WO2020056867A1 - 柔性显示面板及其制备方法 - Google Patents
柔性显示面板及其制备方法 Download PDFInfo
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- WO2020056867A1 WO2020056867A1 PCT/CN2018/113288 CN2018113288W WO2020056867A1 WO 2020056867 A1 WO2020056867 A1 WO 2020056867A1 CN 2018113288 W CN2018113288 W CN 2018113288W WO 2020056867 A1 WO2020056867 A1 WO 2020056867A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to the field of display technology, and in particular, to a flexible display panel and a manufacturing method thereof.
- the flexible substrate is an important part of the flexible display device. As the supporting and protecting component of the entire flexible device, the flexible substrate not only has an important influence on the display quality of the device, but also directly affects the service life of the device.
- the performance requirements of flexible devices for substrate materials are mainly reflected in heat resistance, high temperature dimensional stability, flexibility, water and oxygen barrier properties, and surface planarization.
- ultra-thin glass and polymer films are generally used as substrate materials.
- polymer film substrates are superior in terms of optical properties, mechanical properties, and chemical properties, but they are insufficient in terms of blocking water and oxygen and high-temperature dimensional stability.
- Existing flexible substrates generally use a double-layer polymer film, and an inorganic barrier layer is provided between the two polymer films to block water and oxygen and prevent water and oxygen from corroding the upper display device.
- an inorganic barrier layer is provided between the two polymer films to block water and oxygen and prevent water and oxygen from corroding the upper display device.
- it needs to be performed at a high temperature. Due to the different thermal expansion coefficients of the film layers of the flexible substrate, the interface stress between the polymer film and the barrier layer is concentrated, which causes the film layer to crack or fall off.
- the polymer film is also easily detached from the barrier layer.
- the existing flexible substrate has a problem that the polymer film and the inorganic barrier layer are easily separated.
- the present invention provides a flexible display panel to solve the existing flexible display panels. Due to the large difference in the thermal expansion coefficient of the film layer in a high-temperature environment, the stress at the film interface is concentrated, and the film layer is cracked or detached. Problems affecting the stability and service life of flexible substrates.
- the present invention provides a flexible display panel including a first organic layer, a barrier layer formed on the first organic layer, and a first adhesion-promoting layer formed between the first organic layer and the barrier layer.
- the first adhesion-promoting layer is made of silica nanotubes, the silica nanotubes are distributed on the first surface of the first organic layer, and the silica nanotubes and the first organic layer
- the area ratio of the contact surface to the first surface is 10% to 80%.
- the flexible display panel further includes a second organic layer, and the second organic layer is formed on the barrier layer.
- the flexible display panel further includes a TFT device, an OLED light emitting layer, and a thin film encapsulation layer disposed on the second organic layer in this order.
- the flexible display panel further includes a second adhesion-promoting layer formed between the barrier layer and the second organic layer.
- the first organic layer and the second organic layer are made of at least one of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate. preparation.
- the present invention also provides another flexible display panel, including: a first organic layer, a barrier layer formed on the first organic layer, and a first adhesion-promoting layer; wherein the first adhesion-promoting layer is formed on the first organic layer; Between the first organic layer and the barrier layer.
- the flexible display panel further includes a second organic layer, and the second organic layer is formed on the barrier layer.
- the flexible display panel further includes a TFT device, an OLED light emitting layer, and a thin film encapsulation layer disposed on the second organic layer in this order.
- the flexible display panel further includes a second adhesion-promoting layer formed between the barrier layer and the second organic layer.
- the first adhesion-promoting layer and / or the second adhesion-promoting layer are made of silica nanotubes.
- the first organic layer and the second organic layer are made of at least one of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate. preparation.
- the thickness of the first organic layer and the thickness of the second organic layer are 20-500 microns.
- the first organic layer is made of a polyimide material, and the thickness of the first organic layer is 100 micrometers.
- the barrier layer is made of at least one of silicon dioxide, amorphous silicon, and silicon nitride.
- the thickness of the barrier layer is 100-2000 nanometers.
- the barrier layer is made of silicon dioxide, and the thickness of the barrier layer is 500 nanometers.
- the present invention also provides a method for manufacturing a flexible display panel, including:
- a barrier layer is formed on the surface of the first adhesion increasing layer.
- the first adhesion-promoting layer and / or the second adhesion-promoting layer are made of silica nanotubes.
- the barrier layer is made of at least one of silicon dioxide, amorphous silicon, and silicon nitride.
- the first organic layer and the second organic layer are made of at least one of polyimide, polyetherimide, polyphenylene sulfide, and polyarylate. preparation.
- the beneficial effect of the present invention is that the flexible display panel provided by the present invention and the method for preparing the same enhance the adhesion between the film layers of the flexible substrate by providing an adhesion increasing layer, thereby improving the stability of the flexible display panel during use. And service life.
- FIG. 1 is a schematic diagram of the overall structure of a flexible display panel according to the first embodiment
- FIG. 2 is another schematic structural diagram of a flexible display panel according to the first embodiment
- FIG. 3 is another schematic structural diagram of a flexible display panel according to the first embodiment
- FIG. 4 is a flowchart of steps in a method for manufacturing a flexible display panel according to the present invention.
- the present invention is directed to the existing flexible display panel. Since the flexible substrate has a large difference in thermal expansion coefficient in a high-temperature environment, the stress at the interface of the film layer is concentrated, and the film layer is cracked or detached, thereby affecting the stability of the flexible display panel. Performance and service life, this embodiment can solve this defect.
- this embodiment provides a flexible display panel 10 including a first organic layer 11, a first adhesion layer 12, a barrier layer 13, a second adhesion layer 14, a second organic layer 15, and a TFT ( Thin Film Transistor (device) 16, OLED light-emitting layer 17, and thin-film encapsulation layer 18
- the first organic layer 11 is disposed on a rigid substrate 20, and the rigid substrate 20 is used as a substrate.
- the rigid substrate 10 and the rigid substrate 10 The flexible substrate 20 is peeled off.
- the rigid substrate 10 is a glass substrate, and may be other materials.
- the first adhesion-promoting layer 12 is disposed between the first organic layer 11 and the barrier layer 13.
- the first adhesion-promoting layer 12 connects the first organic layer 11 and the barrier layer 13.
- the first adhesion-promoting layer 12 is used to enhance the adhesion between the first adhesion-promoting layer 12 and the barrier layer 13.
- the flexible display panel 10 is prevented from being affected by stress during the bending process of daily use. , Resulting in the first organic layer 11 being separated from the barrier layer 13.
- the process temperature is as high as 300-500 degrees Celsius, and the first The thermal expansion coefficients of the organic layer 11 and the barrier layer 13 are significantly different.
- the size of the film layer changes too much, and internal stress is generated at the interface of the film layer, resulting in peeling between the film layers during bending.
- the stress at the interface between the two film layers can be balanced, and the stability of the flexible substrate 20 at high temperatures can be improved.
- the second organic layer is provided on the barrier layer 13.
- the second adhesion layer 14 is provided between the barrier layer 13 and the second organic layer 15.
- the first adhesion-promoting layer 12 and the second adhesion-promoting layer 14 are made of silicon dioxide nanotubes.
- the silicon dioxide nanotubes have the advantages of high strength, high toughness, and high stability at high temperatures, and can strengthen the film layer. For the adhesion, you can also use other similar size materials with the same effect.
- silica nanotubes are prepared on the first surface of the first organic layer 11, so that the silica nanotubes are substantially uniformly dispersed on the first surface and distributed on the first surface.
- the silica nanotubes occupy 10% to 80% of the area of the first surface, and the first surface is a surface of the first organic layer 11 facing away from the rigid substrate 20.
- the first organic layer 11 and the second organic layer 15 are made of one or more combinations of polyimide, polyimide, polyetherimide, polyphenylene sulfide, and polyarylate.
- the thickness of the first organic layer 11 and the second organic layer 15 is 20-500 ⁇ m.
- both the first organic layer 11 and the second organic layer 15 are made of polyacryl.
- the imine material is prepared with a thickness of 100 microns.
- the barrier layer 13 is made of one or more combinations of silicon dioxide, amorphous silicon, and silicon nitride, and the thickness of the barrier layer is 100-2000 nanometers.
- the barrier layer 13 is made of a silicon dioxide material and has a thickness of 500 nanometers.
- the present invention also provides a method for manufacturing a flexible display panel, including:
- a barrier layer is formed on the surface of the first adhesion increasing layer.
- the manufacturing method is described in detail below.
- a polyimide solution is coated on a rigid substrate to form a polyimide wet film with a thickness of 100 micrometers.
- the rigid substrate may be a glass substrate.
- silicon dioxide nanotubes are formed on the surface of the polyimide wet film, so that the silicon dioxide nanotubes are distributed approximately uniformly on the surface of the polyimide wet film to form a first adhesion-promoting layer and be distributed in all
- the silica nanotubes on the surface of the polyimide wet film account for 10% to 80% of the area of the surface of the polyimide wet film.
- step S30 the wet film having the first adhesion-promoting layer formed on its surface is subjected to post-curing treatment or the like to cure the polyimide to form a first organic layer.
- a silicon dioxide film layer is deposited on the surface of the first adhesion-promoting layer by a plasma enhanced chemical vapor deposition method to form a barrier layer, and the thickness of the silicon dioxide film layer is 500 nanometers.
- a substantially uniformly distributed silica nanotube is formed on the surface of the barrier layer to form a second adhesion-promoting layer, and the silica nanotube distributed on the surface of the barrier layer occupies the surface of the barrier layer 10% ⁇ 80% of the area.
- a polyimide solution is coated on the surface of the second adhesion-promoting layer, and then cured to form a second organic layer, and the thickness of the second organic layer is 100 micrometers.
- the TFT device includes an active layer, a gate insulating layer, a gate, and a source / drain.
- the OLED light-emitting layer includes an anode, a light-emitting material layer, and a cathode.
- the thin-film encapsulation layer includes an organic layer and an inorganic layer. Layered composite structure.
- the polyimide solution may also be other polymers, such as one or a combination of polyetherimide, polyphenylene sulfide, and polyarylate. Depending on the selected materials, The thickness is different, the thickness is between 20 ⁇ 500 microns.
- amorphous silicon and silicon nitride can be used as the barrier layer, and the thickness ranges from 100 to 2000 nanometers.
- the flexible display panel and the preparation method thereof provided by the present invention enhance the adhesion between the film layers of the flexible substrate by providing an adhesion-increasing layer, thereby improving the stability and service life of the flexible display panel during use.
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Abstract
一种柔性显示面板(10),包括:第一有机层(11)、设置于第一有机层(11)上的阻挡层(13)、以及第一增附层(12),其中,第一增附层(12)设置于第一有机层(11)与阻挡层(13)之间。通过设置增附层(12),增强了柔性基板膜层之间的附着力,进而提高了柔性显示面板(10)在使用过程中的稳定性和使用寿命。
Description
本发明涉及显示技术领域,尤其涉及一种柔性显示面板及其制备方法。
柔性基板是柔性显示器件的重要组成部分,柔性基板作为整个柔性器件的支撑和保护组件,不仅对器件的显示品质有重要的影响,而且直接关系到器件的使用寿命。柔性器件对于基板材料的性能要求主要体现在耐热性、高温尺寸稳定性、柔韧性、阻隔水氧特性、表面平坦化等方面,目前,一般采用超薄玻璃和聚合物薄膜作为基板材料,相较于玻璃基板,聚合物薄膜基板在光学性能、机械性能以及化学性能方面都较为优异,但是在阻隔水氧和高温尺寸稳定性方面不足。
现有的柔性基板一般采用双层聚合物薄膜,并在两层聚合物薄膜之间设置无机阻挡层,用以阻隔水氧,避免水氧腐蚀上层的显示器件。但是,在柔性基板上制作显示器件过程中,需要在高温条件下进行,由于柔性基板的膜层的热膨胀系数不同,聚合物薄膜与阻挡层之间的界面应力集中,导致膜层破裂或脱落,另外,柔性基板在弯折过程中,聚合物薄膜也易与阻挡层脱离。
综上所述,现有的柔性基板,存在聚合物薄膜与无机阻挡层之间容易脱离的问题。
本发明提供一种柔性显示面板,以解决现有的柔性显示面板,由于在高温环境中,膜层的热膨胀系数差异较大,导致膜层界面的应力集中,进而导致膜层破裂或脱离,进而影响柔性基板的稳定性和使用寿命的问题。
为解决上述问题,本发明提供的技术方案如下:
本发明提供一种柔性显示面板,包括:第一有机层、形成于所述第一有机层上的阻挡层、形成于所述第一有机层与所述阻挡层之间的第一增附层;所述第一增附层采用二氧化硅纳米管制备,所述二氧化硅纳米管分布在所述第一有机层的第一表面,所述二氧化硅纳米管与所述第一有机层接触的表面与所述第一表面的面积比例为10%~80%。
在本发明的至少一种实施例中,所述柔性显示面板还包括第二有机层,所述第二有机层形成于所述阻挡层上。
在本发明的至少一种实施例中,所述柔性显示面板还包括依次设置在所述第二有机层上的TFT器件、OLED发光层、以及薄膜封装层。
在本发明的至少一种实施例中,所述柔性显示面板还包括第二增附层,所述第二增附层形成于所述阻挡层与所述第二有机层之间。
在本发明的至少一种实施例中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
本发明还提供另一种柔性显示面板,包括:第一有机层、形成于所述第一有机层上的阻挡层、第一增附层;其中,所述第一增附层形成于所述第一有机层与所述阻挡层之间。
在本发明的至少一种实施例中,所述柔性显示面板还包括第二有机层,所述第二有机层形成于所述阻挡层上。
在本发明的至少一种实施例中,所述柔性显示面板还包括依次设置在所述第二有机层上的TFT器件、OLED发光层、以及薄膜封装层。
在本发明的至少一种实施例中,所述柔性显示面板还包括第二增附层,所述第二增附层形成于所述阻挡层与所述第二有机层之间。
在本发明的至少一种实施例中,所述第一增附层和/或第二增附层采用二氧化硅纳米管制备。
在本发明的至少一种实施例中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
在本发明的至少一种实施例中,所述第一有机层的厚度和所述第二有机层的厚度为20~500微米。
在本发明的至少一种实施例中,所述第一有机层采用聚酰亚胺材料制备,所述第一有机层的厚度为100微米。
在本发明的至少一种实施例中,所述阻挡层采用二氧化硅、非晶硅、以及氮化硅中的至少一种制备。
在本发明的至少一种实施例中,所述阻挡层的厚度为100~2000纳米。
在本发明的至少一种实施例中,所述阻挡层采用二氧化硅制备,所述阻挡层的厚度为500纳米
本发明还提供一种柔性显示面板的制备方法,包括:
S10,在一刚性基板上涂布有机溶液,形成湿膜;
S20,在所述湿膜表面形成第一增附层;
S30,对表面形成有所述第一增附层的湿膜进行固化处理,使得所述湿膜固化成第一有机层;
S40,在所述第一增附层表面形成阻挡层;
S50,在所述阻挡层表面形成第二增附层;
S60,在所述第二增附层上形成第二有机层;
S70,在所述第二有机层上依次制备TFT器件、OLED发光层、以及薄膜封装层;
S80,剥离所述刚性基板。
在本发明的至少一种实施例中,所述第一增附层和/或第二增附层采用二氧化硅纳米管制备。
在本发明的至少一种实施例中,所述阻挡层采用二氧化硅、非晶硅、以及氮化硅中的至少一种制备。
在本发明的至少一种实施例中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
本发明的有益效果为:本发明提供的柔性显示面板及其制备方法通过设置增附层,增强了柔性基板的膜层之间的附着力,进而提高了柔性显示面板在使用过程中的稳定性和使用寿命。
为了更清楚地说明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单介绍,显而易见地,下面描述中的附图仅仅是发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为实施例一的柔性显示面板的整体结构示意图;
图2为实施例一的柔性显示面板的另一结构示意图;
图3为实施例一的柔性显示面板的又一结构示意图;
图4为本发明柔性显示面板的制备方法的步骤流程图。
以下各实施例的说明是参考附加的图示,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。在图中,结构相似的单元是用以相同标号表示。
本发明针对现有的柔性显示面板,由于柔性基板在高温环境中,膜层的热膨胀系数差异较大,导致膜层界面的应力集中,进而导致膜层破裂或脱离,进而影响柔性显示面板的稳定性和使用寿命,本实施例能够解决该缺陷。
如图1所示,本实施例提供一种柔性显示面板10,包括第一有机层11、第一增附层12、阻挡层13、第二增附层14、第二有机层15、TFT(Thin Film Transistor,薄膜晶体管)器件16、OLED发光层17、以及薄膜封装层18
如图2所示,所述第一有机层11设置于刚性基板20上,所述刚性基板20作为衬底,在后续的显示面板的发光器件制作完成后,将所述刚性基板10与所述柔性基板20剥离,在本实施例中,所述刚性基板10为玻璃基板,也可为其他材料。
所述第一增附层12设置于所述第一有机层11与所述阻挡层13之间,所述第一增附层12连接所述第一有机层11与所述阻挡层13,所述第一增附层12用以增强所述第一增附层12与所述阻挡层13的附着力,一方面,避免所述柔性显示面板10在日常使用弯折过程中,受到应力的影响,导致所述第一有机层11与所述阻挡层13脱离,另一方面,在所述第二有机层15上制作所述TFT器件16时,工艺温度高达300~500摄氏度,所述第一有机层11与所述阻挡层13的热膨胀系数差异较大,在高温状态下,膜层的尺寸变化过大,且膜层界面处产生内应力,导致弯折时造成膜层之间的剥离,通过在两个膜层之间增加所述第一增附层12,可平衡两个膜层界面的应力,提高所述柔性基板20在高温下的稳定性。
为了增加柔性基板的可靠性,除了设置所述阻挡层13用以隔绝水氧的入侵,另外会设置两层有机层,本实施例中,在所述阻挡层13上设置有所述第二有机层15,同样地,为防止所述阻挡层13与所述第二有机层15脱离,在所述阻挡层13和所述第二有机层15之间设置有所述第二增附层14。
所述第一增附层12和所述第二增附层14采用二氧化硅纳米管材料制备,二氧化硅纳米管在高温下具有高强、高韧、高稳定性的优点,能够增强膜层的附着力,也可采用其他具有相同效果的类似尺寸的材料。
如图3所示,在所述第一有机层11的第一表面制备二氧化硅纳米管,使得所述二氧化硅纳米管大致均匀分散在所述第一表面,分布在所述第一表面的该二氧化硅纳米管占所述第一表面的面积的10%~80%,所述第一表面为所述第一有机层11背离所述刚性基板20一侧的表面。
所述第一有机层11和所述第二有机层15采用聚酰亚胺、聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的一种或多种组合材料制备,所述第一有机层11和所述第二有机层15的厚度为20~500微米,在本实施例中,所述第一有机层11和所述第二有机层15均采用聚酰亚胺材料制备,其厚度均为100微米。
所述阻挡层13采用二氧化硅、非晶硅、以及氮化硅中的一种或多种组合材料制备,所述阻挡层的厚度为100~2000纳米。本实施例中,所述阻挡层13采用二氧化硅材料制备,其厚度为500纳米。
如图4所示,本发明还提供一种柔性显示面板的制备方法,包括:
S10,在一刚性基板上涂布有机溶液,形成湿膜;
S20,在所述湿膜表面形成第一增附层;
S30,对表面形成有所述第一增附层的湿膜进行固化处理,使得所述湿膜固化成第一有机层;
S40,在所述第一增附层表面形成阻挡层;
S50,在所述阻挡层表面形成第二增附层;
S60,在所述第二增附层上形成第二有机层;
S70,在所述第二有机层上依次制备TFT器件、OLED发光层、以及薄膜封装层;
S80,剥离所述刚性基板。
下面对所述制作方法进行详细说明。
所述S10中,在刚性基板上涂布聚酰亚胺溶液,形成厚度为100微米的聚酰亚胺湿膜,所述刚性基板可为玻璃基板。
所述S20中,在聚酰亚胺湿膜表面形成二氧化硅纳米管,使二氧化硅纳米管大致均匀分布在该聚酰亚胺湿膜表面,以形成第一增附层,分布在所述聚酰亚胺湿膜表面的二氧化硅纳米管占该聚酰亚胺湿膜表面的面积的10%~80%。
所述S30中,对表面形成有所述第一增附层的湿膜进行后固化处理等使得聚酰亚胺固化,以形成第一有机层。
所述S40中,利用等离子体增强化学气相沉积法在所述第一增附层表面沉积二氧化硅膜层,以形成阻挡层,所述二氧化硅膜层的厚度为500纳米。
所述S50中,在所述阻挡层表面形成大致均匀分布的二氧化硅纳米管,以形成第二增附层,分布在所述阻挡层表面的该二氧化硅纳米管占所述阻挡层表面的面积的10%~80%。
所述S60中,在所述第二增附层表面涂布聚酰亚胺溶液,再经过固化形成第二有机层,所述第二有机层的厚度为100微米。
所述S70中,所述TFT器件包括有源层、栅极绝缘层、栅极、源漏极,所述OLED发光层包括阳极、发光材料层以及阴极,所述薄膜封装层采用有机层和无机层叠加的复合结构。
所述S80中,在所述柔性显示面板制备完成后,将所述柔性显示面板与所述刚性基板剥离。
其中,聚酰亚胺溶液也可为其他聚合物,如聚醚酰亚胺、聚苯硫醚、聚芳酯中一种或几种组合,根据选择的材料的不同,涂布的膜层的厚度不同,厚度在20~500微米之间。
所述阻挡层除了选用二氧化硅以外,还可选用非晶硅、氮化硅中的一种或多种组合,厚度范围在100~2000纳米之间。
有益效果:本发明提供的柔性显示面板及其制备方法通过设置增附层,增强了柔性基板的膜层之间的附着力,进而提高了柔性显示面板在使用过程中的稳定性和使用寿命。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。
Claims (20)
- 一种柔性显示面板,其中,包括:第一有机层;阻挡层,形成于所述第一有机层上;第一增附层,形成于所述第一有机层与所述阻挡层之间,所述第一增附层采用二氧化硅纳米管制备,所述二氧化硅纳米管分布在所述第一有机层的第一表面,所述二氧化硅纳米管与所述第一有机层接触的表面与所述第一表面的面积比例为10%~80%。
- 根据权利要求1所述的柔性显示面板,其中,所述柔性显示面板还包括第二有机层,所述第二有机层形成于所述阻挡层上。
- 根据权利要求2所述的柔性显示面板,其中,所述柔性显示面板还包括依次设置在所述第二有机层上的TFT器件、OLED发光层、以及薄膜封装层。
- 根据权利要求2所述的柔性显示面板,其中,所述柔性显示面板还包括第二增附层,所述第二增附层形成于所述阻挡层与所述第二有机层之间。
- 根据权利要求2所述的柔性显示面板,其中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
- 一种柔性显示面板,其中,包括:第一有机层;阻挡层,形成于所述第一有机层上;第一增附层,形成于所述第一有机层与所述阻挡层之间。
- 根据权利要求6所述的柔性显示面板,其中,所述柔性显示面板还包括第二有机层,所述第二有机层形成于所述阻挡层上。
- 根据权利要求7所述的柔性显示面板,其中,所述柔性显示面板还包括依次设置在所述第二有机层上的TFT器件、OLED发光层、以及薄膜封装层。
- 根据权利要求7所述的柔性显示面板,其中,所述柔性显示面板还包括第二增附层,所述第二增附层形成于所述阻挡层与所述第二有机层之间。
- 根据权利要求9所述的柔性显示面板,其中,所述第一增附层和/或第二增附层采用二氧化硅纳米管制备。
- 根据权利要求7所述的柔性显示面板,其中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
- 根据权利要求11所述的柔性显示面板,其中,所述第一有机层的厚度和所述第二有机层的厚度为20~500微米。
- 根据权利要求12所述的柔性显示面板,其中,所述第一有机层采用聚酰亚胺材料制备,所述第一有机层的厚度为100微米。
- 根据权利要求6所述的柔性显示面板,其中,所述阻挡层采用二氧化硅、非晶硅、以及氮化硅中的至少一种制备。
- 根据权利要求14所述的柔性显示面板,其中,所述阻挡层的厚度为100~2000纳米。
- 根据权利要求15所述的柔性显示面板,其中,所述阻挡层采用二氧化硅制备,所述阻挡层的厚度为500纳米。
- 一种柔性显示面板的制备方法,其中,包括:S10,在一刚性基板上涂布有机溶液,形成湿膜;S20,在所述湿膜表面形成第一增附层;S30,对表面形成有所述第一增附层的湿膜进行固化处理,使得所述湿膜固化成第一有机层;S40,在所述第一增附层表面形成阻挡层;S50,在所述阻挡层表面形成第二增附层;S60,在所述第二增附层上形成第二有机层;S70,在所述第二有机层上依次制备TFT器件、OLED发光层、以及薄膜封装层;S80,剥离所述刚性基板。
- 根据权利要求17所述的柔性显示面板的制备方法,其中,所述第一增附层和/或第二增附层采用二氧化硅纳米管制备。
- 根据权利要求17所述的柔性显示面板的制备方法,其中,所述阻挡层采用二氧化硅、非晶硅、以及氮化硅中的至少一种制备。
- 根据权利要求17所述的柔性显示面板的制备方法,其中,所述第一有机层和所述第二有机层采用聚酰亚胺、聚醚酰亚胺、聚苯硫醚、以及聚芳酯中的至少一种制备。
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| CN110379923A (zh) * | 2019-07-30 | 2019-10-25 | 武汉华星光电半导体显示技术有限公司 | 柔性基板及其制造方法、有机发光显示面板 |
| CN110690358A (zh) * | 2019-09-05 | 2020-01-14 | 武汉华星光电半导体显示技术有限公司 | 显示面板、显示装置及显示面板的制作方法 |
| CN111725404B (zh) * | 2020-06-01 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
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| CN114335404B (zh) * | 2021-12-20 | 2023-11-28 | 深圳市华星光电半导体显示技术有限公司 | 柔性基板的制备方法、柔性基板以及柔性显示面板 |
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