WO2020206980A1 - Appareil d'affichage à delo souple et son procédé de préparation - Google Patents

Appareil d'affichage à delo souple et son procédé de préparation Download PDF

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Publication number
WO2020206980A1
WO2020206980A1 PCT/CN2019/112920 CN2019112920W WO2020206980A1 WO 2020206980 A1 WO2020206980 A1 WO 2020206980A1 CN 2019112920 W CN2019112920 W CN 2019112920W WO 2020206980 A1 WO2020206980 A1 WO 2020206980A1
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WO
WIPO (PCT)
Prior art keywords
layer
nano
flexible
oled display
display device
Prior art date
Application number
PCT/CN2019/112920
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English (en)
Chinese (zh)
Inventor
王敏
杨中国
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020206980A1 publication Critical patent/WO2020206980A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

Definitions

  • This application relates to the field of display technology, and in particular to a flexible OLED display device and a manufacturing method.
  • OLED organic electroluminescent device
  • flexible OLED (organic electroluminescent device) display devices have the advantages of lightness, thinness, flexibility, low power consumption, etc., and have broad application prospects in smart home appliances, wearable devices, etc.
  • the organic light-emitting layer of OLED is very sensitive to water and oxygen, which affects its light-emitting performance, so the packaging structure and materials are very important.
  • the bending radius of curvature is very small, so the packaging reliability requirements are higher.
  • the existing packaging methods for flexible OLEDs are mostly organic-inorganic multilayer film packaging, and the bending radius of curvature is generally above 3mm ,
  • the organic-inorganic multilayer film packaging method has a high water vapor barrier capacity.
  • the inorganic film has excellent water vapor barrier performance, and the organic film can release the inter-film stress and improve the bending performance.
  • the combination of the two can obtain excellent water vapor barrier performance and bending performance.
  • the inorganic film will form unavoidable pinholes during the film formation process, which will become water vapor intrusion channels, and when the film thickness is large, cracks are likely to occur during the bending process, which reduces the packaging effect and greatly restricts the limit bending radius of the flexible OLED Therefore, packaging of flexible OLED display devices with a bending radius of less than 1 mm and bending times greater than 100,000 times becomes a problem.
  • the existing flexible OLED display device has a relatively large film thickness when encapsulated by organic-inorganic multilayer thin films, which leads to cracks in the bending process of OLED devices with a small bending radius, which reduces the packaging effect and further Cause the OLED device to fail.
  • the present application provides a flexible OLED display device and a preparation method, which can prevent cracks in the OLED device with a small bending radius of curvature during the bending process, so as to solve the problem of the existing flexible OLED display device when using organic-inorganic multilayer film packaging.
  • the large thickness of the film leads to cracks in the bending process of the OLED device with a small bending radius of curvature, which reduces the packaging effect and further causes the technical problem of the failure of the OLED device.
  • the present application provides a flexible OLED display device, including: a first flexible barrier film, a flexible substrate, a TFT layer, an OLED light-emitting layer, a thin film packaging member, and a second flexible barrier film;
  • the thin film encapsulation member includes at least two nano-inorganic layers and at least one organic layer, the organic layer and the nano-inorganic layer are alternately stacked and the organic layer is located between two adjacent nano-inorganic layers. between.
  • the nano-inorganic layer is formed by overlapping a first nano-metal layer and a second nano-metal layer, and the number of overlapping layers is not less than three.
  • the material of the first nano metal layer is aluminum oxide
  • the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the thickness of the first nano metal layer ranges from 3 to 10 nanometers, and the thickness of the second nano metal layer is the same as the thickness of the first nano metal layer .
  • the organic layer is any one of a high molecular silicon-based organic polymer or an organic resin.
  • the thickness of the organic layer is greater than or equal to 100 nanometers.
  • the size of the organic layer is smaller than the size of the nano-inorganic layer and larger than the size of the OLED light-emitting layer.
  • the present application also provides a method for manufacturing a flexible OLED display device, the method including:
  • the nano-inorganic layer is formed by overlapping a first nano-metal layer and a second nano-metal layer, and the number of overlapping layers No less than 3 layers; the material of the first nano metal layer is aluminum oxide, and the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the organic layer is any one of a high molecular silicon-based organic polymer or an organic resin, and the organic layer is The thickness is greater than or equal to 100 nanometers.
  • the flexible OLED display device and the preparation method provided in the present application introduce the inorganic barrier film formed by stacking single-layer nano-inorganic layers of equal thickness into the organic-inorganic multilayer film packaging structure to avoid small bending radius of curvature. Cracks are generated during the bending of the OLED device, which further enables the OLED device to obtain higher water vapor barrier performance, and further improves the service life of the flexible OLED display device.
  • FIG. 1 is a schematic diagram of the structure of a flexible OLED display device of this application.
  • Fig. 2 is an enlarged schematic diagram of A in Fig. 1.
  • FIG. 3 is a flow chart of a manufacturing method of a flexible OLED display device of this application.
  • 4A-4D are schematic diagrams of the manufacturing method of the flexible OLED display device described in FIG. 3.
  • This application is directed to the existing flexible OLED display device. Due to the large thickness of the film layer when the organic-inorganic multilayer film is used for encapsulation, the OLED device with a small bending radius of curvature is prone to cracks during the bending process, which reduces the packaging effect and further leads to The technical problem of the failure of the OLED device can be solved by this embodiment.
  • FIG. 1 it is a schematic diagram of the structure of a flexible OLED display device of this application.
  • the present application provides a flexible OLED display device, including: a first flexible barrier film 11, a flexible substrate 12, a TFT layer 13, an OLED light-emitting layer 14, a thin film packaging member 15, and a second flexible barrier film 16;
  • the thin film packaging member 15 includes at least two nano inorganic layers 151 and at least one organic layer 152.
  • the organic layers 152 and the nano inorganic layers 151 are alternately stacked, and the organic layers 152 are located in two adjacent layers. Between the nano-inorganic layers 151.
  • the nano inorganic layer 151 includes a first nano inorganic layer 1511 and a second nano inorganic layer 1512.
  • the first nano inorganic layer 1511 is located on the TFT layer 13 and covers the OLED light-emitting layer 14, the organic layer 152 is located on the first nano inorganic layer 1511, and the second nano inorganic layer 1512 is located on the The first nano inorganic layer 1511 is on and completely covers the organic layer 152.
  • the organic layer 152 is any one of a high molecular silicon-based organic polymer or an organic resin; the thickness of the organic layer 152 is greater than or equal to 100 nanometers. The size of the organic layer 152 is smaller than the size of the nano inorganic layer 151 but larger than the size of the OLED light-emitting layer 14.
  • the nano-inorganic layer 151 is formed by overlapping the first nano-metal layer 201 and the second nano-metal layer 202, and the number of overlapping layers is not less than three.
  • the material of the first nano metal layer 201 is aluminum oxide
  • the material of the second nano metal layer 202 is zinc oxide or zirconium dioxide.
  • the thickness of the first nano metal layer 201 ranges from 3 to 10 nanometers
  • the thickness of the second nano metal layer 202 is the same as the thickness of the first nano metal layer 201.
  • the thin film packaging member 15 has a three-layer structure (a first nano inorganic layer organic layer and a second nano inorganic layer), but it should be understood that the thin film packaging member 15 is not limited to three layers
  • the structure can also be composed of more layers.
  • a five-layer structure first nano-inorganic layer, organic layer, second nano-inorganic layer, organic layer, and third nano-inorganic layer
  • the layer is the nano-inorganic layer 151, and the number of packaging layers and the thickness of each layer in the thin film packaging member 15 can be adjusted according to actual needs, which is not limited in this application.
  • FIG. 3 it is a flow chart of the manufacturing method of the flexible OLED display device of this application.
  • the present application provides a method for manufacturing a flexible OLED display device, the method includes:
  • a glass substrate 301 is provided, and a flexible substrate 302 and a TFT layer 303 are sequentially prepared on the glass substrate 301.
  • the S10 further includes:
  • the first flexible substrate 302 is prepared;
  • a TFT layer 303 is fabricated on the first flexible substrate 302 to form a flexible TFT substrate, as shown in FIG. 4A.
  • an OLED device is fabricated on the flexible TFT substrate by evaporation or inkjet printing to form an OLED light-emitting layer 304.
  • the S20 further includes:
  • An OLED device is fabricated on the TFT layer 303 by evaporation or inkjet printing to form an OLED light-emitting layer 304, as shown in FIG. 4B.
  • the thin film packaging member 305 on the surface of the TFT layer 303, the thin film packaging member 305 covers the OLED light emitting layer 304, and the thin film packaging member 305 includes at least two nano-inorganic layers 3051 and at least one organic layer 3052, the organic layer 3052 and the nano inorganic layer 3051 are alternately stacked, and the organic layer 3052 is located between two adjacent nano inorganic layers 3051.
  • the S30 further includes:
  • an atomic layer deposition method or a plasma enhanced atomic layer deposition method is used to fabricate at least three overlapping first nano metal layers and second nano metal layers on the OLED light-emitting layer 304, A nano inorganic layer 3051 is formed, and the nano inorganic layer 3051 completely covers the OLED light-emitting layer 304.
  • the thickness of the second nano metal layer is the same as the thickness of the first nano metal layer; the thickness of the first nano metal layer ranges from 3 to 10 nanometers, and the thickness of the second nano metal layer is the same as that of the first nano metal layer.
  • the thickness of the first nano metal layer is the same; the material of the first nano metal layer is aluminum oxide, and the material of the second nano metal layer is zinc oxide or zirconium dioxide.
  • the film material can be a high molecular silicon-based organic polymer, preferably polymethyl methacrylate, and the film material can also be organic.
  • a type of substance in resin, etc. the organic film layer is heated in a vacuum chamber to remove residual solvent, and cured by ultraviolet light to form an organic layer 3052; wherein the thickness of the organic layer 3052 is greater than or equal to 100 nanometers; The size of the organic layer 3052 is smaller than the size of the nano inorganic layer 3051 and larger than the size of the OLED light-emitting layer 304.
  • an atomic layer deposition method or a plasma-enhanced atomic layer deposition method is used to fabricate the nano-inorganic layer 3051 above the organic layer 3052, so that the organic layer 3052 is located between the two nano-inorganic layers 3051.
  • nano-inorganic layer 3051 repeat the above steps several times to produce multiple organic film layers and nano-inorganic film layers, ensuring that the first and uppermost layers are the nano-inorganic layer 3051, and the nano-inorganic layer 3051 It overlaps and stacks with the organic layer 3052 to form a thin film packaging member 305, as shown in FIG. 4C.
  • the S40 further includes:
  • the flexible TFT substrate is attached to the second flexible barrier film 306 by means of rollers or vacuum pressing.
  • the second flexible barrier film 306 can block external moisture and protect The organic-inorganic multilayer film is protected from the external environment; then the glass substrate 301 is cut, the flexible substrate 302 is separated from the glass substrate 301, and a first flexible barrier is attached to the surface of the flexible substrate 302 Film 307, and finally the flexible OLED display device is obtained.
  • the first flexible barrier film 307 can prevent the intrusion of water vapor from the flexible substrate and protect the flexible TFT substrate from the external environment, thereby making the flexible OLED display device, as shown in FIG. 4D.
  • the thin-film packaging member 305 is not limited to a nine-layer structure, and may also be composed of other layers. For example, five layers may be used.
  • Layer structure first nano-inorganic layer, organic layer, second nano-inorganic layer, organic layer, and third nano-inorganic layer
  • the number of packaging layers and the thickness of each layer in the thin film packaging member 305 are not limited in this application.
  • This application provides a flexible OLED display device and a preparation method. It mainly introduces a nano-layer structure into an organic-inorganic multilayer film packaging structure.
  • the packaging structure has a good packaging effect and can simultaneously meet the requirements of the flexible OLED display device for high water resistance, lightness and bending reliability. Sexual requirements. It can bend more than 100,000 times when the bending radius is less than 1mm.
  • the flexible OLED display device and the preparation method provided in the present application introduce the inorganic barrier film formed by stacking single-layer nano-inorganic layers of equal thickness into the organic-inorganic multilayer film packaging structure to avoid small bending radius of curvature. Cracks are generated during the bending of the OLED device, which further enables the OLED device to obtain higher water vapor barrier performance, and further improves the service life of the flexible OLED display device.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un appareil d'affichage à DELO souple et son procédé de préparation. L'appareil d'affichage à DELO souple comprend : un premier film barrière souple , un substrat souple , une couche TFT, une couche électroluminescente à DELO, un élément d'emballage à film mince et un second film barrière souple. L'élément d'emballage à film mince comprend au moins deux nano-couches inorganiques et au moins une couche organique, les couches organiques et les nano-couches inorganiques étant stratifiées en alternance, et la couche organique étant située entre deux nano-couches inorganiques adjacentes.
PCT/CN2019/112920 2019-04-12 2019-10-24 Appareil d'affichage à delo souple et son procédé de préparation WO2020206980A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910292086.2A CN110048019A (zh) 2019-04-12 2019-04-12 柔性oled显示装置及制备方法
CN201910292086.2 2019-04-12

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Publication Number Publication Date
WO2020206980A1 true WO2020206980A1 (fr) 2020-10-15

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CN110048019A (zh) * 2019-04-12 2019-07-23 深圳市华星光电半导体显示技术有限公司 柔性oled显示装置及制备方法
CN110931657A (zh) * 2019-12-06 2020-03-27 中国乐凯集团有限公司 一种钙钛矿薄膜太阳能电池用柔性复合衬底及其制备方法
CN113555512A (zh) * 2020-04-24 2021-10-26 深圳市柔宇科技有限公司 柔性显示封装结构、柔性显示装置及柔性面板的封装方法
CN111584745A (zh) * 2020-05-13 2020-08-25 深圳市华星光电半导体显示技术有限公司 显示面板及其制造方法
CN111599935A (zh) * 2020-05-19 2020-08-28 福建华佳彩有限公司 一种柔性amoled面板封装结构及其封装方法
CN112331804A (zh) * 2020-11-04 2021-02-05 福建华佳彩有限公司 一种柔性oled显示器件及其制备方法

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