TW202027952A - Replica mold for imprint and manufacturing method thereof - Google Patents

Replica mold for imprint and manufacturing method thereof Download PDF

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TW202027952A
TW202027952A TW108144521A TW108144521A TW202027952A TW 202027952 A TW202027952 A TW 202027952A TW 108144521 A TW108144521 A TW 108144521A TW 108144521 A TW108144521 A TW 108144521A TW 202027952 A TW202027952 A TW 202027952A
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TWI822920B (en
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小林淳平
加藤拓
長澤偉大
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日商日產化學有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

To provide a novel replica mold for imprinting. A replica mold for imprinting, which is provided with a layer A described below and a layer B described below, said layer B being bonded to the layer A. Layer A: a structure which is formed of a cured product of a composition that contains the following component (a1) and component (a2) Component (a1): a compound which has at least one radically polymerizable group in each molecule Component (a2): a radical photopolymerization initiator in an amount of from 0.01% by mass to 0.3% by mass relative to 100% by mass of the component (a1) Layer B: a film which is formed of a cured product of a composition that contains the following component (b1) and component (b2) Component (b1): a compound which is composed of a linear or chain-like molecular chain containing a fluorine atom, and which has a radically polymerizable group at all terminals of the molecular chain Component (b2): a radical photopolymerization initiator in an amount of from 0.05% by mass to 15% by mass relative to 100% by mass of the component (b1).

Description

壓印用複製模及其製作方法Copy mold for imprinting and manufacturing method thereof

本發明係關於一種具有圖案之壓印用複製模。更詳細而言,本發明係關於一種即便為厚膜亦於紫外線區域保持高透明性且無需脫模劑之重新塗佈且即便用於重複光壓印亦可實現良好之圖案形成之壓印用複製模、及該複製模之製造方法。 於本說明書中,所謂「厚膜」,表示0.01 mm以上之厚度且最大厚度2.0 mm之膜。The present invention relates to a copy mold for imprinting with patterns. In more detail, the present invention relates to an imprint that maintains high transparency in the ultraviolet region even if it is a thick film, does not require re-coating of a release agent, and can achieve good pattern formation even when used for repeated light imprinting. Copy mold and manufacturing method of the copy mold. In this specification, the so-called "thick film" means a film with a thickness of 0.01 mm or more and a maximum thickness of 2.0 mm.

樹脂透鏡被用於行動電話、數位相機、車載相機等電子設備,被要求具有符合該電子設備之目的之優異之光學特性。又,對於該樹脂透鏡,要求配合使用態樣而具有較高之耐久性、例如耐熱性及耐候性、以及可良率較佳地成形之較高之生產性。作為滿足此種要求之樹脂透鏡用之材料,例如使用聚碳酸酯樹脂、環烯烴聚合物、甲基丙烯酸系樹脂等熱塑性之透明樹脂。Resin lenses are used in electronic devices such as mobile phones, digital cameras, and in-vehicle cameras, and are required to have excellent optical characteristics that meet the purpose of the electronic devices. In addition, for the resin lens, it is required to have high durability, such as heat resistance and weather resistance, and high productivity that can be molded with a better yield when used in combination. As a material for resin lenses that meets such requirements, for example, thermoplastic transparent resins such as polycarbonate resins, cycloolefin polymers, and methacrylic resins are used.

於樹脂透鏡之製造時,為了良率或生產效率之提高、進而透鏡積層時之光軸偏移之抑制,積極研究自熱塑性樹脂之射出成型向藉由使用室溫下為液狀之硬化性樹脂之壓抵成形所進行之晶圓級成形之轉變。關於晶圓級成形,就生產性之觀點而言,通常為於玻璃基板等支持體上形成透鏡之混合透鏡方式。In the manufacture of resin lenses, in order to improve the yield or production efficiency, and to suppress the deviation of the optical axis when the lens is laminated, we are actively researching from the injection molding of thermoplastic resins to the use of curable resins that are liquid at room temperature. The transformation of wafer-level forming performed by compression forming. Regarding wafer-level molding, from the viewpoint of productivity, it is usually a hybrid lens method in which lenses are formed on a support such as a glass substrate.

於晶圓級成形中,模具亦必須以晶圓級成型。通常之樹脂透鏡製造用之模具使用對金屬進行掘鑿及研磨而成者,於晶圓級時,必須於面內具有多個透鏡圖案且正確地控制其面內誤差或像素間間距。因此,模具之製作非常困難,而且變得昂貴。進而,於使用金屬製之模具之情形時,用於樹脂透鏡用材料之硬化之UV光不能透過,故而於成形透鏡之支持體之素材上產生限制。因此,通常使用主模與複製模材料製作複製模,使用該複製模進行晶圓級成形。其中,如專利文獻1中記載般,開發有使用相對廉價之一像素分之主模與複製模材料,利用晶圓內之分步重複成型(step and repeat molding)製作複製模之方法。 [先前技術文獻] [專利文獻]In wafer-level forming, the mold must also be formed at the wafer level. Generally, the mold used for resin lens manufacturing is made by digging and grinding metal. At the wafer level, it must have multiple lens patterns in the plane and accurately control the in-plane error or the pixel pitch. Therefore, the production of the mold is very difficult and becomes expensive. Furthermore, when a metal mold is used, the UV light used for the curing of the resin lens material cannot pass through, so there is a restriction on the material of the support for forming the lens. Therefore, a master mold and a replica mold material are usually used to make a replica mold, and the replica mold is used for wafer-level molding. Among them, as described in Patent Document 1, there has been developed a method of using relatively inexpensive master mold and replica mold materials of one pixel, and using step and repeat molding in the wafer to produce replica molds. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利第4226061號(日本專利特開2009-172773號公報)[Patent Document 1] Japanese Patent No. 4226061 (Japanese Patent Laid-Open No. 2009-172773)

[發明所欲解決之問題][The problem to be solved by the invention]

於通常使用之複製模中,用於樹脂透鏡之製造步驟之UV光、尤其是波長365 nm之透過率較低。於使用此種複製模而成形樹脂透鏡時,存在為了賦予脫模性而塗佈市售之脫模劑之方法。然而,於使用相同之複製模持續成形重複樹脂透鏡之情形時,上述脫模劑自該複製模之表面剝離。因此,使用相同之複製模成形重複樹脂透鏡變得困難。In the commonly used copy molds, the UV light used in the manufacturing step of the resin lens, especially the transmittance at a wavelength of 365 nm, is low. When molding a resin lens using such a replica mold, there is a method of applying a commercially available mold release agent in order to impart mold releasability. However, when the same replica mold is used to continuously mold the repeated resin lens, the release agent is peeled off from the surface of the replica mold. Therefore, it becomes difficult to mold repeated resin lenses using the same replica mold.

如此般,可用作用於相機模組等中所使用之樹脂透鏡之成形之複製模,並且具有較高之透明性,且能夠成形重複樹脂透鏡之複製模仍未發現,期待其之開發。本發明係鑒於此種情況而成者,其目的在於提供一種具有較高之透明性,且能夠成形重複樹脂透鏡之複製模。 [解決問題之技術手段]In this way, it can be used as a replica mold for the molding of resin lenses used in camera modules, etc., and has high transparency, and a replica mold capable of molding repeated resin lenses has not yet been discovered, and its development is expected. The present invention was made in view of this situation, and its object is to provide a replica mold with high transparency and capable of forming repeated resin lenses. [Technical means to solve the problem]

本發明者等人為了解決上述課題而進行銳意研究,結果藉由使包含含有於包含氟原子之線狀或鏈狀之分子鏈之所有末端具有自由基聚合性基之化合物、及光自由基聚合起始劑之組合物之硬化物之膜接著於包含含有於1分子中具有至少1個自由基聚合性基之化合物、及光自由基聚合起始劑之組合物之硬化物之結構體而完成本發明。即,本發明之複製模具有紫外線區域之較高之透明性,且能夠成形重複樹脂透鏡。The inventors of the present invention conducted intensive research to solve the above-mentioned problems, and as a result, by including a compound having a radical polymerizable group at all ends of a linear or chain molecular chain containing a fluorine atom, and photoradical polymerization The film of the cured product of the composition of the initiator is then completed by the structure containing the cured product of the composition of the composition containing at least one radical polymerizable group in one molecule and the photoradical polymerization initiator this invention. That is, the replication mold of the present invention has high transparency in the ultraviolet region, and can mold repeating resin lenses.

即,本發明之第1態樣係一種具備下述A層及接著於該A層之下述B層之壓印用複製模。 A層:包含含有下述(a1)成分及(a2)成分之組合物之硬化物之結構體 (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.01質量%至0.3質量%之光自由基聚合起始劑 B層:包含含有下述(b1)成分及(b2)成分之組合物之硬化物之膜 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑That is, the first aspect of the present invention is a copy mold for imprint having the following A layer and the following B layer next to the A layer. Layer A: A structure containing a cured product of a composition containing the following (a1) and (a2) components (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.01% by mass to 0.3% by mass relative to 100% by mass of the above-mentioned component (a1) Layer B: A film containing a cured product of a composition containing the following components (b1) and (b2) (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% to 15% by mass relative to 100% by mass of the above (b1) component

上述(b1)成分之化合物例如為於上述線狀或鏈狀之分子鏈之所有末端經由胺基甲酸酯鍵具有下述式(3)所表示之基之多官能(甲基)丙烯酸酯化合物,上述線狀或鏈狀之分子鏈包含下述式(1)所表示之基及下述式(2a)或式(2b)所表示之基。 [化1]

Figure 02_image001
(式中,R1 表示碳原子數1或2之全氟伸烷基,R2a 表示碳原子數2或3之伸烷基,R2b 表示碳原子數2或3之3價之烴基,*表示分別與上述胺基甲酸酯鍵之-O-基鍵結之鍵結鍵,p及q分別表示上述式(1)所表示之基之重複數及上述式(2a)所表示之基之重複數並且獨立地表示2以上之整數,R3 表示甲基或氫原子)The compound of the component (b1) is, for example, a polyfunctional (meth)acrylate compound having a group represented by the following formula (3) via a urethane bond at all ends of the linear or chain molecular chain The linear or chain-shaped molecular chain includes a group represented by the following formula (1) and a group represented by the following formula (2a) or (2b). [化1]
Figure 02_image001
(In the formula, R 1 represents a perfluoroalkylene group with 1 or 2 carbon atoms, R 2a represents an alkylene group with 2 or 3 carbon atoms, and R 2b represents a trivalent hydrocarbon group with 2 or 3 carbon atoms, * Represents the bonding bond to the -O- group of the above urethane bond, p and q represent the repeating number of the group represented by the above formula (1) and the number of the group represented by the above formula (2a), respectively Repeat number and independently represent an integer of 2 or more, R 3 represents a methyl group or a hydrogen atom)

表示上述式(2a)所表示之基之重複數之q例如為5至12之整數。The q representing the number of repetitions of the base represented by the above formula (2a) is, for example, an integer of 5-12.

上述式(2a)所表示之基例如為聚(氧伸乙基)。The group represented by the above formula (2a) is, for example, poly(oxyethylene).

上述式(1)所表示之基例如為具有氧全氟亞甲基及氧全氟伸乙基之兩者之基。The group represented by the above formula (1) is, for example, a group having both of oxyperfluoromethylene and oxyperfluoroethylene.

上述(b1)成分之化合物例如為重量平均分子量1000至30000之巨單體或聚合物。The compound of the component (b1) is, for example, a macromonomer or polymer having a weight average molecular weight of 1,000 to 30,000.

包含上述(b1)成分及(b2)成分之組合物可進而含有光增感劑。The composition containing the above-mentioned (b1) component and (b2) component may further contain a photosensitizer.

於上述(a1)成分含有至少2種化合物之情形時,該2種化合物中之至少1種化合物為於1分子中具有至少2個(甲基)丙烯醯氧基之化合物。When the above-mentioned (a1) component contains at least two compounds, at least one of the two compounds is a compound having at least two (meth)acryloxy groups in one molecule.

上述於1分子中具有至少2個(甲基)丙烯醯氧基之化合物例如為下述式(4)所表示之二(甲基)丙烯酸酯化合物。 [化2]

Figure 02_image003
(式中,R4 及R5 分別獨立地表示氫原子或甲基,R6 及R7 分別獨立地表示碳原子數1至4之伸烷基,R8 及R9 分別獨立地表示氫原子或甲基,r1 及r2 分別獨立地表示1至5之整數)The compound having at least two (meth)acryloxy groups in one molecule is, for example, a di(meth)acrylate compound represented by the following formula (4). [化2]
Figure 02_image003
(In the formula, R 4 and R 5 each independently represent a hydrogen atom or a methyl group, R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms, and R 8 and R 9 each independently represent a hydrogen atom Or methyl, r 1 and r 2 each independently represent an integer from 1 to 5)

上述A層例如具有透鏡形狀之反轉圖案。上述A層之最大厚度例如為2.0 mm。The A layer has, for example, a lens-shaped reverse pattern. The maximum thickness of the above A layer is, for example, 2.0 mm.

本發明之其他態樣係一種壓印用複製模之製作方法,其包含:將包含下述(a1)成分及(a2)成分之組合物塗佈於主模上之步驟、經由包含下述(a1)成分及(a2)成分之組合物將上述主模壓接於基材之步驟、於將上述主模壓接於上述基材之狀態下通過該基材對包含下述(a1)成分及(a2)成分之組合物進行曝光而使該組合物進行光硬化之步驟、於上述光硬化步驟之後將上述基材上所得之硬化物自上述主模脫模而形成A層之步驟、於上述A層上塗佈包含下述(b1)成分至(b3)成分之組合物之步驟、及將包含下述(b1)成分至(b3)成分之組合物於40℃至200℃下進行烘烤且其後進行曝光而形成接著於上述A層之上述B層之步驟。 (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.1質量%至1質量%之光自由基聚合起始劑 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑 (b3)成分:溶劑Another aspect of the present invention is a method of making a replica mold for imprinting, which includes the step of applying a composition containing the following components (a1) and (a2) to a master mold through the steps including the following ( a1) The composition of component and (a2) The step of crimping the above-mentioned master mold to the substrate, passing the substrate pair in the state where the above-mentioned master mold is crimped to the substrate, contains the following (a1) components and (a2) ) The step of exposing the composition of the components to photocuring the composition, after the photocuring step, the step of releasing the cured product obtained on the substrate from the master mold to form the A layer, in the A layer The step of applying a composition containing the following components (b1) to (b3), and baking the composition containing the following components (b1) to (b3) at 40°C to 200°C and Then, exposure is performed to form the step of forming the layer B next to the layer A. (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.1% to 1% by mass of the photo-radical polymerization initiator relative to 100% by mass of the above (a1) component (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% to 15% by mass relative to 100% by mass of the above (b1) component (b3) Ingredient: Solvent

進而,本發明之其他態樣係一種壓印用複製模之製作方法,其包含:將包含下述(a1)成分及(a2)成分之組合物塗佈於基材上之步驟、經由包含下述(a1)成分及(a2)成分之組合物將上述基材壓接於主模之步驟、於將上述主模壓接於上述基材之狀態下通過該基材對包含下述(a1)成分及(a2)成分之組合物進行曝光而使該組合物進行光硬化之步驟、於上述光硬化步驟之後將上述基材上所得之硬化物自上述主模脫模而形成A層之步驟、於上述A層上塗佈包含下述(b1)成分至(b3)成分之組合物之步驟、及將包含下述(b1)成分至(b3)成分之組合物於40℃至200℃下進行烘烤且其後進行曝光而形成接著於上述A層之上述B層之步驟。 (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.1質量%至1質量%之光自由基聚合起始劑 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑 (b3)成分:溶劑 [發明之效果]Furthermore, another aspect of the present invention is a method of making a replica mold for imprinting, which includes the step of coating a composition containing the following components (a1) and (a2) on a substrate, and including The composition of the component (a1) and the component (a2) includes the step of crimping the base material to the master mold, and passing the base material in the state where the master mold is crimped to the base material, including the following component (a1) And the step of exposing the composition of component (a2) to photocuring the composition, after the photocuring step, the step of releasing the cured product obtained on the substrate from the master mold to form the A layer, in The step of applying a composition containing the following components (b1) to (b3) on the A layer, and baking the composition containing the following components (b1) to (b3) at 40°C to 200°C The step of baking and then exposing to form the layer B next to the layer A. (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.1% to 1% by mass of the photo-radical polymerization initiator relative to 100% by mass of the above (a1) component (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% to 15% by mass relative to 100% by mass of the above (b1) component (b3) Ingredient: Solvent [Effects of Invention]

本發明之壓印用複製模藉由使包含含有上述(b1)成分及(b2)成分之組合物之硬化物之膜接著於包含含有上述(a1)成分及(a2)成分之組合物之硬化物之結構體,從而即便為厚膜亦具有較高之透明性,且能夠連續轉印。The replica mold for imprint of the present invention is cured by curing a film containing a cured product of a composition containing the above-mentioned (b1) component and (b2) component to a composition containing the above-mentioned (a1) component and (a2) component The structure of the object, even if it is a thick film, has high transparency and can be continuously transferred.

又,本發明之壓印用複製模可於任意之基材上製作,形成於該基材上之複製模即便為厚膜亦於紫外線區域具有較高之透明性。因此,本發明之壓印用複製模可較佳地用於固體拍攝元件、感測器用透鏡等要求形狀精度之光學構件之製造。In addition, the copy mold for imprinting of the present invention can be made on any substrate, and the copy mold formed on the substrate has high transparency in the ultraviolet region even if it is a thick film. Therefore, the imprint replica mold of the present invention can be preferably used for the manufacture of optical components requiring shape accuracy, such as solid-state imaging devices and sensor lenses.

[(a1)成分] (a1)成分係於1分子中具有至少1個自由基聚合性基之化合物。作為該自由基聚合性基,例如可列舉(甲基)丙烯醯氧基。於本發明中,(甲基)丙烯醯氧基意指丙烯醯氧基與甲基丙烯醯氧基之兩者。又,(甲基)丙烯酸酯意指丙烯酸酯與甲基丙烯酸酯之兩者。[(a1) Ingredients] (a1) The component is a compound having at least one radical polymerizable group in one molecule. As this radically polymerizable group, (meth)acryloxy group is mentioned, for example. In the present invention, the (meth)acryloyloxy group means both of the acryloyloxy group and the methacryloyloxy group. In addition, (meth)acrylate means both acrylate and methacrylate.

作為上述(a1)成分之化合物,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸異己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸1-金剛烷基酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸2-甲基-2-乙基-1,3-二氧雜環戊烷-4-基)甲酯、(甲基)丙烯酸環己烷螺-2-(1,3-二氧雜環戊烷-4-基)甲酯、(甲基)丙烯酸3-乙基-3-氧雜環丁基甲酯、γ-丁內酯(甲基)丙烯酸酯、甲氧基二乙二醇二(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯、甲氧基四乙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇#400(甲基)丙烯酸酯、甲氧基聚乙二醇#600(甲基)丙烯酸酯、甲氧基聚乙二醇#1000(甲基)丙烯酸酯、甲氧基三丙二醇(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、異壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、丙烯酸2-羥基-3-甲基丙烯醯基丙酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇#200二(甲基)丙烯酸酯、聚乙二醇#400二(甲基)丙烯酸酯、聚乙二醇#600二(甲基)丙烯酸酯、聚乙二醇#1000二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、聚丙二醇#400二丙烯酸酯、聚丙二醇#700二丙烯酸酯、聚四亞甲基二醇#650二(甲基)丙烯酸酯、聚乙烯聚丙二醇二(甲基)丙烯酸酯、二㗁烷二醇二(甲基)丙烯酸酯、三環癸醇二(甲基)丙烯酸酯、乙氧基改性氫化雙酚A二丙烯酸酯、乙氧基改性氫化雙酚A二甲基丙烯酸酯、丙氧基改性氫化雙酚A二丙烯酸酯、丙氧基改性氫化雙酚A二甲基丙烯酸酯、丁氧基改性氫化雙酚A二丙烯酸酯、丁氧基改性氫化雙酚A二甲基丙烯酸酯、乙氧基丙氧基改性氫化雙酚A二丙烯酸酯、乙氧基丙氧基改性氫化雙酚A二甲基丙烯酸酯、乙氧基改性氫化雙酚F二丙烯酸酯、乙氧基改性氫化雙酚F二甲基丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、乙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、丙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、乙氧基化甘油三(甲基)丙烯酸酯、丙氧基化甘油三(甲基)丙烯酸酯、異氰尿酸三-(2-(甲基)丙烯醯氧基乙基)酯、己內酯改性異氰尿酸三-(2-(甲基)丙烯醯氧基乙基)酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、乙氧基化季戊四醇三(甲基)丙烯酸酯、乙氧基化季戊四醇四(甲基)丙烯酸酯、丙氧基化季戊四醇三(甲基)丙烯酸酯、丙氧基化季戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、乙氧基化二-三羥甲基丙烷四(甲基)丙烯酸酯、丙氧基化二-三羥甲基丙烷四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇聚(甲基)丙烯酸酯、乙氧基化二季戊四醇聚(甲基)丙烯酸酯、丙氧基化二季戊四醇聚(甲基)丙烯酸酯、乙氧基化聚甘油聚(甲基)丙烯酸酯。As the compound of the above-mentioned (a1) component, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, (methyl) ) N-butyl acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, n-pentyl (meth)acrylate, isoamyl (meth)acrylate, n-hexyl (meth)acrylate , Isohexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-nonyl (meth)acrylate, (meth) Base) isononyl acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, tetradecyl (meth)acrylate, (meth)acrylic acid Behenyl ester, iso-(meth)acrylate, cyclohexyl (meth)acrylate, 1-adamantyl (meth)acrylate, dicyclopentyl (meth)acrylate, two (meth)acrylate Cyclopentenyloxyethyl, dicyclopentenyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-methyl-2-ethyl-1,3-diox (meth)acrylate Cyclopentane-4-yl)methyl, cyclohexanespiro-2-(1,3-dioxol-4-yl)methyl (meth)acrylate, 3-(meth)acrylic acid Ethyl-3-oxetanyl methyl ester, γ-butyrolactone (meth)acrylate, methoxydiethylene glycol di(meth)acrylate, methoxytriethylene glycol (meth)acrylic acid Ester, methoxy tetraethylene glycol (meth) acrylate, methoxy polyethylene glycol #400 (meth) acrylate, methoxy polyethylene glycol #600 (meth) acrylate, methoxy Base polyethylene glycol #1000 (meth)acrylate, methoxytripropylene glycol (meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di( Meth) acrylate, 1,9-nonanediol di(meth)acrylate, isononanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl Glycol di(meth)acrylate, 2-hydroxy-3-methacryloyl propyl acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethyl Glycol di(meth)acrylate, polyethylene glycol #200 di(meth)acrylate, polyethylene glycol #400 di(meth)acrylate, polyethylene glycol #600 di(meth)acrylate Ester, polyethylene glycol #1000 di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol #400 diacrylate, polypropylene glycol #700 diacrylic acid Ester, polytetramethylene glycol #650 di(meth)acrylate, polyethylene polypropylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tricyclodecanol di( Meth) acrylate, ethoxy-modified hydrogenated bisphenol A diacrylate, ethoxy-modified hydrogenated bisphenol A dimethacrylate, propoxy-modified hydrogenated bisphenol A diacrylate, propoxy Modified hydrogenated bisphenol A dimethacrylate, butoxy Base modified hydrogenated bisphenol A diacrylate, butoxy modified hydrogenated bisphenol A dimethacrylate, ethoxy propoxy modified hydrogenated bisphenol A diacrylate, ethoxy propoxy modified Hydrogenated bisphenol A dimethacrylate, ethoxy-modified hydrogenated bisphenol F diacrylate, ethoxy-modified hydrogenated bisphenol F dimethacrylate, trimethylolpropane tri(meth)acrylate , Ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, ethoxylated glycerol tri(meth)acrylate, propoxy Alkylated glycerol tri(meth)acrylate, isocyanurate tris-(2-(meth)acryloxyethyl) ester, caprolactone modified isocyanurate tris-(2-(meth)propene Ethoxylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate Ester, propoxylated pentaerythritol tris(meth)acrylate, propoxylated pentaerythritol tetra(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, ethoxylated di-tris Methylolpropane tetra(meth)acrylate, propoxylated di-trimethylolpropane tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol poly(meth)acrylate , Ethoxylated dipentaerythritol poly(meth)acrylate, propoxylated dipentaerythritol poly(meth)acrylate, ethoxylated polyglycerol poly(meth)acrylate.

上述(a1)成分之化合物可作為市售品而獲得,作為其具體例,可列舉:Lightester M、Lightester E、Lightester NB、Lightester IB、Lightester TB、Lightester EH、Lightester IB-X、Lightester CH、Light Acrylate IB-XA(以上由共榮社化學(股)製造)、NOAA、IOAA、INAA、LA、STA、ISTA、IBXA、Viscoat#155、1-ADA、1-ADMA、Viscoat#150、MEDOL-10、CHDOL-10、OXE-10、OXE-30、GBLA、GBLMA、Viscoat#195、Viscoat#230、Viscoat#260、Viscoat#295、Viscoat#300、Viscoat#400、Viscoat#360(以上由大阪有機化學工業(股)製造)、LA、LMA、A-MS、A-S、S-1800A、A-BH、AM-30G、AM-90G、AM-130G、AM-230G、AM-30PG、M-20G、M-30G、M-40G、M-90G、M-130G、M-230G、A-HD-N、A-NOD-N、A-IND、A-DOD-N、A-NPG、BD、HD-N、NOD-N、DOD-N、NPG、701A、701、A-200、A-400、A-600、A-1000、APG-100、APG-200、APG-400、APG-700、1G、2G、3G、4G、9G、14G、23G、3PG、9PG、A-PTMG-65、A-1206PE、1206PE、A-0612PE、A-0412PE、A-1000PER、1000PER、A-3000PER、A-DOG、A-DCP、DCP、A-TMPT、A-TMPT-3EO、A-TMPT-9EO、AT-20E、AT-30E、A-TMPT-3PO、A-TMPT-6O、TMPT、TMPT-3EO、TMPT-9EO、TMPT-3PO、A-GLY-3E、A-GLY-6E、A-GLY-9E、A-GLY-20E、A-GLY-3P、A-GLY-6P、A-GLY-9P、GLY-3E、GLY-6E、GLY-9E、GLY-20E、A-9300、A-9200、A-9300-1CL、A-9300-3CL、A-TMM-3、A-TMM-3L、A-TMM-3LM-N、ATM-4EL、ATM-8EL、ATM-4PL、TM-4EL、TM-4PL、A-TMMT、ATM-4E、ATM-35E、ATM-4P、ATM-10P、TM-4E、TM-35E、TM-4P、TM-10P、AD-TMP-L、AD-TMP-4E、AD-TMP-4P、D-TMP、D-TMP-4E、D-TMP-4P、A-DPH、A-9550、A-DPH-6E、A-DPH-12E、A-DPH-6EL、A-DPH-12EL、A-DPH-6P、M-DPH-6E、M-DPH-12E、M-DPH-6P、A-PG5027E、A-PG5054E、M-PG5027E、M-PG5054E(以上由新中村化學工業(股)製造)、Fancryl(註冊商標)FA-513AS、Fancryl FA-512AS、Fancryl FA-511AS(以上由日立化成(股)製造)、New Frontier(註冊商標)HBPE-4、New Frontier HBPEM-10(以上由第一工業製藥(股)製造)、KAYARAD(註冊商標)PET-30、KAYARAD DPHA、KAYARAD DPEA-12(以上由日本化藥(股)製造)。上述(a1)成分可單獨使用1種,或亦可混合2種以上使用。The compound of the above component (a1) can be obtained as a commercially available product, and specific examples thereof include: Lightester M, Lightester E, Lightester NB, Lightester IB, Lightester TB, Lightester EH, Lightester IB-X, Lightester CH, Light Acrylate IB-XA (manufactured by Kyoeisha Chemical Co., Ltd. above), NOAA, IOAA, INAA, LA, STA, ISTA, IBXA, Viscoat#155, 1-ADA, 1-ADMA, Viscoat#150, MEDOL-10 , CHDOL-10, OXE-10, OXE-30, GBLA, GBLMA, Viscoat#195, Viscoat#230, Viscoat#260, Viscoat#295, Viscoat#300, Viscoat#400, Viscoat#360 (The above are from Osaka Organic Chemical Industrial (Stock) Manufacturing), LA, LMA, A-MS, AS, S-1800A, A-BH, AM-30G, AM-90G, AM-130G, AM-230G, AM-30PG, M-20G, M -30G, M-40G, M-90G, M-130G, M-230G, A-HD-N, A-NOD-N, A-IND, A-DOD-N, A-NPG, BD, HD-N , NOD-N, DOD-N, NPG, 701A, 701, A-200, A-400, A-600, A-1000, APG-100, APG-200, APG-400, APG-700, 1G, 2G , 3G, 4G, 9G, 14G, 23G, 3PG, 9PG, A-PTMG-65, A-1206PE, 1206PE, A-0612PE, A-0412PE, A-1000PER, 1000PER, A-3000PER, A-DOG, A -DCP, DCP, A-TMPT, A-TMPT-3EO, A-TMPT-9EO, AT-20E, AT-30E, A-TMPT-3PO, A-TMPT-6O, TMPT, TMPT-3EO, TMPT-9EO , TMPT-3PO, A-GLY-3E, A-GLY-6E, A-GLY-9E, A-GLY-20E, A-GLY-3P, A-GLY-6P, A-GLY-9P, GLY-3E , GLY-6E, GLY-9E, GLY-20E, A-9300, A-9200, A-9300-1CL, A-9300-3CL, A-TMM-3, A-TMM-3L, A-TMM-3LM -N, AT M-4EL, ATM-8EL, ATM-4PL, TM-4EL, TM-4PL, A-TMMT, ATM-4E, ATM-35E, ATM-4P, ATM-10P, TM-4E, TM-35E, TM- 4P, TM-10P, AD-TMP-L, AD-TMP-4E, AD-TMP-4P, D-TMP, D-TMP-4E, D-TMP-4P, A-DPH, A-9550, A- DPH-6E, A-DPH-12E, A-DPH-6EL, A-DPH-12EL, A-DPH-6P, M-DPH-6E, M-DPH-12E, M-DPH-6P, A-PG5027E, A-PG5054E, M-PG5027E, M-PG5054E (the above are manufactured by Shinnakamura Chemical Industry Co., Ltd.), Fancryl (registered trademark) FA-513AS, Fancryl FA-512AS, Fancryl FA-511AS (the above are manufactured by Hitachi Chemical Co., Ltd.) Manufacturing), New Frontier (registered trademark) HBPE-4, New Frontier HBPEM-10 (the above are manufactured by Daiichi Industrial Pharmaceutical Co., Ltd.), KAYARAD (registered trademark) PET-30, KAYARAD DPHA, KAYARAD DPEA-12 (the above are manufactured by Nippon Kayaku Co., Ltd.). The said (a1) component may be used individually by 1 type, or may mix and use 2 or more types.

[(a2)成分] (a2)成分之光自由基聚合起始劑只要為對用以形成本發明之壓印用複製模之A層之組合物之光硬化時所使用之光源具有吸收者,則並無特別限定。作為該(a2)成分之光自由基聚合起始劑,例如可列舉:過氧化異丁酸第三丁酯、2,5-二甲基-2,5-雙(苯甲醯基二氧基)己烷、1,4-雙[α-(第三丁基二氧基)-異丙氧基]苯、過氧化二-第三丁基、2,5-二甲基-2,5-雙(第三丁基二氧基)己烯過氧化氫、α-(異丙基苯基)-異丙基過氧化氫、第三丁基過氧化氫、1,1-雙(第三丁基二氧基)-3,3,5-三甲基環己烷、4,4-雙(第三丁基二氧基)戊酸丁酯、過氧化環己酮、2,2',5,5'-四(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三丁基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三戊基過氧基羰基)二苯甲酮、3,3',4,4'-四(第三己基過氧基羰基)二苯甲酮、3,3'-雙(第三丁基過氧基羰基)-4,4'-二羧基二苯甲酮、過氧化苯甲酸第三丁酯、二過氧化間苯二甲酸二-第三丁酯等有機過氧化物;9,10-蒽醌、1-氯蒽醌、2-氯蒽醌、八甲基蒽醌、1,2-苯并蒽醌等醌類;安息香甲基、安息香乙醚、α-甲基安息香、α-苯基安息香等安息香衍生物;2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-[4-{4-(2-羥基-2-甲基丙醯基)苄基}-苯基]-2-甲基丙烷-1-酮、苯基乙醛酸甲酯、2-甲基-1-[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-𠰌啉基苯基)-1-丁酮、2-二甲胺基-2-(4-甲基-苄基)-1-(4-𠰌啉-4-基-苯基)-丁烷-1-酮等苯烷酮系化合物;雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基-二苯基-氧化膦等醯基氧化膦系化合物;2-(O-苯甲醯基肟)-1-[4-(苯硫基)苯基]-1,2-辛二酮、1-(O-乙醯基肟)-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]乙酮等肟酯系化合物。[(a2) Ingredients] The photo-radical polymerization initiator of the component (a2) is not particularly limited as long as it absorbs the light source used in the light curing of the composition for forming the layer A of the imprint replica mold of the present invention. As the photoradical polymerization initiator of the component (a2), for example, t-butyl peroxyisobutyrate, 2,5-dimethyl-2,5-bis(benzyldioxy )Hexane, 1,4-bis[α-(tertiary butyldioxy)-isopropoxy]benzene, di-tertiary butyl peroxide, 2,5-dimethyl-2,5- Bis(tertiary butyldioxy)hexene hydroperoxide, α-(isopropylphenyl)-isopropyl hydroperoxide, tertiary butyl hydroperoxide, 1,1-bis(tertiary butyl) Dioxy)-3,3,5-trimethylcyclohexane, 4,4-bis(tert-butyldioxy)butyl valerate, cyclohexanone peroxide, 2,2',5 ,5'-Tetra(tert-butylperoxycarbonyl)benzophenone, 3,3',4,4'-Tetra(tert-butylperoxycarbonyl)benzophenone, 3,3' ,4,4'-Tetra (third pentylperoxycarbonyl) benzophenone, 3,3',4,4'-tetra(third hexylperoxycarbonyl) benzophenone, 3,3 '-Bis(tertiary butylperoxycarbonyl)-4,4'-dicarboxybenzophenone, tertiary butyl peroxybenzoate, di-tertiary butyl peroxyisophthalate, etc. Peroxide; 9,10-anthraquinone, 1-chloroanthraquinone, 2-chloroanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone and other quinones; benzoin methyl, benzoin ethyl ether, α- Benzoin derivatives such as methylbenzoin and α-phenylbenzoin; 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy- 2-Methyl-1-phenylpropane-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propane-1-one, 2-hydroxy-1-[4-{4-(2-hydroxy-2-methylpropionyl)benzyl}-phenyl]-2-methylpropane-1-one, methyl phenylglyoxylate , 2-Methyl-1-[4-(methylthio)phenyl]-2-𠰌line propane-1-one, 2-benzyl-2-dimethylamino-1-(4-𠰌line) Phenyl)-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-𠰌olin-4-yl-phenyl)-butane-1- Benzophenone compounds such as ketones; bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide, 2,4,6-trimethylbenzyl-diphenyl-phosphine oxide Isosinyl phosphine oxide compounds; 2-(O-benzyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyl oxime) Oxime)-1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]ethanone and other oxime ester compounds.

上述(a2)成分之光自由基聚合起始劑可作為市售品而獲得,作為其具體例,可列舉:IRGACURE(註冊商標)651、IRGACURE 184、IRGACURE 500、IRGACURE 2959、IRGACURE 127、IRGACURE 754、IRGACURE 907、IRGACURE 369、IRGACURE 379、IRGACURE 379EG、IRGACURE 819、IRGACURE 819DW、IRGACURE 1800、IRGACURE 1870、IRGACURE 784、IRGACURE OXE01、IRGACURE OXE02、IRGACURE 250、IRGACURE 1173、IRGACURE MBF、IRGACURE 4265、IRGACURE TPO(以上由BASF JAPAN(股)製造)、KAYACURE(註冊商標)DETX、KAYACURE MBP、KAYACURE DMBI、KAYACURE EPA、KAYACURE OA(以上由日本化藥(股)製造)、VICURE-10、VICURE-55(以上由STAUFFER Co. LTD製造)、ESACURE(註冊商標)KIP150、ESACURE TZT、ESACURE 1001、ESACURE KTO46、ESACURE KB1、ESACURE KL200、ESACURE KS300、ESACURE EB3、Triazine-PMS、Triazine A、Triazine B(以上由Nihon SiberHegner(股)製造)、Adeka Optomer N-1717、Adeka Optomer N-1414、Adeka Optomer N-1606(ADEKA(股)製造)。上述(a2)成分可單獨使用1種,或亦可混合2種以上使用。該(a2)成分之光自由基聚合起始劑之含有比率相對於上述(a1)成分100質量%為0.01質量%至0.3質量%。The photoradical polymerization initiator of the component (a2) can be obtained as a commercially available product. Specific examples thereof include: IRGACURE (registered trademark) 651, IRGACURE 184, IRGACURE 500, IRGACURE 2959, IRGACURE 127, and IRGACURE 754 , IRGACURE 907, IRGACURE 369, IRGACURE 379, IRGACURE 379EG, IRGACURE 819, IRGACURE 819DW, IRGACURE 1800, IRGACURE 1870, IRGACURE 784, IRGACURE OXE01, IRGACURE OXE02, IRGACURE 4 MBF, IRGACURE 1 MBF, IRGACURE 1 Manufactured by BASF JAPAN (Stock)), KAYACURE (registered trademark) DETX, KAYACURE MBP, KAYACURE DMBI, KAYACURE EPA, KAYACURE OA (the above are manufactured by Nippon Kayaku Co., Ltd.), VICURE-10, VICURE-55 (the above are by STAUFFER Co. LTD), ESACURE (registered trademark) KIP150, ESACURE TZT, ESACURE 1001, ESACURE KTO46, ESACURE KB1, ESACURE KL200, ESACURE KS300, ESACURE EB3, Triazine-PMS, Triazine A, Triazine B (the above are provided by Nihon SiberHegner (shares) ) Manufacturing), Adeka Optomer N-1717, Adeka Optomer N-1414, Adeka Optomer N-1606 (manufactured by ADEKA Co., Ltd.). The said (a2) component may be used individually by 1 type, or may mix and use 2 or more types. The content ratio of the radical photopolymerization initiator of the component (a2) is 0.01% by mass to 0.3% by mass relative to 100% by mass of the component (a1).

[(b1)成分] (b1)成分係於包含氟原子之線狀或鏈狀之分子鏈之所有末端具有自由基聚合性基之化合物。作為該自由基聚合性基,例如可列舉(甲基)丙烯醯氧基。[(b1) Ingredients] (b1) The component is a compound having radical polymerizable groups at all ends of a linear or chain molecular chain containing fluorine atoms. As this radically polymerizable group, (meth)acryloxy group is mentioned, for example.

作為上述(b1)成分之化合物,例如可列舉:(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3,3-五氟丙酯、(甲基)丙烯酸2-(全氟丁基)乙酯、(甲基)丙烯酸3-(全氟丁基)-2-羥基丙酯、(甲基)丙烯酸2-(全氟己基)乙酯、(甲基)丙烯酸3-全氟己基-2-羥基丙酯、(甲基)丙烯酸3-(全氟-3-甲基丁基)-2-羥基丙酯、(甲基)丙烯酸1H,1H,3H-四氟丙酯、(甲基)丙烯酸1H,1H,5H-八氟戊酯、(甲基)丙烯酸1H,1H,7H-十二氟庚酯、(甲基)丙烯酸1H-1-(三氟甲基)三氟乙酯、(甲基)丙烯酸1H,1H,3H-六氟丁酯、(甲基)丙烯酸1,2,2,2-四氟-1-(三氟甲基)乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、(甲基)丙烯酸2,2,3,3,4,4,4-七氟丁酯、(甲基)丙烯酸1H,1H-十五氟-正辛酯、丙烯酸1H,1H,2H,2H-十三氟辛酯、1,6-雙((甲基)丙烯醯氧基)-2,2,3,3,4,4,5,5-八氟己烷。Examples of the compound of the component (b1) include: 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3,3-pentafluoropropyl (meth)acrylate, ( 2-(perfluorobutyl)ethyl (meth)acrylate, 3-(perfluorobutyl)-2-hydroxypropyl (meth)acrylate, 2-(perfluorohexyl)ethyl (meth)acrylate, 3-perfluorohexyl-2-hydroxypropyl (meth)acrylate, 3-(perfluoro-3-methylbutyl)-2-hydroxypropyl (meth)acrylate, 1H, 1H (meth)acrylate ,3H-tetrafluoropropyl ester, (meth)acrylate 1H,1H,5H-octafluoropentyl ester, (meth)acrylate 1H,1H,7H-dodecafluoroheptyl ester, (meth)acrylate 1H-1- (Trifluoromethyl)trifluoroethyl, (meth)acrylate 1H,1H,3H-hexafluorobutyl, (meth)acrylate 1,2,2,2-tetrafluoro-1-(trifluoromethyl) ) Ethyl ester, 2,2,3,3-tetrafluoropropyl (meth)acrylate, 2,2,3,3,4,4,4-heptafluorobutyl (meth)acrylate, (meth) Acrylic acid 1H,1H-pentadecafluoro-n-octyl ester, acrylic acid 1H,1H,2H,2H-tridecafluorooctyl ester, 1,6-bis((meth)acryloyloxy)-2,2,3, 3,4,4,5,5-octafluorohexane.

上述化合物可作為市售品而獲得,作為其具體例,可列舉:丙烯酸2,2,2-三氟乙酯、甲基丙烯酸2,2,2-三氟乙酯、丙烯酸2,2,3,3,3-五氟丙酯、甲基丙烯酸2,2,3,3,3-五氟丙酯、丙烯酸2-(全氟丁基)乙酯、甲基丙烯酸2-(全氟丁基)乙酯、丙烯酸3-(全氟丁基)-2-羥基丙酯、甲基丙烯酸3-(全氟丁基)-2-羥基丙酯、丙烯酸2-(全氟己基)乙酯、甲基丙烯酸2-(全氟己基)乙酯、丙烯酸3-全氟己基-2-羥基丙酯、甲基丙烯酸3-全氟己基-2-羥基丙酯、丙烯酸3-(全氟-3-甲基丁基)-2-羥基丙酯、甲基丙烯酸3-(全氟-3-甲基丁基)-2-羥基丙酯、丙烯酸1H,1H,3H-四氟丙酯、甲基丙烯酸1H,1H,3H-四氟丙酯、丙烯酸1H,1H,5H-八氟戊酯、甲基丙烯酸1H,1H,5H-八氟戊酯、甲基丙烯酸1H,1H,7H-十二氟庚酯、丙烯酸1H,1H,7H-十二氟庚酯、丙烯酸1H-1-(三氟甲基)三氟乙酯、甲基丙烯酸1H-1-(三氟甲基)三氟乙酯、丙烯酸1H,1H,3H-六氟丁酯、甲基丙烯酸1H,1H,3H-六氟丁酯、丙烯酸1,2,2,2-四氟-1-(三氟甲基)乙酯、(以上由大金工業(股)製造)、丙烯酸2,2,3,3-四氟丙酯、甲基丙烯酸2,2,3,3-四氟丙酯、甲基丙烯酸2,2,3,3,4,4,4-七氟丁酯、丙烯酸1H,1H-十五氟-正辛酯、1,6-雙(丙烯醯氧基)-2,2,3,3,4,4,5,5-八氟己烷(以上由東京化成工業(股)製造)、LINC-151EPA、LINC-152EPA、LINC-102A、LINC-2A、LINC-5A、LINC-162A、LINC-3A(以上由共榮社化學(股)製造)、FLUOROLINK(註冊商標)MD500、FLUOROLINK MD700、FLUOROLINK MD40、FLUOROLINK MD1700、FOMBLIN(註冊商標)MT70(以上由Solvay公司製造)、Viscoat13F(大阪有機化學工業(股)製造)。The above-mentioned compounds are available as commercially available products, and specific examples thereof include: 2,2,2-trifluoroethyl acrylate, 2,2,2-trifluoroethyl methacrylate, 2,2,3 acrylate ,3,3-pentafluoropropyl, 2,2,3,3,3-pentafluoropropyl methacrylate, 2-(perfluorobutyl) ethyl acrylate, 2-(perfluorobutyl methacrylate) ) Ethyl acrylate, 3-(perfluorobutyl)-2-hydroxypropyl acrylate, 3-(perfluorobutyl)-2-hydroxypropyl methacrylate, 2-(perfluorohexyl) ethyl acrylate, methyl 2-(perfluorohexyl) ethyl acrylate, 3-perfluorohexyl-2-hydroxypropyl acrylate, 3-perfluorohexyl-2-hydroxypropyl methacrylate, 3-(perfluoro-3-methyl acrylate) Butyl)-2-hydroxypropyl, 3-(perfluoro-3-methylbutyl)-2-hydroxypropyl methacrylate, 1H, 1H, 3H-tetrafluoropropyl methacrylate, 1H methacrylate ,1H,3H-Tetrafluoropropyl, 1H,1H,5H-octafluoropentyl acrylate, 1H,1H,5H-octafluoropentyl methacrylate, 1H,1H,7H-dodecafluoroheptyl methacrylate , Acrylic acid 1H, 1H, 7H-dodecafluoroheptyl ester, acrylic acid 1H-1-(trifluoromethyl) trifluoroethyl, methacrylic acid 1H-1-(trifluoromethyl) trifluoroethyl, acrylic acid 1H ,1H,3H-hexafluorobutyl, 1H,1H,3H-hexafluorobutyl methacrylate, 1,2,2,2-tetrafluoro-1-(trifluoromethyl)ethyl acrylate, (above Daikin Industry Co., Ltd.), 2,2,3,3-tetrafluoropropyl acrylate, 2,2,3,3-tetrafluoropropyl methacrylate, 2,2,3,3 methacrylate, 4,4,4-Heptafluorobutyl, 1H,1H-pentadecafluoro-n-octyl acrylate, 1,6-bis(acryloyloxy)-2,2,3,3,4,4,5, 5-Octafluorohexane (the above are manufactured by Tokyo Chemical Industry Co., Ltd.), LINC-151EPA, LINC-152EPA, LINC-102A, LINC-2A, LINC-5A, LINC-162A, LINC-3A (the above are made by Kosei Soka Chemical Co., Ltd.), FLUOROLINK (registered trademark) MD500, FLUOROLINK MD700, FLUOROLINK MD40, FLUOROLINK MD1700, FOMBLIN (registered trademark) MT70 (manufactured by Solvay), Viscoat 13F (manufactured by Osaka Organic Chemical Industry Co., Ltd.).

上述(b1)成分可為於包含上述式(1)所表示之基及上述式(2a)或式(2b)所表示之基之線狀或鏈狀之分子鏈之所有末端經由胺基甲酸酯鍵具有上述式(3)所表示之基、即包含(甲基)丙烯醯氧基之聚合性基之多官能(甲基)丙烯酸酯化合物。此處,多官能(甲基)丙烯酸酯化合物係除單官能(甲基)丙烯酸酯化合物以外之2官能以上之丙烯酸酯化合物或甲基丙烯酸酯化合物。並且,所謂上述胺基甲酸酯鍵,係指-NH-C(=O)-O-所表示之結構。上述多官能(甲基)丙烯酸酯化合物於1分子中具有2個或4個胺基甲酸酯鍵、及2個或4個包含(甲基)丙烯醯氧基之聚合性基。再者,上述式(1)所表示之基有時被稱為聚(氧全氟伸烷基),上述式(2a)所表示之基有時被稱為聚(氧伸烷基)。The above-mentioned (b1) component may be a linear or chain-like molecular chain containing the group represented by the above formula (1) and the group represented by the above formula (2a) or formula (2b) through carbamic acid at all ends The ester bond has a group represented by the above formula (3), that is, a polyfunctional (meth)acrylate compound containing a polymerizable group of (meth)acryloxy groups. Here, the polyfunctional (meth)acrylate compound is an acrylate compound or methacrylate compound having two or more functions other than the monofunctional (meth)acrylate compound. In addition, the aforementioned urethane bond refers to a structure represented by -NH-C(=O)-O-. The said polyfunctional (meth)acrylate compound has 2 or 4 urethane bonds, and 2 or 4 polymerizable groups containing a (meth)acryloxy group in 1 molecule. In addition, the group represented by the above formula (1) is sometimes referred to as poly(oxyperfluoroalkylene), and the group represented by the above formula (2a) is sometimes referred to as poly(oxyalkylene).

上述線狀或鏈狀之分子鏈只要為包含上述式(1)所表示之基及上述式(2a)或式(2b)所表示之基之分子鏈,則並無特別限定。於上述線狀或鏈狀之分子鏈中,上述式(1)所表示之基與上述式(2a)或式(2b)所表示之基之鍵結順序並無特別限定,又,各基之數並無特別限定。又,於上述線狀或鏈狀之分子鏈中,式(1)所表示之基與式(2a)或式(2b)所表示之基可以單鍵進行鍵結(直接鍵結),亦可經由碳原子數1至3之伸烷基、碳原子數1至3之全氟伸烷基、或其等之組合等結構(連結基)而鍵結。The linear or chain-shaped molecular chain is not particularly limited as long as it includes the group represented by the formula (1) and the group represented by the formula (2a) or (2b). In the linear or chain-like molecular chain, the bonding sequence of the group represented by the above formula (1) and the group represented by the above formula (2a) or formula (2b) is not particularly limited, and the order of the groups The number is not particularly limited. In addition, in the linear or chain molecular chain, the group represented by formula (1) and the group represented by formula (2a) or formula (2b) may be bonded by a single bond (direct bonding), or It is bonded via a structure (linking group) such as an alkylene group having 1 to 3 carbon atoms, a perfluoroalkylene group having 1 to 3 carbon atoms, or a combination thereof.

上述式(1)所表示之基中之氧全氟伸烷基:-(O-R1 )-之R1 之碳原子數為1或2。即,上述式(1)所表示之基具有碳原子數1或2之2價之氟化碳基與氧原子交替連結而成之結構,氧全氟伸烷基具有碳原子數1或2之2價之氟化碳基與氧原子連結而成之結構。作為該氧全氟伸烷基,具體而言,可列舉-(OCF2 )-(即氧全氟亞甲基)及-(OCF2 CF2 )-(即氧全氟伸乙基)。上述氧全氟伸烷基可單獨使用-(OCF2 )-及-(OCF2 CF2 )-中之任1種,亦可組合2種使用。於組合2種使用之情形時,-(OCF2 )-及-(OCF2 CF2 )-之鍵結可為嵌段鍵結及無規鍵結之任一者。The oxygen perfluoroalkylene group in the group represented by the above formula (1): the number of carbon atoms of R 1 in -(OR 1 )- is 1 or 2. That is, the group represented by the above formula (1) has a structure in which a divalent carbon fluoride group with 1 or 2 carbon atoms is alternately connected with an oxygen atom, and an oxygen perfluoroalkylene group has a carbon atom number of 1 or 2 A structure formed by connecting a divalent fluorocarbon group and an oxygen atom. Specific examples of the oxyperfluoroalkylene group include -(OCF 2 )- (that is, oxyperfluoromethylene) and -(OCF 2 CF 2 )- (that is, oxyperfluoromethylene). The above-mentioned oxyperfluoroalkylene group may be used alone or in combination of two of -(OCF 2 )- and -(OCF 2 CF 2 )-. In the case of combining two kinds of use, the bonding of -(OCF 2 )- and -(OCF 2 CF 2 )- can be any of block bonding and random bonding.

就提高模具之脫模性之觀點而言,作為上述式(1)所表示之基,較佳為使用具有-(OCF2 )-(即氧全氟亞甲基)與-(OCF2 CF2 )-(即氧全氟伸乙基)之兩者之基。作為上述式(1)所表示之基,較佳為以按莫耳比率計成為[-(OCF2 )-]:[-(OCF2 CF2 )-]=2:1~1:2之比率包含-(OCF2 )-與-(OCF2 CF2 )-之基,更佳為以大致成為1:1之比率包含-(OCF2 )-與-(OCF2 CF2 )-之基。該等之鍵結可為嵌段鍵結及無規鍵結之任一者。上述式(1)所表示之基之重複數p為2以上之整數,較佳為5至30之範圍,更佳為7至21之範圍。From the viewpoint of improving the mold release properties, as the base represented by the above formula (1), it is preferable to use -(OCF 2 )- (ie, oxygen perfluoromethylene) and -(OCF 2 CF 2 )-(Ie, oxyperfluoroethylene group). The base represented by the above formula (1) is preferably [-(OCF 2 )-]: [-(OCF 2 CF 2 )-] = 2:1 to 1:2 in molar ratio The base containing -(OCF 2 )- and -(OCF 2 CF 2 )-, more preferably the base containing -(OCF 2 )- and -(OCF 2 CF 2 )- at a ratio of approximately 1:1. These bonds can be any of block bonds and random bonds. The repeating number p of the group represented by the above formula (1) is an integer of 2 or more, preferably in the range of 5 to 30, more preferably in the range of 7 to 21.

又,上述式(1)所表示之基之利用凝膠滲透層析法之以聚苯乙烯換算所測定之重量平均分子量(Mw)為1,000至5,000、較佳為1,500至3,000。 In addition, the weight average molecular weight (Mw) of the base represented by the above formula (1) measured in terms of polystyrene by gel permeation chromatography is 1,000 to 5,000, preferably 1,500 to 3,000.

上述式(2a)所表示之基中之氧伸烷基:-(O-R2 )-之R2 之碳原子數為2或3。即,上述式(2a)所表示之基具有碳原子數2或3之伸烷基與氧原子交替連結而成之結構,氧伸烷基具有碳原子數2或3之伸烷基與氧原子連結而成之結構。作為上述氧伸烷基,可列舉氧伸乙基、氧伸丙基、及氧三亞甲基。上述氧伸烷基可單獨使用1種,或亦可組合2種以上使用。於將該氧伸烷基組合2種以上使用之情形時,2種以上之氧伸烷基之鍵結可為嵌段鍵結及無規鍵結之任一者。The oxyalkylene group in the group represented by the above formula (2a): the number of carbon atoms of R 2 in -(OR 2 )- is 2 or 3. That is, the group represented by the above formula (2a) has a structure in which an alkylene group with 2 or 3 carbon atoms and an oxygen atom are alternately connected, and the oxyalkylene group has an alkylene group with 2 or 3 carbon atoms and an oxygen atom. Linked structure. Examples of the oxyethylene group include oxyethylene group, oxypropylene group, and oxytrimethylene group. The said oxyalkylene group may be used individually by 1 type, or may be used in combination of 2 or more types. When the oxyalkylene group is used in combination of two or more types, the bonding of the two or more oxyalkylene groups may be any of block bonding and random bonding.

上述式(2a)所表示之基例如為聚(氧伸乙基)。上述式(2a)所表示之基之重複數q為2以上之整數,例如為2至15之範圍,較佳為2至12之範圍、或5至12之範圍、或7至12之範圍。The group represented by the above formula (2a) is, for example, poly(oxyethylene). The repeating number q of the group represented by the above formula (2a) is an integer of 2 or more, for example, in the range of 2 to 15, preferably in the range of 2 to 12, or 5 to 12, or 7 to 12.

上述式(2b)所表示之基中之3價之烴基:R2b 之碳原子數為2或3。即,上述式(2b)所表示之基具有於碳原子數2或3之烷甲伸苯基(alkane tolylene)(自碳原子數2或3之伸烷基之任意之碳原子去除一個氫原子而成之3價之基)連結1個氧原子而成之結構。於上述式(2b)所表示之基之中,較佳為於1,2,3-丙三基之1位(或3位)連結1個氧原子而成之基。The trivalent hydrocarbon group among the groups represented by the above formula (2b): R 2b has 2 or 3 carbon atoms. That is, the group represented by the above formula (2b) has an alkane tolylene (alkane tolylene) with 2 or 3 carbon atoms (a hydrogen atom is removed from any carbon atom of an alkylene with 2 or 3 carbon atoms) The trivalent group formed) is a structure formed by connecting one oxygen atom. Among the groups represented by the above formula (2b), a group formed by connecting one oxygen atom to the 1-position (or 3-position) of the 1,2,3-propanetriyl group is preferred.

上述包含(甲基)丙烯醯氧基之聚合性基不限於具有1個(甲基)丙烯醯氧基者,亦可為具有2個以上者。作為上述包含(甲基)丙烯醯氧基之聚合性基,例如可列舉以下所示之式[X1]至式[X5]所表示之結構(末端基)、及將該等結構(末端基)中之丙烯醯氧基取代為甲基丙烯醯氧基而成之結構。The polymerizable group containing the (meth)acryloxy group is not limited to one having one (meth)acryloxy group, and may have two or more. As the polymerizable group containing the (meth)acryloyloxy group, for example, the structure (terminal group) represented by the formula [X1] to the formula [X5] shown below, and these structures (terminal group) The acryloxy group is substituted with methacryloxy group.

[化3]

Figure 02_image005
[化3]
Figure 02_image005

於上述(b1)成分為具有上述包含(甲基)丙烯醯氧基之聚合性基之多官能(甲基)丙烯酸酯化合物之情形時,就工業製造較容易之方面而言,可列舉以下所示之結構式(A-1)所表示之化合物、(A-2)所表示之化合物及(A-3)所表示之化合物、以及將該等化合物中之丙烯醯氧基取代為甲基丙烯醯氧基而成之化合物作為較佳之例。再者,於下述結構式中,2個X或4個X分別表示上述式[X1]至式[X5]所表示之結構(末端基)中之1個,PFPE表示聚(氧全氟伸烷基),q1 及q2 分別獨立地表示氧伸乙基之數、例如2至15之整數,較佳為表示2至12之整數,或表示5至12之整數,或表示7至12之整數。 [化4]

Figure 02_image007
When the (b1) component is a polyfunctional (meth)acrylate compound having a polymerizable group containing the (meth)acryloyloxy group, in terms of ease of industrial production, the following can be listed The compound represented by the structural formula (A-1), the compound represented by (A-2) and the compound represented by (A-3), and the propyleneoxy group in these compounds is substituted with methpropylene A compound composed of an oxo group is a preferred example. Furthermore, in the following structural formula, 2 Xs or 4 Xs respectively represent one of the structures (terminal groups) represented by the above formula [X1] to formula [X5], and PFPE represents poly(oxyperfluoroextension) Alkyl), q 1 and q 2 each independently represent the number of oxyethylene groups, such as an integer of 2 to 15, preferably an integer of 2 to 12, or an integer of 5 to 12, or 7 to 12 Of integers. [化4]
Figure 02_image007

於上述(b1)成分為具有上述包含(甲基)丙烯醯氧基之聚合性基之多官能(甲基)丙烯酸酯化合物之情形時,該包含(甲基)丙烯醯氧基之聚合性基較佳為具有2個以上之(甲基)丙烯醯氧基之例如上述式[X3]至式[X5]所表示之結構(末端基)。When the above-mentioned (b1) component is a polyfunctional (meth)acrylate compound having the above-mentioned (meth)acryloxy group-containing polymerizable group, the (meth)acryloxy group-containing polymerizable group It is preferably a structure (terminal group) represented by the above-mentioned formula [X3] to formula [X5] having two or more (meth)acryloxy groups.

上述(b1)成分可單獨使用1種,或亦可混合2種以上使用。該(b1)成分較理想為以相對於該(b1)成分、與下述之(b2)成分、(b3)成分及作為任意成分之其他添加劑之總質量100質量%,較佳為0.1質量%至10質量%、更佳為0.5質量%至8質量%之比率使用。The said (b1) component may be used individually by 1 type, or may mix and use 2 or more types. The (b1) component is preferably 100% by mass relative to the total mass of the (b1) component, the following (b2) component, (b3) component, and other additives as optional components, preferably 0.1% by mass It is used at a rate of up to 10% by mass, more preferably 0.5% by mass to 8% by mass.

上述(b1)成分例如藉由如下方法獲得:於經由直接鍵結於或經由上述連結基而鍵結於上述式(1)所表示之基之兩末端之上述式(2a)或式(2b)所表示之基具有至少2個羥基之化合物中,使該至少2個羥基與異氰酸2-(甲基)丙烯醯氧基乙酯、異氰酸1,1-雙((甲基)丙烯醯氧基甲基)乙酯等具有(甲基)丙烯醯氧基之異氰酸酯化合物進行胺基甲酸酯化反應。The above-mentioned (b1) component is obtained, for example, by the following method: the above-mentioned formula (2a) or formula (2b) which is directly bonded to or bonded to both ends of the group represented by the above-mentioned formula (1) via the above-mentioned linking group In a compound with at least 2 hydroxyl groups, the at least 2 hydroxyl groups are combined with 2-(meth)acryloyloxyethyl isocyanate, 1,1-bis((meth)propylene isocyanate An isocyanate compound having a (meth)acryloxy group such as oxymethyl) ethyl ester undergoes a urethane reaction.

上述(b1)成分之利用凝膠滲透層析法之以聚苯乙烯換算所測定之重量平均分子量(Mw)為1,500至7,000、較佳為2,000至6,000。The weight average molecular weight (Mw) of the component (b1) measured by gel permeation chromatography in terms of polystyrene is 1,500 to 7,000, preferably 2,000 to 6,000.

用以形成本發明之壓印用複製模之B層之組合物除了上述(b1)成分以外,亦可包含僅於包含上述式(1)所表示之基及上述式(2a)或式(2b)所表示之基之線狀或鏈狀之分子鏈之一部分之末端經由胺基甲酸酯鍵具有包含(甲基)丙烯醯氧基之聚合性基,且於該線狀或鏈狀之分子鏈之其他末端具有羥基之化合物(即,於該其他末端不具有聚合性基之化合物)。用以形成上述B層之組合物可進而包含於包含上述式(1)所表示之基及上述式(2a)或式(2b)所表示之基之線狀或鏈狀之分子鏈之所有末端具有羥基之化合物、即不具有上述聚合性基之化合物。用以形成上述B層之組合物有時稱為脫模劑。The composition used to form the layer B of the imprinting replica mold of the present invention may contain only the base represented by the above formula (1) and the above formula (2a) or formula (2b) in addition to the above (b1) component. A part of the linear or chain-shaped molecular chain of the group represented by) has a polymerizable group containing (meth)acryloyloxy through a urethane bond, and the linear or chain-shaped molecule A compound having a hydroxyl group at the other end of the chain (ie, a compound having no polymerizable group at the other end). The composition for forming the above-mentioned layer B may be further included at all ends of the linear or chain-like molecular chain including the base represented by the above formula (1) and the base represented by the above formula (2a) or formula (2b) A compound having a hydroxyl group, that is, a compound that does not have the above-mentioned polymerizable group. The composition used to form the above-mentioned layer B is sometimes called a release agent.

[(b2)成分] (b2)成分之光自由基聚合起始劑只要為對用以形成本發明之壓印用複製模之B層之組合物之光硬化時所使用之光源具有吸收者,則並無特別限定。作為該(b2)成分,可列舉與上述(a2)成分同樣之光自由基聚合起始劑。上述(b2)成分可單獨使用1種,或亦可混合2種以上使用。該(b2)成分之光自由基聚合起始劑之含有比率相對於上述(b1)成分100質量%為0.05質量%至15質量%。[(b2) Ingredient] The photo-radical polymerization initiator of the component (b2) is not particularly limited as long as it absorbs the light source used in the light curing of the composition for forming the layer B of the imprint replica mold of the present invention. As this (b2) component, the same photoradical polymerization initiator as the said (a2) component is mentioned. The said (b2) component may be used individually by 1 type, or may mix and use 2 or more types. The content of the radical photopolymerization initiator of the component (b2) is 0.05 to 15% by mass relative to 100% by mass of the component (b1).

[(b3)成分] 作為(b3)成分之溶劑只要為可發揮上述(b1)成分及(b2)成分之黏度調節之作用,調節該(b1)成分及(b2)成分之黏度者,則並無特別限定。該(b3)成分係於形成上述B層之步驟中去除。[(b3) Ingredients] The solvent as the component (b3) is not particularly limited as long as it exerts the effect of adjusting the viscosity of the component (b1) and (b2), and adjusts the viscosity of the component (b1) and (b2). The (b3) component is removed in the step of forming the B layer.

作為該溶劑,例如可列舉:甲苯、對二甲苯、鄰二甲苯、苯乙烯、乙二醇二甲醚、丙二醇單甲醚、乙二醇單甲醚、丙二醇單乙醚、乙二醇單乙醚、乙二醇單異丙醚、乙二醇甲醚乙酸酯、丙二醇單甲醚乙酸酯、乙二醇乙醚乙酸酯、二乙二醇二甲醚、丙二醇單丁醚、乙二醇單丁醚、二乙二醇二乙醚、二丙二醇單甲醚、二乙二醇單甲醚、二丙二醇單乙醚、二乙二醇單乙醚、三乙二醇二甲醚、二乙二醇單乙醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、二丙酮醇、糠醇、四氫糠醇、丙二醇、苄醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基正丁基酮、環己酮、2-庚酮、乙酸乙酯、乙酸異丙酯、乙酸正丙酯、乙酸異丁酯、乙酸正丁酯、乳酸乙酯、丙酮酸乙酯、甲醇、乙醇、異丙醇、第三丁醇、烯丙醇、正丙醇、2-甲基-2-丁醇、異丁醇、正丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、三亞甲基二醇、1-甲氧基-2-丁醇、異丙醚、1,4-二㗁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-咪唑啶酮、二甲基亞碸、N-環己基-2-吡咯啶、甲基全氟丙醚、甲基九氟丁醚、甲基九氟異丁醚、乙基九氟丁醚、乙基九氟異丁醚、1,1,1,2,2,3,4,5,5,5-十氟-3-甲氧基-4-(三氟甲基)-戊烷、1,1,2,2-四氟乙基-2,2,2-三氟乙醚、1,1,1,2,3,4,4,5,5,5-十氟戊烷、五氟壬烷、六氟苯、十七氟-正辛基溴、1,1,1,3,3,3-六氟-2-甲氧基丙烷、十八氟辛烷、八氟環戊烯、全氟三丁基胺、全氟十氫萘、全氟己烷、全氟甲基環己烷、全氟庚烷、八氟甲苯、全氟三戊基胺、全氟三乙基胺、全氟(1,3-二甲基環己烷)、全氟異己烷。As the solvent, for example, toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, Ethylene glycol monoisopropyl ether, ethylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl ether, ethylene glycol mono Butyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether Acetate, diethylene glycol, 1-octanol, ethylene glycol, hexanediol, diacetone alcohol, furfuryl alcohol, tetrahydrofurfuryl alcohol, propylene glycol, benzyl alcohol, 1,3-butanediol, 1,4-butane Glycol, 2,3-butanediol, γ-butyrolactone, acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl ketone, methyl n-butyl ketone , Cyclohexanone, 2-heptanone, ethyl acetate, isopropyl acetate, n-propyl acetate, isobutyl acetate, n-butyl acetate, ethyl lactate, ethyl pyruvate, methanol, ethanol, isopropanol , Tertiary butanol, allyl alcohol, n-propanol, 2-methyl-2-butanol, isobutanol, n-butanol, 2-methyl-1-butanol, 1-pentanol, 2-methyl 1-pentanol, 2-ethylhexanol, trimethylene glycol, 1-methoxy-2-butanol, isopropyl ether, 1,4-dioxane, N,N-dimethyl Methamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfene, N-cyclohexyl -2-pyrrolidine, methyl perfluoropropyl ether, methyl nonafluorobutyl ether, methyl nonafluoroisobutyl ether, ethyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, 1,1,1,2 ,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, 1,1,2,2-tetrafluoroethyl-2,2 ,2-Trifluoroethyl ether, 1,1,1,2,3,4,4,5,5,5-decafluoropentane, pentafluorononane, hexafluorobenzene, heptafluoro-n-octyl bromide, 1,1,1,3,3,3-hexafluoro-2-methoxypropane, octafluorooctane, octafluorocyclopentene, perfluorotributylamine, perfluorodecalin, perfluorohexane Alkane, perfluoromethylcyclohexane, perfluoroheptane, octafluorotoluene, perfluorotripentylamine, perfluorotriethylamine, perfluoro(1,3-dimethylcyclohexane), perfluoro Isohexane.

作為上述(b3)成分之溶劑可作為市售品而獲得,作為其具體例,可列舉:Novec(註冊商標)7000、Novec 7100、Novec 7200、Novec 7300(以上由3M JAPAN(股)製造)、Asahiklin(註冊商標)AE-3000、Asahiklin AE-3100E(以上由AGC(股)製造)、Vertrel(註冊商標)XF、Vertrel XF-UP、Vertrel XE-XP、Vertrel X-E10、Vertrel X-P10、Vertrel X-D、Vertrel X-GY、Vertrel MCA、Vertrel SDG、Vertrel SMT、Vertrel SFR、Vertrel DC、Vertrel Sinera、Vertrel Suprion、Vertrel Sion(以上由Dupont-Mitsui Fluorochemicals(股)製造)。上述(b3)成分可單獨使用1種,或亦可混合2種以上使用。The solvent as the above-mentioned (b3) component can be obtained as a commercially available product. Specific examples thereof include: Novec (registered trademark) 7000, Novec 7100, Novec 7200, Novec 7300 (the above are manufactured by 3M JAPAN (stock)), Asahiklin (registered trademark) AE-3000, Asahiklin AE-3100E (the above are manufactured by AGC (stock)), Vertrel (registered trademark) XF, Vertrel XF-UP, Vertrel XE-XP, Vertrel X-E10, Vertrel X-P10, Vertrel XD, Vertrel X-GY, Vertrel MCA, Vertrel SDG, Vertrel SMT, Vertrel SFR, Vertrel DC, Vertrel Sinera, Vertrel Suprion, Vertrel Sion (the above are manufactured by Dupont-Mitsui Fluorochemicals (stock)). The said (b3) component may be used individually by 1 type, or may mix and use 2 or more types.

[其他添加劑] 用以形成本發明之壓印用複製模之A層之組合物視需要可含有溶劑。又,用以形成上述A層之組合物及用以形成上述B層之組合物可於無損本發明之效果之範圍內視需要含有界面活性劑、鏈轉移劑、及光增感劑。[Other additives] The composition used to form the A layer of the replica mold for imprint of the present invention may contain a solvent if necessary. In addition, the composition for forming the A layer and the composition for forming the B layer may optionally contain a surfactant, a chain transfer agent, and a photosensitizer within a range that does not impair the effects of the present invention.

作為該溶劑,例如可列舉:甲苯、對二甲苯、鄰二甲苯、苯乙烯、乙二醇二甲醚、丙二醇單甲醚、乙二醇單甲醚、丙二醇單乙醚、乙二醇單乙醚、乙二醇單異丙醚、乙二醇甲醚乙酸酯、丙二醇單甲醚乙酸酯、乙二醇乙醚乙酸酯、二乙二醇二甲醚、丙二醇單丁醚、乙二醇單丁醚、二乙二醇二乙醚、二丙二醇單甲醚、二乙二醇單甲醚、二丙二醇單乙醚、二乙二醇單乙醚、三乙二醇二甲醚、二乙二醇單乙醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、二丙酮醇、糠醇、四氫糠醇、丙二醇、苄醇、1,3-丁二醇、1,4-丁二醇、2,3-丁二醇、γ-丁內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基正丁基酮、環己酮、2-庚酮、乙酸乙酯、乙酸異丙酯、乙酸正丙酯、乙酸異丁酯、乙酸正丁酯、乳酸乙酯、丙酮酸乙酯、甲醇、乙醇、異丙醇、第三丁醇、烯丙醇、正丙醇、2-甲基-2-丁醇、異丁醇、正丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、三亞甲基二醇、1-甲氧基-2-丁醇、異丙醚、1,4-二㗁烷、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-咪唑啶酮、二甲基亞碸、N-環己基-2-吡咯啶、甲基全氟丙醚、甲基九氟丁醚、甲基九氟異丁醚、乙基九氟丁醚、乙基九氟異丁醚、1,1,1,2,2,3,4,5,5,5-十氟-3-甲氧基-4-(三氟甲基)-戊烷、1,1,2,2-四氟乙基-2,2,2-三氟乙醚、1,1,1,2,3,4,4,5,5,5-十氟戊烷、五氟壬烷、六氟苯、十七氟-正辛基溴、1,1,1,3,3,3-六氟-2-甲氧基丙烷、十八氟辛烷、八氟環戊烯、全氟三丁基胺、全氟十氫萘、全氟己烷、全氟甲基環己烷、全氟庚烷、八氟甲苯、全氟三戊基胺、全氟三乙基胺、全氟(1,3-二甲基環己烷)、全氟異己烷。上述溶劑可單獨使用1種,或亦可混合2種以上使用。As the solvent, for example, toluene, p-xylene, o-xylene, styrene, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, Ethylene glycol monoisopropyl ether, ethylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol dimethyl ether, propylene glycol monobutyl ether, ethylene glycol mono Butyl ether, diethylene glycol diethyl ether, dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol dimethyl ether, diethylene glycol monoethyl ether Acetate, diethylene glycol, 1-octanol, ethylene glycol, hexanediol, diacetone alcohol, furfuryl alcohol, tetrahydrofurfuryl alcohol, propylene glycol, benzyl alcohol, 1,3-butanediol, 1,4-butane Glycol, 2,3-butanediol, γ-butyrolactone, acetone, methyl ethyl ketone, methyl isopropyl ketone, diethyl ketone, methyl isobutyl ketone, methyl n-butyl ketone , Cyclohexanone, 2-heptanone, ethyl acetate, isopropyl acetate, n-propyl acetate, isobutyl acetate, n-butyl acetate, ethyl lactate, ethyl pyruvate, methanol, ethanol, isopropanol , Tertiary butanol, allyl alcohol, n-propanol, 2-methyl-2-butanol, isobutanol, n-butanol, 2-methyl-1-butanol, 1-pentanol, 2-methyl 1-pentanol, 2-ethylhexanol, trimethylene glycol, 1-methoxy-2-butanol, isopropyl ether, 1,4-dioxane, N,N-dimethyl Methamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfene, N-cyclohexyl -2-pyrrolidine, methyl perfluoropropyl ether, methyl nonafluorobutyl ether, methyl nonafluoroisobutyl ether, ethyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, 1,1,1,2 ,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, 1,1,2,2-tetrafluoroethyl-2,2 ,2-Trifluoroethyl ether, 1,1,1,2,3,4,4,5,5,5-decafluoropentane, pentafluorononane, hexafluorobenzene, heptafluoro-n-octyl bromide, 1,1,1,3,3,3-hexafluoro-2-methoxypropane, octafluorooctane, octafluorocyclopentene, perfluorotributylamine, perfluorodecalin, perfluorohexane Alkane, perfluoromethylcyclohexane, perfluoroheptane, octafluorotoluene, perfluorotripentylamine, perfluorotriethylamine, perfluoro(1,3-dimethylcyclohexane), perfluoro Isohexane. These solvents may be used individually by 1 type, or may mix and use 2 or more types.

作為上述界面活性劑,例如可列舉:聚氧乙烯月桂醚、聚氧乙烯硬脂醚、聚氧乙烯鯨蠟醚、聚氧乙烯油醚等聚氧乙烯烷基醚類、聚氧乙烯辛基苯醚、聚氧乙烯壬基苯醚等聚氧乙烯烷基芳基醚類、聚氧乙烯・聚氧丙烯嵌段共聚物類、山梨醇酐單月桂酸酯、山梨醇酐單棕櫚酸酯、山梨醇酐單硬脂酸酯、山梨醇酐單油酸酯、山梨醇酐三油酸酯、山梨醇酐三硬脂酸酯等山梨醇酐脂肪酸酯類、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單棕櫚酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐三油酸酯、聚氧乙烯山梨醇酐三硬脂酸酯等聚氧乙烯山梨醇酐脂肪酸酯類等非離子系界面活性劑。上述界面活性劑可作為市售品而獲得,作為其具體例,可列舉:Eftop(註冊商標)EF301、Eftop EF303、Eftop EF352(以上由Mitsubishi Materials Electronic Chemicals(股)製造)、Megafac(註冊商標)F-171、Megafac F-173、Megafac F-477、Megafac F-486、Megafac F-554、Megafac F-556、Megafac R-08、Megafac R-30、Megafac R-30N、Megafac R-40、Megafac R-40-LM、Megafac RS-56、Megafac RS-75、Megafac RS-72-K、Megafac RS-76-E、Megafac RS-76-NS、Megafac RS-78、Megafac RS-90(以上由DIC(股)製造)、Fluorad FC430、Fluorad FC431(以上由3M JAPAN(股)製造)、AsahiGuard(註冊商標)AG710、Surflon(註冊商標)S-382、Surflon SC101、Surflon SC102、Surflon SC103、Surflon SC104、Surflon SC105、Surflon SC106(以上由AGC(股)製造)等氟系界面活性劑;及有機矽氧烷聚合物KP341(信越化學工業(股)製造)、BYK-302、BYK-307、BYK-322、BYK-323、BYK-330、BYK-333、BYK-370、BYK-375、BYK-378、BYK-UV 3500、BYK-UV 3570(以上由BYK-Chemie JAPAN(股)製造)。上述界面活性劑可單獨使用1種,或亦可混合2種以上使用。於用以形成上述A層之組合物及用以形成上述B層之組合物含有上述界面活性劑之情形時,其含有比率較佳為相對於(a1)成分100質量%為0.01質量%至10質量%。Examples of the above-mentioned surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether, and polyoxyethylene octylbenzene. Ethers, polyoxyethylene alkyl aryl ethers such as polyoxyethylene nonylphenyl ether, polyoxyethylene/polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan Alcohol monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate and other sorbitan fatty acid esters, polyoxyethylene sorbitan monolaurate , Polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate and other polyoxyethylene Nonionic surfactants such as sorbitan fatty acid esters. The above-mentioned surfactants are available as commercially available products, and specific examples thereof include: Eftop (registered trademark) EF301, Eftop EF303, Eftop EF352 (the above are manufactured by Mitsubishi Materials Electronic Chemicals (stock)), Megafac (registered trademark) F-171, Megafac F-173, Megafac F-477, Megafac F-486, Megafac F-554, Megafac F-556, Megafac R-08, Megafac R-30, Megafac R-30N, Megafac R-40, Megafac R-40-LM, Megafac RS-56, Megafac RS-75, Megafac RS-72-K, Megafac RS-76-E, Megafac RS-76-NS, Megafac RS-78, Megafac RS-90 (Above by DIC (Stock) Manufacturing), Fluorad FC430, Fluorad FC431 (the above are manufactured by 3M JAPAN (Stock)), AsahiGuard (registered trademark) AG710, Surflon (registered trademark) S-382, Surflon SC101, Surflon SC102, Surflon SC103, Surflon SC104, Fluorine-based surfactants such as Surflon SC105 and Surflon SC106 (manufactured by AGC Co., Ltd.); and organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-302, BYK-307, BYK-322 , BYK-323, BYK-330, BYK-333, BYK-370, BYK-375, BYK-378, BYK-UV 3500, BYK-UV 3570 (the above are manufactured by BYK-Chemie JAPAN (stock)). These surfactants may be used alone or in combination of two or more kinds. When the composition for forming the layer A and the composition for forming the layer B contain the surfactant, the content ratio is preferably 0.01 mass% to 10% relative to 100% by mass of the component (a1) quality%.

作為上述鏈轉移劑,例如作為硫醇化合物,可列舉:巰基乙酸甲酯、3-巰基丙酸甲酯、3-巰基丙酸2-乙基己酯、3-巰基丙酸3-甲氧基丁酯、3-巰基丙酸正辛酯、3-巰基丙酸硬脂酯、1,4-雙(3-巰基丙醯氧基)丁烷、1,4-雙(3-巰基丁醯氧基)丁烷、三羥甲基乙烷三(3-巰基丙酸酯)、三羥甲基乙烷三(3-巰基丁酸酯)、三羥甲基丙烷三(3-巰基丙酸酯)、三羥甲基丙烷三(3-巰基丁酸酯)、季戊四醇四(3-巰基丙酸酯)、季戊四醇四(3-巰基丁酸酯)、二季戊四醇六(3-巰基丙酸酯)、二季戊四醇六(3-巰基丁酸酯)、四乙二醇雙(3-巰基丙酸酯)、異氰尿酸三[2-(3-巰基丙醯氧基)乙基]酯、異氰尿酸三[2-(3-巰基丁醯氧基)乙基]酯、1,3,5-三(3-巰基丁醯氧基乙基)-1,3,5-三𠯤-2,4,6-(1H,3H,5H)-三酮等巰基羧酸酯類;乙硫醇、2-甲基丙烷-2-硫醇、1-十二烷硫醇、2,3,3,4,4,5-六甲基己烷-2-硫醇(第三-十二烷硫醇)、乙烷-1,2-二硫醇、丙烷-1,3-二硫醇、苄基硫醇等烷基硫醇類;苯硫醇、3-甲基苯硫醇、4-甲基苯硫醇、萘-2-硫醇、吡啶-2-硫醇、苯并咪唑-2-硫醇、苯并噻唑-2-硫醇等芳香族硫醇類;2-巰基乙醇、4-巰基-1-丁醇等巰基醇類;3-(三甲氧基矽烷基)丙烷-1-硫醇、3-(三乙氧基矽烷基)丙烷-1-硫醇等含有矽烷之硫醇類;雙(2-巰基乙基)醚;作為二硫醚化合物,可列舉:二乙基二硫醚、二丙基二硫醚、二異丙基二硫醚、二丁基二硫醚、二-第三丁基二硫醚、二戊基二硫醚、二異戊基二硫醚、二己基二硫醚、二環己基二硫醚、二癸基二硫醚、雙(2,3,3,4,4,5-六甲基己烷-2-基)二硫醚(二-第三-十二烷基二硫醚)、雙(2,2-二乙氧基乙基)二硫醚、雙(2-羥基乙基)二硫醚、二苄基二硫醚等烷基二硫醚類;二苯基二硫醚、二-對甲苯基二硫醚、二(吡啶-2-基)吡啶基二硫醚、二(苯并咪唑-2-基)二硫醚、二(苯并噻唑-2-基)二硫醚等芳香族二硫醚類;四甲基秋蘭姆二硫醚、四乙基秋蘭姆二硫醚、四丁基秋蘭姆二硫醚、雙(五亞甲基)秋蘭姆二硫醚等秋蘭姆二硫醚類;α-甲基苯乙烯二聚物。該鏈轉移劑可單獨使用1種,可組合2種以上使用。於用以形成上述A層之組合物及用以形成上述B層之組合物含有上述鏈轉移劑之情形時,其含有比率較佳為相對於(a1)成分100質量%為0.01質量%至20質量%。As the chain transfer agent, for example, the thiol compound includes methyl thioglycolate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, and 3-methoxy 3-mercaptopropionate. Butyl ester, n-octyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, 1,4-bis(3-mercaptopropionoxy) butane, 1,4-bis(3-mercaptobutyroxy) Yl)butane, trimethylolethane tris(3-mercaptopropionate), trimethylolethane tris(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopropionate) ), trimethylolpropane tris(3-mercaptobutyrate), pentaerythritol tetra(3-mercaptopropionate), pentaerythritol tetra(3-mercaptobutyrate), dipentaerythritol hexa(3-mercaptopropionate) , Dipentaerythritol hexa(3-mercaptobutyrate), tetraethylene glycol bis(3-mercaptopropionate), tris[2-(3-mercaptopropoxy)ethyl]isocyanurate, isocyanurate Tris[2-(3-mercaptobutanoyloxy)ethyl] urate, 1,3,5-tris(3-mercaptobutanoyloxyethyl)-1,3,5-tris𠯤-2,4 ,6-(1H,3H,5H)-triketone and other mercapto carboxylic acid esters; ethyl mercaptan, 2-methylpropane-2-mercaptan, 1-dodecyl mercaptan, 2,3,3,4 ,4,5-hexamethylhexane-2-thiol (third-dodecyl mercaptan), ethane-1,2-dithiol, propane-1,3-dithiol, benzyl sulfide Alkyl mercaptans such as alcohols; benzene mercaptan, 3-methylbenzene mercaptan, 4-methylbenzene mercaptan, naphthalene-2-mercaptan, pyridine-2-mercaptan, benzimidazole-2-mercaptan , Benzothiazole-2-thiol and other aromatic mercaptans; 2-mercaptoethanol, 4-mercapto-1-butanol and other mercapto alcohols; 3-(trimethoxysilyl)propane-1-thiol, Silane-containing mercaptans such as 3-(triethoxysilyl)propane-1-thiol; bis(2-mercaptoethyl)ether; as the disulfide compound, diethyl disulfide, Dipropyl disulfide, diisopropyl disulfide, dibutyl disulfide, di-tertiary butyl disulfide, dipentyl disulfide, diisopentyl disulfide, dihexyl disulfide Sulfide, dicyclohexyl disulfide, didecyl disulfide, bis(2,3,3,4,4,5-hexamethylhexane-2-yl) disulfide (di-third- Dodecyl disulfide), bis(2,2-diethoxyethyl) disulfide, bis(2-hydroxyethyl) disulfide, dibenzyl disulfide and other alkyl disulfides Class; diphenyl disulfide, two-p-tolyl disulfide, two (pyridin-2-yl) pyridyl disulfide, two (benzimidazol-2-yl) disulfide, two (benzo Thiazol-2-yl) disulfide and other aromatic disulfides; tetramethylthiuram disulfide, tetraethylthiuram disulfide, tetrabutylthiuram disulfide, bis(five Methylene) thiuram disulfide and other thiuram disulfides; α-methylstyrene dimer. This chain transfer agent can be used individually by 1 type, and can be used in combination of 2 or more types. When the composition for forming the layer A and the composition for forming the layer B contain the chain transfer agent, the content ratio is preferably 0.01% by mass to 20% relative to 100% by mass of the component (a1) quality%.

作為上述光增感劑,例如可列舉:硫𠮿

Figure 108144521-A0304-12-01
系、9-氧硫𠮿
Figure 108144521-A0304-12-01
系、𠮿
Figure 108144521-A0304-12-01
系、酮系、噻喃鎓鹽系、基礎苯乙烯基(base styryl)系、部花青系、3-取代香豆素系、3,4-取代香豆素系、花青系、吖啶系、噻𠯤系、啡噻𠯤系、蒽系、蔻系、苯并蒽系、苝系、酮基香豆素系、香豆素系、硼酸酯系。該光增感劑可作為市售品而獲得,作為其具體例,可列舉:ANTHRACURE(註冊商標)UVS-581、ANTHRACURE UVS-1331(以上由川崎化成工業(股)製造)、KAYACURE(註冊商標)DETX-S(日本化藥(股)製造)。該光增感劑可單獨使用1種,可組合2種以上使用。藉由使用上述光增感劑,亦可調整UV區域之吸收波長。於用以形成上述A層之組合物及用以形成上述B層之組合物含有上述光增感劑之情形時,其含有比率相對於上述(a1)成分或上述(b1)成分100質量%,例如為0.01質量%至10質量%,較佳為0.05質量%至5質量%。As the above photosensitizer, for example, sulfur 𠮿
Figure 108144521-A0304-12-01
Department, 9-oxysulfur𠮿
Figure 108144521-A0304-12-01
Department, 𠮿
Figure 108144521-A0304-12-01
Series, ketone series, thiopyrylium salt series, base styryl series, merocyanine series, 3-substituted coumarin series, 3,4-substituted coumarin series, cyanine series, acridine Series, thiophene series, phenanthrene series, anthracene series, coronene series, benzanthracene series, perylene series, ketocoumarin series, coumarin series, borate series. The photosensitizer is available as a commercially available product, and specific examples thereof include: ANTHRACURE (registered trademark) UVS-581, ANTHRACURE UVS-1331 (manufactured by Kawasaki Chemical Industry Co., Ltd.), KAYACURE (registered trademark) ) DETX-S (manufactured by Nippon Kayaku Co., Ltd.). This photosensitizer can be used individually by 1 type, and can be used in combination of 2 or more types. By using the aforementioned photosensitizer, the absorption wavelength in the UV region can also be adjusted. When the composition for forming the layer A and the composition for forming the layer B contain the photosensitizer, the content ratio is relative to 100% by mass of the component (a1) or the component (b1), For example, it is 0.01% by mass to 10% by mass, preferably 0.05% by mass to 5% by mass.

[壓印用複製模材料之製備] 用以形成本發明之壓印用複製模之A層之組合物及用以形成B層之組合物之製備方法並無特別限定。於用以形成上述A層之組合物之情形時,只要例如將上述(a1)成分、上述(a2)成分、及視需要之其他添加劑進行混合,使組合物成為均勻之狀態即可。又,於用以形成上述B層之組合物之情形時,只要例如將(b1)成分、(b2)成分、(b3)成分、及視需要之其他添加劑進行混合,使組合物成為均勻之狀態即可。並且,將用以形成上述A層之組合物及用以形成上述B層之組合物之各成分進行混合之順序只要可獲得均勻之組合物則並無問題,並無特別限定。[Preparation of copy mold material for imprinting] The preparation method of the composition for forming the A layer of the imprint replica mold of the present invention and the composition for forming the B layer is not particularly limited. In the case of the composition for forming the layer A, for example, the component (a1), the component (a2), and other additives as necessary are mixed to make the composition uniform. In addition, in the case of forming the composition of the above-mentioned B layer, for example, only the (b1) component, (b2) component, (b3) component, and other additives as necessary are mixed to make the composition uniform OK. In addition, the order of mixing the components of the composition for forming the A layer and the composition for forming the B layer is not a problem as long as a uniform composition can be obtained, and is not particularly limited.

本發明之壓印用複製模可藉由利用光壓印形成上述A層後,利用光硬化於該A層上形成上述B層而獲得。The replica mold for imprinting of the present invention can be obtained by forming the A layer by light imprinting, and then forming the B layer on the A layer by light curing.

本發明之壓印用複製模之A層可藉由將包含上述(a1)成分及(a2)成分之組合物塗佈於基材上或主模上,將該基材與該主模貼合使之光硬化且進行脫模而獲得所需之結構體。作為包含上述(a1)成分及(a2)成分之組合物之塗佈方法,可列舉公知或周知之方法、例如灌注法、旋轉塗佈法、浸漬法、流塗法、噴墨法、噴霧法、棒式塗佈法、凹版塗佈法、狹縫式塗佈法、輥式塗佈法、轉印印刷法、毛刷塗佈、刮刀塗佈法、氣刀塗佈法。The layer A of the replica mold for imprinting of the present invention can be applied to a substrate or a master mold by applying a composition containing the above-mentioned (a1) component and (a2) component to the master mold. Light harden and demold to obtain the desired structure. As the coating method of the composition containing the above-mentioned (a1) component and (a2) component, known or well-known methods such as pouring method, spin coating method, dipping method, flow coating method, inkjet method, spray method can be cited , Bar coating method, gravure coating method, slit coating method, roll coating method, transfer printing method, brush coating, knife coating method, air knife coating method.

作為形成本發明之壓印用複製模之A層之基材,例如可列舉包含矽、將銦錫氧化物(ITO)製膜而成之玻璃(ITO基板)、將氮化矽(SiN)製膜而成之玻璃(SiN基板)、將銦鋅氧化物(IZO)製膜而成之玻璃、聚對苯二甲酸乙二酯(PET)、三乙醯基纖維素(TAC)、丙烯酸系樹脂、塑膠、玻璃、石英、陶瓷等之基材。又,亦可使用具有可撓性之可撓性基材、例如包含三乙醯基纖維素、聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、環烯烴(共)聚合物、聚乙烯醇、聚碳酸酯、聚苯乙烯、聚醯亞胺、聚醯胺、聚烯烴、聚丙烯、聚乙烯、聚萘二甲酸乙二酯、聚醚碸、及組合有該等聚合物之共聚物之基材。As the substrate for forming the A layer of the imprinting replica mold of the present invention, for example, glass (ITO substrate) containing silicon, indium tin oxide (ITO) formed into a film, and silicon nitride (SiN) made Film made of glass (SiN substrate), glass made of indium zinc oxide (IZO) film, polyethylene terephthalate (PET), triacetyl cellulose (TAC), acrylic resin , Plastic, glass, quartz, ceramics, etc. In addition, flexible substrates with flexibility, such as triacetyl cellulose, polyethylene terephthalate, polymethyl methacrylate, cycloolefin (co)polymer, poly Vinyl alcohol, polycarbonate, polystyrene, polyimide, polyamide, polyolefin, polypropylene, polyethylene, polyethylene naphthalate, polyether turpentine, and copolymers combining these polymers The base material of things.

作為為了形成本發明之壓印用複製模之A層而進行光硬化之光源,並無特別限定,例如可列舉:高壓水銀燈、低壓水銀燈、無電極燈、金屬鹵化物燈、KrF準分子雷射、ArF準分子雷射、F2 準分子雷射、電子束(EB)、遠紫外線(EUV)、紫外線LED(UV-LED)。又,關於上述光源之波長,通常可使用436 nm之G射線、405 nm之H射線、365 nm之I射線、或GHI混合射線。進而,曝光量較佳為30 mJ/cm2 至10000 mJ/cm2 、更佳為100 mJ/cm2 至8000 mJ/cm2The light source for photocuring to form the A layer of the imprinting replica mold of the present invention is not particularly limited. Examples include high-pressure mercury lamps, low-pressure mercury lamps, electrodeless lamps, metal halide lamps, and KrF excimer lasers. , ArF excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), ultraviolet LED (UV-LED). In addition, with regard to the wavelength of the above-mentioned light source, G-rays of 436 nm, H-rays of 405 nm, I-rays of 365 nm, or GHI mixed rays can usually be used. Furthermore, the exposure amount is preferably 30 mJ/cm 2 to 10000 mJ/cm 2 , more preferably 100 mJ/cm 2 to 8000 mJ/cm 2 .

再者,於用以形成上述A層之組合物含有溶劑之情形時,可以使溶劑蒸發之目的對光照射前之塗膜及光照射後所得之光硬化物之至少一者追加烘烤步驟。作為用於烘烤步驟之設備,並無特別限定,例如只要為可使用加熱板、烘箱、爐,於適當之環境下、即大氣、氮氣等惰性氣體、或真空中進行烘烤者即可。烘烤溫度只要可達成使溶劑蒸發之目的,則並無特別限定,例如可於40℃至200℃下進行。Furthermore, when the composition for forming the A layer contains a solvent, at least one of the coating film before light irradiation and the photocured product obtained after light irradiation can be added with a baking step for the purpose of evaporating the solvent. The equipment used in the baking step is not particularly limited. For example, it may be capable of using a hot plate, oven, or furnace, and baking in an appropriate environment, that is, air, inert gas such as nitrogen, or vacuum. The baking temperature is not particularly limited as long as it can achieve the purpose of evaporating the solvent. For example, it can be performed at 40°C to 200°C.

進行光壓印之裝置只要可獲得目標之圖案,則並無特別限定,例如可使用藉由東芝機械(股)製造之ST50、Obducat公司製造之Sindre(註冊商標)60、明昌機工(股)製造之NM-0801HB等市售之裝置將基材與主模進行壓接且光硬化後,使硬化物自該主模脫模之方法。The device for light imprinting is not particularly limited as long as the target pattern can be obtained. For example, ST50 manufactured by Toshiba Machine Co., Ltd., Sindre (registered trademark) 60 manufactured by Obducat Co., Ltd., and Mingchang Machinery Co., Ltd. can be used. NM-0801HB and other commercially available devices are a method of crimping the base material and the master mold and curing the hardened product from the master mold.

又,作為本發明中使用之光壓印所使用之主模之材料,例如可列舉:石英、矽(Si)、鎳、氧化鋁(Al2 O3 )、羰基矽烷、玻璃碳,只要可獲得目標之圖案,則並無特別限定。又,為了提高脫模性,可對主模進行於其表面形成氟系化合物等之薄膜之脫模處理。作為用於脫模處理之脫模劑,例如可列舉大金工業(股)製造之OPTOOL(註冊商標)HD、OPTOOL DSX,只要可獲得目標之圖案,則並無特別限定。In addition, as the material of the master mold used for photoimprinting used in the present invention, for example, quartz, silicon (Si), nickel, alumina (Al 2 O 3 ), carbonyl silane, glassy carbon, as long as available The pattern of the target is not particularly limited. In addition, in order to improve the mold releasability, the master mold may be subjected to a mold release treatment to form a thin film of a fluorine-based compound or the like on its surface. As the mold release agent used for the mold release treatment, for example, OPTOOL (registered trademark) HD and OPTOOL DSX manufactured by Daikin Industry Co., Ltd. are listed, and there is no particular limitation as long as the target pattern can be obtained.

本發明之壓印用複製模之A層藉由自上述主模脫模後進行加熱,可提高紫外線區域之透明性。上述A層之加熱方法可列舉使用加熱板、烘箱等加熱機構之方法。The A layer of the copy mold for imprinting of the present invention is heated after being released from the master mold, so that the transparency in the ultraviolet region can be improved. The heating method of the A layer may be a method using a heating mechanism such as a hot plate and an oven.

本發明之壓印用複製模之B層可藉由將包含上述(b1)成分、(b2)成分及(b3)成分之組合物塗佈於上述A層上且進行光硬化而獲得所需之覆膜。作為包含上述(b1)成分、(b2)成分及(b3)成分之組合物之塗佈方法,可列舉公知或周知之方法、例如灌注法、旋轉塗佈法、浸漬法、流塗法、噴墨法、噴霧法、棒式塗佈法、凹版塗佈法、狹縫式塗佈法、輥式塗佈法、轉印印刷法、毛刷塗佈、刮刀塗佈法、氣刀塗佈法。The layer B of the replica mold for imprinting of the present invention can be obtained by applying a composition containing the above-mentioned (b1) component, (b2) component and (b3) component on the above-mentioned layer A and photocuring. Laminated. As the coating method of the composition containing the above-mentioned (b1) component, (b2) component and (b3) component, known or well-known methods such as pouring method, spin coating method, dipping method, flow coating method, spray Ink method, spray method, bar coating method, gravure coating method, slit coating method, roll coating method, transfer printing method, brush coating, knife coating method, air knife coating method .

作為為了形成本發明之壓印用複製模之B層而進行光硬化之光源,並無特別限定,例如可列舉:高壓水銀燈、低壓水銀燈、無電極燈、金屬鹵化物燈、KrF準分子雷射、ArF準分子雷射、F2 準分子雷射、電子束(EB)、遠紫外線(EUV)、紫外線LED(UV-LED)。又,關於上述光源之波長,通常可使用436 nm之G射線、405 nm之H射線、365 nm之I射線、或GHI混合射線。進而,曝光量較佳為30 mJ/cm2 至2000 mJ/cm2 、更佳為30 mJ/cm2 至1000 mJ/cm2The light source for photocuring to form the B layer of the imprinting replica mold of the present invention is not particularly limited. Examples include high-pressure mercury lamps, low-pressure mercury lamps, electrodeless lamps, metal halide lamps, and KrF excimer lasers. , ArF excimer laser, F 2 excimer laser, electron beam (EB), extreme ultraviolet (EUV), ultraviolet LED (UV-LED). In addition, with regard to the wavelength of the above-mentioned light source, G-rays of 436 nm, H-rays of 405 nm, I-rays of 365 nm, or GHI mixed rays can usually be used. Furthermore, the exposure amount is preferably 30 mJ/cm 2 to 2000 mJ/cm 2 , more preferably 30 mJ/cm 2 to 1000 mJ/cm 2 .

於形成本發明之壓印用複製模之B層之步驟中,可以使作為(b3)成分之溶劑蒸發之目的於用以形成上述B層之組合物之塗佈後、光硬化前或光硬化後追加烘烤步驟。作為用於該烘烤步驟之設備,並無特別限定,例如只要為可使用加熱板、烘箱、或爐,於適當之環境下、即大氣、氮氣等惰性氣體、或真空中進行烘烤者即可。關於上述烘烤步驟中之烘烤溫度,可於能夠使溶劑蒸發之例如40℃至200℃下進行。In the step of forming the B layer of the imprinting replica mold of the present invention, the solvent as the component (b3) can be evaporated for the purpose of coating, before photocuring, or photocuring of the composition for forming the B layer Add baking step later. The equipment used in this baking step is not particularly limited. For example, as long as it can be baked in a suitable environment, that is, in the atmosphere, inert gas such as nitrogen, or in a vacuum, a hot plate, oven, or furnace can be used. can. Regarding the baking temperature in the above baking step, it can be carried out at a temperature of 40°C to 200°C that can evaporate the solvent.

藉由本發明所得之壓印用複製模之圖案尺寸並無特別限定,亦可以例如奈米級、微米級、毫米級獲得良好之圖案。 [實施例]The pattern size of the imprint replica mold obtained by the present invention is not particularly limited, and good patterns can be obtained, for example, at the nanometer, micrometer, and millimeter levels. [Example]

以下,列舉實施例及比較例,對本發明進行進而詳細之說明,但本發明不限定於下述實施例。再者,下述合成例中所得之化合物之物性之分析中使用之裝置及條件如下所述。Hereinafter, examples and comparative examples are given to further describe the present invention in detail, but the present invention is not limited to the following examples. In addition, the equipment and conditions used in the analysis of the physical properties of the compounds obtained in the following synthesis examples are as follows.

(1)凝膠滲透層析法(GPC) 裝置:島津製作所(股)製造之GPC系統 GPC管柱:Shodex(註冊商標)GPC KF-804L及GPC KF-803L 管柱溫度:40℃ 溶劑:四氫呋喃 流量:1 mL/min 標準試樣:聚苯乙烯(1) Gel permeation chromatography (GPC) Device: GPC system manufactured by Shimadzu Corporation GPC column: Shodex (registered trademark) GPC KF-804L and GPC KF-803L Column temperature: 40℃ Solvent: Tetrahydrofuran Flow rate: 1 mL/min Standard sample: polystyrene

又,下述簡略符號表示以下含義。 PFPE1:經由聚(氧伸乙基)(重複單元之數8至9)於兩末端具有羥基之全氟聚醚[Solvay Specialty Polymers公司製造,Fluorolink(註冊商標)5147X] PFPE2:於兩末端分別經由上述式(2b)所表示之基各具有2個羥基之全氟聚醚[Solvay Specialty Polymers公司製造,Fomblin(註冊商標)T4] BEI:異氰酸1,1-雙(丙烯醯氧基甲基)乙酯[昭和電工(股)製造,Karenz(註冊商標)BEI] DBTDL:二月桂酸二丁基錫[東京化成工業(股)製造] DOTDD:二新癸酸二辛基錫[日東化成(股)製造,Neostan(註冊商標)U-830] AIBN:偶氮雙異丁腈 MEK:甲基乙基酮 MIBK:甲基異丁基酮 PGME:丙二醇單甲醚 PGMEA:丙二醇單甲醚乙酸酯In addition, the following abbreviated symbols indicate the following meanings. PFPE1: Perfluoropolyether with hydroxyl groups at both ends via poly(oxyethylene) (number of repeating units 8-9) [manufactured by Solvay Specialty Polymers, Fluorolink (registered trademark) 5147X] PFPE2: A perfluoropolyether having 2 hydroxyl groups at each end via the group represented by the above formula (2b) [manufactured by Solvay Specialty Polymers, Fomblin (registered trademark) T4] BEI: 1,1-bis(acryloxymethyl)ethyl isocyanate [manufactured by Showa Denko Corporation, Karenz (registered trademark) BEI] DBTDL: Dibutyltin dilaurate [manufactured by Tokyo Chemical Industry Co., Ltd.] DOTDD: Dioctyltin dineodecanoate [manufactured by Nitto Kasei Co., Ltd., Neostan (registered trademark) U-830] AIBN: Azobisisobutyronitrile MEK: Methyl ethyl ketone MIBK: Methyl isobutyl ketone PGME: Propylene glycol monomethyl ether PGMEA: Propylene glycol monomethyl ether acetate

<合成例1> 向2 L之四口燒瓶中加入PGMEA 178.84 g,於氮氣環境下、內溫80℃下進行攪拌。歷時2小時向其中滴加混合有甲基丙烯酸甲酯(東京化成工業(股)製造)120 g、丙烯酸異𦯉酯(東京化成工業(股)製造)249.66 g、AIBN(關東化學(股)製造)5.904 g、及PGMEA 697.48 g之溶液,滴加後反應17小時。將反應溶液滴加至甲醇(純正化學(股)製造)6.3 kg中,於133.3 Pa之減壓下、80℃下對所析出之聚合物進行乾燥,獲得非交聯性之共聚物MI55 330.4 g。利用GPC測定所得之MI55之重量平均分子量,結果以標準聚苯乙烯換算計為20,100。<Synthesis example 1> PGMEA 178.84 g was added to a 2 L four-necked flask, and stirred at an internal temperature of 80°C under a nitrogen atmosphere. Methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) 120 g, isopropyl acrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) 249.66 g, and AIBN (manufactured by Kanto Chemical Co., Ltd.) were added dropwise over 2 hours. ) A solution of 5.904 g and 697.48 g of PGMEA was added dropwise and reacted for 17 hours. The reaction solution was dropped into 6.3 kg of methanol (manufactured by Junsei Chemical Co., Ltd.), and the precipitated polymer was dried under a reduced pressure of 133.3 Pa at 80°C to obtain a non-crosslinkable copolymer MI55 330.4 g . The weight average molecular weight of MI55 measured by GPC was 20,100 in terms of standard polystyrene.

<合成例2> 向茄形燒瓶中加入PFPE1 10.5 g(5 mmol)、BEI 2.39 g(10.0 mmol)、DBTDL 0.129 g及MEK 12.9 g。使用攪拌子(stirrer chip),將上述茄形燒瓶內之混合物於室溫(大致23℃)下攪拌24小時,獲得反應物。向該反應物中加入PGMEA 30.37 g,利用蒸發器將MEK蒸餾去除,以固形物成分30質量%獲得包含作為(b1)成分之SM1之PGMEA溶液。所得之SM1之利用GPC之以聚苯乙烯換算所測定之重量平均分子量Mw為3,400,分散度:Mw(重量平均分子量)/Mn(數量平均分子量)為1.1。<Synthesis example 2> Add 10.5 g (5 mmol) of PFPE1, 2.39 g (10.0 mmol) of BEI, 0.129 g of DBTDL and 12.9 g of MEK to the eggplant-shaped flask. Using a stirrer chip, the mixture in the eggplant-shaped flask was stirred at room temperature (approximately 23° C.) for 24 hours to obtain a reactant. 30.37 g of PGMEA was added to the reactant, MEK was distilled off using an evaporator, and a PGMEA solution containing SM1 as a component (b1) was obtained at a solid content of 30% by mass. The weight average molecular weight Mw of the obtained SM1 measured by GPC in terms of polystyrene was 3,400, and the degree of dispersion: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.

<合成例3> 向茄形燒瓶中加入PFPE1 10.5 g(5 mmol)、BEI 2.39 g(10.0 mmol)、DOTDD 0.0644 g及PGMEA 12.9 g。使用攪拌子,將上述茄形燒瓶內之混合物於室溫(大致23℃)下攪拌48小時,獲得反應物。向該反應物中加入PGMEA 38.9 g,以固形物成分20質量%獲得包含作為(b1)成分之SM2之PGMEA溶液。所得之SM2之利用GPC之以聚苯乙烯換算所測定之重量平均分子量Mw為3,410,分散度:Mw(重量平均分子量)/Mn(數量平均分子量)為1.1。<Synthesis example 3> Into the eggplant-shaped flask were added PFPE1 10.5 g (5 mmol), BEI 2.39 g (10.0 mmol), DOTDD 0.0644 g, and PGMEA 12.9 g. Using a stir bar, the mixture in the eggplant-shaped flask was stirred at room temperature (approximately 23° C.) for 48 hours to obtain a reactant. 38.9 g of PGMEA was added to the reactant, and a PGMEA solution containing SM2 as a component (b1) was obtained at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM2 measured by GPC in terms of polystyrene was 3,410, and the dispersion degree: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.

<合成例4> 向茄形燒瓶中加入PFPE2 11.45 g(5 mmol)、BEI 4.79 g(20.0 mmol)、DOTDD 0.162 g及MEK 16.24 g。於氮氣環境下,使用攪拌子,將上述茄形燒瓶內之混合物於室溫(大致23℃)下攪拌72小時,獲得反應物。向該反應物中加入PGMEA 64.96 g,利用蒸發器將MEK蒸餾去除,以固形物成分20質量%獲得包含作為(b1)成分之SM3之PGMEA溶液。所得之SM3之利用GPC之以聚苯乙烯換算所測定之重量平均分子量Mw為2,750,分散度:Mw(重量平均分子量)/Mn(數量平均分子量)為1.1。<Synthesis example 4> 11.45 g (5 mmol) of PFPE2, 4.79 g (20.0 mmol) of BEI, 0.162 g of DOTDD, and 16.24 g of MEK were added to the eggplant-shaped flask. Under a nitrogen atmosphere, using a stir bar, the mixture in the eggplant-shaped flask was stirred at room temperature (approximately 23° C.) for 72 hours to obtain a reactant. 64.96 g of PGMEA was added to the reactant, MEK was distilled off using an evaporator, and a PGMEA solution containing SM3 as a component (b1) was obtained at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM3 measured in terms of polystyrene by GPC was 2,750, and the dispersion degree: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.

<合成例5> 向茄形燒瓶中加入PFPE2 11.45 g(5 mmol)、BEI 4.79 g(20.0 mmol)、DOTDD 0.162 g及PGMEA 16.24 g。於氮氣環境下,使用攪拌子,將上述茄形燒瓶內之混合物於室溫(大致23℃)下攪拌72小時,獲得反應物。向該反應物中加入PGMEA 48.72 g,以固形物成分20質量%獲得包含作為(b1)成分之SM4之PGMEA溶液。所得之SM4之利用GPC之以聚苯乙烯換算所測定之重量平均分子量Mw為2,760,分散度:Mw(重量平均分子量)/Mn(數量平均分子量)為1.1。<Synthesis example 5> Into the eggplant-shaped flask were added 11.45 g (5 mmol) of PFPE2, 4.79 g (20.0 mmol) of BEI, 0.162 g of DOTDD, and 16.24 g of PGMEA. Under a nitrogen atmosphere, using a stir bar, the mixture in the eggplant-shaped flask was stirred at room temperature (approximately 23° C.) for 72 hours to obtain a reactant. 48.72 g of PGMEA was added to the reactant to obtain a PGMEA solution containing SM4 as a component (b1) at a solid content of 20% by mass. The weight average molecular weight Mw of the obtained SM4 measured by GPC in terms of polystyrene was 2,760, and the dispersion degree: Mw (weight average molecular weight)/Mn (number average molecular weight) was 1.1.

[用以形成A層之組合物之製備] <製備例1> 添加New Frontier(註冊商標)HBPE-4(第一工業製藥(股)製造)(以下,於本說明書中簡稱為「HBPE-4」)7 g、KAYARAD(註冊商標)PET-30(日本化藥(股)製造)(以下,於本說明書中簡稱為「PET-30」)3 g、及IRGACURE(註冊商標)184(BASF JAPAN(股)製造)(以下,於本說明書中簡稱為「IRGACURE 184」)0.01 g(相對於HBPE-4、PET-30之總質量為0.1質量%),製備組合物A1。[Preparation of composition for forming A layer] <Preparation Example 1> Added New Frontier (registered trademark) HBPE-4 (manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.) (hereinafter, referred to as "HBPE-4" in this manual) 7 g, KAYARAD (registered trademark) PET-30 (Nippon Kayaku (Stock) Manufacturing) (hereinafter referred to as "PET-30" in this manual) 3 g, and IRGACURE (registered trademark) 184 (made by BASF JAPAN (stock)) (hereinafter, referred to as "IRGACURE 184" in this manual ") 0.01 g (0.1% by mass relative to the total mass of HBPE-4 and PET-30) to prepare composition A1.

<製備例2> 添加HBPE-4 9 g、合成例1中獲得之MI55 1 g、及IRGACURE 184 0.01 g(相對於HBPE-4、MI55之總質量為0.1質量%),製備組合物A2。<Preparation Example 2> 9 g of HBPE-4, 1 g of MI55 obtained in Synthesis Example 1, and 0.01 g of IRGACURE 184 (0.1% by mass relative to the total mass of HBPE-4 and MI55) were added to prepare composition A2.

<製備例3> 添加HBPE-4 9.5 g、合成例1中獲得之MI55 0.5 g、及IRGACURE 184 0.01 g(相對於HBPE-4、MI55之總質量為0.1質量%),製備組合物A3。<Preparation Example 3> 9.5 g of HBPE-4, 0.5 g of MI55 obtained in Synthesis Example 1, and 0.01 g of IRGACURE 184 (0.1% by mass relative to the total mass of HBPE-4 and MI55) were added to prepare composition A3.

<製備例4> 添加HBPE-4 9.75 g、合成例1中獲得之MI55 0.25 g、及IRGACURE 184 0.01 g(相對於HBPE-4、MI55之總質量為0.1質量%),製備組合物A4。<Preparation Example 4> 9.75 g of HBPE-4, 0.25 g of MI55 obtained in Synthesis Example 1, and 0.01 g of IRGACURE 184 (0.1% by mass relative to the total mass of HBPE-4 and MI55) were added to prepare composition A4.

<製備例5> 添加HBPE-4 5 g、NK ESTER A-DOG(以下,於本說明書中簡稱為「A-DOG」)(新中村化學工業(股)製造)5 g、及IRGACURE 184 0.01 g(相對於HBPE-4、A-DOG之總質量為0.1質量%),製備組合物A5。<Preparation Example 5> Added HBPE-4 5 g, NK ESTER A-DOG (hereinafter, referred to as "A-DOG" in this manual) (manufactured by Shinnakamura Chemical Co., Ltd.) 5 g, and IRGACURE 184 0.01 g (relative to HBPE- 4. The total mass of A-DOG is 0.1% by mass) to prepare composition A5.

<製備例6> 添加PET-30 7 g、NK ESTER A-200(新中村化學工業(股)製造)1.5 g、A-DOG 1.5 g、及IRGACURE 184 0.01 g(相對於PET-30、A-200、A-DOG之總質量為0.1質量%),製備組合物A6。<Preparation Example 6> Added PET-30 7 g, NK ESTER A-200 (manufactured by Shinnakamura Chemical Industry Co., Ltd.) 1.5 g, A-DOG 1.5 g, and IRGACURE 184 0.01 g (relative to PET-30, A-200, A-DOG The total mass is 0.1% by mass) to prepare composition A6.

<製備例7> 添加HBPE-4 5 g、NK ESTER A-DCP(以下,於本說明書中簡稱為「A-DCP」)(新中村化學工業(股)製造)5 g、及IRGACURE 184 0.01 g(相對於HBPE-4、A-DCP之總質量為0.1質量%),製備組合物A7。<Preparation Example 7> Add HBPE-4 5 g, NK ESTER A-DCP (hereinafter, referred to as "A-DCP" in this manual) (manufactured by Shinnakamura Chemical Co., Ltd.) 5 g, and IRGACURE 184 0.01 g (relative to HBPE- 4. The total mass of A-DCP is 0.1% by mass) to prepare composition A7.

<製備例8> 添加A-DCP 5 g、1-ADMA(大阪有機化學工業(股)製造)5 g、及IRGACURE 184 0.01 g(相對於A-DCP、1-ADMA之總質量為0.1質量%),製備組合物A8。<Preparation Example 8> A-DCP 5 g, 1-ADMA (manufactured by Osaka Organic Chemical Industry Co., Ltd.) 5 g, and IRGACURE 184 0.01 g (0.1% by mass relative to the total mass of A-DCP and 1-ADMA) were added to prepare a composition A8.

<製備例9> 添加A-DCP 5 g、1-ADMA(大阪有機化學工業(股)製造)5 g、及IRGACURE 184 0.5 g(相對於A-DCP、1-ADMA之總質量為5質量%),製備組合物A9。<Preparation Example 9> A-DCP 5 g, 1-ADMA (manufactured by Osaka Organic Chemical Industry Co., Ltd.) 5 g, and IRGACURE 184 0.5 g (5% by mass relative to the total mass of A-DCP and 1-ADMA) were added to prepare a composition A9.

[用以形成B層之組合物(脫模劑)之製備] <製備例10> 混合LINC-5A(共榮社化學(股)製造)0.285 g、丙烯酸2,2,2-三氟乙酯(大金工業(股)製造)0.015 g、IRGACURE(註冊商標)819(BASF JAPAN(股)製造,雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦)(以下,於本說明書中簡稱為「IRGACURE 819」)0.006 g、及PGMEA 8.44 g,製備組合物(脫模劑)B1。[Preparation of the composition (release agent) used to form layer B] <Preparation Example 10> Mixed LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.) 0.285 g, 2,2,2-trifluoroethyl acrylate (manufactured by Daikin Industry Co., Ltd.) 0.015 g, IRGACURE (registered trademark) 819 (BASF JAPAN ( Stock), bis(2,4,6-trimethylbenzyl)-phenylphosphine oxide) (hereinafter, referred to as "IRGACURE 819" in this manual) 0.006 g, and PGMEA 8.44 g, preparation combination物 (release agent) B1.

<製備例11> 混合LINC-162A(共榮社化學(股)製造)0.3 g、IRGACURE 819 0.006 g、及PGMEA 8.44 g,製備組合物(脫模劑)B2。<Preparation Example 11> 0.3 g of LINC-162A (manufactured by Kyoeisha Chemical Co., Ltd.), IRGACURE 819 0.006 g, and PGMEA 8.44 g were mixed to prepare composition (release agent) B2.

<製備例12> 混合LINC-102A(共榮社化學(股)製造)0.3 g、IRGACURE 819 0.006 g、及PGMEA 8.44 g,製備組合物(脫模劑)B3。<Preparation Example 12> 0.3 g of LINC-102A (manufactured by Kyoeisha Chemical Co., Ltd.), IRGACURE 819 0.006 g, and PGMEA 8.44 g were mixed to prepare composition (release agent) B3.

<製備例13> 混合LINC-5A(共榮社化學(股)製造)0.3 g、IRGACURE 819 0.006 g、及PGMEA 8.44 g,製備組合物(脫模劑)B4。<Preparation Example 13> 0.3 g of LINC-5A (manufactured by Kyoeisha Chemical Co., Ltd.), IRGACURE 819 0.006 g, and PGMEA 8.44 g were mixed to prepare a composition (release agent) B4.

<製備例14> 混合DAC-HP(大金工業(股)製造)1.0 g、IRGACURE 819 0.004 g、及PGMEA 4.82 g,製備組合物(脫模劑)B5。<Preparation Example 14> 1.0 g of DAC-HP (manufactured by Daikin Industry Co., Ltd.), IRGACURE 819 0.004 g, and PGMEA 4.82 g were mixed to prepare a composition (release agent) B5.

<製備例15> 混合合成例2中所得之包含SM1之PGMEA溶液1.00 g、IRGACURE(註冊商標)127(BASF JAPAN(股)製造,2-羥基-1-[4-{4-(2-羥基-2-甲基丙醯基)苄基}-苯基]-2-甲基丙烷-1-酮)0.0060 g、及作為(C)成分之PGMEA 7.67 g,製備組合物(脫模劑)B6。<Preparation Example 15> Mix the PGMEA solution containing SM1 obtained in Synthesis Example 2 with 1.00 g, IRGACURE (registered trademark) 127 (manufactured by BASF JAPAN Co., Ltd., 2-hydroxy-1-[4-{4-(2-hydroxy-2-methyl) Propyl)benzyl}-phenyl]-2-methylpropan-1-one) 0.0060 g, and 7.67 g of PGMEA as the component (C) to prepare composition (release agent) B6.

<製備例16> 混合合成例3中所得之包含SM2之PGMEA溶液1.00 g、IRGACURE 819 0.0040 g、KAYACURE(註冊商標)DETX-S(日本化藥(股)製造)(以下,於本說明書中簡稱為「DETX-S」)0.0002 g及PGMEA 4.80 g,製備組合物(脫模劑)B7。<Preparation Example 16> Mixing the PGMEA solution containing SM2 obtained in Synthesis Example 3 1.00 g, IRGACURE 819 0.0040 g, KAYACURE (registered trademark) DETX-S (manufactured by Nippon Kayaku Co., Ltd.) (hereinafter, referred to as "DETX-S" in this manual) ") 0.0002 g and PGMEA 4.80 g to prepare composition (release agent) B7.

<製備例17> 混合合成例4中所得之包含SM3之PGMEA溶液1.00 g、IRGACURE 819 0.0040 g、DETX-S 0.0002 g及PGMEA 4.83 g,製備組合物(脫模劑)B8。<Preparation Example 17> The PGMEA solution containing SM3 1.00 g, IRGACURE 819 0.0040 g, DETX-S 0.0002 g and PGMEA 4.83 g obtained in Synthesis Example 4 were mixed to prepare composition (release agent) B8.

<製備例18> 混合合成例5中所得之包含SM4之PGMEA溶液1.00 g、IRGACURE 819 0.0040 g、DETX-S 0.0002 g及PGMEA 4.83 g,製備組合物(脫模劑)B9。<Preparation Example 18> The PGMEA solution containing SM4, 1.00 g, IRGACURE 819 0.0040 g, DETX-S 0.0002 g, and PGMEA 4.83 g obtained in Synthesis Example 5 were mixed to prepare composition (release agent) B9.

[壓印用複製模之製作] <實施例1> 將製備例1中所得之組合物A1灌注至預先使用NOVEC(註冊商標)1720(3M JAPAN(股)製造)(以下,於本說明書中簡稱為「NOVEC1720」)進行過脫模處理之鎳製模具(配置縱3行×橫5行之15個2 mm徑×300 μm深之凹透鏡型)中,於其上載置石英玻璃基板,使用奈米壓印裝置NM-0801HB(明昌機工(股)製造)進行光壓印。光壓印係於始終23℃之條件下,以如下之順序進行:a)歷時10秒鐘加壓至500 N、b)使用高壓水銀燈進行5000 mJ/cm2 之曝光、c)歷時10秒鐘進行泄壓、d)將鎳製模具與石英玻璃基板分離而進行脫模,於該石英玻璃基板上獲得2 mm徑×300 μm高之凸透鏡圖案。利用150℃之加熱板,對該石英玻璃基板上所得之凸透鏡圖案加熱5分鐘,形成A層。所使用之上述石英玻璃基板係藉由預先旋轉塗佈KBM-5103(信越化學工業(股)製造)且利用150℃之加熱板加熱5分鐘而進行過密接處理者。利用旋轉塗佈機,將製備例10中所得之組合物(脫模劑)B1製膜於所得之A層上,使用加熱板,於80℃下烘烤5分鐘。其後,於氮氣環境下,使用批次式UV照射裝置(高壓水銀燈2 kW×1燈)(EYE GRAPHICS(股)製造),通過透過i射線之濾光片,以40 mW/cm2 進行125秒鐘之UV曝光,於上述A層上形成B層,製作壓印用複製模RM-1。[Preparation of a replica mold for imprinting] <Example 1> The composition A1 obtained in Preparation Example 1 was poured in advance using NOVEC (registered trademark) 1720 (manufactured by 3M JAPAN (stock)) (hereinafter referred to as abbreviated in this manual) It is "NOVEC1720") in a nickel mold (with 3 rows of vertical × 5 rows of horizontal, 15 concave lenses of 2 mm diameter × 300 μm depth), on which a quartz glass substrate is placed, using nano Imprinting device NM-0801HB (manufactured by Mingchang Machinery Co., Ltd.) performs light imprinting. Light imprinting is always performed at 23°C in the following order: a) Pressurization to 500 N in 10 seconds, b) Exposure to 5000 mJ/cm 2 using a high-pressure mercury lamp, c) 10 seconds Perform pressure relief and d) Separate the nickel mold from the quartz glass substrate and demold, and obtain a convex lens pattern of 2 mm diameter × 300 μm height on the quartz glass substrate. The convex lens pattern obtained on the quartz glass substrate was heated for 5 minutes using a heating plate at 150°C to form a layer A. The above-mentioned quartz glass substrate used has been subjected to a close bonding process by spin-coating KBM-5103 (manufactured by Shin-Etsu Chemical Co., Ltd.) in advance and heating it with a hot plate at 150°C for 5 minutes. Using a spin coater, the composition (release agent) B1 obtained in Preparation Example 10 was formed into a film on the obtained layer A, and baked at 80° C. for 5 minutes using a hot plate. After that, in a nitrogen environment, a batch-type UV irradiation device (high-pressure mercury lamp 2 kW×1 lamp) (manufactured by EYE GRAPHICS Co., Ltd.) was used to pass the i-ray filter through a 40 mW/cm 2 UV exposure for 2 seconds to form layer B on the above layer A to make a replica RM-1 for imprinting.

<實施例2> 將製備例10中所得之組合物(脫模劑)B1變更為製備例11中所得之組合物(脫模劑)B2,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-2。<Example 2> Except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B2 obtained in Preparation Example 11, a replica mold for imprint was produced in the same manner as in Example 1 RM-2.

<實施例3> 將製備例10中所得之組合物(脫模劑)B1變更為製備例12中所得之組合物(脫模劑)B3,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-3。<Example 3> The composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B3 obtained in Preparation Example 12, except that the same method as Example 1 was used to produce a replica mold for imprint RM-3.

<實施例4> 將製備例10中所得之組合物(脫模劑)B1變更為製備例13中所得之組合物(脫模劑)B4,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-4。<Example 4> Except that the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B4 obtained in Preparation Example 13, the replica mold for imprint was produced in the same manner as in Example 1 RM-4.

<實施例5> 將製備例10中所得之組合物(脫模劑)B1變更為製備例14中所得之組合物(脫模劑)B5,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-5。<Example 5> The composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B5 obtained in Preparation Example 14, except that the same method as Example 1 was used to produce a replica mold for imprint RM-5.

<實施例6> 將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-6。<Example 6> The composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition (release agent) B7 obtained in Preparation Example 16, except that the same method as Example 1 was used to produce a replica mold for imprint RM-6.

<實施例7> 將製備例1中所得之組合物A1變更為製備例2中所得之組合物A2,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-7。<Example 7> The composition A1 obtained in Preparation Example 1 was changed to the composition A2 obtained in Preparation Example 2, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-7 for imprinting was produced.

<實施例8> 將製備例1中所得之組合物A1變更為製備例3中所得之組合物A3,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-8。<Example 8> The composition A1 obtained in Preparation Example 1 was changed to the composition A3 obtained in Preparation Example 3, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-8 for imprinting was produced.

<實施例9> 將製備例1中所得之組合物A1變更為製備例4中所得之組合物A4,將製備例10中所得之組合物(脫模劑)B1變更為製備例15中所得之組合物(脫模劑)B6,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-9。<Example 9> The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 15 (release Agent) B6, except for this, in the same manner as in Example 1, a replica RM-9 for imprinting was produced.

<實施例10> 將製備例1中所得之組合物A1變更為製備例4中所得之組合物A4,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-10。<Example 10> The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-10 for imprinting was produced.

<實施例11> 將製備例1中所得之組合物A1變更為製備例4中所得之組合物A4,將製備例10中所得之組合物(脫模劑)B1變更為製備例17中所得之組合物(脫模劑)B8,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-11。<Example 11> The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 17 (release Agent) B8, except for this, in the same manner as in Example 1, a replica RM-11 for imprinting was produced.

<實施例12> 將製備例1中所得之組合物A1變更為製備例4中所得之組合物A4,將製備例10中所得之組合物(脫模劑)B1變更為製備例18中所得之組合物(脫模劑)B9,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-12。<Example 12> The composition A1 obtained in Preparation Example 1 was changed to the composition A4 obtained in Preparation Example 4, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 18 (release Agent) B9, except for this, in the same manner as in Example 1, a replica RM-12 for imprinting was produced.

<實施例13> 將製備例1中所得之組合物A1變更為製備例5中所得之組合物A5,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-13。<Example 13> The composition A1 obtained in Preparation Example 1 was changed to the composition A5 obtained in Preparation Example 5, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-13 for imprint was produced.

<實施例14> 將製備例1中所得之組合物A1變更為製備例6中所得之組合物A6,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-14。<Example 14> The composition A1 obtained in Preparation Example 1 was changed to the composition A6 obtained in Preparation Example 6, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-14 for imprinting was produced.

<實施例15> 將製備例1中所得之組合物A1變更為製備例7中所得之組合物A7,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-15。<Example 15> The composition A1 obtained in Preparation Example 1 was changed to the composition A7 obtained in Preparation Example 7, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-15 for imprinting was produced.

<實施例16> 將製備例1中所得之組合物A1變更為製備例8中所得之組合物A8,將製備例10中所得之組合物(脫模劑)B1變更為製備例16中所得之組合物(脫模劑)B7,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-16。<Example 16> The composition A1 obtained in Preparation Example 1 was changed to the composition A8 obtained in Preparation Example 8, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 16 (release Agent) B7, except for this, in the same manner as in Example 1, a replica RM-16 for imprinting was produced.

<比較例1> 將製備例1中所得之組合物A1變更為製備例8中所得之組合物A8,除此以外,以與實施例1同樣之方法形成A層。於所得之A層上旋轉塗佈NOVEC1720,利用150℃之加熱板加熱5分鐘,藉此製作壓印用複製模RM-19。<Comparative example 1> Except for changing the composition A1 obtained in Preparation Example 1 to the composition A8 obtained in Preparation Example 8, the A layer was formed in the same manner as in Example 1. NOVEC 1720 was spin-coated on the A layer obtained, and heated with a hot plate at 150° C. for 5 minutes, thereby making a replica RM-19 for imprinting.

<比較例2> 將製備例1中所得之組合物A1變更為製備例8中所得之組合物A8,除此以外,以與實施例1同樣之方法形成A層。於所得之A層上旋轉塗佈PFPE1,利用150℃之加熱板加熱5分鐘,藉此製作壓印用複製模RM-20。<Comparative example 2> Except for changing the composition A1 obtained in Preparation Example 1 to the composition A8 obtained in Preparation Example 8, the A layer was formed in the same manner as in Example 1. PFPE1 was spin-coated on the obtained layer A, and heated with a hot plate at 150°C for 5 minutes, thereby making a replica RM-20 for imprinting.

<比較例3> 將製備例1中所得之組合物A1變更為製備例9中所得之組合物A9,將製備例10中所得之組合物(脫模劑)B1變更為製備例11中所得之組合物(脫模劑)B2,除此以外,以與實施例1同樣之方法製作壓印用複製模RM-21。<Comparative Example 3> The composition A1 obtained in Preparation Example 1 was changed to the composition A9 obtained in Preparation Example 9, and the composition (release agent) B1 obtained in Preparation Example 10 was changed to the composition obtained in Preparation Example 11 (release Agent) B2, except that, in the same manner as in Example 1, a replica RM-21 for imprinting was produced.

[壓印材料之製備] 混合NK ESTER A-DOG(新中村化學工業(股)製造)5 g及含有自由基聚合性基之聚碳酸酯ETERNACOLL(註冊商標)ΜM-90(1/3)DA(宇部興產(股)製造)5 g,於該混合物中加入IRGACURE184 0.2 g,製備壓印材料。[Preparation of imprinting material] Mixed NK ESTER A-DOG (manufactured by Shinnakamura Chemical Industry Co., Ltd.) 5 g and polycarbonate ETERNACOLL (registered trademark) containing radical polymerizable groups ΜM-90(1/3)DA (Ube Industries Co., Ltd.) Manufacturing) 5 g, 0.2 g of IRGACURE184 was added to the mixture to prepare an imprinting material.

[使用壓印用複製模之凹透鏡圖案之製作] 將所製備之壓印材料灌注至利用實施例1中記載之方法進行過密接處理之石英玻璃基板上,於其上載置實施例1至實施例16及比較例1至比較例3中所得之各壓印用複製模,使用奈米壓印裝置NM-0801HB(明昌機工(股)製造)進行光壓印。光壓印係於始終23℃之條件下,以如下之順序進行:a)歷時10秒鐘加壓至500 N、b)使用高壓水銀燈進行5000 mJ/cm2 之曝光、c)歷時10秒鐘進行泄壓、d)將複製模與石英玻璃基板分離而進行脫模,於該石英玻璃基板上獲得凹透鏡圖案。使用工業用顯微鏡 ECLIPSE L150(Nikon(股)製造),觀察所得之凹透鏡圖案之剝離・破裂之有無。將其結果示於表1及表2。[Production of concave lens pattern using copy mold for imprinting] The prepared imprinting material was poured onto a quartz glass substrate that had been closely bonded by the method described in Example 1, and the examples 1 to were placed thereon 16 and each of the imprinting replica molds obtained in Comparative Example 1 to Comparative Example 3 was subjected to light imprinting using a nanoimprinting device NM-0801HB (manufactured by Mingchang Machinery Co., Ltd.). Light imprinting is always performed at 23°C in the following order: a) Pressurization to 500 N in 10 seconds, b) Exposure to 5000 mJ/cm 2 using a high-pressure mercury lamp, c) 10 seconds Perform pressure relief and d) separate the replication mold from the quartz glass substrate and demold, and obtain a concave lens pattern on the quartz glass substrate. Using an industrial microscope ECLIPSE L150 (manufactured by Nikon Co., Ltd.), observe whether the resulting concave lens pattern is peeled off or cracked. The results are shown in Table 1 and Table 2.

[光學特性評價] 使用分光光度計UV2600(島津製作所(股)製造),於將參考設為石英玻璃之狀態下測定實施例1至實施例16及比較例1至比較例3中所得之各壓印用複製模之波長365 nm下之透過率。將其結果示於表1及表2。測定了透過率之上述壓印用複製模具有2 mm徑×300 μm高之凸透鏡圖案。[Evaluation of Optical Properties] Using a spectrophotometer UV2600 (manufactured by Shimadzu Corporation), measuring the values of the replica molds obtained in Examples 1 to 16 and Comparative Examples 1 to 3 in a state where the reference is set to quartz glass The transmittance at a wavelength of 365 nm. The results are shown in Table 1 and Table 2. The above-mentioned replica mold for imprint, whose transmittance was measured, has a convex lens pattern of 2 mm diameter × 300 μm height.

[能夠重複壓印之次數之測定] 直接使用實施例1至實施例16及比較例1至比較例3中所得之各壓印用複製模,重複與上述同樣之光壓印,最大進行至10次,測定光壓印之次數直至無法形成2 mm徑×300 μm深之凹透鏡形狀圖案為止。將所得之結果示於表1及表2。[Determination of the number of times that can be repeatedly imprinted] Using the copy molds for imprinting obtained in Example 1 to Example 16 and Comparative Example 1 to Comparative Example 3 directly, repeat the same light imprinting as above, up to 10 times, and measure the number of light imprinting until it fails. Until the formation of a concave lens shape pattern of 2 mm diameter × 300 μm depth. The results obtained are shown in Table 1 and Table 2.

[表1] 表1    凹透鏡圖案之破裂之有無 凹透鏡圖案之剝離之有無 365 nm下之透過率(%) 能夠重複壓印之次數 實施例1 83.7 8次 實施例2 83.5 8次 實施例3 84.0 9次 實施例4 84.1 8次 實施例5 83.8 9次 實施例6 82.1 10次 實施例7 84.3 10次 實施例8 85.2 10次 實施例9 84.9 10次 實施例10 84.7 10次 實施例11 85.2 10次 實施例12 85.7 10次 實施例13 84.9 10次 實施例14 84.3 10次 實施例15 84.5 10次 實施例16 84.2 10次 [Table 1] Table 1 Whether the concave lens pattern is broken Whether the concave lens pattern is peeled off Transmittance under 365 nm (%) The number of times that can be repeated Example 1 no no 83.7 8 times Example 2 no no 83.5 8 times Example 3 no no 84.0 9 times Example 4 no no 84.1 8 times Example 5 no no 83.8 9 times Example 6 no no 82.1 10 times Example 7 no no 84.3 10 times Example 8 no no 85.2 10 times Example 9 no no 84.9 10 times Example 10 no no 84.7 10 times Example 11 no no 85.2 10 times Example 12 no no 85.7 10 times Example 13 no no 84.9 10 times Example 14 no no 84.3 10 times Example 15 no no 84.5 10 times Example 16 no no 84.2 10 times

[表2] 表2    凹透鏡圖案之破裂之有無 凹透鏡圖案之剝離之有無 365 nm下之透過率(%) 能夠重複壓印之次數 比較例1 82.1 1次 比較例2 82.1 0次 比較例3 75.2 10次 [Table 2] Table 2 Whether the concave lens pattern is broken Whether the concave lens pattern is peeled off Transmittance under 365 nm (%) The number of times that can be repeated Comparative example 1 no no 82.1 1 time Comparative example 2 no Have 82.1 0 times Comparative example 3 no Have 75.2 10 times

根據表1及表2所示之結果,使用實施例1至實施例16中製作之壓印用複製模所製作之凹透鏡圖案未觀察到破裂・剝離之任一者。並且,實施例1至實施例16中製作之壓印用複製模均能夠進行8次以上之重複壓印。進而,實施例1至實施例16中製作之壓印用複製模於365 nm下之透過率均為80%以上,確認有紫外線區域之較高之透明性。另一方面,使用比較例2及比較例3中製作之壓印用複製模所製作之凹透鏡圖案觀察到剝離。並且,比較例1及比較例2中製作之壓印用複製模能夠進行重複壓印之次數為1次或0次。進而,比較例3中製作之壓印用複製模於波長365 nm下之透過率成為低於80%之結果。According to the results shown in Table 1 and Table 2, no cracking or peeling was observed in the concave lens pattern produced using the replica mold for imprint produced in Example 1 to Example 16. In addition, the imprint replica molds produced in Example 1 to Example 16 were able to perform repeated imprinting more than 8 times. Furthermore, the transmittance at 365 nm of the replica molds for imprints produced in Example 1 to Example 16 were all 80% or more, and it was confirmed that they had high transparency in the ultraviolet region. On the other hand, peeling was observed in the concave lens pattern produced using the replica mold for imprint produced in Comparative Example 2 and Comparative Example 3. In addition, the copy mold for imprint produced in Comparative Example 1 and Comparative Example 2 can be repeatedly imprinted once or 0 times. Furthermore, the transmittance of the replica mold for imprint produced in Comparative Example 3 at a wavelength of 365 nm was lower than 80%.

根據以上之結果,本發明之壓印用複製模係具有紫外線區域之較高之透明性者,能夠進行重複之壓印。進而,使用該壓印用複製模所製作之圖案成為無破裂・剝離者。Based on the above results, the copy mold for imprinting of the present invention has high transparency in the ultraviolet region and can perform repeated imprinting. Furthermore, the pattern produced using this imprinting replica mold has no cracking or peeling.

Claims (13)

一種壓印用複製模,其具備下述A層及接著於該A層之下述B層, A層:包含含有下述(a1)成分及(a2)成分之組合物之硬化物之結構體 (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.01質量%至0.3質量%之光自由基聚合起始劑 B層:包含含有下述(b1)成分及(b2)成分之組合物之硬化物之膜 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑。A copy mold for imprinting, comprising the following A layer and the following B layer next to the A layer, Layer A: A structure containing a cured product of a composition containing the following (a1) and (a2) components (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.01% by mass to 0.3% by mass relative to 100% by mass of the above-mentioned component (a1) Layer B: A film containing a cured product of a composition containing the following components (b1) and (b2) (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% by mass to 15% by mass relative to 100% by mass of the aforementioned (b1) component. 如請求項1之壓印用複製模,其中上述(b1)成分之化合物係於上述線狀或鏈狀之分子鏈之所有末端經由胺基甲酸酯鍵具有下述式(3)所表示之基之多官能(甲基)丙烯酸酯化合物,上述線狀或鏈狀之分子鏈包含下述式(1)所表示之基及下述式(2a)或式(2b)所表示之基, [化1]
Figure 03_image009
(式中,R1 表示碳原子數1或2之全氟伸烷基,R2a 表示碳原子數2或3之伸烷基,R2b 表示碳原子數2或3之3價之烴基,*表示分別與上述胺基甲酸酯鍵之-O-基鍵結之鍵結鍵,p及q分別表示上述式(1)所表示之基之重複數及上述式(2a)所表示之基之重複數並且獨立地表示2以上之整數,R3 表示甲基或氫原子)。
The copy mold for imprinting according to claim 1, wherein the compound of the component (b1) is represented by the following formula (3) at all ends of the linear or chain molecular chain via urethane bonds The multifunctional (meth)acrylate compound of a group, the linear or chain-shaped molecular chain includes a group represented by the following formula (1) and a group represented by the following formula (2a) or (2b), [化1]
Figure 03_image009
(In the formula, R 1 represents a perfluoroalkylene group with 1 or 2 carbon atoms, R 2a represents an alkylene group with 2 or 3 carbon atoms, and R 2b represents a trivalent hydrocarbon group with 2 or 3 carbon atoms, * Represents the bonding bond to the -O- group of the above urethane bond, p and q represent the repeating number of the group represented by the above formula (1) and the number of the group represented by the above formula (2a), respectively The repeating number independently represents an integer of 2 or more, and R 3 represents a methyl group or a hydrogen atom).
如請求項2之壓印用複製模,其中表示上述式(2a)所表示之基之重複數之q為5至12之整數。For example, the copy mold for imprinting of claim 2, wherein q representing the number of repetitions of the base represented by the above formula (2a) is an integer from 5 to 12. 如請求項2或3之壓印用複製模,其中上述式(2a)所表示之基為聚(氧伸乙基)。Such as claim 2 or 3 of the copy mold for imprint, wherein the group represented by the above formula (2a) is poly(oxyethylene). 如請求項2至4中任一項之壓印用複製模,其中上述式(1)所表示之基為具有氧全氟亞甲基及氧全氟伸乙基之兩者之基。The copy mold for imprinting according to any one of claims 2 to 4, wherein the group represented by the above formula (1) is a group having both of oxyperfluoromethylene and oxyperfluoroethylene. 如請求項1至5中任一項之壓印用複製模,其中上述(b1)成分之化合物係重量平均分子量1000至30000之巨單體或聚合物。The replica mold for imprinting according to any one of claims 1 to 5, wherein the compound of the component (b1) is a macromonomer or polymer with a weight average molecular weight of 1,000 to 30,000. 如請求項1至6中任一項之壓印用複製模,其中包含上述(b1)成分及(b2)成分之組合物進而含有光增感劑。The copy mold for imprint according to any one of claims 1 to 6, wherein the composition containing the above-mentioned (b1) component and (b2) component further contains a photosensitizer. 如請求項1之壓印用複製模,其中上述(a1)成分含有至少2種化合物,該2種化合物中之至少1種化合物係於1分子中具有至少2個(甲基)丙烯醯氧基之化合物。For example, the copy mold for imprint of claim 1, wherein the component (a1) contains at least two compounds, and at least one of the two compounds has at least two (meth)acryloyloxy groups in one molecule The compound. 如請求項8之壓印用複製模,其中上述於1分子中具有至少2個(甲基)丙烯醯氧基之化合物係下述式(4)所表示之二(甲基)丙烯酸酯化合物, [化2]
Figure 03_image011
(式中,R4 及R5 分別獨立地表示氫原子或甲基,R6 及R7 分別獨立地表示碳原子數1至4之伸烷基,R8 及R9 分別獨立地表示氫原子或甲基,r1 及r2 分別獨立地表示1至5之整數)。
The copy mold for imprinting according to claim 8, wherein the compound having at least two (meth)acryloxy groups in one molecule is a di(meth)acrylate compound represented by the following formula (4), [化2]
Figure 03_image011
(In the formula, R 4 and R 5 each independently represent a hydrogen atom or a methyl group, R 6 and R 7 each independently represent an alkylene group having 1 to 4 carbon atoms, and R 8 and R 9 each independently represent a hydrogen atom Or methyl, r 1 and r 2 each independently represent an integer of 1 to 5).
如請求項1至9中任一項之壓印用複製模,其中上述A層具有透鏡形狀之反轉圖案。The copy mold for imprinting according to any one of claims 1 to 9, wherein the layer A has a lens-shaped reverse pattern. 如請求項1至10中任一項之壓印用複製模,其中上述A層之最大厚度為2.0 mm。Such as the copy mold for imprinting in any one of Claims 1 to 10, wherein the maximum thickness of the A layer is 2.0 mm. 一種壓印用複製模之製作方法,其包含: 將包含下述(a1)成分及(a2)成分之組合物塗佈於主模上之步驟、 經由包含下述(a1)成分及(a2)成分之組合物將上述主模壓接於基材之步驟、 於將上述主模壓接於上述基材之狀態下通過該基材對包含下述(a1)成分及(a2)成分之組合物進行曝光而使該組合物進行光硬化之步驟、 於上述光硬化步驟之後將上述基材上所得之硬化物自上述主模脫模而形成A層之步驟、 於上述A層上塗佈包含下述(b1)成分至(b3)成分之組合物之步驟、及 將包含下述(b1)成分至(b3)成分之組合物於40℃至200℃下進行烘烤且其後進行曝光而形成接著於上述A層之上述B層之步驟, (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.1質量%至1質量%之光自由基聚合起始劑 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑 (b3)成分:溶劑。A method for making a copy mold for imprinting, which includes: The step of coating the composition containing the following (a1) components and (a2) components on the master mold, The step of crimping the above-mentioned master mold to the substrate through a composition containing the following (a1) components and (a2) components, The step of exposing a composition containing the following components (a1) and (a2) through the substrate in a state where the master mold is pressure-bonded to the substrate, and the composition is photocured, The step of releasing the cured product obtained on the substrate from the master mold to form the A layer after the light curing step, The step of applying a composition containing the following components (b1) to (b3) on the A layer, and A step of baking a composition containing the following components (b1) to (b3) at 40°C to 200°C and then performing exposure to form the layer B next to the layer A, (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.1% to 1% by mass of the photo-radical polymerization initiator relative to 100% by mass of the above (a1) component (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% to 15% by mass relative to 100% by mass of the above (b1) component (b3) Ingredient: solvent. 一種壓印用複製模之製作方法,其包含: 將包含下述(a1)成分及(a2)成分之組合物塗佈於基材上之步驟、 經由包含下述(a1)成分及(a2)成分之組合物將上述基材壓接於主模之步驟、 於將上述主模壓接於上述基材之狀態下通過該基材對包含下述(a1)成分及(a2)成分之組合物進行曝光而使該組合物進行光硬化之步驟、 於上述光硬化步驟之後將上述基材上所得之硬化物自上述主模脫模而形成A層之步驟、 於上述A層上塗佈包含下述(b1)成分至(b3)成分之組合物之步驟、及 將包含下述(b1)成分至(b3)成分之組合物於40℃至200℃下進行烘烤且其後進行曝光而形成接著於上述A層之上述B層之步驟, (a1)成分:於1分子中具有至少1個自由基聚合性基之化合物 (a2)成分:相對於上述(a1)成分100質量%為0.1質量%至1質量%之光自由基聚合起始劑 (b1)成分:包含含有氟原子之線狀或鏈狀之分子鏈且於該分子鏈之所有末端具有自由基聚合性基之化合物 (b2)成分:相對於上述(b1)成分100質量%為0.05質量%至15質量%之光自由基聚合起始劑 (b3)成分:溶劑。A method for making a copy mold for imprinting, which includes: The step of coating a composition containing the following (a1) components and (a2) components on a substrate, The step of crimping the above-mentioned base material to the master mold through a composition containing the following (a1) components and (a2) components, The step of exposing a composition containing the following components (a1) and (a2) through the substrate in a state where the master mold is pressure-bonded to the substrate, and the composition is photocured, The step of releasing the cured product obtained on the substrate from the master mold to form the A layer after the light curing step, The step of applying a composition containing the following components (b1) to (b3) on the A layer, and A step of baking a composition containing the following components (b1) to (b3) at 40°C to 200°C and then performing exposure to form the layer B next to the layer A, (a1) Component: a compound having at least one radical polymerizable group in one molecule (a2) Component: 0.1% to 1% by mass of the photo-radical polymerization initiator relative to 100% by mass of the above (a1) component (b1) Component: A compound containing a linear or chain molecular chain containing fluorine atoms and having radical polymerizable groups at all ends of the molecular chain (b2) Component: A photo-radical polymerization initiator of 0.05% to 15% by mass relative to 100% by mass of the above (b1) component (b3) Ingredient: solvent.
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