WO2020136808A1 - 半導体素子構造 - Google Patents
半導体素子構造 Download PDFInfo
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- WO2020136808A1 WO2020136808A1 PCT/JP2018/048157 JP2018048157W WO2020136808A1 WO 2020136808 A1 WO2020136808 A1 WO 2020136808A1 JP 2018048157 W JP2018048157 W JP 2018048157W WO 2020136808 A1 WO2020136808 A1 WO 2020136808A1
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- 239000004065 semiconductor Substances 0.000 title claims description 30
- 239000002184 metal Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 54
- 230000004888 barrier function Effects 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 229910052720 vanadium Inorganic materials 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 abstract description 15
- 150000002367 halogens Chemical class 0.000 abstract description 15
- 230000007774 longterm Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 73
- 239000010408 film Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
- H01L29/454—Ohmic electrodes on AIII-BV compounds on thin film AIII-BV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
- H01L27/0733—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors in combination with capacitors only
Definitions
- This application relates to a semiconductor device structure.
- Patent Document 1 there is a method in which a barrier metal is provided between the AuSn solder and the Au that is the source electrode so that Au in the upper layer does not diffuse into the AuSn solder so that corrosion does not occur. It is disclosed.
- JP-A-2016-46306 (paragraph 0021, FIG. 4)
- the present application discloses a technique for solving the above problems, and an object thereof is to provide a semiconductor element structure capable of preventing corrosion due to a halogen gas and ensuring long-term reliability.
- a semiconductor device structure disclosed in the present application includes a SiC substrate having a GaN layer stacked on the surface thereof, a source electrode formed on the surface of the GaN layer, an MIM capacitor formed on the surface of the source electrode, and the SiC.
- a barrier metal layer having resistance to a halogen element is inserted in the source electrode, so that the penetration of the halogen element, particularly Br into the insulating film existing in the MIM capacitor can be suppressed for a long period of time. be able to.
- FIG. 3 is a cross-sectional view showing the structure of the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 7 is a cross-sectional view showing the method of manufacturing the semiconductor device structure according to the first embodiment.
- FIG. 1 is a sectional view showing the structure of the semiconductor device structure according to the first embodiment.
- the semiconductor device structure 101 includes a SiC substrate 1, a GaN layer 2 formed on the surface of the SiC substrate 1, an MIM capacitor 3 formed on the surface of the GaN layer 2, and an MIM structure of the MIM capacitor 3.
- the source electrode 4 includes the lower metal layer 30 and the via hole 5 reaching the source electrode 4 from the back surface of the SiC substrate 1.
- the MIM capacitor 3 is a thin film capacitor having a MIM (Metal-Insulator-Metal) structure in which an insulating film 32 is sandwiched between a lower metal layer 30 as a first metal layer and an upper metal layer 31 as a second metal layer. Yes, it is an intermediate insulating film for producing capacitance.
- the insulating film 32 is intended to secure the breakdown voltage, and is not particularly limited as long as it is a film classified as an insulating film such as SiN, SiO 2 , or SiON.
- the source electrode 4 is composed of a Ti layer 40 for adhering the GaN layer 2 and the MIM capacitor 3 to each other and for making ohmic contact, a barrier metal layer 42 for preventing entry of halogen, and an Au layer for preventing oxidation of the barrier metal layer 42. 41 and the metal layer 30 below the MIM capacitor 3.
- the material of the barrier metal layer 42 Cr or V having resistance to invasion of Br that deteriorates the insulating film 32 existing in the MIM capacitor 3 among the halogen elements is applied. Since the material of the barrier metal layer 42 is highly stressed, Cr is set to 500 nm or less and V is set to 300 nm or less so as not to give stress to the insulating film 32 of the MIM capacitor 3. In any case of Cr and V, there is no problem if the lower limit is equivalent to 10 atomic layers, but from the viewpoint of controllability of a vapor deposition apparatus and a sputtering apparatus at the time of film formation, 10 nm or more is a barrier. As is desirable in maintaining long-term reliability.
- the barrier metal layer 42 having resistance to the halogen element is inserted in the source electrode 4 including the metal layer 30 below the MIM capacitor 3, so that the insulating film 32 existing in the MIM capacitor 3 is formed.
- the invasion of halogen elements, especially Br, is suppressed for a long period of time.
- FIGS. 2 to 8. 2 to 8 are cross-sectional views showing the manufacturing process of the semiconductor device structure 101 according to the first embodiment.
- a Ti layer 40 as a source electrode, a barrier metal layer 42, and an Au layer 41 are provided on the surface of the GaN layer 2 of the SiC substrate 1 in which the GaN layer 2 is epitaxially grown as shown in FIG. Stack in sequence.
- the metal film formation in this step may be performed by any method such as sputtering or vapor deposition.
- the metal layer 30 below the MIM capacitor 3 is laminated on the surface of the laminated Au layer 41 to form the source electrode.
- the metal layer 30 below the MIM capacitor 3 is formed by vapor deposition or sputtering.
- the material of the metal layer 30 is not particularly limited. In some cases, the Au layer 41 may also serve as the metal layer 30.
- an insulating film 32 is formed on the surface of the stacked metal layers 30, and subsequently, as shown in FIG. 6, an upper metal layer is formed on the surface of the formed insulating film 32.
- 31 are stacked to form the MIM capacitor 3.
- the material of the metal layer 31 is not particularly limited. Au is mainly used.
- a via hole 12 reaching from the back surface side of the SiC substrate 1 to the back surface side of the source electrode 4 is formed by dry etching using SF 6 /O 2 gas.
- Ni, Cr or the like is used as an etching mask. This is because Ni and Cr have a very high selection ratio (Ni or Cr has an etching rate about 20 times slower) and dry etching resistance with respect to the conditions for etching the SiC substrate 1 and the GaN layer 2. is there.
- the depth of the hole 12 may be between the back surface of the Ti layer 40 and the back surface of the barrier metal layer 42, and the barrier metal layer 42 is not etched.
- the shape and size of the hole 12 are not particularly limited.
- a via hole 5 and a back surface electrode 5a are formed on the inside of the hole 12 and the back surface of the SiC substrate 1 by sputtering or vapor deposition. Sputtering is desirable from the aspect of coverage.
- AuSn is generally used as the material for the via hole 5 and the back electrode 5a, but AuGe or Au alone may be used.
- the SiC substrate 1 having the GaN layer 2 laminated on the surface, the source electrode 4 formed on the surface of the GaN layer 2, and the source electrode. 4 is provided with a MIM capacitor 3 formed on the front surface of the SiC substrate 1 and a via hole 5 reaching the source electrode 4 from the back surface of the SiC substrate 1.
- the source electrode 4 includes a barrier metal layer 42, and the bottom of the via hole 5 is the source. Since it is arranged between the back surface of the electrode 4 and the back surface of the barrier metal layer 42, a barrier metal layer having resistance to a halogen element is inserted in the source electrode, so that the insulating film existing in the MIM capacitor can be formed.
- the present invention is not limited to this. It may have a two-layer structure of a Cr layer and a V layer, or a mixed crystal layer of Cr and V.
- a chemical that reacts with Cr or V is used in the chemical treatment of acid or alkali in the wafer process after the opening of the via hole, any of the laminated structures is obtained.
- the stacking order of the Cr layer and the V layer is not particularly limited.
- it may have a three-layer structure of a Cr layer, a V layer and a Ni layer, or a mixed crystal layer of Cr, V and Ni.
- a Cr layer, a V layer and a Ni layer, or a mixed crystal layer of Cr, V and Ni may have a three-layer structure of a Cr layer, a V layer and a Ni layer, or a mixed crystal layer of Cr, V and Ni.
- the order of stacking the Cr layer, the V layer and the Ni layer is not particularly limited.
- the barrier metal used for the barrier metal layer 42 is not limited to the above types. Any metal having a halogen barrier property can be applied. At the same time, when forming an MIM structure and other electrodes or structures that may be deteriorated by a halogen element not directly under the source electrode but under the drain electrode, for example, it is imaginable that a similar barrier metal can be provided for protection. It's not difficult.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
図1は、実施の形態1における半導体素子構造の構成を示す断面図である。図1に示すように、半導体素子構造101は、SiC基板1、SiC基板1の表面に形成されたGaN層2、GaN層2の表面に形成されたMIMキャパシタ3、MIMキャパシタ3のMIM構造の下側の金属層30を含むソース電極4、SiC基板1の裏面からソース電極4に達するビアホール5から構成される。
Claims (10)
- 表面にGaN層が積層されたSiC基板と、
前記GaN層の表面に形成されたソース電極と、
前記ソース電極の表面に形成されたMIMキャパシタと、
前記SiC基板の裏面から前記ソース電極に達するビアホールと
を備え、
前記ソース電極には、バリアメタル層が含まれ、
前記ビアホールの底は、前記ソース電極の裏面から前記バリアメタル層の裏面の間にあることを特徴とする半導体素子構造。 - 前記バリアメタル層は、CrまたはVからなることを特徴とする請求項1に記載の半導体素子構造。
- 前記バリアメタル層は、Cr層とV層の二層からなることを特徴とする請求項1に記載の半導体素子構造。
- 前記バリアメタル層は、CrとVの混晶からなることを特徴とする請求項1に記載の半導体素子構造。
- 前記バリアメタル層は、Cr層、V層およびNi層の三層からなることを特徴とする請求項1に記載の半導体素子構造。
- 前記バリアメタル層は、Cr、VおよびNiの混晶からなることを特徴とする請求項1に記載の半導体素子構造。
- 前記MIMキャパシタは、前記ソース電極の表面に形成された第1の金属層と第2の金属層とで挟んだ絶縁膜であることを特徴とする請求項1から請求項6のいずれか1項に記載の半導体素子構造。
- 前記ソース電極は、前記GaN層の表面にTi層、前記バリアメタル層、Au層と順次積層されたことを特徴とする請求項7に記載の半導体素子構造。
- 前記ソース電極のAu層は、前記MIMキャパシタの第1の金属層を兼ねることを特徴とする請求項8に記載の半導体素子構造。
- 前記ソース電極の代わりに、ドレイン電極であることを特徴とする請求項1から請求項9のいずれか1項に記載の半導体素子構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2020562050A JP7076576B2 (ja) | 2018-12-27 | 2018-12-27 | 半導体素子構造 |
KR1020217017619A KR102600742B1 (ko) | 2018-12-27 | 2018-12-27 | 반도체 소자 구조 |
PCT/JP2018/048157 WO2020136808A1 (ja) | 2018-12-27 | 2018-12-27 | 半導体素子構造 |
US17/287,709 US11881516B2 (en) | 2018-12-27 | 2018-12-27 | Semiconductor element comprising a MIM capacitor and a via hole, a bottom of the via hole being placed between a rear surface of a source electrode and a rear surface of a barrier metal layer |
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PCT/JP2018/048157 WO2020136808A1 (ja) | 2018-12-27 | 2018-12-27 | 半導体素子構造 |
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JP (1) | JP7076576B2 (ja) |
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WO (1) | WO2020136808A1 (ja) |
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JP2001267331A (ja) * | 2000-03-15 | 2001-09-28 | Hitachi Ltd | 半導体装置の製造方法 |
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2018
- 2018-12-27 KR KR1020217017619A patent/KR102600742B1/ko active IP Right Grant
- 2018-12-27 JP JP2020562050A patent/JP7076576B2/ja active Active
- 2018-12-27 US US17/287,709 patent/US11881516B2/en active Active
- 2018-12-27 WO PCT/JP2018/048157 patent/WO2020136808A1/ja active Application Filing
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JPH04252038A (ja) * | 1991-01-28 | 1992-09-08 | Nec Yamagata Ltd | 半導体装置 |
JP2001267331A (ja) * | 2000-03-15 | 2001-09-28 | Hitachi Ltd | 半導体装置の製造方法 |
JP2008108840A (ja) * | 2006-10-24 | 2008-05-08 | Mitsubishi Electric Corp | 半導体装置 |
JP2011192836A (ja) * | 2010-03-15 | 2011-09-29 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2016046306A (ja) * | 2014-08-20 | 2016-04-04 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
JP2016131183A (ja) * | 2015-01-13 | 2016-07-21 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
WO2018173275A1 (ja) * | 2017-03-24 | 2018-09-27 | 三菱電機株式会社 | 半導体装置の製造方法および半導体装置 |
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JPWO2020136808A1 (ja) | 2021-09-30 |
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