WO2020133792A1 - 防静电的显示面板及制备方法 - Google Patents

防静电的显示面板及制备方法 Download PDF

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Publication number
WO2020133792A1
WO2020133792A1 PCT/CN2019/081836 CN2019081836W WO2020133792A1 WO 2020133792 A1 WO2020133792 A1 WO 2020133792A1 CN 2019081836 W CN2019081836 W CN 2019081836W WO 2020133792 A1 WO2020133792 A1 WO 2020133792A1
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Prior art keywords
cutting line
sub
display panel
circuit
electrostatic discharge
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PCT/CN2019/081836
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English (en)
French (fr)
Inventor
卢改平
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武汉华星光电技术有限公司
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Priority to US16/469,160 priority Critical patent/US20200401002A1/en
Publication of WO2020133792A1 publication Critical patent/WO2020133792A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/22—Antistatic materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present application relates to the field of display technology, in particular to an anti-static display panel and a preparation method.
  • the display screen needs to be cut from a large glass into a small display screen. Since a large amount of static electricity is easily generated during the cutting process, static electricity is easily introduced into the metal traces around the LCD panel and the display area to cause electrostatic damage to the device, which in turn causes display anomalies and greatly affects the product yield.
  • Existing COG chip on Glass, the chip is bound to the glass substrate
  • the product will be designed for electrostatic protection, but as the frame becomes smaller and smaller, so that the display area increases, the traditional electrostatic protection design cannot be placed.
  • the graphic design of the narrow border panel is away from the cutting line. It is closer, so the electrostatic protection for narrow frames needs to be strengthened.
  • the static protection design cannot be placed during the design of the narrow-frame panel. Static electricity can be easily introduced into the metal traces on the periphery of the display panel and the display area to cause electrostatic damage to the device, further affecting product quality.
  • This application provides an anti-static display panel and a preparation method, which can protect a narrow-frame display panel from electrostatic damage, so as to solve the existing display panel, because in the design process of the narrow-frame panel, the electrostatic protection design cannot be placed, static electricity It is easy to introduce the metal traces on the periphery of the display panel and the display area to cause electrostatic damage to the device, which further affects the technical problems of product quality.
  • the present application provides an anti-static display panel, which includes a display area, and a driver chip fixed on the surface of the flexible circuit board is bound to the lower edge of the display area;
  • the pin on the driving chip is electrically connected to an electrostatic discharge circuit, and the pin and the electrostatic discharge circuit form a closed loop.
  • the electrostatic discharge circuit is composed of two or more short-circuit bars and metal wires.
  • each short-circuit bar is electrically connected to the corresponding pin, and the second end of each short-circuit bar passes through the metal ⁇ Wire electrical connection.
  • the driving chip is arranged along the first direction D1
  • the short-circuit bar is arranged perpendicular to the first direction D1
  • the two adjacent short-circuit bars The distance between them is equal.
  • the pin includes a chip input pin and a chip output pin, the chip input pin is electrically connected to the corresponding short-circuit bar, and the chip The output pin is electrically connected to the corresponding short-circuit bar.
  • the present application also provides a method for preparing an anti-static display panel.
  • the method includes:
  • a TFT array substrate includes a display area, and a flexible circuit board is bound along a first direction D1 near a lower edge of the display area, and a driver is fixed on the flexible circuit board chip;
  • a cutting line surrounded by a rectangular frame is provided on the TFT array substrate, the cutting line passes through the electrostatic discharge circuit along the first direction D1, and is cut along the cutting line using a cutting machine In the TFT array substrate, the electrostatic discharge circuit is disconnected to obtain the anti-static display panel.
  • each short-circuit bar is electrically connected to the corresponding pin, and the second end of each short-circuit bar The metal wires are electrically connected.
  • the cutting line includes a first sub-cutting line, a second sub-cutting line, a third sub-cutting line, and a fourth sub-cutting line Cutting lines, the first sub-cutting line and the third sub-cutting line are arranged in parallel along the first direction D1, the second sub-cutting line and the fourth sub-cutting line are perpendicular to the The first direction D1 is arranged in parallel.
  • the third sub-cutting line passes through the short-circuit bar.
  • the present application also provides a method for preparing an anti-static display panel.
  • the method includes:
  • a TFT array substrate includes a display area, and a flexible circuit board is bound along a first direction D1 near a lower edge of the display area, and a driver is fixed on the flexible circuit board chip;
  • a cutting line surrounded by a rectangular frame is provided on the TFT array substrate, the cutting line passes through the electrostatic discharge circuit along the first direction D1, and is cut along the cutting line using a cutting machine In the TFT array substrate, the electrostatic discharge circuit is disconnected to obtain the anti-static display panel.
  • the cutting line includes a first sub-cutting line, a second sub-cutting line, a third sub-cutting line, and a fourth sub-cutting Line
  • the first sub-cutting line and the third sub-cutting line are arranged in parallel along the first direction D1
  • the second sub-cutting line and the fourth sub-cutting line are perpendicular to the first One direction D1 is arranged in parallel.
  • the third sub-cutting line passes through the short-circuit bar.
  • the beneficial effects of the present application are: the anti-static display panel and the preparation method provided by the present application, the pin on the driving chip and an electrostatic discharge circuit form a closed loop, which effectively protects the internal signal line of the narrow-frame display panel, further The risk of the display panel being damaged by static electricity is reduced, and the product yield is further improved.
  • FIG. 1 is a top view of an anti-static display panel of the present application.
  • FIG. 2 is an enlarged schematic view at A in FIG. 1.
  • FIG. 3 is a schematic diagram of the display panel of the anti-static display of this application.
  • FIG. 4 is a flow chart of a method for preparing an anti-static display panel of the present application.
  • 4A-4C are schematic diagrams of the preparation method of the anti-static display panel of the present application.
  • This application is directed to the existing narrow-frame display panel.
  • the electrostatic protection design cannot be placed. Static electricity can easily be introduced into the metal traces around the display panel and the display area to cause electrostatic damage to the device and further affect the product. This technical problem can be solved by this embodiment.
  • FIGS. 1 and 2 it is a plan view of an anti-static display panel of the present application.
  • the present application provides an anti-static display panel 10, which includes a display area 11, and a driving chip 13 fixed on the surface of the flexible circuit board 12 is bound to the lower edge of the display area 11;
  • the pin 131 on the driving chip 13 is electrically connected to an electrostatic discharge circuit 20, and the pin 131 and the electrostatic discharge circuit 20 form a closed loop.
  • the electrostatic discharge circuit 20 is composed of two or more short-circuit bars 21 and metal wires 22.
  • each short-circuit bar 21 is electrically connected to the corresponding pin 131, and the second end 212 of each short-circuit bar 21 is electrically connected through the metal wire 22.
  • the driving chip 13 is disposed along the first direction D1
  • the short-circuit bars 21 are disposed perpendicular to the first direction D1
  • the distance between two adjacent short-circuit bars 21 is equal.
  • the pin 131 includes a chip input pin and a chip output pin, the chip input pin is electrically connected to the corresponding short-circuit bar 21, and the chip output pin is connected to the corresponding short-circuit bar 21 Electrical connection.
  • FIG. 3 it is a schematic diagram of the display panel of the anti-static display of this application.
  • the cutting line 30 passes through the short-circuit bar 21 along the first direction D1.
  • the pins 131 of the driving chip 13 tend to attract static electricity; the pins 131 drain the attracted static electricity into the electrostatic discharge circuit 20.
  • the short-circuit bar 21 is cut off to disconnect the adjacent pins 131 to ensure the normal use of subsequent modules and effectively protect the internal signal lines of the narrow-frame display panel.
  • the present application also provides a flow of a method for preparing an anti-static display panel.
  • the method includes:
  • the TFT array substrate 40 includes a display area 41, and a flexible circuit board 42 is bound along a first direction D1 near a lower edge of the display area 41.
  • the flexible circuit The driver chip 43 is fixed on the board 42.
  • the S10 further includes:
  • a TFT array substrate 40 is provided.
  • the TFT array substrate 40 includes a display area 41.
  • the TFT array substrate 40, the driving chip 43 and the TFT array substrate 40 are moved along the first direction D1 near the lower edge of the display area 41.
  • the flexible circuit board 42 is bound, the flexible circuit board 42 is bound on the TFT array substrate 40 through an anisotropic conductive adhesive film, and the driving chip 43 is also bound through the anisotropic conductive adhesive film On the flexible circuit board.
  • the anisotropic conductive adhesive film is a semi-transparent polymer continuous material with three characteristics of adhesion, conduction, and insulation at the same time, which can provide fine pitch and high reliability cold interconnection.
  • the characteristic of the anisotropic conductive adhesive film is that the longitudinal direction (Z direction) is electrically conductive in the direction of the force, and it has obvious high impedance characteristics in the lateral plane (X, Y direction).
  • the main component of the anisotropic conductive adhesive is an adhesive doped with many conductive particles and has a film thickness of about several tens of microns, and a layer of base film is added for protection.
  • the conductive particles are nickel-plated and gold-plated plastic powder with a plastic ball in the center and nickel-gold plating on the outside.
  • anisotropic conductive adhesive film For the anisotropic conductive adhesive film to take effect, it must be hot pressed, that is, the three elements of temperature, time, and pressure make the anisotropic conductive adhesive film solidify, and the conductive particles blast to achieve the conduction effect, as shown in FIG. 4A Show.
  • S20 Provide an electrostatic discharge circuit, electrically connecting the pins on the driving chip with the electrostatic discharge circuit, so that the pins and the electrostatic discharge circuit form a closed loop.
  • the S20 further includes:
  • the electrostatic discharge circuit 50 is composed of two or more short-circuit bars 51 and metal wires 52; the first end 511 of each short-circuit bar 51 is electrically connected to the corresponding pin, and each of the short circuits The second end 512 of the rod 51 is electrically connected through the metal wire 52; the driving chip 43 is arranged along the first direction D1, the short-circuit rod 51 is arranged perpendicular to the first direction D1, the two adjacent ones The distances between the short-circuit bars 51 are equal; the pins include chip input pins and chip output pins, the chip input pins are electrically connected to the corresponding short-circuit bars 51, and the chip output pins are corresponding to the corresponding The shorting bar 51 is electrically connected; the pin on the driving chip 43 is electrically connected to the electrostatic discharge circuit 50 so that the pin and the electrostatic discharge circuit form a closed loop, as shown in FIG. 4B .
  • a rectangular frame-shaped cutting line 60 is provided on the TFT array substrate 40.
  • the cutting line 60 passes through the electrostatic discharge circuit 50 along the first direction D1.
  • the cutting line 60 cuts the TFT array substrate 40, and the electrostatic discharge circuit 50 is turned off to obtain the anti-static display panel.
  • the S30 further includes:
  • a rectangular frame-shaped cutting line 60 is provided on the TFT array substrate 40.
  • the cutting line 60 includes a first sub-cutting line 61, a second sub-cutting line 62, a third sub-cutting line 63, and a third Four sub-cutting lines 64, the first sub-cutting line 61 and the third sub-cutting line 63 are arranged in parallel along the first direction D1, the second sub-cutting line 62 and the fourth sub-cutting line 64 is arranged parallel to the first direction D1; the third sub-cutting line 63 passes through the short-circuit bar 51.
  • the pins of the driving chip 43 tend to attract static electricity; the pins drain the attracted static electricity into the electrostatic discharge circuit 50, and the The short-circuit bar 51 is cut off and the adjacent pins are disconnected to ensure the normal use of the subsequent modules, effectively protecting the signal line inside the narrow border display panel, as shown in FIG. 4C.
  • the anti-static display panel and the preparation method of the present application can increase the product's electrostatic protection capability when the frame is narrow.
  • the beneficial effects of the present application are: the anti-static display panel and the preparation method provided by the present application, the pin on the driving chip and an electrostatic discharge circuit form a closed loop, which effectively protects the internal signal line of the narrow-frame display panel, further The risk of the display panel being damaged by static electricity is reduced, and the product yield is further improved.

Abstract

一种防静电的显示面板及制备方法，包括显示区域，靠近所述显示区域的下方边缘处绑定有固定在柔性电路板表面的驱动芯片；其中，所述驱动芯片上的引脚与一静电释放电路电连接，所述引脚与所述静电释放电路组成一闭合回路。

Description

防静电的显示面板及制备方法 技术领域
本申请涉及显示技术领域，尤其涉及一种防静电的显示面板及制备方法。
 背景技术
目前随着移动显示技术向更高画质、更高精细程度、更轻薄和更低功耗发展，显示屏幕需要由大的玻璃切割成小的显示屏幕。由于在切割过程中极易产生大量静电，静电很容易导入液晶面板外围金属走线以及显示区域造成器件静电击伤，进而造成显示异常，大量影响产品良率。现有的COG(chip on Glass，芯片绑定在玻璃基板上)产品会进行静电防护设计，但是随着边框日趋缩小，以便可显示区增加，导致传统的静电防护设计无法摆放，窄边框面板图形设计距离切割线会更近，故对于窄边框的静电防护更需加强。
综上所述，现有的窄边框显示面板，由于在窄边框面板设计过程中，静电防护设计无法摆放，静电很容易导入显示面板外围的金属走线以及显示区域造成器件静电击伤，进一步影响产品品质。
 技术问题
现有的窄边框显示面板，在窄边框面板设计过程中因为静电防护设计无法摆放，静电很容易导入显示面板外围的金属走线以及显示区域造成器件静电击伤，进一步影响产品品质。
 技术解决方案
本申请提供一种防静电的显示面板及制备方法，能够保护窄边框显示面板免受静电损伤，以解决现有的显示面板，由于在窄边框面板设计过程中，静电防护设计无法摆放，静电很容易导入显示面板外围的金属走线以及显示区域造成器件静电击伤，进一步影响产品品质的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种防静电的显示面板，包括显示区域，靠近所述显示区域的下方边缘处绑定有固定在柔性电路板表面的驱动芯片；
其中，所述驱动芯片上的引脚与一静电释放电路电连接，所述引脚与所述静电释放电路组成一闭合回路。
在本申请实施例所提供的防静电的显示面板中申请，所述静电释放电路由两个或两个以上的短路棒以及金属线构成。
在本申请实施例所提供的防静电的显示面板中申请，每一所述短路棒的第一端与对应的所述引脚电连接，每一所述短路棒的第二端通过所述金属线电连接。
在本申请实施例所提供的防静电的显示面板中申请，所述驱动芯片沿着第一方向D1设置，所述短路棒垂直于所述第一方向D1设置，相邻的两所述短路棒之间的距离相等。
在本申请实施例所提供的防静电的显示面板中申请，所述引脚包括芯片输入引脚以及芯片输出引脚，所述芯片输入引脚与对应的所述短路棒电连接，所述芯片输出引脚与对应的所述短路棒电连接。
本申请还提供一种防静电的显示面板的制备方法，所述方法包括：
S10，提供一TFT阵列基板，所述TFT阵列基板包括显示区域，在靠近所述显示区域的下方边缘处上沿着第一方向D1绑定一柔性电路板，所述柔性电路板上固定有驱动芯片；
S20，提供一静电释放电路，将所述驱动芯片上的引脚与所述静电释放电路电连接，使所述引脚与所述静电释放电路组成一闭合回路，所述静电释放电路由两个或两个以上的短路棒以及金属线构成，所述短路棒垂直于所述第一方向D1设置，相邻的两所述短路棒之间的距离相等；
S30，在所述TFT阵列基板上设置一围成矩形框状的切割线，所述切割线沿着所述第一方向D1穿过所述静电释放电路，使用切割机沿着所述切割线切割所述TFT阵列基板，所述静电释放电路断开，得到所述防静电的显示面板。
申请在本申请实施例所提供的防静电的显示面板的制备方法中申请，每一所述短路棒的第一端与对应的所述引脚电连接，每一所述短路棒的第二端通过所述金属线电连接。
在本申请实施例所提供的防静电的显示面板的制备方法中申请，所述S30中，所述切割线包括第一子切割线、第二子切割线、第三子切割线以及第四子切割线，所述第一子切割线以及所述第三子切割线沿着所述第一方向D1平行设置，所述第二子切割线以及所述第四子切割线沿着垂直于所述第一方向D1平行设置。
在本申请实施例所提供的防静电的显示面板的制备方法中申请，所述第三子切割线穿过所述短路棒。
本申请又提供一种防静电的显示面板的制备方法，所述方法包括：
S10，提供一TFT阵列基板，所述TFT阵列基板包括显示区域，在靠近所述显示区域的下方边缘处上沿着第一方向D1绑定一柔性电路板，所述柔性电路板上固定有驱动芯片；
S20，提供一静电释放电路，将所述驱动芯片上的引脚与所述静电释放电路电连接，使所述引脚与所述静电释放电路组成一闭合回路；
S30，在所述TFT阵列基板上设置一围成矩形框状的切割线，所述切割线沿着所述第一方向D1穿过所述静电释放电路，使用切割机沿着所述切割线切割所述TFT阵列基板，所述静电释放电路断开，得到所述防静电的显示面板。
在本申请实施例所提供的防静电的显示面板的制备方法中，所述S30中，所述切割线包括第一子切割线、第二子切割线、第三子切割线以及第四子切割线，所述第一子切割线以及所述第三子切割线沿着所述第一方向D1平行设置，所述第二子切割线以及所述第四子切割线沿着垂直于所述第一方向D1平行设置。
在本申请实施例所提供的防静电的显示面板的制备方法中，所述第三子切割线穿过所述短路棒。
 有益效果
本申请的有益效果为：本申请所提供的防静电的显示面板及制备方法，将驱动芯片上的引脚与一静电释放电路组成一闭合回路，有效保护了窄边框显示面板内部信号线，进一步降低了显示面板被静电击伤的风险，更进一步提高了产品良率。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请防静电的显示面板的俯视图。
图2为图1中A处的放大示意图。
图3为本申请防静电的显示面板切割示意图。
图4为本申请防静电的显示面板的制备方法流程图。
图4A-图4C为本申请防静电的显示面板的制备方法示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的窄边框显示面板，由于在窄边框面板设计过程中，静电防护设计无法摆放，静电很容易导入显示面板外围的金属走线以及显示区域造成器件静电击伤，进一步影响产品品质的技术问题，本实施例能够解决该缺陷。
如图1以及图2所示，为本申请防静电的显示面板的俯视图。
具体地，本申请提供一种防静电的显示面板10，包括显示区域11，靠近所述显示区域11的下方边缘处绑定有固定在柔性电路板12表面的驱动芯片13；
其中，所述驱动芯片13上的引脚131与一静电释放电路20电连接，所述引脚131与所述静电释放电路20组成一闭合回路。
具体地，所述静电释放电路20由两个或两个以上的短路棒21以及金属线22构成。
具体地，每一所述短路棒21的第一端211与对应的所述引脚131电连接，每一所述短路棒21的第二端212通过所述金属线22电连接。
具体地，所述驱动芯片13沿着第一方向D1设置，所述短路棒21垂直于所述第一方向D1设置，相邻的两所述短路棒21之间的距离相等。
具体地，所述引脚131包括芯片输入引脚以及芯片输出引脚，所述芯片输入引脚与对应的所述短路棒21电连接，所述芯片输出引脚与对应的所述短路棒21电连接。
如图3所示，为本申请防静电的显示面板切割示意图。其中，切割线30沿着所述第一方向D1穿过所述短路棒21。
由于在切割过程中极易产生大量静电，所述驱动芯片13的所述引脚131易吸引静电；所述引脚131将吸引到的静电引流到所述静电释放电路20中，面板切割时将所述短路棒21切断，断开相邻的所述引脚131，以保证后续模组正常使用，有效保护了窄边框显示面板内部信号线。
如图4所示，本申请还提供一种防静电的显示面板的制备方法流程，所述方法包括：
S10，提供一TFT阵列基板40，所述TFT阵列基板40包括显示区域41，在靠近所述显示区域41的下方边缘处上沿着第一方向D1绑定一柔性电路板42，所述柔性电路板42上固定有驱动芯片43。
具体的，所述S10还包括：
首先，提供一TFT阵列基板40，所述TFT阵列基板40包括显示区域41，在靠近所述显示区域41的下方边缘处上沿着第一方向D1将所述TFT阵列基板40、驱动芯片43及柔性电路板42进行绑定，所述柔性电路板42通过异方性导电胶膜绑定在所述TFT阵列基板40上，而所述驱动芯片43也通过所述异方性导电胶膜绑定在所述柔性电路板上。
具体地，所述异方性导电胶膜是同时具有接着、导电、绝缘三大特性的半透明高分子接续材料，可以提供细间距，高可靠性冷互联。所述异方性导电胶膜的特点在于纵向（Z方向）受力方向电气导通，而在横向平面（X、Y方向）具有明显的高阻抗特性。所述异方性导电胶的主要成分为掺有许多导电粒子，膜厚在数十微米左右的黏合剂，作为保护作用还加了一层底膜。导电粒子为表面镀镍镀金的塑料粉末，中心为塑胶球，在外镀镍金。所述异方性导电胶膜要发生作用必须经过热压，即通过温度、时间、压力三个要素使得所述异方性导电胶膜胶固化，导电粒子爆破达到导通效果，如图4A所示。
S20，提供一静电释放电路，将所述驱动芯片上的引脚与所述静电释放电路电连接，使所述引脚与所述静电释放电路组成一闭合回路。
具体的，所述S20还包括：
所述静电释放电路50由两个或两个以上的短路棒51以及金属线52构成；每一所述短路棒51的第一端511与对应的所述引脚电连接，每一所述短路棒51的第二端512通过所述金属线52电连接；所述驱动芯片43沿着第一方向D1设置，所述短路棒51垂直于所述第一方向D1设置，相邻的两所述短路棒51之间的距离相等；所述引脚包括芯片输入引脚以及芯片输出引脚，所述芯片输入引脚与对应的所述短路棒51电连接，所述芯片输出引脚与对应的所述短路棒51电连接；所述驱动芯片43上的所述引脚与所述静电释放电路50电连接，使所述引脚与所述静电释放电路组成一闭合回路，如图4B所示。
S30，在所述TFT阵列基板40上设置一围成矩形框状的切割线60，所述切割线60沿着所述第一方向D1穿过所述静电释放电路50，使用切割机沿着所述切割线60切割所述TFT阵列基板40，所述静电释放电路50断开，得到所述防静电的显示面板。
具体的，所述S30还包括：
首先，在所述TFT阵列基板40上设置一围成矩形框状的切割线60，所述切割线60包括第一子切割线61、第二子切割线62、第三子切割线63以及第四子切割线64，所述第一子切割线61以及所述第三子切割线63沿着所述第一方向D1平行设置，所述第二子切割线62以及所述第四子切割线64沿着垂直于所述第一方向D1平行设置；所述第三子切割线63穿过所述短路棒51。由于在切割过程中极易产生大量静电，所述驱动芯片43的所述引脚易吸引静电；所述引脚将吸引到的静电引流到所述静电释放电路50中，面板切割时将所述短路棒51切断，断开相邻的所述引脚，以保证后续模组正常使用，有效保护了窄边框显示面板内部信号线，如图4C所示。
本申请的防静电的显示面板以及制备方法，能在边框边窄的情况下增加产品的静电防护能力。
本申请的有益效果为：本申请所提供的防静电的显示面板及制备方法，将驱动芯片上的引脚与一静电释放电路组成一闭合回路，有效保护了窄边框显示面板内部信号线，进一步降低了显示面板被静电击伤的风险，更进一步提高了产品良率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (12)

  1. 一种防静电的显示面板，其中，包括显示区域，靠近所述显示区域的下方边缘处绑定有固定在柔性电路板表面的驱动芯片；
    其中，所述驱动芯片上的引脚与一静电释放电路电连接，所述引脚与所述静电释放电路组成一闭合回路。
  2. 根据权利要求1所述的防静电的显示面板，其中，所述静电释放电路由两个或两个以上的短路棒以及金属线构成。
  3. 根据权利要求2所述的防静电的显示面板，其中，每一所述短路棒的第一端与对应的所述引脚电连接，每一所述短路棒的第二端通过所述金属线电连接。
  4. 根据权利要求2所述的防静电的显示面板，其中，所述驱动芯片沿着第一方向D1设置，所述短路棒垂直于所述第一方向D1设置，相邻的两所述短路棒之间的距离相等。
  5. 根据权利要求1所述的防静电的显示面板，所述引脚包括芯片输入引脚以及芯片输出引脚，所述芯片输入引脚与对应的所述短路棒电连接，所述芯片输出引脚与对应的所述短路棒电连接。
  6. 一种防静电的显示面板的制备方法，其中，所述方法包括：
    S10，提供一TFT阵列基板，所述TFT阵列基板包括显示区域，在靠近所述显示区域的下方边缘处上沿着第一方向D1绑定一柔性电路板，所述柔性电路板上固定有驱动芯片；
    S20，提供一静电释放电路，将所述驱动芯片上的引脚与所述静电释放电路电连接，使所述引脚与所述静电释放电路组成一闭合回路，所述静电释放电路由两个或两个以上的短路棒以及金属线构成，所述短路棒垂直于所述第一方向D1设置，相邻的两所述短路棒之间的距离相等；
    S30，在所述TFT阵列基板上设置一围成矩形框状的切割线，所述切割线沿着所述第一方向D1穿过所述静电释放电路，使用切割机沿着所述切割线切割所述TFT阵列基板，所述静电释放电路断开，得到所述防静电的显示面板。
  7. 根据权利要求6所述的防静电的显示面板的制备方法，其中，每一所述短路棒的第一端与对应的所述引脚电连接，每一所述短路棒的第二端通过所述金属线电连接。
  8. 根据权利要求6所述的防静电的显示面板的制备方法，其中，所述S30中，所述切割线包括第一子切割线、第二子切割线、第三子切割线以及第四子切割线，所述第一子切割线以及所述第三子切割线沿着所述第一方向D1平行设置，所述第二子切割线以及所述第四子切割线沿着垂直于所述第一方向D1平行设置。
  9. 根据权利要求8所述的防静电的显示面板的制备方法，其中，所述第三子切割线穿过所述短路棒。
  10. 一种防静电的显示面板的制备方法，其中，所述方法包括：
    S10，提供一TFT阵列基板，所述TFT阵列基板包括显示区域，在靠近所述显示区域的下方边缘处上沿着第一方向D1绑定一柔性电路板，所述柔性电路板上固定有驱动芯片；
    S20，提供一静电释放电路，将所述驱动芯片上的引脚与所述静电释放电路电连接，使所述引脚与所述静电释放电路组成一闭合回路；
    S30，在所述TFT阵列基板上设置一围成矩形框状的切割线，所述切割线沿着所述第一方向D1穿过所述静电释放电路，使用切割机沿着所述切割线切割所述TFT阵列基板，所述静电释放电路断开，得到所述防静电的显示面板。
  11. 根据权利要求10所述的防静电的显示面板的制备方法，其中，所述S30中，所述切割线包括第一子切割线、第二子切割线、第三子切割线以及第四子切割线，所述第一子切割线以及所述第三子切割线沿着所述第一方向D1平行设置，所述第二子切割线以及所述第四子切割线沿着垂直于所述第一方向D1平行设置。
  12. 根据权利要求10所述的防静电的显示面板的制备方法，其中，所述第三子切割线穿过所述短路棒。
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