WO2016086532A1 - 柔性oled衬底及柔性oled封装方法 - Google Patents

柔性oled衬底及柔性oled封装方法 Download PDF

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WO2016086532A1
WO2016086532A1 PCT/CN2015/072471 CN2015072471W WO2016086532A1 WO 2016086532 A1 WO2016086532 A1 WO 2016086532A1 CN 2015072471 W CN2015072471 W CN 2015072471W WO 2016086532 A1 WO2016086532 A1 WO 2016086532A1
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metal foil
polymer layer
flexible oled
layer
flexible
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PCT/CN2015/072471
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English (en)
French (fr)
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郝鹏
罗长诚
李先杰
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深圳市华星光电技术有限公司
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Priority to GB1706761.2A priority Critical patent/GB2546681B/en
Priority to US14/424,019 priority patent/US20160372689A1/en
Priority to JP2017528875A priority patent/JP6637502B2/ja
Priority to KR1020177012279A priority patent/KR20170066572A/ko
Publication of WO2016086532A1 publication Critical patent/WO2016086532A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • the present invention relates to the field of display technologies, and in particular, to a flexible OLED substrate and a flexible OLED packaging method.
  • the flat display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the existing flat display devices mainly include a liquid crystal display (LCD) and an organic light emitting display (OLED).
  • OLED display devices have become the most promising new display devices in recent years due to their advantages of self-luminescence, all solid state, and high contrast.
  • the biggest feature of OLED display devices is that flexible display can be realized.
  • Flexible display devices made of flexible substrates and which are light, flexible and portable are important development directions of OLED display devices.
  • the conventional OLED display device uses a rigid glass substrate with low permeability to oxygen and water vapor, which can better protect the device.
  • the flexible substrate applied to the flexible organic electroluminescent device is mainly a polymer substrate, and the polymer substrate is light, thin, strong and flexible, but the free volume fraction of the polymer substrate itself is small and the average segment is free. The greater the degree, it is easy to be penetrated by water and oxygen, shortening the life of organic light-emitting devices.
  • the metal foil When the thickness of the metal foil is less than 100 ⁇ m, the metal foil can exhibit excellent flexibility, and is excellent in heat resistance and low in thermal expansion coefficient compared with the polymer, and in particular, there is no problem of water and oxygen permeation. It is used as a substrate material for a flexible organic electroluminescent device, but the metal foil as a substrate material of a flexible display device also has a problem of large conductivity and surface roughness.
  • a polymer-metal foil composite flexible package substrate comprising: a first polymer layer 10, a metal foil 20 disposed on the first polymer layer 10, and disposed on the metal foil A second polymer layer 30 over the sheet 20.
  • the surface size of the metal foil 20 is larger than the surface dimensions of the first polymer layer 10 and the second polymer layer 30, and the metal foil is excellent in flexibility and water and oxygen barrier properties. Overcome the problems of electrical conductivity and surface roughness.
  • an organic electroluminescent device 50 is formed over the second polymer layer 30 of the flexible package substrate; then, the metal foil 20 on the flexible package substrate is not first
  • the organic rubber 40 is coated over the portion covered by the polymer layer 10 and the second polymer layer 30, and the portion is adhered to the side of the organic electroluminescent device 50.
  • the package structure It is still possible for water and oxygen to penetrate through the joint or the side of the polymer. And because it is a flexible device, when the device is deformed, stress occurs between the device and the substrate, and the stress is concentrated on the joint of the encapsulant, which is prone to cracking.
  • the object of the present invention is to provide a flexible OLED substrate which has good flexibility and waterproof and oxygen permeability.
  • the packaging process can be simplified, the reliability of the flexible packaging process can be improved, and water can be prevented.
  • the leakage of oxygen through the package junction and the stress concentration when the flexible device is deformed causes the device to rupture.
  • the present invention first provides a flexible OLED substrate comprising: a polymer layer, a metal foil disposed on the polymer layer, and an insulating rubber layer disposed on the metal foil;
  • the surface size of the metal foil is larger than the surface size of the polymer layer, and the surface size of the polymer layer is larger than the surface size of the insulating rubber layer.
  • the metal foil is a metal foil having water, oxygen, and flexibility bending capabilities.
  • the metal foil is an aluminum foil.
  • the metal foil has a thickness of between 3 ⁇ m and 100 ⁇ m.
  • the polymer layer is a polymer layer that supports and protects the metal foil.
  • the polymer layer is a polyimide layer.
  • the polymer layer has a thickness of between 10 ⁇ m and 300 ⁇ m.
  • the invention also provides a flexible OLED packaging method, comprising:
  • Step 1 providing a metal foil, coating a polymer precursor solution on one side of the metal foil and then heating and solidifying to form a polymer layer;
  • Step 2 Apply an insulating rubber material uniformly on the other side surface of the metal foil to form an insulating rubber layer with a rubber coating machine, thereby preparing a flexible OLED lining comprising a polymer layer, a metal foil and an insulating rubber layer. bottom;
  • Step 3 Align the prepared OLED device with the flexible OLED substrate, and adhere the OLED device to the flexible OLED substrate through an insulating glue layer.
  • the polymer precursor solution in the step 1 is a polyimide precursor solution, and the prepared polymer layer is a polyimide layer, and the polymer layer has a thickness of between 10 ⁇ m and 300 ⁇ m.
  • the area of the insulating rubber layer in the step 2 is smaller than the area of the metal foil and the polymer layer, and is large.
  • the area to be packaged for the OLED device and is located at the location covered by the metal foil and polymer layer.
  • the OLED device in the step 3 is a bottom emission type OLED device.
  • the present invention also provides a flexible OLED substrate comprising: a polymer layer, a metal foil disposed on the polymer layer, and an insulating rubber layer disposed on the metal foil; a surface size of the metal foil Greater than the surface size of the polymer layer, the surface size of the polymer layer is larger than the surface size of the insulating rubber layer;
  • the metal foil is a metal foil having the ability to block water, oxygen and flexible bending;
  • the thickness of the metal foil is between 3 ⁇ m and 100 ⁇ m;
  • the polymer layer is a polymer layer having a supporting and protective effect on the metal foil;
  • the thickness of the polymer layer is between 10 ⁇ m and 300 ⁇ m.
  • the present invention prepares a flexible OLED substrate by using an insulating rubber material, which has good flexibility and water repellency and oxygen permeability.
  • the prepared OLED flexible device is directly adhered to the substrate by using an insulating rubber material, and the substrate preparation and packaging process are combined to simplify the packaging process, and the stress generated between the device and the substrate when bent is caused by the entire device. Sharing, improving the reliability of the packaging process.
  • Figure 1 is a prior art flexible OLED substrate
  • FIG. 2 is an OLED display device packaged with the flexible OLED substrate of FIG. 1;
  • Figure 3 is a flexible OLED substrate of the present invention.
  • Figure 5 is an OLED display device incorporating a flexible OLED substrate package of the present invention.
  • the present invention provides a flexible OLED substrate comprising: a polymer layer 1, a metal foil 2 disposed on the polymer layer 1 and an insulating rubber layer 3 disposed on the metal foil 2; the surface size of the metal foil 2 is larger than the surface size of the polymer layer 1, the polymer The surface size of the layer 1 is larger than the surface size of the insulating rubber layer 3.
  • the metal foil 2 may be any metal foil having an ability to isolate water, oxygen, and flexible bending, such as aluminum foil; preferably, the metal foil 2 has a thickness of between 3 ⁇ m and 100 ⁇ m.
  • the polymer layer 1 may be any polymer layer having a supporting and protective effect on the metal foil 2, such as a polyimide layer; preferably, the polymer layer 1 has a thickness of 10 ⁇ m to 300 ⁇ m. between.
  • the material of the insulating glue layer 3 may be an insulating solid glue, and the insulating glue layer 3 is responsible for adhering the OLED device to the OLED flexible substrate during packaging, and has a certain insulation water, The action of oxygen, and because of its insulating properties, can avoid contact of the conductive metal foil with the device electrodes.
  • the present invention further provides a flexible OLED packaging method, including:
  • Step 1 A metal foil 2 is provided, and a polymer precursor solution is coated on the side of the metal foil 2 and then cured by heating to form a polymer layer 1.
  • the metal foil 2 may be selected from an aluminum foil having a thickness of between 3 ⁇ m and 100 ⁇ m; the polymer precursor solution may be selected from a polyimide precursor solution, and the prepared polymer layer 1 is a polyimide.
  • the layer, the polymer layer 1 has a thickness of between 10 ⁇ m and 300 ⁇ m.
  • Step 2 uniformly coating the insulating rubber material on the other side surface of the metal foil sheet with a glue coater to form the insulating rubber material layer 3, thereby preparing the polymer layer 1, the metal foil sheet 2 and the insulating rubber material layer 3 Flexible OLED substrate.
  • the area of the metal foil 2 in the step 1 should be larger than the area of the polymer layer 1; the area of the insulating rubber layer 3 coated in the step 2 should be smaller than that of the metal foil 2 and the polymer layer 1
  • the area is larger than the area to be packaged by the OLED device 5, and is located at a position covered by the metal foil 2 and the polymer layer 1.
  • Step 3 The prepared OLED device 5 is paired with the flexible OLED substrate, and the OLED device 5 is adhered to the flexible OLED substrate through the insulating rubber layer 3.
  • the OLED device 5 in the step 3 is a bottom emission type OLED device.
  • the insulating rubber layer 3 is adhered to the bottom and side edges of the OLED device 5.
  • the OLED packaging method of the present invention simplifies the packaging process, and the insulating rubber material layer 3 in the obtained package structure is integrated, not spliced, thereby avoiding water and oxygen infiltration at the joint. Leakage, the stress generated between the device and the substrate when bent, will be shared by the entire device, improving the reliability of the packaging process.

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
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Abstract

提供了一种柔性OLED衬底及柔性OLED封装方法，所述柔性OLED衬底包括：聚合物层(1)，设于所述聚合物层(1)上的金属箔片(2)，及设于金属箔片(2)上的绝缘胶材层(3)；所述金属箔片(2)的表面尺寸大于聚合物层(1)的表面尺寸，聚合物层(1)的表面尺寸大于绝缘胶材层(3)的表面尺寸。该柔性OLED衬底具有良好柔韧性和防水、氧渗透性能。利用绝缘胶材层(3)将制备好的OLED柔性器件(5)直接粘附于衬底上，将衬底制备与封装过程结合在一起，简化了封装工艺，并且器件弯曲时与衬底之间产生的应力将由整个器件分担，提高了封装工艺的可靠性。

Description

柔性OLED衬底及柔性OLED封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种柔性OLED衬底及柔性OLED封装方法。
背景技术
平面显示器件具有机身薄、省电、无辐射等众多优点，得到了广泛的应用。现有的平面显示器件主要包括液晶显示器件(Liquid Crystal Display，LCD)及有机电致发光显示器件(Organic Light Emitting Display，OLED)。
OLED显示器件以其自发光、全固态、高对比度等优点，成为近年来最具潜力的新型显示器件。而OLED显示器件最大的特点在于可以实现柔性显示，采用柔性衬底制成重量轻、可弯曲、便于携带的柔性显示器件是OLED显示器件的重要发展方向。
传统的OLED显示器件采用的硬质玻璃衬底对氧气和水汽具有低渗透性，能够较好的保护器件。应用于柔性有机电致发光器件的柔性衬底目前主要为聚合物衬底，聚合物衬底轻薄、坚固且柔韧性极佳，但由于聚合物衬底本身自由体积分数较小且链段平均自由度较大，决定了其容易被水和氧气渗透，缩短有机发光器件寿命。
金属箔片在其厚度达到100μm以下时，能够表现出优异的可挠性，并且与聚合物相比，耐热性能优异且热膨胀系数很低，特别是不存在水和氧气渗透的问题，非常适于用作柔性有机电致发光器件的衬底材料，但金属箔片作为柔性显示器件衬底材料还存在导电及表面粗糙度较大的问题。
如图1所示，现有一种聚合物-金属箔复合柔性封装衬底，其包括：第一聚合物层10，设置于第一聚合物层10之上的金属箔片20，设置于金属箔片20之上的第二聚合物层30。其中，所述金属箔片20的表面尺寸大于所述第一聚合物层10和第二聚合物层30的表面尺寸，在利用金属箔片优异的可挠性和水、氧阻隔性能的同时，克服其导电及表面粗糙度问题。然而，该聚合物-金属箔复合柔性封装衬底制备完成后，仍需通过封装工艺与器件相结合。如图2所示，首先，在所述柔性封装衬底的第二聚合物层30之上形成有机电致发光器件50；然后，在所述柔性封装衬底的金属箔片20未被第一聚合物层10和第二聚合物层30覆盖的部分之上涂覆有机胶材40，并将所述部分粘附于所述有机电致发光器件50的侧边。该种封装结构， 水、氧仍有可能通过结合处或聚合物的侧面渗透。并且由于是柔性器件，在器件形变时，器件与衬底之间会出现应力，而应力必然集中在封装胶的连接处，易发生破裂。
发明内容
本发明的目的在于提供一种柔性OLED衬底，其具有良好的柔韧性和防水、氧渗透性能，使用该衬底进行OLED封装时，可简化封装工艺，提高柔封装工艺的可靠性，防止水、氧通过封装结合处渗漏和柔性器件变形时的应力集中导致器件破裂。
本发明的目的还在于提供一种柔性OLED封装方法，该方法将柔性OLED衬底的制备过程与OLED封装过程结合在一起，简化了封装工艺，并且由于将OLED器件直接粘附于柔性OLED衬底上，使得器件弯曲时与衬底之间产生的应力由整个器件分担，提高了封装工艺的可靠性。
为实现上述目的，本发明首先提供了一种柔性OLED衬底，包括：聚合物层，设于所述聚合物层上的金属箔片，及设于金属箔片上的绝缘胶材层；所述金属箔片的表面尺寸大于聚合物层的表面尺寸，聚合物层的表面尺寸大于绝缘胶材层的表面尺寸。
所述金属箔片为具有隔绝水、氧能力和柔性弯曲能力的金属箔片。
所述金属箔片为铝箔。
所述金属箔片的厚度在3μm到100μm之间。
所述聚合物层为对金属箔片具有支撑和保护作用的聚合物层。
所述聚合物层为聚酰亚胺层。
所述聚合物层的厚度在10μm到300μm之间。
本发明还提供一种柔性OLED封装方法，包括：
步骤1、提供一金属箔片，在金属箔片一侧涂布聚合物前体溶液然后加热固化形成聚合物层；
步骤2、用胶材涂布机将绝缘胶材均匀涂覆于金属箔片另一侧表面形成绝缘胶材层，从而制备出包含聚合物层、金属箔片和绝缘胶材层的柔性OLED衬底；
步骤3、将制备好的OLED器件与该柔性OLED衬底对组，通过绝缘胶材层将OLED器件粘附于该柔性OLED衬底上。
所述步骤1中的聚合物前体溶液为聚酰亚胺前驱体溶液，制备出来的聚合物层为聚酰亚胺层，所述聚合物层的厚度在10μm到300μm之间。
所述步骤2中的绝缘胶材层面积小于金属箔片和聚合物层的面积，大 于OLED器件需封装的面积，并位于金属箔片和聚合物层所覆盖的位置。
所述步骤3中的OLED器件为底发光型OLED器件。
本发明还提供一种柔性OLED衬底，包括：聚合物层，设于所述聚合物层上的金属箔片，及设于金属箔片上的绝缘胶材层；所述金属箔片的表面尺寸大于聚合物层的表面尺寸，聚合物层的表面尺寸大于绝缘胶材层的表面尺寸；
其中，所述金属箔片为具有隔绝水、氧能力和柔性弯曲能力的金属箔片；
其中，所述金属箔片的厚度在3μm到100μm之间；
其中，所述聚合物层为对金属箔片具有支撑和保护作用的聚合物层；
其中，所述聚合物层的厚度在10μm到300μm之间。
本发明的有益效果：本发明通过采用一种绝缘胶材来制备柔性OLED衬底，具有良好柔韧性和防水、氧渗透性能。利用绝缘胶材将制备好的OLED柔性器件直接粘附于衬底上，将衬底制备与封装过程结合在一起，简化了封装工艺，并且器件弯曲时与衬底之间产生的应力将由整个器件分担，提高了封装工艺的可靠性。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为现有的一种柔性OLED衬底；
图2为采用图1柔性OLED衬底封装的OLED显示器件；
图3为本发明的柔性OLED衬底；
图4为本发明的柔性OLED封装方法的流程图；
图5为采用本发明的柔性OLED衬底封装的OLED显示器件。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3，本发明提供了一种柔性OLED衬底，包括：聚合物层1， 设于所述聚合物层1上的金属箔片2，及设于金属箔片2上的绝缘胶材层3；所述金属箔片2的表面尺寸大于聚合物层1的表面尺寸，聚合物层1的表面尺寸大于绝缘胶材层3的表面尺寸。
所述金属箔片2可以为具有隔绝水、氧能力和柔性弯曲能力的任何金属箔片，如铝箔；优选的，所述金属箔片2的厚度在3μm到100μm之间。具体的，所述聚合物层1可以为对金属箔片2具有支撑和保护作用的任何聚合物层，如聚酰亚胺层；优选的，所述聚合物层1的厚度在10μm到300μm之间。
具体的，所述绝缘性胶材层3的材料可以为绝缘固体胶，所述绝缘性胶材层3负责在封装时将OLED器件粘附在该OLED柔性衬底上，并具有一定隔绝水、氧的作用，且由于其具有绝缘性，可以避免导电性金属箔片与器件电极相接触。
请参阅图4、图5，本发明还提供了一种柔性OLED封装方法，包括：
步骤1、提供一金属箔片2，在金属箔片2一侧涂布聚合物前体溶液然后加热固化形成聚合物层1。
具体的，所述金属箔片2可选择铝箔，厚度在3μm到100μm之间；所述聚合物前体溶液可选择聚酰亚胺前驱体溶液，制备出来的聚合物层1为聚酰亚胺层，所述聚合物层1的厚度在10μm到300μm之间。
步骤2、用胶材涂布机将绝缘胶材均匀涂覆于金属箔片另一侧表面形成绝缘胶材层3，从而制备出包含聚合物层1、金属箔片2和绝缘胶材层3的柔性OLED衬底。
需要注意的是，所述步骤1中金属箔片2的面积应大于聚合物层1的面积；所述步骤2中涂布的绝缘胶材层3面积应小于金属箔片2和聚合物层1的面积，大于OLED器件5需封装的面积，并位于金属箔片2和聚合物层1所覆盖的位置。
步骤3、将制备好的OLED器件5与该柔性OLED衬底对组，通过绝缘胶材层3将OLED器件5粘附于该柔性OLED衬底上。
值得一提的是，所述步骤3中的OLED器件5为底发光型OLED器件。所述绝缘胶材层3粘附于OLED器件5的底边与侧边。相比较现有技术，本发明的OLED封装方法简化了封装工艺，且所制得的封装结构中所述绝缘胶材层3为一个整体，而非拼接而成，避免了结合处水、氧渗漏，器件弯曲时与衬底之间产生的应力将由整个器件分担，提高了封装工艺的可靠性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (14)

  1. 一种柔性OLED衬底，包括：聚合物层，设于所述聚合物层上的金属箔片，及设于金属箔片上的绝缘胶材层；所述金属箔片的表面尺寸大于聚合物层的表面尺寸，聚合物层的表面尺寸大于绝缘胶材层的表面尺寸。
  2. 如权利要求1所述的柔性OLED衬底，其特征在于，所述金属箔片为具有隔绝水、氧能力和柔性弯曲能力的金属箔片。
  3. 如权利要求2所述的柔性OLED衬底，其中，所述金属箔片为铝箔。
  4. 如权利要求1所述的柔性OLED衬底，其中，所述金属箔片的厚度在3μm到100μm之间。
  5. 如权利要求1所述的柔性OLED衬底，其中，所述聚合物层为对金属箔片具有支撑和保护作用的聚合物层。
  6. 如权利要求5所述的柔性OLED衬底，其中，所述聚合物层为聚酰亚胺层。
  7. 如权利要求1所述的柔性OLED衬底，其中，所述聚合物层的厚度在10μm到300μm之间。
  8. 一种柔性OLED封装方法，包括：
    步骤1、提供一金属箔片，在金属箔片一侧涂布聚合物前体溶液然后加热固化形成聚合物层。
    步骤2、用胶材涂布机将绝缘胶材均匀涂覆于金属箔片另一侧表面形成绝缘胶材层，从而制备出包含聚合物层、金属箔片和绝缘胶材层的柔性OLED衬底；
    步骤3、将制备好的OLED器件与该柔性OLED衬底对组，通过绝缘胶材层将OLED器件粘附于该柔性OLED衬底上。
  9. 如权利要求8所述的柔性OLED封装方法，其中，所述步骤1中的聚合物前体溶液为聚酰亚胺前驱体溶液，制备出来的聚合物层为聚酰亚胺层，所述聚合物层的厚度在10μm到300μm之间。
  10. 如权利要求8所述的柔性OLED封装方法，其中，所述步骤2中的绝缘胶材层面积小于金属箔片和聚合物层的面积，大于OLED器件需封装的面积，并位于金属箔片和聚合物层所覆盖的位置。
  11. 如权利要求8所述的柔性OLED封装方法，其中，所述步骤3中的OLED器件为底发光型OLED器件。
  12. 一种柔性OLED衬底，包括：聚合物层，设于所述聚合物层上的 金属箔片，及设于金属箔片上的绝缘胶材层；所述金属箔片的表面尺寸大于聚合物层的表面尺寸，聚合物层的表面尺寸大于绝缘胶材层的表面尺寸；
    其中，所述金属箔片为具有隔绝水、氧能力和柔性弯曲能力的金属箔片；
    其中，所述金属箔片的厚度在3μm到100μm之间；
    其中，所述聚合物层为对金属箔片具有支撑和保护作用的聚合物层；
    其中，所述聚合物层的厚度在10μm到300μm之间。
  13. 如权利要求12所述的柔性OLED衬底，其中，所述金属箔片为铝箔。
  14. 如权利要求12所述的柔性OLED衬底，其中，所述聚合物层为聚酰亚胺层。
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