase in the melting point of the thermoplastic liquid crystal polymer means that the thermoplastic liquid crystal polymer film (raw material film) is set between a normal temperature (for example, 25 ° C.) and a predetermined temperature (for example, 400 ° C.) in the differential scanning calorimetry.
  • a normal temperature for example, 25 ° C.
  • a predetermined temperature for example, 400 ° C.
  • the temperature at which the heat absorption peak appears during reheating is set to the melting point Tm 0 of the thermoplastic liquid crystal polymer, and the thermoplastic liquid crystal polymer film is heat-treated at a temperature of Tm 0-10 ° C. for 1 hour, and then the differential is shown.
  • Tm' the temperature at which the heat absorption peak appears when heated from room temperature (for example, 25 ° C.) to a predetermined temperature (for example, 400 ° C.)
  • Rtm (Tm'-Tm 0 ) / 60. It is a calculated value.
  • the temperature change rate (heating rate, temperature lowering rate) in the above differential scanning calorimetry may be 10 ° C./min.
  • the laminated body means a structure in which an adherend is laminated on a thermoplastic liquid crystal polymer film
  • the molded body means a circuit or the like formed on the thermoplastic liquid crystal polymer film. It means a structure.
  • thermoplastic liquid crystal polymer film a laminate and a molded product having a wide process window during lamination and circuit processing due to its high heat resistance. Therefore, for example, multi-layer lamination, which has been complicated until now This leads to simplification of the process, and it is possible to manufacture the laminate at low cost. Further, it is possible to manufacture a super multi-layer laminated substrate without using special equipment or jigs.
  • thermoplastic liquid crystal polymer film of the present invention is composed of a thermoplastic liquid crystal polymer.
  • This thermoplastic liquid crystal polymer is composed of a melt-moldable liquid crystal polymer (or a polymer capable of forming an optically anisotropic molten phase), and the chemical composition of the melt-moldable liquid crystal polymer is particularly limited.
  • a thermoplastic liquid crystal polyester or a thermoplastic liquid crystal polyester amide having an amide bond introduced therein can be mentioned.
  • thermoplastic liquid crystal polymer may be a polymer in which an imide bond, a carbonate bond, an isocyanate-derived bond such as a carbodiimide bond or an isocyanurate bond is further introduced into an aromatic polyester or an aromatic polyester amide.
  • thermoplastic liquid crystal polymer used in the present invention include known thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polyesteramides derived from the compounds classified into (1) to (4) and derivatives thereof exemplified below. Can be mentioned. However, it goes without saying that the combination of various raw material compounds has an appropriate range in order to form a polymer capable of forming an optically anisotropic molten phase.
  • Aromatic or aliphatic diols (see Table 1 for typical examples)
  • Aromatic diamine, aromatic hydroxyamine or aromatic aminocarboxylic acid (see Table 4 for typical examples)
  • thermoplastic liquid crystal polymers obtained from these raw material compounds include copolymers having structural units shown in Tables 5 and 6.
  • a polymer containing p-hydroxybenzoic acid and / or 6-hydroxy-2-naphthoic acid as at least a repeating unit is preferable, and (i) p-hydroxybenzoic acid and 6-hydroxy-are particularly preferable.
  • a copolymer containing a repeating unit of an aromatic diol and at least one aromatic dicarboxylic acid is preferred.
  • thermoplastic liquid crystal polymer is a copolymer containing a repeating unit of p-hydroxybenzoic acid (A) and 6-hydroxy-2-naphthoic acid (B)
  • A p-hydroxybenzoic acid
  • B 6-hydroxy-2-naphthoic acid
  • A molar ratio
  • (A) / (B) 10/90 to 90/10 is preferable, 50/50 to 90/10 is more preferable, 75/25 to 90/10 is more preferable, and 75/25 to 85/15 is even more preferable.
  • 77/23 to 80/20 is particularly preferable.
  • aromatic diols and aromatic dicarboxylic acids for example, from the viewpoint of adjusting the molecular weight and the like.
  • Terephthalic acid may be included.
  • At least one aromatic hydroxycarboxylic acid selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, and 4,4'-dihydroxybiphenyl
  • At least one aromatic diol selected from the group consisting of hydroquinone, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether
  • at least one aromatic diol selected from the group consisting of terephthalic acid, isophthalic acid and 2,6-naphthalenedicarboxylic acid.
  • It may be a copolymer containing a repeating unit with a group dicarboxylic acid.
  • the possibility of forming the optically anisotropic molten phase referred to in the present invention can be determined by, for example, placing the sample on a hot stage, heating the sample in a nitrogen atmosphere, and observing the transmitted light of the sample.
  • the thermoplastic liquid crystal polymer film of the present invention is preferably composed of the thermoplastic liquid crystal polymer having a melting point increase rate Rtm of 0.20 ° C./min or more among the above copolymers. It may be more preferably 0.22 ° C./min or more, still more preferably 0.25 ° C./min or more, and even more preferably 0.26 ° C./min or more.
  • the upper limit of the melting point rise rate Rtm of the thermoplastic liquid crystal polymer is not particularly limited, but may be 1.0 ° C./min or less.
  • the melting point rise rate Rtm is calculated as follows. First, using a differential scanning calorimeter, a part of the thermoplastic liquid crystal polymer film is placed in a sample container, heated from room temperature (for example, 25 ° C.) to 400 ° C. at a rate of 10 ° C./min, and then to room temperature. The position of the heat absorption peak that appears when the film is cooled at a rate of 10 ° C./min and then raised again from room temperature to 400 ° C. at a rate of 10 ° C./min is the melting point peculiar to the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film. Measure as (hereinafter referred to as Tm 0 ).
  • thermoplastic liquid crystal polymer film used for the measurement of Tm 0 was treated for 60 minutes at Tm 0 -10 ° C., a part of the thermoplastic liquid crystal polymer films the process put into the sample container, to 400 ° C. from room
  • the position of the heat absorption peak that appears when the temperature is raised at a rate of 10 ° C./min is measured as the melting point Tm'of the thermoplastic liquid crystal polymer film heat-treated for 60 minutes in an atmosphere of Tm 0-10 ° C.
  • the melting point increase rate Rtm (° C./min) of the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film is calculated by the following formula.
  • Rtm (Tm'-Tm 0 ) / 60
  • the packing characteristics of crystals can be changed by a slight difference in the composition ratio of the monomers even when they are composed of the same type of monomers. Therefore, it is difficult to express the packing characteristics of crystals by the composition ratio of monomers or the like.
  • thermoplastic liquid crystal polymer has a rapid melting point rise rate Rtm
  • those skilled in the art can easily determine the presence or absence of crystal packing characteristics that contribute to heat resistance.
  • those skilled in the art can heat-treat a thermoplastic liquid crystal polymer having crystal packing characteristics that contribute to heat resistance without requiring undue trial and error to obtain a thermoplastic liquid crystal polymer film or the like having a predetermined crystal profile. it can.
  • the thermoplastic liquid crystal polymer preferably has a melting point (Tm 0 ) in the range of, for example, 300 to 380 ° C, more preferably 305 to 360 ° C, and even more preferably 310 to 350 ° C. Good.
  • Tm 0 melting point
  • the melting point can be obtained by observing the thermal behavior of the thermoplastic liquid crystal polymer sample as described above using a differential scanning calorimeter.
  • the thermoplastic liquid crystal polymer may have a melt viscosity of 30 to 120 Pa ⁇ s at a shear rate of 1000 / s at (Tm 0 + 20) ° C., preferably a melt viscosity of 50. It may have ⁇ 100 Pa ⁇ s.
  • thermoplastic liquid crystal polymer includes thermoplastic polymers such as polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylate, polyamide, polyphenylene sulfide, polyether ether ketone, and fluororesin, as long as the effects of the present invention are not impaired. , Various additives may be added. In addition, a filler may be added if necessary.
  • thermoplastic liquid crystal polymer film [Manufacturing method of thermoplastic liquid crystal polymer film, laminate or molded product]
  • a heat treatment is performed on a thermoplastic liquid crystal polymer film (film before heat resistance) composed of a thermoplastic liquid crystal polymer having a melting point rise rate Rtm of 0.20 ° C./min or more.
  • Rtm melting point rise rate
  • thermoplastic liquid crystal polymer film (film before heat resistance) is not particularly limited as long as it is composed of the thermoplastic liquid crystal polymer having a specific melting point rise rate Rtm, and for example, the thermoplastic liquid crystal polymer is cast-molded.
  • the film may be obtained by extrusion molding the melt-kneaded product of the thermoplastic liquid crystal polymer. Any method is used as the extrusion molding method, but the well-known T-die method, inflation method and the like are industrially advantageous.
  • the inflation method stress is applied not only in the mechanical axis direction (hereinafter abbreviated as MD direction) of the thermoplastic liquid crystal polymer film but also in the direction orthogonal to this (hereinafter abbreviated as TD direction), and the MD direction and TD direction are applied. Since it can be uniformly stretched in the direction, a thermoplastic liquid crystal polymer film having controlled molecular orientation, dielectric properties, etc. in the MD direction and the TD direction can be obtained.
  • MD direction mechanical axis direction
  • TD direction direction orthogonal to this
  • the melt sheet extruded from the T-die may be stretched not only in the MD direction of the thermoplastic liquid crystal polymer film but also in both the MD direction and the TD direction at the same time to form a film.
  • the melt sheet extruded from the T die may be once stretched in the MD direction and then stretched in the TD direction to form a film.
  • a predetermined draw ratio corresponding to the stretching ratio in the MD direction
  • a blow ratio corresponding to the stretching ratio in the TD direction
  • the draw ratio of such extrusion molding may be, for example, about 1.0 to 10 as the draw ratio (or draw ratio) in the MD direction, preferably about 1.2 to 7, and more preferably 1. It may be about 3 to 7. Further, the stretching ratio (or blow ratio) in the TD direction may be, for example, about 1.5 to 20, preferably about 2 to 15, and more preferably about 2.5 to 14.
  • thermoplastic liquid crystal polymer film (film before heat resistance, material film) thus obtained is heat-treated to be heat-treated.
  • the heat treatment method is not particularly limited as long as the heat-resistant thermoplastic liquid crystal polymer film has a specific crystal profile.
  • the thermoplastic liquid crystal polymer film (film before heat resistance) is directly heat-treated by roll-to-roll or the like.
  • the laminated body in which the once obtained thermoplastic liquid crystal polymer film (film before heat resistance) and the adherend are laminated may be heat-treated, or the thermoplastic liquid crystal polymer film (heat resistance) may be subjected to sputtering, plating, or the like.
  • the laminate in which the metal layer is directly formed on the front film) may be heat-treated.
  • Such a laminate can be manufactured by using a thermocompression bonding method such as a hot press, a hot roller, or a double belt press, but the present invention is not particularly limited thereto.
  • heat source for performing heat treatment
  • a known or conventional heat source can be used.
  • Preferred heat sources include, for example, hot air ovens, steam ovens, electric heaters, infrared heaters, ceramic heaters, heat rolls, heat presses, electromagnetic wave irradiators (eg, microwave irradiators, etc.) and the like. These heat sources may be used alone or in combination of two or more.
  • the heat resistance can be increased by one step or a plurality of steps of heat treatment, but in the thermoplastic liquid crystal polymer film of the present invention, the heat treatment is preferably carried out in one or two steps, more preferably in one step. Is preferably performed.
  • Tm 0 °C less preferably heat treated at (Tm 0 -2) °C or less May be done.
  • the heating temperature is preferably (Tm 0 -50) °C or higher, more preferably may be (Tm 0 -40) °C or higher.
  • the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer can be determined by the above-mentioned method for measuring the melting point.
  • the heat treatment is performed only by the first heat treatment, and in the multi-step heat treatment, after the first heat treatment, the heat treatment in the next step is performed at a heating temperature higher than the heat treatment temperature in the previous step. It may be done.
  • thermoplastic liquid crystal polymer film rises with heat treatment, but in the present invention, rapid heat resistance can be achieved. Therefore, if the heating temperature is determined based on the melting point (Tm 0 ) of the thermoplastic liquid crystal polymer. Good.
  • the heating temperature after the second heat treatment may be performed at a melting point (Tm 0 ) or higher of the thermoplastic liquid crystal polymer, if necessary.
  • Tm melting point
  • the maximum temperature reached in the heat treatment in a plurality of steps is (Tm). It may be 0 + 30) ° C. or lower, and preferably (Tm 0 + 20) ° C. or lower.
  • the heating time at each stage of the heat treatment can be appropriately set according to the heating temperature, the stage of the heat treatment, and the like.
  • the heating time may be, for example, about 10 minutes to 3 hours in total, preferably about 10 minutes to 2 hours (for example, about 30 minutes to 2 hours). ), More preferably about 10 minutes to 1.3 hours (for example, about 45 minutes to 1.3 hours).
  • the adherend is not particularly limited as long as it can be used as a support for heat treatment, and examples thereof include a metal layer and a heat-resistant resin layer.
  • the metal constituting the metal layer is not particularly limited as long as it is a conductive metal, and for example, copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, iron, iron alloy, silver, silver alloy, and Examples thereof include these composite metal species. These metals may contain other metal species at 2000 mass ppm or less, and may contain unavoidable impurities.
  • the thermoplastic liquid crystal polymer film portion can be used as it is as a heat-resistant laminate after heat treatment.
  • copper, copper alloy, silver, and silver alloy may be used when conductivity and heat dissipation are required, and iron alloy may be used when ferromagnetism is required, and inexpensive ones are required. If so, aluminum or the like may be used.
  • copper may be used as the metal species for the circuit board, and specifically, the metal layer contains 99.8% or more of copper by mass, and further, silver, tin, zinc, chromium, boron, etc. At least one other metal species selected from the group consisting of titanium, magnesium, phosphorus, silicon, iron, gold, placeodim, nickel, and cobalt is composed of less than 2000 mass ppm and copper with residual unavoidable impurities. You may.
  • a known method can be used as a method for forming a metal layer on the thermoplastic liquid crystal polymer film.
  • a metal layer may be vapor-deposited on a thermoplastic liquid crystal polymer film, or a metal layer may be formed by electroless plating or electroplating.
  • a metal foil (for example, a copper foil) may be laminated on the surface of the thermoplastic liquid crystal polymer film by thermocompression bonding.
  • the copper foil is not particularly limited as long as it can be used in a circuit board, and may be either a rolled copper foil or an electrolytic copper foil.
  • the resin constituting the heat-resistant resin layer examples include a resin having a melting point higher than the maximum reached temperature performed by heat treatment or a thermosetting resin, and preferably polyimide, polyphenylene ether, polyphenylene sulfide, and fluororesin (for example,). , Polytetrafluoroethylene) and the like.
  • thermoplastic liquid crystal polymer film A known method can be used as a method for forming the heat-resistant resin layer on the thermoplastic liquid crystal polymer film.
  • the heat-resistant resin film may be laminated on the surface of the thermoplastic liquid crystal polymer film by thermocompression bonding. ..
  • Ta and Tb are selected from the range of 0.1 to 500 ⁇ m, respectively. It is possible to do. From the viewpoint of thinning and weight reduction in recent years, Ta may be preferably about 1 to 175 ⁇ m, more preferably about 5 to 130 ⁇ m. Further, Tb may be preferably about 1 to 20 ⁇ m, more preferably about 2 to 15 ⁇ m.
  • the laminate has a multilayer structure of a thermoplastic liquid crystal polymer film and a metal layer, and includes at least one thermoplastic liquid crystal polymer film and at least one metal layer.
  • a laminated body having a multi-layer structure (I) Metal layer / Thermoplastic liquid crystal polymer film (ii) Metal layer / Thermoplastic liquid crystal polymer film / Metal layer (iii) Thermoplastic liquid crystal polymer film / Thermoplastic liquid crystal polymer film / Metal layer (iv) Thermoplastic liquid crystal polymer film / Metal layer / Thermoplastic liquid crystal polymer film (v) Metal layer / Thermoplastic liquid crystal polymer film / Thermoplastic liquid crystal polymer film / Metal layer (vi) metal layer / Thermoplastic liquid crystal polymer film / Metal layer / Thermoplastic liquid crystal polymer film / Examples thereof include those having a laminated structure such as a metal layer, but the present invention is not limited thereto.
  • thermoplastic liquid crystal polymer film may be used as a laminated body as it is in a state of being laminated with the adherend, or may be separated from the adherend and used alone as the thermoplastic liquid crystal polymer film. Further, the thermoplastic liquid crystal polymer film may be multi-layered via an appropriate adhesive layer. Examples of the adhesive layer include polyphenylene ether, epoxy resin, polyurethane, thermoplastic polyimide, polyetherimide and the like.
  • the molded product may be produced by post-processing the thermoplastic liquid crystal polymer film and / or the laminate.
  • a molded body (or unit circuit board) such as a wiring board may be manufactured by forming a conductor pattern on the surface of a thermoplastic liquid crystal polymer film. Further, a molded body (or unit circuit board) such as a wiring board may be manufactured by forming a conductor pattern on the metal layer of the laminated body. Further, a molded body (or circuit board) such as a wiring board may be manufactured by superimposing a unit circuit board on which a conductor pattern is formed on another substrate material to form a multilayer. Examples of the substrate material include the above-mentioned thermoplastic liquid crystal polymer film, metal layer, unit circuit board, and the like, and an adhesive layer may be used if necessary.
  • a molded product may be obtained by performing heat treatment. In that case, the polymer portion of the molded product has a specific range of UC, which will be described later.
  • thermoplastic liquid crystal polymer film, laminate and molded product In the thermoplastic liquid crystal polymer film, laminate, and molded body of the present invention, since crystals having a specific crystal structure (oblique crystal structure) are generated in the thermoplastic liquid crystal polymer by heat treatment, the thermoplastic liquid crystal polymer portion
  • the following equation (1) is satisfied, and more preferably the following equation (2) is satisfied. 0 ⁇ UC ⁇ 2.0 (1) 0.1 ⁇ UC ⁇ 1.5 (2)
  • the UC in the present invention can be regarded as an index of the uniformity (crystallinity) of the structure of the orthorhombic crystal.
  • the UC by wide-angle X-ray diffraction measurement is a value measured by the method described in Examples described later. From the above viewpoint, the UC is preferably 0.20 or more, more preferably 0.50 or more, further preferably 0.80 or more, further preferably 1.00 or more, and particularly preferably 1.25 or more.
  • the thermoplastic liquid crystal polymer portion is a parameter having a specific value derived from a specific crystal structure. By having UC, it is possible to increase the melting point even if the SC value is relatively low.
  • the full width at half maximum SC of the main peak is 1.7 or less.
  • 1.4 ⁇ SC ⁇ 1.7 it can be considered that a large number of orthorhombic crystals having a large crystallite size are generated in the film.
  • thermoplastic liquid crystal polymer film of the present invention has a heat absorption peak position that appears when the temperature is raised at a rate of 10 ° C./min in a temperature range of room temperature (for example, 25 ° C.) to 400 ° C. using a differential scanning calorimeter.
  • Tm melting point
  • the melting point (Tm) of the thermoplastic liquid crystal polymer film may be 310 ° C. or higher, preferably 315 ° C. or higher, and more preferably 320 ° C. or higher.
  • the upper limit of the melting point (Tm) is not particularly limited, but may be, for example, about 400 ° C.
  • the Tm / SC is, for example, 180 to 180 in the thermoplastic liquid crystal polymer film, laminate and molded product of the present invention. It may be about 240, preferably about 182 to 235, and more preferably about 185 to 230.
  • the greatest feature of the present invention is that the heat resistance required when used as a laminate or a molded product and the productivity of the laminate are described by the above parameters, which is a new thermoplastic liquid crystal that has never existed before. They have found polymer films, laminates and moldings.
  • thermoplastic liquid crystal polymer film already on the market, for example, a highly heat-resistant film having a melting point of 280 to 340 ° C. exists, but in such a thermoplastic liquid crystal polymer film, UC does not exist in a predetermined range.
  • heat resistance is mainly performed by a solid phase polymerization process, not by the formation of orthocrystals, so that heat treatment requires an enormous amount of time. It is disadvantageous in terms of productivity.
  • thermoplastic liquid crystal polymer film of the present invention laminated, even if it has the same melting point as the thermoplastic liquid crystal polymer film obtained by the prior art.
  • the UC is present in a specific range, so that the heat resistance and the productivity are high.
  • the melting point of the thermoplastic liquid crystal polymer film can be arbitrarily controlled to the same temperature as the conventional one.
  • thermoplastic liquid crystal polymer film, laminate, and molded product of the present invention not only have excellent heat resistance, but also have a wide process window, so that they can be suitably used in various applications.
  • a laminate having at least one thermoplastic liquid crystal polymer film and at least one metal layer can form a circuit pattern on the metal layer and is useful as a wiring board.
  • the molded body includes a plurality of circuit layers, the molded body is suitable as a multi-layer circuit board because it is possible to satisfy the demands for high density and high functionality.
  • thermoplastic liquid crystal polymer film, laminate and molded product of the present invention are not only excellent in productivity but also extremely high in heat resistance, so that they are used in applications such as high frequency circuit boards, in-vehicle sensors, mobile circuit boards, and antennas. Suitable, but not limited to, these.
  • thermoplastic liquid crystal polymer film was measured at 1 cm intervals in the TD direction, and the average value of 10 points arbitrarily selected from the center and edges was used as the film thickness. ..
  • thermoplastic liquid crystal polymer films obtained in Examples and Comparative Examples, placed in a sample container, and placed at 10 ° C. from room temperature to 400 ° C.
  • the position of the heat absorption peak that appears when the temperature is raised at a rate of / min is defined as the melting point Tm of the thermoplastic liquid crystal polymer film.
  • thermoplastic liquid crystal polymer film film before heat resistance
  • the temperature is 10 ° C./min from room temperature to 400 ° C.
  • the thermoplastic liquid crystal polymer film is used to determine the position of the heat absorption peak that appears when the temperature is raised to room temperature at a rate of 10 ° C / min and then raised again from room temperature to 400 ° C at a rate of 10 ° C / min.
  • the melting point of the constituent thermoplastic liquid crystal polymer was set to Tm 0 .
  • thermoplastic liquid crystal polymer film (film before heat resistance) was treated in an oven batch in an atmosphere of Tm 0-10 ° C. for 60 minutes.
  • the position was defined as the melting point Tm'of the treated thermoplastic liquid crystal polymer film, and the melting point increase rate Rtm (° C./min) of the thermoplastic liquid crystal polymer constituting the thermoplastic liquid crystal polymer film was calculated by the following formula.
  • Rtm (Tm'-Tm 0 ) / 60
  • thermoplastic liquid crystal polymer film was cut into 10 mm squares and attached to a standard sample holder. In order to increase the S / N ratio of the data, a plurality of thermoplastic liquid crystal polymer films were stacked so as to match the MD directions, and the thickness was adjusted to be about 0.5 mm.
  • the X-ray source was CuK ⁇
  • the filament voltage was 45 kV
  • the current was 110 mA.
  • a collimator of 0.3 mm was used.
  • thermoplastic liquid crystal polymer film A standard sample holder was attached to the device, and the position was adjusted so that X-rays would be emitted from the direction consistent with the normal of the thermoplastic liquid crystal polymer film. That is, X-rays were irradiated perpendicularly to the surface of the thermoplastic liquid crystal polymer film.
  • the distance (camera distance) between the thermoplastic liquid crystal polymer film and the detector was set to 100 mm.
  • a two-dimensional PSPC detector was used as the detector, and a two-dimensional diffraction image was acquired. The detector was placed behind the sample so that the normal of the thermoplastic liquid crystal polymer film, the normal of the detector, and the X-ray irradiation direction all coincided.
  • the exposure time was 600 seconds.
  • the obtained two-dimensional diffraction image was subjected to ring averaging processing and converted into a one-dimensional profile (data 1).
  • the range of the annulus average was 10 to 30 degrees at the diffraction angle (2 ⁇ ).
  • the azimuth range was 0 to 180 degrees.
  • the step of 2 ⁇ was set to 0.05 degrees.
  • the azimuth angle of 0 degrees was made to correspond to the MD direction of the thermoplastic liquid crystal polymer film.
  • the converted one-dimensional profile (data 1) was subjected to processing such as parasitic scattering using the background data (measurement data when the sample was not attached) acquired under the same conditions. That is, the background data was made into a one-dimensional profile and then subtracted from the data of the thermoplastic liquid crystal polymer film. This was used as data 2.
  • a baseline was set and subtracted from the background processed data 2.
  • the baseline was a linear function in which 2 ⁇ connects the intensity values at 14 degrees and 26 degrees in the data after background processing.
  • the intensity values at 14 degrees and 26 degrees were average values (interval 0.05 degrees) in the range of 13.8 to 14.2 degrees and 25.8 to 26.2 degrees, respectively.
  • the above linear function was subtracted from the data 2. This was used as data 3.
  • the integrated intensity was obtained in the range of 14 to 26 degrees with the diffraction angle 2 ⁇ , and the obtained integrated intensity was defined as A.
  • thermoplastic liquid crystal polymer film 1 and the metal foil 2 were superposed to prepare an assembly.
  • the metal foil Fukuda Metal Foil Powder Industry Co., Ltd. (CF-H9A-DS-HD2-12, thickness 12 ⁇ m) was used.
  • this assembly was heated from room temperature (25 ° C.) to 250 ° C. at 6 ° C./min, held for 15 minutes, and then raised to 300 ° C. at 6 ° C./min. After warming, thermocompression bonding was performed under the condition of a surface pressure of 4 MPa, and after 10 minutes, the temperature was lowered to 250 ° C. at 7 ° C./min, and after reaching 250 ° C., it was confirmed that the temperature reached 50 ° C. by quenching.
  • a metal-clad laminate 3 having a polymer film 1 and a metal foil 2 was produced.
  • the heat resistance of the solder float was measured by a method of examining whether or not the surface of the thermoplastic liquid crystal polymer film retains its original shape on a molten solder bath kept at a predetermined temperature. That is, the metal-clad laminate 3 was placed on a solder bath at 288 ° C. for 60 seconds, and morphological changes such as swelling and deformation of the surface of the thermoplastic liquid crystal polymer film were visually observed.
  • the evaluation criteria are as follows. A: No swelling or deformation was observed in the solder bath for 60 seconds. B: Blisters and severe deformation were observed in the solder bath for 60 seconds. Below, A in the table indicates pass, and B indicates failure.
  • thermoplastic liquid crystal polymer film The heat resistance due to the laminated flow was evaluated by observing changes in the shape of the thermoplastic liquid crystal polymer film at the four corners of the multilayer laminated substrate.
  • FIG. 2 two metal-clad laminates 3 obtained in FIG. 1 were laminated so that the thermoplastic liquid crystal polymer films 1 were overlapped with each other to prepare an assembly.
  • a SUS plate 4 and a cushioning material 5 are respectively arranged on the upper and lower surfaces of the assembly, the assembly is sandwiched, and thermocompression bonding is performed at 310 ° C. and a surface pressure of 2 MPa in a vacuum press to prepare a multilayer laminated substrate. ..
  • thermoplastic liquid crystal polymer film at the four corners of the produced multilayer laminated substrate were visually observed and evaluated according to the following criteria.
  • thermoplastic liquid crystal polymer As a typical example of the polymerization of the thermoplastic liquid crystal polymer, the method of Example 1 is as follows. 6.1 kg (23 mol parts) of p-hydroxybenzoic acid, 28.1 kg (77 mol parts) of 2-hydroxy-6-naphthoic acid, and 20.1 kg of acetic anhydride were added and acetylated (160 ° C., about under reflux). After 2 hours), the temperature was raised at 1 ° C./min, kept at 340 ° C., reduced pressure treatment (1000 Pa) was performed for 60 minutes, and melt polycondensation was performed.
  • reduced pressure treatment 1000 Pa
  • thermotropic liquid polyester having a molar ratio of 23 mol parts of 6-hydroxy-2-naphthoic acid unit and 77 mol parts of p-hydroxybenzoic acid unit was polymerized and extruded from an inflation die to a thickness of 50 ⁇ m.
  • a thermoplastic liquid crystal polymer film (film before heat resistance) was obtained.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 310 ° C.
  • the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 290 ° C. for 1 hour.
  • the Tm of the obtained thermoplastic liquid crystal polymer film was 328 ° C.
  • thermoplastic liquid crystal polymer film obtained in (2) above A metal-clad laminate and a multilayer laminate were produced using the thermoplastic liquid crystal polymer film obtained in (2) above.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • FIG. 3 is a graph showing the wide-angle X-ray diffraction profile (data 3) of the thermoplastic liquid crystal polymer film after the heat treatment obtained in Example 1.
  • thermotropic liquid polyester having a molar ratio of 23 mol parts of 6-hydroxy-2-naphthoic acid unit and 77 mol parts of p-hydroxybenzoic acid unit was polymerized and extruded from an inflation die to a thickness of 50 ⁇ m.
  • a thermoplastic liquid crystal polymer film (film before heat resistance) was obtained.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 310 ° C.
  • the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 310 ° C. for 1 hour.
  • the Tm of the obtained thermoplastic liquid crystal polymer film was 337 ° C.
  • thermoplastic liquid crystal polymer film obtained in (2) above A metal-clad laminate and a multilayer laminate were produced using the thermoplastic liquid crystal polymer film obtained in (2) above.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic polyester having a molar ratio of 20 mol parts of 6-hydroxy-2-naphthoic acid unit, 80 mol parts of p-hydroxybenzoic acid unit, and 1 mol part of terephthalic acid unit is polymerized and extruded from an inflation die. It was molded to obtain a thermoplastic liquid crystal polymer film (film before heat resistance) having a thickness of 50 ⁇ m.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 320 ° C.
  • the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 300 ° C. for 1 hour to prepare a film.
  • thermoplastic liquid crystal polymer film was 334 ° C.
  • a metal-clad laminate and a multilayer laminate were produced using the thermoplastic liquid crystal polymer film obtained in (2) above.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermotropic liquid polyester having a molar ratio of 20 mol parts of 6-hydroxy-2-naphthoic acid unit, 80 mol parts of p-hydroxybenzoic acid unit and 1 mol part of terephthalic acid was polymerized and extruded from an inflation die.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film (film before heat resistance) was 320 ° C.
  • the thermoplastic liquid crystal polymer film (film before heat resistance) obtained above was heat-treated at 320 ° C. for 1 hour to prepare a thermoplastic liquid crystal polymer film.
  • thermoplastic liquid crystal polymer film was 360 ° C.
  • a metal-clad laminate and a multilayer laminate were produced using the thermoplastic liquid crystal polymer film obtained in (2) above.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic polyester having a molar ratio of 27 mol parts of 6-hydroxy-2-naphthoic acid unit and 73 mol parts of p-hydroxybenzoic acid unit is polymerized and extruded from an inflation die to have a thermoplastic property having a thickness of 50 ⁇ m.
  • a liquid crystal polymer film was obtained.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 280 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced. The results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic polyester having a molar ratio of 23 mol parts of 6-hydroxy-2-naphthoic acid unit and 77 mol parts of p-hydroxybenzoic acid unit is polymerized and extruded from an inflation die to have a thermoplastic property having a thickness of 50 ⁇ m.
  • a liquid crystal polymer film was obtained.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 310 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced. The results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermotropic liquid polyester having a molar ratio of 20 mol parts of 6-hydroxy-2-naphthoic acid unit, 80 mol parts of p-hydroxybenzoic acid unit and 1 mol part of terephthalic acid is polymerized and extruded from an inflation die.
  • a thermoplastic liquid crystal polymer film having a thickness of 50 ⁇ m was obtained.
  • the Tm 0 of the thermoplastic liquid crystal polymer constituting the obtained thermoplastic liquid crystal polymer film was 320 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced. The results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic liquid crystal polymer film was 290 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic liquid crystal polymer film was 303 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced.
  • the results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic liquid crystal polymer film was 335 ° C.
  • thermoplastic liquid crystal polymer film obtained in (1) above a metal-clad laminate and a multilayer laminate were produced. The results of evaluation of wide-angle X-ray diffraction, solder float, and laminated flow of the obtained thermoplastic liquid crystal polymer film and multilayer laminated substrate are as shown in the table.
  • thermoplastic liquid crystal polymer film of Comparative Example 1 is heated for 7 hours to increase the heat resistance, which is insufficient in terms of productivity. Further, even when the heat resistance is increased, UC does not exist in a specific range in Comparative Example 6 because the orthorhombic crystal structure of the crystals in the film is not uniform.
  • thermoplastic liquid crystal polymer films are thermoplastic liquid crystal polymer films obtained by heat-treating a film having a specific range of Rtm in a short time of 1 hour, but sufficient heat resistance can be achieved.
  • thermoplastic liquid crystal polymer film having high orthorhombic uniformity as in Examples 1 to 4 satisfies both productivity and heat resistance.
  • a metal-clad laminate having such a thermoplastic liquid crystal polymer film it has a wide process window in both lamination and circuit processing, so that the laminate can be manufactured at low cost without using special equipment or jigs. It is possible to manufacture.
  • thermoplastic liquid crystal polymer film and laminated board of the present invention are suitable as materials for various molded bodies (for example, wiring boards), particularly as multilayer laminated circuit materials, and for example, printed wiring boards in the fields of electronics, electricity, and communication industries. It is useful in applications such as high frequency circuit boards, in-vehicle sensors, mobile circuit boards, and antennas.
  • Thermoplastic liquid crystal polymer film 2 ...
  • Metal layer (copper foil) 3 ...
  • Metal-clad laminate 4 ...
  • SUS plate 5 ... Cushion material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

La présente invention concerne un film de polymère à cristaux liquides thermoplastique, un stratifié et un article moulé qui présentent une large fenêtre de traitement dans l'exécution d'une multicouche de carte de câblage et qui présentent à la fois une résistance à la chaleur élevée et une productivité élevée. Le film de polymère à cristaux liquides thermoplastique est constitué d'un polymère à cristaux liquides thermoplastique qui est un polymère capable de former une phase de fusion optiquement anisotrope. Le profil de diffraction de la partie de polymère observée par la mesure de diffraction des rayons X à grand angle satisfait à la formule (1) : 0 ≤ UC ≤ 2,0 (1), où A est l'intensité intégrée au-dessus de la ligne de base à 2θ = 14-26°, B est l'intensité intégrée du profil de sous-pic après approximation du profil de pic principal à 2θ = 22,3-24,3° en tant que fonction linéaire et retrait de celui-ci, et B/A × 100 = UC.
PCT/JP2020/016680 2019-04-23 2020-04-16 Film de polymère à cristaux liquides thermoplastique, stratifié, et article moulé, et leurs procédés de production WO2020218139A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021516047A JP7024141B2 (ja) 2019-04-23 2020-04-16 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
KR1020217036848A KR102518008B1 (ko) 2019-04-23 2020-04-16 열가소성 액정 폴리머 필름, 적층체, 및 성형체, 그리고 그것들의 제조 방법
CN202080030360.XA CN113727832B (zh) 2019-04-23 2020-04-16 热塑性液晶聚合物膜、层叠体和成形体以及它们的制造方法
JP2022018581A JP2022070936A (ja) 2019-04-23 2022-02-09 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-082063 2019-04-23
JP2019082063 2019-04-23

Publications (1)

Publication Number Publication Date
WO2020218139A1 true WO2020218139A1 (fr) 2020-10-29

Family

ID=72942638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/016680 WO2020218139A1 (fr) 2019-04-23 2020-04-16 Film de polymère à cristaux liquides thermoplastique, stratifié, et article moulé, et leurs procédés de production

Country Status (5)

Country Link
JP (2) JP7024141B2 (fr)
KR (1) KR102518008B1 (fr)
CN (1) CN113727832B (fr)
TW (1) TWI793415B (fr)
WO (1) WO2020218139A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102671490B1 (ko) * 2022-04-04 2024-05-30 동우 화인켐 주식회사 연성 금속 적층 필름 및 이의 제조 방법
KR102634204B1 (ko) * 2022-04-04 2024-02-07 동우 화인켐 주식회사 연성 금속 적층 필름 및 이의 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0890570A (ja) * 1994-09-16 1996-04-09 Hoechst Celanese Corp 液晶ポリマーフイルムの処理方法
JP2006137786A (ja) * 2004-11-10 2006-06-01 Kuraray Co Ltd 熱可塑性液晶ポリマーフィルムおよびこれを用いた回路基板
WO2007013330A1 (fr) * 2005-07-27 2007-02-01 Kuraray Co., Ltd. Procédé de production de panneau de connexion recouvert d’un film polymère thermoplastique à cristaux liquides
JP2010000795A (ja) * 1998-04-06 2010-01-07 Kuraray Co Ltd 液晶ポリマーフィルムと積層体及びそれらの製造方法並びに多層実装回路基板
WO2014046014A1 (fr) * 2012-09-20 2014-03-27 株式会社クラレ Carte de circuit imprimé et son procédé de fabrication
WO2015064437A1 (fr) * 2013-11-01 2015-05-07 株式会社クラレ Procédé de production d'un film polymère à cristaux liquides thermoplastique, substrat pour circuit et son procédé de production
JP2016107507A (ja) * 2014-12-05 2016-06-20 株式会社クラレ 金属張積層板およびその製造方法
WO2018150549A1 (fr) * 2017-02-17 2018-08-23 株式会社クラレ Procédé de production d'un film polymère à cristaux liquides thermoplastique possédant une couche de dépôt métallique, film polymère à cristaux liquides thermoplastique possédant une couche de dépôt métallique obtenue par ledit procédé de production, procédé de production pour laminé recouvert de métal et laminé recouvert de métal

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158555A (en) 1979-05-29 1980-12-10 Denki Kagaku Keiki Co Ltd Measuring apparatus for hydrogen chloride in exhaust gas
JP3878741B2 (ja) 1998-04-22 2007-02-07 株式会社クラレ ポリマーフィルムの製造方法
JP4138995B2 (ja) 1999-03-31 2008-08-27 株式会社クラレ 回路基板およびその製造方法
JP3893930B2 (ja) 2001-10-12 2007-03-14 株式会社デンソー シート材保持具、シート材保持方法、及び多層基板の製造方法
JP3756836B2 (ja) * 2002-03-29 2006-03-15 株式会社クラレ 液晶ポリマーフィルムの製造方法
JP2003292638A (ja) * 2002-03-29 2003-10-15 Kuraray Co Ltd 高耐熱性フィルム
JP5041652B2 (ja) * 2003-05-21 2012-10-03 株式会社クラレ フィルムの製造方法
KR101767682B1 (ko) * 2011-06-08 2017-08-11 심천 워트 어드밴스드 머티리얼즈 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 및 이를 포함하는 고분자 필름, 연성 금속박 적층판 및 인쇄 회로기판
WO2013146174A1 (fr) * 2012-03-29 2013-10-03 株式会社クラレ Film polymère à cristaux liquides thermoplastique et son procédé de production
KR102612138B1 (ko) * 2017-03-31 2023-12-08 주식회사 쿠라레 열가소성 액정 폴리머 및 그 필름
KR20210016429A (ko) * 2018-06-01 2021-02-15 주식회사 쿠라레 열가소성 액정 폴리머 성형체와 그 제조 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0890570A (ja) * 1994-09-16 1996-04-09 Hoechst Celanese Corp 液晶ポリマーフイルムの処理方法
JP2010000795A (ja) * 1998-04-06 2010-01-07 Kuraray Co Ltd 液晶ポリマーフィルムと積層体及びそれらの製造方法並びに多層実装回路基板
JP2006137786A (ja) * 2004-11-10 2006-06-01 Kuraray Co Ltd 熱可塑性液晶ポリマーフィルムおよびこれを用いた回路基板
WO2007013330A1 (fr) * 2005-07-27 2007-02-01 Kuraray Co., Ltd. Procédé de production de panneau de connexion recouvert d’un film polymère thermoplastique à cristaux liquides
WO2014046014A1 (fr) * 2012-09-20 2014-03-27 株式会社クラレ Carte de circuit imprimé et son procédé de fabrication
WO2015064437A1 (fr) * 2013-11-01 2015-05-07 株式会社クラレ Procédé de production d'un film polymère à cristaux liquides thermoplastique, substrat pour circuit et son procédé de production
JP2016107507A (ja) * 2014-12-05 2016-06-20 株式会社クラレ 金属張積層板およびその製造方法
WO2018150549A1 (fr) * 2017-02-17 2018-08-23 株式会社クラレ Procédé de production d'un film polymère à cristaux liquides thermoplastique possédant une couche de dépôt métallique, film polymère à cristaux liquides thermoplastique possédant une couche de dépôt métallique obtenue par ledit procédé de production, procédé de production pour laminé recouvert de métal et laminé recouvert de métal

Also Published As

Publication number Publication date
TWI793415B (zh) 2023-02-21
KR20220005005A (ko) 2022-01-12
TW202100608A (zh) 2021-01-01
KR102518008B1 (ko) 2023-04-04
JPWO2020218139A1 (fr) 2020-10-29
JP7024141B2 (ja) 2022-02-22
CN113727832B (zh) 2022-09-13
CN113727832A (zh) 2021-11-30
JP2022070936A (ja) 2022-05-13

Similar Documents

Publication Publication Date Title
JP7024142B2 (ja) 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
JP2022070936A (ja) 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
KR102635625B1 (ko) 금속 피복 적층판 및 그 제조 방법
JP7024143B2 (ja) 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
WO2022065285A1 (fr) Matériau isolant pour cartes de circuit imprimé, procédé de production associé et stratifié plaqué de feuille métallique
WO2022065270A1 (fr) Matériau isolant pour substrat de circuit, et stratifié revêtu d'une feuille métallique
JP7182030B2 (ja) 金属張積層体の製造方法
JP7378107B2 (ja) 金属被覆液晶ポリマーフィルム
WO2020255871A1 (fr) Procédé de production d'un stratifié plaqué de métal
CN115298024A (zh) 覆金属层叠体的制造方法
CA3202677A1 (fr) Composite polymere a cristaux liquides, film composite polymere a cristaux liquides et stratifie a revetement metallique comprenant celui-ci
CN116848216A (zh) 液晶聚合物复合材料、液晶聚合物复合材料膜和包括其的覆金属层压材料

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20794932

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021516047

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20794932

Country of ref document: EP

Kind code of ref document: A1