WO2020116397A1 - Replica mold for imprinting and method for producing same - Google Patents

Replica mold for imprinting and method for producing same Download PDF

Info

Publication number
WO2020116397A1
WO2020116397A1 PCT/JP2019/047048 JP2019047048W WO2020116397A1 WO 2020116397 A1 WO2020116397 A1 WO 2020116397A1 JP 2019047048 W JP2019047048 W JP 2019047048W WO 2020116397 A1 WO2020116397 A1 WO 2020116397A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
mass
group
layer
meth
Prior art date
Application number
PCT/JP2019/047048
Other languages
French (fr)
Japanese (ja)
Inventor
淳平 小林
加藤 拓
偉大 長澤
Original Assignee
日産化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日産化学株式会社 filed Critical 日産化学株式会社
Priority to JP2020559182A priority Critical patent/JP7288247B2/en
Publication of WO2020116397A1 publication Critical patent/WO2020116397A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Definitions

  • the present invention relates to a replica mold for imprint having a pattern. More specifically, it is a replica mold that retains high transparency in the ultraviolet region even if it is a thick film, and does not require recoating with a release agent and can form good patterns even when repeatedly used for optical imprinting.
  • the present invention relates to an imprint replica mold and a method for manufacturing the replica mold.
  • the term “thick film” refers to a film having a thickness of 0.01 mm or more and a maximum thickness of 2.0 mm.
  • Resin lenses are used in electronic devices such as mobile phones, digital cameras, and vehicle-mounted cameras, and are required to have excellent optical characteristics according to the purpose of the electronic devices. Further, the resin lens is required to have high durability, for example, heat resistance and weather resistance, and high productivity capable of being molded with a high yield, in accordance with the usage mode.
  • a thermoplastic transparent resin such as a polycarbonate resin, a cycloolefin polymer, or a methacrylic resin has been used.
  • wafers are manufactured from thermoplastic resin injection molding to pressing molding using a curable resin that is liquid at room temperature.
  • the transition to level molding is being actively studied.
  • wafer level molding a hybrid lens system in which a lens is formed on a support such as a glass substrate is generally used from the viewpoint of productivity.
  • the mold In the wafer level molding, the mold also needs to be molded at the wafer level.
  • a typical resin lens manufacturing mold is made by excavating and polishing metal, but at the wafer level it has a large number of lens patterns in the plane, and its in-plane error and pitch between pixels are accurate. Need to control. Therefore, it is very difficult to manufacture the mold and it is expensive. Further, when a metal mold is used, UV light used for curing the resin lens material does not pass therethrough, so that the material of the support on which the lens is molded is limited. Therefore, it is common to manufacture a replica mold using a master mold and a replica mold material, and perform wafer level molding using the replica mold. Among them, as described in Patent Document 1, a method of producing a replica mold by step-and-repeat molding in a wafer using a relatively inexpensive master mold for one pixel and a replica mold material has been developed. ing.
  • Japanese Patent No. 4226061 Japanese Patent Laid-Open No. 2009-172773
  • a commonly used replica mold has a low transmittance of UV light used in the manufacturing process of a resin lens, particularly a wavelength of 365 nm.
  • the present invention has been made in view of such circumstances, and an object thereof is to provide a replica mold having high transparency and capable of repeatedly molding a resin lens.
  • the present inventors have found that a cured product of a composition containing a compound having at least one radically polymerizable group in one molecule and a photoradical polymerization initiator.
  • a film comprising a cured product of a composition containing a compound having a radical polymerizable group at all terminals of a linear or chain molecular chain containing a fluorine atom and a photoradical polymerization initiator is adhered to the structure consisting of
  • the present invention has been accomplished. That is, the replica mold of the present invention has high transparency in the ultraviolet region and can repeatedly mold resin lenses.
  • the first aspect of the present invention is an imprint replica mold including the following layer A and the following layer B adhered to the layer A.
  • Layer A Structure (a1) component comprising a cured product of a composition containing the following (a1) component and (a2) component: Compound (a2) component having at least one radically polymerizable group in one molecule: the above ( a1) 0.01 mass% to 0.3 mass% of photoradical polymerization initiator B layer relative to 100 mass% of the component: a film composed of a cured product of a composition containing the following (b1) component and (b2) component ( Component b1): a compound having a linear or chain molecular chain containing a fluorine atom and having radically polymerizable groups at all terminals of the molecular chain (b2) component: 100% by mass of the component (b1) To 0.05 mass% to 15 mass% of photoradical polymerization initiator
  • the compound of the component (b1) is, for example, all of the linear or chain molecular chains containing a group represented by the following formula (1) and a group represented by the following formula (2a) or formula (2b). It is a polyfunctional (meth)acrylate compound having a group represented by the following formula (3) at the terminal via a urethane bond.
  • R 1 represents a perfluoroalkylene group having 1 or 2 carbon atoms
  • R 2a represents an alkylene group having 2 or 3 carbon atoms
  • R 2b is a trivalent carbon atom having 2 or 3 carbon atoms.
  • * represents a bond for bonding to the —O— group of the urethane bond
  • p and q represent the number of repeating groups of the formula (1) and the formula (2a), respectively.
  • R 3 represents a methyl group or a hydrogen atom.
  • Q which represents the repeating number of the group represented by the formula (2a), is, for example, an integer of 5 to 12.
  • the group represented by the formula (2a) is, for example, a poly(oxyethylene) group.
  • the group represented by the formula (1) is, for example, a group having both an oxyperfluoromethylene group and an oxyperfluoroethylene group.
  • the compound as the component (b1) is, for example, a macromonomer or polymer having a weight average molecular weight of 1,000 to 30,000.
  • composition containing the component (b1) and the component (b2) may further contain a photosensitizer.
  • the component (a1) contains at least two compounds
  • at least one compound of the two compounds is a compound having at least two (meth)acryloyloxy groups in one molecule.
  • the compound having at least two (meth)acryloyloxy groups in one molecule is, for example, a di(meth)acrylate compound represented by the following formula (4).
  • R 4 and R 5 each independently represent a hydrogen atom or a methyl group
  • R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms
  • R 8 and R 9 are each independently Represents a hydrogen atom or a methyl group
  • r 1 and r 2 each independently represent an integer of 1 to 5.
  • the layer A has, for example, a lens-shaped inverted pattern.
  • the maximum thickness of the A layer is, for example, 2.0 mm.
  • Another aspect of the present invention is the step of applying a composition containing a component (a1) and a component (a2) below onto a master mold, the master containing the composition containing a component (a1) and a component (a2) below.
  • a step of pressure-bonding a mold to a substrate exposing the composition containing the following component (a1) and component (a2) through the substrate while the master mold is pressure-bonded to the substrate, and photocuring the composition.
  • Step, after the photo-curing step a step of releasing the cured product obtained on the substrate from the master mold to form an A layer, and the following (b1) component to (b3) component on the A layer
  • a composition containing the following components (b1) to (b3) is baked at 40° C. to 200° C.
  • a method for producing an imprint replica mold which includes the steps of: Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1).
  • Component (b1) a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
  • Still another embodiment of the present invention is the step of applying a composition containing the following component (a1) and the component (a2) onto a substrate, the above-mentioned composition comprising the component (a1) and the component (a2).
  • a step of press-bonding the base material to the master mold exposing the composition containing the following component (a1) and component (a2) through the base material while pressing the master mold to the base material, and photocuring the composition.
  • the step of photo-curing the step of releasing the cured product obtained on the base material from the master mold to form an A layer, and the following components (b1) to (b3) on the A layer.
  • a step of applying a composition containing the components, and a composition containing the components (b1) to (b3) below is baked at 40° C.
  • the method for producing an imprint replica mold including the step of: Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1).
  • Component (b1) a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
  • the replica mold for imprint of the present invention is a cured product of a composition containing the component (b1) and the component (b2) in a structure composed of the cured product of the composition containing the component (a1) and the component (a2). Since the film made of is adhered, even a thick film has high transparency and continuous transfer is possible.
  • the imprint replica mold of the present invention can be produced on any base material, and the replica mold formed on the base material has high transparency even in a thick film in the ultraviolet region. Therefore, the replica mold for imprinting of the present invention can be suitably used for manufacturing an optical member such as a solid-state imaging device and a lens for a sensor, which is required to have a high shape accuracy.
  • the component (a1) is a compound having at least one radically polymerizable group in one molecule.
  • the radically polymerizable group include a (meth)acryloyloxy group.
  • the (meth)acryloyloxy group means both an acryloyloxy group and a methacryloyloxy group.
  • (meth)acrylate means both acrylate and methacrylate.
  • Examples of the compound as the component (a1) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate and isobutyl (meth).
  • the compound of the component (a1) is available as a commercial product, and specific examples thereof include light ester M, the same E, the same NB, the same IB, the same TB, the same EH, the same IB-X and the same CH, Light acrylate IB-XA (manufactured by Kyoeisha Chemical Co., Ltd.), NOAA, IOAA, INAA, LA, STA, ISTA, IBXA, VISCOAT #155, 1-ADA, 1-ADMA, VISCOAT #150, MEDOL-10 , CHDOL-10, OXE-10, OXE-30, GBLA, GBLMA, viscoat #195, viscoat #230, viscoat #260, viscoat #295, viscoat #300, viscoat #400, viscoat #360 (above, Osaka Organic Chemistry) Industrial, Ltd.), LA, LMA, A-MS, AS, S-1800A, A-BH, AM-30G, AM-90G, AM-130G, AM-230G, AM-30PG, M-20
  • A-DCP, DCP A-TMPT, A-TMPT-3EO, A-TMPT-9EO, AT-20E, AT-30E, A-TMPT-3PO, A-TMPT-6O, TMPT, TMPT-3EO, TMPT -9EO, TMPT-3PO, A-GLY-3E, A-GLY-6E, A-GLY-9E, A-GLY-20E, A-GLY-3P, A-GLY-6P, A-GLY-9P, GLY -3E, GLY-6E, GLY-9E, GLY-20E, A-9300, A-9200, A-9300-1CL, A-9300-3CL, A-TMM-3, A-TMM-3L, A-TMM -3LM-N, ATM-4EL, ATM-8EL, ATM-4PL, TM-4EL, TM-4PL, A-TMMT, ATM-4E, ATM-35E, ATM-4P, ATM-10P, TM-4E, TM -35E, TM-4P, TM -10P, AD
  • Component (a2) The photoradical polymerization initiator of the component (a2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer A of the replica mold for imprint of the present invention. Not a thing.
  • radical photopolymerization initiator of the component (a2) examples include tert-butylperoxy-iso-butyrate, 2,5-dimethyl-2,5-bis(benzoyldioxy)hexane and 1,4-bis[ ⁇ - (Tert-Butyldioxy)-iso-propoxy]benzene, di-tert-butylperoxide, 2,5-dimethyl-2,5-bis(tert-butyldioxy)hexene hydroperoxide, ⁇ -(iso-propylphenyl)-iso- Propyl hydroperoxide, tert-butyl hydroperoxide, 1,1-bis(tert-butyldioxy)-3,3,5-trimethylcyclohexane, butyl-4,4-bis(tert-butyldioxy)valerate, cyclohexanone peroxide, 2,2 ',5,5'-Tetra(tert-butylperoxy
  • the photoradical polymerization initiator of the component (a2) is available as a commercial product, and specific examples thereof include IRGACURE (registered trademark) 651, 184, 500, 2959, 127, 754, 907, 369, 379, 379EG, 819, 819DW, 1800, 1870, 784, OXE01, OXE02, 250, 1173, MBF, 4265, TPO (above, BASF Japan Ltd.), KAYACURE (registered trademark) DETX, MBP, DMBI, EPA, OA (Nippon Kayaku Co., Ltd.), VICURE-10, 55 (above, STAUFFER Co.).
  • IRGACURE registered trademark
  • the component (a2) may be used alone, or two or more kinds may be mixed and used.
  • the content ratio of the photo radical polymerization initiator of the component (a2) is 0.01% by mass to 0.3% by mass with respect to 100% by mass of the component (a1).
  • the component (b1) is a compound having a radically polymerizable group at every end of a linear or chain molecular chain containing a fluorine atom.
  • Examples of the radically polymerizable group include a (meth)acryloyloxy group.
  • Examples of the compound as the component (b1) include 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3,3-pentafluoropropyl (meth)acrylate, and 2-(perfluorobutyl).
  • the above compounds are available as commercial products, and specific examples thereof include 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3,3,3- Pentafluoropropyl acrylate, 2,2,3,3,3-pentafluoropropyl methacrylate, 2-(perfluorobutyl)ethyl acrylate, 2-(perfluorobutyl)ethyl methacrylate, 3-(perfluorobutyl)- 2-hydroxypropyl acrylate, 3-(perfluorobutyl)-2-hydroxypropyl methacrylate, 2-(perfluorohexyl)ethyl acrylate, 2-(perfluorohexyl)ethyl methacrylate, 3-perfluorohexyl-2- Hydroxypropyl acrylate, 3-perfluorohexyl-2-hydroxypropyl methacrylate, 3-(perfluoro-3-methylbutyl)
  • the component (b1) has urethane groups at all terminals of a linear or chain molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b). It may be a polyfunctional (meth)acrylate compound having a polymerizable group containing a group represented by the formula (3), that is, a (meth)acryloyloxy group, through a bond.
  • the polyfunctional (meth)acrylate compound is a bifunctional or higher functional acrylate compound or methacrylate compound excluding the monofunctional (meth)acrylate compound.
  • the urethane bond means a structure represented by —NH—C( ⁇ O)—O—.
  • the polyfunctional (meth)acrylate compound has two or four urethane bonds and two or four polymerizable groups containing a (meth)acryloyloxy group in one molecule.
  • the group represented by the formula (1) may be referred to as a poly(oxyperfluoroalkylene) group, and the group represented by the formula (2a) may be referred to as a poly(oxyalkylene) group.
  • the linear or chain molecular chain is not particularly limited as long as it is a molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b).
  • the bonding order of the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) is not particularly limited, and The number is not particularly limited.
  • the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) may be bonded by a single bond (direct bond). Alternatively, they may be bonded via a structure (linking group) such as an alkylene group having 1 to 3 carbon atoms, a perfluoroalkylene group having 1 to 3 carbon atoms, or a combination thereof.
  • the number of carbon atoms of R 1 of the oxyperfluoroalkylene group: —(O—R 1 )— in the group represented by the formula (1) is 1 or 2. That is, the group represented by the formula (1) has a structure in which a divalent fluorocarbon group having 1 or 2 carbon atoms and an oxygen atom are alternately linked, and the oxyperfluoroalkylene group has a carbon atom number. It has a structure in which a monovalent or divalent divalent fluorocarbon group and an oxygen atom are linked.
  • the oxyperfluoroalkylene group examples include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoroethylene group).
  • the oxyperfluoroalkylene group one of -(OCF 2 )- and -(OCF 2 CF 2 )- may be used alone, or two types may be used in combination. When two types are used in combination, the bond of —(OCF 2 )— and —(OCF 2 CF 2 )— may be either a block bond or a random bond.
  • the groups represented by the formula (1) include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoro). It is preferable to use a group having both of (ethylene group).
  • These bonds may be block bonds or random bonds.
  • the repeating number p of the group represented by the formula (1) is an integer of 2 or more, preferably in the range of 5 to 30, and more preferably in the range of 7 to 21.
  • the weight average molecular weight (Mw) measured by gel permeation chromatography of the group represented by the formula (1) is 1,000 to 5,000, preferably 1,500 to 3,000. is there.
  • the number of carbon atoms of R 2 of the oxyalkylene group: —(O—R 2 )— in the group represented by the formula (2a) is 2 or 3. That is, the group represented by the formula (2a) has a structure in which an alkylene group having 2 or 3 carbon atoms and an oxygen atom are alternately linked, and an oxyalkylene group is an alkylene group having 2 or 3 carbon atoms. It has a structure in which oxygen atoms are linked. Examples of the oxyalkylene group include an oxyethylene group, an oxypropylene group, and an oxytrimethylene group.
  • the above oxyalkylene groups may be used alone or in combination of two or more. When two or more oxyalkylene groups are used in combination, the bonds of the two or more oxyalkylene groups may be either block bonds or random bonds.
  • the group represented by the formula (2a) is, for example, a poly(oxyethylene) group.
  • the repeating number q of the group represented by the formula (2a) is an integer of 2 or more, for example, in the range of 2 to 15, preferably in the range of 2 to 12, or in the range of 5 to 12, or in the range of 7 to 12. The range is.
  • the trivalent hydrocarbon group R 2b in the group represented by the formula (2b) has 2 or 3 carbon atoms. That is, the group represented by the formula (2b) is a trivalent group obtained by removing one hydrogen atom from an arbitrary carbon atom of an alkylene group having 2 or 3 carbon atoms (an alkylene group having 2 or 3 carbon atoms).
  • the group) has a structure in which one oxygen atom is linked.
  • a group in which one oxygen atom is linked to the 1-position (or 3-position) of the 1,2,3-propanetriyl group is preferable.
  • the polymerizable group containing a (meth)acryloyloxy group is not limited to having one (meth)acryloyloxy group, and may have two or more.
  • Examples of the polymerizable group containing a (meth)acryloyloxy group include structures (terminal groups) represented by the following formulas [X1] to [X5], and acryloyloxy groups in these structures (terminal groups). And a structure in which is substituted with a methacryloyloxy group.
  • the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group
  • the following structural formula (A- Preferred examples are the compound represented by 1), the compound represented by (A-2) and the compound represented by (A-3), and the compound in which the acryloyloxy group in these compounds is substituted with a methacryloyloxy group.
  • two X's or four X's each represent one of the structures (terminal groups) represented by the above formulas [X1] to [X5], and PFPE is poly(oxyperfluoro).
  • Alkylene) group, q 1 and q 2 each independently represent the number of oxyethylene groups, for example, an integer of 2 to 15, preferably an integer of 2 to 12, or an integer of 5 to 12, Alternatively, it represents an integer of 7 to 12.
  • the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group
  • the polymerizable group containing the (meth)acryloyloxy group is (meth)acryloyloxy.
  • the structure (terminal group) represented by the above formulas [X3] to [X5] is preferable, which has two or more groups.
  • the component (b1) may be used alone or in combination of two or more.
  • the component (b1) is preferably 0.1% by mass based on 100% by mass of the total amount of the component (b1) and the components (b2), (b3) described below and other additives which are optional components. It is desirable to use it in an amount of 10 to 10% by mass, more preferably 0.5 to 8% by mass.
  • the component (b1) is, for example, represented by the formula (2a) or the formula (2b), which is directly bonded to both ends of the group represented by the formula (1) or bonded via the linking group.
  • a compound having at least two hydroxy groups via the group described above, 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis((meth)acryloyloxymethyl)ethyl with respect to the at least two hydroxy groups It can be obtained by a method of subjecting an isocyanate compound having a (meth)acryloyloxy group such as isocyanate to a urethanization reaction.
  • the component (b1) has a weight average molecular weight (Mw) measured by gel permeation chromatography in terms of polystyrene of 1,500 to 7,000, preferably 2,000 to 6,000.
  • composition for forming the layer B of the replica mold for imprinting of the present invention is, in addition to the component (b1), a group represented by the formula (1) and the formula (2a) or the formula (2b). Having a polymerizable group containing a (meth)acryloyloxy group through a urethane bond only at a part of the terminal of a linear or chain molecular chain containing a group represented by A compound having a hydroxy group at the other end of its molecular chain (that is, a compound having no polymerizable group at the other end) may be contained.
  • the composition for forming the B layer further comprises a linear or chain molecular chain containing a group represented by the formula (1) and a group represented by the formula (2a) or the formula (2b).
  • a compound having a hydroxy group at all terminals, that is, a compound not having the above-mentioned polymerizable group may be contained.
  • the composition for forming the B layer may be referred to as a release agent.
  • the photoradical polymerization initiator of the component (b2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer B of the replica mold for imprint of the present invention. Not a thing.
  • Examples of the component (b2) include the same radical photopolymerization initiator as the component (a2).
  • the component (b2) may be used alone or in combination of two or more.
  • the content ratio of the photo radical polymerization initiator of the component (b2) is 0.05% by mass to 15% by mass based on 100% by mass of the component (b1).
  • Component (b3) The solvent which is the component (b3) plays a role of adjusting the viscosity of the component (b1) and the component (b2), and can adjust the viscosity of the component (b1) and the component (b2). It is not particularly limited.
  • the component (b3) is removed in the step of forming the B layer.
  • solvent examples include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether.
  • the solvent which is the component (b3) is available as a commercial product, and specific examples thereof include Novec (registered trademark) 7000, 7100, 7200, and 7300 (above, manufactured by 3M Japan Co., Ltd.). , ASAHIKLIN (registered trademark) AE-3000, AE-3100E (above, manufactured by AGC Corporation), Vertrel (registered trademark) XF, XF-UP, XE-XP, X-E10, X- P10, X-D, X-GY, MCA, SDG, SMT, SFR, DC, Cinera, Supraion, Psion (Mitsui DuPont Fluorochemical Co., Ltd.) Can be mentioned.
  • the component (b3) may be used alone or in combination of two or more.
  • the composition for forming the layer A of the replica mold for imprints of the present invention may contain a solvent, if necessary.
  • the composition for forming the A layer and the composition for forming the B layer may contain a surfactant, a chain transfer agent, and a photosensitizer, if necessary, as long as the effects of the present invention are not impaired.
  • Sensitizers may be included.
  • solvent examples include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether.
  • surfactant examples include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, and other polyoxyethylene alkyl ethers, polyoxyethylene octylphenyl ether, polyoxyethylene.
  • Polyoxyethylene alkylaryl ethers such as ethylene nonylphenyl ether, polyoxyethylene/polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate, etc.
  • Examples include nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters.
  • the above-mentioned surfactant is available as a commercial product, and specific examples thereof include Ftop (registered trademark) EF301, EF303, EF352 (above, manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Megafac ( (Registered trademark) F-171, F-173, F-477, F-486, F-554, F-556, R-08, R-30, R-30N, R- 40, same R-40-LM, same RS-56, same RS-75, same RS-72-K, same RS-76-E, same RS-76-NS, same RS-78, same RS-90 ( As above, DIC Corporation's product, Florade FC430, the same FC431 (above, 3M Japan's product), Asahi Guard (registered trademark) AG710, Surflon (registered trademark) S-382, the same SC101, the same SC102, the same SC103.
  • Ftop registered trademark
  • EF303 EF352
  • the above surfactants may be used alone or in combination of two or more.
  • the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 10% by mass is preferable.
  • chain transfer agent examples include thiol compounds such as methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, and n-mercaptopropionate.
  • This chain transfer agent can be used alone or in combination of two or more.
  • the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 20% by mass is preferable.
  • Examples of the photosensitizer include thioxanthene type, thioxanthone type, xanthene type, ketone type, thiopyrylium salt type, base styryl type, merocyanine type, 3-substituted coumarin type, 3,4-substituted coumarin type, cyanine type , Acridine-based, thiazine-based, phenothiazine-based, anthracene-based, coronene-based, benzanthracene-based, perylene-based, ketocoumarin-based, coumarin-based, and borate-based.
  • the photosensitizer is commercially available, and specific examples thereof include Anthracure (registered trademark) UVS-581, UVS-1331 (all manufactured by Kawasaki Kasei Kogyo Co., Ltd.), and KAYACURE (trade name). Registered trademark) DETX-S (manufactured by Nippon Kayaku Co., Ltd.).
  • This photosensitizer can be used alone or in combination of two or more.
  • the absorption wavelength in the UV region can be adjusted by using the above-mentioned photosensitizer.
  • the content ratio is 100 mass of the component (a1) or the component (b1). %, for example, 0.01% by mass to 10% by mass, preferably 0.05% by mass to 5% by mass.
  • the method for preparing the composition for forming the A layer and the composition for forming the B layer of the replica mold for imprint of the present invention is not particularly limited.
  • the component (a1), the component (a2), and other additives as necessary may be mixed so that the composition is in a uniform state. ..
  • the component (b1), the component (b2), the component (b3) and, if necessary, other additives are mixed to obtain a uniform composition. It should be.
  • the order of mixing the respective components of the composition for forming the A layer and the composition for forming the B layer is not particularly limited as long as a uniform composition can be obtained, and is not particularly limited.
  • the replica mold for imprint of the present invention can be obtained by forming the A layer by photoimprinting and then forming the B layer on the A layer by photocuring.
  • the layer A of the replica mold for imprint of the present invention is obtained by applying a composition containing the above-mentioned components (a1) and (a2) onto a base material or a master mold, and bonding the base material and the master mold together. Then, the desired structure can be obtained by photo-curing and releasing.
  • the method of applying the composition containing the component (a1) and the component (a2) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, a spray method, a bar coating method. Method, gravure coating method, slit coating method, roll coating method, transfer printing method, brush coating, blade coating method, and air knife coating method.
  • Examples of the base material on which the layer A of the imprint replica mold of the present invention is formed include silicon, glass (ITO substrate) on which indium tin oxide (ITO) is formed, and silicon nitride (SiN). Film-formed glass (SiN substrate), indium zinc oxide (IZO) film-formed glass, polyethylene terephthalate (PET), triacetyl cellulose (TAC), acrylic, plastic, glass, quartz, ceramics, etc. Can be mentioned.
  • a flexible base material having flexibility for example, triacetyl cellulose, polyethylene terephthalate, polymethyl methacrylate, cycloolefin (co)polymer, polyvinyl alcohol, polycarbonate, polystyrene, polyimide, polyamide, polyolefin, polypropylene, polyethylene, polyethylene. It is also possible to use a base material composed of naphthalate, polyether sulfone, and a copolymer obtained by combining these polymers.
  • the light source to be photo-cured to form the A layer of the replica mold for imprint of the present invention is not particularly limited, but examples thereof include a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, and an ArF. Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED).
  • the wavelength of the light source generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used.
  • the exposure amount is preferably, 30 mJ / cm 2 to 10000 mJ / cm 2, more preferably at 100 mJ / cm 2 to 8000 mJ / cm 2.
  • the composition for forming the layer A contains a solvent
  • at least one of the coating film before light irradiation and the photocured product obtained after light irradiation is used for the purpose of evaporating the solvent.
  • a baking step may be added.
  • the equipment used in the baking step is not particularly limited, and for example, baking is performed using a hot plate, an oven, a furnace in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or a vacuum. Anything can be used.
  • the baking temperature is not particularly limited as long as it can achieve the purpose of evaporating the solvent, but for example, it can be performed at 40°C to 200°C.
  • the apparatus for performing the optical imprint is not particularly limited as long as the target pattern is obtained, but examples thereof include ST50 manufactured by Toshiba Machine Co., Ltd., Sindre (registered trademark) 60 manufactured by Obducat, and NM manufactured by Meisho Kiko Co., Ltd.
  • ST50 manufactured by Toshiba Machine Co., Ltd.
  • Sindre registered trademark
  • NM manufactured by Meisho Kiko Co., Ltd.
  • a method in which a base material and a master mold are pressure-bonded with a commercially available device such as ⁇ 0801HB and the cured product is released from the master mold after photocuring can be used.
  • examples of the material of the master mold used in the photoimprint used in the present invention include quartz, silicon (Si), nickel, alumina (Al 2 O 3 ), carbonylsilane, and glassy carbon.
  • the master mold may be subjected to a mold release treatment for forming a thin film of a fluorine-based compound or the like on the surface thereof in order to enhance the mold release property.
  • examples of the releasing agent used in the releasing treatment include OPTOOL (registered trademark) HD and DSX manufactured by Daikin Industries, Ltd., but are not particularly limited as long as a desired pattern can be obtained.
  • the layer A of the replica mold for imprint of the present invention can improve transparency in the ultraviolet region by heating after being released from the master mold.
  • Examples of the heating method of the layer A include a method of using a heating means such as a hot plate and an oven.
  • the layer B of the imprint replica mold of the present invention has a desired coating formed by applying a composition containing the component (b1), the component (b2) and the component (b3) onto the layer A and photocuring the composition.
  • the method of applying the composition containing the component (b1), the component (b2) and the component (b3) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, The spray method, the bar coating method, the gravure coating method, the slit coating method, the roll coating method, the transfer printing method, the brush coating, the blade coating method, and the air knife coating method can be mentioned.
  • the light source to be photo-cured to form the B layer of the replica mold for imprint of the present invention is not particularly limited, but for example, a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, ArF.
  • Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED).
  • the wavelength of the light source generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used.
  • the exposure amount is preferably, 30 mJ / cm 2 to 2000 mJ / cm 2, more preferably from 30 mJ / cm 2 to 1000 mJ / cm 2.
  • the step of forming the B layer of the replica mold for imprint of the present invention for the purpose of evaporating the solvent which is the component (b3), after applying the composition for forming the B layer, before photocuring or photocuring.
  • a baking step may be added later.
  • the equipment used in the baking step is not particularly limited, and for example, using a hot plate, an oven, or a furnace, in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or in a vacuum. Anything that can be baked may be used.
  • the baking temperature in the baking step may be, for example, 40° C. to 200° C. at which the solvent can be evaporated.
  • the pattern size of the replica mold for imprint obtained by the present invention is not particularly limited, and it is possible to obtain a good pattern even in the order of nanometer, micrometer, or millimeter.
  • PFPE1 Perfluoropolyether having hydroxy groups at both terminals via a poly(oxyethylene) group (number of repeating units 8 to 9)
  • PFPE2 Perfluoropolyether having two hydroxy groups at both ends via the group represented by the formula (2b)
  • BEI 1,1-bis(acryloyloxymethyl)ethyl isocyanate
  • DBTDL dibutyltin dilaurate [manufactured by Tokyo Chemical Industry Co., Ltd.]
  • DOTDD Dioctyltin Dineodecanoate [Neostan (registered trademark) U-830 manufactured by Nitto Kasei Co., Ltd.
  • the reaction solution was added dropwise to 6.3 kg of methanol (manufactured by Junsei Chemical Co., Ltd.), and the precipitated polymer was dried at 80° C. under reduced pressure of 133.3 Pa to obtain 330.4 g of non-crosslinkable copolymer MI55. ..
  • the weight average molecular weight of the obtained MI55 was measured by GPC, it was 20,100 in terms of standard polystyrene.
  • the weight average molecular weight Mw of the obtained SM1 measured by GPC in terms of polystyrene was 3,400, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM2 measured by GPC in terms of polystyrene was 3,410, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM3 measured by GPC in terms of polystyrene was 2,750, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • the weight average molecular weight Mw of the obtained SM4 measured by GPC in terms of polystyrene was 2,760, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
  • Composition A2 was prepared by adding 9 g of HBPE-4, 1 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55).
  • 9.5 g of HBPE-4, 0.5 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55) were added, and the composition A3 was added.
  • A-DOG NK ester A-DOG
  • A-DCP NK ester A-DCP
  • Preparation of Composition (Release Agent) for Forming Layer B ⁇ Preparation Example 10> 0.285 g of LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.015 g of 2,2,2-trifluoroethyl acrylate (manufactured by Daikin Industries, Ltd.), IRGACURE (registered trademark) 819 (BASF Japan (stock) Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide) (hereinafter, abbreviated as “IRGACURE 819” in the present specification), and PGMEA (8.44 g) are mixed to form a composition.
  • the product (release agent) B1 was prepared.
  • composition (release agent) B5 was prepared by mixing 1.0 g of DAC-HP (manufactured by Daikin Industries, Ltd.), 0.004 g of IRGACURE 819, and 4.82 g of PGMEA.
  • a composition (release agent) B6 was prepared by mixing 0.0060 g of propionyl)benzyl ⁇ -phenyl]-2-methylpropan-1-one) and 7.67 g of PGMEA as the component (C).
  • composition (release agent) B8 was prepared by mixing 1.00 g of the PGMEA solution containing SM3 obtained in Synthesis Example 4, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
  • composition (release agent) B9 was prepared by mixing 1.00 g of the PGMEA solution containing SM4 obtained in Synthesis Example 5, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
  • Example 1 The composition A1 obtained in Preparation Example 1 was release-treated in advance with NOVEC (registered trademark) 1720 (manufactured by 3M Japan Co., Ltd.) (hereinafter, abbreviated as “NOVEC 1720” in this specification).
  • NOVEC 1720 manufactured by 3M Japan Co., Ltd.
  • Nanoimprinting device NM-0801HB manufactured by Meisho Kiko Co., Ltd.
  • the optical imprint is always 23° C., a) pressurizing to 500 N for 10 seconds, b) exposing to 5000 mJ/cm 2 using a high-pressure mercury lamp, c) depressurizing for 10 seconds, and d) nickel.
  • the mold and the quartz glass substrate were separated and released from the mold, and a convex lens pattern having a diameter of 2 mm and a height of 300 ⁇ m was obtained on the quartz glass substrate.
  • the convex lens pattern obtained on the quartz glass substrate was heated on a hot plate at 150° C. for 5 minutes to form a layer A.
  • the quartz glass substrate used was spin-coated with KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.) in advance and subjected to adhesion treatment by heating on a hot plate at 150° C. for 5 minutes.
  • the composition (release agent) B1 obtained in Preparation Example 10 was formed on the obtained layer A by a spin coater, and baked at 80° C. for 5 minutes using a hot plate. Then, under a nitrogen atmosphere, a batch type UV irradiation device (high pressure mercury lamp 2 kW x 1 lamp) (manufactured by Eye Graphics Co., Ltd.) was used to pass an i-line transmission filter, and UV exposure was performed at 40 mW/cm 2 for 125 seconds.
  • a layer B was formed on the layer A to prepare an imprint replica mold RM-1.
  • Example 2 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B2 obtained in Preparation Example 11. RM-2 was prepared.
  • Example 3 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B3 obtained in Preparation Example 12. RM-3 was prepared.
  • Example 4 Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B4 obtained in Preparation Example 13. RM-4 was made.
  • Example 5 Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B5 obtained in Preparation Example 14. RM-5 was prepared.
  • Example 6 Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B7 obtained in Preparation Example 16. RM-6 was made.
  • Example 7 The composition A1 obtained in Preparation Example 1 was changed to the composition A2 obtained in Preparation Example 2, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-7 in the same manner as in example 1.
  • Example 8 The composition A1 obtained in Preparation Example 1 was changed to the composition A3 obtained in Preparation Example 3, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-8 in the same manner as in example 1.
  • Example 9 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 15. was changed to (release agent) B6, it was prepared imprint replica mold RM-9 in the same manner as in example 1.
  • Example 10 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-10 in the same manner as in example 1.
  • Example 11 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 17. was changed to (release agent) B8, were prepared imprint replica mold RM-11 in the same manner as in example 1.
  • Example 12 The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 18. was changed to (release agent) B9, were prepared imprint replica mold RM-12 in the same manner as in example 1.
  • Example 13 The composition A1 obtained in Preparation Example 1 was changed to the composition A5 obtained in Preparation Example 5, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-13 in the same manner as in example 1.
  • Example 14 The composition A1 obtained in Preparation Example 1 was changed to the composition A6 obtained in Preparation Example 6, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-14 in the same manner as in example 1.
  • Example 15 The composition A1 obtained in Preparation Example 1 was changed to the composition A7 obtained in Preparation Example 7, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-15 in the same manner as in example 1.
  • Example 16 The composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-16 in the same manner as in example 1.
  • a layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8.
  • NOVEC 1720 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare an imprint replica mold RM-19.
  • a layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8.
  • PFPE1 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare a replica mold RM-20 for imprint.
  • composition A1 obtained in Preparation Example 1 was changed to the composition A9 obtained in Preparation Example 9, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 11.
  • An imprint replica mold RM-21 was produced in the same manner as in Example 1 except that the release agent was changed to B2.
  • the imprint replica mold of the present invention has high transparency in the ultraviolet region, and repeated imprints are possible. Further, the pattern produced by using the replica mold for imprint has no cracking or peeling.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

[Problem] To provide a novel replica mold for imprinting. [Solution] A replica mold for imprinting, which is provided with a layer A described below and a layer B described below, said layer B being bonded to the layer A. Layer A: a structure which is formed of a cured product of a composition that contains the following component (a1) and component (a2) Component (a1): a compound which has at least one radically polymerizable group in each molecule Component (a2): a radical photopolymerization initiator in an amount of from 0.01% by mass to 0.3% by mass relative to 100% by mass of the component (a1) Layer B: a film which is formed of a cured product of a composition that contains the following component (b1) and component (b2) Component (b1): a compound which is composed of a linear or chain-like molecular chain containing a fluorine atom, and which has a radically polymerizable group at all terminals of the molecular chain Component (b2): a radical photopolymerization initiator in an amount of from 0.05% by mass to 15% by mass relative to 100% by mass of the component (b1)

Description

インプリント用レプリカモールド及びその作製方法Imprint replica mold and method of manufacturing the same
本発明は、パターンを有するインプリント用レプリカモールドに関する。より詳しくは、厚膜であっても紫外線領域において高透明性を保持するレプリカモールドであって、離型剤の塗り直しが不要かつ繰り返し光インプリントに使用しても良好なパターン形成が可能なインプリント用レプリカモールド、および該レプリカモールドの製造方法に関する。
本明細書において“厚膜”とは、0.01mm以上の厚さで、最大厚さ2.0mmの膜を表す。
The present invention relates to a replica mold for imprint having a pattern. More specifically, it is a replica mold that retains high transparency in the ultraviolet region even if it is a thick film, and does not require recoating with a release agent and can form good patterns even when repeatedly used for optical imprinting. The present invention relates to an imprint replica mold and a method for manufacturing the replica mold.
As used herein, the term “thick film” refers to a film having a thickness of 0.01 mm or more and a maximum thickness of 2.0 mm.
樹脂レンズは、携帯電話、デジタルカメラ、車載カメラなどの電子機器に用いられており、その電子機器の目的に応じた、優れた光学特性を有するものであることが求められる。また、当該樹脂レンズは、使用態様に合わせて、高い耐久性、例えば耐熱性及び耐候性、並びに歩留まりよく成形できる高い生産性が求められている。このような要求を満たす樹脂レンズ用の材料としては、例えば、ポリカーボネート樹脂、シクロオレフィンポリマー、メタクリル樹脂等の熱可塑性の透明樹脂が使用されてきた。 Resin lenses are used in electronic devices such as mobile phones, digital cameras, and vehicle-mounted cameras, and are required to have excellent optical characteristics according to the purpose of the electronic devices. Further, the resin lens is required to have high durability, for example, heat resistance and weather resistance, and high productivity capable of being molded with a high yield, in accordance with the usage mode. As a material for a resin lens that meets such requirements, for example, a thermoplastic transparent resin such as a polycarbonate resin, a cycloolefin polymer, or a methacrylic resin has been used.
樹脂レンズの製造にあたり、歩留まりや生産効率の向上、さらにはレンズ積層時の光軸ずれの抑制のために、熱可塑性樹脂の射出成型から、室温で液状の硬化性樹脂を使った押し付け成形によるウェハレベル成形への移行が盛んに検討されている。ウェハレベル成形では、生産性の観点から、ガラス基板等の支持体上にレンズを形成するハイブリッドレンズ方式が一般的である。 When manufacturing resin lenses, in order to improve yield and production efficiency, and also to suppress optical axis deviation when stacking lenses, wafers are manufactured from thermoplastic resin injection molding to pressing molding using a curable resin that is liquid at room temperature. The transition to level molding is being actively studied. In wafer level molding, a hybrid lens system in which a lens is formed on a support such as a glass substrate is generally used from the viewpoint of productivity.
ウェハレベル成形においては、モールドもウェハレベルで成型される必要がある。一般的な樹脂レンズ製造用のモールドは、金属を掘削及び研磨したものが用いられているが、ウェハレベルでは面内に多数のレンズパターンを有し、かつその面内誤差や画素間ピッチを正確に制御する必要がある。そのため、モールドの作製が非常に困難なうえ、高価となってしまう。さらに、金属製のモールドを用いる場合、樹脂レンズ用材料の硬化に用いるUV光が透過しないため、レンズが成形される支持体の素材に制限が生じる。そのため、マスターモールドとレプリカモールド材料を用いてレプリカモールドを作製し、そのレプリカモールドを用いてウェハレベル成形を行うことが一般的である。その中で、特許文献1に記載のように、比較的安価な一画素分のマスターモールドと、レプリカモールド材料とを用いて、ウェハ内のステップアンドリピート成型でレプリカモールドを作製する方法が開発されている。 In the wafer level molding, the mold also needs to be molded at the wafer level. A typical resin lens manufacturing mold is made by excavating and polishing metal, but at the wafer level it has a large number of lens patterns in the plane, and its in-plane error and pitch between pixels are accurate. Need to control. Therefore, it is very difficult to manufacture the mold and it is expensive. Further, when a metal mold is used, UV light used for curing the resin lens material does not pass therethrough, so that the material of the support on which the lens is molded is limited. Therefore, it is common to manufacture a replica mold using a master mold and a replica mold material, and perform wafer level molding using the replica mold. Among them, as described in Patent Document 1, a method of producing a replica mold by step-and-repeat molding in a wafer using a relatively inexpensive master mold for one pixel and a replica mold material has been developed. ing.
特許第4226061号(特開2009-172773号公報)Japanese Patent No. 4226061 (Japanese Patent Laid-Open No. 2009-172773)
一般的に用いられるレプリカモールドは、樹脂レンズの製造工程に用いるUV光、特に波長365nmの透過率が低い。このようなレプリカモールドを用いて樹脂レンズを成形する際、離型性を付与するために市販の離型剤を塗布する方法がある。しかし、同じレプリカモールドを用いて繰り返し樹脂レンズを成形し続ける場合、該レプリカモールドの表面から前記離型剤が剥離する。そのため、同じレプリカモールドを用いて繰り返し樹脂レンズを成形することが困難となる。 A commonly used replica mold has a low transmittance of UV light used in the manufacturing process of a resin lens, particularly a wavelength of 365 nm. When molding a resin lens using such a replica mold, there is a method of applying a commercially available mold release agent in order to impart mold releasability. However, when the resin lens is continuously molded using the same replica mold, the release agent peels off from the surface of the replica mold. Therefore, it becomes difficult to repeatedly mold the resin lens using the same replica mold.
このように、カメラモジュールなどに用いられる樹脂レンズの成形向けレプリカモールドに使用し得ると共に、高い透明性を有し、繰り返し樹脂レンズを成形可能なレプリカモールドは未だなく、その開発が望まれていた。本発明は、このような事情に鑑みてなされたものであり、高い透明性を有し、繰り返し樹脂レンズを成形可能なレプリカモールドを提供することを目的とする。 As described above, there is still no replica mold that can be used in a replica mold for molding a resin lens used for a camera module or the like, has high transparency, and can repeatedly mold a resin lens, and its development has been desired. .. The present invention has been made in view of such circumstances, and an object thereof is to provide a replica mold having high transparency and capable of repeatedly molding a resin lens.
本発明者らは、上記の課題を解決するべく鋭意検討を行った結果、ラジカル重合性基を1分子中に少なくとも1つ有する化合物、及び光ラジカル重合開始剤を含有する組成物の硬化物から成る構造体に、フッ素原子を含む線状又は鎖状の分子鎖の全ての末端にラジカル重合性基を有する化合物、及び光ラジカル重合開始剤を含有する組成物の硬化物から成る膜を接着させることで本発明を成した。すなわち、本発明のレプリカモールドは、紫外線領域における高い透明性を有し、繰り返し樹脂レンズを成形可能である。 As a result of intensive studies to solve the above problems, the present inventors have found that a cured product of a composition containing a compound having at least one radically polymerizable group in one molecule and a photoradical polymerization initiator. A film comprising a cured product of a composition containing a compound having a radical polymerizable group at all terminals of a linear or chain molecular chain containing a fluorine atom and a photoradical polymerization initiator is adhered to the structure consisting of Thus, the present invention has been accomplished. That is, the replica mold of the present invention has high transparency in the ultraviolet region and can repeatedly mold resin lenses.
すなわち本発明の第1の態様は、下記A層及び該A層に接着した下記B層を備えたインプリント用レプリカモールドである。
A層:下記(a1)成分及び(a2)成分を含む組成物の硬化物から成る構造体
(a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
(a2)成分:前記(a1)成分100質量%に対し、0.01質量%乃至0.3質量%の光ラジカル重合開始剤
B層:下記(b1)成分及び(b2)成分を含む組成物の硬化物から成る膜
(b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
(b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
That is, the first aspect of the present invention is an imprint replica mold including the following layer A and the following layer B adhered to the layer A.
Layer A: Structure (a1) component comprising a cured product of a composition containing the following (a1) component and (a2) component: Compound (a2) component having at least one radically polymerizable group in one molecule: the above ( a1) 0.01 mass% to 0.3 mass% of photoradical polymerization initiator B layer relative to 100 mass% of the component: a film composed of a cured product of a composition containing the following (b1) component and (b2) component ( Component b1): a compound having a linear or chain molecular chain containing a fluorine atom and having radically polymerizable groups at all terminals of the molecular chain (b2) component: 100% by mass of the component (b1) To 0.05 mass% to 15 mass% of photoradical polymerization initiator
前記(b1)成分の化合物は、例えば下記式(1)で表される基及び下記式(2a)又は式(2b)で表される基を含む前記線状又は鎖状の分子鎖の全ての末端に、ウレタン結合を介して、下記式(3)で表される基を有する多官能(メタ)アクリレート化合物である。
Figure JPOXMLDOC01-appb-C000003
 
(式中、Rは炭素原子数1又は2のパーフルオロアルキレン基を表し、R2aは炭素原子数2又は3のアルキレン基を表し、R2bは炭素原子数2又は3の3価の炭化水素基を表し、*はそれぞれ前記ウレタン結合の-O-基と結合する結合手を表し、p及びqはそれぞれ前記式(1)で表される基の繰り返し数及び前記式(2a)で表される基の繰り返し数を表すと共に独立して2以上の整数を表し、Rはメチル基又は水素原子を表す。)
The compound of the component (b1) is, for example, all of the linear or chain molecular chains containing a group represented by the following formula (1) and a group represented by the following formula (2a) or formula (2b). It is a polyfunctional (meth)acrylate compound having a group represented by the following formula (3) at the terminal via a urethane bond.
Figure JPOXMLDOC01-appb-C000003

(In the formula, R 1 represents a perfluoroalkylene group having 1 or 2 carbon atoms, R 2a represents an alkylene group having 2 or 3 carbon atoms, and R 2b is a trivalent carbon atom having 2 or 3 carbon atoms. Represents a hydrogen group, * represents a bond for bonding to the —O— group of the urethane bond, p and q represent the number of repeating groups of the formula (1) and the formula (2a), respectively. Represents a repeating number of a group represented by 2 and independently represents an integer of 2 or more, and R 3 represents a methyl group or a hydrogen atom.)
前記式(2a)で表される基の繰り返し数を表すqが、例えば5乃至12の整数である。 Q, which represents the repeating number of the group represented by the formula (2a), is, for example, an integer of 5 to 12.
前記式(2a)で表される基が、例えばポリ(オキシエチレン)基である。 The group represented by the formula (2a) is, for example, a poly(oxyethylene) group.
前記式(1)で表される基が、例えばオキシパーフルオロメチレン基及びオキシパーフルオロエチレン基の双方を有する基である。 The group represented by the formula (1) is, for example, a group having both an oxyperfluoromethylene group and an oxyperfluoroethylene group.
前記(b1)成分の化合物が、例えば重量平均分子量1000乃至30000のマクロモノマー又はポリマーである。 The compound as the component (b1) is, for example, a macromonomer or polymer having a weight average molecular weight of 1,000 to 30,000.
前記(b1)成分及び(b2)成分を含む組成物が更に光増感剤を含有してもよい。 The composition containing the component (b1) and the component (b2) may further contain a photosensitizer.
前記(a1)成分が少なくとも2種の化合物を含有する場合、該2種の化合物のうち少なくとも1種の化合物は(メタ)アクリロイルオキシ基を1分子中に少なくとも2つ有する化合物である。 When the component (a1) contains at least two compounds, at least one compound of the two compounds is a compound having at least two (meth)acryloyloxy groups in one molecule.
前記(メタ)アクリロイルオキシ基を1分子中に少なくとも2つ有する化合物は、例えば下記式(4)で表されるジ(メタ)アクリレート化合物である。
Figure JPOXMLDOC01-appb-C000004
 
(式中、R及びRはそれぞれ独立に水素原子又はメチル基を表し、R及びRはそれぞれ独立に炭素原子数1乃至4のアルキレン基を表し、R及びRはそれぞれ独立に水素原子又はメチル基を表し、r及びrはそれぞれ独立に1乃至5の整数を表す。)
The compound having at least two (meth)acryloyloxy groups in one molecule is, for example, a di(meth)acrylate compound represented by the following formula (4).
Figure JPOXMLDOC01-appb-C000004

(In the formula, R 4 and R 5 each independently represent a hydrogen atom or a methyl group, R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms, and R 8 and R 9 are each independently Represents a hydrogen atom or a methyl group, and r 1 and r 2 each independently represent an integer of 1 to 5.)
前記A層が、例えばレンズ形状の反転パターンを有する。前記A層の最大厚さが、例えば2.0mmである。 The layer A has, for example, a lens-shaped inverted pattern. The maximum thickness of the A layer is, for example, 2.0 mm.
本発明の他の態様は、下記(a1)成分及び(a2)成分を含む組成物をマスターモールド上に塗布する工程、下記(a1)成分及び(a2)成分を含む組成物を介して前記マスターモールドを基材に圧着する工程、前記マスターモールドを前記基材に圧着させたまま該基材を通して下記(a1)成分及び(a2)成分を含む組成物を露光し、該組成物を光硬化する工程、前記光硬化する工程の後、前記基材上に得られた硬化物を前記マスターモールドから離型しA層を形成する工程、前記A層上に下記(b1)成分乃至(b3)成分を含む組成物を塗布する工程、及び下記(b1)成分乃至(b3)成分を含む組成物を40℃乃至200℃でベークし、その後露光して前記A層に接着した前記B層を形成する工程、を含むインプリント用レプリカモールドの作製方法である。
(a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
(a2)成分:前記(a1)成分100質量%に対し、0.1質量%乃至1質量%の光ラジカル重合開始剤
(b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
(b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
(b3)成分:溶媒
Another aspect of the present invention is the step of applying a composition containing a component (a1) and a component (a2) below onto a master mold, the master containing the composition containing a component (a1) and a component (a2) below. A step of pressure-bonding a mold to a substrate, exposing the composition containing the following component (a1) and component (a2) through the substrate while the master mold is pressure-bonded to the substrate, and photocuring the composition. Step, after the photo-curing step, a step of releasing the cured product obtained on the substrate from the master mold to form an A layer, and the following (b1) component to (b3) component on the A layer And a composition containing the following components (b1) to (b3) is baked at 40° C. to 200° C. and then exposed to form the B layer adhered to the A layer. A method for producing an imprint replica mold, which includes the steps of:
Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1). Component (b1): a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
さらに本発明の他の態様は、下記(a1)成分及び(a2)成分を含む組成物を基材上に塗布する工程、下記(a1)成分及び(a2)成分を含む組成物を介して前記基材をマスターモールドに圧着する工程、前記マスターモールドを前記基材に圧着させたまま該基材を通して下記(a1)成分及び(a2)成分を含む組成物を露光し、該組成物を光硬化する工程、前記光硬化する工程の後、前記基材上に得られた硬化物を前記マスターモールドから離型しA層を形成する工程、前記A層上に下記(b1)成分乃至(b3)成分を含む組成物を塗布する工程、及び下記(b1)成分乃至(b3)成分を含む組成物を40℃乃至200℃でベークし、その後露光して前記A層に接着した前記B層を形成する工程、を含むインプリント用レプリカモールドの作製方法である。
(a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
(a2)成分:前記(a1)成分100質量%に対し、0.1質量%乃至1質量%の光ラジカル重合開始剤
(b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
(b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
(b3)成分:溶媒
Still another embodiment of the present invention is the step of applying a composition containing the following component (a1) and the component (a2) onto a substrate, the above-mentioned composition comprising the component (a1) and the component (a2). A step of press-bonding the base material to the master mold, exposing the composition containing the following component (a1) and component (a2) through the base material while pressing the master mold to the base material, and photocuring the composition. And the step of photo-curing, the step of releasing the cured product obtained on the base material from the master mold to form an A layer, and the following components (b1) to (b3) on the A layer. A step of applying a composition containing the components, and a composition containing the components (b1) to (b3) below is baked at 40° C. to 200° C. and then exposed to form the B layer adhered to the A layer. The method for producing an imprint replica mold including the step of:
Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1). Component (b1): a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
本発明のインプリント用レプリカモールドは、前記(a1)成分及び(a2)成分を含む組成物の硬化物から成る構造体に、前記(b1)成分及び(b2)成分を含む組成物の硬化物から成る膜が接着していることで、厚膜でも高い透明性を有し、連続転写が可能である。 The replica mold for imprint of the present invention is a cured product of a composition containing the component (b1) and the component (b2) in a structure composed of the cured product of the composition containing the component (a1) and the component (a2). Since the film made of is adhered, even a thick film has high transparency and continuous transfer is possible.
また本発明のインプリント用レプリカモールドは、任意の基材上に作製することができ、当該基材上に形成されたレプリカモールドは、厚膜でも紫外線領域において高い透明性を有する。このため、本発明のインプリント用レプリカモールドは、固体撮像素子、センサー用レンズなどの形状精度の求められる光学部材の製造に好適に用いることができる。 The imprint replica mold of the present invention can be produced on any base material, and the replica mold formed on the base material has high transparency even in a thick film in the ultraviolet region. Therefore, the replica mold for imprinting of the present invention can be suitably used for manufacturing an optical member such as a solid-state imaging device and a lens for a sensor, which is required to have a high shape accuracy.
[(a1)成分]
(a1)成分は、ラジカル重合性基を1分子中に少なくとも1つ有する化合物である。該ラジカル重合性基として、例えば(メタ)アクリロイルオキシ基が挙げられる。本発明において(メタ)アクリロイルオキシ基は、アクリロイルオキシ基とメタクリロイルオキシ基の双方を意味する。また、(メタ)アクリレートは、アクリレートとメタクリレートの双方を意味する。
[Component (a1)]
The component (a1) is a compound having at least one radically polymerizable group in one molecule. Examples of the radically polymerizable group include a (meth)acryloyloxy group. In the present invention, the (meth)acryloyloxy group means both an acryloyloxy group and a methacryloyloxy group. Further, (meth)acrylate means both acrylate and methacrylate.
上記(a1)成分の化合物としては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、n-プロピル(メタ)アクリレート、イソプロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、tert-ブチル(メタ)アクリレート、n-ペンチル(メタ)アクリレート、イソペンチル(メタ)アクリレート、n-ヘキシル(メタ)アクリレート、イソへキシル(メタ)アクリレート、n-オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、2-エチルへキシル(メタ)アクリレート、n-ノニル(メタ)アクリレート、イソノニル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、イソステアリル(メタ)アクリレート、テトラデシル(メタ)アクリレート、ベヘニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、シクロへキシル(メタ)アクリレート、1-アダマンチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニルオキエチル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、2-メチル-2-エチル-1,3-ジオキソラン-4-イル)メチル(メタ)アクリレート、シクロヘキサンスピロ-2-(1,3-ジオキソラン-4-イル)メチル(メタ)アクリレート、3-エチル-3-オキセタニルメチル(メタ)アクリレート、γ-ブチロラクトン(メタ)アクリレート、メトキシジエチレングリコールジ(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート、メトキシテトラエチレングリコール(メタ)アクリレート、メトキシポリエチレングリコール#400(メタ)アクリレート、メトキシポリエチレングリコール#600(メタ)アクリレート、メトキシポリエチレングリコール#1000(メタ)アクリレート、メトキシトリプロピレングリコール(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、1,9-ノナンジオールジ(メタ)アクリレート、イソノナンジオールジ(メタ)アクリレート、1,10-デカンジオールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、2-ヒドロキシ-3-メタクリルプロピルアクリレート、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコール#200ジ(メタ)アクリレート、ポリエチレングリコール#400ジ(メタ)アクリレート、ポリエチレングリコール#600ジ(メタ)アクリレート、ポリエチレングリコール#1000ジ(メタ)アクリレート、ジプロピレングリコールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ポリプロピレングリコール#400ジアクリレート、ポリプロピレングリコール#700ジアクリレート、ポリテトラメチレングリコール#650ジ(メタ)アクリレート、ポリエチレンポリプロピレングリコールジ(メタ)アクリレート、ジオキサングリコールジ(メタ)アクリレート、トリシクロデカノールジ(メタ)アクリレート、エトキシ変性水添ビスフェノールAジアクリレート、エトキシ変性水添ビスフェノールAジメタクリレート、プロポキシ変性水添ビスフェノールAジアクリレート、プロポキシ変性水添ビスフェノールAジメタクリレート、ブトキシ変性水添ビスフェノールAジアクリレート、ブトキシ変性水添ビスフェノールAジメタクリレート、エトキシプロポキシ変性水添ビスフェノールAジアクリレート、エトキシプロポキシ変性水添ビスフェノールAジメタクリレート、エトキシ変性水添ビスフェノールFジアクリレート、エトキシ変性水添ビスフェノールFジメタクリレート、トリメチロールプロパントリ(メタ)アクリレート、エトキシ化トリメチロールプロパントリ(メタ)アクリレート、プロポキシ化トリメチロールプロパントリ(メタ)アクリレート、エトキシ化グリセリントリ(メタ)アクリレート、プロポキシ化グリセリントリ(メタ)アクリレート、トリス-(2-(メタ)アクリロイルオキシエチル)イソシアヌレート、カプロラクトン変性トリス-(2-(メタ)アクリロイルオキシエチル)イソシアヌレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、エトキシ化ペンタエリスリトールトリ(メタ)アクリレート、エトキシ化ペンタエリスリトールテトラ(メタ)アクリレート、プロポキシ化ペンタエリスリトールトリ(メタ)アクリレート、プロポキシ化ペンタエリスリトールテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、エトキシ化ジトリメチロールプロパンテトラ(メタ)アクリレート、プロポキシ化ジトリメチロールプロパンテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールポリ(メタ)アクリレート、エトキシ化ジペンタエリスリトールポリ(メタ)アクリレート、プロポキシ化ジペンタエリスリトールポリ(メタ)アクリレート、エトキシ化ポリグリセリンポリ(メタ)アクリレートが挙げられる。 Examples of the compound as the component (a1) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate and isobutyl (meth). Acrylate, tert-butyl(meth)acrylate, n-pentyl(meth)acrylate, isopentyl(meth)acrylate, n-hexyl(meth)acrylate, isohexyl(meth)acrylate, n-octyl(meth)acrylate, isooctyl( (Meth)acrylate, 2-ethylhexyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, tetradecyl (meth) ) Acrylate, behenyl(meth)acrylate, isobornyl(meth)acrylate, cyclohexyl(meth)acrylate, 1-adamantyl(meth)acrylate, dicyclopentanyl(meth)acrylate, dicyclopentenyl oxyethyl(meth)acrylate, Dicyclopentenyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl (meth)acrylate, cyclohexanespiro-2-(1,3- Dioxolan-4-yl)methyl (meth)acrylate, 3-ethyl-3-oxetanylmethyl (meth)acrylate, γ-butyrolactone (meth)acrylate, methoxydiethylene glycol di(meth)acrylate, methoxytriethylene glycol (meth)acrylate, Methoxytetraethylene glycol (meth)acrylate, methoxypolyethylene glycol #400 (meth)acrylate, methoxypolyethylene glycol #600 (meth)acrylate, methoxypolyethylene glycol #1000 (meth)acrylate, methoxytripropylene glycol (meth)acrylate, 1, 4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, isononanediol di(meth)acrylate, 1,10-decanediol di( (Meth)acrylate, neopentyl glycol di(meth)acrylate, 2-hydroxy-3-methacrylpropyl acrylate Relate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol #200 di(meth)acrylate, polyethylene glycol #400 di(meth)acrylate, polyethylene glycol #600 Di(meth)acrylate, polyethylene glycol #1000 di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol #400 diacrylate, polypropylene glycol #700 diacrylate, polytetra Methylene glycol #650 di(meth)acrylate, polyethylene polypropylene glycol di(meth)acrylate, dioxane glycol di(meth)acrylate, tricyclodecanol di(meth)acrylate, ethoxy modified hydrogenated bisphenol A diacrylate, ethoxy modified hydrogenated Bisphenol A dimethacrylate, propoxy modified hydrogenated bisphenol A diacrylate, propoxy modified hydrogenated bisphenol A dimethacrylate, butoxy modified hydrogenated bisphenol A diacrylate, butoxy modified hydrogenated bisphenol A dimethacrylate, ethoxypropoxy modified hydrogenated bisphenol A diacrylate , Ethoxypropoxy modified hydrogenated bisphenol A dimethacrylate, ethoxy modified hydrogenated bisphenol F diacrylate, ethoxy modified hydrogenated bisphenol F dimethacrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxy Trimethylolpropane tri(meth)acrylate, ethoxylated glycerin tri(meth)acrylate, propoxylated glycerin tri(meth)acrylate, tris-(2-(meth)acryloyloxyethyl)isocyanurate, caprolactone modified tris-(2- (Meth)acryloyloxyethyl)isocyanurate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, propoxylated pentaerythritol Tri(meth)acrylate, propoxylated pentaerythritol tetra(meth)acrylate Rate, ditrimethylolpropane tetra(meth)acrylate, ethoxylated ditrimethylolpropane tetra(meth)acrylate, propoxylated ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol poly(meth)acrylate , Ethoxylated dipentaerythritol poly(meth)acrylate, propoxylated dipentaerythritol poly(meth)acrylate, ethoxylated polyglycerin poly(meth)acrylate.
上記(a1)成分の化合物は市販品として入手が可能であり、その具体例としては、ライトエステルM、同E、同NB、同IB、同TB、同EH、同IB-X、同CH、ライトアクリレートIB-XA、(以上、共栄社化学(株)製)、NOAA、IOAA、INAA、LA、STA、ISTA、IBXA、ビスコート#155、1-ADA、1-ADMA、ビスコート#150、MEDOL-10、CHDOL-10、OXE-10、OXE-30、GBLA、GBLMA、ビスコート#195、ビスコート#230、ビスコート#260、ビスコート#295、ビスコート#300、ビスコート#400、ビスコート#360(以上、大阪有機化学工業(株)製)、LA、LMA、A-MS、A-S、S-1800A、A-BH、AM-30G、AM-90G、AM-130G、AM-230G、AM-30PG、M-20G、M-30G、M-40G、M-90G、M-130G、M-230G、A-HD-N、A-NOD-N、A-IND、A-DOD-N、A-NPG、BD、HD-N、NOD-N、DOD-N、NPG、701A、701、A-200、A-400、A-600、A-1000、APG-100、APG-200、APG-400、APG-700、1G、2G、3G、4G、9G、14G、23G、3PG、9PG、A-PTMG-65、A-1206PE、1206PE、A-0612PE、A-0412PE、A-1000PER、1000PER、A-3000PER、A-DOG、A-DCP、DCP、A-TMPT、A-TMPT-3EO、A-TMPT-9EO、AT-20E、AT-30E、A-TMPT-3PO、A-TMPT-6O、TMPT、TMPT-3EO、TMPT-9EO、TMPT-3PO、A-GLY-3E、A-GLY-6E、A-GLY-9E、A-GLY-20E、A-GLY-3P、A-GLY-6P、A-GLY-9P、GLY-3E、GLY-6E、GLY-9E、GLY-20E、A-9300、A-9200、A-9300-1CL、A-9300-3CL、A-TMM-3、A-TMM-3L、A-TMM-3LM-N、ATM-4EL、ATM-8EL、ATM-4PL、TM-4EL、TM-4PL、A-TMMT、ATM-4E、ATM-35E、ATM-4P、ATM-10P、TM-4E、TM-35E、TM-4P、TM-10P、AD-TMP-L、AD-TMP-4E、AD-TMP-4P、D-TMP、D-TMP-4E、D-TMP-4P、A-DPH、A-9550、A-DPH-6E、A-DPH-12E、A-DPH-6EL、A-DPH-12EL、A-DPH-6P、M-DPH-6E、M-DPH-12E、M-DPH-6P、A-PG5027E、A-PG5054E、M-PG5027E、M-PG5054E(以上、新中村化学工業(株))、ファンクリル(登録商標)FA-513AS、同FA-512AS、同FA-511AS(以上、日立化成(株))、ニューフロンティア(登録商標)HBPE-4、同HBPEM-10(以上、第一工業製薬(株)製)、KAYARAD(登録商標)PET-30、同DPHA、同DPEA-12(以上、日本化薬(株)製)が挙げられる。上記(a1)成分は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。 The compound of the component (a1) is available as a commercial product, and specific examples thereof include light ester M, the same E, the same NB, the same IB, the same TB, the same EH, the same IB-X and the same CH, Light acrylate IB-XA (manufactured by Kyoeisha Chemical Co., Ltd.), NOAA, IOAA, INAA, LA, STA, ISTA, IBXA, VISCOAT #155, 1-ADA, 1-ADMA, VISCOAT #150, MEDOL-10 , CHDOL-10, OXE-10, OXE-30, GBLA, GBLMA, viscoat #195, viscoat #230, viscoat #260, viscoat #295, viscoat #300, viscoat #400, viscoat #360 (above, Osaka Organic Chemistry) Industrial, Ltd.), LA, LMA, A-MS, AS, S-1800A, A-BH, AM-30G, AM-90G, AM-130G, AM-230G, AM-30PG, M-20G. , M-30G, M-40G, M-90G, M-130G, M-230G, A-HD-N, A-NOD-N, A-IND, A-DOD-N, A-NPG, BD, HD -N, NOD-N, DOD-N, NPG, 701A, 701, A-200, A-400, A-600, A-1000, APG-100, APG-200, APG-400, APG-700, 1G 2G, 3G, 4G, 9G, 14G, 23G, 3PG, 9PG, A-PTMG-65, A-1206PE, 1206PE, A-0612PE, A-0412PE, A-1000PER, 1000PER, A-3000PER, A-DOG. , A-DCP, DCP, A-TMPT, A-TMPT-3EO, A-TMPT-9EO, AT-20E, AT-30E, A-TMPT-3PO, A-TMPT-6O, TMPT, TMPT-3EO, TMPT -9EO, TMPT-3PO, A-GLY-3E, A-GLY-6E, A-GLY-9E, A-GLY-20E, A-GLY-3P, A-GLY-6P, A-GLY-9P, GLY -3E, GLY-6E, GLY-9E, GLY-20E, A-9300, A-9200, A-9300-1CL, A-9300-3CL, A-TMM-3, A-TMM-3L, A-TMM -3LM-N, ATM-4EL, ATM-8EL, ATM-4PL, TM-4EL, TM-4PL, A-TMMT, ATM-4E, ATM-35E, ATM-4P, ATM-10P, TM-4E, TM -35E, TM-4P, TM -10P, AD-TMP-L, AD-TMP-4E, AD-TMP-4P, D-TMP, D-TMP-4E, D-TMP-4P, A-DPH, A-9550, A-DPH-6E , A-DPH-12E, A-DPH-6EL, A-DPH-12EL, A-DPH-6P, M-DPH-6E, M-DPH-12E, M-DPH-6P, A-PG5027E, A-PG5054E , M-PG5027E, M-PG5054E (above, Shin-Nakamura Chemical Co., Ltd.), Fancryl (registered trademark) FA-513AS, FA-512AS, FA-511AS (above, Hitachi Chemical Co., Ltd.), New Frontier (registered trademark) HBPE-4, HBPEM-10 (above, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), KAYARAD (registered trademark) PET-30, DPHA, DPEA-12 (above, Nippon Kayaku Co., Ltd. ) Made). The component (a1) may be used alone or in combination of two or more.
[(a2)成分]
(a2)成分の光ラジカル重合開始剤は、本発明のインプリント用レプリカモールドのA層を形成するための組成物の光硬化時に使用する光源に吸収をもつものであれば、特に限定されるものではない。該(a2)成分の光ラジカル重合開始剤として、例えば、tert-ブチルペルオキシ-iso-ブチレート、2,5-ジメチル-2,5-ビス(ベンゾイルジオキシ)ヘキサン、1,4-ビス[α-(tert-ブチルジオキシ)-iso-プロポキシ]ベンゼン、ジ-tert-ブチルペルオキシド、2,5-ジメチル-2,5-ビス(tert-ブチルジオキシ)ヘキセンヒドロペルオキシド、α-(iso-プロピルフェニル)-iso-プロピルヒドロペルオキシド、tert-ブチルヒドロペルオキシド、1,1-ビス(tert-ブチルジオキシ)-3,3,5-トリメチルシクロヘキサン、ブチル-4,4-ビス(tert-ブチルジオキシ)バレレート、シクロヘキサノンペルオキシド、2,2’,5,5’-テトラ(tert-ブチルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-ブチルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-アミルペルオキシカルボニル)ベンゾフェノン、3,3’,4,4’-テトラ(tert-ヘキシルペルオキシカルボニル)ベンゾフェノン、3,3’-ビス(tert-ブチルペルオキシカルボニル)-4,4’-ジカルボキシベンゾフェノン、tert-ブチルペルオキシベンゾエート、ジ-tert-ブチルジペルオキシイソフタレート等の有機過酸化物;9,10-アントラキノン、1-クロロアントラキノン、2-クロロアントラキノン、オクタメチルアントラキノン、1,2-ベンズアントラキノン等のキノン類;ベンゾインメチル、ベンゾインエチルエーテル、α-メチルベンゾイン、α-フェニルベンゾイン等のベンゾイン誘導体;2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒドロキシ-1-[4-{4-(2-ヒドロキシ-2-メチルプロピオニル)ベンジル}-フェニル]-2-メチルプロパン-1-オン、フェニルグリオキシリックアシッドメチルエステル、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-1-ブタノン、2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モルホリン-4-イル-フェニル)-ブタン-1-オン等のアルキルフェノン系化合物;ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド、2,4,6-トリメチルベンゾイル-ジフェニル-ホスフィンオキサイド等のアシルホスフィンオキサイド系化合物;2-(O-ベンゾイルオキシム)-1-[4-(フェニルチオ)フェニル]-1,2-オクタンジオン、1-(O-アセチルオキシム)-1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]エタノン等のオキシムエステル系化合物が挙げられる。
[Component (a2)]
The photoradical polymerization initiator of the component (a2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer A of the replica mold for imprint of the present invention. Not a thing. Examples of the radical photopolymerization initiator of the component (a2) include tert-butylperoxy-iso-butyrate, 2,5-dimethyl-2,5-bis(benzoyldioxy)hexane and 1,4-bis[α- (Tert-Butyldioxy)-iso-propoxy]benzene, di-tert-butylperoxide, 2,5-dimethyl-2,5-bis(tert-butyldioxy)hexene hydroperoxide, α-(iso-propylphenyl)-iso- Propyl hydroperoxide, tert-butyl hydroperoxide, 1,1-bis(tert-butyldioxy)-3,3,5-trimethylcyclohexane, butyl-4,4-bis(tert-butyldioxy)valerate, cyclohexanone peroxide, 2,2 ',5,5'-Tetra(tert-butylperoxycarbonyl)benzophenone, 3,3',4,4'-Tetra(tert-butylperoxycarbonyl)benzophenone, 3,3',4,4'-Tetra(tert -Amylperoxycarbonyl)benzophenone, 3,3',4,4'-tetra(tert-hexylperoxycarbonyl)benzophenone, 3,3'-bis(tert-butylperoxycarbonyl)-4,4'-dicarboxybenzophenone, Organic peroxides such as tert-butylperoxybenzoate and di-tert-butyldiperoxyisophthalate; such as 9,10-anthraquinone, 1-chloroanthraquinone, 2-chloroanthraquinone, octamethylanthraquinone and 1,2-benzanthraquinone Quinones; benzoin methyl, benzoin ethyl ether, α-methylbenzoin, α-phenylbenzoin and other benzoin derivatives; 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenyl ketone, 2- Hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy- 1-[4-{4-(2-hydroxy-2-methylpropionyl)benzyl}-phenyl]-2-methylpropan-1-one, phenylglyoxylic acid methyl ester, 2-methyl-1-[4- (Methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinofe Alkylphenone compounds such as nyl)-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one; bis( Acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl)-phenylphosphine oxide and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide; 2-(O-benzoyloxime)-1-[4-( Oxime esters such as phenylthio)phenyl]-1,2-octanedione and 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone System compounds.
上記(a2)成分の光ラジカル重合開始剤は、市販品として入手が可能であり、その具体例としては、IRGACURE(登録商標)651、同184、同500、同2959、同127、同754、同907、同369、同379、同379EG、同819、同819DW、同1800、同1870、同784、同OXE01、同OXE02、同250、同1173、同MBF、同4265、同TPO(以上、BASFジャパン(株)製)、KAYACURE(登録商標)DETX、同MBP、同DMBI、同EPA、同OA(以上、日本化薬(株)製)、VICURE-10、同55(以上、STAUFFER Co.LTD製)、ESACURE(登録商標)KIP150、同TZT、同1001、同KTO46、同KB1、同KL200、同KS300、同EB3、トリアジン-PMS、トリアジンA、トリアジンB(以上、日本シイベルヘグナー(株)製)、アデカオプトマーN-1717、同N-1414、同N-1606((株)ADEKA製)が挙げられる。上記(a2)成分は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。該(a2)成分の光ラジカル重合開始剤の含有割合は、前記(a1)成分100質量%に対し、0.01質量%乃至0.3質量%である。 The photoradical polymerization initiator of the component (a2) is available as a commercial product, and specific examples thereof include IRGACURE (registered trademark) 651, 184, 500, 2959, 127, 754, 907, 369, 379, 379EG, 819, 819DW, 1800, 1870, 784, OXE01, OXE02, 250, 1173, MBF, 4265, TPO (above, BASF Japan Ltd.), KAYACURE (registered trademark) DETX, MBP, DMBI, EPA, OA (Nippon Kayaku Co., Ltd.), VICURE-10, 55 (above, STAUFFER Co.). Ltd.), ESACURE (registered trademark) KIP150, TZT, 1001, KTO46, KB1, KL200, KS300, EB3, triazine-PMS, triazine A, triazine B (above, manufactured by Nippon Sibel Hegner Co., Ltd.). ), Adeka optomer N-1717, N-1414 and N-1606 (manufactured by ADEKA Corporation). The component (a2) may be used alone, or two or more kinds may be mixed and used. The content ratio of the photo radical polymerization initiator of the component (a2) is 0.01% by mass to 0.3% by mass with respect to 100% by mass of the component (a1).
[(b1)成分]
(b1)成分は、フッ素原子を含む線状又は鎖状の分子鎖の全ての末端にラジカル重合性基を有する化合物である。該ラジカル重合性基として、例えば(メタ)アクリロイルオキシ基が挙げられる。
[Component (b1)]
The component (b1) is a compound having a radically polymerizable group at every end of a linear or chain molecular chain containing a fluorine atom. Examples of the radically polymerizable group include a (meth)acryloyloxy group.
上記(b1)成分の化合物としては、例えば、2,2,2-トリフルオロエチル(メタ)アクリレート、2,2,3,3,3-ペンタフルオロプロピル(メタ)アクリレート、2-(パーフルオロブチル)エチル(メタ)アクリレート、3-(パーフルオロブチル)-2-ヒドロキシプロピル(メタ)アクリレート、2-(パーフルオロヘキシル)エチル(メタ)アクリレート、3-パーフルオロヘキシル-2-ヒドロキシプロピル(メタ)アクリレート、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピル(メタ)アクリレート、1H,1H,3H-テトラフルオロプロピル(メタ)アクリレート、1H,1H,5H-オクタフルオロペンチル(メタ)アクリレート、1H,1H,7H-ドデカフルオロヘプチル(メタ)アクリレート、1H-1-(トリフルオロメチル)トリフルオロエチル(メタ)アクリレート、1H,1H,3H-ヘキサフルオロブチル(メタ)アクリレート、1,2,2,2-テトラフルオロ-1-(トリフルオロメチル)エチル(メタ)アクリレート、2,2,3,3-テトラフルオロプロピル(メタ)アクリレート、2,2,3,3,4,4,4-ヘプタフルオロブチル(メタ)アクリレート、1H,1H-ペンタデカフルオロ-n-オクチル(メタ)アクリレート、1H,1H,2H,2H-トリデカフルオロオクチルアクリレート、1,6-ビス((メタ)アクリロイルオキシ)-2,2,3,3,4,4,5,5-オクタフルオロヘキサンが挙げられる。 Examples of the compound as the component (b1) include 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3,3-pentafluoropropyl (meth)acrylate, and 2-(perfluorobutyl). ) Ethyl (meth)acrylate, 3-(perfluorobutyl)-2-hydroxypropyl (meth)acrylate, 2-(perfluorohexyl)ethyl (meth)acrylate, 3-perfluorohexyl-2-hydroxypropyl (meth) Acrylate, 3-(perfluoro-3-methylbutyl)-2-hydroxypropyl(meth)acrylate, 1H,1H,3H-tetrafluoropropyl(meth)acrylate, 1H,1H,5H-octafluoropentyl(meth)acrylate, 1H,1H,7H-dodecafluoroheptyl (meth)acrylate, 1H-1-(trifluoromethyl)trifluoroethyl (meth)acrylate, 1H,1H,3H-hexafluorobutyl (meth)acrylate, 1,2,2 ,2-Tetrafluoro-1-(trifluoromethyl)ethyl(meth)acrylate, 2,2,3,3-tetrafluoropropyl(meth)acrylate, 2,2,3,3,4,4,4-hepta Fluorobutyl (meth)acrylate, 1H,1H-pentadecafluoro-n-octyl (meth)acrylate, 1H,1H,2H,2H-tridecafluorooctyl acrylate, 1,6-bis((meth)acryloyloxy)- 2,2,3,3,4,4,5,5-octafluorohexane may be mentioned.
上記化合物は市販品として入手が可能であり、その具体例としては、2,2,2-トリフルオロエチルアクリレート、2,2,2-トリフルオロエチルメタクリレート、2,2,3,3,3-ペンタフルオロプロピルアクリレート、2,2,3,3,3-ペンタフルオロプロピルメタアクリレート、2-(パーフルオロブチル)エチルアクリレート、2-(パーフルオロブチル)エチルメタアクリレート、3-(パーフルオロブチル)-2-ヒドロキシプロピルアクリレート、3-(パーフルオロブチル)-2-ヒドロキシプロピルメタアクリレート、2-(パーフルオロヘキシル)エチルアクリレート、2-(パーフルオロヘキシル)エチルメタアクリレート、3-パーフルオロヘキシル-2-ヒドロキシプロピルアクリレート、3-パーフルオロヘキシル-2-ヒドロキシプロピルメタアクリレート、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピルアクリレート、3-(パーフルオロ-3-メチルブチル)-2-ヒドロキシプロピルメタアクリレート、1H,1H,3H-テトラフルオロプロピルアクリレート、1H,1H,3H-テトラフルオロプロピルメタアクリレート、1H,1H,5H-オクタフルオロペンチルアクリレート、1H,1H,5H-オクタフルオロペンチルメタアクリレート、1H,1H,7H-ドデカフルオロヘプチルメタアクリレート、1H,1H,7H-ドデカフルオロヘプチルアクリレート、1H-1-(トリフルオロメチル)トリフルオロエチルアクリレート、1H-1-(トリフルオロメチル)トリフルオロエチルメタアクリレート、1H,1H,3H-ヘキサフルオロブチルアクリレート、1H,1H,3H-ヘキサフルオロブチルメタアクリレート、1,2,2,2-テトラフルオロ-1-(トリフルオロメチル)エチルアクリレート、(以上、ダイキン工業(株)製)、2,2,3,3-テトラフルオロプロピルアクリレート、2,2,3,3-テトラフルオロプロピルメタアクリレート、2,2,3,3,4,4,4-ヘプタフルオロブチルメタアクリレート、1H,1H-ペンタデカフルオロ-n-オクチルアクリレート、1,6-ビス(アクリロイルオキシ)-2,2,3,3,4,4,5,5-オクタフルオロヘキサン(以上、東京化成工業(株)製)、LINC-151EPA、LINC-152EPA、LINC-102A、LINC-2A、LINC-5A、LINC-162A、LINC-3A(以上、共栄社化学(株)製)、FLUOROLINK(登録商標)MD500、同MD700、同MD40、同MD1700、FOMBLIN(登録商標)MT70(以上、ソルベイ社製)、ビスコート13F(大阪有機化学工業(株)製)が挙げられる。 The above compounds are available as commercial products, and specific examples thereof include 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3,3,3- Pentafluoropropyl acrylate, 2,2,3,3,3-pentafluoropropyl methacrylate, 2-(perfluorobutyl)ethyl acrylate, 2-(perfluorobutyl)ethyl methacrylate, 3-(perfluorobutyl)- 2-hydroxypropyl acrylate, 3-(perfluorobutyl)-2-hydroxypropyl methacrylate, 2-(perfluorohexyl)ethyl acrylate, 2-(perfluorohexyl)ethyl methacrylate, 3-perfluorohexyl-2- Hydroxypropyl acrylate, 3-perfluorohexyl-2-hydroxypropyl methacrylate, 3-(perfluoro-3-methylbutyl)-2-hydroxypropyl acrylate, 3-(perfluoro-3-methylbutyl)-2-hydroxypropyl meta Acrylate, 1H,1H,3H-tetrafluoropropyl acrylate, 1H,1H,3H-tetrafluoropropyl methacrylate, 1H,1H,5H-octafluoropentyl acrylate, 1H,1H,5H-octafluoropentyl methacrylate, 1H, 1H,7H-dodecafluoroheptyl methacrylate, 1H,1H,7H-dodecafluoroheptyl acrylate, 1H-1-(trifluoromethyl)trifluoroethyl acrylate, 1H-1-(trifluoromethyl)trifluoroethyl methacrylate, 1H,1H,3H-hexafluorobutyl acrylate, 1H,1H,3H-hexafluorobutyl methacrylate, 1,2,2,2-tetrafluoro-1-(trifluoromethyl)ethyl acrylate, (above, Daikin Industries ( Ltd.), 2,2,3,3-tetrafluoropropyl acrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 2,2,3,3,4,4,4-heptafluorobutylmethacrylate Acrylate, 1H,1H-pentadecafluoro-n-octyl acrylate, 1,6-bis(acryloyloxy)-2,2,3,3,4,4,5,5-octafluorohexane (above, Tokyo Chemical Industry Co., Ltd.), LINC-151EPA, LINC-152EPA, LINC-102A, LINC-2 A, LINC-5A, LINC-162A, LINC-3A (all manufactured by Kyoeisha Chemical Co., Ltd.), FLUOROLINK (registered trademark) MD500, same MD700, same MD40, same MD1700, FOMBLIN (registered trademark) MT70 (above, Solvay) And manufactured by Viscoat 13F (manufactured by Osaka Organic Chemical Industry Co., Ltd.).
前記(b1)成分は、前記式(1)で表される基及び前記式(2a)又は式(2b)で表される基を含む線状又は鎖状の分子鎖の全ての末端に、ウレタン結合を介して、前記式(3)で表される基、すなわち(メタ)アクリロイルオキシ基を含む重合性基を有する多官能(メタ)アクリレート化合物でもよい。ここで、多官能(メタ)アクリレート化合物は、単官能(メタ)アクリレート化合物を除く、2官能以上のアクリレート化合物又はメタクリレート化合物である。そして、上記ウレタン結合とは、-NH-C(=O)-O-で表される構造をいう。上記多官能(メタ)アクリレート化合物は、1分子中に、ウレタン結合を2つ又は4つ、及び(メタ)アクリロイルオキシ基を含む重合性基を2つ又は4つ有する。なお、前記式(1)で表される基はポリ(オキシパーフルオロアルキレン)基と称することがあり、前記式(2a)で表される基はポリ(オキシアルキレン)基と称することがある。 The component (b1) has urethane groups at all terminals of a linear or chain molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b). It may be a polyfunctional (meth)acrylate compound having a polymerizable group containing a group represented by the formula (3), that is, a (meth)acryloyloxy group, through a bond. Here, the polyfunctional (meth)acrylate compound is a bifunctional or higher functional acrylate compound or methacrylate compound excluding the monofunctional (meth)acrylate compound. The urethane bond means a structure represented by —NH—C(═O)—O—. The polyfunctional (meth)acrylate compound has two or four urethane bonds and two or four polymerizable groups containing a (meth)acryloyloxy group in one molecule. The group represented by the formula (1) may be referred to as a poly(oxyperfluoroalkylene) group, and the group represented by the formula (2a) may be referred to as a poly(oxyalkylene) group.
上記線状又は鎖状の分子鎖は、前記式(1)で表される基及び前記式(2a)又は式(2b)で表される基を含む分子鎖であれば特に限定されない。上記線状又は鎖状の分子鎖において、前記式(1)で表される基と前記式(2a)又は式(2b)で表される基の結合順序は特に限定されず、また各基の数は特に限定されない。また、上記線状又は鎖状の分子鎖において、式(1)で表される基と式(2a)又は式(2b)で表される基は単結合で結合(直接結合)されていてもよいし、炭素原子数1乃至3のアルキレン基、炭素原子数1乃至3のパーフルオロアルキレン基、或いはそれらの組み合わせ等の構造(連結基)を介して結合されていてもよい。 The linear or chain molecular chain is not particularly limited as long as it is a molecular chain containing the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b). In the above-mentioned linear or chain molecular chain, the bonding order of the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) is not particularly limited, and The number is not particularly limited. Further, in the above linear or chain molecular chain, the group represented by the formula (1) and the group represented by the formula (2a) or the formula (2b) may be bonded by a single bond (direct bond). Alternatively, they may be bonded via a structure (linking group) such as an alkylene group having 1 to 3 carbon atoms, a perfluoroalkylene group having 1 to 3 carbon atoms, or a combination thereof.
前記式(1)で表される基におけるオキシパーフルオロアルキレン基:-(O-R)-のRの炭素原子数は1又は2である。すなわち、前記式(1)で表される基は、炭素原子数1又は2の2価のフッ化炭素基と酸素原子が交互に連結した構造を有し、オキシパーフルオロアルキレン基は炭素原子数1又は2の2価のフッ化炭素基と酸素原子が連結した構造を有する。該オキシパーフルオロアルキレン基として具体的には、-(OCF)-(すなわちオキシパーフルオロメチレン基)及び-(OCFCF)-(すなわちオキシパーフルオロエチレン基)が挙げられる。上記オキシパーフルオロアルキレン基は、-(OCF)-及び-(OCFCF)-のうちいずれか1種を単独で使用してもよく、2種を組み合わせて使用してもよい。2種を組み合わせて使用する場合、-(OCF)-及び-(OCFCF)-の結合はブロック結合及びランダム結合の何れであってもよい。 The number of carbon atoms of R 1 of the oxyperfluoroalkylene group: —(O—R 1 )— in the group represented by the formula (1) is 1 or 2. That is, the group represented by the formula (1) has a structure in which a divalent fluorocarbon group having 1 or 2 carbon atoms and an oxygen atom are alternately linked, and the oxyperfluoroalkylene group has a carbon atom number. It has a structure in which a monovalent or divalent divalent fluorocarbon group and an oxygen atom are linked. Specific examples of the oxyperfluoroalkylene group include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoroethylene group). As the oxyperfluoroalkylene group, one of -(OCF 2 )- and -(OCF 2 CF 2 )- may be used alone, or two types may be used in combination. When two types are used in combination, the bond of —(OCF 2 )— and —(OCF 2 CF 2 )— may be either a block bond or a random bond.
モールドの離型性を高める観点から、前記式(1)で表される基として、-(OCF)-(すなわちオキシパーフルオロメチレン基)と-(OCFCF)-(すなわちオキシパーフルオロエチレン基)の双方を有する基を用いることが好ましい。前記式(1)で表される基として、-(OCF)-と-(OCFCF)-とが、モル比率で[-(OCF)-]:[-(OCFCF)-]=2:1~1:2となる割合で含む基であることが好ましく、およそ1:1となる割合で含む基であることがより好ましい。これらの結合は、ブロック結合及びランダム結合の何れであってもよい。前記式(1)で表される基の繰り返し数pは、2以上の整数であり、5乃至30の範囲であることが好ましく、7乃至21の範囲であることがより好ましい。 From the viewpoint of enhancing the mold releasability of the mold, the groups represented by the formula (1) include -(OCF 2 )- (that is, oxyperfluoromethylene group) and -(OCF 2 CF 2 )- (that is, oxyperfluoro). It is preferable to use a group having both of (ethylene group). As the group represented by the formula (1), -(OCF 2 )- and -(OCF 2 CF 2 )- are molar ratio [-(OCF 2 )-]: [-(OCF 2 CF 2 ). It is preferable that the group is contained in a ratio of −]=2:1 to 1:2, and it is more preferable that the group is contained in a ratio of about 1:1. These bonds may be block bonds or random bonds. The repeating number p of the group represented by the formula (1) is an integer of 2 or more, preferably in the range of 5 to 30, and more preferably in the range of 7 to 21.
また、前記式(1)で表される基のゲル浸透クロマトグラフィーによるポリスチレン換算で測定される重量平均分子量(Mw)は、1,000乃至5,000、好ましくは1,500乃至3,000である。 The weight average molecular weight (Mw) measured by gel permeation chromatography of the group represented by the formula (1) is 1,000 to 5,000, preferably 1,500 to 3,000. is there.
前記式(2a)で表される基におけるオキシアルキレン基:-(O-R)-のRの炭素原子数は2又は3である。すなわち、前記式(2a)で表される基は、炭素原子数2又は3のアルキレン基と酸素原子が交互に連結した構造を有し、オキシアルキレン基は炭素原子数2又は3のアルキレン基と酸素原子が連結した構造を有する。上記オキシアルキレン基としては、オキシエチレン基、オキシプロピレン基、及びオキシトリメチレン基が挙げられる。上記オキシアルキレン基は、1種を単独で使用してもよく、或いは2種以上を組み合わせて使用してもよい。該オキシアルキレン基を2種以上組み合わせて使用する場合、2種以上のオキシアルキレン基の結合はブロック結合及びランダム結合の何れであってもよい。 The number of carbon atoms of R 2 of the oxyalkylene group: —(O—R 2 )— in the group represented by the formula (2a) is 2 or 3. That is, the group represented by the formula (2a) has a structure in which an alkylene group having 2 or 3 carbon atoms and an oxygen atom are alternately linked, and an oxyalkylene group is an alkylene group having 2 or 3 carbon atoms. It has a structure in which oxygen atoms are linked. Examples of the oxyalkylene group include an oxyethylene group, an oxypropylene group, and an oxytrimethylene group. The above oxyalkylene groups may be used alone or in combination of two or more. When two or more oxyalkylene groups are used in combination, the bonds of the two or more oxyalkylene groups may be either block bonds or random bonds.
前記式(2a)で表される基は、例えばポリ(オキシエチレン)基である。前記式(2a)で表される基の繰り返し数qは2以上の整数であり、例えば2乃至15の範囲であり、好ましくは2乃至12の範囲、又は5乃至12の範囲、或いは7乃至12の範囲である。 The group represented by the formula (2a) is, for example, a poly(oxyethylene) group. The repeating number q of the group represented by the formula (2a) is an integer of 2 or more, for example, in the range of 2 to 15, preferably in the range of 2 to 12, or in the range of 5 to 12, or in the range of 7 to 12. The range is.
前記式(2b)で表される基における3価の炭化水素基:R2bの炭素原子数は2又は3である。すなわち、前記式(2b)で表される基は、炭素原子数2又は3のアルカントリレン基(炭素原子数2又は3のアルキレン基の任意の炭素原子から一個の水素原子を除去した3価の基)に1つの酸素原子が連結した構造を有する。前記式(2b)で表される基の中でも、1,2,3-プロパントリイル基の1位(又は3位)に1つの酸素原子が連結した基であることが好ましい。 The trivalent hydrocarbon group R 2b in the group represented by the formula (2b) has 2 or 3 carbon atoms. That is, the group represented by the formula (2b) is a trivalent group obtained by removing one hydrogen atom from an arbitrary carbon atom of an alkylene group having 2 or 3 carbon atoms (an alkylene group having 2 or 3 carbon atoms). The group) has a structure in which one oxygen atom is linked. Among the groups represented by the formula (2b), a group in which one oxygen atom is linked to the 1-position (or 3-position) of the 1,2,3-propanetriyl group is preferable.
前記(メタ)アクリロイルオキシ基を含む重合性基は、(メタ)アクリロイルオキシ基を1つ有するものに限らず、2つ以上有するものであってもよい。前記(メタ)アクリロイルオキシ基を含む重合性基として、例えば、以下に示す式[X1]乃至式[X5]で表される構造(末端基)、及びこれらの構造(末端基)におけるアクリロイルオキシ基をメタクリロイルオキシ基に置換した構造が挙げられる。 The polymerizable group containing a (meth)acryloyloxy group is not limited to having one (meth)acryloyloxy group, and may have two or more. Examples of the polymerizable group containing a (meth)acryloyloxy group include structures (terminal groups) represented by the following formulas [X1] to [X5], and acryloyloxy groups in these structures (terminal groups). And a structure in which is substituted with a methacryloyloxy group.
Figure JPOXMLDOC01-appb-C000005
 
Figure JPOXMLDOC01-appb-C000005
 
前記(b1)成分が前記(メタ)アクリロイルオキシ基を含む重合性基を有する多官能(メタ)アクリレート化合物である場合、工業的製造が容易であるという点から、以下に示す構造式(A-1)で表される化合物、(A-2)で表される化合物及び(A-3)で表される化合物、並びにこれらの化合物中のアクリロイルオキシ基をメタクリロイルオキシ基に置換した化合物を好ましい例として挙げることができる。なお、下記構造式中、2つのX又は4つのXはそれぞれ前記式[X1]乃至式[X5]で表される構造(末端基)のうちの1つを表し、PFPEはポリ(オキシパーフルオロアルキレン)基を表し、q及びqはそれぞれ独立してオキシエチレン基の数、例えば2乃至15の整数を表し、好ましくは2乃至12の整数を表し、又は5乃至12の整数を表し、或いは7乃至12の整数を表す。
Figure JPOXMLDOC01-appb-C000006
 
When the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group, the following structural formula (A- Preferred examples are the compound represented by 1), the compound represented by (A-2) and the compound represented by (A-3), and the compound in which the acryloyloxy group in these compounds is substituted with a methacryloyloxy group. Can be mentioned as. In the structural formulas below, two X's or four X's each represent one of the structures (terminal groups) represented by the above formulas [X1] to [X5], and PFPE is poly(oxyperfluoro). Alkylene) group, q 1 and q 2 each independently represent the number of oxyethylene groups, for example, an integer of 2 to 15, preferably an integer of 2 to 12, or an integer of 5 to 12, Alternatively, it represents an integer of 7 to 12.
Figure JPOXMLDOC01-appb-C000006
前記(b1)成分が前記(メタ)アクリロイルオキシ基を含む重合性基を有する多官能(メタ)アクリレート化合物である場合、該(メタ)アクリロイルオキシ基を含む重合性基は、(メタ)アクリロイルオキシ基を2つ以上有する、例えば上記式[X3]乃至式[X5]で表される構造(末端基)であることが好ましい。 When the component (b1) is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group, the polymerizable group containing the (meth)acryloyloxy group is (meth)acryloyloxy. The structure (terminal group) represented by the above formulas [X3] to [X5] is preferable, which has two or more groups.
前記(b1)成分は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。該(b1)成分は、該(b1)成分と、後述する(b2)成分、(b3)成分及び任意成分であるその他添加剤との総質量100質量%に対し、好ましくは0.1質量%乃至10質量%、より好ましくは0.5質量%乃至8質量%の割合で使用することが望ましい。 The component (b1) may be used alone or in combination of two or more. The component (b1) is preferably 0.1% by mass based on 100% by mass of the total amount of the component (b1) and the components (b2), (b3) described below and other additives which are optional components. It is desirable to use it in an amount of 10 to 10% by mass, more preferably 0.5 to 8% by mass.
前記(b1)成分は、例えば、前記式(1)で表される基の両末端に、直接結合するか或いは前記連結基を介して結合する、前記式(2a)又は式(2b)で表される基を介して少なくとも2つのヒドロキシ基を有する化合物において、該少なくとも2つのヒドロキシ基に対して、2-(メタ)アクリロイルオキシエチルイソシアネート、1,1-ビス((メタ)アクリロイルオキシメチル)エチルイソシアネート等の、(メタ)アクリロイルオキシ基を有するイソシアネート化合物を、ウレタン化反応させる方法により得られる。 The component (b1) is, for example, represented by the formula (2a) or the formula (2b), which is directly bonded to both ends of the group represented by the formula (1) or bonded via the linking group. A compound having at least two hydroxy groups via the group described above, 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis((meth)acryloyloxymethyl)ethyl with respect to the at least two hydroxy groups It can be obtained by a method of subjecting an isocyanate compound having a (meth)acryloyloxy group such as isocyanate to a urethanization reaction.
前記(b1)成分のゲル浸透クロマトグラフィーによるポリスチレン換算で測定される重量平均分子量(Mw)は1,500乃至7,000、好ましくは2,000乃至6,000である。 The component (b1) has a weight average molecular weight (Mw) measured by gel permeation chromatography in terms of polystyrene of 1,500 to 7,000, preferably 2,000 to 6,000.
本発明のインプリント用レプリカモールドのB層を形成するための組成物は、前記(b1)成分に加えて、前記式(1)で表される基及び前記式(2a)又は式(2b)で表される基を含む線状又は鎖状の分子鎖の一部の末端にのみウレタン結合を介して、(メタ)アクリロイルオキシ基を含む重合性基を有し、且つ該線状又は鎖状の分子鎖の他の末端にヒドロキシ基を有する化合物(すなわち該他の末端においては重合性基を有していない化合物)が含まれていてもよい。前記B層を形成するための組成物はさらに、前記式(1)で表される基及び前記式(2a)又は式(2b)で表される基を含む線状又は鎖状の分子鎖の全ての末端にヒドロキシ基を有する化合物、すなわち上記重合性基を有していない化合物が含まれていてもよい。前記B層を形成するための組成物は、離型剤と称することがある。 The composition for forming the layer B of the replica mold for imprinting of the present invention is, in addition to the component (b1), a group represented by the formula (1) and the formula (2a) or the formula (2b). Having a polymerizable group containing a (meth)acryloyloxy group through a urethane bond only at a part of the terminal of a linear or chain molecular chain containing a group represented by A compound having a hydroxy group at the other end of its molecular chain (that is, a compound having no polymerizable group at the other end) may be contained. The composition for forming the B layer further comprises a linear or chain molecular chain containing a group represented by the formula (1) and a group represented by the formula (2a) or the formula (2b). A compound having a hydroxy group at all terminals, that is, a compound not having the above-mentioned polymerizable group may be contained. The composition for forming the B layer may be referred to as a release agent.
[(b2)成分]
(b2)成分の光ラジカル重合開始剤は、本発明のインプリント用レプリカモールドのB層を形成するための組成物の光硬化時に使用する光源に吸収をもつものであれば、特に限定されるものではない。該(b2)成分として、前記(a2)成分と同様の光ラジカル重合開始剤が挙げられる。前記(b2)成分は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。該(b2)成分の光ラジカル重合開始剤の含有割合は、前記(b1)成分100質量%に対し0.05質量%乃至15質量%である。
[Component (b2)]
The photoradical polymerization initiator of the component (b2) is not particularly limited as long as it has absorption in the light source used during photocuring of the composition for forming the layer B of the replica mold for imprint of the present invention. Not a thing. Examples of the component (b2) include the same radical photopolymerization initiator as the component (a2). The component (b2) may be used alone or in combination of two or more. The content ratio of the photo radical polymerization initiator of the component (b2) is 0.05% by mass to 15% by mass based on 100% by mass of the component (b1).
[(b3)成分]
(b3)成分である溶媒は、前記(b1)成分及び(b2)成分の粘度調節の役割を果たし、該(b1)成分及び(b2)成分の粘度を調節することができるものであれば、特に限定されるものではない。該(b3)成分は、前記B層を形成する工程で除去される。
[Component (b3)]
The solvent which is the component (b3) plays a role of adjusting the viscosity of the component (b1) and the component (b2), and can adjust the viscosity of the component (b1) and the component (b2). It is not particularly limited. The component (b3) is removed in the step of forming the B layer.
該溶媒としては、例えば、トルエン、p-キシレン、o-キシレン、スチレン、エチレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテル、エチレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノイソプロピルエーテル、エチレングリコールメチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、エチレングリコールエチルエーテルアセテート、ジエチレングリコ-ルジメチルエーテル、プロピレングリコールモノブチルエーテル、エチレングリコールモノブチルエーテル、ジエチレングリコールジエチルエーテル、ジプロピレングリコールモノメチルエーテル、ジエチレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジエチレングリコールモノエチルエーテル、トリエチレングリコールジメチルエーテル、ジエチレングリコールモノエチルエーテルアセテート、ジエチレングリコール、1-オクタノール、エチレングリコール、ヘキシレングリコール、ジアセトンアルコール、フルフリルアルコール、テトラヒドロフルフリルアルコール、プロピレングリコール、ベンジルアルコール、1,3-ブタンジオール、1,4-ブタンジオール、2,3-ブタンジオール、γ-ブチロラクトン、アセトン、メチルエチルケトン、メチルイソプロピルケトン、ジエチルケトン、メチルイソブチルケトン、メチルn-ブチルケトン、シクロヘキサノン、2-ヘプタノン、酢酸エチル、酢酸イソプロピル、酢酸n-プロピル、酢酸イソブチル、酢酸n-ブチル、乳酸エチル、ピルビン酸エチル、メタノール、エタノール、イソプロパノール、tert-ブタノール、アリルアルコール、n-プロパノール、2-メチル-2-ブタノール、イソブタノール、n-ブタノール、2-メチル-1-ブタノール、1-ペンタノール、2-メチル-1-ペンタノール、2-エチルヘキサノール、トリメチレングリコール、1-メトキシ-2-ブタノール、イソプロピルエーテル、1,4-ジオキサン、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチル-2-ピロリドン、1,3-ジメチル-2-イミダゾリジノン、ジメチルスルホキシド、N-シクロヘキシル-2-ピロリジン、メチルパーフルオロプロピルエーテル、メチルノナフルオロブチルエーテル、メチルノナフルオロイソブチルエーテル、エチルノナフルオロブチルエーテル、エチルノナフルオロイソブチルエーテル、1,1,1,2,2,3,4,5,5,5-デカフロオロ-3-メトキシ-4-(トリフルオロメチル)-ペンタン、1,1,2,2-テトラフルオロエチル-2,2,2-トリフルオロエチルエーテル、1,1,1,2,3,4,4,5,5,5-デカフルオロペンタン、ペンタフルオロノナン、ヘキサフルオロベンゼン、ヘプタデカフルオロ-n-オクチルブロミド、1,1,1,3,3,3-ヘキサフルオロ-2-メトキシプロパン、オクタデカフルオロオクタン、オクタフルオロシクロペンテン、パーフルオロトリブチルアミン、パーフルオロデカリン、パーフルオロヘキサン、パーフルオロメチルシクロヘキサン、パーフルオロヘプタン、オクタフルオロトルエン、パーフルオロトリペンチルアミン、パーフルオロトリエチルアミン、パーフルオロ(1,3-ジメチルシクロヘキサン)、パーフルオロイソヘキサンが挙げられる。 Examples of the solvent include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether. , Ethylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene Glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol, 1-octanol, ethylene glycol, hexylene glycol, diacetone alcohol, furfuryl alcohol, tetrahydrofurfuryl alcohol, propylene glycol, Benzyl alcohol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, γ-butyrolactone, acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl ketone, methyl n-butyl ketone, cyclohexanone, 2-heptanone, ethyl acetate, isopropyl acetate, n-propyl acetate, isobutyl acetate, n-butyl acetate, ethyl lactate, ethyl pyruvate, methanol, ethanol, isopropanol, tert-butanol, allyl alcohol, n-propanol, 2-methyl -2-butanol, isobutanol, n-butanol, 2-methyl-1-butanol, 1-pentanol, 2-methyl-1-pentanol, 2-ethylhexanol, trimethylene glycol, 1-methoxy-2-butanol , Isopropyl ether, 1,4-dioxane, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfoxide, N-cyclohexyl -2-Pyrrolidine, methyl perfluoropropyl ether, methyl nona Fluorobutyl ether, methyl nonafluoroisobutyl ether, ethyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(tri Fluoromethyl)-pentane, 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, 1,1,1,2,3,4,4,5,5,5-deca Fluoropentane, pentafluorononane, hexafluorobenzene, heptadecafluoro-n-octyl bromide, 1,1,1,3,3,3-hexafluoro-2-methoxypropane, octadecafluorooctane, octafluorocyclopentene, per Fluorotributylamine, perfluorodecalin, perfluorohexane, perfluoromethylcyclohexane, perfluoroheptane, octafluorotoluene, perfluorotripentylamine, perfluorotriethylamine, perfluoro(1,3-dimethylcyclohexane), perfluoroisohexane Is mentioned.
前記(b3)成分である溶媒は、市販品として入手が可能であり、その具体例としては、Novec(登録商標)7000、同7100、同7200、同7300(以上、スリーエムジャパン(株)製)、アサヒクリン(登録商標)AE-3000、同AE-3100E(以上、AGC(株)製)、バートレル(登録商標)XF、同XF-UP、同XE-XP、同X-E10、同X-P10、同X-D、同X-GY、同MCA、同SDG、同SMT、同SFR、同DC、同シネラ、同スープリオン、同サイオン(以上、三井・デュポン フロロケミカル(株)製)が挙げられる。前記(b3)成分は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。 The solvent which is the component (b3) is available as a commercial product, and specific examples thereof include Novec (registered trademark) 7000, 7100, 7200, and 7300 (above, manufactured by 3M Japan Co., Ltd.). , ASAHIKLIN (registered trademark) AE-3000, AE-3100E (above, manufactured by AGC Corporation), Vertrel (registered trademark) XF, XF-UP, XE-XP, X-E10, X- P10, X-D, X-GY, MCA, SDG, SMT, SFR, DC, Cinera, Supraion, Psion (Mitsui DuPont Fluorochemical Co., Ltd.) Can be mentioned. The component (b3) may be used alone or in combination of two or more.
[その他添加剤]
本発明のインプリント用レプリカモールドのA層を形成するための組成物は、必要に応じて溶媒を含有することができる。また、前記A層を形成するための組成物及び前記B層を形成するための組成物は、本発明の効果を損なわない限りにおいて、必要に応じて界面活性剤、連鎖移動剤、及び光増感剤を含有することができる。
[Other additives]
The composition for forming the layer A of the replica mold for imprints of the present invention may contain a solvent, if necessary. In addition, the composition for forming the A layer and the composition for forming the B layer may contain a surfactant, a chain transfer agent, and a photosensitizer, if necessary, as long as the effects of the present invention are not impaired. Sensitizers may be included.
該溶媒としては、例えば、トルエン、p-キシレン、o-キシレン、スチレン、エチレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテル、エチレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノイソプロピルエーテル、エチレングリコールメチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、エチレングリコールエチルエーテルアセテート、ジエチレングリコ-ルジメチルエーテル、プロピレングリコールモノブチルエーテル、エチレングリコールモノブチルエーテル、ジエチレングリコールジエチルエーテル、ジプロピレングリコールモノメチルエーテル、ジエチレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジエチレングリコールモノエチルエーテル、トリエチレングリコールジメチルエーテル、ジエチレングリコールモノエチルエーテルアセテート、ジエチレングリコール、1-オクタノール、エチレングリコール、ヘキシレングリコール、ジアセトンアルコール、フルフリルアルコール、テトラヒドロフルフリルアルコール、プロピレングリコール、ベンジルアルコール、1,3-ブタンジオール、1,4-ブタンジオール、2,3-ブタンジオール、γ-ブチロラクトン、アセトン、メチルエチルケトン、メチルイソプロピルケトン、ジエチルケトン、メチルイソブチルケトン、メチルn-ブチルケトン、シクロヘキサノン、2-ヘプタノン、酢酸エチル、酢酸イソプロピル、酢酸n-プロピル、酢酸イソブチル、酢酸n-ブチル、乳酸エチル、ピルビン酸エチル、メタノール、エタノール、イソプロパノール、tert-ブタノール、アリルアルコール、n-プロパノール、2-メチル-2-ブタノール、イソブタノール、n-ブタノール、2-メチル-1-ブタノール、1-ペンタノール、2-メチル-1-ペンタノール、2-エチルヘキサノール、トリメチレングリコール、1-メトキシ-2-ブタノール、イソプロピルエーテル、1,4-ジオキサン、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチル-2-ピロリドン、1,3-ジメチル-2-イミダゾリジノン、ジメチルスルホキシド、N-シクロヘキシル-2-ピロリジン、メチルパーフルオロプロピルエーテル、メチルノナフルオロブチルエーテル、メチルノナフルオロイソブチルエーテル、エチルノナフルオロブチルエーテル、エチルノナフルオロイソブチルエーテル、1,1,1,2,2,3,4,5,5,5-デカフロオロ-3-メトキシ-4-(トリフルオロメチル)-ペンタン、1,1,2,2-テトラフルオロエチル-2,2,2-トリフルオロエチルエーテル、1,1,1,2,3,4,4,5,5,5-デカフルオロペンタン、ペンタフルオロノナン、ヘキサフルオロベンゼン、ヘプタデカフルオロ-n-オクチルブロミド、1,1,1,3,3,3-ヘキサフルオロ-2-メトキシプロパン、オクタデカフルオロオクタン、オクタフルオロシクロペンテン、パーフルオロトリブチルアミン、パーフルオロデカリン、パーフルオロヘキサン、パーフルオロメチルシクロヘキサン、パーフルオロヘプタン、オクタフルオロトルエン、パーフルオロトリペンチルアミン、パーフルオロトリエチルアミン、パーフルオロ(1,3-ジメチルシクロヘキサン)、パーフルオロイソヘキサンが挙げられる。上記溶媒は1種単独で用いてもよく、又は2種以上を混合して用いてもよい。 Examples of the solvent include toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether. , Ethylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene Glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol, 1-octanol, ethylene glycol, hexylene glycol, diacetone alcohol, furfuryl alcohol, tetrahydrofurfuryl alcohol, propylene glycol, Benzyl alcohol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, γ-butyrolactone, acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl ketone, methyl n-butyl ketone, cyclohexanone, 2-heptanone, ethyl acetate, isopropyl acetate, n-propyl acetate, isobutyl acetate, n-butyl acetate, ethyl lactate, ethyl pyruvate, methanol, ethanol, isopropanol, tert-butanol, allyl alcohol, n-propanol, 2-methyl -2-butanol, isobutanol, n-butanol, 2-methyl-1-butanol, 1-pentanol, 2-methyl-1-pentanol, 2-ethylhexanol, trimethylene glycol, 1-methoxy-2-butanol , Isopropyl ether, 1,4-dioxane, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfoxide, N-cyclohexyl -2-Pyrrolidine, methyl perfluoropropyl ether, methyl nona Fluorobutyl ether, methyl nonafluoroisobutyl ether, ethyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(tri Fluoromethyl)-pentane, 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, 1,1,1,2,3,4,4,5,5,5-deca Fluoropentane, pentafluorononane, hexafluorobenzene, heptadecafluoro-n-octyl bromide, 1,1,1,3,3,3-hexafluoro-2-methoxypropane, octadecafluorooctane, octafluorocyclopentene, per Fluorotributylamine, perfluorodecalin, perfluorohexane, perfluoromethylcyclohexane, perfluoroheptane, octafluorotoluene, perfluorotripentylamine, perfluorotriethylamine, perfluoro(1,3-dimethylcyclohexane), perfluoroisohexane Is mentioned. The above solvents may be used alone or in combination of two or more.
上記界面活性剤としては、例えば、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンオレイルエーテル等のポリオキシエチレンアルキルエーテル類、ポリオキシエチレンオクチルフェニルエーテル、ポリオキシエチレンノニルフェニルエーテル等のポリオキシエチレンアルキルアリールエーテル類、ポリオキシエチレン・ポリオキシプロピレンブロックコポリマー類、ソルビタンモノラウレート、ソルビタンモノパルミテート、ソルビタンモノステアレート、ソルビタンモノオレエート、ソルビタントリオレエート、ソルビタントリステアレート等のソルビタン脂肪酸エステル類、ポリオキシエチレンソルビタンモノラウレート、ポリオキシエチレンソルビタンモノパルミテート、ポリオキシエチレンソルビタンモノステアレート、ポリオキシエチレンソルビタントリオレエート、ポリオキシエチレンソルビタントリステアレート等のポリオキシエチレンソルビタン脂肪酸エステル類等のノニオン系界面活性剤が挙げられる。上記界面活性剤は、市販品として入手が可能であり、その具体例としては、エフトップ(登録商標)EF301、同EF303、同EF352(以上、三菱マテリアル電子化成(株)製)、メガファック(登録商標)F-171、同F-173、同F-477、同F-486、同F-554、同F-556、同R-08、同R-30、同R-30N、同R-40、同R-40-LM、同RS-56、同RS-75、同RS-72-K、同RS-76-E、同RS-76-NS、同RS-78、同RS-90(以上、DIC(株)製)、フロラードFC430、同FC431(以上、スリーエムジャパン(株)製)、アサヒガード(登録商標)AG710、サーフロン(登録商標)S-382、同SC101、同SC102、同SC103、同SC104、同SC105、同SC106(以上、AGC(株)製)等のフッ素系界面活性剤;及びオルガノシロキサンポリマーKP341(信越化学工業(株)製)、BYK-302、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-370、BYK-375、BYK-378、BYK-UV 3500、BYK-UV 3570(以上、ビックケミー・ジャパン(株)製)が挙げられる。上記界面活性剤は、1種単独で用いてもよく、又は2種以上を混合して用いてもよい。前記A層を形成するための組成物及び前記B層を形成するための組成物が上記界面活性剤を含有する場合、その含有割合は、(a1)成分100質量%に対し、0.01質量%乃至10質量%であることが好ましい。 Examples of the surfactant include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, and other polyoxyethylene alkyl ethers, polyoxyethylene octylphenyl ether, polyoxyethylene. Polyoxyethylene alkylaryl ethers such as ethylene nonylphenyl ether, polyoxyethylene/polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan Sorbitan fatty acid esters such as tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate, etc. Examples include nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters. The above-mentioned surfactant is available as a commercial product, and specific examples thereof include Ftop (registered trademark) EF301, EF303, EF352 (above, manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), Megafac ( (Registered trademark) F-171, F-173, F-477, F-486, F-554, F-556, R-08, R-30, R-30N, R- 40, same R-40-LM, same RS-56, same RS-75, same RS-72-K, same RS-76-E, same RS-76-NS, same RS-78, same RS-90 ( As above, DIC Corporation's product, Florade FC430, the same FC431 (above, 3M Japan's product), Asahi Guard (registered trademark) AG710, Surflon (registered trademark) S-382, the same SC101, the same SC102, the same SC103. , SC104, SC105, SC106 (above, manufactured by AGC Co., Ltd.) and the like; and organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-302, BYK-307, BYK. -322, BYK-323, BYK-330, BYK-333, BYK-370, BYK-375, BYK-378, BYK-UV 3500, BYK-UV 3570 (above, manufactured by BYK Japan KK) .. The above surfactants may be used alone or in combination of two or more. When the composition for forming the A layer and the composition for forming the B layer contain the surfactant, the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 10% by mass is preferable.
上記連鎖移動剤としては、例えば、チオール化合物として、メルカプト酢酸メチル、3-メルカプトプロピオン酸メチル、3-メルカプトプロピオン酸2-エチルヘキシル、3-メルカプトプロピオン酸3-メトキシブチル、3-メルカプトプロピオン酸n-オクチル、3-メルカプトプロピオン酸ステアリル、1,4-ビス(3-メルカプトプロピオニルオキシ)ブタン、1,4-ビス(3-メルカプトブチリルオキシ)ブタン、トリメチロールエタントリス(3-メルカプトプロピオネート)、トリメチロールエタントリス(3-メルカプトブチレート)、トリメチロールプロパントリス(3-メルカプトプロピオネート)、トリメチロールプロパントリス(3-メルカプトブチレート)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)、ペンタエリスリトールテトラキス(3-メルカプトブチレート)、ジペンタエリスリトールヘキサキス(3-メルカプトプロピオネート)、ジペンタエリスリトールヘキサキス(3-メルカプトブチレート)、テトラエチレングリコールビス(3-メルカプトプロピオネート)、トリス[2-(3-メルカプトプロピオニルオキシ)エチル]イソシアヌレート、トリス[2-(3-メルカプトブチリルオキシ)エチル]イソシアヌレート、1,3,5-トリス(3-メルカプトブチリルオキシエチル)-1,3,5-トリアジン-2,4,6-(1H,3H,5H)-トリオン等のメルカプトカルボン酸エステル類;エタンチオール、2-メチルプロパン-2-チオール、1-ドデカンチオール、2,3,3,4,4,5-ヘキサメチルヘキサン-2-チオール(tert-ドデカンチオール)、エタン-1,2-ジチオール、プロパン-1,3-ジチオール、ベンジルチオール等のアルキルチオール類;ベンゼンチオール、3-メチルベンゼンチオール、4-メチルベンゼンチオール、ナフタレン-2-チオール、ピリジン-2-チオール、ベンゾイミダゾール-2-チオール、ベンゾチアゾール-2-チオール等の芳香族チオール類;2-メルカプトエタノール、4-メルカプト-1-ブタノール等のメルカプトアルコール類;3-(トリメトキシシリル)プロパン-1-チオール、3-(トリエトキシシリル)プロパン-1-チオール等のシラン含有チオール類;ビス(2-メルカプトエチル)エーテルが挙げられ、ジスルフィド化合物として、ジエチルジスルフィド、ジプロピルジスルフィド、ジイソプロピルジスルフィド、ジブチルジスルフィド、ジ-tert-ブチルジスルフィド、ジペンチルジスルフィド、ジイソペンチルジスルフィド、ジヘキシルジスルフィド、ジシクロヘキシルジスルフィド、ジデシルジスルフィド、ビス(2,3,3,4,4,5-ヘキサメチルヘキサン-2-イル)ジスルフィド(ジ-tert-ドデシルジスルフィド)、ビス(2,2-ジエトキシエチル)ジスルフィド、ビス(2-ヒドロキシエチル)ジスルフィド、ジベンジルジスルフィド等のアルキルジスルフィド類;ジフェニルジスルフィド、ジ-p-トリルジスルフィド、ジ(ピリジン-2-イル)ピリジルジスルフィド、ジ(ベンゾイミダゾール-2-イル)ジスルフィド、ジ(ベンゾチアゾール-2-イル)ジスルフィド等の芳香族ジスルフィド類;テトラメチルチウラムジスルフィド、テトラエチルチウラムジスルフィド、テトラブチルチウラムジスルフィド、ビス(ペンタメチレン)チウラムジスルフィド等のチウラムジスルフィド類;α-メチルスチレンダイマーが挙げられる。この連鎖移動剤は、1種単独で使用することができ、2種以上を組み合わせて使用することができる。前記A層を形成するための組成物及び前記B層を形成するための組成物が上記連鎖移動剤を含有する場合、その含有割合は、(a1)成分100質量%に対し、0.01質量%乃至20質量%であることが好ましい。 Examples of the chain transfer agent include thiol compounds such as methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, and n-mercaptopropionate. Octyl, stearyl 3-mercaptopropionate, 1,4-bis(3-mercaptopropionyloxy)butane, 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolethane tris(3-mercaptopropionate) , Trimethylolethane tris(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptopropionate), Pentaerythritol tetrakis(3-mercaptobutyrate), dipentaerythritol hexakis(3-mercaptopropionate), dipentaerythritol hexakis(3-mercaptobutyrate), tetraethylene glycol bis(3-mercaptopropionate) , Tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate, tris[2-(3-mercaptobutyryloxy)ethyl]isocyanurate, 1,3,5-tris(3-mercaptobutyryloxyethyl) Mercaptocarboxylic acid esters such as -1,3,5-triazine-2,4,6-(1H,3H,5H)-trione; ethanethiol, 2-methylpropane-2-thiol, 1-dodecanethiol, 2 ,3,3,4,5,5-hexamethylhexane-2-thiol (tert-dodecanethiol), ethane-1,2-dithiol, propane-1,3-dithiol, benzylthiol and other alkylthiols; benzene Aromatic thiols such as thiol, 3-methylbenzenethiol, 4-methylbenzenethiol, naphthalene-2-thiol, pyridine-2-thiol, benzimidazol-2-thiol, benzothiazole-2-thiol; 2-mercaptoethanol , 4-mercapto-1-butanol and other mercapto alcohols; 3-(trimethoxysilyl)propane-1-thiol, 3-(triethoxysilyl)propane-1-thiol and other silane-containing thiols; bis(2- Mercaptoethyl) ether, and as a disulfide compound, Didisulfide, dipropyl disulfide, diisopropyl disulfide, dibutyl disulfide, di-tert-butyl disulfide, dipentyl disulfide, diisopentyl disulfide, dihexyl disulfide, dicyclohexyl disulfide, didecyl disulfide, bis(2,3,3,4,4,4) Alkyl disulfides such as 5-hexamethylhexan-2-yl)disulfide (di-tert-dodecyldisulfide), bis(2,2-diethoxyethyl)disulfide, bis(2-hydroxyethyl)disulfide and dibenzyldisulfide; Aromatic disulfides such as diphenyl disulfide, di-p-tolyl disulfide, di(pyridin-2-yl)pyridyl disulfide, di(benzimidazol-2-yl)disulfide, di(benzothiazol-2-yl)disulfide; tetra Examples include thiuram disulfides such as methyl thiuram disulfide, tetraethyl thiuram disulfide, tetrabutyl thiuram disulfide, and bis(pentamethylene) thiuram disulfide; α-methylstyrene dimer. This chain transfer agent can be used alone or in combination of two or more. When the composition for forming the A layer and the composition for forming the B layer contain the chain transfer agent, the content ratio thereof is 0.01 mass with respect to 100 mass% of the component (a1). % To 20% by mass is preferable.
上記光増感剤としては、例えば、チオキサンテン系、チオキサントン系、キサンテン系、ケトン系、チオピリリウム塩系、ベーススチリル系、メロシアニン系、3-置換クマリン系、3,4-置換クマリン系、シアニン系、アクリジン系、チアジン系、フェノチアジン系、アントラセン系、コロネン系、ベンズアントラセン系、ペリレン系、ケトクマリン系、クマリン系、ボレート系が挙げられる。該光増感剤は、市販品として入手が可能であり、その具体例としては、アントラキュアー(登録商標)UVS-581、同UVS-1331(以上、川崎化成工業(株)製)、KAYACURE(登録商標)DETX-S(日本化薬(株)製)が挙げられる。この光増感剤は、1種単独で使用することができ、2種以上を組み合わせて使用することができる。上記光増感剤を用いることによって、UV領域の吸収波長を調整することもできる。前記A層を形成するための組成物及び前記B層を形成するための組成物が上記光増感剤を含有する場合、その含有割合は、前記(a1)成分または前記(b1)成分100質量%に対し、例えば0.01質量%乃至10質量%であり、好ましくは0.05質量%乃至5質量%である。 Examples of the photosensitizer include thioxanthene type, thioxanthone type, xanthene type, ketone type, thiopyrylium salt type, base styryl type, merocyanine type, 3-substituted coumarin type, 3,4-substituted coumarin type, cyanine type , Acridine-based, thiazine-based, phenothiazine-based, anthracene-based, coronene-based, benzanthracene-based, perylene-based, ketocoumarin-based, coumarin-based, and borate-based. The photosensitizer is commercially available, and specific examples thereof include Anthracure (registered trademark) UVS-581, UVS-1331 (all manufactured by Kawasaki Kasei Kogyo Co., Ltd.), and KAYACURE (trade name). Registered trademark) DETX-S (manufactured by Nippon Kayaku Co., Ltd.). This photosensitizer can be used alone or in combination of two or more. The absorption wavelength in the UV region can be adjusted by using the above-mentioned photosensitizer. When the composition for forming the A layer and the composition for forming the B layer contain the photosensitizer, the content ratio is 100 mass of the component (a1) or the component (b1). %, for example, 0.01% by mass to 10% by mass, preferably 0.05% by mass to 5% by mass.
[インプリント用レプリカモールド材料の調製]
本発明のインプリント用レプリカモールドのA層を形成するための組成物及びB層を形成するための組成物の調製方法は、特に限定されない。前記A層を形成するための組成物の場合、例えば前記(a1)成分、前記(a2)成分、及び必要に応じてその他添加剤を混合し、組成物が均一な状態となっていればよい。また、前記B層を形成するための組成物の場合、例えば(b1)成分、(b2)成分、(b3)成分、及び必要に応じてその他添加剤を混合し、組成物が均一な状態となっていればよい。そして、前記A層を形成するための組成物及び前記B層を形成するための組成物の各成分を混合する順序は、均一な組成物が得られるなら問題なく、特に限定されない。
[Preparation of replica mold material for imprint]
The method for preparing the composition for forming the A layer and the composition for forming the B layer of the replica mold for imprint of the present invention is not particularly limited. In the case of the composition for forming the A layer, for example, the component (a1), the component (a2), and other additives as necessary may be mixed so that the composition is in a uniform state. .. In the case of the composition for forming the B layer, for example, the component (b1), the component (b2), the component (b3) and, if necessary, other additives are mixed to obtain a uniform composition. It should be. The order of mixing the respective components of the composition for forming the A layer and the composition for forming the B layer is not particularly limited as long as a uniform composition can be obtained, and is not particularly limited.
本発明のインプリント用レプリカモールドは、光インプリントにより前記A層を形成後、該A層上に、前記B層を光硬化により形成することで得ることができる。 The replica mold for imprint of the present invention can be obtained by forming the A layer by photoimprinting and then forming the B layer on the A layer by photocuring.
本発明のインプリント用レプリカモールドのA層は、前記(a1)成分及び(a2)成分を含む組成物を基材上またはマスターモールド上に塗布し、該基材と該マスターモールドとを貼り合わせて光硬化させ、離型することで所望の構造体を得ることができる。前記(a1)成分及び(a2)成分を含む組成物の塗布方法としては、公知又は周知の方法、例えば、ポッティング法、スピンコート法、ディップ法、フローコート法、インクジェット法、スプレー法、バーコート法、グラビアコート法、スリットコート法、ロールコート法、転写印刷法、刷毛塗り、ブレードコート法、エアーナイフコート法を挙げることができる。 The layer A of the replica mold for imprint of the present invention is obtained by applying a composition containing the above-mentioned components (a1) and (a2) onto a base material or a master mold, and bonding the base material and the master mold together. Then, the desired structure can be obtained by photo-curing and releasing. The method of applying the composition containing the component (a1) and the component (a2) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, a spray method, a bar coating method. Method, gravure coating method, slit coating method, roll coating method, transfer printing method, brush coating, blade coating method, and air knife coating method.
本発明のインプリント用レプリカモールドのA層が形成される基材としては、例えば、シリコン、インジウム錫酸化物(ITO)が製膜されたガラス(ITO基板)、シリコンナイトライド(SiN)が製膜されたガラス(SiN基板)、インジウム亜鉛酸化物(IZO)が製膜されたガラス、ポリエチレンテレフタレート(PET)、トリアセチルセルロース(TAC)、アクリル、プラスチック、ガラス、石英、セラミックス等からなる基材を挙げることができる。また、可撓性を有するフレキシブル基材、例えば、トリアセチルセルロース、ポリエチレンテレフタレート、ポリメタクリル酸メチル、シクロオレフィン(コ)ポリマー、ポリビニルアルコール、ポリカーボネート、ポリスチレン、ポリイミド、ポリアミド、ポリオレフィン、ポリプロピレン、ポリエチレン、ポリエチレンナフタレート、ポリエーテルスルフォン、及びこれらポリマーを組み合わせた共重合体からなる基材を用いることも可能である。 Examples of the base material on which the layer A of the imprint replica mold of the present invention is formed include silicon, glass (ITO substrate) on which indium tin oxide (ITO) is formed, and silicon nitride (SiN). Film-formed glass (SiN substrate), indium zinc oxide (IZO) film-formed glass, polyethylene terephthalate (PET), triacetyl cellulose (TAC), acrylic, plastic, glass, quartz, ceramics, etc. Can be mentioned. Further, a flexible base material having flexibility, for example, triacetyl cellulose, polyethylene terephthalate, polymethyl methacrylate, cycloolefin (co)polymer, polyvinyl alcohol, polycarbonate, polystyrene, polyimide, polyamide, polyolefin, polypropylene, polyethylene, polyethylene. It is also possible to use a base material composed of naphthalate, polyether sulfone, and a copolymer obtained by combining these polymers.
本発明のインプリント用レプリカモールドのA層を形成するために光硬化させる光源としては、特に限定されないが、例えば、高圧水銀ランプ、低圧水銀ランプ、無電極ランプ、メタルハライドランプ、KrFエキシマーレーザー、ArFエキシマーレーザー、Fエキシマーレーザー、電子線(EB)、極端紫外線(EUV)、紫外線LED(UV-LED)を挙げることができる。また、前記光源の波長は、一般的には、436nmのG線、405nmのH線、365nmのI線、又はGHI混合線を用いることができる。さらに、露光量は、好ましくは、30mJ/cm乃至10000mJ/cm、より好ましくは100mJ/cm乃至8000mJ/cmである。 The light source to be photo-cured to form the A layer of the replica mold for imprint of the present invention is not particularly limited, but examples thereof include a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, and an ArF. Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED). As the wavelength of the light source, generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used. Furthermore, the exposure amount is preferably, 30 mJ / cm 2 to 10000 mJ / cm 2, more preferably at 100 mJ / cm 2 to 8000 mJ / cm 2.
なお、前記A層を形成するための組成物が溶媒を含有する場合には、光照射前の塗膜及び光照射後に得られた光硬化物の少なくとも一方に対し、溶媒を蒸発させる目的で、ベーク工程を加えてもよい。ベーク工程に使用する機器としては、特に限定されるものではなく、例えば、ホットプレート、オーブン、ファーネスを用いて、適切な雰囲気下、すなわち大気、窒素等の不活性ガス、又は真空中でベークすることができるものであればよい。ベーク温度は、溶媒を蒸発させる目的を達成できるなら特に限定されないが、例えば、40℃乃至200℃で行うことができる。 When the composition for forming the layer A contains a solvent, at least one of the coating film before light irradiation and the photocured product obtained after light irradiation is used for the purpose of evaporating the solvent. A baking step may be added. The equipment used in the baking step is not particularly limited, and for example, baking is performed using a hot plate, an oven, a furnace in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or a vacuum. Anything can be used. The baking temperature is not particularly limited as long as it can achieve the purpose of evaporating the solvent, but for example, it can be performed at 40°C to 200°C.
光インプリントを行う装置は、目的のパターンが得られれば特に限定されないが、例えば、東芝機械(株)製のST50、Obducat社製のSindre(登録商標)60、明昌機工(株)製のNM-0801HB等の市販されている装置にて、基材とマスターモールドを圧着し、光硬化後に該マスターモールドから硬化物を離型する方法を用いることができる。 The apparatus for performing the optical imprint is not particularly limited as long as the target pattern is obtained, but examples thereof include ST50 manufactured by Toshiba Machine Co., Ltd., Sindre (registered trademark) 60 manufactured by Obducat, and NM manufactured by Meisho Kiko Co., Ltd. A method in which a base material and a master mold are pressure-bonded with a commercially available device such as −0801HB and the cured product is released from the master mold after photocuring can be used.
また、本発明で用いる光インプリントに使用するマスターモールドの材料としては、例えば、石英、シリコン(Si)、ニッケル、アルミナ(Al)、カルボニルシラン、グラッシーカーボンを挙げることができるが、目的のパターンが得られるなら、特に限定されない。また、マスターモールドは、離型性を高めるために、その表面にフッ素系化合物等の薄膜を形成する離型処理を行ってもよい。離型処理に用いる離型剤としては、例えば、ダイキン工業(株)製のオプツール(登録商標)HD、同DSXが挙げられるが、目的のパターンが得られるなら、特に限定されない。 Further, examples of the material of the master mold used in the photoimprint used in the present invention include quartz, silicon (Si), nickel, alumina (Al 2 O 3 ), carbonylsilane, and glassy carbon. There is no particular limitation as long as the desired pattern can be obtained. Further, the master mold may be subjected to a mold release treatment for forming a thin film of a fluorine-based compound or the like on the surface thereof in order to enhance the mold release property. Examples of the releasing agent used in the releasing treatment include OPTOOL (registered trademark) HD and DSX manufactured by Daikin Industries, Ltd., but are not particularly limited as long as a desired pattern can be obtained.
本発明のインプリント用レプリカモールドのA層は、前記マスターモールドから離型後に加熱することで、紫外線領域における透明性を向上させることができる。前記A層の加熱方法は、ホットプレート、オーブン等の加熱手段を使用する方法が挙げられる。 The layer A of the replica mold for imprint of the present invention can improve transparency in the ultraviolet region by heating after being released from the master mold. Examples of the heating method of the layer A include a method of using a heating means such as a hot plate and an oven.
本発明のインプリント用レプリカモールドのB層は、前記(b1)成分、(b2)成分及び(b3)成分を含む組成物を前記A層上に塗布し、光硬化させることで所望の被膜を得ることができる。前記(b1)成分、(b2)成分及び(b3)成分を含む組成物の塗布方法としては、公知又は周知の方法、例えば、ポッティング法、スピンコート法、ディップ法、フローコート法、インクジェット法、スプレー法、バーコート法、グラビアコート法、スリットコート法、ロールコート法、転写印刷法、刷毛塗り、ブレードコート法、エアーナイフコート法を挙げることができる。 The layer B of the imprint replica mold of the present invention has a desired coating formed by applying a composition containing the component (b1), the component (b2) and the component (b3) onto the layer A and photocuring the composition. Obtainable. The method of applying the composition containing the component (b1), the component (b2) and the component (b3) is a known or well-known method, for example, a potting method, a spin coating method, a dipping method, a flow coating method, an inkjet method, The spray method, the bar coating method, the gravure coating method, the slit coating method, the roll coating method, the transfer printing method, the brush coating, the blade coating method, and the air knife coating method can be mentioned.
本発明のインプリント用レプリカモールドのB層を形成するために光硬化させる光源としては、特に限定されないが、例えば、高圧水銀ランプ、低圧水銀ランプ、無電極ランプ、メタルハライドランプ、KrFエキシマーレーザー、ArFエキシマーレーザー、Fエキシマーレーザー、電子線(EB)、極端紫外線(EUV)、紫外線LED(UV-LED)を挙げることができる。また、前記光源の波長は、一般的には、436nmのG線、405nmのH線、365nmのI線、又はGHI混合線を用いることができる。さらに、露光量は、好ましくは、30mJ/cm乃至2000mJ/cm、より好ましくは30mJ/cm乃至1000mJ/cmである。 The light source to be photo-cured to form the B layer of the replica mold for imprint of the present invention is not particularly limited, but for example, a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, a KrF excimer laser, ArF. Examples include excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), and ultraviolet LED (UV-LED). As the wavelength of the light source, generally, 436 nm G line, 405 nm H line, 365 nm I line, or GHI mixed line can be used. Furthermore, the exposure amount is preferably, 30 mJ / cm 2 to 2000 mJ / cm 2, more preferably from 30 mJ / cm 2 to 1000 mJ / cm 2.
本発明のインプリント用レプリカモールドのB層を形成する工程において、(b3)成分である溶媒を蒸発させる目的で、前記B層を形成するための組成物を塗布後、光硬化前もしくは光硬化後にベーク工程を加えてもよい。該ベーク工程に使用する機器としては、特に限定されるものではなく、例えば、ホットプレート、オーブン、又はファーネスを用いて、適切な雰囲気下、すなわち大気、窒素等の不活性ガス、又は真空中でベークすることができるものであればよい。前記ベーク工程におけるベーク温度は、溶媒を蒸発させることが可能な、例えば、40℃乃至200℃で行うことができる。 In the step of forming the B layer of the replica mold for imprint of the present invention, for the purpose of evaporating the solvent which is the component (b3), after applying the composition for forming the B layer, before photocuring or photocuring. A baking step may be added later. The equipment used in the baking step is not particularly limited, and for example, using a hot plate, an oven, or a furnace, in a suitable atmosphere, that is, in the atmosphere, an inert gas such as nitrogen, or in a vacuum. Anything that can be baked may be used. The baking temperature in the baking step may be, for example, 40° C. to 200° C. at which the solvent can be evaporated.
本発明により得られるインプリント用レプリカモールドのパターンサイズは特に限定されず、例えばナノメートルオーダー、マイクロメートルオーダー、ミリメートルオーダーでも良好なパターンを得ることが可能である。 The pattern size of the replica mold for imprint obtained by the present invention is not particularly limited, and it is possible to obtain a good pattern even in the order of nanometer, micrometer, or millimeter.
以下、実施例及び比較例を挙げて、本発明を更に詳しく説明するが、本発明は、下記実施例に限定されるものではない。なお、下記合成例で得られた化合物の、物性の分析に用いた装置及び条件は、以下の通りである。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. The equipment and conditions used for the analysis of the physical properties of the compound obtained in the following synthesis example are as follows.
(1)ゲル浸透クロマトグラフィー(GPC)
装置:(株)島津製作所製 GPCシステム
GPCカラム:Shodex(登録商標)GPC KF-804L及びGPC KF-803L
カラム温度:40℃
溶媒:テトラヒドロフラン
流量:1mL/分
標準試料:ポリスチレン
(1) Gel permeation chromatography (GPC)
Device: Shimadzu Corporation GPC system GPC column: Shodex (registered trademark) GPC KF-804L and GPC KF-803L
Column temperature: 40°C
Solvent: Tetrahydrofuran Flow rate: 1 mL/min Standard sample: Polystyrene
また、下記略記号は以下の意味を表す。
PFPE1:ポリ(オキシエチレン)基(繰り返し単位の数8乃至9)を介して両末端にヒドロキシ基を有するパーフルオロポリエーテル[ソルベイスペシャルティポリマーズ社製 Fluorolink(登録商標)5147X]
PFPE2:両末端それぞれに、前記式(2b)で表される基を介してヒドロキシ基を2つずつ有するパーフルオロポリエーテル[ソルベイスペシャルティポリマーズ社製 Fomblin(登録商標)T4]
BEI:1,1-ビス(アクリロイルオキシメチル)エチルイソシアネート[昭和電工(株)製 カレンズ(登録商標)BEI]
DBTDL:ジラウリン酸ジブチル錫[東京化成工業(株)製]
DOTDD:ジオクチル錫ジネオデカノエート[日東化成(株)製 ネオスタン(登録商標)U-830]
AIBN:アゾビスイソブチロニトリル
MEK:メチルエチルケトン
MIBK:メチルイソブチルケトン
PGME:プロピレングリコールモノメチルエーテル
PGMEA:プロピレングリコールモノメチルエーテルアセテート
The following abbreviations have the following meanings.
PFPE1: Perfluoropolyether having hydroxy groups at both terminals via a poly(oxyethylene) group (number of repeating units 8 to 9) [Fluorolink (registered trademark) 5147X manufactured by Solvay Specialty Polymers]
PFPE2: Perfluoropolyether having two hydroxy groups at both ends via the group represented by the formula (2b) [Fomblin (registered trademark) T4 manufactured by Solvay Specialty Polymers]
BEI: 1,1-bis(acryloyloxymethyl)ethyl isocyanate [Karenzu (registered trademark) BEI manufactured by Showa Denko KK]
DBTDL: dibutyltin dilaurate [manufactured by Tokyo Chemical Industry Co., Ltd.]
DOTDD: Dioctyltin Dineodecanoate [Neostan (registered trademark) U-830 manufactured by Nitto Kasei Co., Ltd.]
AIBN: Azobisisobutyronitrile MEK: Methyl ethyl ketone MIBK: Methyl isobutyl ketone PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate
<合成例1>
2Lの四つ口フラスコにPGMEAを178.84g入れ、窒素雰囲気下、内温80℃で攪拌した。ここに、メタクリル酸メチル(東京化成工業(株)製)120g、イソボルニルアクリレート(東京化成工業(株)製)249.66g、AIBN(関東化学(株)製)5.904g、及びPGMEA697.48gを混合させた溶液を2時間かけて滴下し、滴下後17時間反応させた。反応溶液をメタノール(純正化学(株)製)6.3kgに滴下し、析出したポリマーを133.3Paの減圧下、80℃で乾燥し、非架橋性の共重合体MI55を330.4g得た。GPCにて、得られたMI55の重量平均分子量を測定したところ、標準ポリスチレン換算で20,100であった。
<Synthesis example 1>
178.84 g of PGMEA was put into a 2 L four-necked flask, and the mixture was stirred under a nitrogen atmosphere at an internal temperature of 80°C. Here, 120 g of methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.), isobornyl acrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) 249.66 g, AIBN (manufactured by Kanto Chemical Co., Ltd.) 5.904 g, and PGMEA 697. A solution obtained by mixing 48 g was added dropwise over 2 hours, and after the addition, reaction was performed for 17 hours. The reaction solution was added dropwise to 6.3 kg of methanol (manufactured by Junsei Chemical Co., Ltd.), and the precipitated polymer was dried at 80° C. under reduced pressure of 133.3 Pa to obtain 330.4 g of non-crosslinkable copolymer MI55. .. When the weight average molecular weight of the obtained MI55 was measured by GPC, it was 20,100 in terms of standard polystyrene.
<合成例2>
ナスフラスコに、PFPE1 10.5g(5mmol)、BEI 2.39g(10.0mmol)、DBTDL 0.129g及びMEK 12.9gを仕込んだ。上記ナスフラスコ内の混合物を、スターラーチップを用いて室温(およそ23℃)で24時間撹拌し、反応物を得た。この反応物へPGMEAを30.37g加え、エバポレーターにてMEKを留去し、(b1)成分である、SM1を含むPGMEA溶液を固形分30質量%で得た。得られたSM1のGPCによるポリスチレン換算で測定される重量平均分子量Mwは3,400、分散度:Mw(重量平均分子量)/Mn(数平均分子量)は1.1であった。
<Synthesis example 2>
An eggplant flask was charged with 10.5 g (5 mmol) of PFPE1, 2.39 g (10.0 mmol) of BEI, 0.129 g of DBTDL and 12.9 g of MEK. The mixture in the eggplant flask was stirred with a stirrer chip at room temperature (about 23° C.) for 24 hours to obtain a reaction product. To this reaction product, 30.37 g of PGMEA was added, and MEK was distilled off by an evaporator to obtain a PGMEA solution containing SM1 as the component (b1) with a solid content of 30% by mass. The weight average molecular weight Mw of the obtained SM1 measured by GPC in terms of polystyrene was 3,400, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
<合成例3>
ナスフラスコに、PFPE1 10.5g(5mmol)、BEI 2.39g(10.0mmol)、DOTDD 0.0644g及びPGMEA12.9gを仕込んだ。上記ナスフラスコ内の混合物を、スターラーチップを用いて室温(およそ23℃)で48時間撹拌し、反応物を得た。この反応物へPGMEAを38.9g加え、(b1)成分であるSM2を含むPGMEA溶液を固形分20質量%で得た。得られたSM2のGPCによるポリスチレン換算で測定される重量平均分子量Mwは3,410、分散度:Mw(重量平均分子量)/Mn(数平均分子量)は1.1であった。
<Synthesis example 3>
An eggplant flask was charged with 10.5 g (5 mmol) of PFPE1, 2.39 g (10.0 mmol) of BEI, 0.0644 g of DOTDD and 12.9 g of PGMEA. The mixture in the eggplant flask was stirred at room temperature (about 23° C.) for 48 hours using a stirrer tip to obtain a reaction product. 38.9 g of PGMEA was added to this reaction product to obtain a PGMEA solution containing SM2 as the component (b1) at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM2 measured by GPC in terms of polystyrene was 3,410, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
<合成例4>
ナスフラスコに、PFPE2 11.45g(5mmol)、BEI 4.79g(20.0mmol)、DOTDD 0.162g及びMEK 16.24gを仕込んだ。上記ナスフラスコ内の混合物を、窒素雰囲気下にてスターラーチップを用いて室温(およそ23℃)で72時間撹拌し、反応物を得た。この反応物へPGMEAを64.96g加え、エバポレーターにてMEKを留去し、(b1)成分であるSM3を含むPGMEA溶液を固形分20質量%で得た。得られたSM3のGPCによるポリスチレン換算で測定される重量平均分子量Mwは2,750、分散度:Mw(重量平均分子量)/Mn(数平均分子量)は1.1であった。
<Synthesis example 4>
An eggplant flask was charged with 11.45 g (5 mmol) of PFPE2, 4.79 g (20.0 mmol) of BEI, 0.162 g of DOTDD and 16.24 g of MEK. The mixture in the eggplant flask was stirred under a nitrogen atmosphere with a stirrer chip at room temperature (about 23° C.) for 72 hours to obtain a reaction product. 64.96 g of PGMEA was added to this reaction product, and MEK was distilled off by an evaporator to obtain a PGMEA solution containing SM3 as the component (b1) at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM3 measured by GPC in terms of polystyrene was 2,750, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
<合成例5>
ナスフラスコに、PFPE2 11.45g(5mmol)、BEI 4.79g(20.0mmol)、DOTDD 0.162g及びPGMEA 16.24gを仕込んだ。上記ナスフラスコ内の混合物を、窒素雰囲気下にてスターラーチップを用いて室温(およそ23℃)で72時間撹拌し、反応物を得た。この反応物へPGMEAを48.72g加え、(b1)成分であるSM4を含むPGMEA溶液を固形分20質量%で得た。得られたSM4のGPCによるポリスチレン換算で測定される重量平均分子量Mwは2,760、分散度:Mw(重量平均分子量)/Mn(数平均分子量)は1.1であった。
<Synthesis example 5>
An eggplant flask was charged with 11.45 g (5 mmol) of PFPE2, 4.79 g (20.0 mmol) of BEI, 0.162 g of DOTDD and 16.24 g of PGMEA. The mixture in the eggplant flask was stirred under a nitrogen atmosphere with a stirrer chip at room temperature (about 23° C.) for 72 hours to obtain a reaction product. To this reaction product, 48.72 g of PGMEA was added to obtain a PGMEA solution containing SM4 as the component (b1) at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM4 measured by GPC in terms of polystyrene was 2,760, and the dispersity: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.
[A層を形成するための組成物の調製]
<調製例1>
ニューフロンティア(登録商標)HBPE-4(第一工業製薬(株)製)(以下、本明細書では「HBPE-4」と略称する。)7g、KAYARAD(登録商標)PET-30(日本化薬(株)製)(以下、本明細書では「PET-30」と略称する。)を3g、及びIRGACURE(登録商標)184(BASFジャパン(株)製)(以下、本明細書では「IRGACURE 184」と略称する。)を0.01g(HBPE-4、PET-30の総質量に対して0.1質量%)加え、組成物A1を調製した。
[Preparation of Composition for Forming Layer A]
<Preparation Example 1>
New Frontier (registered trademark) HBPE-4 (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.) (hereinafter, abbreviated as "HBPE-4" in this specification) 7 g, KAYARAD (registered trademark) PET-30 (Nippon Kayaku) 3 g of IRGACURE (registered trademark) 184 (manufactured by BASF Japan Ltd.) (hereinafter referred to as “IRGACURE 184”). 0.01 g (0.1% by mass relative to the total mass of HBPE-4 and PET-30) was added to prepare Composition A1.
<調製例2>
HBPE-4を9g、合成例1で得たMI55を1g、及びIRGACURE 184を0.01g(HBPE-4、MI55の総質量に対して0.1質量%)加え、組成物A2を調製した。
<Preparation example 2>
Composition A2 was prepared by adding 9 g of HBPE-4, 1 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55).
<調製例3>
HBPE-4を9.5g、合成例1で得たMI55を0.5g、及びIRGACURE 184を0.01g(HBPE-4、MI55の総質量に対して0.1質量%)加え、組成物A3を調製した。
<Preparation Example 3>
9.5 g of HBPE-4, 0.5 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of HBPE-4 and MI55) were added, and the composition A3 was added. Was prepared.
<調製例4>
HBPE-4を9.75g、合成例1で得たMI55を0.25g、及びIRGACURE 184を0.01g(HBPE-4、MI55の総質量に対して0.1質量%)加え、組成物A4を調製した。
<Preparation Example 4>
9.75 g of HBPE-4, 0.25 g of MI55 obtained in Synthesis Example 1 and 0.01 g of IRGACURE 184 (0.1% by mass relative to the total mass of HBPE-4 and MI55) were added, and the composition A4 was added. Was prepared.
<調製例5>
HBPE-4を5g、NKエステル A-DOG(以下、本明細書では「A-DOG」と略称する。)(新中村化学工業(株)製)を5g、及びIRGACURE 184を0.01g(HBPE-4、A-DOG総質量に対して0.1質量%)加え、組成物A5を調製した。
<Preparation example 5>
5 g of HBPE-4, 5 g of NK ester A-DOG (hereinafter abbreviated as "A-DOG" in the present specification) (manufactured by Shin-Nakamura Chemical Co., Ltd.), and 0.01 g of IRGACURE 184 (HBPE -4, 0.1% by mass relative to the total mass of A-DOG) was added to prepare a composition A5.
<調製例6>
PET-30を7g、NKエステル A-200(新中村化学工業(株)製)を1.5g、A-DOGを1.5g、及びIRGACURE 184を0.01g(PET-30、A-200、A-DOG総質量に対して0.1質量%)加え、組成物A6を調製した。
<Preparation Example 6>
7 g of PET-30, 1.5 g of NK Ester A-200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 1.5 g of A-DOG, and 0.01 g of IRGACURE 184 (PET-30, A-200, 0.1% by mass based on the total mass of A-DOG) was added to prepare a composition A6.
<調製例7>
HBPE-4を5g、NKエステル A-DCP(以下、本明細書では「A-DCP」と略称する。)(新中村化学工業(株)製)を5g、及びIRGACURE 184を0.01g(HBPE-4、A-DCP総質量に対して0.1質量%)加え、組成物A7を調製した。
<Preparation Example 7>
5 g of HBPE-4, 5 g of NK ester A-DCP (hereinafter abbreviated as “A-DCP” in the present specification) (manufactured by Shin-Nakamura Chemical Co., Ltd.), and 0.01 g of IRGACURE 184 (HBPE -4, 0.1% by mass relative to the total mass of A-DCP) was added to prepare a composition A7.
<調製例8>
A-DCPを5g、1-ADMA(大阪有機化学工業(株)製)を5g、及びIRGACURE 184を0.01g(A-DCP、1-ADMA総質量に対して0.1質量%)加え、組成物A8を調製した。
<Preparation Example 8>
Add 5 g of A-DCP, 5 g of 1-ADMA (manufactured by Osaka Organic Chemical Industry Co., Ltd.), and 0.01 g of IRGACURE 184 (0.1% by mass based on the total mass of A-DCP and 1-ADMA), Composition A8 was prepared.
<調製例9>
A-DCPを5g、1-ADMA(大阪有機化学工業(株)製)を5g、及びIRGACURE 184を0.5g(A-DCP、1-ADMA総質量に対して5質量%)加え、組成物A9を調製した。
<Preparation Example 9>
5 g of A-DCP, 1-ADMA (manufactured by Osaka Organic Chemical Industry Co., Ltd.) and 0.5 g of IRGACURE 184 (A-DCP, 5% by mass relative to the total mass of 1-ADMA) were added to the composition. A9 was prepared.
[B層を形成するための組成物(離型剤)の調製]
<調製例10>
LINC-5A(共栄社化学(株)製)を0.285g、2,2,2-トリフルオロエチルアクリレート(ダイキン工業(株)製)を0.015g、IRGACURE(登録商標)819(BASFジャパン(株)製、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキサイド)(以下、本明細書では「IRGACURE 819」と略称する。)を0.006g、及びPGMEAを8.44g混合し、組成物(離型剤)B1を調製した。
[Preparation of Composition (Release Agent) for Forming Layer B]
<Preparation Example 10>
0.285 g of LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.015 g of 2,2,2-trifluoroethyl acrylate (manufactured by Daikin Industries, Ltd.), IRGACURE (registered trademark) 819 (BASF Japan (stock) Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide) (hereinafter, abbreviated as “IRGACURE 819” in the present specification), and PGMEA (8.44 g) are mixed to form a composition. The product (release agent) B1 was prepared.
<調製例11>
LINC-162A(共栄社化学(株)製)を0.3g、IRGACURE 819を0.006g、及びPGMEAを8.44g混合し、組成物(離型剤)B2を調製した。
<Preparation Example 11>
0.3 g of LINC-162A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.006 g of IRGACURE 819, and 8.44 g of PGMEA were mixed to prepare a composition (release agent) B2.
<調製例12>
LINC-102A(共栄社化学(株)製)を0.3g、IRGACURE 819を0.006g、及びPGMEAを8.44g混合し、組成物(離型剤)B3を調製した。
<Preparation Example 12>
0.3 g of LINC-102A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.006 g of IRGACURE 819, and 8.44 g of PGMEA were mixed to prepare a composition (release agent) B3.
<調製例13>
LINC-5A(共栄社化学(株)製)を0.3g、IRGACURE 819を0.006g、及びPGMEAを8.44g混合し、組成物(離型剤)B4を調製した。
<Preparation Example 13>
0.3 g of LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.), 0.006 g of IRGACURE 819, and 8.44 g of PGMEA were mixed to prepare a composition (release agent) B4.
<調製例14>
DAC-HP(ダイキン工業(株)製)を1.0g、IRGACURE 819を0.004g、及びPGMEAを4.82g混合し、組成物(離型剤)B5を調製した。
<Preparation Example 14>
A composition (release agent) B5 was prepared by mixing 1.0 g of DAC-HP (manufactured by Daikin Industries, Ltd.), 0.004 g of IRGACURE 819, and 4.82 g of PGMEA.
<調製例15>
合成例2で得られたSM1を含むPGMEA溶液1.00g、IRGACURE(登録商標)127(BASFジャパン(株)製、2-ヒドロキシ-1-[4-{4-(2-ヒドロキシ-2-メチルプロピオニル)ベンジル}-フェニル]-2-メチルプロパン-1-オン)を0.0060g、及び(C)成分としてPGMEAを7.67g混合し、組成物(離型剤)B6を調製した。
<Preparation Example 15>
1.00 g of a PGMEA solution containing SM1 obtained in Synthesis Example 2, IRGACURE (registered trademark) 127 (manufactured by BASF Japan Ltd., 2-hydroxy-1-[4-{4-(2-hydroxy-2-methyl) A composition (release agent) B6 was prepared by mixing 0.0060 g of propionyl)benzyl}-phenyl]-2-methylpropan-1-one) and 7.67 g of PGMEA as the component (C).
<調製例16>
合成例3で得られたSM2を含むPGMEA溶液1.00g、IRGACURE 819を0.0040g、KAYACURE(登録商標)DETX-S(日本化薬(株)製)(以下、本明細書では「DETX-S」と略称する。)を0.0002g及びPGMEAを4.80g混合し、組成物(離型剤)B7を調製した。
<Preparation Example 16>
1.00 g of the PGMEA solution containing SM2 obtained in Synthesis Example 3, 0.0040 g of IRGACURE 819, KAYACURE (registered trademark) DETX-S (manufactured by Nippon Kayaku Co., Ltd.) (hereinafter, referred to as "DETX- S)) and 4.80 g of PGMEA were mixed to prepare a composition (release agent) B7.
<調製例17>
合成例4で得られたSM3を含むPGMEA溶液1.00g、IRGACURE 819を0.0040g、DETX-Sを0.0002g及びPGMEAを4.83g混合し、組成物(離型剤)B8を調製した。
<Preparation Example 17>
A composition (release agent) B8 was prepared by mixing 1.00 g of the PGMEA solution containing SM3 obtained in Synthesis Example 4, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
<調製例18>
合成例5で得られたSM4を含むPGMEA溶液1.00g、IRGACURE 819を0.0040g、DETX-Sを0.0002g及びPGMEAを4.83g混合し、組成物(離型剤)B9を調製した。
<Preparation Example 18>
A composition (release agent) B9 was prepared by mixing 1.00 g of the PGMEA solution containing SM4 obtained in Synthesis Example 5, 0.0040 g of IRGACURE 819, 0.0002 g of DETX-S and 4.83 g of PGMEA. ..
[インプリント用レプリカモールドの作製]
<実施例1>
調製例1で得られた組成物A1を、予めNOVEC(登録商標)1720(スリーエムジャパン(株)製)(以下、本明細書では「NOVEC1720」と略称する。)を用いて離型処理したニッケル製モールド(2mm径×300μm深さの凹レンズ型を縦3列×横5列の15個配置)へポッティングし、その上に石英ガラス基板を被せ、ナノインプリント装置NM-0801HB(明昌機工(株)製)を用いて光インプリントを行った。光インプリントは、常時23℃の条件で、a)10秒間かけて500Nまで加圧、b)高圧水銀ランプを用いて5000mJ/cmの露光、c)10秒間かけて除圧、d)ニッケル製モールドと石英ガラス基板を分離して離型、というシーケンスで行い、該石英ガラス基板上に2mm径×300μm高さの凸レンズパターンを得た。その石英ガラス基板上に得られた凸レンズパターンを150℃のホットプレートで5分間加熱し、A層を形成した。使用した前記石英ガラス基板は、予めKBM-5103(信越化学工業(株)製)をスピンコートし、150℃のホットプレートで5分間加熱することにより、密着処理を行ったものである。得られたA層上へ調製例10で得られた組成物(離型剤)B1をスピンコーターで製膜し、ホットプレートを用いて80℃で5分間ベークした。その後、窒素雰囲気下にてバッチ式UV照射装置(高圧水銀灯2kW×1灯)(アイグラフィックス(株)製)を用いて、i線透過フィルターを通し、40mW/cmで125秒間UV露光し、A前記層上へB層を形成し、インプリント用レプリカモールドRM-1を作製した。
[Preparation of replica mold for imprint]
<Example 1>
The composition A1 obtained in Preparation Example 1 was release-treated in advance with NOVEC (registered trademark) 1720 (manufactured by 3M Japan Co., Ltd.) (hereinafter, abbreviated as “NOVEC 1720” in this specification). Nanoimprinting device NM-0801HB (manufactured by Meisho Kiko Co., Ltd.) by potting on a mold (15 concave lenses of 2 mm diameter × 300 μm depth arranged in 3 rows × 5 rows) and covering it with a quartz glass substrate. ) Was used for optical imprint. The optical imprint is always 23° C., a) pressurizing to 500 N for 10 seconds, b) exposing to 5000 mJ/cm 2 using a high-pressure mercury lamp, c) depressurizing for 10 seconds, and d) nickel. The mold and the quartz glass substrate were separated and released from the mold, and a convex lens pattern having a diameter of 2 mm and a height of 300 μm was obtained on the quartz glass substrate. The convex lens pattern obtained on the quartz glass substrate was heated on a hot plate at 150° C. for 5 minutes to form a layer A. The quartz glass substrate used was spin-coated with KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.) in advance and subjected to adhesion treatment by heating on a hot plate at 150° C. for 5 minutes. The composition (release agent) B1 obtained in Preparation Example 10 was formed on the obtained layer A by a spin coater, and baked at 80° C. for 5 minutes using a hot plate. Then, under a nitrogen atmosphere, a batch type UV irradiation device (high pressure mercury lamp 2 kW x 1 lamp) (manufactured by Eye Graphics Co., Ltd.) was used to pass an i-line transmission filter, and UV exposure was performed at 40 mW/cm 2 for 125 seconds. A layer B was formed on the layer A to prepare an imprint replica mold RM-1.
<実施例2>
調製例10で得られた組成物(離型剤)B1を調製例11で得られた組成物(離型剤)B2へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-2を作製した。
<Example 2>
Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B2 obtained in Preparation Example 11. RM-2 was prepared.
<実施例3>
調製例10で得られた組成物(離型剤)B1を調製例12で得られた組成物(離型剤)B3へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-3を作製した。
<Example 3>
Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B3 obtained in Preparation Example 12. RM-3 was prepared.
<実施例4>
調製例10で得られた組成物(離型剤)B1を調製例13で得られた組成物(離型剤)B4へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-4を作製した。
<Example 4>
Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B4 obtained in Preparation Example 13. RM-4 was made.
<実施例5>
調製例10で得られた組成物(離型剤)B1を調製例14で得られた組成物(離型剤)B5へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-5を作製した。
<Example 5>
Replica mold for imprinting was performed in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B5 obtained in Preparation Example 14. RM-5 was prepared.
<実施例6>
調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-6を作製した。
<Example 6>
Replica mold for imprinting was carried out in the same manner as in Example 1 except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B7 obtained in Preparation Example 16. RM-6 was made.
<実施例7>
調製例1で得られた組成物A1を調製例2で得られた組成物A2へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-7を作製した。
<Example 7>
The composition A1 obtained in Preparation Example 1 was changed to the composition A2 obtained in Preparation Example 2, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-7 in the same manner as in example 1.
<実施例8>
調製例1で得られた組成物A1を調製例3で得られた組成物A3へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-8を作製した。
<Example 8>
The composition A1 obtained in Preparation Example 1 was changed to the composition A3 obtained in Preparation Example 3, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, it was prepared imprint replica mold RM-8 in the same manner as in example 1.
<実施例9>
調製例1で得られた組成物A1を調製例4で得られた組成物A4へ変更し、調製例10で得られた組成物(離型剤)B1を調製例15で得られた組成物(離型剤)B6へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-9を作製した。
<Example 9>
The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 15. was changed to (release agent) B6, it was prepared imprint replica mold RM-9 in the same manner as in example 1.
<実施例10>
調製例1で得られた組成物A1を調製例4で得られた組成物A4へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-10を作製した。
<Example 10>
The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-10 in the same manner as in example 1.
<実施例11>
調製例1で得られた組成物A1を調製例4で得られた組成物A4へ変更し、調製例10で得られた組成物(離型剤)B1を調製例17で得られた組成物(離型剤)B8へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-11を作製した。
<Example 11>
The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 17. was changed to (release agent) B8, were prepared imprint replica mold RM-11 in the same manner as in example 1.
<実施例12>
調製例1で得られた組成物A1を調製例4で得られた組成物A4へ変更し、調製例10で得られた組成物(離型剤)B1を調製例18で得られた組成物(離型剤)B9へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-12を作製した。
<Example 12>
The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 18. was changed to (release agent) B9, were prepared imprint replica mold RM-12 in the same manner as in example 1.
<実施例13>
調製例1で得られた組成物A1を調製例5で得られた組成物A5へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-13を作製した。
<Example 13>
The composition A1 obtained in Preparation Example 1 was changed to the composition A5 obtained in Preparation Example 5, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-13 in the same manner as in example 1.
<実施例14>
調製例1で得られた組成物A1を調製例6で得られた組成物A6へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-14を作製した。
<Example 14>
The composition A1 obtained in Preparation Example 1 was changed to the composition A6 obtained in Preparation Example 6, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-14 in the same manner as in example 1.
<実施例15>
調製例1で得られた組成物A1を調製例7で得られた組成物A7へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-15を作製した。
<Example 15>
The composition A1 obtained in Preparation Example 1 was changed to the composition A7 obtained in Preparation Example 7, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-15 in the same manner as in example 1.
<実施例16>
調製例1で得られた組成物A1を調製例8で得られた組成物A8へ変更し、調製例10で得られた組成物(離型剤)B1を調製例16で得られた組成物(離型剤)B7へ変更した以外は、実施例1と同様の方法インプリント用レプリカモールドRM-16を作製した。
<Example 16>
The composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8, and the composition (release agent) B1 obtained in Preparation Example 10 was obtained as the composition obtained in Preparation Example 16. was changed to (release agent) B7, were prepared imprint replica mold RM-16 in the same manner as in example 1.
<比較例1>
調製例1で得られた組成物A1を調製例8で得られた組成物A8へ変更した以外は、実施例1と同様の方法でA層を形成した。得られたA層上へNOVEC1720をスピンコートし、150℃のホットプレートで5分間加熱することにより、インプリント用レプリカモールドRM-19を作製した。
<Comparative Example 1>
A layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8. NOVEC 1720 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare an imprint replica mold RM-19.
<比較例2>
調製例1で得られた組成物A1を調製例8で得られた組成物A8へ変更した以外は、実施例1と同様の方法でA層を形成した。得られたA層上へPFPE1をスピンコートし、150℃のホットプレートで5分間加熱することにより、インプリント用レプリカモールドRM-20を作製した。
<Comparative example 2>
A layer A was formed in the same manner as in Example 1 except that the composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8. PFPE1 was spin-coated on the obtained layer A and heated on a hot plate at 150° C. for 5 minutes to prepare a replica mold RM-20 for imprint.
<比較例3>
調製例1で得られた組成物A1を調製例9で得られた組成物A9へ変更し、調製例10で得られた組成物(離型剤)B1を調製例11で得られた組成物(離型剤)B2へ変更した以外は、実施例1と同様の方法でインプリント用レプリカモールドRM-21を作製した。
<Comparative example 3>
The composition A1 obtained in Preparation Example 1 was changed to the composition A9 obtained in Preparation Example 9, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 11. An imprint replica mold RM-21 was produced in the same manner as in Example 1 except that the release agent was changed to B2.
[インプリント材料の調製]
NKエステル A-DOG(新中村化学工業(株)製)を5g及びラジカル重合性基含有ポリカーボネートETERNACOLL(登録商標)UM-90(1/3)DA(宇部興産(株)製)5gを混合し、その混合物にIRGACURE184を0.2g加え、インプリント材料を調製した。
[Preparation of imprint material]
5 g of NK ester A-DOG (manufactured by Shin-Nakamura Chemical Co., Ltd.) and 5 g of a radical-polymerizable group-containing polycarbonate ETERNACOLL (registered trademark) UM-90 (1/3) DA (manufactured by Ube Industries, Ltd.) were mixed. Then, 0.2 g of IRGACURE 184 was added to the mixture to prepare an imprint material.
[インプリント用レプリカモールドを用いた凹レンズパターンの作製]
調製したインプリント材料を、実施例1に記載した方法で密着処理した石英ガラス基板上へポッティングし、その上に実施例1乃至実施例16及び比較例1乃至比較例3で得られた各インプリント用レプリカモールドを被せ、ナノインプリント装置NM-0801HB(明昌機工(株)製)を用いて光インプリントを行った。光インプリントは、常時23℃の条件で、a)10秒間かけて500Nまで加圧、b)高圧水銀ランプを用いて5000mJ/cmの露光、c)10秒間かけて除圧、d)レプリカモールドと石英ガラス基板を分離して離型、というシーケンスで行い、該石英ガラス基板上に凹レンズパターンを得た。工業用顕微鏡 ECLIPSE L150((株)ニコン製)を用いて、得られた凹レンズパターンの剥がれ・割れの有無を観察した。その結果を表1及び表2に示す。
[Fabrication of concave lens pattern using replica mold for imprint]
The prepared imprint material was potted onto a quartz glass substrate that had been subjected to a contact treatment by the method described in Example 1, and the imprint obtained in each of Examples 1 to 16 and Comparative Examples 1 to 3 was formed thereon. A replica mold for printing was covered, and optical imprint was performed using a nanoimprint apparatus NM-0801HB (manufactured by Meisho Kiko Co., Ltd.). The optical imprint is always 23° C. under conditions of a) pressurizing to 500 N for 10 seconds, b) exposing to 5000 mJ/cm 2 using a high pressure mercury lamp, c) depressurizing for 10 seconds, and d) replica. The mold and the quartz glass substrate were separated and released in a sequence to obtain a concave lens pattern on the quartz glass substrate. Using an industrial microscope ECLIPSE L150 (manufactured by Nikon Corporation), the presence or absence of peeling or cracking of the obtained concave lens pattern was observed. The results are shown in Tables 1 and 2.
[光学特性評価]
実施例1乃至実施例16及び比較例1乃至比較例3で得られた各インプリント用レプリカモールドの波長365nmにおける透過率を、分光光度計UV2600((株)島津製作所製)を用い、リファレンスを石英ガラスにした状態で測定した。その結果を表1及び表2に示す。透過率を測定した前記インプリント用レプリカモールドは、2mm径×300μm高さの凸レンズパターンを有する。
[Optical property evaluation]
The transmittance at a wavelength of 365 nm of each of the imprint replica molds obtained in Examples 1 to 16 and Comparative Examples 1 to 3 was measured using a spectrophotometer UV2600 (manufactured by Shimadzu Corporation) as a reference. It was measured in the state of being made of quartz glass. The results are shown in Tables 1 and 2. The replica mold for imprint whose transmittance was measured has a convex lens pattern having a diameter of 2 mm and a height of 300 μm.
[繰り返しインプリント可能回数の測定]
実施例1乃至実施例16及び比較例1乃至比較例3で得られた各インプリント用レプリカモールドをそのまま用いて、前述と同様の光インプリントを繰り返し、最大10回まで行い、2mm径×300μm深さの凹レンズ形状パターンが形成されなくなるまでの、光インプリントの回数を測定した。得られた結果を表1及び表2に示す。
[Measurement of the number of times imprinting can be repeated]
Using each of the imprint replica molds obtained in Examples 1 to 16 and Comparative Examples 1 to 3, the same optical imprint as described above was repeated up to 10 times and 2 mm diameter×300 μm. The number of optical imprints was measured until the concave lens-shaped pattern of depth was not formed. The obtained results are shown in Tables 1 and 2.
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000008
Figure JPOXMLDOC01-appb-T000008
表1及び表2に示す結果より、実施例1乃至実施例16で作製されたインプリント用レプリカモールドを用いて作製された凹レンズパターンは、割れ・剥がれがいずれも観察されなかった。そして、実施例1乃至実施例16で作製されたインプリント用レプリカモールドは、いずれも8回以上の繰り返しインプリントが可能であった。さらに実施例1乃至実施例16で作製されたインプリント用レプリカモールドは、365nmにおける透過率はいずれも80%以上であり、紫外線領域における高い透明性が確認された。一方、比較例2及び比較例3で作製されたインプリント用レプリカモールドを用いて作製された凹レンズパターンは、剥がれが観察された。そして比較例1及び比較例2で作製されたインプリント用レプリカモールドは、繰り返しインプリント可能な回数が1回または0回であった。さらに比較例3で作製されたインプリント用レプリカモールドは、波長365nmにおける透過率が80%を下回る結果となった。 From the results shown in Tables 1 and 2, neither cracking nor peeling was observed in the concave lens patterns produced using the imprint replica molds produced in Examples 1 to 16. The imprint replica molds produced in Examples 1 to 16 were all capable of repeating imprinting eight times or more. Further, the imprint replica molds produced in Examples 1 to 16 all had a transmittance at 365 nm of 80% or more, and high transparency in the ultraviolet region was confirmed. On the other hand, peeling was observed in the concave lens patterns produced using the imprint replica molds produced in Comparative Examples 2 and 3. The imprint replica molds produced in Comparative Example 1 and Comparative Example 2 were capable of repeating imprint once or 0 times. Further, the replica mold for imprint produced in Comparative Example 3 had a transmittance of less than 80% at a wavelength of 365 nm.
以上の結果から、本発明のインプリント用レプリカモールドは、紫外線領域における高い透明性を有するものとなり、繰り返しのインプリントが可能である。更に該インプリント用レプリカモールドを用いて作製されたパターンは、割れ・剥がれが無いものとなる。
 
From the above results, the imprint replica mold of the present invention has high transparency in the ultraviolet region, and repeated imprints are possible. Further, the pattern produced by using the replica mold for imprint has no cracking or peeling.

Claims (13)

  1. 下記A層及び該A層に接着した下記B層を備えたインプリント用レプリカモールド。
    A層:下記(a1)成分及び(a2)成分を含む組成物の硬化物から成る構造体
    (a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
    (a2)成分:前記(a1)成分100質量%に対し、0.01質量%乃至0.3質量%の光ラジカル重合開始剤
    B層:下記(b1)成分及び(b2)成分を含む組成物の硬化物から成る膜
    (b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
    (b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
    A replica mold for imprinting, which comprises the following A layer and the following B layer adhered to the A layer.
    Layer A: Structure (a1) component comprising a cured product of a composition containing the following (a1) component and (a2) component: Compound (a2) component having at least one radically polymerizable group in one molecule: the above ( a1) 0.01 mass% to 0.3 mass% of photoradical polymerization initiator B layer relative to 100 mass% of the component: a film composed of a cured product of a composition containing the following (b1) component and (b2) component ( Component b1): a compound having a linear or chain molecular chain containing a fluorine atom and having radically polymerizable groups at all terminals of the molecular chain (b2) component: 100% by mass of the component (b1) To 0.05 mass% to 15 mass% of photoradical polymerization initiator
  2. 前記(b1)成分の化合物は、下記式(1)で表される基及び下記式(2a)又は式(2b)で表される基を含む前記線状又は鎖状の分子鎖の全ての末端に、ウレタン結合を介して、下記式(3)で表される基を有する多官能(メタ)アクリレート化合物である、請求項1に記載のインプリント用レプリカモールド。
    Figure JPOXMLDOC01-appb-C000001
     
    (式中、Rは炭素原子数1又は2のパーフルオロアルキレン基を表し、R2aは炭素原子数2又は3のアルキレン基を表し、R2bは炭素原子数2又は3の3価の炭化水素基を表し、*はそれぞれ前記ウレタン結合の-O-基と結合する結合手を表し、p及びqはそれぞれ前記式(1)で表される基の繰り返し数及び前記式(2a)で表される基の繰り返し数を表すと共に独立して2以上の整数を表し、Rはメチル基又は水素原子を表す。)
    The compound of the component (b1) is a compound represented by the following formula (1) and all terminals of the linear or chain molecular chain containing a group represented by the following formula (2a) or formula (2b). The replica mold for imprint according to claim 1, which is a polyfunctional (meth)acrylate compound having a group represented by the following formula (3) via a urethane bond.
    Figure JPOXMLDOC01-appb-C000001

    (In the formula, R 1 represents a perfluoroalkylene group having 1 or 2 carbon atoms, R 2a represents an alkylene group having 2 or 3 carbon atoms, and R 2b is a trivalent carbon atom having 2 or 3 carbon atoms. Represents a hydrogen group, * represents a bond for bonding to the —O— group of the urethane bond, p and q represent the number of repeating groups of the formula (1) and the formula (2a), respectively. Represents a repeating number of a group represented by 2 and independently represents an integer of 2 or more, and R 3 represents a methyl group or a hydrogen atom.)
  3. 前記式(2a)で表される基の繰り返し数を表すqが5乃至12の整数である、請求項2に記載のインプリント用レプリカモールド。 The imprint replica mold according to claim 2, wherein q, which represents the number of repetitions of the group represented by the formula (2a), is an integer of 5 to 12.
  4. 前記式(2a)で表される基がポリ(オキシエチレン)基である、請求項2又は請求項3に記載のインプリント用レプリカモールド。 The replica mold for imprint according to claim 2 or 3, wherein the group represented by the formula (2a) is a poly(oxyethylene) group.
  5. 前記式(1)で表される基が、オキシパーフルオロメチレン基及びオキシパーフルオロエチレン基の双方を有する基である、請求項2乃至請求項4のいずれか一項に記載のインプリント用レプリカモールド。 The imprinting replica according to any one of claims 2 to 4, wherein the group represented by the formula (1) is a group having both an oxyperfluoromethylene group and an oxyperfluoroethylene group. mold.
  6. 前記(b1)成分の化合物が重量平均分子量1000乃至30000のマクロモノマー又はポリマーである、請求項1乃至請求項5のいずれか一項に記載のインプリント用レプリカモールド。 The replica mold for imprint according to claim 1, wherein the compound of the component (b1) is a macromonomer or a polymer having a weight average molecular weight of 1,000 to 30,000.
  7. 前記(b1)成分及び(b2)成分を含む組成物が更に光増感剤を含有する、請求項1乃至請求項6のいずれか一項に記載のインプリント用レプリカモールド。 The replica mold for imprints according to any one of claims 1 to 6, wherein the composition containing the component (b1) and the component (b2) further contains a photosensitizer.
  8. 前記(a1)成分が少なくとも2種の化合物を含有し、該2種の化合物のうち少なくとも1種の化合物は(メタ)アクリロイルオキシ基を1分子中に少なくとも2つ有する化合物である、請求項1に記載のインプリント用レプリカモールド。 The component (a1) contains at least two kinds of compounds, and at least one kind of the two kinds of compounds is a compound having at least two (meth)acryloyloxy groups in one molecule. The replica mold for imprint described in.
  9. 前記(メタ)アクリロイルオキシ基を1分子中に少なくとも2つ有する化合物は下記式(4)で表されるジ(メタ)アクリレート化合物である、請求項8に記載のインプリント用レプリカモールド。
    Figure JPOXMLDOC01-appb-C000002
     
    (式中、R及びRはそれぞれ独立に水素原子又はメチル基を表し、R及びRはそれぞれ独立に炭素原子数1乃至4のアルキレン基を表し、R及びRはそれぞれ独立に水素原子又はメチル基を表し、r及びrはそれぞれ独立に1乃至5の整数を表す。)
    The replica mold for imprinting according to claim 8, wherein the compound having at least two (meth)acryloyloxy groups in one molecule is a di(meth)acrylate compound represented by the following formula (4).
    Figure JPOXMLDOC01-appb-C000002

    (In the formula, R 4 and R 5 each independently represent a hydrogen atom or a methyl group, R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms, and R 8 and R 9 are each independently Represents a hydrogen atom or a methyl group, and r 1 and r 2 each independently represent an integer of 1 to 5.)
  10. 前記A層がレンズ形状の反転パターンを有する、請求項1乃至請求項9のいずれか一項に記載のインプリント用レプリカモールド。 The replica mold for imprint according to claim 1, wherein the A layer has a lens-shaped inverted pattern.
  11. 前記A層の最大厚さが2.0mmである、請求項1乃至請求項10のいずれか一項に記載のインプリント用レプリカモールド。 The replica mold for imprint according to any one of claims 1 to 10, wherein the maximum thickness of the A layer is 2.0 mm.
  12. 下記(a1)成分及び(a2)成分を含む組成物をマスターモールド上に塗布する工程、
    下記(a1)成分及び(a2)成分を含む組成物を介して前記マスターモールドを基材に圧着する工程、
    前記マスターモールドを前記基材に圧着させたまま該基材を通して下記(a1)成分及び(a2)成分を含む組成物を露光し、該組成物を光硬化する工程、
    前記光硬化する工程の後、前記基材上に得られた硬化物を前記マスターモールドから離型しA層を形成する工程、
    前記A層上に下記(b1)成分乃至(b3)成分を含む組成物を塗布する工程、及び
    下記(b1)成分乃至(b3)成分を含む組成物を40℃乃至200℃でベークし、その後露光して前記A層に接着した前記B層を形成する工程、を含むインプリント用レプリカモールドの作製方法。
    (a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
    (a2)成分:前記(a1)成分100質量%に対し、0.1質量%乃至1質量%の光ラジカル重合開始剤
    (b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
    (b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
    (b3)成分:溶媒
    A step of applying a composition containing the following component (a1) and component (a2) onto a master mold,
    A step of pressure-bonding the master mold to a substrate through a composition containing the following component (a1) and component (a2),
    A step of exposing the composition containing the following component (a1) and component (a2) through the base material while keeping the master mold pressed against the base material, and photocuring the composition;
    After the photo-curing step, a step of releasing the cured product obtained on the base material from the master mold to form an A layer,
    A step of applying a composition containing the following components (b1) to (b3) on the layer A, and a composition containing the following components (b1) to (b3) are baked at 40° C. to 200° C., and then And a step of forming the B layer adhered to the A layer by exposure to light.
    Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1). Component (b1): a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
  13. 下記(a1)成分及び(a2)成分を含む組成物を基材上に塗布する工程、
    下記(a1)成分及び(a2)成分を含む組成物を介して前記基材をマスターモールドに圧着する工程、
    前記マスターモールドを前記基材に圧着させたまま該基材を通して下記(a1)成分及び(a2)成分を含む組成物を露光し、該組成物を光硬化する工程、
    前記光硬化する工程の後、前記基材上に得られた硬化物を前記マスターモールドから離型しA層を形成する工程、
    前記A層上に下記(b1)成分乃至(b3)成分を含む組成物を塗布する工程、及び
    下記(b1)成分乃至(b3)成分を含む組成物を40℃乃至200℃でベークし、その後露光して前記A層に接着した前記B層を形成する工程、を含むインプリント用レプリカモールドの作製方法。
    (a1)成分:ラジカル重合性基を1分子中に少なくとも1つ有する化合物
    (a2)成分:前記(a1)成分100質量%に対し、0.1質量%乃至1質量%の光ラジカル重合開始剤
    (b1)成分:フッ素原子を含む線状又は鎖状の分子鎖からなる化合物であって該分子鎖の全ての末端にラジカル重合性基を有する化合物
    (b2)成分:前記(b1)成分100質量%に対し、0.05質量%乃至15質量%の光ラジカル重合開始剤
    (b3)成分:溶媒
     
    A step of applying a composition containing the following component (a1) and component (a2) onto a substrate,
    A step of pressure-bonding the base material to a master mold through a composition containing the following component (a1) and component (a2),
    A step of exposing the composition containing the following component (a1) and component (a2) through the base material while keeping the master mold pressed against the base material, and photocuring the composition;
    After the photo-curing step, a step of releasing the cured product obtained on the base material from the master mold to form an A layer,
    A step of applying a composition containing the following components (b1) to (b3) on the layer A, and a composition containing the following components (b1) to (b3) are baked at 40° C. to 200° C., and then And a step of forming the B layer adhered to the A layer by exposure to light.
    Component (a1): Compound having at least one radical-polymerizable group in one molecule (a2) Component: 0.1% by mass to 1% by mass of photoradical polymerization initiator based on 100% by mass of the component (a1). Component (b1): a compound composed of a linear or chain molecular chain containing a fluorine atom and having a radical polymerizable group at all terminals of the molecular chain (b2) component: 100 mass of the component (b1) % To 0.05% by mass to 15% by mass of the radical photopolymerization initiator (b3) component: solvent
PCT/JP2019/047048 2018-12-07 2019-12-02 Replica mold for imprinting and method for producing same WO2020116397A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020559182A JP7288247B2 (en) 2018-12-07 2019-12-02 IMPRINT REPLICA MOLD AND MANUFACTURING METHOD THEREOF

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-229747 2018-12-07
JP2018229747 2018-12-07

Publications (1)

Publication Number Publication Date
WO2020116397A1 true WO2020116397A1 (en) 2020-06-11

Family

ID=70975130

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/047048 WO2020116397A1 (en) 2018-12-07 2019-12-02 Replica mold for imprinting and method for producing same

Country Status (3)

Country Link
JP (1) JP7288247B2 (en)
TW (1) TWI822920B (en)
WO (1) WO2020116397A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5951165B2 (en) * 1976-05-17 1984-12-12 株式会社日立製作所 power amplifier
JP2007526820A (en) * 2003-12-19 2007-09-20 ザ ユニバーシティ オブ ノース カロライナ アット チャペル ヒル Method for producing separated microstructure and separated nanostructure using soft lithography or imprint lithography
JP2010000719A (en) * 2008-06-20 2010-01-07 Mitsubishi Rayon Co Ltd Film-like replica mold, its manufacturing method, and manufacturing method of film product having fine uneven structure
JP2010080670A (en) * 2008-09-26 2010-04-08 Hitachi Industrial Equipment Systems Co Ltd Microstructure and method of manufacturing the same
JP2010105357A (en) * 2008-10-31 2010-05-13 Konica Minolta Opto Inc Molding device, molding die member, wafer lens, and method of manufacturing wafer lens molding die

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69118413T2 (en) * 1990-01-18 1996-08-08 Du Pont Process for the production of optically readable media with information in relief
MY146088A (en) * 2003-06-04 2012-06-29 Wd Media Inc An imprinting method
JP2007307752A (en) * 2006-05-17 2007-11-29 Asahi Glass Co Ltd Mold and its manufacturing method
TWI510507B (en) * 2009-05-29 2015-12-01 Nissan Chemical Ind Ltd Fluorine-containing highly branched polymer and resin composition containing the ploymer
WO2013061726A1 (en) * 2011-10-28 2013-05-02 東レ株式会社 Gas barrier film
JP6522322B2 (en) * 2013-12-12 2019-05-29 株式会社トクヤマ Method of manufacturing replica mold for nanoimprinting
CN106575606B (en) * 2014-08-21 2020-03-27 日产化学工业株式会社 Imprint material
US10134588B2 (en) * 2016-03-31 2018-11-20 Canon Kabushiki Kaisha Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography
US10509313B2 (en) * 2016-06-28 2019-12-17 Canon Kabushiki Kaisha Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5951165B2 (en) * 1976-05-17 1984-12-12 株式会社日立製作所 power amplifier
JP2007526820A (en) * 2003-12-19 2007-09-20 ザ ユニバーシティ オブ ノース カロライナ アット チャペル ヒル Method for producing separated microstructure and separated nanostructure using soft lithography or imprint lithography
JP2010000719A (en) * 2008-06-20 2010-01-07 Mitsubishi Rayon Co Ltd Film-like replica mold, its manufacturing method, and manufacturing method of film product having fine uneven structure
JP2010080670A (en) * 2008-09-26 2010-04-08 Hitachi Industrial Equipment Systems Co Ltd Microstructure and method of manufacturing the same
JP2010105357A (en) * 2008-10-31 2010-05-13 Konica Minolta Opto Inc Molding device, molding die member, wafer lens, and method of manufacturing wafer lens molding die

Also Published As

Publication number Publication date
JPWO2020116397A1 (en) 2021-10-21
JP7288247B2 (en) 2023-06-07
TWI822920B (en) 2023-11-21
TW202027952A (en) 2020-08-01

Similar Documents

Publication Publication Date Title
KR102290403B1 (en) Novel compound having isocyanuric skeleton and composition in which said compound is included
KR102226670B1 (en) Imprint material containing modified silicone compound and silsesquioxane compound
JP5263560B2 (en) High hardness imprint material
CN109563194B (en) Imprint material
JP7288247B2 (en) IMPRINT REPLICA MOLD AND MANUFACTURING METHOD THEREOF
JP6916473B2 (en) Mold release agent
JP7070845B2 (en) Mold release agent containing solid resin
JP6338061B2 (en) Imprint material with low release force
JP6997417B2 (en) Replica mold material for imprint
JP6997418B2 (en) Replica mold material for imprint
JP6508488B2 (en) Imprint material

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19892652

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020559182

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19892652

Country of ref document: EP

Kind code of ref document: A1