WO2020140448A1 - 一种扬声器装置 - Google Patents

一种扬声器装置 Download PDF

Info

Publication number
WO2020140448A1
WO2020140448A1 PCT/CN2019/102383 CN2019102383W WO2020140448A1 WO 2020140448 A1 WO2020140448 A1 WO 2020140448A1 CN 2019102383 W CN2019102383 W CN 2019102383W WO 2020140448 A1 WO2020140448 A1 WO 2020140448A1
Authority
WO
WIPO (PCT)
Prior art keywords
speaker device
sound
circuit board
key
microphone
Prior art date
Application number
PCT/CN2019/102383
Other languages
English (en)
French (fr)
Inventor
张磊
李永坚
周文兵
郑金波
蒋筑阳
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Publication of WO2020140448A1 publication Critical patent/WO2020140448A1/zh
Priority to US17/305,244 priority Critical patent/US11800275B2/en
Priority to US18/491,786 priority patent/US20240048892A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00—Stereophonic arrangements
    • H04R5/033—Headphones for stereophonic communication
    • H04R5/0335—Earpiece support, e.g. headbands or neckrests
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/109—Arrangements to adapt hands free headphones for use on both ears
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers

Definitions

  • the present application relates to the field of speaker devices, and particularly to a key module in a speaker device.
  • the speaker assembly of the speaker device on the market is provided with a key module and an auxiliary key module to facilitate the user to perform corresponding functions.
  • the user can realize corresponding functions through the key module and the auxiliary key module, for example, pause/play music and answer the phone.
  • the settings of the key module and the auxiliary key module do not take into account their influence on the working state of the speaker assembly.
  • the key module will reduce the volume of the speaker assembly to some extent.
  • An embodiment of the present specification provides a speaker device, the speaker device includes: a support connector for contacting with a user's head; at least one speaker assembly, the speaker assembly includes an earphone core and an earphone core for accommodating the earphone core Movement casing, the movement casing is fixedly connected with the support connector, there is at least one key module on the movement casing, and the interior of the movement object further includes at least two microphones, the at least The two microphones are located at different distances from the user's mouth; the support connector accommodates a control circuit or battery, and the control circuit or battery drives the earphone core to vibrate to generate sound.
  • FIG. 1 is a schematic diagram of an explosion structure of an embodiment of a speaker device of the present application.
  • FIG. 2 is a schematic diagram of a part of the structure of an ear hook in an embodiment of a speaker device of the present application
  • FIG. 3 is a partial enlarged view of part A in FIG. 2;
  • FIG. 4 is a partial cross-sectional view of an embodiment of the speaker device of the present application.
  • FIG. 5 is a partial enlarged view of part B in FIG. 4;
  • FIG. 6 is a partial structural cross-sectional view of an embodiment of a speaker device of the present application.
  • FIG. 7 is a partial enlarged view of part C in FIG. 6;
  • FIG. 8 is a schematic diagram of a part of the structure of the movement housing in an embodiment of the speaker device of the present application.
  • FIG. 9 is a partial enlarged view of part D in FIG. 8.
  • FIG. 10 is a partial cross-sectional view of a movement housing in an embodiment of a speaker device of the present application
  • FIG. 11 is a partial structural diagram of a speaker device provided by some embodiments of the present application.
  • FIG. 12 is an exploded view of a partial structure of a speaker device provided by some embodiments of the present application.
  • FIG. 13 is a partial structural cross-sectional view of a speaker device provided by some embodiments of the present application.
  • FIG. 15 is a partial structural diagram of a speaker device provided by some embodiments of the present application.
  • 16 is an exploded view of a partial structure of a speaker device provided by some embodiments of the present application.
  • FIG. 17 is a partial structural cross-sectional view of a speaker device provided by some embodiments of the present application.
  • FIG. 19 is a partial structural cross-sectional view of a speaker device provided by some embodiments of the present application.
  • 21 is a schematic structural diagram of a speaker device provided by some embodiments of the present application.
  • 22 is a schematic structural diagram of a speaker assembly provided by some embodiments of the present application.
  • FIG. 23 is a schematic structural view of a speaker assembly provided by some embodiments of the present application at another angle;
  • 24 is a schematic diagram showing the distance h1 in some embodiments of the speaker device of the present application.
  • 25 is a schematic diagram showing the distance h2 in some embodiments of the speaker device of the present application.
  • 26 is a schematic diagram showing the distance h3 in some embodiments of the speaker device of the present application.
  • 27 is a schematic diagram showing distances D1 and D2 in some embodiments of the speaker device of the present application.
  • 28 is a schematic diagram showing distances l3 and l4 in some embodiments of the speaker device of the present application.
  • FIG. 30 is a partial cross-sectional view provided by an embodiment of the speaker device of the present application.
  • FIG. 31 is an enlarged view of the structure at A in FIG. 30;
  • FIG. 32 is a cross-sectional view of the speaker device of the present application in the assembled state along the A-A axis in FIG. 29;
  • 35 is a cross-sectional view of the speaker device of the present application along the B-B axis in FIG. 29 in a combined state;
  • FIG. 36 is a schematic structural view of an embodiment of the present invention at different angles between the first circuit board and the second circuit board and FIG. 35;
  • FIG. 37 is a cross-sectional view of the speaker device of the present application along the C-C axis in FIG. 29 in a combined state;
  • Fig. 38 is a schematic diagram showing the transmission of sound through air conduction.
  • a microphone such as a microphone can pick up the sound of the user/wearer's surroundings, and after a certain algorithm, transmit the sound (or the generated electrical signal) to the speaker section. That is, the speaker device can be modified to include the function of picking up environmental sounds, and after certain signal processing, the sound is transmitted to the user/wearer through the speaker module, thereby simultaneously realizing the functions of the speaker and the traditional speaker device.
  • the algorithms described here may include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling One or more combinations of suppression and volume control.
  • FIG. 1 is a schematic diagram of an explosion structure of an embodiment of a speaker device of the present application.
  • the speaker device may include: an ear hanger 10, a circuit case 20, a movement case 41, a rear hanger 30, an earphone core 42, a control circuit 60, and a battery 70.
  • the movement casing 41 and the circuit casing 20 are respectively disposed at both ends of the earhook 10, and the rear hanging 30 is further disposed at the end of the circuit casing 20 away from the earhook 10.
  • the earhook 10 includes an elastic metal wire 11, a wire 12, a fixed sleeve 13, and a plug end 14 and a plug end 15 provided at both ends of the elastic metal wire 11, and further includes a protective sleeve 16 and is integrally formed with the protective sleeve 16 ⁇ 17 ⁇ The casing sheath 17.
  • FIG. 2 is a schematic diagram of a part of the structure of the ear hanger in an embodiment of the speaker device of the present application;
  • FIG. 3 is a partially enlarged view of part A of FIG. 2;
  • FIG. 4 is a partial cross-sectional view of an embodiment of the speaker device of the present application; 4 is a partial enlarged view of part B;
  • FIG. 6 is a partial structural cross-sectional view of an embodiment of the speaker device of the present application;
  • FIG. 7 is a partial enlarged view of part C of FIG. 6.
  • the outer end surface 21 of the movement housing 41 refers to the end surface of the movement housing 41 facing the earhook 10.
  • the socket 22 is used to provide a receiving space for the insertion end 14 of the earhook 10 to be inserted into the movement housing 41, so as to further realize the insertion and fixing of the insertion end 14 and the movement housing 41.
  • the stop block 23 may be formed by the inner wall of the socket 22 protruding in a direction perpendicular to the inner wall.
  • the stop block 23 may be a plurality of block-shaped protrusions arranged at intervals, or may also be an annular protrusion along the inner side wall of the socket 22, which is not specifically limited herein.
  • the connector end 14 includes an insertion portion 142 and two elastic hooks 143.
  • the insertion portion 142 is at least partially inserted into the socket 22 and abuts the outer surface 231 of the stopper 23.
  • the shape of the outer side wall of the insertion portion 142 matches the shape of the inner side wall of the socket 22, so that when the insertion portion 142 is at least partially inserted into the socket 22, the outer side wall of the insertion portion 142 and the socket 22 The inner wall of the abutment.
  • the outer side surface 231 of the stop block 23 refers to a side surface of the stop block 23 disposed toward the ear hook 10.
  • the insertion portion 142 may further include an end surface 1421 facing the movement housing 41, and the end surface 1421 may match the outer side surface 231 of the stopper 23 so that when the insertion portion 142 is at least partially inserted into the socket 22, the insertion portion The end surface 1421 of 142 is in contact with the outer surface 231 of the stopper 23.
  • the cross-sectional shape of the receptacle 22 of the movement housing 41 along the direction perpendicular to the insertion direction of the insertion end 14 relative to the movement housing 41 may be an ellipse ring or a near ellipse ring, correspondingly, the insertion portion 142
  • the cross section of can be a nearly elliptical shape matching the socket 22, of course, the shapes of the two can also be other, which can be set according to actual needs.
  • each elastic hook 143 may be arranged side by side and spaced perpendicular to the insertion direction and symmetrically disposed on the side of the insertion portion 142 facing the interior of the movement housing 41.
  • Each elastic hook 143 may include a beam portion 1431 and a hook portion 1432 respectively.
  • the beam portion 1431 and the insertion portion 142 are connected to a side of the movement housing 41.
  • the hook portion 1432 is disposed on the beam portion 1431 away from the insertion portion 142 One end and extend perpendicular to the insertion direction.
  • each hook portion 1432 is provided with a transition slope 14321 connecting a side surface parallel to the insertion direction and an end surface away from the insertion portion 142.
  • the plug end 14 gradually enters the interior of the movement housing 41 from the socket 22, and when reaching the position of the stopper 23, the two elastic cards
  • the hook portion 1432 of the hook 143 will be blocked by the stopper 23, and under the action of external thrust, the stopper 23 gradually presses the transition slope 14321 of the hook portion 1432 so that the two elastic hooks 143 are elastically deformed and close together ,
  • the transition slope 14321 passes through the stop block 23 and reaches the side of the stop block 23 near the inside of the movement case 41
  • the elastic hook 143 elastically recovers due to the loss of the stop block 23 and is stuck on the stop
  • the block 23 faces the inner side of the interior of the movement housing 41, so that the stopper block 23 is caught between the insertion portion 142 and the hook portion 1432 of the connector end 14, thereby achieving the movement housing 41 and the connector end 14
  • the connection is fixed.
  • the insertion portion 142 is partially inserted into the socket 22, and the exposed portion of the insertion portion 142 is arranged in a step shape, thereby forming and An annular mesa 1422 provided at intervals on the outer end surface 21 of the movement case 41.
  • the exposed portion of the insertion portion 142 refers to the portion of the insertion portion 142 exposed to the movement case 41, specifically, it may refer to the portion exposed to the movement case 41 and close to the outer end surface of the movement case 41 .
  • the ring-shaped mesa 1422 may be disposed opposite to the outer end surface 21 of the movement housing 41, and the interval between the two may refer to the interval along the insertion direction and the interval perpendicular to the insertion direction.
  • the protective sleeve 16 extends to the side of the annular mesa 1422 facing the outer end surface 21 of the movement housing 41, and when the jack 22 of the movement housing 41 is plugged and fixed with the plug end 14 , Filled in the gap between the ring-shaped mesa 1422 and the outer end surface 21 of the movement housing 41, and elastically abuts the movement housing 41, so that it is difficult for external liquid from the plug end 14 and the movement housing 41 The joint between the two enters the inside of the movement case 41, thereby achieving the sealing between the plug end 14 and the jack 22 to protect the headphone core 42 and the like inside the movement case 41, thereby improving the waterproofness of the speaker device effect.
  • the protective sleeve 16 forms an annular abutment surface 161 on the side of the annular mesa 1422 facing the outer end surface of the movement housing 41.
  • the annular contact surface 161 is the end surface of the protection sleeve 16 facing the movement housing 41 side.
  • the protective sleeve 16 further includes an annular boss 162 located inside the annular abutment surface 161 and protrudingly disposed relative to the annular abutment surface 161.
  • the ring-shaped boss 162 is specifically formed on the side of the ring-shaped abutment surface 161 facing the plug end 14, and protrudes from the ring-shaped abutment surface 161 in the direction toward the movement case 41.
  • the annular boss 162 can also be directly formed on the periphery of the annular mesa 1422 and cover the annular mesa 1422.
  • the movement housing 41 includes a connection slope 24 for connecting the outer end surface 21 of the movement housing 41 and the inner side wall of the socket 22.
  • the connection slope 24 is specifically a transition surface between the outer end surface 21 of the movement housing 41 and the inner side wall of the socket 22, the connection slope 24 and the outer end surface 21 of the movement housing 41 and the connection socket 22 Are not on the same plane.
  • the connecting inclined surface 24 may be a flat surface, or may be set as a curved surface or other shapes according to actual requirements, which is not specifically limited here.
  • the annular abutment surface 161 and the annular boss 162 elastically abut the outer end surface of the movement casing 41 and the connection inclined surface 24, respectively.
  • the insertion portion 142 is further formed on the side of the annular mesa 1422 facing the outer end surface 21 of the movement housing 41 with an annular groove 1423 adjacent to the annular mesa 1422, wherein the annular boss 162 may be formed in the annular shape In the groove 1423.
  • annular groove 1423 may be formed on the side of the annular mesa 1422 facing the movement housing 41.
  • the ring-shaped mesa 1422 is a side wall surface of the ring-shaped groove 1423 facing the movement case 41 side.
  • the ring-shaped boss 162 is formed in the ring-shaped groove 1423 along the side wall surface.
  • FIG. 8 is a schematic diagram of a part of the structure of the movement housing in an embodiment of the speaker device of the present application;
  • FIG. 9 is a partially enlarged view of part D of FIG. 8;
  • FIG. 10 is a part of the movement housing of an embodiment of the speaker device of the present application Sectional view.
  • the movement casing 41 may include a main casing 25 and a partition assembly 26, wherein the partition assembly 26 is located inside the main casing 25 and is connected to the main casing 25, and
  • the internal space 27 of the main housing 25 is divided into a first accommodating space 271 and a second accommodating space 272 on the side close to the receptacle 22.
  • the main housing 25 includes a peripheral side wall 411 and a bottom end wall 416 connected to an end surface of the peripheral side wall 411.
  • the peripheral side wall 411 and the bottom end wall 416 together form an interior of the main housing 25 Space 27.
  • the partition assembly 26 is located on the side of the main housing 25 close to the receptacle 22 and includes a side partition 261 and a bottom partition 262.
  • the side partition 261 may be disposed in a direction perpendicular to the bottom end wall 416, and both ends of the side partition 261 are connected to the peripheral side wall 411, thereby partitioning the internal space 27 of the main housing 25.
  • the bottom partition 262 may be parallel or nearly parallel to the bottom end wall 416 and spaced apart, and further connected to the peripheral side wall 411 and the side partition 261 respectively, so that the internal space 27 formed by the main housing 25 is divided into two A first accommodating space 271 surrounded by the side partition 261, the bottom partition 262, the peripheral side wall 411 and the bottom end wall 416 away from the connecting hole 22 is formed, and the bottom partition 262 and the side partition 261 and The second accommodating space 272 enclosed by the peripheral side wall 411 adjacent to the receptacle 22.
  • the second accommodating space 272 may be smaller than the first accommodating space 271.
  • partition assembly 26 can also divide the internal space 27 of the main housing 25 by other installation methods, which is not specifically limited here.
  • the partition assembly 26 further includes an inner partition 263 that further divides the second receiving space 272 into two sub-receiving spaces 2721.
  • the inner partition 263 is disposed perpendicular to the bottom end wall 416 of the main housing 25, respectively connected to the side partition 261 and the peripheral side wall 411, and further extends to the routing hole 2621, so that While the housing space 272 is divided into two sub-housing spaces 2721, the wiring hole 2621 is further divided into two, and the two wiring holes 2621 can respectively communicate with the corresponding sub-housing spaces 2721.
  • the second receiving space 272 may be further filled with sealant.
  • the wire 12 and the wire 80 accommodated in the second accommodating space 272 can be further fixed to further reduce the adverse effect on sound quality due to wire vibration, thereby improving the sound quality of the speaker device, and It can protect the welding point between the wire 12 and the wire 80.
  • sealing the second accommodating space 272 can also achieve the purpose of waterproof and dustproof.
  • the above description of the earphone core 42 of the speaker device is only a specific example, and should not be regarded as the only feasible implementation.
  • the specific methods and steps for implementing the earphone core 42 of the speaker device may be implemented without departing from this principle.
  • the second accommodating space 272 may also be larger than or the first accommodating space 271, or the second accommodating space 272 is equal to the first accommodating space 271.
  • FIG. 11 is a partial structure diagram of a speaker device provided by some embodiments of the present application
  • FIG. 12 is an exploded view of the partial structure of a speaker device provided by some embodiments of the present application
  • FIG. 13 is a partial structure of a speaker device provided by some embodiments of the present application Sectional view.
  • the movement housing 41 may include an auxiliary function module
  • the auxiliary function module may be a module that is different from the earphone core 42 for receiving auxiliary signals and performs auxiliary functions.
  • the auxiliary function module may be a microphone 432, a key switch, etc., which can be set according to actual needs.
  • the auxiliary function module may include a microphone 432, and the number of the microphone 432 is two, namely a first microphone 432a and a second microphone 432b.
  • both the first microphone 432a and the second microphone 432b may be MEMS (Micro Electro Mechanical System) microphones 432, which have a small operating current, relatively stable performance, and high voice quality.
  • the two microphones 432 can be arranged at different positions of the flexible circuit board 44 according to actual requirements.
  • the flexible circuit board 44 may include a main circuit board 441 and a first branch circuit board 442 and a second branch circuit board 443 connected to the main circuit board 441, the first branch circuit board 442 and the main circuit board 441 Extending in the same direction, the first microphone 432a is attached to the end of the first branch circuit board 442 away from the main body circuit board 441, the second branch circuit board 443 extends perpendicular to the main body circuit board 441, and the second microphone 432b is attached to the second branch The circuit board 443 is away from the end of the main circuit board 441, and the plurality of first pads 45 are disposed on the end of the main circuit board 441 away from the first branch circuit board 442 and the second branch circuit board 443.
  • the movement housing 41 includes a circumferential side wall 411 surrounding the bottom wall 416 connected to one end surface of the circumferential side wall 411, thereby forming a receiving space having an open end.
  • the earphone core 42 is placed in the accommodating space through the open end, the first microphone 432a is fixed on the bottom end wall 416, and the second microphone 432b is fixed on the peripheral side wall 411.
  • the first branch circuit board 442 and/or the second branch circuit board 443 may be bent appropriately to accommodate the position of the sound inlet corresponding to the microphone 432 on the movement housing 41.
  • the flexible circuit board 44 may be disposed in the movement case 41 in such a manner that the main circuit board 441 is parallel to the bottom end wall 416, so that the first microphone 432a can correspond to the bottom end wall 416 without the need for the main circuit board 441 Bend.
  • the second main circuit board 441 needs to be bent, specifically, the second branch circuit board 443 can be placed away from the main circuit board 441 The end portion is bent so that the surface of the second branch circuit board 443 is perpendicular to the surface of the main circuit board 441 and the first branch circuit board 442, and then the second microphone 432b faces away from the main circuit board 441 and the first
  • the direction of the branch circuit board 442 is fixed to the peripheral side wall 411 of the movement case 41.
  • the first pad 45, the first microphone 432a, and the second microphone 432b may be disposed on the same side of the flexible circuit board 44.
  • the other side of the flexible circuit board 44 is provided with a rigid support plate 4a for supporting the first pad 45 and a microphone rigid support plate 4b including the microphone rigid support plate 4b for supporting the first microphone 432a
  • the rigid support plate 4b1 and the rigid support plate 4b2 for supporting the second microphone 432b.
  • the rigid support plate 4a, the rigid support plate 4b1, and the rigid support plate 4b2 are mainly used to support the corresponding pads and the microphone 432, so as to have a certain strength.
  • the materials of the three may be the same or different, and may specifically be polyimide (Polyimide Film, PI), or other materials that can play a role in supporting strength, such as polycarbonate and polyvinyl chloride.
  • the thickness of the three rigid support plates can be set according to the strength of the rigid support plate itself and the actual required strength of the first pad 45 and the first microphone 432a and the second microphone 432b, which is not specifically limited here .
  • the first microphone 432a and the second microphone 432b respectively correspond to the two microphone assemblies 4c.
  • the structure of the two microphone assemblies 4c is the same, and the sound inlet 41 is provided on the movement housing 41.
  • the speaker device is further provided with an integral molding on the movement housing at the movement housing 41
  • the annular baffle wall 414 on the inner surface of the body 41 is disposed on the periphery of the sound inlet hole 413, and further defines a receiving space 415 communicating with the sound inlet hole 413.
  • the microphone assembly 4c further includes: a waterproof membrane assembly 4c1.
  • the waterproof membrane component 4c1 is disposed in the accommodating space 415 and covers the sound hole 413.
  • the microphone rigid support plate 4b is disposed in the accommodating space 415 and is located on the side of the waterproof membrane component 4c1 away from the sound inlet 413 to press the waterproof membrane component 4c1 on the inner surface of the movement housing 41.
  • the microphone rigid support plate 4b is provided with an acoustic hole 4b3 corresponding to the acoustic hole 413.
  • the microphone 432 is disposed on the side of the microphone rigid support plate 4b away from the waterproof membrane assembly 4c1 and covers the sound hole 4b3.
  • the waterproof membrane assembly 4c1 has a waterproof and sound-permeable function, and is closely attached to the inner surface of the movement casing 41 to prevent the liquid outside the movement casing 41 from entering the sound casing 413 through the sound hole 413 into the inside of the movement casing 41 Affect the performance of the microphone 432.
  • the axial directions of the sound inlet hole 4b3 and the sound inlet hole 413 may coincide, or they may intersect at a certain angle according to the actual needs of the microphone 432 and the like.
  • the microphone rigid support plate 4b is disposed between the waterproof membrane assembly 4c1 and the microphone 432, on the one hand, the waterproof membrane assembly 4c1 is pressed, and the waterproof membrane assembly 4c1 is closely attached to the inner surface of the movement casing 41; on the other hand
  • the microphone rigid support plate 4b has a certain strength, so as to support the microphone 432.
  • the material of the microphone rigid support plate 4b may be polyimide (Polyimice Film, PI), or other materials that can play a role of strength support, such as polycarbonate, polyvinyl chloride, etc.
  • the thickness of the microphone rigid support plate 4b can be set according to the strength of the microphone rigid support plate 4b and the strength actually required by the microphone 432, which is not specifically limited here.
  • the waterproof membrane assembly 4c1 may include a waterproof membrane body 4c11 and an annular rubber pad 4c12.
  • the annular rubber pad 4c12 is disposed on the side of the waterproof membrane body 4c11 facing the microphone rigid support plate 4b, and is further disposed around the sound inlet hole 413 and the sound inlet hole 4b3.
  • the microphone rigid support plate 4b is pressed against the ring-shaped rubber pad 4c12, so that the waterproof membrane assembly 4c1 and the microphone rigid support plate 4b are adhesively fixed together.
  • the annular rubber pad 4c12 is configured to form a sealed cavity between the waterproof membrane body 4c11 and the rigid support plate that only communicates with the microphone 432 through the sound hole 4b3, that is, the waterproof membrane assembly 4c1 and the microphone rigid support plate 4b There is no gap between the connections, so that the space around the annular rubber pad 4c12 between the waterproof membrane body 4c11 and the microphone rigid support plate 4b is isolated from the sound inlet 4b3.
  • the waterproof membrane body 4c11 may specifically be a waterproof sound-permeable membrane, which is equivalent to the eardrum of the human ear.
  • the waterproof membrane body 4c11 vibrates, which causes the air pressure in the sealed cavity to change, resulting in a sound from the microphone 432.
  • the waterproof membrane body 4c11 vibrates, the air pressure in the sealed cavity changes, and the air pressure needs to be controlled within an appropriate range. If it is too large or too small, it will affect the sound quality.
  • the distance between the waterproof membrane body 4c11 and the rigid support plate may be 0.1-0.2mm, specifically 0.1mm, 0.15mm, 0.2mm, etc., so that the sealed cavity caused by the vibration of the waterproof membrane body 4c11 The air pressure changes within the appropriate range, thereby improving the sound quality.
  • the waterproof membrane assembly 4c1 further includes an annular rubber pad 4c13 disposed on an inner surface side of the waterproof membrane body 4c11 facing the movement case 41 and overlapping the annular rubber pad 4c12.
  • the waterproof membrane assembly 4c1 can be closely adhered to the inner surface of the movement casing 41 around the sound inlet hole 413, thereby reducing the loss of sound entering through the sound inlet hole 413 and improving the conversion of sound into a waterproof membrane Conversion rate of vibration of the body 4c11.
  • a sealant may be further coated on the periphery of the annular barrier wall 414 and the microphone 432 to further improve the sealing performance, thereby improving the conversion rate of sound, thereby improving the sound quality.
  • the flexible circuit board 44 may be disposed between the rigid support board and the microphone 432, and a sound inlet hole 444 is provided at a position corresponding to the sound inlet hole 4b3 of the microphone rigid support board 4b, thereby allowing external sound
  • the induced vibration of the waterproof membrane body 4c11 passes through the sound entrance hole 444 to further affect the microphone 432.
  • the flexible circuit board 44 further extends away from the microphone 432 to connect with other functional elements or wires to achieve corresponding functions.
  • the rigid support plate 4b of the microphone also extends a distance away from the microphone 432 along with the flexible circuit board.
  • the annular blocking wall 414 is provided with a notch matching the shape of the flexible circuit board to allow the flexible circuit board to extend from the accommodating space 415.
  • the gap can be further filled with sealant to further improve the sealing performance.
  • the above description of the microphone of the speaker device is only a specific example, and should not be regarded as the only feasible implementation.
  • the ring-shaped rubber pad 4c12 and the ring-shaped rubber pad 4c13 may be double-sided tape or sealant, respectively. Such deformations are within the scope of protection of this application.
  • the speaker device may further include a key module 4d, and the auxiliary function module mounted on the flexible circuit board 44 includes a key switch, and the key switch and the microphone 432 are respectively disposed in the movement housing 41 Different locations.
  • FIG. 15 is a partial structure diagram of a speaker device provided by some embodiments of the present application
  • FIG. 16 is an exploded view of the partial structure of a speaker device provided by some embodiments of the present application
  • FIG. 17 is a partial structure of a speaker device provided by some embodiments of the present application 18 is a partial enlarged view of part D in FIG. 17
  • FIG. 19 is a partial structural sectional view of a speaker device provided by some embodiments of the present application
  • FIG. 20 is a partial enlarged view of part E in FIG.
  • a flexible circuit board 44 is provided inside the movement case 41, and a key module adapted to the flexible circuit board is provided outside the movement case 41 4d.
  • the flexible circuit board 44 may include a main body circuit board 445 and a branch circuit board 446, wherein the branch circuit board 446 may extend perpendicular to the extending direction of the main circuit board 445.
  • the plurality of first pads 45 are disposed on the end of the main circuit board 445 away from the branch circuit board 446, the key switch is mounted on the main circuit board 445, and the second pad 46 is disposed on the branch circuit board 446 away from the main circuit board 445 Of the end.
  • circuit boards in the above embodiments can be used to refer to the structure for mounting electronic components.
  • the movement housing 41 includes a circumferential side wall 411 surrounding the bottom wall 416 connected to one end surface of the circumferential side wall 411, thereby forming a receiving space having an open end.
  • the board surface of the flexible circuit board 44 is disposed parallel to the bottom end wall 416 so that the key switch can be disposed toward the bottom end wall 416 of the movement housing 41.
  • the key switch is disposed on the side of the flexible circuit board 44 facing the bottom end wall 416.
  • the first pad 45 and the second pad 46 may be disposed away from the flexible circuit board 44 One side of the bottom end wall 416, so that the first pad 45 and the second pad 46 and the key switch are respectively disposed on both sides of the flexible circuit board 44.
  • the main circuit board 445 is provided on the side away from the key switch with a rigid support plate 4d3 for supporting the key switch and keeping the first pad 45 exposed.
  • One side of the one pad 45 is provided with a rigid support plate 4e for supporting the first pad 45 and keeping the key switch exposed, and the branch circuit board 446 is provided on the side away from the second pad 46 for supporting the second pad 46 'S rigid support plate 4f.
  • the key switch and the first pad 45 may be respectively disposed on both sides of the main circuit board 445 and spaced apart on both sides of the main circuit board 445. Accordingly, the rigid support plate 4d3 corresponding to the key switch and the rigid support plate 4e corresponding to the first pad 45 are also provided on both sides of the main circuit board 445, respectively, and further bypass the key switch and the first pad 45 respectively , So that the two have adjacent edges arranged adjacently.
  • a side of the rigid support plate 4d3 away from the flexible circuit board 44 may be further provided with a rigid support plate 4d4, the rigid support plate 4d4 is more rigid than the rigid support plate 4d3, and the rigid support plate 4d3 corresponds to the key switch.
  • the inner surface of the movement housing 41 specifically the inner surface of the bottom end wall 416 is provided with a recessed area 4121, and further is provided in the recessed area 4121 and used to communicate with the inside of the movement housing 41 Keyhole 4122 on the surface and the outer surface.
  • the recessed area 4121 is formed by the inner surface of the movement housing 41 recessed toward the outside of the movement housing 41.
  • the key hole 4122 can be further disposed in the middle part of the recessed area 4121, or in other parts according to actual requirements.
  • the key module 4d may further include an elastic socket 4d1 and a key 4d2.
  • the elastic socket 4d1 includes an integrated socket body 4d11 and a support column 4d12.
  • the bearing body 4d11 is disposed in the recessed area 4121 and fixed to the bottom of the recessed area 4121.
  • the bottom of the recessed area 4121 refers to the inner wall surface of the recessed area 4121 away from the interior of the movement housing 41.
  • the support column 4d12 is disposed on the side of the bearing body 4d11 facing the outside of the movement case 41, and is exposed from the key hole 4122.
  • the elastic socket 4d1 is disposed in the recessed area 4121 and fixed to the bottom of the recessed area 4121, and covers the key hole 4122 from the inner side of the movement housing 41 through the socket body 4d11, so that the movement shell
  • the interior of the body 41 is separated from the outside, so that the liquid outside the movement case 41 is difficult to enter the inside of the movement case 41 through the key hole 4122, thereby playing a role in waterproofing and protecting the internal components of the movement case 41 .
  • the elastic socket 4d1 may be fixed to the bottom of the recessed area 4121 through the socket body 4d11 in an adhesive manner, specifically on the surface of the socket body 4d11 facing the outside of the movement housing 41 and the recessed area Apply adhesive, double-sided tape, etc. between the bottom of 4121 to stick the two together.
  • the seat body 4d11 may be fixed to the bottom of the recessed area 4121 by injection molding.
  • the surface of the seat body 4d11 facing the outside of the movement housing 41 and the bottom of the recessed area 4121 of the movement housing 41 are integrally formed by injection molding, which may be specifically formed by encapsulation.
  • the elastic bearing 4d1 and the bottom of the recessed area 4121 of the movement housing 41 are integrally formed by injection molding, so that the connection between the two is stronger and the bonding strength between the two is increased Moreover, the sealing property of the movement casing 41 can be improved, so that on the one hand, the entire key module 4d can be made more stable and reliable, and on the other hand, the waterproof effect of the movement casing 41 can be further improved.
  • the seat body 4d11 includes an annular fixing portion 4d111 and an elastic support portion 4d112.
  • the ring-shaped fixing portion 4d111 is disposed around the key hole 4122 and is fixedly attached to the bottom of the recessed area 4121, thereby fixing the elastic bearing 4d1 and the movement housing 41 together.
  • the elastic supporting portion 4d112 is connected to the inner annular surface of the ring-shaped fixing portion 4d111 and bulges toward the outside of the movement housing 41 in a dome shape, so that its top to bottom has a certain height in the pressing direction of the key 4d2, and it The size of the top along the direction perpendicular to the pressing direction is smaller than the bottom.
  • the supporting column 4d12 is provided on the top of the elastic supporting portion 4d112.
  • the connection between the components is relatively tight, so that the pressing stroke between the key 4d2 and the key switch is small, thereby reducing the pressing feel of the key 4d2.
  • the elastic support portion 4d112 bulges toward the outside of the movement housing 41 in a dome shape, the distance between the key 4d2 and the key switch inside the movement housing 41 can be increased, and the keys can be appropriately increased 4d2 triggers the pressing stroke of the key switch, which can improve the user's feeling of pressing the key 4d2.
  • the bottom of the elastic support portion 4d112 is fixed to the side wall surface of the key hole 4122, so that the top of the elastic support portion 4d112 is exposed from the key hole 4122, and thus the elastic support portion 4d112 is provided at the end of the movement housing 41 toward the outside of the movement case 41
  • the supporting column 4d12 is completely exposed to the outside of the movement casing 41, and then fixed to the key 4d2 outside the movement casing 41.
  • a recessed area 4123 is provided on the outer surface of the movement housing 41, wherein the key hole 4122 is further located in the recessed area 4123. That is, the recessed area 4121 and the recessed area 4123 are located at both ends of the keyhole 4122, respectively, and penetrate through the keyhole 4122.
  • the shapes and sizes of the recessed area 4121 and the recessed area 4123 may be the same or different according to actual requirements.
  • the number of the recessed areas 4121 and the recessed areas 4123 may be the same, and the number of the two may be determined according to the number of buttons 4d2, and may be one or more.
  • Each recessed area 4121 and the recessed area 4123 may be correspondingly provided with one or more A key hole 4122 is not specifically limited here.
  • the number of keys 4d2 corresponding to the movement housing 41 is one, and corresponds to one recessed area 4121 and one recessed area 4123.
  • the support column 4d12 is supported by the elastic support portion 4d112 to the outer side of the key hole 4122 facing the movement case 41 and is located in the recessed area 4123.
  • the key 4d2 is disposed on the elastic support portion of the support column 4d12 On the side of 4d112, in this embodiment, by providing the height of the elastic supporting portion 4d112 and the supporting column 4d12 in the pressing direction of the key 4d2, the key 4d2 is at least partially sunk in the recessed area 4123 to improve space utilization and reduce The space occupied by the key module 4d.
  • the key 4d2 includes a key body 4d21 and an annular flange 4d22 and an annular flange 4d23 disposed on one side of the key body 4d21.
  • the annular flange 4d22 and the annular flange 4d23 may be specifically disposed on the opposite side of the pressing surface of the key body 4d21.
  • the annular flange 4d22 is located in the middle region of the key body 4d21, the annular flange 4d23 is located at the outer edge of the key body 4d21, and the annular flange 4d22 and the annular flange 4d23 are both facing away from the pressing surface of the key body 4d21.
  • the direction is convexly formed so as to form an annular flange 4d22 surrounding the formed cylindrical receiving space 4d24, and a ring-shaped cylindrical receiving space 4d25 formed by the annular flange 4d22 and the annular flange 4d23 together.
  • the protrusion heights of the annular flange 4d22 and the annular flange 4d23 relative to the key body 4d21 may be equal or unequal.
  • the height of the annular flange 4d22 relative to the key body 4d21 is greater than the height of the annular flange 4d23 relative to the key body 4d21.
  • the support column 4d12 is inserted into the annular flange 4d22, that is, accommodated in the accommodating space 4d24.
  • the support column 4d12 may be bonded to the annular flange by bonding, injection molding, or elastic contact. 4d22 fixed together.
  • the end surface of the annular flange 4d23 away from the key body 4d21 is sunk in the recessed area 4123, and is spaced from the bottom of the recessed area 4123 when the elastic seat 4d1 is in a natural state.
  • the bottom of the recessed area 4123 refers to the inner wall surface of the recessed area 4123 facing the inside of the movement case 41.
  • the elastic socket 4d1 further includes a contact head 4d13 for contacting the key switch.
  • the contact head 4d13 may be disposed on the side of the socket body 4d11 near the interior of the movement housing 41, and may be specifically disposed on the elastic support portion
  • the top of 4d112 faces the middle region of the inner wall surface of the inside of the movement case 41 and protrudes toward the inside of the movement case 41 relative to the inner wall surface.
  • the top of the elastic support portion 4d112 of the elastic socket 4d1 moves in the direction toward the movement housing 41, thereby driving the contact head 4d13 to move toward the key switch inside the movement housing 41, thereby passing the contact
  • the head 4d13 triggers the key switch to realize the corresponding function. In this way, the pressing stroke of the key 4d2 can be reduced according to actual needs.
  • the above description of the speaker device is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for professionals in the field, after understanding the basic principles of the speaker device, it is possible to carry out various forms and details of the specific methods and steps for implementing the speaker device without departing from this principle. Amendments and changes, but these amendments and changes are still within the scope of the above description.
  • the number of sound holes 413 may be set to one or more. Such deformations are within the scope of protection of this application.
  • FIG. 21 is a schematic structural diagram of a speaker device provided by some embodiments of the present application
  • FIG. 22 is a schematic structural diagram of a speaker assembly of the speaker device provided by some embodiments of the present application.
  • the speaker device can transmit sound to the human hearing system through bone conduction and air conduction, thereby enabling the user to produce hearing.
  • the speaker device may further include a support connector 100 and at least one speaker assembly 40 disposed on the support connector 100.
  • the support connector 100 may include the circuit housing, the ear hanger, and the rear hanger part in the foregoing embodiment, and the movement housing is connected to the support connector.
  • the two earhooks 10 When the earhook 10 is worn, the two earhooks 10 can respectively correspond to the left and right ears of the user, and the rear hanger 30 can correspond to the back side of the user's head to jointly fix the speaker device to the user's head.
  • the earhook 10 can be used to make contact with the user's head, and one or more contact points between the earhook 10 and the user's head (that is, one or more points near the top 25 of the earhook) can be when the speaker assembly 40 vibrates Vibration fulcrum.
  • the vibration of the speaker assembly 40 can be regarded as the fixed point of the ear hook top 25, and the portion of the ear hook 10 between the ear hook top 25 and the speaker assembly 40 serves as the reciprocating swing motion of the arm. Can be used as a vibration fulcrum.
  • the amplitude (ie, vibration acceleration) of the swing of the speaker assembly 40 is positively correlated with the volume of the sound generated by it.
  • the mass distribution of the speaker assembly 40 has a significant effect on the amplitude of the reciprocating swing, which in turn affects the volume produced by the speaker assembly 40.
  • the speaker assembly 40 may include a speaker module (not shown in the figure) and a key module 4d.
  • a speaker module (not shown in the figure) and a key module 4d.
  • the speaker module may be a part of the speaker assembly 40 other than the key module 4d, including, for example, a headphone core 42 and a movement housing 41.
  • the key module 4d can be used for human-computer interaction. For example: to achieve pause/start, recording, answering calls, etc.
  • the key module 4d can realize different interactive functions based on the user's operation instructions, for example: click the key module 4d once to pause/start (such as music, recording, etc.); quickly click the key module 4d twice to realize answering Telephone; click regularly (for example, click once every second, twice in total) to realize the recording function.
  • the user's operation instructions may be operations such as clicking, sliding, scrolling, or a combination thereof. For example, sliding up and down on the surface of the key module 4d to realize the function of switching songs.
  • the user can use the left and right hands to operate the key module 4d separately to improve the user experience.
  • the functions of human-computer interaction can be allocated to the left and right button modules 4d, and the user can operate the corresponding button module 4d according to different functions. For example, corresponding to the button module 4d on the left: click once to turn on the recording function, and click again to turn off the recording function; click twice quickly to realize the pause/play function. For another example, a quick click on the button module 4d on the right side can realize the function of answering a call (if music is playing and there is no telephone access at this time, the function of switching the next/previous song can be realized).
  • the above functions corresponding to the left and right key modules 4d may be user-defined.
  • the user can assign the pause/play function performed by the left button module 4d to the right button module 4d for execution through application software settings.
  • the answering call function performed by the right key module 4d is assigned to be performed by the left key module 4d.
  • operation instructions such as the number of clicks and sliding gestures
  • the user can also set through the application software.
  • the operation instruction corresponding to the answering call function is set from one click to two clicks, and the operation instruction corresponding to the function of switching the next/previous song is set from two clicks to three clicks.
  • User customization can be more in line with the user's operating habits, to a certain extent, avoid operational errors and improve user experience.
  • the above-mentioned human-computer interaction function may not be unique, but may be set according to functions commonly used by users.
  • the key module 4d can also implement functions such as refusing calls, reading text messages by voice, etc., and users can customize settings for the functions and operation instructions corresponding to the functions to meet different needs.
  • the distance between the center of the key module 4d and the vibration fulcrum may not be greater than the distance between the center of the speaker module and the vibration fulcrum. As a result, the vibration acceleration of the speaker assembly 40 is increased, thereby increasing the volume of the speaker assembly 40 vibrated.
  • the center of the key module 4d may be the center of mass m1 or centroid g1, and there is a first distance l1 between the center of mass m1 or centroid g1 of the key module 4d and the top 25 of the ear hook (that is, the vibration fulcrum).
  • the module (the speaker assembly 40 except the rest of the key module 4d) has a second distance l2 between the center of mass m2 or centroid g2 and the top 25 of the earhook.
  • the centroid or centroid of the above speaker module can also be replaced with the centroid or centroid of the movement casing.
  • the mass distribution of the button module 4d and the speaker module is relatively uniform. Therefore, it can be considered that the center of mass m1 of the button module 4d coincides with the centroid, and the center of mass m2 of the speaker module coincides with the centroid g2.
  • the mass distribution of the key module 4d in the speaker assembly 40 can be embodied as the ratio between the first distance l1 and the second distance l2, and the mass ratio k of the mass of the key module 4d to the speaker module.
  • the vibration acceleration of the speaker assembly 40 will be less than when the key module 4d is disposed 4g from the proximal end of the ear hook top 25 Vibration acceleration, which causes the volume to drop.
  • the vibration acceleration of the speaker assembly 40 decreases, which in turn causes the volume to decrease; while at the first distance l1
  • the vibration acceleration of the speaker assembly 40 decreases, which in turn causes the volume to decrease.
  • the setting of the key module 4d can cause the volume reduction of the speaker assembly 40 to be controlled within the range recognized by the ear.
  • the ratio between the first distance l1 and the second distance l2 may not be greater than 1.
  • the centroid m1 or centroid g1 of the key module 4d coincides with the centroid m2 or centroid g2 of the speaker module, so that the key module 4d is opposite Centered in the speaker assembly 40; when the ratio between the first distance l1 and the second distance l2 is less than 1, the centroid m1 or centroid g1 of the key module 4d is closer to the earhook than the centroid m2 or centroid g2 of the speaker module
  • the position of the tip 25 is thus set at the proximal end of the speaker assembly 40 near the tip 25 of the ear hook.
  • the center of mass m1 or centroid g1 of the key module 4d is closer to the top 25 of the earhook relative to the center of mass m2 or centroid g2 of the speaker module.
  • the ratio between the first distance l1 and the second distance l2 may not be greater than 0.95, so that the key module 4d is closer to the top 25 of the ear hook.
  • the ratio between the first distance l1 and the second distance l2 can also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., which can be set according to requirements, which is not limited here.
  • the mass ratio of the key module 4d to the speaker module may not be greater than 0.3, and specifically may not be greater than 0.29, 0.23, 0.17, 0.1, 0.06, 0.04, etc., not limited here.
  • the centroid m2 of the key module 4d may coincide with the centroid g2 (not shown in the figure), that is, at the same point.
  • the centroid m2 of the speaker module coincides with the centroid g2 (not shown in the figure).
  • the prerequisite for being located at the same point is that the mass distribution of the key module 4d and the speaker module is relatively uniform.
  • the centroid m1 and the centroid g1 of the key module 4d may not coincide. Specifically, since the structure of the key module 4d is relatively simple and regular, the centroid g1 is easier to calculate, so the centroid g1 is selected as the reference point.
  • the centroid m2 of the speaker module does not coincide with the centroid g2, but due to the different materials used for the speaker module (such as microphone 432, flexible circuit board 44, pad, etc. are made of different materials), the mass distribution is uneven, and The shape of each component is irregular (such as microphone 432, flexible circuit board 44, pad, etc.). Therefore, the center of mass m2 of the speaker module is used as a reference point.
  • the key module 4d may have a first distance l1 between the centroid g1 and the top 25 of the ear hook, and the center of mass m2 of the speaker module may have a first distance between the top 25 of the ear hook. Two distance l2.
  • the mass distribution of the key module 4d in the speaker assembly 40 can be embodied as the ratio between the first distance l1 and the second distance l2, and the mass ratio k of the mass of the key module 4d to the speaker module.
  • the vibration acceleration of the speaker assembly 40 decreases, which in turn causes the volume to decrease;
  • the vibration acceleration of the speaker device 30 decreases, which in turn causes the volume to decrease. Therefore, by adjusting the ratio between the first distance l1 and the second distance l2 and the mass ratio k of the mass of the key module 4d to the mass of the speaker module, the volume reduction caused by the setting of the key module 4d can be controlled by the human ear Within the scope of identification.
  • the ratio between the first distance l1 and the second distance l2 may not be greater than 1.
  • the centroid g1 of the key module 4d coincides with the centroid m2 of the speaker module, so that the key module 4d is centered relative to the speaker assembly 40;
  • the ratio between the first distance l1 and the second distance l2 is less than 1, the centroid g1 of the key module 4d is closer to the top 25 of the earhook relative to the center of mass m2 of the speaker module, thereby being disposed in the speaker assembly 30 near the earhook
  • the proximal end of the top 25 is 4g.
  • the centroid g1 of the key module 4d is closer to the top 25 of the earhook relative to the centroid m2 of the speaker assembly 30.
  • the ratio between the first distance l1 and the second distance l2 may not be greater than 0.95, so that the key module 4d can be closer to the top 25 of the ear hook.
  • the ratio between the first distance l1 and the second distance l2 can also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., which can be set according to requirements, which is not limited here.
  • the mass ratio of the key module 4d to the speaker module may not be greater than 0.3, and specifically may not be greater than 0.29, 0.23, 0.17 , 0.1, 0.06, 0.04, etc., not limited here.
  • centroid g2 of the speaker module can still be used as a reference point.
  • the description here is similar to the foregoing embodiment and will not be repeated.
  • the speaker module may include an earphone core 42 for generating sound, and a movement case 41 accommodating the earphone core 42.
  • the movement housing 41 is provided with a cavity that accommodates the earphone core 42.
  • the peripheral side wall 411 may include a first peripheral side wall 411a disposed along the length of the outer side wall 412 and a second peripheral side wall 411b disposed along the width direction of the outer side wall 412; the outer sidewall 412 and the peripheral side The walls 411 are connected together to form a cavity open at one end and accommodating the earphone core 42.
  • both the first circumferential side wall 411a and the second circumferential side wall 411b may be two, and the first circumferential side wall 411a and the second circumferential side wall 411b may be enclosed in sequence.
  • the two first circumferential side walls 411a respectively face the front and rear sides of the user's head
  • the two second circumferential side walls 411b respectively face the upper and lower sides of the user's head.
  • the movement housing 41 may further include an outer side wall 412 corresponding to the bottom end wall 416.
  • the outer side wall 412 may be configured to cover one end of the first circumferential side wall 411a and the second circumferential side wall 411b after being enclosed, thereby forming a cavity casing with a cavity open at one end and closed at one end 41.
  • the earphone core 42 can be accommodated in the cavity of the movement housing 41.
  • the shape surrounded by the first circumferential side wall 411a and the second circumferential side wall 411b may not be limited.
  • the first circumferential side wall 411a and the second circumferential side wall 411b can be combined into any shape suitable for wearing on the user's head, for example: rectangular, square, circular, oval, etc.
  • the combined shape of the first circumferential side wall 411a and the second circumferential side wall 411b may conform to the principles of ergonomics to improve the user's wearing experience.
  • the heights of the first circumferential side wall 411a and the second circumferential side wall 411b may be the same or different. When the heights of the two peripheral side walls 411 connected in sequence are different, it should be ensured that the protruding portions of the peripheral side walls 411 will not affect the user's wearing and operation.
  • FIG. 24 is a schematic diagram showing the distance h1 in some embodiments of the speaker device of the present application
  • FIG. 25 is a schematic diagram showing the distance h2 in some embodiments of the speaker device of the present application
  • FIG. 26 is a schematic diagram showing the distance in some embodiments of the speaker device of the present application Schematic diagram of h3.
  • the outer side wall 412 covers an end of the first circumferential side wall 411a and the second circumferential side wall 411b after being enclosed. And when the user wears the speaker device, the outer side wall 412 is located at the end of the first circumferential side wall 411a and the second circumferential side wall 411b away from the user's head.
  • the outer side wall 412 may include a proximal end point and a distal end point, and the proximal end point and the distal end point may be located on a contour of the outer side wall 412 connected to the first peripheral side wall 411a and the second peripheral side wall 411b, respectively , And the near and far points are located at the relative positions of the contour.
  • the distance h1 between the near-end point and the vibration fulcrum is the shortest, which is called the top position; the distance h2 between the far-end point and the vibration fulcrum is the longest, which is called the bottom position; in addition, The distance h3 between the midpoint of the line connecting the near-end point and the far-end point and the vibration fulcrum may be between h1 and h2, which is called the middle position.
  • the key module 4d may be located at the middle position of the outer side wall 412; or the key module 4d may be located between the middle position and the top position of the outer side wall 412.
  • the shape of the button 4d2 may be a rounded rectangle, and the rounded rectangular button 4d2 extends along the length of the outer side wall 412.
  • the key 4d2 includes two axes of symmetry (long axis and short axis), which are arranged axisymmetrically in two symmetric directions perpendicular to each other.
  • FIG. 27 is a schematic diagram showing distances D1 and D2 in some embodiments of the speaker device of the present application. As shown in FIG. 27, the distance between the top of the key 4d2 and the position of the top of the outer side wall 412 is the first distance D1. The distance between the bottom of the key 4d2 and the position of the bottom of the outer side wall 412 is the second distance D2. The ratio of the first distance D1 to the second distance D2 may not be greater than 1.
  • the button 4d2 when the ratio between the first spacing D1 and the second spacing D2 is equal to 1, the button 4d2 is located in the middle of the outer side wall 412, and when the ratio between the first spacing D1 and the second spacing D2 is less than 1, the button 4d2 is located between the middle position and the top position of the outer side wall 412.
  • the ratio between the first distance D1 and the second distance D2 may not be greater than 0.95, so that the key 4d2 is closer to the top of the outer wall 412, that is, closer to the vibration fulcrum, so as to further increase the volume of the speaker assembly 40.
  • the ratio between the first distance D1 and the second distance D2 may also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., which can be set according to requirements, which is not limited here.
  • the connecting portion of the earhook 10 and the speaker module may have a central axis.
  • an outer side may be included.
  • the outer side of the key 4d2 may be the side away from the user's head when wearing the speaker device.
  • the extension r of the central axis may have a projection on the plane where the outer side of the key is located.
  • the angle ⁇ between the projection and the long axis direction of the key 4d2 may be less than 10°, and may specifically be 9°, 7°, 5°, 3°, 1°, etc., which is not specifically limited here.
  • the long axis direction of the key 4d2 does not deviate too much from the extension line r
  • the direction of extension is such that the key 4d2 in the long axis direction is kept at or near the same as the direction of the extension line r of the central axis.
  • the extension r of the central axis has a projection on the plane where the outer side of the key 4d2 is located.
  • the outer surface of the key 4d2 has a cross point in the long axis direction and the short axis direction, and the shortest distance d between the projection and the cross point.
  • the shortest distance d is smaller than the dimension S 2 in the short axis direction of the outer surface of the key 4d2, so that the key 4d2 is close to the extension r of the central axis of the ear hook.
  • the projection of the extension line r of the central axis of the earhook 10 on the plane where the outer side of the key 4d2 is located may coincide with the direction of the long axis to further improve the sound quality of the speaker assembly 40.
  • the long axis of the key 4d2 may be along the direction from the top of the key 4d2 to the bottom of the key 4d2, or may be the direction in which the earhook 10 is connected to the movement housing 41.
  • the short axis of the key 4d2 may be along a straight direction perpendicular to the long axis of the key 4d2 and passing through the midpoint of the line between the top and bottom.
  • the dimension of the key 4d2 along the long axis direction is s 1
  • the dimension along the circumferential direction is s 2 .
  • the first circumferential side wall 411a has a bottom position, a middle position, and a top position in a direction close to the vibration fulcrum.
  • the bottom end position may be the connection point between the first circumferential side wall 411a and the second circumferential side wall 411b away from the earloop 10.
  • the top end position may be a connection point between the first circumferential side wall 411a and the second circumferential side wall 411b close to the earloop 10.
  • the middle position may be the midpoint of the line connecting the bottom end position and the top end position of the first circumferential side wall 411a.
  • the key module 4d may be located at the middle position of the first circumferential side wall 411a (not shown in the figure), or the key module 4d may be located between the middle position and the top position of the first circumferential side wall 411b (FIG. Not shown). And the key module is centrally arranged on the first circumferential side wall 411a along the width direction of the first circumferential side wall 411a of 4d.
  • FIG. 28 is a schematic diagram showing distances l3 and l4 in some embodiments of the speaker device of the present application.
  • the distance between the top of the key module 4d and the top of the first circumferential side wall 411a is a third distance 13.
  • the distance between the bottom of the key module 4d and the bottom end of the first circumferential side wall 411 is a fourth distance l4.
  • the ratio of the third distance l3 to the fourth distance l4 may not be greater than 1.
  • the ratio between the third distance l3 and the fourth distance l4 may not be greater than 0.95, so that the key module 4d is closer to the top position of the first circumferential side wall 411a, that is, closer to the vibration fulcrum, to further improve the speaker assembly 40 volume.
  • the ratio between the third distance l3 and the fourth distance l4 may also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., which can be specifically set according to requirements, and is not limited here.
  • the third distance D3 between the top of the key 4d2 and the top position of the first circumferential side wall 411a, and there is a third distance between the bottom of the key 4d2 and the bottom end position of the first circumferential side wall 411a Four pitch D4.
  • the ratio of the third distance D3 to the fourth distance D4 may not be greater than 1.
  • the ratio between the third distance D3 and the fourth distance D4 may not be greater than 0.95, so that the key 4d2 is closer to the top position of the first circumferential side wall 411a, that is, closer to the vibration fulcrum, so as to further improve the speaker assembly 40 Volume.
  • the ratio between the third distance D3 and the fourth distance D4 can also be 0.9, 0.8, 0.7, 0.6, 0.5, etc., which can be set according to requirements, which is not limited here.
  • the speaker device is only a specific example, and should not be regarded as the only feasible implementation.
  • the key module 4d may be provided in only one of the speaker assemblies 40 on the left and right sides, or both of the speaker assemblies 40 may be provided with the key module 4d. Such deformations are within the scope of protection of this application.
  • FIGS. 29 to 31 are exploded structural views provided by an embodiment of the speaker device of the present application;
  • FIG. 30 is a partial cross-sectional view provided by an embodiment of the speaker device of the present application;
  • FIG. 31 is an enlarged view of the structure at A in FIG. 30.
  • the speaker device includes a component body, and a cavity 111 is formed inside the component body. It should be noted that the component body may be equivalent to the movement housing 41 in the foregoing embodiment.
  • the component body may be a structure formed by combining at least two parts; it may also be a structure manufactured by an integral molding technology, for example, a structure integrally formed by an integral injection process.
  • the spatial shape of the component body includes but is not limited to cuboid, cube, ellipsoid, sphere, cone, and other irregular spatial shapes.
  • the material of the component body includes but is not limited to one or more combinations of plastic, silicone, rubber, plastic, glass, ceramic, alloy, stainless steel, etc.
  • the assembly body may include an accommodating body 51 and a cover 52; the interior of the accommodating body 51 is hollow to form the cavity 111, and the accommodating body 51 is provided with a communication with the cavity 111
  • the opening 112 is covered with the cover 52 and closes the cavity 111.
  • the cavity 111 may be an internal cavity formed by two or more parts assembled together; or may be an internal cavity formed according to the shape of the forming mold during the integral molding process of the component.
  • the cavity 111 can be used to accommodate a plurality of electronic components and circuit structures of the speaker device.
  • the assembly body 50 may be used to seal the cavity 111, and the cavity 111 may be completely sealed by the assembly body 50, or may be sealed together by the assembly body 50 and other accessories on the assembly body 50.
  • the accommodating body corresponds to the peripheral side wall in the foregoing embodiment
  • the cover body corresponds to the bottom end wall in the foregoing embodiment.
  • the accommodating body 51 may be at least a part of the speaker device.
  • the accommodating body 51 in this embodiment may specifically be a structure for accommodating, for example, a circuit board, a battery, and electronic components in the speaker device, and may be, for example, the whole or a part of the housing of the speaker device.
  • the accommodating body 51 is provided with a cavity 111 having an opening 112 for accommodating the above-mentioned circuit board, battery, electronic components, and the like.
  • the opening 112 communicates with the cavity and is used for the mounting and dismounting channels of the circuit board, battery, electronic components, and the like.
  • the number of the opening 112 may be one or multiple, which is not limited herein.
  • the shape of the cover 52 at least partially matches the opening 112 described above, so that the cover 52 is placed on the opening 112 to seal the cavity 111.
  • the material of the cover 52 may be different from the housing body 11 or at least partially the same.
  • the cover 52 includes a hard support 121 and a soft cover 122.
  • the hard bracket 121 is used for mechanical connection with the containing body 51
  • the soft cover layer 122 is integrally injection-molded on the surface of the hard bracket 121, which is used as a cavity after the hard bracket 121 is connected with the containing body 51 111 provides a seal.
  • the material of the hard bracket 121 may be hard plastic, and the material of the soft cover layer 122 may be soft silicone or rubber.
  • the shape of the hard bracket 121 facing the accommodating body 51 can be matched with the opening 112 to be fixed on the opening 112 of the cavity 111 by means of insertion, snapping, etc., so as to be mechanically connected with the accommodating body 51 .
  • the connection between the rigid bracket 121 and the housing body 51 is easy to form a gap to reduce the sealing of the cavity 111.
  • the soft cover layer 122 is integrally formed on the outer surface of the rigid bracket 121 away from the housing body 51 , Which can be further covered at the connection between the hard bracket 121 and the accommodating body 51, so as to achieve the sealing of the cavity 111.
  • the cover 52 includes a hard support 121 and a soft cover 122 integrally molded on the surface of the hard support 121.
  • the hard support 121 is mechanically connected to the housing body 51, and the soft cover 122 further After the hard bracket 121 is connected to the accommodating body 51, a seal is provided for the cavity 111, and the soft cover layer 122 is more convenient to fit the gap between the hard bracket 121 and the accommodating body 51, so as to further improve the speaker device Sealing, thereby improving the waterproof effect of the speaker device.
  • the hard bracket 121 and the soft cover layer 122 are integrally injection molded, which can simplify the assembly process of the speaker device.
  • the hard bracket 121 includes an insertion portion 1211 and a covering portion 1212.
  • the covering portion 1212 covers the opening 112.
  • the insertion portion 1211 is disposed on one side of the covering portion 1212 and extends along the inner wall of the cavity 111. In the cavity 111, the covering portion 1212 is fixed to the opening 112.
  • the insertion portion 1211 may not be inserted through the inner wall of the cavity 111.
  • an insertion portion that matches the shape of the insertion portion 1211 of the hard bracket 121 may also be provided inside the cavity 111.
  • the insertion part 1211 can be inserted into the insertion part, and the insertion part can be fixed inside the cavity 111.
  • the shape of the insertion portion 1211 is a cylinder, and the insertion portion may be a ring that can surround the insertion portion of the cylinder.
  • the inner diameter of the insertion portion of the ring may be smaller than the insertion portion of the cylinder.
  • the outer diameter of ⁇ is such that when the insertion portion 1211 is inserted into the insertion portion, the interference fit with the insertion portion is obtained so that the rigid bracket 121 can be stably connected with the cavity 111.
  • other insertion methods may also be used, as long as the insertion portion 1211 can be inserted into the cavity 111 and fixed to the cavity 111.
  • the covering portion 1212 is provided on the side of the insertion portion 1211 facing away from the cavity 111, and covers the opening 112 after the insertion portion 1211 is inserted into the cavity 111.
  • the covering part 1212 may be a complete structure, or some holes may be further provided as needed to achieve a certain function.
  • FIG. 32 is a cross-sectional view of the speaker device of the present application along the A-A axis in FIG. 29 in a combined state.
  • the receiving body 51 includes an opening edge 113 for defining the opening 112, the covering portion 1212 is pressed against an inner region 1131 of the opening edge 113 near the opening 112, and the soft cover layer 122 covers the covering portion 1212 away
  • the outer surface of the body 51 is accommodated and pressed onto the outer region 1132 around the inner region 1131 of the opening edge 113, thereby achieving sealing with the opening edge 113.
  • the inner region 1131 and the outer region 1132 of the opening edge 113 belong to the opening edge 113, and are not other regions than the opening edge 113.
  • the inner region 1131 of the opening edge 113 is a region of the opening edge 113 close to the opening 112
  • the outer region 1132 of the opening edge 113 is a region of the opening edge 113 away from the opening 112.
  • the covering portion 1212 of the rigid bracket 121 is pressed against the inner region 1131 of the opening edge 113 near the opening 112, so that the covering portion 1212 can initially seal the opening edge 113.
  • the housing body 51 and the hard bracket 121 are made of hard material, the connection between the two and the further covering of the covering portion 1212 cannot achieve a good sealing effect, and the covering portion 1212 is pressed against the opening
  • the edge 113 and the end away from the opening 112 are likely to form a gap between the opening edge 113 and further penetrate the cavity 111 through the gap, thereby reducing the sealing performance.
  • the soft cover layer 122 covers the outer surface of the covering portion 1212 away from the accommodating body 51, and is further pressed against the outer region 1132 around the inner region 1131 of the opening edge 113, so that the hard The gap between the covering portion 1212 of the quality bracket 121 and the opening edge 113 is further covered, and since the soft cover layer 122 is made of soft material, the sealing effect of the speaker device can be further improved and the speaker device has better waterproofness.
  • FIG. 33 is an enlarged view of the structure at B in FIG. 32.
  • the periphery of the covering portion 1212 covers the inner region 1131 of the opening edge 113, and the The inner region 1131 of the opening edge 113 contacts; and the soft cover layer 122 is disposed on the side of the covering portion 1212 away from the housing body 51, so that the covering portion 1212 located in the inner region 1131 of the opening edge 113 is sandwiched by the opening edge 113 Between the inner region 1131 and the soft cover layer 122, and the soft cover layer 122 further extends away from the opening 112 and toward the opening edge 113 of the covering portion 1212 until it contacts the outer region 1132 of the opening edge 113, so that The contact end surface of the cover portion 1212 and the opening edge 113 and the contact end surface of the soft cover layer 122 and the opening edge 113 are arranged flush with each other, and are formed on the inner region 1131 of the opening edge 113 to form the “open
  • FIG. 34 is a partial cross-sectional view provided by an embodiment of the speaker device of the present application.
  • the soft cover layer 122 after the soft cover layer 122 extends to contact with the outer region 1132 of the opening edge 113, it further extends along the region between the covering portion 1212 and the opening edge 113 to the inner region 1131 of the opening edge 113. Between the inner region 1131 of the opening edge 113 and the covering portion 1212, and the covering portion 1212 is pressed against the inner region 1131 of the opening edge 113 to form the "opening edge 113-soft cover layer 122-cover portion 1212-soft cover Layer 122" structure.
  • the soft cover layer 122 further extends between the hard support 121 and the opening edge 113 on the basis of the covering portion 1212 covering the hard support 121, thereby further increasing the space between the cavity 111 and the cover 52 Sealing, and further improve the waterproof effect of the speaker device.
  • the speaker device further includes a circuit component 53 disposed in the cavity 111, and a switch 1311 is disposed on the circuit component 53.
  • the circuit assembly 53 may include a first circuit board 131, and the switch 1311 is disposed on the outer side of the first circuit board 131 facing the opening 112 of the cavity 111.
  • the number of switches 1311 may be one, or multiple. When the number of switches 1311 is plural, they may be arranged on the first circuit board 131 at intervals.
  • first circuit board 131 corresponds to the first branch circuit board in the foregoing embodiment.
  • the hard bracket 121 is provided with a switch hole 1213 corresponding to the switch 1311
  • the soft cover layer 122 further covers the switch hole 1213
  • a pressing portion 1221 is provided at a position corresponding to the switch hole 1213.
  • the switch hole 1213 extends toward the inside of the cavity 111.
  • the pressing portion 1221 provided on the soft cover layer 122 is formed by the side of the soft cover layer 122 facing the bracket 121 protruding toward the switch hole 1213 and the switch 1311.
  • the shape of the pressing portion 1221 matches the switch hole 1213 , So that when the position corresponding to the soft cover layer 122 is pressed, the pressing portion 1221 can pass through the switch hole 1213 to reach the corresponding switch 1311 on the first circuit board 131.
  • the length of the pressing portion 1221 in the direction toward the switch 1311 is set so that the switch 1311 is not pressed when there is no pressing at the position corresponding to the soft cover layer 122, and the corresponding switch 1311 can be pressed when pressed.
  • the position of the soft cover layer 122 corresponding to the pressing portion 1221 is further protruded toward the side facing away from the hard bracket 121 to form a convex pressing portion 1222, so that the user can clarify the position of the switch 1311 And, by pressing the corresponding pressing portion 1222, the starting circuit component 53 performs the corresponding function.
  • the first microphone element 1312 and the second microphone element 1321 are distributed in the movement housing 41 in a specific manner such that a main sound source (eg, a person's mouth) is located at the first The two microphone elements 1321 point in the direction of the first microphone element 1312.
  • a main sound source eg, a person's mouth
  • first microphone element 1312 corresponds to the first microphone 432a in the foregoing embodiment
  • second microphone element 1321 corresponds to the second microphone 432b in the foregoing embodiment.
  • the distance of the mouth (primary sound source) relative to the first microphone element 1312 and the second microphone element 1321 is higher than that of other sound sources (eg, noise sources) in the environment relative to the first microphone element 1312
  • the distance to the second microphone element 1321 is close, and it can be considered that the mouth is the near-field sound source of the first microphone element 1312 and the second microphone element 1321.
  • the amount of sound received by the two sets of microphone components is related to the distance from the sound source.
  • the first microphone element 1312 Since the first microphone element 1312 is closer to the main sound source, the first microphone element 1312 will receive a larger audio signal V J1 ; the second microphone element 1321 is farther from the main sound source, so the second microphone element 1321 will receive To the smaller audio signal V J2 . That is, V J1 >V J2 .
  • the noise source in the environment is far away from the first microphone element 1312 and the second microphone element 1321, it can be considered that the noise source in the environment is the far-field sound source of the first microphone element 1312 and the second microphone element 1321.
  • the noise signals received by the two microphone assemblies are similar, that is, V Y1 ⁇ V Y2 .
  • the total sound signal received by the first microphone element 1312 is:
  • V 1 V J1 +V Y1 (1)
  • the total sound signal received by the second group of microphone components is:
  • V 2 V J2 +V Y2 (2)
  • the first microphone element 1312 total sound signal and the second microphone element 1321 total sound signal may be differentially processed.
  • the form of differential processing can be as follows:
  • the first microphone element 1312 and/or the second microphone element can be further obtained
  • the audio signal from the main sound source actually obtained by 1321 is V J1 or V J2 .
  • the differential result of the signal obtained in formula (3) should be as large as possible, that is, V J1 >>V J2 .
  • this effect may be achieved in the following manner: the first microphone element 1312 is installed as close as possible to the main sound source (such as a person's mouth); the second microphone element 1321 is installed as far as possible It may be far away from the main sound source (such as a person's mouth); isolate the space between two microphones; set a sound blocking member between the two microphone elements. It should be noted that all of the above methods can achieve the effect of improving the quality of the audio signal, and these methods can be used alone or in combination.
  • the first circuit board 131 and the first microphone element 1312 mounted thereon may be set to be inclined of.
  • the second circuit board 132 and the second microphone element 1321 mounted thereon may be set to be inclined In order to flexibly adjust the required installation distance.
  • a corresponding sound guide channel and sound blocking member can also be provided in each microphone assembly installation area.
  • FIG. 35 is a cross-sectional view of the speaker device of the present application along the BB axis in FIG. 29 in a combined state
  • FIG. 36 is the first circuit board and the second circuit board of the present application Schematic diagram of the circuit board and the embodiment with different angles in FIG. 35.
  • the first circuit board 131 includes a first microphone element 1312. Specifically, the first circuit board 131 is disposed facing the cover 52, and the first microphone element 1312 is disposed on a side of the first circuit board 131 facing the cover 52.
  • the first microphone element 1312 may be disposed on the first circuit board 131 at a distance from the switch 1311 in the above embodiment.
  • the first microphone element 1312 is used to receive a sound signal from the outside of the movement case 41 and convert the sound signal into an electrical signal for analysis and processing.
  • the bracket 121 is provided with a microphone hole 1214 corresponding to the first microphone element 1312
  • the soft cover layer 122 is provided with a first sound guide hole 1223 corresponding to the microphone hole 1214.
  • the first sound guide hole 1223 may be provided corresponding to the first microphone element 1312.
  • the first sound guide hole 1223 is provided on the cover 52, one end of the first sound guide hole 1223 is connected to the microphone hole 1214 on the cover 52, and the other end of the first sound guide hole 1223 faces the first
  • the microphone element 1312 can shorten the sound guide distance and improve the sound guide effect.
  • the first circuit board 131 faces the cover 52 in a manner parallel or inclined to the cover 52, and the first sound guide hole 1223 is perpendicular or inclined to the surface of the cover 52.
  • the depth direction of the opening 112 may be vertical relative to the bottom of the receiving body 51 or may be inclined.
  • the cover 52 is horizontal with respect to the containing body 51 after being covered; when the opening 112 is inclined, the cover 52 is relative to the containing body after being covered 51 is inclined, and the inclination is inclined to the side facing the mouth of the human body.
  • the first sound guide hole 1223 can be more directly facing the mouth or face of the person, and the effect of the microphone component acquiring the sound of the main sound source is improved.
  • the angle between the plane of the opening 112 and the plane of the width direction of the receiving body is in the range of 10° to 30°, so that the first sound guide hole 1223 further faces the mouth area of the person .
  • the angle between the plane where the opening 112 is located and the plane where the width direction of the receiving body is located may be any angle within the above range, for example, 10°, 15°, 20°, 23°, 27°, It can be 30°, etc., no specific limitation here.
  • the first sound guide hole 1223 is provided through the soft cover layer 122.
  • the first sound guide hole 1223 is perpendicular to the cover body 52
  • the first sound guide hole 1223 is vertical; when the opening 112 is vertical and the first circuit board 131 is inclined to the cover 52, the first sound guide hole 1223 is inclined to the cover 52, ie The first sound guide hole 1223 is inclined; when the opening 112 is inclined and the first circuit board 131 is parallel to the cover 52, the first sound guide hole 1223 is disposed perpendicular to the cover 52, that is, the first sound guide hole 1223 is inclined; when the opening 112 is inclined and the first circuit board 131 is inclined to the cover 52, the first sound guide hole 1223 may also be inclined to the cover 52, that is, the first sound guide hole 1223 may be Vertical or inclined.
  • the angle between the first circuit board 131 and the plane where the cover body 52 is located is within a range of 5° to 20°.
  • the angle between the first circuit board 131 and the plane where the cover 52 is located may be within the range of the included angle, such as 5° , Any angle of 8°, 10°, 15°, 20°, not specifically limited here.
  • the first sound guide hole 1223 corresponds to the microphone hole 1214 on the bracket 121, and further communicates the first microphone element 1312 with the outside of the movement case 41, so that the sound outside the movement case 41 can pass through the first guide
  • the sound hole 1223 and the microphone hole 1214 are received by the first microphone element 1312.
  • the central axis of the first sound guide hole 1223 coincides with the main axis of the sound receiving area 13121 of the first microphone element 1312.
  • the sound receiving area 13121 of the first microphone element 1312 refers to an area (for example, a diaphragm) on the first microphone element 1312 that receives sound waves.
  • the first sound guide hole 1223 When the central axis of the first sound guide hole 1223 coincides with the main axis of the sound receiving area 13121 of the first microphone element 1312, after the sound of the main sound source is collected by the microphone hole 1214, the first sound guide hole 1223 can directly guide the sound
  • the sound receiving area 13121 of a microphone element 1312 further reduces the sound propagation path, which can not only avoid the loss and echo caused by the repeated propagation of the main sound source in the cavity, but also prevent the main sound source from entering the second microphone through the channel in the cavity
  • the area where the element 1321 is located thereby playing the role of improving sound effects.
  • the cover 52 is arranged in a strip shape, wherein the main axis of the first sound guide hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 are in the width direction of the cover 52 coincide.
  • the main axis of the sound receiving area 13121 of the first microphone element 1312 refers to the main axis of the sound receiving area 13121 of the first microphone element 1312 in the width direction of the cover 52, as shown in the axis n in FIG. 35, the first guide
  • the main axis of the sound hole 1223 is as the axis m in FIG. 35, and the axis n and the axis m coincide.
  • the shape of the first sound guide hole 1223 may be any shape as long as it can input sound from outside of the speaker device.
  • the first sound guide hole 1223 is a circular hole with a small size, and is disposed in the area of the cover 52 corresponding to the microphone hole 1214.
  • the small size first sound guide hole 1223 can reduce the communication between the first microphone element 1312 and the like in the speaker device and the outside world, thereby improving the enclosure of the speaker device.
  • the sound guide channel 12241 may be provided in a curved shape.
  • the main axis of the first sound guide hole 1223 is disposed in the middle of the cover 52 in the width direction of the cover 52.
  • the soft cover layer 122 is also provided with a first sound blocking member 1224 at a position corresponding to the microphone hole 1214.
  • the first sound blocking member 1224 extends toward the inside of the cavity 111 through the microphone hole 1214 and defines a sound guide channel 12241.
  • One end of the sound channel 12241 communicates with the first sound guide hole 1223 on the soft cover layer 122, and the first microphone element 1312 is inserted into the sound guide channel 12241 from the other end of the sound guide channel 12241.
  • the switch hole 1213 and the microphone hole 1214 may be disposed on the hard bracket 121 at intervals.
  • the distance between the switch hole 1213 and the microphone hole 1214 may be 10-20 mm, and specifically may also be 10 mm, 15 mm, 20 mm, and so on.
  • the first sound blocking member 1224 extends from the outer periphery of the first sound guide hole 1223 through the soft cover layer 122 through the microphone hole 1214 to the interior of the cavity 111 to the outer periphery of the first microphone element 1312, thereby forming a A sound guide hole 1223 to the sound guide channel 12241 of the first microphone element 1312, so that the sound signal of the speaker device entering the sound guide hole can directly reach the first microphone element 1312 through the sound guide channel 12241.
  • the shape of the sound guide channel 12241 in a cross section perpendicular to the longitudinal direction thereof may be consistent with the shape of the microphone hole 1214 or the first microphone element 1312, and of course may not be consistent.
  • the cross-sectional shapes of the microphone hole 1214 and the first microphone element 1312 in a direction perpendicular to the bracket 121 toward the cavity 111 are both square, and the size of the microphone hole 1214 is slightly larger than the peripheral size of the sound guide channel 12241
  • the internal dimensions of the sound guide channel 12241 are not smaller than the outer dimensions of the first microphone element 1312, so that the sound guide channel 12241 can pass through the first sound guide hole 1223 to reach the first microphone element 1312 and be wrapped in the first microphone element 1312 The periphery.
  • the soft cover layer 122 of the speaker device is provided with the first sound guide hole 1223 and the periphery of the first sound guide hole 1223 passes through the microphone hole 1214 to reach the first microphone element 1312 and is wrapped in the first microphone element 1312 Peripheral sound-guiding channel 12241, the sound-guiding channel 12241 is arranged so that the sound signal entering through the first sound-guiding hole 1223 can reach the first microphone element 1312 through the first sound-guiding hole 1223 and be received by the first microphone element 1312 Therefore, the leakage of the sound signal during the propagation process can be reduced, thereby improving the efficiency of the speaker device receiving the sound signal.
  • the speaker device further includes a waterproof mesh fabric 54 disposed in the sound guide channel 12241.
  • the waterproof mesh fabric 54 is held by the first microphone element 1312 against the side of the soft cover layer 122 facing the microphone element And cover the first sound guide hole 1223.
  • the bracket 121 protruding from the position of the sound guide channel 12241 near the first microphone element 1312 forms a convex surface opposite to the first microphone element 1312, so that the waterproof mesh 54 is sandwiched between the first microphone element 1312 and the convex surface Or, it can be directly bonded to the periphery of the first microphone element 1312, and the specific setting method is not limited herein.
  • the waterproof mesh 54 in this embodiment may also have a function of sound transmission and the like to avoid the sound receiving effect on the sound receiving area 13121 of the first microphone element 1312 Negative Effects.
  • the first microphone element 1312 can be disposed at the first position of the first circuit board 131, and when the first sound guide hole 1223 is disposed, it is also beautiful and convenient.
  • the first position and the second position may not correspond in the width direction of the cover 52, resulting in the first
  • the main axis of the sound guide hole 1223 and the main axis of the sound receiving area 13121 of the first microphone element 1312 are spaced apart from each other in the width direction of the cover 52, so that the sound input by the first sound guide hole 1223 may not be able to be reached in a straight line
  • the cover 52 may be a part of the outer shell of the speaker device, and in order to meet the overall aesthetic requirements of the speaker device, the first sound guide hole 1223 may be provided in the middle of the width direction of the cover 52, so that the first A sound guide hole 1223 looks more symmetrical, meeting people's visual needs.
  • the corresponding sound guide channel 12241 can be set to have a stepped cross section along the BB axis in FIG. 29, so that the sound signal introduced by the first sound guide hole 1223 can be transmitted to the first sound guide channel 12241 through the stepped sound guide channel 12241.
  • a microphone element 1312 is received by the first microphone element 1312.
  • the speaker device further includes a light-emitting element 1313.
  • the light emitting element 1313 may be disposed on the first circuit board 131 of the circuit assembly 53 to be accommodated in the cavity 111.
  • the light emitting element 1313 may be arranged on the first circuit board 131 in a certain arrangement together with the switch 1311 and the first microphone element 1312 in the above embodiment.
  • the circuit component 53 may be equivalent to the control circuit 60 in the foregoing embodiment.
  • the hard bracket 121 is provided with a light exit hole 1215 corresponding to the light emitting element 1313, the soft cover layer 122 covers the light exit hole 1215, and the thickness of the area of the soft cover layer 122 corresponding to the light exit hole 1215 is set to allow the light emitting element The light generated by 1313 is transmitted through the soft cover layer 122.
  • the light-emitting element 1313 may be a light-emitting diode, etc.
  • the number of the light-emitting element 1313 may be one or more, and the number of light-emitting holes 1215 on the rigid support 121 may be the same as that of the light-emitting element 1313. At this time, different light exit holes 1215 correspond to different light emitting elements 1313 to transmit different signals.
  • the soft cover layer 122 can still transmit the light emitted by the light-emitting element 1313 to the outside of the speaker device by covering the light exit hole 1215 by certain means.
  • the thickness of the soft cover layer 122 corresponding to the entire area or part of the light exit hole 1215 may be set to be smaller than the thickness of the soft cover layer 122 corresponding to the area around the light exit hole 1215, so that The light emitted by the light emitting element 1313 can pass through the light exit hole 1215 and be further transmitted by the soft cover layer 122.
  • the area where the soft cover layer 122 covers the light exit hole 1215 can also transmit light through other means, which is not specifically limited here.
  • the soft cover layer 122 is provided with a window corresponding to the whole area or part of the light exit hole 1215, and the window is covered with a layer of transparent or light-transmitting material (for example, thin film, quartz, etc.), so that the light emitted by the light emitting element 1313 The light can pass through the light exit hole 1215 and be further transmitted through the window.
  • a layer of transparent or light-transmitting material for example, thin film, quartz, etc.
  • the soft cover layer 122 on the basis of covering the light exit hole 1215 of the corresponding light emitting element 1313, is further configured to allow the light emitted by the light emitting element 1313 to transmit from the soft cover layer 122 to the outside of the speaker device, thereby
  • the light-emitting element 1313 can be sealed by the soft cover layer 122 without affecting the light-emitting function of the speaker device to improve the sealing performance and waterproof performance of the speaker device.
  • the hard bracket 121 is further provided with a light blocking member 1216 extending toward the inside of the cavity 111 at the periphery of the light exit hole 1215, the light blocking member 1216 restricts the transmission direction of the light generated by the light emitting element 1313 .
  • the shape of the light exit hole 1215 may be any shape that can transmit the light emitted by the light emitting element 1313, such as a circle, square, triangle, etc. In this embodiment, the shape of the light exit hole 1215 is circular.
  • the arrangement of the light blocking member 1216 can limit the transmission direction of the light generated by the light emitting element 1313, so as to reduce light leakage, thereby improving the brightness of the light transmitted through the light exit hole 1215.
  • the light blocking member 1216 in this embodiment may be partially or entirely formed by a hard bracket 121, for example, the hard bracket 121 may extend along the periphery of the light exit hole 1215 toward the interior of the cavity 111 and surround the light emitting element 1313, Thereby, an optical channel through which light propagates is formed, and through this optical channel, the light generated by the light-emitting element 1313 can directly propagate toward the light exit hole 1215 along the installation direction of the channel; or, the hard bracket 121 may not form an optical channel, but The propagation of light is restricted only from one direction or several directions.
  • the hard bracket 121 may extend from only one side of the light exit hole 1215 into the cavity 111 to form a light blocking member 1216 that blocks the light emitting element 1313 on one side. Or it can further cooperate with other components to limit the propagation of light.
  • the hard bracket 121 extends from the side of the light exit hole 1215 into the cavity 111 to form a light blocking member 1216 that blocks the light emitting element 1313 on one side.
  • the light blocking member 1216 further cooperates with the inner wall of the cavity 111 or the hard bracket 121 Other structures, etc. to limit the transmission direction of the light generated by the light emitting element 1313 from multiple directions.
  • the light emitting element 1313 and the first microphone element 1312 are arranged on the first circuit board 131, and the corresponding light exit hole 1215 and the microphone hole 1214 are arranged on the hard bracket 121 at intervals, as in the above embodiment
  • the first microphone element 1312 is provided with a first sound blocking member 1224 formed by the soft cover layer 122 and defining a sound guide channel 12241.
  • the first sound blocking member 1224 is disposed through the microphone hole 1214, thereby The first microphone element 1312 and the light emitting element 1313 and the microphone hole 1214 and the light exit hole 1215 are spaced apart.
  • the light blocking member 1216 formed by the hard bracket 121 cooperates with a side wall of the first sound blocking member 1224 close to the light emitting element 1313, and both of them jointly limit the transmission direction of the light generated by the light emitting element 1313.
  • the cavity 111 is provided in an elongated shape in a cross section perpendicular to the direction of the opening 112.
  • the hard bracket 121 is also elongated and inserted into the cavity 111 from the opening 112 through the insertion portion 1211, Thereby, a mechanical connection is formed with the cavity 111.
  • the light emitting element 1313 is also provided with corresponding insertion portions 1211 of the rigid holder 121 on both sides along the longitudinal direction of the rigid holder 121
  • the light blocking member 1216 is further provided on the side of the light emitting element 1313 perpendicular to the length direction of the hard bracket 121, and the first sound blocking
  • the side wall of the piece 1224 is disposed on the other side of the light emitting element 1313 perpendicular to the length direction of the rigid bracket 121, and the two can be parallel plates, which are further restricted by the insertion portions 1211 on both sides of the light emitting element 1313 The transmission direction of the light generated by the light emitting element 1313.
  • the circuit assembly 53 in the speaker device includes the first circuit board 131 in the above-mentioned speaker device embodiment, and may further include a second circuit board 132, as shown in FIG. 29, FIG. 32, and FIG. 35. Figure 36.
  • the second circuit board 132 is disposed facing the accommodating body 51, and the second circuit board 132 is inclined to the first circuit board 131 and disposed in the cavity 111, and the second circuit board 132 faces the accommodating body A side of 51 is provided with a second microphone element 1321.
  • the second circuit board 132 corresponds to the second branch circuit board in the foregoing embodiment.
  • the second microphone element 1321 is disposed facing the side wall of the accommodating body 51, so that there is a large space near the second microphone element 1321, and it is convenient to provide functional parts corresponding to the second microphone element 1321 on the accommodating body 51.
  • the second circuit board 132 is inclined to the first circuit board 131, and the functional parts on the two circuit boards can be offset from each other, and can also play a role in reducing the spacing between the functional parts, which can further save and compress the speaker device. space.
  • a side wall of the housing body 51 opposite to the cover 52 or the first sound guide hole 1223 is further provided with a second sound guide hole 114.
  • first sound-guiding hole and the second sound-guiding hole are equivalent to the sound inlet hole in the foregoing embodiment.
  • the side wall of the accommodating body 51 is correspondingly provided with a second sound guide hole 114, and the second sound guide hole 114 and the first sound guide hole 1223 are away from each other.
  • the opening 112 of the accommodating body 51 is an inclined opening
  • the cover 52 is inclined relative to the accommodating body 51
  • the side wall of the accommodating body 51 opposite to the first sound guide hole 1223 is the cavity 111
  • the second sound guide hole 114 is disposed on the side of the housing 51.
  • the second sound guide hole 114 is disposed on one side of the accommodating body 51 and is within a range of 3 to 6 mm from the top of the accommodating body 51. Specifically, it can be 3mm, 4mm, 5mm, 6mm, etc.
  • the cover 52 when the depth direction of the opening 112 of the accommodating body 51 is vertical with respect to the bottom of the accommodating body, the cover 52 is disposed horizontally with respect to the accommodating body 51, and the opposite of the first sound guide hole 1223
  • the side wall of the containing body 51 is the top of the cavity 111, and the sound guide hole 114 is provided on the top of the containing body 51.
  • the second sound guide hole 114 may be disposed at the top middle position of the accommodating body 51.
  • the second sound hole 114 can be moved away from the main sound source, the sound of the main sound source received by the second sound hole 114 can be reduced, the ratio of the ambient noise received by the second sound hole 114 can be increased, and the noise reduction effect can be enhanced.
  • the cover 52 is provided with a first sound guide hole 1223 corresponding to the first microphone element 1312 and the microphone hole 1214, wherein the first microphone element 1312 is used to receive The sound input through a sound guide hole 1223, the second microphone element 1321 is used to receive the sound input through the second sound guide hole 114.
  • the central axis of the second sound guide hole 114 coincides with the main axis of the sound receiving area of the second microphone element 1321.
  • noise can be directly directed to the sound receiving area of the second microphone element 1321 through the second sound guide hole 114, reducing noise Propagation inside the cavity 111.
  • the noise can be directly directed to the sound receiving area 13121 of the first microphone element 1312 through the first sound guide hole 1223.
  • the noise received by the first microphone element 1312 and the second microphone element 1321 is approximately the same, which is beneficial for eliminating noise in subsequent processing and improving the quality of the main sound source.
  • the central axis of the second sound guide hole 114 coincides with or is parallel to the central axis of the first sound guide hole 1223.
  • the second sound-guiding hole 114 and the first sound-guiding hole 1223 have the same central axis direction, that is, the central axes of the two are coincident or parallel.
  • the sound inlet of the second sound guide hole 114 and the sound inlet of the first sound guide hole 1223 face in opposite directions, reducing the main sound source received by the second sound guide hole 114, which is beneficial to eliminate noise in subsequent processing and improve Main sound source quality.
  • the main axis of the sound receiving area of the second microphone element 1321 coincides with or is parallel to the main axis of the sound receiving area 13121 of the first microphone element 1312.
  • the sound receiving area of the second microphone element 1321 receives the sound signal passing through the second sound guide hole 114, and the sound receiving area 13121 of the first microphone element 1312 receives the sound signal passing through the first sound guide hole 1223. Since the main sound source signal through the second sound guide hole 114 is small, the main sound source signal received by the sound receiving area of the second microphone element 1321 is small, which is beneficial to achieve the effect of improving the quality of the audio signal.
  • the first circuit board 131 may be parallel to the opening plane of the opening 112 and disposed near the opening 112. Alternatively, the first circuit board 131 may also be inclined to the opening plane of the opening 112 and disposed near the opening 112. Further, the first circuit board 131 may further be provided with a switch 1311, a light-emitting element 1313, etc. as described above.
  • the switch 1311, the light-emitting element 1313, and the first microphone element 1312 may be arranged on the first circuit board in a certain arrangement
  • a switch hole 1213, a light exit hole 1215, a microphone hole 1214, etc. are provided on the cover 52 at intervals to transmit signals through the corresponding holes to the outside of the speaker device.
  • the microphone hole 1214 may be provided at the central position of the cover 52, and the switch hole 1213 and the light exit hole 1215 may be provided on both sides of the microphone hole 1214 in the longitudinal direction of the cover 52, respectively.
  • the distance between the switch hole 1213 and the light exit hole 1215 from the microphone hole 1214 may be in the range of 5-10 mm, specifically, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc.
  • the distance between the switch hole 1213 and the light exit hole 1215 from the microphone hole 1214 may be equal or unequal.
  • the receiving body 51 extends from the opening 112 in a direction perpendicular to the plane of the opening to form a cavity 111 with a certain width
  • the second circuit board 132 may be parallel to the width direction of the cavity 111 and perpendicular to the opening Flat set.
  • the second circuit board 132 may also be inclined to the width direction of the cavity 111 and inclined to the plane of the opening 112.
  • the second circuit board 132 is inclined to the first circuit board 131 and disposed in the cavity 111.
  • the second circuit board 132 may be further provided with a main control chip and an antenna.
  • the second circuit board 132 is inclined to the width direction of the cavity 111 and is arranged to be inclined to the plane of the opening 112.
  • the angle between the second circuit board 132 and the cavity 111 in the width direction is within a range of 5° to 20°.
  • the angle between the second circuit board 132 and the width direction of the cavity 111 may be any angle within the above range, such as 5°, 10°, 15°, 20°, etc., which is not specifically limited herein.
  • the main axis of the sound receiving area of the second microphone element 1321 coincides with the main axis of the sound receiving area 13121 of the first microphone element 1312, and the first microphone The element 1312 and the second microphone element 1321 are in line with the user's mouth.
  • a first microphone element 1312 and a second microphone element 1321 are provided on two circuit boards, respectively.
  • the two microphone elements receive sound signals through the first sound guide hole 1223 and the second sound guide hole 114, one of them
  • the microphone element can be used to collect main sounds such as human voice, and the other microphone element can have a background noise collection function, which is convenient for collecting ambient noise.
  • the two cooperate with the analysis and processing of the received sound signal, which can play the role of noise reduction, etc. So as to improve the processing quality of sound signals.
  • FIG. 36 is a schematic structural diagram of an embodiment of the speaker device of the present application in a different angle from FIG. 35 in a combined state, a first circuit board 131 and a second circuit board 132 Set obliquely to each other in the same cavity 111, which can make the installation of the two circuit boards more flexible, and can adjust the angle between the two circuit boards according to the size and position of the electronic components on the two circuit boards, thereby improving the speaker
  • the space utilization rate of the device is further applied to the speaker device, the space of the speaker device can be saved, which is beneficial to the thinning and thinning of the speaker device.
  • the angle between the first circuit board 131 and the second circuit board 132 is in the range of 50° to 150°, and the specific angle between the first circuit board 131 and the second circuit board 132 may be any angle within the above range , For example, 70°, 80°, 90°, 100°, 110°, etc.
  • the opening 112 and the cover 52 are arranged in a corresponding elongated shape, the shape of the first circuit board 131 matches the shape of the opening 112, and the width d 1 of the first circuit board 131 is not greater than The dimension of the opening plane along the width of the opening 112, so that the first circuit board 131 (parallel or inclined to the plane where the opening is located) can be accommodated in the cavity 111 near the opening 112, that is, the first circuit board 131 is also long Strip setting.
  • the switch 1311, the light emitting element 1313 and the first microphone element 1312 may be arranged on the first circuit board 131 at intervals along the length direction of the first circuit board 131, that is, in the length direction of the cover 52.
  • the second microphone element 1321 is a bone conduction microphone, and the bone conduction microphone extends out of the receiving body 51 through the second sound guide hole 114.
  • the bone conduction microphone is installed on a side wall of the receiving body 51.
  • the side wall is a side wall that fits the user's body when the user wears the speaker device, so that the bone conduction microphone can better receive the vibration signal of the main sound source.
  • the second microphone element 1321 will mainly collect the vibration signal of the main sound source, and combine the vibration signal with the sound signal (including audio signal and Noise) for comparison.
  • the sound signal collected by the first microphone element 1312 may be optimized to obtain a high-quality audio signal.
  • the component body 50 is provided with a second sound guide hole 114 penetrating the side wall of the cavity 111, and a second sound blocking member 115 is provided at a position corresponding to the second sound guide hole 114.
  • the member 115 extends toward the inside of the cavity 111 through the second sound guide hole 114 to limit the transmission direction of sound to the second microphone element 1321.
  • the second sound guide hole 114 corresponding to the second microphone element 1321 is provided on the assembly body 50 and penetrates the cavity 111 to communicate the second microphone element 1321 with the outside world so that the second microphone The element 1321 can receive external sound signals.
  • the second sound blocking member 115 can be a hard material or a soft material.
  • the second sound blocking member 115 can be moved from the housing body 51 on the inner side of the cavity 111 along the periphery of the second sound guide hole 114 toward the cavity
  • the body 111 extends inside.
  • the second sound blocking member 114 may be formed by a soft glue integrally injection-molded with the accommodating body 51 on the inner side of the cavity 111 along the outer periphery of the second sound guide hole 114 and formed into the cavity 111.
  • the second sound blocking member 115 may extend into the cavity 111 along the circumference of the second sound guide hole 114 and extend to the second microphone element 1321, and thus surround the sound receiving area of the second microphone element 1321 To form a channel connecting the second sound hole 114 and the second microphone element 1321, so that the sound signal input from the outside to the second sound hole 114 directly passes through the channel and is received by the sound receiving area of the second microphone element 1321 .
  • the second sound blocking member 115 may not completely surround the second sound-guiding hole 114, but only extends along one or both sides of the second sound-guiding hole 114 to the interior of the cavity 111. , And extends to the second microphone element 1321 to guide the sound input from the second sound guide hole 114 to the second microphone element 1321 to be received by the sound receiving area.
  • the speaker device may further include an audio signal comparison element.
  • the audio signal comparison element may mainly collect the vibration signal of the main sound source by the second microphone element 1321 and the sound signal (including the audio signal and the sound signal) collected by the first microphone element 1312 (air conduction). Noise), and based on the above comparison result, the sound signal collected by the first microphone element 1312 can be optimized to obtain a high-quality audio signal. Such deformations are within the scope of protection of this application.
  • the speaker device described above can transmit sound to the user through air conduction.
  • the speaker device may include one or more sound sources.
  • the sound source may be located at a specific position on the user's head, for example, the top of the head, forehead, cheeks, temples, pinna, back of the pinna, etc., without blocking or covering the ear canal.
  • FIG. 38 is a schematic diagram showing the transmission of sound through air conduction.
  • the sound source 3010 and the sound source 3020 can generate sound waves of opposite phases ("+" and "-" in the figure indicate opposite phases).
  • the sound source mentioned here refers to the sound output hole of the speaker device to output sound.
  • the sound source 3010 and the sound source 3020 may be two sound exit holes respectively located at specific positions on the speaker device (for example, the movement housing 41 or the circuit housing 20).
  • the sound source 3010 and the sound source 3020 may be generated by the same vibration device 3001.
  • the vibration device 3001 includes a diaphragm (not shown in the figure).
  • the front of the diaphragm drives the air to vibrate, and a sound source 3010 is formed at the sound hole through the sound guide channel 3012, and the air is driven to vibrate at the back of the diaphragm, and at the sound hole through the sound guide channel 3022 Sound source 3020 is formed.
  • the sound guide channel refers to a sound propagation path from the diaphragm to the corresponding sound hole.
  • the sound guide channel is a path surrounded by a specific structure on the speaker (for example, the movement housing 41 or the circuit housing 20). It should be understood that, in some alternative embodiments, the sound source 3010 and the sound source 3020 may also be generated by different vibration devices through different diaphragm vibrations.
  • the sound transmitted to the user's ear may be referred to as near-field sound
  • the leaked sound transmitted to the environment may be referred to as far-field sound.
  • the near-field/far-field sounds of different frequencies generated by the speaker device are related to the distance between the sound source 3010 and the sound source 3020.
  • the near-field sound generated by the speaker device increases as the distance between the two sound sources increases, and the generated far-field sound (leakage) increases as the frequency increases.
  • the distance between the sound source 3010 and the sound source 3020 can be designed separately so that the low-frequency near-field sounds (for example, sounds with frequencies less than 800 Hz) generated by the speaker device are as large as possible, and the high-frequency far-field sounds (for example, (Sounds with a frequency greater than 2000Hz) are as small as possible.
  • the speaker device may include two or more sets of dual sound sources.
  • Each set of dual sound sources includes two sound sources similar to the sound source 3010 and the sound source 3020, and generates sounds with specific frequencies, respectively.
  • the first set of dual sound sources can be used to generate low frequency sounds
  • the second set of dual sound sources can be used to generate high frequency sounds.
  • the distance between the two sound sources in the first set of dual sound sources can be set to a larger value. And because the wavelength of the low-frequency signal is long, the large distance between the two sound sources will not form an excessive phase difference in the far field, and therefore will not form excessive sound leakage in the far field. In order to make the high-frequency far-field sound smaller, the distance between the two sound sources in the second set of dual sound sources can be set to a smaller value. Because the wavelength of the high-frequency signal is short, the small distance between the two sound sources can avoid the formation of a large phase difference in the far field, thus avoiding the formation of large sound leakage. The distance between the second set of dual sound sources is less than the distance between the first set of dual sound sources.
  • the beneficial effects that the embodiments of the present application may bring include, but are not limited to: (1) The position of the key module 4d on the speaker device is optimized to improve the vibration efficiency; (2) The sound transmission efficiency of the speaker device is improved and the volume is increased; (3) Improve the waterproof effect of the speaker device; (4) Reduce the loss of sound entering through the sound inlet hole 413, and improve the conversion rate of the sound into the vibration of the waterproof membrane body 4c11; (5) Improve the movement shell 41 Waterproof and protective effect of internal devices; (6) Avoid loss and echo caused by repeated propagation of the main sound source in the cavity, and prevent the main sound source from being introduced into the area where the second microphone element 1321 is located through the channel in the cavity, thereby achieving The role of improving sound effects. It should be noted that different embodiments may have different beneficial effects. In different embodiments, the possible beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

Abstract

一种扬声器装置，包括：支撑连接件（100），用于与使用者头部进行接触；至少一个扬声器组件（40），扬声器组件（40）包括耳机芯（42）和用于容纳耳机芯（42）的机芯壳体（41），机芯壳体（41）与支撑连接件（100）固定连接，机芯壳体（41）上存在至少一个按键模块（4d），机芯壳体（41）内部还包括至少两个麦克风（432），至少两个麦克风（432）位于相距使用者嘴部不同距离的位置；支撑连接件（100）中容纳控制电路（60）或电池，控制电路（60）或电池驱动耳机芯（42）振动以产生声音。扬声器装置可以优化声音传递效率、提高音量，提升了用户的体验度。

Description

一种扬声器装置
优先权信息
本申请要求于2019年01月05日提交的中国申请号为201910009909.6的优先权，其全部内容通过引用的方式并入本文。
技术领域
本申请涉及扬声器装置领域，特别涉及一种扬声器装置中的按键模块。
背景技术
目前，市面上的扬声器装置的扬声器组件上设置有按键模块和辅助按键模块，以方便用户执行相应的功能。用户可以通过按键模块和辅助按键模块实现相应的功能，例如，暂停/播放音乐、接听电话。然而，按键模块和辅助按键模块的设置并未考虑其对扬声器组件工作状态的影响，例如，按键模块会在一定程度上降低扬声器组件所产生的音量。
发明内容
本说明书实施例提供一种扬声器装置，所述扬声器装置包括：支撑连接件，用于与使用者头部进行接触；至少一个扬声器组件，所述扬声器组件包括耳机芯和用于容纳所述耳机芯的机芯壳体，所述机芯壳体与所述支撑连接件固定连接，所述机芯壳体上存在至少一个按键模块，所述机芯客体内部还包括至少两个麦克风，所述至少两个麦克风位于相距使用者嘴部不同距离的位置；所述支撑连接件中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是本申请扬声器装置一实施例的爆炸结构示意图；
图2是本申请扬声器装置一实施例中耳挂的部分结构示意图；
图3是图2中A部分的局部放大图；
图4是本申请扬声器装置一实施例的局部截面图；
图5是图4中B部分的局部放大图；
图6是本申请扬声器装置一实施例的局部结构截面图；
图7是图6中C部分的局部放大图；
图8是本申请扬声器装置一实施例中机芯壳体的部分结构示意图；
图9是图8中D部分的局部放大图；
图10是本申请扬声器装置一实施例中机芯壳体的局部截面图；
图11是本申请一些实施例提供的扬声器装置的局部结构图；
图12是本申请一些实施例提供的扬声器装置的局部结构爆炸图；
图13是本申请一些实施例提供的扬声器装置的局部结构截面图；
图14是图13中C部分的局部放大图；
图15是本申请一些实施例提供的扬声器装置的局部结构图；
图16是本申请一些实施例提供的扬声器装置的局部结构爆炸图；
图17是本申请一些实施例提供的扬声器装置的局部结构截面图；
图18是图17中D部分的局部放大图；
图19是本申请一些实施例提供的扬声器装置的局部结构截面图；
图20是图219中E部分的局部放大图；
图21是本申请一些实施例提供的扬声器装置的结构示意图；
图22是本申请一些实施例提供的扬声器组件的结构示意图；
图23是本申请一些实施例提供的扬声器组件的另一角度的结构示意图；
图24是本申请扬声器装置的一些实施例中表示距离h1的示意图；
图25是本申请扬声器装置的一些实施例中表示距离h2的示意图；
图26是本申请扬声器装置的一些实施例中表示距离h3的示意图；
图27是本申请扬声器装置的一些实施例中表示距离D1、D2的示意图；
图28是本申请扬声器装置的一些实施例中表示距离l3、l4的示意图；
图29是本申请扬声器装置一实施例提供的爆炸结构图；
图30是本申请扬声器装置一实施例提供的局部截面图；
图31是图30中A处的结构放大图；
图32是本申请扬声器装置在组合状态下沿图29中的A-A轴线的截面图；
图33是图32中B处的结构放大图；
图34是本申请扬声器装置一实施例提供的局部截面图；
图35是本申请扬声器装置在组合状态下沿图29中的B-B轴线的截面图；
图36是本申请第一电路板和第二电路板与图35不同夹角的实施例的结构示意图；
图37是本申请扬声器装置在组合状态下沿图29中的C-C轴线的截面图；
图38是显示一种通过气传导的方式传递声音的示意图。
具体实施例
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。以下，不失一般性，在描述本发明中关于传导相关技术时，将采用“扬声器装置”或“扬声器”的描述。该描述仅仅为传导应用的一种形式，对于该领域的普通技术人员来说，“扬声器装置”或“扬声器”也可用其他同类词语代替，比如“发声装置”、“助听器”或“扬声装置”等。事实上，本发明中的各种实现方式可以很方便地应用到其它非扬声器类的听力设备上。例如，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在扬声器装置中加入环境声音拾取和处理功能，使该扬声器装置实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至扬声器部分。即扬声器装置可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过扬声器模块将声音传递给使用者/佩戴者，从而同时实现扬声器和传统扬声器装置的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
图1是本申请扬声器装置一实施例的爆炸结构示意图。如图1所示，扬声器装置可包括：耳挂10、电路壳体20、机芯壳体41、后挂30，以及耳机芯42、控制电路60、电池70。其中，机芯壳体41与电路壳体20分别设置于耳挂10的两端，后挂30则进一步设置于电路壳体20远离耳挂10的一端。其中，机芯壳体41的数量为两个，分别用于容纳耳机芯42，电路壳体20的数量也为两个，分别用来容纳控制电路60和电池70，后挂30的两端分别连接对应的电路壳体20。耳挂10包括弹性金属丝11、导线12、固定套管13以及设置于弹性金属丝11两端的接插端14和接插端15，还进一步包括保护套管16以及与保护套管16一体成型的壳体护套17。
图2是本申请扬声器装置一实施例中耳挂的部分结构示意图；图3是图2中A部分的局部放大图；图4是本申请扬声器装置一实施例的局部截面图；图5是图4中B部分的局部放大图；图6是本申请扬声器装置一实施例的局部结构截面图；图7是图6中C部分的局部放大图。在一些实施例中，机芯壳体41的外端面21是指机芯壳体41朝向耳挂10的端面。而接插孔22用于为耳挂10的接插端14插入机芯壳体41提供容置空间，以便进一步实现接插端14与机芯壳体41的接插固定。
进一步地，止挡块23可以由接插孔22的内侧壁沿垂直于该内侧壁的方向凸出形成。具体地，止挡块23可以为多个间隔设置的块状凸起，或者也可以为沿接插孔22内侧壁的环状凸起，此处不做具体限定
其中，接插端14包括插入部142和两个弹性卡勾143。具体地，插入部142至少部分插入于接插孔22内并抵接于止挡块23的外侧面231上。其中，插入部142的外侧壁的形状与接插孔22的内侧壁的形状匹配，以使得插入部142至少部分插入于接插孔22内时，使得插入部142的外侧壁与接插孔22的内侧壁抵接。
需要说明的是，止挡块23的外侧面231是指止挡块23朝向耳挂10设置的一侧面。插入部142可进一步包括一朝向机芯壳体41的端面1421，该端面1421可与止挡块23的外侧面231匹配，从而在插入部142至少部分插入于接插孔22内时，插入部142的端面1421与止挡块23的外侧面231抵接。
具体地，机芯壳体41的接插孔22的沿垂直于接插端14相对于机芯壳体41的插入方向上的截面形状可为椭圆环形或近椭圆环形，对应地，插入部142的横截面可以为与接插孔22匹配的近椭圆形，当然，二者的形状还可以为其它，具体可根据实际需求进行设置。
进一步地，两个弹性卡勾143可沿垂直于插入方向并排并间隔且对称设置于插入部142朝向机芯壳体41内部的一侧。其中，每个弹性卡勾143可分别包括梁部1431和勾部1432，梁部1431与插入部142朝向机芯壳体41的一侧连接，勾部1432设置在梁部1431远离插入部142的一端，并沿垂直于插入方向延伸。进一步地，每个勾部1432设置有连接平行于插入方向的侧面与远离插入部142的端面的过渡斜面14321。
具体的，在耳挂10与机芯壳体41的安装过程当中，接插端14由接插孔22逐渐进入机芯壳体41内部，在到达止挡块23的位置时，两个弹性卡勾143的勾部1432会受到止挡块23的阻挡，在外部推力的作用下，止挡块23逐渐挤压勾部1432的过渡斜面14321而使得两个弹性卡勾143发生弹性形变而彼此并拢，在过渡斜面14321通过止挡块23而到达止挡块23靠近机芯壳体41内部的一侧时，弹性卡勾143因失去止挡块23的阻挡而弹性回复，并卡置于止挡块23朝向机芯壳体41内部的内侧面上，从而将止挡块23卡置于接插端14的插入部142和勾部1432之间，进而实现机芯壳体41与接插端14的接插固定。
在一些实施例中，在机芯壳体41与接插端14接插固定后，插入部142部分插入于接插孔22内，且在插入部142的外露部分呈阶梯状设置，进而形成与机芯壳体41的外端面21间隔设置的环形台面1422。
需要指出的是，插入部142的外露部分是指插入部142外露于机芯壳体41的部分，具体地，可以是指外露于机芯壳体41且靠近机芯壳体41外端面的部分。
在一些实施例中，环形台面1422可以与机芯壳体41的外端面21相对设置，且二者之间的间隔可以是指沿接插方向间隔以及沿垂直于接插方向的间隔。
在一些实施例中，保护套管16延伸至环形台面1422朝向机芯壳体41的外端面21的一侧，并在机芯壳体41的接插孔22与接插端14接插固定时，填充于环形台面1422与机芯壳体41的外端面21之间的间隔内，并与机芯壳体41弹性抵接，从而使得外部液体难以从接插端14与机芯壳体41之间的接合处进入机芯壳体41内部，进而实现接插端14与接插孔22之间的密封，以保护机 芯壳体41内部的耳机芯42等，从而能够提高对扬声器装置的防水效果。
在一些实施例中，保护套管16在环形台面1422朝向机芯壳体41的外端面的21一侧形成一环形抵接面161。其中，该环形抵接面161为保护套管16朝向机芯壳体41一侧的端面。
在一些实施例中，保护套管16还包括位于该环形抵接面161内部且相对于环形抵接面161凸出设置的环形凸台162。具体地，该环形凸台162具体形成于环形抵接面161朝向接插端14的一侧，并相对于该环形抵接面161沿朝向机芯壳体41的方向凸出设置，进一步地，该环形凸台162还可直接形成于环形台面1422的外围，并覆盖该环形台面1422。
在一些实施例中，机芯壳体41包括用于连接机芯壳体41的外端面21和接插孔22的内侧壁的连接斜面24。其中，该连接斜面24具体为机芯壳体41的外端面21与接插孔22的内侧壁之间的过渡面，该连接斜面24与机芯壳体41的外端面21和接插孔22的内侧壁均不在同一平面上。其中，该连接斜面24可以为平面，或者也可以根据实际需求而设置成曲面，或者其它形状，此处不做具体限定。
在一些实施例中，在机芯壳体41与接插端14接插固定时，环形抵接面161和环形凸台162分别与机芯壳体41的外端面和连接斜面24弹性抵接。
需要指出的是，由于机芯壳体41的外端面21和连接斜面24不在同一平面上，从而使得保护套管16与机芯壳体41之间的弹性抵接处不位于同一平面上，从而使得外部液体难以由保护套管16与机芯壳体41之间进入机芯壳体41以进一步进入耳机芯42，从而能够提高扬声器装置的防水效果，以对内部功能结构起到保护作用，进而延长扬声器装置的使用寿命。
在一些实施例中，插入部142在环形台面1422朝向机芯壳体41的外端面21的一侧进一步形成有与环形台面1422邻接的环形凹槽1423，其中，环形凸台162可形成于环形凹槽1423内。
在一些实施例中，环形凹槽1423可形成于环形台面1422朝向机芯壳体41的一侧。在一个应用场景中，环形台面1422为环形凹槽1423的朝向机芯壳体41一侧的侧壁面，此时，环形凸台162沿该侧壁面形成于环形凹槽1423内。
图8是本申请扬声器装置一实施例中机芯壳体的部分结构示意图；图9是图8中D部分的局部放大图；图10是本申请扬声器装置一实施例中机芯壳体的局部截面图。
请结合图8、图9以及图10，机芯壳体41可包括主壳体25以及隔板组件26，其中，隔板组件26位于主壳体25内部，并与主壳体25连接，进而将主壳体25的内部空间27分隔成第一容置空间271和靠近接插孔22一侧的第二容置空间272。
在一些实施例中，主壳体25包括周侧壁411以及与周侧壁411的一端面连接的底端壁416，周侧壁411与底端壁416共同围绕形成一主壳体25的内部空间27。
在一些实施例中，隔板组件26位于主壳体25的靠近接插孔22的一侧，并包括侧隔板261以及底隔板262。其中，侧隔板261可沿垂直于底端壁416的方向设置，且侧隔板261的两端均与周侧壁411连接，从而对主壳体25的内部空间27进行分隔。底隔板262可与底端壁416平行或者接近平行且间隔设置，并进一步分别与周侧壁411和侧隔板261连接，从而将主壳体25所形成的 内部空间27一分为二而形成由侧隔板261、底隔板262和远离接插孔22的周侧壁411、底端壁416共同围成的第一容置空间271，以及由底隔板262与侧隔板261和靠近接插孔22的周侧壁411共同围成的第二容置空间272。其中，第二容置空间272可小于第一容置空间271。
当然，隔板组件26也可以通过其它的设置方式对主壳体25的内部空间27进行划分，此处不做具体限定。
在一些实施例中，隔板组件26进一步包括内隔板263，内隔板263进一步将第二容置空间272分隔成两个子容置空间2721。具体地，该内隔板263垂直于主壳体25的底端壁416设置，分别与侧隔板261和周侧壁411连接，并进一步延伸至走线孔2621处，从而在将第二容置空间272分隔为两个子容置空间2721的同时，还进一步将走线孔2621划分为两个，两个走线孔2621可分别与对应的子容置空间2721连通。
在一些实施例中，第二容置空间272可进一步由密封胶进行填充。通过这种方式，能够将第二容置空间272内所容置的导线12和导线80进一步固定，以进一步降低由于导线振动而对声音质量造成的不良影响，从而提高扬声器装置的声音质量，同时能够对导线12与导线80之间的焊接点起到保护作用，另外，将第二容置空间272密封设置还能够达到防水防尘的目的。
需要注意的是，以上对扬声器装置的耳机芯42的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声装置的耳机芯42的基本原理后，可能在不背离这一原理的情况下，对实施扬声装置的耳机芯42的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，第二容置空间272还可以大于或第一容置空间271，或者第二容置空间272与第一容置空间271相等。诸如此类的变形，均在本申请的保护范围之内。
图11是本申请一些实施例提供的扬声器装置的局部结构图，图12是本申请一些实施例提供的扬声器装置的局部结构爆炸图，图13是本申请一些实施例提供的扬声器装置的局部结构截面图。
结合图11和图12，在一些实施例中，机芯壳体41可以包括辅助功能模块，辅助功能模块可以为区别于耳机芯42之外的用于接收辅助信号而执行辅助功能的模块。例如，辅助功能模块可以是麦克风432、按键开关等，具体可根据实际需求设置。
在一些实施例中，辅助功能模块可以包括麦克风432，该麦克风432的数量为两个，分别为第一麦克风432a和第二麦克风432b。其中，第一麦克风432a和第二麦克风432b都可以是MEMS(微型机电系统)麦克风432，工作电流小，性能较为稳定，且产生的语音质量高。两个麦克风432根据实际需求可设置在软性电路板44的不同位置上。
在一些实施例中，软性电路板44可以包括主体电路板441以及与主体电路板441连接的第一分支电路板442和第二分支电路板443，第一分支电路板442与主体电路板441同向延伸，第一麦克风432a贴装于第一分支电路板442远离主体电路板441的端部，第二分支电路板443与主体电路板441垂直延伸，第二麦克风432b贴装于第二分支电路板443远离主体电路板441的端部， 多个第一焊盘45则设置于主体电路板441远离第一分支电路板442和第二分支电路板443的端部。
在一些实施例中，机芯壳体41包括环绕设置的周侧壁411以及与周侧壁411的一端面连接的底端壁416，进而形成具有一开口端的容置空间。其中，耳机芯42经开口端放置于容置空间内，第一麦克风432a固定于底端壁416上，第二麦克风432b固定于周侧壁411上。
在一些实施例中，可以适当对第一分支电路板442和/或第二分支电路板443进行弯折，以适应麦克风432对应的入声孔在机芯壳体41上的位置的设置。具体地，软性电路板44可以主体电路板441平行于底端壁416的方式设置于机芯壳体41内，从而能够使得第一麦克风432a对应于底端壁416，而无需对主体电路板441进行弯折。而第二麦克风432b由于固定于机芯壳体41的周侧壁411上，因此需要对第二主体电路板441进行弯折设置，具体可将第二分支电路板443在远离主体电路板441的端部弯折设置，以使得第二分支电路板443的板面垂直于主体电路板441和第一分支电路板442的板面，并进而使得第二麦克风432b朝向背离主体电路板441和第一分支电路板442的方向而固定于机芯壳体41的周侧壁411上。
在一些实施例中，第一焊盘45、第一麦克风432a和第二麦克风432b均可设置于软性电路板44的同一侧。
在一些实施例中，软性电路板44的另一侧设置有用于支撑第一焊盘45的刚性支撑板4a、麦克风刚性支撑板4b，该麦克风刚性支撑板4b包括用于支撑第一麦克风432a的刚性支撑板4b1以及用于支撑第二麦克风432b的刚性支撑板4b2。
在一些实施例中，刚性支撑板4a、刚性支撑板4b1和刚性支撑板4b2主要用于对相应的焊盘和麦克风432起支撑作用，从而需具有一定的强度。三者的材质可以相同或者不同，具体可以为聚酰亚胺(PolyimideFilm，PI)，或者其它能够起到强度支撑作用的材质，如聚碳酸酯、聚氯乙烯等。另外，三个刚性支撑板的厚度可以根据刚性支撑板本身所具有的强度以及第一焊盘45以及第一麦克风432a、第二麦克风432b所实际需求的强度进行设定，此处不做具体限定。
第一麦克风432a和第二麦克风432b分别对应于两个麦克风组件4c。在一些实施例中，两个麦克风组件4c的结构相同，机芯壳体41上设置有入声孔413，进一步地，该扬声器装置在机芯壳体41处还设置有一体成型于机芯壳体41的内表面的环形挡壁414，并设置于入声孔413的外围，进而定义一与入声孔413连通的容置空间415。
结合图11、图12和图13，在一些实施例中，麦克风组件4c还包括：防水膜组件4c1。
其中，防水膜组件4c1设置于容置空间415内，并覆盖入声孔413。麦克风刚性支撑板4b设置于容置空间415内，并位于防水膜组件4c1的远离入声孔413的一侧，以将防水膜组件4c1压持于机芯壳体41的内表面上。在一些实施例中，麦克风刚性支撑板4b上设置有与入声孔413对应的入声孔4b3。在一些实施例中，麦克风432设置于麦克风刚性支撑板4b远离防水膜组件4c1的一侧并覆盖入声孔4b3。
其中，防水膜组件4c1具有防水透声的作用，并紧密贴合于机芯壳体41的内表面，以防止机芯壳体41外部的液体由入声孔413进入机芯壳体41内部而影响麦克风432的性能。
入声孔4b3和入声孔413的轴向可以重合，也可以根据麦克风432等的实际需求而以一定的角度相交均可。
需要说明的是，上述实施例中的入声孔都可以用于指代机芯壳体41接收声音结构。
麦克风刚性支撑板4b设置于防水膜组件4c1与麦克风432之间，一方面对防水膜组件4c1进行压持，而使防水膜组件4c1紧密贴合于机芯壳体41的内表面；另一方面，麦克风刚性支撑板4b具有一定的强度，从而起到支撑麦克风432的作用。
在一些实施例中，麦克风刚性支撑板4b的材质可以为聚酰亚胺(PolyimiceFilm，PI)，或者其它能够起到强度支撑作用的材质，如聚碳酸酯、聚氯乙烯等。另外，麦克风刚性支撑板4b的厚度可以根据麦克风刚性支撑板4b的强度以及麦克风432所实际需求的强度进行设定，此处不做具体限定。
图14是图13中C部分的局部放大图。如图14所示，在一些实施例中，防水膜组件4c1可以包括防水膜本体4c11以及环形胶垫4c12。该环形胶垫4c12设置于防水膜本体4c11朝向麦克风刚性支撑板4b一侧，并进而设置于入声孔413和入声孔4b3的外围。
其中，麦克风刚性支撑板4b压持于环形胶垫4c12，从而使得防水膜组件4c1与麦克风刚性支撑板4b之间粘接固定于一起。
在一些实施例中，环形胶垫4c12设置成在防水膜本体4c11和刚性支撑板之间形成一仅通过入声孔4b3连通至麦克风432的密封腔，即将防水膜组件4c1与麦克风刚性支撑板4b之间的连接不留空隙，从而使得防水膜本体4c11和麦克风刚性支撑板4b之间的环形胶垫4c12外围的空间与入声孔4b3隔绝。
在一些实施例中，防水膜本体4c11具体可以为防水透声膜，相当于人耳的鼓膜。在有外界声音由入声孔413进入时，该防水膜本体4c11发生振动，从而导致密封腔中的气压发生变化，从而导致麦克风432中发出声音。
进一步地，由于防水膜本体4c11在振动时导致密封腔中气压发生变化，而该气压需要控制在适当的范围内，若过大或过小均为影响声音质量。本实施例中，防水膜本体4c11和刚性支撑板之间的间距可以为0.1-0.2mm，具体可以为0.1mm、0.15mm、0.2mm等，从而使得防水膜本体4c11振动所导致的密封腔当中的气压变化在适当的范围之内，从而提高声音质量。
在一些实施例中，防水膜组件4c1进一步包括设置于防水膜本体4c11朝向机芯壳体41的内表面一侧且与环形胶垫4c12重叠设置的环形胶垫4c13。
通过这种方式，能够将防水膜组件4c1与入声孔413外围的机芯壳体41的内表面紧密贴合，从而减少由入声孔413进入的声音的散失，而提高声音转化为防水膜本体4c11的振动的转化率。
在一些实施例中，还可以进一步在环形挡壁414以及麦克风432的外围涂覆密封胶，以进一步提高密封性，从而提高声音的转化率，进而提高声音质量。
在一些实施例中，软性电路板44可设置于刚性支撑板和麦克风432之间，并在对应于麦 克风刚性支撑板4b的入声孔4b3的位置设置有入声孔444，从而使得外界声音所引起的防水膜本体4c11的振动穿过该入声孔444从而进一步影响麦克风432。
在一些实施例中，软性电路板44进一步向远离麦克风432的方向延伸，以与其它功能元件或导线连接而实现相应的功能。对应地，麦克风刚性支撑板4b上也随着软性电路板向远离麦克风432的方向延伸出一段距离。
对应地，环形挡壁414上设置有与软性电路板的形状匹配的缺口，以允许该软性电路板从容置空间415延伸而出。另外，可在该缺口处进一步填充密封胶，以进一步提高密封性。
需要注意的是，以上对扬声器装置的麦克风的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的麦克风的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的麦克风的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，环形胶垫4c12和环形胶垫4c13可分别为双面胶，或者密封胶等。诸如此类的变形，均在本申请的保护范围之内。
进一步地，在一些实施例中，扬声器装置还可以包括按键模块4d，贴装于软性电路板44上的辅助功能模块包括按键开关，该按键开关与上述麦克风432分别设置于机芯壳体41的不同的位置。
图15是本申请一些实施例提供的扬声器装置的局部结构图；图16是本申请一些实施例提供的扬声器装置的局部结构爆炸图；图17是本申请一些实施例提供的扬声器装置的局部结构截面图；图18是图17中D部分的局部放大图；图19是本申请一些实施例提供的扬声器装置的局部结构截面图；图20是图19中E部分的局部放大图。
结合图15、图16以及图20，在一些实施例中，机芯壳体41内部设有软性电路板44，机芯壳体41的外侧设有与软性电路板相适配的按键模块4d。在一些实施例中，对应地，软性电路板44可包括主体电路板445以及分支电路板446，其中，该分支电路板446可沿垂直于主体电路板445的延伸方向而延伸。其中多个第一焊盘45设置于主体电路板445远离分支电路板446的端部，按键开关贴装于主体电路板445上，第二焊盘46设置于分支电路板446远离主体电路板445的端部。
需要说明的是，上述实施例中的电路板都可以用于指代安装电子元件的结构。
在一些实施例中，机芯壳体41包括环绕设置的周侧壁411以及与周侧壁411的一端面连接的底端壁416，进而形成具有一开口端的容置空间。软性电路板44的板面与底端壁416平行间隔设置，以使得按键开关可朝向机芯壳体41的底端壁416设置。
在一些实施例中，按键开关设置于软性电路板44的朝向底端壁416的一侧，为了方便装配，第一焊盘45和第二焊盘46可设置于软性电路板44的远离底端壁416的一侧，从而使得第一焊盘45和第二焊盘46与按键开关分别设置于软性电路板44的两侧。
结合图16、图17和图18，在一些实施例中，主体电路板445在远离按键开关的一侧设置有用于支撑按键开关并保持第一焊盘45外露的刚性支撑板4d3，在远离第一焊盘45的一侧设置有用于支撑第一焊盘45并保持按键开关外露的刚性支撑板4e，分支电路板446在远离第二焊盘46的 一侧设置有用于支撑第二焊盘46的刚性支撑板4f。
在一些实施例中，按键开关与第一焊盘45可分别设置于主体电路板445的两侧，并于该主体电路板445的两侧间隔设置。相应地，对应于按键开关的刚性支撑板4d3和对应于第一焊盘45的刚性支撑板4e也分别设置于主体电路板445的两侧，并进一步分别绕开按键开关和第一焊盘45，从而使得二者具有相邻设置的相邻边缘。在一些实施例中，刚性支撑板4d3的远离软性电路板44的一侧可进一步设置刚性支撑板4d4，该刚性支撑板4d4的刚性大于刚性支撑板4d3，刚性支撑板4d3对应于按键开关。
在一些实施例中，机芯壳体41的内表面，具体为底端壁416的内表面上设置有凹陷区4121，并进一步设置有位于该凹陷区4121并用于连通机芯壳体41的内表面和外表面的按键孔4122。其中，该凹陷区4121是由机芯壳体41的内表面朝向机芯壳体41的外部凹陷形成。按键孔4122可进一步设置于该凹陷区4121的中间部位，或者根据实际需求设置于其它部位。
结合图16、图19和图20所示，在一些实施例中，按键模块4d还可以包括弹性承座4d1及按键4d2。在一些实施例中，弹性承座4d1包括一体成型的承座本体4d11以及支撑柱4d12。其中，承座本体4d11设置于凹陷区4121内，并固定于凹陷区4121的底部。具体地，该凹陷区4121的底部是指凹陷区4121的远离机芯壳体41的内部的内壁面。支撑柱4d12设置于承座本体4d11朝向机芯壳体41外部的一侧，并从按键孔4122外露。
上述方式中，弹性承座4d1设置于凹陷区4121内，并固定于凹陷区4121的底部，并通过承座本体4d11而从机芯壳体41内部一侧覆盖按键孔4122，以将机芯壳体41内部与外部隔开，从而使得机芯壳体41外部的液体难以通过按键孔4122而进入到机芯壳体41的内部，从而对机芯壳体41内部器件起到防水、保护的作用。
在一些实施例中，弹性承座4d1可通过承座本体4d11以粘贴的方式固定于凹陷区4121的底部，具体可在承座本体4d11的朝向机芯壳体41外部一侧的表面与凹陷区4121的底部之间施加粘胶、双面胶等而将二者粘贴在一体。
在一些实施例中，承座本体4d11可通过注塑方式固定于凹陷区4121的底部。承座本体4d11的朝向机芯壳体41外部一侧的表面与机芯壳体41的凹陷区4121底部之间通过注塑而一体成型，具体可以通过包胶的方式形成。在本实施例中，通过弹性承座4d1与机芯壳体41的凹陷区4121的底部通过注塑的方式一体成型，从而使得二者之间的结合更加牢固，增大二者之间的结合强度并能够提高机芯壳体41的密封性，从而一方面能够使得整个按键模块4d更加稳定、牢靠，另一方面能够进一步提高机芯壳体41的防水效果。
在一些实施例中，承座本体4d11包括环形固定部4d111及弹性支撑部4d112。其中，该环形固定部4d111绕按键孔4122设置并与凹陷区4121的底部贴合固定，从而将弹性承座4d1与机芯壳体41固定在一起。
弹性支撑部4d112与环形固定部4d111的内环面连接且朝向机芯壳体41的外部呈穹顶形隆起，从而使得其顶部到底部之间在按键4d2的按压方向上具有一定的高度，且其顶部沿垂直于按 压方向上的尺寸小于底部。其中，支撑柱4d12设置于弹性支撑部4d112的顶部。在按键4d2受到按压时，该弹性支撑部4d112的顶部受到按压而朝向靠近其底部的方向运动，进而带动按键4d2朝向按键孔4122的方向运动直至触发按键开关。
需要指出的是，由于扬声器装置的整体结构较小，各部件之间连接较为紧密，从而使得按键4d2到按键开关之间的按压行程较小，从而减弱对按键4d2的按压触感。本实施例中，由于弹性支撑部4d112朝向机芯壳体41的外部呈穹顶形隆起，从而能够增大按键4d2与机芯壳体41内部的按键开关之间的距离，进而能够适当增大按键4d2触发按键开关的按压行程，从而能够提高用户按压按键4d2的手感。
具体地，弹性支撑部4d112的底部固定于按键孔4122的侧壁面上，从而使得弹性支撑部4d112的顶部从按键孔4122外露，进而使得设置在弹性支撑部4d112的朝向机芯壳体41外部一端的支撑柱4d12完全外露于机芯壳体41的外部，并进而在机芯壳体41的外部与按键4d2固定在一起。
在一些实施例中，机芯壳体41的外表面上设置有凹陷区4123，其中按键孔4122进一步位于凹陷区4123内。即凹陷区4121和凹陷区4123分别位于按键孔4122的两端，并由按键孔4122贯通。其中，凹陷区4121和凹陷区4123的形状、尺寸等可以根据实际需求而设置为相同或者不同。另外，凹陷区4121和凹陷区4123的数量可以相同，二者的数量可以根据按键4d2的数量而定，可以为一个或者多个，每个凹陷区4121和凹陷区4123内可以对应设置一个或者多个按键孔4122，此处不做具体限定。本实施例中，该机芯壳体41对应的按键4d2数量为一个，且对应一个凹陷区4121和一个凹陷区4123。
在一些实施例中，支撑柱4d12由弹性支撑部4d112支撑至按键孔4122的朝向机芯壳体41外部一侧而位于凹陷区4123内，进一步地，按键4d2设置于支撑柱4d12的弹性支撑部4d112一侧，本实施例中，通过设置弹性支撑部4d112以及支撑柱4d12的沿按键4d2的按压方向的高度，而使得按键4d2至少部分沉设于凹陷区4123内，以提高空间利用率，减少按键模块4d所占用的空间。
在一些实施例中，按键4d2包括按键本体4d21以及设置于按键本体4d21一侧的环形凸缘4d22和环形凸缘4d23。其中，环形凸缘4d22和环形凸缘4d23具体可设置于按键本体4d21的按压面的对侧。
在一些实施例中，环形凸缘4d22位于按键本体4d21的中间区域，环形凸缘4d23位于按键本体4d21的外边缘，且环形凸缘4d22和环形凸缘4d23均朝向背离按键本体4d21的按压面的方向凸出形成，从而形成环形凸缘4d22围绕形成的柱状的容置空间4d24，以及由环形凸缘4d22和环形凸缘4d23共同围绕形成的环柱状的容置空间4d25。其中，环形凸缘4d22和环形凸缘4d23相对于按键本体4d21所凸出的高度可以相等或者不等。本实施例中，环形凸缘4d22相对于按键本体4d21所凸出的高度大于环形凸缘4d23相对于按键本体4d21所凸出的高度。
在一些实施例中，支撑柱4d12插置于环形凸缘4d22内部，即容置于容置空间4d24当中，具体地，支撑柱4d12可以通过粘接、注塑或者弹性抵接等方式与环形凸缘4d22固定在一起。
在一些实施例中，环形凸缘4d23远离按键本体4d21的端面沉设于凹陷区4123内，并在弹性承座4d1处于自然状态时与凹陷区4123的底部间隔一定距离。
在一些实施例中，凹陷区4123的底部是指凹陷区4123的朝向机芯壳体41内部的内壁面。具体地，在弹性承座4d1处于自然状态时，通过按压按键4d2的按压面，而使得弹性承座4d1的弹性支撑部4d112的顶部沿朝向机芯壳体41内的方向运动，并在环形凸缘4d23远离按键本体4d21的端面接触到凹陷区4123的底部之前，触发按键开关。
在一些实施例中，弹性承座4d1进一步包括用于接触按键开关的接触头4d13，该接触头4d13可设置于承座本体4d11靠近机芯壳体41内部一侧，具体可设置于弹性支撑部4d112的顶部的朝向机芯壳体41内部的内壁面的中间区域，并相对于该内壁面朝向机芯壳体41内部凸出设置。
在按压按键4d2时，弹性承座4d1的弹性支撑部4d112的顶部沿朝向机芯壳体41内的方向运动，从而带动接触头4d13朝向机芯壳体41内部的按键开关运动，从而通过该接触头4d13触发按键开关，从而实现相应的功能。通过这种方式，能够根据实际需求而减小按键4d2的按压行程。
需要注意的是，以上对扬声器装置的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声装置的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，入声孔413的数量可以设置为一个或者多个。诸如此类的变形，均在本申请的保护范围之内。
请参阅图21-图22，图21是本申请一些实施例提供的扬声器装置的结构示意图；图22是本申请一些实施例提供的扬声器装置的扬声器组件的结构示意图。扬声器装置可以通过骨传导、气传导的方式将声音传递给人体的听觉系统，从而使用户产生听觉。在一些实施例中，扬声器装置还可以包括支撑连接件100和设置于支撑连接件100上的至少一个扬声器组件40。需要说明的是，支撑连接件100可以包括前述实施例中的电路壳体、耳挂和后挂部分，机芯壳体与支撑连接件连接。
耳挂10佩戴时，两个耳挂10可以分别对应用户的左右耳，后挂30可以对应用户的头部后侧，共同将扬声器装置固定于用户头部。耳挂10可以用于与使用者头部进行接触，耳挂10与使用者头部的一个或多个接触点(即耳挂顶端25附近的一个或多个点)可以为扬声器组件40振动时的振动支点。
在一些实施例中，扬声器组件40的振动可看成是以耳挂顶端25为固定点，耳挂顶端25与扬声器组件40之间的耳挂10部分作为臂杆的往复摆动运动，该固定点可以被作为振动支点。其中，扬声器组件40摆动的幅度(即振动加速度)与其产生的音量呈正相关。而扬声器组件40的质量分布对其往复摆动的幅度有明显影响，进而影响扬声器组件40所产生的音量。
在一些实施例中，扬声器组件40可以包括扬声器模块(图中未示出)和按键模块4d。特别的，扬声器模块可以有两个，分别位于左、右侧的两个扬声器组件40内。在一些实施例中，扬声器模块可以是扬声器组件40的除按键模块4d以外的部分，包括，例如耳机芯42和机芯外壳41。
在一些实施例中，按键模块4d可以用于进行人机交互。例如：实现暂停/开始、录音、接 听电话等操作。
具体的，按键模块4d可以基于用户的操作指令实现不同的交互功能，例如：点击一次按键模块4d，可以实现暂停/开始(例如音乐、录音等)；快速点击两次按键模块4d，可以实现接听电话；有规律地点击(例如，隔一秒点击一次，总共点击两次)实现录音功能。在一些实施例中，用户的操作指令可以是点击、滑动、滚动等操或其组合的操作。例如在按键模块4d的表面上下滑动，实现切换歌曲的功能。
在一个应用场景中，按键模块4d可以有至少两个，并且分别对应于左、右侧两个耳挂。用户可以使用左、右手分别操作按键模块4d，提高用户使用体验。
在一些实施例中，为了进一步提高用户的人机交互体验，可以将人机交互的功能分配到左、右两侧的按键模块4d，用户可以根据功能的不同操作对应的按键模块4d。例如，对应左侧的按键模块4d：点击一次，可以开启录音功能，再点击一次，录音功能关闭；快速点击两次，可以实现暂停/播放功能。又例如，在右侧的按键模块4d上快速点击两次，可以实现接听电话功能(若此时在播放音乐且无电话通入，则可以实现切换下一首/上一首歌曲功能)。
在一些实施例中，上述对于左、右侧按键模块4d对应的功能可以是用户自定义的。例如，用户可以通过应用软件设置，将由左侧按键模块4d执行的暂停/播放功能分配到由右侧的按键模块4d执行。又例如将由右侧按键模块4d执行的接听电话功能分配到由左侧的按键模块4d执行。进一步的，对于实现对应功能的操作指令(例如点击次数、滑动手势)，用户同样可以通过应用软件进行设置。例如，将接听电话功能对应的操作指令由点击一次设置为点击两次，将切换下一首/上一首歌曲功能对应的操作指令由点击两次设置为点击三次。用户自定义可以更符合用户操作习惯，一定程度上避免操作失误，提高用户体验。
在一些实施例中，上述人机交互功能可以不是唯一的，而是根据用户常用的功能进行设定。例如，按键模块4d还可以实现拒接电话、语音阅读短信等功能，用户可以对于功能以及功能对应的操作指令进行自定义设置，满足不同需求。
在一些实施例中，按键模块4d的中心与振动支点之间的距离可以不大于扬声器模块的中心与振动支点之间的距离。从而增大扬声器组件40的振动加速度，进而提高扬声器组件40振动发出的音量。
在一些实施例中，按键模块4d的中心可以是质心m1或者形心g1，按键模块4d的质心m1或形心g1与耳挂顶端25(也即振动支点)之间具有第一距离l1，扬声器模块(扬声器组件40除按键模块4d的其余部分)的质心m2或形心g2与耳挂顶端25之间具有第二距离l2。需注意的是，上述扬声器模块的质心或形心，也可以替换为机芯壳体的质心或形心。
在一些实施例中，按键模块4d与扬声器模块的质量分布较为均匀，因此，可认为按键模块4d的质心m1与形心重合，扬声器模块的质心m2与形心g2也重合。
在一些实施例中，按键模块4d在扬声器组件40内的质量分布可以体现为第一距离l1与第二距离l2之间的比例，以及按键模块4d的质量与扬声器模块的质量比k。
具体地，由动力学原理可以得出按键模块4d设置于距离耳挂顶端25的远端4h时，扬声器组件40的振动加速度会小于按键模块4d设置于距离耳挂顶端25的近端4g时的振动加速度，从而造成音量下降。在按键模块4d的质量一定的情况下，随着第一距离l1与第二距离l2之间的比例的增加，扬声器组件40的振动加速度减小，进而导致音量减小；而在第一距离l1与第二距离l2之间的比例一定的情况下，随着按键模块4d质量的增加，扬声器组件40的振动加速度减小，进而导致音量降低。因此，可通过调节第一距离l1与第二距离l2之间的比例以及按键模块4d的质量与扬声器模块的质量比k，而将按键模块4d的设置而导致扬声器组件40的音量降低控制在人耳所能够识别的范围之内。
在一些实施例中，第一距离l1与第二距离l2之间的比例可以不大于1。
具体地，在第一距离l1与第二距离l2之间的比例等于1时，按键模块4d的质心m1或形心g1与扬声器模块的质心m2或形心g2重合，从而使得该按键模块4d相对于扬声器组件40居中设置；在第一距离l1与第二距离l2之间的比例小于1时，按键模块4d的质心m1或形心g1相对于扬声器模块的质心m2或形心g2更靠近耳挂顶端25的位置，从而设置于扬声器组件40靠近耳挂顶端25的近端。而且第一距离l1与第二距离l2之间的比例越小，则按键模块4d的质心m1或形心g1相对于扬声器模块的质心m2或形心g2更靠近耳挂顶端25。
在一些实施例中，第一距离l1与第二距离l2之间的比例可以不大于0.95，从而使得按键模块4d更靠近于耳挂顶端25。其中，第一距离l1与第二距离l2之间的比例还可以为0.9、0.8、0.7、0.6、0.5等，具体可根据需求进行设置，此处不做限定。
进一步地，在第一距离l1与第二距离l2之间的比例满足上述范围的情况下，按键模块4d的质量与扬声器模块的质量比可不大于0.3，具体还可以不大于0.29、0.23、0.17、0.1、0.06、0.04等，此处不做限定。
需要额外注意的是，上述一个或多个实施例中，按键模块4d的质心m2可以和形心g2(图中未示出)重合，即位于同一点。扬声器模块的质心m2与形心g2(图中未示出)重合，位于同一点的前提条件是：按键模块4d以及扬声器模块的质量分布较为均匀。
在一些实施例中，按键模块4d的质心m1和形心g1可以不重合。具体的，由于按键模块4d的结构比较简单且规则，因此形心g1更容易计算出，所以选用形心g1作为参考点。扬声器模块的质心m2与形心g2也不重合，但由于扬声器模块所采用的材料不同(如麦克风432、软性电路板44、焊盘等均采用不同的材料制作)，质量分布不均匀，且各零部件形状不规则(如麦克风432、软性电路板44、焊盘等)。因此，将扬声器模块的质心m2作为参考点。
在一个应用场景中，与上述实施例相对应的，按键模块4d的形心g1与耳挂顶端25之间可以具有第一距离l1，扬声器模块的质心m2与耳挂顶端25之间可以具有第二距离l2。按键模块4d在扬声器组件40内的质量分布可体现为第一距离l1与第二距离l2之间的比例，以及按键模块4d的质量与扬声器模块的质量比k。具体地，在按键模块4d质量一定的情况下，随着第一距离l1与第二距离l2之间的比例的增加，扬声器组件40的振动加速度减小，进而导致音量减小；而在第 一距离l1与第二距离l2之间的比例一定的情况下，随着按键模块4d质量的增加，扬声装置30的振动加速度减小，进而导致音量降低。因此，可通过调节第一距离l1与第二距离l2之间的比例以及按键模块4d的质量与扬声器模块的质量比k，而将按键模块4d的设置而导致的音量降低控制在人耳所能够识别的范围之内。
在一个应用场景中，第一距离l1与第二距离l2之间的比例可不大于1。
具体地，在第一距离l1与第二距离l2之间的比例等于1时，按键模块4d的形心g1与扬声器模块的质心m2重合，从而使得该按键模块4d相对于扬声器组件40居中设置；在第一距离l1与第二距离l2之间的比例小于1时，按键模块4d的形心g1相对于扬声器模块的质心m2更靠近耳挂顶端25的位置，从而设置于扬声器组件30靠近耳挂顶端25的近端4g。而且第一距离l1与第二距离l2之间的比例越小，则按键模块4d的形心g1相对于扬声器组件30的质心m2更靠近耳挂顶端25。
进一步地，第一距离l1与第二距离l2之间的比例可不大于0.95，从而使得按键模块4d可以更靠近于耳挂顶端25。其中，第一距离l1与第二距离l2之间的比例还可以为0.9、0.8、0.7、0.6、0.5等，具体可根据需求进行设置，此处不做限定。
再进一步地，在第一距离l1与第二距离l2之间的比例满足上述范围的情况下，按键模块4d的质量与扬声器模块的质量比可不大于0.3，具体还可以不大于0.29、0.23、0.17、0.1、0.06、0.04等，此处不做限定。
需要注意的是，在另一实施例中，仍然可以将扬声器模块的形心g2作为参考点，此处的描述与前述实施例相似，不再赘述。
图23是本申请一些实施例提供的扬声器装置的扬声器组件的另一角度的结构示意图。在一些实施例中，扬声器模块可以包括用于产生声音的耳机芯42以及容纳耳机芯42的机芯壳体41。在一些实施例中，机芯壳体41设置有容纳耳机芯42的空腔。
在一些实施例中，周侧壁411可以包括沿外侧壁412的长度方向设置的第一周侧壁411a和沿外侧壁412的宽度方向设置的第二周侧壁411b；外侧壁412与周侧壁411连接在一起形成一端开口并容纳耳机芯42的空腔。
在一些实施例中，第一周侧壁411a和第二周侧壁411b可以均为两个，第一周侧壁411a和第二周侧壁411b可以依次围合。用户佩戴扬声器装置时，两个第一周侧壁411a分别朝向用户头部的前侧和后侧，两个第二周侧壁411b分别朝向用户头部的上侧和下侧。
在一些实施例中，机芯壳体41还可以包括与底端壁416对应的外侧壁412。其中，外侧壁412可以被配置为盖设于第一周侧壁411a和第二周侧壁411b围合之后的一端，以此来形成一个一端开口、一端封闭的具有空腔的机芯壳体41。耳机芯42可以容纳于机芯壳体41的空腔内。
在一些实施例中，第一周侧壁411a和第二周侧壁411b围合而成的形状可以不受限制。第一周侧壁411a和第二周侧壁411b可以围合成任意适用于用户头部佩戴的形状，例如：长方形，正方形，圆形，椭圆形等。
在一些实施例中，第一周侧壁411a和第二周侧壁411b围合成的形状可以符合人体工程学原理，提高用户的佩戴体验。在一些实施例中，第一周侧壁411a和第二周侧壁411b的高度可以相同，也可以不同。当依次连接的两个周侧壁411的高度不相同时，应保证周侧壁411凸出的部分不会影响用户的佩戴以及操作。
图24是本申请扬声器装置的一些实施例中表示距离h1的示意图；图25是本申请扬声器装置的一些实施例中表示距离h2的示意图；图26是本申请扬声器装置的一些实施例中表示距离h3的示意图。在一些实施例中，外侧壁412盖设于第一周侧壁411a和第二周侧壁411b围合后的一端。且当用户佩戴扬声器装置时，外侧壁412位于第一周侧壁411a和第二周侧壁411b的远离用户头部的一端。在一些实施例中，外侧壁412可以包括近端点和远端点，近端点和远端点可以分别位于外侧壁412与第一周侧壁411a和第二周侧壁411b连接的轮廓上，且近端点和远端点分别位于轮廓的相对位置。在一些实施例中，近端点与振动支点之间的距离h1是最短的，称为顶端位置；远端点与振动支点之间的距离h2是最长的，称为底端位置；另外，近端点和远端点的连线的中点与振动支点之间的距离h3可以介于h1和h2之间，称为中部位置。
在一实施例中，按键模块4d可以位于外侧壁412的中部位置；或者按键模块4d位于外侧壁412的中部位置到顶端位置之间。
在一个实施例中，按键4d2的形状可以为圆角矩形，圆角矩形的按键4d2沿外侧壁412的长度方向延伸。按键4d2包括两条对称轴(长轴和短轴)，在相对于彼此垂直交叉的两个对称方向呈轴对称设置。
图27是本申请扬声器装置的一些实施例中表示距离D1、D2的示意图。如图27所示，按键4d2的顶部与外侧壁412的顶端位置之间的间距为第一间距D1。按键4d2的底部与外侧壁412的底端位置之间的间距为第二间距D2。第一间距D1与第二间距D2的比例可以不大于1。
具体的，在第一间距D1和第二间距D2之间的比例等于1时，按键4d2位于外侧壁412的中部位置，当第一间距D1和第二间距D2之间的比例小于1时，按键4d2位于外侧壁412的中部位置到顶端位置之间。
进一步的，第一间距D1与第二间距D2之间的比例可不大于0.95，从而使得按键4d2更靠近与外侧壁412的顶端位置，也即更靠近振动支点，以进一步提高扬声器组件40的音量。其中，第一间距D1与第二间距D2之间的比例还可以为0.9、0.8、0.7、0.6、0.5等，具体可根据需求进行设置，此处不做限定。
在一些实施例中，耳挂10与扬声器模块的连接部分可以具有中轴线。其中，可以包括一个外侧面。在一些实施例中，按键4d2的外侧面可以是用户佩戴扬声器装置时远离用户头部的侧面。在一些实施例中，中轴线的延长线r在按键的外侧面所在的平面上可具有投影。该投影与按键4d2的长轴方向之间的夹角θ可以小于10°，具体可以为9°、7°、5°、3°、1°等，此处不做具体限定。
其中，该延长线r在按键4d2的外侧面所在的平面上的投影与长轴方向之间的夹角的角度 θ小于10°时，按键4d2的长轴方向不至过于偏离该延长线r的延长方向，从而使得按键4d2在长轴方向上与该中轴线的延长线r的方向保持一致或者接近一致。
在一些实施例中，中轴线的延长线r在按键4d2的外侧面所在的平面上具有投影。按键4d2的外侧面的长轴方向和短轴方向具有交叉点，投影与交叉点之间的具有最短距离d。最短距离d小于按键4d2的外侧面的短轴方向上的尺寸S 2，从而使得按键4d2靠近于该耳挂的中轴线的延长线r。在一些实施例中，耳挂10的中轴线的延长线r在按键4d2的外侧面所在的平面上的投影可与长轴方向重合，以进一步提高扬声器组件40的音质。
在一些实施例中，按键4d2的长轴可以是沿按键4d2的顶部到按键4d2的底部的方向，也可以是耳挂10与机芯壳体41连接的方向上。按键4d2的短轴可以是沿与按键4d2的长轴垂直的，且经过顶部与底部之间的连线的中点的直线方向上。按键4d2沿长轴方向的尺寸为s 1，沿算周方向的尺寸为s 2。
在一些实施例中，第一周侧壁411a沿靠近振动支点的方向具有底端位置、中部位置和顶端位置。
其中，底端位置可以为第一周侧壁411a与远离耳挂10的第二周侧壁411b的连接点。顶端位置可以为第一周侧壁411a与靠近耳挂10的第二周侧壁411b的连接点。中部位置可以为第一周侧壁411a的底端位置与顶端位置连线的中点。
在一些实施例中，按键模块4d可以位于第一周侧壁411a的中部位置(图中未示出)，或者按键模块4d可以位于第一周侧壁411b的中部位置到顶端位置之间(图中未示出)。并且按键模块沿4d第一周侧壁411a的宽度方向居中设置在第一周侧壁411a上。
图28是本申请扬声器装置的一些实施例中表示距离l3、l4的示意图。在一些实施例中，按键模块4d的顶部与第一周侧壁411a的顶端位置之间的间距为第三距离l3。按键模块4d的底部与第一周侧壁411的底端位置之间的间距为第四距离l4。第三距离l3与第四距离l4的比例可以不大于1。
进一步的，第三距离l3与第四距离l4之间的比例可不大于0.95，从而使得按键模块4d更靠近与第一周侧壁411a的顶端位置，也即更靠近振动支点，以进一步提高扬声器组件40的音量。其中，第三距离l3与第四距离l4之间的比例还可以为0.9、0.8、0.7、0.6、0.5等，具体可根据需求进行设置，此处不做限定。
其中，如前述披露内容所述，按键4d2的顶部与第一周侧壁411a的顶端位置之间存在第三间距D3，按键4d2的底部与第一周侧壁411a的底端位置之间存在第四间距D4。第三间距D3与第四间距D4的比例可以不大于1。
进一步的，第三间距D3与第四间距D4之间的比例可不大于0.95，从而使得按键4d2更靠近与第一周侧壁411a的顶端位置，也即更靠近振动支点，以进一步提高扬声器组件40的音量。其中，第三间距D3与第四间距D4之间的比例还可以为0.9、0.8、0.7、0.6、0.5等，具体可根据需求进行设置，此处不做限定。
需要注意的是，以上对扬声器装置的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，按键模块4d可以设置在只设置在左右两侧扬声器组件40中的其中一个内，也可以两个扬声器组件40都设置有按键模块4d。诸如此类的变形，均在本申请的保护范围之内。
图29是本申请扬声器装置一实施例提供的爆炸结构图；图30是本申请扬声器装置一实施例提供的局部截面图；图31是图30中A处的结构放大图。如图29至图31所示，扬声器装置包括组件本体，组件本体内部形成腔体111。需要说明的是，组件本体可以相当于前述实施例中的机芯壳体41。
组件本体可以是由至少两个零部件组合而成的结构；也可以是由一体成型技术制造而成的结构，例如通过一体注塑工艺一体成型的结构。所述组件本体的空间形状包括但不限于长方体、正方体、椭球体、球体、锥体以及其他不规则空间形状等。所述组件本体的材质包括但不限于塑料、硅胶、橡胶、塑胶、玻璃、陶瓷、合金、不锈钢等的一种或多种的组合。
在一些实施例中，组件本体可以包括容置本体51和盖体52；所述容置本体51内部中空形成所述腔体111，所述容置本体51设置有与所述腔体111连通的开口112，所述盖体52盖设于所述开口112上并将所述腔体111封闭。所述腔体111可以是由两个或两个以上零部件组装时共同构成的内部空腔；也可以是组件在一体成型过程中，根据成型模具形状所形成的内部空腔。所述腔体111可以用于容纳扬声器装置的多个电子元件和电路结构。所述组件本体50可以用于密封腔体111，所述腔体111可以是由组件本体50完全密封的，也可以是由组件本体50和组件本体50上的其他配件共同密封的。
需要说明的是，容置本体相当于前述实施例中的周侧壁，盖体相当于前述实施例中的底端壁。
其中，容置本体51可以为扬声器装置的至少一部分。本实施例中的容置本体51具体可以为扬声器装置中用于盛放例如电路板、电池以及电子元件等的结构，例如可以为扬声器装置的外壳等的整体或者一部分。
另外，容置本体51通过设置具有开口112的腔体111用来容置上述电路板、电池以及电子元件等。所述开口112与所述腔体连通，用于上述电路板、电池以及电子元件等的装卸通道。具体地，开口112的数量可以为一个，也可以为多个，此处不做限定。
进一步的，盖体52的形状至少部分与上述开口112匹配，从而将盖体52盖设在开口112上对腔体111进行密封。其中，盖体52的材质可以与容置本体11不同，或者至少部分相同。
本实施例中，盖体52包括硬质支架121以及软质盖层122。其中，硬质支架121用于与容置本体51进行机械连接，软质盖层122一体注塑于硬质支架121的表面上，用于在硬质支架121与容置本体51连接后为腔体111提供密封。
具体地，硬质支架121的材质可以为硬质的塑胶，软质盖层122的材质可以为软质的硅胶、橡胶等。其中，硬质支架121朝向容置本体51一侧的形状可与开口112匹配，以通过插接、扣合等方式固定于腔体111的开口112上，从而与容置本体51机械连接在一起。而硬质支架121与容置本体51连接处容易形成缝隙而降低腔体111的密封性，进一步地，软质盖层122一体注塑而形成在硬质支架121远离容置本体51的外表面上，可进一步覆盖在硬质支架121与容置本体51的连接处，从而实现腔体111的密封。
上述实施例中，盖体52包括硬质支架121以及一体注塑于硬质支架121的表面上的软质盖层122，硬质支架121与容置本体51进行机械连接，软质盖层122进一步在硬质支架121与容置本体51连接后为腔体111提供密封，且软质盖层122更有利于贴合硬质支架121与容置本体51之间的缝隙，以进一步提高扬声器装置的密封性，从而提高扬声器装置的防水效果。同时，硬质支架121与软质盖层122一体注塑而成，能够简化扬声器装置的装配工序。
在一实施例中，硬质支架121包括插入部1211和覆盖部1212，覆盖部1212盖设在开口112上，插入部1211设置在覆盖部1212的一侧，并沿腔体111的内壁延伸入腔体111内，以将覆盖部1212固定在开口112上。
在一个应用场景中，插入部1211还可以不通过腔体111的内壁进行插接，例如，腔体111的内部还可设置有与硬质支架121的插入部1211的形状匹配的插接部，使得插入部1211能够与插接部插接，将插接部固定在腔体111内部。例如，插入部1211的形状为圆柱体，此时插接部可以为能够包绕该圆柱体插接部的圆环，其中，圆环的插接部的内径可适当小于圆柱体的插接部的外径，从而使得在插入部1211插接在插接部中时与插接部过盈配合而使得硬质支架121能够与腔体111稳定连接。当然，也可以采用其它的插接方式，只要能够使得插入部1211插入腔体111内部并与腔体111固定即可。
具体的，覆盖部1212设置在插入部1211背离腔体111的一侧，并在插入部1211插入腔体111后覆盖在开口112上。其中，覆盖部1212可以为完整结构，或者还可以根据需要进一步在其上设置一些孔洞，从而实现一定的功能。
请进一步参阅图32，图32是本申请扬声器装置在组合状态下沿图29中的A-A轴线的截面图。在一实施例中，容置本体51包括用于定义开口112的开口边缘113，覆盖部1212压合在开口边缘113的靠近开口112的内侧区域1131，软质盖层122覆盖在覆盖部1212远离容置本体51的外表面上，并压合在开口边缘113的内侧区域1131外围的外侧区域1132上，进而实现与开口边缘113之间的密封。
其中，开口边缘113的内侧区域1131和外侧区域1132均属于开口边缘113，而并非开口边缘113之外的其它区域。其中，开口边缘113的内侧区域1131为开口边缘113的靠近开口112的区域，而开口边缘113的外侧区域1132为开口边缘113的远离开口112的区域。
本实施例中，硬质支架121的覆盖部1212压合在开口边缘113的靠近开口112的内侧区域1131，能够使得覆盖部1212首先对开口边缘113处进行初步密封。但是，由于容置本体51与硬 质支架121均为硬质材质，二者之间的连接以及覆盖部1212的进一步覆盖也并不能够达到较好的密封效果，在覆盖部1212压合在开口边缘113并远离开口112的端部容易与开口边缘113之间产生缝隙，并进一步通过该缝隙与腔体111贯通，从而降低密封性。
因此，本实施例中，软质盖层122覆盖在覆盖部1212远离容置本体51的外表面上，并进一步压合在开口边缘113的内侧区域1131外围的外侧区域1132上，从而能够将硬质支架121的覆盖部1212与开口边缘113之间产生的缝隙进一步覆盖，且由于软质盖层122为软质材质，从而能够进一步提高扬声器装置的密封效果而使得扬声器装置的防水性更好。
请进一步参阅图33，图33是图32中B处的结构放大图，在一个应用场景中，在盖体52扣合状态下，覆盖部1212的外围覆盖开口边缘113的内侧区域1131，并与开口边缘113的内侧区域1131接触；而软质盖层122设置在覆盖部1212远离容置本体51的一侧，从而使得位于开口边缘113的内侧区域1131的覆盖部1212夹设在开口边缘113的内侧区域1131与软质盖层122之间，且软质盖层122进一步向覆盖部1212远离开口112的方向以及朝向开口边缘113的方向延伸，直至与开口边缘113的外侧区域1132接触，从而使得覆盖部1212与开口边缘113的接触端面和软质盖层122与开口边缘113的接触端面彼此平齐设置，并在开口边缘113的内侧区域1131上从而形成“开口边缘113-覆盖部1212-软质盖层122”的结构。
在另一个应用场景中，请进一步参阅图34，图34是本申请扬声器装置一实施例提供的局部截面图。本应用场景中，软质盖层122在延伸至与开口边缘113的外侧区域1132接触后，进一步沿覆盖部1212与开口边缘113之间的区域延伸至开口边缘113的内侧区域1131，进而假设在开口边缘113的内侧区域1131与覆盖部1212之间，并由覆盖部1212压合在开口边缘113的内侧区域1131上从而形成“开口边缘113-软质盖层122-覆盖部1212-软质盖层122”的结构。本应用场景中，软质盖层122在覆盖硬质支架121的覆盖部1212的基础上进一步延伸至硬质支架121和开口边缘113之间，从而进一步提高腔体111与盖体52之间的密封，以及进一步提高扬声器装置的防水效果。
在一实施例中，请继续参阅图29至图34，扬声器装置还包括设置于腔体111内的电路组件53，电路组件53上设置有开关1311。
具体地，电路组件53可包括第一电路板131，开关1311设置于第一电路板131朝向腔体111的开口112的外部一侧。其中，开关1311的数量可以为一个，也可以为多个。在开关1311的数量为多个时，可间隔设置在第一电路板131上。
需要说明的是，第一电路板131相当于前述实施例中的第一分支电路板。
相应地，硬质支架121上设置有与开关1311对应的开关孔1213，软质盖层122进一步覆盖开关孔1213，且在对应开关孔1213的位置设置有抵压部1221，抵压部1221经开关孔1213朝向腔体111的内部延伸，在软质盖层122的对应位置被按压时，抵压部1221抵压电路组件53上的开关1311，从而触发电路组件53执行预设的功能。
其中，软质盖层122上设置的抵压部1221由软质盖层122朝向支架121的一侧朝向开关 孔1213以及开关1311的方向凸出形成，抵压部1221的形状与开关孔1213匹配，使得在软质盖层122对应的位置被按压时，抵压部1221能够穿过开关孔1213到达第一电路板131上的对应的开关1311。同时抵压部1221沿朝向开关1311方向的长度设置成能够使得在软质盖层122对应的位置无按压时不抵压开关1311，而在被按压时能够抵压对应的开关1311即可。
在一个应用场景中，软质盖层122上对应于抵压部1221的位置朝向背离硬质支架121的一侧进一步凸出形成以凸起的按压部1222，从而使得用户能够明确开关1311的位置，并通过按压对应的按压部1222从而出发电路组件53执行相应的功能。
在一些实施例中，所述第一麦克风元件1312和所述第二麦克风元件1321按照特定的方式分布在机芯壳体41中中，使得主声源(例如，人的嘴巴)位于所述第二麦克风元件1321指向所述第一麦克风元件1312的方向上。
需要说明的是，第一麦克风元件1312相当于前述实施例中的第一麦克风432a，第二麦克风元件1321相当于前述实施例中的第二麦克风432b。
当用户佩戴所述扬声器装置时，由于嘴巴(主声源)相对于第一麦克风元件1312和第二麦克风元件1321的距离比环境中其他声源(例如，噪声源)相对于第一麦克风元件1312和第二麦克风元件1321的距离近，可以认为嘴巴是第一麦克风元件1312和第二麦克风元件1321的近场声源。对于近场声源，两组麦克风组件所接收到的声音大小与距声源的距离相关。由于第一麦克风元件1312距离主声源较近，因此第一麦克风元件1312将接收到较大的音频信号V J1；第二麦克风元件1321距离主声源较远，因此第二麦克风元件1321将接收到较小的音频信号V J2。即，V J1>V J2。
由于环境中的噪声源相对于第一麦克风元件1312和第二麦克风元件1321的距离较远，可以认为环境中的噪声源是第一麦克风元件1312和第二麦克风元件1321的远场声源。对于远场声源，两组麦克风组件接收到的噪声信号大小相近，即V Y1≈V Y2。
因此，第一麦克风元件1312接收到的声音总信号为：
V 1＝V J1+V Y1                     (1)
第二组麦克风组件接收到的声音总信号为：
V 2＝V J2+V Y2                     (2)
为排除接收到的声音信号中的噪声，可以对第一麦克风元件1312声音总信号与第二麦克风元件1321声音总信号做差分处理。差分处理的形式可以是按照如下形式：
V＝V 1-V 2＝(V J1-V J2)+(V Y1-V Y2)≈V J1-V J2     (3)
进一步地，根据公式(3)获得的信号的差分结果，结合第一麦克风元件1312和第二麦克风元件1321相对于主声源的距离，可以进一步获得第一麦克风元件1312和/或第二麦克风元件1321实际获得的主声源发出的音频信号，即V J1或V J2。
因此，为保证最终获得的音频信号的质量，应使公式(3)中获得的信号的差分结果尽可能大，即V J1>>V J2。本申请的一些实施例中，可以采用以下方式实现这一效果：使第一麦克风元件1312的安装位置尽可能靠近主声源(如人的嘴部)；使第二麦克风元件1321的安装位置尽可能远离主声 源(如人的嘴部)；隔绝两个麦克风空间；在两个麦克风元件之间设置挡音件等。应当注意的是，以上手段均可以实现提高音频信号质量的效果，这些手段可以单独使用，也可以组合使用。
在一些实施例中，为使第一麦克风元件1312的安装位置尽可能靠近主声源(如人的嘴部)，可以将第一电路板131及其上安装的第一麦克风元件1312设置为倾斜的。在一些实施例中，为使第二麦克风元件1321的安装位置尽可能远离主声源(如人的嘴部)，可以将第二电路板132及其上安装的第二麦克风元件1321设置为倾斜的，以便灵活调整所需的安装距离。同时也可以在每个麦克风组件安装区域设置相应的导音通道及挡音件。具体的安装方式可以进一步参见图35-37及其相关描述。
在一实施例中，请进一步参阅图35、图36，图35为本申请扬声器装置在组合状态下沿图29中的B-B轴线的截面图；图36是本申请中第一电路板和第二电路板与图35中不同夹角的实施例的结构示意图。第一电路板131包括第一麦克风元件1312。具体地，所述第一电路板131面向所述盖体52设置，所述第一麦克风元件1312设置于第一电路板131面向所述盖体52的一侧。例如，第一麦克风元件1312可与上述实施例中的开关1311间隔设置在第一电路板131上。具体地，第一麦克风元件1312用于接收来自机芯壳体41外部的声音信号，并将声音信号转换为电信号以进行分析处理。
相应地，支架121上设置有与第一麦克风元件1312对应的麦克风孔1214，软质盖层122上设置有与麦克风孔1214对应的第一导音孔1223。第一导音孔1223可与第一麦克风元件1312对应设置。
具体的，所述第一导音孔1223设置于所述盖体52上，第一导音孔1223的一端连接盖体52上的麦克风孔1214，第一导音孔1223的另一端面向第一麦克风元件1312，从而可以缩短导音距离，提高导音效果。
具体的，第一电路板131以平行或倾斜于所述盖体52的方式面向所述盖体52，且所述第一导音孔1223垂直或倾斜于所述盖体52的表面。
在一些实施例中，所述开口112的深度方向相对于容置本体51的底部可以是竖直的，也可以是倾斜的。当所述开口112是竖直的，所述盖体52盖上后相对于容置本体51为水平的；当所述开口112是倾斜的，所述盖体52盖上后相对于容置本体51为倾斜的，所述倾斜为面向人体嘴部一侧倾斜，此方式可以使第一导音孔1223更直接的面向人的嘴部或面部，提高麦克风组件获取主声源声音的效果。
进一步的，当开口112是倾斜的，开口112所在平面与容置本体宽度方向所在平面的夹角位于10°～30°范围内，以使得第一导音孔1223更进一步面向人的嘴部区域。具体的，当开口112是倾斜的，开口112所在平面与容置本体宽度方向所在平面的夹角可以是上述范围内的任意角度，例如10°、15°、20°、23°、27°、30°等均可，此处不做具体限定。
具体地，第一导音孔1223贯通软质盖层122设置，当所述开口112为竖直的且第一电路板131平行于盖体52时，第一导音孔1223垂直于盖体52设置，即第一导音孔1223为竖直的；当 所述开口112为竖直的且第一电路板131倾斜于盖体52时，第一导音孔1223倾斜于盖体52设置，即第一导音孔1223为倾斜的；当所述开口112为倾斜的且第一电路板131平行于盖体52时，第一导音孔1223垂直于盖体52设置，即第一导音孔1223为倾斜的；当所述开口112为倾斜的且第一电路板131倾斜于盖体52时，第一导音孔1223也可以倾斜于盖体52设置，即第一导音孔1223可以是竖直，也可以是倾斜的。
进一步的，当第一电路板131以倾斜于所述盖体52的方式面向所述盖体52时，第一电路板131与盖体52所在平面的夹角位于5°～20°范围内。具体的，当第一电路板131以倾斜于所述盖体52的方式面向所述盖体52时，第一电路板131与盖体52所在平面的夹角可以是夹角范围内如5°、8°、10°、15°、20°的任意角度，此处不做具体限定。
具体的，第一导音孔1223与支架121上的麦克风孔1214对应，进而将第一麦克风元件1312与机芯壳体41的外部连通，使得机芯壳体41外部的声音可通过第一导音孔1223以及麦克风孔1214而被第一麦克风元件1312所接收。
为进一步提高导音效果，所述第一导音孔1223的中轴线与第一麦克风元件1312的受音区13121的主轴线重合。所述第一麦克风元件1312的受音区13121是指第一麦克风元件1312上接收声波的区域(例如，振膜)。当第一导音孔1223的中轴线与第一麦克风元件1312的受音区13121的主轴线重合时，主声源的声音被麦克风孔1214采集后，通过第一导音孔1223可以直接导向第一麦克风元件1312的受音区13121，进一步减小声音的传播路径，既可以避免主声源在腔体内反复传播造成损失和回声，又可以避免主声源通过腔体内的通道传入第二麦克风元件1321所在区域，从而起到提高音效的作用。
其中，在一实施例中，盖体52呈长条状设置，其中第一导音孔1223的主轴线与第一麦克风元件1312的受音区13121的主轴线在盖体52的宽度方向上彼此重合。其中，第一麦克风元件1312的受音区13121的主轴线是指第一麦克风元件1312的受音区13121在盖体52的宽度方向上的主轴线，如图35中的轴线n，第一导音孔1223的主轴线如图35中的轴线m，轴线n和轴线m重合。
进一步的，第一导音孔1223的形状可以为任意形状，只要能够将扬声器装置外界的声音输入即可。在一个应用场景中，第一导音孔1223为尺寸较小的圆孔，设置在盖体52对应麦克风孔1214的区域内。小尺寸第一导音孔1223能够减少扬声器装置内的第一麦克风元件1312等与外界的连通，从而提高扬声器装置的封闭性。
再进一步地，为了将由第一导音孔1223进入的声音信号引导至第一麦克风元件1312，可将导音通道12241设置为弯曲状。
具体地，在一个应用场景中，所述第一导音孔1223的主轴线在所述盖体52的宽度方向上设置于所述盖体52的中部。
同时，软质盖层122在对应麦克风孔1214的位置还设置有第一挡音件1224，第一挡音件1224经麦克风孔1214朝向腔体111的内部延伸，并定义导音通道12241，导音通道12241的一端 与软质盖层122上的第一导音孔1223连通，第一麦克风元件1312从导音通道12241的另一端插入至导音通道12241。
其中，在扬声器装置还包括上述实施例中的开关1311时，开关孔1213和麦克风孔1214可间隔设置在硬质支架121上。
进一步的，开关孔1213和麦克风孔1214的间隔距离可以是10～20mm，具体的还可以是10mm、15mm、20mm等。
对应地，第一挡音件1224由软质盖层122自第一导音孔1223的外围，穿过麦克风孔1214，向腔体111内部延伸至第一麦克风元件1312的外围，从而形成由第一导音孔1223至第一麦克风元件1312的导音通道12241，以使得扬声器装置进入导音孔的声音信号能够通过导音通道12241直接到达第一麦克风元件1312。
具体地，导音通道12241在垂直于其长度方向的截面上的形状可以与麦克风孔1214或第一麦克风元件1312的形状一致，当然也可以不一致。在一个应用场景中，麦克风孔1214和第一麦克风元件1312在垂直于支架121朝向腔体111的方向上的截面形状均为四方形，且麦克风孔1214的尺寸略大于导音通道12241的外围尺寸，而导音通道12241的内部尺寸也不小于第一麦克风元件1312的外围尺寸，从而使得导音通道12241能够穿过第一导音孔1223到达第一麦克风元件1312并包裹在第一麦克风元件1312的外围。
通过上述方式，扬声器装置的软质盖层122上设置有第一导音孔1223以及由第一导音孔1223外围穿过麦克风孔1214而到达第一麦克风元件1312并包裹在第一麦克风元件1312外围的导音通道12241，该导音通道12241的设置使得由第一导音孔1223进入的声音信号能够通过该第一导音孔1223到达第一麦克风元件1312，被第一麦克风元件1312所接收，从而能够降低声音信号在传播过程中的泄露，进而提高扬声器装置接收声音信号的效率。
其中，在一个应用场景中，扬声器装置还包括设置于导音通道12241内的防水网布54，该防水网布54由第一麦克风元件1312抵持于软质盖层122朝向麦克风元件的一侧，并覆盖第一导音孔1223。
具体地，导音通道12241内可靠近第一麦克风元件1312的位置支架121凸出形成一与第一麦克风元件1312相对的凸面，从而使得防水网布54夹设在第一麦克风元件1312与该凸面之间，或者还可以直接粘接在第一麦克风元件1312的外围，具体设置方式此处不做限定。
本实施例中的防水网布54除了进一步对第一麦克风元件1312起到防水作用之外，还可具有透声等作用，以避免对第一麦克风元件1312的受音区13121的受音效果产生不利影响。
需要指出的是，由于电路组件53本身设置的需要，第一麦克风元件1312可设置在第一电路板131的第一位置上，而在设置第一导音孔1223时，又由于美观、方便等需求，从而将第一导音孔1223设置在盖体52的第二位置上，本实施例中，第一位置和第二位置在盖体52的宽度方向上可并不对应，从而导致第一导音孔1223的主轴线与第一麦克风元件1312的受音区13121的主轴线在盖体52的宽度方向上彼此间隔设置，从而由第一导音孔1223输入的声音可能不能够沿直线达到 第一麦克风元件1312的受音区13121。
本实施例中，盖体52可以为扬声器装置的外壳体的一部分，而为了满足扬声器装置的整体美观需求，第一导音孔1223可设置在盖体52的宽度方向上的中部，以使得第一导音孔1223看上去更加对称，满足人们的视觉需求。
本应用场景中，可将对应的导音通道12241设置为沿图29中B-B轴线的截面呈台阶状，从而将第一导音孔1223导入的声音信号通过台阶状的导音通道12241传播至第一麦克风元件1312而为第一麦克风元件1312所接收。
进一步地，请进一步参阅图37，图37是本申请扬声器装置在组合状态下沿图29中的C-C轴线的截面图。在一实施例中，扬声器装置还包括一发光元件1313。具体地，发光元件1313可设置在电路组件53的第一电路板131上，以容置于腔体111内。例如，发光元件1313可与上述实施例中的开关1311、第一麦克风元件1312一起按照一定的排列方式设置在第一电路板131上。需要说明的是，电路组件53可以相当于前述实施例中的控制电路60。
相应地，硬质支架121上设置有与发光元件1313对应的出光孔1215，软质盖层122覆盖出光孔1215，且软质盖层122对应于出光孔1215的区域的厚度设置成允许发光元件1313所产生的光线经软质盖层122透射。
其中，发光元件1313可以为发光二极管等，发光元件1313的数量可以为一个或者多个，硬质支架121上的出光孔1215的数量可与发光元件1313一致，在发光元件1313的数量为多个时，则对应有不同的出光孔1215，进而可通过不同的发光元件1313传递不同的信号。
本实施例中，可通过一定手段将使得软质盖层122在覆盖出光孔1215的情况下仍然能够将发光元件1313所发射出的光线透射至扬声器装置的外部。
具体地，在一个应用场景中，可将软质盖层122对应于出光孔1215的整体区域或者部分区域的厚度设置成小于软质盖层122对应于出光孔1215外围的区域的厚度，以使得发光元件1313所发出的光线能够通过出光孔1215并进一步由软质盖层122透射出去。当然，也可以通过其它手段使得在软质盖层122覆盖出光孔1215的区域能够透射光线，此处不做具体限定。例如，将软质盖层122对应于出光孔1215的整体区域或者部分区域设置一个窗口，窗口上覆盖一层透明或透光材料(例如，薄膜、石英等)，以使得发光元件1313所发出的光线能够通过出光孔1215并进一步由窗口透射出去。
通过上述方式中，软质盖层122在覆盖对应发光元件1313的出光孔1215的基础上，进一步设置成能够使得发光元件1313所发射的光线从软质盖层122透射至扬声器装置的外部，从而能够在不影响扬声器装置发光功能的情况下通过软质盖层122将发光元件1313密封，以提高扬声器装置的密封性以及防水性能。
具体地，在一实施例中，硬质支架121在出光孔1215的外围进一步设置有朝向腔体111的内部延伸的挡光件1216，挡光件1216限制发光元件1313所产生的光线的传输方向。
其中，出光孔1215的形状可以为任意能够将发光元件1313所发出的光线透出的形状，如 圆形、方形、三角形等，本实施例中，出光孔1215的形状为圆形。
由于发光元件1313与出光孔1215之间还存在一定的距离，因此，若不设置约束，那么发光元件1313所发射出的光线将会在到达出光孔1215的过程中泄露掉一部分，从而不能够有效的传播至出光孔1215，进而降低从扬声器装置外部所能够看到的光的亮度，从而不便于用户接收信号。而本实施例中挡光件1216的设置能够限制发光元件1313所产生的光线的传输方向，以减少漏光，从而提高由出光孔1215所透出的光线的亮度。
具体地，本实施例中的挡光件1216可部分或者全部由硬质支架121形成，例如，硬质支架121可以沿着出光孔1215的外围向腔体111内部延伸，并包围发光元件1313，从而形成一光线传播的光通道，通过该光通道，发光元件1313所产生的光线能够沿着该通道的设置方向直接向出光孔1215传播；或者，硬质支架121也可不形成光通道，而是仅从一个方向或者几个方向上限制光线的传播，例如硬质支架121可以仅由出光孔1215的一侧向腔体111内延伸而形成一侧遮挡发光元件1313的挡光件1216。或者还可以进一步配合其它部件来限制光线的传播。例如，硬质支架121由出光孔1215的一侧向腔体111内延伸而形成一侧遮挡发光元件1313的挡光件1216，该挡光件1216进一步配合腔体111的内壁或者硬质支架121的其它结构等来从多个方向限制发光元件1313所产生的光线的传输方向。
在一个应用场景中，发光元件1313与第一麦克风元件1312相邻设置在第一电路板131上，对应的出光孔1215和麦克风孔1214间隔设置在硬质支架121上，如上述实施例中所述，在第一麦克风元件1312的外围设置有由软质盖层122所形成的定义一导音通道12241的第一挡音件1224，该第一挡音件1224穿过麦克风孔1214设置，从而将第一麦克风元件1312与发光元件1313以及麦克风孔1214与出光孔1215间隔设置。
具体地，本应用场景中，硬质支架121形成的挡光件1216与第一挡音件1224靠近发光元件1313的一侧壁配合，二者共同限制发光元件1313所产生的光线的传输方向。
在另一个应用场景中，腔体111在垂直于开口112方向的截面上呈长条状设置，对应地，硬质支架121也呈长条状由开口112通过插入部1211插入腔体111内，从而与腔体111形成机械连接。在沿硬质支架121的长度方向上的两侧，设置有插入部1211，从而发光元件1313在沿硬质支架121的长度方向上的两侧也设置有对应的硬质支架121的插入部1211，以在发光元件1313的两侧限制光线，进一步地，在本应用场景中，挡光件1216进一步设置在发光元件1313的垂直于硬质支架121长度方向上的一侧，而第一挡音件1224的侧壁则设置在发光元件1313的垂直于硬质支架121长度方向上的另一侧，二者可为彼此并行的板体，并进一步与发光元件1313两侧的插入部1211共同限制发光元件1313所产生的光线的传输方向。
其中，在一实施例中，扬声器装置中的电路组件53包括上述扬声器装置实施例中的第一电路板131，且还可以进一步包括第二电路板132，具体可参阅图29、图32、图35、图36。
具体的，所述第二电路板132面向所述容置本体51设置，且第二电路板132倾斜于第一电路板131设置于腔体111内，第二电路板132面向所述容置本体51的一侧设置有第二麦克风元 件1321。
需要说明的是，第二电路板132相当于前述实施例中的第二分支电路板。
第二麦克风元件1321面向容置本体51的侧壁设置，使得第二麦克风元件1321附近有较大空间，可以方便在容置本体51上设置与第二麦克风元件1321相应的功能件。并且，第二电路板132倾斜于第一电路板131设置，两个电路板上的功能件可以相互错位设置，也可以起到缩小功能件之间间距的作用，可以进一步节约、压缩扬声器装置内部空间。
其中，所述盖体52或所述第一导音孔1223相对的所述容置本体51的侧壁上还设置有第二导音孔114。
需要说明的是，第一导音孔和第二导音孔相当于前述实施例中的入声孔。
容置本体51的侧壁上对应设置有第二导音孔114，第二导音孔114与第一导音孔1223相互远离。在一些实施例中，容置本体51的开口112为倾斜开口，盖体52相对容置本体51倾斜，与第一导音孔1223相对的所述容置本体51的侧壁为腔体111的一侧侧面，第二导音孔114设置于容置本体51的一侧侧面。进一步的，第二导音孔114设置于容置本体51的一侧侧面，距离容置本体51的顶部3～6mm的范围内。具体可以为3mm、4mm、5mm、6mm等。
在一些实施例中，容置本体51的开口112的深度方向相对于容置本体的底部为竖直时，盖体52相对容置本体51水平设置，与第一导音孔1223相对的所述容置本体51的侧壁为腔体111的顶部，导音孔114设置于容置本体51的顶部。进一步的，第二导音孔114可以设置于容置本体51的顶部中间位置。
上述方式可以使第二导音孔114远离主声源，减少第二导音孔114接收到的主声源声音，提高第二导音孔114接收环境噪声的比例，增强降噪效果。
而如上述本申请扬声器装置实施例中所述，盖体52上设置有与第一麦克风元件1312以及麦克风孔1214对应的第一导音孔1223，其中，第一麦克风元件1312用于接收经第一导音孔1223输入的声音，第二麦克风元件1321用于接收经第二导音孔114输入的声音。
进一步地，所述第二导音孔114的中轴线与第二麦克风元件1321的受音区的主轴线重合。
当第二导音孔114的中轴线与第二麦克风元件1321的受音区的主轴线重合时，噪声通过第二导音孔114可以直接导向第二麦克风元件1321的受音区，减少噪声在腔体111内部的传播。同时，噪声通过第一导音孔1223可以直接导向第一麦克风元件1312的受音区13121。第一麦克风元件1312与第二麦克风元件1321接收到的噪声近似相同，有利于后续处理中消除噪声，提高主声源质量。
在一些实施例中，所述第二导音孔114的中轴线与所述第一导音孔1223的中轴线重合或平行。
第二导音孔114与第一导音孔1223具有相同的中轴线方向，即两者的中轴线重合或平行。并且，第二导音孔114的声音入口和第一导音孔1223的声音入口朝向相反的方向，减小第二导音孔114接收到的主声源，有利于后续处理中消除噪声，提高主声源质量。
在一些实施例中，所述第二麦克风元件1321的受音区的主轴线与所述第一麦克风元件1312的受音区13121的主轴线重合或平行。第二麦克风元件1321的受音区接收通过第二导音孔114的声音信号，第一麦克风元件1312的受音区13121接收通过第一导音孔1223的声音信号。由于通过第二导音孔114中的主声源信号较小，因此第二麦克风元件1321的受音区接收到的主声源信号较小，有利于实现提高音频信号质量的效果。
在一些实施例中，第一电路板131可以平行开口112的开口平面且靠近开口112设置。可选地，第一电路板131也可以倾斜于开口112的开口平面且靠近开口112设置。进一步地，第一电路板131上还可进一步设置如上所述的开关1311、发光元件1313等，开关1311、发光元件1313以及第一麦克风元件1312等可按照一定的排列方式设置在第一电路板131上，对应地，分别在盖体52上间隔设置开关孔1213、出光孔1215以及麦克风孔1214等，以通过对应的孔与扬声器装置的外部进行信号的传输。
进一步的，麦克风孔1214可以设置在盖体52的中部中心位置，开关孔1213和出光孔1215可以在盖体52长度方向上分别设置于麦克风孔1214的两侧。开关孔1213和出光孔1215距离麦克风孔1214的距离可以是5～10mm的范围内，具体的可以是5mm、6mm、7mm、8mm、9mm、10mm等。开关孔1213和出光孔1215距离麦克风孔1214的距离可以是相等的，也可以是不相等的。
在一些实施例中，容置本体51自开口112沿垂直于开口平面的方向延伸以形成具有一定宽度的腔体111，第二电路板132可以平行于腔体111的宽度方向，并垂直于开口平面设置。可选地，第二电路板132也可以倾斜于腔体111的宽度方向，并倾斜于开口112平面设置。第二电路板132倾斜于第一电路板131设置于腔体111内。其中，第二电路板132上可进一步设置有主控芯片和天线等。
在一些实施例中，第二电路板132倾斜于腔体111的宽度方向，并倾斜于开口112平面设置。第二电路板132与腔体111的宽度方向的夹角位于5°～20°范围内。具体的，第二电路板132与腔体111的宽度方向的夹角可以是上述范围内的任意角度，例如5°、10°、15°、20°等均可，此处不做具体限定。
在一个应用场景中，在用户使用该扬声器装置时，所述第二麦克风元件1321的受音区的主轴线与所述第一麦克风元件1312的受音区13121的主轴线重合，且第一麦克风元件1312和第二麦克风元件1321与用户的嘴巴在一条直线上。
本实施例中，分别在两个电路板上设置第一麦克风元件1312和第二麦克风元件1321，两个麦克风元件分别通过第一导音孔1223和第二导音孔114接收声音信号，其中一个麦克风元件可用于收集人声等主要声音，而另一个麦克风元件可具备背景噪声采集功能，方便采集周围环境噪音，二者配合对接收到的声音信号进行分析处理，能够起到降噪等的作用，从而提高声音信号的处理质量。
进一步地，如图35和图36所示，所示图36是本申请扬声器装置在组合状态下的与图35不同夹角的实施例的结构示意图，第一电路板131和第二电路板132互相倾斜设置于同一个腔体 111内，可以使两个电路板的安装方式更加灵活，可以根据两个电路板上电子元件的大小和位置调整两个电路板之间的夹角，从而提高扬声器装置的空间利用率，在进一步应用于扬声器装置时，能够节省扬声器装置的空间，以利于扬声器装置的轻薄化。
进一步的，第一电路板131和第二电路板132的夹角位于50°～150°范围内，具体的第一电路板131和第二电路板132的夹角可以是上述范围内的任意角度，例如70°、80°、90°、100°、110°等均可。
具体地，在一个应用场景中，开口112和盖体52呈对应的长条状设置，第一电路板131的形状与开口112的形状相匹配，且第一电路板131的宽度d 1不大于开口平面沿开口112宽度方向上的尺寸，以使得第一电路板131(平行或倾斜于开口所在平面)能够容置于腔体111内靠近开口112的位置，即第一电路板131也呈长条状设置。对应地，开关1311、发光元件1313以及第一麦克风元件1312可沿第一电路板131的长度方向，也即盖体52的长度方向间隔设置在第一电路板131上。
在一些实施例中，所述第二麦克风元件1321为骨传导麦克风，所述骨传导麦克风通过第二导音孔114伸出所述容置本体51。所述骨传导麦克风安装于容置本体51的一侧侧壁。所述侧壁为用户佩戴扬声器装置时贴合用户身体的一侧侧壁，以便所述骨传导麦克风更好地接收主声源的振动信号。当用户佩戴扬声器装置进行语音输入时，第二麦克风元件1321将主要采集主声源的振动信号，并将所述振动信号与第一麦克风元件1312(气导)采集的声音信号(包括音频信号与噪声)进行对比。在一些实施例中，可以基于上述对比结果，对所述第一麦克风元件1312采集的声音信号进行优化，获得高质量的音频信号。
在一些实施例中，组件本体50上设置贯通腔体111的侧壁的第二导音孔114，且在对应第二导音孔114的位置设置有第二挡音件115，第二挡音件115经第二导音孔114朝向腔体111的内部延伸，以限制声音向第二麦克风元件1321的传输方向。
具体地，本实施例中，对应于第二麦克风元件1321的第二导音孔114设置在组件本体50上，并贯通腔体111以将第二麦克风元件1321与外界连通，以使得第二麦克风元件1321能够接收外界的声音信号。
其中，第二挡音件115可以为硬质材料，或者软质材料，例如第二挡音件115可以由容置本体51在腔体111内部一侧沿第二导音孔114的外围向腔体111内部延伸而形成。本实施例中，第二挡音件114可由与容置本体51一体注塑而成的软胶在腔体111内部一侧沿第二导音孔114的外围向腔体111内部延伸而形成。在一应用场景中，第二挡音件115可以沿第二导音孔114的四周向腔体111内部延伸，并延伸至第二麦克风元件1321，并进而包围第二麦克风元件1321的受音区，以形成一连接第二导音孔114和第二麦克风元件1321的通道，使得外界输入至第二导音孔114的声音信号直接经过该通道而被第二麦克风元件1321的受音区所接收。在另一个应用场景中，第二挡音件115可并不完全包围在第二导音孔114的四周，而仅沿第二导音孔114的一侧或者两侧等向腔体111内部延伸，并延伸至第二麦克风元件1321，以引导由第二导音孔114输入的声音传播至第二麦克风元件1321而被其受音区所接收。
需要注意的是，以上对扬声器装置的双麦克风模块的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解扬声器装置的双麦克风模块的基本原理后，可能在不背离这一原理的情况下，对实施扬声器装置的双麦克风模块的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，扬声器装置还可以包括音频信号对比元件，音频信号对比元件可以将第二麦克风元件1321主要采集主声源的振动信号与第一麦克风元件1312(气导)采集的声音信号(包括音频信号与噪声)进行对比，并且可以基于上述对比结果，对所述第一麦克风元件1312采集的声音信号进行优化，获得高质量的音频信号。诸如此类的变形，均在本申请的保护范围之内。
在一些实施例中，以上描述的扬声器装置可以通过气传导的方式将声音传递给用户。当采用气传导的方式传递声音时，扬声器装置可以包括一个或多个声源。声源可以位于用户头部的特定位置，例如，头顶、额头、脸颊、鬓角、耳廓、耳廓背面等，而不用堵塞或者覆盖耳道。出于描述的目的，图38是显示一种通过气传导的方式传递声音的示意图。
如图38所示，声源3010和声源3020可以产生相位相反的声波(图中以“+”和“-”表示相位相反)。为简单起见，这里所说的声源指的是扬声器装置上输出声音的出声孔。例如，声源3010和声源3020可以是分别位于扬声器装置上特定位置(例如，机芯壳体41，或者电路壳体20)的两个出声孔。
在一些实施例中，声源3010和声源3020可以由同一个振动装置3001产生。振动装置3001包括振膜(未显示在图中)。当振膜受到电信号驱动而振动时，振膜正面驱动空气振动，通过导声通道3012在出声孔处形成声源3010，振膜背面驱动空气振动，通过导声通道3022在出声孔处形成声源3020。所述导声通道指的是振膜到对应出声孔的声音传播路径。在一些实施例中，所述导声通道是由扬声器上特定结构(例如，机芯壳体41，或者电路壳体20)围成的路径。需要知道的是，在一些可替代的实施例中，声源3010和声源3020还可以由不同的振动装置，分别通过不同的振膜振动产生。
由声源3010和声源3020产生的声音中，一部分传递给用户耳朵形成用户听到的声音，另一部分传递到环境中形成漏音。考虑到声源3010和声源3020距离用户耳朵的位置较近，为了描述方便，传递到用户耳朵的声音可以称为近场声音，传递到环境中的漏音可以称为远场声音。在一些实施例中，扬声器装置产生的不同频率的近场/远场声音与声源3010和声源3020之间的间距有关。一般说来，扬声器装置产生的近场声音会随着两个声源之间间距的增大而增大，而产生的远场声音(漏音)会随着频率的增加而增大。
针对不同频率的声音，可以分别设计声源3010和声源3020之间的间距，使得扬声器装置产生的低频近场声音(例如，频率小于800Hz的声音)尽可能大，且高频远场声音(例如，频率大于2000Hz的声音)尽可能小。为了达到以上目的，所述扬声器装置中可以包括两组或两组以上的双声源，每组双声源包含类似于声源3010和声源3020的两个声源，并分别产生特定频率的声音。具体地，第一组双声源可以用于产生低频声音，第二组双声源可以用产生高频声音。为了获得较大 的低频近场声音，第一组双声源中两个声源之间的距离可以设置为较大的值。并且由于低频信号的波长较长，双声源之间较大的距离不会在远场形成过大的相位差，因而也不会在远场中形成过多的漏音。为了使得高频远场声音较小，第二组双声源中两个声源之间的距离可以设置为较小的值。由于高频信号的波长较短，双声源之间较小的距离可以避免在远场形成大的相位差，因而可以避免形成大的漏音。第二组双声源之间的距离小于所述第一组双声源之间的距离。
本申请实施例可能带来的有益效果包括但不限于：(1)优化了扬声器装置上按键模块4d的位置，提高了振动效率；(2)提高了扬声器装置的声音传递效率，提高了音量；(3)提高对扬声器装置的防水效果；(4)减少由入声孔413进入的声音的散失，而提高声音转化为防水膜本体4c11的振动的转化率；(5)提高对机芯壳体41内部器件的防水、保护效果；(6)避免主声源在腔体内反复传播造成损失和回声，又可以避免主声源通过腔体内的通道传入第二麦克风元件1321所在区域，从而起到提高音效的作用。需要说明的是，不同实施例可能产生的有益效果不同，在不同的实施例里，可能产生的有益效果可以是以上任意一种或几种的组合，也可以是其他任何可能获得的有益效果。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述发明披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。

Claims (29)

  1. 一种扬声器装置，其特征在于，所述扬声器装置包括：
    支撑连接件，用于与使用者头部进行接触；
    至少一个扬声器组件，所述扬声器组件包括耳机芯和用于容纳所述耳机芯的机芯壳体，所述机芯壳体与所述支撑连接件固定连接，所述机芯壳体上存在至少一个按键模块，所述机芯客体内部还包括至少两个麦克风，所述至少两个麦克风位于相距使用者嘴部不同距离的位置；
    所述支撑连接件中容纳控制电路或电池，所述控制电路或电池驱动所述耳机芯振动以产生声音。
  2. 根据权利要求1所述的扬声器装置，其特征在于，所述支撑连接件与人体头部的接触位置包含至少一个接触点；
    所述按键模块的中心与所述至少一个接触点之间的距离不大于所述机芯壳体的中心与所述至少一个接触点之间的距离。
  3. 根据权利要求2所述的扬声器装置，其特征在于，所述中心为质心或形心。
  4. 根据权利要求1所述的扬声器装置，其特征在于，所述机芯壳体包括远离人体头部的外侧壁和与所述外侧壁连接并环绕设置的周侧壁。
  5. 根据权利要求4所述的扬声器装置，其特征在于，
    所述周侧壁包括沿外侧壁长度方向设置的第一周侧壁和沿外侧壁宽度方向设置的第二周侧壁；
    所述外侧壁与所述周侧壁连接在一起形成一端开口并容纳所述耳机芯的空腔。
  6. 根据权利要求5所述的扬声器装置，其特征在于，所述按键模块位于外侧壁的中部位置；或者所述按键模块位于外侧壁的中部位置与顶端位置之间。
  7. 根据权利要求6所述的扬声器装置，其特征在于，所述按键模块包括按键和用于支撑所述按键的弹性承座；
    所述外侧壁上设置有按键孔，所述按键孔与所述按键相互配合。
  8. 根据权利要求1所述的扬声器装置，其特征在于，所述支撑连接件与所述机芯壳体的连接部分具有中轴线，所述中轴线的延长线在所述按键模块的外侧面所在的平面上具有投影，所述投影与所述按键模块的长轴方向之间的夹角小于10°。
  9. 根据权利要求8所述的扬声器装置，其特征在于，所述按键模块的外侧面的长轴方向和短轴方向具有交叉点，所述投影与所述交叉点之间具有最短距离，所述最短距离小于所述按键模块的外 侧面在短轴方向上的尺寸。
  10. 根据权利要求2所述的扬声器装置，其特征在于，所述按键模块的中心与所述扬声器组件的所述至少一个接触点之间具有第一距离；所述机芯壳体的中心与所述扬声器组件的所述至少一个接触点之间具有第二距离；
    所述第一距离与所述第二距离之间的比例不大于0.95。
  11. 根据权利要求1所述的扬声器装置，其特征在于，所述按键模块的质量与所述扬声器组件的质量比不大于0.3。
  12. 根据权利要求4所述的扬声器装置，其特征在于，所述扬声器包括：
    辅助功能模块，用于接收辅助信号，执行辅助功能，所述辅助功能模块包括所述至少两个麦克风；
    第一软性电路板，用于电连接外部控制电路的音频信号导线和辅助信号导线，并通过所述第一软性电路板将所述音频信号导线和所述辅助信号导线分别与所述耳机芯和所述辅助功能模块电连接。
  13. 根据权利要求12所述的扬声器装置，其特征在于，所述第一软性电路板至少包括主体电路板和第一分支电路板，所述第一分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的一端延伸；以及
    所述辅助功能模块至少包括第一辅助功能模块和第二辅助功能模块，所述第一辅助功能模块设置于所述主体电路板上，所述第二辅助功能模块设置于所述第一分支电路板上。
  14. 根据权利要求13所述的扬声器装置，其特征在于，
    所述第一软性电路板还包括第二分支电路板，所述第二分支电路板和所述主体电路板相连，并远离所述主体电路板沿所述主体电路板的另一端延伸，并与所述第一分支电路板间隔设置；以及
    所述辅助功能模块还包括第三辅助功能模块，所述第三辅助功能模块设置在所述第二分支电路板上。
  15. 根据权利要求14所述的扬声器装置，其特征在于，所述机芯壳体还包括与所述外侧壁对应设置且与所述周侧壁的端面连接的底端壁，所述第一分支电路板面向所述底端壁设置，所述第二分支电路板面向所述周侧壁设置；以及
    第二辅助功能模块包括第一麦克风元件，第三辅助功能模块包括二麦克风元件，所述第一麦克风元件设置于所述第一分支电路板面向所述底端壁的一侧，所述第二麦克风元件设置于所述第二分支电路板面向所述周侧壁的一侧。
  16. 根据权利要求1所述的扬声器装置，其特征在于，所述机芯壳体上设置有第一入声孔，所述扬声器组件还包括：
    环形挡壁，所述环形挡壁一体成型于所述机芯壳体的内表面上，且设置于所述第一入声孔的外围，进而定义一与所述第一入声孔连通的容置空间；
    防水膜组件，设置于所述容置空间内，并覆盖所述第一入声孔；
    刚性支撑板，设置于所述容置空间内，并将所述防水膜组件压持于所述机芯壳体的内表面上，所述刚性支撑板上设置有第二入声孔。
  17. 根据权利要求16所述的扬声器装置，其特征在于，所述防水膜组件包括防水膜本体以及设置于所述防水膜本体朝向所述刚性支撑板一侧的第一环形胶垫，所述第一环形胶垫设置于所述第一入声孔和所述第二入声孔的外围，所述刚性支撑板压持于所述第一环形胶垫上。
  18. 根据权利要求17所述的扬声器装置，其特征在于，所述第一环形胶垫设置成在所述防水膜本体和所述刚性支撑板之间形成一仅通过所述第二入声孔连通至所述麦克风的密封腔。
  19. 根据权利要求16所述的扬声器装置，其特征在于，所述防水膜组件进一步包括设置于所述防水膜本体朝向所述机芯壳体的内表面一侧且与所述第一环形胶垫重叠设置的第二环形胶垫。
  20. 根据权利要求1所述的扬声器装置，其特征在于，所述机芯壳体的内表面上设置有第一凹陷区，所述机芯壳体上设置有位于所述第一凹陷区并用于连通所述机芯壳体的内表面和外表面的按键孔。
  21. 根据权利要求20所述的扬声器装置，其特征在于，所述扬声器装置还包括：
    弹性承座，所述弹性承座包括一体成型的承座本体以及支撑柱，其中所述承座本体设置于所述第一凹陷区内，并固定于所述第一凹陷区的底部，所述支撑柱设置于所述承座本体朝向所述机芯壳体外部的一侧，并从所述按键孔外露；
    按键，设置于所述支撑柱的外露部分上。
  22. 根据权利要求21所述的扬声器装置，其特征在于，所述承座本体包括绕所述按键孔设置并与所述第一凹陷区的底部贴合固定的环形固定部以及与所述环形固定部的内环面连接且朝向所述机芯壳体的外部呈穹顶形隆起的弹性支撑部，其中所述支撑柱设置于所述弹性支撑部的顶部。
  23. 根据权利要求21所述的扬声器装置，其特征在于，所述机芯壳体的外表面上设置有第二凹陷区，其中所述按键孔进一步位于所述第二凹陷区内，所述按键至少部分沉设于所述第二凹陷区内。
  24. 根据权利要求21所述的扬声器装置，其特征在于，所述按键包括按键本体以及设置于所述按键本体一侧的第一环形凸缘和第二环形凸缘，其中所述第一环形凸缘位于所述按键本体的中间区域，所述第二环形凸缘位于所述按键本体的外边缘，所述支撑柱插置于所述第一环形凸缘内部，所述第二环形凸缘远离所述按键本体的端面沉设于所述第二凹陷区内，并在所述弹性承座处于自然状态时与所述第二凹陷区的底部间隔一定距离。
  25. 根据权利要求21所述的扬声器装置，其特征在于，所述弹性承座还包括设置于所述承座本体靠近所述机芯壳体内部一侧并用于接触所述按键开关的接触头。
  26. 根据权利要求1所述的扬声器装置，其特征在于，所述机芯壳体包括主壳体以及隔板组件，所述隔板组件位于所述主壳体内部，并与所述主壳体连接，进而将所述主壳体的内部空间分隔成第一容置空间和第二容置空间；
    所述机芯壳体上还设置有与所述机芯壳体的外端面连通的接插孔。
  27. 根据权利要求26所述的扬声器装置，其特征在于，所述第二容置空间靠近所述接插孔设置。
  28. 根据权利要求26所述的扬声器装置，其特征在于，所述主壳体包括周侧壁以及与所述周侧壁的一端面连接的底端壁。
  29. 根据权利要求28所述的扬声器装置，其特征在于，所述隔板组件包括两端与所述周侧壁连接的侧隔板，以及与所述底端壁间隔设置且分别与所述周侧壁和侧隔板连接的底隔板，其中所述底隔板上设置有走线孔。
PCT/CN2019/102383 2019-01-05 2019-08-24 一种扬声器装置 WO2020140448A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/305,244 US11800275B2 (en) 2019-01-05 2021-07-01 Loudspeaker apparatus
US18/491,786 US20240048892A1 (en) 2019-01-05 2023-10-22 Loudspeaker apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910009909.6A CN109862491B (zh) 2019-01-05 2019-01-05 骨传导扬声装置
CN201910009909.6 2019-01-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/305,244 Continuation US11800275B2 (en) 2019-01-05 2021-07-01 Loudspeaker apparatus

Publications (1)

Publication Number Publication Date
WO2020140448A1 true WO2020140448A1 (zh) 2020-07-09

Family

ID=66894033

Family Applications (5)

Application Number Title Priority Date Filing Date
PCT/CN2019/102382 WO2020140447A1 (zh) 2011-12-23 2019-08-24 一种扬声器装置
PCT/CN2019/102388 WO2020140451A1 (zh) 2019-01-05 2019-08-24 一种扬声器装置
PCT/CN2019/102379 WO2020140445A1 (zh) 2019-01-05 2019-08-24 一种扬声装置
PCT/CN2019/102383 WO2020140448A1 (zh) 2019-01-05 2019-08-24 一种扬声器装置
PCT/CN2019/102381 WO2020140446A1 (zh) 2019-01-05 2019-08-24 一种扬声器装置

Family Applications Before (3)

Application Number Title Priority Date Filing Date
PCT/CN2019/102382 WO2020140447A1 (zh) 2011-12-23 2019-08-24 一种扬声器装置
PCT/CN2019/102388 WO2020140451A1 (zh) 2019-01-05 2019-08-24 一种扬声器装置
PCT/CN2019/102379 WO2020140445A1 (zh) 2019-01-05 2019-08-24 一种扬声装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/102381 WO2020140446A1 (zh) 2019-01-05 2019-08-24 一种扬声器装置

Country Status (3)

Country Link
US (10) US11438689B2 (zh)
CN (3) CN109862491B (zh)
WO (5) WO2020140447A1 (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11463814B2 (en) 2011-12-23 2022-10-04 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
CN109862491B (zh) 2019-01-05 2023-11-24 深圳市韶音科技有限公司 骨传导扬声装置
US11363362B2 (en) 2018-06-15 2022-06-14 Shenzhen Shokz Co., Ltd. Speaker device
CN116709128A (zh) 2018-06-15 2023-09-05 深圳市韶音科技有限公司 骨传导扬声器及骨传导耳机
RU2754382C1 (ru) 2018-06-15 2021-09-01 Шэньчжэнь Вокстек Ко., Лтд. Динамик на основе костной проводимости и способ его тестирования
USD907002S1 (en) * 2019-01-05 2021-01-05 Shenzhen Voxtech Co., Ltd. Bone conduction headphone
CN111031432A (zh) * 2019-12-20 2020-04-17 歌尔股份有限公司 颈戴式耳机及功能切换方法、系统、设备、计算机介质
PE20221348A1 (es) 2020-04-30 2022-09-13 Shenzhen Shokz Co Ltd Auriculares de conduccion osea
EP4072158A4 (en) * 2020-04-30 2023-07-05 Shenzhen Shokz Co., Ltd. HEADPHONES
USD953291S1 (en) * 2020-08-13 2022-05-31 Shenzhen Shokz Co., Ltd. Earphone
USD961546S1 (en) * 2020-09-09 2022-08-23 Zhiyu Zhang Headphones
US11516573B2 (en) * 2020-09-19 2022-11-29 Shenzhen Mengda Network Technology Co., Ltd. Split bone conduction earphone
JP1695437S (zh) * 2020-09-30 2021-09-21
CL2021001114S1 (es) * 2020-11-20 2021-09-24 Shenzhen Voxtech Co Ltd Audífono
USD993211S1 (en) * 2020-12-21 2023-07-25 Sentien HQ s.r.o. Wearable smart headphones
USD957361S1 (en) * 2021-01-06 2022-07-12 Jian Chen Bone conduction headphones
USD978106S1 (en) * 2021-02-01 2023-02-14 Shenzhen Yiyin Technology Co., Ltd Bone conduction earphone
JP1694438S (zh) * 2021-03-25 2021-09-06
CN116762364A (zh) * 2021-04-27 2023-09-15 深圳市韶音科技有限公司 声学输入输出设备
USD992525S1 (en) * 2021-07-06 2023-07-18 Dongguan Pure Audio Technology Co., Ltd. Bone conduction headphone
USD955364S1 (en) * 2021-07-27 2022-06-21 Xiamen Mairdi Electronic Technology Co., Ltd. Bone conduction headset
USD1002574S1 (en) * 2021-07-30 2023-10-24 Dongguan Pure Audio Technology Co., Ltd. Bone conduction headphone
CN113347546A (zh) * 2021-08-04 2021-09-03 深圳市吸铁石科技有限公司 一种头戴骨导式助听器
US11683621B2 (en) * 2021-09-22 2023-06-20 Bose Corporation Ingress resistant portable speaker
USD964962S1 (en) * 2021-09-30 2022-09-27 Yanjin Zuo Headphone
USD1006782S1 (en) * 2021-12-31 2023-12-05 Klatre innovation Co., Ltd. Bone conduction earphone
CN216795282U (zh) * 2022-03-04 2022-06-21 深圳市亿音科技有限公司 一种新型骨传导振子以及骨传导蓝牙耳机
USD1012887S1 (en) * 2022-03-29 2024-01-30 Suzhou Thor Electronic Technology Co., Ltd. Bone conduction headphone
USD1016781S1 (en) * 2022-11-15 2024-03-05 Zhonghua Tan Bone conduction headphones
CN115811686A (zh) * 2022-11-22 2023-03-17 歌尔科技有限公司 用于穿戴式电子设备的发声装置模组及可穿戴式电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204272346U (zh) * 2014-12-03 2015-04-15 张艇 骨传导耳机
CN204465795U (zh) * 2014-12-10 2015-07-08 深圳瑞迪恩科技有限公司 一种头戴式骨传导耳机
WO2016206029A1 (zh) * 2015-06-23 2016-12-29 苏州佑克骨传导科技有限公司 发箍式骨传导耳机
CN205864669U (zh) * 2016-06-12 2017-01-04 范伏清 具有语音识别功能的骨传导蓝牙耳机
CN205946101U (zh) * 2016-08-18 2017-02-08 深圳市八达晟电子有限公司 骨传导游戏助听蓝牙耳机装置
WO2017039039A1 (ko) * 2015-09-04 2017-03-09 재단법인 다차원 스마트 아이티 융합시스템 연구단 골전도 이어폰 장치 및 그 동작 방법
CN106604174A (zh) * 2017-02-28 2017-04-26 北京立施体育文化产业有限公司 一种骨传导耳机
CN106792312A (zh) * 2016-12-26 2017-05-31 东莞产权交易中心 一种骨传导耳机
CN109862491A (zh) * 2019-01-05 2019-06-07 深圳市韶音科技有限公司 骨传导扬声装置

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113428A (en) * 1990-09-04 1992-05-12 Robert Fitzgerald Cordless telephone headset
ATE278289T1 (de) * 1999-11-12 2004-10-15 Ericsson Telefon Ab L M Konfiguriebarer schalter für einen schnurlosen kopfhörer
US7150526B2 (en) * 2000-06-02 2006-12-19 Oakley, Inc. Wireless interactive headset
JP2004229147A (ja) * 2003-01-27 2004-08-12 Hitachi Maxell Ltd 耳装着型の通話装置
US7046799B2 (en) * 2003-09-12 2006-05-16 Motorola, Inc. Communication headset and method
US7248705B1 (en) * 2005-12-29 2007-07-24 Van Hauser Llc Noise reducing headphones with sound conditioning
WO2007133055A1 (en) * 2006-05-17 2007-11-22 Sung-Ho Kim Bone conduction headset
US8019092B2 (en) 2009-10-27 2011-09-13 Savannah Marketing Group Inc. Aural device with white noise generator
CN102497612B (zh) 2011-12-23 2013-05-29 深圳市韶音科技有限公司 一种骨传导扬声器及其复合振动装置
CN202488645U (zh) * 2012-01-06 2012-10-10 瑞声光电科技(常州)有限公司 骨传导器件和骨传导耳机
US20130329903A1 (en) * 2012-06-07 2013-12-12 Shao-Chieh Ting Multifunctional bluetooth earphone device with neck speakers
US10433044B2 (en) 2012-08-02 2019-10-01 Ronald Pong Headphones with interactive display
CN203057431U (zh) * 2013-01-08 2013-07-10 深圳市韶音科技有限公司 一种单磁体的骨传导耳机装置
CN103079135B (zh) * 2013-01-08 2016-08-31 深圳市韶音科技有限公司 一种单磁体的骨传导耳机装置及其加工方法
WO2015040832A1 (ja) * 2013-09-20 2015-03-26 パナソニックＩｐマネジメント株式会社 骨伝導スピーカ及び骨伝導ヘッドホン装置
JP2015133673A (ja) * 2014-01-15 2015-07-23 船井電機株式会社 マイクロホンを備えたイヤホン装置、および、イヤホン装置
CN103792683B (zh) * 2014-01-26 2015-04-08 杭州双弯月电子科技有限公司 骨传导蓝牙眼镜
US10130809B2 (en) 2014-06-13 2018-11-20 Nervana, LLC Transcutaneous electrostimulator and methods for electric stimulation
US9652124B2 (en) * 2014-10-31 2017-05-16 Microsoft Technology Licensing, Llc Use of beacons for assistance to users in interacting with their environments
CN104581484A (zh) * 2014-12-29 2015-04-29 汉得利（常州）电子股份有限公司 微型骨传导器件防声泄露隔音腔
CN204360945U (zh) * 2015-01-06 2015-05-27 深圳市韶音科技有限公司 一种骨传导耳机及其按键结构
US20160249129A1 (en) * 2015-02-22 2016-08-25 Caroline Patricia Smith Headphone Earphone Hybrid
US10462593B2 (en) 2015-06-30 2019-10-29 Voyetra Turtle Beach, Inc. Matrixed audio settings
EP3337185B1 (en) * 2015-08-13 2021-07-21 Shenzhen Voxtech Co., Ltd Bone conduction loudspeaker
CN204948313U (zh) * 2015-09-06 2016-01-06 深圳市韶音科技有限公司 骨传导无线耳机
CN204948312U (zh) * 2015-09-06 2016-01-06 深圳市韶音科技有限公司 骨传导无线耳机
JP3217693U (ja) * 2015-09-19 2018-08-30 パリファリー インコーポレイティド 装飾的無線通信システム及びそのモジュール
CN205336486U (zh) * 2015-12-15 2016-06-22 深圳市韶音科技有限公司 一种骨传导无线耳机
US10021475B2 (en) * 2015-12-21 2018-07-10 Panasonic Intellectual Property Management Co., Ltd. Headset
US9788097B2 (en) * 2016-01-29 2017-10-10 Big O LLC Multi-function bone conducting headphones
US10136220B2 (en) 2016-04-08 2018-11-20 Bluecom Co., Ltd. Bluetooth neck band headset including vibration speaker
CN205726269U (zh) * 2016-04-27 2016-11-23 范伏清 一种太阳能蓄电式骨传导耳机
KR101782435B1 (ko) * 2016-05-27 2017-09-27 주식회사 블루콤 스마트폰연결잭을 포함하고 있는 넥밴드형 이어폰
JP6706766B2 (ja) * 2016-10-28 2020-06-10 パナソニックＩｐマネジメント株式会社 音声入出力装置および骨伝導ヘッドセットシステム
CN107801114B (zh) * 2017-02-10 2023-06-16 深圳市启元数码科技有限公司 一种防水骨传导耳机及其防水密封方法
CN206650818U (zh) * 2017-02-24 2017-11-17 象山赛柏斯智能科技有限公司 一种加强运动型耳机
CN207039648U (zh) 2017-05-06 2018-02-23 高榕科技（深圳）有限公司 一种新的基于大容量信息存储及通讯设备的内容推送系统
CN207410479U (zh) * 2017-05-23 2018-05-25 东莞市库珀电子有限公司 一种带有摄像功能的骨传导蓝牙耳机
CN207070263U (zh) * 2017-07-01 2018-03-02 丹阳市立旺塑料配件有限公司 一种蓝牙眼镜用骨传导结构
CN207070281U (zh) * 2017-08-18 2018-03-02 深圳市韶音科技有限公司 一种骨传导耳机
CN207039848U (zh) * 2017-08-18 2018-02-23 深圳市韶音科技有限公司 一种骨传导耳机
CN117479071A (zh) * 2017-08-18 2024-01-30 深圳市韶音科技有限公司 一种骨传导耳机
CN116980794A (zh) * 2017-08-18 2023-10-31 深圳市韶音科技有限公司 一种骨传导耳机
CN107682773B (zh) * 2017-11-28 2023-09-19 深圳市率先电器有限公司 外响颈挂式蓝牙耳机
CN107995549B (zh) * 2017-11-29 2019-07-26 苏州佑克骨传导科技有限公司 一种具有计步功能的后戴式骨传导耳机
US10872592B2 (en) * 2017-12-15 2020-12-22 Skullcandy, Inc. Noise-canceling headphones including multiple vibration members and related methods
CN107948883A (zh) * 2018-01-08 2018-04-20 深圳市韶音科技有限公司 一种骨传导扬声器
KR101934229B1 (ko) * 2018-01-10 2018-12-31 허진숙 골 전도용 헤드셋
CN108391213A (zh) * 2018-04-26 2018-08-10 深圳朗凡创新科技有限公司 一种骨传导发声装置
CN108600889B (zh) * 2018-05-29 2020-06-30 福建太尔集团股份有限公司 一种求救系统及求救方法
CN108429975A (zh) * 2018-06-06 2018-08-21 罗令 一种骨传导智能通讯耳机
RU2754382C1 (ru) * 2018-06-15 2021-09-01 Шэньчжэнь Вокстек Ко., Лтд. Динамик на основе костной проводимости и способ его тестирования
CN117528322A (zh) * 2019-01-05 2024-02-06 深圳市韶音科技有限公司 骨传导扬声装置
CN109547906B (zh) * 2019-01-05 2023-12-08 深圳市韶音科技有限公司 骨传导扬声装置
KR20210023588A (ko) * 2019-08-23 2021-03-04 차재춘 이어셋 타입의 휴대 가능한 공기청정기

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204272346U (zh) * 2014-12-03 2015-04-15 张艇 骨传导耳机
CN204465795U (zh) * 2014-12-10 2015-07-08 深圳瑞迪恩科技有限公司 一种头戴式骨传导耳机
WO2016206029A1 (zh) * 2015-06-23 2016-12-29 苏州佑克骨传导科技有限公司 发箍式骨传导耳机
WO2017039039A1 (ko) * 2015-09-04 2017-03-09 재단법인 다차원 스마트 아이티 융합시스템 연구단 골전도 이어폰 장치 및 그 동작 방법
CN205864669U (zh) * 2016-06-12 2017-01-04 范伏清 具有语音识别功能的骨传导蓝牙耳机
CN205946101U (zh) * 2016-08-18 2017-02-08 深圳市八达晟电子有限公司 骨传导游戏助听蓝牙耳机装置
CN106792312A (zh) * 2016-12-26 2017-05-31 东莞产权交易中心 一种骨传导耳机
CN106604174A (zh) * 2017-02-28 2017-04-26 北京立施体育文化产业有限公司 一种骨传导耳机
CN109862491A (zh) * 2019-01-05 2019-06-07 深圳市韶音科技有限公司 骨传导扬声装置

Also Published As

Publication number Publication date
US20210168489A1 (en) 2021-06-03
US11800275B2 (en) 2023-10-24
US20220060811A1 (en) 2022-02-24
US20210385570A1 (en) 2021-12-09
US11659318B2 (en) 2023-05-23
CN109862491A (zh) 2019-06-07
US20220303665A1 (en) 2022-09-22
US20230082066A1 (en) 2023-03-16
CN114615603B (zh) 2023-11-24
WO2020140451A1 (zh) 2020-07-09
WO2020140446A1 (zh) 2020-07-09
US11109142B2 (en) 2021-08-31
WO2020140447A1 (zh) 2020-07-09
US11438689B2 (en) 2022-09-06
US20240048892A1 (en) 2024-02-08
WO2020140445A1 (zh) 2020-07-09
CN109862491B (zh) 2023-11-24
US20230388700A1 (en) 2023-11-30
US11197086B2 (en) 2021-12-07
CN114615603A (zh) 2022-06-10
CN117241182A (zh) 2023-12-15
US20210329365A1 (en) 2021-10-21
US20210076123A1 (en) 2021-03-11
US20210168488A1 (en) 2021-06-03
US11877116B2 (en) 2024-01-16

Similar Documents

Publication Publication Date Title
WO2020140448A1 (zh) 一种扬声器装置
US11592690B2 (en) Loudspeaker device
US20210072559A1 (en) Eyeglasses
WO2020140450A1 (zh) 一种扬声器装置
WO2020140452A1 (zh) 一种扬声器装置
US11272292B2 (en) Loudspeaker apparatus
US9253563B2 (en) Bone conduction speaker unit
WO2023236737A1 (zh) 一种骨传导耳机头及骨传导耳机
JP2021034775A (ja) イヤホン
TW201537996A (zh) 骨傳導喇叭單元
CN113949957A (zh) 骨传导耳机及骨传导耳机装配方法
CN112104936A (zh) 一种耳机
JP6534023B1 (ja) 骨伝導マイク
CN111491224A (zh) 降噪耳机的耳罩及头戴式降噪耳机
WO2021219052A1 (zh) 声学装置
JP2014165568A (ja) ヘッドセット
RU2800542C1 (ru) Акустические устройства
TW202023254A (zh) 會議電話
RU2793148C2 (ru) Очки
WO2022143279A1 (zh) 一种耳机
CN117729462A (zh) 一种电子设备
JP2009077116A (ja) 骨伝導送受話装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19906610

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19906610

Country of ref document: EP

Kind code of ref document: A1