WO2020199499A1 - 金手指及其制作方法、电路板及其制作方法 - Google Patents

金手指及其制作方法、电路板及其制作方法 Download PDF

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WO2020199499A1
WO2020199499A1 PCT/CN2019/104446 CN2019104446W WO2020199499A1 WO 2020199499 A1 WO2020199499 A1 WO 2020199499A1 CN 2019104446 W CN2019104446 W CN 2019104446W WO 2020199499 A1 WO2020199499 A1 WO 2020199499A1
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Prior art keywords
layer
nickel
conductive layer
palladium
gold finger
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PCT/CN2019/104446
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English (en)
French (fr)
Inventor
王国
周波
罗定峰
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
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Publication of WO2020199499A1 publication Critical patent/WO2020199499A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

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  • the invention relates to the technical field of corrosion resistance, in particular to a gold finger and a manufacturing method thereof, a circuit board and a manufacturing method thereof.
  • the circuit board includes a substrate, a circuit and a gold finger.
  • the circuit and the gold finger are both arranged on the substrate, and the circuit is electrically connected with the gold finger. After the customer purchases the circuit board from the manufacturer, the corresponding components can be welded on the circuit board to realize the corresponding function.
  • the corrosion resistance of gold fingers is one of the indicators for customers to judge gold fingers and circuit boards including gold fingers. Customers usually use mixed gas corrosion tests to test the corrosion resistance of gold fingers. In traditional technology, it is difficult for gold fingers to pass the mixed gas corrosion test.
  • a method for making gold fingers including:
  • a sealing film is formed on the side of the palladium layer facing away from the nickel layer.
  • a conductive layer is formed to electrically connect with the circuit.
  • a nickel layer is formed on the conductive layer to prevent corrosion of the conductive layer.
  • the nickel layer can also serve as a welding base for components.
  • a palladium layer is formed on the side of the nickel layer facing away from the conductive layer to prevent corrosion of the nickel layer and improve the corrosion resistance of the gold finger.
  • a sealing film is formed on the side of the palladium layer facing away from the nickel layer to further improve the corrosion resistance of the gold finger, so that the gold finger can pass the mixed gas corrosion test.
  • the method further includes the step of performing microetching, brushing and/or sandblasting on the conductive layer.
  • the conductive layer is a copper layer
  • the nickel layer is formed by an autocatalytic redox reaction using hypophosphite as a reducing agent, and the reaction formula is as follows:
  • the palladium layer is formed by the redox reaction of sodium hypophosphite and hydrochloric acid, and the reaction formula is as follows:
  • a method for manufacturing a circuit board includes:
  • a conductive pattern is formed on a substrate, the conductive pattern includes electrically connected lines and a conductive layer, the conductive pattern is divided into a soldering area and a non-welding area, wherein the conductive layer and part of the wiring are located in the soldering area, Another part of the circuit is located in the non-welded area;
  • a sealing film is formed, the sealing film covers the conductive pattern after nickel-palladium plating, wherein the conductive layer covered with the sealing film forms a gold finger.
  • a conductive pattern is formed on the substrate, and the conductive pattern includes electrically connected lines and conductive layers so as to satisfy the electrical connection relationship of the components to be soldered.
  • the conductive pattern is divided into a welding area and a non-welding area. Among them, the conductive layer and part of the circuit are located in the welding area, and another part of the circuit is located in the non-welding area, forming a solder resist layer covering the conductive pattern of the non-welding area to protect the conductive non-welding area
  • the conductive pattern is not oxidized, and the part of the conductive pattern located in the non-welded area is prevented from being connected to the portion located in the welding area to cause short circuit.
  • Micro-etching, brushing and/or sandblasting of the conductive patterns in the welding area to ensure that the conductive patterns in the welding area are clean and pollution-free.
  • Nickel-palladium is plated on the conductive pattern after microetching, brushing and/or sandblasting to improve the corrosion resistance of the conductive pattern located in the welding area.
  • a sealing film covering the conductive pattern after plating nickel and palladium is formed to further improve the corrosion resistance of the conductive pattern in the welding area, so that the gold finger can pass the mixed gas corrosion test.
  • a gold finger including:
  • a nickel layer arranged on the conductive layer
  • the palladium layer is disposed on the side of the nickel layer facing away from the conductive layer;
  • the sealing film is arranged on the side of the palladium layer facing away from the nickel layer.
  • the conductive layer is used for electrical connection with the circuit.
  • the nickel layer provided on the conductive layer can prevent the conductive layer from corroding, and on the other hand, it can provide a welding base for the components to be welded.
  • the palladium layer arranged on the side of the nickel layer facing away from the conductive layer can prevent the nickel layer from corroding and improve the corrosion resistance of the gold finger.
  • the sealing film provided on the side of the palladium layer facing away from the nickel layer can further improve the corrosion resistance of the gold finger, so that the gold finger can pass the mixed gas corrosion test.
  • the conductive layer is a copper layer, and the thickness of the nickel layer ranges from 3 ⁇ m to 8 ⁇ m.
  • the thickness of the palladium layer ranges from 0.1 ⁇ m to 0.3 ⁇ m.
  • the thickness of the sealing film ranges from 0.02 ⁇ m to 0.03 ⁇ m.
  • a circuit board including:
  • the gold finger as described above is arranged on the substrate;
  • a circuit is arranged on the substrate, and the circuit is electrically connected with the golden finger.
  • the circuit board includes the gold finger and has the technical effect of the gold finger, the gold finger can pass the mixed gas corrosion test.
  • Fig. 1 is a schematic flow chart of a method for manufacturing a gold finger in an embodiment
  • FIG. 2 is a schematic flowchart of a method for manufacturing a gold finger in another embodiment
  • FIG. 3 is a schematic flowchart of a manufacturing method of a circuit board in an embodiment
  • FIG. 4 is a schematic flowchart of a manufacturing method of a circuit board in another embodiment
  • Figure 5 is a cross-sectional view of a gold finger in an embodiment.
  • a method for manufacturing a gold finger in an embodiment is used to make a corrosion-resistant gold finger, so that the gold finger can pass the mixed gas corrosion test.
  • the method for making gold fingers includes the following steps:
  • Step S110 forming a conductive layer.
  • the conductive layer is electrically connected to the circuit.
  • the conductive layer is formed by etching, the conductive layer is a copper layer, and the process is mature, wherein the thickness of the copper layer can be flexibly set according to customer needs.
  • the conductive layer can be formed by other methods, such as laser.
  • the conductive layer can also be a layered structure of other materials, such as an aluminum layer.
  • a nickel layer is formed on the conductive layer.
  • the existence of the nickel layer can prevent corrosion of the conductive layer on the one hand, and on the other hand can play the role of providing a welding base for the components.
  • the nickel layer can be formed by electroplating or electroless plating.
  • the nickel layer is formed by an autocatalytic redox reaction using hypophosphite as a reducing agent, and the reaction formula is as follows:
  • the method of using hypophosphite as a reducing agent to form an autocatalytic redox reaction has the characteristics of low cost. Understandably, the nickel layer in this embodiment is formed by electroless plating, and since hydrogen is generated during the reaction, pores will appear on the nickel layer. Of course, in other embodiments, electroplating or other electroless plating methods can also be used to form the nickel layer.
  • the thickness of the nickel layer ranges from 3 ⁇ m to 8 ⁇ m. If the thickness of the nickel layer is less than 3 ⁇ m, the conductive layer will easily diffuse to the surface of the nickel layer facing away from the conductive layer. On the one hand, the corrosion resistance of the gold finger will decrease, and on the other hand, the gold finger will have poor soldering. If the thickness of the nickel layer is greater than 8 ⁇ m, the nickel layer is prone to nickel corrosion defects, resulting in poor welding of the gold fingers. In this embodiment, the thickness of the nickel layer is 5 ⁇ m. Of course, in other embodiments, the thickness of the nickel layer may be 4 ⁇ m, 6 ⁇ m, or the like.
  • a palladium layer is formed on the side of the nickel layer opposite to the conductive layer.
  • the presence of the palladium layer can prevent the nickel layer from corroding and improve the corrosion resistance of the gold finger.
  • the palladium layer can be formed by electroplating or electroless plating.
  • the palladium layer is formed by the redox reaction of sodium hypophosphite and hydrochloric acid, and the reaction formula is as follows:
  • the method of using sodium hypophosphite and hydrochloric acid system to perform oxidation-reduction reaction to form a palladium layer has the characteristics of low cost, difficult to black plate and high welding reliability. It is understandable that the formation method of the palladium layer in this embodiment belongs to electroless plating. Since hydrogen is generated during the reaction, pores will appear on the palladium layer. Of course, in other embodiments, the palladium layer can also be formed by electroplating or other electroless plating methods.
  • the thickness of the palladium layer ranges from 0.1 ⁇ m to 0.3 ⁇ m. If the thickness of the palladium layer is less than 0.1 ⁇ m, the diameter of the pores generated in the palladium layer will be too large, which exceeds the sealing ability of the sealing film, and the corrosion resistance of the gold finger is reduced. If the thickness of the palladium layer is greater than 0.3 ⁇ m, it is more difficult to form the palladium layer, resulting in increased cost. In this embodiment, the thickness of the nickel layer is 0.2 ⁇ m. Of course, in other embodiments, the thickness of the nickel layer may be 0.15 ⁇ m, 0.25 ⁇ m, or the like.
  • Step S140 forming a sealing film on the side of the palladium layer facing away from the nickel layer.
  • the presence of the sealing film can further improve the corrosion resistance of the gold finger, so that the gold finger can pass the mixed gas corrosion test.
  • the sealing film can be formed with a sealing agent.
  • the sealing agent is NF1208 sealing agent produced by Guangzhou Tianzhi Environmental Protection Technology Co., Ltd.
  • the temperature range of the sealing solution prepared by the sealing agent can be 50-60°C, and the reaction time can be 3 minutes ⁇ 5min. For example, react at 55°C for 4 min.
  • the sealing film can also be formed with other types of sealing agents.
  • the traditional anti-oxidant layer is usually formed by using anti-oxidant solution, which is difficult to form a film.
  • the sealing film in this embodiment has strong biological surface activity and can quickly penetrate into the pores of the plating layer to play a role.
  • the sealing film can form a bidentate or multidentate chelate structure with the metal at the pores of the plating layer, passivate the plating layer by layer, and eliminate the hidden corrosion risk of the plating layer.
  • the sealing film also has a certain degree of hydrophobicity to strengthen the protection of the sealing and cut off the channel of external corrosive gas.
  • the thickness of the sealing film ranges from 0.02 ⁇ m to 0.03 ⁇ m. If the thickness of the sealing film is less than 0.02 ⁇ m, it will lead to poor sealing, such as missing sealing. If the thickness of the sealing film is less than 0.03 ⁇ m, it will result in poor welding. In this embodiment, the thickness of the sealing film is 0.025 ⁇ m. Of course, in other embodiments, the thickness of the sealing film may be 0.02 ⁇ m or 0.03 ⁇ m, etc. It should be noted that when the nickel layer and/or the palladium layer are formed by other methods that do not generate pores, the presence of the sealing film can still improve the corrosion resistance of the gold finger.
  • the manufacturing method of gold fingers in another embodiment is used to manufacture corrosion-resistant gold fingers, which has the feature of lower cost.
  • the manufacturing method of gold fingers in another embodiment and the manufacturing method of gold fingers in one embodiment mainly include the following differences:
  • the method further includes step S111 of performing micro-etching, brushing and/or sandblasting on the conductive layer.
  • the combination of microetching, brushing and/or sandblasting can effectively remove oxides and impurities on the surface of the conductive layer, roughen the conductive layer, and clean the conductive layer, so that the conductive layer is clean. No pollution.
  • sulfuric acid and sodium persulfate can be used to roughen the conductive layer to enhance the bonding ability of the conductive layer and the nickel layer.
  • a sandblasting machine can be used to spray blasting materials such as alumina onto the conductive layer, so that the conductive layer has a certain degree of cleanliness and roughness.
  • spray blasting materials such as alumina
  • the conductive layer has a certain degree of cleanliness and roughness.
  • only micro-etching, brushing or sandblasting can be used to clean the board surface.
  • the method further includes step S141 of detecting the sealing condition.
  • the inspection of the sealing condition it can focus on detecting whether there is a phenomenon of missing sealing, so as to make high-quality golden fingers.
  • the second inspection can be done with inspection tools such as a tenfold mirror.
  • the sealing quality of the pores can also be tested during the testing of the sealing condition.
  • the normal production time of a single cycle of the gold immersion tank is 25 minutes.
  • the chemical sealing agent sealing time is 5 minutes, by contrast, the efficiency can be increased by 80%.
  • a method of manufacturing a circuit board in an embodiment is used to manufacture a circuit board including gold fingers, and the gold fingers included in the circuit board can pass the mixed gas corrosion test.
  • the manufacturing method of the circuit board includes the following steps:
  • a conductive pattern is formed on the substrate.
  • the conductive pattern includes electrically connected lines and a conductive layer.
  • the conductive pattern is divided into a soldering area and a non-welding area.
  • the conductive layer and some of the lines are located in the soldering area, and the other part of the wiring is located in the non-welding area. .
  • the circuit and the conductive layer are electrically connected to meet the electrical connection relationship of the components to be welded.
  • the conductive pattern can be formed by etching.
  • the material of the circuit and the conductive layer is copper, which is relatively uniform and the process is mature. Of course, in other embodiments, the material of the circuit and/or the conductive layer can be changed.
  • a pad is formed in step S210, the pad belongs to a conductive pattern, and both the circuit and the conductive layer include pads.
  • step S220 a solder resist layer is formed, and the solder resist layer covers the conductive pattern in the non-welded area.
  • the presence of the solder resist layer can protect the non-welded parts on the conductive pattern from oxidation, and prevent the conductive pattern in the non-welded area from being connected to the conductive pattern in the soldered area and cause a short circuit.
  • the pad is located in the bonding area.
  • step S230 the conductive pattern of the welding area is micro-etched, brushed and/or sandblasted.
  • Micro-etching, brushing and/or sand blasting can be performed only on the conductive pattern in the soldering area, or on the entire surface of the substrate plate where the conductive pattern is formed.
  • the three methods of micro-etching, brushing, and sandblasting are combined, and the entire surface of the substrate plate on which the conductive pattern is formed is performed, which is convenient for operation. Of course, in other embodiments, one or two of them can be selected.
  • Step S240 plating nickel and palladium on the conductive pattern after microetching, brushing and/or sandblasting.
  • the nickel-palladium plating is performed by electroless plating.
  • the conductive pattern is first plated with nickel, and then the nickel-plated conductive pattern is plated with palladium.
  • nickel-palladium plating is performed by electroplating.
  • a sealing film is formed.
  • the sealing film covers the conductive pattern plated with nickel and palladium, wherein the conductive layer covered with the sealing film forms a gold finger.
  • the presence of the sealing film can further improve the corrosion resistance of the conductive pattern.
  • a sealing film is formed on the conductive patterns located in the welding area. It should be noted that the sealing film can be formed in the welding area and the non-welding area, the sealing film in the welding area can disappear during the welding process, and the sealing film in the non-welding area can still be retained after welding.
  • a method for manufacturing a circuit board in another embodiment is used for manufacturing a circuit board with good corrosion resistance.
  • the manufacturing method of the circuit board in another embodiment and the manufacturing method of the circuit board in one embodiment mainly include the following differences:
  • the method further includes step S221 to form characters on the solder resist layer.
  • the presence of characters can play a role in marking, so that components can be placed on the circuit board later.
  • the specific content of the required characters can be determined according to the needs of customers.
  • step S241 is further included, forming: cutting the substrate into at least two sub-boards. Partially process the larger substrate first, and then cut the processed substrate into at least two sub-boards to improve production efficiency.
  • an isolation layer can be arranged between the daughter board and the daughter board to prevent the daughter board from being scratched.
  • the isolation layer may be a paper layer or the like.
  • the method further includes step S242 to perform an electrical test on the conductive pattern.
  • the electrical test can be used to determine whether there is a short circuit in the conductive pattern, so as to improve the pass rate of the circuit board. If the flying probe tester is used for electrical testing, it is necessary to ensure that the circuit board has no needle marks on the side of the pad to further improve the pass rate of the circuit board.
  • step S242 and before step S250 it further includes step S253, the first quality inspection.
  • the first quality inspection you can focus on the appearance inspection (such as the width and length of the circuit board, etc.) in order to produce high-quality circuit boards.
  • the first quality inspection can be completed with inspection tools such as visual inspection machines.
  • the first quality inspection can be performed between step S241 and step S242.
  • step S253 can be omitted.
  • step S250 it further includes step S251, a second quality inspection.
  • the focus can be on whether there is any leakage of sealing holes in order to produce high-quality circuit boards.
  • the second quality inspection can be completed with inspection tools such as a tenfold mirror.
  • the sealing quality of the pores can also be inspected.
  • the second quality inspection can be omitted.
  • step S252 is further included to package the substrate after the sealing film is formed.
  • the existence of step S272 can prevent the circuit board from being damaged and facilitate the handling of the circuit board.
  • step S252 may be omitted.
  • the circuit board in one embodiment has the characteristics of good corrosion resistance and low cost, and includes a substrate, gold fingers and circuits.
  • the gold fingers and circuits are all arranged on the substrate, and the circuits are electrically connected to the gold fingers.
  • the gold finger can be integrally formed with the circuit.
  • Corresponding components can be welded on the circuit board to achieve corresponding functions.
  • the golden finger 10 in an embodiment has the characteristics of good corrosion resistance.
  • the gold finger 10 includes a conductive layer 100, a nickel layer 200, a palladium layer 300, and a sealing film 400. It should be noted that the gold finger 10 in this embodiment can be manufactured by the gold finger manufacturing method described in any of the foregoing embodiments.
  • the nickel layer 200 is disposed on the conductive layer 100, the palladium layer 300 is disposed on the side of the nickel layer 200 facing away from the conductive layer 100, and the sealing film 400 is disposed on the side of the palladium layer 300 facing away from the nickel layer 200.
  • the presence of the conductive layer 100 facilitates the electrical connection between the gold finger 10 and the circuit.
  • the nickel layer 200 disposed on the conductive layer 100 can prevent corrosion of the conductive layer 100 on the one hand, and can provide a welding base for the components to be welded on the other hand.
  • the palladium layer 300 disposed on the side of the nickel layer 200 facing away from the conductive layer 100 can prevent the nickel layer 200 from corroding and improve the corrosion resistance of the gold finger 10.
  • the sealing film 400 disposed on the side of the palladium layer 300 facing away from the nickel layer 200 can further improve the corrosion resistance of the gold finger 10 so that the gold finger 10 can pass the mixed gas corrosion test.
  • the conductive layer 100 is a copper layer.
  • the conductive layer 100 is another layered structure capable of conducting electricity.
  • the thickness of the nickel layer 200 ranges from 3 ⁇ m to 8 ⁇ m. If the thickness of the nickel layer 200 is less than 3 ⁇ m, the conductive layer 100 will easily diffuse to the surface of the nickel layer 200 facing away from the conductive layer 100. On the one hand, the corrosion resistance of the gold finger 10 will decrease, and on the other hand, the gold finger 10 will be reduced. Poor welding appears. If the thickness of the nickel layer 200 is greater than 8 ⁇ m, the nickel layer 200 is prone to nickel corrosion defects, resulting in poor soldering of the gold finger 10. In this embodiment, the thickness of the nickel layer 200 is 5 ⁇ m. Of course, in other embodiments, the thickness of the nickel layer 200 may be 4 ⁇ m, 6 ⁇ m, or the like.
  • the thickness of the palladium layer 300 ranges from 0.1 ⁇ m to 0.3 ⁇ m. If the thickness of the palladium layer 300 is less than 0.1 ⁇ m, the diameter of the pores generated on the palladium layer 300 will be too large, exceeding the sealing capacity of the sealing film 400, and the corrosion resistance of the gold finger 10 will be reduced. If the thickness of the palladium layer 300 is greater than 0.3 ⁇ m, it is more difficult, resulting in increased cost. In this embodiment, the thickness of the nickel layer 200 is 0.2 ⁇ m. Of course, in other embodiments, the thickness of the nickel layer 200 may be 0.15 ⁇ m, 0.25 ⁇ m, or the like.
  • the thickness of the sealing film 400 ranges from 0.02 ⁇ m to 0.03 ⁇ m. If the thickness of the sealing film 400 is less than 0.02 ⁇ m, it will lead to a phenomenon of poor sealing, such as missing sealing. If the thickness of the sealing film 400 is less than 0.03 ⁇ m, it will result in poor welding. In this embodiment, the thickness of the sealing film 400 is 0.025 ⁇ m. Of course, in other embodiments, the thickness of the sealing film 400 may be 0.02 ⁇ m, 0.03 ⁇ m, or the like. It should be noted that when the nickel layer 200 and/or the palladium layer 300 are formed by other methods that do not generate pores, the presence of the sealing film 400 can still improve the corrosion resistance of the gold finger 10.

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Abstract

一种金手指（10）及其制作方法、电路板及其制作方法。金手指的制作方法包括：形成导电层（S110）；在导电层上形成镍层（S120）；在镍层背向于导电层的一侧形成钯层（S130）；在钯层背向于镍层的一侧形成封孔膜（S140）。电路板的制作方法包括：在基板上形成导电图案，导电图案包括电连接的线路及导电层，导电图案划分有焊接区及非焊接区（S210）；形成阻焊层，阻焊层覆盖非焊接区的导电图案（S220）；对焊接区的导电图案进行微蚀、磨刷和/或喷砂（S230）；对微蚀、磨刷和/或喷砂后的导电图案镀镍钯（S240）；形成封孔膜，封孔膜覆盖镀镍钯后的导电图案（S250）。上述金手指（10）及其制作方法、电路板及其制作方法能够使金手指（10）能够通过混合气体腐蚀测试。

Description

金手指及其制作方法、电路板及其制作方法 技术领域
本发明涉及耐腐蚀技术领域，特别是涉及一种金手指及其制作方法、电路板及其制作方法。
背景技术
电路板包括基板、线路及金手指，线路与金手指均设置于基板上，线路与金手指电连接。客户从厂家购买电路板后，可在电路板上焊接相应的元器件，以实现相应的功能。金手指的耐腐蚀性是客户评判金手指及包括金手指的电路板的指标之一，客户通常会利用混合气体腐蚀测试来测试金手指的耐腐蚀性。在传统技术中，金手指较难通过混合气体腐蚀测试。
发明内容
基于此，有必要针对上述问题，提供一种金手指及其制作方法、电路板及其制作方法，旨在使金手指能够通过混合气体腐蚀测试。
一种金手指的制作方法，包括：
形成导电层；
在所述导电层上形成镍层；
在所述镍层背向于所述导电层的一侧形成钯层；及
在所述钯层背向于所述镍层的一侧形成封孔膜。
上述金手指的制作方法至少具有以下优点：
形成导电层，以与线路电连接。在导电层上形成镍层，以防止导电层发生 腐蚀，同时镍层还可起到为元器件提供焊接基底的作用。在镍层背向于导电层的一侧形成钯层，以防止镍层发生腐蚀，提高金手指的耐腐蚀性。在钯层背向于镍层的一侧形成封孔膜，以进一步提高金手指的耐腐蚀性，从而使金手指能够通过混合气体腐蚀测试。
下面进一步对技术方案进行说明：
在其中一个实施例中，步骤形成导电层之后，步骤在所述导电层上形成镍层之前，还包括步骤：对所述导电层进行微蚀、磨刷和/或喷砂。
在其中一个实施例中，所述导电层为铜层，所述镍层利用次磷酸盐作为还原剂进行自催化氧化还原反应形成，其反应式如下：
Figure PCTCN2019104446-appb-000001
Ni 2++2H→Ni↓+2H +
Figure PCTCN2019104446-appb-000002
在其中一个实施例中，所述钯层利用次磷酸钠与盐酸体系进行氧化还原反应形成，其反应式如下：
Figure PCTCN2019104446-appb-000003
Pd 2++2H→Pd↓+2H +
Figure PCTCN2019104446-appb-000004
一种电路板的制作方法，包括：
在基板上形成导电图案，所述导电图案包括电连接的线路及导电层，所述导电图案划分有焊接区及非焊接区，其中，所述导电层及部分所述线路位于所述焊接区，另一部分所述线路位于所述非焊接区；
形成阻焊层，所述阻焊层覆盖所述非焊接区的导电图案；
对所述焊接区的所述导电图案进行微蚀、磨刷和/或喷砂；
对微蚀、磨刷和/或喷砂后的所述导电图案镀镍钯；及
形成封孔膜，所述封孔膜覆盖镀镍钯后的所述导电图案，其中，覆盖有所述封孔膜的所述导电层形成金手指。
上述电路板的制作方法至少具有以下优点：
在基板上形成导电图案，导电图案包括电连接的线路及导电层，以便于满足待焊的元器件的电连接关系。导电图案划分有焊接区及非焊接区，其中，导电层及部分线路位于焊接区，另一部分线路位于非焊接区，形成覆盖非焊接区的导电图案的阻焊层，以保护导非焊接区的导电图案不受氧化，防止导电图案上位于非焊接区的部分与位于焊接区的部分连接而导致短路。对焊接区的导电图案进行微蚀、磨刷和/或喷砂，以保证焊接区的导电图案清洁无污染。对微蚀、磨刷和/或喷砂后的导电图案镀镍钯，以提高位于焊接区内的导电图案的耐腐蚀性。形成覆盖镀镍钯后的导电图案的封孔膜，以进一步提高位于焊接区内的导电图案的耐腐蚀性，从而使金手指能够通过混合气体腐蚀测试。
一种金手指，包括：
导电层；
镍层，设置于所述导电层上；
钯层，设置于所述镍层背向于所述导电层的一侧；及
封孔膜，设置于所述钯层背向于所述镍层的一侧。
上述金手指至少具有以下优点：
导电层用于与线路电连接，设置于导电层上镍层一方面可防止导电层发生腐蚀，另一方面可为待焊的元器件提供焊接基底。设置于镍层背向于导电层的一侧的钯层可防止镍层发生腐蚀，提高金手指的耐腐蚀性。设置于钯层背向于镍层的一侧的封孔膜可进一步提高金手指的耐腐蚀性，从而使金手指能够通过 混合气体腐蚀测试。
下面进一步对技术方案进行说明：
在其中一个实施例中，所述导电层为铜层，所述镍层的厚度范围为3μm～8μm。
在其中一个实施例中，所述钯层的厚度范围为0.1μm～0.3μm。
在其中一个实施例中，所述封孔膜的厚度范围为0.02μm～0.03μm。
一种电路板，包括：
基板；
如上述所述的金手指，设置于所述基板上；及
线路，设置于所述基板上，所述线路与所述金手指电连接。
上述电路板至少具有以下优点：
由于电路板包括上述金手指，具备上述金手指的技术效果，故能够使金手指能够通过混合气体腐蚀测试。
附图说明
图1为一实施例中金手指的制作方法的流程示意图；
图2为另一实施例中金手指的制作方法的流程示意图；
图3为一实施例中电路板的制作方法的流程示意图；
图4为又一实施例中电路板的制作方法的流程示意图；
图5为一实施例中金手指的剖视图。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对 本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施的限制。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
当下越来越多的客户对金手指的耐腐蚀性提出了要求，因此生产厂家也越来越重视金手指的耐腐蚀性。本申请的发明人发现，在传统技术中，经表面处理工艺处理的金手指不能使金手指的耐腐蚀性达标。
请参阅图1，一实施例中的金手指的制作方法，用于制作耐腐蚀的金手指，从而使金手指能够通过混合气体腐蚀测试。具体到本实施例中，金手指的制作方法包括以下步骤：
步骤S110，形成导电层。导电层与线路电连接。在本实施例中，导电层通过蚀刻的方式形成，导电层为铜层，工艺成熟，其中，铜层的厚度可根据客户的需要灵活设置。当然，在其他实施例中，导电层可通过其他方式形成，如激光镭射等。导电层也可以为其他材质的层状结构，如铝层等。
步骤S120，在导电层上形成镍层。镍层的存在一方面可防止导电层发生腐蚀，另一方面可起到为元器件提供焊接基底的作用，镍层的形成方式可以是电镀或者化学镀等。在本实施例中，镍层利用次磷酸盐作为还原剂进行自催化氧化还原反应形成，其反应式如下：
Figure PCTCN2019104446-appb-000005
Ni 2++2H→Ni↓+2H +
Figure PCTCN2019104446-appb-000006
利用次磷酸盐作为还原剂进行自催化氧化还原反应形成的方式具有成本较低的特点。可以理解地，本实施例中镍层的形成方式属于化学镀，由于反应过程中有氢气产生，故镍层上会有孔隙出现。当然，在其他实施例中，还可以采用电镀或其他化学镀的方式形成镍层。
进一步地，镍层的厚度范围为3μm～8μm。若镍层的厚度小于3μm，导电层容易扩散至镍层的背向于导电层的表面上，一方面会导致金手指的耐腐蚀性降低，另一方面会导致金手指出现焊接不良的现象。若镍层的厚度大于8μm，则镍层容易出现镍腐蚀缺陷，导致金手指出现焊接不良的现象。在本实施例中，镍层的厚度为5μm。当然，在其他实施例中，镍层的厚度可以为4μm或6μm等。
步骤S130，在镍层背向于导电层的一侧形成钯层。钯层的存在可防止镍层发生腐蚀，提高金手指的耐腐蚀性，钯层的形成方式可以是电镀或者化学镀等。在本实施例中，钯层利用次磷酸钠与盐酸体系进行氧化还原反应形成，其反应式如下：
Figure PCTCN2019104446-appb-000007
Pd 2++2H→Pd↓+2H +
Figure PCTCN2019104446-appb-000008
利用次磷酸钠与盐酸体系进行氧化还原反应形成钯层的方式具有成本较低、不易黑盘及焊接可靠性较高等特点。可以理解地，本实施例中钯层的形成方式属于化学镀，由于反应过程中有氢气产生，故钯层上会有孔隙出现。当然，在其他实施例中，还可以采用电镀或其他化学镀的方式形成钯层。
进一步地，钯层的厚度范围为0.1μm～0.3μm。若钯层的厚度小于0.1μm，会导致钯层上产生的孔隙直径过大，超过封孔膜的封孔能力，使得金手指的耐腐蚀性降低。若钯层的厚度大于0.3μm，则形成钯层的难度较大，导致成本增加。在本实施例中，镍层的厚度为0.2μm。当然，在其他实施例中，镍层的厚度可以为0.15μm或0.25μm等。
步骤S140，在钯层背向于镍层的一侧形成封孔膜。封孔膜的存在可在进一步提高金手指的耐腐蚀性，从而使金手指能够通过混合气体腐蚀测试。其中，封孔膜可利用封孔剂形成。在本实施例中，封孔剂为广州天至环保科技有限公司生产的NF1208封孔剂，封孔剂配成的封孔溶液的温度范围可为50～60℃，反应时间的范围可为3min～5min。例如，在55℃下反应4min。当然，在其他实施例中，封孔膜还可利用其他种类的封孔剂形成。
传统的抗氧化层通常利用抗氧化药水形成，其较难成膜。区别于传统的抗氧化层，本实施例中的封孔膜具有较强的生物表面活性，能够快速深入到镀层孔隙内发挥作用。封孔膜能够与镀层孔隙处的金属形成双齿或多齿螯合结构，逐层钝化镀层，消除镀层的腐蚀隐患。封孔膜还具有一定的疏水性，以强化封孔保护作用，切断外界腐蚀气体的通道。
进一步地，封孔膜的厚度范围为0.02μm～0.03μm。若封孔膜的厚度小于0.02μm，会导致产生封孔不良的现象，如漏封孔等。若封孔膜的厚度小于0.03 μm，则会导致焊接不良的后果。在本实施例中，封孔膜的厚度为0.025μm。当然，在其他实施例中，封孔膜的厚度可以为0.02μm或0.03μm等。需要说明的是，在利用其他不产生孔隙的方式形成镍层和/或钯层时，封孔膜的存在仍可起到提高金手指的耐腐蚀性的作用。
请参阅图2，另一实施例中的金手指的制作方法，用于制作耐腐蚀的金手指，具有成本较低的特点。另一实施例中的金手指的制作方法与一实施例中的金手指的制作方法主要包括以下区别：
在另一实施例中的金手指的制作方法中，步骤S110之后，步骤S120之前，还包括步骤S111，对导电层进行微蚀、磨刷和/或喷砂。在本实施例中，通过微蚀、磨刷和/或喷砂相结合的方式，能有效去除导电层的表面的氧化物与杂物、粗化导电层及清洁导电层，以使导电层清洁无污染。微蚀时，可利用硫酸与过硫酸钠粗化导电层，以增强导电层与镍层的结合能力。磨刷时，可选用1000#～12000#的刷轮进行磨刷，以获得较好的磨刷效果。喷砂时，可利用喷砂机将氧化铝等喷料喷射至导电层，以使导电层具有一定的清洁度及粗糙度。当然，在其他实施例中，可仅利用微蚀、磨刷或喷砂的方式进行板面清洁。
在另一实施例中的金手指的制作方法中，步骤S140之后，还包括步骤S141，封孔情况检测。在封孔情况检测期间，可重点检测是否存在漏封孔的现象，以便制作高品质的金手指。第二次检测可利用十倍镜等检测工具完成。当然，在其他实施例中，在封孔情况检测期间，还可对孔隙的封孔质量进行检测。
利用上述任一实施例中的金手指的制作方法及用该方法制作而成的金手指至少具有以下优点：
(1)工艺上只镀镍钯不镀金，与相同耐腐蚀能力的电镀厚金的金手指相比，成本节省3/4；
(2)传统镀镍钯金的金手指不能通过硝酸蒸汽暴露60min，利用上述任一实施例中的金手指的制作方法制作而成的金手指能满足通过硝酸蒸汽暴露60min的硝酸蒸汽测试要求。
(3)在传统技术中，以电镀厚金为例，镀金时，浸金缸的单循环正常生产时间是25min。在上述任一实施例中的金手指的制作方法中，化学封孔剂封孔时间是5min，相比之下，效率可提升80％。
请参阅图3，一实施例中的电路板的制作方法，用于制作包括金手指的电路板，电路板包括的金手指能够通过混合气体腐蚀测试。具体到本实施例中，电路板的制作方法包括以下步骤：
步骤S210，在基板上形成导电图案，导电图案包括电连接的线路及导电层，导电图案划分有焊接区及非焊接区，其中，导电层及部分线路位于焊接区，另一部分线路位于非焊接区。线路及导电层电连接，以便于满足待焊的元器件的电连接关系。导电图案可通过蚀刻的方式形成。在本实施例中，线路及导电层的材质均为铜，较为统一且工艺成熟。当然，在其他实施例中，线路和/或导电层的材质可改变。在本实施例中，步骤S210中形成焊盘，焊盘属于导电图案，线路与导电层均包括焊盘，
步骤S220，形成阻焊层，阻焊层覆盖非焊接区的导电图案。阻焊层的存在可保护导电图案上的非焊接部位不受氧化，防止非焊接区内的导电图案与焊接区内的导电图案连接而导致短路。在本实施例中，焊盘位于焊接区。
步骤S230，对焊接区的导电图案进行微蚀、磨刷和/或喷砂。微蚀、磨刷和/或喷砂可以仅对焊接区的导电图案进行，也可以对基板板形成有导电图案的整个板面进行。在本实施例中，微蚀、磨刷和喷砂三种方式相结合，且对基板板形成有导电图案的整个板面进行，操作方便。当然，在其他实施例中，可选 择其中一种或两种进行。
步骤S240，对微蚀、磨刷和/或喷砂后的导电图案镀镍钯。在本实施例中，镀镍钯采用化学镀的方式进行，先在导电图案上镀镍，然后在镀镍后的导电图案上镀钯。当然，在其他实施例中，镀镍钯采用电镀的方式进行。
步骤S250，形成封孔膜，封孔膜覆盖镀镍钯后的导电图案，其中，覆盖有封孔膜的导电层形成金手指。封孔膜的存在能够进一步提高导电图案的耐腐蚀性。在本实施例中，位于焊接区的导电图案上均形成有封孔膜。需要说明的是，焊接区与非焊接区内均可形成封孔膜，焊接区的封孔膜可在焊接过程中消失，非焊接区的封孔膜在焊接后依然能够保留。
请参阅图4，又一实施例中的电路板的制作方法，用于制作耐腐蚀性好的电路板。又一实施例中的电路板的制作方法与一实施例中的电路板的制作方法主要包括以下区别：
在又一实施例中的电路板的制作方法中，步骤S220之后，步骤S230之前，还包括步骤S221，在阻焊层上形成字符。字符的存在可起到标识作用，以便于后期在电路板上放置元器件。所需字符的具体内容可根据客户的需求决定。
在又一实施例中的电路板的制作方法中，步骤S240之后，步骤S250之前，还包括步骤S241，成型：将基板切割为至少两块子板。先在较大的基板上进行部分加工，然后将加工后的基板切割为至少两块子板，以提高生产效率。成型后，子板与子板之间可设置一隔离层，以防止子板被划伤。其中，隔离层可以是纸层等。
在又一实施例中的电路板的制作方法中，步骤S241之后，步骤S250之前，还包括步骤S242，对导电图案进行电测试。可通过电测试判断导电图案中是否存在短路现象，以便于提高电路板的合格率。若利用飞针测试机进行电测试， 则需保证电路板具有焊盘的一面无针印，以进一步提高电路板的合格率。
在又一实施例中的电路板的制作方法中，步骤S242之后，步骤S250之前，还包括步骤S253，第一次质检。在第一次质检期间，可重点进行外观检测(如电路板的宽度及长度等)，以便制作高品质的电路板。第一次质检可利用外观检查机等检测工具完成。当然，在其他实施例中，第一次质检可在步骤S241与步骤S242之间进行。或者，步骤S253可省去。
在又一实施例中的电路板的制作方法中，步骤S250之后，还包括步骤S251，第二次质检。在第二次质检期间，可重点检测是否存在漏封孔的现象，以便制作高品质的电路板。第二次质检可利用十倍镜等检测工具完成。当然，在其他实施例中，在第二次质检期间，还可对孔隙的封孔质量进行检测。或者，第二次质检可省去。
在又一实施例中的电路板的制作方法中，步骤S251之后，还包括步骤S252，对形成封孔膜后的基板进行包装。步骤S272的存在可防止电路板被损坏，便于搬运电路板。当然，在其他实施例中，步骤S252可省去。
一实施例中的电路板，具有耐腐蚀性好且成本较低的特点，包括基板、金手指及线路，金手指及线路均设置于基板上，线路与金手指电连接。其中，金手指可与线路一体成型。可在电路板上焊接相应的元器件，以实现相应的功能。
请参阅图5，一实施例中的金手指10，具有耐腐蚀性好的特点。具体地，金手指10包括导电层100、镍层200、钯层300及封孔膜400。需要说明的是，本实施例中的金手指10可由上述任一实施例所述的金手指的制作方法制作而成。
镍层200设置于导电层100上，钯层300设置于镍层200背向于导电层100的一侧，封孔膜400设置于钯层300背向于镍层200的一侧。导电层100的存 在便于金手指10与线路电连接，设置于导电层100上镍层200一方面可防止导电层100发生腐蚀，另一方面可为待焊的元器件提供焊接基底。设置于镍层200背向于导电层100的一侧的钯层300可防止镍层200发生腐蚀，提高金手指10的耐腐蚀性。设置于钯层300背向于镍层200的一侧的封孔膜400可进一步提高金手指10的耐腐蚀性，从而使金手指10能够通过混合气体腐蚀测试。
在本实施例中，导电层100为铜层。当然，在其他实施例中，导电层100为其他能够导电的层状结构。
进一步地，镍层200的厚度范围为3μm～8μm。若镍层200的厚度小于3μm，导电层100容易扩散至镍层200的背向于导电层100的表面上，一方面会导致金手指10的耐腐蚀性降低，另一方面会导致金手指10出现焊接不良的现象。若镍层200的厚度大于8μm，则镍层200容易出现镍腐蚀缺陷，导致金手指10出现焊接不良的现象。在本实施例中，镍层200的厚度为5μm。当然，在其他实施例中，镍层200的厚度可以为4μm或6μm等。
进一步地，钯层300的厚度范围为0.1μm～0.3μm。若钯层300的厚度小于0.1μm，会导致钯层300上产生的孔隙直径过大，超过封孔膜400的封孔能力，使得金手指10的耐腐蚀性降低。若钯层300的厚度大于0.3μm，则难度较大，导致成本增加。在本实施例中，镍层200的厚度为0.2μm。当然，在其他实施例中，镍层200的厚度可以为0.15μm或0.25μm等。
进一步地，封孔膜400的厚度范围为0.02μm～0.03μm。若封孔膜400的厚度小于0.02μm，会导致产生封孔不良的现象，如漏封孔等。若封孔膜400的厚度小于0.03μm，则会导致焊接不良的后果。在本实施例中，封孔膜400的厚度为0.025μm。当然，在其他实施例中，封孔膜400的厚度可以为0.02μm或0.03μm等。需要说明的是，在利用其他不产生孔隙的方式形成镍层200和/ 或钯层300时，封孔膜400的存在仍可起到提高金手指10的耐腐蚀性的作用。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种金手指的制作方法，其特征在于，包括：
    形成导电层；
    在所述导电层上形成镍层；
    在所述镍层背向于所述导电层的一侧形成钯层；及
    在所述钯层背向于所述镍层的一侧形成封孔膜。
  2. 根据权利要求1所述的金手指的制作方法，其特征在于，步骤形成导电层之后，步骤在所述导电层上形成镍层之前，还包括步骤：对所述导电层进行微蚀、磨刷和/或喷砂。
  3. 根据权利要求1或2所述的金手指的制作方法，其特征在于，所述导电层为铜层，所述镍层利用次磷酸盐作为还原剂进行自催化氧化还原反应形成，其反应式如下：
    Figure PCTCN2019104446-appb-100001
    Ni 2++2H→Ni↓+2H +
    Figure PCTCN2019104446-appb-100002
  4. 根据权利要求1或2所述的金手指的制作方法，其特征在于，所述钯层利用次磷酸钠与盐酸体系进行氧化还原反应形成，其反应式如下：
    Figure PCTCN2019104446-appb-100003
    Pd 2++2H→Pd↓+2H +
    Figure PCTCN2019104446-appb-100004
  5. 一种电路板的制作方法，其特征在于，包括：
    在基板上形成导电图案，所述导电图案包括电连接的线路及导电层，所述导电图案划分有焊接区及非焊接区，其中，所述导电层及部分所述线路位于所 述焊接区，另一部分所述线路位于所述非焊接区；
    形成阻焊层，所述阻焊层覆盖所述非焊接区的导电图案；
    对所述焊接区的所述导电图案进行微蚀、磨刷和/或喷砂；
    对微蚀、磨刷和/或喷砂后的所述导电图案镀镍钯；及
    形成封孔膜，所述封孔膜覆盖镀镍钯后的所述导电图案，其中，覆盖有所述封孔膜的所述导电层形成金手指。
  6. 一种金手指，其特征在于，包括：
    导电层；
    镍层，设置于所述导电层上；
    钯层，设置于所述镍层背向于所述导电层的一侧；及
    封孔膜，设置于所述钯层背向于所述镍层的一侧。
  7. 根据权利要求6所述的金手指，其特征在于，所述导电层为铜层，所述镍层的厚度范围为3μm～8μm。
  8. 根据权利要求7所述的金手指，其特征在于，所述钯层的厚度范围为0.1μm～0.3μm。
  9. 根据权利要求8所述的金手指，其特征在于，所述封孔膜的厚度范围为0.02μm～0.03μm。
  10. 一种电路板，其特征在于，包括：
    基板；
    如权利要求6至9任一项所述的金手指，设置于所述基板上；及
    线路，设置于所述基板上，所述线路与所述金手指电连接。
PCT/CN2019/104446 2019-04-04 2019-09-04 金手指及其制作方法、电路板及其制作方法 WO2020199499A1 (zh)

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