WO2020206980A1 - 柔性oled显示装置及制备方法 - Google Patents

柔性oled显示装置及制备方法 Download PDF

Info

Publication number
WO2020206980A1
WO2020206980A1 PCT/CN2019/112920 CN2019112920W WO2020206980A1 WO 2020206980 A1 WO2020206980 A1 WO 2020206980A1 CN 2019112920 W CN2019112920 W CN 2019112920W WO 2020206980 A1 WO2020206980 A1 WO 2020206980A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
nano
flexible
oled display
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/112920
Other languages
English (en)
French (fr)
Inventor
王敏
杨中国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020206980A1 publication Critical patent/WO2020206980A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

Definitions

  • This application relates to the field of display technology, and in particular to a flexible OLED display device and a manufacturing method.
  • OLED organic electroluminescent device
  • flexible OLED (organic electroluminescent device) display devices have the advantages of lightness, thinness, flexibility, low power consumption, etc., and have broad application prospects in smart home appliances, wearable devices, etc.
  • the organic light-emitting layer of OLED is very sensitive to water and oxygen, which affects its light-emitting performance, so the packaging structure and materials are very important.
  • the bending radius of curvature is very small, so the packaging reliability requirements are higher.
  • the existing packaging methods for flexible OLEDs are mostly organic-inorganic multilayer film packaging, and the bending radius of curvature is generally above 3mm ,
  • the organic-inorganic multilayer film packaging method has a high water vapor barrier capacity.
  • the inorganic film has excellent water vapor barrier performance, and the organic film can release the inter-film stress and improve the bending performance.
  • the combination of the two can obtain excellent water vapor barrier performance and bending performance.
  • the inorganic film will form unavoidable pinholes during the film formation process, which will become water vapor intrusion channels, and when the film thickness is large, cracks are likely to occur during the bending process, which reduces the packaging effect and greatly restricts the limit bending radius of the flexible OLED Therefore, packaging of flexible OLED display devices with a bending radius of less than 1 mm and bending times greater than 100,000 times becomes a problem.
  • the existing flexible OLED display device has a relatively large film thickness when encapsulated by organic-inorganic multilayer thin films, which leads to cracks in the bending process of OLED devices with a small bending radius, which reduces the packaging effect and further Cause the OLED device to fail.
  • the present application provides a flexible OLED display device and a preparation method, which can prevent cracks in the OLED device with a small bending radius of curvature during the bending process, so as to solve the problem of the existing flexible OLED display device when using organic-inorganic multilayer film packaging.
  • the large thickness of the film leads to cracks in the bending process of the OLED device with a small bending radius of curvature, which reduces the packaging effect and further causes the technical problem of the failure of the OLED device.
  • the present application provides a flexible OLED display device, including: a first flexible barrier film, a flexible substrate, a TFT layer, an OLED light-emitting layer, a thin film packaging member, and a second flexible barrier film;
  • the thin film encapsulation member includes at least two nano-inorganic layers and at least one organic layer, the organic layer and the nano-inorganic layer are alternately stacked and the organic layer is located between two adjacent nano-inorganic layers. between.
  • the nano-inorganic layer is formed by overlapping a first nano-metal layer and a second nano-metal layer, and the number of overlapping layers is not less than three.
  • the material of the first nano metal layer is aluminum oxide
  • the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the thickness of the first nano metal layer ranges from 3 to 10 nanometers, and the thickness of the second nano metal layer is the same as the thickness of the first nano metal layer .
  • the organic layer is any one of a high molecular silicon-based organic polymer or an organic resin.
  • the thickness of the organic layer is greater than or equal to 100 nanometers.
  • the size of the organic layer is smaller than the size of the nano-inorganic layer and larger than the size of the OLED light-emitting layer.
  • the present application also provides a method for manufacturing a flexible OLED display device, the method including:
  • the nano-inorganic layer is formed by overlapping a first nano-metal layer and a second nano-metal layer, and the number of overlapping layers No less than 3 layers; the material of the first nano metal layer is aluminum oxide, and the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the organic layer is any one of a high molecular silicon-based organic polymer or an organic resin, and the organic layer is The thickness is greater than or equal to 100 nanometers.
  • the flexible OLED display device and the preparation method provided in the present application introduce the inorganic barrier film formed by stacking single-layer nano-inorganic layers of equal thickness into the organic-inorganic multilayer film packaging structure to avoid small bending radius of curvature. Cracks are generated during the bending of the OLED device, which further enables the OLED device to obtain higher water vapor barrier performance, and further improves the service life of the flexible OLED display device.
  • FIG. 1 is a schematic diagram of the structure of a flexible OLED display device of this application.
  • Fig. 2 is an enlarged schematic diagram of A in Fig. 1.
  • FIG. 3 is a flow chart of a manufacturing method of a flexible OLED display device of this application.
  • 4A-4D are schematic diagrams of the manufacturing method of the flexible OLED display device described in FIG. 3.
  • This application is directed to the existing flexible OLED display device. Due to the large thickness of the film layer when the organic-inorganic multilayer film is used for encapsulation, the OLED device with a small bending radius of curvature is prone to cracks during the bending process, which reduces the packaging effect and further leads to The technical problem of the failure of the OLED device can be solved by this embodiment.
  • FIG. 1 it is a schematic diagram of the structure of a flexible OLED display device of this application.
  • the present application provides a flexible OLED display device, including: a first flexible barrier film 11, a flexible substrate 12, a TFT layer 13, an OLED light-emitting layer 14, a thin film packaging member 15, and a second flexible barrier film 16;
  • the thin film packaging member 15 includes at least two nano inorganic layers 151 and at least one organic layer 152.
  • the organic layers 152 and the nano inorganic layers 151 are alternately stacked, and the organic layers 152 are located in two adjacent layers. Between the nano-inorganic layers 151.
  • the nano inorganic layer 151 includes a first nano inorganic layer 1511 and a second nano inorganic layer 1512.
  • the first nano inorganic layer 1511 is located on the TFT layer 13 and covers the OLED light-emitting layer 14, the organic layer 152 is located on the first nano inorganic layer 1511, and the second nano inorganic layer 1512 is located on the The first nano inorganic layer 1511 is on and completely covers the organic layer 152.
  • the organic layer 152 is any one of a high molecular silicon-based organic polymer or an organic resin; the thickness of the organic layer 152 is greater than or equal to 100 nanometers. The size of the organic layer 152 is smaller than the size of the nano inorganic layer 151 but larger than the size of the OLED light-emitting layer 14.
  • the nano-inorganic layer 151 is formed by overlapping the first nano-metal layer 201 and the second nano-metal layer 202, and the number of overlapping layers is not less than three.
  • the material of the first nano metal layer 201 is aluminum oxide
  • the material of the second nano metal layer 202 is zinc oxide or zirconium dioxide.
  • the thickness of the first nano metal layer 201 ranges from 3 to 10 nanometers
  • the thickness of the second nano metal layer 202 is the same as the thickness of the first nano metal layer 201.
  • the thin film packaging member 15 has a three-layer structure (a first nano inorganic layer organic layer and a second nano inorganic layer), but it should be understood that the thin film packaging member 15 is not limited to three layers
  • the structure can also be composed of more layers.
  • a five-layer structure first nano-inorganic layer, organic layer, second nano-inorganic layer, organic layer, and third nano-inorganic layer
  • the layer is the nano-inorganic layer 151, and the number of packaging layers and the thickness of each layer in the thin film packaging member 15 can be adjusted according to actual needs, which is not limited in this application.
  • FIG. 3 it is a flow chart of the manufacturing method of the flexible OLED display device of this application.
  • the present application provides a method for manufacturing a flexible OLED display device, the method includes:
  • a glass substrate 301 is provided, and a flexible substrate 302 and a TFT layer 303 are sequentially prepared on the glass substrate 301.
  • the S10 further includes:
  • the first flexible substrate 302 is prepared;
  • a TFT layer 303 is fabricated on the first flexible substrate 302 to form a flexible TFT substrate, as shown in FIG. 4A.
  • an OLED device is fabricated on the flexible TFT substrate by evaporation or inkjet printing to form an OLED light-emitting layer 304.
  • the S20 further includes:
  • An OLED device is fabricated on the TFT layer 303 by evaporation or inkjet printing to form an OLED light-emitting layer 304, as shown in FIG. 4B.
  • the thin film packaging member 305 on the surface of the TFT layer 303, the thin film packaging member 305 covers the OLED light emitting layer 304, and the thin film packaging member 305 includes at least two nano-inorganic layers 3051 and at least one organic layer 3052, the organic layer 3052 and the nano inorganic layer 3051 are alternately stacked, and the organic layer 3052 is located between two adjacent nano inorganic layers 3051.
  • the S30 further includes:
  • an atomic layer deposition method or a plasma enhanced atomic layer deposition method is used to fabricate at least three overlapping first nano metal layers and second nano metal layers on the OLED light-emitting layer 304, A nano inorganic layer 3051 is formed, and the nano inorganic layer 3051 completely covers the OLED light-emitting layer 304.
  • the thickness of the second nano metal layer is the same as the thickness of the first nano metal layer; the thickness of the first nano metal layer ranges from 3 to 10 nanometers, and the thickness of the second nano metal layer is the same as that of the first nano metal layer.
  • the thickness of the first nano metal layer is the same; the material of the first nano metal layer is aluminum oxide, and the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the film material can be a high molecular silicon-based organic polymer, preferably polymethyl methacrylate, and the film material can also be organic.
  • a type of substance in resin, etc. the organic film layer is heated in a vacuum chamber to remove residual solvent, and cured by ultraviolet light to form an organic layer 3052; wherein the thickness of the organic layer 3052 is greater than or equal to 100 nanometers; The size of the organic layer 3052 is smaller than the size of the nano inorganic layer 3051 and larger than the size of the OLED light-emitting layer 304.
  • an atomic layer deposition method or a plasma-enhanced atomic layer deposition method is used to fabricate the nano-inorganic layer 3051 above the organic layer 3052, so that the organic layer 3052 is located between the two nano-inorganic layers 3051.
  • nano-inorganic layer 3051 repeat the above steps several times to produce multiple organic film layers and nano-inorganic film layers, ensuring that the first and uppermost layers are the nano-inorganic layer 3051, and the nano-inorganic layer 3051 It overlaps and stacks with the organic layer 3052 to form a thin film packaging member 305, as shown in FIG. 4C.
  • the S40 further includes:
  • the flexible TFT substrate is attached to the second flexible barrier film 306 by means of rollers or vacuum pressing.
  • the second flexible barrier film 306 can block external moisture and protect The organic-inorganic multilayer film is protected from the external environment; then the glass substrate 301 is cut, the flexible substrate 302 is separated from the glass substrate 301, and a first flexible barrier is attached to the surface of the flexible substrate 302 Film 307, and finally the flexible OLED display device is obtained.
  • the first flexible barrier film 307 can prevent the intrusion of water vapor from the flexible substrate and protect the flexible TFT substrate from the external environment, thereby making the flexible OLED display device, as shown in FIG. 4D.
  • the thin-film packaging member 305 is not limited to a nine-layer structure, and may also be composed of other layers. For example, five layers may be used.
  • Layer structure first nano-inorganic layer, organic layer, second nano-inorganic layer, organic layer, and third nano-inorganic layer
  • the number of packaging layers and the thickness of each layer in the thin film packaging member 305 are not limited in this application.
  • This application provides a flexible OLED display device and a preparation method. It mainly introduces a nano-layer structure into an organic-inorganic multilayer film packaging structure.
  • the packaging structure has a good packaging effect and can simultaneously meet the requirements of the flexible OLED display device for high water resistance, lightness and bending reliability. Sexual requirements. It can bend more than 100,000 times when the bending radius is less than 1mm.
  • the flexible OLED display device and the preparation method provided in the present application introduce the inorganic barrier film formed by stacking single-layer nano-inorganic layers of equal thickness into the organic-inorganic multilayer film packaging structure to avoid small bending radius of curvature. Cracks are generated during the bending of the OLED device, which further enables the OLED device to obtain higher water vapor barrier performance, and further improves the service life of the flexible OLED display device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性OLED显示装置及制备方法，包括：第一柔性阻隔膜、柔性衬底、TFT层、OLED发光层、薄膜封装构件以及第二柔性阻隔膜；其中，所述薄膜封装构件包括至少两层纳米无机层以及至少一层有机层，所述有机层与所述纳米无机层交替层叠地设置且所述有机层位于相邻两所述纳米无机层之间。

Description

柔性OLED显示装置及制备方法 技术领域
本申请涉及显示技术领域，尤其涉及一种柔性OLED显示装置及制备方法。
 背景技术
目前柔性OLED（有机电致发光器件）显示装置具有轻薄、可弯折、低功耗等优点，在智能家电、可穿戴设备等方面具有广泛的应用前景。然而OLED的有机发光层对水氧十分敏感，影响其发光性能，因此封装结构和材料至关重要。对于柔性OLED显示装置来讲，弯折曲率半径非常小，因此对封装可靠性要求更高，现有的用于柔性OLED的封装方式多为有机无机多层薄膜封装，弯曲曲率半径一般在3mm以上，有机无机多层薄膜封装方式具有较高的水汽阻隔能力，其中无机薄膜具有优异的阻隔水汽性能，有机膜可释放膜间应力，提高弯曲性能，二者搭配可获得优异的水汽阻隔性能和弯曲性能。然而，无机膜在成膜过程会形成不可避免的针孔，成为水汽入侵通道，且膜层厚度较大时，弯曲过程中易产生裂纹，降低封装效果，大大制约了柔性OLED的极限弯曲曲率半径，使得弯曲曲率半径小于1mm且弯折次数大于100000次的柔性OLED显示装置封装成为难题。
综上所述，现有的柔性OLED显示装置，在使用有机无机多层薄膜封装时的膜层厚度较大，导致弯曲曲率半径小的OLED器件弯曲过程中易产生裂纹，降低了封装效果，进一步导致OLED器件失效。
 技术问题
现有的柔性OLED显示装置，在使用有机无机多层薄膜封装时的膜层厚度较大，导致弯曲曲率半径小的OLED器件弯曲过程中易产生裂纹，降低了封装效果，进一步导致OLED器件失效。
 技术解决方案
本申请提供一种柔性OLED显示装置及制备方法，能够防止弯曲曲率半径小的OLED器件在弯曲过程中产生裂纹，以解决现有的柔性OLED显示装置，由于在使用有机无机多层薄膜封装时的膜层厚度较大，导致弯曲曲率半径小的OLED器件弯曲过程中易产生裂纹，降低了封装效果，进一步导致OLED器件失效的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种柔性OLED显示装置，包括：第一柔性阻隔膜、柔性衬底、TFT层、OLED发光层、薄膜封装构件以及第二柔性阻隔膜；
其中，所述薄膜封装构件包括至少两层纳米无机层以及至少一层有机层，所述有机层与所述纳米无机层交替层叠地设置且所述有机层位于相邻两所述纳米无机层之间。
在本申请实施例所提供的柔性OLED显示装置中，所述纳米无机层由第一纳米金属层以及第二纳米金属层交叠堆积而成，交叠层数不少于3层。
在本申请实施例所提供的柔性OLED显示装置中，所述第一纳米金属层的材质为氧化铝，所述第二纳米金属层的材质为氧化锌或者二氧化锆。
在本申请实施例所提供的柔性OLED显示装置中，所述第一纳米金属层的厚度范围为3~10纳米，所述第二纳米金属层的厚度与所述第一纳米金属层的厚度相同。
在本申请实施例所提供的柔性OLED显示装置中，所述有机层为高分子硅基有机聚合物或者有机树脂中的任意一种。
在本申请实施例所提供的柔性OLED显示装置中，所述有机层的厚度大于或等于100纳米。
在本申请实施例所提供的柔性OLED显示装置中，所述有机层的尺寸小于所述纳米无机层的尺寸而大于所述OLED发光层的尺寸。
本申请还提供一种柔性OLED显示装置的制备方法，所述方法包括：
S10，提供一玻璃基板，在所述玻璃基板上依次制备柔性衬底以及TFT层；
S20，在所述柔性TFT基板上通过蒸镀或喷墨打印制作OLED器件，形成OLED发光层；
S30，在所述TFT层的表面制备薄膜封装构件，所述薄膜封装构件覆盖所述OLED发光层，所述薄膜封装构件包括至少两层纳米无机层以及至少一层有机层，所述有机层与所述纳米无机层交替层叠地设置且所述有机层位于相邻两所述纳米无机层之间；
S40，在所述薄膜封装构件的上方，使用滚轮或真空压合等方式将所述柔性TFT基板与第二柔性阻隔膜贴合，将所述柔性衬底与所述玻璃基板分离，在所述柔性衬底的表面贴合第一柔性阻隔膜，最后得到所述柔性OLED显示装置。
在本申请实施例所提供的柔性OLED显示装置的制备方法中，所述步骤S30中，所述纳米无机层由第一纳米金属层以及第二纳米金属层交叠堆积而成，交叠层数不少于3层；所述第一纳米金属层的材质为氧化铝，所述第二纳米金属层的材质为氧化锌或者二氧化锆。
在本申请实施例所提供的柔性OLED显示装置的制备方法中，所述步骤S30中，所述有机层为高分子硅基有机聚合物或者有机树脂中的任意一种，且所述有机层的厚度大于或等于100纳米。
 有益效果
本申请的有益效果为：本申请所提供的柔性OLED显示装置及制备方法，将等厚单层纳米无机层堆叠形成的无机阻隔膜引入有机无机多层薄膜封装结构中，避免弯曲曲率半径小的OLED器件弯曲过程中产生裂纹，进一步使OLED器件获得较高的水汽阻隔性能，更进一步提高了柔性OLED显示装置的使用寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请柔性OLED显示装置结构示意图。
图2为图1中A处的放大示意图。
图3为本申请柔性OLED显示装置的制备方法流程图。
图4A-图4D为图3所述柔性OLED显示装置的制备方法示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的柔性OLED显示装置，由于在使用有机无机多层薄膜封装时的膜层厚度较大，导致弯曲曲率半径小的OLED器件弯曲过程中易产生裂纹，降低了封装效果，进一步导致OLED器件失效的技术问题，本实施例能够解决该缺陷。
如图1所示，为本申请柔性OLED显示装置结构示意图。其中，本申请提供一种柔性OLED显示装置，包括：第一柔性阻隔膜11、柔性衬底12、TFT层13、OLED发光层14、薄膜封装构件15以及第二柔性阻隔膜16；
其中，所述薄膜封装构件15包括至少两层纳米无机层151以及至少一层有机层152，所述有机层152与所述纳米无机层151交替层叠地设置且所述有机层152位于相邻两所述纳米无机层151之间。
具体的，所述纳米无机层151包括第一纳米无机层1511以及第二纳米无机层1512。所述第一纳米无机层1511位于所述TFT层13上并覆盖所述OLED发光层14，所述有机层152位于所述第一纳米无机层1511上，所述第二纳米无机层1512位于所述第一纳米无机层1511上并完全覆盖所述有机层152。
具体的，所述有机层152为高分子硅基有机聚合物或者有机树脂中的任意一种；所述有机层152的厚度大于或等于100纳米。所述有机层152的尺寸小于所述纳米无机层151的尺寸而大于所述OLED发光层14的尺寸。
如图2所示，为图1中A处的放大示意图。其中，所述纳米无机层151由第一纳米金属层201以及第二纳米金属层202交叠堆积而成，交叠层数不少于3层。
具体的，所述第一纳米金属层201的材质为氧化铝，所述第二纳米金属层202的材质为氧化锌或者二氧化锆。所述第一纳米金属层201的厚度范围为3~10纳米，所述第二纳米金属层202的厚度与所述第一纳米金属层201的厚度相同。
以上是以所述薄膜封装构件15为三层结构（第一纳米无机层有机层以及第二纳米无机层）为例子进行的说明，但应理解，所述薄膜封装构件15并不限制为三层结构，还可以是由更多层组成，比如可以采用五层结构（第一纳米无机层、有机层、第二纳米无机层、有机层以及第三纳米无机层），保证第一层以及最后一层为所述纳米无机层151，可以根据实际需要调整所述薄膜封装构件15中封装层的数量以及各层的厚度，本申请对此不予限定。
如图3所示，为本申请柔性OLED显示装置的制备方法流程图。其中，本申请提供一种柔性OLED显示装置的制备方法，所述方法包括：
S10，提供一玻璃基板301，在所述玻璃基板301上依次制备柔性衬底302以及TFT层303。
具体的，所述S10还包括：
首先，提供一玻璃基板301，使用纯水或热硫酸等清洗液将所述玻璃基板301洗净，之后在所述玻璃基板301上涂布聚酰亚胺溶液，并沉积氮硅化合物或氮氧化合物后制备成第一柔性衬底302；
然后在所述第一柔性衬底302上制作TFT层303，形成柔性TFT基板，如图4A所示。
S20，在所述柔性TFT基板上通过蒸镀或喷墨打印制作OLED器件，形成OLED发光层304。
具体的，所述S20还包括：
在所述TFT层303上通过蒸镀或喷墨打印制作OLED器件，形成OLED发光层304，如图4B所示。
S30，在所述TFT层303的表面制备薄膜封装构件305，所述薄膜封装构件305覆盖所述OLED发光层304，所述薄膜封装构件305包括至少两层纳米无机层3051以及至少一层有机层3052，所述有机层3052与所述纳米无机层3051交替层叠地设置且所述有机层3052位于相邻两所述纳米无机层3051之间。
具体的，所述S30还包括：
首先在所述柔性TFT基板上于所述OLED发光层304的上方使用原子层沉积法或者等离子体增强原子层沉积法制作至少三层交叠堆积的第一纳米金属层与第二纳米金属层，形成纳米无机层3051，所述纳米无机层3051完全覆盖所述OLED发光层304。其中，所述第二纳米金属层的厚度与所述第一纳米金属层的厚度相同；所述第一纳米金属层的厚度范围为3~10纳米，所述第二纳米金属层的厚度与所述第一纳米金属层的厚度相同；所述第一纳米金属层的材质为氧化铝，所述第二纳米金属层的材质为氧化锌或者二氧化锆。
之后，在所述纳米无机层3051上使用旋涂或打印的方式制作有机膜层, 膜层材料可为高分子硅基有机聚合物优选为聚甲基丙烯酸甲酯，膜层材料也可以为有机树脂等中的一类物质，所述有机膜层在真空腔内加热以去除残留溶剂，并用紫外光照射固化后形成有机层3052；其中，所述有机层3052的厚度大于或等于100纳米；所述有机层3052的尺寸小于所述纳米无机层3051的尺寸而大于所述OLED发光层304的尺寸。
然后，在所述有机层3052的上方使用原子层沉积法或者等离子体增强原子层沉积法制作所述纳米无机层3051，使得所述有机层3052位于两所述纳米无机层3051之间。
最后，在所述纳米无机层3051上，多次重复以上步骤，制作多层有机膜层以及纳米无机膜层，确保第一层以及最上层为所述纳米无机层3051，所述纳米无机层3051与所述有机层3052交叠堆积，形成薄膜封装构件305，如图4C所示。
S40，在所述薄膜封装构件的上方，使用滚轮或真空压合等方式将所述柔性TFT基板与第二柔性阻隔膜贴合，将所述柔性衬底与所述玻璃基板分离，在所述柔性衬底的表面贴合第一柔性阻隔膜，最后得到所述柔性OLED显示装置。
具体的，所述S40还包括：
首先，在所述纳米无机层3051上方，使用滚轮或真空压合等方式将所述柔性TFT基板与第二柔性阻隔膜306贴合，所述第二柔性阻隔膜306可以阻挡外界水汽，并保护有机无机多层薄膜免受外界环境的破坏；之后切割所述玻璃基板301，将所述柔性衬底302与所述玻璃基板301分离，在所述柔性衬底302的表面贴合第一柔性阻隔膜307，最后得到所述柔性OLED显示装置。其中，所述第一柔性阻隔膜307可以防止水汽从柔性基板侵入，并保护柔性TFT基板不受外界环境损坏，从而制成所述柔性OLED显示装置，如图4D所示。
以上是以所述薄膜封装构件305为九层结构为例子进行的说明，但应理解，所述薄膜封装构件305并不限制为九层结构，还可以是由其他层数组成，比如可以采用五层结构（第一纳米无机层、有机层、第二纳米无机层、有机层以及第三纳米无机层），保证第一层以及最后一层为所述纳米无机层3051，可以根据实际需要调整所述薄膜封装构件305中封装层的数量以及各层的厚度，本申请对此不予限定。
本申请提供一种柔性OLED显示装置及制备方法，主要将纳米层结构引入有机无机多层薄膜封装结构，本封装结构封装效果好，能同时满足柔性OLED显示装置对高阻水性、轻薄、弯曲可靠性的要求。可在弯曲半径小于1mm时，弯曲100000次以上。
本申请的有益效果为：本申请所提供的柔性OLED显示装置及制备方法，将等厚单层纳米无机层堆叠形成的无机阻隔膜引入有机无机多层薄膜封装结构中，避免弯曲曲率半径小的OLED器件弯曲过程中产生裂纹，进一步使OLED器件获得较高的水汽阻隔性能，更进一步提高了柔性OLED显示装置的使用寿命。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种柔性OLED显示装置，其中，包括：
    第一柔性阻隔膜；
    柔性衬底，位于所述第一柔性阻隔膜上；
    TFT层，位于所述柔性衬底上；
    OLED发光层，位于所述TFT层上；
    薄膜封装构件，位于所述TFT层上并覆盖所述OLED发光层；
    第二柔性阻隔膜，位于所述TFT层上并覆盖所述薄膜封装构件；
    其中，所述薄膜封装构件包括至少两层纳米无机层以及至少一层有机层，所述有机层与所述纳米无机层交替层叠地设置且所述有机层位于相邻两所述纳米无机层之间。
  2. 根据权利要求1所述的柔性OLED显示装置，其中，所述纳米无机层由第一纳米金属层以及第二纳米金属层交叠堆积而成，交叠层数不少于3层。
  3. 根据权利要求2所述的柔性OLED显示装置，其中，所述第一纳米金属层的材质为氧化铝，所述第二纳米金属层的材质为氧化锌或者二氧化锆。
  4. 根据权利要求2所述的柔性OLED显示装置，其中，所述第一纳米金属层的厚度范围为3~10纳米，所述第二纳米金属层的厚度与所述第一纳米金属层的厚度相同。
  5. 根据权利要求1所述的柔性OLED显示装置，其中，所述有机层为高分子硅基有机聚合物或者有机树脂中的任意一种。
  6. 根据权利要求5所述的柔性OLED显示装置，其中，所述有机层的厚度大于或等于100纳米。
  7. 根据权利要求5所述的柔性OLED显示装置，其中，所述有机层的尺寸小于所述纳米无机层的尺寸而大于所述OLED发光层的尺寸。
  8. 一种柔性OLED显示装置的制备方法，其中，所述方法包括：
    S10，提供一玻璃基板，在所述玻璃基板上依次制备柔性衬底以及TFT层；
    S20，在所述柔性TFT基板上通过蒸镀或喷墨打印制作OLED器件，形成OLED发光层；
    S30，在所述TFT层的表面制备薄膜封装构件，所述薄膜封装构件覆盖所述OLED发光层，所述薄膜封装构件包括至少两层纳米无机层以及至少一层有机层，所述有机层与所述纳米无机层交替层叠地设置且所述有机层位于相邻两所述纳米无机层之间；
    S40，在所述薄膜封装构件的上方，使用滚轮或真空压合等方式将所述柔性TFT基板与第二柔性阻隔膜贴合，将所述柔性衬底与所述玻璃基板分离，在所述柔性衬底的表面贴合第一柔性阻隔膜，最后得到所述柔性OLED显示装置。
  9. 根据权利要求8所述的柔性OLED显示装置的制备方法，其中，所述步骤S30中，所述纳米无机层由第一纳米金属层以及第二纳米金属层交叠堆积而成，交叠层数不少于3层；所述第一纳米金属层的材质为氧化铝，所述第二纳米金属层的材质为氧化锌或者二氧化锆。
  10. 根据权利要求8所述的柔性OLED显示装置的制备方法，其中，所述步骤S30中，所述有机层为高分子硅基有机聚合物或者有机树脂中的任意一种，且所述有机层的厚度大于或等于100纳米。
PCT/CN2019/112920 2019-04-12 2019-10-24 柔性oled显示装置及制备方法 Ceased WO2020206980A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910292086.2 2019-04-12
CN201910292086.2A CN110048019A (zh) 2019-04-12 2019-04-12 柔性oled显示装置及制备方法

Publications (1)

Publication Number Publication Date
WO2020206980A1 true WO2020206980A1 (zh) 2020-10-15

Family

ID=67276867

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/112920 Ceased WO2020206980A1 (zh) 2019-04-12 2019-10-24 柔性oled显示装置及制备方法

Country Status (2)

Country Link
CN (1) CN110048019A (zh)
WO (1) WO2020206980A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110048019A (zh) * 2019-04-12 2019-07-23 深圳市华星光电半导体显示技术有限公司 柔性oled显示装置及制备方法
CN110931657A (zh) * 2019-12-06 2020-03-27 中国乐凯集团有限公司 一种钙钛矿薄膜太阳能电池用柔性复合衬底及其制备方法
CN113555512A (zh) * 2020-04-24 2021-10-26 深圳市柔宇科技有限公司 柔性显示封装结构、柔性显示装置及柔性面板的封装方法
CN111584745A (zh) * 2020-05-13 2020-08-25 深圳市华星光电半导体显示技术有限公司 显示面板及其制造方法
CN111599935B (zh) * 2020-05-19 2024-08-13 福建华佳彩有限公司 一种柔性amoled面板封装结构及其封装方法
CN112331804A (zh) * 2020-11-04 2021-02-05 福建华佳彩有限公司 一种柔性oled显示器件及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437288A (zh) * 2011-11-16 2012-05-02 四川长虹电器股份有限公司 有机电致发光器件的封装结构
CN102593371A (zh) * 2012-03-16 2012-07-18 四川长虹电器股份有限公司 有机电致发光器件的封装结构
US20130248827A1 (en) * 2012-03-26 2013-09-26 Canon Kabushiki Kaisha Organic electroluminescence display device
US20140291630A1 (en) * 2013-04-01 2014-10-02 Samsung Display Co., Ltd. Organic light-emitting diode display and method of manufacturing same
CN109585684A (zh) * 2018-12-07 2019-04-05 深圳市华星光电半导体显示技术有限公司 一种显示装置及其封装方法
CN110048019A (zh) * 2019-04-12 2019-07-23 深圳市华星光电半导体显示技术有限公司 柔性oled显示装置及制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104979478A (zh) * 2014-04-03 2015-10-14 海洋王照明科技股份有限公司 柔性有机电致发光装置及其制备方法
US9594287B2 (en) * 2014-08-24 2017-03-14 Royole Corporation Substrate-less flexible display and method of manufacturing the same
CN106711345A (zh) * 2015-11-12 2017-05-24 宁波长阳科技股份有限公司 一种柔性透明阻隔膜及其制备方法
CN106450035B (zh) * 2016-11-17 2018-10-30 上海天马有机发光显示技术有限公司 一种显示面板及其制备方法
CN106654045B (zh) * 2016-12-19 2019-12-24 武汉华星光电技术有限公司 Oled封装方法与oled封装结构
CN109427992B (zh) * 2017-08-28 2019-10-18 昆山国显光电有限公司 薄膜封装结构及具有其的显示装置
CN108666421A (zh) * 2018-05-23 2018-10-16 京东方科技集团股份有限公司 柔性基底、有机电致发光二极管显示基板和显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437288A (zh) * 2011-11-16 2012-05-02 四川长虹电器股份有限公司 有机电致发光器件的封装结构
CN102593371A (zh) * 2012-03-16 2012-07-18 四川长虹电器股份有限公司 有机电致发光器件的封装结构
US20130248827A1 (en) * 2012-03-26 2013-09-26 Canon Kabushiki Kaisha Organic electroluminescence display device
US20140291630A1 (en) * 2013-04-01 2014-10-02 Samsung Display Co., Ltd. Organic light-emitting diode display and method of manufacturing same
CN109585684A (zh) * 2018-12-07 2019-04-05 深圳市华星光电半导体显示技术有限公司 一种显示装置及其封装方法
CN110048019A (zh) * 2019-04-12 2019-07-23 深圳市华星光电半导体显示技术有限公司 柔性oled显示装置及制备方法

Also Published As

Publication number Publication date
CN110048019A (zh) 2019-07-23

Similar Documents

Publication Publication Date Title
WO2020206980A1 (zh) 柔性oled显示装置及制备方法
JP4332579B2 (ja) 有機デバイスのための可撓性基体、有機デバイスおよびその製造方法
CN109427992B (zh) 薄膜封装结构及具有其的显示装置
WO2016101395A1 (zh) 柔性oled显示器件及其制造方法
CN102437288A (zh) 有机电致发光器件的封装结构
WO2015089998A1 (zh) Oled用薄膜封装结构、oled器件以及显示装置
CN110391349B (zh) 一种有机发光二极管显示面板及其制作方法
CN110571347B (zh) 一种显示面板及其制备方法
WO2015145533A1 (ja) 発光装置及び発光装置の製造方法
WO2020220523A1 (zh) 有机发光二极管显示装置及其制作方法
WO2020056867A1 (zh) 柔性显示面板及其制备方法
WO2020029351A1 (zh) 一种复合膜层及制作方法、oled显示面板的制作方法
CN110211969A (zh) 阵列基板及其制备方法、柔性显示面板
CN104538556A (zh) 柔性oled衬底及柔性oled封装方法
CN110165076B (zh) 有机发光二极管显示面板
JP5660128B2 (ja) 発光装置
JP2011528156A5 (zh)
WO2020113829A1 (zh) 一种显示装置及其封装方法
WO2022077774A1 (zh) 显示面板及其制作方法
CN107910451A (zh) 复合膜及其制造方法和封装结构
WO2022188193A1 (zh) 一种显示面板及其制备方法
CN111584745A (zh) 显示面板及其制造方法
JP2014515864A (ja) 基板及びその製造方法、ならびに当該基板を使用する有機電界発光デバイス
CN105957978B (zh) 封装结构及其制造方法
KR20200067025A (ko) 유기광전자소자의 봉지필름 및 그 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19924378

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19924378

Country of ref document: EP

Kind code of ref document: A1