WO2020196265A1 - 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 - Google Patents

表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 Download PDF

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Publication number
WO2020196265A1
WO2020196265A1 PCT/JP2020/012303 JP2020012303W WO2020196265A1 WO 2020196265 A1 WO2020196265 A1 WO 2020196265A1 JP 2020012303 W JP2020012303 W JP 2020012303W WO 2020196265 A1 WO2020196265 A1 WO 2020196265A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
roughened
roughened particles
particles
treated
Prior art date
Application number
PCT/JP2020/012303
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
惇郎 佐野
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to KR1020217029665A priority Critical patent/KR102706307B1/ko
Priority to CN202080023613.0A priority patent/CN113795614B/zh
Publication of WO2020196265A1 publication Critical patent/WO2020196265A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Definitions

  • the specific surface area is increased by forming fine irregularities on the roughened surface, it is roughened depending on the type of the resin base material when it is bonded to the resin base material. Poor filling of resin on the surface may occur. In such a case, there is a problem that a gap is generated between the resin base material and the copper foil, which causes deterioration in heat resistance and moisture resistance and reliability of the substrate.
  • the surface-treated copper foil of the present invention has a copper foil substrate and a surface-treated film containing a roughened layer formed by forming roughened particles on at least one surface of the copper foil substrate.
  • the surface of such a surface-treated film is at least one surface of the outermost surface (front and back surfaces) of the surface-treated copper foil, and a state in which roughened particles formed on at least one surface of the copper foil substrate are formed. It is a roughened surface having a fine uneven surface shape that reflects the particle shape and the like.
  • the surface of such a surface-treated film (hereinafter referred to as "roughened surface”) may be, for example, the surface of a roughened-treated layer formed on a copper foil substrate, or on the roughened-treated layer.
  • the roughened particles satisfying the above requirement (III) are extracted as the roughened particles (p'). Since the anchor effect of such roughened particles (p') works more effectively, the peel strength cannot be expressed only by the effect of the particle height (h) and the ratio of the particle height to the particle width (w). Bring improvement.
  • a method for measuring the number of nodes (hereinafter, may be simply referred to as “roughened particle nodes”) of the roughened particles specified in the requirement (III) will be described with reference to FIG.
  • the average value of the width (w) of the roughened particles is preferably 0.2 to 1.0 ⁇ m, more preferably 0.2 to 0.6 ⁇ m, and further preferably 0.3 to 0.5 ⁇ m. Is. In particular, when the average value of the width (w) of the roughened particles is 0.5 ⁇ m or less, the heat resistance can be further improved.
  • the linear density (d) of the roughened particles on the roughened surface is preferably 0.5 to 2.5 particles / ⁇ m, more preferably 0.8 to 2.1 particles / ⁇ m, and further. It is preferably 1.0 to 1.8 pieces / ⁇ m.
  • the linear density (d) of the roughened particles is a value calculated from the number of roughened particles (observation target particles) existing around 75 ⁇ m in the width direction of the observation field, and is per unit line region (width region). Means the particle number density of.
  • the surface-treated copper foil of the present invention has a developed area ratio (Sdr) measured by a three-dimensional white interference type microscope on the roughened surface, preferably 250 to 400%, more preferably 290 to 390%. More preferably, it is 300 to 380%.
  • the developed area ratio (Sdr) is 290% or more, more excellent adhesion and heat resistance can be realized.
  • the developed area ratio (Sdr) of the roughened particles is 390% or less, more excellent transmission characteristics can be realized.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
PCT/JP2020/012303 2019-03-26 2020-03-19 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 WO2020196265A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020217029665A KR102706307B1 (ko) 2019-03-26 2020-03-19 표면 처리 동박, 그리고 이것을 이용한 동클래드 적층판 및 프린트 배선판
CN202080023613.0A CN113795614B (zh) 2019-03-26 2020-03-19 表面处理铜箔、使用了该表面处理铜箔的覆铜层叠板以及印刷电路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019059395A JP6816193B2 (ja) 2019-03-26 2019-03-26 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板
JP2019-059395 2019-03-26

Publications (1)

Publication Number Publication Date
WO2020196265A1 true WO2020196265A1 (ja) 2020-10-01

Family

ID=72609848

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/012303 WO2020196265A1 (ja) 2019-03-26 2020-03-19 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP6816193B2 (zh)
KR (1) KR102706307B1 (zh)
CN (1) CN113795614B (zh)
TW (1) TWI742575B (zh)
WO (1) WO2020196265A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023281775A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281778A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281774A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281777A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281776A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

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* Cited by examiner, † Cited by third party
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CN117083419A (zh) * 2021-03-26 2023-11-17 三菱综合材料株式会社 金属板材、层叠体、绝缘电路基板以及金属板材的制造方法
JP2022157676A (ja) * 2021-03-31 2022-10-14 古河電気工業株式会社 紫外線吸収シート、紫外線吸収シートに用いる金属箔および内装材

Citations (2)

* Cited by examiner, † Cited by third party
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WO2018181726A1 (ja) * 2017-03-30 2018-10-04 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
WO2019021895A1 (ja) * 2017-07-24 2019-01-31 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板

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CN106028638B (zh) * 2010-09-27 2019-09-03 吉坤日矿日石金属株式会社 印刷电路板用铜箔、其制造方法以及印刷电路板
JP6261037B2 (ja) 2014-02-06 2018-01-17 古河電気工業株式会社 高周波回路用銅箔、銅張積層板及びプリント配線板
KR101598691B1 (ko) 2014-05-16 2016-02-29 조성호 화분의 가습 겸용 자동 급수장치
TW201603707A (zh) 2014-06-24 2016-02-01 陶氏農業科學公司 具有特定殺蟲效用之分子及與其相關之中間物、組成物和製程
CN107429417B (zh) * 2015-03-31 2019-11-22 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018145519A (ja) * 2017-03-03 2018-09-20 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7055049B2 (ja) 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

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WO2018181726A1 (ja) * 2017-03-30 2018-10-04 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
WO2019021895A1 (ja) * 2017-07-24 2019-01-31 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023281775A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281778A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281774A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281777A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2023281776A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
KR20210143761A (ko) 2021-11-29
TWI742575B (zh) 2021-10-11
CN113795614B (zh) 2024-03-26
TW202100812A (zh) 2021-01-01
CN113795614A (zh) 2021-12-14
JP2020158832A (ja) 2020-10-01
JP6816193B2 (ja) 2021-01-20
KR102706307B1 (ko) 2024-09-11

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