WO2020077699A1 - 显示面板及其封装方法及电子设备 - Google Patents

显示面板及其封装方法及电子设备 Download PDF

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Publication number
WO2020077699A1
WO2020077699A1 PCT/CN2018/113935 CN2018113935W WO2020077699A1 WO 2020077699 A1 WO2020077699 A1 WO 2020077699A1 CN 2018113935 W CN2018113935 W CN 2018113935W WO 2020077699 A1 WO2020077699 A1 WO 2020077699A1
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Prior art keywords
layer
tft
organic
inorganic
water
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English (en)
French (fr)
Inventor
朱三
金东焕
蔡丰豪
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/323,563 priority Critical patent/US20200144537A1/en
Publication of WO2020077699A1 publication Critical patent/WO2020077699A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the invention relates to the field of displays, in particular to a display panel and its packaging method and an electronic device.
  • Organic light-emitting diode also known as organic electro-laser display, organic light-emitting semiconductor, OLED display technology has the advantages of self-luminescence, wide viewing angle, almost infinitely high contrast, low power consumption, extremely high response speed, etc. .
  • the OLED display is a display made of organic electroluminescent diodes. With self-luminous organic electro-active photodiodes at the same time, no backlight, high contrast, thin thickness, wide viewing angle, fast response speed, can be used in flexible panels, wide temperature range, simple structure and manufacturing process , Is considered to be the next generation of flat panel display emerging application technology.
  • OLED can be fabricated on a flexible substrate to achieve flexible display, so it is recognized as the next generation of lighting and display technology with the most development potential.
  • LCD display technology the light-emitting materials used in OLED displays are extremely sensitive to water and oxygen, resulting in a shortened service life.
  • the packaging structure is required to have a good barrier to water and oxygen; on the other hand, the packaging structure is required to be flexible and bendable. This makes the traditional rigid packaging structure unable to meet the requirements, and the thin film packaging technology that can better adapt to the development of OLED technology has emerged.
  • inorganic thin film layer has a good barrier to water vapor and oxygen, but its film forming property and flatness are not good.
  • Commonly used inorganic thin film materials are transparent oxide thin film materials (alumina, silicon oxide, zirconium oxide, etc.), nitride Silicon series, etc.
  • the organic polymer layer has good film forming, uniformity and surface flatness, and has the function of significantly improving the film stress and covering the particles.
  • organic polymer film materials are acrylic polymers and epoxy
  • inorganic and organic thin films are alternately formed and stacked to form a complementary water vapor and oxygen isolation unit, which can form a composite protective layer that is good for OLED luminescent materials.
  • the organic layer polymer has a poor barrier to water vapor and oxygen. Therefore, in the actual design process, the organic layer must not be in contact with air. In the current conventional design, it is necessary to ensure that the inorganic film layer covers the organic film layer. During the leveling process, the polymer must also be leveled to form a film within the specified local area.
  • a glue frame layer (Dam) is usually prepared on the periphery of the organic layer to play a role of "water blocking", so that the polymer forms a film in the designated area to ensure the accuracy of the layer film.
  • the current glue frame layer is formed by using organic materials such as photosensitive polyimide.
  • organic polymers tend to have poor barrier properties to water and oxygen, so that water and oxygen may enter the interior of the substrate through the glue frame layer, resulting in package failure. Therefore, designing a new type of display panel has become an urgent problem to be solved in thin film packaging.
  • the invention provides a display panel, comprising: a substrate; a TFT layer, which is provided on one side surface of the substrate; a light-emitting layer, which is provided on one side surface of the TFT layer away from the substrate; and a glue frame layer , Provided on the surface of the TFT layer away from the substrate, the glue frame layer is ring-shaped, surrounding the light-emitting layer; a first inorganic layer covering the light-emitting layer, the glue frame layer and the A TFT layer between the light-emitting layer and the glue frame layer; an organic layer disposed on a surface of the first inorganic layer away from the substrate and surrounded by the glue frame layer; and a second inorganic Layer covering the organic layer, the first inorganic layer and the TFT layer outside the first inorganic layer; wherein the material of the glue frame layer includes an organic photosensitive material; more than two are provided in the glue frame layer Water-absorbing particles, the water-absorbing particles are evenly distributed in the organic photosensitive material.
  • the TFT layer includes a TFT device; and / or, the light-emitting layer includes an OLED device; and / or, the first inorganic layer and the second inorganic layer include silicon oxide and silicon nitride And at least one of aluminum oxide; and / or, the organic layer includes at least one of silicone resin and acrylic resin.
  • the thickness of the first inorganic layer and the second inorganic layer is 0.3um ⁇ 3um; the thickness of the organic layer is 2um ⁇ 15um.
  • the materials of the water-absorbing particles include polyacrylics, polyacrylamides, polyacrylonitriles, polyvinyl alcohols, polyvinylates, polyoxyethylenes, or derivatives of any of these materials One or more.
  • the present invention also provides an electronic device, including the display panel described above.
  • the present invention also provides a display panel packaging method, including the following steps: S1 plastic frame material preparation step, preparing a plastic frame film liquid containing water-absorbing particles; S2 In the preparation step of the TFT layer, a TFT layer is provided on the upper surface of a substrate to form a TFT substrate; in the preparation step of the S3 light emitting layer, a light emitting device is provided on the upper surface of the TFT layer to form a light emitting layer; in the preparation step of the S4 glue frame layer, the The glue frame film liquid is coated on the upper surface of the TFT layer to form a glue frame layer surrounding the light emitting layer; S5 first inorganic layer preparation step, a first inorganic layer is prepared on the upper surface of the TFT layer, Covering the light emitting layer, the glue frame layer, and the TFT layer between the light emitting layer and the glue frame layer; S6 organic layer preparation step, preparing an organic layer on the upper surface of the first inorganic layer, The organic layer is surrounded by the glue
  • the step of preparing the sealant material specifically includes the following steps: S11 main material selection step, providing a liquid organic photosensitive material; S12 particle addition step, adding more than two water-absorbing particles to the organic photosensitive material; In step S13, the organic photosensitive material is stirred, so that the water-absorbing particles are evenly distributed in the organic photosensitive material; and in step S14, a frame glue film liquid is obtained.
  • the mass percentage of the water-absorbing particles in the plastic frame membrane liquid is 0-50%.
  • the step of preparing the sealant layer specifically includes the following steps: S41 coating positioning step, finding and confirming the preset coating position corresponding to the peripheral area of the light emitting layer on the upper surface of the TFT layer; S42 film liquid coating Step, apply the sealant film liquid to the preset coating position; S43 development step, perform exposure development processing on the sealant film liquid; and S44 sealant layer generation step, generate an annular frame
  • S41 coating positioning step finding and confirming the preset coating position corresponding to the peripheral area of the light emitting layer on the upper surface of the TFT layer
  • S42 film liquid coating Step apply the sealant film liquid to the preset coating position
  • S43 development step perform exposure development processing on the sealant film liquid
  • S44 sealant layer generation step generate an annular frame
  • the glue layer surrounds the light-emitting layer.
  • the technical effect of the present invention is that water absorbing particles are added to the prior art rubber frame layer, so that water and oxygen are absorbed by the water absorbing particles when the rubber frame layer enters the rubber frame layer or the water and oxygen permeation path becomes longer, thereby making it difficult for water and oxygen to enter and improve
  • the effect of water and oxygen penetration improves the packaging effect and enhances the practicality, thereby extending the service life of electronic equipment.
  • FIG. 1 is a schematic diagram of a display panel according to an embodiment of the invention.
  • FIG. 2 is a flowchart of a method for packaging a display panel according to an embodiment of the invention
  • FIG. 3 is a flowchart of steps for preparing a plastic frame material according to an embodiment of the present invention
  • FIG. 4 is a flowchart of steps for setting a rubber frame layer according to an embodiment of the present invention.
  • Plastic frame layer 41, water-absorbing particles; 42, organic photosensitive material;
  • the component When certain components are described as “on” another component, the component may be placed directly on the other component; there may also be an intermediate component, which is placed on the intermediate component , And the intermediate component is placed on another component.
  • the two When a component is described as “installed to”, “connected to” or “connected to” another component, the two can be understood to be “installed”, “connected” or “connected” directly, or a component through an intermediate component “Install to”, “Connect to” or “Connect to” another component.
  • this embodiment provides a display panel, including: a substrate 1, a TFT layer 2, a light emitting layer 3, a glue frame layer 4 (Dam), a first inorganic layer 5, an organic layer 6, and a second inorganic layer 7.
  • a display panel including: a substrate 1, a TFT layer 2, a light emitting layer 3, a glue frame layer 4 (Dam), a first inorganic layer 5, an organic layer 6, and a second inorganic layer 7.
  • the TFT layer 2 is provided on the upper surface of the substrate 1; the light emitting layer 3 is provided on the upper surface of the TFT layer 2; the glue frame layer 4 is provided above the TFT layer 2 with a gap between the light emitting layer 3; the first inorganic layer 5 covers Above the glue frame layer 4, the light emitting layer 3 and the gap between the glue frame layer 4 and the light emitting layer 3; the organic layer 6 is provided above the light emitting layer 3 and is surrounded by the glue frame layer 4; the second inorganic layer 7 is covered Above the first inorganic layer 5, the organic layer 6, and the TFT layer 2 outside the first inorganic layer 5.
  • the material of the glue frame layer 4 includes an organic photosensitive material 42. More than two water-absorbing particles 41 are provided inside the glue frame layer 4, and the water-absorbing particles 41 are evenly distributed in the organic photosensitive material.
  • the TFT layer 2 may include a TFT device; and / or, the light emitting layer 3 includes an OLED device; and / or, the first inorganic layer 5 and the second inorganic layer 7 include silicon oxide, silicon nitride, and aluminum oxide And / or, the organic layer 6 includes at least one of silicone resin and polymethyl methacrylate.
  • the thickness of the first inorganic layer 5 and the second inorganic layer 7 is 0.3um ⁇ 3um; the thickness of the organic layer 6 is 2um ⁇ 15um.
  • the inorganic layer has a good barrier to water vapor and oxygen, but its shortcomings are poor film formation and flatness, so it is covered above the rubber frame layer 4 to block water and oxygen.
  • the materials of the water-absorbing particles 41 include: polyacrylics, polyacrylamides, polyacrylonitriles, polyvinyl alcohols, polyvinylates, polyoxyethylenes, or one of the derivatives of any one of them or Multiple.
  • the material of the organic photosensitive material 42 includes organic materials such as photosensitive polyimide.
  • the organic layer 6 has good film formation, uniformity and surface flatness, and has the function of significantly improving the film layer stress and covering particles, covering the first inorganic layer 5 and the second inorganic layer 7 below ,
  • the entire outer surface of the organic layer 6 is completely covered by the rubber frame layer 4, the first inorganic layer 5 and the second inorganic layer 7, completely not in contact with the air, isolated from water and oxygen, to improve the film forming property of the first inorganic layer 5
  • an inorganic layer and an organic layer are alternately formed into a film stack, using their respective advantages to block water and oxygen to form a composite protective layer of OLED luminescent materials to improve the packaging effect and extend The service life of OLED devices.
  • this embodiment also provides a display panel packaging method, which specifically includes the following steps S1 to S6.
  • S1 glue frame material preparation step preparing a glue frame film liquid containing water-absorbing particles
  • S2 TFT layer preparation step providing a TFT layer 2 on the upper surface of the substrate 1 to form a TFT substrate
  • S3 light emitting layer preparation step in the TFT layer 2
  • a light emitting device is provided on the upper surface to form a light emitting layer 3
  • S4 glue frame layer preparation step the glue frame film is applied on the upper surface of the TFT layer 2 to form a glue frame layer 4 surrounding the light emitting layer 4
  • S5 first In the inorganic layer preparation step a first inorganic layer 5 is prepared on the upper surface of the TFT layer 2, covering the light-emitting layer 4, the glue frame layer 4 and the TFT layer 2 between the light-emitting layer 4 and the glue frame layer 4
  • S6 organic layer preparation step in An organic layer 6 is prepared on the upper surface of the first inorganic layer 5, and the organic layer 6 is surrounded by the glue frame layer 4
  • the preparation step of the sealant material specifically includes the following steps: S11 main material selection step, providing a liquid organic photosensitive material 42; S12 particle addition step, adding more than two water-absorbing particles 41 to the organic photosensitive 42 in the material; S13 stirring step, the organic photosensitive material 42 is stirred, so that the water-absorbing particles 41 are evenly distributed in the organic photosensitive material 42; and S14 film liquid generation step to obtain a frame glue film liquid.
  • the mass percentage of the water-absorbing particles 41 in the film liquid for the glue frame layer is 0-50%. In this embodiment, the mass percentage of the water-absorbing particles 41 in the film liquid for the glue frame layer is 5% for preparation .
  • the preparation step of the sealant layer specifically includes the following steps: S41 coating positioning step, find and confirm the preset coating position corresponding to the peripheral area of the light emitting layer 3 on the upper surface of the TFT layer 2; S42 film liquid coating Step of spreading, applying the sealant film liquid to the preset coating position; developing step S43, performing exposure and development treatment on the sealant film liquid; and step S44 generating a sealant layer, generating an annular 4 layers of frame glue, surrounding the light-emitting layer 3.
  • the materials of the water-absorbing particles 41 include: polyacrylics, polyacrylamides, polyacrylonitriles, polyvinyl alcohols, polyvinylates, polyoxyethylenes, or one of the derivatives of any one of them or Multiple.
  • the material of the organic photosensitive material 42 includes organic materials such as photosensitive polyimide.
  • the inorganic layer has a good barrier to water vapor and oxygen, but its shortcomings are poor film formation and flatness, so it is covered above the rubber frame layer 4 to block water and oxygen.
  • the materials of the first inorganic layer 5 and the second inorganic layer 7 include: transparent oxide thin film materials (alumina, silicon oxide, zirconium oxide, etc.), silicon nitride series, and the like.
  • the thickness of the prepared first inorganic layer 5 and the second inorganic layer 7 is 0.3um ⁇ 3um; the thickness of the prepared organic layer 6 is 2um ⁇ 15um.
  • the organic layer 6 has good film formation, uniformity and surface flatness, and has the function of significantly improving the film layer stress and covering particles, covering the first inorganic layer 5 and the second inorganic layer 7 below , Not in contact with air at all, to isolate water and oxygen, to improve the technical problems of the first inorganic layer 5 film formation and poor flatness, in this embodiment, the inorganic layer and the organic layer are alternately formed into a film stack, using their respective The utility model has the advantages of blocking water and oxygen, forming a composite protective layer of OLED luminescent materials, improving the packaging effect, and prolonging the service life of OLED devices.
  • the technical effect is that water-absorbing particles are added to the plastic frame layer, so that water and oxygen are absorbed by the water-absorbing particles when the plastic frame layer enters the plastic frame layer, or the water and oxygen permeation path becomes longer, thereby making the water oxygen It is difficult to enter the organic layer, enhance the waterproof oxygen penetration effect, improve the packaging effect, simple operation, low cost and strong practicability.
  • this embodiment can also provide an electronic device, including the display panel described above, the electronic device can be used to display text, pictures, images and other data, and can be used as an interface between the electronic device and the user.
  • the technical effect of the electronic device described in this embodiment is that water-absorbing particles are added to the plastic frame layer at the edge of the display panel of the electronic device to effectively prevent water and oxygen from penetrating into the organic layer of the display panel, thereby effectively extending the display panel and the electronic The service life of the equipment.
  • the technical effect of the present invention is that water-absorbing particles are added to the prior art rubber frame layer, so that water and oxygen are absorbed by the water-absorbing particles when the rubber frame layer enters the rubber frame layer or the water and oxygen penetration paths become longer, thereby making it difficult for water and oxygen to enter the organic layer , Improve the water and oxygen penetration effect, improve the packaging effect, and enhance the practicality, thereby extending the service life of electronic equipment.

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  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
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Abstract

本发明提供一种显示面板及其封装方法及电子设备，所述电子设备包括显示面板，所述显示面板包括一基板、一TFT层、一发光层、一胶框层、一第一无机层、一有机层以及一第二无机层，所述胶框层材质包括有机光敏材料；所述胶框层内设有两个以上吸水颗粒，所述吸水颗粒均匀分布于所述有机光敏材料中。所述显示面板的封装方法包括胶框材料制备步骤、TFT层制备步骤、发光层制备步骤、胶框层制备步骤、第一无机层制备步骤、有机层制备步骤以及第二无机层制备步骤.。本发明的技术效果在于，在现有技术的胶框层中加入了吸水颗粒，使得水氧进入胶框层时被吸水颗粒所吸收或者水氧渗透路径变长，改善水氧渗透效果，提高封装效果，进而延长电子设备的使用寿命。

Description

显示面板及其封装方法及电子设备 技术领域
本发明涉及显示器领域，特别涉及一种显示面板及其封装方法及一种电子设备。
 背景技术
有机发光二极管（Organic Light-Emitting Diode，OLED）又称有机电激光显示、有机发光半导体，OLED显示技术具有自发光、广视角、几乎无穷高的对比度、较低耗电、极高反应速度等优点。OLED显示屏是利用有机电致发光二极管制成的显示屏。由于同时具备自发光有机电激发光二极管，不需背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、使用温度范围广、构造及制程较简单等优异之特性，被认为是下一代的平面显示器新兴应用技术。
OLED可以制作在柔性衬底上，实现柔性显示，因此被公认为是最具有发展潜力的下一代照明及显示技术。与LCD显示技术相比，OLED显示中所使用的发光材料对水氧极为敏感，导致其使用寿命缩短。
为了更好地发展柔性OLED显示技术，针对性地提出了柔性OLED的封装要求：一方面要求封装结构对水氧气具有很好的阻隔性；另一方面要求封装结构具有柔性可弯曲的特性。这就使得传统的刚性封装结构无法满足要求，而能更好的适应OLED技术发展的薄膜封装技术应运而生。
目前，成熟的薄膜封装结构由无机薄膜和有机聚合物薄膜交替沉积形成。其中无机薄膜层对水汽和氧气具有很好阻隔作用，但其成膜性和平整度欠佳，常用的无机薄膜材料有透明氧化物薄膜材料（氧化铝、氧化硅、氧化锆等）、氮化硅系列等。而有机聚合物层具有很好的成膜性、均匀性和表面平整度，具有明显改善膜层应力、覆盖颗粒物（Particle）的作用，常用的有机聚合物薄膜材料有丙烯酸类聚合物、环氧类聚合物，让无机薄膜和有机薄膜交替成膜堆叠形成一个互补的水汽和氧气隔离单元，从而可以形成对OLED发光材料很好的复合保护层。然而有机层聚合物对水汽和氧气的阻隔效果欠佳，因此在实际设计过程中，必须保证有机层不可与空气接触，目前常规设计，需保证无机膜层覆盖有机膜层，同时有机聚合物在流平过程中，也必须使聚合物在指定局域内流平成膜。但实际情况由于成膜基板的表面及有机聚合物表面能均一性不可控，导致聚合物在流平过程，无法很好的在制定区域流平。为了达到指定区域流平，通常在有机层外围制备一胶框层（Dam），起到“挡水”的作用，使得聚合物在指定区域成膜，保证层膜精度。
目前的胶框层通过采用光敏型聚酰亚胺等有机物制备形成。通常的，有机聚合物往往对水氧的阻隔性能较差，从而使水氧可能经过胶框层进入基板内部，从而造成封装失效。因此一种设计一种新型显示面板成为薄膜封装亟待解决的难题。
 技术问题
现有技术中存在胶框层对水氧的阻隔性能较差水氧容易经过胶框层进入基板内部从而导致封装失败，电子设备的使用寿命较短等技术问题。
 技术解决方案
本发明提供一种显示面板，包括：一基板；一TFT层，设于所述基板的一侧表面；一发光层，设于所述TFT层远离所述基板的一侧表面；一胶框层，设于所述TFT层远离所述基板的一侧表面，所述胶框层为环状，围绕所述发光层；一第一无机层，覆盖所述发光层、所述胶框层以及所述发光层与所述胶框层之间的TFT层；一有机层，设于所述第一无机层远离所述基板的一侧表面，且被所述胶框层围绕；以及一第二无机层，覆盖所述有机层、所述第一无机层以及所述第一无机层外部的TFT层；其中，所述胶框层材质包括有机光敏材料；所述胶框层内设有两个以上吸水颗粒，所述吸水颗粒均匀分布于所述有机光敏材料中。
进一步地，所述发光层于所述胶框层之间存在间隙；所述第一无机层对应所述间隙位置的部分，其一侧贴附于所述TFT层，其另一侧贴附于所述有机层的第一侧面；以及所述第二无机层对应所述间隙位置的部分，其一侧贴附于所述有机层的第二侧面，另一侧形成一沟槽。
进一步地，所述TFT层包括TFT器件；和/或，所述发光层包括OLED器件；和/或，所述第一无机层、所述第二无机层包括硅的氧化物、硅的氮化物及铝的氧化物中的至少一种；和/或，所述有机层包括硅树脂及丙烯酸树脂中的至少一种。
进一步地，所述第一无机层、所述第二无机层的厚度为0.3um~3um；所述有机层的厚度为2um~15um。
进一步地，所述吸水颗粒的材质包括聚丙烯酸类、聚丙烯酰胺类、聚丙烯腈类、聚乙烯醇类、聚乙烯酸盐类、聚氧乙烯类或其中任一种材质的衍生物中的一种或多种。
为实现上述目的，本发明还提供一种电子设备，包括前文所述的显示面板。
为实现上述目的，本发明还提供一种显示面板的封装方法，包括如下步骤：S1 胶框材料制备步骤，制备一种含有吸水颗粒的胶框膜液；S2 TFT层制备步骤，在一基板上表面设置一TFT层，形成一TFT基板；S3发光层制备步骤，在所述TFT层上表面设置发光器件，形成一发光层；S4 胶框层制备步骤，将所述胶框膜液涂布于所述TFT层上表面，形成围绕所述发光层的一胶框层；S5 第一无机层制备步骤，在所述TFT层上表面制备一第一无机层，覆盖所述发光层、所述胶框层以及所述发光层与所述胶框层之间的TFT层；S6 有机层制备步骤，在所述第一无机层上表面制备一有机层，所述有机层被所述胶框层围绕；以及S7 第二无机层制备步骤，在所述TFT层上表面制备一第二无机层，覆盖所述有机层、所述第一无机层的一部分及所述第一无机层外部的TFT层。
进一步地，所述框胶材料制备步骤具体包括如下步骤：S11主材选取步骤，提供一种液态的有机光敏材料；S12颗粒添加步骤，将两个以上吸水颗粒加入至所述有机光敏材料中；S13搅拌步骤，对所述有机光敏材料进行搅拌处理，使得所述吸水颗粒均匀分布于所述有机光敏材料中；以及S14膜液生成步骤，获得一框胶膜液。
进一步地，所述吸水颗粒在所述胶框膜液中的质量百分数为0~50%。
进一步地，所述框胶层制备步骤具体包括如下步骤：S41涂布定位步骤，在所述TFT层上表面找到并确认对应所述发光层外围区域的预设涂布位置；S42膜液涂布步骤，将所述框胶膜液涂布于所述预设涂布位置；S43显影步骤，对所述框胶膜液进行曝光显影处理；以及S44框胶层生成步骤，生成一环状的框胶层，围绕所述发光层。
 有益效果
本发明的技术效果在于，在现有技术的胶框层中加入了吸水颗粒，使得水氧进入胶框层时被吸水颗粒所吸收或者水氧渗透路径变长，从而使得水氧难以进入，改善水氧渗透效果，提高封装效果，实用性增强，进而延长电子设备的使用寿命。
 附图说明
图1为本发明实施例所述的显示面板的示意图；
图2为本发明实施例所述的显示面板的封装方法的流程图；
图3为本发明实施例所述的胶框材料制备步骤的流程图；
图4为本发明实施例所述的胶框层设置步骤的流程图。
部分组件标识如下：
1、基板；
2、TFT层；
3、发光层；
4、胶框层；41、吸水颗粒；42、有机光敏材料；
5、第一无机层；
6、有机层；61、第一侧面；62、第二侧面；
7、第二无机层；
8、沟槽。
 本发明的最佳实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
当某些组件，被描述为“在”另一组件“上”时，所述组件可以直接置于所述另一组件上；也可以存在一中间组件，所述组件置于所述中间组件上，且所述中间组件置于另一组件上。当一个组件被描述为“安装至”、“连接至”或“连通至”另一组件时，二者可以理解为直接“安装”、“连接”或“连通”，或者一个组件通过一中间组件“安装至”、“连接至”或“连通至”另一个组件。
如图1所示，本实施例提供一种显示面板，包括：基板1、TFT层2、发光层3、胶框层4（Dam）、第一无机层5、有机层6以及第二无机层7。TFT层2设于基板1的上表面；发光层3设于TFT层2的上表面；胶框层4被设置于TFT层2上方，与发光层3之间存在间隙；第一无机层5覆盖于胶框层4、发光层3以及胶框层4与发光层3之间的间隙的上方；有机层6设于发光层3的上方，并且被胶框层4包围；第二无机层7覆盖于第一无机层5、有机层6以及第一无机层5外部的TFT层2的上方。
胶框层4材质包括有机光敏材料42，胶框层4内部设有两个以上吸水颗粒41，吸水颗粒41均匀分布于有机光敏材料中。
第一无机层5对应所述间隙位置的部分，其一侧贴附于TFT层2，其另一侧贴附于有机层6的第一侧面61；以及第二无机层7对应所述间隙位置的部分，其一侧贴附于有机层6的第二侧面62，另一侧形成一沟槽8。
TFT层2可包括TFT器件；和/或，发光层3包括OLED器件；和/或，第一无机层5、第二无机层7包括硅的氧化物、硅的氮化物及铝的氧化物中的至少一种；和/或，有机层6包括硅树脂及聚甲基丙烯酸甲酯中的至少一种。
第一无机层5、第二无机层7的厚度为0.3um~3um；有机层6的厚度为2um~15um。
无机层对水汽和氧气具有很好的阻隔作用，但其缺点是成膜性以及平整度欠佳，所以覆盖于胶框层4的上方，用以阻隔水氧。
吸水颗粒41的材质包括：聚丙烯酸类、聚丙烯酰胺类、聚丙烯腈类、聚乙烯醇类、聚乙烯酸盐类、聚氧乙烯类或其中任一种材质的衍生物中的一种或多种。有机光敏材料42的材质包括光敏型聚酰亚胺等有机物。
有机层6具有很好的成膜性、均匀性和表面平整度，具有明显改善膜层应力、覆盖颗粒物（Particle）的作用，覆盖于第一无机层5的上方以及第二无机层7的下方，有机层6全部外表面都被胶框层4、第一无机层5及第二无机层7完整包覆，完全不与空气接触，隔绝水氧，用以改善第一无机层5成膜性以及平整度差的技术问题，在本实施例中，采用无机层与有机层交替成膜堆叠，利用各自的优点，用以阻隔水氧，形成OLED发光材料的复合保护层，提高封装效果，延长OLED器件的使用寿命。
本实施例所述的显示面板，其技术效果在于，在现有技术的胶框层中加入了吸水颗粒，使得水氧进入胶框层时被吸水颗粒所吸收或者水氧渗透路径变长，从而使得水氧难以进入，改善水氧渗透效果，提高封装效果，实用性增强，进而延长电子设备的使用寿命。如图2所示，本实施例还提供一种显示面板的封装方法，具体包括如下步骤S1~S6。
S1 胶框材料制备步骤，制备一种含有吸水颗粒的胶框膜液；S2 TFT层制备步骤，在基板1上表面设置TFT层2，形成TFT基板；S3发光层制备步骤，在所述TFT层2上表面设置发光器件，形成一发光层3；S4 胶框层制备步骤，将所述胶框膜液涂布于TFT层2上表面，形成围绕发光层4的胶框层4；S5 第一无机层制备步骤，在TFT层2上表面制备第一无机层5，覆盖发光层4、胶框层4以及发光层4与胶框层4之间的TFT层2；S6 有机层制备步骤，在第一无机层5上表面制备有机层6，有机层6被胶框层4围绕；以及S7 第二无机层制备步骤，在TFT层2上表面制备第二无机层7，覆盖有机层6、第一无机层5的一部分及第一无机层5外部的TFT层2。
如图3所示，所述框胶材料制备步骤具体包括如下步骤：S11主材选取步骤，提供一种液态的有机光敏材料42；S12颗粒添加步骤，将两个以上吸水颗粒41加入至有机光敏材料中42；S13搅拌步骤，对有机光敏材料42进行搅拌处理，使得吸水颗粒41均匀分布于有机光敏材料42中；以及S14膜液生成步骤，获得一框胶膜液。
吸水颗粒41在所述胶框层用膜液中的质量百分数为0~50%，在本实施例中可选取吸水颗粒41在所述胶框层用膜液中的质量百分数为5%进行制备。
如图4所示，所述框胶层制备步骤具体包括如下步骤：S41涂布定位步骤，在TFT层2上表面找到并确认对应发光层3外围区域的预设涂布位置；S42膜液涂布步骤，将所述框胶膜液涂布于所述预设涂布位置；S43显影步骤，对所述框胶膜液进行曝光显影处理；以及S44框胶层生成步骤，生成一环状的框胶4层，围绕发光层3。
吸水颗粒41的材质包括：聚丙烯酸类、聚丙烯酰胺类、聚丙烯腈类、聚乙烯醇类、聚乙烯酸盐类、聚氧乙烯类或其中任一种材质的衍生物中的一种或多种。有机光敏材料42的材质包括光敏型聚酰亚胺等有机物。
无机层对水汽和氧气具有很好的阻隔作用，但其缺点是成膜性以及平整度欠佳，所以覆盖于胶框层4的上方，用以阻隔水氧。第一无机层5和第二无机层7的材质包括：透明氧化物薄膜材料（氧化铝、氧化硅、氧化锆等）、氮化硅系列等。制备所得的第一无机层5、第二无机层7的厚度为0.3um~3um；制备所得的有机层6的厚度为2um~15um。
有机层6具有很好的成膜性、均匀性和表面平整度，具有明显改善膜层应力、覆盖颗粒物（Particle）的作用，覆盖于第一无机层5的上方以及第二无机层7的下方，完全不与空气接触，隔绝水氧，用以改善第一无机层5成膜性以及平整度差的技术问题，在本实施例中，采用无机层与有机层交替成膜堆叠，利用各自的优点，用以阻隔水氧，形成OLED发光材料的复合保护层，提高封装效果，延长OLED器件的使用寿命。
本实施例所述显示面板的封装方法，其技术效果在于，在胶框层中添加吸水颗粒，使得水氧进入胶框层时被吸水颗粒所吸收或者水氧渗透路径变长，从而使得水氧难以进入有机层，增强防水氧渗透效果，提高封装效果，操作简单、成本低廉，实用性强。
进一步地，本实施例还可以提供一种电子设备，包括前文所述显示面板，所述电子设备可用于显示文本、图片、影像等数据，可用作电子设备与用户交流的界面。
本实施例所述电子设备的技术效果在于，在电子设备的显示面板边缘处的胶框层中添加吸水颗粒，有效防止水氧渗透进入到显示面板的有机层，从而得以有效延长显示面板及电子设备的使用寿命。
本发明的技术效果在于：在现有技术的胶框层中加入了吸水颗粒，使得水氧进入胶框层时被吸水颗粒所吸收或者水氧渗透路径变长，从而使得水氧难以进入有机层，改善水氧渗透效果，提高封装效果，实用性增强，进而延长电子设备的使用寿命。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种显示面板，其包括：
    一基板；
    一TFT层，设于所述基板的一侧表面；
    一发光层，设于所述TFT层远离所述基板的一侧表面；
    一胶框层，设于所述TFT层远离所述基板的一侧表面，所述胶框层为环状，围绕所述发光层；
    一第一无机层，覆盖所述发光层、所述胶框层以及所述发光层与所述胶框层之间的TFT层；
    一有机层，设于所述第一无机层远离所述基板的一侧表面，且被所述胶框层围绕；以及
    一第二无机层，覆盖所述有机层、所述第一无机层以及所述第一无机层外部的TFT层；
    其中，所述胶框层材质包括有机光敏材料；
    所述胶框层内设有两个以上吸水颗粒，所述吸水颗粒均匀分布于所述有机光敏材料中。
  2. 如权利要求1所述的显示面板，其中，
    所述发光层于所述胶框层之间存在间隙；
    所述第一无机层对应所述间隙位置的部分，其一侧贴附于所述TFT层，其另一侧贴附于所述有机层的第一侧面；以及
    所述第二无机层对应所述间隙位置的部分，其一侧贴附于所述有机层的第二侧面，另一侧形成一沟槽。
  3. 如权利要求1所述的显示面板，其中，
    所述TFT层包括TFT器件；和/或，
    所述发光层包括OLED器件；和/或，
    所述第一无机层、所述第二无机层包括硅的氧化物、硅的氮化物及铝的氧化物中的至少一种；和/或，
    所述有机层包括硅树脂及丙烯酸树脂中的至少一种。
  4. 如权利要求1所述的显示面板，其中，
    所述第一无机层、所述第二无机层的厚度为0.3um~3um；
    所述有机层的厚度为2um~15um。
  5. 如权利要求1所述的显示面板，其中，
    所述吸水颗粒的材质包括聚丙烯酸类、聚丙烯酰胺类、聚丙烯腈类、聚乙烯醇类、聚乙烯酸盐类、聚氧乙烯类或其中任一种材质的衍生物中的一种或多种。
  6. 一种电子设备，其包括如权利要求1-5中任一项所述的显示面板。
  7. 一种显示面板的封装方法，其包括如下步骤：
    S1 胶框材料制备步骤，制备一种含有吸水颗粒的胶框膜液；
    S2 TFT层制备步骤，在一基板上表面设置一TFT层，形成一TFT基板；
    S3发光层制备步骤，在所述TFT层上表面设置发光器件，形成一发光层；
    S4 胶框层制备步骤，将所述胶框膜液涂布于所述TFT层上表面，形成围绕所述发光层的一胶框层；
    S5 第一无机层制备步骤，在所述TFT层上表面制备一第一无机层，覆盖所述发光层、所述胶框层以及所述发光层与所述胶框层之间的TFT层；
    S6 有机层制备步骤，在所述第一无机层上表面制备一有机层，所述有机层被所述胶框层围绕；以及
    S7 第二无机层制备步骤，在所述TFT层上表面制备一第二无机层，覆盖所述有机层、所述第一无机层的一部分及所述第一无机层外部的TFT层。
  8. 如权利要求7所述的显示面板的封装方法，其中，
    所述框胶材料制备步骤具体包括如下步骤：
    S11主材选取步骤，提供一种液态的有机光敏材料；
    S12颗粒添加步骤，将两个以上吸水颗粒加入至所述有机光敏材料中；
    S13搅拌步骤，对所述有机光敏材料进行搅拌处理，使得所述吸水颗粒均匀分布于所述有机光敏材料中；以及
    S14膜液生成步骤，获得一框胶膜液。
  9. 如权利要求7或8所述的显示面板的封装方法，其中，
    所述吸水颗粒在所述胶框膜液中的质量百分数为0~50%。
  10. 如权利要求7所述的显示面板的封装方法，其中，
    所述框胶层制备步骤具体包括如下步骤：
    S41涂布定位步骤，在所述TFT层上表面找到并确认对应所述发光层外围区域的预设涂布位置；
    S42膜液涂布步骤，将所述框胶膜液涂布于所述预设涂布位置；
    S43显影步骤，对所述框胶膜液进行曝光显影处理；以及
    S44框胶层生成步骤，生成一环状的框胶层，围绕所述发光层。
PCT/CN2018/113935 2018-10-18 2018-11-05 显示面板及其封装方法及电子设备 Ceased WO2020077699A1 (zh)

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CN110265466B (zh) * 2019-06-28 2021-09-03 昆山工研院新型平板显示技术中心有限公司 显示面板、显示装置及显示面板的制作方法
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CN114695791A (zh) * 2022-03-23 2022-07-01 武汉华星光电半导体显示技术有限公司 拼接显示面板

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