WO2020113873A1 - 可弯折面板及其制作方法 - Google Patents

可弯折面板及其制作方法 Download PDF

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Publication number
WO2020113873A1
WO2020113873A1 PCT/CN2019/080928 CN2019080928W WO2020113873A1 WO 2020113873 A1 WO2020113873 A1 WO 2020113873A1 CN 2019080928 W CN2019080928 W CN 2019080928W WO 2020113873 A1 WO2020113873 A1 WO 2020113873A1
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WO
WIPO (PCT)
Prior art keywords
flexible substrate
glue
driving chip
binding end
panel according
Prior art date
Application number
PCT/CN2019/080928
Other languages
English (en)
French (fr)
Inventor
王明亮
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/349,283 priority Critical patent/US11114426B2/en
Publication of WO2020113873A1 publication Critical patent/WO2020113873A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of flexible display, in particular to a bendable panel and a manufacturing method thereof.
  • bendable, foldable and curved display devices have shown more and more extensive application prospects. Its main advantage lies in its foldability, so as to achieve the diversity of products, and can achieve excellent display effects and appearance effects.
  • AMOLED Active active-matrix organic light-emitting diode
  • the more common flexible display application solution is to bend the product at the binding end of the display panel and bend the binding end to the back of the display panel to reduce the border area of the display panel and increase the effective display of the display panel The proportion of the area.
  • the object of the present invention is to provide a bendable panel and a manufacturing method thereof.
  • the bendable panel improves the existing display panel to provide better support and impact resistance to the bending area of the display panel. In addition, it enhances the protective effect of the lines in the bending area, such as corrosion resistance.
  • the invention provides a bendable panel.
  • the bendable panel includes a flexible display panel and a driving chip.
  • the flexible display panel is based on a flexible substrate.
  • the flexible substrate includes an effective display area and a binding end on one side of the effective display area
  • the driving chip is provided at the binding end, and the binding end is bent toward the back toward the light exit side of the flexible display panel, so that the driving chip is located on the back of the flexible substrate;
  • the binding The fixed end includes a first terminal portion close to the effective display area, a second terminal portion close to the driving chip, and a bent portion connecting the first terminal portion and the second terminal portion in a bent shape; Glue is provided in the bending area formed by the inner surface of the bending portion.
  • a thin film circuit layer connected between the effective display area and the driving chip is further provided on the flexible substrate, and the thin film circuit layer is attached to the bent portion And bend in the same direction as the bending part.
  • a conductive circuit respectively connecting the flexible display panel and the driving chip is provided on a surface of the thin film circuit layer.
  • a UV glue layer is provided on the outer surface of the thin film circuit layer.
  • the driving chip is directly attached to the flexible substrate.
  • the driving chip is indirectly fixed to the flexible substrate through a flip chip.
  • a support plate is attached to the back of the second terminal portion.
  • a backplane film layer is laminated on the back of the flexible substrate, and the backplane film layer is used to support and protect the flexible substrate.
  • the present invention also provides a method for manufacturing a bendable panel.
  • the manufacturing method of the bendable panel includes the following steps: (a) binding a driving chip at a binding end of the flexible substrate; (b) setting a surface on the binding end facing away from the light emitting side of the flexible substrate Glue; (c) After setting the glue on the binding end, bend the binding end back toward the light emitting side of the flexible display panel so that the driving chip is located on the back of the flexible substrate; (D) Curing the glue.
  • step (b) the glue is set by spraying or coating.
  • step (d) the glue is cured by high temperature or standing.
  • the advantage of the present invention is that the bendable panel improves the existing display panel to provide better support and impact resistance to the bending area of the display panel. In addition, it enhances the protection effect of the circuit in the bending area, such as corrosion resistance.
  • FIG. 1 is a schematic structural diagram of a bendable panel according to an embodiment of the invention.
  • FIG. 2 is a schematic diagram of the glue provided in the bendable panel according to an embodiment of the present invention before bending.
  • FIG. 3 is a schematic diagram of another angle of setting glue before bending in a bendable panel according to an embodiment of the invention.
  • FIG. 4 is a flowchart of steps of a method for manufacturing a bendable panel according to an embodiment of the invention.
  • the embodiment of the invention provides a bendable panel and a manufacturing method thereof. Each will be described in detail below.
  • FIG. 1 is a schematic structural diagram of a bendable panel according to an embodiment of the invention.
  • FIG. 2 is a schematic diagram of the glue provided in the bendable panel according to an embodiment of the present invention before bending.
  • FIG. 3 is a schematic diagram of another angle of setting glue before bending in a bendable panel according to an embodiment of the invention.
  • the bendable panel includes a flexible display panel 100 and a driving chip 170.
  • the flexible display panel 100 uses the flexible substrate 130 as a base.
  • the flexible substrate 130 is made of polyimide material. Because the polyimide material has the advantages of wide temperature, chemical resistance, and high strength, the flexible substrate 130 is made with good flexibility Sex.
  • the flexible substrate 130 may also use one or a combination of several materials such as polyetherimide (PET), polyphenylene sulfide (PPS), and polyarylate (PAR). production.
  • PET polyetherimide
  • PPS polyphenylene sulfide
  • PAR polyarylate
  • the flexible substrate 130 includes an effective display area 1300 and a binding end 131 located on one side of the effective display area 1300.
  • the driving chip 170 is disposed on the binding end 131 of the flexible substrate 130 of the flexible display panel 100 through a binding process.
  • the binding end 131 is bent toward the light exit side of the flexible display panel 100 so that the driving chip 170 is located on the back of the flexible substrate 130.
  • the binding end 131 includes a first terminal portion 132 close to the effective display area, a second terminal portion 133 close to the driving chip 170, and a bent shape connecting the first terminal portion 132 and the second terminal portion 133 Flexed portion 134.
  • Glue 180 is provided in the bending area formed by the inner surface of the bending portion 134.
  • the glue 180 may be provided to the inner surface of the bent portion 134 by spraying or coating.
  • the coated glue 180 can be selected from high temperature curing glue, standing curing glue or other curable colloids.
  • the viscosity of the glue 180 is adjustable, has a certain fluidity, and has a convex shape after coating.
  • the binding end 131 is bent. Since the glue 180 has fluidity, the bent area formed by the inner surface of the bent portion 134 is filled with glue 180. In this way, it may be possible to provide better supportability and impact resistance to the bending area of the flexible display panel 100.
  • the glue 180 is cured at a high temperature or standing.
  • the bending portion 134 of the binding end 131 itself is not provided with a line.
  • a thin film circuit layer 141 connected between the effective display area 1300 and the driving chip 170 is provided on the flexible substrate 130, and the thin film circuit layer 141 is attached to the bent portion 134, And it is bent in the same direction as the bending portion 134.
  • conductive circuits (not shown in the figure) connected to the flexible display panel 100 and the driving chip 170 are provided.
  • the effective display area 1300 of the flexible display panel 100 can account for the largest proportion.
  • the electrical connection between the flexible display panel 100 and the driving chip 170 can be achieved through the conductive wiring in the thin film wiring layer 141.
  • the flexible display panel 100 includes a display module and a touch module provided on the display module.
  • the display module includes the above-mentioned flexible substrate 130, on which a thin film transistor layer 140, an organic electroluminescent layer, and a thin film encapsulation layer are stacked in this order, which is not drawn in the structural diagram shown in FIG. Organic electroluminescent layer and thin film encapsulation layer.
  • the thin film transistor layer 140 may be made by low temperature polysilicon (LTPS) or indium gallium zinc oxide (IGZO) process.
  • LTPS low temperature polysilicon
  • IGZO indium gallium zinc oxide
  • the thin-film encapsulation layer is used to block water vapor corrosion.
  • a backplane film layer 120 is laminated and covered on the back of the flexible substrate 130.
  • the backplane film layer 120 is used for supporting and protecting the flexible substrate 130 and shielding and reflecting.
  • a foam layer 110 may be further provided on the back of the backplane film layer 120, and the foam layer 110 is used to further protect the flexible substrate 130.
  • the touch module includes a touch layer 150, a polarizer layer (not shown in the figure) and a cover glass 160.
  • the touch module and the display module are attached to each other through optical glue.
  • the touch layer 150 is used to realize a touch control function.
  • one end of the touch layer 150 is connected to the flexible printed circuit board 172.
  • the polarizer layer is used to reduce the reflection effect caused by external incident light.
  • the cover glass 160 is used to protect the touch module and the display module.
  • the flexible display panel 100 may not have a touch module, but only a display module.
  • the thin film circuit layer 141 is used for bridging the source electrode, gate drive circuit and other circuits of the flexible display panel 100 and the output end of the driving chip 170, which avoids the easy direct plating of conductive circuits on the flexible substrate 130.
  • the driving chip 170 may be indirectly fixed to the flexible substrate 130 through the flip-chip film 135, and a flexible printed circuit (PFC) 136 is connected to one end of the flip-chip film 135.
  • PFC flexible printed circuit
  • the driving chip 170 may also be directly attached to the flexible substrate 130.
  • a support plate 190 is attached to the back of the second terminal portion 133.
  • the support plate 190 covers at least the back surface of the second terminal portion 133 where the driving chip 170 is provided, not only to fill the height difference, to ensure the bending radius of the binding end 131, but also enhance the binding of the driving chip 170 The intensity of a given location.
  • the support plate 190 is opposite to the flexible substrate 130, the driving chip 170 is hidden on the back of the flexible substrate 130, and the second terminal of the binding end 131
  • the portion 133 is substantially parallel to the effective display area 1300 of the flexible substrate 130.
  • a UV glue layer 171 is provided on the outer surface of the thin film circuit layer 141. Since the thin film circuit layer 141 is attached to the bent portion 134 and is bent in the same direction as the bent portion 134, the UV adhesive layer 171 and the bent portion 134 are oriented in the same direction Bend. Therefore, the UV adhesive layer 171 further enhances the strength of the bending area to avoid the problem that the bending area easily deforms when the flexible display panel 100 is subjected to an external force such as extrusion, thereby better protecting the area The conductive circuit in the thin film circuit layer 141. In addition, in this embodiment, the UV adhesive layer 171 may be fixed to the thin film circuit layer 141 by double-sided adhesive.
  • FIG. 4 is a flowchart of steps of a method for manufacturing a bendable panel according to an embodiment of the invention.
  • the invention also provides a method for manufacturing a bendable panel.
  • the manufacturing method of the bendable panel includes the following steps:
  • Step S410 Bind the driver chip to the binding end of the flexible substrate.
  • a thin film transistor layer 140, an organic electroluminescent layer, and a thin film encapsulation layer are first formed on the flexible substrate 130 of the flexible display panel 100, and the touch layer 150, polarizer layer, and cover glass 160 may be further formed.
  • the driving chip 170 is bound to the binding end 131 of the flexible substrate 130. And after this step, it further includes a first terminal portion 132 and a second terminal portion 133 provided at the binding end 131 of the flexible substrate 130, that is, near the effective display area 1300 and near the driving chip 170, respectively.
  • a thin film wiring layer 141 is formed on the flexible substrate 130, and the conductive wiring of the thin film wiring layer 141 is connected to the first terminal portion 132 and the second terminal portion 133, respectively.
  • a UV glue layer 171 is provided on the outer surface of the thin film circuit layer 141. Since the thin film circuit layer 141 is attached to the bent portion 134 and is bent in the same direction as the bent portion 134, the UV adhesive layer 171 and the bent portion 134 are oriented in the same direction Bend. Therefore, the UV adhesive layer 171 further enhances the strength of the bent region to avoid the problem that the bent region is easily deformed when the flexible display panel 100 is subjected to an external force such as extrusion.
  • Step S420 Glue is provided on the surface of the binding end facing away from the light emitting side of the flexible substrate.
  • the glue 180 is set by spraying or coating.
  • the glue 180 may be high temperature curing glue, static curing glue or other curable colloids.
  • the viscosity of the glue can be adjusted, has a certain fluidity, and has a convex shape after coating.
  • Step S430 After setting glue on the binding end, bend the binding end back toward the light exit side of the flexible display panel 100 so that the driving chip is located on the back of the flexible substrate.
  • the binding end 131 is bent. Since the glue 180 has fluidity, the bent area formed by the inner surface of the bent portion 134 is filled with glue 180.
  • Step S440 curing the glue.
  • the glue 180 is cured by high temperature or standing. In this way, after the glue 180 is cured, it may be able to provide better support and impact resistance to the bending area of the flexible display panel 100.
  • the bendable panel of the present invention improves the existing display panel to provide better support and impact resistance to the bending area of the display panel.
  • the conductive circuit in the thin film circuit layer 141 is used to realize the electrical connection between the flexible display panel 100 and the driving chip 170, and the bonding end 131 is turned away from the flexible display
  • the light-emitting side of the panel 100 is bent to hide the driving chip 170 at the back of the effective display area, which maximizes the effective display area 1300 of the flexible display panel 100, and also ensures that the conductive circuit has good bending properties and improves
  • the foldability of the flexible display panel 100 is shown.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种可弯折面板及其制作方法，可弯折面板对现有的显示面板进行改进，以对显示面板的弯折区域提供更好的支撑性和抗冲击性。另外，增强了对弯折区域内的线路的保护效果，例如抗腐蚀能力。

Description

可弯折面板及其制作方法 技术领域
本发明涉及柔性显示技术领域，尤其涉及一种可弯折面板及其制作方法。
 背景技术
随着更先进的制造设备和材料工程技术的发展，可弯曲、可折叠及曲面显示装置展现出越来越广泛的应用前景。其主要优势在于其具有可绕折性，从而实现产品的多样性，并且能够达到出色的显示效果和外观效果。
柔性有源矩阵发光二极管(Active-matrix organic light-emitting diode，即AMOLED)是未来极具竞争优势的柔性显示技术，通过将柔性显示介质电子元件与材料安装在有柔性或可弯曲的基板上，使得显示器具有能够弯曲或卷曲成任意形状的特性，并具有轻、薄且方便携带等特点，尤其是其可折叠性，使得面板可以更大的显示区域而不会占据更大的空间，另外，其可以搭配不同外形的盖板，即可实现不同样式的显示产品，有助于提高该产品的市场占有率。
目前比较常见的柔性显示屏应用方案为，在显示面板的绑定端进行产品弯折，将绑定端弯折至显示面板的背部，以减少显示面板的边框区，并且增加显示面板的有效显示区域的占比。
 技术问题
然而，采用上述柔性显示屏应用方案时可能会遇到以下的状况：由于绑定端在弯折区域内的线路比较脆弱，因此，一旦柔性显示屏受力容易引起线路的断裂。
有鉴于此，提供一种更加可靠的可弯折面板成为了业内的一项重要课题。
 技术解决方案
本发明的目的在于，提供一种可弯折面板及其制作方法。所述可弯折面板对现有的显示面板进行改进，以对显示面板的弯折区域提供更好的支撑性和抗冲击性。另外,增强了对弯折区域内的线路的保护效果,例如抗腐蚀能力。
根据本发明的一方面，本发明提供了一种可弯折面板。所述可弯折面板包括柔性显示面板和驱动芯片，所述柔性显示面板是以一柔性基板作为基底，所述柔性基板包括一有效显示区域和一位于所述有效显示区域一侧的绑定端；所述驱动芯片设置在所述绑定端，所述绑定端朝背向所述柔性显示面板的出光侧的方向弯折，使得所述驱动芯片位于所述柔性基板的背面；所述绑定端包括靠近所述有效显示区域的第一端子部、靠近所述驱动芯片的第二端子部以及连接所述第一端子部和所述第二端子部且呈弯折状的弯折部；在所述弯折部的内表面所形成的弯折区域内设置有胶水。
在本发明的一实施例中，在所述柔性基板上还设置有连接在所述有效显示区域和所述驱动芯片之间的薄膜线路层，所述薄膜线路层贴合在所述弯折部上，且与所述弯折部朝同一方向弯折。
在本发明的一实施例中，在所述薄膜线路层的一表面设置有分别连接所述柔性显示面板和所述驱动芯片的导电线路。
在本发明的一实施例中，在所述薄膜线路层的外表面设置有UV胶层。
在本发明的一实施例中，所述驱动芯片直接贴合在所述柔性基板上。
在本发明的一实施例中，所述驱动芯片通过一覆晶薄膜间接固定至所述柔性基板。
在本发明的一实施例中，在所述第二端子部的背面贴合有一支撑板。
在本发明的一实施例中，在所述柔性基板的背面贴合覆盖有一背板薄膜层，所述背板薄膜层用于对所述柔性基板起到支撑保护的作用。
根据本发明的另一方面，本发明还提供一种可弯折面板的制作方法。所述可弯折面板的制作方法包括以下步骤：（a）在所述柔性基板的绑定端绑定驱动芯片；（b）在绑定端背向所述柔性基板的出光侧方向的表面设置胶水；（c）在对所述绑定端设置胶水之后，将所述绑定端朝背向所述柔性显示面板的出光侧方向弯折，使得所述驱动芯片位于所述柔性基板的背面；（d）对胶水进行固化。
在本发明的一实施例中，在步骤（b）中，通过喷射或涂布方式设置胶水。
在本发明的一实施例中，在步骤（d）中，采用高温或静置的方式对胶水进行固化。
 有益效果
本发明的优点在于，所述可弯折面板通过对现有的显示面板进行改进，以实现对显示面板的弯折区域提供更好的支撑性和抗冲击性。另外,增强了对弯折区域的线路的保护效果,例如抗腐蚀能力。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明一实施例中的可弯折面板的结构示意图。
图2是本发明一实施例中的可弯折面板在弯折之前设置胶水的示意图。
图3是本发明一实施例中的可弯折面板在弯折之前设置胶水的另一角度示意图。
图4是本发明一实施例中的可弯折面板的制作方法的步骤流程图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书以及上述附图中的术语“第一”、“第二”、“第三”等（如果存在）是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解，这样描述的对象在适当情况下可以互换。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含。
在本专利文档中，下文论述的附图以及用来描述本发明公开的原理的各实施例仅用于说明，而不应解释为限制本发明公开的范围。所属领域的技术人员将理解，本发明的原理可在任何适当布置的系统中实施。将详细说明示例性实施方式，在附图中示出了这些实施方式的实例。此外，将参考附图详细描述根据示例性实施例的终端。附图中的相同附图标号指代相同的元件。
本发明说明书中使用的术语仅用来描述特定实施方式，而并不意图显示本发明的概念。除非上下文中有明确不同的意义，否则，以单数形式使用的表达涵盖复数形式的表达。在本发明说明书中，应理解，诸如“包括”、“具有”以及“含有”等术语意图说明存在本发明说明书中揭示的特征、数字、步骤、动作或其组合的可能性，而并不意图排除可存在或可添加一个或多个其他特征、数字、步骤、动作或其组合的可能性。附图中的相同参考标号指代相同部分。
本发明实施例提供一种可弯折面板及其制作方法。以下将分别进行详细说明。
参阅图1至图3。图1是本发明一实施例中的可弯折面板的结构示意图。图2是本发明一实施例中的可弯折面板在弯折之前设置胶水的示意图。图3是本发明一实施例中的可弯折面板在弯折之前设置胶水的另一角度示意图。
本发明一实施例的可弯折面板包括柔性显示面板100和驱动芯片170。
其中，所述柔性显示面板100是以柔性基板130作为基底。在本实施例中，所述柔性基板130是聚酰亚胺材料制成，由于聚酰亚胺材料具有温度广、耐化学腐蚀、高强度等优点，因此制成的柔性基板130具有良好的柔韧性。当然，在本发明的其他部分实施中，所述柔性基板130也可以采用聚醚酰亚胺（PET）、聚苯硫醚（PPS）、聚芳酯（PAR）等一种或几种材料组合制成。
所述柔性基板130包括有效显示区域1300和位于有效显示区域1300一侧的绑定端131。所述驱动芯片170通过绑定工艺而设置在所述柔性显示面板100的柔性基板130的绑定端131。所述绑定端131朝背向所述柔性显示面板100的出光侧的方向弯折，使得所述驱动芯片170位于所述柔性基板130的背面。具体的，所述绑定端131包括靠近有效显示区域的第一端子部132、靠近驱动芯片170的第二端子部133以及连接第一端子部132和第二端子部133且呈弯折状的弯折部134。
在所述弯折部134的内表面所形成的弯折区域内设置有胶水180。具体的，可以通过喷射或涂布的方式来设置胶水180至所述弯折部134的内表面。涂布的胶水180可以选用高温固化胶水、静置固化胶水或其他可固化胶体。所述胶水180的黏度可调整，具有一定的流动性，在涂布后形态为凸起状。当胶水180还未固化时，对所述绑定端131进行弯折，由于胶水180具有流动性，于是使得所述弯折部134的内表面所形成的弯折区域内填充满了胶水180。这样，可以能够对柔性显示面板100的弯折区域提供更好的支撑性和抗冲击性。在所述绑定端131弯折之后，对所述胶水180进行高温或静置固化。
在本实施例中，在所述绑定端131的弯折部134本身并未设置线路。而是在所述柔性基板130上设置有连接在所述有效显示区域1300和所述驱动芯片170之间的薄膜线路层141，所述薄膜线路层141贴合在所述弯折部134上，且与所述弯折部134朝同一方向弯折。在所述薄膜线路层141的一表面设置有分别连接柔性显示面板100和驱动芯片170的导电线路（图中未标示）。
由于所述驱动芯片170最终隐藏至所述柔性基板130的背面，使得柔性显示面板100的有效显示区域1300占比可以做到最大。通过薄膜线路层141中的导电线路可以实现柔性显示面板100和驱动芯片170的电连接。
在本实施例中，所述柔性显示面板100包括显示模块和设置在所述显示模块上的触摸模块。所述显示模块包括上述的柔性基板130，在所述柔性基板130上依次堆叠设置有薄膜晶体管层140、有机电致发光层和薄膜封装层，在图1所示的结构简图中未绘制出有机电致发光层和薄膜封装层。其中所述薄膜晶体管层140可以通过低温多晶硅（LTPS）或氧化铟镓锌（IGZO）工艺制成。所述薄膜封装层用于阻挡水气侵蚀。
另外，在所述柔性基板130的背面贴合覆盖有一背板薄膜层120，所述背板薄膜层120用于对所述柔性基板130起到支撑保护以及遮光反射的作用。可选的，在所述背板薄膜层120的背面还可以设置有一泡沫层110，所述泡沫层110用于进一步对所述柔性基板130进行保护。
所述触摸模块包括触摸层150、偏光片层(图中未标示)和盖板玻璃160。所述触摸模块与所述显示模块通过光学胶彼此贴合。所述触摸层150用于实现触控功能。在本实施例中，所述触摸层150的一端连接柔性印刷电路板172。所述偏光片层用于减少外部入射光线造成的反射影响。所述盖板玻璃160用于保护所述触摸模块和所述显示模块。当然，在其他部分实施例中，所述柔性显示面板100也可以不具有触摸模块，仅具有显示模块。
可以理解的是，所述薄膜线路层141用于将柔性显示面板100的源极、栅极驱动电路等线路与驱动芯片170的输出端桥接起来，避免了导电线路直接镀在柔性基板130上易折断的问题。在本实施例中，所述驱动芯片170可以通过覆晶薄膜135与柔性基板130实现间接固定,在覆晶薄膜135的一端连接有柔性印刷电路（PFC）136。当然，在其他实施例中，所述驱动芯片170也可以直接贴合在所述柔性基板130上。
另外，在所述第二端子部133的背面贴合有一支撑板190。所述支撑板190至少覆盖第二端子部133设置有驱动芯片170的背面，不仅用于填补高度差，保证所述绑定端131弯折后的半径，而且也增强了所述驱动芯片170绑定位置的强度。当所述绑定端131弯折后，所述支撑板190与所述柔性基板130相对设置，所述驱动芯片170隐藏在所述柔性基板130的背面，所述绑定端131的第二端子部133基本平行于所述柔性基板130的有效显示区域1300。
在本实施例中，在所述薄膜线路层141的外表面设置有UV胶层171。由于所述薄膜线路层141贴合在所述弯折部134上，且与所述弯折部134朝同一方向弯折，因此，所述UV胶层171与所述弯折部134朝同一方向弯折。于是，所述UV胶层171进一步增强所述弯折区域的强度，以避免所述柔性显示面板100受到例如挤压等外力作用时所述弯折区域易变形的问题，从而更好地保护所述薄膜线路层141内的导电线路。另外，在本实施例中，所述UV胶层171可以通过双面胶固定于所述薄膜线路层141。
参阅图4所示，图4是本发明一实施例中的可弯折面板的制作方法的步骤流程图。
在本发明的一实施例中，本发明还提供一种可弯折面板的制作方法。所述可弯折面板的制作方法包括以下步骤：
步骤S410：在柔性基板的绑定端绑定驱动芯片。
在步骤S410之前，在柔性显示面板100的柔性基板130上先形成薄膜晶体管层140、有机电致发光层、薄膜封装层，并且可以进一步形成触摸层150、偏光片层和盖板玻璃160。
在步骤S410中，在所述柔性基板130的绑定端131绑定驱动芯片170。并且在此步骤之后，进一步包括在柔性基板130的绑定端131，即在靠近有效显示区域1300的位置和靠近驱动芯片170的位置分别设置第一端子部132和第二端子部133。在柔性基板130上制作薄膜线路层141，并且将薄膜线路层141的导电线路分别连接至第一端子部132和第二端子部133。
另外，在所述薄膜线路层141的外表面设置有UV胶层171。由于所述薄膜线路层141贴合在所述弯折部134上，且与所述弯折部134朝同一方向弯折，因此，所述UV胶层171与所述弯折部134朝同一方向弯折。于是，所述UV胶层171进一步增强所述弯折区域的强度，以避免所述柔性显示面板100受到例如挤压等外力作用时所述弯折区域易变形的问题。
步骤S420：在绑定端背向所述柔性基板的出光侧方向的表面设置胶水。
在步骤S420中，通过喷射或涂布方式设置胶水180。所述胶水180可以为高温固化胶水、静置固化胶水或其他可固化胶体。所述胶水的黏度可调整，具有一定的流动性，在涂布后形态为凸起状。
步骤S430：在对所述绑定端设置胶水之后，将所述绑定端朝背向所述柔性显示面板100的出光侧方向弯折，使得所述驱动芯片位于所述柔性基板的背面。
当胶水180还未固化时，对所述绑定端131进行弯折，由于胶水180具有流动性，于是使得所述弯折部134的内表面所形成的弯折区域内填充满了胶水180。
步骤S440：对胶水进行固化。
在此步骤中，采用高温或静置的方式对胶水180进行固化。这样，当胶水180固化后，可以能够对柔性显示面板100的弯折区域提供更好的支撑性和抗冲击性。
本发明所述可弯折面板通过对现有的显示面板进行改进，以实现对显示面板的弯折区域提供更好的支撑性和抗冲击性。另外,通过设置UV层增强了对弯折区域的线路的保护效果,例如抗腐蚀能力。另外，通过在柔性基板130的绑定端131设置薄膜线路层141，利用薄膜线路层141内的导电电路实现柔性显示面板100和驱动芯片170的电连接，并且使绑定端131背向柔性显示面板100的出光侧弯折而将驱动芯片170隐藏在有效显示区域的背部，使得柔性显示面板100的有效显示区域1300占比做到最大，同时也保证了导电线路具有良好的弯折性，提高了柔性显示面板100的可折叠性。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (11)

  1. 一种可弯折面板，其包括一柔性显示面板和一驱动芯片，所述柔性显示面板是以一柔性基板作为基底，所述柔性基板包括一有效显示区域和一位于所述有效显示区域一侧的绑定端；所述驱动芯片设置在所述绑定端，所述绑定端朝背向所述柔性显示面板的出光侧的方向弯折，使得所述驱动芯片位于所述柔性基板的背面；所述绑定端包括一靠近所述有效显示区域的第一端子部、一靠近所述驱动芯片的第二端子部以及一连接所述第一端子部和所述第二端子部且呈弯折状的弯折部；在所述弯折部的内表面所形成的弯折区域内设置有胶水。
  2. 根据权利要求1所述的可弯折面板，其中在所述柔性基板上还设置有一连接在所述有效显示区域和所述驱动芯片之间的薄膜线路层，所述薄膜线路层贴合在所述弯折部上，且与所述弯折部朝同一方向弯折。
  3. 根据权利要求2所述的可弯折面板，其中在所述薄膜线路层的一表面设置有一分别连接所述柔性显示面板和所述驱动芯片的导电线路。
  4. 根据权利要求2所述的可弯折面板，其特征在于，在所述薄膜线路层的外表面设置有一UV胶层。
  5. 根据权利要求1所述的可弯折面板，其中所述驱动芯片直接贴合在所述柔性基板上。
  6. 根据权利要求1所述的可弯折面板，其中所述驱动芯片通过一覆晶薄膜间接固定至所述柔性基板。
  7. 根据权利要求1所述的可弯折面板，其中在所述第二端子部的背面贴合有一支撑板。
  8. 根据权利要求1所述的可弯折面板，其中在所述柔性基板的背面贴合覆盖有一背板薄膜层，所述背板薄膜层用于对所述柔性基板起到支撑保护的作用。
  9. 一种采用权利要求1所述的可弯折面板的制作方法，其包括以下步骤：
    （a）在柔性基板的绑定端绑定驱动芯片；
    （b）在所述绑定端背向所述柔性基板的出光侧方向的表面设置胶水；
    （c）在对所述绑定端设置胶水之后，将所述绑定端朝背向所述柔性显示面板的出光侧方向弯折，使得所述驱动芯片位于所述柔性基板的背面；以及
    （d）对胶水进行固化。
  10. 根据权利要求9所述的可弯折面板的制作方法，其中在步骤（b）中，通过喷射或涂布方式设置胶水。
  11. 根据权利要求9所述的可弯折面板的制作方法，其中在步骤（d）中，采用高温或静置的方式对胶水进行固化。
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Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109461382B (zh) * 2018-12-03 2020-08-11 武汉华星光电半导体显示技术有限公司 可弯折面板及其制作方法
KR20200102572A (ko) * 2019-02-21 2020-09-01 삼성디스플레이 주식회사 표시장치
CN109859632A (zh) * 2019-03-15 2019-06-07 武汉华星光电半导体显示技术有限公司 显示屏
KR20200113108A (ko) * 2019-03-22 2020-10-06 삼성디스플레이 주식회사 터치 감지 장치와 이를 포함하는 표시 장치
CN109994606B (zh) * 2019-03-27 2023-10-17 武汉华星光电半导体显示技术有限公司 柔性显示面板
WO2020211085A1 (zh) * 2019-04-19 2020-10-22 京东方科技集团股份有限公司 一种柔性显示屏及显示装置
CN109979327B (zh) * 2019-04-22 2021-04-02 武汉华星光电半导体显示技术有限公司 一种柔性显示器
CN110164901B (zh) * 2019-06-25 2021-10-22 京东方科技集团股份有限公司 阵列基板及其制备方法、显示面板和显示装置
JP7287462B2 (ja) * 2019-06-27 2023-06-06 株式会社村田製作所 樹脂多層基板
CN110297346B (zh) * 2019-06-28 2022-07-12 广州国显科技有限公司 一种显示面板及其制作方法
CN110634398A (zh) * 2019-08-19 2019-12-31 武汉华星光电半导体显示技术有限公司 显示装置及制备方法
CN110444121B (zh) * 2019-08-22 2022-02-08 京东方科技集团股份有限公司 一种柔性显示模组及其制备方法、柔性显示装置
US11050030B2 (en) 2019-09-25 2021-06-29 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. OLED display and OLED display device
CN110718159A (zh) * 2019-09-25 2020-01-21 武汉华星光电半导体显示技术有限公司 Oled显示屏及oled显示装置
TWI713422B (zh) * 2019-10-14 2020-12-11 達運精密工業股份有限公司 顯示模組
CN110726363B (zh) * 2019-10-14 2021-11-02 武汉华星光电半导体显示技术有限公司 一种显示装置及其制作方法
CN110764302A (zh) * 2019-10-31 2020-02-07 京东方科技集团股份有限公司 一种显示面板及其制备方法、对位系统
CN110767092B (zh) * 2019-11-05 2021-11-23 京东方科技集团股份有限公司 显示装置
KR20210056484A (ko) * 2019-11-08 2021-05-20 삼성디스플레이 주식회사 폴더블 표시 장치
CN110993653A (zh) * 2019-11-25 2020-04-10 武汉华星光电半导体显示技术有限公司 一种oled显示面板及显示装置
US12058925B2 (en) * 2019-11-28 2024-08-06 Chengdu Boe Optoelectronics Technology Co., Ltd. Display assembly and manufacturing method thereof and display device
CN111081146A (zh) * 2019-12-18 2020-04-28 京东方科技集团股份有限公司 一种显示基板的制备方法、显示基板及显示装置
CN111131570B (zh) * 2019-12-30 2021-11-30 Oppo广东移动通信有限公司 一种用于折叠屏的显示模组及其电子设备
CN111128026A (zh) * 2019-12-30 2020-05-08 业成科技（成都）有限公司 耐弯折结构及显示面板
CN111402732A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 一种显示面板
KR20210130328A (ko) * 2020-04-21 2021-11-01 삼성디스플레이 주식회사 본딩 장치 및 이를 이용한 표시 장치의 제조방법
CN111681543B (zh) * 2020-04-26 2022-10-25 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN111785169A (zh) * 2020-07-15 2020-10-16 京东方科技集团股份有限公司 一种显示装置及制作方法
US11889647B2 (en) * 2020-08-19 2024-01-30 Apple Inc. Display panel bend reinforcement
CN112289185B (zh) * 2020-10-26 2021-11-23 武汉华星光电半导体显示技术有限公司 显示模组
CN112201154B (zh) * 2020-10-30 2022-08-09 京东方科技集团股份有限公司 显示模组及显示装置
JP7539820B2 (ja) * 2020-11-16 2024-08-26 新光電気工業株式会社 配線基板及び半導体装置
CN112634755A (zh) * 2020-12-10 2021-04-09 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法
CN112863338B (zh) * 2021-01-12 2022-05-31 武汉华星光电半导体显示技术有限公司 显示模组及其制备方法
CN112863347B (zh) * 2021-01-14 2022-09-27 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN112991945A (zh) * 2021-02-23 2021-06-18 京东方科技集团股份有限公司 一种可折叠显示装置及其制作方法
CN113053244B (zh) * 2021-03-11 2023-04-18 京东方科技集团股份有限公司 一种显示模组及其制作方法、背膜
US20220384396A1 (en) * 2021-05-28 2022-12-01 Industrial Technology Research Institute Display apparatus
CN114093274B (zh) * 2021-12-09 2023-01-24 武汉华星光电半导体显示技术有限公司 显示装置及显示终端
CN219162557U (zh) * 2022-09-16 2023-06-09 荣耀终端有限公司 一种电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106898264A (zh) * 2017-03-06 2017-06-27 武汉华星光电技术有限公司 一种可折叠面板及其制作方法
CN106973520A (zh) * 2017-05-27 2017-07-21 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN107644589A (zh) * 2016-07-22 2018-01-30 三星显示有限公司 制造显示装置的方法以及用于制造显示装置的设备
US20180180911A1 (en) * 2016-12-26 2018-06-28 Japan Display Inc. Display device
CN108281387A (zh) * 2018-01-23 2018-07-13 武汉华星光电半导体显示技术有限公司 柔性显示装置的制作方法及柔性显示装置
CN108597378A (zh) * 2018-04-28 2018-09-28 京东方科技集团股份有限公司 一种柔性基板及其制作方法、显示装置
CN109461382A (zh) * 2018-12-03 2019-03-12 武汉华星光电半导体显示技术有限公司 可弯折面板及其制作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11295747A (ja) * 1998-04-06 1999-10-29 Seiko Epson Corp 液晶表示装置およびその製造方法
US9349969B2 (en) * 2013-02-01 2016-05-24 Lg Display Co., Ltd. Electronic devices with flexible display and method for manufacturing the same
KR102048467B1 (ko) * 2013-04-03 2019-11-26 삼성디스플레이 주식회사 유기발광 표시장치
JP6419608B2 (ja) 2015-03-12 2018-11-07 株式会社ジャパンディスプレイ 表示装置
CN104869749B (zh) * 2015-04-17 2018-02-27 麦克思股份有限公司 电子装置
JP6329925B2 (ja) * 2015-06-26 2018-05-23 株式会社ジャパンディスプレイ 表示装置
JP2018054736A (ja) * 2016-09-27 2018-04-05 株式会社ジャパンディスプレイ 表示装置
KR102329830B1 (ko) * 2017-01-10 2021-11-23 삼성디스플레이 주식회사 유기 발광 표시 장치
CN113823184B (zh) * 2018-03-15 2023-08-01 群创光电股份有限公司 显示面板及应用其的显示装置的组装方法
KR102555446B1 (ko) * 2018-04-26 2023-07-13 삼성디스플레이 주식회사 표시 장치
US11081660B2 (en) * 2018-05-03 2021-08-03 Samsung Display Co., Ltd. Display device and support film structure for display device
KR102677937B1 (ko) * 2018-10-11 2024-06-24 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR102558846B1 (ko) * 2018-10-31 2023-07-21 엘지디스플레이 주식회사 플렉서블 표시장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107644589A (zh) * 2016-07-22 2018-01-30 三星显示有限公司 制造显示装置的方法以及用于制造显示装置的设备
US20180180911A1 (en) * 2016-12-26 2018-06-28 Japan Display Inc. Display device
CN106898264A (zh) * 2017-03-06 2017-06-27 武汉华星光电技术有限公司 一种可折叠面板及其制作方法
CN106973520A (zh) * 2017-05-27 2017-07-21 京东方科技集团股份有限公司 一种显示面板、显示装置及显示面板的制作方法
CN108281387A (zh) * 2018-01-23 2018-07-13 武汉华星光电半导体显示技术有限公司 柔性显示装置的制作方法及柔性显示装置
CN108597378A (zh) * 2018-04-28 2018-09-28 京东方科技集团股份有限公司 一种柔性基板及其制作方法、显示装置
CN109461382A (zh) * 2018-12-03 2019-03-12 武汉华星光电半导体显示技术有限公司 可弯折面板及其制作方法

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