WO2020085440A1 - Composition de résine absorbant l'humidité, film absorbant l'humidité et procédé de production de film absorbant l'humidité - Google Patents

Composition de résine absorbant l'humidité, film absorbant l'humidité et procédé de production de film absorbant l'humidité Download PDF

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Publication number
WO2020085440A1
WO2020085440A1 PCT/JP2019/041748 JP2019041748W WO2020085440A1 WO 2020085440 A1 WO2020085440 A1 WO 2020085440A1 JP 2019041748 W JP2019041748 W JP 2019041748W WO 2020085440 A1 WO2020085440 A1 WO 2020085440A1
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Prior art keywords
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film
moisture
zeolite
mass
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PCT/JP2019/041748
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English (en)
Japanese (ja)
Inventor
周 加藤
直美 関谷
香織 角田
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共同印刷株式会社
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Priority to JP2020552594A priority Critical patent/JPWO2020085440A1/ja
Publication of WO2020085440A1 publication Critical patent/WO2020085440A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment

Definitions

  • hygroscopic films containing zeolite as a hygroscopic agent may be used.
  • a film described in Patent Document 1 is known.
  • Patent Document 2 includes a zeolite having an average particle diameter D50 of 100 nm or less, a specific oxide (excluding zeolite) having an average particle diameter D50 of 100 nm or less, a specific ester compound, and a thermoplastic resin, and a light transmittance.
  • a hygroscopic film is disclosed.
  • Patent Document 2 has extremely high transparency and is useful as a sealing film for organic EL or the like.
  • Patent Documents 3 and 4 describe methods for producing nano-sized zeolite.
  • An object of the present invention is to provide a hygroscopic resin composition useful as a packaging material, a film containing the same, and a method for producing the same.
  • ⁇ Mode 1 Zeolite having an average particle diameter D50 of 300 nm or less, The haze, which contains an ester compound and a thermoplastic resin, and is measured in a film having a thickness of 100 ⁇ m before moisture absorption according to JIS K7105 is 25% or more and 80% or less, Hygroscopic resin composition.
  • ⁇ Mode 2 The composition according to aspect 1, wherein the haze measured after moisture absorption is 10% or more lower than the haze.
  • ⁇ Mode 3 The composition according to aspect 1 or 2, wherein the average particle diameter D50 of the zeolite is more than 100 nm.
  • ⁇ Mode 4 >> 4.
  • Composition. ⁇ Mode 5 The composition according to any one of aspects 1 to 4, wherein the thermoplastic resin is a polyolefin resin.
  • ⁇ Mode 6 >> 6.
  • the melt flow rate measured according to JIS K7210 under the conditions of a temperature of 190 ° C. and a load of 21.18 N is 0.3 g / 10 min or more and 30 g / 10 min or less, and the melt flow rate is any one of Aspects 1 to 5.
  • the composition according to. ⁇ Mode 7 >> 7.
  • ⁇ Mode 8 >> 8.
  • ⁇ Aspect 9 >> A hygroscopic film comprising the composition according to any one of aspects 1 to 8.
  • ⁇ Mode 10 >> A hygroscopic laminate having the film according to Aspect 8 or 9 between an outer skin layer and an inner skin layer.
  • ⁇ Mode 11 A method for producing a moisture absorbent film, which comprises molding the composition according to any one of aspects 1 to 8 by a T-die method or an inflation method.
  • the moisture absorbent resin composition of the present invention has a mean particle size D50 of 300 nm or less of zeolite, an ester compound and a thermoplastic resin, and the haze when measured in a film having a thickness of 100 ⁇ m before moisture absorption according to JIS K7105. , 25% or more and 80% or less.
  • a conventional hygroscopic film containing zeolite as a hygroscopic agent as described in Patent Document 1 becomes transparent after moisture absorption, but is white before moisture absorption, and when used in a packaging container or the like, check the inside. Was difficult.
  • the film described in Patent Document 2 has extremely high transparency because it is used as a sealing film for organic EL or the like. Therefore, when the film described in Patent Document 2 is used in a packaging container, the contents can be confirmed due to its high transparency.
  • Patent Document 1 when the film described in Patent Document 2 is used in a packaging container or the like, it is not possible to visually determine whether or not the film has absorbed moisture.
  • the moisture-absorbing film of Patent Document 1 has a property of becoming transparent after moisture absorption, and thus it is possible to easily determine whether or not moisture has been absorbed.
  • the present inventors formed a film of the specific composition of the present invention, it is possible to confirm the inside when used for a packaging container and the like, and to determine whether or not it has absorbed moisture. I found it easy to do.
  • the resin composition of the present invention has a haze of 25% or more, 30% or more, 40% or more when measured as a film having a thickness of 100 ⁇ m before moisture absorption according to JIS K7105. It may be 50% or more, or 60% or more.
  • the haze is 80% or less, and may be 70% or less, 60% or less, or 50% or less.
  • the haze may be 25% or more and 70% or less, or 30% or more and 60% or less.
  • the film can be provided with transparency to the extent that the inside can be confirmed when used as a packaging container and the like, and opacity to the extent that the change in transparency can be seen after absorbing moisture. In particular, if the change in haze before and after moisture absorption is 10% or more, 20% or more, or 30% or more, the change in color is easily visible.
  • the resin composition of the present invention has a melt flow rate of 0.3 g / 10 min or more and 30 g / 10 min or less when measured according to JIS K7210 under the conditions of a temperature of 190 ° C. and a load of 21.18 N. preferable.
  • the melt flow rate may be 0.5 g / 10 min or more, 0.8 g / 10 min or more, 1.0 g / 10 min or more, 3.0 g / 10 min or more, or 5.0 g / 10 min or more, 20 g / 10 min Or less, or 15 g / 10 min or less, 10 g / 10 min or less, 8.0 g / 10 min or less, or 5.0 g / 10 min or less.
  • the melt flow rate may be 0.5 g / 10 min or more and 10 g / 10 min or less.
  • the resin composition of the present invention can be relatively easily formed into a film by the T-die method or the inflation method.
  • T A film cannot be formed by a die method or an inflation method, and a specific composition of a resin composition having preferable thermal characteristics for forming the film is not disclosed.
  • the zeolite contained in the resin composition of the present invention is zeolite particles having an average particle diameter D50 of 300 nm or less.
  • the pore (absorption port) diameter of zeolite may be 0.3 nm or more and 1 nm or less, and may be 0.3 nm or more and 0.5 nm or less.
  • the average particle diameter D50 of zeolite is 300 nm or less from the viewpoint of giving appropriate haze to the composition.
  • the average particle size D50 of the zeolite may be 250 nm or less, 200 nm or less, 150 nm or less, or 100 nm or less.
  • the average particle diameter D50 of the zeolite may be 10 nm or more, 30 nm or more, 50 nm or more, or 100 nm or more.
  • the average particle diameter D50 of zeolite may be 10 nm or more and 300 nm or less, or more than 100 nm and 250 nm or less.
  • the value of the atomic ratio of Si to Al in the zeolite (Si / Al) is arbitrary, and may be, for example, 1 or more, 2 or more, 3 or more, 5 or more, 10 or more, or 15 or more, and for example, 80 Hereafter, it may be 60 or less, 50 or less, 40 or less, or 30 or less.
  • the zeolite used in the present invention is preferably hydrophilic, and Na-A type zeolite is particularly preferably used.
  • the zeolite used in the present invention can be produced, for example, by the methods described in Patent Documents 3 and 4. Such a zeolite may be used by adjusting the bulk density as described in Patent Document 2.
  • Zeolite can be obtained, for example, by dispersing a raw material zeolite represented by the following formula (1) in an aqueous solution containing a silicate or aluminosilicate represented by the following formula (2) and recrystallizing the raw material zeolite.
  • B in the above formula (1) may be, for example, 2 to 60 or 20 to 80.
  • c may be, for example, 0.01 to 1.
  • the ratio d / g in the above formula (2) may be, for example, 0.003 to 0.010.
  • the ratio e / g may be, for example, 0 or 0.000003 to 0.000250.
  • the ratio f / g may be, for example, 0.0001 to 0.0160 or 0.006 to 0.025.
  • the raw material zeolite of the above formula (1) for example, NaSiAlO 4 , NaSi 12 AlO 26 , NH 4 Si 19 AlO 40, etc. can be used.
  • the zeolite obtained as described above may be subjected to ion exchange, pulverization, or both, and then used.
  • the content of zeolite in the resin composition of the present invention is not particularly limited as long as the advantageous effects of the present invention can be provided.
  • the content of zeolite may be 5 mass% or more, 10 mass% or more, 20 mass% or more, 30 mass% or more, 40 mass% or more, or 50 mass% or more, 70 mass% or less, 60 It may be less than or equal to 50% by weight, less than or equal to 50% by weight, or less than or equal to 40% by weight.
  • the content of zeolite may be 20% by mass or more and 60% by mass or less, or 30% by mass or more and 50% by mass or less.
  • the resin composition of the present invention comprises one or more elements selected from Al, Si, Ti, and Zr having an average particle diameter D50 of 100 nm or less as used in the invention described in Patent Document 2. It is not necessary to include oxides (excluding zeolite).
  • the resin composition of the present invention does not contain such an oxide, it is not necessary to consider the mixed state of the zeolite and the oxide, the dispersed state of the oxide, etc., so that it can be easily produced, The cost can also be reduced.
  • the resin composition of the present invention contains an ester compound.
  • an ester compound a compound used as an emulsifying agent or the like can be used, and the zeolite used in the present invention and the thermoplastic resin can be mixed.
  • an ester compound having an HLB value of 5 or less may be used.
  • the HLB value is an index indicating hydrophilicity or lipophilicity.
  • the HLB value of the ester compound being 5 or less means that the ester compound has a high lipophilicity, and is, for example, a numerical value in a range used as an antifoaming agent or an emulsifier of an emulsion.
  • the HLB value of the ester compound may be 5 or more as long as the advantageous effects of the present invention are obtained, and for example, the HLB value of the ester compound is 8.0 or less, 6.0 or less, 5. It may be 0 or less, 4.5 or less, 4.0 or less, or 3.5 or less, and may be 2.0 or more, 2.5 or more, or 3.0 or more.
  • the HLB value of the ester compound may be 2.0 or more and 5.0 or less, or 2.5 or more and 4.5 or less.
  • the ester compound is, for example, a monoester compound of a polyhydric alcohol and a fatty acid.
  • the polyhydric alcohol may be, for example, glycerin, alkylene glycol or the like.
  • the fatty acid may be, for example, a saturated or unsaturated fatty acid having 12 to 24 carbon atoms.
  • the ester compound may be a monoester of an alkylene glycol having 2 to 6 carbon atoms and a fatty acid having 15 to 24 carbon atoms.
  • the alkylene glycol may be, for example, ethylene glycol, propylene glycol, diethylene glycol or the like.
  • the above-mentioned fatty acids having 15 to 24 carbon atoms may be saturated or unsaturated, and may be, for example, stearic acid, behenic acid and the like.
  • the ester compound may be, for example, propylene glycol monostearate, propylene glycol monobehenate, or the like.
  • the content of the ester compound in the resin composition of the present invention is not particularly limited as long as the advantageous effects of the present invention can be provided.
  • the content of the ester compound is 2.0% by mass or more and 15% by mass or less, and may be 2.5% by mass or more, 3.0% by mass or more, or 5.0% by mass or more. It may be less than or equal to 10% by weight, less than or equal to 10% by weight, less than or equal to 8.0% by weight, or less than or equal to 6.0% by weight.
  • the content of the ester compound may be 2.5% by mass or more and 12% by mass or less, or 3.0% by mass or more and 10% by mass or less.
  • the resin composition of the present invention contains a thermoplastic resin, particularly a thermoplastic resin containing ethylene units.
  • the resin composition of the present invention is preferably a thermoplastic resin containing a polar group such as a carboxylic acid group or a carboxylic acid ester group and an ethylene unit.
  • thermoplastic resin examples include a polyolefin resin
  • examples of the polyolefin resin include a polyethylene resin, a polypropylene resin, and a copolymer of ethylene and an oxygen-containing ethylenically unsaturated monomer.
  • examples of the copolymer of ethylene and an oxygen-containing ethylenically unsaturated monomer include EVOH (ethylene-vinyl alcohol copolymer) and the like.
  • the polyethylene-based resin includes a repeating unit of an ethylene group in a main chain of a polymer, including 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, 70 mol% or more, or 80 mol% or more.
  • Resins such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), ethylene-acrylic acid copolymer (EAA), ethylene- Methacrylic acid copolymer (EMAA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-methyl acrylate copolymer (EMA), ethylene-vinyl acetate copolymer ( EVA), carboxylic acid modified polyethylene, cal Phosphate-modified ethylene vinyl acetate copolymer, ionomer, and their derivatives, and selected from the group consisting of mixtures.
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • MDPE medium density polyethylene
  • HDPE high density polyethylene
  • EAA ethylene-acrylic acid copolymer
  • EMMA ethylene-methyl methacrylate copolymer
  • EMMA
  • a polypropylene-based resin is a resin containing a repeating unit of a propylene group in the main chain of a polymer, which is 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, 70 mol% or more, or 80 mol% or more.
  • PP polypropylene
  • random PP random polypropylene
  • block PP block polypropylene
  • chlorinated polypropylene carboxylic acid modified polypropylene, and derivatives thereof, and mixtures thereof.
  • ethylene-vinyl acetate copolymer can be mentioned among these.
  • the vinyl acetate content in the ethylene-vinyl acetate copolymer may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, or 30% by mass or more, and 60% by mass or less, 55% by mass. % Or less, 50% by mass or less, 45% by mass or less, or 40% by mass or less.
  • the vinyl acetate content in the ethylene-vinyl acetate copolymer may be, for example, 5% by mass or more and 50% by mass or less, or 20% by mass or more and 40% by mass or less.
  • the content of the thermoplastic resin in the resin composition of the present invention may be 30% by mass or more, 40% by mass or more, 50% by mass or more, 60% by mass or more, or 70% by mass or more, and 80% by mass or less. , 70 mass% or less, 60 mass% or less, or 50 mass% or less.
  • the content of the thermoplastic resin may be 30% by mass or more and 80% by mass or less, or 40% by mass or more and 70% by mass or less.
  • the resin composition of the present invention contains, in addition to the above-mentioned components, if necessary, a lubricant, an antistatic agent, a release agent, a plasticizer, an antioxidant, an antibacterial agent, an antifungal agent, an ultraviolet absorber. Can further contain optional additives such as.
  • the moisture absorbent film of the present invention contains or consists of the above moisture absorbent resin composition.
  • the thickness of the film of the present invention may be 10 ⁇ m or more, 20 ⁇ m or more, 30 ⁇ m or more, or 40 ⁇ m or more, and may be 300 ⁇ m or less, 200 ⁇ m or less, 100 ⁇ m or less, 90 ⁇ m or less, 80 ⁇ m or less, 70 ⁇ m or less, or 60 ⁇ m or less.
  • the film of the present invention may have a thickness of 10 ⁇ m or more and 300 ⁇ m or less, or 20 ⁇ m or more and 100 ⁇ m or less.
  • the moisture absorbent laminate of the present invention can be obtained by laminating the above moisture absorbent film with another film, for example, a skin layer.
  • the laminate of the present invention may be a laminate of the above-mentioned film and a normal film used as a packaging material.
  • the moisture absorbent laminate of the present invention may include the moisture absorbent film described above and a transparent barrier film (for example, a PET film obtained by vapor deposition of silica, alumina, or the like, a polyamide film, or the like).
  • a transparent barrier film for example, a PET film obtained by vapor deposition of silica, alumina, or the like, a polyamide film, or the like.
  • the laminate of the present invention may have a skin layer on at least one surface of the film, for example, an outer skin layer and an inner skin layer on both surfaces thereof.
  • the skin layer improves the film formation stability of the film of the present invention, imparts surface smoothness, prevents the zeolite in the film from falling off, prevents the zeolite from being directly exposed to the outside, and mechanically when used as a packaging container. It has at least one function of improving strength (for example, tensile strength) and improving heat seal strength with other films or laminates.
  • the resin forming the skin layer a resin generally used for films can be used.
  • the resins constituting the respective skin layers may be the same or different.
  • resin constituting the skin layer for example, polystyrene resin, polyester resin, acrylic resin, polyamide resin, polyvinyl alcohol resin, polyurethane resin, polyolefin resin, polycarbonate resin, polysulfone resin, and derivatives thereof, And mixtures thereof.
  • the thickness of the skin layer can be 1 ⁇ m or more, 3 ⁇ m or more, 5 ⁇ m or more, or 7 ⁇ m or more, and can be 50 ⁇ m or less, 40 ⁇ m or less, 30 ⁇ m or less, 20 ⁇ m or less, or 15 ⁇ m or less per one surface.
  • the thickness of these skin layers may be the same or different.
  • the method for forming the moisture-absorbing film or the laminate is not particularly limited, and examples thereof include a single-layer or multi-layer inflation method, a T-die method, a casting method, etc., and the T-die method or the inflation method is particularly preferable.
  • a pellet-shaped moisture-absorbent resin composition (masterbatch) should be prepared by extruding a mixture of the materials contained in the moisture-absorbent resin composition in a pellet form and cooling the mixture. You can Alternatively, the materials contained in the hygroscopic resin composition may be kneaded to form a film as it is.
  • the kneading can be performed using, for example, a batch kneader such as a kneader, a Banbury mixer, a Henschel mixer, a mixing roll, or a continuous kneader such as a twin-screw kneader.
  • a kneading temperature of 60 ° C. or higher, 80 ° C. or higher, 100 ° C. or higher, or 120 ° C. or higher and 170 ° C. or lower, 150 ° C. or lower, or 130 ° C. or lower, 0.5. Kneading can be performed for a kneading time of not less than 30 minutes and not more than 30 minutes.
  • the moisture-absorbing film of the present invention is obtained by kneading the materials contained in the moisture-absorbent resin composition described above, for example, with a biaxial kneading extruder or the like, and as it is, 100 ° C or higher, 120 ° C or higher, 130 ° C or higher, 135 ° C or higher, 140 ° C or higher. Or 150 ° C. or more, 250 ° C. or less, 220 ° C. or less, or less than 200 ° C., to form moisture absorption by molding by an inflation molding method or a T-die method.
  • the masterbatch can be prepared as described above, reheated, and manufactured by an inflation molding method, a T-die method, or the like.
  • a skin layer made of, for example, an olefin resin may be coextruded on both sides of the moisture absorption film, or a film to be the skin layer may be laminated by thermocompression bonding to form a moisture absorption laminate.
  • thermoplastic resin Na-A type zeolite, and ester compound (propylene glycol monobehenate, HLB value 3.4) were melt-kneaded at 160 ° C. for 10 minutes using a Banbury mixer with the composition shown in Table 1, The resin composition of each example was obtained.
  • ⁇ Haze> The resin composition was cut into a predetermined weight, and a film having a thickness of 100 ⁇ m was produced by hot press molding.
  • the press conditions were a temperature of 160 ° C. and a pressure of 40 to 60 MPa for 2 minutes.
  • the film thus obtained was cut into a 50 mm square, and the haze was measured according to JIS K7105 using a haze measuring instrument (Murakami Color Research Laboratory, HR-100).
  • the film was left to stand in an environment of 23 ° C. and 50%, allowed to absorb moisture until the weight change after moisture absorption became constant, and then measured by the same method as above.
  • Table 1 shows the constitution and evaluation result of each example.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

Cette composition de résine absorbant l'humidité comprend une zéolite qui a une taille moyenne de particule D50 inférieure ou égale à 300 nm, un composé ester et une résine thermoplastique. Le trouble de la composition de résine absorbant l'humidité tel que mesuré pour un film qui est épais de 100 µm conformément avec une pré-absorption d'humidité JIS K7105 est de 25% à 80%.
PCT/JP2019/041748 2018-10-26 2019-10-24 Composition de résine absorbant l'humidité, film absorbant l'humidité et procédé de production de film absorbant l'humidité WO2020085440A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020552594A JPWO2020085440A1 (ja) 2018-10-26 2019-10-24 吸湿樹脂組成物、並びに吸湿フィルム及びその製造方法

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JP2018-201847 2018-10-26
JP2018201847 2018-10-26

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WO2020085440A1 true WO2020085440A1 (fr) 2020-04-30

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0333162A (ja) * 1989-06-30 1991-02-13 Mizusawa Ind Chem Ltd 樹脂用配合剤組成物
JP2009029964A (ja) * 2007-07-27 2009-02-12 Riken Technos Corp 吸水性を有するフィルム
JP2010116436A (ja) * 2008-11-11 2010-05-27 Toyo Seikan Kaisha Ltd 吸水性樹脂組成物
WO2015022896A1 (fr) * 2013-08-12 2015-02-19 共同印刷株式会社 Composition d'adsorbant, film contenant un adsorbant et son procédé de production
JP2018100390A (ja) * 2016-12-20 2018-06-28 共同印刷株式会社 光透過性吸湿フィルム及びその製造方法
WO2019151142A1 (fr) * 2018-01-31 2019-08-08 日本ゼオン株式会社 Composition de résine, film de résine, et dispositif électroluminescent organique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0333162A (ja) * 1989-06-30 1991-02-13 Mizusawa Ind Chem Ltd 樹脂用配合剤組成物
JP2009029964A (ja) * 2007-07-27 2009-02-12 Riken Technos Corp 吸水性を有するフィルム
JP2010116436A (ja) * 2008-11-11 2010-05-27 Toyo Seikan Kaisha Ltd 吸水性樹脂組成物
WO2015022896A1 (fr) * 2013-08-12 2015-02-19 共同印刷株式会社 Composition d'adsorbant, film contenant un adsorbant et son procédé de production
JP2018100390A (ja) * 2016-12-20 2018-06-28 共同印刷株式会社 光透過性吸湿フィルム及びその製造方法
WO2019151142A1 (fr) * 2018-01-31 2019-08-08 日本ゼオン株式会社 Composition de résine, film de résine, et dispositif électroluminescent organique

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