WO2020116397A1 - Moule de réplique pour empreinte et procédé de production correspondant - Google Patents

Moule de réplique pour empreinte et procédé de production correspondant Download PDF

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Publication number
WO2020116397A1
WO2020116397A1 PCT/JP2019/047048 JP2019047048W WO2020116397A1 WO 2020116397 A1 WO2020116397 A1 WO 2020116397A1 JP 2019047048 W JP2019047048 W JP 2019047048W WO 2020116397 A1 WO2020116397 A1 WO 2020116397A1
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component
mass
group
layer
meth
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PCT/JP2019/047048
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English (en)
Japanese (ja)
Inventor
淳平 小林
加藤　拓
偉大 長澤
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日産化学株式会社
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Priority to JP2020559182A priority Critical patent/JP7288247B2/ja
Publication of WO2020116397A1 publication Critical patent/WO2020116397A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Definitions

  • the present invention relates to a replica mold for imprint having a pattern. More specifically, it is a replica mold that retains high transparency in the ultraviolet region even if it is a thick film, and does not require recoating with a release agent and can form good patterns even when repeatedly used for optical imprinting.
  • the present invention relates to an imprint replica mold and a method for manufacturing the replica mold.
  • the term “thick film” refers to a film having a thickness of 0.01 mm or more and a maximum thickness of 2.0 mm.
  • Resin lenses are used in electronic devices such as mobile phones, digital cameras, and vehicle-mounted cameras, and are required to have excellent optical characteristics according to the purpose of the electronic devices. Further, the resin lens is required to have high durability, for example, heat resistance and weather resistance, and high productivity capable of being molded with a high yield, in accordance with the usage mode.
  • a thermoplastic transparent resin such as a polycarbonate resin, a cycloolefin polymer, or a methacrylic resin has been used.
  • wafers are manufactured from thermoplastic resin injection molding to pressing molding using a curable resin that is liquid at room temperature.
  • the transition to level molding is being actively studied.
  • wafer level molding a hybrid lens system in which a lens is formed on a support such as a glass substrate is generally used from the viewpoint of productivity.
  • the mold In the wafer level molding, the mold also needs to be molded at the wafer level.
  • a typical resin lens manufacturing mold is made by excavating and polishing metal, but at the wafer level it has a large number of lens patterns in the plane, and its in-plane error and pitch between pixels are accurate. Need to control. Therefore, it is very difficult to manufacture the mold and it is expensive. Further, when a metal mold is used, UV light used for curing the resin lens material does not pass therethrough, so that the material of the support on which the lens is molded is limited. Therefore, it is common to manufacture a replica mold using a master mold and a replica mold material, and perform wafer level molding using the replica mold. Among them, as described in Patent Document 1, a method of producing a replica mold by step-and-repeat molding in a wafer using a relatively inexpensive master mold for one pixel and a replica mold material has been developed. ing.
  • Japanese Patent No. 4226061 Japanese Patent Laid-Open No. 2009-172773
  • a commonly used replica mold has a low transmittance of UV light used in the manufacturing process of a resin lens, particularly a wavelength of 365 nm.
  • the present invention has been made in view of such circumstances, and an object thereof is to provide a replica mold having high transparency and capable of repeatedly molding a resin lens.
  • the present inventors have found that a cured product of a composition containing a compound having at least one radically polymerizable group in one molecule and a photoradical polymerization initiator.
  • a film comprising a cured product of a composition containing a compound having a radical polymerizable group at all terminals of a linear or chain molecular chain containing a fluorine atom and a photoradical polymerization initiator is adhered to the structure consisting of
  • the present invention has been accomplished. That is, the replica mold of the present invention has high transparency in the ultraviolet region and can repeatedly mold resin lenses.
  • the first aspect of the present invention is an imprint replica mold including the following layer A and the following layer B adhered to the layer A.
  • Layer A Structure (a1) component comprising a cured product of a composition containing the following (a1) component and (a2) component: Compound (a2) component having at least one radically polymerizable group in one molecule: the above ( a1) 0.01 mass% to 0.3 mass% of photoradical polymerization initiator B layer relative to 100 mass% of the component: a film composed of a cured product of a composition containing the following (b1) component and (b2) component ( Component b1): a compound having a linear or chain molecular chain containing a fluorine atom and having radically polymerizable groups at all terminals of the molecular chain (b2) component: 100% by mass of the component (b1) To 0.05 mass% to 15 mass% of photoradical polymerization initiator
  • the compound of the component (b1) is, for example, all of the linear or chain molecular chains containing a group represented by the following formula (1) and a group represented by the following formula (2a) or formula (2b). It is a polyfunctional (meth)acrylate compound having a group represented by the following formula (3) at the terminal via a urethane bond.
  • R 1 represents a perfluoroalkylene group having 1 or 2 carbon atoms
  • R 2a represents an alkylene group having 2 or 3 carbon atoms
  • R 2b is a trivalent carbon atom having 2 or 3 carbon atoms.
  • * represents a bond for bonding to the —O— group of the urethane bond
  • p and q represent the number of repeating groups of the formula (1) and the formula (2a), respectively.
  • R 3 represents a methyl group or a hydrogen atom.
  • Q which represents the repeating number of the group represented by the formula (2a), is, for example, an integer of 5 to 12.
  • the group represented by the formula (2a) is, for example, a poly(oxyethylene) group.
  • the group represented by the formula (1) is, for example, a group having both an oxyperfluoromethylene group and an oxyperfluoroethylene group.
  • the compound as the component (b1) is, for example, a macromonomer or polymer having a weight average molecular weight of 1,000 to 30,000.
  • composition containing the component (b1) and the component (b2) may further contain a photosensitizer.
  • the component (a1) contains at least two compounds
  • at least one compound of the two compounds is a compound having at least two (meth)acryloyloxy groups in one molecule.
  • the compound having at least two (meth)acryloyloxy groups in one molecule is, for example, a di(meth)acrylate compound represented by the following formula (4).
  • R 4 and R 5 each independently represent a hydrogen atom or a methyl group
  • R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms
  • R 8 and R 9 are each independently Represents a hydrogen atom or a methyl group
  • r 1 and r 2 each independently represent an integer of 1 to 5.
  • the layer A has, for example, a lens-shaped inverted pattern.
  • the maximum thickness of the A layer is, for example, 2.0 mm.
  • Another aspect of the present invention is the step of applying a composition containing a component (a1) and a component (a2) below onto a master mold, the master containing the composition containing a component (a1) and a component (a2) below.
  • a step of pressure-bonding a mold to a substrate exposing the composition containing the following component (a1) and component (a2) through the substrate while the master mold is pressure-bonded to the substrate, and photocuring the composition.
  • Step, after the photo-curing step a step of releasing the cured product obtained on the substrate from the master mold to form an A layer, and the following (b1) component to (b3) component on the A layer
  • a composition containing the following components (b1) to (b3) is baked at 40° C. to 200° C.
  • a method for producing an imprint replica mold which includes the steps of: Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1).
  • Component (b1) a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
  • Still another embodiment of the present invention is the step of applying a composition containing the following component (a1) and the component (a2) onto a substrate, the above-mentioned composition comprising the component (a1) and the component (a2).
  • a step of press-bonding the base material to the master mold exposing the composition containing the following component (a1) and component (a2) through the base material while pressing the master mold to the base material, and photocuring the composition.
  • the step of photo-curing the step of releasing the cured product obtained on the base material from the master mold to form an A layer, and the following components (b1) to (b3) on the A layer.
  • a step of applying a composition containing the components, and a composition containing the components (b1) to (b3) below is baked at 40° C.
  • the method for producing an imprint replica mold including the step of: Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1).
  • Component (b1) a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
  • the replica mold for imprint of the present invention is a cured product of a composition containing the component (b1) and the component (b2) in a structure composed of the cured product of the composition containing the component (a1) and the component (a2). Since the film made of is adhered, even a thick film has high transparency and continuous transfer is possible.
  • the imprint replica mold of the present invention can be produced on any base material, and the replica mold formed on the base material has high transparency even in a thick film in the ultraviolet region. Therefore, the replica mold for imprinting of the present invention can be suitably used for manufacturing an optical member such as a solid-state imaging device and a lens for a sensor, which is required to have a high shape accuracy.
  • the component (a1) is a compound having at least one radically polymerizable group in one molecule.
  • the radically polymerizable group include a (meth)acryloyloxy group.
  • the (meth)acryloyloxy group means both an acryloyloxy group and a methacryloyloxy group.
  • (meth)acrylate means both acrylate and methacrylate.
  • Examples of the compound as the component (a1) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate and isobutyl (meth).
  • the compound of the component (a1) is available as a commercial product, and specific examples thereof include light ester M, the same E, the same NB, the same IB, the same TB, the same EH, the same IB-X and the same CH, Light acrylate IB-XA (manufactured by Kyoeisha Chemical Co., Ltd.), NOAA, IOAA, INAA, LA, STA, ISTA, IBXA, VISCOAT #155, 1-ADA, 1-ADMA, VISCOAT #150, MEDOL-10 , CHDOL-10, OXE-10, OXE-30, GBLA, GBLMA, viscoat #195, viscoat #230, viscoat #260, viscoat #295, viscoat #300, viscoat #400, viscoat #360 (above, Osaka Organic Chemistry) Industrial, Ltd.), LA, LMA, A-MS, AS, S-1800A, A-BH, AM-30G, AM-90G, AM-130G, AM-230G, AM-30PG, M-20
  • A-DCP, DCP A-TMPT, A-TMPT-3EO, A-TMPT-9EO, AT-20E, AT-30E, A-TMPT-3PO, A-TMPT-6O, TMPT, TMPT-3EO, TMPT -9EO, TMPT-3PO, A-GLY-3E, A-GLY-6E, A-GLY-9E, A-GLY-20E, A-GLY-3P, A-GLY-6P, A-GLY-9P, GLY -3E, GLY-6E, GLY-9E, GLY-20E, A-9300, A-9200, A-9300-1CL, A-9300-3CL, A-TMM-3, A-TMM-3L, A-TMM -3LM-N, ATM-4EL, ATM-8EL, ATM-4PL, TM-4EL, TM-4PL, A-TMMT, ATM-4E, ATM-35E, ATM-4P, ATM-10P, TM-4E, TM -35E, TM-4P, TM -10P, AD
  • Component (a2) The photoradical polymerization initiator of the component (a2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer A of the replica mold for imprint of the present invention. Not a thing.
  • radical photopolymerization initiator of the component (a2) examples include tert-butylperoxy-iso-butyrate, 2,5-dimethyl-2,5-bis(benzoyldioxy)hexane and 1,4-bis[ ⁇ - (Tert-Butyldioxy)-iso-propoxy]benzene, di-tert-butylperoxide, 2,5-dimethyl-2,5-bis(tert-butyldioxy)hexene hydroperoxide, ⁇ -(iso-propylphenyl)-iso- Propyl hydroperoxide, tert-butyl hydroperoxide, 1,1-bis(tert-butyldioxy)-3,3,5-trimethylcyclohexane, butyl-4,4-bis(tert-butyldioxy)valerate, cyclohexanone peroxide, 2,2 ',5,5'-Tetra(tert-butylperoxy
  • the photoradical polymerization initiator of the component (a2) is available as a commercial product, and specific examples thereof include IRGACURE (registered trademark) 651, 184, 500, 2959, 127, 754, 907, 369, 379, 379EG, 819, 819DW, 1800, 1870, 784, OXE01, OXE02, 250, 1173, MBF, 4265, TPO (above, BASF Japan Ltd.), KAYACURE (registered trademark) DETX, MBP, DMBI, EPA, OA (Nippon Kayaku Co., Ltd.), VICURE-10, 55 (above, STAUFFER Co.).
  • IRGACURE registered trademark
  • the component (a2) may be used alone, or two or more kinds may be mixed and used.
  • the content ratio of the photo radical polymerization initiator of the component (a2) is 0.01% by mass to 0.3% by mass with respect to 100% by mass of the component (a1).
  • the component (b1) is a compound having a radically polymerizable group at every end of a linear or chain molecular chain containing a fluorine atom.
  • Examples of the radically polymerizable group include a (meth)acryloyloxy group.
  • Examples of the compound as the component (b1) include 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3,3-pentafluoropropyl (meth)acrylate, and 2-(perfluorobutyl).
  • the above compounds are available as commercial products, and specific examples thereof include 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3,3,3- Pentafluoropropyl acrylate, 2,2,3,3,3-pentafluoropropyl methacrylate, 2-(perfluorobutyl)ethyl acrylate, 2-(perfluorobutyl)ethyl methacrylate, 3-(perfluorobutyl)- 2-hydroxypropyl acrylate, 3-(perfluorobutyl)-2-hydroxypropyl methacrylate, 2-(perfluorohexyl)ethyl acrylate, 2-(perfluorohexyl)ethyl methacrylate, 3-perfluorohexyl-2- Hydroxypropyl acrylate, 3-perfluorohexyl-2-hydroxypropyl methacrylate, 3-(perfluoro-3-methylbutyl)
  • the component (b1) has urethane groups at all terminals of a linear or chain molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b). It may be a polyfunctional (meth)acrylate compound having a polymerizable group containing a group represented by the formula (3), that is, a (meth)acryloyloxy group, through a bond.
  • the polyfunctional (meth)acrylate compound is a bifunctional or higher functional acrylate compound or methacrylate compound excluding the monofunctional (meth)acrylate compound.
  • the urethane bond means a structure represented by —NH—C( ⁇ O)—O—.
  • the polyfunctional (meth)acrylate compound has two or four urethane bonds and two or four polymerizable groups containing a (meth)acryloyloxy group in one molecule.
  • the group represented by the formula (1) may be referred to as a poly(oxyperfluoroalkylene) group, and the group represented by the formula (2a) may be referred to as a poly(oxyalkylene) group.
  • the linear or chain molecular chain is not particularly limited as long as it is a molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b).
  • the bonding order of the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) is not particularly limited, and The number is not particularly limited.
  • the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) may be bonded by a single bond (direct bond). Alternatively, they may be bonded via a structure (linking group) such as an alkylene group having 1 to 3 carbon atoms, a perfluoroalkylene group having 1 to 3 carbon atoms, or a combination thereof.
  • the number of carbon atoms of R 1 of the oxyperfluoroalkylene group: —(O—R 1 )— in the group represented by the formula (1) is 1 or 2. That is, the group represented by the formula (1) has a structure in which a divalent fluorocarbon group having 1 or 2 carbon atoms and an oxygen atom are alternately linked, and the oxyperfluoroalkylene group has a carbon atom number. It has a structure in which a monovalent or divalent divalent fluorocarbon group and an oxygen atom are linked.
  • the oxyperfluoroalkylene group examples include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoroethylene group).
  • the oxyperfluoroalkylene group one of -(OCF 2 )- and -(OCF 2 CF 2 )- may be used alone, or two types may be used in combination. When two types are used in combination, the bond of —(OCF 2 )— and —(OCF 2 CF 2 )— may be either a block bond or a random bond.
  • the groups represented by the formula (1) include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoro). It is preferable to use a group having both of (ethylene group).
  • These bonds may be block bonds or random bonds.
  • the repeating number p of the group represented by the formula (1) is an integer of 2 or more, preferably in the range of 5 to 30, and more preferably in the range of 7 to 21.
  • the weight average molecular weight (Mw) measured by gel permeation chromatography of the group represented by the formula (1) is 1,000 to 5,000, preferably 1,500 to 3,000. is there.
  • the number of carbon atoms of R 2 of the oxyalkylene group: —(O—R 2 )— in the group represented by the formula (2a) is 2 or 3. That is, the group represented by the formula (2a) has a structure in which an alkylene group having 2 or 3 carbon atoms and an oxygen atom are alternately linked, and an oxyalkylene group is an alkylene group having 2 or 3 carbon atoms. It has a structure in which oxygen atoms are linked. Examples of the oxyalkylene group include an oxyethylene group, an oxypropylene group, and an oxytrimethylene group.
  • the above oxyalkylene groups may be used alone or in combination of two or more. When two or more oxyalkylene groups are used in combination, the bonds of the two or more oxyalkylene groups may be either block bonds or random bonds.
  • the group represented by the formula (2a) is, for example, a poly(oxyethylene) group.
  • the repeating number q of the group represented by the formula (2a) is an integer of 2 or more, for example, in the range of 2 to 15, preferably in the range of 2 to 12, or in the range of 5 to 12, or in the range of 7 to 12. The range is.
  • the trivalent hydrocarbon group R 2b in the group represented by the formula (2b) has 2 or 3 carbon atoms. That is, the group represented by the formula (2b) is a trivalent group obtained by removing one hydrogen atom from an arbitrary carbon atom of an alkylene group having 2 or 3 carbon atoms (an alkylene group having 2 or 3 carbon atoms).
  • the group) has a structure in which one oxygen atom is linked.
  • a group in which one oxygen atom is linked to the 1-position (or 3-position) of the 1,2,3-propanetriyl group is preferable.
  • the polymerizable group containing a (meth)acryloyloxy group is not limited to having one (meth)acryloyloxy group, and may have two or more.
  • Examples of the polymerizable group containing a (meth)acryloyloxy group include structures (terminal groups) represented by the following formulas [X1] to [X5], and acryloyloxy groups in these structures (terminal groups). And a structure in which is substituted with a methacryloyloxy group.
  • the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group
  • the following structural formula (A- Preferred examples are the compound represented by 1), the compound represented by (A-2) and the compound represented by (A-3), and the compound in which the acryloyloxy group in these compounds is substituted with a methacryloyloxy group.
  • two X's or four X's each represent one of the structures (terminal groups) represented by the above formulas [X1] to [X5], and PFPE is poly(oxyperfluoro).
  • Alkylene) group, q 1 and q 2 each independently represent the number of oxyethylene groups, for example, an integer of 2 to 15, preferably an integer of 2 to 12, or an integer of 5 to 12, Alternatively, it represents an integer of 7 to 12.
  • the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group
  • the polymerizable group containing the (meth)acryloyloxy group is (meth)acryloyloxy.
  • the structure (terminal group) represented by the above formulas [X3] to [X5] is preferable, which has two or more groups.
  • the component (b1) may be used alone or in combination of two or more.
  • the component (b1) is preferably 0.1% by mass based on 100% by mass of the total amount of the component (b1) and the components (b2), (b3) described below and other additives which are optional components. It is desirable to use it in an amount of 10 to 10% by mass, more preferably 0.5 to 8% by mass.
  • the component (b1) is, for example, represented by the formula (2a) or the formula (2b), which is directly bonded to both ends of the group represented by the formula (1) or bonded via the linking group.
  • a compound having at least two hydroxy groups via the group described above, 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis((meth)acryloyloxymethyl)ethyl with respect to the at least two hydroxy groups It can be obtained by a method of subjecting an isocyanate compound having a (meth)acryloyloxy group such as isocyanate to a urethanization reaction.
  • the component (b1) has a weight average molecular weight (Mw) measured by gel permeation chromatography in terms of polystyrene of 1,500 to 7,000, preferably 2,000 to 6,000.
  • composition for forming the layer B of the replica mold for imprinting of the present invention is, in addition to the component (b1), a group represented by the formula (1) and the formula (2a) or the formula (2b). Having a polymerizable group containing a (meth)acryloyloxy group through a urethane bond only at a part of the terminal of a linear or chain molecular chain containing a group represented by A compound having a hydroxy group at the other end of its molecular chain (that is, a compound having no polymerizable group at the other end) may be contained.
  • the composition for forming the B layer further comprises a linear or chain molecular chain containing a group represented by the formula (1) and a group represented by the formula (2a) or the formula (2b).
  • a compound having a hydroxy group at all terminals, that is, a compound not having the above-mentioned polymerizable group may be contained.
  • the composition for forming the B layer may be referred to as a release agent.
  • the photoradical polymerization initiator of the component (b2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer B of the replica mold for imprint of the present invention. Not a thing.
  • Examples of the component (b2) include the same radical photopolymerization initiator as the component (a2).
  • the component (b2) may be used alone or in combination of two or more.
  • the content ratio of the photo radical polymerization initiator of the component (b2) is 0.05% by mass to 15% by mass based on 100% by mass of the component (b1).
  • Component (b3) The solvent which is the component (b3) plays a role of adjusting the viscosity of the component (b1) and the component (b2), and can adjust the viscosity of the component (b1) and the component (b2). It is not particularly limited.
  • the component (b3) is removed in the step of forming the B layer.
  • solvent examples include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether.
  • the solvent which is the component (b3) is available as a commercial product, and specific examples thereof include Novec (registered trademark) 7000, 7100, 7200, and 7300 (above, manufactured by 3M Japan Co., Ltd.). , ASAHIKLIN (registered trademark) AE-3000, AE-3100E (above, manufactured by AGC Corporation), Vertrel (registered trademark) XF, XF-UP, XE-XP, X-E10, X- P10, X-D, X-GY, MCA, SDG, SMT, SFR, DC, Cinera, Supraion, Psion (Mitsui DuPont Fluorochemical Co., Ltd.) Can be mentioned.
  • the component (b3) may be used alone or in combination of two or more.
  • the composition for forming the layer A of the replica mold for imprints of the present invention may contain a solvent, if necessary.
  • the composition for forming the A layer and the composition for forming the B layer may contain a surfactant, a chain transfer agent, and a photosensitizer, if necessary, as long as the effects of the present invention are not impaired.
  • Sensitizers may be included.
  • solvent examples include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether.
  • surfactant examples include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, and other polyoxyethylene alkyl ethers, polyoxyethylene octylphenyl ether, polyoxyethylene.
  • Polyoxyethylene alkylaryl ethers such as ethylene nonylphenyl ether, polyoxyethylene/polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate, etc.
  • Examples include nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters.
  • the above-mentioned surfactant is available as a commercial product, and specific examples thereof include Ftop (registered trademark) EF301, EF303, EF352 (above, manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Megafac ( (Registered trademark) F-171, F-173, F-477, F-486, F-554, F-556, R-08, R-30, R-30N, R- 40, same R-40-LM, same RS-56, same RS-75, same RS-72-K, same RS-76-E, same RS-76-NS, same RS-78, same RS-90 ( As above, DIC Corporation's product, Florade FC430, the same FC431 (above, 3M Japan's product), Asahi Guard (registered trademark) AG710, Surflon (registered trademark) S-382, the same SC101, the same SC102, the same SC103.
  • Ftop registered trademark
  • EF303 EF352
  • the above surfactants may be used alone or in combination of two or more.
  • the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 10% by mass is preferable.
  • chain transfer agent examples include thiol compounds such as methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, and n-mercaptopropionate.
  • This chain transfer agent can be used alone or in combination of two or more.
  • the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 20% by mass is preferable.
  • Examples of the photosensitizer include thioxanthene type, thioxanthone type, xanthene type, ketone type, thiopyrylium salt type, base styryl type, merocyanine type, 3-substituted coumarin type, 3,4-substituted coumarin type, cyanine type , Acridine-based, thiazine-based, phenothiazine-based, anthracene-based, coronene-based, benzanthracene-based, perylene-based, ketocoumarin-based, coumarin-based, and borate-based.
  • the photosensitizer is commercially available, and specific examples thereof include Anthracure (registered trademark) UVS-581, UVS-1331 (all manufactured by Kawasaki Kasei Kogyo Co., Ltd.), and KAYACURE (trade name). Registered trademark) DETX-S (manufactured by Nippon Kayaku Co., Ltd.).
  • This photosensitizer can be used alone or in combination of two or more.
  • the absorption wavelength in the UV region can be adjusted by using the above-mentioned photosensitizer.
  • the content ratio is 100 mass of the component (a1) or the component (b1). %, for example, 0.01% by mass to 10% by mass, preferably 0.05% by mass to 5% by mass.
  • the method for preparing the composition for forming the A layer and the composition for forming the B layer of the replica mold for imprint of the present invention is not particularly limited.
  • the component (a1), the component (a2), and other additives as necessary may be mixed so that the composition is in a uniform state. ..
  • the component (b1), the component (b2), the component (b3) and, if necessary, other additives are mixed to obtain a uniform composition. It should be.
  • the order of mixing the respective components of the composition for forming the A layer and the composition for forming the B layer is not particularly limited as long as a uniform composition can be obtained, and is not particularly limited.
  • the replica mold for imprint of the present invention can be obtained by forming the A layer by photoimprinting and then forming the B layer on the A layer by photocuring.
  • the layer A of the replica mold for imprint of the present invention is obtained by applying a composition containing the above-mentioned components (a1) and (a2) onto a base material or a master mold, and bonding the base material and the master mold together. Then, the desired structure can be obtained by photo-curing and releasing.
  • the method of applying the composition containing the component (a1) and the component (a2) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, a spray method, a bar coating method. Method, gravure coating method, slit coating method, roll coating method, transfer printing method, brush coating, blade coating method, and air knife coating method.
  • Examples of the base material on which the layer A of the imprint replica mold of the present invention is formed include silicon, glass (ITO substrate) on which indium tin oxide (ITO) is formed, and silicon nitride (SiN). Film-formed glass (SiN substrate), indium zinc oxide (IZO) film-formed glass, polyethylene terephthalate (PET), triacetyl cellulose (TAC), acrylic, plastic, glass, quartz, ceramics, etc. Can be mentioned.
  • a flexible base material having flexibility for example, triacetyl cellulose, polyethylene terephthalate, polymethyl methacrylate, cycloolefin (co)polymer, polyvinyl alcohol, polycarbonate, polystyrene, polyimide, polyamide, polyolefin, polypropylene, polyethylene, polyethylene. It is also possible to use a base material composed of naphthalate, polyether sulfone, and a copolymer obtained by combining these polymers.
  • the light source to be photo-cured to form the A layer of the replica mold for imprint of the present invention is not particularly limited, but examples thereof include a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, and an ArF. Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED).
  • the wavelength of the light source generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used.
  • the exposure amount is preferably, 30 mJ / cm 2 to 10000 mJ / cm 2, more preferably at 100 mJ / cm 2 to 8000 mJ / cm 2.
  • the composition for forming the layer A contains a solvent
  • at least one of the coating film before light irradiation and the photocured product obtained after light irradiation is used for the purpose of evaporating the solvent.
  • a baking step may be added.
  • the equipment used in the baking step is not particularly limited, and for example, baking is performed using a hot plate, an oven, a furnace in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or a vacuum. Anything can be used.
  • the baking temperature is not particularly limited as long as it can achieve the purpose of evaporating the solvent, but for example, it can be performed at 40°C to 200°C.
  • the apparatus for performing the optical imprint is not particularly limited as long as the target pattern is obtained, but examples thereof include ST50 manufactured by Toshiba Machine Co., Ltd., Sindre (registered trademark) 60 manufactured by Obducat, and NM manufactured by Meisho Kiko Co., Ltd.
  • ST50 manufactured by Toshiba Machine Co., Ltd.
  • Sindre registered trademark
  • NM manufactured by Meisho Kiko Co., Ltd.
  • a method in which a base material and a master mold are pressure-bonded with a commercially available device such as ⁇ 0801HB and the cured product is released from the master mold after photocuring can be used.
  • examples of the material of the master mold used in the photoimprint used in the present invention include quartz, silicon (Si), nickel, alumina (Al 2 O 3 ), carbonylsilane, and glassy carbon.
  • the master mold may be subjected to a mold release treatment for forming a thin film of a fluorine-based compound or the like on the surface thereof in order to enhance the mold release property.
  • examples of the releasing agent used in the releasing treatment include OPTOOL (registered trademark) HD and DSX manufactured by Daikin Industries, Ltd., but are not particularly limited as long as a desired pattern can be obtained.
  • the layer A of the replica mold for imprint of the present invention can improve transparency in the ultraviolet region by heating after being released from the master mold.
  • Examples of the heating method of the layer A include a method of using a heating means such as a hot plate and an oven.
  • the layer B of the imprint replica mold of the present invention has a desired coating formed by applying a composition containing the component (b1), the component (b2) and the component (b3) onto the layer A and photocuring the composition.
  • the method of applying the composition containing the component (b1), the component (b2) and the component (b3) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, The spray method, the bar coating method, the gravure coating method, the slit coating method, the roll coating method, the transfer printing method, the brush coating, the blade coating method, and the air knife coating method can be mentioned.
  • the light source to be photo-cured to form the B layer of the replica mold for imprint of the present invention is not particularly limited, but for example, a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, ArF.
  • Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED).
  • the wavelength of the light source generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used.
  • the exposure amount is preferably, 30 mJ / cm 2 to 2000 mJ / cm 2, more preferably from 30 mJ / cm 2 to 1000 mJ / cm 2.
  • the step of forming the B layer of the replica mold for imprint of the present invention for the purpose of evaporating the solvent which is the component (b3), after applying the composition for forming the B layer, before photocuring or photocuring.
  • a baking step may be added later.
  • the equipment used in the baking step is not particularly limited, and for example, using a hot plate, an oven, or a furnace, in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or in a vacuum. Anything that can be baked may be used.
  • the baking temperature in the baking step may be, for example, 40° C. to 200° C. at which the solvent can be evaporated.
  • the pattern size of the replica mold for imprint obtained by the present invention is not particularly limited, and it is possible to obtain a good pattern even in the order of nanometer, micrometer, or millimeter.
  • PFPE1 Perfluoropolyether having hydroxy groups at both terminals via a poly(oxyethylene) group (number of repeating units 8 to 9)
  • PFPE2 Perfluoropolyether having two hydroxy groups at both ends via the group represented by the formula (2b)
  • BEI 1,1-bis(acryloyloxymethyl)ethyl isocyanate
  • DBTDL dibutyltin dilaurate [manufactured by Tokyo Chemical Industry Co., Ltd.]
  • DOTDD Dioctyltin Dineodecanoate [Neostan (registered trademark) U-830 manufactured by Nitto Kasei Co., Ltd.
  • the reaction solution was added dropwise to 6.3 kg of methanol (manufactured by Junsei Chemical Co., Ltd.), and the precipitated polymer was dried at 80° C. under reduced pressure of 133.3 Pa to obtain 330.4 g of non-crosslinkable copolymer MI55. ..
  • the weight average molecular weight of the obtained MI55 was measured by GPC, it was 20,100 in terms of standard polystyrene.
  • the weight average molecular weight Mw of the obtained SM1 measured by GPC in terms of polystyrene was 3,400, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM2 measured by GPC in terms of polystyrene was 3,410, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM3 measured by GPC in terms of polystyrene was 2,750, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM4 measured by GPC in terms of polystyrene was 2,760, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • Composition A2 was prepared by adding 9 g of HBPE-4, 1 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55).
  • 9.5 g of HBPE-4, 0.5 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55) were added, and the composition A3 was added.
  • A-DOG NK ester A-DOG
  • A-DCP NK ester A-DCP
  • Preparation of Composition (Release Agent) for Forming Layer B ⁇ Preparation Example 10> 0.285 g of LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.015 g of 2,2,2-trifluoroethyl acrylate (manufactured by Daikin Industries, Ltd.), IRGACURE (registered trademark) 819 (BASF Japan (stock) Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide) (hereinafter, abbreviated as “IRGACURE 819” in the present specification), and PGMEA (8.44 g) are mixed to form a composition.
  • the product (release agent) B1 was prepared.
  • composition (release agent) B5 was prepared by mixing 1.0 g of DAC-HP (manufactured by Daikin Industries, Ltd.), 0.004 g of IRGACURE 819, and 4.82 g of PGMEA.
  • a composition (release agent) B6 was prepared by mixing 0.0060 g of propionyl)benzyl ⁇ -phenyl]-2-methylpropan-1-one) and 7.67 g of PGMEA as the component (C).
  • composition (release agent) B8 was prepared by mixing 1.00 g of the PGMEA solution containing SM3 obtained in Synthesis Example 4, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
  • composition (release agent) B9 was prepared by mixing 1.00 g of the PGMEA solution containing SM4 obtained in Synthesis Example 5, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
  • Example 1 The composition A1 obtained in Preparation Example 1 was release-treated in advance with NOVEC (registered trademark) 1720 (manufactured by 3M Japan Co., Ltd.) (hereinafter, abbreviated as “NOVEC 1720” in this specification).
  • NOVEC 1720 manufactured by 3M Japan Co., Ltd.
  • Nanoimprinting device NM-0801HB manufactured by Meisho Kiko Co., Ltd.
  • the optical imprint is always 23° C., a) pressurizing to 500 N for 10 seconds, b) exposing to 5000 mJ/cm 2 using a high-pressure mercury lamp, c) depressurizing for 10 seconds, and d) nickel.
  • the mold and the quartz glass substrate were separated and released from the mold, and a convex lens pattern having a diameter of 2 mm and a height of 300 ⁇ m was obtained on the quartz glass substrate.
  • the convex lens pattern obtained on the quartz glass substrate was heated on a hot plate at 150° C. for 5 minutes to form a layer A.
  • the quartz glass substrate used was spin-coated with KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.) in advance and subjected to adhesion treatment by heating on a hot plate at 150° C. for 5 minutes.
  • the composition (release agent) B1 obtained in Preparation Example 10 was formed on the obtained layer A by a spin coater, and baked at 80° C. for 5 minutes using a hot plate. Then, under a nitrogen atmosphere, a batch type UV irradiation device (high pressure mercury lamp 2 kW x 1 lamp) (manufactured by Eye Graphics Co., Ltd.) was used to pass an i-line transmission filter, and UV exposure was performed at 40 mW/cm 2 for 125 seconds.
  • a layer B was formed on the layer A to prepare an imprint replica mold RM-1.
  • Example 2 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B2 obtained in Preparation Example 11. RM-2 was prepared.
  • Example 3 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B3 obtained in Preparation Example 12. RM-3 was prepared.
  • Example 4 Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B4 obtained in Preparation Example 13. RM-4 was made.
  • Example 5 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B5 obtained in Preparation Example 14. RM-5 was prepared.
  • Example 6 Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B7 obtained in Preparation Example 16. RM-6 was made.
  • Example 7 The composition A1 obtained in Preparation Example 1 was changed to the composition A2 obtained in Preparation Example 2, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-7 in the same manner as in example 1.
  • Example 8 The composition A1 obtained in Preparation Example 1 was changed to the composition A3 obtained in Preparation Example 3, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-8 in the same manner as in example 1.
  • Example 9 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 15. was changed to (release agent) B6, it was prepared imprint replica mold RM-9 in the same manner as in example 1.
  • Example 10 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-10 in the same manner as in example 1.
  • Example 11 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 17. was changed to (release agent) B8, were prepared imprint replica mold RM-11 in the same manner as in example 1.
  • Example 12 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 18. was changed to (release agent) B9, were prepared imprint replica mold RM-12 in the same manner as in example 1.
  • Example 13 The composition A1 obtained in Preparation Example 1 was changed to the composition A5 obtained in Preparation Example 5, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-13 in the same manner as in example 1.
  • Example 14 The composition A1 obtained in Preparation Example 1 was changed to the composition A6 obtained in Preparation Example 6, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-14 in the same manner as in example 1.
  • Example 15 The composition A1 obtained in Preparation Example 1 was changed to the composition A7 obtained in Preparation Example 7, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-15 in the same manner as in example 1.
  • Example 16 The composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-16 in the same manner as in example 1.
  • a layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8.
  • NOVEC 1720 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare an imprint replica mold RM-19.
  • a layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8.
  • PFPE1 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare a replica mold RM-20 for imprint.
  • composition A1 obtained in Preparation Example 1 was changed to the composition A9 obtained in Preparation Example 9, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 11.
  • An imprint replica mold RM-21 was produced in the same manner as in Example 1 except that the release agent was changed to B2.
  • the imprint replica mold of the present invention has high transparency in the ultraviolet region, and repeated imprints are possible. Further, the pattern produced by using the replica mold for imprint has no cracking or peeling.

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Abstract

Le problème décrit par la présente invention est de fournir un nouveau moule de réplique pour empreinte. La solution selon l'invention porte sur un moule de réplique pour empreinte, qui est pourvu d'une couche (A) décrite ci-dessous et d'une couche (B) décrite ci-dessous, ladite couche (B) étant liée à la couche (A). Couche (A) : une structure qui est formée d'un produit durci d'une composition qui contient le composant suivant (a1) et le composant suivant (a2). Composant (a1) : un composé qui a au moins un groupe polymérisable par voie radicalaire dans chaque molécule. Composant (a2) : un initiateur de photopolymérisation radicalaire à hauteur de 0,01 % en masse à 0,3 % en masse par rapport à 100 % en masse du composant (a1). Couche (B) : un film qui est formé d'un produit durci d'une composition qui contient le composant suivant (b1) et le composant suivant (b2). Composant (b1) : un composé qui est composé d'une chaîne moléculaire linéaire ou de type chaîne contenant un atome de fluor et qui a un groupe polymérisable par voie radicalaire à toutes les terminaisons de la chaîne moléculaire. Composant (b2) : un initiateur de photopolymérisation radicalaire à hauteur de 0,05 % en masse à 15 % en masse par rapport à 100 % en masse du composant (b1).
PCT/JP2019/047048 2018-12-07 2019-12-02 Moule de réplique pour empreinte et procédé de production correspondant WO2020116397A1 (fr)

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