WO2020124968A1 - 柔性衬底及其制备方法 - Google Patents

柔性衬底及其制备方法 Download PDF

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Publication number
WO2020124968A1
WO2020124968A1 PCT/CN2019/091276 CN2019091276W WO2020124968A1 WO 2020124968 A1 WO2020124968 A1 WO 2020124968A1 CN 2019091276 W CN2019091276 W CN 2019091276W WO 2020124968 A1 WO2020124968 A1 WO 2020124968A1
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Prior art keywords
inorganic
layer
polymer layer
protrusions
flexible substrate
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PCT/CN2019/091276
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English (en)
French (fr)
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张福阳
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武汉华星光电半导体显示技术有限公司
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Priority to US16/485,177 priority Critical patent/US20200198285A1/en
Publication of WO2020124968A1 publication Critical patent/WO2020124968A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the invention relates to the field of display devices, in particular to a flexible substrate and a preparation method thereof.
  • the technical problem to be solved by the present invention is to provide a flexible substrate and a preparation method thereof, which can improve the adhesion between the second polymer layer (organic) material and the inorganic material, and effectively avoid the subsequent manufacturing process of devices such as display panels Or it may happen that the second polymer layer is separated from the inorganic layer during the use of devices such as display panels.
  • the present invention provides a flexible substrate including a first polymer layer, an inorganic layer and a second polymer layer, the inorganic layer covering the first polymer layer, the The second polymer layer covers the inorganic layer, and the surface of the inorganic layer facing the second polymer layer has a plurality of inorganic protrusions embedded in the bottom of the second polymer layer,
  • the thickness of the first polymer layer is 5-15 ⁇ m
  • the thickness of the second polymer layer is 5-15 ⁇ m
  • the thickness of the inorganic layer is 50-1000 nm
  • the thickness of the inorganic protrusion The range is 50 ⁇ 1000nm.
  • the flexible substrate includes a central region and an edge region surrounding the central region.
  • the inorganic layer is provided with a plurality of surfaces facing the surface of the second polymer layer.
  • the inorganic protrusions are arranged in a plurality of arrays of the inorganic protrusions.
  • the surface of the inorganic layer facing the second polymer layer has at least one inorganic protrusion,
  • the inorganic protrusions form an annular structure surrounding the central area, and the inorganic protrusions of the central area are located inside the annular structure.
  • the spacing between the inorganic protrusions is less than or equal to 4 mm.
  • the thickness of the inorganic protrusion is smaller than the thickness of the inorganic layer.
  • the present invention also provides a flexible substrate including a first polymer layer, an inorganic layer and a second polymer layer, the inorganic layer covering the first polymer layer, the The second polymer layer covers the inorganic layer, and the surface of the inorganic layer facing the second polymer layer has a plurality of inorganic protrusions embedded in the bottom of the second polymer layer.
  • the flexible substrate includes a central region and an edge region surrounding the central region, in which the surface of the inorganic layer facing the second polymer layer is both There is at least one said inorganic protrusion.
  • the inorganic protrusions form a ring structure surrounding the central area, and the inorganic protrusions in the center area are located inside the ring structure.
  • a plurality of the inorganic protrusions are arranged in the central area, and a plurality of the inorganic protrusions are arranged in an array.
  • the spacing between the inorganic protrusions is less than or equal to 4 mm.
  • the thickness of the inorganic protrusion is smaller than the thickness of the inorganic layer.
  • the thickness range of the first polymer layer is 5-15 ⁇ m
  • the thickness range of the second polymer layer is 5-15 ⁇ m
  • the thickness range of the inorganic layer is 50-1000 nm.
  • the thickness of the inorganic protrusions ranges from 50 to 1000 nm.
  • the invention also provides a method for preparing the above flexible substrate, including the following steps: providing a support substrate; forming a first polymer layer on the support substrate; forming an inorganic on the first polymer layer A layer; forming a plurality of inorganic protrusions on the surface of the inorganic layer; covering the inorganic protrusions and the surface of the inorganic layer with a second polymer layer; removing the supporting substrate to form the flexible substrate.
  • a method of forming a plurality of inorganic protrusions on the surface of the inorganic layer is: forming an inorganic material layer on the surface of the inorganic layer; patterning the inorganic material layer to form the inorganic protrusions .
  • a method of forming a plurality of inorganic protrusions on the surface of the inorganic layer is: patterning the inorganic layer to form a plurality of inorganic protrusions on the surface of the inorganic layer.
  • the advantage of the present invention is that the protrusion of the inorganic substance is embedded in the bottom of the second polymer layer, which can improve the adhesion of the (organic) material of the second polymer layer and the inorganic material, effectively avoiding the subsequent process or display of devices such as display panels
  • the separation of the second polymer layer from the inorganic layer occurs during the use of devices such as panels; and the inorganic layer can effectively block water and oxygen from entering the substrate intermediate layer, improving the reliability of devices such as display panels.
  • FIG. 1 is a schematic diagram of the side structure of the flexible substrate of the present invention.
  • FIG. 2 is a schematic top view of the inorganic protrusions and the inorganic layer
  • 3A to 3F are flowcharts of an embodiment of a method for manufacturing a flexible substrate of the present invention.
  • FIG. 1 is a schematic diagram of the side structure of the flexible substrate of the present invention.
  • the flexible substrate of the present invention includes a first polymer layer 10, an inorganic layer 11 and a second polymer layer 12.
  • the inorganic layer 11 covers the first polymer layer 10, and the second polymer layer 12 covers the inorganic layer 11.
  • the first polymer layer 10 is a flexible layer, and the materials for making the first polymer layer 10 include but are not limited to PI (polyimide), PEI (polyetherimide), PPS (polyphenylene sulfide) ) And one or several combinations of PAR (polyarylate).
  • the thickness of the first polymer layer 10 is in the range of 5-15 ⁇ m. In other embodiments, the thickness of the first polymer layer 10 may be selected according to actual design.
  • the material of the inorganic layer 11 may be a conventional inorganic material, including but not limited to SiN x , SiO 2 , a-Si.
  • the thickness of the inorganic layer 11 may range from 50 to 1000 nm, and the thickness of the inorganic layer 11 may be selected according to actual design. For example, in this embodiment, the thickness of the inorganic layer 11 is 300 nm.
  • the inorganic layer 11 can effectively block water and oxygen from entering the flexible substrate.
  • the surface of the inorganic layer 11 facing the second polymer layer 12 has a plurality of inorganic protrusions 13.
  • the material of the inorganic protrusion 13 may be a conventional inorganic material, including but not limited to SiN x , SiO 2 , a-Si.
  • the thickness of the inorganic protrusion 13 may range from 50 to 1000 nm, and the thickness of the inorganic protrusion 13 may be selected according to actual design. For example, in this embodiment, the thickness of the inorganic protrusion 13 is 300 nm .
  • the material of the inorganic protrusion 13 and the inorganic layer 11 may be the same or different, which is not limited in the present invention.
  • a plurality of the inorganic protrusions 13 are independent of each other, and a part of the surface of the inorganic layer 11 is not covered by the inorganic protrusions 13.
  • the thickness of the inorganic protrusion 13 may be equal to or less than the thickness of the inorganic layer 11. In this embodiment, the thickness of the inorganic protrusion 13 may be equal to the thickness of the inorganic layer 11.
  • the inorganic protrusion 13 is embedded in the bottom of the second polymer layer 12, specifically, the second polymer layer 12 covers the surface of the inorganic protrusion 13 and the bare surface of the inorganic layer 11 .
  • the inorganic protrusions 13 are embedded in the bottom of the second polymer layer 12, which improves the adhesion between the second polymer layer 12 and the inorganic layer 11, and effectively avoids the subsequent manufacturing process of the display panel or the display panel In the process of using, the second polymer layer 12 and the inorganic layer 11 are separated.
  • FIG. 2 is a schematic plan view of the inorganic protrusion 13 and the inorganic layer 11. 1 and 2, the flexible substrate includes a central area A and an edge area B surrounding the central area A. Specifically, if the flexible substrate is used for a display panel, the center area A corresponds to the display area of the display panel, and the edge area B corresponds to the edge of the non-display area or the display area of the display panel.
  • the surface of the inorganic layer 11 facing the second polymer layer 12 has at least one inorganic protrusion 13, and the inorganic protrusion 13 is drawn by shading .
  • the arrangement rule of the inorganic protrusions 13 may be different.
  • the inorganic protrusions 13 form a ring structure surrounding the central region A, and the inorganic protrusions 13 of the central region A are located in the Inside the ring structure; the central area A is provided with a plurality of the inorganic protrusions 13 arranged in an array.
  • the array arrangement means that the inorganic protrusions 13 are arranged regularly in an array.
  • the plurality of inorganic substance protrusions 13 are arranged in a straight line in the lateral direction and the longitudinal direction.
  • the spacing between the inorganic protrusions 13 can be set according to actual conditions.
  • the spacing between the inorganic protrusions 13 is less than or equal to 4 mm to improve the inorganic protrusions 13 Adhesion to the second polymer layer 12.
  • the inorganic protrusion 13 in the central area A, is cylindrical, and the radius of the inorganic protrusion 13 is less than or equal to 2 mm.
  • the shape of the inorganic protrusion 13 includes but is not limited to a conventional shape such as a cylindrical shape and a conical shape.
  • the flexible substrate of the invention uses an inorganic layer to effectively block water and oxygen from entering the intermediate layer of the flexible substrate and improve the reliability of the screen. Its inorganic protrusions are embedded in the bottom of the second polymer layer, which improves the inorganic layer and the second polymer layer. The adhesion effectively prevents the separation of the second polymer layer and the inorganic layer in the subsequent process of manufacturing the display panel or during the use of the display panel.
  • the invention also provides a method for preparing the above flexible substrate.
  • 3A to 3F are flowcharts of an embodiment of a method for manufacturing a flexible substrate of the present invention.
  • the preparation method includes the following steps:
  • the supporting substrate 300 includes but is not limited to conventional structures such as glass substrates.
  • a first polymer layer 310 is formed on the supporting substrate 300.
  • the first polymer layer 310 is a flexible layer, and materials for making the first polymer layer 310 include but are not limited to PI (polyimide), PEI (polyetherimide), and PPS (polyphenylene sulfide) ) And one or several combinations of PAR (polyarylate).
  • the material of the first polymer layer 310 is PI.
  • a PI layer is coated on the support substrate 300 as the first polymer layer 310.
  • the thickness of the first polymer layer 310 ranges from 5 to 15 ⁇ m. For example, the thickness of the first polymer layer 310 is 10 ⁇ m.
  • an inorganic layer 320 is formed on the first polymer layer 310.
  • the material of the inorganic layer 320 may be a conventional inorganic material, including but not limited to SiN x , SiO 2 , a-Si.
  • the inorganic layer 320 is deposited on the first polymer layer 310 by a method such as vapor deposition.
  • the thickness of the inorganic layer 320 may range from 50 to 1000 nm, and the inorganic layer may be selected according to actual design 320 thickness. For example, in this embodiment, PECVD is used to form SiO 2 as the inorganic layer 320, and its thickness is 600 nm.
  • a plurality of inorganic protrusions 330 are formed on the surface of the inorganic layer 320.
  • the material of the inorganic protrusions 330 may be a conventional inorganic material, including but not limited to SiN x , SiO 2 , a-Si.
  • the thickness of the inorganic protrusion 330 may range from 50 to 1000 nm, and the thickness of the inorganic protrusion 330 may be selected according to actual design.
  • the material of the inorganic protrusions 330 and the inorganic layer 320 may be the same or different, which is not limited in the present invention.
  • the plurality of inorganic protrusions 330 are independent of each other, and a part of the surface of the inorganic layer 320 is not covered by the inorganic protrusions 330.
  • the thickness of the inorganic protrusion 330 may be equal to or less than the thickness of the inorganic layer 320.
  • the present invention provides two methods for forming the inorganic protrusions 330.
  • one method for forming a plurality of inorganic protrusions on the surface of the inorganic layer is: forming an inorganic material on the surface of the inorganic layer 320 Layer; pattern the inorganic material layer to form the inorganic protrusions 330.
  • Another method for forming a plurality of inorganic protrusions 330 on the surface of the inorganic layer 320 is to pattern the inorganic layer 320 to form a plurality of inorganic protrusions 330 on the surface of the inorganic layer 320.
  • an inorganic material layer is formed on the surface of the inorganic layer 320; the inorganic material layer is patterned to form the inorganic protrusion 330, specifically, on the inorganic layer 320
  • a-Si is made as an inorganic material layer by PECVD, the inorganic material layer is patterned, and the inorganic protrusions 330 are formed.
  • a surface of the inorganic protrusions 330 and the inorganic layer 320 is covered with a second polymer layer 340.
  • the second polymer layer 340 is a flexible layer, and materials for making the second polymer layer 340 include but are not limited to PI (polyimide), PEI (polyetherimide), and PPS (polyphenylene sulfide) ) And one or several combinations of PAR (polyarylate).
  • the material of the second polymer layer 340 is PI.
  • a surface of the inorganic protrusions 330 and the inorganic layer 320 is covered with a PI layer as the second polymer layer 340, and the second polymer layer 340 covers the inorganic protrusions 330
  • the exposed surface of the inorganic layer 320 and the exposed surface of the inorganic layer 320 form a structure in which the inorganic protrusions 330 are embedded in the bottom of the second polymer layer 340.
  • the thickness of the second polymer layer 340 ranges from 5 to 15 ⁇ m. For example, in this embodiment, the thickness of the second polymer layer 340 is 8 ⁇ m.
  • the supporting substrate 300 is removed to form the flexible substrate including the first polymer layer 310, the inorganic layer 320, the inorganic protrusions 330, and the second polymer layer 340.
  • This step is an optional step, and the supporting substrate 300 may be removed after the flexible substrate is combined with external components.
  • the support substrate 300 may be removed after the display panel is formed on the flexible substrate.

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Abstract

一种柔性衬底及其制备方法。柔性衬底包括第一聚合物层（10）、无机层（11）及第二聚合物层（12），其中无机层（11）覆盖第一聚合物层（10），第二聚合物层（12）覆盖无机层（11），无机层（11）朝向第二聚合物层（12）的表面具有多个无机物凸起（13），无机物凸起（13）嵌入第二聚合物层（12）的底部。通过无机物凸起（13）嵌入第二聚合物层（12）的底部，能够提高第二聚合物层（12）材料与无机层（11）材料的粘附力，有效避免后续制作工艺中或者使用过程中第二聚合物层（12）与无机层（11）分离情况的发生；且无机层（11）能够有效阻隔水氧进入衬底中间层，提高显示面板的可靠性。

Description

柔性衬底及其制备方法 技术领域
本发明涉及显示装置领域，尤其涉及一种柔性衬底及其制备方法。
 背景技术
近年来，显示面板的柔性化已经上升为各大手机、显示面板厂商追逐的技术创新点，可弯曲、可折叠、可卷曲甚至可任意变形的面板正逐渐从概念变为现实。与传统的硬式面板不同，柔性面板需要采用柔性的衬底以实现可弯曲、可折叠、可卷曲等特性。而目前比较成熟的技术是用聚合物、金属薄膜、纸板等材料制作柔性衬底，且聚合物材料以其平整度高、塑性好等特点受到青睐。
 技术问题
由于聚合物材料透水率高、耐高温性差等特点，若使用聚合物作为显示面板的衬底，则一般需要两层聚合物同时使用，且中间要使用无机材料（如SiO 2、SiN x等）作为水氧阻隔层。但是由于聚合物材料与无机材料的粘附力较差，这就容易造成在后续制作显示面板、或者显示面板的使用过程中，上层的聚合物材料与无机材料的发生分离，造成显示面板的损坏。
技术解决方案
本发明所要解决的技术问题是，提供一种柔性衬底及其制备方法，其能够提高第二聚合物层（有机）材料与无机材料粘附力，有效避免后续制作显示面板等器件的工艺中或者显示面板等器件的使用过程中所述第二聚合物层与无机层分离的情况发生。
为了解决上述问题，本发明提供了一种柔性衬底，其包括一第一聚合物层、一无机层及一第二聚合物层，所述无机层覆盖所述第一聚合物层，所述第二聚合物层覆盖所述无机层，所述无机层朝向所述第二聚合物层的表面具有多个无机物凸起，所述无机物凸起嵌入所述第二聚合物层的底部，所述第一聚合物层的厚度范围是5-15μm，所述第二聚合物层的厚度范围是5-15μm，所述无机层的厚度范围是50~1000nm，所述无机物凸起的厚度范围是50~1000nm，所述柔性衬底包括一中心区及包围所述中心区的一边缘区，在所述中心区，所述无机层朝向所述第二聚合物层的表面设置有多个所述无机物凸起，多个所述无机物凸起阵列排布，在所述边缘区，所述无机层朝向所述第二聚合物层的表面具有至少一所述无机物凸起，在所述边缘区，所述无机物凸起形成一包围所述中心区的环形结构，所述中心区的所述无机物凸起位于所述环形结构内部。
在一实施例中，在所述中心区，所述无机物凸起之间的间距小于或者等于4毫米。
在一实施例中，所述无机物凸起的厚度小于所述无机层的厚度。
为了解决上述问题，本发明还提供了一种柔性衬底，包括一第一聚合物层、一无机层及一第二聚合物层，所述无机层覆盖所述第一聚合物层，所述第二聚合物层覆盖所述无机层，所述无机层朝向所述第二聚合物层的表面具有多个无机物凸起，所述无机物凸起嵌入所述第二聚合物层的底部。
在一实施例中，所述柔性衬底包括一中心区及包围所述中心区的边缘区，在所述中心区及所述边缘区所述无机层朝向所述第二聚合物层的表面均具有至少一所述无机物凸起。
在一实施例中，在所述边缘区，所述无机物凸起形成一包围所述中心区的环形结构，所述中心区的所述无机物凸起位于所述环形结构内部。
在一实施例中，在所述中心区设置有多个所述无机物凸起，多个所述无机物凸起阵列排布。
在一实施例中，在所述中心区，所述无机物凸起之间的间距小于或者等于4毫米。
在一实施例中，所述无机物凸起的厚度小于所述无机层的厚度。
在一实施例中，所述第一聚合物层的厚度范围是5-15μm，所述第二聚合物层的厚度范围是5-15μm，所述无机层的厚度范围是50~1000nm，所述无机物凸起的厚度范围是50~1000nm。
本发明还提供一种上述的柔性衬底的制备方法，包括如下步骤：提供一支撑基板；在所述支撑基板上形成一第一聚合物层；在所述第一聚合物层上形成一无机层；在所述无机层表面形成多个无机物凸起；在所述无机物凸起及所述无机层表面覆盖一第二聚合物层；去除所述支撑基板，形成所述柔性衬底。
在一实施例中，在所述无机层表面形成多个无机物凸起的方法为：在所述无机层表面形成一无机材料层；图形化所述无机材料层，形成所述无机物凸起。
在一实施例中，在所述无机层表面形成多个无机物凸起的方法为：图形化所述无机层，以在所述无机层表面形成多个无机物凸起。
 有益效果
本发明的优点在于，无机物凸起嵌入第二聚合物层的底部，能够提高第二聚合物层（有机）材料与无机材料粘附力，有效避免后续制作显示面板等器件的工艺中或者显示面板等器件的使用过程中所述第二聚合物层与无机层分离的情况发生；且所述无机层能够有效阻隔水氧进入衬底中间层，提高显示面板等器件的可靠性。
 附图说明
图1是本发明柔性衬底的侧面结构示意图；
图2是所述无机物凸起及无机层的俯视示意图；
图3A~图3F是本发明柔性衬底的制备方法的一实施例的流程图。
 本发明的实施方式
下面结合附图对本发明提供的柔性衬底及其制备方法的具体实施方式做详细说明。
图1是本发明柔性衬底的侧面结构示意图。请参阅图1，本发明柔性衬底包括一第一聚合物层10、一无机层11及一第二聚合物层12。所述无机层11覆盖所述第一聚合物层10，所述第二聚合物层12覆盖所述无机层11。
所述第一聚合物层10为柔性层，制作所述第一聚合物层10的材料包括但不限于PI（聚酰亚胺）、PEI（聚醚酰亚胺）、PPS（聚苯硫醚）及PAR（聚芳酯）中的一种或几种的组合。其中，在本实施例中，所述第一聚合物层10的厚度范围是5-15μm，在其他实施例中，可根据实际设计选择所述第一聚合物层10的厚度。
所述无机层11的材料可以为常规的无机材料，包括但不限于SiN x、SiO 2、a-Si。所述无机层11的厚度范围可以为50~1000nm，可根据实际设计选择所述无机层11的厚度，例如，在本实施例中，所述无机层11的厚度为300纳米。在本发明柔性衬底中，所述无机层11能够有效地阻隔水氧进入柔性衬底内。
所述无机层11朝向所述第二聚合物层12的表面具有多个无机物凸起13。所述无机物凸起13的材料可以为常规的无机材料，包括但不限于SiN x、SiO 2、a-Si。所述无机物凸起13的厚度范围可以为50~1000nm，可根据实际设计选择所述无机物凸起13的厚度，例如，在本实施例中，所述无机物凸起13的厚度是300nm。所述无机物凸起13与所述无机层11的材料可以相同也可以不同，本发明对此不进行限定。多个所述无机物凸起13彼此独立，所述无机层11部分表面未被所述无机物凸起13覆盖。所述无机物凸起13的厚度可等于或者小于所述无机层11的厚度，在本实施例中，所述无机物凸起13的厚度可等于所述无机层11的厚度。
所述无机物凸起13嵌入所述第二聚合物层12的底部，具体地说，所述第二聚合物层12覆盖所述无机物凸起13的表面及所述无机层11裸露的表面。所述无机物凸起13嵌入所述第二聚合物层12的底部，提高了所述第二聚合物层12与无机层11的粘附力，有效避免后续制作显示面板的工艺中或者显示面板的使用过程中所述第二聚合物层12与无机层11分离的情况发生。
图2是所述无机物凸起13及无机层11的俯视示意图。请参阅图1及图2，所述柔性衬底包括一中心区A及包围所述中心区A的边缘区B。具体地说，若所述柔性衬底用于显示面板，则所述中心区A对应显示面板的显示区，所述边缘区B对应所述显示面板的非显示区或者显示区的边缘。
在所述中心区A及所述边缘区B，所述无机层11朝向所述第二聚合物层12表面均具有至少一所述无机物凸起13，所述无机物凸起13采用阴影绘制。其中，在所述中心区A及所述边缘区B，所述无机物凸起13的排列规律可以不同。例如，在本实施例中，在所述边缘区B，所述无机物凸起13形成一包围所述中心区A的环形结构，所述中心区A的所述无机物凸起13位于所述环形结构内部；所述中心区A设置有多个所述无机物凸起13，多个所述无机物凸起13阵列排布。所述阵列排布指的是无机物凸起13呈阵列式规律排布。具体地说，在本实施例中，多个所述无机物凸起13在横向及纵向均呈直线排布。
所述无机物凸起13之间的间距可根据实际情况设置，例如，在本实施例中，所述无机物凸起13之间的间距小于或者等于4毫米，以提高所述无机物凸起13与第二聚合物层12的粘附力。进一步，在一实施例中，在所述中心区A，所述无机物凸起13为圆柱形，所述无机物凸起13的半径小于或等于2毫米。所述无机物凸起13的形状包括但不限于柱形、锥形等常规的形状。
本发明柔性衬底利用无机层有效阻隔水氧进入柔性衬底中间层，提高屏幕的可靠性，其无机物凸起嵌入第二聚合物层的底部，提高了无机层与第二聚合物层的粘附力，有效避免后续制作显示面板的工艺中或者显示面板的使用过程中所述第二聚合物层与无机层分离的情况发生。
本发明还提供一种上述的柔性衬底的制备方法。图3A~图3F是本发明柔性衬底的制备方法的一实施例的流程图。所述制备方法包括如下步骤：
请参阅图3A，提供一支撑基板300。所述支撑基板300包括但不限于玻璃基板等常规结构。
请参阅图3B，在所述支撑基板300上形成一第一聚合物层310。所述第一聚合物层310为柔性层，制作所述第一聚合物层310的材料包括但不限于PI（聚酰亚胺）、PEI（聚醚酰亚胺）、PPS（聚苯硫醚）及PAR（聚芳酯）中的一种或几种的组合。在本实施例中，所述第一聚合物层310的材料为PI。具体地说，在所述支撑基板300上涂覆一层PI层作为所述第一聚合物层310。所述第一聚合物层310的厚度范围为5~15μm，例如，所述第一聚合物层310的厚度为10μm。
请参阅图3C，在所述第一聚合物层310上形成一无机层320。所述无机层320的材料可以为常规的无机材料，包括但不限于SiN x、SiO 2、a-Si。具体地说，采用气相沉积等方法在所述第一聚合物层310上沉积形成所述无机层320，所述无机层320的厚度范围可以为50~1000nm，可根据实际设计选择所述无机层320的厚度。例如，在本实施例中，利用PECVD制作SiO 2作为无机层320，其厚度为600nm。
请参阅图3D，在所述无机层320表面形成多个无机物凸起330。所述无机物凸起330的材料可以为常规的无机材料，包括但不限于SiN x、SiO 2、a-Si。所述无机物凸起330的厚度范围可以为50~1000nm，可根据实际设计选择所述无机物凸起330的厚度。所述无机物凸起330与所述无机层320的材料可以相同也可以不同，本发明对此不进行限定。多个所述无机物凸起330彼此独立，所述无机层320部分表面未被所述无机物凸起330覆盖。所述无机物凸起330的厚度可等于或者小于所述无机层320的厚度。
本发明提供两种形成所述无机物凸起330的方法，具体地说，在所述无机层表面形成多个无机物凸起的一种方法为：在所述无机层320表面形成一无机材料层；图形化所述无机材料层，形成所述无机物凸起330。在所述无机层320表面形成多个无机物凸起330的另一种方法为：图形化所述无机层320，以在所述无机层320表面形成多个无机物凸起330。在本实施例中，请参阅图3D，在所述无机层320表面形成一无机材料层；图形化所述无机材料层，形成所述无机物凸起330，具体地说，在无机物层320上，利用PECVD制作a-Si作为无机材料层，图形化所述无机材料层，形成所述无机物凸起330。
请参阅图3E，在所述无机物凸起330及所述无机层320表面覆盖一第二聚合物层340。所述第二聚合物层340为柔性层，制作所述第二聚合物层340的材料包括但不限于PI（聚酰亚胺）、PEI（聚醚酰亚胺）、PPS（聚苯硫醚）及PAR（聚芳酯）中的一种或几种的组合。在本实施例中，所述第二聚合物层340的材料为PI。具体地说，在所述无机物凸起330及所述无机层320表面覆盖一层PI层作为所述第二聚合物层340，所述第二聚合物层340覆盖所述无机物凸起330的表面及所述无机层320裸露的表面，形成所述无机物凸起330嵌入所述第二聚合物层340的底部的结构形式。所述第二聚合物层340的厚度范围为5~15μm，例如，在本实施例中，所述第二聚合物层340的厚度为8μm。
请参阅图3F，去除所述支撑基板300，形成所述包括第一聚合物层310、无机层320、无机物凸起330及第二聚合物层340的柔性衬底。该步骤为可选步骤，也可以在柔性衬底与外部部件结合后再去除所述支撑基板300。例如，若所述柔性衬底作为显示面板的衬底，则可以在所述柔性衬底上形成显示面板后再去除所述支撑基板300。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (13)

  1. 一种柔性衬底，其包括一第一聚合物层、一无机层及一第二聚合物层，所述无机层覆盖所述第一聚合物层，所述第二聚合物层覆盖所述无机层，所述无机层朝向所述第二聚合物层的表面具有多个无机物凸起，所述无机物凸起嵌入所述第二聚合物层的底部，所述第一聚合物层的厚度范围是5-15μm，所述第二聚合物层的厚度范围是5-15μm，所述无机层的厚度范围是50~1000nm，所述无机物凸起的厚度范围是50~1000nm，所述柔性衬底包括一中心区及包围所述中心区的一边缘区，在所述中心区，所述无机层朝向所述第二聚合物层的表面设置有多个所述无机物凸起，多个所述无机物凸起阵列排布，在所述边缘区，所述无机层朝向所述第二聚合物层的表面具有至少一所述无机物凸起，在所述边缘区，所述无机物凸起形成一包围所述中心区的环形结构，所述中心区的所述无机物凸起位于所述环形结构内部。
  2. 根据权利要求1所述的柔性衬底，其中在所述中心区，所述无机物凸起之间的间距小于或者等于4毫米。
  3. 根据权利要求1所述的柔性衬底，其中所述无机物凸起的厚度小于所述无机层的厚度。
  4. 一种柔性衬底，其包括一第一聚合物层、一无机层及一第二聚合物层，所述无机层覆盖所述第一聚合物层，所述第二聚合物层覆盖所述无机层，所述无机层朝向所述第二聚合物层的表面具有多个无机物凸起，所述无机物凸起嵌入所述第二聚合物层的底部。
  5. 根据权利要求4所述的柔性衬底，其中所述柔性衬底包括一中心区及包围所述中心区的边缘区，在所述中心区及所述边缘区所述无机层朝向所述第二聚合物层的表面均具有至少一所述无机物凸起。
  6. 根据权利要求5所述的柔性衬底，其中在所述边缘区，所述无机物凸起形成一包围所述中心区的环形结构，所述中心区的所述无机物凸起位于所述环形结构内部。
  7. 根据权利要求5所述的柔性衬底，其中在所述中心区设置有多个所述无机物凸起，多个所述无机物凸起阵列排布。
  8. 根据权利要求7所述的柔性衬底，其中在所述中心区，所述无机物凸起之间的间距小于或者等于4毫米。
  9. 根据权利要求4所述的柔性衬底，其中所述无机物凸起的厚度小于所述无机层的厚度。
  10. 根据权利要求4所述的柔性衬底，其中所述第一聚合物层的厚度范围是5-15μm，所述第二聚合物层的厚度范围是5-15μm，所述无机层的厚度范围是50~1000nm，所述无机物凸起的厚度范围是50~1000nm。
  11. 一种如权利要求4所述的柔性衬底的制备方法，其包括如下步骤：提供一支撑基板；在所述支撑基板上形成一第一聚合物层；在所述第一聚合物层上形成一无机层；在所述无机层表面形成多个无机物凸起；在所述无机物凸起及所述无机层表面覆盖一第二聚合物层；去除所述支撑基板，形成所述柔性衬底。
  12. 根据权利要求11所述的柔性衬底的制备方法，其中在所述无机层表面形成多个无机物凸起的方法为：在所述无机层表面形成一无机材料层；图形化所述无机材料层，形成所述无机物凸起。
  13. 根据权利要求11所述的柔性衬底的制备方法，其中在所述无机层表面形成多个无机物凸起的方法为：图形化所述无机层，以在所述无机层表面形成多个无机物凸起。
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